JP6270707B2 - Substrate liquid processing apparatus and substrate liquid processing method - Google Patents

Description

  The disclosed embodiment relates to a substrate liquid processing apparatus and a substrate liquid processing method.

  2. Description of the Related Art Conventionally, in a semiconductor device manufacturing process, liquid processing is performed for processing a substrate by supplying a processing liquid such as an etching liquid or a cleaning liquid to a substrate such as a semiconductor wafer or a glass substrate.

  A processing liquid supply system for supplying a processing liquid to a processing unit that performs liquid processing includes, for example, a container for storing the processing liquid, a circulation line for circulating the processing liquid in the container, and a branch from the circulation line. And a branch line connected to the processing unit.

  In such a treatment liquid supply system, the concentration of the treatment liquid may decrease while the treatment liquid is circulated. Therefore, in the processing liquid supply system, there is a case where a process for adjusting the concentration of the processing liquid in the container is performed by supplying a stock solution of the processing liquid to the container (see Patent Document 1).

JP 2007-109738 A

  However, if a treatment liquid having a different concentration from the treatment liquid in the container is supplied to the container, the concentration of the treatment liquid in the container fluctuates, so that a certain amount of time is required until the concentration of the treatment liquid in the container is stabilized. . If it takes a long time for the concentration of the processing liquid in the container to stabilize, for example, the processing liquid cannot be supplied to the substrate during that time, and the execution of the liquid processing must be interrupted. There is a possibility that problems such as lowering may occur.

  Note that the above-described problem is not limited to the case where the concentration of the processing liquid in the container is adjusted. For example, the same problem may occur when a new processing liquid is additionally supplied to the container.

  An object of one embodiment is to provide a substrate liquid processing apparatus and a substrate liquid processing method capable of shortening the time until the concentration of the processing liquid in a container is stabilized.

  A substrate liquid processing apparatus according to an aspect of an embodiment includes a container, a circulation line, and a partition member. The container can store a treatment liquid containing at least two kinds of liquids. The circulation line takes out the processing liquid stored in the container and returns it to the container. A partition member is arrange | positioned with a clearance gap between the side walls of a container, and partitions the inside of a container up and down. In the circulation line, the take-out port for taking out the processing liquid in the container is arranged below the partition member, and the return port for discharging the process liquid taken out from the take-out port toward the partition member is arranged above the partition member. .

  According to one aspect of the embodiment, the time until the concentration of the processing liquid in the container is stabilized can be shortened.

FIG. 1 is a diagram showing a schematic configuration of a substrate processing system according to the present embodiment. FIG. 2 is a diagram illustrating a schematic configuration of a processing liquid supply system according to the first embodiment. FIG. 3 is a diagram illustrating a configuration of a processing liquid supply system according to the first embodiment. FIG. 4 is a schematic plan sectional view of the tank. FIG. 5 is a schematic side sectional view of the tank. FIG. 6 is a diagram illustrating a schematic configuration of a processing liquid supply system to be compared. FIG. 7 is a diagram illustrating a comparison result of stirring performance between the processing liquid supply system according to the first embodiment and the processing liquid supply system illustrated in FIG. 6. FIG. 8 is a diagram illustrating a configuration of a processing liquid supply system according to the second embodiment.

(First embodiment)
Hereinafter, embodiments of a substrate liquid processing apparatus and a substrate liquid processing method disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

  FIG. 1 is a diagram showing a schematic configuration of a substrate processing system according to the present embodiment. In the following, in order to clarify the positional relationship, the X axis, the Y axis, and the Z axis that are orthogonal to each other are defined, and the positive direction of the Z axis is the vertically upward direction.

  As shown in FIG. 1, the substrate processing system 1 includes a carry-in / out station 2 and a processing station 3. The carry-in / out station 2 and the processing station 3 are provided adjacent to each other.

  The carry-in / out station 2 includes a carrier placement unit 11 and a transport unit 12. A plurality of carriers C that accommodate a plurality of substrates, in this embodiment a semiconductor wafer (hereinafter referred to as a wafer W) in a horizontal state, are placed on the carrier placement unit 11.

  The transport unit 12 is provided adjacent to the carrier placement unit 11 and includes a substrate transport device 13 and a delivery unit 14 inside. The substrate transfer device 13 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 13 can move in the horizontal direction and the vertical direction and can turn around the vertical axis, and transfers the wafer W between the carrier C and the delivery unit 14 using the wafer holding mechanism. Do.

  The processing station 3 is provided adjacent to the transfer unit 12. The processing station 3 includes a transport unit 15 and a plurality of processing units 16. The plurality of processing units 16 are provided side by side on the transport unit 15.

  The transport unit 15 includes a substrate transport device 17 inside. The substrate transfer device 17 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 17 can move in the horizontal direction and the vertical direction and can turn around the vertical axis, and transfers the wafer W between the delivery unit 14 and the processing unit 16 using a wafer holding mechanism. I do.

  The processing unit 16 performs predetermined substrate processing on the wafer W transferred by the substrate transfer device 17.

  Further, the substrate processing system 1 includes a control device 4. The control device 4 is a computer, for example, and includes a control unit 18 and a storage unit 19. The storage unit 19 stores a program for controlling various processes executed in the substrate processing system 1. The control unit 18 controls the operation of the substrate processing system 1 by reading and executing the program stored in the storage unit 19.

  Such a program may be recorded on a computer-readable storage medium, and may be installed in the storage unit 19 of the control device 4 from the storage medium. Examples of the computer-readable storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  In the substrate processing system 1 configured as described above, first, the substrate transfer device 13 of the loading / unloading station 2 takes out the wafer W from the carrier C placed on the carrier placement unit 11 and receives the taken-out wafer W. Place on the transfer section 14. The wafer W placed on the delivery unit 14 is taken out from the delivery unit 14 by the substrate transfer device 17 of the processing station 3 and carried into the processing unit 16.

  The wafer W carried into the processing unit 16 is processed by the processing unit 16, then unloaded from the processing unit 16 by the substrate transfer device 17, and placed on the delivery unit 14. Then, the processed wafer W placed on the delivery unit 14 is returned to the carrier C of the carrier placement unit 11 by the substrate transfer device 13.

  Next, a schematic configuration of the processing liquid supply system provided in the substrate processing system 1 will be described with reference to FIG. FIG. 2 is a diagram illustrating a schematic configuration of a processing liquid supply system according to the first embodiment.

  As shown in FIG. 2, the processing liquid supply system included in the substrate processing system 1 includes a processing fluid supply source 70 that supplies the processing liquid to the plurality of processing units 16.

  The processing fluid supply source 70 includes a tank 102 that stores the processing liquid, and a circulation line 104 that exits from the tank 102 and returns to the tank 102. The circulation line 104 is provided with a pump 106. The pump 106 creates a circulating flow that exits the tank 102, passes through the circulation line 104, and returns to the tank 102. A filter 108 for removing contaminants such as particles contained in the processing liquid is provided in the circulation line 104 on the downstream side of the pump 106. If necessary, auxiliary equipment (such as a heater) may be further provided in the circulation line 104.

  One or more branch lines 112 are connected to the connection area 110 set in the circulation line 104. Each branch line 112 supplies the processing liquid flowing through the circulation line 104 to the corresponding processing unit 16. Each branch line 112 can be provided with a flow rate adjusting mechanism such as a flow rate control valve, a filter, or the like, if necessary.

  The substrate processing system 1 includes a tank liquid replenishing unit 116 that replenishes the tank 102 with a processing liquid or a processing liquid constituent component. The tank 102 is provided with a drain unit 118 for discarding the processing liquid in the tank 102.

  Next, the configuration of the above-described processing liquid supply system (hereinafter referred to as “processing liquid supply system 100”) will be described in more detail with reference to FIG. FIG. 3 is a diagram illustrating a configuration of the processing liquid supply system 100 according to the first embodiment.

  As shown in FIG. 3, in the processing liquid supply system 100, the tank liquid replenishment unit 116 includes an addition line 160 and a concentration correction line 170.

  The addition line 160 is a line for supplying a new processing liquid diluted to an appropriate concentration as the concentration of the processing liquid supplied to the processing unit 16 to the tank 102, and is supplied to the new processing liquid supply source 162 via the valve 161. Connected. The new processing liquid supply source 162 may include, for example, a raw liquid supply source that supplies a raw liquid of the processing liquid and a dilution liquid supply source that supplies a dilution liquid such as DIW (pure water).

  The concentration correction line 170 is a line for supplying the stock solution of the processing solution to the tank 102, and is connected to the stock solution supply source 172 via the valve 171. The concentration correction line 170 may be connected to the stock solution supply source of the new process solution supply source 162.

  Further, the processing liquid supply system 100 includes liquid level sensors S0 to S2. The liquid level sensors S0 to S2 are arranged on the side of the tank 102, for example, and detect the liquid level of the processing liquid in the tank 102. The liquid level sensor S0 is a sensor for detecting that the processing liquid in the tank 102 has become empty, and is disposed in the vicinity of the bottom of the tank 102. The liquid level sensor S1 (corresponding to an example of a lower limit liquid level detection unit) is a sensor for detecting the lower limit liquid level in the tank 102, and is disposed above the liquid level sensor S0 and a partition member 130 described later. . The liquid level sensor S2 (corresponding to an example of the upper limit liquid level detection unit) is a sensor for detecting the upper limit liquid level in the tank 102, and is disposed above the liquid level sensor S1. The detection results by the liquid level sensors S0 to S2 are output to the control unit 18.

  When the liquid level sensor S <b> 1 detects the lower limit liquid level in the tank 102, the control unit 18 opens the valve 161 to supply new processing liquid from the addition line 160 to the tank 102. As a result, the processing liquid is added into the tank 102. Thereafter, when the liquid level sensor S2 detects the upper limit liquid level in the tank 102, the control unit 18 closes the valve 161 to stop the supply of the processing liquid from the addition line 160 to the tank 102.

  Further, the processing liquid supply system 100 includes a concentration sensor S3. The concentration sensor S3 is provided in the circulation line 104 and detects the concentration of the processing liquid flowing through the circulation line 104. The detection result by the density sensor S3 is output to the control unit 18.

  When the control unit 18 determines that the concentration of the processing liquid flowing through the circulation line 104 is lower than the predetermined concentration based on the detection result of the concentration sensor S3, the control unit 18 interrupts the substrate processing by the processing unit 16 and then turns the valve 171 for a predetermined time. By opening, a predetermined amount of the processing solution stock solution is supplied from the concentration correction line 170 to the tank 102. Thereby, the density | concentration of the process liquid in the tank 102 rises and it adjusts to an appropriate density | concentration. Thereafter, when the control unit 18 determines that the concentration of the processing liquid flowing through the circulation line 104 has reached a predetermined concentration based on the detection result of the concentration sensor S3, the substrate processing by the processing unit 16 is resumed.

  The treatment liquid supply system 100 according to the first embodiment includes a partition member 130 that partitions the tank 102 up and down. The partition member 130 is disposed with a predetermined gap between the partition member 130 and the side wall of the tank 102.

  In the processing liquid supply system 100 according to the first embodiment, the extraction port 141 of the circulation line 104 that extracts the processing liquid in the tank 102 is disposed below the partition member 130, and the processing liquid extracted from the extraction port 141. The return port 142 of the circulation line 104 that discharges toward the partition member 130 is disposed above the partition member 130.

  By disposing the return port 142 of the circulation line 104 above the partition member 130, convection of the processing liquid is generated above the partition member 130 due to the flow of the processing liquid flowing out from the return port 142. Since the processing liquid in the tank 102 is constantly stirred by this convection, even when a processing liquid having a concentration different from the processing liquid in the tank 102 is supplied from the addition line 160 or the concentration correction line 170, the tank 102. It is possible to stabilize the concentration of the treatment liquid inside. Thereby, since the interruption time of the processing unit 16 can be shortened, the throughput can be improved.

  A processing liquid having a temperature different from that of the existing processing liquid in the tank 102 may be supplied from the addition line 160 or the concentration correction line 170. However, according to the substrate processing system 1 according to the first embodiment, the processing liquid is processed. Similar to the concentration of the liquid, the temperature of the treatment liquid can be stabilized at an early stage.

  Note that the return port 142 of the circulation line 104 is brought close to the partition member 130 to such an extent that the flow of the processing liquid flowing out from the return port 142 reaches the partition member 130 and convection of the process liquid is formed in the tank 102. Be placed. The specific arrangement of the return port 142 will be described later.

  The processing liquid stirred above the partition member 130 passes through the gap between the partition member 130 and the side wall of the tank 102, moves below the partition member 130, and is an extraction port disposed below the partition member 130. 141 enters the circulation line 104.

  As described above, in the substrate processing system 1 according to the first embodiment, since the extraction port 141 of the circulation line 104 is disposed below the partition member 130, the processing liquid supplied from the addition line 160 and the concentration correction line 170. Can be prevented from directly flowing into the outlet 141.

  As shown in FIG. 3, the drain portion 118 is connected to a position downstream of the extraction port 141 and upstream of the pump 106 in the circulation line 104. The drain part 118 is provided with a valve 181.

  Next, the internal configuration of the tank 102 will be specifically described with reference to FIGS. 4 and 5. FIG. 4 is a schematic plan sectional view of the tank 102. FIG. 5 is a schematic side sectional view of the tank 102. In FIG. 4, the fixing member 180 shown in FIG. 5 is omitted.

  As shown in FIG. 4, the tank 102 has a cylindrical shape. By making the tank 102 cylindrical, the stagnation of the processing liquid is less likely to occur in the tank 102 as compared to the rectangular tank, so that the processing liquid can be more efficiently stirred. Accordingly, it is possible to further shorten the time until the concentration of the processing liquid in the tank 102 is stabilized.

  In order to make it difficult to cause stagnation in the tank 102, it is preferable that the tank 102 has a perfect circle shape in plan view, but the tank 102 may have an elliptical shape in plan view.

  As shown in FIG. 4, the return port 142 of the circulation line 104 is disposed at the center of the tank 102 in plan view. Thus, by arranging the return port 142 of the circulation line 104, which is the starting point of convection, at the center of the tank 102 in plan view, the convection of the processing liquid is less likely to be biased. Therefore, the stirring property of the treatment liquid can be improved.

  Further, as shown in FIG. 4, the supply port 163 of the addition line 160 is disposed in the vicinity of the return port 142 of the circulation line 104 in a plan view. In this way, by arranging the supply port 163 of the additional line 160 at the center of the tank 102 that is the starting point of the convection, the processing liquid supplied from the additional line 160 can be easily placed on the convection. Accordingly, it is possible to further shorten the time until the concentration of the processing liquid in the tank 102 is stabilized. Further, it is possible to prevent the convection from being hindered by the flow of the processing liquid supplied from the addition line 160.

  When the circulation line 104 and the addition line 160 are compared, the circulation line 104 that continuously supplies the processing liquid to the tank 102 has a greater contribution to convection formation than the addition line 160. For this reason, it is preferable to arrange the return port 142 of the circulation line 104 having a larger contribution to convection formation at a position closer to the center of the tank 102. In other words, the supply port 163 of the addition line 160 having a smaller contribution to convection formation than the circulation line 104 is preferably arranged at a location farther from the center of the tank 102 than the return port 142 of the circulation line 104. .

  The flow rate of the processing solution supplied from the concentration correction line 170 is small compared to the flow rate of the processing solution supplied from the circulation line 104 or the addition line 160. For this reason, the influence of the stock solution of the processing liquid supplied from the concentration correction line 170 on the convection in the tank 102 is smaller than that of the circulation line 104 and the addition line 160. For this reason, the supply port 173 of the density correction line 170 may be disposed not in the center of the tank 102 but in the vicinity of the side wall 121 of the tank 102.

  The concentration correction line 170 supplies a stock solution of the processing solution along the side wall 121 of the tank 102. In this way, splashing of the stock solution can be prevented. Further, as shown in FIG. 3, the supply port 173 of the concentration correction line 170 is disposed above the liquid level sensor S2, in other words, at a position not immersed in the processing liquid in the tank 102. As a result, the stock solution of the processing liquid can be prevented from leaking into the tank 102.

  As shown in FIG. 5, the return port 142 of the circulation line 104 and the supply port 163 of the addition line 160 are disposed below the liquid level sensor S <b> 1, in other words, below the lower limit liquid level in the tank 102. . As described above, the return port 142 of the circulation line 104 and the supply port 163 of the addition line 160 are disposed below the lower limit liquid level in the tank 102, and thus are always immersed in the processing liquid in the tank 102. Therefore, when the processing liquid is supplied from the return port 142 and the supply port 163 to the tank 102, it is possible to prevent bubbles from being mixed into the processing liquid in the tank 102 and the processing liquid from being bubbled. It is also possible to prevent the convection in the tank 102 from being hindered by bubbles. The return port 142 of the circulation line 104 and the supply port 163 of the addition line 160 are disposed above the liquid level sensor S0.

  A gap between the side wall 121 of the tank 102 and the partition member 130 is formed over the entire circumference of the partition member 130. Thereby, it is possible to make it difficult for the processing liquid to stagnate between the side wall 121 of the tank 102 and the partition member 130.

  Between the side wall 121 of the tank 102 and the partition member 130, a gap having a uniform size is provided over the entire circumference of the partition member 130. Specifically, the partition member 130 has the same circular shape as the tank 102 in a plan view, and the partition member 130 is arranged at the center of the tank 102 so that the side wall 121 and the partition member 130 of the tank 102 Can be made uniform over the entire circumference of the partition member 130. Thus, by making the gap between the side wall 121 of the tank 102 and the partition member 130 uniform over the entire circumference of the partition member 130, it is possible to make it difficult to cause stagnation of the processing liquid in the tank 102. In other words, the processing liquid in the tank 102 can be stirred more uniformly.

  The opening area D1 of the gap between the side wall 121 of the tank 102 and the partition member 130 is not less than the opening area D2 of the take-out port 141 of the circulation line 104 as shown in FIG. Further, the opening area D3 of the gap between the bottom surface 122 of the tank 102 and the partition member 130 is also equal to or larger than the opening area D2 of the take-out port 141 of the circulation line 104. Thereby, the increase in the pressure loss by the partition member 130 can be suppressed as much as possible.

  The partition member 130 is fixed in a state of being separated from the bottom surface 122 of the tank 102 by the fixing portion 180. Therefore, by changing the fixing portion 180, the minimum value D3 of the gap between the bottom surface 122 of the tank 102 and the partition member 130 can be easily adjusted.

  As shown in FIG. 5, the partition member 130 has an umbrella shape. Specifically, the upper surface 131 of the partition member 130 has a shape whose height decreases from the central portion toward the peripheral portion. Thereby, for example, when all the processing liquid in the tank 102 is discharged from the drain part 118, it is possible to suppress the processing liquid from remaining on the upper surface 131 of the partition member 130.

  Note that the bottom surface 122 of the tank 102 has a downward slope toward the center, and the outlet 141 of the circulation line 104 is disposed at the center of the bottom surface 122. Therefore, the processing liquid in the tank 102 can be efficiently introduced into the take-out port 141.

  In addition, the partition member 130 includes a through hole 133 at the center. The through hole 133 is a hole for venting air, and when the processing liquid is supplied to the empty tank 102, the air accumulated on the lower surface 132 of the partition member 130 can be removed.

  The through hole 133 is formed to have a smaller diameter than the extraction port 141 of the circulation line 104. Specifically, the opening area D4 of the through hole 133 is formed to be smaller than the opening area D2 of the extraction port 141. Therefore, it is possible to prevent the processing liquid supplied from the return port 142 of the circulation line 104 or the supply port 163 of the addition line 160 from flowing directly into the extraction port 141 of the circulation line 104 through the through hole 133.

  Further, the lower surface 132 of the partition member 130 has a shape that decreases in height from the central portion toward the peripheral portion. Thereby, the air accumulated on the lower surface 132 of the partition member 130 can be collected at the central portion of the partition member 130 and efficiently removed from the through hole 133.

  Next, the processing liquid stirring performance of the processing liquid supply system 100 according to the first embodiment will be described with reference to FIGS. 6 and 7. FIG. 6 is a diagram showing a schematic configuration of a processing liquid supply system 300 to be compared. Moreover, FIG. 7 is a figure which shows the comparison result of the stirring performance of the process liquid supply system 100 which concerns on 1st Embodiment, and the process liquid supply system 300 shown in FIG.

  FIG. 7 shows the change over time of the concentration of the processing liquid when a predetermined amount of the processing liquid having a predetermined concentration is supplied to the tank in which pure water is stored. In FIG. 7, the experimental result about the processing liquid supply system 100 which concerns on 1st Embodiment is shown as the continuous line, and the experimental result about the processing liquid supply system 300 used as a comparison object is shown with the broken line.

  As shown in FIG. 6, the conventional processing liquid supply system 300 includes a rectangular tank 301 and a circulation line 302. The take-out port 321 of the circulation line 302 is provided on the side wall of the tank 301. Further, the return port 322 of the circulation line 302 is disposed in the vicinity of the take-out port 321. Note that the capacity and circulation flow rate of the tank 301 in the treatment liquid supply system 300 are the same as the capacity and circulation flow rate of the tank 102 in the present embodiment. Further, in this experiment, a processing solution having a predetermined concentration was introduced into the tanks 102 and 301 via the circulation lines 104 and 302.

  As shown in FIG. 7, in the processing liquid supply system 100 according to the first embodiment, compared with the processing liquid supply system 300, the time until the concentration of the processing liquid is stabilized is shortened by about 27%. Further, in the processing liquid supply system 100 according to the first embodiment, the overshoot is reduced by about 40% as compared with the processing liquid supply system 300. As described above, according to the processing liquid supply system 100 according to the first embodiment, it is understood that the time until the concentration of the processing liquid in the tank 102 is stabilized is shortened and overshoot is suppressed.

  Here, the case where the concentration in the tanks 102 and 301 is increased has been described as an example, but the same applies to the case where the concentration in the tank 102.301 is decreased. That is, according to the processing liquid supply system 100 according to the first embodiment, even when a dilution liquid such as pure water is supplied into the tank 102 to reduce the concentration of the processing liquid in the tank 102, the conventional processing is performed. Compared with the liquid supply system 300, it is possible to shorten the time until the concentration of the processing liquid is stabilized, and to reduce the undershoot.

  As described above, the substrate processing system 1 (corresponding to an example of a substrate liquid processing apparatus) according to the first embodiment includes the tank 102 (corresponding to an example of a container), the circulation line 104, and the partition member 130. . The tank 102 is a processing liquid for processing the wafer W, and can store a processing liquid containing at least two kinds of liquids. The circulation line 104 takes out the processing liquid stored in the tank 102 and returns it to the tank 102. The partition member 130 is disposed with a gap between the partition wall 130 and the side wall 121 of the tank 102, and partitions the tank 102 up and down. Further, the circulation line 104 has a take-out port 141 for taking out the processing liquid in the tank 102 below the partition member 130, and a return port 142 for discharging the process liquid taken out from the take-out port 141 toward the partition member 130. It is disposed above the member 130.

  Therefore, according to the substrate processing system 1 according to the first embodiment, the time until the concentration of the processing liquid in the tank 102 is stabilized can be shortened.

(Second Embodiment)
By the way, the processing liquid supply system 100 may include lines other than the circulation line 104, the addition line 160, and the concentration correction line 170 described above. Therefore, in the second embodiment, FIG. 8 shows a configuration example of the processing liquid supply system when a recovery line for recovering the used processing liquid and a preheating line for preheating the branch line 112 are further provided. The description will be given with reference. FIG. 8 is a diagram illustrating a configuration of a processing liquid supply system 100A according to the second embodiment.

  In the following description, parts that are the same as those already described are given the same reference numerals as those already described, and redundant descriptions are omitted.

  As illustrated in FIG. 8, the processing liquid supply system 100 </ b> A according to the second embodiment includes a recovery line 113 and a preheating line 115. The recovery line 113 has one end connected to each processing unit 16 and the other end connected to the tank 102. The processing liquid used in each processing unit 16 is returned to the tank 102 through the recovery line 113.

  The preheating line 115 has one end connected to the branch line 112 via the valve 151 and the other end connected to the tank 102. When the liquid processing by the processing unit 16 is not performed, the processing liquid that has flowed into the branch line 112 flows into the preheating line 115 through the bubble 151 and is returned to the tank 102 through the preheating line 115. Thus, even when the liquid processing by the processing unit 16 is not performed, the branch line 112 can be preheated by flowing the processing liquid through the branch line 112.

  As shown in FIG. 8, the supply port 135 of the recovery line 113 and the supply port 152 of the preheating line 115 are arranged in the center of the tank 102.

  In this way, by disposing the supply port 135 of the recovery line 113 and the supply port 152 of the preheating line 115 at the center of the tank 102 that is the starting point of convection, the processing liquid supplied from these supply ports 135 and 152 can be supplied. It becomes easy to get on convection. Accordingly, it is possible to further shorten the time until the concentration of the processing liquid in the tank 102 is stabilized. Further, it is possible to prevent the convection from being hindered by the flow of the processing liquid supplied from these supply ports 135 and 152.

  Similar to the extension line 160, the recovery line 113 and the preheating line 115 contribute less to the formation of convection than the circulation line 104. For this reason, it is preferable that the supply port 135 of the recovery line 113 and the supply port 152 of the preheating line 115 are disposed at a location farther from the center of the tank 102 than the return port 142 of the circulation line 104.

  Here, as shown in FIG. 8, the supply port 163 of the addition line 160, the supply port 135 of the recovery line 113, and the supply port 152 of the preheating line 115 are arranged at the same height as the return port 142 of the circulation line 104. However, the height positions of the supply ports 135, 152, and 163 need not be the same as those of the return port 142. For example, the supply ports 135, 152, and 163 may be disposed at a higher position than the return port 142.

  In each of the above-described embodiments, an example in which the tank 102 has a cylindrical shape has been described. However, the tank 102 does not necessarily need to have a cylindrical shape. When the tank 102 is square, the partition member 130 is preferably formed in a square having the same shape as the tank 102 in plan view.

  Moreover, although each embodiment mentioned above demonstrated the example in case the partition member 130 is arrange | positioned in the center part of the tank 102, the partition member 130 may be arrange | positioned in the position shifted | deviated from the center part of the tank 102. FIG. .

  Moreover, in each embodiment mentioned above, although the example in the case where the clearance gap between the side wall 121 of the tank 102 and the partition member 130 was formed over the perimeter of the partition member 130 was demonstrated, the side wall 121 of the tank 102 and the partition member The clearance gap between 130 should just be formed in a part of peripheral part of the partition member 130 at least.

  Moreover, although each embodiment mentioned above demonstrated the example in case the partition member 130 had an umbrella shape, the shape of the partition member 130 is not limited to an umbrella shape.

  In the above-described embodiment, the example in which the processing liquid stored in the tank 102 is a processing liquid obtained by mixing the stock solution and the diluent is described. However, the processing liquid stored in the tank 102 is It is not limited to this. For example, the processing liquid stored in the tank 102 may be a processing liquid obtained by mixing at least two types of stock solutions. As described above, the treatment liquid only needs to include at least two kinds of liquids.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

DESCRIPTION OF SYMBOLS 1 Substrate processing system 16 Processing unit 100 Processing liquid supply system 102 Tank 104 Circulation line 130 Partition member 131 Upper surface 132 of partition member Lower surface 133 of partition member 141 Outlet port 142 Return port 160 Additional line 163 Additional port supply port 170 Concentration Correction line 173 Concentration correction line supply port

Claims (13)

A container capable of storing a treatment liquid comprising at least two kinds of liquids;
A circulation line for removing the processing liquid stored in the container and returning it to the container;
A partition member that is arranged with a gap between the side wall of the container and partitions the inside of the container up and down,
The circulation line is
An outlet for taking out the processing liquid in the container is disposed below the partition member, and a return port for discharging the processing liquid taken out from the outlet toward the partition member is disposed above the partition member. A substrate liquid processing apparatus. The return port of the circulation line is
The substrate liquid processing apparatus according to claim 1, wherein the substrate liquid processing apparatus is disposed at a central portion of the container in a plan view. The gap between the side wall of the container and the partition member is
The substrate liquid processing apparatus according to claim 1, wherein the substrate liquid processing apparatus is formed over the entire circumference of the partition member. The gap between the side wall of the container and the partition member is
The substrate liquid processing apparatus according to claim 1, wherein the size is uniform over the entire circumference of the partition member. The opening area of the gap between the side wall of the container and the partition member is
It is more than the opening area of the said extraction port. The substrate liquid processing apparatus as described in any one of Claims 1-4 characterized by the above-mentioned. The upper surface of the partition member is
The substrate liquid processing apparatus according to claim 1, wherein the substrate liquid processing apparatus has a shape with a height that decreases from a central portion toward a peripheral portion. The partition member is
With a through hole in the center,
The lower surface of the partition member is
The substrate liquid processing apparatus according to claim 1, wherein the substrate liquid processing apparatus has a shape with a height that decreases from a central portion toward a peripheral portion. The opening area of the through hole is
The substrate liquid processing apparatus according to claim 7, wherein the substrate liquid processing apparatus is smaller than an opening area of the extraction port. A lower limit liquid level detection unit that is disposed above the partition member and detects a lower limit liquid level in the container;
The return port of the circulation line is
The substrate liquid processing apparatus according to claim 1, wherein the substrate liquid processing apparatus is disposed below the lower limit liquid level detection unit. The container is
It has cylindrical shape. The substrate liquid processing apparatus as described in any one of Claims 1-9 characterized by the above-mentioned. An additional line for supplying new processing solution to the container;
The supply port of the extension line is
It arrange | positions in the vicinity of the return port of the said circulation line in planar view. The substrate liquid processing apparatus as described in any one of Claims 1-10 characterized by these. The treatment liquid is
A treatment liquid obtained by mixing at least two types of stock solutions or a treatment liquid obtained by mixing a stock solution and a diluent;
A concentration correction line for supplying the stock solution to the container;
An upper limit liquid level detection unit for detecting an upper limit liquid level in the container,
The supply port of the density correction line is
The substrate liquid processing apparatus according to claim 1, wherein the substrate liquid processing apparatus is disposed above the upper limit liquid level detection unit. A container capable of storing a processing liquid comprising at least two kinds of liquids, wherein the processing member is disposed in the container in which a partition member for vertically partitioning the container is disposed with a gap between the container and a side wall of the container. A storage process for storing liquid;
A circulation port in which a take-out port for taking out the processing liquid in the container is arranged below the partition member, and a return port for discharging the treatment liquid taken out from the take-out port toward the partition member is arranged above the partition member. And a circulation step of taking out the processing liquid stored in the container and returning it to the container using a line.

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