JP6229475B2 - Electro-optical device and electronic apparatus - Google Patents

Description

  The present invention relates to an electro-optical device and an electronic apparatus equipped with the electro-optical device.

  A micro display having a display area of less than 1 inch is used in a display part of a head cape display or an electronic viewfinder. An organic electroluminescence (hereinafter referred to as organic EL) display device is a self-luminous display device and does not require a backlight as a light source compared to a non-light-emitting display device such as a liquid crystal display device. It is excellent in weight reduction and is suitable for a display part of a head cloak display or an electronic viewfinder.

  The organic EL display device includes an organic EL element as a light emitting element, a drive circuit for driving the organic EL element, and the like. The organic EL element includes an anode, a cathode, and a light emitting functional layer sandwiched between these electrodes. When a current is passed between the anode and the cathode, the light emitting functional layer emits light.

  The organic EL element generates heat due to a current flowing between the anode and the cathode. Since the drive circuit controls the whole of the current flowing through the plurality of organic EL elements, a larger current flows and generates larger heat than the single organic EL element. For example, when the temperature of the light emitting functional layer rises due to the heat generation of the organic EL element or the drive circuit, the deterioration of the light emitting functional layer is accelerated. Suppressing heat dissipation is important.

  For example, Patent Document 1 proposes an electro-optical panel (electro-optical device) having a heat radiating portion (heat sink) that radiates heat generated in the electro-optical panel to the outside. The heat sink is a heat radiating fin formed to have a large surface area with a material having high thermal conductivity, and can efficiently dissipate heat generated in the electro-optical device to the outside.

JP 2010-256654 A

  However, in the heat sink of Patent Document 1, it is necessary to increase the volume and surface area of the heat sink in order to efficiently dissipate the heat generated in the electro-optical device. Therefore, the heat sink of patent document 1 had the subject that it was not suitable for the heat dissipation of the micro display by which thickness reduction (compactness) and weight reduction were requested | required. Further, it is difficult to reduce the thickness and weight of small, medium, and large display devices.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electro-optical device according to this application example includes a panel having a pixel and a drive circuit that drives the pixel, and a printed circuit board fixed to the panel with a first heat conductive adhesive. The printed circuit board is fixed to the support by a second heat conductive adhesive on the side opposite to the side on which the panel is fixed.

  The panel is fixed to the printed circuit board with a first thermally conductive adhesive. The printed circuit board is fixed to the support by a second heat conductive adhesive on the side opposite to the side on which the panel is fixed. The heat generated by the pixels and the drive circuit (heat generated by the panel) passes through the first heat conductive adhesive, the printed circuit board, and the second heat conductive adhesive to the support side. Propagated. Since the first thermally conductive adhesive and the second thermally conductive adhesive are adhesives that easily propagate heat, the heat generated by the panel is quickly and efficiently propagated to the side of the support, Heat can be radiated from the support.

  Application Example 2 In the electro-optical device according to the application example described above, the printed circuit board has a multilayer structure in which insulating layers and conductive layers are alternately stacked, and the printed circuit board is fixed to the panel. A heat conductive pattern formed by the conductive layer sandwiched between the insulating layers, and a first exposed portion that exposes a part of the heat conductive pattern, and the panel; It is preferable that the part of the heat conductive pattern exposed at the exposed portion is fixed by the first heat conductive adhesive.

  The printed circuit board has a multilayer structure in which insulating layers and conductive layers are alternately stacked. The heat conduction pattern is formed of a conductive layer sandwiched between insulating layers. In the part which fixes a panel, since the heat conductive pattern is exposed by the 1st exposed part, a panel can be directly fixed to a heat conductive pattern with a 1st heat conductive adhesive. Therefore, the heat generated in the panel can be quickly and efficiently propagated to the printed circuit board side by the heat conduction pattern.

  Application Example 3 In the electro-optical device according to the application example described above, the printed circuit board has a multilayer structure in which insulating layers and conductive layers are alternately stacked, and the printed circuit board has a surface on the panel side. A heat conduction pattern is formed by the disposed conductive layer so as to overlap a portion fixed to the panel, and the panel and the heat conduction pattern are fixed by the first heat conductive adhesive. Is preferred.

  Since the printed circuit board has a multilayer structure in which insulating layers and conductive layers are alternately stacked, and the heat conduction pattern is formed of a conductive layer on the surface of the printed circuit board panel side, the first heat conduction The panel can be directly fixed to the heat conductive pattern by the adhesive. Therefore, the heat generated in the panel can be quickly and efficiently propagated to the printed circuit board side by the heat conduction pattern.

  Application Example 4 In the electro-optical device according to the application example described above, a second exposed portion that exposes a part of the heat conductive pattern is formed on the printed board at a portion fixed to the support. The support and the part of the heat conductive pattern exposed at the second exposed portion are preferably fixed by the second heat conductive adhesive.

  Since the heat conductive pattern is exposed by the second exposed portion at the portion to be fixed to the support, the heat conductive pattern can be directly fixed to the support by the second heat conductive adhesive. Therefore, the heat propagated from the panel to the printed board side can be quickly and efficiently propagated to the support side through the heat conduction pattern formed on the printed board.

  Application Example 5 In the electro-optical device according to the application example described above, a surface of the printed circuit board is covered with a solder resist, and the solder resist has a portion that is fixed to the panel, the first exposed portion. It is preferable that a third exposed portion for exposing is formed.

  The conductive layer provided on the surface of the printed circuit board is protected by a solder resist. Further, the solder resist has a third exposed portion that exposes the first exposed portion at a portion where the panel is fixed to the printed circuit board. Therefore, the heat conductive pattern is exposed by the first exposed portion and the third exposed portion, and the panel can be directly fixed to the heat conductive pattern by the first heat conductive adhesive. Therefore, the heat generated in the panel can be quickly and efficiently propagated to the printed circuit board side by the heat conduction pattern.

  Application Example 6 In the electro-optical device according to the application example described above, the surface of the printed circuit board is covered with a solder resist, and the second exposure is performed on a part of the solder resist that is fixed to the support. It is preferable that the 4th exposed part which exposes a part is formed.

  The conductive layer provided on the surface of the printed circuit board is protected by a solder resist. Furthermore, the 4th exposed part which exposes a 2nd exposed part is formed in the site | part to which a printed circuit board is fixed to a support body in a soldering resist. Therefore, the heat conductive pattern is exposed by the second exposed portion and the fourth exposed portion, and the heat conductive pattern can be directly fixed to the support by the second heat conductive adhesive. Therefore, the heat transmitted to the printed circuit board can be quickly and efficiently transmitted to the side of the support by the heat conduction pattern formed on the printed circuit board.

  Application Example 7 In the electro-optical device according to the application example described above, it is preferable that the potential of the heat conduction pattern is a ground potential or a floating state.

  Since the potential of the heat conduction pattern is in the ground potential or floating state, even if the heat conduction pattern and the panel are in contact with each other, electrical damage to the panel is suppressed.

  Application Example 8 In the electro-optical device according to the application example, the thermal conductivity of the first thermal conductive adhesive and the thermal conductivity of the second thermal conductive adhesive are 0.5 W / It is preferably larger than m · K or 0.5 W / m · K.

  The thermal conductivity of the first thermal conductive adhesive and the thermal conductivity of the second thermal conductive adhesive are 0.5 W / m · K, or greater than 0.5 W / m · K. The heat conductive adhesive and the second heat conductive adhesive are excellent in heat conductivity and easily propagate heat. Therefore, the heat generated by the panel can be quickly and efficiently passed through the first thermally conductive adhesive that easily propagates heat, the printed circuit board, and the second thermally conductive adhesive that easily propagates heat. It can propagate to the support side.

  Application Example 9 In the electro-optical device according to the application example described above, it is preferable that the thermal conductivity of the support is 1 W / m · K or greater than 1 W / m · K.

  The thermal conductivity of the support is greater than 1 W / m · K or 1 W / m · K, and the support is excellent in thermal conductivity. Therefore, heat is easily propagated to the support, and heat is easily propagated from the support to other elements (for example, the atmosphere). Therefore, the heat generated by the panel is easily transmitted to the support, and the heat transmitted to the support (heat generated from the panel) is easily radiated from the support.

  Furthermore, by using the exterior member (housing) of the electronic device also as the support, the entire housing of the electronic device can be used as a heat radiating portion, so that heat generated in the panel can be quickly and efficiently generated. It can dissipate heat. Further, by utilizing the housing of the electronic device as a support (heat radiating portion) of the electro-optical device, a configuration in which a heat radiating portion is formed separately from the housing of the electronic device, for example, known technology Compared with the electro-optical device of Japanese Patent Application Laid-Open No. 2010-256654, the electronic apparatus can be made thinner (compact) and lighter.

  Application Example 10 In the electro-optical device according to the application example described above, it is preferable that at least one circuit component is mounted on the printed board on the side opposite to the side on which the panel is fixed.

  Since the circuit component is mounted on the side opposite to the side on which the panel of the printed board is fixed, the electro-optical device can be made compact.

  Application Example 11 In the electro-optical device according to the application example described above, the support has a protrusion that bulges in a direction from the panel toward the circuit component at a portion overlapping with at least one of the circuit components. It is preferable to have a part or an opening.

The circuit component protrudes from the surface of the printed circuit board in the direction from the panel to the circuit component. For this reason, since it is necessary to separate the support from the printed circuit board so that the circuit component and the support do not come into contact with each other, the dimension in the direction from the panel of the electro-optical device toward the circuit component increases.
When a convex part or an opening is provided in the support, and the circuit component is disposed in the convex part or in the opening, the circuit part is arranged from the panel of the electro-optical device as compared with a configuration in which the convex part or the opening is not provided in the support. It is possible to reduce the size in the direction toward. Therefore, the electro-optical device can be thinned.

  Application Example 12 In the electro-optical device according to the application example described above, it is preferable that the panel is mounted on the printed board by wire bonding.

  The panel is mounted on the printed circuit board by wire bonding. For example, the resistance (contact resistance) of the mounting portion can be reduced as compared with a method of mounting a panel using a connector or a flexible printed board. Accordingly, it is possible to suppress the rounding of the signal supplied to the panel and the delay of the signal, and improve the display quality of the panel.

  Application Example 13 In the electro-optical device according to the application example, the panel includes a semiconductor substrate, and the semiconductor substrate is fixed to the printed circuit board with the first thermal conductive adhesive. Is preferred.

  For example, a semiconductor substrate such as silicon is excellent in thermal conductivity. By constructing the panel with a semiconductor substrate with excellent thermal conductivity and fixing it to the printed circuit board with the first thermal conductive adhesive with excellent thermal conductivity, the heat generated in the panel is excellent in thermal conductivity. It can propagate to the printed circuit board side quickly and efficiently via the semiconductor substrate and the first heat conductive adhesive having excellent heat conductivity.

  Application Example 14 In the electro-optical device according to the application example described above, it is preferable that an organic electroluminescence element is formed in the pixel.

  Since an electro-optical device having an organic electroluminescence element is a self-luminous display device, it does not require a backlight as a light source, and thus is excellent in thickness reduction (compactness) and weight reduction compared to a non-light-emitting display device. . The heat generated by the organic electroluminescence element and the drive circuit is transferred to the support side through the first heat conductive adhesive, the heat conductive pattern (printed circuit board), and the second heat conductive adhesive. Propagated and dissipated quickly and efficiently by the support. Therefore, the influence of heat generated by the organic electroluminescence element or the drive circuit is suppressed, and the temperature rise of the organic electroluminescence element is reduced. Therefore, it is possible to suppress the problem that the deterioration of the organic electroluminescence element is accelerated by the temperature rise.

  Application Example 15 In the electro-optical device according to the application example described above, it is preferable that the panel is a micro display for an electronic viewfinder or a micro display for a head mounted display.

  The electro-optical device uses a housing of an electronic device (for example, a head-mounted display) as a support (heat dissipation unit) of the electro-optical device, so that a heat dissipation unit is provided separately from the case of the electronic device. Compared with the formed configuration, for example, an electro-optical device of a known technique (Japanese Patent Laid-Open No. 2010-256654), the electronic apparatus can be made thinner (compact) and lighter. Therefore, the electro-optical device is suitable for a micro display for an electronic viewfinder or a micro display for a head mounted display, which is required to be thin (compact) and light.

  Application Example 16 Electronic equipment according to this application example includes the electro-optical device according to the application example.

  In the electro-optical device described in the application example, heat generated by the panel is quickly and efficiently dissipated, and adverse effects of the heat are suppressed, and an electro-optical device according to a known technique (Japanese Patent Laid-Open No. 2010-256654) Compared to a thinner (compact) and lighter weight, it has a configuration that is suitable. Therefore, by applying the electro-optical device to the electronic apparatus according to this application example, the electronic apparatus can be reduced in thickness (compact) and reduced in weight. For example, by applying the electro-optical device to the display part of electronic devices such as head-mounted displays, digital cameras, personal computers, portable information terminals, navigators, viewers, head-up displays, etc., it is thinner (compact) and lighter It is possible to realize an electronic device that is excellent in efficiency.

1 is a schematic diagram illustrating a configuration of a virtual image display device according to Embodiment 1. FIG. Schematic which shows the structure of a 1st display apparatus. FIG. 3 is a schematic sectional view of a region B surrounded by a broken line in FIG. 2. The schematic plan view of the surface by which the semiconductor element of the image display apparatus was mounted. The schematic plan view of the surface by which the organic EL display apparatus of the image display apparatus was mounted. FIG. 6 is a schematic sectional view taken along line C-C ′ of FIG. 5. FIG. 3 is an equivalent circuit diagram illustrating an electrical configuration of the organic EL display device. Schematic which shows the structure of a digital camera. FIG. 9 is a schematic cross-sectional view of an image display device according to modification example 2. FIG. 10 is a schematic cross-sectional view of an image display device according to modification example 3.

  Embodiments of the present invention will be described below with reference to the drawings. Such an embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. In each of the following drawings, the scale of each layer or each part is made different from the actual scale so that each layer or each part can be recognized on the drawing.

(Embodiment 1)
"Outline of virtual image display device"
The virtual image display device 100 according to the first embodiment is an example of the “electronic device” in the present invention, and is a head-mounted display having an appearance like glasses. A wearer wearing the virtual image display device 100 can recognize image light from the virtual image by the virtual image display device 100. Furthermore, the virtual image display device 100 has a see-through function. Therefore, the wearer wearing the virtual image display device 100 can simultaneously observe the virtual image by the virtual image display device 100 and the external image.
In order to reduce the burden on the wearer, the virtual image display device 100 is required to be thin (compact) and light.

FIG. 1 is a schematic diagram illustrating a configuration of a virtual image display device according to the present embodiment. First, an outline of the virtual image display device 100 will be described with reference to FIG.
As shown in FIG. 1, the virtual image display device 100 is added to an optical panel 110 that covers the wearer's eyes, a frame 121 that supports the optical panel 110 and the like, and a front cover portion of the frame 121 to a side temple portion. The first driving unit 131 and the second driving unit 132 are provided. The optical panel 110 has a first panel portion 111 and a second panel portion 112, and both the panel portions 111 and 112 are plate-like parts integrally connected at the center. The first display device 100A in which the first panel portion 111 on the left side and the first drive unit 131 are combined in the drawing is a portion that forms a virtual image for the left eye, and functions alone as a virtual image display device. Further, the second display device 100B in which the second panel portion 112 on the right side and the second driving unit 132 in the drawing are combined is a portion that forms a virtual image for the right eye, and functions alone as a virtual image display device.

"Overview of display device"
FIG. 2 is a schematic diagram illustrating the configuration of the first display device. Next, an overview of the first display device 100A will be described with reference to FIG. In the drawing, the image light GL and the external light OL emitted from the image display device 11 are indicated by dashed-dotted arrows.
Note that the second display device 100B (FIG. 1) has the same structure as the first display device 100A and is simply flipped left and right, and thus the description of the second display device 100B is omitted.

  The optical system of the first display device 100A has a first optical axis AX1, a second optical axis AX2, and a third optical axis AX3. In FIG. 2, the first optical axis AX1 and the third optical axis AX3 are parallel, and the second optical axis AX2 is orthogonal to the first optical axis AX1 and the third optical axis AX3. The first optical axis AX1 and the third optical axis AX3 may not be parallel, and the second optical axis AX2 may not be orthogonal to the first optical axis AX1 and the third optical axis AX3. What is necessary is just to arrange | position so that the light from the image display apparatus 11 may reach the wearer's eyes EY when the wearer wears the virtual image display apparatus 100.

  The image forming apparatus 10 is elongated along the first optical axis AX1. That is, the first optical axis AX1 is disposed so as to pass through the image forming apparatus 10. As shown in FIG. 2, the first optical axis AX1 may be disposed so as to pass through the center of the image forming apparatus 10. The light guide device 20 is elongated along the second optical axis AX2. That is, the second optical axis AX2 is disposed so as to pass through the light guide device 20. As shown in FIG. 2, the second optical axis AX2 may be disposed so as to pass through the light guide device 20. When the wearer wears the virtual image display device 100, the third optical axis AX3 is disposed so as to pass through the wearer's eye EY.

  The image forming apparatus 10 is elongated along the first optical axis AX1. That is, the first optical axis AX1 is disposed so as to pass through the center of the image forming apparatus 10. The light guide device 20 is elongated along the second optical axis AX2. That is, the second optical axis AX2 is disposed so as to pass through the center of the light guide device 20. When the wearer wears the virtual image display device 100, the third optical axis AX3 is disposed so as to pass through the wearer's eye EY.

The image forming apparatus 10 includes an image display device 11 and a projection optical system 12. The image display device 11 is fixed to the housing 131a of the first drive unit 131 (FIG. 1), and emits image light GL based on the image signal. The projection optical system 12 is a collimating lens that converts the image light GL emitted from the image display device 11 into a light beam in a parallel state.
Although details will be described later, the casing 131a is an exterior member of the first drive unit 131 (an exterior member of the virtual image display device 100), and a support that fixes the printed circuit board 50 (see FIG. 3) of the image display device 11. I also serve. That is, the housing 131 a forms part of the image display device 11.
The image display device 11 is an example of the “electro-optical device” in the present invention. Further, the casing 131a is an example of the “support” in the present invention.

  The light guide device 20 is obtained by joining a light guide member 21 and a light transmission member 23, and is a flat optical member that extends in parallel as a whole. The light guide member 21 and the light transmitting member 23 are formed of a resin material that exhibits high light transmittance in the visible range.

  The light guide member 21 is a trapezoidal prism in plan view, and includes, as side surfaces, a first reflecting surface 21a, a second reflecting surface 21b, a third reflecting surface 21c, and a fourth reflecting surface 21d. The 1st reflective surface 21a, the 2nd reflective surface 21b, and the 3rd reflective surface 21c are total reflection surfaces using a refractive index difference. The fourth reflecting surface 21d includes a half mirror layer 28 having light transmissivity and light reflectivity. The half mirror layer 28 is formed by forming a metal reflective film or a dielectric multilayer film made of, for example, silver.

  The first reflecting surface 21a and the second reflecting surface 21b face each other, correspond to the long side portion of the trapezoidal prism, and are long in the direction of the second optical axis AX2. The third reflecting surface 21c and the fourth reflecting surface 21d correspond to the slopes (short sides) of the trapezoidal prism, and both are inclined at an acute angle of 45 ° or less with respect to the second optical axis AX2.

  Part of the image light GL emitted from the image display device 11 passes through the light guide device 20, is reflected in the direction of the second optical axis AX2 by the third reflection surface 21c, and travels toward the fourth reflection surface 21d. Part of the image light GL emitted from the image display device 11 passes through the light guide device 20, is reflected by the first reflecting surface 21a and the second reflecting surface 21b, and travels toward the fourth reflecting surface 21d.

  That is, the image light GL emitted from the image display device 11 passes through the light guide device 20 and the light guide member 21, is reflected by the fourth reflecting surface 21d, and enters the wearer's eye EY. Further, the external light OL passes through the light transmission member 23, the fourth reflection surface 21d, and the light guide member 21, and enters the eye EY of the wearer. As a result, the wearer can recognize the external image and the virtual image by superimposing them.

  In the following description, the direction parallel to the second optical axis AX2 and directed from the fourth reflecting surface 21d to the third reflecting surface 21c is defined as the X direction. A direction parallel to the first optical axis AX1 and the third optical axis AX3 and directed from the third reflecting surface 21c to the image display device 11 is defined as a Z direction. Further, a direction orthogonal to the X direction and the Z direction is defined as a Y direction.

"Outline of image display device"
FIG. 3 is a schematic cross-sectional view of a region B surrounded by a broken line in FIG. FIG. 4 is a schematic plan view of the surface of the image display device on which the semiconductor element is mounted. FIG. 5 is a schematic plan view of the surface of the image display device on which the organic EL display device is mounted. FIG. 6 is a schematic cross-sectional view taken along the line CC ′ of FIG.
In FIGS. 4 and 5, the housing 131a is not shown. In FIGS. 3 to 6, components necessary for the description are illustrated, and components unnecessary for the description are not illustrated.
The outline of the image display device 11 will be described with reference to FIGS. 3 to 6.

  As shown in FIG. 3, the image display device 11 includes a printed circuit board 50, an organic EL display device 30, a semiconductor element 71, a housing 131a, and the like. Although not shown, the image display device 11 has a connector and is connected to an external circuit (not shown) via a flexible printed circuit board or a cable.

  As described above, the housing 131 a is an exterior member of the first drive unit 131 (an exterior member of the virtual image display device 100), and also serves as a support that fixes the printed circuit board 50. The casing 131a is made of a material having excellent thermal conductivity, that is, a material having a thermal conductivity of 1 W / m · K or greater than 1 W / m · K. Specifically, a metal such as aluminum, an aluminum alloy, magnesium, or a magnesium alloy can be used as a constituent material of the housing 131a. Further, the housing 131 a has a role of a heat radiating unit in the image display device 11.

  The organic EL display device 30 includes an element substrate 31 and a sealing substrate 32. The element substrate 31 of the organic EL display device 30 includes a light emitting element that emits image light GL (organic EL element 45, see FIG. 7), and is mounted on one surface of the printed board 50. Further, the element substrate 31 of the organic EL display device 30 is fixed to one surface of the printed board 50.

The semiconductor element 71 is a control circuit that supplies various control signals to the organic EL display device 30, and is mounted on the other surface of the printed board 50. Although not shown, in addition to the semiconductor element 71, a plurality of electronic components such as other semiconductor elements (for example, a power supply circuit), a resistance element, and a capacitor element are mounted on the other surface of the printed circuit board 50. ing.
The organic EL display device 30 is an example of the “panel” in the present invention. A plurality of electronic components such as the semiconductor element 71, another semiconductor element (for example, a power supply circuit), a resistance element, and a capacitance element are examples of the “circuit component” in the present invention.

The printed circuit board 50 is a member for fixing and wiring electronic components such as the semiconductor element 71 and the organic EL display device 30, and includes a printed circuit board body 50a and a solder resist 53 that covers the surface of the printed circuit board body 50a. The
The printed circuit board main body 50a is an example of the “printed circuit board” in the present invention.

  The printed circuit board body 50a includes a conductive layer 52a (see FIG. 6), an insulating layer 51a, a conductive layer 52b, an insulating layer 51b, a conductive layer 52c, an insulating layer 51c, a conductive layer 52d, and an insulating layer 51d. The conductive layer 52e has a structure in which the conductive layer 52e is sequentially stacked in the Z direction. That is, the printed circuit board body 50a has a multilayer structure in which wiring layers and insulating layers are alternately stacked.

  The conductive layers 52a, 52b, 52c, 52d, and 52e are made of a metal such as copper, for example, and are excellent in electrical conductivity and thermal conductivity. In the conductive layer 52a, signal lines, electrode pads for supplying signals to the organic EL display device 30, and the like are formed. A heat conduction pattern is formed on the conductive layer 52b. That is, the heat conduction pattern is formed by the conductive layer 52b sandwiched between the insulating layer 51a and the insulating layer 51b. A ground wiring to which a ground potential is supplied is formed in the conductive layer 52c. A power supply wiring is formed on the conductive layer 52d. On the conductive layer 52e, signal wirings, electrode pads for supplying signals to the semiconductor element 71, and the like are formed.

  The conductive layer 52b (thermal conductive pattern), the conductive layer 52c (ground wiring), and the conductive layer 52d (power supply wiring) are solid patterns, and the conductive layer 52a (signal wiring, electrode pad) and the conductive layer 52e (signal wiring, electrode) The pad) is patterned into the shape of a wiring or a terminal (electrode pad). By these conductive layers 52a, 52b, 52c, 52d, and 52e, heat is quickly and efficiently transmitted to the entire printed circuit board main body 50a.

The insulating layers 51a, 51b, 51c, 51d are made of an organic material such as an epoxy-based material or a polyimide-based material. The insulating layers 51a, 51b, 51c and 51d may be made of an inorganic material such as ceramics or a composite material in which an organic material is impregnated with glass fiber.
Although not shown, via holes are formed in the insulating layers 51a, 51b, 51c, and 51d, and the conductive layers 52a, 52c, 52d, and 52e are three-dimensionally wired by the via holes.

No potential is supplied to the conductive layer 52b, and the potential of the conductive layer 52b is in a floating state. The conductive layer 52b is disposed up to the peripheral edge (end) of the printed circuit board main body 50a.
The conductive layer 52b is an example of the “thermal conduction pattern” in the present invention. Hereinafter, the conductive layer 52b is referred to as a heat conductive pattern 52b.

  The conductive layers 52a, 52c, 52d, and 52e are disposed away from the peripheral edge (end) of the printed circuit board main body 50a. For this reason, the insulating layer 51a, the heat conduction pattern 52b, the insulating layer 51b, the insulating layer 51c, and the insulating layer 51d are sequentially laminated in the Z direction at the peripheral edge (end) of the printed circuit board body 50a. Yes.

  The surface of the printed board main body 50 a on which the organic EL display device 30 is mounted and the surface of the printed board main body 50 a on which the semiconductor element 71 is mounted are covered with a solder resist 53. The solder resist 53 is an insulating film that protects the conductive layer 52a and the conductive layer 52e provided on the surface of the printed circuit board body 50a.

In the portion where the organic EL display device 30 is fixed to the printed board 50, an opening 56 is formed in the insulating layer 51 a and an opening 58 is formed in the solder resist 53. The opening 56 and the opening 58 overlap in plan and are formed at substantially the same position in plan. That is, the opening 58 of the solder resist 53 exposes the opening 56 of the insulating layer 51a. As a result, the heat conductive pattern 52 b is exposed through the opening 56 and the opening 58 on the side of the printed circuit board 50 where the organic EL display device 30 is mounted.
The opening 56 is an example of the “first exposed portion” in the present invention. The opening 58 is an example of the “third exposed portion” in the present invention.

An adhesive 66 is filled inside the openings 56 and 58. That is, at the portion where the organic EL display device 30 is fixed to the printed circuit board 50, the organic EL display device 30 is bonded (fixed) to the heat conduction pattern 52b by the adhesive 66 filled inside the openings 56 and 58. Has been. Further, an adhesive 66 is disposed between the organic EL display device 30 (element substrate 31) and the printed circuit board 50 (solder resist 53) in a region where the opening 56 and the opening 58 are not formed. 30 (element substrate 31) and the printed circuit board 50 are bonded (fixed) by an adhesive 66.
Further, the inside of the opening 56 and the opening 58 may not be filled with the adhesive 66. In this case, the heat generated by the organic EL display device 30 is transmitted to the heat conduction pattern 52 b through the space of the opening 56 and the opening 58.

The adhesive 66 is composed of an adhesive having a thermal conductivity of 0.5 W / m · K or a thermal conductivity greater than 0.5 W / m · K and having excellent thermal conductivity. As such an adhesive having excellent thermal conductivity, an epoxy adhesive, a polyimide adhesive, a synthetic rubber adhesive, an adhesive containing a filler such as ceramic or metal having high thermal conductivity may be used. it can.
If the adhesive 66 is cured with ultraviolet light, the ultraviolet light may adversely affect the organic EL display device 30. Therefore, it is not preferable to cure the adhesive 66 with ultraviolet light. Therefore, it is preferable to cure the adhesive 66 with heat or moisture.
The adhesive 66 is an example of the “first thermally conductive adhesive” in the present invention.

  Although details will be described later, the organic EL display device 30 generates heat when energized. The heat generated by the organic EL display device 30 is quickly and efficiently transmitted to the heat conductive pattern 52b (printed circuit board 50) by the adhesive 66 having excellent heat conductivity.

An opening 55 is formed through the insulating layer 51b, the insulating layer 51c, and the insulating layer 51d at the peripheral edge (end) of the printed circuit board body 50a on the side where the semiconductor element 71 is mounted, and the solder resist 53 has an opening 57. Is formed. The opening 55 and the opening 57 overlap in a plane, that is, are formed at substantially the same position in a plane. That is, the opening 57 of the solder resist 53 exposes the opening 56 of the insulating layers 51b, 51c, 51d. As a result, the heat conductive pattern 52 b is exposed through the openings 55 and 57 on the side of the printed circuit board 50 where the semiconductor element 71 is mounted.
The opening 55 is an example of the “second exposed portion” in the present invention. The opening 57 is an example of the “fourth exposed portion” in the present invention.

Inside the openings 55 and 57, an adhesive 65 is filled. The heat conductive pattern 52b is bonded (fixed) to the housing 131a by an adhesive 65 filled inside the openings 55 and 57. An adhesive 65 is also disposed between the printed circuit board 50 (solder resist 53) and the housing 131a and between the semiconductor element 71 and the housing 131a in a region where the openings 55 and 57 are not formed. The substrate 50, the semiconductor element 71, and the housing 131a are bonded (fixed) with an adhesive 65.
Further, the adhesive 65 may not be filled inside the openings 55 and 57. In this case, the heat generated by the organic EL display device 30 is propagated to the heat conduction pattern 52 b through the openings 55 and 57 and the heat conduction sheet 61. The heat conductive pattern 52 b may be in contact with the heat conductive sheet 61 at the opening 55 and the opening 57.

The adhesive 65 is made of an adhesive having a thermal conductivity of 0.5 W / m · K or a thermal conductivity greater than 0.5 W / m · K and having excellent thermal conductivity. Further, since the adhesive 65 is disposed so as to cover the semiconductor element 71, the adhesive 65 is insulated so that the bumps 72 of the semiconductor element 71 and the electrode pads formed of the conductive layer 52e are not electrically short-circuited. Sex is required. That is, the adhesive 65 is an adhesive excellent in thermal conductivity and insulation, and for example, an epoxy adhesive, an acrylic adhesive, a polyimide adhesive, a silicon rubber adhesive, or the like can be used.
Since the adhesive 65 is disposed on the side opposite to the organic EL display device 30 side of the printed circuit board 50, even if the adhesive 65 is cured with ultraviolet light, the ultraviolet light is incident on the organic EL display device 30 ( The adhesive 65 can be cured with ultraviolet rays. Therefore, it is preferable to cure the adhesive 66 with ultraviolet rays, heat, moisture, or the like.
The adhesive 65 is an example of the “second heat conductive adhesive” in the present invention.

  The heat conductive pattern 52b (printed circuit board 50) is bonded to the housing 131a by an adhesive 65 filled inside the openings 55 and 57. As a result, the heat propagated from the organic EL display device 30 to the heat conduction pattern 52b is quickly and efficiently propagated to the housing 131a side by the adhesive 65 having excellent heat conductivity.

As described above, the heat generated in the organic EL display device 30 is quickly and efficiently transmitted through the adhesive 66 excellent in thermal conductivity, the thermal conductive pattern 52b, and the adhesive 65 excellent in thermal conductivity. Is transmitted to the housing 131a side, and is radiated to the outside by the housing 131a.
The semiconductor element 71 has bumps 72 and is connected (mounted) to an electrode pad formed of the conductive layer 52e.

  As shown in FIG. 4, on the side of the printed circuit board 50 where the semiconductor element 71 is mounted, the opening 55 and the opening 57 have a rectangular shape elongated in the Y direction, and are formed at both ends of the printed circuit board 50 in the X direction. Has been. The heat conduction pattern 52b has a rectangular shape elongated in the X direction, and is formed so as to overlap the opening 55 and the opening 57 in a plane on the side where the semiconductor element 71 of the printed board 50 is mounted. Part of the opening 57 is exposed.

  As shown in FIG. 5, on the side of the printed circuit board 50 where the organic EL display device 30 is mounted, the heat conduction pattern 52b has a rectangular shape elongated in the X direction, and is planar with the organic EL display device 30. It is formed to overlap. That is, the heat conduction pattern 52 b is provided so as to overlap with a portion where the organic EL display device 30 is fixed. Although not shown in FIG. 5, the conductive layer 52c (ground wiring) and the conductive layer 52d (power supply wiring) also have a rectangular shape elongated in the X direction, like the heat conduction pattern 52b, and display an organic EL display. It is provided so as to overlap with a portion where the device 30 is fixed.

Further, circular openings 56 and openings 58 are arranged in a matrix in the X direction and the Y direction on the printed circuit board 50 where the organic EL display device 30 is fixed. A part of the heat conduction pattern 52 b is exposed through the opening 56 and the opening 58.
Note that the shapes of the openings 56 and 58 may be rectangular or elliptical. The number of the openings 56 and the openings 58 may be singular.

  As described above, the organic EL display device 30 includes the element substrate 31 and the sealing substrate 32. Both substrates are bonded by a resin layer (not shown). Further, in the portion where the organic EL display device 30 is fixed to the printed circuit board 50, the element substrate 31 of the organic EL display device 30 is bonded (fixed) to the heat conduction pattern 52b (printed circuit board 50) by the adhesive 66. Yes.

  The element substrate 31 includes a plurality of pixels P arranged in a matrix in the display region E, peripheral circuits (data line driving circuit 35 and scanning line driving circuit 36) for driving the plurality of pixels P, external connection terminals 37, and the like. Is formed. Specifically, the element substrate 31 is a semiconductor substrate (silicon substrate) on which pixels P, a data line driving circuit 35, a scanning line driving circuit 36, an external connection terminal 37, and the like are formed. That is, the element substrate 31 is composed of a semiconductor substrate (silicon substrate) having excellent thermal conductivity.

  A plurality of external connection terminals 37 are arranged along the first side of the element substrate 31. A data line driving circuit 35 is disposed between the plurality of external connection terminals 37 and the display area E. A scanning line driving circuit 36 is disposed between the second and third sides that are orthogonal to the first side and face each other, and the display area E.

The sealing substrate 32 is smaller than the element substrate 31 and is arranged so that the external connection terminals 37 are exposed. The sealing substrate 32 is a translucent insulating substrate, and a quartz substrate, a glass substrate, or the like can be used. The sealing substrate 32 has a role to protect an organic EL element 45 (see FIG. 7), which will be described later, disposed in the display area E from being damaged, and is provided wider than the display area E. Further, the sealing substrate 32 is a surface on the side from which the image light GL is emitted in the organic EL display device 30.
A protective glass for protecting the organic EL display device 30 may be disposed on the surface of the sealing substrate 32 opposite to the element substrate 31.

  As shown in FIG. 6, the external connection terminal 37 of the organic EL display device 30 is connected to the electrode pad formed of the conductive layer 52 a of the printed board 50 by a bonding wire 67. The bonding wire 67 is covered with a resin layer 68.

  That is, the organic EL display device 30 is mounted on the printed board 50 by wire bonding. The mounting by wire bonding can reduce the connection resistance between the external connection terminal 37 and the electrode pad of the organic EL display device 30 as compared with, for example, mounting by a flexible printed board or a connector. When the connection resistance is reduced, the rounding or delay of the signal supplied from the electrode pad to the external connection terminal 37 is suppressed, and the display quality of the organic EL display device 30 can be improved.

  In mounting by wire bonding, the adhesive 66 disposed between the organic EL display device 30 (element substrate 31) and the printed circuit board 50 (solder resist 53) is thinner in order to suppress problems of the bonding device. For example, the thickness of the adhesive 66 is preferably 0.1 mm or smaller than 0.1 mm.

"Outline of organic EL display device"
FIG. 7 is an equivalent circuit diagram showing an electrical configuration of the organic EL display device. Next, the details of the organic EL display device 30 will be described with reference to FIG.

  As shown in FIG. 7, the organic EL display device 30 includes a plurality of scanning lines 33 and a plurality of data lines 38 that intersect each other, and a plurality of power supply lines 39 that are parallel to each of the plurality of data lines 38. doing. The scanning line 33 is connected to the scanning line driving circuit 36, and the data line 38 is connected to the data line driving circuit 35. In addition, pixels P are arranged in a matrix corresponding to the intersections of the plurality of scanning lines 33 and the plurality of data lines 38.

  The pixel P includes an organic EL element 45 that is a light emitting element, and a pixel circuit 40 that controls driving (light emission) of the organic EL element 45.

  The organic EL element 45 includes a pixel electrode 46 that functions as an anode, a counter electrode 48 that functions as a cathode, and a light emitting functional layer 47 that includes an organic light emitting layer provided between the pixel electrode 46 and the counter electrode 48. doing. Such an organic EL element 45 can be electrically expressed as a diode, and the light emitting functional layer 47 emits light by a current flowing through the organic EL element 45. Specifically, holes are supplied from the pixel electrode 46 to the light emitting functional layer 47, electrons are supplied from the counter electrode 48 to the light emitting functional layer 47, and the holes and electrons are combined in the light emitting functional layer 47. 47 emits light.

  The pixel circuit 40 includes a switching transistor 41, a storage capacitor 42, and a driving transistor 43. The two transistors 41 and 43 can be configured using, for example, an n-channel or p-channel transistor.

  The gate of the switching transistor 41 is connected to the scanning line 33. One of the source and drain of the switching transistor 41 is connected to the data line 38. The other of the source and drain of the switching transistor 41 is connected to the gate of the driving transistor 43.

  One of the source and drain of the driving transistor 43 is connected to the pixel electrode 46 of the organic EL element 45. The other of the source and drain of the driving transistor 43 is connected to the power supply line 39. A storage capacitor 42 is connected between the gate of the driving transistor 43 and the power supply line 39.

  When the scanning line 33 is driven and the switching transistor 41 is turned on, the potential based on the image signal supplied from the data line 38 at that time is held in the storage capacitor 42 via the switching transistor 41. The on / off state of the driving transistor 43 is determined according to the potential of the storage capacitor 42, that is, the gate potential of the driving transistor 43. When the driving transistor 43 is turned on, a current corresponding to the gate potential is supplied to the light emitting functional layer 47 sandwiched between the pixel electrode 46 and the counter electrode 48 from the power line 39 via the driving transistor 43. Flows. The organic EL element 45 emits light according to the amount of current flowing through the light emitting functional layer 47.

  The scanning line driving circuit 36 supplies a scanning signal for controlling on / off of the switching transistor 41. The data line driving circuit 35 controls a current for the organic EL element 45 to emit light. For this reason, since a larger current flows in the data line driving circuit 35 than in the scanning line driving circuit 36, heat is generated by the current. Further, the organic EL element 45 also generates heat due to the current flowing through the organic EL element 45. Since the data line driving circuit 35 controls the entire current flowing through the plurality of organic EL elements 45, a larger current flows than the current flowing through the single organic EL element 45, and the heat generation amount is higher than that of the single organic EL element 45. Is big.

The heat generated by the data line driving circuit 35 is propagated to the organic EL element 45 through the base material (silicon substrate) of the element substrate 31 having excellent thermal conductivity. That is, the organic EL element 45 may be affected by the heat generated by the data line driving circuit 35 in addition to the heat generated by the current flowing through the organic EL element 45, and the temperature of the organic EL element 45 may increase. When the temperature of the light emitting functional layer 47 of the organic EL element 45 rises, the deterioration of the light emitting functional layer 47 of the organic EL element 45 is accelerated, so that the life of the organic EL element 45 may be shortened.
Furthermore, if the entire organic EL display device 30 generates heat due to heat generated by the data line driving circuit 35 and the organic EL element 45, the wearer may be adversely affected such as low-temperature burns.

  As described above, the heat generated by the data line driving circuit 35 and the organic EL element 45 is generated by the base material (silicon substrate) of the element substrate 31 having excellent thermal conductivity, the adhesive 66 having excellent thermal conductivity, The heat transfer pattern 52b having excellent heat conductivity and the adhesive 65 having excellent heat conductivity are transmitted to the side of the casing 131a having excellent heat conductivity quickly and efficiently. The casing 131a also serves as an exterior member of the first drive unit 131 (exterior member of the virtual image display apparatus 100) and is widely provided throughout the virtual image display apparatus 100. Therefore, the casing 131a has excellent heat dissipation and is transmitted to the casing 131a. Heat can be radiated to the outside quickly and efficiently. The heat generated by the data line driving circuit 35 and the organic EL element 45 is quickly and efficiently dissipated to the outside, so that the temperature rise of the organic EL element 45 is suppressed and the deterioration of the organic EL element 45 is accelerated. Is suppressed. Furthermore, since the temperature rise of the organic EL display device 30 (virtual image display device 100) is also suppressed, adverse effects of heat on the wearer, such as low temperature burns, are also suppressed.

  Further, in the present embodiment, the heat radiation portion (housing 131a) of the electro-optical device (image display device 11) also serves as an exterior member of the electronic device (virtual image display device 100). The electronic apparatus can be made thinner (compact) and lighter than a configuration in which a heat radiating portion is formed separately, for example, an electro-optical device of a known technique (Japanese Patent Laid-Open No. 2010-256654). Therefore, the electro-optical device (image display device 11) according to the present embodiment is required to be thinner (compact) and lighter than the electro-optical device disclosed in Japanese Unexamined Patent Application Publication No. 2010-256654. It is suitable for an electronic device (virtual image display device 100).

(Embodiment 2)
FIG. 8 is a schematic diagram showing the configuration of the digital camera. Next, another electronic device to which the image display device 11 is applied will be described with reference to FIG.

  As shown in FIG. 8, a digital camera 200 is an example of another electronic device according to the present invention, and includes a main body 201 having an optical system such as an image sensor. The main body 201 is provided with a monitor 202 for displaying captured images and an electronic viewfinder 203 for visually recognizing a subject.

  The monitor 202 and the electronic viewfinder 203 are both microdisplays having the same pixel density, and fine pixels are arranged. The monitor 202 and the electronic viewfinder 203 are equipped with the above-described image display device 11 (see FIG. 6). Since the image display device 11 uses the housing of the digital camera 200 as a heat radiating portion, the image display device 11 is excellent in heat radiation. Furthermore, by using the housing of the digital camera 200 as a heat dissipation unit, the monitor 202 and the electronic viewfinder 203 can be reduced in thickness (compact) and reduced in weight.

  Since the heat generated by the organic EL display device 30 is quickly and efficiently dissipated to the outside, the increase in the temperature of the organic EL element 45 is suppressed and the deterioration of the deterioration of the organic EL element 45 is suppressed. it can. Furthermore, since the temperature rise of the electronic viewfinder 203 is also suppressed, the adverse effect of heat on the user can be suppressed.

  Furthermore, the electro-optical device (image display device 11) of the present invention includes various electronic devices such as a mobile computer, a digital video camera, an in-vehicle device, an audio device, and an information terminal device in addition to the virtual image display device 100 and the digital camera 200 described above. It can also be applied to the display portion of the device.

The present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification. Electronic equipment equipped with the electro-optical device is also included in the technical scope of the present invention.
Various modifications other than the above embodiment are conceivable. Hereinafter, a modification will be described.

(Modification 1)
The electro-optical device according to the present invention is not limited to the image display device 11 described above. For example, the image display device 11 may have a liquid crystal display device instead of the organic EL display device 30.

(Modification 2)
FIGS. 9A and 9B are schematic cross-sectional views of an image display device according to Modification 2 corresponding to FIG. In the modified example 2, the shape of the housing 131a is different from that of the first embodiment, and other configurations are the same as those of the first embodiment.

  As shown in FIG. 9A, the housing 131a has a convex portion 131b that swells in the Z direction on the side where the semiconductor element 71 is mounted. The convex 131b is wider than the semiconductor element 71 in plan view. For this reason, the semiconductor element 71 protruding in the Z direction from the surface of the printed circuit board 50 is disposed (stored) inside the convex portion 131 b via the adhesive 65.

  As shown in FIG. 9B, the housing 131a has an opening 131c. The opening 131c is wider than the semiconductor element 71 in plan view. For this reason, the semiconductor element 71 protruding in the Z direction from the surface of the printed circuit board 50 is disposed in the opening 131c.

  By providing the housing 131a with a convex portion 131b or an opening 131c and disposing the semiconductor element 71 inside the convex portion 131b or in the opening 131c, the size of the image display device 11 in the Z direction can be reduced as compared with the first embodiment. The image display device 11 can be thinned.

  Further, in the configuration in which the semiconductor element 71 is disposed in the opening 131c shown in FIG. 9B, the adhesive 65 does not cover the semiconductor element 71. The electrode terminal (bump 72) can be prevented from being electrically short-circuited, and the reliability of the image display device 11 can be improved.

As described above, on the surface of the printed circuit board 50 on which the semiconductor element 71 is mounted, in addition to the semiconductor element 71, other semiconductor elements (for example, a power supply circuit), a resistance element, a capacitor element, and the like A plurality of electronic components are mounted. A convex portion 131b or an opening 131c corresponding to each of the plurality of electronic components may be provided in the housing 131a, and among these electronic components, an electronic component having a large dimension in the Z direction (projecting greatly in the Z direction) A convex portion 131b or an opening 131c corresponding to the electronic component) may be provided in the housing 131a.
That is, the housing 131a may have a configuration in which a convex portion 131b or an opening 131c swelled in the Z direction is provided in a portion overlapping with at least one of the plurality of electronic components in a plane.

(Modification 3)
FIG. 10 is a schematic cross-sectional view of an image display device according to Modification 3 corresponding to FIG. In the third modification, the arrangement position of the adhesive 65 is different from that in the first embodiment, and other configurations are the same as those in the first embodiment.

  As shown in FIG. 10, since the adhesive 65 is disposed so as not to contact the semiconductor element 71, for example, the insulating property of the adhesive 65 is deteriorated, and the electrode terminals (bumps 72) of the semiconductor element 71 are electrically connected. Therefore, it is possible to improve the reliability of the image display device 11.

Although illustration is omitted, it is preferable that the adhesive 65 be disposed so as not to contact an electronic component (for example, another semiconductor element) that is desired to reliably suppress an electrical short circuit. Since the electronic component for which electrical shorting is to be suppressed is not covered with the adhesive 65, the reliability of the image display device 11 can be improved.
The adhesive 65 only needs to be disposed so as to cover the openings 55 and 57 so that the heat conduction pattern 52b and the casing 131a are securely bonded, and is divided into a plurality of patterns as shown in the present modification. May be arranged.

(Modification 4)
In the first embodiment, the heat conduction pattern is formed by the conductive layer 52b sandwiched between the insulating layer 51a and the insulating layer 51b. However, the present invention is not limited to this. For example, the structure which forms a heat conductive pattern by the conductive layer 52a arrange | positioned on the surface by the side of the organic EL display apparatus 30 of the printed circuit board main body 50a may be sufficient.

(Modification 5)
In the first embodiment, the heat generated by the organic EL display device 30 is propagated to the side of the heat conduction pattern (heat conduction pattern 52b) formed by the conductive layer 52b through the adhesive 66 having excellent heat conductivity. However, it is not limited to this. For example, instead of the heat conduction pattern (heat conduction pattern 52b) formed of the conductive layer 52b, a conductive layer 52c (ground wiring) to which a ground potential is supplied may be used as the heat conduction pattern.

  Further, when the conductive layer 52c (ground wiring) is a heat conduction pattern, the conductive layer 52c is disposed up to the peripheral edge (end) of the printed board main body 50a, and the organic EL display device 30 of the printed board 50 is mounted. On the side, a part of the conductive layer 52c is exposed by the openings 56 and 58, and on the side where the semiconductor element 71 of the printed circuit board 50 is mounted, a part of the conductive layer 52c is exposed by the openings 55 and 57. preferable.

  With this configuration, the heat generated in the organic EL display device 30 is generated by using the base material (silicon substrate) of the element substrate 31 having excellent thermal conductivity, the adhesive 66 having excellent thermal conductivity, and the conductive layer 52c (ground wiring). ) And the adhesive 65 excellent in thermal conductivity are quickly and efficiently propagated to the side of the casing 131a having excellent thermal conductivity, and the casing 131a allows rapid and efficient transmission. Heat can be radiated to the outside.

  Since the potential of the conductive layer 52c (ground wiring) is the same ground potential as the base material (silicon substrate) of the element substrate 31, even if the conductive layer 52c and the element substrate 31 are in electrical contact, the element substrate 31 The risk of electrical damage is suppressed. Further, by using a conductive layer 52c (ground wiring) to which a ground potential is supplied instead of the heat conduction pattern 52b, the conductive layer 52b can be omitted, and the cost of the printed circuit board 50 can be reduced.

(Modification 6)
The printed circuit board main body 50a is a multilayer in which conductive layers (conductive layers 52a, 52b, 52c, 52d, 52e) excellent in thermal conductivity and insulating layers (insulating layers 51a, 51b, 51c, 51d) are alternately stacked. It has a structure. Furthermore, the heat conductive pattern 52b, the conductive layer 52c (ground wiring), and the conductive layer 52d (power supply wiring) are solid patterns and are provided so as to overlap with a portion where the organic EL display device 30 is fixed. For this reason, heat is easily transmitted in the Z direction (the direction from the organic EL display device 30 toward the housing 131a) in the printed circuit board 50 that fixes the organic EL display device 30.

Therefore, the configuration may be such that the openings 55 and 57 are not provided in the printed circuit board 50, and the printed circuit board 50 is fixed (adhered) to the casing 131a with the adhesive 65 having excellent thermal conductivity. Furthermore, the organic EL display device 30 may be fixed to the printed circuit board 50 with an adhesive 66 having excellent thermal conductivity without providing the openings 56 and 58 in the printed circuit board 50.
Even with this configuration, heat generated in the organic EL display device 30 can be quickly and efficiently passed through the adhesive 66 having excellent thermal conductivity, the printed board 50, and the adhesive 65 having excellent thermal conductivity. Thus, it can be propagated to the housing 131a side.

  DESCRIPTION OF SYMBOLS 10 ... Image forming apparatus, 11 ... Image display apparatus, 12 ... Projection optical system, 20 ... Light guide apparatus, 21 ... Light guide member, 30 ... Organic EL display apparatus, 31 ... Element substrate, 32 ... Sealing substrate, 50 ... Printed circuit board, 50a ... Printed circuit board body, 51a, 51b, 51c, 51d ... Insulating layer, 52a, 52c, 52d, 52e ... Conductive layer, 52b ... Conductive layer (thermal conductive pattern), 53 ... Solder resist, 55, 56 ... Insulating layer opening, 57, 58 ... Solder resist opening, 65, 66 ... Adhesive, 71 ... Semiconductor element, 72 ... Bump.

Claims (16)

A panel having a pixel and a driving circuit for driving the pixel;
A printed circuit board fixed to the panel with a first thermally conductive adhesive;
A support;
Including
The electro-optical device, wherein the printed board is fixed to the support by a second heat conductive adhesive on the side opposite to the side on which the panel is fixed. The printed circuit board has a multilayer structure in which insulating layers and conductive layers are alternately stacked,
The printed circuit board includes a heat conduction pattern formed by the conductive layer sandwiched between the insulating layers at a portion fixed to the panel, and a first exposed portion that exposes a part of the heat conduction pattern. Have
2. The electricity according to claim 1, wherein the panel and a part of the heat conductive pattern exposed at the first exposed portion are fixed by the first heat conductive adhesive. 3. Optical device. The printed circuit board has a multilayer structure in which insulating layers and conductive layers are alternately stacked,
The conductive layer disposed on the surface of the printed circuit board on the side of the panel forms a heat conduction pattern that overlaps a portion fixed to the panel,
The electro-optical device according to claim 1, wherein the panel and the heat conductive pattern are fixed by the first heat conductive adhesive. In the printed circuit board, a second exposed portion that exposes a part of the heat conduction pattern is formed at a portion fixed to the support,
The said support body and a part of said heat conductive pattern exposed by the said 2nd exposed part are being fixed with the said 2nd heat conductive adhesive, The Claim 2 or 3 characterized by the above-mentioned. The electro-optical device described. The surface of the printed circuit board is covered with a solder resist,
The electro-optical device according to claim 2, wherein the solder resist has a third exposed portion that exposes the first exposed portion at a portion fixed to the panel. The surface of the printed circuit board is covered with a solder resist,
The electro-optical device according to claim 4, wherein the solder resist has a fourth exposed portion that exposes the second exposed portion at a portion fixed to the support.   The electro-optical device according to claim 2, wherein the potential of the heat conduction pattern is a ground potential or a floating state.   The thermal conductivity of the first thermal conductive adhesive and the thermal conductivity of the second thermal conductive adhesive are greater than 0.5 W / m · K or 0.5 W / m · K. The electro-optical device according to claim 1, wherein:   The electro-optical device according to claim 1, wherein the support has a thermal conductivity of 1 W / m · K or greater than 1 W / m · K.   10. The electro-optical device according to claim 1, wherein at least one circuit component is mounted on the printed board on a side opposite to the side on which the panel is fixed. 11.   The said support body has the convex part or opening which swelled in the direction which goes to the said circuit component from the said panel in the part which planarly overlaps with at least one of the said circuit components, The opening is characterized by the above-mentioned. The electro-optical device according to 10.   The electro-optical device according to claim 1, wherein the panel is mounted on the printed board by wire bonding. The panel has a semiconductor substrate,
The electro-optical device according to claim 1, wherein the semiconductor substrate is fixed to the printed board with the first thermally conductive adhesive.   The electro-optical device according to claim 1, wherein an organic electroluminescence element is formed in the pixel.   The electro-optical device according to claim 1, wherein the panel is a micro display for an electronic viewfinder or a micro display for a head mounted display.   An electronic apparatus comprising the electro-optical device according to claim 1.

Images