JP6292579B2 - Electronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component having a three-dimensional wiring pattern and a method for manufacturing the same.

  In recent years, electronic parts such as capacitance sensors have been three-dimensionalized to improve operability and produce a high-quality visual appearance (for example, Patent Document 1).

  In Patent Document 1, a three-dimensionally formed film base material, a decorative layer integrated on the back surface of the film base material, and a film base material and a decorative layer are integrally laminated. A capacitance sensor and a manufacturing method including a conductive circuit pattern layer are disclosed.

  FIG. 14 is a perspective view schematically showing the capacitance sensor 100.

  When the decorative layer 110 and the circuit pattern layer 120 are integrated with the film base 101, the film base 101 is set in a mold and molded three-dimensionally, the mold is cooled and the mold is opened. Then, the three-dimensionally formed electrostatic capacity sensor 100 is removed.

  For the conductive circuit pattern layer 120, a conductive polymer screen-printed with a conductive ink is used in consideration of the followability to the elongation of the film substrate 101 to be three-dimensionally formed. At this time, if a transparent conductive polymer is used, a region where the non-light-transmitting decorative layer 110 is not formed can be made transparent.

  In the manufactured capacitive sensor 100, the end portion of the circuit pattern layer 120 is inserted into the electrical connector of the circuit board. Since the capacitance sensor 100 has a three-dimensional shape having flexibility, even when the surface is installed in a curved attachment portion, the capacitance sensor 100 can be disposed close to the back surface of the operation surface. Therefore, the degree of freedom in designing the capacitance sensor 100 can be remarkably improved with a simple configuration, and a smooth operation feeling can be obtained. In addition, the three-dimensional capacitance sensor 100 can easily bring out a high-class feeling and high quality.

JP 2010-267607 A

  However, it is known that the resistance value of conductive polymers increases due to moisture absorption. Patent Document 1 describes that a protective layer is laminated in order to mechanically protect the wiring pattern, but no consideration is given to a moisture-proof film for protecting the conductive polymer from absorbing moisture. There wasn't. Even when the protective layer apparently holds the mechanical protective effect against the conductive polymer wiring pattern that deforms when three-dimensionally molded, there is a problem that it does not function as a moisture-proof film. occured. For this reason, when applying a conductive polymer to an electronic component that is deformed when it is three-dimensionally molded, the conductive polymer changes over time due to moisture permeation, and the three-dimensionally shaped wiring pattern deformed by the three-dimensional molding There has been a problem that the resistance value of the substrate increases.

  An object of the present invention is to solve the above-described problems, and in particular, to provide an electronic component having a stable resistance value and a three-dimensional wiring pattern, and a method for manufacturing the same.

An electronic component of the present invention includes a film base material having a three-dimensional shape, a wiring pattern made of a conductive polymer formed on one side of the film base material , and a chloride formed on the wiring pattern. It has a vinyl moisture-proof film and a molding resin formed on the other surface side of the film substrate .
In the electronic component of the present invention, an adhesive layer is formed on the other surface side of the film base material, and the adhesive layer is the vinyl chloride resin material.

According to this configuration, by protecting the wiring pattern made of the conductive polymer with the vinyl chloride moisture-proof film, moisture resistance can be maintained even if the wiring pattern is deformed after the wiring pattern is formed. Therefore, even in a three-dimensional wiring pattern deformed by three-dimensional molding, the moisture resistance is not lowered, and the resistance value can be maintained stably.
Moreover, even if the water molecule contained in air permeate | transmits the shaping | molding resin, the quantity of the water molecule which permeate | transmits a film base material with an contact bonding layer can be reduced. For this reason, even if molding resin and a film base material are materials with high moisture permeability, the influence of humidity with respect to a conductive polymer can be controlled.

  Moreover, in the electronic component of the present invention, the film base material and the moisture-proof film are visually transparent, and the conductive polymer is made of a mixture containing polyethylene dioxythiophene and polystyrene sulfonic acid. And

  According to this configuration, at least the wiring pattern has transparency, so that it is possible to improve design and to provide an illumination function.

  In the electronic component of the present invention, the film base material is flexible and can be deformed.

  According to this configuration, the film substrate, the wiring pattern made of a conductive polymer, and the vinyl chloride moisture-proof film have flexibility and can be deformed, so that a three-dimensional shape can be imparted to the wiring pattern. Easy.

  In the electronic component according to the aspect of the invention, the wiring pattern may include a capacitive electrode portion that detects a change in capacitance and a lead-out wiring portion connected to the capacitive electrode portion.

  According to this configuration, it is possible to form a capacitive electrode portion configured by a three-dimensional wiring pattern. Thereby, the electronic component which has a three-dimensional-shaped capacitive electrode part, for example, the electrostatic capacitance sensor excellent in design property is realizable.

The method for producing an electronic component of the present invention includes a step of forming a wiring pattern made of a conductive polymer on one side of a film base, and a step of forming a vinyl chloride moisture-proof film on the wiring pattern. And a step of forming a three-dimensional shape by heating and deforming after the step of forming the moisture-proof film, and the step of forming the three-dimensional shape is a molding resin on the other surface side of the film substrate. Including the step of forming .
In the electronic component manufacturing method of the present invention, an adhesive layer made of the vinyl chloride resin material is provided between the film substrate and the moisture-proof film and the three-dimensional shape. It includes a step of forming on the other surface side.

  According to this configuration, an electronic component having a three-dimensional wiring pattern can be easily manufactured by heat-deforming a flat film substrate by a method such as hot pressing. By protecting with a vinyl chloride moisture-proof film, the moisture-proof effect does not deteriorate even if the wiring pattern is deformed after the wiring pattern forming step and the moisture-proof film forming step, so that the resistance value of the wiring pattern can be maintained stably.

In the manufacturing method of the electronic component of the present invention, the step of forming the molding resin, characterized in that it comprises a step of integrating the molding resin to the film substrate by insert molding.

  According to this configuration, an electronic component having a three-dimensional wiring pattern can be easily manufactured by heat-deforming a flat film substrate by a method such as hot pressing and integrating the molding resin by insert molding. . By integrating the molding resin, durability and aesthetics can be improved.

  According to the present invention, by protecting a wiring pattern made of a conductive polymer with a vinyl chloride moisture-proof film, the resistance value is stable even when deformed by three-dimensional molding, and the three-dimensional shape is reduced. An electronic component having a wiring pattern can be provided.

  In addition, according to the manufacturing method of the present invention, since the moisture-proof effect does not decrease even when the wiring pattern is formed and the moisture-proof film is formed after the step, the resistance value is stable and the three-dimensional shape is obtained. An electronic component having a wiring pattern can be manufactured.

It is a perspective view which shows the electronic component of embodiment of this invention. It is the schematic diagram which looked at the electronic component of embodiment of this invention from diagonally downward. It is a top view which shows the electronic component of embodiment of this invention. It is a front view which shows the electronic component of embodiment of this invention. It is the schematic cross section cut | disconnected by the VV line | wire of FIG. It is process drawing explaining the manufacturing method of the electronic component of embodiment of this invention, and is a schematic cross section which shows the state which formed the conductive polymer in the flat film base material. It is a schematic cross section which shows the process of performing desired patterning to a conductive polymer and forming a wiring pattern. It is a schematic cross-sectional view showing a step of forming a vinyl chloride moisture-proof film on a wiring pattern. It is a schematic cross section which shows the process of heat-deforming a film sensor and forming a three-dimensional shape. It is a schematic cross section which shows the process of integrating molding resin with a film sensor by insert molding. It is a schematic cross section which shows insert molding by which molding resin was integrated with the other surface side of the film base material. It is a schematic cross section which shows insert molding by which molding resin was integrated with the one surface side of the film base material. 5 is a graph comparing the rate of increase in resistance value between Example 1 and Comparative Example 1. FIG. It is a perspective view which shows the conventional electrostatic capacitance sensor typically.

[First Embodiment]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. For easy understanding, the dimensions of the drawings are appropriately changed.

  FIG. 1 is a perspective view showing an electronic component 1 according to an embodiment of the present invention. FIG. 2 is a schematic view of the electronic component 1 according to the embodiment of the present invention as viewed obliquely from below. FIG. 3 is a plan view showing the electronic component 1 according to the embodiment of the present invention. FIG. 4 is a front view showing the electronic component 1 according to the embodiment of the present invention. 5 is a cross-sectional view taken along line VV in FIG.

  The electronic component 1 according to the present embodiment is a capacitance sensor including a three-dimensional capacitance detection unit 1A, and is an input device that is operated by an operator by touching the capacitance detection unit 1A with a finger. This is the case used.

  As shown in FIGS. 1 to 5, the electronic component 1 of the present embodiment has a three-dimensional shape in which the central portion of the molding resin 40 protrudes upward (Z1 direction). The film sensor 10 has a three-dimensional shape so as to follow the three-dimensional shape of the molding resin 40, and the film sensor 10 has a wiring pattern 12 and a moisture-proof film 14 on one surface 11 a side of the film substrate 11. Are stacked.

  The film base 11 is obtained by heat-deforming a flat sheet-like biaxially stretched polyester film using a mold. The film substrate 11 of the present embodiment is a material that has flexibility, can be deformed, and is visually transparent. For example, by transmitting visible light from below to above, an electronic component 1 can be provided with an illumination function. Further, for example, except for the three-dimensionally shaped electrostatic capacitance detection unit 1A, a light-shielding resin material may be printed to make a non-light-transmitting region.

  In the wiring pattern 12, a conductive polymer 20 made of a mixture containing polyethylene dioxythiophene and polystyrene sulfonic acid is formed on one surface 11 a of the film substrate 11. It is known that a conductive polymer material of polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) is a transparent electrode material having high conductivity. Moreover, it has a softness | flexibility and can also deform | transform so that it may be extended | stretched, for example. The conductive polymer 20 is a non-conductive film 13 in which regions other than the wiring pattern 12 are made non-conductive. The nonconductive film 13 functions as an insulating film and does not short-circuit the wiring pattern 12. The conductive polymer 20 is not limited to PEDOT / PSS as long as it is a transparent electrode material having similar physical properties.

  As shown in FIG. 2, the wiring pattern 12 in the electronic component 1 of the present embodiment includes a capacitive electrode portion 12A that detects a change in capacitance and a lead-out wiring portion 12B connected to the capacitive electrode portion 12A. . The capacitive electrode portion 12A is arranged corresponding to the three-dimensional shaped electrostatic capacitance detecting portion 1A. Note that the wiring pattern 12 shown in FIG. 2 schematically represents a patterned state.

  The moisture-proof film 14 is formed by printing a vinyl chloride resin material on the wiring pattern 12. As shown in FIG. 2, in the electronic component 1 of the present embodiment, one end of the wiring pattern 12 is exposed on one surface 11 a of the film substrate 11, and the moisture-proof film 14 is formed over almost the entire other surface. Yes. The moisture-proof film 14 of the present embodiment is made of a vinyl chloride resin material that is visually transparent, has flexibility, and can be deformed to be stretched, for example.

  The molding resin 40 is obtained by molding a thermoplastic resin polycarbonate (PC) using a mold. The molding resin 40 of the present embodiment is a material that is visually transparent. Thereby, since the molding resin 40, the film base material 11, the wiring pattern 12, and the moisture-proof film 14 are provided with transparency in the electronic component 1 of the present embodiment, it is possible to improve the design and provide an illumination function. is there.

  Note that one end of the wiring pattern 12 on which the moisture-proof film 14 is not formed is preferably sealed with a resin or the like in order to increase durability and reliability when the electronic component 1 and the external circuit are electrically connected. . Further, it is more preferable that a conductive pattern containing metal is laminated on the exposed wiring pattern 12 to protect the conductive polymer 20.

  In the electronic component 1 of this embodiment, a wiring pattern 12 and a moisture-proof film 14 made of a conductive polymer 20 are formed on one surface 11a of a flat sheet-like film base material 11, and are molded into a three-dimensional shape. . Since the film substrate 11, the wiring pattern 12 made of the conductive polymer 20, and the moisture-proof film 14 are all flexible and can be deformed, a three-dimensional wiring pattern 12 can be obtained.

  Further, a molding resin 40 is molded and integrated on the other surface 11 b side of the film base 11. Note that the electronic component 1 of the present embodiment is provided with an adhesive layer 15 in order to improve the adhesion between the molding resin 40 and the film substrate 11. The adhesive layer 15 is a resin material called a binder, and is formed of the same vinyl chloride resin material as the moisture-proof film 14 in this embodiment. For this reason, the adhesive layer 15 of this embodiment does not impair the characteristics of the electronic component 1 described above.

  Since the electronic component 1 of this embodiment uses a vinyl chloride resin material for the moisture-proof film 14, the moisture permeability is low, and the influence of humidity on the conductive polymer 20 can be suppressed. The vinyl chloride moisture-proof film 14 has flexibility, can be deformed, and retains low moisture permeability even when deformed into a three-dimensional shape. For this reason, it is suppressed that the water molecule contained in the air permeates the moisture-proof film 14 and affects the conductive polymer 20.

  Furthermore, since the same vinyl chloride resin material as the moisture-proof film 14 is used for the adhesive layer 15 in the electronic component 1 of the present embodiment, even if water molecules contained in the air permeate the molded resin 40, The amount of water molecules that permeate through the film substrate 11 can be reduced by the layer 15. For this reason, even if the molding resin 40 and the film base material 11 are materials with high moisture permeability, the influence of humidity on the conductive polymer 20 can be suppressed.

  Hereinafter, the effect by having set it as this embodiment is demonstrated.

  The electronic component 1 according to this embodiment includes a film substrate 11 having a three-dimensional shape, a wiring pattern 12 made of a conductive polymer 20 formed on the film substrate 11, and a chloride formed on the wiring pattern 12. And a vinyl moisture-proof film 14. According to this configuration, the wiring pattern 12 made of the conductive polymer 20 is protected by the vinyl chloride moisture-proof film 14, so that moisture resistance can be maintained even when the wiring pattern is deformed. Therefore, even in the three-dimensional wiring pattern 12 deformed by the three-dimensional molding, the moisture-proof effect is not lowered, and the resistance value can be stably maintained.

  Moreover, in the electronic component 1 of this embodiment, while the film base material 11 and the moisture-proof film | membrane 14 are provided with transparency visually, the conductive polymer 20 consists of a mixture containing polyethylene dioxythiophene and polystyrene sulfonic acid. According to this configuration, at least the wiring pattern 12 has transparency, so that it is possible to improve design and to provide an illumination function.

  Moreover, in the electronic component 1 of this embodiment, the film base material 11 has flexibility and can be deformed. According to this configuration, since the film substrate 11, the wiring pattern 12 made of the conductive polymer 20, and the vinyl chloride moisture-proof film 14 have flexibility and can be deformed, the wiring pattern 12 has a three-dimensional shape. It is easy to give.

  In the electronic component 1 of the present embodiment, the wiring pattern 12 includes a capacitive electrode portion 12A that detects a change in electrostatic capacitance, and a lead-out wiring portion 12B connected to the capacitive electrode portion 12A. According to this configuration, it is possible to form the capacitive electrode portion 12 </ b> A configured by the three-dimensional wiring pattern 12. Thereby, the electrostatic capacitance sensor which has the three-dimensional shape capacitive electrode part 12A excellent in design property is realizable.

<Manufacturing method>
A method for manufacturing the electronic component 1 in the embodiment of the present invention will be described. FIG. 6 is a schematic cross-sectional view showing a state in which the conductive polymer 20 is formed on the flat film substrate 11. FIG. 7 is a schematic cross-sectional view showing a process of forming the wiring pattern 12 by performing desired patterning on the conductive polymer 20. FIG. 8 is a schematic cross-sectional view showing a process of forming a vinyl chloride moisture-proof film 14 on the wiring pattern 12. FIG. 9 is a schematic cross-sectional view showing a step of forming a three-dimensional shape by heating and deforming the film sensor 10 after the step of forming the moisture-proof film 14. FIG. 10 is a schematic cross-sectional view showing a process of integrating the molding resin 40 into the film sensor 10 by insert molding. FIG. 11 is a schematic cross-sectional view showing insert molding in which a molding resin 40 is integrated on the other surface 11 b side of the film base 11. FIG. 12 is a schematic cross-sectional view showing insert molding in which a molding resin 40 is integrated on the one surface 11 a side of the film base 11.

  A film substrate 11 made of a biaxially stretched polyester film is prepared. As shown in FIG. 6, the conductive substrate made of a mixture containing polyethylene dioxythiophene and polystyrene sulfonic acid is formed on one surface 11 a of the film substrate 11. Molecule 20 is formed. The conductive polymer 20 is formed, for example, by applying an ink in which polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) is dispersed.

  Subsequently, a resist is printed, and the conductive polymer 20 is rendered nonconductive. By this non-conducting treatment, the conductive polymer 20 protected by the resist is patterned. The resist is peeled off after the non-conducting treatment to form a wiring pattern 12 as shown in FIG. In addition, it is preferable that the nonconductive film 13 made nonconductive by the nonconductive process is left between the wiring patterns 12 without being removed. The difference in optical characteristics between the wiring pattern 12 and the nonconductive film 13 is small, and the boundary can be made difficult to be visually recognized. In the present embodiment, the following process will be described as an example of leaving the nonconductive film 13.

  Subsequently, a vinyl chloride moisture-proof film 14 is printed to form a vinyl chloride moisture-proof film 14 as shown in FIG. In addition, these processes are performed so that it may laminate | stack in order on the one surface 11a of the flat film base material 11. FIG.

  After these steps, the film sensor 10 is inserted into the apparatus in which the mold is mounted and heated, and the film sensor 10 is copied in accordance with the shape of the lower mold 51 as shown in FIG. It is deformed and formed into a three-dimensional shape.

  Subsequently, as shown in FIG. 10, the molding resin 40 is filled in the gap with the upper mold, and the molding resin 40 is integrated with the film sensor 10. The molding resin 40 is a thermoplastic resin polycarbonate (PC). Other materials may be used as long as they are thermoplastic resin materials. For example, polymethyl methacrylate resin (PMMA) or cycloolefin polymer (COP) can be used. The example shown in FIG. 11 is insert molding in which a molding resin 40 is integrated on the other surface 11 b side of the film substrate 11. An adhesive layer 15 that improves the adhesion is formed on the other surface 11 b of the film base 11. In addition, it is good also as insert molding (film insert molding) which prints colored ink on the other surface 11b of the film base material 11, and has the printing surface of colored ink between the film base material 11 and the shaping | molding resin 40. . By integrating the molding resin 40, durability and aesthetics can be improved. Moreover, the example shown in FIG. 12 is the insert molding in which the molding resin 40 is integrated on the one surface 11 a side of the film base 11. In this case, the moisture-proof film 14 on the wiring pattern 12 is in close contact with the molding resin 40. In addition, it is more preferable from the viewpoint of moisture resistance to form the moisture-proof film 14 also on the other surface 11b of the film substrate 11.

  In the film sensor 10, since the wiring pattern 12 and the moisture-proof film 14 are formed on the one surface 11a of the flat film base 11, a difficult process such as three-dimensional patterning or a special manufacturing apparatus is not required. Unlike the present embodiment, if it is intended to form three-dimensionally from the beginning, a simple forming method such as printing cannot be applied, which causes a quality reduction factor and a cost increase factor.

  Furthermore, the wiring pattern 12 and the vinyl chloride moisture-proof film 14 made of the conductive polymer 20 in the present embodiment are deformed following the deformation when the film substrate 11 is deformed into a three-dimensional shape. Can do.

  Even if the vinyl chloride moisture-proof film 14 is formed on the wiring pattern 12 in the state of the flat film substrate 11, the moisture-proof effect does not deteriorate even if the film is heated and deformed into a three-dimensional shape. For this reason, it is suppressed that the water molecule contained in the air permeates the moisture-proof film 14 and affects the conductive polymer 20. Thereby, the resistance value of the wiring pattern 12 can be maintained stably.

  Further, if a die having a different shape is used for the same film sensor 10, it can be formed into a different three-dimensional shape. For example, it is easy to improve the design by forming different three-dimensional shapes.

  Hereinafter, the effect by having set it as this embodiment is demonstrated.

  The method of manufacturing the electronic component 1 according to the present embodiment includes a step of forming a wiring pattern 12 made of a conductive polymer 20 on a film substrate 11 and a step of forming a vinyl chloride moisture-proof film 14 on the wiring pattern 12. And a step of forming a three-dimensional shape by heat-deforming after the step of forming the moisture-proof film 14.

  According to this configuration, it is possible to easily manufacture the electronic component 1 having the three-dimensional wiring pattern 12 by heating and deforming the flat film substrate 11 by a method such as hot pressing. By protecting with the vinyl chloride moisture-proof film 14, even if the wiring pattern is formed and the moisture-proof film is formed, the moisture-proof effect is not lowered even when the wiring pattern 12 is deformed. Therefore, the resistance value of the wiring pattern 12 can be stably maintained.

  Moreover, in the manufacturing method of the electronic component 1 of this embodiment, the process of forming a three-dimensional shape includes the process of integrating the molding resin 40 by insert molding.

  According to this configuration, the electronic component 1 having the three-dimensional wiring pattern 12 is obtained by heat-deforming the flat film substrate 11 by a method such as hot pressing and integrating the molding resin 40 by insert molding. Easy to manufacture. By integrating the molding resin 40, durability and aesthetics can be improved.

  The resistance value of the wiring pattern 12 in the electronic component 1 of this embodiment was measured, and it was verified that the resistance value could be maintained stably. FIG. 13 is a graph comparing the rate of increase in resistance value between Example 1 and Comparative Example 1.

  For the film base 11 of Example 1, a decorative / sheath-molded biaxially stretched polyester film (trade name: Soft Shine TA0009) manufactured by Toyobo was used.

  The wiring pattern 12 of Example 1 was patterned to a wiring pattern width of 2.4 mm using a conductive polymer 20 made of a mixture containing polyethylene dioxythiophene and polystyrene sulfonic acid.

  For the moisture-proof film 14 of Example 1, a polyvinyl chloride resin (trade name JT27) manufactured by Seiko Advance was used.

  As Comparative Example 1, a test sample using a protective film (trade name MIX-HF) made by Teikoku ink was prepared instead of the moisture-proof film 14.

  FIG. 13 is a graph showing the results of manufacturing and measuring nine electronic components 1 of Example 1 and the results of measuring and measuring six test samples of Comparative Example 1. The horizontal axis of the graph in FIG. 13 represents the elapsed time from the time of creation in days, and the vertical axis of the graph represents the rate of increase in resistance value based on the individual initial values measured at the time of creation. In all of the comparative examples, the resistance value increased by 5% or more after 30 days had elapsed. On the other hand, in all nine bodies of Example 1, no increase in resistance value was observed such that the resistance value exceeded the initial value even after 100 days had elapsed. In addition, although the behavior in which individual resistance values decreased after the start of the test compared to the initial value was observed, this seems to be because aging for stabilizing the characteristics of the conductive polymer 20 was not performed immediately after fabrication. No practical problem.

  As described above, the electronic component 1 and the manufacturing method thereof according to the embodiment of the present invention have been specifically described. However, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention. Can be implemented. For example, the present invention can be modified as follows, and these also belong to the technical scope of the present invention.

  (1) In the present embodiment, an input device using a capacitance sensor has been shown as an example, but it may be changed to an electronic component for other purposes.

  (2) In the present embodiment, the molding resin 40 is integrated after forming the three-dimensional shape of the film sensor 10 by a vacuum molding method or the like. The construction method performed simultaneously with the process to shape | mold may be sufficient.

  (3) In this embodiment, although the molding resin 40 was integrated, the aspect which does not integrate the molding resin 40 may be sufficient.

  (4) In the present embodiment, a material having transparency by visual observation is used. However, in the case of an application not having an illumination function, the material may be made of an opaque material.

DESCRIPTION OF SYMBOLS 1 Electronic component 1A Capacitance detection part 10 Film sensor 11 Film base material 11a One side 11b The other side 12 Wiring pattern 12A Capacitance electrode part 12B Lead-out wiring part 13 Nonconductive film 14 Moisture-proof film 15 Adhesive layer 20 Conductive polymer 40 Molding resin 51 Lower mold 52 Upper mold

Claims (8)

A film substrate having a three-dimensional shape, a wiring pattern made of a conductive polymer formed on one side of the film substrate , a vinyl chloride moisture-proof film formed on the wiring pattern, An electronic component comprising: a molding resin formed on the other surface side of the film base material . An adhesive layer is formed on the other side of the film substrate;
  The electronic component according to claim 1, wherein the adhesive layer is the vinyl chloride resin material. While the film substrate and the moisture-proof film have transparency with visual observation,
The conductive polymer, the electronic component according to claim 1 or claim 2, characterized by comprising a mixture containing a polyethylene dioxythiophene and polystyrene sulfonic acid. Electronic component according to any one of claims 1 to 3, wherein the film substrate is deformable has flexibility. The said wiring pattern is provided with the capacity | capacitance electrode part which detects the change of an electrostatic capacitance, and the lead-out wiring part connected to the said capacity | capacitance electrode part, The Claim 1 thru | or 4 characterized by the above-mentioned. Electronic components. Forming a wiring pattern made of a conductive polymer on one side of the film substrate;
Forming a vinyl chloride moisture-proof film on the wiring pattern;
And a step of forming a three-dimensional shape by heat-deforming after the step of forming the moisture-proof film ,
The method of manufacturing an electronic component , wherein the step of forming the three-dimensional shape includes a step of forming a molding resin on the other surface side of the film substrate .   Between the step of forming the moisture-proof film and the step of forming the three-dimensional shape, a step of forming an adhesive layer, which is the vinyl chloride resin material, on the other surface side of the film base material is included. The manufacturing method of the electronic component of Claim 6 characterized by the above-mentioned. It said step of forming a molded resin, method for manufacturing the electronic component according to claim 6 or claim 7, characterized in that it comprises a step of integrating the molded resin by insert molding on the film substrate.