JP6290892B2 - ダイヤモンドを生成し、リアルタイム現場分析を実行するための装置及び方法 - Google Patents
ダイヤモンドを生成し、リアルタイム現場分析を実行するための装置及び方法 Download PDFInfo
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
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Description
ハウジングと、
構造的にハウジングに連結され、ダイヤモンド成長物を収納するようになった閉鎖区域を備える反応室と、
ハウジング内で反応室の上方に取り付けられ、マイクロ波を反応室に放射して、反応室内でダイヤモンドの成長を行うようになった放射手段と、
反応室の上部に設けられ、放射手段からの放射波が反応室に入射するのを可能にするようになった誘電体カバーと、
を備える。
ハウジングと、
構造的にハウジングに連結され、ダイヤモンド成長物を収納するようになった閉鎖区域を備える反応室と、
ハウジング内で反応室の上方に取り付けられ、マイクロ波を反応室に放射して、反応室内でダイヤモンドの成長を行うようになった放射手段と、
反応室の上部に設けられ、放射手段からの放射波が反応室に入射するのを可能にするようになった誘電体カバーと、
環状ハウジング内部で反応室の上方に取り付けられた記録手段と、
反応室の周辺に配置され、分析ビームを放射する手段及び分析ビームを受け取る手段を備える測定機構と、
反応室の外側に隣接して配置された顕微鏡と、
を備える。
請求項1から22に記載の装置を準備する段階と、
複数のダイヤモンド種を反応室の内部に配置する段階と、
反応室に水素ガスを供給する段階と、
放射手段から放射したマイクロ波を反応室に向かわせてプラズマ放電を形成する段階と、
反応室に混合反応ガスを供給する段階と、
ダイヤモンドを所定の厚さに成長させる段階と、
成長ダイヤモンド層の予め設定された一組の特性を測定する段階と、
測定結果に基づいて、リアルタイム現場分析を実行する段階と、
現場分析の結果に従ってプロセス条件を調整する段階と、
所望の厚さが得られるまでダイヤモンドを成長させる段階と、
を含む。
Claims (25)
- ダイヤモンドを生成し、リアルタイム現場分析を実行する装置であって、
ハウジングと、
構造的に前記ハウジングに連結され、ダイヤモンド成長物を収納するようになった閉鎖区域を備える反応室と、
前記ハウジング内で前記反応室の上方に取り付けられ、マイクロ波を前記反応室に放射して、前記反応室内でダイヤモンドの成長を行うようになった放射手段と、
前記ハウジング内部で前記反応室の上方に取り付けられた記録手段と、
前記反応室の上部に設けられ、前記閉鎖区域と、前記放射手段及び記録手段の両方との間に配置され、前記放射手段からの放射波が前記反応室に入射するのを可能にすると共に前記記録手段が前記反応室内部での前記ダイヤモンドの成長を記録するのを可能にするようになった誘電体カバーと、
を備えることを特徴とする装置。 - 前記反応室の周辺に配置され、分析ビームを放射する手段及び分析ビームを受け取る手段を備える測定機構と、
前記反応室の外側に隣接して配置された顕微鏡と、
をさらに備える、請求項1に記載の装置。 - 前記ハウジングは、前記反応室の上部に取り付けられる、請求項1又は2のいずれか1項に記載の装置。
- 前記反応室は、支持部の上部に取り付けられ、前記支持部は、密封リング手段によって前記反応室に連結されている、請求項3に記載の装置。
- 前記反応室は、前記ハウジング内部に取り付けられる、請求項1又は2のいずれか1項に記載の装置。
- 前記ハウジングは、支持部の上部に取り付けられ、前記支持部は、密封リング手段によって前記反応室に連結されている、請求項5に記載の装置。
- 前記誘電体カバーは、石英カバーの形態である、請求項1から6のいずれか1項に記載の装置。
- 前記放射手段は、マイクロ波アンテナの形態である、請求項1から7のいずれか1項に記載の装置。
- 前記反応室は、内部に同心円状に取り付けられた基板ステージを備え、前記基板ステージは、前記支持部で支持される、請求項4または請求項6に記載の装置。
- 前記支持部は、底板支持部の形態である、請求項4、請求項6、または請求項9に記載の装置。
- 前記反応室は、円筒状金属側壁を備える、請求項1から10のいずれか1項に記載の装置。
- 複数の凹部が、前記円筒状金属側壁の外面上に一体的に形成されている、請求項11に記載の装置。
- 複数のアクセスポートが、前記円筒状金属側壁上の選択された箇所に形成される、請求項11又は12に記載の装置。
- 4つのアクセスポートが存在する、請求項13に記載の装置。
- 前記ハウジングは、円筒状金属側壁を有する環状ハウジングの形態である、請求項1から14のいずれか1項に記載の装置。
- 前記記録手段は、高忠実度カメラの形態である、請求項2から15のいずれか1項に記載の装置。
- 前記測定機構は、第1及び第3のアクセスポートの近くの前記反応室の周辺に取り付けられている、請求項2に記載の装置。
- 分析ビームの放射手段は、電子銃の形態である、請求項2から17のいずれか1項に記載の装置。
- 前記顕微鏡は、前記反応室の第2のアクセスポートの外側に隣接して配置される、請求項2に記載の装置。
- 前記装置の第4アクセスポートの外側に隣接して配置された分析機器を更に備え、前記分析機器は、ラマン分光器及びXRDを含む、請求項2から19のいずれか1項に記載の装置。
- 前記基板ステージは、環状ハウジングの軸に沿って、前記ダイヤモンドの成長表面の位置を調整するための調節手段をさらに備える、請求項9に記載の装置。
- 前記調節手段は、アクチュエータ、またはステップモータの形態とすることができる、請求項21に記載の装置。
- ダイヤモンドを生成し、リアルタイム現場分析を実行する方法であって、
請求項1から22のいずれか1項に記載の装置を準備する段階と、
複数のダイヤモンド種を前記反応室の内部に配置する段階と、
前記反応室に水素ガスを供給する段階と、
前記放射手段から放射したマイクロ波を、前記誘電体カバーを通して前記反応室に向かわせてプラズマ放電を形成する段階と、
前記反応室に混合反応ガスを供給する段階と、
前記ダイヤモンドを所定の厚さに成長させる段階と、
前記誘電体カバーを通して前記記録手段によって前記反応室内部の前記ダイヤモンドの成長を記録する段階と、
前記所定の厚さに成長した前記ダイヤモンドの層の予め設定された一組の特性を測定する段階と、
前記測定結果に基づいて、リアルタイム現場分析を実行する段階と、
前記現場分析の結果に従ってプロセス条件を調整する段階と、
所望の厚さが得られるまで前記ダイヤモンドを成長させる段階と、
を含む方法。 - 前記複数のダイヤモンド種が、前記反応室の基板上に配置されることを特徴とする、請求項23に記載の前記方法。
- 最初に前記複数のダイヤモンド種をモリブデン基板ホルダ上に配置し、その後、前記モリブデン基板ホルダを基板ホルダに配置する、請求項23に記載の方法。
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PCT/SG2013/000377 WO2014035344A1 (en) | 2012-08-30 | 2013-08-29 | Apparatus and method of producing diamond |
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WO2016100115A1 (en) * | 2014-12-17 | 2016-06-23 | Ii-Vi Incorporated | Apparatus and method of manufacturing free standing cvd polycrystalline diamond films |
CN105525344B (zh) * | 2015-12-23 | 2018-05-01 | 中国科学院深圳先进技术研究院 | 用于金刚石单晶同质外延的籽晶托盘、基台组件及其应用 |
CN107021480B (zh) * | 2017-04-26 | 2019-01-08 | 金华职业技术学院 | 一种用于沉积制备金刚石的反应器 |
FR3067362B1 (fr) | 2017-06-09 | 2019-07-26 | Diam Concept | Procede et dispositif pour la surveillance d'un depot assiste par plasma microonde |
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Publication number | Publication date |
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CN104903490B (zh) | 2017-11-07 |
ES2638166T3 (es) | 2017-10-19 |
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SG11201501091RA (en) | 2015-04-29 |
US20160333497A1 (en) | 2016-11-17 |
WO2014035344A1 (en) | 2014-03-06 |
US20190284716A1 (en) | 2019-09-19 |
CN104903490A (zh) | 2015-09-09 |
KR20150048156A (ko) | 2015-05-06 |
DK2890828T3 (en) | 2017-09-11 |
PT2890828T (pt) | 2017-08-28 |
EP2890828B1 (en) | 2017-06-14 |
KR101654821B1 (ko) | 2016-09-06 |
EP2890828A1 (en) | 2015-07-08 |
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