JP6197529B2 - Package structure - Google Patents

Description

  The present invention relates to a package structure.

  2. Description of the Related Art A technique for covering an electronic component including an electronic element such as a semiconductor element with a member that protects from an external environment, an impact, or the like is known. As an example using such a technique, a structure in which a substrate (also referred to as an inlet, an inlay, or the like) provided with a semiconductor memory element and an antenna element is covered with a material using resin or ceramics is known. Such structures are written and read using radio waves, and are attached to products and parts as electronic tags (also referred to as RFID (Radio Frequency IDentification) tags), for example, for logistics management and process Used for management.

JP 2006-031599 A JP 2001-175823 A JP 2008-129838 A

  The structure as described above may be used in an external environment at a higher temperature, in addition to being used in an external environment such as room temperature. The structure is used in a relatively high temperature external environment, and the heat of the external environment is transferred to the inside of the structure, and the temperature of the electronic components inside the structure is higher than the set temperature, for example, higher than the temperature at which the electronic components can operate normally In such a case, the performance and reliability of the structure may be lowered.

According to an aspect of the present invention, an electronic component, a first package that covers the electronic component, a second package that covers the first package, and heat insulation provided between the first package and the second package A package structure including the material is provided. The said package structure WHEREIN: The said 2nd package is a part of inner surface facing the said heat insulating material, Comprising: It has a recessed part in the area | region of the said site | part of the site | part corresponding to the said electronic component. Alternatively, in the package structure, the first package includes a plurality of members each having a space formed between layers by heat on one side and the other side of the electronic component.

  According to the disclosed package structure, it is possible to suppress the temperature rise of the electronic components in the package due to the heat of the external environment. As a result, a high-performance and highly reliable package structure including electronic components can be realized.

It is FIG. (1) which shows an example of the package structure which concerns on 1st Embodiment. It is FIG. (2) which shows an example of the package structure which concerns on 1st Embodiment. It is a figure which shows an example of an inlay. It is FIG. (1) which shows an example of the formation method of a package structure. It is FIG. (2) which shows an example of the formation method of a package structure. It is FIG. (3) which shows an example of the formation method of a package structure. It is explanatory drawing of the model of the package structure which concerns on 1st Embodiment. It is a figure which shows an example of the analysis result of the model which concerns on 1st Embodiment. It is FIG. (1) which shows an example of the package structure which concerns on 2nd Embodiment. It is FIG. (2) which shows an example of the package structure which concerns on 2nd Embodiment. It is a figure which shows an example of the analysis result of the package structure which concerns on 2nd Embodiment. It is FIG. (1) which shows an example of the package structure which concerns on 3rd Embodiment. It is FIG. (2) which shows an example of the package structure which concerns on 3rd Embodiment. It is a figure which shows an example of the analysis result of the package structure which concerns on 3rd Embodiment. It is FIG. (1) which shows an example of the package structure which concerns on 4th Embodiment. It is FIG. (2) which shows an example of the package structure which concerns on 4th Embodiment. It is a figure which shows an example of the analysis result of the package structure which concerns on 4th Embodiment.

First, the first embodiment will be described.
1 and 2 are views showing an example of a package structure according to the first embodiment. FIG. 1 is a schematic external view of an example of the package structure. 2A is a schematic cross-sectional view taken along the chain line S1 in FIG. 1, FIG. 2B is a schematic cross-sectional view taken along the alternate long and short dash line S2 in FIG. 1, and FIG. It is a cross-sectional schematic diagram along line.

As shown in FIGS. 1 and 2, the package structure 100 includes an electronic component 10, an inner package 20, a heat insulating material 30, and an outer package 40.
The inner package 20 is provided so as to cover the electronic component 10, and the outer package 40 is provided outside the inner package 20 so as to cover the inner package 20. A heat insulating material 30 is provided between the inner package 20 and the outer package 40 so as to cover the inner package 20. In the package structure 100, the outer package 40 is directly exposed to the external environment.

  For the inner package 20 and the outer package 40, a resin material, for example, a resin material having a certain heat resistance such as polyphenylene sulfide (PPS) resin, phenol resin, or silicone resin is used. The materials of the inner package 20 and the outer package 40 may be the same or different.

  The inner package 20 has two members (upper and lower inner packages) that sandwich the electronic component 10 from above and below, and these members are fixed (integrated) with screws 50 at the ends, for example, at the four corners. Has been. The outer package 40 has two members (upper and lower outer packages) that cover the inner package 20 containing the electronic component 10 and the surrounding heat insulating material 30, and these members are thermally welded, bonded, and sealed with tape. It is fixed (integrated) by a method such as stopping. Details of these points will be described later.

  For the heat insulating material 30 provided between the inner package 20 and the outer package 40, a sandy or granular inorganic material, for example, a sandy or granular inorganic material having a certain heat resistance such as ceramics or glass is used. By using such a sandy or granular material, the heat insulating material 30 exhibits fluidity, and when the inner package 20 is deformed as described later, the shape is flexibly changed following the deformation.

  For example, an inlay (inlet) having a configuration in which a semiconductor memory element and an antenna element are provided on a substrate is used for the electronic component 10 incorporated in the inner package 20. An example of an inlay used as the electronic component 10 is shown in FIG. 3A is a schematic plan view of the inlay, and FIG. 3B is a schematic cross-sectional view taken along the line MM of FIG.

  An electronic component 10 (inlay) illustrated in FIG. 3 includes a substrate 11, an antenna 12 (antenna element), a control IC (Integrated Circuit) chip 13 (semiconductor element), and a memory chip 14 (semiconductor element).

  As the substrate 11, a plate-like, sheet-like, or film-like substrate is used. For example, the board | substrate 11 can use what used the epoxy resin or the glass epoxy resin. In addition to this, a resin material such as bismaleimide triazine, polyamide, or polyimide, a composite resin material containing glass fiber, carbon fiber, or the like can be used.

  A conductive film having a predetermined pattern shape is used for the antenna 12. For the conductive film used for the antenna 12, for example, a metal material such as copper (Cu), aluminum (Al), silver (Ag), or gold (Au), or a metal material including at least one of them is used. it can. The antenna 12 may be formed by, for example, forming a paste containing such a metal material on the substrate 11 using a printing method, or applying a foil of such a metal material on the substrate 11 and then patterning by etching. And can be provided.

  The control IC chip 13 and the memory chip 14 are provided on the substrate 11 and are electrically connected to the antenna 12. The control IC chip 13 writes information received by the antenna 12 from the outside to the memory chip 14, and reads information stored in the memory chip 14 and transmits it from the antenna 12 to the outside.

  Here, the case where two semiconductor chips of the control IC chip 13 and the memory chip 14 are provided on the substrate 11 is illustrated. In addition, a semiconductor chip (IC chip with a built-in memory) in which the functions of both the control IC chip 13 and the memory chip 14 are incorporated in one chip can be provided on the substrate 11 by being electrically connected to the antenna 12.

  In the package structure 100 described above, the inner package 20 is provided so as to cover the electronic component 10 having such a configuration, and the outer package 40 is formed on the outer side of the inner package 20 and the heat insulating material 30 via the heat insulating material 30. It is provided so as to cover.

  In the package structure 100, the semiconductor chip (for example, the memory chip 14 or the IC chip with built-in memory) included in the electronic component 10 itself is relatively weak against heat. In the package structure 100, as described above, the electronic component 10 is covered with the inner package 20, the heat insulating material 30, and the outer package 40 in order, so that the heat of the external environment to which the outer package 40 is directly exposed can be increased. The time to reach the electronic component 10 is delayed. Thereby, the temperature rise of the electronic component 10 is suppressed and the thermal damage of the electronic component 10 is suppressed.

  The package structure 100 can suppress damage of the electronic component 10 due to heat of the external environment even when used in a relatively low temperature external environment such as room temperature or in a relatively high temperature external environment. In addition, the design is performed based on the temperature of the external environment.

  For example, the package structure 100 used in a relatively high temperature external environment can be configured as follows. The electronic component 10 is, for example, one having a planar size of 60 mm × 20 mm and a thickness of 1 mm. The inner package 20 is made of, for example, a heat-resistant resin such as PPS resin, and has a planar size of 80 mm × 80 mm and a thickness of 10 mm. For the outer package 40, for example, a heat-resistant resin such as PPS resin is used, and a planar size is 100 mm × 100 mm, a thickness is 30 mm, and a wall thickness is 5 mm. Between the inner package 20 and the outer package 40 having such a size, a heat insulating material 30 showing fluidity using an inorganic material such as sand-like ceramics is provided.

  In addition to such a relatively high temperature external environment, the electronic tag may have a relatively high humidity external environment, or an external environment such as in water or in a solution, in a gas (toxic gas, etc.) atmosphere, or in a decompressed atmosphere. Sometimes used in environments. When the package structure 100 as described above is employed as an electronic tag used in such an external environment, the package structure 100 is designed based on the conditions of each external environment in addition to the temperature.

The package structure 100 can be formed as follows, for example.
4-6 is a figure which shows an example of the formation method of a package structure. 4 to 6 schematically show the cross-section of the main part of each forming step of the package structure.

4A and 4B illustrate a process of incorporating the electronic component 10 in the inner package 20.
As shown in FIG. 4A, the inner package 20 includes a lower inner package 21 (member) and an upper inner package 22 (member) that sandwich the electronic component 10 from above and below. The lower inner package 21 has a recess 21 a that houses the lower side of the electronic component 10, and the upper inner package 22 has a recess 22 a that houses the upper side of the electronic component 10.

  The electronic component 10 is disposed between the lower inner package 21 and the upper inner package 22 as shown in FIG. 4B, and the lower inner package 21 and the upper inner package 22 are arranged at, for example, the four corners. It is fixed (screwed) with screws 50 and integrated. In this case, a screw hole 50 a into which the screw 50 can be screwed is provided in advance at a screwing position of the lower inner package 21 and the upper inner package 22. In addition, the screwing positions of the lower inner package 21 and the upper inner package 22 are limited to the above four corners as long as they are end portions outside the region where the electronic component 10 is disposed (recesses 21a and 22a). It is not something.

4A and 4B, the structure 110 in which the electronic component 10 is built in the inner package 20 is obtained.
FIGS. 5A and 5B and FIGS. 6A to 6C illustrate a process of incorporating the heat insulating material 30 and the structure 110 into the outer package 40. FIG.

  The outer package 40 includes a lower outer package 41 (member) as shown in FIG. 5A and an upper outer package 42 (member) as shown in FIGS. 6B and 6C. As shown in FIG. 5A, the lower outer package 41 has a housing part 41a for housing the structure 110 and a fitting part 41b into which the plate-like upper outer package 42 is fitted.

First, as shown in FIG. 5 (B), a part of the heat insulating material 30 is disposed on the bottom of the accommodating portion 41a of the lower outer package 41 as shown in FIG. 5 (A).
Next, as illustrated in FIG. 6A, the structure 110 is disposed in the housing portion 41 a of the lower outer package 41 in which a part of the heat insulating material 30 is disposed. The housing portion 41a of the lower outer package 41 is formed in advance so that when the structure 110 is arranged in this way, a gap 41c in which the remaining heat insulating material 30 is arranged is formed around the structure 110. Is done.

  After the structure 110 is disposed in the housing portion 41a of the lower outer package 41, the remaining heat insulating material 30 is disposed in the gap 41c around the structure 110 as shown in FIG. 110 is covered with a heat insulating material 30.

  After covering the structure 110 with the heat insulating material 30 as described above, the upper outer package 42 is fitted into the fitting portion 41b of the lower outer package 41 as shown in FIGS. 6 (B) and 6 (C). The lower outer package 41 and the upper outer package 42 are integrated. Examples of a method for integrating the lower outer package 41 and the upper outer package 42 include a method of thermally welding the lower outer package 41 and the upper outer package 42 and a method of bonding with an adhesive or the like. In addition, there is also a method in which, for example, the fitted boundary portion between the lower outer package 41 and the upper outer package 42 is sealed by tape sealing or the like without performing the above-described heat welding or adhesion. For example, a boundary portion of the lower outer package 41 and the upper outer package 42 that have been heat-welded or bonded as described above may be sealed by tape sealing or the like. Thus, by integrating the lower outer package 41 and the upper outer package 42, the inner package 20 and the heat insulating material 30 containing the electronic component 10 are sealed by the outer package 40.

  4 to 6, the package structure 100 having a structure in which the electronic component 10 is covered with the inner package 20, the heat insulating material 30, and the outer package 40 in this order is formed.

  As described above, in the package structure 100, the inner package 20 containing the electronic component 10 is disposed via the heat insulating material 30 inside the outer package 40 that is directly exposed to the external environment. Thereby, the time which the heat | fever of an external environment is transmitted to the electronic component 10 can be delayed, the temperature rise of the electronic component 10 and the thermal damage by it can be suppressed.

  Further, the upper and lower members of the outer package 40 are integrated (fixed) by a method such as heat welding, bonding, or tape sealing as described above, so that intrusion of gas or liquid in the external environment can be achieved. Damage due to can be suppressed.

  Further, in the structure in which the upper and lower members of the inner package 20 are fixed with screws as described above, the electronic component 10 can be easily replaced as compared with the case where the inner package 20 is fixed by thermal welding or the like, as in the outer package 40. In addition, the inner package 20 can be easily reused. For example, when replacing the electronic component 10 for the package structure 100 used in a certain external environment for a certain period, first, the upper and lower members to which the outer package 40 is fixed are first disassembled. The inner package 20 containing the electronic component 10 is taken out. The screwed upper and lower members of the inner package 20 can be easily separated by removing the screws 50. After replacing the electronic component 10, the same upper and lower members are used. It can be stopped by the screw 50 and reused. Even if the outer package 40 directly exposed to the external environment cannot be reused in the package structure 100, the inner package 20 is protected from the external environment by the outer package 40. It may be possible. The structure in which the upper and lower members of the inner package 20 are fixed with screws is effective for reusing the inner package 20 and facilitating replacement of the electronic component 10.

  By the way, when the package structure 100 is used in a relatively high temperature external environment as described above, for example, the package structure 100 may be deformed (thermal deformation) due to heat of the external environment. The thermal deformation of the package structure 100 can affect the temperature of the electronic component 10 incorporated therein.

Here, an example of the result of analyzing (simulating) the relationship between the thermal deformation and the center temperature using a model that takes into account the thermal deformation of the package structure 100 will be described.
FIG. 7 is an explanatory diagram of a model of the package structure according to the first embodiment, and FIG. 8 is a diagram illustrating an example of an analysis result of the model according to the first embodiment.

FIG. 7A shows a model 101 of the package structure 100 that does not undergo thermal deformation at the temperature of the external environment, that is, a model 101 that does not consider thermal deformation.
FIG. 7B shows a model 102 of the package structure 100 that is thermally deformed at the temperature of the external environment, that is, a model 102 that takes thermal deformation into consideration.

  In the package structure 100, before the outer package 40 and the inner package 20 are thermally expanded, the electronic component 10 is thermally deformed by heat transmitted through the outer package 40, the heat insulating material 30 and the inner package 20 from the external environment. There is a case. When the electronic component 10 uses the resin substrate 11 such as the epoxy resin shown in FIG. 3, thermal deformation such as warping or twisting of the electronic component 10 due to heat may occur.

  In the package structure 100 formed by the method shown in FIGS. 4 to 6, the lower and upper members (the lower inner package 21 and the upper inner package 22) of the inner package 20 are positioned at, for example, four corners. It is fixed with screws. In the case of such fixing with screws, when the electronic component 10 is thermally deformed, the inner part of the inner package 20 from the screw fixing position is pushed out from the inside by the electronic component 10 that has been thermally deformed. Deformation that swells up and down may occur.

  On the other hand, the outer package 40 of the package structure 100 formed by the method shown in FIGS. 4 to 6 is a lower and upper member (a lower outer package 41 and an upper outer package) around the inner package 20. The package 42) is fixed. The outer package 40 fixed in this way can be prevented from being deformed even when the electronic component 10 is thermally deformed and the inner package 20 is deformed thereby.

  In FIG. 7B, the outer package 40 is not deformed or hardly deformed, and the inner package 20 is deformed so that its central portion is expanded by the thermally deformed electronic component 10, and heat insulation is performed so as to follow the deformation. An example of how the material 30 is deformed is shown.

  When the inner package 20 is deformed so that the central portion thereof swells, spaces 60 (for example, air layers) are formed above and below the electronic component 10 as shown in FIG. 7B. In addition to the thermal deformation of the electronic component 10 as described above, the deformation that causes the central portion of the inner package 20 to swell may be performed between the lower and upper members (the lower inner package 21 and the upper inner package 22) during formation. Thermal expansion of the contained gas (eg, air) can also contribute.

  7B of the package structure 100, the inner surface of the outer package 40 on the heat insulating material 30 side and the heat insulating material of the inner package 20 at the position of the center line C where the deformation amount of the inner package 20 is relatively large. Let L be the distance to the outer surface on the 30 side. Furthermore, let G be the bulge of the inner package 20 at the position of the center line C. Further, the position of the point P on the center line C is defined as the center of the package structure 100, and the temperature of the point P is defined as the center temperature T.

  FIG. 8 shows the result of analyzing the center temperature T when the package structure 100 is exposed to the external environment (temperature and time) under predetermined conditions using the model 102 in consideration of the thermal deformation as described above. Here, the package structure 100 is a series of external environments of 240 ° C. for 30 minutes → 30 ° C. for 30 minutes → 180 ° C. for 30 minutes → 30 ° C. for 30 minutes → 180 ° C. for 30 minutes → 30 ° C. for 30 minutes. The conditions used for exposure are used. FIG. 8 also shows the analysis result of the central temperature T when the model 101 that does not consider thermal deformation is used and the package structure 100 is exposed to the external environment (temperature and time) under the same conditions. .

  First, a case where thermal deformation does not occur due to the external environment as in the model 101 of FIG. 7A, that is, the electronic component 10 is not thermally deformed and the bulge G of the inner package 20 is 0 mm will be described. Note that the thickness of the inner package 20 at the portion corresponding to the electronic component 10 (the thickness on the upper and lower sides sandwiching the electronic component 10) is 4.5 mm. In this case, the center temperature T of the package structure 100 increases as indicated by z in FIG.

  When the center temperature T of the model 101 is compared with the center temperature (measured temperature) of the actual package structure 100, the value tends to be lower than the measured temperature. Therefore, when the package structure 100 is designed based on the analysis result of the model 101 that does not consider such thermal deformation, the actual temperature of the electronic component 10 becomes higher than the design value, and the electronic component 10 is thermally damaged. There is a possibility of joining.

  The difference between the center temperature T obtained by the analysis using the model 101 and the actually measured temperature obtained for the package structure 100 is considered to be affected by thermal deformation as shown in the model 102.

  In the example of FIG. 8a using the model 102, it is assumed that the outer package 40 and the inner package 20 are made of the same material (for example, PPS resin), and the inner package 20 is deformed when its bulge G is 2 mm. T is analyzed. Note that the thickness of the inner package 20 at the portion corresponding to the electronic component 10 (the thickness on the upper and lower sides sandwiching the electronic component 10) is 4.5 mm. If the inner package 20 is deformed with a bulge G of 2 mm and approaches the outer package 40 due to the deformation (FIG. 8a), the center temperature T is assumed that the inner package 20 is not deformed (FIG. 8). higher than z).

  In the package structure 100, the distance L between the outer package 40 and the inner package 20 affects the temperature of the electronic component 10, and the inner package 20 swells and approaches the outer package 40, thereby increasing the temperature of the electronic component 10. Is more likely to occur.

Therefore, hereinafter, a package structure capable of suppressing such a temperature rise of the electronic component 10 will be described in detail as second to fourth embodiments.
First, a second embodiment will be described.

Here, a method for suppressing the temperature rise of the electronic component 10 by suppressing excessive deformation of the deformed inner package 20 to the outer package 40 will be described.
9 and 10 are views showing an example of the package structure according to the second embodiment. 9A to 9C schematically illustrate a cross section of the package structure when exposed to a relatively low temperature external environment, and FIGS. 10A to 10C illustrate the cross section. FIG. 2 schematically shows a cross section of the package structure when exposed to a relatively high temperature external environment. 9 and 10 correspond to the respective cross-sectional positions along the chain line S1, the alternate long and short dash line S2, and the alternate long and two short dashes line S3 in FIG. 1 described in the first embodiment. It is a cross-sectional schematic diagram to do. In addition, the relatively low temperature external environment here refers to a temperature environment in which the electronic component is not thermally deformed. The relatively high temperature external environment refers to a temperature environment in which thermal deformation occurs in the electronic component.

  A package structure 100a shown in FIGS. 9A to 9C includes an inner package 20, in which an electronic component 10 is embedded, a heat insulating material 30, and an outer package 40. The package structure 100 a is provided with a recess 43 in a portion corresponding to the electronic component 10 on the inner surface (the surface on the heat insulating material 30 side) of the outer package 40. In this respect, the package structure 100a is different from the package structure 100 according to the first embodiment.

  The package structure 100a can be formed by a procedure similar to that described with reference to FIGS. 4 to 6 for the package structure 100 described above. In that case, in the package structure 100a, the recesses are respectively formed on the inner surfaces of the lower and upper members of the outer package 40 (the lower outer package 41 and the upper outer package 42) corresponding to the lower and upper portions of the electronic component 10. 43 is provided. The outer package 40 provided with such a recess 43 is used, and the package structure 100a is formed according to the examples of FIGS.

  In the outer package 40 of the package structure 100a, the thickness of the outer package 40 is reduced at the portion where the concave portion 43 is provided, as compared with the other portions, because the concave portion 43 is provided. In the package structure 100a, the portion where the thickness of the outer package 40 is reduced in this way is kept within the region corresponding to the electronic component 10. Therefore, the area of the region where the thickness of the outer package 40 is reduced is suppressed, and a decrease in mechanical strength of the outer package 40 and the package structure 100a using the outer package 40 is suppressed.

  The depth D of the recess 43 provided in the outer package 40 is set based on thermal deformation that occurs in the electronic component 10 when the package structure 100a is used and deformation of the inner package 20 that occurs due to the thermal deformation.

  When the package structure 100a is exposed to a relatively high temperature external environment, for example, thermal deformation of the electronic component 10 and deformation of the inner package 20 as shown in FIGS. 10A to 10C may occur. . For example, due to thermal deformation of the electronic component 10, the lower and upper members (the lower inner package 21 and the upper inner package 22) whose four corners and the like of the inner package 20 are fixed with screws 50 are pushed from the inside at the center. The space 60 is formed by deforming so as to expand and expand. When the inner package 20 is deformed to swell, the fluid heat insulating material 30 is deformed so as to follow the deformation.

  In the package structure 100a, even if the inner package 20 swells due to the thermal deformation of the electronic component 10 as described above, the recess 43 is provided in the outer package 40. Therefore, the inner package 20 and the outer package 40 are excessively approached. Is suppressed. That is, in the package structure 100a, as shown in FIG. 9, by providing the recess 43 in the outer package 40, the inner surface of the outer package 40 at the portion corresponding to the electronic component 10 to the outer surface of the inner package 20 is provided. The distance L is originally longer. Therefore, as shown in FIG. 10, even when the electronic component 10 is thermally deformed and the inner package 20 swells, a certain distance L <b> 1 is ensured between the inner surface of the outer package 40 and the outer surface of the inner package 20. Thereby, the excessive approach of the inner package 20 and the outer package 40 is suppressed.

  The depth D of the recess 43 provided in the outer package 40 is set so that a constant distance L1 is secured between the outer package 40 and the inner package 20 even if the inner package 20 swells in this way.

  FIG. 11 shows the result of analyzing the center temperature T when the package structure 100a having the outer package 40 provided with the recess 43 is exposed to the external environment (temperature and time) under the same conditions as described in FIG. Show.

  In FIG. 11, a recess 43 having a depth D of 2 mm is provided in the outer package 40 (FIG. 9), and the inner package 20 is swollen to a deformation of 2 mm when exposed to the external environment (FIG. 10). The analysis result (b of FIG. 11) of the center temperature T is shown.

  Further, in FIG. 11, for comparison, when the outer package 40 is not provided with the recess 43 and the bulge G of the inner package 20 is 0 mm (model 101 in FIG. 7A), The analysis results (z in FIG. 11 (corresponding to z in FIG. 8)) are also shown. Further, in FIG. 11, for comparison, when the outer package 40 is not provided with the recess 43 and the bulge G of the inner package 20 is 2 mm (model 102 in FIG. 7B), the central temperature T The analysis results (a in FIG. 11 (corresponding to a in FIG. 8)) are also shown.

  In any case of FIG. 11 (a, b, z in FIG. 11), the thickness of the inner package 20 at the portion corresponding to the electronic component 10 (the thickness on the upper and lower sides sandwiching the electronic component 10) is 4. .5 mm.

  From FIG. 11, when the inner package 20 is deformed so as to swell (a and b in FIG. 11), when the recess 43 is provided in the outer package 40 (b in FIG. 11), the recess 43 is not provided (a in FIG. 11). ), The center temperature T can be kept low. When the outer package 40 is provided with the recess 43 (b in FIG. 11), the center temperature T tends to be relatively close to the center temperature T of the inner package 20 that does not bulge (z in FIG. 11). Is recognized.

  In the package structure 100a according to the second embodiment, the concave portion 43 having a depth D set in a portion corresponding to the electronic component 10 of the outer package 40 based on deformation (swelling) of the inner package 20 during use. Is provided. Thereby, even when the inner package 20 is deformed so as to swell, excessive approach between the inner package 20 and the outer package 40 is suppressed, and heat transfer to the electronic component 10 (heat resistance from the outer package 40 to the electronic component 10 is reduced). Reduction) is suppressed. As a result, the temperature rise of the electronic component 10 and the resulting thermal damage to the electronic component 10 are effectively suppressed, and the high-performance and highly reliable package structure 100a is realized.

Next, a third embodiment will be described.
Here, a method of suppressing the temperature rise of the electronic component 10 by increasing the thermal resistance of the deformed inner package 20 will be described.

  12 and 13 are views showing an example of a package structure according to the third embodiment. FIG. 12 schematically illustrates a cross-section of the main part of the package structure when exposed to a relatively low temperature external environment, and FIG. 13 illustrates the package structure when exposed to a relatively high temperature external environment. The cross section of the main part of the body is schematically shown. Here, the relatively low temperature external environment refers to a temperature environment in which electronic components do not undergo thermal deformation, and the relatively high temperature external environment refers to a temperature at which electronic components undergo thermal deformation. Say the environment.

  In the package structure 100b shown in FIG. 12, the inner package 20 containing the electronic component 10 includes a plurality of layers 23 (23a, 23b, 23c, and 23d as an example here). FIG. 12 illustrates, as the member 23, a package structure 100b having two layers of members 23a and 23b on the lower side of the electronic component 10 and two layers of members 23c and 23d on the upper side of the electronic component 10. Yes. The package structure 100b is different from the package structure 100 according to the first embodiment in that the inner package 20 including such a multi-layer member 23 is used.

  The package structure 100b can be formed in the same procedure as described for the package structure 100 with reference to FIGS. In that case, in the package structure 100b, a plurality of layers of members 23 sandwiching the electronic component 10 from above and below, that is, in this example, a total of four layers of members 23a, 23b, 23c, and 23d of the lower two layers and the upper two layers are prepared. The Then, according to the example of FIG. 4 described above, the electronic component 10 is arranged between the lower two-layer members 23a and 23b and the upper two-layer members 23c and 23d, and the members 23a, 23b, 23c, and 23d are Those four corners are fixed with screws 50. Thereafter, the heat insulating material 30 and the outer package 40 are provided in accordance with the example of FIGS. 5 and 6, and the package structure 100b is formed.

  When the package structure 100b is exposed to a relatively high temperature external environment, for example, as shown in FIG. 13, thermal deformation of the electronic component 10 and deformation of the inner package 20 may occur. For example, in the package structure 100b, a force pushed by the electronic component 10 that is thermally deformed acts on the inner package 20 whose four corners and the like are fixed by screws 50, so that the space 60 (between the members 23a and 23c closest to the electronic component 10 is provided. For example, an air layer) is formed. Further, in the package structure 100b, the gas (for example, air) between the layers of the members 23a, 23b, 23c, and 23d is thermally expanded, and a space 61 (for example, an air layer) is formed between the layers. Due to the thermal deformation of the electronic component 10 and the formation of the spaces 61 and 60 between the layers of the members 23a, 23b, 23c, and 23d, the inner package 20 is deformed so that the central portion is expanded from the inside to expand. Can do. When the inner package 20 is deformed so as to swell, the fluid heat insulating material 30 is deformed so as to follow the deformation.

  In the package structure 100b, the spaces 61 and 60 are formed between the members 23a, 23b, 23c, and 23d of the inner package 20, so that the thermal resistance of the inner package 20 increases. As the thermal resistance of the inner package 20 increases in this way, it is possible to delay the time for heat from the external environment to be transmitted from the outer package 40 to the electronic component 10, thereby increasing the temperature of the electronic component 10, and thereby the electronic component 10 thermal damage can be suppressed.

  Here, as the inner package 20, an example in which the electronic component 10 includes two members 23 (23 a, 23 b, 23 c, 23 d), two layers on the lower side and two layers on the upper side, is illustrated. The number of 20 layers is not limited to this. As the inner package 20, one having two or more layers of members 23 on the lower side of the electronic component 10 and two or more layers of members 23 on the upper side can be used. In this case, the number of layers of the members 23 provided on the lower side and the upper side of the electronic component 10 is not necessarily the same.

Further, the thickness of each of the group of members 23 provided on the lower side and the upper side of the electronic component 10 does not necessarily need to be the same or equivalent.
The package structure 100b using the inner package 20 having the multi-layer members 23 on the upper side and the lower side of the electronic component 10 was exposed to the external environment (temperature and time) under the same conditions as described in FIG. FIG. 14 shows the result of analyzing the center temperature T at the time.

  In FIG. 14, the inner package 20 has two layers of members 23 on the upper and lower sides of the electronic component 10 (FIG. 12), and the inner package 20 swells and deforms by 2 mm when exposed to the external environment (FIG. 13). ) Shows the analysis result (c1 in FIG. 14) of the center temperature T. Here, the thickness of each member 23 corresponding to the electronic component 10 is 2.25 mm, and each member 23 is expanded by 1 mm (the total of the upper and lower sides of the member 23 group across the electronic component 10) Thickness is 4.5mm, bulge G is 2mm).

  14 further shows that the inner package 20 has three layers of members 23 on the upper and lower sides of the electronic component 10, respectively, and the inner package 20 bulges in the inner package 20 and the center G is deformed by 2 mm. The analysis result of temperature T (d1 of FIG. 14) is shown. Here, the thickness of each member 23 corresponding to the electronic component 10 is set to 1.5 mm, and each member 23 is expanded by 0.67 mm (on the upper and lower sides of the member 23 group across the electronic component 10). The total thickness is 4.5mm and the bulge G is 2mm).

  14 further shows that the inner package 20 has five layers of members 23 on the upper and lower sides of the electronic component 10, respectively, and the inner package 20 bulges in the inner package 20 and the center G is deformed by 2 mm. The analysis result of temperature T (e1 of FIG. 14) is shown. Here, the thickness of each member 23 corresponding to the electronic component 10 is 0.9 mm, and each member 23 swells 0.4 mm (on the upper and lower sides of the member 23 group across the electronic component 10). The total thickness is 4.5mm and the bulge G is 2mm).

In any case (c1, d1, e1 in FIG. 14), the outer package 40 is not provided with the recess 43 as described in the second embodiment.
For comparison, FIG. 14 shows a center temperature T in the case where the outer package 40 is not provided with the recess 43 and the bulge G of the inner package 20 is 0 mm, as described in the first embodiment. The analysis results (z in FIG. 14 (corresponding to z in FIG. 8)) are also shown. Further, for comparison, FIG. 14 shows a central temperature T in the case where the outer package 40 is not provided with the recess 43 and the bulge G of the inner package 20 is 2 mm, as described in the first embodiment. The analysis results (a in FIG. 14 (corresponding to a in FIG. 8)) are also shown. In any case (a and z in FIG. 14), the thickness of the inner package 20 at the site corresponding to the electronic component 10 is 4.5 mm.

  14, when the inner package 20 is deformed so as to swell (a, c1, d1, e1 in FIG. 14), a structure having a plurality of layers of members 23 on the upper side and the lower side of the electronic component 10 (c1 in FIG. 14). , D1, e1), the center temperature T can be kept low. When the structure (c1, d1, e1 in FIG. 14) having a plurality of layers of members 23 on the upper side and the lower side of the electronic component 10 is employed, the center temperature T is assumed that the inner package 20 does not bulge. A tendency to be relatively close to the center temperature T (z in FIG. 14) is recognized. Moreover, when the structure (c1, d1, e1 of FIG. 14) which has the member 23 of the multi-layer each on the upper side and the lower side of the electronic component 10 is employ | adopted, center part temperature T increases the number of layers of the member 23 As a result, a tendency to be kept low is recognized.

  In the package structure 100b according to the third embodiment, the inner package 20 having a plurality of layers of members 23 is provided on the upper side and the lower side of the electronic component 10, respectively. In the package structure 100b, when the inner package 20 is deformed, spaces 61 and 60 are formed between the layers of the group of members 23, and the thermal resistance of the inner package 20 increases. Thereby, it is possible to delay the time for heat from the external environment to be transmitted from the outer package 40 to the electronic component 10. As a result, the temperature rise of the electronic component 10 and the resulting thermal damage of the electronic component 10 are effectively suppressed, and a high-performance and highly reliable package structure 100b is realized.

Next, a fourth embodiment will be described.
Here, a method of suppressing the temperature rise of the electronic component 10 by increasing the thermal resistance of the deformed inner package 20 and suppressing excessive deformation of the deformed inner package 20 to the outer package 40 will be described. .

  15 and 16 are views showing an example of a package structure according to the fourth embodiment. FIG. 15 schematically illustrates a cross-section of the main part of the package structure when exposed to a relatively low temperature external environment, and FIG. 16 illustrates the package structure when exposed to a relatively high temperature external environment. The cross section of the main part of the body is schematically shown. Here, the relatively low temperature external environment refers to a temperature environment in which electronic components do not undergo thermal deformation, and the relatively high temperature external environment refers to a temperature at which electronic components undergo thermal deformation. Say the environment.

  A package structure 100c shown in FIG. 15 is a recess 43 as described in the second embodiment on the inner surface of the outer package 40 (the surface on the heat insulating material 30 side) corresponding to the electronic component 10. Is provided. In this respect, the package structure 100c is different from the package structure 100b according to the third embodiment.

  The package structure 100c can be formed in the same procedure as shown in FIGS. In that case, in the package structure 100c, as the inner package 20, a plurality of layers of members 23 sandwiching the electronic component 10 from above and below, that is, four layers of members 23a, 23b, 23c, and 23d in this example are prepared. Further, as the outer package 40, there are provided the recesses 43 in the portions corresponding to the lower and upper sides of the electronic component 10 on the inner surfaces of the lower and upper members (the lower outer package 41 and the upper outer package 42), respectively. Be prepared. Such an inner package 20 and an outer package 40 are used, and a package structure 100c is formed according to the example of FIGS.

  When the package structure 100c is exposed to a relatively high temperature external environment, for example, as shown in FIG. 16, the electronic component 10 is thermally deformed, and due to thermal expansion of the internal gas, members 23a, Spaces 61 and 60 are formed between the respective layers 23b, 23c, and 23d. At that time, the inner package 20 can be deformed so that the central portion is pushed and expanded from the inside. Even in the case where the inner package 20 is deformed so as to swell, the package structure 100c is provided with the concave portion 43 in a portion corresponding to the electronic component 10 of the outer package 40. Approach is suppressed.

FIG. 17 shows the result of analyzing the center temperature T when the package structure 100c is exposed to the external environment (temperature and time) under the same conditions as described in FIG.
In FIG. 17, the inner package 20 has two layers of members 23 on the upper and lower sides of the electronic component 10 (FIG. 15), and the inner package 20 swells and deforms by 2 mm when exposed to the external environment (FIG. 16). ) Shows the analysis result (c2 in FIG. 17) of the center temperature T. Here, it is assumed that the thickness of each member 23 corresponding to the electronic component 10 is 2.25 mm, and each member 23 expands by 1 mm.

  Further, in FIG. 17, the inner package 20 has three layers of members 23 on the upper and lower sides of the electronic component 10, respectively, and the central portion in the case where the inner package 20 bulges to the inner package 20 and a deformation of 2 mm occurs. The analysis result (d2 of FIG. 17) of the temperature T is shown. Here, it is assumed that the thickness of each member 23 corresponding to the electronic component 10 is 1.5 mm, and each member 23 swells 0.67 mm.

  Further, in FIG. 17, the inner package 20 has five layers of members 23 on the upper and lower sides of the electronic component 10, respectively, and the central portion in the case where the inner package 20 bulges and the deformation of 2 mm occurs when exposed to the external environment. The analysis result of temperature T (e2 of FIG. 17) is shown. Here, it is assumed that the thickness of each member 23 corresponding to the electronic component 10 is 0.9 mm, and each member 23 expands 0.4 mm.

  In any case (c2, d2, e2 in FIG. 17), the outer package 40 is provided with a recess 43 having a depth D of 2 mm based on the 2 mm bulge G of the inner package 20.

  For comparison, FIG. 17 shows a central temperature T when the outer package 40 is not provided with the recess 43 and the bulge G of the inner package 20 is 0 mm, as described in the second embodiment. The analysis results (z in FIG. 17 (corresponding to z in FIG. 11)) are also shown. Further, for comparison, FIG. 17 shows a case where the outer package 40 is provided with the recess 43 having a depth D of 2 mm and the bulge G of the inner package 20 is 2 mm, as described in the second embodiment. The analysis result of the central temperature T (b in FIG. 17 (corresponding to b in FIG. 11)) is also shown. In any case (b and z in FIG. 17), the thickness of the inner package 20 at the site corresponding to the electronic component 10 is 4.5 mm.

  17 (b, c2, d2, e2 in FIG. 17), when the outer package 40 has a recess 43 and the inner package 20 has a multi-layer member 23 (c2, d2, e2 in FIG. 17). The center temperature T can be kept low. When the structure having the multi-layer member 23 is adopted (c2, d2, e2 in FIG. 17), the center temperature T does not bulge in the inner package 20 as compared with the case where the structure is not adopted (b in FIG. 17). In this case (see z in FIG. 17), a tendency to be relatively close to the center temperature T is recognized. Moreover, when the structure which has the member 23 of multiple layers is employ | adopted (c2, d2, e2 of FIG. 17), the center part temperature T tends to be restrained low as the number of layers of the member 23 increases. .

  In the package structure 100c, heat transfer to the electronic component 10 is suppressed due to an increase in the thermal resistance of the inner package 20 due to the spaces 61 and 60 and suppression of excessive proximity between the outer package 40 and the inner package 20 due to the recesses 43. . Thereby, the temperature rise of the electronic component 10 and the thermal damage of the electronic component 10 caused thereby can be suppressed.

Regarding the embodiment described above, the following additional notes are further disclosed.
(Appendix 1) Electronic components,
A first package covering the electronic component;
A second package covering the first package;
A heat insulating material provided between the first package and the second package;
The package structure according to claim 1, wherein the second package has an inner surface facing the heat insulating material and has a recess in a portion corresponding to the electronic component.

(Appendix 2) The first package is:
A first member provided on one side across the electronic component;
A second member provided on the other side across the electronic component,
The package structure according to appendix 1, wherein the first member and the second member are fixed with screws.

  (Supplementary note 3) The package structure according to Supplementary note 1 or 2, wherein a depth of the concave portion is set based on a deformation amount of the first package to the second package side when heated. body.

(Appendix 4) Electronic components,
A first package covering the electronic component;
A second package covering the first package;
A heat insulating material provided between the first package and the second package;
The package structure according to claim 1, wherein the first package includes a plurality of layers on one side and the other side of the electronic component.

(Additional remark 5) The said 2nd package is an inner surface facing the said heat insulating material, Comprising: The package structure of Additional remark 4 characterized by having a recessed part in the site | part corresponding to the said electronic component.
(Appendix 6) The member of the plurality of layers on one side across the electronic component and the member of the plurality of layers on the other side sandwiching the electronic component are fixed by screws. Or the package structure of 5.

(Supplementary note 7) The package structure according to any one of supplementary notes 4 to 6, wherein gas is contained between the members of the plurality of layers.
(Supplementary note 8) The package structure according to supplementary note 7, wherein a space is formed between the members of the plurality of layers by thermal expansion of the gas when heated.

(Supplementary Note 9) The second package is:
A third member for accommodating the first package;
A fourth member fitted to the third member;
The package structure according to any one of appendices 1 to 8, wherein the first package is sealed by the third member and the fourth member fitted to the third member. .

(Supplementary Note 10) The electronic component is
A substrate,
An antenna provided on the substrate;
A package structure according to any one of appendices 1 to 9, further comprising: a semiconductor element provided on the substrate and electrically connected to the antenna.

  (Additional remark 11) The said heat insulating material has fluidity | liquidity, The package structure in any one of Additional remark 1 thru | or 10 characterized by the above-mentioned.

DESCRIPTION OF SYMBOLS 10 Electronic component 11 Board | substrate 12 Antenna 13 Control IC chip 14 Memory chip 20 Inner package 21 Lower inner package 22 Upper inner package 21a, 22a, 43 Recess 23, 23a, 23b, 23c, 23d Member 30 Heat insulating material 40 Outer package 41 Below Side outer package 41a Housing portion 41b Fitting portion 41c Clearance 42 Upper outer package 50 Screw 50a Screw hole 60, 61 Space 100, 100a, 100b, 100c Package structure 101, 102 Model 110 structure

Claims (6)

Electronic components,
A first package covering the electronic component;
A second package covering the first package;
A heat insulating material provided between the first package and the second package;
The package structure according to claim 1, wherein the second package is a part of an inner surface facing the heat insulating material and has a recess in a region corresponding to the electronic component in the region . The first package is:
A first member provided on one side across the electronic component;
A second member provided on the other side across the electronic component,
The package structure according to claim 1, wherein the first member and the second member are fixed with screws. Electronic components,
A first package covering the electronic component;
A second package covering the first package;
A heat insulating material provided between the first package and the second package;
The package structure according to claim 1, wherein the first package includes a plurality of members each having a space formed between layers by heat on one side and the other side of the electronic component.   4. The package structure according to claim 3, wherein the second package has an inner surface facing the heat insulating material and has a recess in a portion corresponding to the electronic component.   The member of the plurality of layers on one side with the electronic component interposed therebetween and the member of the plurality of layers on the other side sandwiching the electronic component are fixed with screws. Package structure as described. The second package is:
A third member for accommodating the first package;
A fourth member fitted to the third member;
The package structure according to any one of claims 1 to 5, wherein the first package is sealed by the third member and the fourth member fitted to the third member. body.

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