JP6289006B2 - White photosensitive resin composition, cured product using the same, and touch panel including the cured product as a constituent component - Google Patents
White photosensitive resin composition, cured product using the same, and touch panel including the cured product as a constituent component Download PDFInfo
- Publication number
- JP6289006B2 JP6289006B2 JP2013204497A JP2013204497A JP6289006B2 JP 6289006 B2 JP6289006 B2 JP 6289006B2 JP 2013204497 A JP2013204497 A JP 2013204497A JP 2013204497 A JP2013204497 A JP 2013204497A JP 6289006 B2 JP6289006 B2 JP 6289006B2
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- Japan
- Prior art keywords
- acid
- photosensitive resin
- resin composition
- white
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims description 50
- 239000000470 constituent Substances 0.000 title 1
- 239000002253 acid Substances 0.000 claims description 32
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 30
- 239000004593 Epoxy Substances 0.000 claims description 25
- 150000001875 compounds Chemical class 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 21
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 17
- 239000000047 product Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 150000008065 acid anhydrides Chemical class 0.000 claims description 16
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 15
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 150000003628 tricarboxylic acids Chemical class 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 12
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 229930185605 Bisphenol Natural products 0.000 claims description 7
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 150000001735 carboxylic acids Chemical group 0.000 claims 2
- 125000000896 monocarboxylic acid group Chemical group 0.000 claims 1
- 150000002763 monocarboxylic acids Chemical class 0.000 claims 1
- 239000010408 film Substances 0.000 description 34
- -1 diglycidyl ether compound Chemical class 0.000 description 25
- 238000011161 development Methods 0.000 description 14
- 230000018109 developmental process Effects 0.000 description 14
- 239000000243 solution Substances 0.000 description 14
- 239000002904 solvent Substances 0.000 description 12
- 238000002845 discoloration Methods 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- 239000003513 alkali Substances 0.000 description 8
- 238000000206 photolithography Methods 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000001023 inorganic pigment Substances 0.000 description 6
- 239000000975 dye Substances 0.000 description 5
- 239000000976 ink Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229930195733 hydrocarbon Natural products 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000012860 organic pigment Substances 0.000 description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
- 235000010215 titanium dioxide Nutrition 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 206010040844 Skin exfoliation Diseases 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- QTUVQQKHBMGYEH-UHFFFAOYSA-N 2-(trichloromethyl)-1,3,5-triazine Chemical compound ClC(Cl)(Cl)C1=NC=NC=N1 QTUVQQKHBMGYEH-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
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- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
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- 239000003112 inhibitor Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
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- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- UYFJYGWNYQCHOB-UHFFFAOYSA-N 1-(4-tert-butylphenyl)ethanone Chemical compound CC(=O)C1=CC=C(C(C)(C)C)C=C1 UYFJYGWNYQCHOB-UHFFFAOYSA-N 0.000 description 1
- ONCICIKBSHQJTB-UHFFFAOYSA-N 1-[4-(dimethylamino)phenyl]propan-1-one Chemical compound CCC(=O)C1=CC=C(N(C)C)C=C1 ONCICIKBSHQJTB-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
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Description
本発明は、所望のパターン形成が可能であって、優れた耐熱変色性を有する白色感光性樹脂組成物に関する。詳しくは、白色感光性樹脂組成物、それを用いた硬化物に関するものである。この硬化物はタッチパネルの加飾用白色材料として使用できるものであり、この硬化物を構成成分とするタッチパネルに関する。 The present invention relates to a white photosensitive resin composition capable of forming a desired pattern and having excellent heat discoloration. Specifically, the present invention relates to a white photosensitive resin composition and a cured product using the same. This hardened | cured material can be used as a white material for decorating a touchscreen, and relates to the touchscreen which uses this hardened | cured material as a structural component.
近年、情報機器の多様化、携帯端末の小型軽量化の流れから、携帯電話機や、携帯情報端末、カーナビゲーションシステムを始め、タッチパネルを液晶表示パネル等のフラットディスプレイと一体型で構成した、入力表示一体型のタッチパネル式フラットディスプレイが市場に普及してきた。タッチパネルは、その構造及び検出方式の違いにより、抵抗膜型や静電容量型等の様々なタイプがある。このうち、静電容量型タッチパネルは、１枚の基板上に透光性導電膜（透光性電極）を有し、指またはペン等が接触（タッチ）することによって形成される静電容量を介して流れる微弱電流量の変化を検出する事によって被接触位置を特定するものであり、指示される内容を入力信号として受け取り液晶表示装置等を駆動する。静電容量型タッチパネルは、抵抗膜型タッチパネルと比べて、より高い透過率が得られる利点がある。 In recent years, with the trend toward diversification of information equipment and the reduction in size and weight of mobile terminals, input displays that have been integrated with flat displays such as liquid crystal display panels, such as mobile phones, mobile information terminals, car navigation systems, etc. Integrated touch panel flat displays have become popular in the market. There are various types of touch panels such as a resistance film type and a capacitance type depending on the structure and detection method. Among these, the capacitive touch panel has a translucent conductive film (translucent electrode) on a single substrate, and has a capacitance formed by contact (touch) with a finger or a pen. The position to be touched is specified by detecting a change in the amount of weak current flowing through it, and the liquid crystal display device or the like is driven by receiving the instructed content as an input signal. The capacitive touch panel has an advantage that higher transmittance can be obtained as compared with the resistive touch panel.
タッチパネルは、いずれの方式においても、通常は入力信号検出のために、あるいは画面保護のために、カバーガラス等の透明保護板がその上面に用いられている。そこで、タッチパネルの上面に透明保護板を設けるか、透明保護板自体がタッチパネルを構成するようになっている。また、透明保護板には、低反射膜、アンチグレア膜、ハードコ−ト膜、電磁シールド膜等の機能膜を具備したものがある。 In any of the touch panels, a transparent protective plate such as a cover glass is usually used on the upper surface for detecting an input signal or protecting the screen. Therefore, a transparent protective plate is provided on the upper surface of the touch panel, or the transparent protective plate itself constitutes the touch panel. Some transparent protective plates include functional films such as a low reflection film, an antiglare film, a hard coat film, and an electromagnetic shield film.
また、最近では電子機器のファッション化に伴い、携帯電話機などのモバイル端末機器の透明保護板においては、ＬＣＤ配線の遮蔽などの装飾が各種印刷法にて施されることが一般的である。例えば、特許文献１および特許文献２には、透明保護板表面に、透明窓部を有する窓形成層がハードコートフィルム裏面に予め形成されてなる加飾フィルムを積層状態に貼着した保護パネルを備えた電子機器であって、前記透明保護板が、加飾フィルムと積層された可動電極フィルムと、前記可動電極フィルムとの間に空気層を形成するように周縁部において前記可動電極フィルムと接着された固定電極板とを備えるタッチパネルで構成されている電子機器が開示されている。従来は、上記したように、加飾を施した透明保護板とタッチパネルは別々に形成され、後の工程にて組合わされることが一般的である。しかし、昨今、携帯電話機では薄型化のニ−ズが強く、また、加飾透明保護板に直接タッチパネルを形成することによる、工程数の削減等が検討されており、加飾の方法として薄厚でパターニング可能な感光性樹脂を使用した方法が注目されている。この方法を使用したタッチパネルの製造方法については特許文献３に記載されている。タッチパネル向け加飾透明保護板の加飾部の色としては黒色が一般的であるが、電子機器のファッション化に伴い、白色加飾が求められている。 In recent years, with the trend toward fashion of electronic devices, decorations such as shielding of LCD wiring are generally applied by various printing methods on transparent protective plates of mobile terminal devices such as mobile phones. For example, Patent Document 1 and Patent Document 2 include a protective panel in which a decorative film in which a window forming layer having a transparent window portion is formed in advance on the back surface of a hard coat film is attached to a transparent protective plate surface in a laminated state. The transparent protective plate is bonded to the movable electrode film at a peripheral portion so as to form an air layer between the movable electrode film laminated with a decorative film and the movable electrode film. An electronic device configured by a touch panel including the fixed electrode plate is disclosed. Conventionally, as described above, the decorated transparent protective plate and the touch panel are generally formed separately and combined in a later step. However, recently, there is a strong need for thinning mobile phones, and reduction of the number of processes by directly forming a touch panel on the decorative transparent protective plate has been studied. A method using a photosensitive resin that can be patterned is drawing attention. A touch panel manufacturing method using this method is described in Patent Document 3. Black is generally used as the color of the decorative portion of the decorative transparent protective plate for touch panels, but with the trend toward electronic fashion, white decoration is required.
しかしながら、特に白色感光性樹脂の場合、塗膜を加熱し硬化する際やタッチパネルを作製する工程でかかる熱により変色が起こり、着色することがあり、光反射率が低下してしまうおそれがある。タッチパネル向け白色感光性樹脂の場合には、特に変色と反射率の低下が目立つために、商品価値に低下をきたすおそれがあり、解決が求められている。 However, particularly in the case of a white photosensitive resin, discoloration may occur due to heat applied when the coating film is heated and cured or in the process of manufacturing the touch panel, and the light reflectance may be reduced. In the case of a white photosensitive resin for a touch panel, since discoloration and a decrease in reflectance are particularly conspicuous, there is a possibility that the commercial value may be lowered, and a solution is required.
そこで、本発明の目的は、従来技術における上記諸問題を解決し、十分な耐熱変色性を有した上で、現像特性に優れる白色感光性樹脂組成物、これを用いた硬化物及び当該硬化物を構成成分とするタッチパネルを提供することにある。 Therefore, an object of the present invention is to solve the above-mentioned problems in the prior art, and have a sufficient heat-resistant discoloration, and a white photosensitive resin composition excellent in development characteristics, a cured product using the same, and the cured product It is providing the touch panel which uses as a structural component.
本発明者らは、前記の問題点を解決すべく鋭意研究を進めた結果、特定の構造を有するアルカリ可溶性樹脂（Ａ）、光重合性モノマー（Ｂ）、光重合開始剤（Ｃ）、及び白色遮光材（Ｄ）を含む白色感光性樹脂組成物が、光によるパターン形成が可能であって、優れた耐熱変色性を有する硬化物を得ることができ、タッチパネルの加飾用として有用であることを見出した。すなわち、本発明の要旨は次のとおりである。 As a result of diligent research to solve the above-mentioned problems, the present inventors have determined that an alkali-soluble resin (A) having a specific structure, a photopolymerizable monomer (B), a photopolymerization initiator (C), and The white photosensitive resin composition containing the white light-shielding material (D) is capable of forming a pattern with light, can obtain a cured product having excellent heat discoloration, and is useful for decorating touch panels. I found out. That is, the gist of the present invention is as follows.
（１）本発明は、（Ａ）ビスフェノール類から誘導される２個のグリシジルエーテル基を有するエポキシ化合物と不飽和基含有モノカルボン酸との反応物に対して、（ａ）ジカルボン酸若しくはトリカルボン酸又はその酸無水物、及び（ｂ）テトラカルボン酸又はその酸二無水物を反応させて得られたアルカリ可溶性樹脂、（Ｂ）少なくとも１個のエチレン性不飽和結合を有する光重合性モノマー、（Ｃ）光重合開始剤、及び（Ｄ）白色遮光材を含有する白色感光性樹脂組成物であり、（Ａ）１００質量部に対して（Ｂ）が１０〜１００質量部であり、また、（Ａ）と（Ｂ）の合計量１００質量部に対して（Ｃ）が０．１〜４０質量部であり、さらに固形分中に（Ｄ）が１〜９０質量％含有されることを特徴とする白色感光性樹脂組成物である。 (1) The present invention relates to (A) a reaction product of an epoxy compound having two glycidyl ether groups derived from bisphenols and an unsaturated group-containing monocarboxylic acid, and (a) a dicarboxylic acid or a tricarboxylic acid. Or an acid anhydride thereof, and (b) an alkali-soluble resin obtained by reacting tetracarboxylic acid or an acid dianhydride thereof; (B) a photopolymerizable monomer having at least one ethylenically unsaturated bond; C) a photopolymerization initiator, and (D) a white photosensitive resin composition containing a white light-shielding material. (A) 10 to 100 parts by mass of (B) with respect to 100 parts by mass, (C) is 0.1 to 40 parts by mass with respect to 100 parts by mass of the total amount of A) and (B), and further, 1 to 90% by mass of (D) is contained in the solid content. White photosensitive resin composition .
（２）本発明はまた、（１）に加えて（Ｅ）エポキシ化合物又はエポキシ樹脂を含む白色感光性樹脂組成物である。 (2) The present invention is also a white photosensitive resin composition containing (E) an epoxy compound or an epoxy resin in addition to (1).
（３）本発明はまた、これらの白色感光性樹脂組成物をフォトリソグラフィー法によりパターニングした後、引き続き熱硬化させることにより得られる硬化物である。 (3) The present invention is also a cured product obtained by patterning these white photosensitive resin compositions by a photolithography method and then thermally curing them.
（４）本発明はまた、これら硬化物を有するタッチパネルである。 (4) The present invention is also a touch panel having these cured products.
以下に、本発明を詳細に説明する。 The present invention is described in detail below.
本発明の白色感光性樹脂組成物における（Ａ）は、ビスフェノール類から誘導される２個のグリシジルエーテル基を有するエポキシ化合物と不飽和基含有モノカルボン酸との反応物に対して、（ａ）ジカルボン酸若しくはトリカルボン酸又はその酸無水物、及び（ｂ）テトラカルボン酸又はその酸二無水物を反応させて得られたアルカリ可溶性樹脂であり、なかでも、上記（ａ）／（ｂ）のモル比が０．１〜１０で得られたものであることが好ましい。 (A) in the white photosensitive resin composition of the present invention is obtained by reacting (a) a reaction product of an epoxy compound having two glycidyl ether groups derived from bisphenols and an unsaturated group-containing monocarboxylic acid. An alkali-soluble resin obtained by reacting dicarboxylic acid or tricarboxylic acid or acid anhydride thereof, and (b) tetracarboxylic acid or acid dianhydride, among which the moles of the above (a) / (b) It is preferable that the ratio is 0.1 to 10.
（Ａ）の原料となるビスフェノール類としては、ビス（４−ヒドロキシフェニル）ケトン、ビス（４−ヒドロキシ−３，５−ジメチルフェニル）ケトン、ビス（４−ヒドロキシ−３，５−ジクロロフェニル）ケトン、ビス（４−ヒドロキシフェニル）スルホン、ビス（４−ヒドロキシ−３，５−ジメチルフェニル）スルホン、ビス（４−ヒドロキシ−３，５−ジクロロフェニル）スルホン、ビス（４−ヒドロキシフェニル）ヘキサフルオロプロパン、ビス（４−ヒドロキシ−３，５−ジメチルフェニル）ヘキサフルオロプロパン、ビス（４−ヒドロキシ−３，５−ジクロロフェニル）ヘキサフルオロプロパン、ビス（４−ヒドロキシフェニル）ジメチルシラン、ビス（４−ヒドロキシ−３，５−ジメチルフェニル）ジメチルシラン、ビス（４−ヒドロキシ−３，５−ジクロロフェニル）ジメチルシラン、ビス（４−ヒドロキシフェニル）メタン、ビス（４−ヒドロキシ−３，５−ジクロロフェニル）メタン、ビス（４−ヒドロキシ−３，５−ジブロモフェニル）メタン、２，２−ビス（４−ヒドロキシフェニル）プロパン、２，２−ビス（４−ヒドロキシ−３，５−ジメチルフェニル）プロパン、２，２−ビス（４−ヒドロキシ−３，５−ジクロロフェニル）プロパン、２，２−ビス（４−ヒドロキシ−３−メチルフェニル）プロパン、２，２−ビス（４−ヒドロキシ−３−クロロフェニル）プロパン、ビス（４−ヒドロキシフェニル）エ−テル、ビス（４−ヒドロキシ−３，５−ジメチルフェニル）エ−テル、ビス（４−ヒドロキシ−３，５−ジクロロフェニル）エ−テル、９，９−ビス（４−ヒドロキシフェニル）フルオレン、９，９−ビス（４−ヒドロキシ−３−メチルフェニル）フルオレン、９，９−ビス（４−ヒドロキシ−３−クロロフェニル）フルオレン、９，９−ビス（４−ヒドロキシ−３−ブロモフェニル）フルオレン、９，９−ビス（４−ヒドロキシ−３−フルオロフェニル）フルオレン、９，９−ビス（４−ヒドロキシ−３，５−ジメチルフェニル）フルオレン、９，９−ビス（４−ヒドロキシ−３，５−ジクロロフェニル）フルオレン、９，９−ビス（４−ヒドロキシ−３，５−ジブロモフェニル）フルオレン、４，４’−ビフェノ−ル、３，３’−ビフェノ−ル等およびこれらの誘導体が挙げられる。これらの中では、９，９−フルオレニル基を有するものが特に好適に利用される。 Examples of bisphenols used as a raw material for (A) include bis (4-hydroxyphenyl) ketone, bis (4-hydroxy-3,5-dimethylphenyl) ketone, bis (4-hydroxy-3,5-dichlorophenyl) ketone, Bis (4-hydroxyphenyl) sulfone, bis (4-hydroxy-3,5-dimethylphenyl) sulfone, bis (4-hydroxy-3,5-dichlorophenyl) sulfone, bis (4-hydroxyphenyl) hexafluoropropane, bis (4-hydroxy-3,5-dimethylphenyl) hexafluoropropane, bis (4-hydroxy-3,5-dichlorophenyl) hexafluoropropane, bis (4-hydroxyphenyl) dimethylsilane, bis (4-hydroxy-3, 5-dimethylphenyl) dimethylsilane, bis (4 Hydroxy-3,5-dichlorophenyl) dimethylsilane, bis (4-hydroxyphenyl) methane, bis (4-hydroxy-3,5-dichlorophenyl) methane, bis (4-hydroxy-3,5-dibromophenyl) methane, 2 , 2-bis (4-hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3,5-dimethylphenyl) propane, 2,2-bis (4-hydroxy-3,5-dichlorophenyl) propane, 2, , 2-bis (4-hydroxy-3-methylphenyl) propane, 2,2-bis (4-hydroxy-3-chlorophenyl) propane, bis (4-hydroxyphenyl) ether, bis (4-hydroxy-3) , 5-dimethylphenyl) ether, bis (4-hydroxy-3,5-dichlorophenyl) ether, 9, -Bis (4-hydroxyphenyl) fluorene, 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, 9,9-bis (4-hydroxy-3-chlorophenyl) fluorene, 9,9-bis (4 -Hydroxy-3-bromophenyl) fluorene, 9,9-bis (4-hydroxy-3-fluorophenyl) fluorene, 9,9-bis (4-hydroxy-3,5-dimethylphenyl) fluorene, 9,9- Bis (4-hydroxy-3,5-dichlorophenyl) fluorene, 9,9-bis (4-hydroxy-3,5-dibromophenyl) fluorene, 4,4'-biphenol, 3,3'-biphenol And derivatives thereof. Among these, those having a 9,9-fluorenyl group are particularly preferably used.
（Ａ）のアルカリ可溶性樹脂を得るにあたっては、上記ビスフェノール類とエピクロルヒドリンとを反応させて２個のグリシジルエーテル基を有するエポキシ化合物を得る。この反応の際には、一般にジグリシジルエーテル化合物のオリゴマー化を伴うため、下記一般式（Ｉ）のエポキシ化合物を得ることになる。
一般式（Ｉ）の式中、Ｒ１、Ｒ２、Ｒ３及びＲ４は、それぞれ独立して水素原子、炭素数１〜５のアルキル基、ハロゲン原子又はフェニル基を表し、Ａは、−ＣＯ−、−ＳＯ２−、−Ｃ（ＣＦ３）２−、−Ｓｉ（ＣＨ３）２−、−ＣＨ２−、−Ｃ（ＣＨ３）２−、−Ｏ−、９，９−フルオレニル基又は直結合を表す。ｌは０〜１０の数である。好ましいＲ１、Ｒ２、Ｒ３、及びＲ４は水素原子であり、好ましいＡは−Ｃ（ＣＨ３）２−、又は９，９−フルオレニル基であり、特に好ましくは９，９−フルオレニル基である。また、ｌは通常複数の値が混在するため平均値０〜１０（整数とは限らない）となるが、好ましいｌの平均値は０〜３である。ｌの値が上限値を超えると、当該エポキシ化合物使用して合成したアルカリ可溶性樹脂を用いた白色感光性樹脂組成物としたときに、組成物の粘度が大きくなりすぎて塗工がうまく行かなくなったり、アルカリ可溶性を十分に付与できずアルカリ現像性が非常に悪くなったりする。
In obtaining the alkali-soluble resin (A), the bisphenols and epichlorohydrin are reacted to obtain an epoxy compound having two glycidyl ether groups. Since this reaction generally involves oligomerization of a diglycidyl ether compound, an epoxy compound of the following general formula (I) is obtained.
In the general formula (I), R 1 , R 2 , R 3 and R 4 each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a halogen atom or a phenyl group, and A is — CO—, —SO 2 —, —C (CF 3 ) 2 —, —Si (CH 3 ) 2 —, —CH 2 —, —C (CH 3 ) 2 —, —O—, 9,9-fluorenyl group Or it represents a direct bond. l is a number from 0 to 10. Preferred R 1 , R 2 , R 3 , and R 4 are hydrogen atoms, preferred A is —C (CH 3 ) 2 —, or 9,9-fluorenyl group, particularly preferably 9,9-fluorenyl group. It is. In addition, since l generally has a plurality of values, the average value is 0 to 10 (not necessarily an integer), but the preferable average value of l is 0 to 3. If the value of l exceeds the upper limit, when a white photosensitive resin composition using an alkali-soluble resin synthesized by using the epoxy compound is used, the viscosity of the composition becomes too high and the coating cannot be performed successfully. Or sufficient alkali solubility cannot be imparted, and alkali developability becomes very poor.
次に、一般式（Ｉ）の化合物に対して、例えば不飽和基含有モノカルボン酸としてアクリル酸若しくはメタクリル酸又はこれらの両方を反応させ、これにより得られたヒドロキシ基を有する反応物に対して、（ａ）ジカルボン酸若しくはトリカルボン酸又はその酸無水物、及び（ｂ）テトラカルボン酸又はその酸二無水物を反応させる。その際、（ａ）／（ｂ）のモル比が０．１〜１０となる範囲で反応させるのが好ましい。そして、下記一般式（ＩＩ）で表されるエポキシ（メタ）アクリレート酸付加物の構造を有するアルカリ可溶性樹脂を得る。
（式中、Ｒ１、Ｒ２、Ｒ３及びＲ４は、それぞれ独立して水素原子、炭素数１〜５のアルキル基、ハロゲン原子又はフェニル基を表し、Ｒ５は、水素原子又はメチル基を表し、Ａは、−ＣＯ−、−ＳＯ２−、−Ｃ（ＣＦ３）２−、−Ｓｉ（ＣＨ３）２−、−ＣＨ２−、−Ｃ（ＣＨ３）２−、−Ｏ−、９，９−フルオレニル基又は直結合を表し、Ｘは４価のカルボン酸残基を表し、Ｙ１及びＹ２は、それぞれ独立して水素原子又は−ＯＣ−Ｚ−（ＣＯＯＨ）ｍ（但し、Ｚは２価又は３価カルボン酸残基を表し、ｍは１又は２の数を表す）を表し、ｎは１〜２０の数を表す。）
Next, with respect to the compound of general formula (I), for example, acrylic acid or methacrylic acid as an unsaturated group-containing monocarboxylic acid, or both, and a reaction product having a hydroxy group thus obtained is reacted. (A) a dicarboxylic acid or a tricarboxylic acid or an acid anhydride thereof, and (b) a tetracarboxylic acid or an acid dianhydride thereof are reacted. In that case, it is preferable to make it react in the range from which the molar ratio of (a) / (b) will be 0.1-10. And the alkali-soluble resin which has a structure of the epoxy (meth) acrylate acid adduct represented by the following general formula (II) is obtained.
Wherein R 1 , R 2 , R 3 and R 4 each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a halogen atom or a phenyl group, and R 5 represents a hydrogen atom or a methyl group. A represents —CO—, —SO 2 —, —C (CF 3 ) 2 —, —Si (CH 3 ) 2 —, —CH 2 —, —C (CH 3 ) 2 —, —O—. , 9,9-fluorenyl group or a direct bond, X represents a tetravalent carboxylic acid residue, Y 1 and Y 2 are each independently a hydrogen atom or —OC—Z— (COOH) m (wherein Z represents a divalent or trivalent carboxylic acid residue, m represents a number of 1 or 2, and n represents a number of 1 to 20.)
このエポキシ（メタ）アクリレート酸付加物（ＩＩ）は、エチレン性不飽和二重結合とカルボキシル基とを併せ持つアルカリ可溶性樹脂であるため、本発明の白色感光性樹脂組成物の（Ａ）として優れた耐熱変色性、光硬化性、良現像性、パターニング特性を与え、良好なタッチパネル用白色硬化膜パターンが得られるものである。 Since this epoxy (meth) acrylate acid adduct (II) is an alkali-soluble resin having both an ethylenically unsaturated double bond and a carboxyl group, it is excellent as (A) of the white photosensitive resin composition of the present invention. It gives heat-resistant discoloration, photocurability, good developability, and patterning characteristics, and a good white cured film pattern for a touch panel can be obtained.
本発明の（Ａ）である一般式（ＩＩ）のエポキシ（メタ）アクリレート酸付加物に利用される（ａ）ジカルボン酸若しくはトリカルボン酸又はその酸無水物としては、鎖式炭化水素ジカルボン酸若しくはトリカルボン酸又はその酸無水物や脂環式ジカルボン酸若しくはトリカルボン酸又はその酸無水物、芳香族ジカルボン酸若しくはトリカルボン酸又はその酸無水物が使用される。ここで、鎖式炭化水素ジカルボン酸若しくはトリカルボン酸又はその酸無水物としては、例えば、コハク酸、アセチルコハク酸、マレイン酸、アジピン酸、イタコン酸、アゼライン酸、シトラリンゴ酸、マロン酸、グルタル酸、クエン酸、酒石酸、オキソグルタル酸、ピメリン酸、セバシン酸、スベリン酸、ジグリコール酸等の化合物があり、更には任意の置換基の導入されたジカルボン酸若しくはトリカルボン酸又はその酸無水物でもよい。また、脂環式ジカルボン酸若しくはトリカルボン酸又はその酸無水物としては、例えば、シクロブタンジカルボン酸、シクロペンタンジカルボン酸、ヘキサヒドロフタル酸、テトラヒドロフタル酸、ノルボルナンジカルボン酸等の化合物があり、更には任意の置換基の導入されたジカルボン酸若しくはトリカルボン酸又はその酸無水物でもよい。更に、芳香族ジカルボン酸若しくはトリカルボン酸又はその酸無水物としては、例えばフタル酸、イソフタル酸、トリメリット酸等の化合物があり、更には任意の置換基の導入されたジカルボン酸若しくはトリカルボン酸又はその酸無水物でもよい。 (A) Dicarboxylic acid or tricarboxylic acid or acid anhydride thereof used in the epoxy (meth) acrylate acid adduct of general formula (II) which is (A) of the present invention includes a chain hydrocarbon dicarboxylic acid or tricarboxylic acid. An acid or an acid anhydride thereof, an alicyclic dicarboxylic acid or tricarboxylic acid or an acid anhydride thereof, an aromatic dicarboxylic acid or a tricarboxylic acid or an acid anhydride thereof is used. Here, as the chain hydrocarbon dicarboxylic acid or tricarboxylic acid or an acid anhydride thereof, for example, succinic acid, acetyl succinic acid, maleic acid, adipic acid, itaconic acid, azelaic acid, citrate malic acid, malonic acid, glutaric acid, There are compounds such as citric acid, tartaric acid, oxoglutaric acid, pimelic acid, sebacic acid, suberic acid, diglycolic acid and the like, and further, dicarboxylic acid or tricarboxylic acid having an arbitrary substituent introduced therein or an acid anhydride thereof may be used. Examples of the alicyclic dicarboxylic acid or tricarboxylic acid or acid anhydrides thereof include compounds such as cyclobutane dicarboxylic acid, cyclopentane dicarboxylic acid, hexahydrophthalic acid, tetrahydrophthalic acid, norbornane dicarboxylic acid, and more It may be a dicarboxylic acid or a tricarboxylic acid or an acid anhydride having a substituent introduced therein. Furthermore, examples of the aromatic dicarboxylic acid or tricarboxylic acid or acid anhydride thereof include compounds such as phthalic acid, isophthalic acid, trimellitic acid, and the like. An acid anhydride may be used.
また、本発明の（Ａ）である一般式（ＩＩ）のエポキシ（メタ）アクリレート酸付加物に利用される（ｂ）テトラカルボン酸又はその酸二無水物としては、鎖式炭化水素テトラカルボン酸又はその酸二無水物や脂環式テトラカルボン酸又はその酸二無水物、又は、芳香族多価カルボン酸又はその酸二無水物が使用される。ここで、鎖式炭化水素テトラカルボン酸又はその酸二無水物としては、例えば、ブタンテトラカルボン酸、ペンタンテトラカルボン酸、ヘキサンテトラカルボン酸等があり、更には置換基の導入されたテトラカルボン酸又はその酸二無水物でもよい。また、脂環式テトラカルボン酸又はその酸二無水物としては、例えば、シクロブタンテトラカルボン酸、シクロペンタンテトラカルボン酸、シクロヘキサンテトラカルボン酸、シクロへプタンテトラカルボン酸、ノルボルナンテトラカルボン酸等があり、更には置換基の導入されたテトラカルボン酸又はその酸二無水物でもよい。更に、芳香族テトラカルボン酸やその酸二無水物としては、例えば、ピロメリット酸、ベンゾフェノンテトラカルボン酸、ビフェニルテトラカルボン酸、ビフェニルエ−テルテトラカルボン酸又はその酸二無水物が挙げられ、更には置換基の導入されたテトラカルボン酸又はその酸二無水物でもよい。 The (b) tetracarboxylic acid or acid dianhydride used in the epoxy (meth) acrylate acid adduct of the general formula (II) which is (A) of the present invention includes a chain hydrocarbon tetracarboxylic acid. Or its acid dianhydride, alicyclic tetracarboxylic acid or its acid dianhydride, or aromatic polyhydric carboxylic acid or its acid dianhydride is used. Here, examples of the chain hydrocarbon tetracarboxylic acid or its acid dianhydride include butanetetracarboxylic acid, pentanetetracarboxylic acid, hexanetetracarboxylic acid, and the like, and further, a tetracarboxylic acid into which a substituent is introduced. Or its acid dianhydride may be sufficient. Examples of the alicyclic tetracarboxylic acid or its acid dianhydride include cyclobutanetetracarboxylic acid, cyclopentanetetracarboxylic acid, cyclohexanetetracarboxylic acid, cycloheptanetetracarboxylic acid, norbornanetetracarboxylic acid, Furthermore, a tetracarboxylic acid or an acid dianhydride having a substituent introduced therein may be used. Furthermore, examples of the aromatic tetracarboxylic acid and its acid dianhydride include pyromellitic acid, benzophenone tetracarboxylic acid, biphenyl tetracarboxylic acid, biphenyl ether tetracarboxylic acid, and acid dianhydrides thereof. May be a tetracarboxylic acid or an acid dianhydride having a substituent introduced therein.
本発明の（Ａ）である一般式（ＩＩ）のエポキシ（メタ）アクリレート酸付加物に使用される（ａ）ジカルボン酸若しくはトリカルボン酸又はその酸無水物と（ｂ）テトラカルボン酸又はその酸二無水物とのモル比（ａ）／（ｂ）は、上述したように０．１〜１０であるのが好ましく、より好ましくは０．２〜３となる範囲である。モル比（ａ）／（ｂ）が上記範囲を逸脱すると最適分子量が得られず、（Ａ）を使用した白色感光性樹脂組成物において、アルカリ現像性、耐熱性、耐溶剤性、パターン形状等が劣化するおそれがある。なお、モル比（ａ）／（ｂ）が小さいほどアルカリ溶解性が大となり、分子量が大となる傾向がある。 (A) dicarboxylic acid or tricarboxylic acid or acid anhydride and (b) tetracarboxylic acid or acid diacid used in the epoxy (meth) acrylate acid adduct of general formula (II) which is (A) of the present invention. As described above, the molar ratio (a) / (b) with the anhydride is preferably 0.1 to 10, more preferably 0.2 to 3. When the molar ratio (a) / (b) deviates from the above range, the optimum molecular weight cannot be obtained. In the white photosensitive resin composition using (A), alkali developability, heat resistance, solvent resistance, pattern shape, etc. May deteriorate. In addition, there exists a tendency for alkali solubility to become large and molecular weight to become large, so that molar ratio (a) / (b) is small.
また、本発明の（Ａ）である一般式（ＩＩ）のエポキシ（メタ）アクリレート酸付加物は、重量平均分子量（Ｍｗ）が２０００〜１００００の間であることが好ましく、３０００〜７０００の間であることが特に好ましい。重量平均分子量（Ｍｗ）が２０００に満たないと（Ａ）を使用した白色感光性樹脂組成物の現像時のパターンの密着性が維持できず、パターン剥がれが生じ、また、重量平均分子量（Ｍｗ）が１００００を超えると現像残渣や未露光部の残膜が残り易くなる。更に、（Ａ）は、その酸価が３０〜２００ＫＯＨｍｇ／ｇの範囲にあることが望ましい。この値が３０ＫＯＨｍｇ／ｇより小さいと（Ａ）を使用した白色感光性樹脂組成物のアルカリ現像がうまくできないか、強アルカリ等の特殊な現像条件が必要となり、２００ＫＯＨｍｇ／ｇを超えると（Ａ）を使用した白色感光性樹脂組成物へのアルカリ現像液の浸透が早くなり過ぎ、剥離現像が起きるので、何れも好ましくない。 Moreover, it is preferable that the weight average molecular weight (Mw) is between 2000-10000, and the epoxy (meth) acrylate acid adduct of general formula (II) which is (A) of this invention is between 3000-7000. It is particularly preferred. If the weight average molecular weight (Mw) is less than 2000, the adhesion of the pattern during development of the white photosensitive resin composition using (A) cannot be maintained, pattern peeling occurs, and the weight average molecular weight (Mw) If it exceeds 10,000, a development residue and a residual film of an unexposed part are likely to remain. Further, (A) desirably has an acid value in the range of 30 to 200 KOHmg / g. If this value is less than 30 KOHmg / g, alkali development of the white photosensitive resin composition using (A) cannot be performed well, or special development conditions such as strong alkali are required, and if it exceeds 200 KOHmg / g, (A) Since the alkaline developer penetrates too quickly into the white photosensitive resin composition using the above-mentioned and peeling development occurs, neither is preferable.
本発明で利用される一般式（ＩＩ）のエポキシ（メタ）アクリレート酸付加物は、上述の工程により、既知の方法、例えば特開平８−２７８６２９号公報や特開２００８−９４０１号公報等に記載の方法により製造することができる。先ず、一般式（Ｉ）のエポキシ化合物に不飽和基含有モノカルボン酸を反応させる方法としては、例えば、エポキシ化合物のエポキシ基と当モルの不飽和基含有モノカルボン酸を溶剤中に添加し、触媒（トリエチルベンジルアンモニウムクロライド、２，６−ジイソブチルフェノール等）の存在下、空気を吹き込みながら９０〜１２０℃に加熱・攪拌して反応させるという方法がある。次に、反応生成物であるエポキシアクリレート化合物の水酸基に酸無水物を反応させる方法としては、エポキシアクリレート化合物と酸二無水物および酸一無水物の所定量を溶剤中に添加し、触媒（臭化テトラエチルアンモニウム、トリフェニルホスフィン等）の存在下、９０〜１３０℃で加熱・攪拌して反応させるという方法がある。 The epoxy (meth) acrylate adduct of the general formula (II) used in the present invention is described in known methods such as JP-A-8-278629 and JP-A-2008-9401 by the above-described steps. It can manufacture by the method of. First, as a method for reacting an unsaturated group-containing monocarboxylic acid with an epoxy compound of the general formula (I), for example, an epoxy group of an epoxy compound and an equimolar amount of an unsaturated group-containing monocarboxylic acid are added to a solvent, In the presence of a catalyst (triethylbenzylammonium chloride, 2,6-diisobutylphenol, etc.), there is a method of reacting by heating and stirring at 90 to 120 ° C. while blowing air. Next, as a method of reacting an acid anhydride with a hydroxyl group of an epoxy acrylate compound as a reaction product, a predetermined amount of an epoxy acrylate compound, an acid dianhydride, and an acid monoanhydride is added to a solvent, and a catalyst (odor In the presence of tetraethylammonium bromide, triphenylphosphine, etc.), the reaction is carried out by heating and stirring at 90 to 130 ° C.
本発明の白色感光性樹脂組成物における（Ｂ）少なくとも１個のエチレン性不飽和結合を有する光重合性モノマーとしては、例えば、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート等の水酸基を有する（メタ）アクリル酸エステル類や、エチレングリコールジ（メタ）アクリレート、ジエチレングリコールジ（メタ）アクリレート、トリエチレングリコールジ（メタ）アクリレート、テトラエチレングリコールジ（メタ）アクリレート、テトラメチレングリコールジ（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、トリメチロールエタントリ（メタ）アクリレート、ペンタエリスリトールジ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、ペンタエリスリトールテトラ（メタ）アクリレート、ジペンタエリスリトールテトラ（メタ）アクリレート、グリセロール（メタ）アクリレート、ソルビトールペンタ（メタ）アクリレート、ジペンタエリスリトールペンタ（メタ）アクリレート、又はジペンタエリスリトールヘキサ（メタ）アクリレート、ソルビトールヘキサ（メタ）アクリレート、フォスファゼンのアルキレンオキサイド変性ヘキサ（メタ）アクリレート、カプロラクトン変性ジペンタエリスリトールヘキサ（メタ）アクリレート等の（メタ）アクリル酸エステル類、デンドリマー型多官能アクリレートを挙げることができ、これらの１種又は２種以上を使用することができる。また、当該少なくとも１個のエチレン性不飽和結合を有する光重合性モノマーは、光重合性基を２個以上有して不飽和基含有アルカリ可溶性樹脂の分子同士を架橋することができるものを用いることが好ましい。なお、（Ｂ）少なくとも１個のエチレン性不飽和結合を有する光重合性モノマーは遊離のカルボキシ基を有しない。 Examples of the photopolymerizable monomer (B) having at least one ethylenically unsaturated bond in the white photosensitive resin composition of the present invention include 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate. , (Meth) acrylic acid esters having a hydroxyl group such as 2-ethylhexyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (Meth) acrylate, tetramethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolethane tri (meth) acrylate, pentaerythritol di (meth) acrylate, penta Rithritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol tetra (meth) acrylate, glycerol (meth) acrylate, sorbitol penta (meth) acrylate, dipentaerythritol penta (meth) acrylate, or dipenta (Meth) acrylic esters such as erythritol hexa (meth) acrylate, sorbitol hexa (meth) acrylate, phosphazene alkylene oxide modified hexa (meth) acrylate, caprolactone modified dipentaerythritol hexa (meth) acrylate, dendrimer type polyfunctional acrylate 1 type, or 2 or more types of these can be used. The photopolymerizable monomer having at least one ethylenically unsaturated bond is one having two or more photopolymerizable groups and capable of crosslinking molecules of the unsaturated group-containing alkali-soluble resin. It is preferable. Note that (B) the photopolymerizable monomer having at least one ethylenically unsaturated bond does not have a free carboxy group.
本発明の白色感光性樹脂組成物における（Ｃ）光重合開始剤としては、例えば、アセトフェノン、２，２−ジエトキシアセトフェノン、Ｐ−ジメチルアセトフェノン、Ｐ−ジメチルアミノプロピオフェノン、ジクロロアセトフェノン、トリクロロアセトフェノン、Ｐ−ＴＥＲＴ−ブチルアセトフェノン等のアセトフェノン類、ベンゾフェノン、２−クロロベンゾフェノン、Ｐ，Ｐ‘−ビスジメチルアミノベンゾフェノン等のベンゾフェノン類、ベンジル、ベンゾイン、ベンゾインメチルエーテル、ベンゾインイソプロピルエーテル、ベンゾインイソブチルエーテル等のベンゾインエーテル類、２−（Ｏ−クロロフェニル）−４，５−フェニルビイミダゾール、２−（Ｏ−クロロフェニル）−４，５−ジ（Ｍ−メトキシフェニル）ビイミダゾール、２−（Ｏ−フルオロフェニル）−４，５−ジフェニルビイミダゾール、２−（Ｏ−メトキシフェニル）−４，５−ジフェニルビイミダゾール、２、４，５−トリアリールビイミダゾール等のビイミダゾール系化合物類、２−トリクロロメチル−５−スチリル−１，３，４−オキサジアゾ−ル、２−トリクロロメチル−５−（Ｐ−シアノスチリル）−１，３，４−オキサジアゾール、２−トリクロロメチル−５−（Ｐ−メトキシスチリル）−１，３，４−オキサジアゾール等のハロメチルチアゾール化合物類、２，４，６−トリス（トリクロロメチル）−１，３，５−トリアジン、２−メチル−４，６−ビス（トリクロロメチル）−１，３，５−トリアジン、２−フェニル−４、６−ビス（トリクロロメチル）−１，３，５−トリアジン、２−（４−クロロフェニル）−４，６−ビス（トリクロロメチル）−１，３，５−トリアジン、２−（４−メトキシフェニル）−４，６−ビス（トリクロロメチル）−１，３，５−トリアジン、２−（４−メトキシナフチル）−４，６−ビス（トリクロロＲメチル）−１，３，５−トリアジン、２−（４−メトキシスチリル）−４，６−ビス（トリクロロメチル）−１，３，５−トリアジン、２−（３，４，５−トリメトキシスチリル）−４，６−ビス（トリクロロメチル）−１，３，５−トリアジン、２−（４−メチルチオスチリル）−４，６−ビス（トリクロロメチル）−１，３，５−トリアジン等のハロメチル−Ｓ−トリアジン系化合物類、１，２−オクタンジオン，１−［４−（フェニルチオ）フェニル］−，２−（Ｏ−ベンゾイルオキシム）、１−（４−フェニルスルファニルフェニル）ブタン−１，２−ジオン−２−オキシム−Ｏ−ベンゾア−ト、１−（４−メチルスルファニルフェニル）ブタン−１，２−ジオン−２−オキシム−Ｏ−アセタート、１−（４−メチルスルファニルフェニル）ブタン−１−オンオキシム−Ｏ−アセタート等のＯ−アシルオキシム系化合物類、ベンジルジメチルケタール、チオキサンソン、２−クロロチオキサンソン、２，４−ジエチルチオキサンソン、２−メチルチオキサンソン、２−イソプロピルチオキサンソン等のイオウ化合物、２−エチルアントラキノン、オクタメチルアントラキノン、１，２−ベンズアントラキノン、２，３−ジフェニルアントラキノン等のアントラキノン類、アゾビスイソブチルニトリル、ベンゾイルパーオキサイド、クメンパーオキシド等の有機過酸化物、２−メルカプトベンゾイミダゾール、２−メルカプトベンゾオキサゾール、２−メルカプトベンゾチアゾール等のチオール化合物、トリエタノールアミン、トリエチルアミン等の第３級アミンなどが挙げられる。この中でも、高感度の白色感光性樹脂組成物を得られやすい観点から、Ｏ−アシルオキシム系化合物類を用いることが好ましい。また、これら光重合開始剤を２種類以上使用することもできる。なお、本発明でいう光重合開始剤とは、増感剤を含む意味で使用される。 Examples of the photopolymerization initiator (C) in the white photosensitive resin composition of the present invention include acetophenone, 2,2-diethoxyacetophenone, P-dimethylacetophenone, P-dimethylaminopropiophenone, dichloroacetophenone, and trichloroacetophenone. Acetophenones such as P-TERT-butylacetophenone, benzophenone, 2-chlorobenzophenone, benzophenones such as P, P′-bisdimethylaminobenzophenone, benzyl, benzoin, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether, etc. Benzoin ethers, 2- (O-chlorophenyl) -4,5-phenylbiimidazole, 2- (O-chlorophenyl) -4,5-di (M-methoxyphenyl) biimidazole , 2- (O-fluorophenyl) -4,5-diphenylbiimidazole, 2- (O-methoxyphenyl) -4,5-diphenylbiimidazole, biimidazole series such as 2,4,5-triarylbiimidazole, etc. Compounds, 2-trichloromethyl-5-styryl-1,3,4-oxadiazol, 2-trichloromethyl-5- (P-cyanostyryl) -1,3,4-oxadiazole, 2-trichloromethyl Halomethylthiazole compounds such as -5- (P-methoxystyryl) -1,3,4-oxadiazole, 2,4,6-tris (trichloromethyl) -1,3,5-triazine, 2-methyl -4,6-bis (trichloromethyl) -1,3,5-triazine, 2-phenyl-4,6-bis (trichloromethyl) -1,3,5-triazine, -(4-Chlorophenyl) -4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -1,3,5- Triazine, 2- (4-methoxynaphthyl) -4,6-bis (trichloroRmethyl) -1,3,5-triazine, 2- (4-methoxystyryl) -4,6-bis (trichloromethyl) -1 , 3,5-triazine, 2- (3,4,5-trimethoxystyryl) -4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (4-methylthiostyryl) -4, Halomethyl-S-triazine compounds such as 6-bis (trichloromethyl) -1,3,5-triazine, 1,2-octanedione, 1- [4- (phenylthio) phenyl]-, 2- (O— Benzoylo Oxime), 1- (4-phenylsulfanylphenyl) butane-1,2-dione-2-oxime-O-benzoate, 1- (4-methylsulfanylphenyl) butane-1,2-dione-2-oxime O-acyloxime compounds such as -O-acetate, 1- (4-methylsulfanylphenyl) butan-1-oneoxime-O-acetate, benzyldimethyl ketal, thioxanthone, 2-chlorothioxanthone, 2,4- Sulfur compounds such as diethylthioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, anthraquinones such as 2-ethylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-diphenylanthraquinone, azo Bisisobutylnitrile, benzoylper Side, organic peroxides such as cumene peroxide, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, thiol compounds such as 2-mercaptobenzothiazole, triethanolamine, etc. tertiary amines such as triethylamine and the like. Among these, it is preferable to use O-acyloxime compounds from the viewpoint of easily obtaining a highly sensitive white photosensitive resin composition. Two or more of these photopolymerization initiators can also be used. In addition, the photoinitiator as used in the field of this invention is used by the meaning containing a sensitizer.
本発明のタッチパネル用白色感光性樹脂組成物における（Ｄ）白色遮光材としては、白色有機顔料、白色無機系顔料が挙げられる。白色有機顔料としては、特開平１１−１２９６１３号公報に示される一般式Ａｎ-ｎ[Ｂ]の有機化合物塩（Ａはアニオン性基及びスルホン酸基を有する置換スチルベン系蛍光増白剤、置換クマリン系蛍光増白剤、置換チオフェン系蛍光増白剤等の蛍光増白剤成分、Ｂは炭素数が１５以上であるアンモニウム、ピリジニウム等の有機カチオン、ｎは、１〜９の整数を表す）や、特開平６−１２２６７４号公報に示されるエチレンビスメラミン、Ｎ，Ｎ’−ジシクロヘキシルエチレンビスメラミン等のアルキレンビスメラミン誘導体等の白色有機顔料（市販品としては、ＳｈｉｇｅｎｏｘＯＷＰ、ＳｈｉｇｅｎｏｘＯＷＰＬ（ハッコールケミカル社製））、特開２００８−１０７２号公報記載の熱可塑樹脂を用いた中空粒子、例えばスチレン−アクリル共重合体からなる中空粒子、架橋スチレン−アクリル共重合体からなる中空粒子（市販品としては、ＳＸ８６６、ＳＸ８７８２（ＪＳＲ社製））などが挙げられる。 Examples of the (D) white light shielding material in the white photosensitive resin composition for a touch panel of the present invention include white organic pigments and white inorganic pigments. Examples of the white organic pigment include organic compound salts of the general formula A n- n [B] disclosed in JP-A-11-129613 (A is a substituted stilbene fluorescent whitening agent having an anionic group and a sulfonic acid group, substituted Fluorescent brightener components such as coumarin fluorescent brighteners and substituted thiophene fluorescent brighteners, B is an organic cation such as ammonium or pyridinium having 15 or more carbon atoms, and n is an integer of 1 to 9) And white organic pigments such as alkylene bismelamine derivatives such as ethylene bismelamine and N, N′-dicyclohexylethylene bismelamine disclosed in JP-A No. 6-122647 (commercially available products include Shigenox OWP, Shigenox OWPL (Hackol Chemical Co., Ltd.). ))), Hollow particles using thermoplastic resins described in JP-A-2008-1072, for example, styrene-acrylic Hollow particles comprising a alcohol copolymer, crosslinked styrene - (Commercial products, SX866, SX8782 (JSR Corporation)) hollow particles comprising acrylic copolymer and the like.
白色無機系顔料としては、酸化クロム、酸化鉄、酸化チタン、チタニウムホワイト、酸窒化チタン、チタン窒化物等を挙げることができる。これらの遮光材は、白色有機顔料や白色無機系顔料を含めて、いずれか１種類単独でも２種以上を適宜選択して用いることもできるが、特にチタニウムホワイトが、遮光性、表面平滑性、分散安定性、樹脂との親和性が良好な点で好ましい。また、使用する白色有機白色顔料又は有機無機顔料の平均粒径（レーザー回折・散乱式粒子径測定装置による体積平均粒径）は２０〜１０００ｎｍであることがよく、５０〜７００ｎｍであることがより好ましい。 Examples of white inorganic pigments include chromium oxide, iron oxide, titanium oxide, titanium white, titanium oxynitride, and titanium nitride. These light shielding materials, including white organic pigments and white inorganic pigments, can be used alone or in appropriate selection of two or more, and in particular, titanium white has light shielding properties, surface smoothness, The dispersion stability and the affinity with the resin are preferable. Moreover, the average particle diameter (volume average particle diameter measured by a laser diffraction / scattering particle diameter measuring apparatus) of the white organic white pigment or organic inorganic pigment used is preferably 20 to 1000 nm, more preferably 50 to 700 nm. preferable.
また、本発明の白色感光性樹脂組成物は、用途に応じてグレー、ピンク等へと色目を変える、あるいは遮光性を調節するため、有色インク又は有色無機系顔料等を特に制限なく併用することができる。併用する有色無機系顔料としては、カーボンブラック、酸化クロム、酸化鉄、酸化チタン、チタンブラック、酸窒化チタン、チタン窒化物等を挙げることができる。なお、遮光性を調節する目的では、黒色の遮光層と２層構造にすることもできる。２層構造とする場合は、たとえば、表面保護用のガラス板に白色硬化膜層を形成し、その上に黒色感光性樹脂組成物を用いて遮光層を形成することができる。 In addition, the white photosensitive resin composition of the present invention may be used in combination with a colored ink or a colored inorganic pigment without particular limitation in order to change the color to gray, pink, etc. according to the use or to adjust the light shielding property. Can do. Examples of the colored inorganic pigment used in combination include carbon black, chromium oxide, iron oxide, titanium oxide, titanium black, titanium oxynitride, and titanium nitride. For the purpose of adjusting the light shielding property, a black light shielding layer and a two-layer structure can be used. In the case of a two-layer structure, for example, a white cured film layer can be formed on a glass plate for surface protection, and a light-shielding layer can be formed thereon using a black photosensitive resin composition.
併用する有色インク（黒、シアン、マゼンダ、イエローの各色インク）は特に制限はなく、インクの使用目的に適合する色相、色濃度を達成できるものであれば、公知の水溶性染料、油溶性染料及び顔料から適宜選択して用いることができる。なかでも、非水溶性の液体に均一に分散、溶解しやすい油溶性染料や顔料を用いることが好ましい。油溶性染料を用いる場合の染料の含有量は、白色感光性樹脂組成物の固形分換算で０．０５〜２０質量％の範囲であることが好ましい。 The color inks (black, cyan, magenta and yellow inks) used in combination are not particularly limited, and any known water-soluble dye or oil-soluble dye can be used as long as it can achieve a hue and color density suitable for the intended use of the ink. And pigments can be appropriately selected and used. Among these, it is preferable to use oil-soluble dyes and pigments that are easily dispersed and dissolved in a water-insoluble liquid. When using an oil-soluble dye, the content of the dye is preferably in the range of 0.05 to 20% by mass in terms of solid content of the white photosensitive resin composition.
白色感光性樹脂組成物中の（Ａ）〜（Ｄ）の各成分の構成割合については、（Ａ）１００質量部に対して、（Ｂ）が１０〜１００質量部、また、（Ｃ）が（Ａ）と（Ｂ）の合計量１００質量部に対して０．１〜４０質量部である。（Ｄ）は、固形分（光硬化反応により固形分となるモノマー成分を含む）中１〜９０質量％である。好ましくは（Ａ）１００質量部に対して、（Ｂ）が３０〜５０質量部、また、（Ｃ）が（Ａ）と（Ｂ）の合計量１００質量部に対して３〜３０質量部であり、（Ｄ）が固形分中４０〜６０質量％である。 About the component ratio of each component of (A)-(D) in white photosensitive resin composition, (B) is 10-100 mass parts with respect to (A) 100 mass parts, and (C) is. It is 0.1-40 mass parts with respect to 100 mass parts of total amounts of (A) and (B). (D) is 1-90 mass% in solid content (including the monomer component which becomes solid content by photocuring reaction). Preferably (A) is 30 to 50 parts by mass with respect to 100 parts by mass, and (C) is 3 to 30 parts by mass with respect to 100 parts by mass of the total amount of (A) and (B). Yes, (D) is 40-60 mass% in solid content.
（Ａ）１００質量部に対して（Ｂ）が１０質量部を下回ると、現像液に対する塗膜の溶解性が低くなりすぎるため、フォトリソグラフィー性能が低下する。また、（Ａ）１００質量部に対して（Ｂ）が１００質量部を上回ると、現像液に対する膜の溶解性が高くなりすぎるため、現像時の塗膜の密着性が低下する。 (A) When (B) is less than 10 parts by mass with respect to 100 parts by mass, the solubility of the coating film in the developer becomes too low, so that the photolithography performance is deteriorated. On the other hand, when (B) exceeds 100 parts by mass with respect to (A) 100 parts by mass, the solubility of the film in the developer becomes too high, so that the adhesion of the coating film during development decreases.
（Ｃ）が（Ａ）と（Ｂ）の合計量１００質量部に対して０．１質量部を下回ると、塗膜が硬化しなくなり、４０質量部を上回るとマスク開口面積よりも広い面積が硬化する為、フォトリソグラフィー性能が低下する。 When (C) is less than 0.1 parts by mass with respect to 100 parts by mass of the total amount of (A) and (B), the coating film is not cured, and when it exceeds 40 parts by mass, an area larger than the mask opening area is obtained. Since it hardens | cures, photolithography performance falls.
（Ｄ）が固形分中１質量％を下回ると遮光性が低下し配線等が透けて見えるようになってしまい、９０質量％を上回るとインクの粘度が上がり膜の塗装が困難となる。 When (D) is less than 1% by mass in the solid content, the light-shielding property is lowered and the wiring and the like can be seen through, and when it exceeds 90% by mass, the viscosity of the ink increases and the coating of the film becomes difficult.
本発明の白色感光性樹脂組成物は、上記（Ａ）〜（Ｄ）成分を主成分として含有する。この感光性樹脂組成物においては、固形分（光硬化後に固形分となるモノマー成分を含む）中に、（Ａ）〜（Ｄ）成分が合計で７０質量％以上、好ましくは８０質量％、より好ましくは９０質量％以上含むことがよい。 The white photosensitive resin composition of this invention contains the said (A)-(D) component as a main component. In this photosensitive resin composition, the total amount of the components (A) to (D) is 70% by mass or more, preferably 80% by mass in the solid content (including the monomer component that becomes a solid content after photocuring). Preferably it is 90 mass% or more.
本発明の白色感光性樹脂組成物においては、上記（Ａ）〜（Ｄ）の他に溶剤を使用して粘度を調整することが好ましい。溶剤としては、例えば、メタノール、エタノール、Ｎ−プロパノール、イソプロパノール、エチレングリコール、プロピレングリコール等のアルコール類、α−もしくはβ−テルピネオール等のテルペン類等、アセトン、メチルエチルケトン、シクロヘキサノン、Ｎ−メチル−２−ピロリドン等のケトン類、トルエン、キシレン、テトラメチルベンゼン等の芳香族炭化水素類、セロソルブ、メチルセロソルブ、エチルセロソルブ、カルビトール、メチルカルビトール、エチルカルビトール、ブチルカルビトール、プロピレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、トリエチレングリコールモノメチルエーテル、トリエチレングリコールモノエチルエーテル等のグリコールエーテル類、酢酸エチル、酢酸ブチル、セロソルブアセテート、エチルセロソルブアセテート、ブチルセロソルブアセテート、カルビトールアセテート、エチルカルビトールアセテート、ブチルカルビトールアセテート、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエチルエーテルアセテート、３−メトキシ−３−メチルブチルアセテート等の酢酸エステル類等が挙げられ、これらを用いて溶解、混合させることにより、均一な溶液状の組成物とすることができる。溶剤の量は、目標とする粘度によって変化するが、感光性樹脂組成物溶液中６０〜９０質量％の範囲が好ましい。 In the white photosensitive resin composition of this invention, it is preferable to adjust a viscosity using a solvent other than said (A)-(D). Examples of the solvent include alcohols such as methanol, ethanol, N-propanol, isopropanol, ethylene glycol, and propylene glycol, terpenes such as α- or β-terpineol, acetone, methyl ethyl ketone, cyclohexanone, N-methyl-2- Ketones such as pyrrolidone, aromatic hydrocarbons such as toluene, xylene, tetramethylbenzene, cellosolve, methyl cellosolve, ethyl cellosolve, carbitol, methyl carbitol, ethyl carbitol, butyl carbitol, propylene glycol monomethyl ether, propylene Glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monomethyl ether, Glycol ethers such as reethylene glycol monoethyl ether, ethyl acetate, butyl acetate, cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, propylene glycol mono Examples thereof include acetic esters such as ethyl ether acetate and 3-methoxy-3-methylbutyl acetate, and by dissolving and mixing them, a uniform solution-like composition can be obtained. Although the quantity of a solvent changes with target viscosity, the range of 60-90 mass% in the photosensitive resin composition solution is preferable.
本発明では、（Ａ）〜（Ｄ）成分に加えて（Ｅ）エポキシ化合物又はエポキシ樹脂を含む白色感光性樹脂組成物とすることもできるが、この（Ｅ）エポキシ化合物又はエポキシ樹脂として利用される化合物としては、フェニルグリシジルエーテル、ｐ−ブチルフェノールグリシジルエーテル、トリグリシジルイソシアヌレート、ジグリシジルイソシアヌレート、アリルグリシジルエーテル、グリシジルメタクリレート等のエポキシ化合物類、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、3,3',5,5'-テトラメチル-4,4'-ビフェノール型エポキシ樹脂、ビスフェノールフルオレン型エポキシ樹脂等のビスフェノール型エポキシ樹脂類、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂等のノボラック型エポキシ樹脂類、多価アルコールのグリシジルエーテル、多価カルボン酸のグリシジルエステル、3,4-エポキシシクロヘキセニルメチル-3',4'-エポキシシクロヘキセンカルボキシレート、2,2-ビス（ヒドロキシメチル）-1-ブタノールの1,2-エポキシ-4-（2-オキシラニル）シクロヘキサン付加物等の脂環式エポキシ化合物、エポキシシリコーン樹脂等のシリコーン骨格を有するエポキシ樹脂類等が挙げられる。好ましくはエポキシ基を２つ以上有するエポキシ化合物又はエポキシ樹脂である。 In the present invention, in addition to the components (A) to (D), a white photosensitive resin composition containing (E) an epoxy compound or an epoxy resin can be used, but this (E) is used as the epoxy compound or epoxy resin. Examples of the compound include phenyl glycidyl ether, p-butylphenol glycidyl ether, triglycidyl isocyanurate, diglycidyl isocyanurate, allyl glycidyl ether, glycidyl methacrylate and other epoxy compounds, bisphenol A type epoxy resin, bisphenol F type epoxy resin, 3 , 3 ', 5,5'-tetramethyl-4,4'-biphenol type epoxy resin, bisphenol type epoxy resin such as bisphenol fluorene type epoxy resin, phenol novolac type epoxy resin, novolat such as cresol novolac type epoxy resin Type epoxy resins, glycidyl ether of polyhydric alcohol, glycidyl ester of polycarboxylic acid, 3,4-epoxycyclohexenylmethyl-3 ', 4'-epoxycyclohexenecarboxylate, 2,2-bis (hydroxymethyl) Examples include alicyclic epoxy compounds such as 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 1-butanol, and epoxy resins having a silicone skeleton such as epoxy silicone resin. Preferably, it is an epoxy compound or an epoxy resin having two or more epoxy groups.
この（Ｅ）成分のエポキシ化合物又はエポキシ樹脂の使用量は、白色感光性樹脂組成物のアルカリ可溶性の性質が維持される範囲内で配合するのがよく、上記（Ａ）成分と（Ｂ）成分の合計１００質量部に対して５〜３０質量部の範囲で配合するのがよい。 The amount of the epoxy compound or epoxy resin used as the component (E) is preferably blended within the range in which the alkali-soluble property of the white photosensitive resin composition is maintained. The components (A) and (B) It is good to mix | blend in the range of 5-30 mass parts with respect to a total of 100 mass parts.
また、本発明の白色感光性樹脂組成物には、必要に応じて硬化促進剤、酸化防止剤、熱重合禁止剤、可塑剤、充填材、溶剤、レベリング剤、消泡剤、カップリング剤、界面活性剤等の添加剤を配合することができる。熱重合禁止剤としては、ハイドロキノン、ハイドロキノンモノメチルエーテル、ピロガロール、ＴＥＲＴ−ブチルカテコール、フェノチアジン等を挙げることができ、酸化防止剤としてはヒンダードフェノール系酸化防止剤、リン系加工熱安定剤を上げることができ、可塑剤としては、ジブチルフタレート、ジオクチルフタレート、リン酸トリクレジル等を挙げることができ、充填材としては、ガラスファイバー、シリカ、マイカ、アルミナ等を挙げることができ、消泡剤やレベリング剤としては、シリコーン系、フッ素系、アクリル系の化合物を挙げることができる。また、界面活性剤としてはフッ素系界面活性剤、シリコーン系界面活性剤等を挙げることができ、シランカップリング剤としては３−（グリシジルオキシ）プロピルトリメトキシシラン、３−イソシアナトプロピルトリエトキシシラン、３−ウレイドプロピルトリエトキシシラン等を挙げることができる。 Further, the white photosensitive resin composition of the present invention includes a curing accelerator, an antioxidant, a thermal polymerization inhibitor, a plasticizer, a filler, a solvent, a leveling agent, an antifoaming agent, a coupling agent, if necessary. Additives such as surfactants can be blended. Examples of thermal polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, pyrogallol, TERT-butylcatechol, phenothiazine, etc., and examples of antioxidants include hindered phenol antioxidants and phosphorus processing heat stabilizers. Examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, and tricresyl phosphate. Examples of the filler include glass fiber, silica, mica, alumina, and the like, and an antifoaming agent and a leveling agent. Examples thereof include silicone-based, fluorine-based, and acrylic compounds. Examples of the surfactant include a fluorine-based surfactant and a silicone-based surfactant. Examples of the silane coupling agent include 3- (glycidyloxy) propyltrimethoxysilane and 3-isocyanatopropyltriethoxysilane. , 3-ureidopropyltriethoxysilane and the like.
本発明の白色硬化物は、本発明の白色感光性樹脂組成物を用いてフォトリソグラフィー法により形成される。その製造工程としては、先ず、感光性樹脂組成物溶液を基板表面に塗布し、次いで溶媒を乾燥させた（プリベーク）後、このようにして得られた被膜の上にフォトマスクをあて、紫外線を照射して露光部を硬化させ、更にアルカリ水溶液を用いて未露光部を溶出させる現像を行ってパターンを形成し、更に後硬化としてポストベークを行う方法が挙げられる。ここで、感光性樹脂組成物溶液を塗布する基板としては、ガラス、透明フィルム（例えば、ポリカーボネート、ポリエチレンテレフタレート、ポリエーテルスルフォン等）等が用いられる。 The white cured product of the present invention is formed by a photolithography method using the white photosensitive resin composition of the present invention. As the manufacturing process, first, a photosensitive resin composition solution is applied to the substrate surface, and then the solvent is dried (pre-baked). Then, a photomask is applied on the coating film thus obtained, and ultraviolet rays are applied. There is a method in which an exposed portion is cured by irradiation, a pattern is formed by performing development that elutes an unexposed portion using an alkaline aqueous solution, and post-baking is further performed as post-curing. Here, as a substrate to which the photosensitive resin composition solution is applied, glass, a transparent film (for example, polycarbonate, polyethylene terephthalate, polyether sulfone, or the like) is used.
感光性樹脂組成物溶液を基板に塗布する方法としては、公知の溶液浸漬法、スプレー法の他、ローラーコーター機、ランドコーター機、スリットコーター機やスピナ−機を用いる方法等の何れの方法を採用することができる。これらの方法によって、所望の厚さに塗布した後、溶剤を除去する（プリベーク）ことにより、被膜が形成される。プリベークはオーブン、ホットプレート等により加熱することによって行われる。プリベークにおける加熱温度及び加熱時間は使用する溶剤に応じて適宜選択され、例えば６０〜１１０℃の温度で１〜３分間行われる。 As a method for applying the photosensitive resin composition solution to the substrate, any method such as a method using a roller coater machine, a land coater machine, a slit coater machine or a spinner machine in addition to a known solution dipping method and spray method can be used. Can be adopted. After applying to a desired thickness by these methods, the film is formed by removing the solvent (pre-baking). Pre-baking is performed by heating with an oven, a hot plate or the like. The heating temperature and heating time in the pre-baking are appropriately selected according to the solvent to be used, and are performed, for example, at a temperature of 60 to 110 ° C. for 1 to 3 minutes.
プリベーク後に行われる露光は、露光機によって行なわれ、フォトマスクを介して露光することによりパターンに対応した部分の感光性樹脂組成物のみを感光させる。露光機及びその露光照射条件は適宜選択され、超高圧水銀灯、高圧水銀ランプ、メタルハライドランプ、遠紫外線灯等の光源を用いて露光を行い、塗膜中の感光性樹脂組成物を光硬化させる。 The exposure performed after pre-baking is performed by an exposure machine, and only the photosensitive resin composition corresponding to the pattern is exposed by exposure through a photomask. The exposure machine and the exposure irradiation conditions are appropriately selected, and exposure is performed using a light source such as an ultra-high pressure mercury lamp, a high-pressure mercury lamp, a metal halide lamp, or a deep ultraviolet lamp, and the photosensitive resin composition in the coating film is photocured.
露光後のアルカリ現像は、露光されない部分の感光性樹脂組成物を除去する目的で行われ、この現像によって所望のパターンが形成される。このアルカリ現像に適した現像液としては、例えば、アルカリ金属やアルカリ土類金属の炭酸塩の水溶液、アルカリ金属の水酸化物の水溶液等を挙げることができるが、特に炭酸ナトリウム、炭酸カリウム等の炭酸塩を０．０３〜１重量％含有する弱アルカリ性水溶液を用いて２３〜２７℃の温度で現像するのがよく、市販の現像機や超音波洗浄機等を用いて微細な画像を精密に形成することができる。 The alkali development after exposure is performed for the purpose of removing the photosensitive resin composition in the unexposed portions, and a desired pattern is formed by this development. Examples of the developer suitable for the alkali development include an aqueous solution of an alkali metal or alkaline earth metal carbonate, an aqueous solution of an alkali metal hydroxide, and the like. It is good to develop at a temperature of 23 to 27 ° C. using a weakly alkaline aqueous solution containing 0.03 to 1% by weight of carbonate, and a fine image is precisely obtained using a commercially available developing machine or ultrasonic cleaner. Can be formed.
このようにして現像した後、２００〜２４０℃の温度、２０〜６０分の条件で熱硬化処理（ポストベーク）が行われる。このポストベークは、パターニングされた白色膜と基板との密着性を高めるため等の目的で行われる。これはプリベークと同様に、オーブン、ホットプレート等により加熱することによって行われる。本発明のパターニングされた白色硬化物は、以上のフォトリソグラフィー法による各工程を経て形成される。 After the development as described above, a thermosetting treatment (post-bake) is performed at a temperature of 200 to 240 ° C. for 20 to 60 minutes. This post-baking is performed for the purpose of improving the adhesion between the patterned white film and the substrate. This is performed by heating with an oven, a hot plate or the like, as in the pre-baking. The patterned white cured product of the present invention is formed through each step by the above photolithography method.
本発明の白色感光性樹脂組成物はフォトリソグラフィーによるパターン形成が可能であって、特に現像特性に優れると共に、耐熱変色性に優れた硬化物を得ることができる。 The white photosensitive resin composition of the present invention can be patterned by photolithography, and can provide a cured product that is particularly excellent in development characteristics and excellent in heat discoloration resistance.
以下、実施例により本発明を更に詳細に説明するが、本発明はこれらに限定されるものではない。 EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these.
（白色感光性樹脂組成物溶液の調製）
表１に示す組成によって配合を行い、実施例１〜２および比較例１の白色感光性樹脂組成物溶液を調製した。配合に使用した各成分は、次のとおりである。なお、表１中の数値は質量％を表す。
（Ａ）アルカリ可溶性樹脂：
（Ａ）−１ フルオレン骨格を有するエポキシアクリレート酸付加物のプロピレ ングリコールモノメチルエーテルアセテート溶液（樹脂固形分濃
度５６．５％、新日鉄住金化学（株）製 商品名Ｖ２５９ＭＥ）
（Ａ）−２ ビスフェノールＡのエポキシアクリレート酸付加物（樹脂固形分濃 度５５．１質量％、新日鉄住金化学（株）製 商品名Ｖ−７０１１ ＭＥＧＴＳ）
（Ａ）−３ カルボン酸含有２官能ウレタンアクリレートオリゴマー（樹脂固形 分濃度５３質量％、共栄社化学（株）製 商品名ＤＡＵＡ−１６７
）
（Ｂ）光重合性モノマー：ジペンタエリスリトールヘキサアクリレート（日本化薬（
株）製 商品名ＤＰＨＡ）
（Ｃ）光重合開始剤：１．２−オクタンジオン，１−［４−（フェニルチオ）−，２ −（Ｏ−ベンゾイルオキシム）］（ＢＡＳＦ社製 商品名イル ガキュアＯＸＥ０１）
（Ｄ）白色遮光材：チタニウムホワイト（平均粒径２４０ｎｍ）濃度７３質量％、プ ロピレングリコールモノメチルエーテルアセテート溶剤のチタニ ウムホワイト分散体
（Ｆ）溶剤：
（Ｆ）−１：プロピレングリコールモノメチルエーテルアセテート
（Ｆ）−２：３−メトキシ−３−メチルブチルアセテート
（Ｇ）界面活性剤
（Ｈ）シランカップリング剤（１％プロピレングリコールモノメチルエーテルアセテ
ート溶液）
(Preparation of white photosensitive resin composition solution)
Compounding was carried out according to the composition shown in Table 1, and white photosensitive resin composition solutions of Examples 1-2 and Comparative Example 1 were prepared. Each component used for the blending is as follows. In addition, the numerical value in Table 1 represents mass%.
(A) Alkali-soluble resin:
(A) -1 Propylene glycol monomethyl ether acetate solution of epoxy acrylate acid adduct having a fluorene skeleton (concentration of resin solids)
Degree 56.5%, Nippon Steel & Sumikin Chemical Co., Ltd. product name V259ME)
(A) -2 Epoxy acrylate acid adduct of bisphenol A (resin solid content concentration 55.1% by mass, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name V-7011 MEGTS)
(A) -3 Carboxylic acid-containing bifunctional urethane acrylate oligomer (resin solid content concentration 53 mass%, manufactured by Kyoeisha Chemical Co., Ltd., trade name DAUA-167
)
(B) Photopolymerizable monomer: Dipentaerythritol hexaacrylate (Nippon Kayaku (
Product name DPHA)
(C) Photopolymerization initiator: 1.2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)] (trade name “Irgacure OXE01” manufactured by BASF)
(D) White light-shielding material: titanium white (average particle size 240 nm) concentration 73 mass%, titanium white dispersion of propylene glycol monomethyl ether acetate solvent (F) solvent:
(F) -1: Propylene glycol monomethyl ether acetate (F) -2: 3-methoxy-3-methylbutyl acetate (G) Surfactant (H) Silane coupling agent (1% propylene glycol monomethyl ether acetate
Solution)
（白色感光性樹脂組成物の評価：現像性）
実施例１〜２および比較例１の白色感光性樹脂組成物溶液を、脱脂洗浄した厚さ１.２ｍｍのガラス板上にスピンコーターを用いて５μｍの乾燥膜厚になる条件で塗布・乾燥した後、フォトマスクを密着させ、５００Ｗの高圧水銀灯ランプを用いて波長３６５ｎｍの照度１０ｍＷ／ｃｍ２の紫外線を１０秒間照射した。露光後、０.４％炭酸ナトリウム水溶液を用いて２３℃で６０秒間０.１ＭＰａの圧力で現像し、塗膜の未露光部を除去し、その後、熱風乾燥機を用いて２３０℃で３０分間加熱硬化処理を行って、白色膜パターン（硬化物）を得た。そして、ガラス板上に形成された白色膜パターンを顕微鏡で確認し、以下に従ってパターン形成に関する評価を行った。結果を表２に示す。
・パターン形成
○：パターン形成可能（５μｍ〜３０μｍのライン＆スペースパターンが残る）
×：現像液に溶解せずもしくはパターン剥離
(Evaluation of white photosensitive resin composition: developability)
The white photosensitive resin composition solutions of Examples 1 and 2 and Comparative Example 1 were applied and dried on a degreased and washed 1.2 mm thick glass plate using a spin coater under conditions that resulted in a dry film thickness of 5 μm. Thereafter, a photomask was brought into close contact, and irradiation with ultraviolet rays having a wavelength of 365 nm and an illuminance of 10 mW / cm 2 was performed for 10 seconds using a 500 W high-pressure mercury lamp lamp. After the exposure, development was performed with a 0.4% aqueous sodium carbonate solution at 23 ° C. for 60 seconds at a pressure of 0.1 MPa to remove the unexposed portion of the coating film, and then using a hot air dryer at 230 ° C. for 30 minutes. A heat curing treatment was performed to obtain a white film pattern (cured product). And the white film | membrane pattern formed on the glass plate was confirmed with the microscope, and the evaluation regarding pattern formation was performed according to the following. The results are shown in Table 2.
・ Pattern formation ○: Pattern can be formed (5 to 30 μm line & space pattern remains)
×: Not dissolved in developer or pattern peeling
（白色感光性樹脂組成物の評価：耐熱変色性）
実施例１〜２および比較例１の白色感光性樹脂組成物溶液を、脱脂洗浄した厚さ１.２ｍｍのガラス板上にスピンコ−タ−を用いて１.２μｍの乾燥膜厚になる条件で塗布・乾燥した後、フォトマスクを用いないで、上記と同様の白色膜形成ガラス板全面に、５００Ｗの高圧水銀灯ランプを用いて波長３６５ｎｍの照度１０ｍＷ／ｃｍ２の紫外線を１０秒間照射した。露光後、０.４％炭酸ナトリウム水溶液を用いて２３℃で６０秒間０.１ＭＰａの圧力で現像液処理を行った。その後、熱風乾燥機を用いて２３０℃で３０分間加熱硬化処理を行った。耐熱変色性を確認するために、更に２３０℃で１５０分加熱処理を行い、分光光度計により、黄色度を測定した。結果を表２に示す。
(Evaluation of white photosensitive resin composition: heat discoloration)
The white photosensitive resin composition solutions of Examples 1 and 2 and Comparative Example 1 were degreased and washed on a glass plate having a thickness of 1.2 mm using a spin coater under the condition that a dry film thickness of 1.2 μm was obtained. After coating and drying, the entire surface of the same white film-formed glass plate as described above was irradiated with ultraviolet light having a wavelength of 365 nm and an illuminance of 10 mW / cm 2 for 10 seconds without using a photomask. After the exposure, a developer treatment was performed using a 0.4% aqueous sodium carbonate solution at 23 ° C. for 60 seconds at a pressure of 0.1 MPa. Thereafter, a heat curing treatment was performed at 230 ° C. for 30 minutes using a hot air dryer. In order to confirm the heat discoloration, heat treatment was further performed at 230 ° C. for 150 minutes, and the yellowness was measured with a spectrophotometer. The results are shown in Table 2.
上記に示した実施例１〜２と比較例１の結果から明らかなように、（Ａ）−１ フルオレン骨格を有するエポキシアクリレート酸付加物、及び（Ａ）−２ ビスフェノールＡのエポキシアクリレート酸付加物を使用することにより、パターン形成が可能であり、黄色度についても問題ない硬化物が得られることがわかった。黄色度については７を超えると黄変が顕著になり、白色の色目としては不適切なものとなってしまい、耐熱変色性が十分でないことになる。 As is clear from the results of Examples 1 and 2 and Comparative Example 1 shown above, (A) -1 an epoxy acrylate acid adduct having a fluorene skeleton, and (A) -2 an epoxy acrylate acid adduct of bisphenol A It was found that a cured product that can be formed into a pattern and that has no problem with respect to yellowness can be obtained by using. When the yellowness exceeds 7, yellowing becomes remarkable, and the white color becomes inappropriate, and the heat discoloration property is not sufficient.
本発明の白色感光性樹脂組成物は、耐熱変色性に優れた白色膜を形成することが可能である。更にフォトリソグラフィーでパターン形成できることから、既存のフォトリソグラフィー工程で形成できる利点が有り、更には、薄膜で形成出来ることから、構造体の薄型化に寄与することが可能となり、タッチパネルの作製における白色膜の形成に好適である。 The white photosensitive resin composition of the present invention can form a white film excellent in heat discoloration. Furthermore, since pattern formation can be performed by photolithography, there is an advantage that it can be formed by an existing photolithography process. Furthermore, since it can be formed by a thin film, it is possible to contribute to thinning of a structure, and a white film in manufacturing a touch panel. It is suitable for forming.
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