JP6197545B2 - Electronic component manufacturing method and dicing apparatus - Google Patents

Description

  The present invention relates to a method of manufacturing an electronic component and a dicing apparatus used in the manufacturing process of the electronic component, and more specifically, includes a step of dicing a workpiece that is a material of an electronic component that is adhesively held by an adhesive sheet. The present invention relates to a method for manufacturing an electronic component and a dicing apparatus used in the dicing process.

  Usually, a multilayer ceramic capacitor as an electronic component is manufactured by stacking a plurality of ceramic green sheets printed with a conductive pattern to produce a mother block, and cutting this into a matrix to form an internal electrode layer and a dielectric layer. It is manufactured by dividing into a plurality of laminated chips having a substantially rectangular parallelepiped shape and dividing them into individual pieces, and subjecting the laminated chips after the pieces to various processing.

  Here, dicing is one of methods for dividing the mother block. When the mother block is divided using dicing, there is an advantage that cutting with high processing accuracy can be realized relatively easily. Incidentally, as a document that specifically discloses the mother block dividing step using the dicing, there is, for example, Japanese Patent Laid-Open No. 2012-80008 (Patent Document 1).

  Dicing is a process of cutting a workpiece by bringing the dicing blade into contact with the workpiece while rotating the dicing blade at a high speed. During the dicing, cutting water is generally sprayed toward the workpiece processing point, and the cutting water sprayed thereby cools the dicing blade and the workpiece, and cutting waste generated by the cutting is reduced. It will be washed away by cutting water. As the cutting water, water or water to which a cleaning agent such as a surfactant is added is used.

JP 2012-80008 A

  By the way, when dividing the mother block, an adhesive sheet is generally attached to the mother block in advance, and cutting is performed so as to reach a part of the adhesive sheet beyond the mother block. Thereby, a laminated body chip | tip will be cut out reliably from a mother block.

  However, when the cutting is performed so as to reach the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet waste is included in the cutting waste, which is a foreign matter, and the pressure-sensitive adhesive is present on the cut surface of the mother block. The problem of sticking occurs. Since the adhesive cannot be easily washed away with cutting water due to its adhesiveness, there is a high probability of remaining on the cut surface. The adhesion of the adhesive to the cut surface causes a problem in various processes performed thereafter, resulting in a decrease in yield.

  Here, as the cutting water, when using the above-described water to which a cleaning agent such as a surfactant is added, the action of the cleaning agent can reduce the residue on the cut surface of the adhesive. However, there was a problem that could not be eliminated.

  Therefore, the present invention has been made to solve the above-described problem, and it is possible to suppress the foreign matter from adhering to the cut surface and remaining during dicing, thereby improving the yield. It is an object of the present invention to provide a component manufacturing method and a dicing apparatus suitably used in the manufacturing process of the electronic component.

  As a result of diligent research, the present inventors have found that foreign matter (especially the above-mentioned adhesive) remains on the cut surface when using a cutting water to which a detergent such as a surfactant is added. It has been found that the cause of the problem is the bubbles generated in the cutting water by adding the cleaning agent. In other words, the presence of bubbles brings about the effect of increasing the foreign matter removal ability of the cutting water by stirring the cutting water, but the processing point of the workpiece is not sufficiently filled with the cutting water, resulting in the foreign matter adhering to the cutting surface. It is considered that the bubbles are attached to the cut surface so as to surround, thereby reducing the foreign matter removing ability of the cutting water. Therefore, the present inventors have obtained the knowledge that the foreign matter removing ability of cutting water is insufficient as a whole by surpassing the former, and have completed the present invention based on the knowledge. .

The method of manufacturing an electronic component according to the present invention includes a step of sticking and holding a workpiece, which is a material of an electronic component, using an adhesive sheet, and cutting the workpiece held and stuck by the adhesive sheet using a dicing blade. And a step of dividing the workpiece. The step of dividing the work is to make the dicing blade enter the work so as to reach the pressure-sensitive adhesive sheet while spraying cutting water toward the work point of the work. Here, in the method of manufacturing an electronic component according to the present invention, as the cutting water, a cleaning agent made of a hydrophilic surfactant and an antifoaming agent made of a lipophilic surfactant are added to water. Use what was done.

  In the method for producing an electronic component according to the present invention, the hydrophilic surfactant preferably has an HLB value of 13 to 16, and the lipophilic surfactant has an HLB value of It is preferable that it is 1-3.

  In the method of manufacturing an electronic component according to the present invention, it is preferable to reuse the cutting water by circulating the cutting water using a circulation path. In that case, the cutting water provided in the circulation path is used. It is preferable to add the cleaning agent and the antifoaming agent to the cutting water in a storage tank that temporarily stores the water.

  In the electronic component manufacturing method according to the present invention, the workpiece may be a laminate in which dielectric layers and conductor layers are alternately laminated. It may be a capacitor element.

The dicing apparatus based on the present invention cuts the work by being made to enter the work so as to reach the pressure sensitive sheet, the table on which the work that is the material of the electronic component that is adhesively held by the pressure sensitive adhesive sheet is placed, A dicing blade that divides the workpiece, and a cutting water in which a cleaning agent made of a hydrophilic surfactant and an antifoaming agent made of a lipophilic surfactant are added to water toward the processing point of the workpiece. And a nozzle for spraying.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a foreign material adheres and remains on a cut surface at the time of dicing, and is suitable in the manufacturing method of the electronic component which can improve a yield by this, and the manufacturing process of the said electronic component. It is possible to provide a dicing apparatus used for the above.

1 is a schematic perspective view of a multilayer ceramic capacitor manufactured by applying an electronic component manufacturing method according to an embodiment of the present invention. It is a schematic cross section along the II-II line shown in FIG. 1 of the multilayer ceramic capacitor shown in FIG. FIG. 3 is a schematic cross-sectional view taken along line III-III shown in FIG. 1 of the multilayer ceramic capacitor shown in FIG. 1. It is a figure which shows schematic structure of the dicing apparatus which concerns on embodiment of this invention. It is a figure which shows roughly the manufacture flow of the multilayer ceramic capacitor to which the manufacturing method of the electronic component which concerns on embodiment of this invention was applied. It is a schematic perspective view which shows the process in which an adhesive sheet is affixed. It is an enlarged view near the processing point at the time of dicing. It is a schematic cross section near the processing point at the time of dicing. It is a schematic perspective view which shows the state after parting of the mother block.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The embodiment described below exemplifies a case where the present invention is applied to a manufacturing method of a multilayer ceramic capacitor which is an electronic component and a dicing apparatus used in the manufacturing process of the multilayer ceramic capacitor. In the following embodiments, the same or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated.

  First, prior to describing a method for manufacturing an electronic component and a dicing apparatus according to an embodiment of the present invention, a multilayer ceramic capacitor manufactured according to the manufacturing method using the dicing apparatus will be described.

  FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor manufactured according to a method for manufacturing an electronic component according to an embodiment of the present invention. 2 is a schematic cross-sectional view of the multilayer ceramic capacitor shown in FIG. 1 along the line II-II shown in FIG. 1, and FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor shown in FIG. It is a schematic cross section along line -III.

  As shown in FIGS. 1 to 3, the multilayer ceramic capacitor 10 is an electronic component having a substantially rectangular parallelepiped shape as a whole, and includes an element body portion 11 and a pair of external electrodes 14.

  As shown in FIG. 2 and FIG. 3, the element body portion 11 is configured by dielectric layers 12 and internal electrode layers 13 as conductor layers that are alternately stacked along a predetermined direction. Dielectric layer 12 is formed of, for example, a ceramic material mainly composed of barium titanate. In addition, the dielectric layer 12 may contain a Mn compound, a Mg compound, a Si compound, a Co compound, a Ni compound, a rare earth compound, or the like as a subcomponent of a ceramic powder that is a raw material of a ceramic green sheet described later. On the other hand, the internal electrode layer 13 is formed of a metal material typified by Ni, Cu, Ag, Pd, an Ag—Pd alloy, Au, or the like.

  The element body portion 11 is prepared by preparing a plurality of material sheets on which the conductive paste that becomes the internal electrode layer 13 is printed on the surface of the ceramic green sheet that becomes the dielectric layer 12, and laminating and pressing these plurality of material sheets. The mother block 20 (see FIG. 4 and FIG. 6 and the like) is manufactured, and the mother block 20 is cut into pieces into the laminated chip 21 (see FIG. 9) and then fired. .

The material of the dielectric layer 12 is not limited to the above-mentioned ceramic material mainly composed of barium titanate, and other high dielectric constant ceramic materials (for example, CaTiO ₃ , SrTiO ₃ , CaZrO _3, etc.) are mainly used. May be selected as the material of the dielectric layer 12. Further, the material of the internal electrode layer 13 is not limited to the metal material described above, and other conductive materials may be selected as the material of the internal electrode layer 13.

  As shown in FIGS. 1 and 2, the pair of external electrodes 14 are provided so as to be separated from each other so as to cover the surfaces of both end portions in a predetermined direction of the element body 11. The pair of external electrodes 14 are each composed of a conductive film.

  The pair of external electrodes 14 is composed of a laminated film of a sintered metal layer and a plating layer, for example. The sintered metal layer is formed, for example, by baking a conductive paste such as Cu, Ni, Ag, Pd, an Ag—Pd alloy, Au, or a conductive resin paste containing a metal powder made of these materials. A plating layer is comprised by the Ni plating layer and the Sn plating layer which covers this, for example. Instead of this, the plated layer may be a Cu plated layer or an Au plated layer. Further, the pair of external electrodes 14 may be constituted only by a plating layer.

  As shown in FIG. 2, one of the pair of internal electrode layers 13 adjacent to each other with the dielectric layer 12 sandwiched in the stacking direction is connected to one of the pair of external electrodes 14 inside the multilayer ceramic capacitor 10. The other of the pair of internal electrode layers 13 that are electrically connected and are adjacent to each other with the dielectric layer 12 sandwiched in the stacking direction is the other of the pair of external electrodes 14 in the multilayer ceramic capacitor 10. Is electrically connected. As a result, a plurality of capacitor elements are electrically connected in parallel between the pair of external electrodes 14.

  Here, as shown in FIGS. 1 to 3, the direction in which the pair of external electrodes 14 are arranged is defined as the length direction L of the multilayer ceramic capacitor 10, and the dielectric layer 12, the internal electrode layer 13, Is defined as the thickness direction T, and the direction perpendicular to both the length direction L and the thickness direction T is defined as the width direction W, the multilayer ceramic capacitor 10 shown in FIG. It has an elongated, substantially rectangular parallelepiped shape that is configured to have the longest outer dimension.

  As representative values of the outer dimension in the length direction L and the outer dimension in the width direction W of the multilayer ceramic capacitor 10 (usually, the outer dimension in the thickness direction T is equivalent to the outer dimension in the width direction W), For example, 3.2 [mm] × 1.6 [mm], 2.0 [mm] × 1.25 [mm], 1.6 [mm] × 0.8 [mm], 1.0 [mm] × 0.5 [mm], 0.8 [mm] × 0.4 [mm], 0.6 [mm] × 0.3 [mm], 0.4 [mm] × 0.2 [mm], etc. Can be mentioned.

  FIG. 4 is a diagram showing a schematic configuration of the dicing apparatus according to the present embodiment. Next, the dicing apparatus according to the present embodiment will be described with reference to FIG.

  As shown in FIG. 4, the dicing apparatus 100 mainly includes a table 110, a dicing blade 120, and a circulation path 130.

  The table 110 is a table on which the mother block 20 as a work held and adhered by the adhesive sheet 30 is placed. The table 110 has a suction mechanism (not shown), and the adhesive block 30 is sucked by the suction mechanism, so that the mother block 20 is stably held on the placement surface.

  The table 110 is connected to a drive mechanism (not shown). As a result, the table 110 is driven by a drive mechanism (not shown) to move in the direction of the arrow DR1 shown in the figure, and passes the position below the dicing blade 120 in a state where the mother block 20 is placed. .

  The dicing blade 120 cuts the mother block 20 by cutting the mother block 20. The dicing blade 120 has a disk shape with a blade provided on the outer peripheral edge thereof, and the center portion thereof is pivotally supported by the rotating shaft 121. The rotating shaft 121 is connected to a driving mechanism (not shown). Thus, the dicing blade 120 is rotated at high speed in the direction of the arrow DR2 shown in FIG.

  The circulation path 130 circulates the cutting water A in order to reuse the cutting water A, and connects the storage tank 131, the pump 132, the nozzle 133, the recovery tank 134, the filter 135, and these. It is mainly comprised by the piping line to do.

  The storage tank 131 temporarily stores the cutting water A. The storage tank 131 has a water supply means (not shown) for supplying water a, a cleaning agent supply means (not shown) for supplying the cleaning agent b, and an antifoaming agent (not shown) for supplying the antifoaming agent c. Supply means are attached. By configuring in this way, the cutting water in which the water a, the cleaning agent b, and the defoaming agent c are appropriately stored in the storage tank 131 by the water supply unit, the cleaning agent supply unit, and the antifoaming agent supply unit. A can be supplied. Therefore, the deficiencies of the water a, the cleaning agent b, and the defoaming agent c can be replenished to the cutting water A without stopping the circulation of the cutting water A, and the concentration of the cutting water A circulating in the circulation path 130. Can always be maintained at a substantially constant concentration.

  Here, as the cleaning agent b, for example, a hydrophilic surfactant which is an organic cleaning agent is used. As the hydrophilic surfactant, those having an HLB (Hydrophile-Lipophile Balance) value of 13 to 16 can be preferably used.

  On the other hand, as the antifoaming agent c, for example, silicone-based antifoaming agents, lipophilic surfactants that are organic antifoaming agents, polyethers, higher alcohols, and the like are used. Among these, as the lipophilic surfactant, those having an HLB value of 1 to 3 can be preferably used.

  The pump 132 is a pumping means for circulating the cutting water A in the circulation path 130, and is disposed on the downstream side of the storage tank 131. The cutting water A stored in the storage tank 131 is introduced into the nozzle 133 when the pump 132 is driven.

  The nozzle 133 sprays the cutting water A toward the processing point X (see FIG. 7) of the mother block 20 and is disposed on the downstream side of the pump 132. The nozzle 133 spouts the cutting water A introduced by the pump 132 from the discharge port provided at the tip thereof toward the processing point X.

  The collection tank 134 collects the used cutting water A that hangs down from the table 110 and the dicing blade 120, and is installed at a position below the dicing blade 120. The collection tank 134 recirculates the cutting water A collected by receiving the reservoir to the storage tank 131 through the piping line.

  The filter 135 is for filtering cutting waste and the like contained in the cutting water A collected in the collection tank 134, and is installed in a part of the piping line connecting the collection tank 134 and the storage tank 131. By using the filter 135, the recovered cutting water A can be reused, and the dicing apparatus 100 can be operated at a low cost.

  Details of the cutting process of the mother block 20 performed by the dicing apparatus 100 will be described later.

  FIG. 5 is a diagram schematically showing a manufacturing flow of the multilayer ceramic capacitor to which the method of manufacturing an electronic component according to the embodiment of the present invention is applied, and FIGS. 6 to 9 show one of the steps shown in FIG. It is a figure for demonstrating a part concretely. Next, a manufacturing flow of a multilayer ceramic capacitor to which the electronic component manufacturing method according to the present embodiment is applied will be described with reference to FIGS.

  As described above, the manufacturing flow of the multilayer ceramic capacitor shown in FIG. 5 is a single processing of the component material (mother block 20), which is the core of the multilayer ceramic capacitor 10, by carrying out a batch processing until an intermediate stage of the manufacturing process. A plurality of multilayer ceramic capacitors 10 are simultaneously produced in large quantities by manufacturing them as a lump, then dividing them into individual pieces, and further subjecting the component material (laminated body chip 21) after the separation to batch processing. To produce.

  As shown in FIG. 5, the manufacturing flow of the multilayer ceramic capacitor to which the method of manufacturing an electronic component according to the present embodiment is applied is a process in which a mother block is manufactured (step S <b> 1) and an adhesive sheet are attached in order. Process (process S2), a process of dividing the mother block (process S3), a process of performing barrel polishing (process S4), a process of performing heat treatment (process S5), and an external electrode And a step (step S6) to be formed.

  First, the process (process S1) in which the mother block shown in FIG. 5 is manufactured will be described in detail.

  In the process of manufacturing a mother block, first, a ceramic slurry containing ceramic powder, binder and solvent is prepared, and this ceramic slurry is formed into a sheet shape using a die coater, gravure coater, micro gravure coater, etc. on a carrier film. As a result, a ceramic green sheet is produced.

  Subsequently, a conductive pattern is formed by printing the ceramic paste on the ceramic green sheet by screen printing, inkjet printing, gravure printing or the like so that the conductive paste has a predetermined pattern.

  As a result, a plurality of material sheets are prepared in which a conductive pattern to be the internal electrode layer 13 is printed on the surface of the multilayer ceramic green sheet to be the dielectric layer 12.

  Subsequently, the mother block 20 is manufactured by laminating a plurality of material sheets and thermocompression bonding according to a predetermined rule. As a result, the mother block 20 has a flat, substantially rectangular parallelepiped outer shape, and has a structure in which a plurality of ceramic green sheets serving as the dielectric layer 12 and a plurality of conductive patterns serving as the internal electrode layers 13 are laminated. It will be.

  Next, the process (process S2) where the adhesive sheet shown in FIG. 5 is affixed will be described in detail. FIG. 6 is a schematic perspective view illustrating a process in which an adhesive sheet is attached.

  As shown in FIG. 6, in the step of attaching the adhesive sheet, the adhesive sheet 30 is attached to one of the pair of main surfaces of the prepared mother block 20. As a result, the mother block 20 is in an adhesively held state by the adhesive sheet 30.

  Here, as the pressure-sensitive adhesive sheet 30, one having a base material 31 (see FIG. 7) and a pressure-sensitive adhesive layer 32 (see FIG. 7) located on the surface of the base material 31 can be used, and preferably a foam release sheet. Can be used. The foam release sheet is a sheet that can be easily peeled off from the object to be pasted due to the occurrence of foaming in the adhesive layer by heating, thereby reducing the adhesiveness. In addition, as the pressure-sensitive adhesive sheet 30, a cooling peelable pressure sensitive adhesive sheet, a UV peelable pressure sensitive adhesive sheet, a pressure sensitive peelable pressure sensitive adhesive sheet, or the like can be used.

  Next, the process (process S3) in which the mother block shown in FIG. 5 is divided will be described in detail. FIG. 7 is an enlarged view of the vicinity of the processing point during dicing, and FIG. 8 is a schematic cross-sectional view of the vicinity of the processing point during dicing. FIG. 9 is a schematic perspective view showing a state after the mother block is divided.

  In the step of dividing the mother block, the mother block 20 adhered and held by the adhesive sheet 30 is placed on the table 110 of the dicing apparatus 100 together with the adhesive sheet (see FIG. 4).

  Subsequently, as shown in FIG. 7, the table 110 is moved so as to pass a position below the dicing blade 120 that rotates at high speed in the direction of the arrow DR <b> 2 shown in the figure, so that the dicing blade 120 is mainly used as a mother. The block 20 is contacted, and the mother block 20 is thereby cut.

  At the time of the cutting, cutting water A is sprayed from the nozzle 133 toward the machining point X of the mother block 20 as shown in FIG. 7, and the outer peripheral edge of the dicing blade 120 as shown in FIGS. It is made to approach with respect to the mother block 20 so that the front-end | tip of may reach the adhesive sheet 30. FIG. As a result, the dicing blade 120 and the mother block 20 are cooled by the sprayed cutting water A, and cutting waste generated by the cutting is washed away by the cutting water A. Therefore, smooth cutting with high processing accuracy is possible.

  Here, in the present embodiment, as described above, the cutting water A in which the cleaning agent b and the antifoaming agent c are added to the water a is used. By using such cutting water A, the generation of bubbles can be greatly suppressed as compared with the case where only the cleaning agent is added to the water, and the machining point X of the mother block 20 is sufficiently filled with the cutting water A. As a result, the foreign matter removing ability is increased. Therefore, by using the cutting water A, it is possible to significantly suppress the foreign matter remaining on the cut surface, and it is possible to sufficiently remove the adhesive that is the waste of the adhesive sheet generated by cutting the adhesive sheet. It becomes possible.

  The various conditions relating to the cutting are not particularly limited. For example, the thickness of the dicing blade 120 is 50 [μm] to 150 [μm], and the diameter of the abrasive grains of the dicing blade 120 is 5 [mu] m. [Μm] to 50 [μm], and the combined concentration of the cleaning agent b and the antifoaming agent c in the cutting water A is 2.8 [wt%] to 4.2 [wt%], and the cutting water A is sprayed The flow rate is 1 [L / min] to 2 [L / min], the rotational speed of the dicing blade 120 is 20000 [rpm] to 40000 [rpm], and the feed speed of the table 110 is 10 [mm / s] to 100 [100]. mm / s].

  As shown in FIG. 9, the above-described cutting is performed a plurality of times in a matrix on the mother block 20, whereby the mother block 20 held by the adhesive sheet 30 has a plurality of elongated rectangular parallelepiped shapes. The laminate chip 21 is divided. As described above, the adhesive sheet 30 is not completely separated when the mother block 20 is cut. Therefore, even after the mother block 20 is divided into a plurality of laminated chips 21, the individual laminated chips 21 are separated. Is maintained by the pressure-sensitive adhesive sheet 30.

  Next, the process (process S4) in which the barrel polishing process shown in FIG. 5 is performed will be described in detail.

  In the step in which the barrel polishing process is performed, the divided laminated chip 21 is detached from the pressure-sensitive adhesive sheet 30, and the plurality of removed laminated chips 21 are placed in a small box called a barrel than a ceramic material. Polishing is performed by enclosing with a high-hardness media ball and rotating the barrel. As a result, the outer surface (particularly corners and corners) of the multilayer chip 21 is rounded.

  Next, the process (process S5) in which the heat treatment shown in FIG. 5 is performed will be described in detail.

  In the process in which the heat treatment is performed, the laminated chip 21 after the barrel polishing is heated to a predetermined temperature, whereby the ceramic material is sintered. By this processing, the multilayer chip 21 becomes the element body portion 11 shown in FIGS.

  Next, the process (process S6) in which the external electrode shown in FIG. 5 is formed will be described in detail.

  In the process of forming the external electrode, first, a metal layer is formed by applying a conductive paste to the pair of end faces along the longitudinal direction of the element body 11, and a baking process is performed on the formed metal layer. Is done. Subsequently, Ni plating and Sn plating are sequentially performed on the metal layer baked on the element body 11. Thereby, the pair of external electrodes 14 shown in FIGS. 1 to 3 is formed.

  Through the series of steps described above, the manufacture of the multilayer ceramic capacitor 10 having the structure shown in FIGS. 1 to 3 is completed.

  As described above, the multilayer ceramic capacitor 10 is manufactured according to the manufacturing flow of the multilayer ceramic capacitor to which the electronic component manufacturing method according to the present embodiment described above is applied using the dicing apparatus 100 according to the present embodiment described above. By manufacturing, it can suppress that a foreign material adheres and remains on a cut surface at the time of dicing, and, thereby, the yield of the multilayer ceramic capacitor 10 can be improved.

  The present inventors conducted a verification test in order to verify the effects described above. In the following, the contents and results of the verification test will be described.

  In the verification test, first, a plurality of mother blocks were manufactured under the same conditions. In the examples, cutting water in which a cleaning agent and an antifoaming agent were added to water was prepared, and a part of the manufactured mother blocks was diced using the cutting water. In the comparative example, cutting water in which only a cleaning agent was added to water was prepared, and the remaining of the manufactured mother blocks was diced using the cutting water. In addition, the weight ratio of the water in the cutting water which concerns on an Example, a cleaning agent, and an antifoamer was 3200: 16: 1. Moreover, the weight ratio of the water and the cleaning agent in the cutting water according to the comparative example was 200: 1.

  In the verification test, in both the example and the comparative example, the outer dimension in the length direction L, the outer dimension in the width direction W, and the outer dimension in the thickness direction T of the finished multilayer ceramic capacitor are 1.0 [mm] × 0. Dicing is performed to obtain a laminated chip of a size suitable for this size so as to be 5 [mm] × 0.5 [mm], and the cut surface of the separated laminated chip is magnified 50 times. By observing using a high-magnification microscope having a rate, it was confirmed whether or not there was adhesion of a pressure-sensitive adhesive, which is scraps of the pressure-sensitive adhesive sheet, on the cut surface. In both the examples and the comparative examples, the number of samples of the laminate chip in which the presence or absence of adhesion was confirmed was 100, and the adhesion of adhesion was confirmed regardless of the number of adhesions. Was judged as “bad”, and no sticky material was confirmed as “good”.

  Here, as conditions for dicing, the thickness of the dicing blade was set to 50 [μm], the particle size of the dicing blade was set to # 1000, and the spraying flow rate of the cutting water was set to 1.8 [L / min], the rotational speed of the dicing blade is 30000 [rpm], the feed rate of the table is 20 [mm / s], the foam release sheet is used as the adhesive sheet, and the cutting depth with respect to the adhesive sheet is 30 [μm]. did. In the examples, the combined concentration of the cleaning agent and the defoaming agent in the cutting water is 3.1 [% by weight], and in the comparative example, the concentration of the cleaning agent in the cutting water is 3.1 [% by weight]. It was.

  As a result, the defect occurrence rate in the comparative example was 48 [%], whereas the defect occurrence rate in the example was 0 [%]. From this result, it can be said that it was confirmed experimentally that the above-described effects can be obtained.

  In the above-described embodiment of the present invention, the production flow of the multilayer ceramic capacitor and the case where the present invention is applied to the dicing apparatus used for the production of the multilayer ceramic capacitor have been described by way of example. Naturally, the present invention can also be applied to a manufacturing flow of electronic components other than capacitors and a dicing apparatus used for manufacturing the electronic components.

  The above-described embodiment disclosed herein is illustrative in all respects and is not restrictive. The technical scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 10 Multilayer ceramic capacitor, 11 Element body part, 12 Dielectric layer, 13 Internal electrode layer, 14 External electrode, 20 Mother block, 21 Laminate chip, 30 Adhesive sheet, 31 Base material, 32 Adhesive layer, 100 Dicing apparatus, 110 Table, 120 dicing blade, 121 rotating shaft, 130 circulation path, 131 storage tank, 132 pump, 133 nozzle, 134 recovery tank, 135 filter, A cutting water, a water, b cleaning agent, c antifoaming agent.

Claims (5)

A process of sticking and holding a work, which is a material of an electronic component, with an adhesive sheet;
Cutting the work held by the pressure-sensitive adhesive sheet using a dicing blade, and cutting the work.
The step of dividing the workpiece is to make the dicing blade enter the workpiece so as to reach the pressure-sensitive adhesive sheet while spraying cutting water toward the processing point of the workpiece,
A method for producing an electronic component using, as the cutting water, one obtained by adding a cleaning agent comprising a hydrophilic surfactant and an antifoaming agent comprising a lipophilic surfactant to water. The hydrophilic surfactant has an HLB value of 13 to 16,
The HLB value of the surfactant lipophilic, is 1-3, method for manufacturing the electronic component according to claim 1. Reusing the cutting water by circulating it using a circulation path,
In reservoir for temporarily storing the cutting water provided in the circulation path, adding the cleaning agent and the antifoaming agent to the cutting water, a method of manufacturing an electronic component according to claim 1 or 2 . The workpiece is a laminate in which dielectric layers and conductor layers are alternately laminated,
The electronic component is a capacitor element, method for manufacturing the electronic component according to any one of claims 1 to 3. A table on which a workpiece, which is a material of an electronic component that is adhesively held by an adhesive sheet, is placed;
A dicing blade that cuts the work by being made to enter the work to reach the adhesive sheet, and thereby divides the work;
A dicing apparatus comprising a nozzle for spraying cutting water in which a cleaning agent made of a hydrophilic surfactant and an antifoaming agent made of a lipophilic surfactant are added to water toward a workpiece processing point .

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