JP6264316B2 - Antenna device - Google Patents

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JP6264316B2
JP6264316B2 JP2015064059A JP2015064059A JP6264316B2 JP 6264316 B2 JP6264316 B2 JP 6264316B2 JP 2015064059 A JP2015064059 A JP 2015064059A JP 2015064059 A JP2015064059 A JP 2015064059A JP 6264316 B2 JP6264316 B2 JP 6264316B2
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antenna
compartment
transmission
circuit
receiving
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JP2016184857A (en
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剛 長塚
剛 長塚
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Mitsubishi Electric Corp
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この発明は、マイクロ波、ミリ波等の高周波信号を送信または受信するアンテナ装置に関する。   The present invention relates to an antenna device that transmits or receives high-frequency signals such as microwaves and millimeter waves.

送信アンテナおよび受信アンテナから構成されるアンテナ装置において、受信アンテナにて受信されたミリ波信号のミクサまでの伝送路を極小に抑えるため、樹脂基板の一方の面に、マイクロストリップ線路を給電線路とする受信アンテナと送信アンテナを形成するとともに、受信アンテナの近くにミクサを実装する技術が知られている(例えば特許文献1参照)。   In an antenna device composed of a transmission antenna and a reception antenna, in order to minimize the transmission path to the mixer of the millimeter wave signal received by the reception antenna, a microstrip line is provided as a feed line on one surface of the resin substrate. A technique is known in which a receiving antenna and a transmitting antenna are formed and a mixer is mounted near the receiving antenna (see, for example, Patent Document 1).

また、送信アンテナおよび受信アンテナから構成されるアンテナ装置において、レドームにおける送信アンテナと受信アンテナの間に電波吸収体を設けて、送信アンテナから受信アンテナへの送信電力の漏れ込みや回り込みを低減する技術が知られている。   In addition, in an antenna device composed of a transmission antenna and a reception antenna, a technique for reducing leakage and wraparound of transmission power from the transmission antenna to the reception antenna by providing a radio wave absorber between the transmission antenna and the reception antenna in the radome It has been known.

特開2010−273049号公報JP 2010-273049 A

しかしながら、特許文献1に示す従来のアンテナ装置は、送信アンテナまたは送信回路から放射された電波が、ミクサ、低雑音増幅器等の受信系の回路に漏れ込み、受信系の回路に電波干渉するもしくはノイズが混入するという問題がある。   However, in the conventional antenna device shown in Patent Document 1, radio waves radiated from a transmission antenna or a transmission circuit leak into a reception system circuit such as a mixer or a low-noise amplifier, and interfere with the reception system circuit or cause noise. There is a problem of mixing.

この電波干渉を低減するために、送信アンテナとミクサの間に電波吸収体を設けることが可能である。しかしながら電波吸収体は製造価格が高価であり、アンテナ装置の製造価格が高くなるという問題がある。   In order to reduce this radio wave interference, it is possible to provide a radio wave absorber between the transmission antenna and the mixer. However, the radio wave absorber has a problem that the manufacturing price is expensive and the manufacturing price of the antenna device is high.

この発明は係る課題を解決するためになされたものであって、送信アンテナおよび受信アンテナと、ミクサ、低雑音増幅器等の受信回路を基板の同一面に設けるとともに、電波吸収体を用いることなく、送信アンテナから受信回路への送信電波の漏れ込みを抑制することを目的とする。   The present invention has been made to solve the problem, and a transmission antenna and a reception antenna, and a receiving circuit such as a mixer and a low noise amplifier are provided on the same surface of the substrate, and without using a radio wave absorber, An object is to suppress leakage of transmission radio waves from a transmission antenna to a reception circuit.

この発明によるアンテナ装置は、送信電波を放射する送信アンテナと、上記送信電波の反射波を受信する受信アンテナと、送信アンテナ給電線により上記送信アンテナに接続された送信回路と、受信アンテナ給電線により上記受信アンテナに接続されるとともに、ローカル信号線により送信回路に接続された受信回路とを有し、上記送信アンテナ、受信アンテナ、送信回路、および受信回路を囲むように導体膜が実装された樹脂基板と、少なくとも上記送信回路を収納する第1の隔室、および少なくとも上記受信回路を収納する第2の隔室を形成し、当該第1の隔室と第2の隔室の間の隔壁に導体膜を形成するとともに、上記第1の隔室と第2の隔室を連通し、かつ上記ローカル信号線が配置される導体膜で囲まれた溝が形成されたレドームとを備え、上記溝の幅は上記送信アンテナ給電線から漏れ出る電波の半波長以下としたものである。   An antenna device according to the present invention includes a transmission antenna that radiates a transmission radio wave, a reception antenna that receives a reflected wave of the transmission radio wave, a transmission circuit connected to the transmission antenna by a transmission antenna feed line, and a reception antenna feed line. A resin having a receiving circuit connected to the receiving antenna and connected to the transmitting circuit by a local signal line and having a conductor film mounted so as to surround the transmitting antenna, the receiving antenna, the transmitting circuit, and the receiving circuit Forming a substrate, a first compartment containing at least the transmitting circuit, and a second compartment containing at least the receiving circuit, and forming a partition between the first compartment and the second compartment; A radome having a conductor film formed therein and a groove surrounded by the conductor film in which the first and second compartments communicate with each other and in which the local signal line is disposed The provided, the width of the groove is obtained by the following half-wave of the radio wave leaking from the transmitting antenna feed line.

この発明によれば、送信アンテナ、受信アンテナ、送信回路、および受信回路を、樹脂基板の同一面上に配置したアンテナ装置において、電波吸収体を用いることなく、送信アンテナおよび送信回路から、受信回路への送信電波の漏れ込みを抑制することができる。   According to the present invention, in an antenna device in which a transmission antenna, a reception antenna, a transmission circuit, and a reception circuit are arranged on the same surface of a resin substrate, the reception circuit can be changed from the transmission antenna and the transmission circuit without using a radio wave absorber. Leakage of radio waves transmitted to the can be suppressed.

実施の形態1によるアンテナ装置の構成を示す上断面面図である。1 is an upper cross-sectional view illustrating a configuration of an antenna device according to a first embodiment. 実施の形態1によるアンテナ装置の構成を示すAA側断面図である。FIG. 2 is a side cross-sectional view showing the configuration of the antenna device according to the first embodiment. 実施の形態1によるアンテナ装置の構成を示すBB側断面図である。3 is a BB side cross-sectional view showing the configuration of the antenna device according to the first embodiment. FIG. 実施の形態1によるアンテナ装置のレドームの内面構造を示す図である。It is a figure which shows the inner surface structure of the radome of the antenna apparatus by Embodiment 1. FIG. 実施の形態1によるアンテナ装置のレドームの隔室を接続する溝の周辺部を示す図である。It is a figure which shows the peripheral part of the groove | channel which connects the compartment of the radome of the antenna apparatus by Embodiment 1. FIG.

実施の形態1.
図1は、この発明に係る実施の形態1によるアンテナ装置の構成を示す図である。図2は、実施の形態1によるアンテナ装置の構成を示す、図1のAA線の矢視方向から見た側断面図である。図3は、実施の形態1によるアンテナ装置の構成を示す、図1のBB線の矢視方向から見た側断面図である。図4は、実施の形態1によるアンテナ装置のレドームの内面構造を示す図であって、レドームの内面から見た図である。図5はレドームの隔壁に設けられた溝周辺の詳細図である。
Embodiment 1 FIG.
FIG. 1 is a diagram showing a configuration of an antenna apparatus according to Embodiment 1 of the present invention. FIG. 2 is a side cross-sectional view showing the configuration of the antenna device according to the first embodiment, as viewed from the direction of arrows AA in FIG. 3 is a side cross-sectional view showing the configuration of the antenna device according to the first embodiment, viewed from the direction of the arrow BB in FIG. FIG. 4 is a diagram showing the inner surface structure of the radome of the antenna device according to the first embodiment, as viewed from the inner surface of the radome. FIG. 5 is a detailed view around the groove provided in the partition wall of the radome.

図1において、アンテナ装置10は、樹脂基板1とレドーム50を備えて構成される。樹脂基板1は、両面実装されたプリント配線基板の表面(図1の上面)に、送信アンテナ2および受信アンテナ3を構成するアンテナ実装面60が形成されている。   In FIG. 1, the antenna device 10 includes a resin substrate 1 and a radome 50. The resin substrate 1 has an antenna mounting surface 60 constituting the transmitting antenna 2 and the receiving antenna 3 formed on the surface (the upper surface in FIG. 1) of the printed wiring board mounted on both sides.

樹脂基板1は、高周波信号の伝送損失を抑えるように、アンテナ実装面60が誘電正接の小さい低損失なフッ化樹脂(例えば誘電正接tanθ=0.0007〜0.0020のポリテトラフルオロエチレン基板)を用いて形成されており、複数の基材を複合して構成されている。また、樹脂基板1のアンテナ実装面60に隣接して高周波回路実装面70が形成されている。樹脂基板1の高周波回路実装面70は、送信回路4と受信回路5が、それぞれ間隔を空けてフリップチップ実装されている。樹脂基板1の裏面は、マイコン、メモリ等の1つもしくは複数の集積回路9が実装されている。集積回路9は、樹脂基板1の配線パターン、導体ビア等を通じて、送信回路4および受信回路5にそれぞれ接続されている。   The resin substrate 1 is formed using a low-loss fluororesin having a small dielectric loss tangent (for example, a polytetrafluoroethylene substrate having a dielectric loss tangent tan θ = 0.0007 to 0.0020) so as to suppress transmission loss of high-frequency signals. It is configured by combining a plurality of base materials. A high frequency circuit mounting surface 70 is formed adjacent to the antenna mounting surface 60 of the resin substrate 1. On the high-frequency circuit mounting surface 70 of the resin substrate 1, the transmitting circuit 4 and the receiving circuit 5 are flip-chip mounted with a space therebetween. On the back surface of the resin substrate 1, one or a plurality of integrated circuits 9 such as a microcomputer and a memory are mounted. The integrated circuit 9 is connected to the transmission circuit 4 and the reception circuit 5 through the wiring pattern of the resin substrate 1 and the conductor vias, respectively.

送信アンテナ2は複数のアンテナ素子から構成され、複数のアンテナ素子は所定の間隔を空けて配置され、アンテナアレイを形成する。送信回路4は、送信アンテナ2の送信アンテナ給電線6に接続される。受信アンテナ3は複数のアンテナ素子から構成され、複数のアンテナ素子は所定の間隔を空けて配置され、アンテナアレイを形成する。また、受信アンテナ3は少なくとも2以上の複数のアンテナアレイから配列される。受信回路5は、受信アンテナ3における複数の送信アンテナ給電線7にそれぞれ接続される。送信回路4は受信回路5にローカル信号線8を介して接続される。   The transmission antenna 2 is composed of a plurality of antenna elements, and the plurality of antenna elements are arranged at a predetermined interval to form an antenna array. The transmission circuit 4 is connected to the transmission antenna feed line 6 of the transmission antenna 2. The receiving antenna 3 is composed of a plurality of antenna elements, and the plurality of antenna elements are arranged at a predetermined interval to form an antenna array. Further, the receiving antenna 3 is arranged from at least two or more antenna arrays. The reception circuit 5 is connected to a plurality of transmission antenna feed lines 7 in the reception antenna 3. The transmission circuit 4 is connected to the reception circuit 5 via a local signal line 8.

送信回路4は、発振器、高出力増幅器、電力分配器等から構成される。受信回路5は、ミクサ、低雑音増幅器等から構成される。ローカル信号線8は、送信回路4の発振器と受信回路5のミクサの間を接続する。受信アンテナ3の各アンテナアレイはそれぞれ受信回路5の異なるミクサに接続されて、異なる受信チャンネルを構成している。   The transmission circuit 4 includes an oscillator, a high output amplifier, a power distributor, and the like. The receiving circuit 5 includes a mixer, a low noise amplifier, and the like. The local signal line 8 connects between the oscillator of the transmission circuit 4 and the mixer of the reception circuit 5. Each antenna array of the reception antenna 3 is connected to a different mixer of the reception circuit 5 to constitute a different reception channel.

樹脂基板1の表面における外周縁部は、アンテナ実装面60および高周波回路実装面70の周囲をそれぞれ取り囲むようにグランド導体40が形成されている。例えばグランド導体40は送信アンテナ2および受信アンテナ3の周囲をそれぞれ矩形状に囲んでいる。また、グランド導体40は送信回路4および受信回路5の周囲をそれぞれ矩形状に囲んでいる。また、樹脂基板1の裏面における外周縁部は、外周に沿ってグランド導体41が形成されている。樹脂基板1の内層は、送信アンテナ2および受信アンテナ3の地板をなすグランド導体410が形成されている。樹脂基板1の表面のグランド導体40と裏面のグランド導体41と内層のグランド導体410は、導体ビア55を通じて相互に接続されている。グランド導体410は、送信回路4および受信回路5と集積回路9を接続する図示しない導体ビアを貫通するための導体抜き穴と、導体ビア55を貫通するための導体抜き穴が、それぞれ形成されている。   A ground conductor 40 is formed on the outer peripheral edge of the surface of the resin substrate 1 so as to surround the antenna mounting surface 60 and the high-frequency circuit mounting surface 70. For example, the ground conductor 40 surrounds the transmitting antenna 2 and the receiving antenna 3 in a rectangular shape. The ground conductor 40 surrounds the transmission circuit 4 and the reception circuit 5 in a rectangular shape. A ground conductor 41 is formed along the outer periphery of the outer peripheral edge of the back surface of the resin substrate 1. On the inner layer of the resin substrate 1, a ground conductor 410 that forms a ground plane of the transmitting antenna 2 and the receiving antenna 3 is formed. The ground conductor 40 on the front surface of the resin substrate 1, the ground conductor 41 on the back surface, and the ground conductor 410 on the inner layer are connected to each other through the conductor via 55. The ground conductor 410 is formed with a conductor hole for passing through a conductor via (not shown) that connects the transmission circuit 4 and the receiver circuit 5 and the integrated circuit 9, and a conductor hole for passing through the conductor via 55, respectively. Yes.

ただし、グランド導体40は、送信アンテナ2と送信回路4間を接続する送信アンテナ給電線6が通過する部分の表面において、導体がなく誘電体面が露出した切れ間部61が形成されている。また、グランド導体40は、受信アンテナ3と受信回路5間を接続するそれぞれの送信アンテナ給電線7が通過する部分の表面において、導体がなく誘電体面が露出した切れ間部62がそれぞれ形成されている。また、グランド導体40は、送信回路4と受信回路5間を接続するそれぞれのアンテナ給電線8が通過する部分の表面において、導体がなく誘電体面が露出した切れ間部63がそれぞれ形成されている。   However, the ground conductor 40 has a gap 61 where there is no conductor and the dielectric surface is exposed on the surface of the portion through which the transmission antenna feed line 6 connecting the transmission antenna 2 and the transmission circuit 4 passes. Further, the ground conductor 40 is formed with a gap portion 62 where there is no conductor and the dielectric surface is exposed on the surface of the portion through which each transmission antenna feed line 7 connecting the reception antenna 3 and the reception circuit 5 passes. . Further, the ground conductor 40 is formed with a gap 63 where there is no conductor and the dielectric surface is exposed on the surface of the portion through which each antenna feed line 8 connecting the transmission circuit 4 and the reception circuit 5 passes.

図4において、レドーム50は、平面部51と側壁部52と隔壁部53から一体的に形成されている。平面部51は長方形板状である。平面部51は、送信アンテナ2から外部に送信される所望の送信周波数の電波および外部から入射し受信アンテナ3にて受信される所望の周波数の電波がそれぞれ透過し易いように、その板厚となるレドーム厚さが、電波整合厚となるように形成されている。側壁部52は、平面部51の四辺全周を囲むように立設している。隔壁部53は、平面部51の長方形状の対辺に位置する側壁部52の間をそれぞれ接続している。
図4において、TXは送信アンテナ2および送信回路4が収納され、RXは受信アンテナ3および受信回路5が収納される空間を示している。
In FIG. 4, the radome 50 is integrally formed from a plane portion 51, a side wall portion 52, and a partition wall portion 53. The flat part 51 is a rectangular plate shape. The planar portion 51 has a thickness and a thickness so that a radio wave having a desired transmission frequency transmitted from the transmission antenna 2 to the outside and a radio wave having a desired frequency incident from the outside and received by the reception antenna 3 are easily transmitted. The radome thickness is formed to be the radio wave matching thickness. The side wall portion 52 is erected so as to surround the entire circumference of the four sides of the flat portion 51. The partition wall portion 53 connects between the side wall portions 52 located on the opposite sides of the rectangular shape of the flat surface portion 51.
In FIG. 4, TX indicates a space in which the transmission antenna 2 and the transmission circuit 4 are accommodated, and RX indicates a space in which the reception antenna 3 and the reception circuit 5 are accommodated.

また、レドーム50は、側壁部52および隔壁53で囲まれた複数の隔室45、46、47、48が形成されている。ここで、隔室45は受信回路5を収納し、隔室46は送信回路4を収納している。隔室47は受信アンテナ3を内側に配置し、隔室48は送信アンテナ2を内側に配置している。   Further, the radome 50 is formed with a plurality of compartments 45, 46, 47 and 48 surrounded by the side wall 52 and the partition wall 53. Here, the compartment 45 contains the receiving circuit 5, and the compartment 46 contains the transmitting circuit 4. The compartment 47 has the receiving antenna 3 arranged on the inner side, and the compartment 48 has the transmitting antenna 2 arranged on the inner side.

レドーム50の側壁部52の下端面および隔壁53の下端面は、金属蒸着のようなメタライズ手法により導体膜20が付着している。また、レドーム50の隔室45および隔室46における底面および壁面の内面は、金属蒸着のようなメタライズ手法により導体膜20が付着している。導体膜20はグランド導体40,41を介してグランドに接続されている。   The conductor film 20 is attached to the lower end surface of the side wall portion 52 of the radome 50 and the lower end surface of the partition wall 53 by a metallization technique such as metal vapor deposition. Further, the conductor film 20 is attached to the bottom surface and the inner surface of the wall surface of the compartment 45 and the compartment 46 of the radome 50 by a metallization technique such as metal vapor deposition. The conductor film 20 is connected to the ground via ground conductors 40 and 41.

なお、レドーム50の隔室47,48における底面は、送信アンテナ2から送信される送信電波および受信アンテナ3にて受信される受信電波が通過するように、導体膜20がない。
また、レドーム50の隔室47と隔室48の間を隔てる隔壁53は、送信アンテナ2から空間に放射した電波が通過して受信アンテナ3側に入射することがないように、隔室47側または隔室48側の壁に導体膜20を設ける。
Note that the bottom surfaces of the compartments 47 and 48 of the radome 50 do not have the conductor film 20 so that transmission radio waves transmitted from the transmission antenna 2 and reception radio waves received by the reception antenna 3 can pass therethrough.
Further, the partition wall 53 that separates the compartment 47 and the compartment 48 of the radome 50 from the side of the compartment 47 so that radio waves radiated from the transmitting antenna 2 to the space do not pass through and enter the receiving antenna 3 side. Alternatively, the conductor film 20 is provided on the wall on the compartment 48 side.

レドーム50は、隔壁45の空間と隔壁46の空間を繋いで連通する溝11と、隔壁46の空間と隔壁48の空間を繋いで連通する溝12と、隔壁45の空間と隔壁47の空間を繋いで連通する溝13,14が形成されている。   The radome 50 includes a groove 11 that connects the space of the partition wall 45 and the space of the partition wall 46, a groove 12 that connects the space of the partition wall 46 and the space of the partition wall 48, and the space of the partition wall 45 and the space of the partition wall 47. Grooves 13 and 14 that are connected and communicated are formed.

レドーム50は、下端面の導体膜20が樹脂基板1の導体膜40の上面に接するように配置されて、締結用螺子部または接着剤により固定される。   The radome 50 is disposed so that the conductor film 20 on the lower end surface is in contact with the upper surface of the conductor film 40 of the resin substrate 1 and is fixed by a fastening screw portion or an adhesive.

なお、水密性を保つまたは湿気の混入を防ぐために、レドーム50の外周が樹脂基板1の外周よりも外側に突き出すように、レドーム50を樹脂基板1の上面に配置しても良い。この場合、レドーム50の外周が樹脂基板1よりも外側に突き出す部分において、レドーム50の端面を樹脂ケースに接着することで、水密性を保つとともに湿気の混入を防ぐことができる。また、レドーム50の外周が樹脂基板1よりも外側に突き出す部分において、レドーム50の端面を防水リングに押し当てて樹脂ケースに締結固定して、水密性を保つとともに湿気の混入を防ぐようにしても良い。   Note that the radome 50 may be disposed on the upper surface of the resin substrate 1 so that the outer periphery of the radome 50 protrudes outside the outer periphery of the resin substrate 1 in order to maintain watertightness or prevent moisture from being mixed. In this case, by adhering the end face of the radome 50 to the resin case at the portion where the outer periphery of the radome 50 protrudes outward from the resin substrate 1, it is possible to maintain water tightness and prevent moisture from being mixed. In addition, at the portion where the outer periphery of the radome 50 protrudes outside the resin substrate 1, the end face of the radome 50 is pressed against the waterproof ring and fastened and fixed to the resin case so as to maintain water tightness and prevent moisture from entering. Also good.

図5は、実施の形態1によるアンテナ装置10のレドームの隔室を接続する溝の周辺部を示す図であって、レドーム50が樹脂基板1に接した状態を示している。図4、5において、送信アンテナ給電線6は溝12内に配置され、ローカル信号線8は溝11内に配置され、送信アンテナ給電線7は溝13または溝14内に配置される。   FIG. 5 is a view showing a peripheral portion of the groove connecting the compartments of the radome of the antenna device 10 according to the first embodiment, and shows a state where the radome 50 is in contact with the resin substrate 1. 4 and 5, the transmission antenna feed line 6 is disposed in the groove 12, the local signal line 8 is disposed in the groove 11, and the transmission antenna feed line 7 is disposed in the groove 13 or the groove 14.

また、図5において、各溝11,12,13,14は、上面と側面が導体膜20によりグランド面に覆われる。また、各溝11,12,13,14は、下部周囲に導体ビア55が設けられる。各溝11,12,13,14を覆う導体膜20は、導体膜40および導体ビア55を介して、樹脂基板1の内層または裏面に形成されたグランド導体410またはグランド導体41に接続され、その下側の空間がグランド面に覆われている。これにより、各溝11,12,13,14は、導体膜20、導体ビア55、およびグランド導体41,グランド導体410により、周囲空間がグランド面に囲まれる。   In FIG. 5, each of the grooves 11, 12, 13, and 14 is covered with the ground surface by the conductor film 20 on the upper surface and side surfaces. Each of the grooves 11, 12, 13, 14 is provided with a conductor via 55 around the lower part. The conductor film 20 covering each of the grooves 11, 12, 13, 14 is connected to the ground conductor 410 or the ground conductor 41 formed on the inner layer or the back surface of the resin substrate 1 via the conductor film 40 and the conductor via 55. The lower space is covered by the ground plane. Thus, the surrounding space of each of the grooves 11, 12, 13, and 14 is surrounded by the ground surface by the conductor film 20, the conductor via 55, the ground conductor 41, and the ground conductor 410.

また、各溝11,12,13,14は、送信アンテナ2の所望の送信周波数fの送信波または送信周波数fの高調波(例えば2倍波)を遮断する溝幅Wとなっている。例えば送信周波数fでの波長がλの場合、溝幅W=λ/2以下または溝幅W=λ/2以下として、遮断する信号のカットオフ周波数以下(カットオフ波長以下)となるように溝幅Wを設定する。 Further, each groove 11, 12 has a groove width W for blocking the harmonics of the transmitted wave or the transmission frequency f 0 of the desired transmission frequency f 0 of the transmit antenna 2 (e.g. second harmonic) . For example, when the wavelength at the transmission frequency f 0 is λ, the groove width W = λ / 2 or less or the groove width W = λ / 2 or less, so that it is below the cutoff frequency of the signal to be cut off (below the cutoff wavelength). The groove width W is set.

実施の形態1によるアンテナ装置10は、次のように動作する。
送信アンテナ2から送信電波が放射され、外部の目標(ターゲット)で送信電波が反射してアンテナ装置側に戻り、受信アンテナ3にてその反射電波が受信される。
The antenna device 10 according to the first embodiment operates as follows.
A transmission radio wave is radiated from the transmission antenna 2, the transmission radio wave is reflected by an external target (target), returns to the antenna device side, and the reflected radio wave is received by the reception antenna 3.

送信回路4は、その発振器が所望周波数の源信号を発信し、高出力増幅器が源信号を増幅して、送信アンテナ給電線6から送信アンテナ2に、高出力に増幅された送信信号を給電する。送信アンテナ2は、送信アンテナ給電線6から給電された送信電波を放射する。また、送信回路4は、ローカル信号線8から受信回路5に上記送信信号を電力分配したローカル信号を送る。受信回路5は、受信アンテナ3の受信した受信電波を受信回路5に入力する。受信回路5は、受信アンテナ3の受信した受信電波を増幅し、ローカル信号線8から入力されたローカル信号と周波数混合することにより、ベースバンドのダウンコンバート信号を生成する。送信回路4は、集積回路9の出力するバイアス電源および制御信号に基づいて動作処理を行う。また、受信回路5は、集積回路9の出力するバイアス電源および制御信号に基づいて動作処理を行う。また、受信回路5は、ダウンコンバート信号を集積回路9に送り、アナログディジタル変換、フーリエ変換等のベースバンドの信号処理を行う。   In the transmission circuit 4, the oscillator transmits a source signal having a desired frequency, the high-power amplifier amplifies the source signal, and feeds the transmission signal amplified to high output from the transmission antenna feed line 6 to the transmission antenna 2. . The transmission antenna 2 radiates transmission radio waves fed from the transmission antenna feed line 6. The transmission circuit 4 transmits a local signal obtained by distributing the power of the transmission signal from the local signal line 8 to the reception circuit 5. The receiving circuit 5 inputs the received radio wave received by the receiving antenna 3 to the receiving circuit 5. The receiving circuit 5 amplifies the received radio wave received by the receiving antenna 3 and frequency-mixes it with the local signal input from the local signal line 8 to generate a baseband down-converted signal. The transmission circuit 4 performs an operation process based on the bias power supply and control signal output from the integrated circuit 9. The receiving circuit 5 performs an operation process based on the bias power supply and control signal output from the integrated circuit 9. Further, the receiving circuit 5 sends a down-converted signal to the integrated circuit 9 and performs baseband signal processing such as analog-digital conversion and Fourier transform.

実施の形態1によるアンテナ装置10がレーダ装置である場合は、集積回路9は、ベースバンドの信号処理結果に基づいて、目標検出、目標までの距離、ドップラー信号の抽出、目標の測角処理等のレーダ信号処理を行う。また、受信回路5の受ける複数の受信信号に基づき、受信チャネル間の位相差を求め、測角処理を行う。   When the antenna apparatus 10 according to the first embodiment is a radar apparatus, the integrated circuit 9 detects the target, the distance to the target, the extraction of the Doppler signal, the target angle measurement process, and the like based on the baseband signal processing result. Radar signal processing. Further, based on a plurality of reception signals received by the reception circuit 5, a phase difference between reception channels is obtained, and angle measurement processing is performed.

ここで、送信回路4、送信アンテナ給電線6、およびローカル信号線8は、空間に漏れ電波を放射する。特に、送信アンテナ給電線6は、送信回路4の高出力増幅器により増幅された高出力な電波が放射される。この空間に放射された漏れ電波は、導体膜20によって反射し、レドーム50の隔室46から隔室47の内部に漏れ出ることはない。また、溝11,12,13,14はカットオフ周波数に設定されているので、この空間に放射された漏れ電波が溝11,12,13,14を通じて漏れ出ることはない。   Here, the transmission circuit 4, the transmission antenna feed line 6, and the local signal line 8 radiate leaked radio waves into the space. In particular, the transmission antenna feed line 6 radiates high-power radio waves amplified by the high-power amplifier of the transmission circuit 4. The leaked radio wave radiated into this space is reflected by the conductor film 20 and does not leak from the compartment 46 of the radome 50 into the compartment 47. Further, since the grooves 11, 12, 13, and 14 are set to the cut-off frequency, the leaked radio wave radiated into this space does not leak through the grooves 11, 12, 13, and 14.

隔室46内の反射信号が共振しないように、隔室46の寸法は、送信周波数fまたは送信周波数fの高調波(例えば2倍波)の波長λの整数倍または波長λ/4の奇数倍にならないようにすると良い。 In order to prevent the reflected signal in the compartment 46 from resonating, the size of the compartment 46 is an integral multiple of the wavelength λ of the transmission frequency f 0 or a harmonic of the transmission frequency f 0 (for example, a second harmonic) or a wavelength λ / 4. It is better not to be an odd multiple.

また、隔室46の側壁部52における少なくとも一部の領域の壁面90は、導体膜20を設けないようにしている。ここで、隔室46における溝11,12が形成されていない側壁部52の少なくとも一部の領域の壁面90は、導体膜20が形成されない誘電体窓となっている。
この場合、導体膜20の付着していない部分から、隔室46内の反射信号が外部に漏れ出るため、隔室46内の反射信号は共振を生じない。また、このとき壁面90から外部に漏れ出た信号が回り込んで、受信回路5、送信アンテナ給電線7および受信アンテナ3に入射する信号は減少する。このため、送信回路4、送信アンテナ給電線6、およびローカル信号線8から漏れ出て、受信回路5、送信アンテナ給電線7および受信アンテナ3に入射する信号は低減する。
In addition, the conductive film 20 is not provided on the wall surface 90 of at least a part of the side wall portion 52 of the compartment 46. Here, the wall surface 90 of at least a part of the side wall portion 52 where the grooves 11 and 12 are not formed in the compartment 46 is a dielectric window where the conductor film 20 is not formed.
In this case, since the reflected signal in the compartment 46 leaks to the outside from the portion where the conductor film 20 is not attached, the reflected signal in the compartment 46 does not resonate. At this time, the signal leaking to the outside from the wall surface 90 wraps around, and the signals incident on the reception circuit 5, the transmission antenna feeder 7 and the reception antenna 3 decrease. For this reason, signals leaking from the transmission circuit 4, the transmission antenna feed line 6, and the local signal line 8 and entering the reception circuit 5, the transmission antenna feed line 7 and the reception antenna 3 are reduced.

また、レドーム50の隔室47と隔室48の間を隔てる隔壁53に導体膜20を設けているので、送信アンテナ2から空間に放射した電波が、隔室48から隔室47内の受信アンテナ3へ漏出することを抑えることができる。   Further, since the conductor film 20 is provided on the partition wall 53 that separates the compartment 47 and the compartment 48 of the radome 50, the radio wave radiated from the transmitting antenna 2 to the space is received from the compartment 48 into the receiving antenna in the compartment 47. Leakage to 3 can be suppressed.

なお、送信回路4からの漏れ電波の信号強度が小さい場合は、隔室46と隔室48の間を隔てる隔壁53を除去した構成としても良い。また、送信アンテナ2から送信され、外部で反射されて戻るもしくは送信アンテナ2から直接入射する電波が、受信アンテナ給電線7または受信回路5に給電する信号強度が小さい場合は、隔室45と隔室47の間を隔てる隔壁53を除去した構成としても良い。   When the signal intensity of the leaked radio wave from the transmission circuit 4 is small, the partition wall 53 that separates the compartment 46 and the compartment 48 may be removed. Further, when the intensity of the signal transmitted from the transmitting antenna 2 and reflected back from the outside or directly incident from the transmitting antenna 2 is low, the power supplied to the receiving antenna feeding line 7 or the receiving circuit 5 is small. The partition wall 53 that separates the chambers 47 may be removed.

以上説明した通り、実施の形態1によるアンテナ装置10は、送信電波を放射する送信アンテナ2と、上記送信電波の反射波を受信する受信アンテナ3と、送信アンテナ給電線6により上記送信アンテナ2に接続された送信回路4と、受信アンテナ給電線7により上記受信アンテナ3に接続されるとともに、ローカル信号線8により送信回路4に接続された受信回路5とを有し、上記送信アンテナ2、受信アンテナ3、送信回路4、および受信回路5を囲むように導体膜20が実装された樹脂基板1と、少なくとも上記送信回路4を収納する第1の隔室46、および少なくとも上記受信回路5を収納する第2の隔室45を形成し、当該第1の隔室46と第2の隔室45の間の隔壁53に導体膜20を形成するとともに、上記第1の隔室46と第2の隔室45を連通し、かつ上記ローカル信号線8が配置される導体膜20で囲まれた溝11が形成されたレドーム50を備え、上記溝11の幅は上記送信アンテナ給電線6から漏れ出る電波の半波長(λ/2)以下としたことを特徴とする。   As described above, the antenna device 10 according to Embodiment 1 is connected to the transmission antenna 2 by the transmission antenna 2 that radiates transmission radio waves, the reception antenna 3 that receives reflected waves of the transmission radio waves, and the transmission antenna feeder 6. The transmission circuit 4 is connected to the reception antenna 3 by a reception antenna feed line 7, and the reception circuit 5 is connected to the transmission circuit 4 by a local signal line 8. The resin substrate 1 on which the conductive film 20 is mounted so as to surround the antenna 3, the transmission circuit 4, and the reception circuit 5, the first compartment 46 that houses at least the transmission circuit 4, and at least the reception circuit 5 are accommodated. The second compartment 45 is formed, the conductor film 20 is formed on the partition wall 53 between the first compartment 46 and the second compartment 45, and the first compartment 46 2 including a radome 50 formed with a groove 11 surrounded by a conductor film 20 in which the local signal line 8 is disposed, and the width of the groove 11 extends from the transmission antenna feed line 6. It is characterized in that the leaked radio wave has a half wavelength (λ / 2) or less.

また、送信電波を放射する送信アンテナ2と、上記送信電波の反射波を受信する受信アンテナ3と、送信アンテナ給電線6により上記送信アンテナ2に接続された送信回路4と、受信アンテナ給電線7により上記受信アンテナ3に接続されるとともに、ローカル信号線8により送信回路4に接続された受信回路5とを有し、上記送信アンテナ2、受信アンテナ3、送信回路4、および受信回路5を囲むように導体膜20が実装された樹脂基板1と、少なくとも上記送信回路4を収納する第1の隔室46、上記受信回路5を収納する第2の隔室45、上記受信アンテナ3を収納する第3の隔室47を形成し、当該第1の隔室46と第2の隔室45の間の第1の隔壁53および第2の隔室45と第3の隔室47の間の第2の隔壁53にそれぞれ導体膜20を形成するとともに、上記第1の隔室46と第2の隔室45を連通して上記ローカル信号線8が配置される導体膜20で囲まれた第1の溝11と、上記第2の隔室45と第3の隔室47を連通して上記受信アンテナ給電線7が配置される導体膜20で囲まれた第2の溝13,14が形成されたレドーム50とを備え、上記第1、第2の溝の幅11,13,14は上記送信アンテナ給電線から漏れ出る電波の半波長以下であるアンテナ装置。また、上記第1の隔室46は底面および壁面が導体膜20で覆われている。   In addition, a transmission antenna 2 that radiates a transmission radio wave, a reception antenna 3 that receives a reflection wave of the transmission radio wave, a transmission circuit 4 connected to the transmission antenna 2 by a transmission antenna feed line 6, and a reception antenna feed line 7 And the receiving circuit 5 connected to the transmitting circuit 4 by the local signal line 8 and surrounds the transmitting antenna 2, the receiving antenna 3, the transmitting circuit 4, and the receiving circuit 5. Thus, the resin substrate 1 on which the conductor film 20 is mounted, the first compartment 46 that houses at least the transmission circuit 4, the second compartment 45 that houses the reception circuit 5, and the reception antenna 3 are housed. A third compartment 47 is formed, and a first partition 53 between the first compartment 46 and the second compartment 45 and a second partition 45 between the second compartment 45 and the third compartment 47 are formed. 2 leads to the partition walls 53 respectively The film 20 is formed, and the first groove 11 surrounded by the conductor film 20 in which the local signal line 8 is disposed in communication with the first compartment 46 and the second compartment 45, and the first A radome 50 having a second groove 13 and 14 formed in communication with the second compartment 45 and the third compartment 47 and surrounded by the conductor film 20 in which the receiving antenna feed line 7 is disposed. The antenna device in which the widths 11, 13, and 14 of the first and second grooves are equal to or less than a half wavelength of the radio wave leaking from the transmission antenna feed line. The first compartment 46 is covered with the conductor film 20 at the bottom and the wall surface.

また、送信電波を放射する送信アンテナ2と、上記送信電波の反射波を受信する受信アンテナ3と、送信アンテナ給電線6により上記送信アンテナ2に接続された送信回路4と、受信アンテナ給電線7により上記受信アンテナ3に接続されるとともに、ローカル信号線8により送信回路4に接続された受信回路5と有し、上記送信アンテナ2、受信アンテナ3、送信回路4、および受信回路5を囲むように導体膜20が実装された樹脂基板1と、上記送信回路4を収納する第1の隔室46、上記受信回路5を収納する第2の隔室45、上記受信アンテナ3を収納する第3の隔室47を形成し、上記送信アンテナ2を収納する第4の隔室48を形成し、当該第1の隔室46と第3の隔室47の間の第1の隔壁53、第2の隔室45と第3の隔室47の間の第2の隔壁53、第1の隔室46と第4の隔室48の間の第3の隔壁53および第2の隔室45と第4の隔室48の間の第4の隔壁53にそれぞれ導体膜20を形成するとともに、上記第2の隔室45と第1の隔室46を連通して上記ローカル信号線8が配置される導体膜20で囲まれた第1の溝11と、上記第2の隔室45と第3の隔室47を連通して上記受信アンテナ給電線7が配置される導体膜20で囲まれた第2の溝13,14と、上記第1の隔室46と第4の隔室48を連通して上記送信アンテナ給電線6が配置される導体膜20で囲まれた第3の溝12が形成されたレドーム50とを備え、上記第1、第2、第3の溝11,13,14,12の幅は上記送信アンテナ給電線から漏れ出る電波の半波長以下であり、上記第2、第4の隔室45,48は底面および壁面が導体膜20で覆われるとともに、上記第4の隔室48における上記第1、第3の溝11,12が形成されていない側壁部の少なくとも一部は導体膜20が形成されない誘電体窓となっている。   In addition, a transmission antenna 2 that radiates a transmission radio wave, a reception antenna 3 that receives a reflection wave of the transmission radio wave, a transmission circuit 4 connected to the transmission antenna 2 by a transmission antenna feed line 6, and a reception antenna feed line 7 And the reception circuit 5 connected to the transmission circuit 4 by the local signal line 8 so as to surround the transmission antenna 2, the reception antenna 3, the transmission circuit 4, and the reception circuit 5. The resin substrate 1 on which the conductor film 20 is mounted, the first compartment 46 for housing the transmission circuit 4, the second compartment 45 for housing the reception circuit 5, and the third compartment for housing the reception antenna 3. And a fourth partition 48 for accommodating the transmitting antenna 2 is formed, and the first partition 53 and the second partition between the first partition 46 and the third partition 47 are formed. Compartment 45 and third compartment 7, the third partition wall 53 between the first compartment 46 and the fourth compartment 48, and the fourth partition between the second compartment 45 and the fourth compartment 48. The conductor film 20 is formed on each of the partition walls 53, and the first compartment surrounded by the conductor film 20 in which the local signal line 8 is disposed through the second compartment 45 and the first compartment 46. A groove 11, second grooves 13, 14 surrounded by a conductor film 20 in which the second antenna 45 and the third compartment 47 communicate with each other and the receiving antenna feeder 7 is disposed; The first compartment 46 and the fourth compartment 48, and a radome 50 formed with the third groove 12 surrounded by the conductor film 20 in which the transmission antenna feed line 6 is disposed. The widths of the first, second, and third grooves 11, 13, 14, and 12 are equal to or less than a half wavelength of the radio wave that leaks from the transmission antenna feed line. The bottom and wall surfaces of the second and fourth compartments 45 and 48 are covered with the conductor film 20 and the side walls of the fourth compartment 48 where the first and third grooves 11 and 12 are not formed. At least a portion is a dielectric window in which the conductor film 20 is not formed.

これによって、送信アンテナ2、受信アンテナ3、送信回路4、および受信回路5を、樹脂基板1の同一面上に配置したアンテナ装置10において、電波吸収体を用いることなく、送信アンテナ2および送信回路4から、受信回路5への送信電波の漏れ込みを抑制することができる。   Thus, in the antenna device 10 in which the transmission antenna 2, the reception antenna 3, the transmission circuit 4, and the reception circuit 5 are arranged on the same surface of the resin substrate 1, the transmission antenna 2 and the transmission circuit are used without using a radio wave absorber. 4, leakage of the transmission radio wave to the receiving circuit 5 can be suppressed.

実施の形態2.
実施の形態1のレドーム50において、導体膜20の全部または一部に、抵抗膜を用いても良い。導体膜20に抵抗膜を用いることにより、送信回路4、送信アンテナ給電線6、およびローカル信号線8から空間に放射した電波は、レドーム50の隔室46内で減衰し、隔室45および隔室47に入射する漏れ電波が低減する。また、各溝11,12,13,14の内面の導体膜20に抵抗膜を用いることにより、溝11,12,13,14を通過する送信周波数fの高調波(例えば3倍波、4倍波)の通過を抑制することができる。
Embodiment 2. FIG.
In the radome 50 of the first embodiment, a resistive film may be used for all or part of the conductor film 20. By using a resistive film for the conductor film 20, radio waves radiated into the space from the transmission circuit 4, the transmission antenna feed line 6, and the local signal line 8 are attenuated in the compartment 46 of the radome 50, and Leakage radio waves incident on the chamber 47 are reduced. Further, by using a resistive film as the conductor film 20 on the inner surface of each groove 11, 12, 13, 14, the harmonics of the transmission frequency f 0 passing through the grooves 11, 12, 13, 14 (for example, third harmonic, Double wave) can be suppressed.

ただし、レドーム50の隔室47と隔室48の間を隔てる隔壁53は、送信アンテナ2から空間に放射した電波が通過しないように、導体膜20を金属膜で覆っておくのが良い。   However, the partition wall 53 separating the compartment 47 and the compartment 48 of the radome 50 is preferably covered with a metal film so that radio waves radiated from the transmitting antenna 2 to the space do not pass.

1 樹脂基板、2 送信アンテナ、3 受信アンテナ、4 送信回路、5 受信回路、6 送信アンテナ給電線、7 送信アンテナ給電線、8 ローカル信号線、9 集積回路、10 アンテナ装置、11 溝、12 溝、13 溝、14 溝、20 導体膜、40 導体膜、45 隔室、46 隔室、47 隔室、48 隔室、50 レドーム、53 隔壁。   1 resin substrate, 2 transmitting antenna, 3 receiving antenna, 4 transmitting circuit, 5 receiving circuit, 6 transmitting antenna feed line, 7 transmitting antenna feed line, 8 local signal line, 9 integrated circuit, 10 antenna device, 11 groove, 12 groove , 13 groove, 14 groove, 20 conductor film, 40 conductor film, 45 compartment, 46 compartment, 47 compartment, 48 compartment, 50 radome, 53 partition.

Claims (4)

送信電波を放射する送信アンテナと、
上記送信電波の反射波を受信する受信アンテナと、
送信アンテナ給電線により上記送信アンテナに接続された送信回路と、
受信アンテナ給電線により上記受信アンテナに接続されるとともに、ローカル信号線により送信回路に接続された受信回路と、
を有し、上記送信アンテナ、受信アンテナ、送信回路、および受信回路を囲むように導体膜が実装された樹脂基板と、
少なくとも上記送信回路を収納する第1の隔室、および少なくとも上記受信回路を収納する第2の隔室を形成し、当該第1の隔室と第2の隔室の間の隔壁に導体膜を形成するとともに、上記第1の隔室と第2の隔室を連通し、かつ上記ローカル信号線が配置される導体膜で囲まれた溝が形成されたレドームと、
を備え、
上記溝の幅は上記送信アンテナ給電線から漏れ出る電波の半波長以下であるアンテナ装置。
A transmission antenna that radiates transmission radio waves,
A receiving antenna for receiving the reflected wave of the transmission radio wave;
A transmission circuit connected to the transmission antenna by a transmission antenna feed line;
A receiving circuit connected to the receiving antenna by a receiving antenna feed line and connected to a transmitting circuit by a local signal line;
A resin substrate on which a conductor film is mounted so as to surround the transmission antenna, the reception antenna, the transmission circuit, and the reception circuit;
Forming at least a first compartment containing the transmitting circuit and a second compartment containing at least the receiving circuit, and forming a conductor film on a partition between the first compartment and the second compartment; A radome formed with a groove surrounded by a conductor film in which the first signal chamber and the second chamber communicate with each other and the local signal line is disposed;
With
The antenna device wherein the width of the groove is equal to or less than a half wavelength of the radio wave leaking from the transmission antenna feeder line.
送信電波を放射する送信アンテナと、
上記送信電波の反射波を受信する受信アンテナと、
送信アンテナ給電線により上記送信アンテナに接続された送信回路と、
受信アンテナ給電線により上記受信アンテナに接続されるとともに、ローカル信号線により送信回路に接続された受信回路と、
を有し、上記送信アンテナ、受信アンテナ、送信回路、および受信回路を囲むように導体膜が実装された樹脂基板と、
少なくとも上記送信回路を収納する第1の隔室、上記受信回路を収納する第2の隔室、上記受信アンテナを収納する第3の隔室を形成し、当該第1の隔室と第2の隔室の間の第1の隔壁および第2の隔室と第3の隔室の間の第2の隔壁にそれぞれ導体膜を形成するとともに、上記第1の隔室と第2の隔室を連通して上記ローカル信号線が配置される導体膜で囲まれた第1の溝と、上記第2の隔室と第3の隔室を連通して上記受信アンテナ給電線が配置される導体膜で囲まれた第2の溝が形成されたレドームと、
を備え、
上記第1、第2の溝の幅は上記送信アンテナ給電線から漏れ出る電波の半波長以下であるアンテナ装置。
A transmission antenna that radiates transmission radio waves,
A receiving antenna for receiving the reflected wave of the transmission radio wave;
A transmission circuit connected to the transmission antenna by a transmission antenna feed line;
A receiving circuit connected to the receiving antenna by a receiving antenna feed line and connected to a transmitting circuit by a local signal line;
A resin substrate on which a conductor film is mounted so as to surround the transmission antenna, the reception antenna, the transmission circuit, and the reception circuit;
Forming at least a first compartment containing the transmitting circuit, a second compartment containing the receiving circuit, and a third compartment containing the receiving antenna; Conductive films are formed on the first partition between the compartments and on the second partition between the second and third compartments, respectively, and the first and second compartments are formed. The first groove surrounded by the conductor film in which the local signal line is disposed and the conductor film in which the reception antenna feed line is disposed in communication with the second compartment and the third compartment A radome formed with a second groove surrounded by
With
The antenna device wherein the width of the first and second grooves is equal to or less than a half wavelength of the radio wave leaking from the transmission antenna feed line.
上記第1の隔室は底面および壁面が導体膜で覆われたことを特徴とする請求項2記載のアンテナ装置。   3. The antenna apparatus according to claim 2, wherein the first compartment has a bottom surface and a wall surface covered with a conductor film. 送信電波を放射する送信アンテナと、
上記送信電波の反射波を受信する受信アンテナと、
送信アンテナ給電線により上記送信アンテナに接続された送信回路と、
受信アンテナ給電線により上記受信アンテナに接続されるとともに、ローカル信号線により送信回路に接続された受信回路と、
を有し、上記送信アンテナ、受信アンテナ、送信回路、および受信回路を囲むように導体膜が実装された樹脂基板と、
上記送信回路を収納する第1の隔室、上記受信回路を収納する第2の隔室、上記受信アンテナを収納する第3の隔室を形成し、上記送信アンテナを収納する第4の隔室を形成し、当該第1の隔室と第3の隔室の間の第1の隔壁、第2の隔室と第3の隔室の間の第2の隔壁、第1の隔室と第4の隔室の間の第3の隔壁および第2の隔室と第4の隔室の間の第4の隔壁にそれぞれ導体膜を形成するとともに、上記第2の隔室と第1の隔室を連通して上記ローカル信号線が配置される導体膜で囲まれた第1の溝と、上記第2の隔室と第3の隔室を連通して上記受信アンテナ給電線が配置される導体膜で囲まれた第2の溝と、上記第1の隔室と第4の隔室を連通して上記送信アンテナ給電線が配置される導体膜で囲まれた第3の溝が形成されたレドームと、
を備え、
上記第1、第2、第3の溝の幅は上記送信アンテナ給電線から漏れ出る電波の半波長以下であり、
上記第2、第4の隔室は底面および壁面が導体膜で覆われるとともに、上記第4の隔室における上記第1、第3の溝が形成されていない側壁部の少なくとも一部に導体膜が形成されていないアンテナ装置。
A transmission antenna that radiates transmission radio waves,
A receiving antenna for receiving the reflected wave of the transmission radio wave;
A transmission circuit connected to the transmission antenna by a transmission antenna feed line;
A receiving circuit connected to the receiving antenna by a receiving antenna feed line and connected to a transmitting circuit by a local signal line;
A resin substrate on which a conductor film is mounted so as to surround the transmission antenna, the reception antenna, the transmission circuit, and the reception circuit;
Forming a first compartment for housing the transmission circuit, a second compartment for housing the reception circuit, and a third compartment for housing the reception antenna, and a fourth compartment for housing the transmission antenna. Forming a first partition between the first compartment and the third compartment, a second partition between the second compartment and the third compartment, the first compartment and the first compartment. Conductive films are respectively formed on the third partition between the four compartments and on the fourth partition between the second and fourth compartments, and the second compartment and the first partition. The first antenna groove surrounded by the conductor film in which the local signal line is arranged through the chamber, the second compartment and the third compartment are communicated with the receiving antenna feed line. A second groove surrounded by the conductor film, and a third groove surrounded by the conductor film in which the transmission antenna feed line is arranged to communicate with the first compartment and the fourth compartment are formed. Redo And,
With
The width of the first, second, and third grooves is equal to or less than a half wavelength of the radio wave leaking from the transmission antenna feed line,
The bottom and wall surfaces of the second and fourth compartments are covered with a conductor film, and a conductor film is formed on at least a part of the side wall portion in the fourth compartment where the first and third grooves are not formed. Antenna device in which is not formed.
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