JP6249468B2 - Rotor and car - Google Patents

Description

  The present invention relates to a rotor and an automobile.

  Various techniques for improving the strength and the like of motors mounted on automobiles and the like have been studied. The technique described in Patent Document 1 relates to a resin molding material for motor sealing used for motor sealing. That is, the molding material described in Patent Document 1 is considered to be used for a housing that seals a motor.

Patent Documents 2 to 6 describe techniques related to a rotor constituting a motor. The rotor includes a rotor core having a hole and a permanent magnet inserted into the hole.
For example, the technique described in Patent Document 2 is to fill a slit into a slit provided in communication with an accommodation hole for accommodating a permanent magnet. The slits are described as being formed at both end portions in the circumferential direction of the accommodation hole for accommodating the permanent magnet in order to increase the amount of magnetic flux transmitted to the stator.

Patent Documents 3 to 5 describe techniques for bonding a magnet to a rotor core.
The technique described in Patent Document 3 is to bond the permanent magnet and the rotor core with an adhesive directly coated on the permanent magnet. In the technique described in Patent Document 4, a permanent magnet is inserted into a slot of a rotor core containing an adhesive, and then the adhesive is thermally cured in a state where the top and bottom are reversed. The technique described in Patent Document 5 is to engage a hardened adhesive with a concave portion or a convex portion formed on the inner wall of a slot into which a magnet and an adhesive are inserted or on the surface of the magnet.

Furthermore, Patent Document 6 describes a technique for fixing a magnet to a rotor core by a resin portion injected into a hole for inserting the magnet. In the technique described in Patent Document 6, the filling portion formed between the magnet embedded in the hole portion and the hole portion is changed from the portion facing the central portion in the width direction of the magnet at the opening of the hole portion to the hole portion. It is formed by injection.
In addition, as a technique regarding resin, there exists a thing of patent document 7, for example. The technique described in Patent Document 7 relates to a granular epoxy resin composition for encapsulating a semiconductor, and controls the particle size distribution thereof.

JP 2009-13213 A Japanese Patent Laid-Open No. 2002-359942 JP 2003-199303 A JP 2005-304247 A JP-A-11-98735 JP 2007-236020 A JP 2010-159400 A

  In a rotor constituting a motor, a fixing member for fixing the magnet to the rotor core may be provided in a gap between the hole for inserting the magnet and the magnet. The fixing member is formed, for example, by curing a fixing resin composition filled in a gap between the hole and the magnet.

If a void or the like occurs in the fixing member, the motor characteristics may change. For this reason, when the fixing resin composition is filled in the gap between the hole and the magnet, it is necessary to suppress the occurrence of a portion not filled with the fixing resin composition (hereinafter also referred to as an unfilled portion). is there.
Generation | occurrence | production of an unfilled part is suppressed by enlarging the width | variety of the clearance gap between a hole and a magnet, for example. However, if the width of the gap between the hole and the magnet is increased, the heat dissipation of the magnet may be reduced. Therefore, it has been difficult to suppress the occurrence of unfilled portions while maintaining heat dissipation.

According to the present invention, a rotor core provided with a hole,
A magnet inserted into the hole;
A fixing member provided at a separation portion between the hole and the magnet;
Equipped with a,
Before SL fixing member, a thermosetting resin containing an epoxy resin, made fixing resin composition containing a curing agent and an inorganic filler,
Content of the said inorganic filler is 50 mass% or more and 93 mass % or less with respect to 100 mass% of the total value of the said resin composition for fixation,
Wherein the maximum particle size of the inorganic filler and d1, when the width of the spacing portion between the magnet and the hole was W, W / d1 is Ri der 1.2 to 10,
A rotor is provided in which W is 20 μm or more and 500 μm or less .

  According to the present invention, an automobile including the above-described rotor is provided.

  According to the present invention, the filling property of the fixing resin composition filled in the gap between the hole and the magnet can be improved while improving the heat dissipation.

It is a top view which shows the rotor which concerns on this embodiment. It is sectional drawing which shows the rotor shown in FIG. It is a cross-sectional enlarged view which shows the rotor shown in FIG. FIG. 7 is a plan view showing a first modification of the rotor core that constitutes the rotor shown in FIG. 1. FIG. 10 is a plan view showing a second modification of the rotor core that constitutes the rotor shown in FIG. 1. FIG. 10 is a plan view showing a third modification of the rotor core that constitutes the rotor shown in FIG. 1. FIG. 2 is an enlarged plan view showing a part of the rotor shown in FIG. 1. It is sectional drawing which shows the rotor shown in FIG. FIG. 2 is an enlarged plan view showing a part of the rotor shown in FIG. 1. It is sectional drawing which shows the upper mold | type of the insert molding apparatus used for insert molding.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

FIG. 1 is a plan view showing a rotor 100 according to the present embodiment. FIG. 2 is a cross-sectional view showing the rotor 100 shown in FIG. 1 and 2 are schematic views showing the rotor 100, and the configuration of the rotor 100 according to the present embodiment is not limited to that shown in FIGS.
The rotor 100 includes a rotor core 110, a magnet 120, and a fixing member 130. The rotor core 110 is provided with a hole 150. The magnet 120 is inserted into the hole 150. The fixing member 130 is provided in a separation portion 140 between the hole 150 and the magnet 120.

The fixing member 130 is made of a fixing resin composition. The fixing resin composition contains a thermosetting resin, a curing agent, and an inorganic filler. When the maximum particle diameter of the inorganic filler is d1, and the width of the space between the hole 150 and the magnet 120 is W, W / d1 is 1.2 or more and 10 or less.
Hereinafter, the configuration of the rotor 100 according to the present embodiment will be described in detail.

The rotor 100 according to the present embodiment constitutes a motor mounted on, for example, an automobile. The motor includes a rotor 100 and a stator (not shown) provided around the rotor 100. The stator includes a stator core and a coil wound around the stator core.
As shown in FIG. 2, the rotor 100 is attached to the rotating shaft 170. The rotation generated by the rotor 100 is transmitted to the outside through the rotating shaft 170.

The rotor core 110 is provided with a through hole for inserting the rotating shaft 170. The rotor core 110 is fixed to the rotating shaft 170 inserted into the through hole. The shape of the rotor core 110 is not particularly limited, but is, for example, a circle or a polygon in plan view.
As shown in FIG. 2, the rotor core 110 is formed by laminating a plurality of electromagnetic steel plates 112 that are thin plate-like magnetic bodies. The electromagnetic steel plate 112 is made of, for example, iron or an iron alloy.
Further, as shown in FIG. 2, end plates 118a and 118b are provided at both ends of the rotor core 110 in the axial direction. That is, an end plate 118 a is provided on the laminated electromagnetic steel plates 112. Further, an end plate 118b is provided below the laminated electromagnetic steel plates 112. The end plate 118a and the end plate 118b are fixed to the rotating shaft 170 by, for example, welding.

FIG. 3 is an enlarged cross-sectional view showing the rotor 100 shown in FIG. As shown in FIG. 3, a caulking portion 160 is formed on the plurality of electromagnetic steel plates 112. The crimping part 160 is comprised by the projection part formed in the electromagnetic steel plate 112, for example. The electromagnetic steel plates 112 are coupled to each other by a caulking portion 160.
Further, the end plate 118 a is provided with, for example, a caulking portion 160 protruding from the electromagnetic steel plate 112 and a groove portion 116 for avoiding interference with the fixing member 130 protruding on the electromagnetic steel plate 112. The fixing member 130 protruding on the electromagnetic steel sheet 112 is a portion formed by hardening of the fixing resin composition remaining on the electromagnetic steel sheet 112 when the fixing resin composition is poured into the separating portion 140. It is.

As shown in FIG. 1, the rotor core 110 is provided with a plurality of holes 150. The plurality of holes 150 are arranged in the rotor core 110 so as to be point symmetric about the axis of the rotating shaft 170.
As shown in FIG. 1, in the rotor 100 of the present embodiment, for example, a plurality of hole groups including two adjacent hole portions 150 are arranged along the peripheral edge portion of the rotating shaft 170. The plurality of hole groups are provided, for example, so as to be separated from each other. The two hole parts 150 constituting one hole part group are arranged in a V shape in a plan view, for example. In this case, the two hole parts 150 constituting one hole part group are provided, for example, such that respective end parts facing each other are located on the rotating shaft 170 side. Moreover, the two hole parts 150 which comprise one hole part group are provided so that it may mutually space apart, for example.

  FIG. 4 is a plan view showing a first modification of the rotor core 110 constituting the rotor 100 shown in FIG. As shown in FIG. 4, a plurality of hole groups composed of three hole portions 150 may be arranged along the peripheral edge portion of the rotating shaft 170. In this case, the three hole portions 150 are configured by, for example, a hole portion 154a and a hole portion 154b arranged in a V shape in a plan view, and a hole portion 156 positioned therebetween. The hole 154a, the hole 154b, and the hole 156 are separated from each other.

FIG. 5 is a plan view showing a second modification of rotor core 110 constituting rotor 100 shown in FIG. As shown in FIG. 5, a plurality of holes 150 having a V shape in plan view may be arranged along the peripheral edge of the rotating shaft 170. In this case, the hole 150 is provided, for example, such that the center of the hole 150 is located on the rotating shaft 170 side and both ends of the hole 150 are located on the outer peripheral edge side of the rotor core 110.
FIG. 6 is a plan view showing a third modification of rotor core 110 constituting rotor 100 shown in FIG. As shown in FIG. 6, a plurality of holes 150 having a rectangular shape perpendicular to the radial direction of the rotor core 110 in plan view may be arranged along the peripheral edge of the rotating shaft 170.
The layout of the holes 150 is not limited to that described above.

FIG. 7 is an enlarged plan view showing a part of the rotor 100 shown in FIG.
As shown in FIG. 7, the hole 150 is, for example, a rectangle in plan view. The hole 150 includes a side wall 151 located on the outer peripheral edge side of the rotor core 110, a side wall 153 located on the inner peripheral edge side of the rotor core 110, and a side wall 155 and a side wall 157 that face each other in the circumferential direction of the rotor core 110. The side wall 151 and the side wall 153 are opposed to each other in the radial direction of the rotor core 110. In the present embodiment, two hole portions 150 that constitute one hole group and are adjacent to each other are arranged such that the respective side walls 155 face each other.
The shape of the hole 150 is not particularly limited as long as it corresponds to the shape of the magnet 120, and may be, for example, an ellipse.

  As shown in FIG. 7, the magnet 120 is, for example, a rectangle in plan view. The magnet 120 has a side wall 121 that faces the side wall 151, a side wall 123 that faces the side wall 153, a side wall 125 that faces the side wall 155, and a side wall 127 that faces the side wall 157. That is, the side wall 121 is located on the outer peripheral edge side of the rotor core 110. Further, the side wall 123 is located on the inner peripheral edge side of the rotor core. The magnet 120 is a permanent magnet such as a neodymium magnet. The shape of the magnet 120 is not limited to that described above, and may be, for example, an ellipse.

The fixing member 130 is formed by curing a fixing resin composition filled in a gap between the hole 150 and the magnet 120 (hereinafter also referred to as a separation part 140). As a result, the magnet 120 is fixed to the rotor core 110. In the rotor 100 according to the present embodiment, the width W of the separation portion 140 is, for example, not less than 20 μm and not more than 500 μm.
The fixing member 130 is provided at least in a separation portion 140 between the hole 150 and the magnet 120 in the radial direction of the rotor core 110. That is, the fixing member 130 is provided at least either between the side wall 121 and the side wall 151 or between the side wall 123 and the side wall 153.
The fixing member 130 is provided so as to cover at least three sides of the magnet 120 that is rectangular in plan view, for example. That is, at least three of the side wall 121, the side wall 123, the side wall 125, and the side wall 127 are covered with the fixing member 130.

As shown in FIG. 7, the separation portion 140 is, for example, between the side wall 121 and the side wall 151, between the side wall 123 and the side wall 153, between the side wall 125 and the side wall 155, and between the side wall 127 and the side wall 157. It is formed. In this case, the side wall 121, the side wall 123, the side wall 125, and the side wall 127 of the magnet 120 are covered with the fixing member 130.
In the present embodiment, the fixing member 130 is formed in the gap between the side wall 121 and the side wall 151 and in the gap between the side wall 123 and the side wall 153. For this reason, the position of the magnet 120 is fixed in the radial direction of the rotor core 110. Thereby, it can suppress that the position of the magnet 120 shifts | deviates by the centrifugal force which acts at the time of high-speed rotation of a motor.

  Further, as shown in FIG. 2, the fixing member 130 is formed so as to cover the upper surface of the magnet 120, for example. Thereby, the position of the magnet 120 is fixed in the axial direction of the rotor core 110. Therefore, it is possible to suppress the position of the magnet 120 from shifting in the axial direction of the rotor core 110 when the motor is driven.

FIG. 8 is a cross-sectional view showing the rotor 100 shown in FIG. 1 and shows an example different from FIG.
As shown in FIG. 8, the magnet 120 may be fixed so that, for example, the side wall 121 contacts the side wall 151. In this case, the separation portion 140 is formed between the side wall 123 and the side wall 153, between the side wall 125 and the side wall 155, and between the side wall 127 and the side wall 157. Therefore, the side wall 123, the side wall 125, and the side wall 127 of the magnet 120 are covered with the fixing member 130. Even in this case, the position of the magnet 120 can be fixed in the radial direction of the rotor core 110.

  Moreover, the magnet 120 may be fixed so that the side wall 123 abuts on the side wall 153, for example. In this case, the separation portion 140 is formed between the side wall 121 and the side wall 151, between the side wall 125 and the side wall 155, and between the side wall 127 and the side wall 157. Therefore, the side wall 121, the side wall 125, and the side wall 127 of the magnet 120 are covered with the fixing member 130. Even in this case, the position of the magnet 120 can be fixed in the radial direction of the rotor core 110.

9 is an enlarged plan view showing a part of the rotor 100 shown in FIG. 1, and shows an example different from FIG. As shown in FIG. 9, in the rotor 100 according to this embodiment, slits 152 may be provided at both ends of the hole 150. The slits 152 are located at both ends of the hole 150 in the circumferential direction of the rotor core 110. The slit 152 is provided in communication with the hole 150.
By providing the slits 152 at both ends of the hole 150, the magnetic path of the magnetic flux generated from the magnet 120 can be narrowed. That is, it is possible to suppress short-circuiting of the magnetic flux generated in the circumferential direction of the rotor core 110 from both ends of the magnet 120 in the rotor core 110. As a result, short-circuits in the rotor core 110 can be reduced, and the amount of magnetic flux transmitted to the stator can be increased.

As shown in FIG. 9, a slit filling resin member 132 is formed in the slit 152. The slit filling resin member 132 is formed, for example, by curing the fixing resin composition filled in the separation portion 140 and the slit 152. That is, the slit filling resin member 132 is formed by the same process as the fixing member 130, for example. Therefore, the slit filling resin member 132 is provided integrally with the fixing member 130.
When the slit 152 is formed, a corner is formed at the boundary between the side wall 155 and the side wall 157 and the slit 152. In this case, the stress applied to the magnet 120 when the motor is driven is concentrated on the portion in contact with the corner portion.
According to this modification, by forming the slit filling resin member 132 in the slit 152, it is possible to reduce the concentration of stress applied to the magnet 120 when the motor is driven. For this reason, it can suppress that a big stress acts with respect to the magnet 120 at the time of a motor drive. Therefore, it is possible to prevent the magnet 120 from being damaged.

Next, the fixing resin composition according to this embodiment will be described in detail.
The fixing resin composition according to the present embodiment is, for example, in the form of powder, granules, or tablets. For this reason, as will be described later, for example, the fixing resin composition is filled into the spacing portion 140 by injecting the molten fixing resin composition into the spacing portion 140.
The fixing resin composition according to this embodiment includes a thermosetting resin (A), a curing agent (B), and an inorganic filler (C). Hereinafter, each component will be described.

[Thermosetting resin (A)]
The thermosetting resin (A) is not particularly limited, and examples thereof include an epoxy resin (A1), a phenol resin, an oxetane resin, a (meth) acrylate resin, an unsaturated polyester resin, a diallyl phthalate resin, or a maleimide resin. Is used. Among these, an epoxy resin (A1) excellent in curability, storage stability, heat resistance of the cured product, moisture resistance, and chemical resistance is preferably used.

The thermosetting resin (A) according to the present embodiment preferably includes an epoxy resin (A1). The epoxy resin (A1) is not particularly limited in molecular weight and structure as long as it has two or more epoxy groups in one molecule.
Examples of the epoxy resin (A1) include novolak type epoxy resins such as phenol novolak type epoxy resins and cresol novolak type epoxy resins; bisphenol type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins; N, N-di Aromatic glycidylamine type epoxy resins such as glycidylaniline, N, N-diglycidyltoluidine, diaminodiphenylmethane type glycidylamine, aminophenol type glycidylamine; hydroquinone type epoxy resin; biphenyl type epoxy resin; stilbene type epoxy resin; Methane-type epoxy resin; Triphenolpropane-type epoxy resin; Alkyl-modified triphenolmethane-type epoxy resin; Triazine nucleus-containing epoxy resin; Dicyclopenta En-modified phenol type epoxy resin; naphthol type epoxy resin; naphthalene type epoxy resin; naphthylene ether type epoxy resin; phenol aralkyl type epoxy resin having phenylene and / or biphenylene skeleton, naphthol aralkyl type epoxy having phenylene and / or biphenylene skeleton An epoxy resin such as an aralkyl-type epoxy resin such as a resin, or an aliphatic epoxy resin such as an alicyclic epoxy such as vinylcyclohexene dioxide, dicyclopentadiene oxide, and alicyclic diepoxy-adipade; represented by the following formula (13A) And epoxy resin. These may be used alone or in combination of two or more.

（式（１３Ａ）中、２つのＹは、それぞれ互いに独立して、下記式（１３Ｂ）または下記式（１３Ｃ）で表されるグリシジル化フェニル基を表し、Ｘは、下記式（１３Ｄ）または下記式（１３Ｅ）で表されるグリシジル化フェニレン基を表す。）

(In the formula (13A), two Y's each independently represent a glycidylated phenyl group represented by the following formula (13B) or the following formula (13C), and X represents the following formula (13D) or the following (This represents a glycidylated phenylene group represented by the formula (13E).)

  When the epoxy resin (A1) is included as the thermosetting resin (A), it is preferable from the viewpoint of heat resistance, mechanical properties, and moisture resistance to include a structure in which a glycidyl ether structure or a glycidylamine structure is bonded to an aromatic ring. .

  Examples of the phenol resin include novolak type phenol resins such as phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, and resol type phenol resin.

  Although content of the thermosetting resin (A) which concerns on this embodiment is not specifically limited, Preferably it is 5 mass% or more and 40 mass% or less with respect to 100 mass% of the total value of the resin composition for fixation, More preferably, it is 10 mass% or more and 20 mass% or less.

  In a preferred embodiment including the epoxy resin (A1) as the thermosetting resin (A), the content of the epoxy resin is not particularly limited, but is preferably 70 mass with respect to 100 mass% of the thermosetting resin (A). % To 100% by mass, more preferably 80% to 100% by mass.

[Curing agent (B)]
The curing agent (B) is used to three-dimensionally crosslink the epoxy resin (A1) included as a preferred embodiment in the thermosetting resin (A). Although it does not specifically limit as a hardening | curing agent (B), For example, a phenol resin etc. can be used. The phenol resin-based curing agent is a monomer, oligomer, or polymer in general having two or more phenolic hydroxyl groups in one molecule, and its molecular weight and molecular structure are not particularly limited.
Examples of the phenol resin-based curing agent include novolak resins such as phenol novolak resin, cresol novolak resin, and naphthol novolak resin; polyfunctional phenol resins such as triphenolmethane phenol resin; terpene modified phenol resin, dicyclopentadiene modified Modified phenol resins such as phenol resins; aralkyl resins such as phenol aralkyl resins having a phenylene skeleton and / or biphenylene skeleton, naphthol aralkyl resins having a phenylene and / or biphenylene skeleton; bisphenol compounds such as bisphenol A and bisphenol F; Examples thereof include a phenol resin represented by (12A).

（式（１２Ａ）中、２つのＹは、それぞれ互いに独立して、下記式（１２Ｂ）または下記式（１２Ｃ）で表されるヒドロキシフェニル基を表し、Ｘは、下記式（１２Ｄ）または下記式（１２Ｅ）で表されるヒドロキシフェニレン基を表す。）

(In the formula (12A), two Y's each independently represent a hydroxyphenyl group represented by the following formula (12B) or the following formula (12C), and X represents the following formula (12D) or the following formula (It represents a hydroxyphenylene group represented by (12E).)

  These may be used alone or in combination of two or more. By using such a phenol resin-based curing agent, the balance of flame resistance, moisture resistance, electrical characteristics, curability, storage stability, and the like is improved. In particular, from the viewpoint of curability, the hydroxyl equivalent of the phenol resin-based curing agent can be, for example, 90 g / eq or more and 250 g / eq or less.

  Furthermore, examples of the curing agent that can be used in combination include a polyaddition type curing agent, a catalyst type curing agent, and a condensation type curing agent.

  Examples of polyaddition type curing agents include aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and metaxylenediamine (MXDA), diaminodiphenylmethane (DDM), m-phenylenediamine (MPDA), and diaminodiphenyl. In addition to aromatic polyamines such as sulfone (DDS), polyamine compounds containing dicyandiamide (DICY), organic acid dihydralazide, etc .; alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride (MTHPA) , Acid anhydrides including aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), benzophenone tetracarboxylic acid (BTDA); polyphenols such as novolac-type phenolic resins and phenolic polymers Phenol compounds; polysulfide, thioester, polymercaptan compounds such as thioether; an isocyanate prepolymer, an isocyanate compound such as a blocked isocyanate; organic acids such as carboxylic acid-containing polyester resins.

  Examples of the catalyst-type curing agent include tertiary amine compounds such as benzyldimethylamine (BDMA) and 2,4,6-trisdimethylaminomethylphenol (DMP-30); 2-methylimidazole, 2-ethyl-4- Examples include imidazole compounds such as methylimidazole (EMI24); Lewis acids such as BF3 complexes.

  Examples of the condensation type curing agent include a urea resin such as a resole resin and a methylol group-containing urea resin; and a melamine resin such as a methylol group-containing melamine resin.

  In the case where such other curing agents are used in combination, the content of the phenol resin curing agent is preferably 20% by mass or more, and more preferably 30% by mass or more with respect to the total curing agent (B). Is more preferable, and 50% by mass or more is particularly preferable. When the blending ratio is within the above range, good fluidity can be exhibited while maintaining the flame resistance. Moreover, the content of the phenol resin-based curing agent is not particularly limited, but is preferably 100% by mass or less with respect to the total curing agent (B).

  Although content of the hardening | curing agent (B) with respect to the resin composition for fixation is not specifically limited, It is 0.8 mass% or more with respect to 100 mass% of total values of the resin composition for fixation. Preferably, it is 1.5% by mass or more. By setting the blending ratio within the above range, good curability can be obtained. Moreover, content of the hardening | curing agent (B) with respect to the resin composition for fixation is although it does not specifically limit, It is 12 mass% or less with respect to 100 mass% of total values of the resin composition for all fixation. Is preferable, and it is more preferable that it is 10 mass% or less.

  The phenol resin as the curing agent (B) and the epoxy resin (A1) as the thermosetting resin (A) are the number of epoxy groups (EP) in the total thermosetting resin (A) and the phenolic property of all phenol resins. It is preferable that the equivalent ratio (EP) / (OH) to the number of hydroxyl groups (OH) is 0.8 to 1.3. When the equivalent ratio is within the above range, sufficient curing characteristics can be obtained when the obtained fixing resin composition is molded. However, when a resin other than a phenol resin capable of reacting with an epoxy resin is used in combination, the equivalent ratio may be adjusted as appropriate.

[Inorganic filler (C)]
As the inorganic filler (C), inorganic fillers generally used in the technical field of fixing resin compositions can be used.
Examples of the inorganic filler (C) include fused silica such as fused crushed silica and fused spherical silica, crystalline silica, alumina, kaolin, talc, clay, mica, rock wool, wollastonite, glass powder, glass flake, and glass beads. Glass fiber, silicon carbide, silicon nitride, aluminum nitride, carbon black, graphite, titanium dioxide, calcium carbonate, calcium sulfate, barium carbonate, magnesium carbonate, magnesium sulfate, barium sulfate, cellulose, aramid, wood, phenolic resin molding material and Examples thereof include pulverized powder obtained by pulverizing a cured product of an epoxy resin molding material. Among these, silica such as fused crushed silica, fused spherical silica, and crystalline silica is preferable, and fused spherical silica is more preferable. Of these, calcium carbonate is preferred in terms of cost. As the inorganic filler (C), one kind may be used, or two or more kinds may be used in combination.

The maximum particle diameter _Dmax of the inorganic filler (C) is, for example, 10 μm or more and 300 μm or less. By setting the maximum particle diameter _Dmax of the inorganic filler (C) to be equal to or greater than the above lower limit value, the fluidity of the fixing resin composition can be improved and the filling property to the spacing portion 140 can be improved. . In addition, by setting the maximum particle size _Dmax of the inorganic filler (C) to be equal to or less than the above upper limit value, when filling the spacing portion 140 with the fixing resin composition, the gate of the mold of the insert molding apparatus described later is used. It is suppressed that the inorganic filler (C) is caught and blocks the gate. For this reason, it can suppress that the unfilled part which is not filled with the resin composition for fixation in the spacing part 140 arises. As described above, by setting the maximum particle size _Dmax of the inorganic filler (C) within the above range, it is possible to improve the rotor moldability.
The inorganic filler (C) is obtained by sieving using a mesh of a predetermined size. The size of the mesh used at this time is defined as the maximum particle diameter _Dmax of the inorganic filler (C).

When the maximum particle diameter _Dmax of the inorganic filler (C) is d1, and the width of the separation portion 140 provided between the hole 150 and the magnet 120 is W, W / d1 is, for example, 1.2 or more 10 or less. By setting W / d1 within the above range, an optimum balance can be realized between the maximum particle diameter _Dmax of the inorganic filler (C) and the width of the separation portion 140.
By setting W / d1 to be equal to or higher than the above lower limit value, when the fixing resin composition containing the inorganic filler (C) is filled into the spacing portion 140, the spacing portion 140 is clogged with the inorganic filler (C). This can be suppressed. Moreover, the fluidity | liquidity of the resin composition for fixing can also be improved. For this reason, when filling the spacing resin 140 with the fixing resin composition containing the inorganic filler (C), the occurrence of unfilled portions is suppressed. Moreover, it can also suppress that the heat dissipation of the magnet 120 falls because an unfilled part arises. Moreover, the heat dissipation of the magnet 120 can be made favorable by making W / d1 below the said upper limit. Furthermore, the fluidity of the fixing resin composition can be maintained, and the filling property of the fixing resin composition into the separation portion 140 can be ensured.
That is, by setting W / d1 within the above range, it is possible to realize a rotor that is suitable for achieving a good balance between the effects of heat dissipation of the rotor and filling properties of the fixing resin composition. Further, by improving the heat dissipation of the magnet 120, a rotor having excellent durability can be realized.

The average particle diameter _{D 50} of the inorganic filler (C) is, for example, 1μm or more 100μm or less. Inorganic filler Average particle diameter D ₅₀ of the (C) by more than the upper limit, it is possible to improve the fluidity of the fixing resin composition, when filling the fixing resin composition to the separated portion 140 It is possible to suppress the occurrence of resin clogging. Further, the average particle diameter D ₅₀ of the inorganic filler (C) by the above-described lower limit, it is possible to improve the strength and flowability of the fixing member 130. Thereby, a highly durable rotor can be realized. In addition, it is possible to realize a fixing resin composition having a high filling property in the separation portion 140.
The average particle diameter _{D 50} of the inorganic filler (C), to a volume-reduced average particle size in laser diffraction type measuring device RODOS SR type (SYMPATEC HEROS & RODOS).

If an inorganic filler Average particle diameter _{D 50} of the (C) was d2, W / d2 is, for example, 3 or more and 50 or less. The W / d2 within the above range, it is possible to achieve an optimal balance between the inorganic filler and the mean particle diameter D ₅₀ of (C) the width of the spacing portion 140.
By setting W / d2 to be equal to or more than the above lower limit value, it becomes possible to fill the spacing portion 140 with the fixing resin composition containing the inorganic filler (C) with good fluidity. Moreover, the heat dissipation of the magnet 120 and the intensity | strength of the fixing member 130 can be improved by making W / d2 below the said upper limit. Furthermore, the fluidity of the fixing resin composition can be maintained, and the filling property of the fixing resin composition into the separation portion 140 can be ensured. That is, by setting W / d2 in the above range, it is possible to realize a rotor that is suitable for achieving a better balance between the effects of heat dissipation of the rotor and filling properties of the fixing resin composition. .

Further, in the fixing resin composition according to the present embodiment, the inorganic filler (C) may be an average particle diameter D ₅₀ comprises two or more spherical silica are different. Thereby, improvement of fluidity | liquidity and a filling property and coexistence of burr | flash suppression are attained.

  As the inorganic filler (C), for example, irregularly shaped particles deviating from the true sphere can be used. By using irregularly shaped particles, the filling property of the inorganic filler (C) and the strength of the obtained fixing member can be improved. Further, the irregularly shaped particles tend to enter a minute gap existing on the surface of the electromagnetic steel sheet 112. For this reason, it becomes possible to improve the contact | adhesion intensity | strength of an electromagnetic steel plate and a fixing member by an anchor effect.

  The content of the inorganic filler (C) is preferably 50% by mass or more, more preferably 60% by mass or more, and still more preferably 65% by mass with respect to 100% by mass of the total value of the fixing resin composition. % Or more, and particularly preferably 75% by mass or more. Within the above range, an increase in moisture absorption and a decrease in strength due to curing of the obtained fixing resin composition can be reduced. Further, the content of the inorganic filler (C) is preferably 93% by mass or less, more preferably 91% by mass or less, and still more preferably with respect to 100% by mass of the total value of the fixing resin composition. 90% by mass or less. Within the above range, the obtained fixing resin composition has good fluidity and good moldability. Therefore, the manufacturing stability of the rotor is increased, and a rotor having an excellent balance between yield and durability can be obtained.

  In addition, as a result of the study by the present inventors, the difference in thermal expansion coefficient between the fixing member 130 and the electrical steel sheet 112 can be reduced by setting the content of the inorganic filler (C) to 50 mass% or more. There was found. Thereby, it can suppress that the electromagnetic steel plate 112 deform | transforms according to a temperature change, and the rotational characteristic of the rotor 100 falls. Therefore, among the durability, a rotor that is particularly excellent in sustaining rotational characteristics is realized.

  When silica such as fused crushed silica, fused spherical silica, or crystalline silica is used as the inorganic filler (C), the silica content is 40% by mass with respect to 100% by mass of the fixing resin composition. Preferably, it is more than 60% by mass. Within the above range, the balance between fluidity and coefficient of thermal expansion is good.

  Also, when the inorganic filler (C) is used in combination with a metal hydroxide such as aluminum hydroxide or magnesium hydroxide as described later, or an inorganic flame retardant such as zinc borate, zinc molybdate or antimony trioxide. Therefore, it is desirable that the total amount of these inorganic flame retardants and the inorganic filler is within the range of the content of the inorganic filler (C).

The inorganic filler (C) may be previously subjected to a surface treatment with a coupling agent (F) (also referred to as a first coupling agent) such as a silane coupling agent. Thereby, aggregation of an inorganic filler can be suppressed and good fluidity can be obtained. Therefore, it is possible to improve the filling property of the fixing resin composition into the separation portion 140. Moreover, since affinity with a resin component increases, the intensity | strength of the fixing member formed using the resin composition for fixing can be improved.
As a 1st coupling agent used for the surface treatment of an inorganic filler (C), primary aminosilanes, such as (gamma) -aminopropyl triethoxysilane and (gamma) -aminopropyl trimethoxysilane, can be used, for example. By appropriately selecting the type of the first coupling agent used for the surface treatment of such an inorganic filler (C), or by appropriately adjusting the blending amount of the coupling agent, the fluidity of the fixing resin composition and The strength of the fixing member can be controlled. The first coupling agent is not dissolved in a solvent such as water, but is used as a stock solution.

The coupling treatment to the inorganic filler (C) can be performed, for example, as follows. First, the inorganic filler (C) is charged into the mixer. At this time, it is preferable to remove in advance the water adhering to the surface of the inorganic filler (C). Next, mixing and stirring are performed using a mixer while spraying the first coupling agent onto the inorganic filler (C). At this time, the inside of the mixer is preferably set to a humidity of 50% or less. By adjusting to such a spray environment, it is possible to suppress moisture from reattaching to the surface of the silica particles. Furthermore, it can suppress that water mixes in the coupling agent during spraying and the coupling agents react with each other. Moreover, as a mixer, a ribbon blender etc. can be used, for example. Next, the obtained mixture is taken out of the mixer and subjected to an aging treatment. The aging treatment is performed, for example, by leaving it for 7 days or more under the condition of 20 ± 5 ° C. By performing the aging treatment under such conditions, the first coupling agent can be uniformly bonded to the surface of the inorganic filler (C). Then, the inorganic filler (C) to which the coupling process was performed is obtained by sieving and removing a coarse particle.
By performing the surface treatment with the first coupling agent under such conditions, the coupling agent can be uniformly bonded to the surface of the inorganic filler. In addition, by using the inorganic filler (C) that has been subjected to such a surface treatment, it is possible to improve the interfacial adhesion strength between the inorganic filler (C) and the resin component, and to suppress the occurrence of microcracks in the fixing member. Can be achieved.

[Other ingredients]
The fixing resin composition according to this embodiment may include a curing accelerator (D). The curing accelerator (D) only needs to accelerate the reaction between the epoxy group of the epoxy resin and the hydroxyl group of the phenol resin curing agent (B), and a generally used curing accelerator (D) is used. it can.

Specific examples of the curing accelerator (D) include phosphorus atom-containing compounds such as organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, adducts of phosphonium compounds and silane compounds; Representative examples include 1,8-diazabicyclo (5,4,0) undecene-7, amidine compounds such as imidazole, tertiary amines such as benzyldimethylamine, and quaternary onium salts such as amidinium salts and ammonium salts. And nitrogen atom-containing compounds.
Among these, a phosphorus atom-containing compound is preferable from the viewpoint of curability, and from the viewpoint of balance between fluidity and curability, a tetra-substituted phosphonium compound, a phosphobetaine compound, an adduct of a phosphine compound and a quinone compound, a phosphonium compound A curing accelerator having a latent property such as an adduct of silane compound is more preferable. In view of fluidity, tetra-substituted phosphonium compounds are particularly preferable. From the viewpoint of solder resistance, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds are particularly preferable, and in view of latent curability. An adduct of a phosphonium compound and a silane compound is particularly preferable. Further, from the viewpoint of continuous moldability, a tetra-substituted phosphonium compound is preferable. In view of cost, organic phosphine and nitrogen atom-containing compounds are also preferably used.

  Examples of the organic phosphine that can be used in the fixing resin composition according to this embodiment include a first phosphine such as ethylphosphine and phenylphosphine; a second phosphine such as dimethylphosphine and diphenylphosphine; trimethylphosphine, triethylphosphine, and tributyl. Third phosphine such as phosphine and triphenylphosphine can be used.

  Examples of the tetra-substituted phosphonium compound that can be used in the fixing resin composition according to this embodiment include compounds represented by the following general formula (1).

  In the general formula (1), P represents a phosphorus atom, R1, R2, R3 and R4 each independently represents an aromatic group or an alkyl group, and A represents a functional group selected from a hydroxyl group, a carboxyl group and a thiol group. Represents an anion of an aromatic organic acid having at least one of the groups in the aromatic ring, and AH is an aromatic organic having at least one functional group selected from a hydroxyl group, a carboxyl group, and a thiol group in the aromatic ring Represents an acid, x and y are integers of 1 to 3, z is an integer of 0 to 3, and x = y.

Although the compound represented by General formula (1) is obtained as follows, for example, it is not limited to this. First, a tetra-substituted phosphonium halide, an aromatic organic acid and a base are mixed in an organic solvent and mixed uniformly to generate an aromatic organic acid anion in the solution system. Next, when water is added, the compound represented by the general formula (1) can be precipitated.
In the compound represented by the general formula (1), R1, R2, R3, and R4 bonded to the phosphorus atom are phenyl groups, and AH is bonded to the phosphorus atom from the viewpoint of excellent balance between the yield during synthesis and the curing acceleration effect. A compound having a hydroxyl group in an aromatic ring, that is, a phenol compound, and A is preferably an anion of the phenol compound. The phenol compounds are monocyclic phenol, cresol, catechol, resorcin, condensed polycyclic naphthol, dihydroxynaphthalene, (polycyclic) bisphenol A, bisphenol F, bisphenol S, biphenol having a plurality of aromatic rings. , Phenylphenol, phenol novolak and the like, and among them, phenol compounds having two hydroxyl groups are preferably used.

  Examples of the phosphobetaine compound that can be used in the fixing resin composition according to this embodiment include compounds represented by the following general formula (2).

  In General formula (2), X1 represents a C1-C3 alkyl group, Y1 represents a hydroxyl group, a is an integer of 0-5, b is an integer of 0-4.

  The compound represented by the general formula (2) is subjected to, for example, a step of bringing a triaromatic substituted phosphine that is a third phosphine into contact with a diazonium salt and substituting the diazonium group of the triaromatic substituted phosphine with the diazonium salt. can get. However, the present invention is not limited to this.

  Examples of the adduct of a phosphine compound and a quinone compound that can be used in the fixing resin composition according to this embodiment include compounds represented by the following general formula (3).

  In General formula (3), P represents a phosphorus atom, R5, R6, and R7 represent a C1-C12 alkyl group or a C6-C12 aryl group mutually independently, R8, R9, and R10 represents a hydrogen atom or a C1-C12 hydrocarbon group mutually independently. R8 and R9 may be bonded to each other to form a ring.

  Examples of the phosphine compound used as an adduct of a phosphine compound and a quinone compound include an aromatic ring such as triphenylphosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, trinaphthylphosphine, and tris (benzyl) phosphine. Those having a substituent or a substituent such as an alkyl group or an alkoxyl group are preferred. Examples of the substituent such as an alkyl group and an alkoxyl group include those having 1 to 6 carbon atoms. From the viewpoint of availability, triphenylphosphine is preferable.

  Moreover, o-benzoquinone, p-benzoquinone, anthraquinones are mentioned as a quinone compound used for the adduct of a phosphine compound and a quinone compound. Among these, p-benzoquinone is preferable from the viewpoint of storage stability.

  The adduct of a phosphine compound and a quinone compound can be obtained by, for example, contacting and mixing in a solvent in which both organic tertiary phosphine and benzoquinone can be dissolved. The solvent is preferably a ketone such as acetone or methyl ethyl ketone, which has low solubility in the adduct. However, the present invention is not limited to this.

  In the compound represented by the general formula (3), R5, R6 and R7 bonded to the phosphorus atom are phenyl groups, and R8, R9 and R10 are hydrogen atoms, that is, 1,4-benzoquinone and triphenyl A compound to which phosphine is added is preferable in that it reduces the elastic modulus during heat of the cured product of the fixing resin composition.

  Examples of the adduct of a phosphonium compound and a silane compound that can be used in the fixing resin composition according to this embodiment include compounds represented by the following general formula (4).

  In General formula (4), P represents a phosphorus atom and Si represents a silicon atom. R11, R12, R13 and R14 each independently represent an organic group having an aromatic ring or a heterocyclic ring, or an aliphatic group, and X2 is an organic group bonded to the groups Y2 and Y3. X3 is an organic group bonded to the groups Y4 and Y5. Y2 and Y3 represent a group formed by releasing a proton from a proton donating group, and groups Y2 and Y3 in the same molecule are bonded to a silicon atom to form a chelate structure. Y4 and Y5 represent a group formed by releasing a proton from a proton donating group, and groups Y4 and Y5 in the same molecule are bonded to a silicon atom to form a chelate structure. X2 and X3 may be the same as or different from each other. The groups Y2, Y3, Y4 and Y5 may be the same or different from each other. Z1 is an organic group having an aromatic ring or a heterocyclic ring, or an aliphatic group.

  In the general formula (4), examples of R11, R12, R13, and R14 include phenyl group, methylphenyl group, methoxyphenyl group, hydroxyphenyl group, naphthyl group, hydroxynaphthyl group, benzyl group, methyl group, ethyl group, An n-butyl group, an n-octyl group, a cyclohexyl group, etc. are mentioned. Among these, an aromatic group having a substituent such as a phenyl group, a methylphenyl group, a methoxyphenyl group, a hydroxyphenyl group, and a hydroxynaphthyl group or an unsubstituted aromatic group is preferable.

Moreover, in General formula (4), X2 is an organic group couple | bonded with group Y2 and Y3. Similarly, X3 is an organic group bonded to the groups Y4 and Y5. Y2 and Y3 are groups formed by proton-donating groups releasing protons, and groups Y2 and Y3 in the same molecule are combined with a silicon atom to form a chelate structure. Similarly, Y4 and Y5 are groups formed by proton-donating groups releasing protons, and groups Y4 and Y5 in the same molecule are combined with a silicon atom to form a chelate structure. The groups X2 and X3 may be the same or different from each other, and the groups Y2, Y3, Y4, and Y5 may be the same or different from each other. The groups represented by -Y2-X2-Y3- and -Y4-X3-Y5- in general formula (4) are composed of groups in which a proton donor releases two protons. Is. Therefore, the proton donor is preferably an organic acid having at least two carboxyl groups or hydroxyl groups in the molecule, more preferably an aromatic compound having at least two carboxyl groups or hydroxyl groups on carbon constituting the aromatic ring, An aromatic compound having at least two hydroxyl groups on adjacent carbons constituting the aromatic ring is more preferable.
Examples of proton donors include catechol, pyrogallol, 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,2′-biphenol, 1,1′-bi-2-naphthol, salicylic acid, 1-hydroxy- Examples include 2-naphthoic acid, 3-hydroxy-2-naphthoic acid, chloranilic acid, tannic acid, 2-hydroxybenzyl alcohol, 1,2-cyclohexanediol, 1,2-propanediol, and glycerin. Among these, catechol, 1,2-dihydroxynaphthalene, and 2,3-dihydroxynaphthalene are more preferable from the viewpoint of easy availability of raw materials and a curing acceleration effect.

  Moreover, Z1 in General formula (4) represents the organic group or aliphatic group which has an aromatic ring or a heterocyclic ring. Specific examples thereof include aliphatic hydrocarbon groups such as methyl group, ethyl group, propyl group, butyl group, hexyl group or octyl group, and aromatic groups such as phenyl group, benzyl group, naphthyl group or biphenyl group. Examples thereof include reactive substituents such as a hydrocarbon group, a glycidyloxypropyl group, a mercaptopropyl group, an aminopropyl group, and a vinyl group. Among these, a methyl group, an ethyl group, a phenyl group, a naphthyl group, or a biphenyl group is more preferable from the viewpoint of thermal stability.

  An adduct of a phosphonium compound and a silane compound can be obtained, for example, as follows. First, a silane compound such as phenyltrimethoxysilane and a proton donor such as 2,3-dihydroxynaphthalene are added and dissolved in a flask containing methanol. Next, a sodium methoxide-methanol solution is dropped into the flask while stirring at room temperature. Next, when a solution prepared by dissolving a tetra-substituted phosphonium halide such as tetraphenylphosphonium bromide in methanol in methanol is added dropwise to the flask with stirring at room temperature, crystals are deposited. The precipitated crystals are filtered, washed with water, and vacuum dried to obtain an adduct of a phosphonium compound and a silane compound. However, it is not limited to this.

  The content of the curing accelerator (D) that can be used in the fixing resin composition according to the present embodiment is 0.1% by mass or more with respect to 100% by mass of the total value of all fixing resin compositions. It is preferable. When the content of the curing accelerator (D) is within the above range, sufficient curability can be obtained. Further, the content of the curing accelerator (D) is preferably 3% by mass or less, more preferably 1% by mass or less, with respect to 100% by mass of the total value of the resin composition for fixation. Sufficient fluidity | liquidity can be acquired as content of a hardening accelerator (D) exists in the said range.

  In the fixing resin composition according to this embodiment, a compound (E) in which a hydroxyl group is bonded to two or more adjacent carbon atoms constituting an aromatic ring (hereinafter simply referred to as “compound (E)”). May also be included. By using the compound (E), even when a phosphorus atom-containing curing accelerator having no latent property is used as the curing accelerator (D), the reaction during the melt-kneading of the fixing resin composition is suppressed. The fixing resin composition can be obtained stably. The compound (E) also has an effect of lowering the melt viscosity of the fixing resin composition and improving fluidity. As the compound (E), a monocyclic compound represented by the following general formula (5), a polycyclic compound represented by the following general formula (6), or the like can be used. These compounds may have a substituent other than a hydroxyl group.

  In General Formula (5), one of R15 and R19 is a hydroxyl group, and the other is a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group. R16, R17 and R18 are a hydrogen atom, a hydroxyl group or a substituent other than a hydroxyl group.

  In General formula (6), one of R20 and R26 is a hydroxyl group, and the other is a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group. R21, R22, R23, R24 and R25 are a hydrogen atom, a hydroxyl group or a substituent other than a hydroxyl group.

  Specific examples of the monocyclic compound represented by the general formula (5) include catechol, pyrogallol, gallic acid, gallic acid ester, and derivatives thereof. Specific examples of the polycyclic compound represented by the general formula (6) include 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and derivatives thereof. Among these, a compound in which a hydroxyl group is bonded to each of two adjacent carbon atoms constituting an aromatic ring is preferable because of easy control of fluidity and curability. In consideration of volatilization in the kneading step, it is more preferable that the mother nucleus is a compound having a low volatility and a highly stable weighing naphthalene ring. In this case, specifically, the compound (E) can be a compound having a naphthalene ring such as 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene and derivatives thereof. These compounds (E) may be used individually by 1 type, or may use 2 or more types together.

  The content of the compound (E) is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, with respect to a total value of 100% by mass of the total fixing resin composition. More preferably, it is 0.05 mass% or more. When the content of the compound (E) is within the above range, a sufficient viscosity reduction and fluidity improvement effect of the fixing resin composition can be obtained. Further, the content of the compound (E) is preferably 2% by mass or less, more preferably 0.8% by mass or less, with respect to the total value of 100% by mass of the total fixing resin composition. More preferably, it is 0.5 mass% or less. When the content of the compound (E) is within the above range, there is little risk of causing a decrease in the curability of the fixing resin composition and a decrease in the physical properties of the cured product.

In the fixing resin composition according to the present embodiment, in order to improve the adhesion between the epoxy resin (A1) and the inorganic filler (C), a coupling agent ( F) (also called second coupling agent) can be added. Any second coupling agent may be used as long as it reacts between the epoxy resin (A1) and the inorganic filler (C) to improve the interface strength between the epoxy resin (A1) and the inorganic filler (C). .
The second coupling agent is not particularly limited, and examples thereof include epoxy silane, amino silane, ureido silane, mercapto silane, and the like. Moreover, a coupling agent (F) can also raise the effect of the compound (E) of reducing the melt viscosity of the resin composition for fixation and improving fluidity | liquidity by using together with the above-mentioned compound (E). Is.

  Examples of the epoxy silane include γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, and the like. Is mentioned. Examples of aminosilanes include primary aminosilanes such as γ-aminopropyltriethoxysilane and γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, and N-β (aminoethyl). γ-aminopropylmethyldimethoxysilane, N-phenylγ-aminopropyltriethoxysilane, N-phenylγ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltriethoxysilane, N-6- ( Secondary aminosilanes such as aminohexyl) 3-aminopropyltrimethoxysilane, N- (3- (trimethoxysilylpropyl) -1,3-benzenedimethanane, etc. Further, examples of ureidosilane include γ- Ureidopropyltriethoxysilane, hexamethyldisila It may be used as a latent aminosilane coupling agent in which the primary amino moiety of aminosilane is protected by reacting with a ketone or aldehyde, and the aminosilane may have a secondary amino group. Examples of mercaptosilane include γ-mercaptopropyltrimethoxysilane and 3-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfide, and bis (3-triethoxysilylpropyl) disulfide. Examples of such a silane coupling agent that exhibit the same function as the mercaptosilane coupling agent by thermal decomposition are also included, and these silane coupling agents may be pre-hydrolyzed. These silane coupling agents are Type may be used in combination of two or more be used alone.

  Mercaptosilane is preferable from the viewpoint of continuous formability. Epoxysilane is preferable from the viewpoint of adhesion.

  The content of the coupling agent (F) such as a silane coupling agent that can be used in the fixing resin composition according to this embodiment (the total amount of the first coupling agent and the second coupling agent) is fully fixed. It is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and further preferably 0.1% by mass or more with respect to 100% by mass of the total resin composition. preferable. When the content of the coupling agent (F) is within the above range, the interface strength between the epoxy resin (A1) and the inorganic filler (C) does not decrease, and good vibration resistance can be obtained. . Moreover, it is preferable that content of a coupling agent (F) is 1 mass% or less with respect to the total value of 100 mass% of the resin composition for all fixation, and it is more preferable that it is 0.8 mass% or less. Preferably, it is 0.6 mass% or less. When the content of the coupling agent (F) is within the above range, the interface strength between the epoxy resin (A1) and the inorganic filler (C) does not decrease, and good vibration resistance can be obtained. . Moreover, if content of a coupling agent (F) is in the said range, the water absorption of the hardened | cured material of the resin composition for fixation will not increase, and favorable rust prevention property can be acquired.

In the fixing resin composition according to this embodiment, an inorganic flame retardant (G) can be added in order to improve flame retardancy. As the inorganic flame retardant (G), a metal hydroxide or a composite metal hydroxide that inhibits the combustion reaction by dehydrating and absorbing heat during combustion is preferable in that the combustion time can be shortened. Examples of the metal hydroxide include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, barium hydroxide, and zirconia hydroxide. The composite metal hydroxide is a hydrotalcite compound containing two or more metal elements, wherein at least one metal element is magnesium, and the other metal elements are calcium, aluminum, tin, titanium, iron Any metal element selected from cobalt, nickel, copper, or zinc may be used. As such a composite metal hydroxide, magnesium hydroxide / zinc solid solution is a commercially available product and is easily available. Of these, aluminum hydroxide and magnesium hydroxide / zinc solid solution are preferable from the viewpoint of continuous formability. An inorganic flame retardant (G) may be used independently or may be used 2 or more types. Further, for the purpose of reducing the influence on the continuous moldability, a surface treatment may be performed with a silicon compound such as a silane coupling agent or an aliphatic compound such as wax.
The content of the inorganic flame retardant (G) according to the present embodiment is preferably 1% by mass or more and 20% by mass or less, more preferably 100% by mass with respect to the total value of 100% by mass of the fixing resin composition according to the present invention. Is 3 mass% or more and 10 mass% or less.

In the fixing resin composition according to the present embodiment, the concentration of the ionic impurities is preferably 500 ppm or less, more preferably 300 ppm or less, still more preferably 200 ppm or less with respect to the fixing resin composition. is there. The concentration of the ionic impurity is not particularly limited, but is, for example, 0 ppb or more, more preferably 10 ppb or more, and further preferably 100 ppb or more with respect to the fixing resin composition according to the present invention. Thereby, when using the hardened | cured material of the resin composition for fixation concerning this embodiment for a fixing member, even if it processes at high temperature and humidity, high rust prevention property can be hold | maintained.
Although it does not specifically limit as an ionic impurity which concerns on this embodiment, An alkali metal ion, alkaline-earth metal ion, a halogen ion, etc., More specifically, a sodium ion, a chlorine ion, etc. are mentioned. The concentration of sodium ions is preferably 100 ppm or less, more preferably 70 ppm or less, and further preferably 50 ppm or less with respect to the fixing resin composition according to the present embodiment. The concentration of chloride ions is preferably 100 ppm or less, more preferably 50 ppm or less, and further preferably 30 ppm or less with respect to the fixing resin composition according to the present embodiment. By setting it as said range, corrosion of an electromagnetic steel plate and a magnet can be suppressed.
In this embodiment, ionic impurities can be reduced by using, for example, a highly pure epoxy resin. As described above, a rotor having excellent durability can be obtained.

  The concentration of ionic impurities can be determined as follows. First, the fixing resin composition according to the present embodiment is molded and cured at 175 ° C. for 180 seconds and then pulverized by a pulverizer to obtain a cured powder. The obtained cured product powder is treated in pure water at 120 ° C. for 24 hours to extract ions in pure water, and then measured using ICP-MS (inductively coupled plasma ion source mass spectrometer).

  In the fixing resin composition according to this embodiment, the content of alumina is preferably 10% by mass or less, more preferably 7% by mass or less, with respect to 100% by mass of the total value of the fixing resin composition. More preferably, it is 5 mass% or less. The content of alumina is not particularly limited. For example, the content is preferably 0% by mass or more, and more preferably 0.01% by mass with respect to a total value of 100% by mass of the fixing resin composition according to the present embodiment. It is above, More preferably, it is 0.1 mass% or more. By making the content of alumina not more than the above upper limit value, the fluidity of the fixing resin composition according to this embodiment can be improved and the weight can be reduced. In the present embodiment, 0 mass% allows a detection limit value.

In the fixing resin composition according to this embodiment, in addition to the components described above, hydrotalcites or ion scavengers such as hydrated oxides of elements selected from magnesium, aluminum, bismuth, titanium, zirconium; carbon black, bengara Colorants such as titanium oxide; natural waxes such as carnauba wax; synthetic waxes such as polyethylene wax; mold release agents such as higher fatty acids such as stearic acid and zinc stearate and their metal salts or paraffin; and polybutadiene compounds and acrylonitrile butadiene A low-stress agent such as a silicone compound such as a polymerization compound, silicone oil, or silicone rubber; an adhesion-imparting agent such as triazole may be appropriately blended.
Hydrotalcite as an ion scavenger and triazole as an adhesion-imparting agent have a rust preventive effect on the magnet 120 and the electromagnetic steel sheet 112. For this reason, the heat dissipation of a magnet can be maintained for a long term by using hydrotalcite or triazole. In addition, even at high temperature and high humidity, it is possible to maintain the adhesive force at the interface between the magnetic steel sheet and the magnet and the fixing member for a long period of time.
Moreover, the stress relaxation capability of the obtained fixing member can be improved by adding a low stress agent. For this reason, it becomes possible to suppress generation | occurrence | production of the peeling and crack resulting from the difference in the thermal expansion coefficient of an electromagnetic steel plate and a magnet.

  The content of the colorant according to this embodiment is preferably 0.01% by mass or more and 1% by mass or less, more preferably 100% by mass with respect to the total value of 100% by mass of the fixing resin composition according to this embodiment. It is 0.05 mass% or more and 0.8 mass% or less. By setting the content of the colorant within the above range, a step of removing colored impurities is unnecessary, and workability is improved. Therefore, a rotor excellent in yield is realized.

  The content of the release agent according to this embodiment is not particularly limited, but is preferably 0.01% by mass or more, for example, with respect to the total value of 100% by mass of the fixing resin composition according to this embodiment, More preferably, it is 0.05 mass% or more. Further, the content of the release agent is not particularly limited, but for example, is preferably 1% by mass or less, more preferably 0.5% by mass or less, and further preferably 0.2% by mass or less. Preferably it is 0.1 mass% or less. Usually, when a semiconductor chip is formed by transfer, it is known that a certain amount of a release agent is added in order to ensure the releasability that the fixing member is separated from the mold. However, if the amount of the release agent added is too high, the adhesion between the fixing member and the electrical steel sheet may be reduced. For this reason, in this embodiment, the one where content of a mold release agent is few is preferable, and 0.2 mass% or less is especially preferable. Thereby, since the adhesiveness of a fixing member and an electromagnetic steel plate can be improved, the rotor excellent in durability is implement | achieved.

  The content of the low stress agent according to the present embodiment is preferably 0.01% by mass or more and 3% by mass or less, more preferably 100% by mass with respect to the total value of 100% by mass of the fixing resin composition according to the present embodiment. Is 0.05 mass% or more and 2 mass% or less.

Although the manufacturing method of the fixing resin composition according to the present embodiment is not particularly limited, for example, it is performed as follows. First, a predetermined amount of a thermosetting resin (A), a phenol resin-based curing agent (B), an inorganic filler (C), and preferably other additives are blended. Next, the blended material is uniformly pulverized and mixed at room temperature using, for example, a mixer, a jet mill, a ball mill or the like. Subsequently, using a kneader such as a heating roll, a kneader, or an extruder, the fixing resin composition is melted and heated to about 90 to 120 ° C. while being kneaded. Next, the kneaded fixing resin composition is cooled and pulverized to obtain a solid fixing resin composition in the form of granules or powder. By appropriately adjusting the conditions in these production steps, a fixing resin composition having a desired degree of dispersion and fluidity can be obtained.
The particle size of the powder or granule of the fixing resin composition according to this embodiment is preferably, for example, 5 mm or less. By setting the thickness to 5 mm or less, it is possible to suppress a filling failure at the time of tableting and an increase in tablet mass variation.

Further, a tablet can be obtained by tableting the obtained powder or granule of the fixing resin composition. As an apparatus used for tableting molding, a single-shot or multiple rotary tableting machine can be used. The shape of the tablet is not particularly limited, but is preferably a columnar shape. There are no particular restrictions on the male, female, and environmental temperatures of the tableting machine, but 35 ° C. or lower is preferred. When it exceeds 35 ° C., the viscosity of the fixing resin composition increases due to the reaction, and the fluidity may be impaired. The tableting pressure is preferably in the range of 400 × 10 ⁴ Pa to 3000 × 10 ⁴ Pa. By making the tableting pressure not more than the above upper limit value, it is possible to suppress the occurrence of breakage immediately after tableting. On the other hand, by setting the tableting pressure to the lower limit value or more, it is possible to prevent the tablet from being broken during transportation because sufficient cohesive force cannot be obtained. There are no particular limitations on the material and surface treatment of the male and female molds of the tableting machine, and known materials can be used. Examples of the surface treatment include electric discharge machining, release agent coating, plating treatment, and polishing.

(Method for manufacturing rotor)
The method for manufacturing the rotor 100 according to this embodiment is performed, for example, as follows. First, the rotor core 110 provided with a plurality of holes 150 arranged along the peripheral edge of the through hole through which the rotating shaft 170 passes is prepared. Next, the magnet 120 is inserted into the hole 150. Next, the fixing resin composition is filled in the space 140 between the hole 150 and the magnet 120. Next, the fixing resin composition is cured to obtain the fixing member 130. Next, the rotary shaft 170 is inserted into the through hole of the rotor core 110, and the rotary shaft 170 is fixed to the rotor core 110. Thereby, the rotor 100 according to the present embodiment is obtained.
In the present embodiment, it is preferable to use insert molding as a method of filling the spacing portion 140 with the fixing resin composition. Details will be described below.

First, an insert molding apparatus will be described. FIG. 10 is a cross-sectional view showing an upper mold 200 of an insert molding apparatus used for insert molding.
As an example of a method of forming the fixing member 130, a method of performing insert molding using a tablet-like fixing resin composition can be used. An insert molding device is used for this insert molding. The molding apparatus includes a pot 210 to which a tablet-like fixing resin composition is supplied, an upper mold 200 having a flow path 220 for moving the molten fixing resin composition, a lower mold (not shown), A heating means for heating the upper mold 200 and the lower mold, and an extrusion mechanism for extruding the fixing resin composition in a molten state are provided. The insert molding device may have a transport function for transporting, for example, a rotor core.

The upper mold 200 and the lower mold are preferably in close contact with the upper and lower surfaces of the rotor core 110 during insert molding. For this reason, the upper mold 200 and the lower mold are, for example, plate-shaped. The upper mold 200 and the lower mold of the present embodiment are different from the normal transfer forming mold used in the method for manufacturing a semiconductor device in that the entire rotor core 110 is not covered during insert molding. That is, the upper mold 200 and the lower mold according to the present embodiment do not cover the side surface of the rotor core 110 at the time of insert molding. On the other hand, a transfer molding die is configured such that the entire semiconductor chip is disposed in a cavity constituted by an upper die and a lower die.
In addition, as shown in FIG. 11, the pot 210 may have two separate flow paths 220. In this case, the two flow paths 220 connected to one pot 210 are arranged in a Y shape. As a result, the fixing resin composition according to this embodiment can be filled into the two holes 150 from one pot 210. One pot 210 may have only one flow path for filling one hole 150 with the fixing resin composition, and three or more holes 150 are filled with the fixing resin composition. You may have three or more flow paths. When one pot 210 includes a plurality of flow paths 220, the plurality of flow paths 220 may be independent from each other or may be continuous with each other.

Next, insert molding according to this embodiment will be described.
First, after preheating the rotor core 110 on an oven or a hot platen, it is fixed to a lower mold of a molding apparatus (not shown). Subsequently, the magnet 120 is inserted into the hole 150 of the rotor core 110. Subsequently, the lower mold is raised and the upper mold 200 is pressed against the upper surface of the rotor core 110. Thereby, the upper surface and the lower surface of the rotor core 110 are sandwiched between the upper mold 200 and the lower mold. At this time, the front end portion of the flow path 220 in the upper mold 200 is disposed on the separation portion 140 between the hole 150 and the magnet 120. The rotor core 110 is heated by heat conduction from the lower mold and the upper mold 200 of the molding apparatus. The lower mold and the upper mold 200 of the molding apparatus are temperature-controlled at, for example, about 150 ° C. to 200 ° C. so that the rotor core 110 has a temperature suitable for molding and curing the fixing resin composition. In this state, a tablet-like fixing resin composition is supplied into the pot 210 of the upper mold 200. The tablet-like fixing resin composition supplied into the pot 210 of the upper mold 200 is heated in the pot 210 to be in a molten state.

Subsequently, the fixing resin composition in a molten state is extruded from the pot 210 by a plunger (extrusion mechanism). As a result, the fixing resin composition moves through the flow path 220 and fills the separation portion 140 between the hole 150 and the magnet 120. While the fixing resin composition is filled in the separation portion 140, the rotor core 110 is heated by heat conduction from the molds (the lower mold and the upper mold 200). As the rotor core 110 is heated, the fixing resin composition filled in the separating portion 140 is cured. Thereby, the fixing member 130 is formed.
At this time, the temperature condition at the time of hardening the fixing resin composition can be set to 150 ° C. to 200 ° C., for example. Further, the curing time can be, for example, 30 seconds to 180 seconds. As a result, the magnet 120 inserted into the hole 150 is fixed by the fixing member 130. Thereafter, the upper mold 200 is separated from the upper surface of the rotor core 110. Next, the rotary shaft 170 is inserted into the through hole of the rotor core 110, and the rotary shaft 170 is fixed to the rotor core 110.
As described above, the rotor 100 according to the present embodiment is obtained.

The insert molding method according to the present embodiment is different from the transfer molding method used for manufacturing a semiconductor device in that it is not necessary to remove the mold.
In the insert molding method, the fixing resin composition is filled into the hole 150 of the rotor core 110 through the flow path 220 of the upper mold 200 while the upper surface of the rotor core 110 and the upper mold 200 are in close contact with each other. For this reason, resin is not filled between the upper surface of the rotor core 110 and the upper mold 200, and the upper mold 200 and the upper surface can be easily attached and detached.
On the other hand, in the transfer molding method, since the resin is filled in the cavity between the semiconductor chip and the mold, it is necessary to successfully remove the mold from the molded product. For this reason, releasability between the mold and the molded product is particularly required for the resin for sealing the semiconductor chip.

The rotor 100 according to the present embodiment can be mounted on a vehicle such as an electric vehicle such as a hybrid vehicle, a fuel cell vehicle, and an electric vehicle, a train, and a ship.
Hereinafter, examples of the reference form will be added.
1. A rotor core provided with holes;
A magnet inserted into the hole;
A fixing member provided at a separation portion between the hole and the magnet;
With
The fixing member is composed of a thermosetting resin containing an epoxy resin, a fixing resin composition containing a curing agent and an inorganic filler,
A rotor in which W / d1 is 1.2 or more and 10 or less, where d1 is the maximum particle size of the inorganic filler and W is the width of the space between the hole and the magnet.
2.1. In the rotor described in
d1 is a rotor of 10 μm or more and 300 μm or less.
3.1. Or 2. In the rotor described in
The average particle size of the inorganic filler is a rotor of 1 μm or more and 100 μm or less.
4.1. Or 3. In the rotor according to any one of the above,
The content of the inorganic filler is 50% by mass or more with respect to 100% by mass of the total value of the fixing resin composition.
5.1. Or 4. In the rotor according to any one of the above,
The inorganic filler is a rotor that has been surface-treated with a first coupling agent.
6.5. In the rotor described in
The first coupling agent is a rotor including primary aminosilane.
7.1. Or 6. In the rotor according to any one of the above,
The fixing resin composition is a rotor including a second coupling agent containing secondary aminosilane or mercaptosilane.
8.1. Or 7. In the rotor according to any one of the above,
W is a rotor of 20 μm or more and 500 μm or less.
9.1. Or 8. An automobile comprising the rotor according to any one of the above.

  Hereinafter, the present embodiment will be described in detail with reference to examples. In addition, this embodiment is not limited to description of these Examples at all. Unless otherwise specified, “part” described below indicates “part by mass” and “%” indicates “% by mass”.

The raw material components used in each Example and each Comparative Example are shown below.
(Thermosetting resin (A))
Epoxy resin 1: Epoxy resin synthesized by the method described later 2: Orthocresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-1020-65)
Epoxy resin 3: orthocresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-1020-55)

(Curing agent (B))
Phenol resin-based curing agent 1: Phenol resin-based curing agent synthesized by the method described later 2: Novolac-type phenol resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-51714)
Phenol resin curing agent 3: novolak type phenol resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-HF-3)

(Inorganic filler (C))
Spherical silica 1 (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-950, average particle diameter D ₅₀ 23 μm)
Spherical silica 2 (manufactured by Denki Kagaku Kogyo Co., Ltd., FB-35, average particle diameter D ₅₀ 10 μm)
Alumina (manufactured by Micron, AW40-74, average particle size D ₅₀ 39 μm)

(Curing accelerator (D))
Triphenylphosphine (manufactured by Kay Kasei Co., Ltd., PP-360)

(Coupling agent (F))
Coupling agent 1: γ-aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBE-903)
Coupling agent 2: phenylaminopropyltrimethoxysilane (manufactured by Dow Corning Toray, CF4083)
Coupling agent 3: γ-glycidoxypropyltrimethoxysilane (manufactured by Chisso Corporation, GPS-M)
Coupling agent 4: γ-mercaptopropyltrimethoxysilane

(Other additives)
Mold release agent: Carnauba wax (Nikko Fine Co., Ltd., Nikko Carnauba)
Ion scavenger: Hydrotalcite (Kyowa Chemical Industry Co., Ltd., trade name DHT-4H)
Colorant: Carbon black (Mitsubishi Chemical Corporation MA600)
Flame retardant: Aluminum hydroxide (Sumitomo Chemical Co., Ltd., CL-303)
Triazole: 3-amino-1,2,4-triazole-5-thiol low stress agent: silicone resin (manufactured by Shin-Etsu Chemical Co., Ltd., KMP-594)

(Synthesis of phenol resin curing agent 1)
A separable flask was equipped with a stirrer, thermometer, reflux condenser, and nitrogen inlet, and 1,3-dihydroxybenzene (manufactured by Tokyo Chemical Industry Co., Ltd., “resorcinol”, melting point 111 ° C., molecular weight 110, purity 99. 4%) 360 parts by mass, phenol (special grade reagent manufactured by Kanto Chemical Co., Inc., “phenol”, melting point 41 ° C., molecular weight 94, purity 99.3%) 235 parts by mass, 4,4′-bis crushed in advance in a granular form Chloromethyl biphenyl (manufactured by Wako Pure Chemical Industries, Ltd., “4,4′-bischloromethylbiphenyl”, melting point 126 ° C., purity 95%, molecular weight 251) was weighed in 251 parts by mass in a separable flask and replaced with nitrogen. The mixture was heated, and stirring was started at the start of melting of phenol. Thereafter, the reaction was carried out for 3 hours while maintaining the system temperature in the range of 110 to 130 ° C., and then the reaction was carried out for 3 hours while maintaining the temperature in the range of 140 to 160 ° C. The hydrochloric acid gas generated in the system by the above reaction was discharged out of the system by a nitrogen stream.
After completion of the reaction, unreacted components were distilled off under reduced pressure conditions at 150 ° C. and 2 mmHg. Next, 400 parts by mass of toluene was added and dissolved uniformly, and then transferred to a separatory funnel, and after adding 150 parts by mass of distilled water and shaking, the operation of rinsing the aqueous layer (washing with water) was carried out with neutral water. Then, the oil layer is subjected to a reduced pressure treatment at 125 ° C. to distill off volatile components such as toluene and residual unreacted components, and the phenol resin curing agent 1 (polymer) represented by the following formula (12A) )

The phenol resin-based curing agent 1 had a hydroxyl group equivalent of 135 and an ICI viscosity at 150 ° C. of 4.7 dPa · s.
In addition, the number of repeating monovalent hydroxyphenylene structural units obtained by calculating the relative intensity ratio measured and analyzed by field desorption mass spectrometry (FD-MS) as a mass ratio. The average value k0 of k, the average value m0 of the repeating number m of the divalent hydroxyphenylene structural unit, and the ratio k0 / m0 were 1.20, 1.27, and 48.6 / 51.4, respectively. .

（式（１２Ａ）中、２つのＹは、それぞれ互いに独立して、下記式（１２Ｂ）または下記式（１２Ｃ）で表されるヒドロキシフェニル基を表し、Ｘは、下記式（１２Ｄ）または下記式（１２Ｅ）で表されるヒドロキシフェニレン基を表す。）

(In the formula (12A), two Y's each independently represent a hydroxyphenyl group represented by the following formula (12B) or the following formula (12C), and X represents the following formula (12D) or the following formula (It represents a hydroxyphenylene group represented by (12E).)

(Synthesis of epoxy resin 1)
A separable flask is equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen inlet, and 100 parts by mass of the aforementioned phenol resin curing agent 1 and 400 parts by mass of epichlorohydrin (manufactured by Tokyo Chemical Industry Co., Ltd.) are weighed at 100 ° C. Then, 60 parts by mass of sodium hydroxide (solid fine particle, purity 99% reagent) was gradually added over 4 hours, and the mixture was further reacted for 3 hours. Next, after adding 200 parts by mass of toluene and dissolving, 150 parts by mass of distilled water was added and shaken, and the operation of rinsing the aqueous layer (washing) was repeated until the washing water became neutral, and then the oil layer The epichlorohydrin was distilled off under reduced pressure conditions of 125 ° C. and 2 mmHg. 300 parts by mass of methyl isobutyl ketone was added to the obtained solid and dissolved, heated to 70 ° C., 13 parts by mass of a 30% by mass aqueous sodium hydroxide solution was added over 1 hour, and the reaction was further continued for 1 hour. The water layer was discarded. After adding 150 parts by mass of distilled water to the oil layer and performing a water washing operation, the same water washing operation was repeated until the washing water became neutral, and then methyl isobutyl ketone was distilled off by heating under reduced pressure, and the following formula (13A) The epoxy resin 1 (epoxy equivalent 190g / eq) containing the compound represented was obtained.

（式（１３Ａ）中、２つのＹは、それぞれ互いに独立して、下記式（１３Ｂ）または下記式（１３Ｃ）で表されるグリシジル化フェニル基を表し、Ｘは、下記式（１３Ｄ）または下記式（１３Ｅ）で表されるグリシジル化フェニレン基を表す。）

(In the formula (13A), two Y's each independently represent a glycidylated phenyl group represented by the following formula (13B) or the following formula (13C), and X represents the following formula (13D) or the following (This represents a glycidylated phenylene group represented by the formula (13E).)

In Examples 1 and 2 and Comparative Example 1, spherical silica 1 and spherical silica 2 (treated silica) previously subjected to silane coupling treatment were used as the inorganic filler (C). The silane coupling treatment was performed as follows.
First, spherical silica 1 and spherical silica 2 were each dried at 105 ° C. for 12 hours. Next, spherical silica 1 and spherical silica 2 were put into a mixer and stirred for 10 minutes. Subsequently, the mixture was stirred for 20 minutes while the coupling agent 1 was sprayed onto the mixture of the spherical silica 1 and the spherical silica 2. At this time, the time during which the coupling agent 1 was sprayed was about 10 minutes. The humidity in the mixer was 50% or less. Then, the silica and the coupling agent 1 were mixed by continuing stirring for 60 minutes. Subsequently, it was taken out from the mixer and aged for 7 days under the condition of 20 ± 5 ° C. It was then passed through a 200 mesh sieve to remove coarse particles. Thereby, the inorganic filler (C) to which the silane coupling process was given was obtained. Note that. A ribbon blender was used as the mixer. Moreover, the rotation speed of the ribbon blender was 30 rpm.
In addition, the process silica was mix | blended according to the compounding quantity shown in Table 1 for every Example and comparative example, respectively.

In Examples 2 and 3, and Comparative Example 2, spherical silica 1 and spherical silica 2 (untreated silica) not subjected to silane coupling treatment were used as the inorganic filler (C).
In addition, the untreated silica was blended according to the blending amount shown in Table 1 for each of Examples and Comparative Examples.

About each Example and each comparative example, what mix | blended each component according to the compounding quantity shown in Table 1 was mixed at normal temperature using the mixer, and the powdery intermediate body was obtained. The obtained powdery intermediate was loaded into an automatic supply device (hopper), and quantitatively supplied to a heating roll at 80 ° C. to 100 ° C. for melt kneading. Then, the resin composition for fixing was obtained by cooling and pulverizing. A tablet was obtained by tablet-molding the obtained fixing resin composition using a molding apparatus.
About the obtained resin composition for fixation, the measurement and evaluation regarding a filling characteristic and heat dissipation were performed. The evaluation results are shown in Table 1.

  As shown in Table 1, in Examples 1 to 3, the filling characteristics and heat dissipation were good. On the other hand, as shown in Table 1, in Comparative Example 1, good results in heat dissipation were not obtained. In Comparative Example 2, good results were not obtained in terms of heat dissipation and filling characteristics.

(Durability of rotor core)
The heat dissipation property of the fixing resin composition is an index representing the durability of the rotor core with repeated use. When a fixing member having high heat dissipation is used, a rotor core having good durability can be obtained.
As can be seen from Table 1, the fixing resin compositions of Examples 1 to 3 all showed good heat dissipation. Actually, the rotor core using the cured products of Examples 1 to 3 as the fixing member was excellent in long-term reliability as compared with the case of using the cured products of Comparative Examples 1 and 2.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

100 Rotor 110 Rotor core 112 Magnetic steel plate 116 Groove 118a End plate 118b End plate 120 Magnet 121 Side wall 123 Side wall 125 Side wall 127 Side wall 130 Fixing member 132 Slit filling member 140 Separating portion 150 Hole portion 151 Side wall 152 Slit 153 Side wall 154a Hole portion 154b Hole portion 155 Side wall 156 Hole 157 Side wall 160 Caulking part 170 Rotating shaft 200 Upper mold 210 Pot 220 Flow path

Claims (10)

A rotor core provided with holes;
A magnet inserted into the hole;
A fixing member provided at a separation portion between the hole and the magnet;
Equipped with a,
Before SL fixing member, a thermosetting resin containing an epoxy resin, made fixing resin composition containing a curing agent and an inorganic filler,
Content of the said inorganic filler is 50 mass% or more and 93 mass % or less with respect to 100 mass% of the total value of the said resin composition for fixation,
Wherein the maximum particle size of the inorganic filler and d1, when the width of the spacing portion between the magnet and the hole was W, W / d1 is Ri der 1.2 to 10,
W is a rotor which is 20 μm or more and 500 μm or less . The rotor according to claim 1, wherein
d1 is a rotor of 10 μm or more and 300 μm or less. The rotor according to claim 1 or 2,
The said fixing member is a rotor which is provided on the side wall located in the inner peripheral side of the said rotor core at least among the side walls of the said magnet, and fixes the said magnet. The rotor according to any one of claims 1 to 3,
The average particle size of the inorganic filler is a rotor of 1 μm or more and 100 μm or less. The rotor according to any one of claims 1 to 4,
The inorganic filler is a rotor that has been surface-treated with a first coupling agent. The rotor according to claim 5 , wherein
The first coupling agent is a rotor including primary aminosilane. The rotor according to any one of claims 1 to 6,
The fixing resin composition is a rotor including a second coupling agent containing secondary aminosilane or mercaptosilane. The rotor according to any one of claims 1 to 7,
The fixing resin composition is a rotor including a low stress agent. The rotor according to claim 8, wherein
The rotor whose content of the said low stress agent is 0.01 mass% or more and 3 mass% or less with respect to 100 mass% of the total value of the said resin composition for fixation. An automobile equipped with a motor comprising the rotor according to any one of claims 1 to 9 .

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