JP6248775B2 - Panel material - Google Patents

Description

  The present invention relates to a panel member that reduces sound and vibration.

  In transportation equipment such as automobiles, railway vehicles, ships, and airplanes, sound and vibration are generated due to various factors.

  For example, an engine or a motor that is a power source of an automobile generates large sound and vibration when driven. When this sound / vibration is transmitted to the passenger cabin, the passengers in the passenger cabin are uncomfortable. Therefore, it is important that a panel member (for example, a dash cross) that partitions the engine room or the motor room and the cabin has an excellent function of reducing sound and vibration.

  Therefore, conventionally, in order to suppress the transmission of sound and vibration as described above, a panel member having a configuration in which a metal patch panel is attached to a metal main panel via an adhesive layer has been developed. .

  For example, Patent Literature 1 discloses a metal sound-reducing laminate including a pair of high-rigidity layers and a sound-reducing material layer sandwiched between them. The metal sound-reducing laminate is used, for example, as an automotive part and attenuates sound and vibration energy. The sound reducing material layer includes, for example, one or more selected from a precipitation phase, a viscous layer, and an auxiliary component, and a polymer matrix. The sound-reducing material layer functions as an adhesive that attenuates sound and vibration energy and bonds a pair of high-rigid phases to each other.

  Further, for example, Patent Document 2 discloses a panel assembly including a main panel, a sound attenuating patch, and an adhesive layer that adheres the main panel and the sound attenuating patch. The sound attenuating patch includes a forming feature. The forming feature includes an opening, a hole, a slit, a protrusion, and a recess formed in the sound attenuating patch. The forming feature is provided to improve the formability of the panel assembly without significantly impairing the sound suppression characteristics of the panel assembly.

Special table 2008-539108 gazette Special table 2013-535030 gazette

  When manufacturing the conventional panel member as described above, first, a sheet-like adhesive is arranged on the main panel, and a patch panel is arranged on the adhesive. And it heats to the temperature (for example, 100-300 degreeC) which an adhesive agent fuse | melts, a main panel and a patch panel are pinched | interposed with a flat metal mold | die, and it presses. Thereby, the main panel and the patch panel are bonded via the adhesive, and the panel member is completed.

  In the panel member manufactured by such press bonding, residual stress is generated at the interface between the main panel and the adhesive and the interface between the patch panel and the adhesive. Due to the residual stress, the panel member may be deformed. In other words, a flat panel member may not be obtained.

  By the way, when using a panel member as structural members, such as transportation equipment, generally press molding is given to a panel member. At this time, if the panel member before press molding does not have a flat shape, a molding defect may occur during press molding.

  Moreover, when using a panel member as a structural member of transportation equipment, vibration accompanying an out-of-plane deformation occurs in the panel member during engine operation or the like. At this time, tensile stress and compressive stress repeatedly act on the adhesive between the patch panel and the main panel due to the inertial movement of the patch panel. Due to the action of the tensile stress, a crack may occur at the interface between the patch panel and the adhesive. In particular, when the above-mentioned residual stress is generated in the panel member, the residual stress is superimposed on the tensile stress, and the generation of cracks is promoted. Thereby, a patch panel may peel from a main panel.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a panel member that can suppress deformation after press bonding and suppress peeling of a patch panel.

  First, the inventors verified the deformation mode of the panel member after press bonding. 1A and 1B are diagrams showing a panel member 1 used for verifying a deformation mode, in which FIG. 1A is an external perspective view of the panel member 1, and FIG. 1B is a side view of the panel member 1.

  A panel member 1 shown in FIG. 1 includes a metal patch panel 2, an adhesive layer 3, and a metal main panel 4. The present inventors verified the deformation mode of the panel member 1 by changing the characteristics of the patch panel 2, the adhesive layer 3, and the main panel 4 in the panel member 1. As a result, as the difference in thermal expansion coefficient between the patch panel 2 and the adhesive layer 3 and the difference in thermal expansion coefficient between the main panel 4 and the adhesive layer 3 increase, the amount of deformation of the panel member 1 after press bonding increases. I found out that

  The present inventors considered the reason why the deformation amount of the panel member 1 becomes large as described above as follows. First, the patch panel 2, the adhesive layer 3, and the main panel 4 (hereinafter also referred to as each component) are heated to the same temperature during press bonding and then cooled to room temperature. During this cooling, each component contracts in proportion to the coefficient of thermal expansion. In general, since the adhesive has a larger thermal expansion coefficient than the metal, the shrinkage amount of the adhesive layer 3 is larger than that of the patch panel 2 and the main panel 4. For this reason, tensile stress is generated at the interface between the patch panel 2 and the adhesive layer 3 and at the interface between the main panel 4 and the adhesive layer 3 due to the difference in contraction amount of each component. Thereby, it is thought that the panel member 1 deform | transforms. When the difference in thermal expansion coefficient between the patch panel 2 and the adhesive layer 3 and the difference in thermal expansion coefficient between the main panel 4 and the adhesive layer 3 are increased, the difference in the shrinkage amount is also increased. It is considered that the amount of deformation of 1 also increases.

  Next, the inventors examined in detail the deformation behavior of the panel member 1 and the occurrence of cracks when the vibration was generated, using the panel member 1 having the above-described configuration. Specifically, as indicated by a dotted line in FIG. 1B, the present inventors caused the panel member 1 to vibrate with out-of-plane deformation. As a result, the following was found.

  FIG. 2 is a side view schematically showing the state of the patch panel 2, the adhesive layer 3, and the main panel 4 when the panel member 1 is vibrated. As described above, when vibration accompanied by out-of-plane deformation is generated in the panel member 1, compressive stress and tensile stress repeatedly act on the adhesive layer 3 due to the inertial movement of the patch panel 2. Since the Young's modulus of the adhesive layer 3 is lower than that of the patch panel 2 and the main panel 4, when a tensile stress is applied to the adhesive layer 3, the adhesive layer 3 is deformed to increase its thickness. At this time, as schematically shown in FIG. 2, the adhesive layer 3 was also deformed so as to shrink in a direction (lateral direction) perpendicular to the thickness direction. Along with these deformations, the interface 5 between the patch panel 2 and the adhesive layer 3 is bent toward the adhesive layer 3 as it approaches the end 5a. Further, although not as much as the interface 5, the interface 6 between the main panel 4 and the adhesive layer 3 is also bent toward the adhesive layer 3 as the end portion 6 a is approached. As a result of increasing the amplitude of out-of-plane deformation and repeatedly applying vibration to the panel member 1, a crack occurred from the interface 5 and the patch panel 2 was peeled off.

  The deformation at the interface 5 and the interface 6 increases as the difference in Young's modulus between the patch panel 2 and the main panel 4 and the adhesive layer 3 increases, and cracks at the interface 5 also occur earlier. On the other hand, when the difference in Young's modulus between the patch panel 2 and the adhesive layer 3 was small, a crack occurred from the interface 6 and the patch panel 2 was peeled off.

  Based on the above results, the present inventors further produced a panel member having a plurality of adhesive layers, and verified in detail the deformation of the panel member after press bonding and the peeling of the patch panel when vibration occurred. . As a result, it was found that by appropriately adjusting the Young's modulus of the plurality of adhesive layers, it is possible to suppress deformation of the panel member after press bonding and to suppress peeling of the patch panel.

  This invention is completed based on said knowledge, and makes a summary the following panel member.

(1) Provided with a metal patch panel, a metal main panel, and an adhesive part for bonding the patch panel and the main panel;
The adhesive portion includes a first adhesive layer in contact with the patch panel, and a second adhesive layer provided between the first adhesive layer and the main panel,
A panel member in which the thermal expansion coefficient and Young's modulus of the first adhesive layer and the second adhesive layer satisfy the following formulas (i) and (ii).
α1 <α2 (i)
E1> E2 (ii)
However, in Formula (i), α1 means the thermal expansion coefficient of the first adhesive layer, and α2 means the thermal expansion coefficient of the second adhesive layer. In the formula (ii), E1 means the Young's modulus of the first adhesive layer, and E2 means the Young's modulus of the second adhesive layer.

  (2) The panel member according to (1), wherein the second adhesive layer is in contact with the first adhesive layer.

  (3) The panel member according to (1) or (2), wherein the second adhesive layer is in contact with the main panel.

(4) The adhesive portion further includes a third adhesive layer provided between the second adhesive layer and the main panel,
The thermal expansion coefficient and Young's modulus of the first adhesive layer, the second adhesive layer, and the third adhesive layer satisfy the following formulas (iii) and (iv), (1) or (2 ) Panel member.
α2> max (α1, α3) (iii)
E2 <min (E1, E3) (iv)
However, in formula (iii), α3 means the thermal expansion coefficient of the third adhesive layer, and max (α1, α3) means the larger value of α1 and α3. In the formula (iv), E3 means the Young's modulus of the third adhesive layer, and min (E1, E3) means the smaller value of E1 and E3.

  (5) The panel member according to (4), wherein the third adhesive layer is in contact with the second adhesive layer.

  (6) The panel member according to (4) or (5), wherein the third adhesive layer is in contact with the main panel.

  ADVANTAGE OF THE INVENTION According to this invention, the panel member which can suppress the deformation | transformation after press bonding and can suppress peeling of a patch panel is obtained.

It is a figure which shows the panel member used for verification of a deformation | transformation aspect, (a) is an external appearance perspective view of a panel member, (b) is a side view of a panel member The side view which showed typically the state of the main panel at the time of producing a vibration in the panel member of FIG. 1, an adhesive bond layer, and a patch panel The side view which shows the panel member of 1st Embodiment of this invention. The side view which shows the panel member of 2nd Embodiment of this invention. It is a figure which shows a fatigue test piece, (a) is a top view of a fatigue test piece, (b) is a side view of a fatigue test piece

(First embodiment)
FIG. 3 is a side view showing the panel member 10 according to the first embodiment of the present invention. As shown in FIG. 3, the panel member 10 includes a patch panel 12, an adhesive portion 14, and a main panel 16. The patch panel 12 and the main panel 16 are bonded to each other via the bonding portion 14. Note that the shapes of the patch panel 12, the bonding portion 14, and the main panel 16 are determined depending on the usage environment and application of the panel member 10. For example, the patch panel 12, the bonding portion 14, and the main panel 16 may be formed in a rectangular shape in plan view like the panel member 1 of FIG. 1.

  The panel member 10 is used, for example, as a component member of a transportation device after being subjected to a molding process (press molding or the like). More specifically, the panel member 10 is processed into a dash panel of an automobile, for example, in an automobile manufacturing factory.

  The adhesion part 14 includes a plurality of adhesive layers. In the present embodiment, the adhesive portion 14 includes a first adhesive layer 14a and a second adhesive layer 14b (hereinafter abbreviated as a first layer 14a and a second layer 14b, respectively). The first layer 14 a is in contact with the patch panel 12. The second layer 14 b is provided between the first layer 14 a and the main panel 16. In the present embodiment, the second layer 14 b is in contact with the first layer 14 a and the main panel 16. In other words, in the present embodiment, the second layer 14b, the first layer 14a, and the patch panel 12 are sequentially laminated on the main panel 16.

  The thickness of the patch panel 12 is, for example, 0.5 to 3.2 mm, and preferably 0.7 to 2.3 mm. The thickness of the first layer 14a is, for example, 0.02 to 1.0 mm, and preferably 0.03 to 0.5 mm. The thickness of the second layer 14b is, for example, 0.02 to 1.0 mm, and preferably 0.03 to 0.5 mm. The thickness of the main panel 16 is, for example, 0.5 to 2.0 mm, and preferably 0.5 to 1.5 mm.

  As the patch panel 12 and the main panel 16, various metal plates (for example, steel plates, aluminum plates, aluminum alloy plates, titanium plates, titanium alloy plates, magnesium plates, or magnesium alloy plates) can be used. The first layer 14a and the second layer 14b are made of, for example, a resin adhesive (acrylic resin, epoxy resin, rubber resin, polyurethane resin, polyester resin, or the like). The thermal expansion coefficients of the first layer 14a and the second layer 14b are larger than the thermal expansion coefficients of the patch panel 12 and the main panel 16, and the Young's modulus of the first layer 14a and the second layer 14b is the patch panel 12 and the main panel. Lower than the Young's modulus of 16.

  The panel member 10 can be manufactured as follows, for example. First, the second layer 14 b and the first layer 14 a are formed on the upper surface of the main panel 16. The second layer 14b and the first layer 14a can be formed by attaching an adhesive sheet to the main panel 16, for example. Thereafter, the patch panel 12 is placed on the first layer 14a and heated to the glass transition temperature or higher of the adhesive used as the adhesive portion 14. In a heated state, the patch panel 12 and the main panel 16 are pressed against each other using a mold. That is, the patch panel 12 and the main panel 16 are press bonded. Finally, the patch panel 12, the bonding portion 14, and the main panel 16 are cooled.

In the present embodiment, materials for the first layer 14a and the second layer 14b are appropriately selected so as to satisfy the following expressions (i) and (ii).
α1 <α2 (i)
E1> E2 (ii)
However, in formula (i), α1 means the thermal expansion coefficient of the first layer 14a, and α2 means the thermal expansion coefficient of the second layer 14b. In the formula (ii), E1 means the Young's modulus of the first layer 14a, and E2 means the Young's modulus of the second layer 14b.

  As described above, the thermal expansion coefficient of the first layer 14a is larger than the thermal expansion coefficient of the metal patch panel 12. When the difference in thermal expansion coefficient between the first layer 14a and the patch panel 12 is large, the difference in contraction amount between the first layer 14a and the patch panel 12 becomes large when the panel member 10 is cooled. However, when the thermal expansion coefficients α1 and α2 satisfy the formula (i), that is, when the thermal expansion coefficient of the first layer 14a is small, the difference between the thermal expansion coefficients of the first layer 14a and the patch panel 12 can be reduced. . Thereby, at the time of cooling of the panel member 10 after press bonding, the difference in shrinkage amount between the first layer 14a and the patch panel 12 can be reduced. As a result, in the panel member 10 after press bonding, the residual stress generated in the vicinity of the interface 18 between the first layer 14a and the patch panel 12 can be reduced. Thereby, the deformation | transformation of the panel member 10 after press bonding can be suppressed.

  As described above, the Young's modulus of the first layer 14a is lower than the Young's modulus of the metal patch panel 12. When the difference in Young's modulus between the first layer 14a and the patch panel 12 is large, the difference in deformation amount between the first layer 14a and the patch panel 12 is large when vibration accompanied by out-of-plane deformation occurs in the panel member 10. Become. Thereby, the bending of the interface 18 between the first layer 14a and the patch panel 12 is increased. However, when the Young's moduli E1 and E2 satisfy the equation (ii), that is, when the Young's modulus of the first layer 14a is high, the difference in Young's modulus between the first layer 14a and the patch panel 12 can be reduced. Thereby, when the vibration accompanying an out-of-plane deformation | transformation generate | occur | produces in the panel member 10, it can prevent that the difference of the deformation amount of the 1st layer 14a and the patch panel 12 becomes large. As a result, bending of the interface 18 between the first layer 14a and the patch panel 12 can be suppressed. Moreover, in this embodiment, generation | occurrence | production of the residual stress in the interface 18 vicinity is suppressed as mentioned above. Thereby, even if a tensile stress acts on the first layer 14a due to the inertial movement of the patch panel 12 due to vibration, it is possible to prevent a large superimposed stress (sum of tensile stress and residual stress) from being generated in the vicinity of the interface 18. As a result, the occurrence of cracks at the interface 18 can be suppressed, and the peeling of the patch panel 12 can be suppressed.

  In the panel member 10, a second layer 14b having a Young's modulus lower than that of the first layer 14a is provided on the main panel 16 side of the bonding portion 14 relative to the first layer 14a. Thereby, the average Young's modulus (in this embodiment, the average value of the Young's modulus of the 1st layer 14a and the 2nd layer 14b) of the adhesion part 14 can be made low, and the vibration produced in the panel member 10 is fully attenuated. Can be made. That is, in the panel member 10, the vibration of the panel member 10 can be suppressed by the second layer 14b while preventing the patch panel 12 from being peeled by the first layer 14a.

(Second Embodiment)
FIG. 4 is a side view showing the panel member 20 according to the second embodiment of the present invention. The panel member 20 is different from the above-described panel member 10 in that an adhesive portion 22 is provided instead of the adhesive portion 14. The adhesive portion 22 is different from the adhesive portion 14 in that instead of the first layer 14a and the second layer 14b, a first adhesive layer 22a, a second adhesive layer 22b, and a third adhesive layer 22c (hereinafter, respectively, Abbreviated as a first layer 22a, a second layer 22b, and a third layer 22c).

  The first layer 22a is in contact with the patch panel 12. The third layer 22 c is in contact with the main panel 16. The second layer 22b is provided between the first layer 22a and the third layer 22c. The second layer 22b is in contact with the first layer 22a and the third layer 22c. That is, in the present embodiment, the third layer 22c, the second layer 22b, the first layer 22a, and the patch panel 12 are laminated on the main panel 16 in this order.

  In addition, as the first layer 22a, the second layer 22b, and the third layer 22c, for example, the same material as that of the first layer 14a and the second layer 14b described above can be used. Moreover, the panel member 20 can be manufactured by the method similar to the above-mentioned panel member 10, for example. In the present embodiment, the thermal expansion coefficients of the first layer 22a, the second layer 22b, and the third layer 22c are larger than those of the patch panel 12 and the main panel 16, and the first layer 22a, the second layer 22b, and The Young's modulus of the third layer 22c is lower than the Young's modulus of the patch panel 12 and the main panel 16.

  In the panel member 20, the thickness of the 1st layer 22a is 0.02-1.0 mm, for example, and it is preferable that it is 0.03-0.5 mm. The thickness of the second layer 22b is, for example, 0.02 to 1.0 mm, and preferably 0.03 to 0.5 mm. The thickness of the third layer 22c is, for example, 0.03 to 1.0 mm, and preferably 0.03 to 0.5 mm.

In the present embodiment, materials for the first layer 22a, the second layer 22b, and the third layer 22c are appropriately selected so as to satisfy the following expressions (iii) and (iv).
α2> max (α1, α3) (iii)
E2 <min (E1, E3) (iv)
However, in the formula (iii), α3 means the thermal expansion coefficient of the third layer 22c, and max (α1, α3) means the larger value of α1 and α3. In the formula (iv), E3 means the Young's modulus of the third layer 22c, and min (E1, E3) means the smaller value of E1 and E3.

  As described above, the thermal expansion coefficients of the first layer 22 a and the third layer 22 c are larger than the thermal expansion coefficients of the patch panel 12 and the main panel 16. When the difference between the thermal expansion coefficients of the first layer 22a and the patch panel 12 is large, the difference in contraction amount between the first layer 14a and the patch panel 12 becomes large when the panel member 20 is cooled. Similarly, when the difference in thermal expansion coefficient between the third layer 22c and the main panel 16 is large, the difference in contraction amount between the third layer 22c and the main panel 16 increases when the panel member 20 is cooled.

  However, when the thermal expansion coefficients α1, α2, and α3 satisfy the formula (iii), that is, when the thermal expansion coefficients of the first layer 22a and the third layer 22c are small, the first layer 22a and the patch panel 12 The difference in thermal expansion coefficient and the difference in thermal expansion coefficient between the third layer 22c and the main panel 16 can be reduced. Thereby, at the time of cooling of the panel member 20 after press bonding, the difference in shrinkage between the first layer 22a and the patch panel 12 and the difference in shrinkage between the third layer 22c and the main panel 16 can be reduced. As a result, in the panel member 20 after press bonding, residual stress generated near the interface 24 between the first layer 22a and the patch panel 12 and residual stress generated near the interface 26 between the third layer 22c and the main panel 16 are generated. Can be small. Thereby, the deformation | transformation of the panel member 20 after press bonding can be suppressed.

  As described above, the Young's modulus of the first layer 22a and the third layer 22c is lower than the Young's modulus of the patch panel 12 and the main panel 16. When the difference in Young's modulus between the first layer 22a and the patch panel 12 is large, the difference in deformation amount between the first layer 22a and the patch panel 12 is large when vibration accompanied by out-of-plane deformation occurs in the panel member 20. Become. Thereby, the bending of the interface 24 between the first layer 22a and the patch panel 12 increases. Similarly, when the difference in Young's modulus between the third layer 22c and the main panel 16 is large, the amount of deformation of the third layer 22c and the main panel 16 when the panel member 20 undergoes vibration accompanied by out-of-plane deformation. The difference increases. Thereby, the bending of the interface 26 between the third layer 22c and the main panel 16 is increased.

  However, when the Young's modulus E1, E2, E3 satisfies the formula (iv), that is, when the Young's modulus of the first layer 22a and the third layer 22c is high, the Young's modulus between the first layer 22a and the patch panel 12 is And the difference in Young's modulus between the third layer 22c and the main panel 16 can be reduced. Thereby, when vibration accompanied by out-of-plane deformation occurs in the panel member 20, the difference in deformation amount between the first layer 22a and the patch panel 12 and the difference in deformation amount between the third layer 22c and the main panel 16 are large. Can be prevented. As a result, the deflection of the interfaces 24 and 26 can be suppressed. Moreover, in this embodiment, generation | occurrence | production of the residual stress in the interface 24 and 26 vicinity is suppressed as mentioned above. As a result, even if tensile stress acts on the first layer 22a and the third layer 22c due to the inertial movement of the patch panel 12 due to vibration, a large superimposed stress (sum of tensile stress and residual stress) is generated in the vicinity of the interfaces 24 and 26. It can be prevented from occurring. As a result, the generation of cracks at the interfaces 24 and 26 can be suppressed, and the peeling of the patch panel 12 can be suppressed.

  In the panel member 20, a second layer 22b having a Young's modulus lower than that of the first layer 22a and the third layer 22c is provided between the first layer 22a and the third layer 22c in the bonding portion 22. Thereby, the average Young's modulus (in this embodiment, the average value of the Young's modulus of the 1st layer 22a, the 2nd layer 22b, and the 3rd layer 22c) of adhesion part 22 can be made low, and it occurred in panel member 20 Vibration can be sufficiently damped. That is, in the panel member 20, the vibration of the panel member 20 can be suppressed by the second layer 22b while preventing the peeling of the patch panel 12 by the first layer 22a and the third layer 22c.

(Other embodiments)
In this invention, what is necessary is just to have the 1st adhesive bond layer and 2nd adhesive bond layer which satisfy | fill at least said Formula (i) and Formula (ii), and the structure of an adhesion part is not limited to the above-mentioned example. For example, in the panel member 10 described above, one or more other adhesive layers may be further provided between the first layer 14 a and the second layer 14 b, and between the second layer 14 b and the main panel 16. One or more other adhesive layers may be further provided. For example, in the panel member 20 described above, one or more other adhesive layers may be further provided between the first layer 22a and the second layer 22b, and between the second layer 22b and the third layer 22c. One or a plurality of other adhesive layers may be further provided, and another one or a plurality of adhesive layers may be further provided between the third layer 22 c and the main panel 16.

  Further, for example, in the case where the adhesive portion is composed of three layers as in the second embodiment, the thermal expansion coefficient and the Young's modulus of the third adhesive layer (the layer in contact with the main panel) are as described above. The formulas (iii) and (iv) may not be satisfied.

  In the above-described embodiment, the case where the entire bonding portion is configured by a plurality of adhesive layers has been described. However, the configuration of the bonding portion is not limited to the above-described example. For example, a plurality of adhesive layers may be provided so as to satisfy the requirements of the present invention only in the portion where the peeling of the patch panel is particularly likely to occur. Specifically, for example, an adhesive portion is constituted by a plurality of adhesive layers only in the vicinity of the corner portion of the patch panel 12, and one adhesive layer (that is, a single layer adhesive) is formed in a portion other than the vicinity of the corner portion. The adhesive portion may be constituted by an agent.

  EXAMPLES Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to these Examples.

  In Example 1, by changing the characteristics of the patch panel, the main panel, and the adhesive portion, a plurality of panel members according to claim 1 (hereinafter also referred to as the present invention example) and a plurality of panel members of comparative examples were produced by the manufacturing method described above. . And the fatigue test piece of the shape and dimension shown in FIG. 5 was extract | collected from each panel member. In addition, although illustration is abbreviate | omitted, in the fatigue test piece of FIG. 5, the front-end | tip part (right end part in FIG. 5) of the main panel is joined to the lower surface of the patch panel by welding etc. By repeatedly applying a load to the collected test piece, vibration (frequency: 25 Hz) accompanied by out-of-plane deformation was generated, and the number of repetitions until the peeling of the patch panel occurred was obtained.

  Table 1 below shows the results of the above fatigue test together with the configurations of the panel members of the present invention and the comparative examples. In addition, Test No. The panel member of the comparative example used in 1 and 6 has an adhesive portion composed of one adhesive layer. The number of repetitions shown in Table 1 is the test number. For Nos. 1 to 5, test no. No. 1 is a value made dimensionless by dividing by the number of repetitions of the fatigue test piece. For Test Nos. 6-10, Test No. It is a value made dimensionless by dividing by the number of repetitions of 6 fatigue test pieces.

  As is apparent from Table 1, the number of repetitions until the peeling of the patch panel is clearly increased in the test piece satisfying the requirements of the present invention, compared to the test piece of the comparative example not satisfying the requirements of the present invention. did. From the above, it can be seen that the panel member of the present invention can sufficiently prevent the peeling of the patch panel.

  In Example 2, by changing the characteristics of the patch panel, the main panel, and the adhesive portion, a plurality of panel members according to claims 1 and 3 (hereinafter also referred to as examples of the present invention) and a plurality of panel members according to comparative examples are manufactured by the manufacturing method described above. Produced. And the fatigue test piece of the shape and dimension shown in FIG. 5 was extract | collected from each panel member similarly to the said Example 1. FIG. By repeatedly applying a load to the collected test piece, vibration (frequency: 25 Hz) accompanied by out-of-plane deformation was generated, and the number of repetitions until the peeling of the patch panel occurred was obtained.

  Table 2 below shows the fatigue test results together with the configurations of the panel members of the present invention and the comparative examples. In addition, Test No. The panel member of the present invention example used in 14, 15 and 21 satisfies the requirements of claim 4. On the other hand, test no. The panel member of the example of the present invention used in No. 20 satisfies the requirement of Claim 1, but does not satisfy the requirement of Claim 4. Test No. The panel member of the comparative example used in 11 and 16 has an adhesive portion composed of one adhesive layer. The number of repetitions shown in Table 2 is the test number. For Nos. 11-15, test no. No. 11 is a value made dimensionless by dividing by the number of repetitions of the fatigue test piece. For Nos. 16-21, test no. It is a value made dimensionless by dividing by the number of repetitions of 16 fatigue test pieces.

  As is apparent from Table 2, the number of repetitions until the peeling of the patch panel is clearly increased in the test piece satisfying the requirements of the present invention, compared with the test piece of the comparative example not satisfying the requirements of the present invention. did. In particular, it has been found that the panel member satisfying the requirements of claim 4 can sufficiently prevent the peeling of the patch panel.

  ADVANTAGE OF THE INVENTION According to this invention, the panel member which can suppress the deformation | transformation after press bonding and can suppress peeling of a patch panel is obtained. Therefore, the panel member of this invention can be utilized suitably as a structural member of various transport equipment.

1, 10, 20 Panel member 2, 12 Patch panel 3 Adhesive layer 4, 16 Main panel 5, 6 Interface 5a, 6a End portion 14, 22 Adhesive portion 14a, 22a First adhesive layer 14b, 22b Second adhesive Layers 18, 24, 26 Interface 22c Third adhesive layer

Claims (6)

A metal patch panel, a metal main panel, and an adhesive portion for bonding the patch panel and the main panel;
The adhesive portion includes a first adhesive layer in contact with the patch panel, and a second adhesive layer provided between the first adhesive layer and the main panel,
A panel member in which the thermal expansion coefficient and Young's modulus of the first adhesive layer and the second adhesive layer satisfy the following formulas (i) and (ii).
α1 <α2 (i)
E1> E2 (ii)
However, in Formula (i), α1 means the thermal expansion coefficient of the first adhesive layer, and α2 means the thermal expansion coefficient of the second adhesive layer. In the formula (ii), E1 means the Young's modulus of the first adhesive layer, and E2 means the Young's modulus of the second adhesive layer.   The panel member according to claim 1, wherein the second adhesive layer is in contact with the first adhesive layer.   The panel member according to claim 1, wherein the second adhesive layer is in contact with the main panel. The adhesive portion further includes a third adhesive layer provided between the second adhesive layer and the main panel,
The thermal expansion coefficient and Young's modulus of the first adhesive layer, the second adhesive layer, and the third adhesive layer satisfy the following formulas (iii) and (iv), respectively. Panel member.
α2> max (α1, α3) (iii)
E2 <min (E1, E3) (iv)
However, in formula (iii), α3 means the thermal expansion coefficient of the third adhesive layer, and max (α1, α3) means the larger value of α1 and α3. In the formula (iv), E3 means the Young's modulus of the third adhesive layer, and min (E1, E3) means the smaller value of E1 and E3.   The panel member according to claim 4, wherein the third adhesive layer is in contact with the second adhesive layer.   The panel member according to claim 4 or 5, wherein the third adhesive layer is in contact with the main panel.

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