JP5312541B2 - Capacitance sensor - Google Patents
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- JP5312541B2 JP5312541B2 JP2011194970A JP2011194970A JP5312541B2 JP 5312541 B2 JP5312541 B2 JP 5312541B2 JP 2011194970 A JP2011194970 A JP 2011194970A JP 2011194970 A JP2011194970 A JP 2011194970A JP 5312541 B2 JP5312541 B2 JP 5312541B2
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- 238000010030 laminating Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 78
- 239000012790 adhesive layer Substances 0.000 description 10
- 238000005034 decoration Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000007516 Chrysanthemum Nutrition 0.000 description 1
- 244000189548 Chrysanthemum x morifolium Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Position Input By Displaying (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Description
本発明は、自動車の音響機器や空調機器、コンピュータ機器、家電製品等の操作に使用される静電容量センサに関するものである。 The present invention relates to a capacitance sensor used for operation of automobile audio equipment, air conditioning equipment, computer equipment, home appliances, and the like.
自動車の音響機器や空調機器のスイッチとしては、従来より押しボタンタイプやダイヤルタイプが使用されているが、近年、軽く触れた指先の僅かな静電容量の変化で位置や動きの方向を電気信号に変える静電容量センサの使用が検討されている。この静電容量センサは、図示しないが、絶縁性のフィルムの表面に、装飾用の加飾層と静電容量の変化を検出する回路パターンとが印刷して積層形成されており、操作面をフラットにしたり、スイッチの機構部品を省略することができるというメリットがある（特許文献１、２、３参照）。 Conventionally, push button type and dial type switch have been used for automobile audio equipment and air conditioner switches. However, in recent years, the position and direction of movement can be detected by an electrical signal by a slight change in capacitance of the fingertip. The use of a capacitance sensor that is changed to the above is under consideration. Although not shown, this capacitance sensor is formed by laminating a decorative layer for decoration and a circuit pattern for detecting a change in capacitance on the surface of an insulating film. There is a merit that it can be made flat or a mechanical part of the switch can be omitted (see Patent Documents 1, 2, and 3).
静電容量センサは、以上のように操作面のフラット化や機構部品の削減にメリットがあるものの、フィルムに加飾層と回路パターンとが単に印刷して積層形成されるので、加飾層と回路パターンとの積層形成に伴い加飾層や回路パターンの導電ラインが印刷時に使用される溶剤で滲んだり、損傷するおそれがある。この結果、加飾層と回路パターンとの多様な組み合わせに支障を来たしたり、ユーザーの要求に最適の材料や製法で製造することができない事態が考えられる。 Although the capacitance sensor has advantages in flattening the operation surface and reducing mechanical parts as described above, the decorative layer and the circuit pattern are simply printed on the film to form a laminated layer. With the lamination with the circuit pattern, the decorative layer and the conductive line of the circuit pattern may be smeared or damaged by the solvent used during printing. As a result, various combinations of the decorative layer and the circuit pattern may be hindered, and it may be impossible to manufacture with materials and manufacturing methods that are optimal for the user's requirements.
また、単なる二次元的デザインの静電容量センサでは、三次元形状の取付箇所に静電容量センサを設置することが困難な場合があり、しかも、高級感や上質感の演出にも限界がある。 In addition, with a capacitive sensor with a simple two-dimensional design, it may be difficult to install the capacitive sensor at the three-dimensional mounting location, and there is a limit to the production of high-quality and high quality. .
本発明は上記に鑑みなされたもので、回路パターンと加飾層との組み合わせ性を向上させ、三次元形状の取付箇所に容易に設置することができ、高級感や上質感の演出に制約の少ない静電容量センサを提供することを目的としている。 The present invention has been made in view of the above, and improves the combination of the circuit pattern and the decorative layer, can be easily installed at a three-dimensional mounting location, and is constrained to produce high-quality and high-quality effects. The object is to provide a low capacitance sensor.
本発明においては上記課題を解決するため、一枚のフィルムの表面に静電容量の変化を検出する導電性の回路パターンを備えた回路パターン層と、この回路パターン層の表面側に積層される加飾層と、回路パターン層の表面と加飾層との間に介在され、回路パターン層と加飾層とを接着する中間層とを含み、回路パターン層、加飾層、及び中間層を隙間なく積層して積層フィルムを形成し、この積層フィルムを金型にセットして型締めすることにより、三次元成形されるものであって、
回路パターン層の回路パターンを、一枚のフィルムの表面に印刷される複数の電極と、フィルムの表面に印刷されて各電極の周縁部から伸びる複数の導電ラインとから形成し、
加飾層を、中間層と接着するフィルムの裏面に加飾用の模様を備えることで形成し、
回路パターン層を部分的に屈曲して回路パターンの複数の電極に屈曲した加飾層を中間層を介して積層し、回路パターンの複数の導電ラインを下方に曲げ伸ばしてその末端部を別体の回路基板に着脱自在に挿着したことを特徴としている。
In the present invention, in order to solve the above-described problem, a circuit pattern layer having a conductive circuit pattern for detecting a change in capacitance on the surface of a single film and the surface of the circuit pattern layer are laminated. Including a decorative layer, an intermediate layer that is interposed between the surface of the circuit pattern layer and the decorative layer, and bonds the circuit pattern layer and the decorative layer, and includes the circuit pattern layer, the decorative layer, and the intermediate layer. By laminating without gaps to form a laminated film, by setting this laminated film in a mold and clamping it, it is three-dimensionally molded ,
A circuit pattern of the circuit pattern layer is formed from a plurality of electrodes printed on the surface of one film , and a plurality of conductive lines printed on the surface of the film and extending from the peripheral edge of each electrode,
The decorative layer is formed by providing a decorative pattern on the back surface of the film to be bonded to the intermediate layer,
The circuit pattern layer is partially bent and a decorative layer bent to a plurality of electrodes of the circuit pattern is laminated via an intermediate layer, and a plurality of conductive lines of the circuit pattern are bent and extended downward to separate the end portions thereof. The circuit board is detachably attached to the circuit board .
ここで、特許請求の範囲における回路パターン層のフィルムは、透明、不透明、半透明を特に問うものではない。 Here, the film of the circuit pattern layer in the claims does not particularly require transparency, opaqueness, and translucency .
中間層は、例えば中間厚み調整層、中間接着層、粘着層等とすることが可能である。この中間層は、基本的には導電性の有無を問わないが、回路パターンに電極が多数存在する場合には、面方向に導電性を有しないことが好ましい。さらに、本発明に係る静電容量センサは、少なくとも自動車の音響機器や空調機器、コンピュータ機器、家電製品、コピー機、照明器具、調理機器、携帯機器、通信機器等の操作に用いることができる。 The intermediate layer can be, for example, an intermediate thickness adjusting layer, an intermediate adhesive layer, an adhesive layer, or the like . This intermediate layer basically does not matter whether or not it has electrical conductivity, but when there are a large number of electrodes in the circuit pattern, it is preferable that the intermediate layer does not have electrical conductivity in the plane direction. Furthermore, the capacitance sensor according to the present invention can be used for operations of at least automobile audio equipment, air conditioning equipment, computer equipment, home appliances, copy machines, lighting equipment, cooking equipment, portable equipment, communication equipment, and the like.
本発明によれば、回路パターン層と加飾層とが別体なので、加飾や回路パターンが溶剤等で滲んだり、損傷するおそれが少ない。また、加飾の程度や大きさに左右されることなく回路パターンを形成したり、回路パターンのパターンにかかわらず加飾層を形成することができるので、回路パターン層と加飾層とを自由に組み合わせることができ、最適の材料や製法で製造することができる。 According to the present invention, since the circuit pattern layer and the decorative layer are separate, the decoration and the circuit pattern are less likely to be smeared or damaged by a solvent or the like. In addition, the circuit pattern can be formed without being affected by the degree and size of the decoration, and the decoration layer can be formed regardless of the pattern of the circuit pattern. And can be manufactured with the most suitable materials and manufacturing methods.
本発明によれば、回路パターンと加飾層との組み合わせ性を向上させ、三次元形状の取付箇所に静電容量センサを容易に設置することができるという効果がある。また、高級感や上質感を適切に演出することができる。また、回路パターン層と加飾層との間に中間層を含むので、この中間層により、回路パターン層と加飾層とを接着したり、あるいは回路パターンと加飾層との積層に伴い、加飾層に配線パターンの厚み分の凹凸が浮き出て体裁が悪化するのを有効に抑制することができる。 ADVANTAGE OF THE INVENTION According to this invention, there exists an effect that the combinatorial property of a circuit pattern and a decoration layer is improved and an electrostatic capacitance sensor can be easily installed in the attachment location of a three-dimensional shape. In addition, it is possible to appropriately produce a high-class feeling and high quality. In addition, since the intermediate layer is included between the circuit pattern layer and the decorative layer, the intermediate layer is used to adhere the circuit pattern layer and the decorative layer, or with the lamination of the circuit pattern and the decorative layer, It can suppress effectively that the unevenness | corrugation for the thickness of a wiring pattern protrudes in a decoration layer, and appearance deteriorates.
また、回路パターン層を適宜屈曲したり、湾曲させることができるので、回路パターンを水平方向ではなく、下方に位置する回路基板に接続して配線の便宜を図ることが可能となる。さらに、回路パターン層や加飾層用の保護層を省略することにより、材料の削減が期待できる。 In addition, since the circuit pattern layer can be appropriately bent or curved, the circuit pattern can be connected to a circuit board located below rather than in the horizontal direction for convenience of wiring. Furthermore, material reduction can be expected by omitting the protective layer for the circuit pattern layer and the decorative layer.
以下、図面を参照して本発明の実施形態を説明すると、本実施形態における静電容量センサは、図１ないし図４に示すように、フィルム２に回路パターン３が印刷された回路パターン層１と、この回路パターン層１の表面に部分的に積層される加飾層６と、回路パターン層１の表面と加飾層６とを接着する中間層である中間接着層９とを備え、これら回路パターン層１、加飾層６、及び中間接着層９が三次元成形されており、自動車の音響機器のスイッチ等として利用される。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 4, the capacitance sensor in the present embodiment is a circuit pattern layer 1 in which a circuit pattern 3 is printed on a film 2. And a decorative layer 6 partially laminated on the surface of the circuit pattern layer 1, and an intermediate adhesive layer 9 that is an intermediate layer for bonding the surface of the circuit pattern layer 1 and the decorative layer 6, The circuit pattern layer 1, the decorative layer 6, and the intermediate adhesive layer 9 are three-dimensionally formed and used as a switch for an automobile audio device.
回路パターン層１は、図２ないし図４に示すように、絶縁性を有する透明のフィルム２の表面に静電容量の変化を検出する導電性の回路パターン３がスクリーン印刷されることにより形成され、三次元成形時に所定の形に加工される。フィルム２は、特に限定されるものではないが、例えばポリエチレンテレフタレート、ポリカーボネート、アクリル樹脂等を使用して薄板に成形され、最終的には凹んで部分的に下方に屈曲する略スプーン形に加工される。 As shown in FIGS. 2 to 4, the circuit pattern layer 1 is formed by screen-printing a conductive circuit pattern 3 for detecting a change in capacitance on the surface of a transparent film 2 having insulating properties. , Processed into a predetermined shape during three-dimensional molding. The film 2 is not particularly limited, but is formed into a thin plate using, for example, polyethylene terephthalate, polycarbonate, acrylic resin, etc., and finally processed into a substantially spoon shape that is recessed and partially bent downward. The
回路パターン３は、図２ないし図４に示すように、例えば平面略菊花模様状に配列される複数の電極４と、各電極４の周縁部から所定の一方向に伸びる複数の導電ライン５とを備え、これら複数の電極４と導電ライン５とが銀インク、カーボンインク、導電性ポリマー等からなる導電インクにより平面略スプーン形に配列してスクリーン印刷される。複数の電極４と導電ライン５とは、導電インクの種類等にも左右されるが、例えば１〜１５μｍ、又は１０〜１５μｍ程度の厚さに形成される。 As shown in FIGS. 2 to 4, the circuit pattern 3 includes a plurality of electrodes 4 arranged in a substantially chrysanthemum pattern, for example, and a plurality of conductive lines 5 extending in a predetermined direction from the peripheral edge of each electrode 4. The plurality of electrodes 4 and the conductive lines 5 are screen-printed by arranging them in a substantially spoon-like shape with a conductive ink made of silver ink, carbon ink, conductive polymer or the like. The plurality of electrodes 4 and the conductive lines 5 are formed to have a thickness of, for example, about 1 to 15 μm, or about 10 to 15 μm, depending on the type of conductive ink and the like.
複数の電極４は、それぞれ平面略扇形に形成され、任意の電極４が操作時にユーザーの指と間接的に対向する。また、複数の導電ライン５は、フィルム２の下方への屈曲により下方に伸長され、末端部が回路基板１０の電気コネクタ１１に上方から着脱自在に挿着される。 The plurality of electrodes 4 are each formed in a substantially fan shape, and any electrode 4 indirectly faces the user's finger during operation. The plurality of conductive lines 5 are extended downward by bending the film 2 downward, and the end portions are detachably attached to the electrical connector 11 of the circuit board 10 from above.
加飾層６は、図１、図３、図４に示すように、絶縁性を有する透明のフィルム７の裏面に加飾用の模様８がスクリーン印刷あるいは転写等されることにより形成され、三次元成形時に所定の形に加工される。フィルム７は、特に限定されるものではないが、例えばポリエチレンテレフタレート、ポリカーボネート、アクリル樹脂等を用いて薄板に成形され、最終的には略ドーム形に湾曲加工される。また、模様８は、回路パターン３の複数の電極４に重なるよう有彩色で略ドーム形に形成される。この模様８は、必要に応じ、文字、図形、記号等とされる。 The decorative layer 6 is formed by screen-printing or transferring a decorative pattern 8 on the back surface of an insulating transparent film 7 as shown in FIGS. 1, 3, and 4. It is processed into a predetermined shape at the time of original molding. The film 7 is not particularly limited, but is formed into a thin plate using, for example, polyethylene terephthalate, polycarbonate, acrylic resin, and is finally bent into a substantially dome shape. In addition, the pattern 8 is formed in a substantially dome shape with a chromatic color so as to overlap the plurality of electrodes 4 of the circuit pattern 3. This pattern 8 is made into a character, a figure, a symbol, etc. as needed.
中間接着層９は、図３や図４に示すように、特に制限されるものではないが、例えばポリエチレンテレフタレート等からなる薄い基材の表裏面にアクリル系等の接着剤がそれぞれ塗布されることにより形成される。この中間接着層９は、回路パターン層１の非屈曲部及び複数の電極４と加飾層６とを接着するよう機能する。 The intermediate adhesive layer 9 is not particularly limited as shown in FIGS. 3 and 4, but an acrylic adhesive or the like is applied to the front and back surfaces of a thin substrate made of, for example, polyethylene terephthalate. It is formed by. The intermediate adhesive layer 9 functions to adhere the non-bent portion of the circuit pattern layer 1 and the plurality of electrodes 4 and the decorative layer 6.
上記構成において、静電容量センサを製造する場合には、回路パターン層１、加飾層６、中間接着層９を隙間なく積層して積層フィルムを形成し、この積層フィルムを高温の金型にセットして型締めすることにより三次元成形し、金型を冷却した後、金型を型開きして脱型すれば、静電容量センサを製造することができる。この際、金型に、加飾層６を保護する耐熱性のカバーシートを予めインサートしても良い。 In the above configuration, when manufacturing a capacitance sensor, the circuit pattern layer 1, the decorative layer 6, and the intermediate adhesive layer 9 are laminated without gaps to form a laminated film, and this laminated film is formed into a high-temperature mold. Capacitance sensors can be manufactured by performing three-dimensional molding by setting and clamping and cooling the mold, then opening the mold and removing the mold. At this time, a heat-resistant cover sheet that protects the decorative layer 6 may be inserted into the mold in advance.
製造された静電容量センサは、三次元形状の取付箇所（例えば、自動車のコクピット等）に設置されるが、この際、回路パターン層１が部分的に屈曲されて複数の導電ライン５を下方に向け、この複数の導電ライン５の末端部が回路基板１０の電気コネクタ１１に着脱自在に挿着される。 The manufactured capacitance sensor is installed at a three-dimensional mounting location (for example, a cockpit of an automobile). At this time, the circuit pattern layer 1 is partially bent and the plurality of conductive lines 5 are moved downward. The terminal portions of the plurality of conductive lines 5 are detachably inserted into the electrical connector 11 of the circuit board 10.
次に、設置された静電容量センサを自動車の音響機器のスイッチとして操作したい場合には、静電容量センサの加飾層６に指を軽く接触させ、この指を左右に動かしたり、回したりして適宜動かせば良い。
すると、対向する回路パターン３の電極４と指との間の静電容量が変化して電圧を変化させ、この変化した電圧が電気信号として検出されて回路基板１０のＣＰＵに出力されることにより、自動車の音響機器が作動することとなる。
Next, when it is desired to operate the installed capacitance sensor as a switch of an acoustic device of an automobile, a finger is lightly brought into contact with the decoration layer 6 of the capacitance sensor, and the finger is moved left and right or turned. And move it accordingly.
Then, the capacitance between the electrode 4 and the finger of the circuit pattern 3 facing each other changes to change the voltage, and the changed voltage is detected as an electric signal and output to the CPU of the circuit board 10. The audio equipment of the car will be activated.
上記構成によれば、一枚のフィルムに加飾層６と回路パターン３とを積層形成するのではなく、回路パターン層１と加飾層６とをそれぞれ別体とするので、加飾層６や回路パターン３の導電ライン５が溶剤で滲んだり、損傷するおそれが全くない。したがって、回路パターン層１と加飾層６とを自由に組み合わせることができ、ユーザーの要求に最適の材料や製法で製造することができる。 According to the above configuration, the decorative layer 6 and the circuit pattern 3 are not laminated on a single film, but the circuit pattern layer 1 and the decorative layer 6 are separated from each other. In addition, there is no possibility that the conductive line 5 of the circuit pattern 3 is smeared or damaged by the solvent. Therefore, the circuit pattern layer 1 and the decorative layer 6 can be freely combined, and can be manufactured with materials and manufacturing methods that are optimum for the user's requirements.
また、三次元の静電容量センサであるから、三次元形状の取付箇所に静電容量センサを簡単に設置することができ、しかも、立体化により高級感や上質感を容易に醸し出すことができる。また、回路パターン層１を適宜屈曲したり、湾曲させることができるので、回路パターン３を水平方向ではなく、下方に位置する回路基板１０の電気コネクタ１１に接続して配線の便宜を図ることが可能となる。さらに、回路パターン層１や加飾層６用の保護層を省略して材料の削減を図ることが可能となる。 In addition, since it is a three-dimensional capacitance sensor, the capacitance sensor can be easily installed at a three-dimensional mounting location, and high-quality and high quality can be easily created by three-dimensionalization. . In addition, since the circuit pattern layer 1 can be bent or curved as appropriate, the circuit pattern 3 can be connected to the electrical connector 11 of the circuit board 10 located below rather than in the horizontal direction for convenience of wiring. It becomes possible. Furthermore, it is possible to reduce the material by omitting the protective layer for the circuit pattern layer 1 and the decorative layer 6.
なお、上記実施形態では静電容量センサを成形法により三次元成形したが、何らこれに限定されるものではない。例えば、回路パターン層１を真空成形法や圧空成形法等により三次元形成するとともに、加飾層６を真空成形法や圧空成形法等により三次元形成し、立体的な回路パターン層１と加飾層６とを中間接着層９を介して接着しても良い。また、回路パターン層１の回路パターン３を透明や半透明にしても良い。 In the above embodiment, the capacitance sensor is three-dimensionally formed by a forming method, but the present invention is not limited to this. For example, the circuit pattern layer 1 is three-dimensionally formed by a vacuum forming method, a pressure forming method, or the like, and the decorative layer 6 is three-dimensionally formed by a vacuum forming method, a pressure forming method, or the like. The decorative layer 6 may be bonded via the intermediate adhesive layer 9. Further, the circuit pattern 3 of the circuit pattern layer 1 may be transparent or translucent.
また、加飾層６を、フィルム７に加飾用の模様８を凹凸に加工することにより形成しても良い。これ以外にも、樹脂成形品に加飾を施したタイプ、ガラスに加飾や表面に凹凸を施したタイプ、これらを組み合わせたタイプ等とすることができ、一体化の有無を問うものではない。さらに、上記実施形態では中間層として中間接着層９を示したが、これに限定されるものではなく、粘着層や接着剤を使用することもできる。 Moreover, you may form the decoration layer 6 by processing the pattern 8 for decoration on the film 7 to an unevenness | corrugation. In addition to this, it is possible to use a type in which a resin molded product is decorated, a type in which glass is decorated or the surface is uneven, a type in which these are combined, etc. . Furthermore, although the intermediate | middle adhesive layer 9 was shown as an intermediate | middle layer in the said embodiment, it is not limited to this, An adhesion layer and an adhesive agent can also be used.
１ 回路パターン層
２ フィルム
３ 回路パターン
４ 電極
５ 導電ライン
６ 加飾層
８ 模様
９ 中間接着層（中間層）
１０ 回路基板
１１ 電気コネクタ
DESCRIPTION OF SYMBOLS 1 Circuit pattern layer 2 Film 3 Circuit pattern 4 Electrode 5 Conductive line 6 Decorating layer 8 Pattern 9 Intermediate adhesive layer (intermediate layer)
10 Circuit board 11 Electrical connector
Claims (1)
回路パターン層の回路パターンを、一枚のフィルムの表面に印刷される複数の電極と、フィルムの表面に印刷されて各電極の周縁部から伸びる複数の導電ラインとから形成し、
加飾層を、中間層と接着するフィルムの裏面に加飾用の模様を備えることで形成し、
回路パターン層を部分的に屈曲して回路パターンの複数の電極に屈曲した加飾層を中間層を介して積層し、回路パターンの複数の導電ラインを下方に曲げ伸ばしてその末端部を別体の回路基板に着脱自在に挿着したことを特徴とする静電容量センサ。 A circuit pattern layer having a conductive circuit pattern for detecting a change in capacitance on the surface of a single film, a decorative layer laminated on the surface side of the circuit pattern layer, a surface of the circuit pattern layer, An intermediate layer interposed between the decorative layer and adhering the circuit pattern layer and the decorative layer, and laminating the circuit pattern layer, the decorative layer, and the intermediate layer without gaps to form a laminated film, A capacitive sensor that is three-dimensionally molded by setting this laminated film in a mold and clamping it,
A circuit pattern of the circuit pattern layer is formed from a plurality of electrodes printed on the surface of one film , and a plurality of conductive lines printed on the surface of the film and extending from the peripheral edge of each electrode,
The decorative layer is formed by providing a decorative pattern on the back surface of the film to be bonded to the intermediate layer,
The circuit pattern layer is partially bent and a decorative layer bent to a plurality of electrodes of the circuit pattern is laminated via an intermediate layer, and a plurality of conductive lines of the circuit pattern are bent and extended downward to separate the end portions thereof. Capacitance sensor, which is detachably attached to the circuit board .
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