JP6255789B2 - Imprint method and imprint apparatus - Google Patents

Description

  The present invention relates to an imprint method and an imprint apparatus in which at least one of a mold to be used and a transfer substrate has a mesa structure.

In recent years, a pattern forming technique using an imprint method has attracted attention as a fine pattern forming technique that replaces the photolithography technique. The imprint method is a pattern forming technique in which a fine structure is transferred at an equal magnification by using a mold member (mold) having a fine concavo-convex structure and transferring the concavo-convex structure to a molding resin. For example, in an imprint method using a photocurable resin as a molding resin, droplets of the photocurable resin are supplied to the surface of the transfer substrate, and the mold having the desired concavo-convex structure and the transfer substrate are brought to a predetermined distance. The concavo-convex structure is filled with a photocurable resin, and in this state, light is irradiated from the mold side to cure the photocurable resin. A pattern structure having an inverted uneven structure (uneven pattern) is formed.
In such an imprint method, when the mold and the transfer substrate are brought close to each other by a predetermined distance, the resin to be molded may protrude out of a region where the mold and the transfer substrate are close to each other, and this may become a foreign matter. For example, when a molding resin is applied to the entire surface of a transfer substrate having a larger area than the mold by spin coating or the like, and imprinting is repeatedly performed by step / repeat using the mold, the molding resin protruding outside the mold There exists a problem that hardened | cured material turns into a foreign material and damages a mold or a pattern structure. For such problems, it has been proposed to use a mold having a light shielding member on the side surface to reduce and suppress the photocuring of the protruding molded resin and prevent the generation of foreign matters (Patent Document). 1).

Japanese Patent No. 4869263

  In an imprint using a mold and a transfer substrate, one of which has a mesa structure, for example, misalignment between the mold and the transfer substrate, unevenness in the film thickness distribution or supply amount distribution of the molding resin, the mold and the transfer substrate Due to factors such as the proximity method, the molded resin may protrude from the outside of the mesa structure. Similar to the problem at the time of imprinting by the step / repeat described above, even when the resin to be molded protrudes outside the mesa structure, the mold or pattern structure is damaged by the foreign matter generated from the protruding portion. There is a problem of giving. In particular, in imprinting for manufacturing a replica mold from a master mold, if a defect occurs due to foreign matter adhering to the master mold, the manufacturing cost and the manufacturing time are greatly increased.

However, when a transfer substrate to be used (for example, a substrate for a replica mold) has a mesa structure, the mold (for example, a master mold) includes a light shielding member on a side surface as described in Patent Document 1 above. Even if it exists, since the to-be-molded resin that protrudes outside the mesa structure of the transfer substrate is cured by the irradiation light from the mold side, the generation of foreign matter cannot be prevented.
Moreover, when the mold (for example, master mold) to be used has a mesa structure and a light-shielding member is provided on the side surface of the mesa structure as described in Patent Document 1, the molded resin and the mold after curing are used. When being separated, the molding resin that protrudes outside the mesa structure is in an uncured state. For this reason, uncured molding resin may scatter or cause tailing when released from the mold, and foreign matter may adhere to the mold or pattern structure to cause defects.
The present invention has been made in view of the above-described circumstances, and an imprint method for forming a pattern structure with high accuracy using a mold having a mesa structure and / or a transfer substrate, and an imprint An object is to provide an apparatus.

In order to achieve such an object, the imprint method of the present invention provides the convex structure portion of the transfer substrate having a mesa structure in which the region where the pattern structure is formed has a convex structure portion protruding from the surrounding region. a resin supplying step of supplying an object to be molded resin above, in close proximity with the mold having a concavo-convex structure and the transfer substrate, the molded resin layer by developing the the molded resin between the transfer substrate and the mold a contact step of forming, said a curing step of the concavo-convex structure is cured to be molded resin layer is to be a transfer resin layer transfer, said the mold pulled away from each other and the transfer resin layer, with the transfer resin layer and a release step so as to be brought into a position of a pattern structure on the transfer substrate, wherein a inspection step of inspecting said mold after the demolding process and the pattern structure, and in the inspection process It examines the existence of the protrusion of the pattern structure to the outside of the convex portions of the transfer substrate, and configured so as to determine the subsequent steps on the basis of the test results.

As another aspect of the present invention, the inspection step includes a step of inspecting whether or not the pattern structure protrudes, a step of inspecting whether or not a foreign matter is attached to the mold, and the protrusion of the transfer substrate. A step of inspecting whether or not a foreign substance is attached to the pattern structure located on the structure portion, and the protrusion of the pattern structure is not recognized in the step of inspecting the presence or absence of the pattern structure. In this case, if the pattern structure is determined to proceed to the next step and the pattern structure is protruded in the step of checking whether or not the pattern structure is protruded, a foreign object is detected in the mold. inspecting There the step of examining whether or not attached, whether or not the foreign matter on the pattern structure located on the convex portions of the transfer substrate is adhered And the extent was configured as to implement.

Another aspect of the present invention, wherein when in the step of foreign matter to check whether attached There are observed et Lena adhesion of foreign matter into the mold to mold determines the continue imprint, When foreign matter adheres to the mold, the imprint is decided to be stopped, and the foreign matter adheres to the pattern structure in the step of inspecting whether or not the foreign matter has adhered to the pattern structure. If not recognized, the process proceeds to the next step using the pattern structure, and if foreign matter adheres to the pattern structure, the foreign matter attached to the pattern structure is the pattern. It is determined whether or not there is a problem in the next process using the structure, and when there is no problem , the progress to the next process is determined.

Further, the imprint method of the present invention includes a resin supply step of supplying a resin to be molded to a transfer substrate, a mold having a mesa structure in which a region having a concavo-convex structure forms a projecting structure portion protruding from a surrounding region, and the transfer is brought close to the substrate, wherein the contacting step of forming a the molded resin layer by developing the molded resin, the uneven structure wherein cured to be molded resin layer is transferred between the transfer substrate and the mold a curing step of the transcription resin layer, said pull-off transfer resin layer and said mold to each other, and a release step of a state of a pattern structure was positioned to the transfer substrate which is the transfer resin layer, anda inspection step of examining said mold after said releasing step and said pattern structure, in the inspection step, the pattern structure to the outside of the region corresponding to the convex portions of the mold It examines the existence of the protrusion of, and configured so as to determine the subsequent steps on the basis of the test results.

As another aspect of the present invention, the inspection step includes a step of inspecting whether or not the pattern structure protrudes, a step of inspecting whether or not a foreign matter is attached to the convex structure portion of the mold, A step of inspecting whether or not a foreign substance is attached to a region corresponding to the convex structure portion of the mold in the pattern structure, and in the step of inspecting the presence or absence of protrusion of the pattern structure, When the protrusion is not recognized , the progress to the next process using the pattern structure is determined, and the protrusion of the pattern structure is recognized in the step of inspecting the presence or absence of the pattern structure. a step of checking whether the foreign matter on the convex portions of the mold are attached, the convex structure of the mold in said pattern structure Foreign matter was configured so as to implement a step of examining whether or not attached to the corresponding region.

Another aspect of the present invention, wherein when have the convex structure section observed et Lena adhesion of foreign matters into the convex portions of the mold in the step of foreign matter to check whether attached to the mold determines continue imprint, when said foreign matter adhering to the convex structure of the mold is observed, decided to discontinue the imprint, the convex portions of the mold in the pattern structure In the process of inspecting whether or not foreign matter has adhered to the corresponding region, if the adhesion of foreign matter to the pattern structure is not recognized, determine the progress to the next step using the pattern structure, If the adhesion of foreign matters into the pattern structure is observed, the foreign substance adhering to the pattern structure determines whether a problem in the next step using the pattern structure, if no problem It was such as to determine the progression to the next step configuration.

The imprint apparatus according to the present invention includes a mold having a mesa structure in which a region having a concavo-convex structure protrudes from a surrounding region and having a mesa structure and / or a region where a pattern structure is formed than the surrounding region. a imprint apparatus capable of implementing the imprinting using a transfer substrate having a mesa structure which forms a protruding convex portions, a mold holding portion for holding the mold, for holding said transfer substrate a substrate holding portion, and a resin supply section for supplying the molded resin to the transfer substrate, for said transfer substrate to form the pattern structure, the presence or absence of the outward protruding of the convex portions in which the transfer substrate has or It is configured to include at least an inspection unit that inspects the presence or absence of protrusion to the outside of the region corresponding to the convex structure portion of the mold.
As another aspect of the present invention, the pattern structure formed on the transfer substrate protrudes outward from the convex structure portion of the transfer substrate or to the outside of the region corresponding to the convex structure portion of the mold. If the protrusion of the observed, the inspection unit, the inspection whether the inspection and whether the foreign matter on the mold is attached, foreign matter on the pattern structure formed on the transfer substrate is attached And so on.
Obtaining a further embodiment of the invention, the test unit includes a measuring unit, an acquisition unit for acquiring the measurement information by the measuring unit, a storage unit for storing the mold and the information of the transfer substrate, by the acquisition unit a specifying unit for specifying a state of the mold and the pattern structure on the basis of the above measurement information and the information stored in the storage unit, continue imprint on the basis of the information generated by the identification unit or discontinued, and was configured as having a determination unit for determining the use or disposal of the pattern structure.

  According to the present invention, it is possible to stably produce a highly accurate pattern structure using a mold having a mesa structure and / or a transfer substrate, and it is possible to prevent damage to the mold and the like. Is played.

FIG. 1 is a process diagram for explaining an embodiment of an imprint method of the present invention. FIG. 2 is a process diagram for explaining an embodiment of the imprint method of the present invention. FIG. 3 is a flowchart showing an example of an inspection process in the imprint method of the present invention. FIG. 4 is a diagram for explaining determination when a foreign object is present in the inspection process in the imprint method of the present invention. FIG. 5 is a diagram for explaining determination when a foreign object is present in the inspection process in the imprint method of the present invention. FIG. 6 is a flowchart showing another example of the inspection process in the imprint method of the present invention. FIG. 7 is a process diagram for explaining another embodiment of the imprint method of the present invention. FIG. 8 is a process diagram for explaining another embodiment of the imprint method of the present invention. FIG. 9 is a diagram for explaining another embodiment of the imprint method of the present invention. FIG. 10 is a diagram for explaining another embodiment of the imprint method of the present invention. FIG. 11 is a diagram for explaining another embodiment of the imprint method of the present invention. FIG. 12 is a schematic side view illustrating an embodiment of the imprint apparatus according to the present invention. FIG. 13 is a block diagram for explaining a processing unit in the imprint apparatus of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Note that the drawings are schematic or conceptual, and the dimensions of each member, the ratio of sizes between the members, etc. are not necessarily the same as the actual ones, and represent the same members. However, in some cases, the dimensions and ratios may be different depending on the drawing.

[Imprint method]
(First embodiment)
1 and 2 are process diagrams for explaining an embodiment of the imprint method of the present invention.
In this embodiment, a transfer substrate having a mesa structure in which a region where a pattern structure is formed protrudes from a surrounding region is used. In the illustrated example, the transfer substrate 11 has a convex structure portion 13 positioned on one surface 12a of the base portion 12, and the surface 13a of the convex structure portion 13 is a region where a pattern structure is formed, The mesa structure is in a state protruding from the region 12a (FIG. 1A). Note that there may be only one mesa structure on the transfer substrate, and a plurality of mesa structures may be present side by side at a predetermined interval. Furthermore, the protruding state of the mesa structure may be two or more stages.

The material of the transfer substrate 11 is, for example, glass such as quartz, soda lime glass, borosilicate glass, a resin substrate such as polycarbonate, polypropylene, polyethylene, or a composite material substrate made of any combination of these materials. Good. In addition, metals such as silicon, nickel, titanium, and aluminum, alloys thereof, oxides, nitrides, or any laminated material thereof can be used. However, when light irradiation is performed from the transfer substrate 11 side in the curing step described later, the transfer substrate 11 needs to have such a light transmittance that the curing process can be performed. Further, in the inspection process described later, when the transfer substrate 11 is irradiated with inspection light and measurement is performed using the transmitted light, the transfer substrate 11 has a light transmission property that enables at least inspection with the inspection light. It is necessary to have it, and when measuring using the reflected light, it is necessary to have light reflectivity.
In the present invention, first, in the resin supplying step, droplets of the molding resin 31 are discharged and supplied to a desired region on the convex structure portion 13 of the transfer substrate 11 as described above by an ink jet method (FIG. 1 (A)). The number of droplets of the molding resin 31 supplied to the transfer substrate 11 and the distance between adjacent droplets are the drop amount of each droplet, the total amount of molding resin required, and the mold in the contact process, which is a subsequent process. It can be set as appropriate based on the gap between the transfer substrate 21 and the transfer substrate 11.

  Next, in the contacting step, the transfer substrate 11 and the mold 21 are brought close to each other, and a droplet of the resin to be molded 31 is developed between the transfer substrate 11 and the mold 21 to form the resin layer 32 to be molded ( FIG. 1 (B)). In the illustrated example, the mold 21 to be used has a base material 22 and a concavo-convex structure 24 located in the concavo-convex structure region A set on one surface 22 a of the base material 22. Further, as the material of the base material 22 of the mold 21, when the molding resin used for imprinting is photocurable, a material that can transmit irradiation light for curing them can be used. In addition to glass such as quartz glass, silicate glass, calcium fluoride, magnesium fluoride, and acrylic glass, sapphire and gallium nitride, resin such as polycarbonate, polystyrene, acrylic, and polypropylene, or any laminate of these Materials can be used. Further, when the molding resin to be used is not photocurable, or when it is possible to irradiate light for curing the molding resin from the transfer substrate 11 side, the base material 22 does not have optical transparency. In addition to the above materials, for example, metals such as silicon, nickel, titanium, and aluminum, alloys thereof, oxides, nitrides, or any laminated material thereof can be used. However, in the inspection process to be described later, when the mold 21 is irradiated with inspection light and measurement is performed using the transmitted light, the mold 21 has at least light transmittance that enables inspection with the inspection light. It is necessary to have light reflectivity when measuring using the reflected light.

  In this contact step, the molding resin layer 32 may protrude outside the convex structure portion 13 of the transfer substrate 11. Specifically, the molded resin layer 32 may protrude from a surface different from the surface 13 a of the convex structure portion 13, for example, the side wall of the convex structure portion 13, the side wall of the convex structure portion 13, and the surface 12 a of the base portion 12. . FIG. 1B shows a state in which the molded resin layer 32 formed between the mold 21 and the transfer substrate 11 is protruding, and this protruding portion is the convex structure portion 13 of the transfer substrate 11. Located on the side wall.

Next, in the curing step, the molding resin layer 32 is cured to form a transfer resin layer 34 to which the uneven structure 24 of the mold 21 has been transferred (FIG. 1C). In this curing step, if the molding resin to be used is a photocurable resin, the molding resin layer 32 can be cured by performing light irradiation from the mold 21 side. When the transfer substrate 11 is made of a light-transmitting material, light irradiation may be performed from the transfer substrate 11 side, and light irradiation may be performed from both sides of the transfer substrate 11 and the mold 21. On the other hand, if the molding resin to be used is a thermosetting resin, the molding resin layer 32 can be cured by heat treatment.
Next, in the mold release step, the transfer resin layer 34 and the mold 21 are separated, and the pattern structure 41 that is the transfer resin layer 34 is positioned on the transfer substrate 11 (FIG. 1D). 2 (A) to FIG. 2 (C)).
In the example shown in FIGS. 1 and 2, the pattern structure 41 has a convex portion. However, as will be described later, it is needless to say that the pattern structure 41 may have a concave portion. is there.

Next, the inspection process is started. FIG. 3 is a flowchart showing an example of the inspection process. The inspection process will be described below with reference to FIGS. 1D, 2A to 2C, and FIG.
This inspection process starts when the mold release process ends (step S100) and the pattern structure 41 is positioned on the transfer substrate 11. In the inspection step, first, it is determined whether or not the pattern structure 41 protrudes outside the convex structure portion 13 of the transfer substrate 11 (step S101).
As a result of this determination, when the protrusion of the pattern structure 41 is not recognized (No), the progress of the next process using the pattern structure 41 is determined. Then, it is determined whether or not foreign matter has adhered to the mold 21 (step S102). If adhesion of foreign matter to the mold 21 is not recognized (No), the imprint is continued and the pattern structure 41 is set. The progress of the next process used is determined (step S103). This completes the inspection process (step S112). The next step using the pattern structure 41 is, for example, etching the convex structure portion 13 of the transfer substrate 11 using the pattern structure 41 as an etching mask, and converting the concave / convex structure in which the concave / convex structure 24 of the mold 21 is reversed to the transfer substrate. And imprinting using the transfer substrate 11 having the concavo-convex structure formed by etching as a replica mold. In addition, if adhesion is recognized in the determination as to whether or not foreign matter has adhered to the mold 21 (step S102), the imprint is canceled and the next process using the pattern structure is determined (step). S109), the inspection process is terminated (step S112).

On the other hand, as a result of determining whether or not the pattern structure 41 protrudes outside the convex structure portion 13 of the transfer substrate 11 (step S101), if the pattern structure 41 protrudes (Yes), the mold 21 It is determined whether or not foreign matter is attached (step S104). In the example shown in FIG. 1D and FIG. 2A to FIG. 2C, the pattern structure 41 has a portion 42 that protrudes from the side wall of the convex structure portion 13, so that such a determination is performed. The subsequent steps are determined as follows. In the present invention, the foreign substance means a cured product separated and scattered from the protruding portion of the pattern structure 41 (transfer resin layer 34), a stretched string-like cured product, or a knob-like cured product.
As a result of this determination (step S104), if no foreign matter adheres to the mold 21 (No), whether or not foreign matter is attached to the pattern structure 41 located on the convex structure portion 13 of the transfer substrate 11 is determined. Is determined (step S105). If no foreign matter adheres to the pattern structure 41 positioned on the convex structure portion 13 in this determination (No: see FIG. 1D), the imprint continues and the pattern structure The progress of the next process using is determined (step S103). This completes the inspection process (step S112).

On the other hand, in the above determination (step S105), when adhesion of foreign matter is recognized to the pattern structure 41 located on the convex structure portion 13 (Yes: see FIG. 2A), the pattern structure 41 It is determined whether or not the adhered foreign matter P does not cause a problem in the next process using the pattern structure 41 (step S106). This determination is performed by determining whether or not the position of a defect portion caused by the presence of the foreign matter P in the next process is related to a defect or the like in the final product. Such determination will be described with reference to FIGS. 4 and 5. FIG. First, when the pattern structure 41 has a plurality of protrusions 41 a and the foreign matter P exists on the protrusions 41 a (FIG. 4A), the pattern structure 41 exists between the protrusions 41 a with respect to the pattern structure 41. When the process of removing the remaining film is performed, the removal of the remaining film at the portion where the foreign matter P exists is inhibited (FIG. 4B), so that the next process using the pattern structure 41 ′ after the remaining film removal is performed. The progress of is judged to be stopped. Further, when the pattern structure 41 has a plurality of convex portions 41a and the foreign matter P is present on the remaining film outside the region where the convex portions 41a exist (FIG. 4C), the pattern structure 41 If the remaining film is removed, the removal of the remaining film at the site where the foreign matter P is present is inhibited (FIG. 4D), so the next process using the pattern structure 41 ′ after the remaining film is removed. Progression to is determined to be canceled. Next, when the pattern structure 41 has a plurality of recesses 41b and the foreign matter P is present on the protrusions 41b (FIG. 5A), the pattern structure 41 remains in the recesses 41b. When the film removal process is performed, the removal of the remaining film at the portion where the foreign matter P exists is inhibited (FIG. 5B), so that the process to the next process using the pattern structure 41 ′ after the remaining film removal is performed. Progress is judged to be stopped. On the other hand, when the pattern structure 41 has a plurality of concave portions 41b and the foreign matter P exists outside the region where the convex portions 41b exist (FIG. 5C), the remaining film is removed from the pattern structure 41. When the processing is performed, the remaining film existing in the recess 41b is removed (FIG. 5D), so that the next process using the pattern structure 41 ′ is possible without being affected by the presence of the foreign matter P. The progress to the next process is determined. The same applies to the following embodiments.
As a result of such determination, when it is determined that the foreign matter P does not cause a problem in the next process (No), the continuation of the imprint and the progress of the next process using the pattern structure are determined (step S103), and the inspection is performed. The process ends (step S112). If the presence of the foreign matter P is serious in this determination (step S106), it is determined to continue the imprint, but the progress to the next process using the pattern structure 41 is stopped (step S107). This completes the inspection process (step S112). When the progress to the next process using the pattern structure 41 is stopped, it is possible to remove the formed pattern structure 41 and reuse the transfer substrate 11.

  In the above determination (step S104), when adhesion of the foreign matter P is recognized on the mold 21 (Yes), it is determined whether or not the foreign matter is attached to the pattern structure 41 located on the convex structure portion 13 of the transfer substrate 11. Determination is made (step S108). And in this determination, when the adhesion of the foreign material to the pattern structure 41 located on the convex structure part 13 is not recognized (No: refer to FIG. 2B), the imprint is stopped and the pattern structure is used. The progress of the next process is determined (step S109). This completes the inspection process (step S112). In the example shown in FIG. 2B, a part of the protruding portion 42 of the pattern structure 41 is attached to the mold 21 as the foreign matter P. When the foreign matter P adheres to the mold 21 in this way, as shown in the drawing, even in the case where it exists in a portion away from the concavo-convex structure 24, during the subsequent imprint process, Since the foreign matter P adheres to the concavo-convex structure region where the concavo-convex structure 24 is present, and there is a risk of damaging the mold and the pattern structure, it is determined to stop imprinting using the mold 21. In this case, the mold 21 can be cleaned, and then imprinting can be resumed.

On the other hand, in this determination (step S108), when foreign matter adheres to the pattern structure 41 positioned on the convex structure portion 13 (Yes: see FIG. 2C), the foreign matter attached to the pattern structure 41. It is determined whether P does not cause a problem in the next process using the pattern structure 41 (step S110). As described above with reference to FIGS. 4 and 5, this determination is performed by determining whether or not the position of the defective portion caused by the presence of the foreign matter P in the next process is related to a defect or the like in the final product. . As a result of this determination, when it is determined that the foreign matter P does not cause a problem in the next process (No), the imprint is stopped and the next process using the pattern structure is determined (step S109). The process ends (step S112). If the presence of the foreign matter P is serious in this determination (step S110), the imprint is stopped and the progress to the next process using the pattern structure is stopped (step S111). This completes the inspection process (step S112).
In the present invention, in the flowchart showing the inspection process of FIG. 3, the determination of the presence or absence of foreign matters on the mold (step S104), the determination of the presence or absence of foreign matters on the pattern structure (steps S105 and S108), May be replaced. That is, it may be determined whether or not foreign matter has adhered to the pattern structure in step S104, and whether or not foreign matter has adhered to the mold may be determined in steps S105 and S108.

Moreover, in this invention, you may determine whether the foreign material has adhered to the mold 21 as the first test | inspection of a test process. FIG. 6 is a flowchart showing the inspection process in such a case, and the inspection process will be described below with reference to FIG.
This inspection process is started in a state where the mold release process is completed (step S200) and the pattern structure 41 is located on the transfer substrate 11. In the inspection process, first, it is determined whether or not foreign matter is attached to the mold 21 (step S201).
As a result of this determination (step S201), if no foreign matter adheres to the mold 21 (No), it is determined to continue imprinting. Then, it is determined whether or not the pattern structure 41 protrudes outside the convex structure portion 13 of the transfer substrate 11 (step S202). If the pattern structure 41 does not protrude (No), imprinting is not performed. The continuation and the progress of the next process using the pattern structure 41 are determined (step S203). This completes the inspection process (step S212).

As a result of determining whether or not the pattern structure 41 protrudes (step S202), if the pattern structure 41 is recognized to be protruded (Yes), the pattern structure positioned on the convex structure portion 13 of the transfer substrate 11 is detected. It is determined whether or not foreign matter is attached to 41 (step S204). If no foreign matter adheres to the pattern structure 41 positioned on the convex structure portion 13 in this determination (No: see FIG. 1D), the imprint continues and the pattern structure The progress of the next process using is determined (step S203). This completes the inspection process (step S212).
On the other hand, in the above determination (step S204), when adhesion of foreign matter is recognized on the pattern structure 41 located on the convex structure portion 13 (Yes: see FIG. 2A), the pattern structure 41 It is determined whether the adhered foreign matter P does not cause a problem in the next process using the pattern structure 41 (step S205). As described above with reference to FIGS. 4 and 5, this determination is performed by determining whether or not the position of a defective portion caused by the presence of the foreign matter P in the next process is related to a defect or the like in the final product. As a result of such determination, when it is determined that the foreign matter P does not cause a problem in the next process (No), the continuation of the imprint and the progress of the next process using the pattern structure are determined (step S203), and the inspection is performed. The process ends (step S212). If the presence of the foreign matter P is serious in this determination (step S205), it is determined to continue the imprint, but the progress to the next process using the pattern structure 41 is stopped (step S206). This completes the inspection process (step S212). When the progress to the next process using the pattern structure 41 is stopped, it is possible to remove the formed pattern structure 41 and reuse the transfer substrate 11.

As a result of determining whether or not foreign matter is attached to the mold 21 (step S201), if the foreign matter adheres to the mold 21 (Yes), the pattern to the outside of the convex structure portion 13 of the transfer substrate 11 is determined. Whether or not the structure 41 protrudes is determined (step S207). If the pattern structure 41 does not protrude (No), the imprint is stopped and the next process using the pattern structure 41 proceeds. Determination is made (step S209). This completes the inspection process (step S212). When it is determined to stop imprinting, the mold 21 can be cleaned, and then imprinting can be resumed.
Further, when the protrusion of the pattern structure 41 is recognized as a result of the determination of whether or not the pattern structure 41 protrudes (step S207) (Yes), the pattern structure positioned on the convex structure portion 13 of the transfer substrate 11 It is determined whether or not foreign matter is attached to 41 (step S208). And in this determination, when the adhesion of the foreign material to the pattern structure 41 located on the convex structure part 13 is not recognized (No: refer to FIG. 2B), the imprint is stopped and the pattern structure is used. The progress of the next process is determined (step S209). This completes the inspection process (step S212).

  On the other hand, in this determination (step S208), when foreign matter adheres to the pattern structure 41 located on the convex structure portion 13 (Yes: see FIG. 2C), the foreign matter attached to the pattern structure 41. It is determined whether P does not cause a problem in the next process using the pattern structure 41 (step S210). As described above with reference to FIGS. 4 and 5, this determination is performed by determining whether or not the position of the defective portion caused by the presence of the foreign matter P in the next process is related to a defect or the like in the final product. . As a result of this determination, when it is determined that the foreign matter P does not cause a problem in the next process (No), the imprint is canceled and the next process using the pattern structure is determined (step S209), and the inspection process is performed. The process ends (step S212). If the presence of the foreign matter P is serious in this determination (step S210), the imprint is stopped and the progress to the next process using the pattern structure is stopped (step S211). This completes the inspection process (step S212).

Here, an inspection method for determining whether or not the pattern structure 41 protrudes outside the convex structure portion 13 of the transfer substrate 11 as described above will be described.
In this inspection, design information of the peripheral portion of the convex structure portion 13 of the transfer substrate 11, an inspection simulation result predicted based on this design information, or the convex structure portion 13 of the transfer substrate 11 detected in advance before imprinting. The position information of the peripheral edge is used as reference information. And the presence or absence of a protrusion and a position are detectable by comparing the result of having measured the position of the peripheral part of the pattern structure 41, and said reference | standard information.

Examples of the measurement of the position of the peripheral edge of the pattern structure 41 include the following means (1) to (4).
(1) The inspection object is scanned while irradiating the detection light and the reflected light is detected by the light receiving unit, and the pattern structure 41 is based on whether the reflected light is detected and / or the reflection intensity of the reflected light is reduced. Detect the peripheral edge of
(2) The periphery of the pattern structure 41 is detected based on changes in optical characteristics such as reflectance, transmittance, and refractive index. Optical characteristics such as reflectance, transmittance, and refractive index when the convex structure portion 13 of the transfer substrate 11 is irradiated with detection light are shown in an area where the pattern structure 41 exists and an area where the pattern structure 41 does not exist. By detecting this difference, the peripheral edge of the pattern structure 41 is detected.
(3) The peripheral edge of the pattern structure 41 is detected based on the difference or change in the image information.
(4) The periphery of the pattern structure 41 is detected by contact measurement using an atomic force microscope (AMF) or the like.

The inspection means (1) to (4) can be used singly or in combination of two or more. The detection light can be, for example, convergent light, parallel light, or laser light collected by a reflecting mirror or lens.
Further, when the presence of the protrusion of the pattern structure 41 is recognized, the position information obtained by the inspection means as described above is further processed, for example, the straightness of the side, the parallelism with the opposite side, the side Information on the shape to be inspected may be generated from the change in the angle and the angle of the apex when the convex structure is viewed from the top. Thereby, the shape and dimension of the protrusion part of the pattern structure 41 can be grasped, and feedback to process management, such as correction of the supply position of the droplet of resin to be molded, can be performed. For example, the information that the distance of the side has changed and increased means that the protrusion has occurred and the positions of the points existing at both ends of the side have shifted to the outside of the convex structure. Therefore, when such information is generated, it is possible to perform feedback so as to perform adjustment so that the amount of the resin to be molded toward the apex direction of the convex structure decreases.
In addition, as a method of detecting the peripheral part of the convex structure part 13 of the transfer substrate 11 in advance before imprinting as described above, for example, the above methods (1) to (4) may be mentioned.

Next, a method for inspecting whether or not foreign matter has adhered to the mold 21 and whether or not foreign matter has adhered to the pattern structure 41 will be described.
First, in the inspection of the presence or absence of foreign matter adhering to the mold 21, the design information of the concavo-convex structure 24 located in the concavo-convex structure region A (see FIG. 1B) of the mold 21 and the design information around the concavo-convex structure region A Alternatively, the positional information of the concavo-convex structure of the mold 21 detected in advance before imprinting is used as reference information. Then, by measuring the surface 22a of the mold 21 in which the concavo-convex structure region A is set, and comparing this result with the above-described reference information, it is possible to detect the presence / absence of foreign matter and the presence position.
Examples of the measurement of the surface 22a of the mold 21 include the following means (A) to (D).
(A) The inspection object is scanned while irradiating the detection light and the reflected light is detected by the light receiving unit, and the presence of foreign matter is detected based on the presence or absence of the detection of the reflected light and / or the decrease in the reflected light reflection intensity To detect.
(B) The presence of a foreign object is detected based on changes in optical characteristics such as reflectance, transmittance, and refractive index. Optical characteristics such as reflectance, transmittance, and refractive index when the mold 21 is irradiated with detection light differ depending on the presence or absence of foreign matter, and the presence of foreign matter is detected by detecting this difference.
(C) The presence of a foreign object is detected based on a difference or change in image information.
(D) The presence of a foreign object is detected by contact measurement using an atomic force microscope (AMF) or the like.

The inspection means (A) to (D) can be used alone or in combination of two or more. The detection light can be, for example, convergent light, parallel light, or laser light collected by a reflecting mirror or lens.
In addition, in order to obtain the positional information of the concavo-convex structure of the mold 21 as described above, as a method of detecting the concavo-convex structure of the mold 21 before imprinting, for example, the above-described methods (A) to (D) Is mentioned.

Further, in the inspection of the presence or absence of foreign matter adhesion to the pattern structure 41, the design information of the concavo-convex structure 24 of the mold 21 for forming the pattern structure 41 is used as reference information. Then, the pattern structure 41 is measured by any one of the above methods (A) to (D) or a combination of two or more, and the result is compared with the reference information to determine the presence or absence of foreign matter, The presence position can be detected. Further, when the presence of foreign matter is recognized in the pattern structure 41, the position information obtained by the inspection means as described above is further processed, for example, the straightness of the side, the parallelism with the opposite side, the side Information on the shape to be inspected may be generated from the change in the angle and the angle of the apex when the convex structure is viewed from the top. As a result, the shape and size of the foreign matter existing in the pattern structure 41 can be grasped, and the determination of whether the presence of the foreign matter is not a problem in the next process using the pattern structure 41 has a higher accuracy. Is possible.
The mold inspection and the pattern structure inspection as described above may be performed separately. For example, the mold inspection may be performed inside the imprint apparatus, and the pattern structure inspection may be performed outside the imprint apparatus.

(Second Embodiment)
7 and 8 are process diagrams for explaining another embodiment of the imprint method of the present invention.
In the present embodiment, as shown in FIG. 7A, a flat plate-shaped transfer substrate 61 having no mesa structure is used. The material of the transfer substrate 61 can be the same as that of the transfer substrate 11 described above. In the present embodiment, a mold having a mesa structure in which a region having a concavo-convex structure protrudes from a surrounding region is used. In the illustrated example, the mold 71 has a convex structure portion 73 located on one surface 72a of the base 72, and the surface 73a of the convex structure portion 73 is a region having a concavo-convex structure 74, and a surrounding region 72a. It has a mesa structure that protrudes further. The material of such a mold 71 can be the same as that of the mold 21 described above.

In the present invention, first, in the resin supply step, droplets of the molding resin 81 are discharged and supplied to a desired region on the transfer substrate 61 by the ink jet method (FIG. 7A). The number of droplets of the molding resin 81 to be supplied to the transfer substrate 61, the distance between adjacent droplets, the dropping amount of each droplet, the total amount of molding resin required, and the mold in the contact process which is a post process It can be set as appropriate based on the gap between 71 and the transfer substrate 61.
Next, in the contacting step, the transfer substrate 61 and the mold 71 are brought close to each other, and a droplet of the molding resin 81 is developed between the transfer substrate 61 and the mold 71 to form the molding resin layer 82 (FIG. 7 (B)). FIG. 7B shows a state in which the molded resin layer 82 formed between the transfer substrate 61 and the mold 71 is protruding. This protruding portion wets and spreads on the surface 61 a of the transfer substrate 61, and a part thereof is located on the side wall of the convex structure 73 of the mold 71.
Next, in a curing step, the molding resin layer 82 is cured to form a transfer resin layer 84 to which the uneven structure 74 of the mold 71 is transferred (FIG. 7C). In this curing step, if the molding resin to be used is a photocurable resin, the molding resin layer 82 can be cured by performing light irradiation from the mold 71 side. When the transfer substrate 61 is made of a light transmissive material, light irradiation may be performed from the transfer substrate 61 side, and light irradiation may be performed from both sides of the transfer substrate 61 and the mold 71. On the other hand, if the molding resin to be used is a thermosetting resin, the molding resin layer 82 can be cured by heat treatment.

Next, in the mold release step, the transfer resin layer 84 and the mold 71 are separated to place the pattern structure 91 that is the transfer resin layer 84 on the transfer substrate 61 (FIG. 7D, FIG. 8 (A) to FIG. 8 (C)).
Next, the inspection process is started. The inspection process will be described below with reference to FIGS. 7D, 8A to 8C, and FIG.
This inspection process is started in a state in which the mold release process is completed (step S100) and the pattern structure 91 is positioned on the transfer substrate 61. In the inspection process, first, the pattern structure 91 is formed outside the region B of the transfer substrate 61 corresponding to the convex structure portion 73 of the mold 71 (see FIGS. 7D and 8A to 8C). The presence or absence of protrusion is determined (step S101).
As a result of this determination, when the protrusion of the pattern structure 91 is not recognized (No), the progress of the next process using the pattern structure 91 is determined. Then, it is determined whether or not foreign matter has adhered to the mold 71 (step S102). If adhesion of foreign matter to the mold 71 is not recognized (No), the imprint is continued and the pattern structure 91 is displayed. The progress of the next process used is determined (step S103). This completes the inspection process (step S112).

On the other hand, as a result of the determination (step S101), when the protrusion of the pattern structure 91 is recognized (Yes), it is determined whether or not foreign matter is attached to the convex structure portion 73 of the mold 71 (step S104). In the example shown in FIGS. 7D and 8A to 8C, the pattern structure 91 has a portion 92 that protrudes outside the region B corresponding to the convex structure portion 73 of the mold 71. Therefore, such determination is performed, and the subsequent steps are determined as described below.
As a result of this determination (step S104), if no foreign matter adheres to the convex structure 73 of the mold 71 (No), the foreign matter adheres to the pattern structure 91 located on the region B of the transfer substrate 61. It is determined whether or not (step S105). If no foreign matter adheres to the pattern structure 91 in this determination (No: see FIG. 7D), the imprint continues and the next process using the pattern structure proceeds. Determination is made (step S103) and the inspection process is terminated (step S112).

  On the other hand, in the above determination (step S105), when foreign matter adheres to the pattern structure 91 located on the region B of the transfer substrate 61 (Yes: see FIG. 8A), the pattern structure It is determined whether or not the foreign matter P adhering to 91 does not cause a problem in the next process using the pattern structure 91 (step S106). This determination is performed by determining whether or not the position of a defect portion caused by the presence of the foreign matter P in the next process is related to a defect or the like in the final product. As a result of such determination, when it is determined that the foreign matter P does not cause a problem in the next process (No), the continuation of the imprint and the progress of the next process using the pattern structure are determined (step S103), and inspection is performed. The process ends (step S112). If the presence of the foreign matter P is serious in this determination (step S106), the process proceeds to the next process using the pattern structure, and on the other hand, the continuation of imprinting is determined (step S107). The process ends (step S112). When the progress to the next process using the pattern structure 91 is stopped, it is possible to remove the formed pattern structure 91 and reuse the transfer substrate 61.

  In the above determination (step S104), when the foreign matter P adheres to the convex structure 73 of the mold 71 (Yes), whether or not the foreign matter adheres to the pattern structure 91 located in the region B of the transfer substrate 61. Is determined (step S108). If no foreign matter adheres to the pattern structure 91 located on the region B of the transfer substrate 61 in this determination (No: refer to FIG. 8B), the imprint is canceled and the pattern structure. Is determined (step S109), and the inspection process is terminated (step S112). In the example shown in FIG. 8B, a part of the protruding portion 92 of the pattern structure 91 is attached as the foreign matter P to the convex structure portion 73 of the mold 71. When the foreign matter P adheres to the convex structure portion 73 of the mold 71 as described above, even if the foreign matter P exists at a site away from the concave-convex structure 74 as shown in the figure, the concave-convex structure is formed during the subsequent imprint process. Since foreign matter P adheres to the concavo-convex structure region where 74 is present and may damage the mold or the pattern structure, it is determined to stop imprinting using the mold 71. In this case, the mold 71 can be cleaned, and then imprinting can be resumed.

  On the other hand, in this determination (step S108), when foreign matter adheres to the pattern structure 91 located on the region B of the transfer substrate 61 (Yes: see FIG. 8C), it adheres to the pattern structure 91. It is determined whether or not the foreign matter P has been a problem in the next process using the pattern structure 91 (step S110). As a result of this determination, when it is determined that the foreign matter P does not cause a problem in the next process (No), the imprint is stopped and the next process using the pattern structure is determined (step S109). The process ends (step S112). If the presence of the foreign matter P is serious in this determination (step S110), the imprint is stopped and the progress to the next process using the pattern structure is stopped (step S111), and the inspection process is ended. (Step S112).

It should be noted that, as described above, a method for inspecting whether or not the pattern structure 91 protrudes outside the region B of the transfer substrate 61, and whether or not foreign matter adheres to the mold 71 and foreign matter adheres to the pattern structure 91. The method for inspecting presence / absence can be the same as in the first embodiment.
Even in the case of using a flat plate-shaped transfer substrate having no mesa structure and a mold having a mesa structure as in the present embodiment, as in the first embodiment, FIG. In the flowchart showing the inspection process, determination of whether or not foreign matter has adhered to the mold (step S104) and determination of whether or not foreign matter has adhered to the pattern structure (step S105 and step S108) may be interchanged.
Furthermore, as a first inspection in the inspection process, it may be determined whether or not foreign matter is attached to the mold 71, and the inspection process may be performed according to the flowchart shown in FIG.

(Third embodiment)
FIGS. 9-11 is a figure for demonstrating other embodiment of the imprint method of this invention.
In this embodiment, a transfer substrate having a mesa structure and a mold having a mesa structure are used.
FIG. 9 is a diagram illustrating an example of a state in which the contact process is completed in the present embodiment, and is a diagram corresponding to the above-described FIGS. 1C and 7C. As shown in the figure, the transfer substrate 11 'has a convex structure portion 13' positioned on one surface 12'a of the base portion 12 '. The surface 13'a of the convex structure portion 13' is a pattern structure. Is a mesa structure that protrudes from the surrounding region 12'a. The mold 71 'has a convex structure portion 73' located on one surface 72'a of the base portion 72 '. The surface 73'a of the convex structure portion 73' is a region having a concave and convex structure 74 '. And has a mesa structure that protrudes from the surrounding region 72'a. In this example, the surface 13'a of the convex structure portion 13 'of the transfer substrate 11' is smaller than the surface 73'a of the convex structure portion 73 'of the mold 71'. In this case, when the molded resin layer developed between the mold 71 ′ and the transfer substrate 11 ′ is protruded, the protruding portion wets and spreads on the side wall of the convex structure portion 13 ′ of the transfer substrate 11 ′. The protruding portion of the transfer resin layer 34 ′ cured and formed in is located on the side wall portion of the convex structure portion 13 ′ of the transfer substrate 11 ′. For this reason, the protruding portion of the concavo-convex structure is the same as in the first embodiment described above (the example shown in FIGS. 1 and 2 in which the transfer substrate has a mesa structure and the mold does not have a mesa structure). Can be considered. Therefore, the inspection process after the mold release process includes the above-described FIG. 1D, FIG. 2A to FIG. 2C, FIG. 4A to FIG. 4D, and FIG. 5 (D) and the inspection process described with reference to FIG. 3 or FIG. 6 can be used, and description thereof is omitted here.

  Moreover, FIG. 10 is a figure which shows the other example in the state which the contact process was complete | finished in this embodiment. In this example, the surface 13'a of the convex structure portion 13 'of the transfer substrate 11' is equivalent to the surface 73'a of the convex structure portion 73 'of the mold 71'. Also in this case, when the molding resin layer developed between the mold 71 'and the transfer substrate 11' is protruded, the protruding portion wets and spreads on the side wall of the convex structure portion 13 'of the transfer substrate 11'. The protruding portion of the transfer resin layer 34 ′ formed by curing in the process is located on the side wall portion of the convex structure portion 13 ′ of the transfer substrate 11 ′. For this reason, it can be considered that it is the same as that of the above-mentioned 1st Embodiment (The transfer substrate has a mesa structure, and a mold does not have a mesa structure. The example shown by FIG. 1 and FIG. 2). Therefore, the inspection process after the mold release process includes the above-described FIG. 1D, FIG. 2A to FIG. 2C, FIG. 4A to FIG. 4D, and FIG. 5 (D) and the inspection process described with reference to FIG. 3 or FIG. 6 can be used, and description thereof is omitted here.

On the other hand, FIG. 11 is a figure which shows the other example in the state which the contact process was complete | finished in this embodiment. In this example, the surface 13′a of the convex structure portion 13 ′ of the transfer substrate 11 ′ is larger than the surface 73′a of the convex structure portion 73 ′ of the mold 71 ′. In this case, when the molded resin layer developed between the mold 71 ′ and the transfer substrate 11 ′ is protruded, the protruding portion is on the surface 13′a of the convex structure portion 13 ′ of the transfer substrate 11 ′. The protruding portion of the transfer resin layer 34 ′ which is spread and wetted on the side wall of the convex structure portion 73 ′ of the mold 71 ′ and is cured and formed in the curing process is on the surface 13 ′ a of the convex structure portion 13 ′ of the transfer substrate 11 ′. To position. For this reason, it can be considered that it is the same as that of the above-mentioned 2nd Embodiment (The transfer substrate does not have a mesa structure and the mold has a mesa structure shown in FIG. 7 and FIG. 8). Therefore, the inspection process after the mold release process can be the same as the inspection process described with reference to FIG. 7 (D), FIG. 8 (A) to FIG. 8 (C), and FIG. The description here is omitted.
The imprint method of the present invention as described above can stably produce a high-precision pattern structure using a mold having a mesa structure and / or a transfer substrate, and prevents damage to the mold. be able to.
Note that the above-described embodiments of the imprint method are examples, and the imprint method of the present invention is not limited to these embodiments. For example, in the present invention, a semiconductor device can be manufactured by imprint lithography using a wafer as a transfer substrate.

[Imprint device]
FIG. 12 is a schematic side view illustrating an embodiment of an imprint apparatus according to the present invention.
The imprint apparatus according to the present invention includes a mold having a mesa structure in which a region having a concavo-convex structure protrudes from a surrounding region and having a mesa structure and / or a region where a pattern structure is formed than the surrounding region. This is an imprint apparatus capable of performing imprinting using a transfer substrate having a mesa structure that forms a protruding convex structure portion. FIG. 12 shows an example in which the transfer substrate 11 having the mesa structure described in the imprint method of the present invention and the mold 21 having no mesa structure are used.
In FIG. 12, the imprint apparatus 101 according to the present invention supplies a mold holding unit 102 for holding the mold 21, a substrate holding unit 104 for holding the transfer substrate 11, and a molding resin on the transfer substrate 11. A resin supply unit 106 and an inspection unit 108. FIG. 12 shows a state in which the mold release step in the above-described imprint method of the present invention is completed and the inspection step is performed, but the pattern structure formed on the transfer substrate 11 is omitted. Yes.

(Mold holding part 102)
The mold holding unit 102 constituting the imprint apparatus 101 holds the mold 21. The holding mechanism may be, for example, a holding mechanism by suction, a holding mechanism by mechanical clamping, a holding mechanism by static electricity, or the like. There is no particular limitation. The mold holding unit 102 may be moved up and down in the direction indicated by the arrow Z by the lifting mechanism 103. A light source and an optical system (not shown) for resin curing when a photocurable resin is used as the resin to be molded may be disposed above the mold holding unit 102.
(Substrate holder 104)
The substrate holding unit 104 constituting the imprint apparatus 101 holds the transfer substrate 11. The holding mechanism of the transfer substrate 11 is, for example, a holding mechanism by suction, a holding mechanism by mechanical clamping, a holding mechanism by static electricity, or the like. There may be, and there is no restriction in particular. The substrate holding unit 104 is movable on the XY stage 105 in a horizontal plane by a driving mechanism unit (not shown). Therefore, in the illustrated example, the substrate holding unit 104 exists at a position where an inspection by the measurement unit 109 described later is performed, but the substrate holding unit 104 moves on the XY stage 105 in a horizontal plane, and the imprint position below the mold holding unit 102 and the resin It can be moved to a supply position below the supply unit 106.

(Resin supply unit 106)
The resin supply unit 106 constituting the imprint apparatus 101 supplies droplets of resin to be molded onto the transfer substrate 11 held by the substrate holding unit 104, and an inkjet apparatus (in the illustrated example, only the inkjet head 107 is used). As shown). The ink jet apparatus provided in the droplet supply unit 106 is a desired operation of the ink jet head 107 for supplying droplets of the molding resin onto the transfer substrate 11 held by the substrate holding unit 104, for example, a horizontal plane of the XY stage 105. A drive unit that enables a reciprocating operation in a plane parallel to the inkjet head 107, an ink supply unit to the inkjet head 107, a control unit that controls the inkjet head 107, the drive unit, and the ink supply unit, and the like.

(Inspection unit 108)
The inspection unit 108 constituting the imprint apparatus 1 includes a measurement unit 109 for inspecting a pattern structure formed on the transfer substrate 11 and a measurement unit 110 for inspecting the mold 21. In the present embodiment, the inspection unit 108 includes a processing unit 111 as shown in FIG. In FIG. 13, the processing unit 111 included in the inspection unit 108 includes a measurement unit 109, an acquisition unit 111 </ b> A that acquires measurement information from the measurement unit 110, a storage unit 111 </ b> B that stores information on the transfer substrate 11 and the mold 21, and an acquisition unit. Based on the information from 111A and the information from the storage unit 111B, the specifying unit 111C that specifies the state of the mold and the pattern structure, and the measuring unit 109 and the measuring unit 110 based on the information generated by the specifying unit 111C A determination unit 111D that determines whether to perform additional measurement, continuation or cancellation of imprinting, use or discard of a pattern structure, and an output unit 111E that outputs a determination result of the determination unit 111D using the external output device 112 ,have. Further, the specifying unit 111C further processes the information from the acquisition unit 111A, for example, the straightness of the side, the parallelism with the opposite side, the distance of the side, and the vertex when the convex structure part is viewed from the upper surface. Information on the shape of the inspection object may be generated from the change in angle. As a result, the shape and dimensions of the protruding portion of the pattern structure can be grasped, and the determination unit 111D can determine whether or not it is necessary to correct the supply position of the droplet of the molding resin in the resin supply unit 106. be able to.

Of the measurement units 109 and 110 included in the inspection unit 108, the measurement unit 109 will be described first. The measurement unit 109 that inspects the pattern structure formed on the transfer substrate 11 determines whether or not the pattern structure has an outside protrusion (see FIG. 1D) of the convex structure 13 included in the transfer substrate 11. inspect. In addition, when the mold to be used has a mesa structure, such as the above-described mold 71, the measurement unit 109 has an area corresponding to the convex structure portion of the mold for the pattern structure formed on the transfer substrate 11. Inspects for the presence or absence of protrusion to the outside (see FIG. 7D, etc.). Furthermore, the measurement unit 109 performs an inspection for the presence or absence of foreign matter adhesion (see FIG. 2A and the like) for the pattern structure.
In the illustrated example, the measurement unit 109 includes an irradiation unit 109a that irradiates inspection light, a light receiving unit 109b that receives inspection light reflected by the inspection target, and a control unit (not shown) that controls these. ing. In the inspection unit 108 including such a measurement unit 109, the detection light irradiated to the inspection object from the irradiation unit 109a of the measurement unit 109 is detected by the light receiving unit 109b, and whether or not the reflected light is detected and / or the reflected light is detected. Measure the drop in reflection intensity. This measurement information is sent to the specifying unit 111C via the acquisition unit 111A of the processing unit 111. The identification unit 111C detects the peripheral portion of the pattern structure from the information from the acquisition unit 111A and the information on the transfer substrate 11 stored in the storage unit 111B. Based on the information generated by the specifying unit 111C, if the determination unit 111D determines that there is no protrusion in the pattern structure, the determination unit 111D determines whether to continue imprinting, and outputs the determination result from the output unit 111E. It can be output using the device 112. On the other hand, when the determination unit 111D determines that there is a protrusion in the pattern structure based on the information generated by the specifying unit 111C, and it is necessary to inspect for the presence or absence of foreign matter attached to the pattern structure. In this case, measurement instruction information is sent to the measurement unit 109.

In the inspection of the presence or absence of foreign matter attached to the pattern structure, the measurement information of the measurement unit 109 is sent to the specifying unit 111C via the acquisition unit 111A of the processing unit 111. The identification unit 111C detects the presence or absence of foreign matter adhesion in the pattern structure from the information from the acquisition unit 111A and the design information of the uneven structure of the mold 21 stored in the storage unit 111B. If the determination unit 111D determines that further measurement by the measurement unit 109 is unnecessary based on the information generated by the specification unit 111C, the determination unit 111C generates the measurement information from the measurement unit 110 described later. In consideration of the information, the determination unit 111D can determine whether to continue or stop imprinting, use or discard of the pattern structure, and output the determination result from the output unit 111E using the output device 112. it can.
Further, the inspection unit 108 including the measurement unit 109 as described above irradiates the inspection target with detection light from the irradiation unit 109a of the measurement unit 109, and measures changes in optical characteristics such as reflectance and refractive index of the inspection target. The above-described processing unit 111 can detect the boundary where the optical characteristics change as the peripheral portion of the pattern structure.

In addition, the measurement unit 109 for inspecting the pattern structure formed on the transfer substrate 11 replaces the irradiation unit 109a and the light receiving unit 109b with an imaging unit that captures the surface state of the transfer substrate 11 as image information; It may have a control part which controls this. In this case, the peripheral portion of the pattern structure can be detected by the above-described processing unit 111 based on the difference or change in the image information.
Furthermore, the measurement unit 109 for inspecting the pattern structure formed on the transfer substrate 11 is a contact measurement unit such as an atomic force microscope (AMF) instead of the irradiation unit 109a and the light reception unit 109b, It may have a control part which controls. In this case, the peripheral portion of the pattern structure can be detected by the above-described processing unit 111 based on the step measurement information.

Next, the measurement unit 110 included in the inspection unit 108 will be described. The measuring unit 110 that inspects the mold 21 inspects the presence or absence of foreign matter (see FIG. 2B and the like) attached to the mold 21. In the illustrated example, the measuring unit 110 includes an irradiation unit 110a that irradiates inspection light, a light receiving unit 110b that receives inspection light transmitted through the inspection target, and a control unit (not shown) that controls these. doing.
In the inspection unit 108 including such a measurement unit 110, the detection light irradiated to the mold 21 from the irradiation unit 110a of the measurement unit 110 is detected by the light receiving unit 110b, and the presence / absence of transmission light detection and / or transmission light is detected. Measure the decrease in strength. This measurement information is sent to the specifying unit 111C via the acquisition unit 111A of the processing unit 111. The identification unit 111C detects the presence or absence of foreign matter adhesion on the mold 21 based on information from the acquisition unit 111A and information on the mold 21 stored in the storage unit 111B. Based on the information generated by the specifying unit 111C, the determination unit 111D can determine whether to continue or stop imprinting, and can output the determination result from the output unit 111E using the output device 112.

In addition, the inspection unit 108 including the measurement unit 110 as described above irradiates the inspection target with detection light from the irradiation unit 110a of the measurement unit 110, and measures changes in optical characteristics such as transmittance and refractive index of the inspection target. By the above-described processing unit 111, a part where the optical characteristics change can be detected as a part where a foreign substance exists.
In addition, the measurement unit 110 for inspecting the mold 21 replaces the irradiation unit 110a and the light receiving unit 110b with an imaging unit that captures the surface state of the uneven structure region of the mold 21 as image information, and a control for controlling the imaging unit. It may have a part. In this case, the presence or absence of foreign matter adhesion on the mold 21 can be detected by the above-described processing unit 111 based on the difference or change in the image information.
Furthermore, the measurement unit 110 for inspecting the mold 21 includes a contact measurement unit such as an atomic force microscope (AMF) and a control unit that controls the contact measurement unit instead of the irradiation unit 110a and the light receiving unit 110b. It may be a thing. In this case, the presence or absence of foreign matter adhesion in the mold 21 can be detected by the above-described processing unit 111 based on the measurement information of the step.
In such an inspection of the mold 21 by the measuring unit 110, the protrusion of the pattern structure to the outside of the convex structure 13 of the transfer substrate 11 is usually detected by the inspection of the pattern structure by the measuring unit 109 described above. If you do. However, it can be performed at a desired time separately from the result of the inspection of the pattern structure by the measuring unit 109.

Such an imprint apparatus 101 uses a flat transfer substrate that does not have a mesa structure like the transfer substrate 61 described above, and may use a mold that has a mesa structure such as the mold 71 described above. The inspection unit 108 performs the same operation as described above. The same applies when the transfer substrate and the mold to be used both have a mesa structure.
The imprint apparatus of the present invention as described above can stably produce a high-precision pattern structure by using an imprint method using a mold having a mesa structure and / or a transfer substrate, and breakage of the mold. Etc. can be prevented.

The above-described imprint apparatus 101 is an example, and the present invention is not limited to these. For example, in the above-described imprint apparatus 101, the irradiation unit 109a and the light receiving unit 109b constituting the measurement unit 109 are disposed at positions where the reflection of the inspection light on the inspection target is used for measurement. However, when the structure of the substrate holding unit 104 is such that measurement using the transmitted light of the transfer substrate 11 is possible, the irradiation unit 109a and the light receiving unit 109b are positions where the inspection light transmission in the inspection target is used. It may be arranged. The irradiation unit 110a and the light receiving unit 110b constituting the measurement unit 110 are disposed at positions where the transmission of the inspection light through the mold 21 is used for measurement, but the reflection of the inspection light at the mold 21 is used for measurement. You may arrange | position in the position to do.
Further, the imprint apparatus of the present invention may be configured so that the pattern structure is inspected by the measurement unit 109 at an imprint position below the mold holding unit 102. In this case, after the separation between the mold and the pattern structure is completed, the mold holding unit 102 is raised upward in the Z direction by the lifting mechanism 103 to secure a space for performing the inspection of the pattern structure by the measurement unit 109. be able to. In this case, the measurement unit 109 may also serve as the measurement unit 110.

  The present invention can be applied to the manufacture of various pattern structures using an imprint method and the fine processing of workpieces such as substrates.

DESCRIPTION OF SYMBOLS 11, 61 ... Transfer substrate 13 ... Convex structure part 21, 71 ... Mold 73 ... Convex structure part 11 '... Transfer substrate 13' ... Convex structure part 71 '... Mold 73' ... Convex structure part 101 ... Imprint apparatus 102 ... Mold Holding unit 104 ... Substrate holding unit 106 ... Resin supply unit 108 ... Inspection unit 109, 110 ... Measurement unit 111 ... Processing unit

Claims (9)

A resin supplying step of supplying a resin to be molded onto the convex structure portion of the transfer substrate having a mesa structure in which the region where the pattern structure is formed forms a convex structure portion protruding from the surrounding region;
In close proximity with the mold having a concavo-convex structure and the transfer substrate, the contacting step of forming a the molded resin layer said to expand the molded resin between the transfer substrate and the mold,
A curing step of curing the molding resin layer and transferring the concavo-convex structure to the transfer resin layer;
It pulled apart and the mold and the transfer resin layer to each other, and the releasing step of a state of a pattern structure was positioned to the transfer substrate which is the transfer resin layer,
Anda inspection step of examining said mold after said releasing step and said pattern structure,
In the inspection process, by examining the existence of protrusion of the pattern structure to the outside of the convex portions of the transfer substrate, the imprint, characterized by determining the subsequent steps on the basis of the test results Method. The inspection step includes a step of inspecting whether or not the pattern structure protrudes, a step of inspecting whether or not a foreign substance is attached to the mold, and the pattern located on the convex structure portion of the transfer substrate. And inspecting whether or not foreign matter is attached to the structure,
In the step of inspecting whether or not the pattern structure protrudes, in the case where the protrusion of the pattern structure is not recognized, determine the progress to the next step using the pattern structure,
In the step of inspecting the presence or absence of protrusion of the pattern structure, when the protrusion of the pattern structure is recognized, the step of checking whether or not foreign matter is attached to the mold; and the convex structure of the transfer substrate The imprinting method according to claim 1, further comprising a step of inspecting whether or not a foreign matter is attached to the pattern structure located on a part. Wherein when adhesion of foreign matter into the mold in the step of foreign matter to check whether attached admits et al have Lena the mold determines the continue imprint, adhesion of foreign matter into the mold If so, decide to cancel the imprint,
If no foreign matter adheres to the pattern structure in the step of inspecting whether or not foreign matter is attached to the pattern structure, the process proceeds to the next step using the pattern structure. , if the adhesion of foreign matters into the pattern structure is observed, the foreign substance adhering to the pattern structure determines whether a problem in the next step using the pattern structure, if no problem The imprint method according to claim 2, further comprising determining a progress to a next process. A resin supply step of supplying the molding resin to the transfer substrate;
And regions with an uneven structure is brought into proximity with the mold and the transfer substrate having a mesa structure which forms a convex structure protruding than the surrounding area, to expand the object to be molded resin between the transfer substrate and the mold A contact step for forming a molding resin layer,
A curing step of curing the molding resin layer and transferring the concavo-convex structure to the transfer resin layer;
It pulled apart and the mold and the transfer resin layer to each other, and the releasing step of a state of a pattern structure was positioned to the transfer substrate which is the transfer resin layer,
Anda inspection step of examining said mold after said releasing step and said pattern structure,
In the inspection step, and characterized in that said mold said convex portions examines the existence of the protrusion of the pattern structure to the outside of the region corresponding to, to determine the subsequent steps on the basis of the test results How to imprint. The inspection step includes a step of inspecting whether or not the pattern structure protrudes, a step of inspecting whether or not a foreign substance is attached to the convex structure portion of the mold, and the mold of the mold in the pattern structure. Including the step of inspecting whether or not foreign matter is attached to the region corresponding to the convex structure portion,
In the step of inspecting whether or not the pattern structure protrudes, in the case where the protrusion of the pattern structure is not recognized, determine the progress to the next step using the pattern structure,
In the step of inspecting whether or not the pattern structure protrudes, in the case where the protrusion of the pattern structure is recognized, the step of checking whether or not foreign matter is attached to the convex structure portion of the mold; and 5. The imprint method according to claim 4, wherein a step of inspecting whether a foreign matter is attached to a region corresponding to the convex structure portion of the mold in the pattern structure is performed . If the adhesion of foreign matters into the convex portions of the mold in the step of foreign matter to check whether attached admits et al have Lena on the convex portions of the mold, determining continue imprint And, when adhesion of foreign matter to the convex structure part of the mold is recognized, decide to stop imprinting,
In the step of inspecting whether or not foreign matter has adhered to a region corresponding to the convex structure portion of the mold in the pattern structure, the adhesion of the foreign matter to the pattern structure is not recognized. When the progress to the next process using the body is determined and the adhesion of foreign matter to the pattern structure is observed, the foreign matter attached to the pattern structure is a problem in the next process using the pattern structure. 6. The imprint method according to claim 5, wherein whether or not to be determined is determined, and if the problem does not occur, the progress to the next process is determined. A mold having a mesa structure in which a region having a concavo-convex structure forms a convex structure portion protruding from the surrounding region and / or a mesa in which a region in which the pattern structure is formed forms a convex structure portion protruding from the surrounding region In an imprint apparatus capable of performing imprint using a transfer substrate having a structure,
A mold holding portion for holding the mold, the substrate holding portion for holding a transfer substrate, a resin supply section for supplying the molded resin to the transfer substrate, the transfer substrate to form a pattern structure for, further comprising an inspection unit for inspecting the presence or absence of protrusion of the outer area corresponding to the convex portions of existence or the mold protruding to the outside of the convex portions in which the transfer substrate has has, at least An imprint apparatus characterized by the above. About the pattern structure formed on the transfer substrate, when the protrusion to the outside of the convex structure portion of the transfer substrate or the protrusion of the region corresponding to the convex structure portion of the mold is recognized, the measurement part includes a feature to further perform testing and whether the foreign matter on the mold is attached, whether or not the inspection and foreign matter on the pattern structure formed on the transfer substrate is adhered The imprint apparatus according to claim 7. The inspection unit, the measuring unit and, said acquisition unit for acquiring the measurement information by the measuring unit, a storage unit for storing the mold and the information of the transfer substrate, obtained by the obtaining unit and the measurement information and the storage a specifying unit for specifying a state of the mold and the pattern structure based on the information stored in the section, continue or stop the imprint on the basis of the information generated by the specifying unit, and the pattern structure The imprint apparatus according to claim 7 , further comprising: a determination unit that determines whether to use or discard the printer.

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