JP6269214B2 - Phosphor plate, light emitting device, method for manufacturing phosphor plate, and method for manufacturing light emitting device - Google Patents

Description

  The present invention relates to a phosphor plate containing a fluorescent substance that converts a wavelength, a light emitting device using the phosphor plate, a method for manufacturing the phosphor plate, and a method for manufacturing the light emitting device.

  In general, in a light-emitting device having a light-emitting element such as an LED, white light extraction efficiency is increased by using a phosphor layer or a phosphor plate containing a phosphor that converts a wavelength. For example, in a conventional light emitting device, the blue light emitting element has a coating layer containing a phosphor that emits yellow light by absorbing part of the blue light, and the blue light of the light source and the yellow light from the coating layer are mixed. In order to obtain a pseudo white color, a blue and yellow colors having a complementary color relationship are mixed. In the light emitting device described above, a mixture of yttrium-aluminum-garnet (YAG: Ce) powder and resin activated with cerium is used as the coating layer.

  In order to combine with a light emitting element such as an LED, as an example of a phosphor layer or phosphor plate containing a phosphor that converts a wavelength, for example, conventionally, a light emitting diode substrate as described in Patent Document 1 has been proposed. Yes. This light emitting diode substrate comprises a single crystal layer on which a light emitting diode element can be formed and at least two oxide phases selected from a single metal oxide and a composite metal oxide in a continuous and three-dimensional manner. And a ceramic composite layer for light conversion made of a solidified body entangled with each other. Further, the light emitting diode substrate includes a metal element oxide in which at least one of the oxide phases in the solidified body emits fluorescence, and the single crystal layer and the ceramic composite layer for light conversion are directly formed. In other words, the single crystal layer and the ceramic composite layer for light conversion are bonded with silica.

International exchange number WO2007-018222

  However, the light emitting diode substrate described above contains a metal element oxide that emits fluorescence in the oxide phase in the solidified body. However, the type of fluorescence is specified in the oxide phase, and light that mixes colors. The degree of freedom for setting was limited. Further, in the above light emitting diode substrate, a heat treatment at a high temperature is required when forming a solidified oxide phase containing a fluorescent material, and thus a heat-sensitive fluorescent material could not be used. .

  The present invention was devised in view of the above-described problems, and can reduce the restriction on the degree of freedom of light mixing while maintaining the light extraction efficiency, and can also ease the restriction on the use of fluorescent substances. An object of the present invention is to provide a phosphor plate that can be produced, a method for producing the same, a light emitting device, and a method for producing the same.

In order to solve the above-described problems, the light emitting device according to the present invention is configured as follows. That is, in the phosphor plate, the first light conversion portion in which the oxide phase and the fluorescent substance-containing oxide phase are provided in a spot shape in a cross-sectional view, and the oxide phase and the fluorescent substance-containing binder phase in a spot shape in a cross-sectional view. and a second light conversion unit provided comprises a said first oxide phase and the oxide phase of the light conversion unit and the second light conversion unit are continuous at least in part, the The fluorescent substance-containing oxide phase of the first light conversion part and the fluorescent substance-containing binder phase of the second light conversion part are arranged side by side in the plate thickness direction.

  Moreover, in the method for manufacturing a phosphor plate according to the present invention, a solidified body having a plurality of oxide phases provided in a cross-sectional view is formed by solidifying after melting a mixture of a phosphor and an oxide. A solidified body forming step, an etching step in which the solidified body is immersed in an etching solution and one of the oxide phases of the solidified body is etched to a predetermined depth in the thickness direction, and the void is formed. A coating step of applying a fluorescent material-containing binder containing a fluorescent material to a binder on the surface of the solidified body, an impregnation step of impregnating the fluorescent material-containing binder in the gap, and a fluorescent material impregnated in the solidified body And a curing step of curing the containing binder.

In addition, the light emitting device includes the above-described phosphor plate and a light emitting element in which a semiconductor layer is stacked on the substrate, and the phosphor plate and the substrate are joined.
Furthermore, in the method for manufacturing a light emitting device for manufacturing the above light emitting device, the above-described phosphor plate is manufactured and prepared, and a preparatory step for manufacturing and preparing a plurality of light emitting elements by stacking a semiconductor layer on the substrate. A bonding step of bonding the substrate formed of the same component as any one of the oxide phases of the phosphor plate, and cutting the bonded body of the phosphor plate and the substrate for each light emitting element. And an individualization step for individualizing.

The phosphor plate manufacturing method and the light emitting device manufacturing method thereof according to the present invention have excellent effects as described below.
Since the phosphor plate and the light emitting device can be selectively provided with the phosphor-containing binder in the second light conversion unit, it is possible to relax the restriction on the degree of freedom of light mixing while maintaining the light extraction efficiency. In addition, restrictions on the use of fluorescent substances can be relaxed.

  In the method for manufacturing a phosphor plate and the method for manufacturing a light emitting device, the void formed by etching and removing at least a part of the oxide phase is impregnated with a binder containing a fluorescent substance, and cured, whereby the oxide phase and A light conversion part with a fluorescent substance-containing binder can be formed. Thereby, in the manufacturing method of a fluorescent substance plate and the manufacturing method of a light-emitting device, the fluorescent substance which mixes desired light can be selected, and the restriction | limiting of the fluorescent substance with respect to a heat | fever can also be eased.

1 is a perspective view schematically showing a configuration of a phosphor plate according to an embodiment of the present invention, with a part thereof omitted and a part thereof being a cross section. (A)-(d) is a schematic diagram which shows typically the procedure of the manufacturing method of the fluorescent substance plate which concerns on embodiment of this invention. (A)-(d) is a schematic diagram which shows typically the procedure of the manufacturing method of the fluorescent substance plate which concerns on embodiment of this invention. (A) is a figure which shows typically the state before etching the 1st light conversion part of the fluorescent substance plate which concerns on embodiment of this invention as a cross-sectional perspective view, (b) is embodiment of this invention. The figure which shows typically the state which etched the 1st light conversion part of the phosphor plate which concerns on as a cross-sectional perspective view, (c) is etching the 1st light conversion part of the phosphor plate which concerns on embodiment of this invention It is a figure which shows typically the state which formed the fluorescent substance containing binder phase in the space | gap formed by doing as a cross-sectional perspective view. (A)-(d) is sectional drawing which shows typically the other structure of the fluorescent substance plate which concerns on embodiment of this invention, respectively. (A), (b) is sectional drawing which shows typically the manufacturing method of the light-emitting device which concerns on embodiment of this invention. It is sectional drawing which shows typically the other structure of the light-emitting device which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the light-emitting device with a support substrate which concerns on embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the size, positional relationship, and the like of members shown in each drawing may be partially exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same configuration, member or the same configuration and member, and detailed description will be omitted as appropriate. Moreover, in each structure, the difference in a layer, a film | membrane, and a board is only an expression, and does not change with thickness formation ranges etc.

<Configuration of phosphor plate>
As shown in FIG. 1, the phosphor plate 1 includes a first light conversion unit 4 and a second light conversion unit 6 that are continuously and integrally provided as a solidified body. In the phosphor plate 1, the first light conversion unit 4 includes a plurality of oxides (two shown in FIG. 1) containing an oxide selected from a single metal oxide and a composite metal oxide. Phases 2 and 3 are formed as solidified bodies that are patchy in cross-sectional view. Furthermore, in the phosphor plate 1, the second light conversion unit 6 includes an oxide phase 2 that is one of the oxides described above, a phase including the fluorescent material 5 a and the binder 5 b of the fluorescent material 5 a (hereinafter, “ This is referred to as a “fluorescent substance-containing binder phase”.

  The first oxide phase of the phosphor plate 1 is configured, for example, as a single metal oxide oxide phase (hereinafter referred to as “single metal oxide phase”) 2. The second oxide phase of the phosphor plate 1 is, for example, an oxide phase of a composite metal oxide formed of a ceramic composite material including the fluorescent material 3a (hereinafter referred to as “composite metal oxide phase”). 3 is configured. The phosphor plate 1 transmits light from a light emitting element 12 described later, converts the wavelength of light corresponding to the fluorescent materials 3a and 5a, and outputs the light as, for example, white light. Hereinafter, each structure of the phosphor plate 1 will be described in more detail.

  The first light conversion section 4 has a single metal oxide phase 2 containing a single metal oxide and a composite metal oxide phase 3 formed of a ceramic composite material which is a composite metal oxide in a patchy state ( It consists of a solidified body provided continuously and three-dimensionally intertwined with each other. In the first light conversion unit 4, the composite metal oxide contains a fluorescent material 3 a that is an element or the like that exhibits fluorescence. The single metal oxide used here is an oxide of one kind of metal, and the composite metal oxide is an oxide of two or more kinds of metals. Each of the oxide phases 2 and 3 is formed in an irregular patch shape in a cross-sectional view and formed in a structure intertwined with each other.

Examples of the single metal oxide include aluminum oxide (Al ₂ O ₃ ), zirconium oxide (ZrO ₂ ), magnesium oxide (MgO), silicon oxide (SiO ₂ ), titanium oxide (TiO ₂ ), barium oxide (BaO), In addition to beryllium oxide (BeO), calcium oxide (CaO), chromium oxide (Cr ₂ O ₃ ), etc., rare earth element oxides (La ₂ O ₃ , Y ₂ O ₃ , CeO ₂ , Pr ₆ O ₁₁ , Nd ₂ O) ₃ , Sm ₂ O ₃ , Gd ₂ O ₃ , Eu ₂ O ₃ , Tb ₄ O ₇ , Dy ₂ O ₃ , Ho ₂ O ₃ , Er ₂ O ₃ , Tm ₂ O ₃ , Yb ₂ O ₃ , Lu ₂ O ₃ ). In addition, it is preferable that the single metal oxide phase 2 is formed, for example with aluminum oxide as above-mentioned single metal oxide.

Further, as the composite metal oxide, LaAlO ₃ , CeAlO ₃ , PrAlO ₃ , NdAlO ₃ , SmAlO ₃ , EuAlO ₃ , GdAlO ₃ , DyAlO ₃ , ErAlO ₃ , Yb ₄ Al ₂ O ₉ , Y ₃ Al ₅ O ₁₂ , _{lu 3 Al 6 O 12, Er} 3 Al 5 O 12, Tb 3 Al 5 O 12, 11Al 2 O 3 · La 2 O 3, 11Al 2 O 3 · Nd 2 O 3, 3Dy 2 O 3 · 5Al 2 O 3 2Dy ₂ O ₃ · Al ₂ O ₃ , 11Al ₂ O ₃ · Pr ₂ O ₃ , EuAl ₁₁ O ₁₈ , 2Gd ₂ O ₃ · Al ₂ O ₃ , 11Al ₂ O ₃ · Sm ₂ O ₃ , Yb ₃ Al _{5 O 12, CeAl 11 O 18,} Er 4 Al 2 O 9 , and the like.

For the composite metal oxide phase 3, it is preferable to select an oxide having good compatibility with the single metal oxide phase 2, for example, a composite metal oxide such as CeAlO ₃ . Further, as the fluorescent material 3a contained in the composite metal oxide phase 3, generally used oxides, nitrides, oxynitrides and the like can be used. As such a fluorescent material 3a, for example, a YAG-based phosphor obtained by activating YAG (yttrium, aluminum, garnet) with Ce, a nitride-based phosphor activated with a lanthanoid-based element such as Eu or Ce, or an oxynitride System phosphors and the like.

As the fluorescent material 3a, a material based on an yttrium-aluminum oxide-based phosphor activated with Ce (cerium), which can be excited by light emitted from the light emitting element 12 to be described later, can be used. Specific examples of the yttrium / aluminum oxide phosphor include YAlO ₃ : Ce, Y ₃ Al ₅ O ₁₂ Y: Ce (YAG: Ce), Y ₄ Al ₂ O ₉ : Ce, and a mixture thereof. Can be mentioned. The yttrium / aluminum oxide phosphor may contain at least one of Ba, Sr, Mg, Ca, and Zn.

In addition, as the fluorescent material 3a capable of absorbing blue, blue-green, and green and emitting red, sapphire (aluminum oxide) phosphor activated with Eu and / or Cr, activated with Eu and / or Cr And nitrogen-containing Ca—Al ₂ O ₃ —SiO ₂ phosphor (oxynitride fluorescent glass). Further, for example, an Eu-activated β sialon phosphor having a composition formula of Si _6-z Al _z O _z N _8-z : Eu (0 <z <4.2), (Y, Lu) ₃ (Al, Ga) ₅ O ₁₂ : A rare earth aluminate phosphor represented by Ce, white light is generated by mixing light from the light emitting element 12 and light from the fluorescent material 3a by using one or a combination of these fluorescent materials 3a. You can also get

Further, a blue system can be obtained by combining the YAG phosphor activated with Ce and the nitrogen-containing Ca—Al—Si—O—N oxynitride fluorescent glass activated with Eu and / or Cr. By using the light emitting element 12 that can emit light, the light emitting device 10 that includes RGB (red, green, and blue) components with high luminance can be formed. For this reason, an arbitrary intermediate color can be formed very simply by adding a desired pigment.
The fluorescent material 3a added to the composite metal oxide phase 3 is one that can withstand the temperature when forming as a solidified body.

  As shown in FIG. 1, the second light conversion unit 6 includes a single metal oxide phase 2 and a fluorescent substance-containing binder phase 5 in a patch shape (single metal oxide phase 2 and a fluorescent substance-containing binder phase). 5 is formed of a solidified body which is continuously and three-dimensionally entangled with each other. In the second light conversion unit 6, the single metal oxide phase 2 and the single metal oxide phase 2 of the first light conversion unit 4 are continuously formed at least partially. The single metal oxide phase 2 of the first light conversion unit 4 and the single metal oxide phase 2 of the second light conversion unit 4 are integrally formed as a solidified body in the plate thickness direction in advance as will be described later. In this case, the first light conversion unit 4 is always connected to the second light conversion unit 6 in the thickness direction, and either the first light conversion unit 4 or the second light conversion unit 6 is used. And a state including an independent part. Therefore, the single metal oxide 2 of the second light conversion unit 6 and the single metal oxide phase 2 of the first light conversion unit 4 are configured to be continuously formed at least partially.

  As will be described later, the fluorescent substance-containing binder phase 5 includes a second light conversion unit in the composite metal oxide phase 3 that is continuously formed from the first light conversion unit 4 to the second light conversion unit 6. 6 is formed by removing the mixed metal oxide phase 3 corresponding to 6 and then impregnating and filling it. That is, the first light conversion unit 4 and the second light conversion unit 6 are integrally formed as a solidified body by solidifying the composite material after melting the fluorescent material and the raw metal oxide. And the fluorescent substance containing binder phase 5 is formed by filling the space | gap formed by removing a part of the composite metal oxide phase 3 of the solidified body with the fluorescent substance containing binder. The fluorescent substance-containing binder phase 5 is arranged side by side so as to be in contact with the portion of the composite metal oxide phase 3 that is arranged side by side with a space therebetween and in contact with the composite metal oxide phase 3 without a space. And there is a part. That is, the fluorescent substance-containing binder phase 5 is configured to be at least partially continuous with the composite metal oxide phase 3 and arranged side by side with a space in the other portions.

The fluorescent substance-containing binder phase 5 includes a fluorescent substance 5a and a binder 5b that is a binder of the fluorescent substance 5a.
The fluorescent material 5a can be the same as the fluorescent material 3a described above, and generally used oxides, nitrides, oxynitrides, and the like can be used. As such a fluorescent material 5a, for example, a YAG phosphor obtained by activating YAG (yttrium, aluminum, garnet) with Ce or the like, a nitride phosphor activated with a lanthanoid element such as Eu or Ce, or an oxynitride System phosphors and the like. In addition, since the fluorescent substance 5a of the fluorescent substance containing binder 5 does not apply the temperature which forms a solidified body, the following can be further used, for example. That is, an Eu-activated β sialon phosphor having a composition formula of Si _6-z Al _z O _z N _8-z : Eu (0 <z <4.2), MGa ₂ S ₄ : Eu (M = Mg, Eu-activated thiogallate phosphor represented by Ca, Sr, Ba), rare earth aluminate phosphor represented by (Y, Lu) ₃ (Al, Ga) ₅ O ₁₂ : Ce, La ₃ Si ₆ N ₁₁ : Ce A lanthanum silicon nitride phosphor represented by, for example, K ₂ SiF ₆ : Mn ⁴⁺ , K ₂ TiF ₆ : Mn ⁴⁺ , K ₂ Si _0.5 Ge _0.5 F ₆ : Mn ⁴⁺ Mention may also be made of fluoride phosphors activated with Mn ⁴⁺ .
A wide variety of these fluorescent materials 3a can be used by combining one or more kinds.

  The binder 5b binds to the fluorescent material 5a to form the fluorescent material-containing binder 5 as a phase. The binder 5b is, for example, resin or glass. In addition, when resin is used as the binder 5b, for example, an epoxy resin or a silicone resin, or a mixed resin of an epoxy resin and a silicone resin can be used. Moreover, when glass is used as the binder 5b, borosilicate glass and other general low-melting-point glass can be used.

  The phosphor plate 1 having the above-described configuration includes a single metal oxide phase 2 and a composite metal oxide phase 3 which are crystal phases, and a single metal oxide phase 2 and a phosphor-containing binder phase 5. It is not independent, but is formed as a solidified body in which each phase is intertwined as an inseparable relationship and integrated with the light emitting element 12 to be described later. By making it common, the structure is superior to the refractive index of light and heat.

In addition, the phosphor plate 1 is made of, for example, a ceramic for light conversion composed of the above-described Al ₂ O ₃ crystal (single metal oxide phase 2) and Y ₃ Al ₅ O ₁₂ : Ce in the first light conversion section 4. In the case of the composite (complex metal oxide phase 3), not only two crystals exist but also Al ₂ from a single melt having a composition that is neither Al ₂ O ₃ nor Y ₃ Al ₅ O _12. There are two crystals as a result of crystallization of the O ₃ crystal and the Y ₃ Al ₅ O ₁₂ : Ce crystal, which is different from the case where two crystals exist independently. Therefore, although the single metal oxide phase 2 and the composite metal oxide phase 3 exist as physical sections, the two crystals are inseparable in the above-described meaning. Such a solidified body is essentially different from a state in which a simple Al ₂ O ₃ crystal and a YAG: Ce crystal are mixed.

In the phosphor plate 1, the composite metal oxide phase 3 of the second light conversion unit 6 is left in the first light conversion unit 4 and the second light conversion unit 6, leaving the single metal oxide phase 2. Since the fluorescent substance-containing binder phase 5 is formed in the portion from which the metal is removed, the single metal oxide phase 2 that is two crystals in the second light conversion section 6 and the first light conversion section 4 and The fluorescent substance-containing binder phase 5 is formed in a crystallized state in which the fluorescent substance-containing binder phase 5 is intertwined (three-dimensionally) in a cross-sectional view.
As described above, the phosphor plate 1 includes the first light conversion unit 4 in which a plurality of oxide phases including at least the first oxide phase 2 and the second oxide phase 3 are provided in a patch shape. By providing the second light conversion section 6 in which the oxide phase 2 having the same component as the first oxide phase 2 and the fluorescent substance-containing binder phase 5 are provided in a patch shape, the light extraction efficiency is maintained. In addition, restrictions on the use of fluorescent substances can be relaxed.

<Method for producing phosphor plate>
Next, a method for manufacturing the phosphor plate 1 will be described.
In the phosphor plate 1, the solidified body constituting the first light conversion unit 4 is manufactured by melting and then solidifying the mixture of the fluorescent material and the raw material metal oxide. For example, it is possible to obtain a solidified body by a simple method of cooling and condensing a melt charged in a crucible held at a predetermined temperature while controlling the cooling temperature, but the most preferable one is produced by a unidirectional solidification method. It is. This is because the crystal phase included by unidirectional solidification continuously grows in a single crystal state or a similar state, and each phase has a single crystal orientation.

  In addition, the first light conversion section 4 used in the present invention is disclosed in JP-A-7-149597 and JP-A-7-187893, except that at least one phase contains a metal element oxide that emits fluorescence. Publication, JP-A-8-81257, JP-A-8-253389, JP-A-8-253390, JP-A-9-67194, and corresponding US applications (US Pat. No. 5,569,547). No. 5,484,752, No. 5,902,963) and the like, and can be manufactured by the manufacturing methods disclosed in these publications.

Furthermore, the 2nd light conversion part 6 of the fluorescent substance board 1 can be manufactured according to the following processes. In addition, the fluorescent substance plate 1 can be manufactured here by forming the fluorescent substance containing binder phase 5 of the 2nd light conversion part 6. FIG. Hereinafter, a description will be given with reference to FIGS. 2, 3, and 4. The first light conversion unit 4 will be described as a mixture of Al ₂ O ₃ crystals as the single metal oxide phase 2 and YAG: Ce crystals as the composite metal oxide phase 3. That is, in the first light conversion unit 4, the single metal oxide phase 2 and the composite metal oxide phase 3 are formed in a patch shape (continuously and three-dimensionally entangled with each other) in a sectional view. It consists of a solidified body.
As shown in FIG. 2A and FIG. 4A, a solidified body C having a configuration in which all states are the first light conversion units 4 is prepared. The solidified body C is formed so as to have a plurality of oxide phases provided in spots in a cross-sectional view by solidifying the mixture of the fluorescent material and the oxide after melting (solidified body forming step). Is done.
As shown in FIG. 2B, a SiO ₂ mask Ms is formed, for example, by CVD on one surface of the solidified body C of only the first light conversion section 4 (mask forming process).

Then, as shown in FIG. 2C, the solidified body C is put into an etching solution Hc that becomes a heated phosphoric acid: sulfuric acid mixed solution, and etching is performed (etching step). When etching is performed, the composite metal oxide phase 3 which is a YAG: Ce crystal is more relative to the single metal oxide phase 2 which is an Al ₂ O ₃ crystal when immersed in the etchant Hc from the non-mask side. Will be etched faster. Therefore, the etched solidified body C includes the first light conversion portion 4 of the single metal oxide phase 2 and the composite metal oxide phase 3, the single metal oxide phase 2 and the composite metal oxide phase 3. A part of the film is removed by etching to form a layer Ep having a void E. In FIG. 2, the single metal oxide 2 does not show hatching or the like, but shows a state in which it always exists as an oxide phase.

As shown in FIG. 2D and FIG. 4B, the mask Ms is removed from the solidified body C in which the void E is formed, for example, an existing ultra-high purity buffered hydrofluoric acid (BHF: 50% HF aqueous solution and 40 % NH ₄ F aqueous solution blended at an arbitrary blending ratio) and removed by etching (mask removal step).
Next, as shown in FIG. 3A, a fluorescent powder resin mixed material Pz obtained by mixing a resin serving as the binder 5b and a fluorescent powder of the fluorescent substance 5a is applied from the gap E side of the solidified body C (see FIG. 3A). For example, casting method) (application process).
Further, as shown in FIG. 3B, the solidified body C coated with the fluorescent powder resin mixed material Pz is disposed in a decompression device Va (for example, a vacuum pump) that can be evacuated and evacuated (under a decompressed state). In other words, the gap E is impregnated and filled with the fluorescent powder resin mixed material Pz (impregnation step).

Then, as shown in FIGS. 3C and 4C, after the excess fluorescent powder resin mixed material Pz on the surface of the solidified body C is removed, it is heated to a predetermined temperature by a heating device Ht such as an oven. As shown in FIG. 3D, the phosphor plate 1 is manufactured by curing the resin to form the phosphor-containing binder phase 5 (curing step).
Through the steps as described above, the first light conversion portion 4 of the single metal oxide phase 2 and the composite metal oxide phase 3, and the second of the single metal oxide phase 2 and the fluorescent material-containing binder phase 5 are processed. The phosphor plate 1 including the light conversion unit 6 can be manufactured. That is, the phosphor plate 1 includes a plurality of oxide phases 2 and 3 (at least a first oxide phase and a second oxide phase) made of an oxide selected from a single metal oxide and a composite metal oxide. In the solidified body in which the plurality of oxide phases) are patchy in cross-section, the composite metal oxide phase 3 as the second oxide phase is replaced with the phosphor-containing binder 5 to a predetermined depth in the plate thickness direction. It is formed by that. Then, the phosphor plate 1 serves as the second light conversion portion 6 up to the position of the replaced phosphor substance-containing binder phase 5, and the range up to the remaining composite metal oxide phase 3 (here, the solidified body of the solid body). The first light conversion unit 4 is defined as substantially half of the thickness direction.

  In the phosphor plate 1 manufactured as described above, the phosphor material-containing binder phase 5 formed after impregnation is not subjected to such a high temperature as to form a solidified body. It is possible to use a desired fluorescent material 5 a for the phase 5. Therefore, the color mixture state of light can be freely set when used as the light emitting device 10 described later. In addition, since the thickness of the first light conversion unit 4 and the thickness of the second light conversion unit 6 can be adjusted by changing the etching time in the etching process, it can be adjusted to an arbitrary color tone. Become.

Next, other configurations of the phosphor plate will be sequentially described with reference to FIG. In the drawings, the same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
As shown in FIG. 5A, the phosphor plate 1A includes a first light conversion unit 4 having a single metal oxide phase 2 and a composite metal oxide phase 3, and the first light conversion unit 4 A second metal conversion portion 6 having a single metal oxide phase 2 and a phosphor-containing binder phase 5 that is continuous with one surface, and a single metal that is continuous with the other surface of the first light conversion portion 4. The third light conversion unit 16 having the oxide phase 2 and the fluorescent substance-containing binder phase 15 may be used.

  The phosphor plate 1A is manufactured by the following procedure. The solidified body C is immersed in the etching liquid Hc at a depth within a range where the solidified body C is desired to be etched (a depth corresponding to the third light conversion unit 16). When immersed in the etching solution Hc, the mask Ms (see FIG. 2C) is not provided. Then, etching is performed from one surface side of the solidified body C and the other surface side of the solidified body C. In this way, the composite metal oxide phase 3 from both sides of the solidified body C to a predetermined depth is removed, and etching is performed with an etching time adjusted so that the composite metal oxide phase 3 remains in the center. Next, in the void E (see FIG. 2D) formed after the composite metal oxide phase 3 is removed by etching, the fluorescent powder resin mixture containing the fluorescent material 5a is formed from one surface of the solidified body C. Apply material. In addition, a mixture of fluorescent powder resin containing the fluorescent substance 15a from the other surface of the solidified body C is formed in the void E (see FIG. 2D) formed after the composite metal oxide phase 3 is removed by etching. Apply material. Then, the void C is impregnated with the fluorescent powder resin mixed material by evacuating the solidified body C coated with the fluorescent powder resin mixed material.

  Then, the solidified body C is heated to cure the fluorescent powder resin mixed material, and the second light conversion unit 6 and the third light conversion unit 16 are provided on both sides of the first light conversion unit 4. The body plate 1A can be manufactured. In the phosphor plate 1A, the fluorescent materials 5a and 15a of the second light conversion unit 6 and the third light conversion unit 16 may be the same, or the fluorescent material 5a and the fluorescent material 15a are different. It does not matter. In addition, since the phosphor plate 1A can have three layers, for example, it can be configured to be able to convert RGB, which are the three primary colors of light. In the phosphor plate 1A, the second light conversion unit 6 extends from the state where it is originally formed of the solidified body C of the oxide phase (2, 3) to the position of the replaced phosphor-containing binder phases 5 and 15. The third light conversion unit 16 is used as the first light conversion unit 4 and the range up to the remaining composite metal oxide phase 3 is used.

Next, the phosphor plate 1 </ b> B configured as shown in FIG. 5B may be used (corresponding to the phosphor plate according to claim 2).
As shown in FIG. 5B, the phosphor plate 1B includes a first light conversion unit 16A (the already described third light conversion unit 16) including the single metal oxide phase 2 and the phosphor-containing binder phase 15. And a second light conversion unit 6 including a single metal oxide phase 2 and a fluorescent material-containing binder phase 5. This phosphor plate 1B has a phosphor material-containing binder phase 15 in a gap E in which the composite metal oxide phase 3 previously formed together with the single metal oxide phase 2 on the solidified body C is removed by etching in the plate thickness direction. And the phosphor-containing binder phase 5 are continuous.

  In order to manufacture the phosphor plate 1B, the following procedure is performed as an example. First, the single metal oxide phase 2 and the composite metal oxide phase 3 are etched from the solidified body C (see FIGS. 2 to 3) without providing the mask Ms, so that the single metal oxide is formed from the solidified body C. All the composite metal oxide phase 3 is removed while the physical phase 2 remains. Then, the fluorescent powder resin mixed material containing the fluorescent substance 5a is applied from one surface of the solidified body C, and the fluorescent powder resin mixed material containing the fluorescent substance 15a is applied from the other surface of the solidified body C. Then, the solidified body C coated with different fluorescent powder resin mixed materials on both sides is evacuated to impregnate the fluorescent powder resin mixed material in all of the gap E in the plate thickness direction, and then cured to phosphor plate 1B. Manufacturing. The manufactured phosphor plate 1B can be provided with desired fluorescent materials 5a and 15a in the first light conversion unit 16A and the second light conversion unit 6, so that the color mixing of light can be freely adjusted. . The phosphor plate 1B is originally formed from the solidified body C of the oxide phase (2, 3) to the position of the replaced phosphor substance-containing binder phases 5 and 15 in the first light conversion section 16A. The second light conversion unit 6 is used.

  Next, as illustrated in FIG. 5C, the phosphor plate 1 </ b> C includes a third light conversion unit 26 that is continuous in the plate thickness direction and a first light that is continuous with the third light conversion unit 26. The conversion unit 16 </ b> A (the same configuration as the already described third light conversion unit 16) and the second light conversion unit 6 that is continuous with the first light conversion unit 16 are provided. And the 3rd light conversion part 26 is comprised so that the single metal oxide phase 2 and the fluorescent substance containing binder phase 25 may become patchy in sectional view. In addition, the first light conversion portion 16A is configured such that the single metal oxide phase 2 and the fluorescent substance-containing binder phase 15 are patchy in a cross-sectional view. further. The 2nd light conversion part 6 is comprised so that the single metal oxide phase 2 and the fluorescent substance containing binder phase 5 may become patchy in sectional view.

  In order to manufacture the phosphor plate 1C, for example, the following procedure is performed. First, the solidified body C composed of the single metal oxide phase 2 and the composite metal oxide phase 3 (see FIG. 2A) is etched without providing the mask Ms. All the composite metal oxide phase 3 is removed with the oxide phase 2 left. Then, the fluorescent powder resin mixed material containing the fluorescent substance 5a is applied from one side of the solidified body C, and the fluorescent powder resin mixed material containing the fluorescent substance 15a and the fluorescent substance 25a is applied from the other side of the solidified body C. Apply repeatedly. Then, the solidified body C coated with different fluorescent powder resin mixed materials is evacuated to impregnate all three types of the fluorescent powder resin mixed materials in the thickness direction of the gap E, and then cured to obtain fluorescent light. The body plate 1C is manufactured. In the phosphor plate 1C, since the third light conversion unit 26, the first light conversion unit 16A, and the second light conversion unit 6 are formed, it is easy to adjust the color mixture of light. The phosphor plate 1C is originally replaced with the second light conversion unit 6 from the state where it is formed of the solidified body C of the oxide phase (2, 3) to the position of the replaced phosphor-containing binder phase 5. The range up to the position of the obtained fluorescent substance-containing binder phase 25 is the third light conversion unit 26, and the range up to the remaining composite metal oxide phase 3 is the first light conversion unit 16A.

  Next, as shown in FIG. 5 (d), the phosphor plate 1D includes a light conversion unit 6A (described above) that is composed of a single metal oxide phase 2 and a phosphor-containing binder phase 5 continuously in the plate thickness direction. The same configuration as the second light conversion unit 6). This phosphor plate 1D forms a phosphor-containing binder phase 5 in the void after the composite metal oxide phase 3 is removed from the single metal oxide phase 2 and the composite metal oxide phase 3 that have been formed in advance. It is manufactured by.

  In order to manufacture this phosphor plate 1D, the following procedure is performed as an example. First, the solidified body C composed of the single metal oxide phase 2 and the composite metal oxide phase 3 (see FIG. 2A) is etched without providing the mask Ms. All the composite metal oxide phase 3 is removed with the oxide phase 2 left. Then, a fluorescent powder resin mixed material containing the fluorescent substance 5a is applied from one side or both sides of the solidified body C. Then, the solidified body C coated with the fluorescent powder resin mixed material is evacuated to impregnate the fluorescent powder resin mixed material in all of the thickness direction of the gap E, and then cured, whereby the phosphor plate 1D is formed. Can be manufactured.

  The phosphor plates 1A to 1D described above may be impregnated and filled with the phosphor material 5a (15a, 25a) at a temperature lower than the temperature at which the solidified body C is formed, similarly to the phosphor plate 1 already described. Therefore, the restriction on the adjustment of the color mixture of light is relaxed, and different fluorescent materials 5a (15a, 25a) can be used in multiple layers.

The phosphor plates 1, 1 </ b> A to 1 </ b> D can be used as a part of the light emitting device 10 by being bonded to the light emitting element 12 as shown in FIGS. 6 (a) and 6 (b). Hereinafter, the light emitting device 10 will be described. In addition, each structure already demonstrated attaches | subjects the same code | symbol, and abbreviate | omits the description suitably. In addition, in FIG. 6, it demonstrates as an example using the phosphor plate 1. FIG.
As shown in FIG. 6, the phosphor plate 1 and the light emitting element 12 are joined to form a light emitting device 10. The light emitting device 10 includes a light emitting element 12, a substrate 11 of the light emitting element 12, and a phosphor plate 1 bonded to the substrate 11. In the light emitting element 12, for example, a translucent sapphire substrate is used as the substrate 11. FIGS. 6A and 6B show a state after the wafer having a plurality of light emitting elements (light emitting element groups) 12 formed thereon is cut into individual light emitting elements 12.

The light-emitting device 10 includes a light-emitting element 12 having a semiconductor stacked structure, which is a semiconductor layer formed by stacking on a substrate 11. Although details of the configuration of the light emitting element 12 are omitted, for example, an n-type semiconductor layer formed on the substrate 11, a p-type semiconductor layer formed on the n-type semiconductor layer, and an n-type semiconductor layer And an active layer formed between the p-type semiconductor layer and a p-side full-surface electrode layer formed on the p-type semiconductor layer. In addition, as a material of the light emitting layer, for example, In _X Al _Y Ga _1-XY N (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1) can be used. In the light emitting element 12, an n-side pad electrode 13 is formed on the n-type semiconductor layer on which the p-type semiconductor layer is not stacked, and the p-side pad electrode 14 is projected on the p-side full surface electrode layer. Is formed. Further, the light emitting element 12 is provided with a protective film (not shown) so as to expose the connection end face side of the n-side pad electrode 13 and the connection end face side of the p-side pad electrode 14.

  As a manufacturing method of the light emitting device 10, as an example, ZnS, SiC, GaN, GaP, InN, AlN, ZnSe, GaAsP, GaAlAs, InGaN, GaAlN, AlInGaP are formed on the substrate 11 by a liquid phase growth method, HDVPE method, or MOCVD method. The light emitting element 12 is formed by stacking an n-type semiconductor layer, a p-type semiconductor layer, or the like, which is a stacked structure of a semiconductor in which a semiconductor such as AlInGaN is formed as a light emitting layer.

  Further, the phosphor plate 1 is manufactured as shown in FIGS. Then, the light emitting element 12 and the phosphor plate 1 are prepared (preparation process), and the prepared phosphor plate 1 and the light emitting element 12 are directly bonded via the substrate 11 (bonding process). Examples of the direct bonding between the substrate 11 of the light emitting element 12 and the phosphor plate 1 include surface activation bonding, atomic diffusion bonding, and hydroxyl bonding, and one of these can be selected and used. . Note that surface activated bonding is a method in which impurities such as oxides, moisture, and organic substances adhering to the surface layer of the members to be bonded are removed together with a portion of the surface layer, and the bonds of the surface atoms are directly connected at room temperature. This is a method of bonding (reference: International Publication No. 2011-126000).

After the substrate 11 of the light emitting element 12 and the phosphor plate 1 are joined, they are separated into individual pieces (divided into individual pieces) along a cutting margin of the light emitting device 10 by dicing or the like, whereby FIG. The light emitting device 10 is manufactured as shown in FIG. In addition, the arrow shown in FIG.6 (b) has shown the direction from which the light was taken out.
The light emitting device 10 is configured with the surface on the phosphor plate 1 side connected to the substrate 11 of the light emitting element 12 as a light extraction surface, and the emission wavelength is set to ultraviolet by selecting the material of the semiconductor layer and the degree of mixed crystal thereof. Various types of light to infrared light can be selected, and furthermore, the phosphor plate 1 can mix and adjust the light.

  In the light emitting element 12 when used as the light emitting device 10, the material of the substrate 11 is preferably a material equivalent to the single metal oxide phase 2 of the phosphor plate 1. That is, in the phosphor plate 1, for example, when aluminum oxide (sapphire) is used as the single metal oxide phase 2, it is desirable that aluminum oxide is also used for the material of the substrate 11 of the light emitting element 12. . Here, the material is equivalent means a material containing common components and having a refractive index difference not exceeding 0.1. Further, when the material of the light emitting element 12 to the substrate 11 and the single metal oxide phase 2 is aluminum oxide, the thermal conductivity is high even when compared with glass, resin, or YAG alone, and the temperature rise of the phosphor plate 1 is suppressed. be able to. For this reason, it is possible to obtain a light emitting device 10 that is a white LED that suppresses a decrease in conversion efficiency associated with a temperature rise of the phosphor plate 1 and has a small decrease in luminous flux and color deviation.

As shown in FIG. 7, when the light emitting device 10 is manufactured, the substrate 11 and the phosphor plate 1 of the light emitting element 12 may be joined via the joining layer 30 when they are joined. I do not care. The bonding layer 30 used here is preferably a low melting point material such as silica, resin, glass or the like. The bonding layer 30 can contain a fluorescent material. The color tone of the light emitting diode can be controlled by the contained fluorescent material. Various fluorescent materials can be cited as fluorescent substances to be present at the junction. When considering application to white light-emitting diodes, Ca ₂ Si ₅ N ₈ activated by europium emitting red fluorescence and attached by europium. A material such as activated CaAlSiN ₃ is preferred. As an adhesive material for the fluorescent material of the bonding layer 30, an epoxy resin, a silicone resin, or the like can be used. In addition, the arrow shown in FIG. 7 has shown the direction from which the light was taken out.

Furthermore, as shown in FIG. 8, the light emitting device 10 may be used to form a light emitting device 20 with a supporting substrate. In addition, the arrow shown in FIG. 8 has shown the direction from which the light was taken out.
In the light emitting device 20 with the support substrate, the n-side pad electrode 13 and the p-side pad electrode 14 of the light emitting device 10 are bonded to the mounting position of the support substrate 21, and the white resin 22 is provided on the lower side and the side surface of the light emitting device 10. It is configured.
In the light emitting device 20 with the support substrate, for example, a plurality of light emitting devices 10 are mounted on the support substrate 21, a resin is filled between the light emitting devices 10, and is aligned with the upper end of the light emitting device 10 and cured. By doing so, the light emitting device 20 with a supporting substrate can be manufactured. In addition, the light-emitting device 20 with a support substrate can be used for vehicle-mounted exteriors, for example, by using one or a plurality in parallel.

As described above, by using the phosphor plates 1, 1 </ b> A to 1 </ b> D for the light emitting device 10 or the light emitting device 20 with the support substrate, the selection range of the fluorescent material 5a (15a, 25a) can be expanded. Therefore, it is possible to increase the degree of freedom for setting the color mixture, and to make it difficult to be affected by heat.
In addition, in the joining method of the board | substrate 11 and the fluorescent substance plate 1 of the above-mentioned light emitting element 12, atomic diffusion joining forms a fine crystalline film in the ultrahigh vacuum on the joint surface of each member, and those thin films are formed. This is a method of superposing and joining in a vacuum. Furthermore, in the hydroxyl bonding, a bonding surface of members to be bonded is subjected to a hydrophilic treatment to form a hydroxyl group (OH group), and the bonding surfaces are brought into contact with each other by hydrogen bonding to each other to bond. Is the method.

Moreover, although the fluorescent substance-containing binder phase 5 has been described as using the binder 5b that cures when heated, it may be a resin that cures when irradiated with light such as ultraviolet rays.
Furthermore, the phosphor plates 1 and 1A to 1D are etched from the existing phosphor plate formed by three-dimensionally intermingling the oxide phases of the single metal oxide and the composite metal oxide to form the void E. The first light conversion part and the second light conversion part or the third light conversion part are separately provided with a common oxide phase. A phosphor plate may be formed by providing as a solidified body and directly bonding the provided solidified body.

  The phosphor plates 1, 1 </ b> A to 1 </ b> D have been described as the first light conversion unit 4 of a solidified body composed of a single metal oxide oxide phase and a composite metal oxide oxide phase. It may be configured as follows. That is, the first light conversion unit includes a solidified body composed of oxide phases of two different single metal oxides, a solidified body composed of oxide phases of two or more different single metal oxides, and two different composites. It may be a solidified body made of an oxide phase of a metal oxide or a solidified body made of an oxide phase of two or more different composite metal oxides.

In the second light conversion unit and the third light conversion unit, the fluorescent substance-containing binder phase and the oxide phase have been described as solidified bodies having a single metal oxide, but the oxide phase is a composite metal oxide. There is no limitation as long as the same material continues to the first light conversion unit.
In the light emitting device, the phosphor plates 1 and 1A to 1D are described as an example of a single metal oxide as one of the solid metal oxides and the single metal oxide is a single crystal of Al ₂ O ₃ . However, as long as it is a case where the same material as that of the substrate of the light emitting device is provided on the side where the substrates of the phosphor plates 1, 1 </ b> A to 1 </ b> D are joined, the material other than those described above may be used. Further, in the light emitting device, it is more preferable that the material to be bonded to the substrate is provided on the side to be bonded to the phosphor plates 1 and 1A to 1D, but the materials to be bonded to each other may be different.

In the phosphor plates 1, 1 A, 1 B, 1 C, the phosphor-containing binder phases 5, 15, 25, etc. at the boundaries between the layers need not be partitioned on the same straight plane, and the boundary portions may be uneven. I do not care. Further, the phosphor-containing binder phases 5, 15, and 25 are in contact with (continuously) without being provided with a space in a state in which they are arranged side by side with a space between layers facing each other in the thickness direction. The structure in which the state arrange | positioned alongside may exist may be sufficient. Furthermore, the fluorescent substance-containing binder phases 5, 15, and 25 may be configured to be continuous in the thickness direction without providing spaces in all the phases facing each other. That is, the phosphor-containing binder phases 5, 15 and 25 are not limited in connection relation (filled state) with the facing phases as long as desired light can be extracted when used in the light emitting device. .
Furthermore, the ratio in the plate thickness direction between the first light conversion unit and the second light conversion unit and the ratio in the plate thickness direction from the first light conversion unit to the third light conversion unit are equal. It may be a structure set up arbitrarily.
In addition, in the phosphor plates 1 and 1A to 1D, another oxide phase may exist between the oxide phases (2, 3) entangled in spots in a cross-sectional view. The patchy state is a state in which irregular phases (2, 3 or 2, 5 etc.) are entangled with each other and are continuous or discontinuous in the three-dimensional direction.

Furthermore, in the method for manufacturing a phosphor plate, the phosphor plate may be manufactured by performing a solidified body forming step, an etching step, a coating step, an impregnation step, and a curing step. In the impregnation process, vacuuming is not necessarily required as long as the phosphor-containing binder impregnates the gap in the normal coating process, but if it is performed by vacuuming, the phosphor-containing binder is deep in the gap. It becomes the structure which increases the state which is impregnated until it continues, and is continuously provided with respect to the opposing phase.
Further, in the method of manufacturing a phosphor plate, as described above, the solidified body prepared in advance is cut, and one oxide phase in one of the cut solidified bodies is removed by etching and filled with a phosphor-containing binder. Also good. And after forming a fluorescent substance containing binder phase, the procedure of joining with the other cut | disconnected solidified body is performed. The position of the solidified body to be cut by this manufacturing method can be set within the range when the range of the fluorescent substance-containing binder phase to be filled is known in advance. Therefore, this manufacturing method can further improve the degree of freedom of color mixing, which is convenient.

That is, the phosphor plate is a phosphor plate in which a fluorescent phase (3, 5) containing a fluorescent substance and a non-fluorescent phase (oxide phase 2) not containing a fluorescent substance are provided in a patch shape in a cross-sectional view. The fluorescent phase (3, 5) includes a first region (composite oxide phase 3) containing the first fluorescent material (3a) and a second region (fluorescent material-containing binder phase) containing the second fluorescent material (5a). 5) may be provided as long as they are arranged side by side in the thickness direction. Further, in the case where the third light conversion unit as shown in FIGS. 5A and 5C is provided, the thickness of the third region (the fluorescent substance-containing binder phases 15 and 25) is as described above. It does not matter as being provided side by side in the direction.
Furthermore, in the method for manufacturing the phosphor plate, the complex oxide phase, which is the fluorescent substance-containing layer of the first light conversion unit, has been described as being partly removed by etching to form a fluorescent substance-containing binder layer. The oxide phase of one light conversion part may be removed by etching to form a phosphor-containing binder phase.
Moreover, in the manufacturing method which manufactures a light-emitting device, after manufacturing phosphor board 1,1A-1D and joining with the board | substrate 11 previously, as a procedure which laminates | stacks and manufactures a semiconductor layer on the board | substrate 11 as mentioned above. It doesn't matter.

  The present invention can be used for various light sources such as illumination light sources, various indicator light sources, in-vehicle light sources including vehicle headlights, display light sources, liquid crystal backlight light sources, traffic lights, and signboard channel letters. .

1, 1A, 1B, 1C, 1D phosphor plate 2 oxide phase, first oxide phase (single metal oxide phase)
3 Second oxide phase (complex metal oxide phase)
3a Fluorescent substance (metal element oxide)
4, 16A 1st light conversion part 5, 15, 25 Fluorescent substance containing binder phase 5a, 15a, 25a Fluorescent substance 5b Binder 6 2nd light conversion part 10 Light-emitting device 11 Substrate 12 Light-emitting element 13 N side pad electrode 14 P-side pad electrode 16, 26 Third light conversion unit 20 Light emitting device with support substrate 21 Support substrate 22 White resin 30 Bonding layer C Solidified body E Void Ep layer Hc Etching solution Ht Heating device Ms Mask Pz Fluorescent powder resin mixed material Va pressure reducing device

Claims (19)

A first light conversion portion in which the oxide phase and the fluorescent substance-containing oxide phase are provided in a spot shape in a cross-sectional view;
An oxide phase and a fluorescent substance-containing binder phase provided in a spot shape in cross-sectional view, and
Said first oxide phase of the oxide phase and the second light conversion portion of the light converting portion are continuous at least in part,
The phosphor plate in which the phosphor-containing oxide phase of the first light conversion unit and the phosphor-containing binder phase of the second light conversion unit are arranged side by side in the plate thickness direction. 2. The phosphor according to claim 1, wherein the fluorescent substance-containing oxide phase of the first light conversion part and the fluorescent substance-containing binder phase of the second light conversion part are continuous at least partially in the plate thickness direction. Board.   A fluorescent material arranged in line in the plate thickness direction with an oxide phase at least partially continuous with the oxide phase of the first light conversion portion and the fluorescent material-containing oxide phase of the first light conversion portion 3. The phosphor plate according to claim 1, wherein a third light conversion portion whose inclusion binder phase is patchy in a cross-sectional view is provided continuously to the first light conversion portion.   The fluorescent substance according to claim 3, wherein the fluorescent substance contained in the fluorescent substance-containing oxide phase of the first light conversion part is different from the fluorescent substance in the fluorescent substance-containing binder phase of the third light conversion part. Body board. A first light conversion section in which an oxide phase and a phosphor-containing binder phase are provided in a spot shape in a cross-sectional view;
A second light conversion part in which the oxide phase and the phosphor-containing binder phase are provided in spots in a cross-sectional view, and
The oxide phase of the first light conversion part and the oxide phase of the second light conversion part are continuously provided at least partially,
A phosphor plate in which the phosphor-containing binder phase of the first light conversion unit and the phosphor-containing binder phase of the second light conversion unit are arranged side by side in the plate thickness direction.   The phosphor plate according to claim 5, wherein the phosphor material-containing binder phase of the first light conversion unit and the phosphor material-containing binder phase of the second light conversion unit contain different phosphor materials. An oxide phase that is at least partially continuous with the oxide phase of the first light conversion portion, and a fluorescent material that is arranged side by side in the plate thickness direction on the fluorescent material-containing binder phase of the first light conversion portion A third light conversion portion provided in a patch-like shape in a cross-sectional view containing binder phase, continuously provided in the first light conversion portion,
The fluorescent material-containing binder phase of the third light conversion unit is different from one of the fluorescent material-containing binder phase of the first light conversion unit and the fluorescent material-containing binder phase of the second light conversion unit The phosphor plate according to claim 5, comprising: The phosphor plate according to any one of claims 1 to 7, wherein the oxide phase material of the first light conversion portion contains Al ₂ O ₃ .   The phosphor plate according to any one of claims 1 to 4, wherein the phosphor contained in the phosphor-containing oxide phase of the first light conversion unit includes a rare earth aluminate phosphor.   The phosphor plate according to any one of claims 1 to 9, wherein the phosphor contained in the phosphor-containing binder phase includes a nitride-based phosphor or an oxynitride-based phosphor.   A light emitting device comprising: the phosphor plate according to any one of claims 1 to 10; and a light emitting element formed by laminating a semiconductor layer on the substrate, wherein the phosphor plate and the substrate are joined. . The light emitting device according to claim 11, wherein a material of the substrate includes Al ₂ O ₃ .   When the oxide phase of the phosphor plate is a plurality of oxide phases, the material of the single metal oxide is equivalent to the material of the substrate when one of the oxide phases is a single metal oxide. The light-emitting device according to claim 11, wherein the phosphor plate and the substrate are joined by direct joining.   The light-emitting device according to claim 11 or 12, wherein the phosphor plate and the substrate are bonded via a bonding layer. In the manufacturing method of the fluorescent substance board according to any one of claims 1 to 10,
A solidified body forming step of forming a solidified body having a plurality of oxide phases provided in a cross-sectional view by solidifying the mixture of the fluorescent material and the oxide after melting;
An etching step of forming a void by immersing the solidified body in an etching solution and etching one of the oxide phases of the solidified body to a predetermined depth in the plate thickness direction;
An application step of applying a fluorescent material-containing binder containing a fluorescent material to the binder on the surface of the solidified body in which the voids are formed;
An impregnation step of impregnating the void with the fluorescent material-containing binder;
A curing step of curing the phosphor-containing binder impregnated in the solidified body.   The said impregnation process is a manufacturing method of the fluorescent substance plate of Claim 15 performed by evacuating the solidified body which apply | coated the said fluorescent substance containing binder. A mask forming step of forming a mask on one surface of the solidified body before the etching step;
The method for manufacturing a phosphor plate according to claim 15, wherein a mask removing step for removing the mask from the solidified body is performed after the etching step and before the coating step. In the manufacturing method of the light-emitting device which manufactures the light-emitting device as described in any one of Claims 11-14,
A preparation step of manufacturing and preparing the phosphor plate according to any one of claims 1 to 10, and manufacturing and preparing a plurality of light emitting elements by stacking a semiconductor layer on a substrate,
A bonding step of bonding the substrate and the phosphor plate formed of the same component as any one oxide phase of the phosphor plate;
A singulation process for cutting and separating the joined body obtained by joining the phosphor plate and the substrate for each light emitting element;
A method for manufacturing a light-emitting device, comprising: In the manufacturing method of the light-emitting device which manufactures the light-emitting device as described in any one of Claims 11-14,
A step of manufacturing the phosphor plate according to any one of claims 1 to 10,
A bonding step of bonding a substrate formed of a material having the same component as any one oxide phase of the phosphor plate to the oxide phase side of the phosphor plate;
Forming a plurality of light emitting elements by stacking a semiconductor layer on the bonded substrates;
A singulation step of dividing the substrate on which the plurality of light emitting elements are formed into individual light emitting elements together with the phosphor plate;
A method for manufacturing a light-emitting device.

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