JP6186946B2 - Optical three-dimensional modeling resin composition and three-dimensional modeling - Google Patents

Description

  The present invention provides a resin for optical three-dimensional modeling that has a low viscosity in an uncured state, a high curing speed by light irradiation, excellent molding accuracy, and excellent three-dimensional modeling properties such as strength and heat resistance. Relates to the composition.

In addition to various characteristics such as fast polymerization rate, good workability due to the absence of solvent, energy saving of extremely low energy requirements, active energy ray polymerization technology has recently reduced environmental pollution due to environmental pollution problems. Therefore, the field of use is expanding in the fields of building materials, packaging materials, printing materials, display materials, electrical and electronic component materials, optical devices, displays, and the like.
These contain only a resin that can be polymerized with active energy rays and a monomer having an α, β-unsaturated double bond group, and since the monomer also functions as a solvent, a coating film or a molded product is formed. This is because sometimes the solvent does not volatilize. And as this resin having active energy ray polymerizability, it has an α, β-unsaturated double bond group at the molecular terminal of a low molecular weight polyester resin, polyurethane resin, polyepoxy resin, polyacrylic resin, etc. Oligomers and monomers having an α, β-unsaturated double bond group are used.

In recent years, as a method for producing resin molded products, an ultraviolet laser, which is a kind of active energy ray, is obtained from a liquid photocurable resin composition based on three-dimensional shape data designed by a three-dimensional design system (three-dimensional CAD) on a computer. An optical three-dimensional modeling method (optical modeling method) for producing a molded product by selectively curing with light is used.
Compared to conventional cutting, this stereolithography method can deal with complex shapes that are difficult to cut, is a fully automated process, is easy to handle, has a short manufacturing time, and is advantageous in terms of cost. In addition to the production of resin products, it has come to be widely used in the manufacture of prototype models and medical models for design studies, performance tests, advertisements, and the like.
As a representative example of this three-dimensional modeling method, light, for example, a kind of active energy ray, is obtained so that a polymerization cured layer having a desired pattern is obtained on the liquid surface of the liquid photocurable resin composition placed in a container. Is selectively irradiated with ultraviolet laser light to obtain a polymerized cured layer, and then a liquid photocurable resin composition is supplied on the cured layer in a layered manner, and then the light is selectively irradiated as described above. Irradiation forms a cured polymer layer that is continuous with the cured layer. This is a method of finally obtaining a desired three-dimensional modeled object by repeating this lamination operation. This three-dimensional modeling method is attracting attention because even if the shape of a model to be manufactured is complicated, the target model can be easily obtained in a short time.

As the optical three-dimensional modeling method, for example, as disclosed in Patent Document 1, the energy supply necessary for the liquid photocurable resin composition is selectively performed to form a three-dimensional modeled object having a desired shape. Is the method. Such a method or an improved technique thereof is disclosed in Patent Documents 2 and 3.

As a photocurable resin composition used for the above-mentioned optical modeling, from the viewpoint of efficient optical modeling, it is possible to quickly form a smooth liquid surface with low viscosity, transparency and good photocuring. It is required to have sex. In addition, there is a problem that the cured product may be deformed over time (warping, shrinkage, lifting of the overhang portion, etc.) due to residual distortion caused by shrinkage (curing shrinkage) during polymerization curing by light. Small deformation over time is required. Furthermore, depending on the application, the polymerized cured product is required to have mechanical strength such as toughness, heat resistance, moisture resistance, and water resistance.

Conventionally, as such a photocurable resin composition, from the viewpoint of transparency, photocurability and the like, radically polymerizable compounds such as urethane (meth) acrylate, epoxy (meth) acrylate, and photosensitive polyimide (for example, patents) Documents 4 and 5), resin compositions containing cationically polymerizable compounds such as epoxy compounds and vinyl ether compounds (for example, Patent Document 6) are used. However, with the recent miniaturization and complication of target products, the demand for dimensional accuracy has become increasingly severe, and the temporal deformation characteristics of the resin composition cannot satisfy the demand.
Furthermore, Patent Document 7 discloses a photocurable liquid composition containing fine hollow spheres whose absolute value of the difference in refractive index from an ethylenically unsaturated monomer or photoinitiator is not 0. It is described that the transparency of the ionic liquid composition is reduced. Furthermore, Patent Document 8 discloses a radiation curable resin composition containing a color former, and a three-dimensional article produced from the radiation curable resin composition exhibits different colors before and after curing. Is described.
However, the cured resin obtained by curing the above resin composition has not yet satisfied all the requirements for toughness, water resistance, physical property stability and suppression of deformation over time.
JP 60-247515 A JP-A-62-035966), (US Pat. No. 4,575,330) JP 62-101408 A JP-A-2-228312 JP-A-5-279436 JP-A-1-213304 Japanese Patent No. 2648222 JP 2005-510603 A

  An object of the present invention is to provide a resin composition for optical three-dimensional modeling that is small in deformation with time and that can obtain a cured product having excellent toughness and stability over time. Moreover, it aims at providing the hardened | cured material of this composition.

As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that the above-mentioned goal can be achieved by the resin composition for optical three-dimensional modeling shown below, and have further completed the present invention with a three-dimensional model. .
That is, the present invention provides an oligomer (A) having at least one α, β-unsaturated double bond group in the molecule,
A resin composition for optical three-dimensional modeling, comprising an α, β-unsaturated double bond group-containing compound (B) (excluding those corresponding to the oligomer (A)), wherein the following (1) and It is a resin composition for optical three-dimensional modeling characterized by being (2) ,
Furthermore, an α, β-unsaturated double bond group-containing compound (C) having no amide group and a ring structure (however, oligomer (A) and α, β-unsaturated double bond group-containing compound (B ), An α, β-unsaturated double bond group-containing compound (C) having a ring structure that does not contain a heteroatom, and an α, β-unsaturated double bond group-containing compound (C1)
The α, β-unsaturated double bond group-containing compound (c1) having a ring structure not containing a hetero atom is an α, β-unsaturated double bond group-containing compound (c1-1) having a hydroxyl group,
Furthermore, it is related with the resin composition for optical three-dimensional model | molding characterized by containing a silane compound (F) .
(1) The α, β-unsaturated double bond group-containing compound (B) has one or more amide groups in the molecule.
(2) The α, β-unsaturated double bond group-containing compound (B) has a hydroxyl group and / or an alkoxy group.

Furthermore, the present invention provides the above-mentioned resin for optical three-dimensional modeling, comprising 1 to 500 parts by weight of the α, β-unsaturated double bond group-containing compound (B) with respect to 100 parts by weight of the oligomer (A). Relates to the composition.

  Furthermore, in the present invention, the oligomer (A) is a polyester oligomer (a-1), a polyurethane oligomer (a-2), a polyepoxy oligomer (a-3), or a polyacrylic oligomer (a-4). It is related with said resin composition for optical three-dimensional shaping | molding characterized by being at least 1 or more types of oligomer chosen from the group which consists of.

Furthermore, this invention relates to said resin composition for optical three-dimensional modeling characterized by the weight average molecular weights of an oligomer (A) being 300-30,000.

Furthermore, the present invention is characterized in that the α, β-unsaturated double bond group-containing compound (B) is an aliphatic α, β-unsaturated double bond group-containing compound having no ring structure. It relates to the resin composition for optical three-dimensional modeling.

Further, other α, β-unsaturated double bond group-containing compound (D) having no amide group (however, oligomer (A), α, β-unsaturated double bond group-containing compound (B) and α) , Β-unsaturated double bond group-containing compound (C) is excluded) and the resin composition for optical three-dimensional modeling described above.

Furthermore, this invention relates to said resin composition for optical three-dimensional model | molding which contains 0.01-30 weight part of active energy ray polymerization initiators (E) with respect to 100 weight part of resin compositions further. .

Furthermore, the present invention relates to a cured resin obtained by polymerizing and curing the resin composition for optical three-dimensional modeling using active energy rays.

Furthermore, this invention relates to the three-dimensional molded item which consists of a resin hardened | cured material as described above.

  According to the present invention, there is little deformation at the time of molding such as warping and swelling, and it is possible to produce a highly accurate modeled object by the optical three-dimensional modeling method, and the mechanical properties of the polymerized cured product are excellent. The object can provide a resin composition for optical three-dimensional modeling that can also be used as a mechanism part.

The resin composition for optical three-dimensional modeling of the present invention contains an oligomer (A) having at least one α, β-unsaturated double bond group in the molecule and an α, β-unsaturated double bond group. It is characterized by being a resin composition for optical three-dimensional modeling containing the compound (B) (excluding those corresponding to the oligomer (A)) and being the following (1) and (2).
(1) The α, β-unsaturated double bond group-containing compound (B) has one or more amide groups in the molecule.
(2) The α, β-unsaturated double bond group-containing compound (B) has a hydroxyl group and / or an alkoxy group.
In the resin composition for optical three-dimensional modeling of the present invention (hereinafter referred to as a resin composition), as an oligomer (A) having at least one α, β-unsaturated double bond group, a polyester-based oligomer (a -1), at least one oligomer selected from the group consisting of polyurethane oligomers (a-2), polyepoxy oligomers (a-3) and polyacrylic oligomers (a-4), particularly limited Can be used without

Of the oligomers (A) having at least one α, β-unsaturated double bond group, the polyester oligomer (a-1) may be any one having at least one ester bond in the main chain skeleton. It can be used without particular limitation, and the terminal of the polyester obtained by polycondensation of a polybasic acid and a polyhydric alcohol or a hydroxyl group in the polyester chain and one or more carboxyls in the molecule described later such as (meth) acrylic acid or maleic acid A compound obtained by esterification with an α, β-unsaturated double bond group-containing compound having a group, or a carboxyl group in a polyester terminal or a polyester chain and 2-hydroxyethyl (meth) acrylate, (meth) acrylic An α, β-unsaturated double bond group-containing compound having one or more hydroxyl groups in the molecule to be described later, such as 2-hydroxypropyl acid; It is a compound obtained by esterification. In addition, there are polyester oligomers obtained from an acid anhydride, glycidyl (meth) acrylate, and a compound having at least one hydroxyl group.

Examples of the polybasic acid include aliphatic, alicyclic, and aromatic acids, and each can be used without any particular limitation. More specifically, examples of the aliphatic polybasic acid include oxalic acid, malonic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, suberic acid, maleic acid, chloromaleic acid, fumaric acid, and dodecanedioic acid. Examples thereof include acid, pimelic acid, citraconic acid, glutaric acid, itaconic acid, succinic anhydride, maleic anhydride, and the like, and these aliphatic dicarboxylic acids and anhydrides thereof can be used. Derivatives of succinic anhydride (methyl succinic anhydride, 2,2-dimethyl succinic anhydride, butyl succinic anhydride, isobutyl succinic anhydride, hexyl succinic anhydride, octyl succinic anhydride, dodecenyl succinic anhydride, phenyl anhydride Succinic acid, etc.), glutaric anhydride derivatives (glutaric anhydride, 3-allyl glutaric anhydride, 2,4-dimethyl glutaric anhydride, 2,4-diethyl glutaric anhydride, butyl glutaric anhydride, hexyl glutaric anhydride, etc. ), Maleic anhydride derivatives (2-methylmaleic anhydride, 2,3-dimethylmaleic anhydride, butylmaleic anhydride, pentylmaleic anhydride, hexylmaleic anhydride, octylmaleic anhydride, decylmaleic anhydride, dodecyl Maleic anhydride, 2,3-dichloromaleic anhydride, phenyl maleic anhydride Phosphate, also anhydride derivative of 2,3-diphenyl maleic anhydride, etc.) and the like can be used.

More specifically, as the alicyclic polybasic acid, for example, as the alicyclic dicarboxylic acid, for example, dimer acid, cyclopropane-1α, 2α-dicarboxylic acid, cyclopropane-1α, 2β-dicarboxylic acid , Cyclopropane-1β, 2α-dicarboxylic acid, cyclobutane-1,2-dicarboxylic acid, cyclobutane-1α, 2β-dicarboxylic acid, cyclobutane-1α, 3β-dicarboxylic acid, cyclobutane-1α, 3α-dicarboxylic acid, (1R) -Cyclopentane-1β, 2α-dicarboxylic acid, trans-cyclopentane-1,3-dicarboxylic acid, (1β, 2β) -cyclopentane-1,3-dicarboxylic acid, (1β, 3β) -cyclopentane-1, 3-dicarboxylic acid, (1S, 2S) -1,2-cyclopentanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, , 3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,1-cycloheptanedicarboxylic acid, cubane-1,4-dicarboxylic acid, 2,3-norbornanedicarboxylic acid, hexahydroterephthalic acid, hexahydroisophthalic acid Saturated cycloaliphatic dicarboxylic acids such as hexahydrophthalic acid and tetrahydrophthalic acid, 1-cyclobutene-1,2-dicarboxylic acid, 3-cyclobutene-1,2-dicarboxylic acid, 1-cyclopentene-1,2-dicarboxylic acid Acid, 4-cyclopentene-1,3-dicarboxylic acid, 1-cyclohexene-1,2-dicarboxylic acid, 2-cyclohexene-1,2-dicarboxylic acid, 3-cyclohexene-1,2-dicarboxylic acid, 4-cyclohexene- 1,3-dicarboxylic acid, 2,5-hexadiene-1α, 4α-dicar Unsaturated double bond in such phosphate rings include one or two unsaturated alicyclic dicarboxylic acid having, like these alicyclic dicarboxylic acids and anhydrides thereof can be used.
Also, derivatives of hexahydrophthalic anhydride ((3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride), tetrahydrophthalic anhydride derivatives (1,2,3,6-tetrahydrophthalic anhydride, 3 -Methyl-1,2,3,6-tetrahydrophthalic anhydride, 4-methyl-1,2,3,6-tetrahydrophthalic anhydride, methylbutenyl-1,2,3,6-tetrahydrophthalic anhydride, etc.) The hydrogenated phthalic anhydride derivative can also be used as an alicyclic dicarboxylic acid anhydride.

More specifically, examples of the aromatic polybasic acid include, for example, o-phthalic acid, isophthalic acid, terephthalic acid, toluene dicarboxylic acid, 2,5-dimethylterephthalic acid, 2 , 2'-biphenyldicarboxylic acid, 4,4-biphenyldicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, norbornene dicarboxylic acid, diphenylmethane-4,4'-dicarboxylic acid, phenylindanedicarboxylic acid 1,2-azulene dicarboxylic acid, 1,3-azulene dicarboxylic acid, 4,5-azulene dicarboxylic acid, (-)-1,3-acetonaphthenedicarboxylic acid, 1,4-anthracene dicarboxylic acid, 1,5- Anthracene dicarboxylic acid, 1,8-anthracene dicarboxylic acid, 2,3-anthracenedica Aromatic dicarboxylic acids such as boronic acid, 1,2-phenanthenedicarboxylic acid, 4,5-phenanthenedicarboxylic acid, 3,9-perylenedicarboxylic acid, and aromatic dicarboxylic acids such as phthalic anhydride and 4-methylphthalic anhydride An anhydride is mentioned, These aromatic dicarboxylic acid and its anhydride etc. can be utilized.

Furthermore, chlorendic anhydride, het anhydride, biphenyldicarboxylic anhydride, hymic anhydride, endomethylene-1,2,3,6-tetrahydrophthalic anhydride, methyl-3,6-endomethylene-1,2,3 , 6-tetrahydrophthalic anhydride, 1,2-cyclohexanedicarboxylic anhydride, 1-cyclopentene-1,2-dicarboxylic anhydride, methylcyclohexene dicarboxylic anhydride, 1,8-naphthalenedicarboxylic anhydride, octahydro- Acid anhydrides such as 1,3-dioxo-4,5-isobenzofurandicarboxylic acid anhydride can also be used as the polybasic acid.

Polyhydric alcohols include relatively low molecular weight polyols having a number average molecular weight (Mn) of about 50 to 500 and relatively high molecular weight polyols having a number average molecular weight (Mn) of 500 to 50,000. Each can be used without any particular limitation.
More specific examples of relatively low molecular weight polyols include ethylene glycol, propylene glycol, dipropylene glycol, diethylene glycol, triethylene glycol, butylene glycol, 3-methyl-1,5-pentanediol, 2, 4-diethyl-1,5-pentanediol, 2-methyl-1,8-octanediol, 3,3′-dimethylolheptane, 2-butyl-2-ethyl-1,3-propanediol, polyoxyethylene glycol (Addition mole number 10 or less), polyoxypropylene glycol (addition mole number 10 or less), propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol 1,9-nonanediol, neopentyl glycol, Aliphatic or cycloaliphatic diols such as octanediol, butylethylpentanediol, 2-ethyl-1,3-hexanediol, cyclohexanediol, cyclohexanedimethanol, tricyclodecane dimethanol, cyclopentadiene dimethanol, dimer diol;
1,3-bis (2-hydroxyethoxy) benzene, 1,2-bis (2-hydroxyethoxy) benzene, 1,4-bis (2-hydroxyethoxy) benzene, 4,4′-methylenediphenol, 4, 4 ′-(2-norbornylidene) diphenol, 4,4′-dihydroxybiphenol, o-, m- and p-dihydroxybenzene, 4,4′-isopropylidenephenol, addition-type bisphenol obtained by adding alkylene oxide to bisphenol Aromatic diols and the like.
Examples of the raw material bisphenol of addition-type bisphenol include bisphenol A and bisphenol F, and examples of the raw material alkylene oxide include ethylene oxide and propylene oxide.

More specific examples of the relatively high molecular weight polyols include high molecular weight polyester polyols, high molecular weight polyamide polyols, high molecular weight polycarbonate polyols, and high molecular weight polyurethane polyols. The high molecular weight polycarbonate polyol is obtained by reacting the above-mentioned relatively low molecular weight diol with a carbonate or phosgene.

Examples of commercially available high molecular weight polyester polyols include Byron GK640 manufactured by Toyobo Co., Ltd. [number average molecular weight (hereinafter also referred to as “Mn”) = 18,000, glass transition temperature (hereinafter also referred to as “Tg”). Described) = 79 ° C., hydroxyl value = 5, acid value <4, linear type], Byron GK880 (Mn = 18,000, Tg = 84 ° C., hydroxyl value = 5, acid value <4, linear type), Byron 300 (Mn = 23,000, Tg = 7 ° C., hydroxyl value = 5, acid value <2, linear type), Byron 500 (Mn = 23,000, Tg = 4 ° C., hydroxyl value = 5, acid value <2) , Linear type), Byron 560 (Mn = 19000, Tg = 7 ° C., hydroxyl value = 8, acid value <2, branched type) and Byron 630 (Mn = 20,000, Tg = 75 ° C., hydroxyl group) Value = 5, acid value 1, linear type);
UE-3600 (Mn = 20,000, Tg = 75 ° C., hydroxyl value = 4, acid value = 1), UE-3690 (Mn = 14,000, Tg = 91 ° C., hydroxyl value = 8, manufactured by Kuraray Co., Ltd.) Acid value = 1) [manufactured by Unitika Ltd.], P1010 (Mn = 1,000, hydroxyl value = 112, acid value <0.5, linear liquid type), P2010 (Mn = 2,000, hydroxyl value = 56) , Acid value <0.5, linear liquid type), P4010 (Mn = 4,000, hydroxyl value = 28, acid value <0.5, linear liquid type), P5010 (Mn = 5,000, hydroxyl value = 22). , Acid value <0.5, linear liquid type), P6010 (Mn = 6,000, hydroxyl value = 19, acid value <0.5, linear liquid type), P4050 (Mn = 4,000, hydroxyl value = 28). , Acid value <0.5, linear liquid type), P6010 Mn = 6,000, hydroxyl value = 19, acid value <0.5, linear liquid type), N4010 (Mn = 4,000, hydroxyl value = 28, acid value <0.5, linear liquid type), PNOA4014 ( Mn = 4,000, hydroxyl value = 28, acid value <0.5, linear liquid type), P2011 (Mn = 2,000, hydroxyl value = 56, acid value <0.5, linear liquid type), and P4011 (Mn = 4,000, hydroxyl value = 28, acid value <0.5, linear liquid type);
Kyowa Hakko Chemical Co., Ltd. Kyowapol 2000BA (Mn = 2,000, hydroxyl value = 58, acid value <0.5, linear liquid type) and Kyowapol 5000PA (Mn = 5,000, hydroxyl value = 22, Acid value <0.5, linear liquid type).

  As a commercial product of the high molecular weight polyamide polyol, TPAE617 (Mn = 15,000, Tg = 90 ° C., hydroxyl value = 16, acid value = 1, linear type) manufactured by Fuji Kasei Kogyo Co., Ltd. can be used.

Commercially available products of the above high molecular weight polycarbonate polyol include, for example, Oxomer N112 (Mn = 1,000, Tg = 60 ° C., hydroxyl value = 112, acid value <0.5, linear type) manufactured by Perstorp; Asahi Kasei Chemicals Corporation PCDL-T5651 (Mn = 1,000, hydroxyl value = 110, acid value <0.05, linear liquid type), PCDL-T5652 (Mn = 2,000, hydroxyl value = 56, acid value <0.05) , Linear liquid type), PCDL-T4671 (Mn = 1,000, hydroxyl value = 110, acid value <0.05, linear liquid type), and PCDL-T4672 (Mn = 2,000, hydroxyl value = 52, Acid value <0.05, linear liquid type);
PMHC-1050 (Mn = 1,000, hydroxyl value = 112, acid value <0.5, linear liquid type), PMHC-2050 (Mn = 2,000, hydroxyl value = 56, acid value <0) manufactured by Kuraray Co., Ltd. .5, linear liquid type), C-1090 (Mn = 1,000, hydroxyl value = 112, acid value <0.5, linear liquid type), C-2090 (Mn = 2,000, hydroxyl value = 56, Acid value <0.5, linear liquid type), C-3090 (Mn = 3,000, hydroxyl value = 37, acid value <0.5, linear liquid type), C-4090 (Mn = 4,000, hydroxyl group) Value = 28, acid value <0.5, linear liquid type), C-5090 (Mn = 5,000, hydroxyl value = 22, acid value <0.5, linear liquid type), C-1065N (Mn = 1) , 000, hydroxyl value = 112, acid value <0.5, linear liquid tie ), C-2065N (Mn = 2,000, hydroxyl value = 56, acid value <0.5, linear liquid type), C-1015N (Mn = 1,000, hydroxyl value = 112, acid value <0.5). , Linear liquid type) and C-2015N (Mn = 2,000, hydroxyl value = 56, acid value <0.5, linear liquid type).

Examples of commercially available high molecular weight polyurethane polyols include Byron UR1350 (Mn = 30,000, Tg = 3 ° C., hydroxyl value = 46, acid value <1, linear type) manufactured by Toyobo Co., Ltd., Byron UR1400 (Mn = 40,000, Tg = 83 ° C, hydroxyl value = 2, acid value <1, linear type), Byron UR3210 (Mn = 40,000, Tg = -3 ° C, hydroxyl value = 3, acid value <1, linear) Type), Byron UR5537 (Mn = 20,000, Tg = 34 ° C., hydroxyl value = 17, acid value <1, linear type), and Byron UR9500 (Mn = 25,000, Tg = 15 ° C., hydroxyl value = 5, acid value <1, linear type);
Takelac E158 (hydroxyl value = 20, acid value <3), Takelac E551T (hydroxyl value = 30, acid value <3), Takelac A2789 (hydroxyl value = 10, acid value <2) manufactured by Mitsui Chemicals Polyurethanes, etc. Is mentioned.

In addition, polyester polyols obtained by ring-opening polymerization of lactones such as polycaprolactone diol, poly (β-methyl-γ-valerolactone) diol, and polyvalerolactone diol can also be used as the high molecular weight polyol. Included in polyols.

The polyurethane oligomer (a-2) is obtained by reacting a compound having at least one isocyanate group with an α, β-unsaturated double bond group-containing compound having one or more hydroxyl groups in the molecule described below. Or a urethane prepolymer of a terminal isocyanate group obtained by reacting a compound having at least one isocyanate group with the polyhydric alcohol described above and α, β- having one or more hydroxyl groups in the molecule described below An unsaturated double bond group-containing compound, or a urethane prepolymer of a terminal isocyanate group obtained by reacting a compound having at least one isocyanate group with a polyhydric alcohol, and a compound having at least one amino group And a urethane prepolymer of a terminal isocyanate group obtained by reacting with α having one or more hydroxyl groups is a compound obtained by reacting a β- unsaturated double bond-containing compound. Polyester polyols in which polyhydric alcohols are relatively high molecular weight polyols are included in the polyurethane oligomer (a-2). In addition, the polyurethane oligomer (a-2) includes a urea bond group-containing product obtained by reacting an isocyanate group with an amino group.

Examples of the compound having at least one isocyanate group include monofunctional polyisocyanates and polyfunctional isocyanates, and aromatic polyisocyanates, aliphatic polyisocyanates, araliphatic polyisocyanates, alicyclic polyisocyanates, etc., respectively. Can be mentioned. More specifically, as monofunctional polyisocyanate, for example, methyl isocyanate, ethyl isocyanate, propyl isocyanate, butyl isocyanate, octyl isocyanate, decyl isocyanate, octadecyl isocyanate, stearyl isocyanate, cyclohexyl isocyanate, phenyl isocyanate, benzyl isocyanate, p-chlorophenyl Isocyanate, p-nitrophenyl isocyanate, 2-chloroethyl isocyanate, 2,4-dichlorophenyl isocyanate, 3-chloro-4-methylphenyl isocyanate, trichloroacetyl isocyanate, chlorosulfonyl isocyanate, (R)-(+)-α-methyl Benzyl isocyanate, (S)-(−)-α-methylbenzyl isocyan Nate, (R)-(-)-1- (1-naphthyl) ethyl isocyanate, (R)-(+)-1-phenylethyl isocyanate, (S)-(-)-1-phenylethyl isocyanate, p- And toluenesulfonyl isocyanate.

Among polyfunctional isocyanates, as aromatic polyisocyanate, more specifically, for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4′-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4, Examples thereof include 4′-diphenyl ether diisocyanate and 4,4 ′, 4 ″ -triphenylmethane triisocyanate.

  Aliphatic polyisocyanates include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate (also known as HDI), pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodeca Examples include methylene diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.

  Examples of the araliphatic polyisocyanate include ω, ω′-diisocyanate-1,3-dimethylbenzene, ω, ω′-diisocyanate-1,4-dimethylbenzene, ω, ω′-diisocyanate-1,4-diethylbenzene, , 4-tetramethylxylylene diisocyanate, 1,3-tetramethylxylylene diisocyanate, and the like.

  As alicyclic polyisocyanate, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (also known as IPDI), 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, Examples thereof include methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4′-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanatomethyl) cyclohexane and the like.

  Moreover, 2-methylpentane-2,4-diol adduct of the above polyisocyanate, trimer having an isocyanurate ring, etc. can be used together. Polyphenylmethane polyisocyanate (also known as PAPI), naphthylene diisocyanate, and polyisocyanate-modified products thereof can be used. As the polyisocyanate-modified product, a carbodiimide group, a uretdione group, a uretoimine group, a burette group reacted with water, a group of isocyanurate groups, or a modified product having two or more of these groups can be used. A reaction product of a polyol and a diisocyanate can also be used as a compound having at least two isocyanate groups.

  More specifically, as amines having an amino group, for example, triethylamine, pyridine, aniline, morpholine, N-methylmorpholine, pyrrolidine, piperidine, N-methylpiperidine, cyclohexylamine, n-butylamine, dimethyloxazoline, Monoamines such as imidazole, N-methylimidazole, N, N-dimethylethanolamine, N, N-diethylethanolamine, N, N-dimethylisopropanolamine, N-methyldiethanolamine;

For example, ethylenediamine, trimethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, triethylenetetramine, diethylenetriamine, triaminopropane, 2,2,4-trimethylhexamethylenediamine, 2,2,4-trimethylhexamethylene Diamine, 2-hydroxyethylethylenediamine, hexamethylenediamine 2-hydroxyethylethylenediamine, N- (2-hydroxyethyl) propylenediamine, (2-hydroxyethylpropylene) diamine, (di-2-hydroxyethylethylene) diamine, (di -2-hydroxyethylpropylene) diamine, (2-hydroxypropylethylene) diamine, (di-2-hydroxypropylethylene) diamine, piperazine, etc. Aliphatic polyamines;
Cycloaliphatic polyamines such as isophoronediamine and dicyclohexylmethane-4,4′-diamine;
Phenylenediamine, xylylenediamine, 2,4-tolylenediamine, 2,6-tolylenediamine, diethyltoluenediamine, 3,3′-dichloro-4,4′-diaminodiphenylmethane, 4,4′-bis- ( sec-butyl) aromatic diamines such as diphenylmethane;

For example, trimethylsilyldimethylamine, trimethylsilyldiethylamine, dimethylaminotrimethylsilane, allylaminotrimethylsilane, N-methyl-N-trimethylsilylacetamide, anilinotrimethylsilane, 1-trimethylsilylpyrrole, 1-trimethylsilylpyrrolidone, 1-trimethylsilylimidazole, 1- Silylamines having a monofunctional silylamino group such as trimethylsilyl-1,2,4-triazole;
1,1,3,3-tetramethyldisilazane, hexamethyldisilazane, 1,3-divinyl-1,1,3,3-tetramethyldisilazane, N, N′-bis (trimethylsilyl) -N-phenyl Silylamines having a bifunctional silylamino group such as urea; 1,1,3,3,5,5-hexamethylcyclotrisilazane, 1,1,3,3,5,5,7,7-octamethyl A silylamine having a tri- or higher functional cyclic silylamino group such as cyclotetrasilazane;

For example, 2,5-dimethyl-2,5-hexamethylenediamine, mensendiamine, 1,4-bis (2-amino-2-methylpropyl) piperazine, and amino groups bonded to propylene branched carbons at both ends of the molecule Polypropylene glycol (propylene skeleton diamine, products “Jefamine D230” and “Jeffamine D400” manufactured by Sun Techno Chemical Co., Ltd., propylene skeleton triamine, product “Jeffamine T403” manufactured by Sun Techno Chemical Co., Ltd.), ethylene diamine, propylene diamine , Butylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, hexamethylenediamine, trimethylhexamethylenediamine, N-aminoethylpiperazine, 1,2-diamidine Propane, iminobispropylamine, methyl _{iminobispropylamine, H 2 N (CH 2 CH} 2 O) 2 (CH 2) 2 NH 2 [San Techno Chemical Co. ethylene glycol skeleton diamine "Jeffamine EDR148"], such as Polyether skeleton diamine with methylene group bonded to amine nitrogen, 1,5-diamino-2-methylpentane ("MPMD" manufactured by DuPont Japan), metaxylylenediamine ("MXDA" manufactured by DuPont Japan), Polyamidoamine ("X2000" manufactured by Sanwa Chemical Co., Ltd.), isophoronediamine, 1,3-bisaminomethylcyclohexane ("1,3BAC" manufactured by Mitsubishi Gas Chemical Company), 1-cyclohexylamino-3-aminopropane, 3-amino Methyl-3,3,5-trimethyl-cyclohexylamine, norvo Polyamines such as nan skeleton dimethyleneamine ("NBDA" manufactured by Mitsui Chemicals), dimeramine obtained by converting carboxyl group of dimer acid to amino group, dendrimer having primary or secondary amino group at both ends, propoxy at both ends A polyoxyalkylene glycol diamine having an amine can also be used.

The polyepoxy oligomer (a-3) is a compound having a glycidyl group and an α, β-unsaturated double bond group having one or more carboxyl groups in a molecule to be described later such as (meth) acrylic acid and maleic acid. This is a compound obtained by reaction with a contained compound, and representative examples include bisphenol type, epoxidized oil type, phenol novolac type, and alicyclic type. As the bisphenol-type polyepoxy oligomer, α, β- having one or more carboxyl groups in the later-described molecule such as bisphenol-type diglycidyl ether obtained by reacting bisphenols and epichlorohydrin and (meth) acrylic acid The thing of Mn400-2,000 obtained by reacting with an unsaturated double bond group containing compound can be used.

As the epoxidized oil polyepoxy-based oligomer, an epoxidized oil such as soybean oil and an α, β-unsaturated dicarboxylic acid having at least one carboxyl group in a molecule described later such as (meth) acrylic acid and maleic acid are used. What is obtained by reaction with a compound containing a heavy bond group can be used. As a novolac type polyepoxy oligomer, a reaction between a novolac type epoxy resin and a compound containing an α, β-unsaturated double bond group having one or more carboxyl groups in the molecule described later, such as (meth) acrylic acid. You can use what you get. As an alicyclic polyepoxy oligomer, an alicyclic epoxy resin and an α, β-unsaturated double bond group-containing compound having one or more carboxyl groups in the later-described molecule such as (meth) acrylic acid What was synthesize | combined by reaction can be used. Furthermore, for the purpose of adjusting the crosslinking density by active energy ray polymerization, other polyfunctional α, β-unsaturated double bond group-containing compounds having a plurality of other α, β-unsaturated double bond groups can also be used. .

Furthermore, an acrylic oligomer (a-4) can also be used. Specifically, modified polyether having α, β-unsaturated double bond group, amine-modified α, β-unsaturated double bond group-containing compound, alkyd resin, spiroacetal resin, polybutadiene resin, polythiol polyene Oligomers or prepolymers of one or more compounds selected from the group consisting of resins and polyfunctional compounds such as polyhydric alcohols, α, β-unsaturated double bond group-containing compounds can be used.

The weight average molecular weight (hereinafter referred to as Mw) of the oligomer (A) having at least one α, β-unsaturated double bond group in the molecule is compatible with the polymer coating and good durability (heat resistance). Properties, wet heat resistance) and agglomeration density, it is necessary to be in the range of 300 to 30,000. Furthermore, Mw is more preferably in the range of 400 to 10,000. When the Mw of the oligomer (A) exceeds 30,000, not only the fluidity is lowered, but also an α, β-unsaturated double bond group-containing compound (B) described later (however, corresponding to the oligomer (A)) And the compatibility with the α, β-unsaturated double bond group-containing compound (C) having a ring structure in the molecule is also lowered, so that the coating property of the resin composition is lowered or the resin composition is reduced. When the product is used as an active energy ray polymerizable adhesive, durability such as adhesion of the polymerized coating film may be lowered, or the coating film may be whitened.
When the Mw of the oligomer (A) is less than 300, after the adhesive film of the active energy ray-polymerizable adhesive is stuck on various substrates (G), the active energy ray-polymerizable adhesive layer is cohesively broken. It may be easier.

Next, the α, β-unsaturated double bond group-containing compound (B) will be described.
In the present invention, the α, β-unsaturated double bond group-containing compound (B) (hereinafter referred to as compound (B)) comprises (1) one or more amide groups and (2) one or more hydroxyl groups. And / or having an alkoxy group. However, those corresponding to the oligomer (A) are not included. Since the compound (B) has an amide group, the glass transition point (Tg) of the molded product is improved, a high cohesive force is exhibited, and a molded product having good heat resistance and water resistance can be formed. It will be. Examples of the α, β-unsaturated double bond group-containing compound (B) having one or more amide groups include the compound (b1) containing a hydroxyl group in addition to the amide group, And an α, β-unsaturated double bond group-containing compound (b2) containing an alkoxy group. Furthermore, among (b1) and (b2), the aliphatic α, β-unsaturated double bond group-containing compounds (b1-1) and (b2-1) having no ring structure in the molecule, Can be divided into α, β-unsaturated double bond group-containing compounds (b1-2) and (b2-2) having a ring structure.

More specifically, examples of the aliphatic α, β-unsaturated double bond group-containing compound containing one or more amide groups and a hydroxyl group in addition to the amide group include, for example, N-hydroxymethyl ( Meth) acrylamide [N-hydroxymethylacrylamide and N-hydroxyethylmethacrylamide are collectively referred to as “N-hydroxytityl (meth) acrylamide”. The same applies below. ], N-hydroxyethyl (meth) acrylamide, N-hydroxypropyl (meth) acrylamide, N-hydroxybutyl (meth) acrylamide, N-hydroxyhexyl (meth) acrylamide, N-hydroxyoctyl (meth) acrylamide, 3-hydroxy Hydroxyl-containing aliphatic (meth) acrylamides such as (meth) acrylamide;

For example, N- (2-hydroxyphenyl) (meth) acrylamide, N- (4-hydroxyphenyl) (meth) acrylamide, N- (2-phenylethyl) -3- (3-methoxy-4-hydroxyphenyl) ( (Meth) acrylamide, N-[(3,5-di-tert-butyl-4-hydroxybenzyl) oxymethyl] (meth) acrylamide, N- (4-hydroxy3,5-dimethylbenzyl) (meth) acrylamide, 2 -[(S) -alpha-hydroxybenzyl] (meth) acrylamide, N- (2-hydroxyethyl) -N- [2- (benzyloxyimino) ethyl] (meth) acrylamide, N-cyclohexyl-2-[( S) -β-hydroxyphenethyl] (meth) acrylamide-containing alicyclic ring or aromatic ring-containing ring Meth) acrylamides, and the like, but not particularly limited thereto. Moreover, these may use only 1 type or may use multiple types together.

More specifically, the α, β-unsaturated double bond group-containing compound (b2) containing an alkoxy group in addition to the amide group, for example, N-methoxymethyl (meth) acrylamide, N-methoxyethyl (meth) Acrylamide, N-methoxypropyl (meth) acrylamide, N-methoxybutyl (meth) acrylamide, N-methoxyhexyl (meth) acrylamide, N-methoxyoctyl (meth) acrylamide, N-methoxydecyl (meth) acrylamide, N-methoxy Dodecyl (meth) acrylamide, N-methoxyoctadecyl (meth) acrylamide, N-ethoxymethyl (meth) acrylamide, N-ethoxyethyl (meth) acrylamide, N-ethoxypropyl (meth) acrylamide, N-ethoxybutyl (meth) acrylamide , N -Ethoxyhexyl (meth) acrylamide, N-ethoxyoctyl (meth) acrylamide, N-isopropoxymethyl (meth) acrylamide, N-isopropoxyethyl (meth) acrylamide, N-isopropoxypropyl (meth) acrylamide, N-iso Propoxybutyl (meth) acrylamide, N-isopropoxyhexyl (meth) acrylamide, N-isopropoxyoctyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, N-butoxyethyl (meth) acrylamide, N-butoxypropyl ( (Meth) acrylamide, N-butoxybutyl (meth) acrylamide, N-butoxyhexyl (meth) acrylamide, N-butoxyoctyl (meth) acrylamide, N-isobutoxymethyl (meta) Acrylamide, N-isobutoxyethyl (meth) acrylamide, N-isobutoxypropyl (meth) acrylamide, N-isobutoxybutyl (meth) acrylamide, N-isobutoxyhexyl (meth) acrylamide, N-isobutoxyoctyl (meth) Acrylamide, N- (pentoxymethyl) (meth) acrylamide, N-1-methyl-2-methoxyethyl (meth) acrylamide, N- (oxetane-2-ylmethoxymethyl) (meth) acrylamide, N- (oxetane- Aliphatic (meth) acrylamides containing alkoxy groups such as 3-ylmethoxymethyl) (meth) acrylamide, N, N-di (methoxymethyl) meth) acrylamide, and N, N-di (ethoxymethyl) (meth) acrylamide Kind;

N- (2-methoxyphenyl) (meth) acrylamide, N- (4-methoxyphenyl) (meth) acrylamide, N- (2-ethoxyphenyl) (meth) acrylamide, N- (4-ethoxyphenyl) (meth) Acrylamide, N-phenyl-N- (3-methoxyphenyl) (meth) acrylamide, N-phenyl-N- (3-methoxyphenyl) (meth) acrylamide, (Z) -3- [4-methoxyphenyl] (meta ) Cyclic (meta) containing alkoxy groups such as acrylamide, (E) -N-cyclohexyl-3- (4-methoxyphenyl) (meth) acrylamide, (E) -N, N-diethyl-3-cyclohexyl (meth) acrylamide, etc. ) Acrylamides are mentioned, but not limited to these. These may use only 1 type or may use multiple types together.

Among the α, β-unsaturated double bond group-containing compound (B), these (b1) and (b2) can be used without particular limitation, but are aliphatic α, β-unsaturated having no ring structure. When the double bond group-containing compound is irradiated with active energy rays, the improvement of the glass transition point (Tg) of the molded product accompanying the improvement of the reaction rate enables further improvement of resistance such as heat resistance and water resistance. In addition, it is preferable because shrinkage during polymerization curing can be suppressed. Moreover, since it does not have a cyclic structure near the amide group, it is particularly preferable because it has an advantage that yellowing due to heat is difficult. Among (b1) and (b2), the α, β-unsaturated double bond group-containing compound (b1-2) or (b2-2) having a ring structure in the molecule has a ring structure in the molecule. The aliphatic α, β-unsaturated double bond group-containing compounds (b1-1) and (b2-1) are preferred.

Of the α, β-unsaturated double bond group-containing compound (B), hydroxyl group-containing aliphatic (meth) acrylamides and alkoxy group-containing aliphatic (meth) acrylamides are preferred, particularly industrially. N-hydroxymethyl (meth) acrylamide, N-hydroxyethyl (meth) acrylamide, N-hydroxypropyl (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-methoxyethyl (meth) acrylamide, N- Methoxypropyl (meth) acrylamide and N-methoxybutyl (meth) acrylamide are particularly preferably used.

In the present invention, 1 to 500 parts by weight of the α, β-unsaturated double bond group-containing compound (B) (excluding those corresponding to the oligomer (A)) per 100 parts by weight of the oligomer (A). Is preferably contained, more preferably 5 to 400 parts by weight, and most preferably 10 to 300 parts by weight.
If the amount of (B) is less than 1 part by weight, the cohesive force is insufficient and the effect of improving heat resistance and moist heat resistance cannot be expected so much. On the other hand, if the amount of (B) is more than 500 parts by weight, when the resin composition for optical three-dimensional modeling is polymerized and cured with active energy rays, shrinkage during polymerization curing and deformation during molding increase. Since the cured product tends to be brittle, it is not preferable.

  In addition to the above, there may be mentioned a compound (B ′) containing an α, β-unsaturated double bond group having at least one amide group but not having a hydroxyl group and an alkoxy group. More specifically, examples of such a compound (B ′) include (meth) acrylamide, N-methyl (meth) acrylamide, N-ethyl (meth) acrylamide, N-propyl (meth) acrylamide, and N-isopropyl. (Meth) acrylamide, N-butyl (meth) acrylamide, N-propyl (meth) acrylamide, N-tert-butyl (meth) acrylamide, N-hexyl (meth) acrylamide, N-octyl (meth) acrylamide, N-nonyl (Meth) acrylamide, N-tricosyl (meth) acrylamide, N-nonadecyl (meth) acrylamide, N-docosyl (meth) acrylamide, N-methylene (meth) acrylamide, N-tridecyl (meth) acrylamide, N- (5 5-dimethylhexyl) (meta ) Acrylamide, crotonamide, maleinamide, fumaramide, mesaconamide, citraconamide, itaconamide, 2-methylprop-2-enoylamine, N, N-dimethyl (meth) acrylamide, N, N-diethyl- (meth) acrylamide, N- [3- (N ′, N′-dimethylamino) propyl]-(meth) acrylamide, N- (dibutylaminomethyl) (meth) acrylamide, N-vinylmethanamide, N-vinylacetamide and other aliphatic ( (Meth) acrylamides;

For example, (meth) acrylamides containing sulfonic acids such as (meth) acrylamide sulfonic acid, tert-butyl- (meth) acrylamide sulfonic acid, (meth) acrylamide-2-methyl-1-propanesulfonic acid;

  For example, N- (2-oxobutanoylethyl) (meth) acrylamide, N- (2-oxobutanoylpropyl) (meth) acrylamide, N- (2-oxobutanoylbutyl) (meth) acrylamide, N- ( (Meth) acrylamides having a carbonyl group such as 2-oxobutanoylhexyl) (meth) acrylamide, N- (2-oxobutanoyloctyl) (meth) acrylamide, diacetone (meth) acrylamide;

Examples include compounds containing heterocyclic amide groups having both nitrogen and oxygen atoms, such as 4-acryloylmorpholine, N-vinyl-2-pyrrolidone, and N-vinyl-ε-caprolactam, but are particularly limited thereto. It is not a thing. These may use only 1 type or may use multiple types together.

Since the compound (B ′) containing an α, β-unsaturated double bond group is inferior in durability such as heat resistance and water resistance compared to (B), it is preferably used in place of (B). Absent. However, (B ′) can be used in combination in the range of 0 to 100 parts by weight with respect to 100 parts by weight of (B) for the purpose of improving polymerization curability upon irradiation with active energy rays in (B). If (B ′) is more than 100 parts by weight, the durability is lowered, which is not preferable.

Next, an α, β-unsaturated double bond group-containing compound (C) having no amide group and a ring structure (however, oligomer (A) and α, β-unsaturated double bond group-containing compound (B Excluding those that fall under)).
In the present invention, the α, β-unsaturated double bond group-containing compound (C) has one or more ring structures of a cycloalkane ring, a cycloalkene ring and / or a benzene ring [rings other than heterocycles] And also having a structure]] an α, β-unsaturated double bond group-containing compound (c1) and one heterocycle having a heteroatom such as a nitrogen atom, an oxygen atom and / or a sulfur atom in the ring And [alpha], [beta] -unsaturated double bond group-containing compound (c2) [having a heterocycle]. Having a ring structure other than the ring structure of the compound (B) is preferable because durability such as heat resistance and water resistance is improved.

More specifically, the α, β-unsaturated double bond group-containing compound (c2) having one or more hetero rings having a hetero atom such as a nitrogen atom, an oxygen atom, and / or a sulfur atom in the ring, For example, 2- (2′-hydroxy-5 ′-(meth) acryloyloxyethylphenyl) -2H-benzotriazole, 2- (2′-hydroxy-5 ′-(meth) acryloyloxyethylphenyl) -5-chloro -2H-benzotriazole, 2- (2'-hydroxy-5 '-(meth) acryloyloxypropylphenyl) -2H-benzotriazole, 2- (2'-hydroxy-5'-(meth) acryloyloxypropylphenyl) -5-chloro-2H-benzotriazole, 2- (2'-hydroxy-3'-tert-butyl-5 '-(meth) acryloyloxyethyl Nyl) -2H-benzotriazole, 2- (2′-hydroxy-3′-tert-butyl-5 ′-(meth) acryloyloxyethylphenyl) -5-chloro-2H-benzotriazole Polycyclic (meth) acrylic acid esters;

For example, 2,4-diphenyl-6- [2-hydroxy-4- {2- (meth) acryloyloxyethoxy}]-S-triazine, 2,4-bis (2-methylphenyl) -6- [2- Hydroxy-4- {2- (meth) acryloyloxyethoxy}]-S-triazine, 2,4-bis (2-methoxyphenyl) -6- [2-hydroxy-4- {2- (meth) acryloyloxyethoxy }]-S-triazine, 2,4-bis (2-ethylphenyl) -6- [2-hydroxy-4- {2- (meth) acryloyloxyethoxy}]-S-triazine, 2,4-bis ( 2-Ethoxyphenyl) -6- [2-hydroxy-4- {2- (meth) acryloyloxyethoxy}]-S-triazine, 2,4-bis (2,4-dimethylphenyl) -6- [2- Hydroxy 4- {2- (meth) acryloyloxyethoxy}]-S-triazine, 2,4-bis (2,4-diethoxylphenyl) -6- [2-hydroxy-4- {2- (meth) acryloyloxy Ethoxy}]-S-triazine, 2,4-bis (2,4-diethylphenyl) -6- [2-hydroxy-4- {2- (meth) acryloyloxyethoxy})]-nitrogen such as S-triazine (Meth) acrylic acid esters having an atom-containing six-membered ring;

For example, heterocyclic (meth) acrylic acid esters such as pentamethylpiperidinyl (meth) acrylate, tetramethylpiperidinyl (meth) acrylate, 4- (pyrimidin-2-yl) piperazin-1-yl (meth) acrylate, etc. Kind;

 For example, 1-vinylpyrrole, 2-vinylpyrrole, 2-methyl-5-vinyl-1H-pyrrole, 1-vinyl-2-imidazoline, 2-vinyl-2-imidazoline, 1-vinyl-2-methyl-2- Imidazoline, 4,5-dihydro-2-vinyl-1H-imidazole, 1-vinylimidazole, 2-vinyl-1H-imidazole, 1-vinyl-1H-pyrazole, 1-vinyl-3,5-dimethyl-1H-pyrazole Ethenyl group-containing compounds having a five-membered ring containing a nitrogen atom, such as 3-methyl-5-phenyl-1-vinylpyrazole;

For example, 2-vinylpiperazine, 4-vinylpiperazine, 1-benzyl-2-vinylpiperazine, 1-benzyl-3-vinylpiperazine, 1,4-dimethyl-3-vinylpiperazine, 2-vinylpyridine, 3-vinylpyridine 4-vinylpyridine, 6-methyl-2-ethenylpyridine, 2-vinylpyrazine, 2-methyl-5-vinylpyrazine, 2-methyl-6-vinylpyrazine, 2,5-dimethyl-3-vinylpyrazine, 2-vinylpyrimidine, 2-vinylpyridazine, 2-vinyl-4,6-diamino-1,3,5-triazine, 6-vinyl-1,3,5-5-2,4-diamine, 3-vinyl-1 Ethenyl group-containing compounds having a six-membered ring containing a nitrogen atom, such as 1,2,4,5-tetrazine;

For example, 1-vinylindole, 1-vinyl-2-methyl-1H-indole, 1-vinylisoindole, 1-vinyl-1H-benzimidazole, 2-vinyl-1H-benzimidazole, 2-vinyl-5,6 -Dimethyl-1H-benzimidazole, 1-vinylindazole, 2-vinylquinoline, 4-vinylquinoline, 2-vinylisoquinoline, 2-vinylisoxaline, 2-vinylquinoxaline, 2-vinylquinazoline, 2-vinylcinnoline , Compounds containing nitrogen-containing heteropolycyclic ethenyl groups such as 1-vinylcarbazole;

For example, 1-methyl-4,5-divinyl-1H-imidazole, 1,1′-divinyl-2,2′-bi (1H-imidazole), 2,3-divinylpyridine, 2,4-divinylpyridine, 2 Compounds having a nitrogen atom-containing heterocyclic structure and two or more ethenyl groups, such as 1,5-divinylpyridine and 2,6-divinylpyridine;

For example, 1- (meth) allyl-1H-imidazole [1-allyl-1H-imidazole and 1-methallyl-1H-imidazole are collectively referred to as “1- (meth) allyl-1H-imidazole”. The same applies below. ], 1- (meth) allyl-2-methyl-1H-imidazole, 1- (meth) allyl-3-methyl-1H-imidazole-3-ium, 1- (meth) allyl-3-ethyl-1H-imidazole -3-ium, 4- (meth) allyl-3,5-dimethyl-1H-pyrazole, 5-bromo-1--1- (meth) allyl-1H-pyrazole, 1- (meth) allylpiperazine, 5- ( 1-methylpropyl) -5- (meth) allylpyrimidine, 5- (meth) allyl-5-isopropylpyrimidine, 1- (meth) allyl-5,5-diethylpyrimidine, 2- (meth) allylpyridine, 4- (Meth) allylpyridine, 3,6-dihydro-3- (meth) allylpyridine, N- (meth) allyl-s-triazine-2,4,6-triamine, N- (meth) allyl-4,6 Having a heterocyclic structure of the nitrogen atom-containing, such as dichloro -1,3-5- triazin-2-amine (meth) allyl group-containing compounds;

For example, 2- (meth) allyl-1H-indole, 3- (meth) allyl-1H-indole, 1- (meth) allyl-1H-benzimidazole, 2- (meth) allylindazole, 1- (meth) allyl -3-methyl-1H-indazole, 1- (meth) allyl-4-methyl-1H-indazole, N- (meth) allylquinolin-4-amine, di (meth) allylquinoline, 3-phenyl-4- ( (Meth) allylisoquinoline, 1,2-di (meth) allyl-1,2-dihydroisoquinoline, 9- (meth) allyl-9H-carbazole and other (meth) allyl group-containing heteropolycyclic structures containing nitrogen atoms Compounds;

For example, imide (meth) acrylate, 2- (4-oxazolin-3-yl) ethyl (meth) acrylate, tri (meth) acrylic acid ethoxylated isocyanuric acid, ε-caprolactone modified tris- (2-acryloyloxyethyl) isocyanate (Meth) allyl group-containing compounds having a heterocyclic structure having both a nitrogen atom and an oxygen atom such as nurate;

For example, maleimide derivatives having both nitrogen and oxygen atoms such as maleimide, methylmaleimide, ethylmaleimide, propylmaleimide, butylmaleimide, octylmaleimide, dodecylmaleimide, stearylmaleimide, phenylmaleimide, cyclohexylmaleimide;

For example, 2-vinyl oxazole, 2-phenyl-4-vinyl oxazole, 2-phenyl-5-vinyl oxazole, 5-ethoxy-2-vinyl oxazole, 3-vinyl-5-nitrosoxazole, 2-vinyl-4,5 -Nitrogen such as diphenyloxazole, 2-vinyl-2-oxazoline, 4,4-dimethyl-2-vinyl-2-oxazolin-5-one, 2-vinylbenzoxazole, 1-vinylpyridin-2 (1H) -one Ethenyl group-containing compounds having a heterocyclic structure containing an atom and an oxygen atom;

For example, 2-vinylthiazol, 4-methyl-5-vinylthiazole, 2-vinylbenzothiazole, 2- [2- (1-naphthyl) vinyl] benzothiazole, 2- [2- (dimethylamino) vinyl] benzo Examples include, but are not limited to, ethenyl group-containing compounds having a heterocyclic structure containing a nitrogen atom and a sulfur atom such as thiazole and 1-vinyl-2 (1H) -pyridinethione. These may use only 1 type or may use multiple types together.
In particular, imide acrylate, 2-vinylpyridine, 4-vinylpyridine, and 4-vinylpiperazine are particularly preferably used industrially.

Α, β-unsaturated double bond group-containing compound (C) having no amide group and a ring structure (however, oligomer (A) and α, β-unsaturated double bond group-containing compound (B)) Of the α, β-unsaturated double bond group-containing compound (c1) having a ring structure of any one or more of a cycloalkane ring, a cycloalkene ring, and / or a benzene ring. An α, β-unsaturated double bond group-containing compound (c1-1) further having a hydroxyl group therein and an α, β-unsaturated double bond group-containing compound (c1-2) having no hydroxyl group can be mentioned.

Of the α, β-unsaturated double bond group-containing compound (C1) having a ring structure other than a heterocycle, α, β-unsaturated having a ring structure containing no hetero atom in the molecule and no hydroxyl group More specifically, as the saturated double bond group-containing compound (c1-2), for example, cyclohexyl (meth) acrylate [cyclohexyl acrylate and cyclohexyl methacrylate are collectively referred to as “cyclohexyl (meth) acrylate”. To do. The same applies below. ], 1-methyl-1-cyclopentyl (meth) acrylate, 1-ethyl-1-cyclopentyl (meth) acrylate, 1-isopropyl-1-cyclopentyl (meth) acrylate, 1-methyl- (meth) acrylate 1-cyclohexyl, 1-ethyl-1-cyclohexyl (meth) acrylate, 1-isopropyl-1-cyclohexyl (meth) acrylate, 1-ethyl-1-cyclooctyl (meth) acrylate, benzyl (meth) acrylate , Iso-bonyl (meth) acrylate, phenyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, 2-oxo-1,2-phenylethyl (meth) acrylate, 2- (meth) acrylic acid 2- Oxo-1,2-diphenylethyl, 1-naphthyl (meth) acrylate, 2-naphthyl (meth) acrylate 1-naphthylmethyl (meth) acrylate, 1-anthryl (meth) acrylate, 2-anthryl (meth) acrylate, 9-anthryl (meth) acrylate, 9-anthrylmethyl (meth) acrylate, (Meth) acrylic acid 2-methyladamantyl-2-yl, (meth) acrylic acid dicyclopentanyl, (meth) acrylic acid dicyclopentenyl, (meth) acrylic acid dicyclopentenyloxyethyl, (meth) acrylic acid 2- Ethyladamantyl-2-yl, 2-n-propyladamantyl-2-yl (meth) acrylate, 2-isopropyladamantyl-2-yl (meth) acrylate, 1- (adamantan-1-yl (meth) acrylate ) -1-methylethyl, 1- (adamantan-1-yl) -1-ethylethyl (meth) acrylate, 1- (adamantan-1-yl) -1-methylpropyl (meth) acrylate, 1- (adamantan-1-yl) -1-ethylpropyl (meth) acrylate, (meth) acrylic acid-5-oxo-4 -Oxa-tricyclo [4.2.1.0 ^3,7 ] non-2-yl, (meth) acrylic acid-5-oxo-4-oxa-tricyclo [5.2.1.0 ^3,8 ] deca 2-yl, (meth) acrylic acid dihydro-α-terpinyl, (meth) acrylic acid-6-oxo-7-oxa-bicyclo [3.2.1] oct-2-yl, (meth) acrylic acid- 7-oxo-8-oxa-bicyclo [3.3.1] oct-2-yl, 2- (meth) acryloyloxyethyl phthalate, 2- (meth) acryloyloxypropyl phthalate, 2- (meth) acryloyloxybutyl Phthalate, 2- (meth) acryloyloxyhexyl phthalate, 2- (meth) acryloyloxyoctyl phthalate, 2- (meth) acryloyloxydecyl phthalate, 2- (meth) acryloyloxyethyl hexahydrophthalate, (meth) acrylic (3) , 4-epoxycyclohexyl) methyl, (meth) acrylic acid-o-2-propenylphenyl, (meth) acrylic acid cyclohexyl glycidyl ether, (meth) acrylic acid phenyl glycidyl ether and other (meth) acrylic acid cyclic esters;

  For example, (meth) acrylic acid cyclic esters containing a sulfonyl group such as (meth) acrylic acid sulfophenoxyethyl, (meth) acrylic acid sulfocyclohexyl, (meth) acrylic acid sulfobenzyl;

For example, (meth) acryloyloxyethyldimethylbenzylammonium-p-toluenesulfonate [acryloyloxyethyldimethylbenzylammonium-p-toluenesulfonate and methacryloyloxyethyldimethylbenzylammonium-p-toluenesulfonate are combined to form “(meth) acryloyl This is referred to as “oxyethyldimethylbenzylammonium p-toluenesulfonate”. The same applies below. ], (Meth) acryloyloxyethyltrimethylammonium-p-toluenesulfonate, (meth) acryloylaminopropyltrimethylammonium-p-toluenesulfonate, and other metal salts and ammonium salts of (meth) acrylic acid cyclic esters containing sulfonyl groups;

For example, di (meth) acrylic acid tricyclodecane dihydroxymethyl, di (meth) acrylic acid tricyclodecane dihydroxymethyl dicaprolactonate, di (meth) acrylic acid 1,2-adamantanediol, di (meth) acrylic acid 1 , 3-adamantanediol, 1,4-adamantanediol di (meth) acrylate, tricyclodecanyl dimethylol di (meth) acrylate, and 2,2-bis (hydroxyphenyl) propane di (meth) acrylate Tetraethylene oxide adducts, tetraethylene oxide adducts of 2,2-bis (hydroxyphenyl) methane di (meth) acrylate, and tetraethylene oxide adducts of di (meth) acrylic acid-4,4′-sulfonyldiphenol Di (meth) acrylic acid-hydrogenated 2,2-bis (H Roxyphenyl) propane tetraethylene oxide adduct, di (meth) acrylic acid-hydrogenated 2,2-bis (hydroxyphenyl) methane tetraethylene oxide adduct, di (meth) acrylic acid-hydrogenated 2,2- Tetraethylene oxide of bis (hydroxyphenyl) propane, di (2-methyl) propenoic acid-hydrogenated 2,2-bis (hydroxyphenyl) methane, di (meth) acrylic acid-2,2-bis (hydroxyphenyl) propane Bifunctional (meth) acrylic acid cyclic esters such as adduct-dicaprolactonate, tetraethylene oxide adduct of di (meth) acrylic acid-2,2-bis (hydroxyphenyl) methane-dicaprolactonate;

For example, 5-vinylbicyclo [2.2.1] hept-2-ene, 2,5-bis (allyloxy) norbornane, 5-vinyl-2,3-oxirane norbornane, 2- (2-propenyl) bicyclo [2 2.1] heptane, 5-vinylbicyclo [2.2.1] hept-2-ene, 2-ethenylideneadamantane, 1-allyladamantane, 2-vinylbenzoic acid, 3-vinylbenzoic acid, 4-vinyl Cyclic compounds containing alkenyl groups such as benzoic acid, 4-isopropenylbenzenecarboxylic acid, cinnamic acid, 7-amino-3-vinyl-3-cephem-4-carboxylic acid, cyclohexyl vinyl ether, cyclohexylmaleimide, vinylcyclohexene monooxirane ;

  For example, vinyl benzoylformate, vinyl benzoyl acetate, vinyl benzoylpropionate, vinyl benzoylbutyrate, vinyl benzoylvalerate, vinyl benzoylhexanoate, vinyl benzoyldodecanoate, 1-naphthoylvinyl acetate, 1-naphthoylpropionate, 1- Naphthoyl vinyl butyrate, 1-naphthoyl vinyl valerate, 1-naphtho vinyl hexanoate, 2-naphtho vinyl acetate, 2-naphtho vinyl propionate, 2-naphtho vinyl butyrate, 2-naphtho vinyl butyrate, 2- Vinyl naphthoyl hexanoate, vinyl nicotinoyl acetate, vinyl nicotinoyl propionate, vinyl nicotinoyl butyrate, vinyl nicotinoyl valerate, vinyl nicotinoyl hexanoate, vinyl nicotinoyl decanoate, nicotine Vinyl dodecanoate, vinyl isonicotinoyl acetate, vinyl isonicotinoyl propionate, vinyl isonicotinoyl butyrate, vinyl isonicotinoyl valerate, vinyl isonicotinoyl hexanoate, vinyl isonicotinoyl decanoate, vinyl isonicotinoyl dodecanoate, 2-furoyl Vinyl acetate, vinyl 2-furoylpropionate, vinyl 2-furoylbutyrate, vinyl 2-furoylvalerate, vinyl 2-furoylhexanoate, vinyl 2-furoyldecanoate, vinyl 2-furoyldodecanoate, 3-furoyl Vinyl acetate, vinyl 3-furoylpropionate, vinyl 3-furoylbutyrate, vinyl 3-furoylvalerate, vinyl 3-furoylhexanoate, vinyl 3-furoyldecanoate, vinyl 3-furoyldodecanoate, vinyl anthraniloyl acetate , Vinyl anthraniloyl propionate, vinyl anthraniloyl butyrate, vinyl anthraniloyl valerate, vinyl anthraniloyl hexanoate, vinyl anthraniloyl decanoate, vinyl anthraniloyl decanoate, 4- (2-t-ethoxycarbonylethyl) Aromatic vinyl compounds having an acyl group such as oxy) styrene, 4- (2-t-butoxycarbonylethyloxy) styrene, 4- (2-t-butoxycarbonylpropyloxy) styrene;

For example, benzoyl formate (meth) allyl [all benzoyl formate and methallyl benzoyl formate are collectively referred to as “benzoyl formate (meth) allyl”. The same applies below. ], Benzoylacetic acid (meth) allyl, benzoylpropionic acid (meth) allyl, benzoylbutyric acid (meth) allyl, benzoylvaleric acid (meth) allyl, benzoylhexanoic acid (meth) allyl, benzoyldodecanoic acid (meth) allyl, 1- Naphthoylacetic acid (meth) allyl, 1-naphthoylpropionic acid (meth) allyl, 1-naphthoylbutyric acid (meth) allyl, 1-naphthoylvalerate (meth) allyl, 1-naphthoylhexanoic acid (meth) allyl, 2 -Naphthoyl acetic acid (meth) allyl, 2-naphthoylpropionic acid (meth) allyl, 2-naphthoylbutyric acid (meth) allyl, 2-naphthoylvaleric acid (meth) allyl, 2-naphthoylhexanoic acid (meth) allyl, etc. Aromatic (meth) allyl compounds having an acyl group of

For example, styrene, α-methylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 2-methoxystyrene, 3-methoxystyrene, 4-methoxystyrene, 4-t-butoxystyrene, 4-t- Butoxy-α-methylstyrene, 4- (2-ethyl-2-propoxy) styrene, 4- (2-ethyl-2-propoxy) -α-methylstyrene, 4- (1-ethoxyethoxy) styrene, 4- ( Aromatic vinyl monomers such as 1-ethoxyethoxy) -α-methylstyrene, 1-butylstyrene, 1-chloro-4-isopropenylbenzene;

For example, vinyl phenyl pentyl ether, vinyl phenyl hexyl ether, vinyl phenyl heptyl ether, vinyl phenyl octyl ether, vinyl phenyl nonyl ether, vinyl phenyl decyl ether, vinyl phenyl undecyl ether, vinyl phenyl dodecyl ether, vinyl phenyl tridecyl ether, vinyl Phenyl tetradecyl ether, vinyl phenyl pentadecyl ether, vinyl phenyl hexadecyl ether, vinyl phenyl heptadecyl ether, vinyl phenyl octadecyl ether, vinyl phenyl nonadecyl ether, vinyl phenyl eicosyl ether, vinyl phenyl henecosyl ether, vinyl phenyl doco Sil ether, vinyl phenyl methyl butyl ether, vinyl phenyl Rupentyl ether, vinyl phenyl methyl hexyl ether, vinyl phenyl methyl heptyl ether, vinyl phenyl methyl octyl ether, vinyl phenyl methyl nonyl ether, vinyl phenyl methyl decyl ether, vinyl phenyl methyl undecyl ether, vinyl phenyl methyl dodecyl ether, vinyl phenyl methyl Tridecyl ether, vinyl phenylmethyl tetradecyl ether, vinyl phenyl methyl pentadecyl ether, vinyl phenyl methyl hexadecyl ether, vinyl phenyl methyl heptadecyl ether, vinyl phenyl methyl octadecyl ether, vinyl phenyl methyl nonadecyl ether, vinyl phenyl methyl eicosyl Ether, vinyl phenyl methyl henecosyl ether, vinyl Aromatic vinyl ether-based monomers having a long-chain alkyl groups such as E methylpropenylmethyl docosyl ether;

Hexyl 4-vinylbenzoate, octyl 4-vinylbenzoate, nonyl 4-vinylbenzoate, decyl 4-vinylbenzoate, dodecyl 4-vinylbenzoate, tetradecyl 4-vinylbenzoate, hexadecyl 4-vinylbenzoate, 4 -Octadecyl vinylbenzoate, eicosyl 4-vinylbenzoate, docosyl 4-vinylbenzoate, hexyl 4-isopropenylbenzoate, octyl 4-isopropenylbenzoate, nonyl 4-isopropenylbenzoate, 4-isopropenylbenzoic acid Decyl, 4-isopropenyl benzoate dodecyl, 4-isopropenyl benzoate tetradecyl, 4-isopropenyl benzoate hexadecyl, 4-isopropenyl benzoate octadecyl, 4-isopropenyl benzoate eicosyl, 4-isopropenyl benzoate docosyl, etc. Head of Vinyl benzoate ester or isopropenyl benzoic acid ester monomers having alkyl group;

For example, tetra (ethylene oxide) vinyl phenyl ether, methyl tetra (ethylene oxide) vinyl phenyl ether, ethyl tetra (ethylene oxide) vinyl phenyl ether, propyl tetra (ethylene oxide) vinyl phenyl ether, n-butyl tetra (ethylene oxide) vinyl phenyl ether , N-pentyltetra (ethylene oxide) vinyl phenyl ether, tetra (propylene oxide) vinyl phenyl ether, methyl tetra (propylene oxide) vinyl phenyl ether, ethyl tetra (propylene oxide) vinyl phenyl ether, propoxy tetra (propylene oxide) vinyl phenyl ether N-butyltetra (propylene oxide) vinyl phenyl ether, n Pentaxytetra (propylene oxide) vinyl phenyl ether, poly (ethylene oxide) vinyl phenyl ether, methyl poly (ethylene oxide) vinyl phenyl ether, ethyl poly (ethylene oxide) vinyl phenyl ether, poly (propylene oxide) vinyl phenyl ether, methyl poly (propene Oxide) vinyl phenyl ether, ethyl poly (propylene oxide) ethenyl phenyl ether, poly (ethylene oxide) vinyl benzyl ether, methyl poly (ethylene oxide) vinyl benzyl ether, ethyl poly (ethylene oxide) ethenyl benzyl ether, poly (propylene oxide) vinyl Benzyl ether, methyl vinyl poly (propylene oxide) vinyl benzyl Ether, ethyl poly (propylene oxide) vinyl benzyl ether, poly (ethylene oxide) vinyl phenyl ethyl ether, methyl poly (ethylene oxide) vinyl phenyl ethyl ether, ethyl poly (ethylene oxide) vinyl phenyl ethyl ether, poly (oxypropylene) vinyl phenyl ethyl ether Vinyl phenyl ether monomers having a long-chain polyalkylene oxide moiety such as methyl poly (propylene oxide) vinyl phenyl ethyl ether, ethyl poly (propylene oxide) vinyl phenyl ethyl ether;

For example, isopropenyl phenylmethyl butyl ether, isopropenyl phenyl methyl pentyl ether, isopropenyl phenyl methyl hexyl ether, isopropenyl phenyl methyl heptyl ether, isopropenyl phenyl methyl octyl ether, isopropenyl phenyl methyl nonyl ether, isopropenyl phenyl methyl decyl ether, Isopropenyl phenylmethyl undecyl ether, isopropenyl phenyl methyl dodecyl ether, isopropenyl phenyl methyl tridecyl ether, isopropenyl phenyl methyl tetradecyl ether, isopropenyl phenyl methyl pentadecyl ether, isopropenyl phenyl methyl hexadecyl ether, isopropenyl phenyl Methyl heptadecyl ether, Isopropenyl phenyl having a long chain alkyl group such as isopropenyl phenyl methyl octadecyl ether, isopropenyl phenyl methyl nonadecyl ether, isopropenyl phenyl methyl eicosyl ether, isopropenyl phenyl methyl heneicosyl ether, isopropenyl phenyl methyl docosyl ether Type monomers;

For example, poly (ethylene oxide) isopropenyl phenyl ether, methyl poly (ethylene oxide) isopropenyl phenyl ether, ethyl poly (ethylene oxide) isopropenyl phenyl ether, poly (propylene oxide) isopropenyl phenyl ether, methyl poly (propylene oxide) isopropenyl phenyl Ether, ethyl poly (propene oxide) isopropenyl phenyl ether, poly (ethylene oxide) isopropenyl benzyl ether, methyl poly (ethylene oxide) isopropenyl benzyl ether, ethyl poly (ethylene oxide) isopropenyl benzyl ether, poly (propylene oxide) isopropenyl benzyl Ether, methyl poly (propylene oxide) Isopropenyl-based monomers having a polyalkylene oxide moiety, such as propenyl benzyl ether;

For example, mono-long chain alkyl ester cyclic monomers of dicarboxylic acid such as vinyl phenylnonyl succinate, vinyl phenyl methyl decyl hexahydrophthalate, vinyl phenyl ethyl dodecyl terephthalate;

For example, monopolyalkylene oxide esters of dicarboxylic acids such as vinyl phenyl poly (ethylene oxide) succinate, vinyl phenyl methyl poly (ethylene oxide) hexahydrophthalate, vinyl phenyl ethyl poly (ethylene oxide) terephthalate;
Polyalkylene oxides such as methyl 4-vinylbenzoate poly (ethylene oxide), ethyl polyvinylbenzoate poly (ethylene oxide), methyl 4-isopropenylbenzoate poly (propylene oxide), ethyl polyisopropylenylbenzoate poly (propylene oxide) Vinyl benzoate or isopropenyl benzoate monomers having a moiety;

For example, alkenyl group-containing cyclic sulfonic acids such as styrenesulfonic acid, 2-propenyloxybenzenesulfonic acid, 2-methyl-2-propenyloxybenzenesulfonic acid;

For example, ammonium styrene sulfonate, monomethyl ammonium styrene sulfonate, dimethyl ammonium styrene sulfonate, trimethyl ammonium styrene sulfonate, tetramethyl ammonium styrene sulfonate, ethyl ammonium styrene sulfonate, diethyl ammonium styrene sulfonate, triethyl styrene sulfonate Styrenesulfonic acid such as ammonium, tetraethylammonium styrenesulfonate, propylammonium styrenesulfonate, dipropylammonium styrenesulfonate, tripropylammonium styrenesulfonate, butylammonium styrenesulfonate, pentylammonium styrenesulfonate or hexylammonium styrenesulfonate Ammonium salts of
Metal salts of styrene sulfonic acid such as sodium styrene sulfonate, potassium styrene sulfonate, lithium styrene sulfonate, magnesium styrene sulfonate, zinc styrene sulfonate, iron styrene sulfonate;
Metal salts and ammonium salts of alkenyl group-containing vinyloxybenzenesulfonic acid such as ammonium vinyloxybenzenesulfonate, sodium vinyloxybenzenesulfonate, potassium vinyloxybenzenesulfonate, etc .;
2-methyl-2-propenyloxybenzenesulfonate ammonium, 2-methyl-2-propenyloxybenzenesulfonate sodium, 2-methyl-2-propenyloxybenzenesulfonate potassium and the like 2-methyl-2-propenyloxybenzenesulfonate Examples include acid metal salts and ammonium salts.

  Further, for example, hydrogenated bisphenol A having a hydrogenated aromatic ring structure and the like are included in the compound (c1) if they have an α, β-unsaturated double bond group. These may use only 1 type or may use multiple types together.

Of the α, β-unsaturated double bond group-containing compound (c1) having a ring structure containing no hetero atom in the molecule of the present invention, the compound has a ring structure containing no hetero atom in the molecule, and also has a hydroxyl group. The α, β-unsaturated double bond group-containing compound (c1-2) that is not included is cyclohexyl acrylate or acrylic acid in terms of compatibility with the oligomer (A) and durability such as heat resistance and water resistance. Phenyl, benzyl acrylate, 2-phenoxyethyl acrylate, iso-bonyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, 2-ethyladamantyl-2-yl acrylate Is particularly preferred.

  Of the α, β-unsaturated double bond group-containing compound (c1) having a ring structure containing no hetero atom in the molecule of the present invention, the compound has a ring structure containing no hetero atom in the molecule, and Specific examples of the α, β-unsaturated double bond group-containing compound (c1-1) having a hydroxyl group include (meth) acrylic acid 1,2-cyclohexanedimethanol and (meth) acrylic acid 1,3. -Cyclohexanedimethanol, 1,4-cyclohexanedimethanol (meth) acrylic acid, 2-hydroxy-3-phenoxymethyl (meth) acrylate, 2-hydroxy-3-phenoxyethyl (meth) acrylate, (meth) acrylic 2-hydroxy-3-phenoxypropyl acid, 2-hydroxy-3-phenoxybutyl (meth) acrylate, 2-hydroxy-3 (meth) acrylate Phenoxydecyl, (meth) acrylic acid 2-hydroxy-3-phenoxyoctadecyl, (meth) acrylic acid monohydroxyethyl phthalate, (meth) acrylic acid 2- (4-benzoyl-3-hydroxyphenoxy) ethyl, di (meth) Hydroxyl-containing cyclic (meth) acrylic acid esters such as 1,4-bis (2-hydroxypropyl) benzene acrylate and 1,3-bis (2-hydroxypropyl) benzene di (meth) acrylate;

For example, 2-hydroxy-4- {2- (meth) acryloyloxy} ethoxybenzophenone, 2-hydroxy-4- {2- (meth) acryloyloxy} butoxybenzophenone, 2,2′-dihydroxy-4- {2- Hydroxyl group-containing benzophenone-based (meth) acrylic esters such as (meth) acryloyloxy} ethoxybenzophenone, 2-hydroxy-4- {2- (meth) acryloyloxy} ethoxy-4 ′-(2-hydroxyethoxy) benzophenone;

For example, 1,2-cyclohexanedimethanol monovinyl ether, 1,3-cyclohexanedimethanol monovinyl ether, 1,4-cyclohexanedimethanol monovinyl ether, 2-hydroxy-3-phenoxymethyl monovinyl ether, 2-hydroxy-3-phenoxy Ethyl monovinyl ether, 2-hydroxy-3-phenoxypropyl monovinyl ether, 2-hydroxy-3-phenoxybutyl monovinyl ether, 2-hydroxy-3-phenoxydecyl monovinyl ether, 2-hydroxy-3-phenoxyoctadecyl monovinyl ether, 2- Vinyl ethers having a hydroxyl group-containing alicyclic or aromatic ring such as (4-benzoyl-3-hydroxyphenoxy) ethyl monovinyl ether;

For example, 2-hydroxystyrene, 3-hydroxystyrene, 4-hydroxystyrene, 2-hydroxy-α-methylstyrene, 3-hydroxy-α-methylstyrene, 4-hydroxy-α-methylstyrene, 2-methyl-3- Hydroxystyrene, 4-methyl-3-hydroxystyrene, 5-methyl-3-hydroxystyrene, 2-methyl-4-hydroxystyrene, 3-methyl-4-hydroxystyrene, 3,4-dihydroxystyrene, 2,4, Hydroxyl-containing aromatic ethenyl compounds such as 6-trihydroxystyrene and 2-hydroxy-6-vinylnaphthalene;

For example, 1,2-cyclohexanedimethanol mono (meth) allyl ether, 1,3-cyclohexanedimethanol mono (meth) allyl ether, 1,4-cyclohexanedimethanol mono (meth) allyl ether, o- (meth) allyl Phenol, m- (meth) allylphenol, p- (meth) allylphenol, 2-hydroxy-3-phenoxymethyl mono (meth) allyl ether, 2-hydroxy-3-phenoxyethyl mono (meth) allyl ether, 2- Hydroxy-3-phenoxypropyl mono (meth) allyl ether, 2-hydroxy-3-phenoxybutyl mono (meth) allyl ether, 2-hydroxy-3-phenoxydecyl mono (meth) allyl ether, 2-hydroxy-3-phenoxy Octadecyl mono (meth) allyl Ether, 2- (4-benzoyl-3-hydroxyphenoxy) Echirumono (meth) having an alicyclic or aromatic ring of the hydroxyl group-containing and allyl ether (meth) allyl ethers;

For example, (meth) allyl group-containing compounds having a plurality of hydroxyl groups such as o-di (meth) allylbisphenol A, o-di (meth) allylbisphenol F, o-di (meth) allylbisphenol S;

Examples thereof include cyclic compounds containing ethenyl groups such as 3-allyladamantan-1-ol and cyclooctanedimethanol monovinyl ether. These may be used alone or in combination. May be.

An α, β-unsaturated double bond group-containing compound (c1-1) having a ring structure containing no hetero atom in the molecule and having a hydroxyl group, that is, having a hydroxyl group and having a cycloalkane ring, cyclo As the α, β-unsaturated double bond group-containing compound (c1-1) having an alkene ring and / or a benzene ring, acrylic acid is used depending on both the hardness and durability of the resin cured product described later. 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol acrylate, 2-hydroxy-3-phenoxymethyl acrylate, and 1,4-cyclohexanedimethanol monovinyl ether are particularly preferred.

In this invention, it is preferable to contain 1-500 weight part of (alpha), (beta)-unsaturated double bond group containing compound (C) with respect to 100 weight part of oligomers (A), and 5-400 weight part is more. Preferably, 10 to 300 parts by weight is most preferable.
If the amount of the compound (C) is less than 1 part by weight, the cohesive force is insufficient, and the effect of improving heat resistance and heat-and-moisture resistance cannot be expected. On the other hand, when the compound (C) is more than 500 parts by weight, when the optical three-dimensional resin composition is polymerized and cured with active energy rays, shrinkage during polymerization curing and deformation during molding increase. Furthermore, since hardened | cured material tends to become weak, it is not preferable.

In the α, β-unsaturated double bond group-containing compound (C) of the present invention, an α, β-unsaturated bis having a ring structure of any one of a cycloalkane ring, a cycloalkene ring and / or a benzene ring. The compound (c1) containing a heavy bond group contains an α, β-unsaturated double bond group having one or more hetero rings having a hetero atom such as a nitrogen atom, an oxygen atom and / or a sulfur atom in the ring. Compared to compound (c2), it is more preferably used in terms of heat-resistant yellowing and odor.
Further, when the resin composition for optical three-dimensional modeling is polymerized and cured with active energy rays, the compound (C) has a cycloalkane ring, cycloalkene ring and / or Alternatively, it is most preferably used as an α, β-unsaturated double bond group-containing compound (c1-1) having any one or more ring structures of a benzene ring and having a hydroxyl group. However, an α, β-unsaturated double bond group-containing compound having at least one of a cycloalkane ring, a cycloalkene ring and / or a benzene ring and having no hydroxyl group (c1-2) Even so, it is possible to improve the hardness of the resin cured product described later by using it with the hydroxyl group-containing α, β-unsaturated double bond group-containing compound (d1) described later. The selection of (c1-1) and (c1-2) may be selected according to the purpose of use.

Next, other α, β-unsaturated double bond group-containing compound (D) (however, oligomer (A), α, β-unsaturated double bond group-containing compound (B) and α, β-unsaturated) (Excluding those corresponding to the double bond group-containing compound (C)).
The resin composition of the present invention can contain other α, β-unsaturated double bond group-containing compound (D). The α, β-unsaturated double bond group-containing compound (B ′) described above is a compound having an amide group among the other α, β-unsaturated double bond group-containing compounds (D).
The other α, β-unsaturated double bond group-containing compound (D) is a compound having an α, β-unsaturated double bond group in the molecular structure. The compound (D) preferably has a viscosity of 0.5 to 2000 mPa · s, more preferably 1 to 1000 mPa · s. By using such a compound (D), the viscosity increase of the resin composition for optical three-dimensional modeling resulting from the oligomer (A), the compound (B) having a cyclic structure or the compound (C) is suppressed, and heat resistance While maintaining active energy ray polymerizability, improving durability, such as property, the hardness and viscosity of the below-mentioned resin cured product, or moldability can be maintained.

As other α, β-unsaturated double bond group-containing compound (D), considering the hardness of the resin cured product described later, a hydroxyl group-containing α, β-unsaturated double bond group-containing compound (d1), And / or a carboxyl group-containing α, β-unsaturated double bond group-containing compound (d2). The α, β-unsaturated double bond group-containing compound (d12) having both the hydroxyl group and the carboxyl group can be used without any problem.
Furthermore, even if the compounds (c1) and (d1) having a hydroxyl group and having a cycloalkane ring, a cycloalkene ring and / or a benzene ring coexist, they can be used without any problem.
Moreover, other (alpha), (beta)-unsaturated double bond group containing compound (d3) other than (d1) and (d2) can also be contained.

  The other α, β-unsaturated double bond group-containing compound (d1) containing a hydroxyl group is not particularly limited as long as it has a hydroxyl group in its structure. For example, 2-hydroxy (meth) acrylate Ethyl, 1-hydroxypropyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 1-hydroxybutyl (meth) acrylate, 2-hydroxy (meth) acrylate Butyl, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxy (meth) acrylate Decyl, 12-hydroxylauryl (meth) acrylate, ethyl (meth) acrylate-α- (hydride) Fatty acid esters (meth) such as (xymethyl), monofunctional (meth) acrylate glycerol, (meth) acrylate glycidyl laurate, (meth) acrylate glycidyl oleate, (meth) acrylate glycidyl stearate Repeated addition of acrylic acid esters or polylactone-based (meth) acrylic acid esters such as Plaxel FA2D (manufactured by Daicel Chemical), or alkylene oxides such as ethylene oxide and propylene oxide, which have a hydroxyl group at the terminal by ring-opening addition of a lactone ring Hydroxyl group-containing aliphatic (meth) acrylic acid esters such as alkylene oxide addition system (meth) acrylic acid ester having a hydroxyl group at the terminal and (meth) acrylic acid 2-hydroxyethyl phosphate;

For example, repeated addition of hydroxyethyl vinyl ether, hydroxypropyl vinyl ether, hydroxybutyl vinyl ether, hydroxyhexyl vinyl ether, hydroxyoctyl vinyl ether, hydroxydecyl vinyl ether, hydroxydodecyl vinyl ether, hydroxyoctadecyl vinyl ether, glyceryl vinyl ether, or alkylene oxide such as ethylene oxide or propylene oxide Hydroxyl group-containing aliphatic vinyl ethers such as alkylene oxide addition vinyl ethers having a hydroxyl group at the terminal end;

For example, (meth) allyl alcohol, isopropenyl alcohol, dimethyl (meth) allyl alcohol, hydroxyethyl (meth) allyl ether, hydroxypropyl (meth) allyl ether, hydroxybutyl (meth) allyl ether, hydroxyhexyl (meth) allyl ether , Hydroxyoctyl (meth) allyl ether, hydroxydecyl (meth) allyl ether, hydroxydodecyl (meth) allyl ether, hydroxyoctadecyl (meth) allyl ether, glyceryl (meth) allyl ether, or alkylene oxides such as ethylene oxide and propylene oxide Hydroxyl group-containing aliphatic (meth) allyl alcohols such as alkylene oxide addition system (meth) allyl ether having a hydroxyl group at the terminal of repeating addition of Or (meth) allyl ethers;

  For example, α, β-unsaturated double bond group-containing compounds having a plurality of hydroxyl groups such as propenediol, butenediol, heptenediol, octenediol, and glycerol di (meth) acrylate;

  Examples thereof include monomers having a hydroxyl group and an ethenyl group such as vinyl alcohol, but are not particularly limited thereto. These may use only 1 type or may use multiple types together.

  As other α, β-unsaturated double bond group-containing compound (d1) containing a hydroxyl group, 2-hydroxyethyl (meth) acrylate and 2-hydroxy (meth) acrylate are preferred in terms of reducing the shrinkage of the resin. An α, β-unsaturated double bond group-containing compound having 2 to 18 carbon atoms such as propyl, 4-hydroxybutyl (meth) acrylate, Plaxel FA2D (manufactured by Daicel Chemical Industries) is particularly preferable.

 The other α, β-unsaturated double bond group-containing compound (d2) containing a carboxyl group is not particularly limited as long as it has a carboxyl group in its structure. For example, (meth) acrylic acid, (Meth) acrylic acid 2-carboxyethyl, (meth) acrylic acid 2-carboxypropyl, (meth) acrylic acid 3-carboxypropyl, (meth) acrylic acid 4-carboxybutyl, (meth) acrylic acid dimer, maleic acid, Fumaric acid, monomethylmaleic acid, monomethylfumaric acid, aconitic acid, sorbic acid, cinnamic acid, α-chlorosorbic acid, glutaconic acid, citraconic acid, mesaconic acid, itaconic acid, tiglic acid, angelic acid, senetic acid, crotonic acid , Isococrotonic acid, mucobromic acid, mucochloric acid, sorbic acid, muconic acid, aconitic acid Of lactone rings such as penicillic acid, gellanic acid, citronellic acid, 4-acrylamidobutanoic acid, 6-acrylamidohexanoic acid, 2- (meth) acryloyloxyethyl succinate, or mono (meth) acrylic acid ω-carboxypolycaprolactone ester Polylactone-based (meth) acrylic acid ester having a carboxyl group at the terminal by ring-opening addition, or alkylene oxide-added succinic acid and (meth) acrylic having a carboxyl group at the terminal where alkylene oxide such as ethylene oxide or propylene oxide is repeatedly added Examples include, but are not limited to, carboxyl group-containing aliphatic α, β-unsaturated double bond group-containing carboxylic acids such as acid esters and acid anhydrides thereof. These may use only 1 type or may use multiple types together.

  As the other α, β-unsaturated double bond group-containing compound (d2) containing a carboxyl group, acrylic acid, methacrylic acid, and 2-carboxypropyl acrylate are particularly preferable from the viewpoint of improving the hardness of the resin.

Of the α, β-unsaturated double bond group-containing compound (D), other α, β-unsaturated double bond groups other than the hydroxyl-containing α, β-unsaturated double bond group-containing compound (d1) More specifically, the containing compound (d3) is, for example, methyl (meth) acrylate, ethyl (meth) acrylate, 1-propyl (meth) acrylate, 2-propyl (meth) acrylate, (meth). N-butyl acrylate, sec-butyl (meth) acrylate, iso-butyl (meth) acrylate, tert-butyl (meth) acrylate, n-amyl (meth) acrylate, iso-amyl (meth) acrylate , N-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, iso-octyl (meth) acrylate, n-nonyl (meth) acrylate Alkyl (meth) acrylates such as (meth) acrylic iso-nonyl, decyl (meth) acrylate, dodecyl (meth) acrylate, octadecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate Esters;

For example, methyl (meth) acrylate, ethyl (meth) acrylate, 1-propyl (meth) acrylate, 2-propyl (meth) acrylate, n-butyl (meth) acrylate, sec- (meth) acrylic acid sec- Butyl, iso-butyl (meth) acrylate, tert-butyl (meth) acrylate, n-amyl (meth) acrylate, iso-amyl (meth) acrylate, n-hexyl (meth) acrylate, (meth) 2-ethylhexyl acrylate, n-octyl (meth) acrylate, iso-octyl (meth) acrylate, n-nonyl (meth) acrylate, (meth) acryl iso-nonyl, decyl (meth) acrylate, (meth) ) Dodecyl acrylate, octadecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate Of (meth) acrylic acid alkyl esters;

For example, (meth) acrylic acid (meth) allyl, (meth) acrylic acid 1-butenyl, (meth) acrylic acid 2-butenyl, (meth) acrylic acid 3-butenyl, (meth) acrylic acid 1,3-methyl- 3-butenyl, (meth) acrylic acid 2-chloro-2-propenyl, (meth) acrylic acid 3-chloro-2-propenyl, ((meth) acrylic acid 2- (2-propenyloxy) ethyl, (meth) acrylic acid 2 -Propenyl lactyl, 3,7-dimethyloct-6-en-1-yl (meth) acrylate, (meth) acrylic acid (E) -3,7-dimethyloct-2,6-dien-1-yl (Meth) acrylic acid esters further containing an unsaturated group such as rosinyl (meth) acrylate, cinnamyl (meth) acrylate, vinyl (meth) acrylate;

  For example, perfluoromethyl (meth) acrylate, perfluoroethyl (meth) acrylate, perfluoropropyl (meth) acrylate, perfluorobutyl (meth) acrylate, perfluorooctyl (meth) acrylate, (meth) Trifluoromethylmethyl acrylate, 2-trifluoromethylethyl (meth) acrylate, diperfluoromethylmethyl (meth) acrylate, 2-perfluoroethylethyl (meth) acrylate, 2-par (meth) acrylate Fluoromethyl-2-perfluoroethylmethyl, triperfluoromethylmethyl (meth) acrylate, 2-perfluoroethyl-2-perfluorobutylethyl (meth) acrylate, 2-perfluorohexylethyl (meth) acrylate , (Meth) acrylic propenoic acid 2-perf Orodeshiruechiru, (meth) (meth) acrylic acid perfluoroalkyl esters such as 2-perfluoro-hexadecyl acrylate;

  For example, N-methylaminoethyl (meth) acrylate, N-tributylaminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, ( Amino group-containing (meth) acrylic acid esters such as (meth) acrylic acid N, N-diethylaminomethyl;

  For example, (meth) acrylic acid glycidyl, (meth) acrylic acid (3-methyl-3-oxetanyl) methyl, (meth) acrylic acid tetrahydrofurfuryl, (meth) acrylic acid-2-oxotetrahydropyran-4-yl, (Meth) acrylic acid-4-methyl-2-oxotetrahydropyran-4-yl, (meth) acrylic acid-4-ethyl-2-oxotetrahydropyran-4-yl, (meth) acrylic acid-4-propyl- 2-oxotetrahydropyran-4-yl, (meth) acrylic acid-5-oxotetrahydrofuran-3-yl, (meth) acrylic acid-2,2-dimethyl-5-oxotetrahydrofuran-3-yl, (meth) acrylic Acid-4,4-dimethyl-5-oxotetrahydrofuran-3-yl, (meth) acrylic acid-2-oxoteto Hydrofuran-3-yl, (meth) acrylic acid-4,4-dimethyl-2-oxotetrahydrofuran-3-yl, (meth) acrylic acid-5,5-dimethyl-2-oxotetrahydrofuran-3-yl, (meth ) Acrylic acid-2-oxotetrahydrofuran-3-yl, (meth) acrylic acid-5-oxotetrahydrofuran-2-ylmethyl, (meth) acrylic acid-3,3-dimethyl-5-oxotetrahydrofuran-2-ylmethyl, (Meth) acrylic acid-4,4-dimethyl-5-oxotetrahydrofuran-2-ylmethyl-containing heterocyclic ring-containing (meth) acrylic acid esters;

 For example, (meth) acrylic acid (methoxycarbonyl) methyl, (meth) acrylic acid (methoxycarbonyl) ethyl, (meth) acrylic acid (methoxycarbonyl) propyl, (meth) acrylic acid (methoxycarbonyl) butyl, (meth) acrylic Acid (methoxycarbonyl) decyl, (meth) acrylic acid (ethoxycarbonyl) methyl, (meth) acrylic acid (ethoxycarbonyl) ethyl, (meth) acrylic acid (ethoxycarbonyl) propyl, (meth) acrylic acid (ethoxycarbonyl) butyl , (Meth) acrylic acid (ethoxycarbonyl) hexyl, (meth) acrylic acid (ethoxycarbonyl) octyl, (meth) acrylic acid 2- (ethoxycarbonyloxy) ethyl, (meth) acrylic acid 2- (ethoxycarbonyloxy) propyl , (Meth) acrylic acid 2- (ethoxyca (Rubonyloxy) butyl, 2- (ethoxycarbonyloxy) hexyl (meth) acrylate, 2- (ethoxycarbonyloxy) octyl (meth) acrylate, 2- (propoxycarbonyloxy) ethyl (meth) acrylate, (meth) 2- (Butoxycarbonyloxy) ethyl acrylate, 2- (butoxycarbonyloxy) butyl (meth) acrylate, 2- (octyloxycarbonyloxy) ethyl (meth) acrylate, 2- (octyloxy) (meth) acrylate Aliphatic (meth) acrylic acid esters having one carbonyl group such as carbonyloxy) butyl;

For example, 2-oxobutanoylethyl (meth) acrylate, 2-oxobutanoylpropyl (meth) acrylate, 2-oxobutanoylbutyl (meth) acrylate, 2-oxobutanoylhexyl (meth) acrylate, (Meth) acrylic acid 2-oxobutanoyloctyl, (meth) acrylic acid 2-oxobutanoyldecyl, (meth) acrylic acid 2-oxobutanoyldodecyl, (meth) acrylic acid 3-oxobutanoylethyl, ) 3-oxobutanoylpropyl acrylate, 3-oxobutanoylbutyl (meth) acrylate, 3-oxobutanoylhexyl (meth) acrylate, 3-oxobutanoyloctyl (meth) acrylate, (meth) acrylic 3-oxobutanoyldecyl acid, 3-oxobutanoyldodecyl (meth) acrylate (Meth) acrylic acid 4-cyanooxobutanoylethyl, (meth) acrylic acid 4-cyanooxobutanoylpropyl, (meth) acrylic acid 4-cyanooxobutanoylbutyl, (meth) acrylic acid 4-cyanooxobutanoyl Ruhexyl, 4-cyanooxobutanoyloctyl (meth) acrylate, 2,3-di (oxobutanoyl) propyl (meth) acrylate, 2,3-di (oxobutanoyl) butyl (meth) acrylate, ( Aliphatic (meth) acrylic acid esters having two carbonyl groups such as 2,3-di (oxobutanoyl) hexyl (meth) acrylate and 2,3-di (oxobutanoyl) octyl (meth) acrylate Kind;

For example, 3- (meth) acryloyloxypropylmethyldimethoxysilane, 3- (meth) acryloyloxypropyltrimethoxysilane, 3- (meth) acryloyloxypropyltripropoxysilane, 3- (meth) acryloyloxypropyltributoxysilane 3- (meth) acryloyloxypropylmethyldimethoxysilane, 3- (meth) acryloyloxypropylmethyldiethoxysilane, 3- (meth) acryloyloxypropylethyldimethoxysilane, 3- (meth) acryloyloxypropylbutyldimethoxysilane, 3- (meth) acryloyloxypropylethyldipropoxysilane, 3- (meth) acryloyloxypropylmethyldiethoxysilane, 3- (meth) acryloyloxypropyltrime Kishishiran, 3- (meth) acryloyloxy propyl triethoxysilane, 3- (meth) acryloyl alkoxysilyl group-containing (meth) acrylic acid esters such as propyl tripropoxysilane;

For example, sulfomethyl (meth) acrylate, 2-sulfoethyl (meth) acrylate, 2-sulfopropyl (meth) acrylate, 3-sulfopropyl (meth) acrylate, 2-sulfobutyl (meth) acrylate, (meth) 4-sulfobutyl acrylate, 2-sulfobutyl (meth) acrylate, 6-sulfohexyl (meth) acrylate, sulfooctyl (meth) acrylate, sulfodecyl (meth) acrylate, sulfolauryl (meth) acrylate, (meth ) (Meth) acrylic acid alkyl esters containing a sulfonyl group such as sulfostearyl acrylate;

For example, metal salts and ammonium of sulfonyl group-containing (meth) acrylic acid esters such as (meth) acryloyloxydimethylethylammonium ethyl sulfate, (meth) acryloylaminopropyltrimethylammonium sulfate, (meth) acryloylaminopropyltriethylammonium sulfate salt;

For example, (meth) acrylic acid phosphooxyethyl, (meth) acrylic acid phosphooxypropyl, (meth) acrylic acid phosphooxybutyl, (meth) acrylic acid-3-chloro-2-acid phosphooxyethyl, ( (Meth) acrylic acid-3-chloro-2-acid phosphooxypropyl, (meth) acrylic acid-3-chloro-2-acid phosphooxybutyl, phenyl-2- (meth) acryloyloxyethyl phosphate, (meth) acrylic acid Phosphonic acid group-containing (meth) acrylic acid esters such as acid phosphooxyethylene oxide (ethylene oxide addition moles: 4 to 10) and (meth) acrylic acid acid phosphooxypropylene oxide (propylene oxide addition moles: 4 to 10) Kind;

For example, 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl (meth) acrylate, 3-propoxyethyl (meth) acrylate, 2-butoxy (meth) acrylate Alkoxy group-containing (meth) acrylic acid esters such as ethyl, 3-butoxyethyl (meth) acrylate, 4-butoxyethyl (meth) acrylate;

  For example, alkylene oxide-containing (meth) acrylic acid derivatives such as an alkylene oxide adduct of (meth) acrylic acid;

For example, vinyl acetoacetate, vinyl acetopropionate, vinyl acetoisobutyrate, vinyl acetobutyrate, vinyl acetovalerate, vinyl acetohexanoate, vinyl aceto-2-ethylhexanoate, vinyl aceto-n-octanoate, vinyl acetodecanoate, acetodecane Vinyl acid, vinyl acetooctadecanoate, vinyl acetopivalate, vinyl acetocaprate, vinyl acetocrotonate, vinyl acetosorbate, vinyl propanoyl acetate, vinyl butyryl acetate, vinyl isobutyryl acetate, vinyl palmitoyl acetate, vinyl stearoyl acetate, vinyl pyroyl acetate , Vinyl propanoyl valerate, vinyl butyryl valerate, isobutyryl valerate, palmitoyl valerate, stearoyl valerate, pyrvoyl Vinyl Rerin acid, 2-acetoacetoxyethyl vinyl ether, 2-acetoacetoxyethyl butyl vinyl ether, 2-acetoacetoxyethyl hexyl vinyl ether, aliphatic vinyl compounds of having an acyl group such as 2-acetoacetoxyethyl octyl vinyl ether;

  For example, ethyl vinyl ether, 1-propyl vinyl ether, 2-propyl vinyl ether, n-butyl vinyl ether, sec-butyl vinyl ether, iso-butyl vinyl ether, tert-butyl vinyl ether, n-amyl vinyl ether, n-hexyl, 2-ethylhexyl vinyl ether, n -Aliphatic vinyl ethers such as octyl vinyl ether, iso-octyl vinyl ether, n-nonyl vinyl ether, iso-nonyl vinyl ether, decyl vinyl ether, dodecyl vinyl ether, octadecyl vinyl ether, lauryl vinyl ether, stearyl vinyl ether;

  For example, fluorine-containing ethenyl compounds such as perfluorovinyl, perfluoropropene, perfluoro (propyl vinyl ether), vinylidene fluoride;

For example, alkenyl group-containing sulfonic acids such as vinyl sulfonic acid, 2-propenyl sulfonic acid, 2-methyl-2-propenyl sulfonic acid, and vinyl sulfuric acid;

For example, metal salts and ammonium salts such as ammonium vinyl sulfonate, sodium vinyl sulfonate, potassium vinyl sulfonate, sodium vinyl alkyl sulfosuccinate;
Metal salts and ammonium salts of 2-methyl-2-propenylsulfonic acid such as ammonium 2-methyl-2-propenylsulfonate, sodium 2-methyl-2-propenylsulfonate, and potassium 2-methyl-2-propenylsulfonate;

    For example, nitrile group-containing α, such as (meth) acrylonitrile, α-chloroacrylonitrile, crotonnitrile, maleinnitrile, fumaronitrile, mesaconnitrile, citraconnitrile, itacononitrile, 2-propenenitrile, 2-methacrylic acid (meth) acrylate, etc. β-unsaturated double bond group-containing compounds;

  For example, vinyl esters of carboxylic acids such as vinyl formate, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl caprate, vinyl laurate, vinyl versatate, vinyl pivalate, vinyl palmitate, vinyl stearate;

  For example, saturated carboxylic acids such as (meth) allyl acetate, (meth) allyl propionate, (meth) allyl butyrate, (meth) allyl caprate, (meth) allyl laurate, allyl octylate, coconut oil fatty acid, vinyl pivalate, etc. (Meth) allyl esters of acids;

  For example, acetoacetic acid (meth) allyl, acetopropionic acid (meth) allyl, acetoisobutyric acid (meth) allyl, acetobutyric acid (meth) allyl, acetovaleric acid (meth) allyl, acetohexanoic acid (meth) allyl, aceto-2- Ethylhexanoic acid (meth) allyl, aceto-n-octanoic acid (meth) allyl, acetodecanoic acid (meth) allyl, acetodecanoic acid (meth) allyl, acetooctadecanoic acid (meth) allyl, acetopivalic acid (meth) allyl, acetocaprin Acid (meth) allyl, acetocrotonic acid (meth) allyl, acetosorbic acid (meth) allyl, propanoyl acetate (meth) allyl, butyryl acetate (meth) allyl, isobutyryl acetate (meth) allyl, palmitoyl acetate (meth) allyl, Stearoyl acetate (meth) allyl, (meth) allyl Aliphatic (meth) allyl compounds having an acyl group such as hydrin;

  For example, (meth) allylchlorosilane, (meth) allyltrimethoxysilane, (meth) allyltriethoxysilane, (meth) allylaminotrimethylsilane, diethoxyethylvinylsilane, trichlorovinylsilane, trimethoxyvinylsilane, triethoxyvinylsilane, tripropoxy Alkoxysilyl group-containing α, β-unsaturated double bond group-containing compounds such as vinylsilane and vinyltris (2-methoxyethoxy) silane;

For example, glycidyl group-containing vinyl esters such as glycidyl cinnamate, allyl glycidyl ether, 1,3-butadiene monooxirane;

  For example, vinyl esters such as vinyl chloride, vinylidene chloride and allyl chloride;

  For example, dienes such as allene, 1,2-butadiene, 1,3-butadiene, 2-methyl-1,3-butadiene, 2-chloro-1,3-butadiene;

  For example, cis-diallyl succinate, diallyl 2-methylidene succinate, vinyl (E) -but-2-enoate, (Z) -octadeca-9-enoate, (9Z, 12Z, 15Z) -octadeca-9, Α, β-unsaturated double bond group-containing compounds containing polyfunctional unsaturated bonds such as vinyl 12,15-trienoate;

  For example, ethylene, propylene, 1-butene, 2-butene, 2-methylpropene, 1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene 1-docosene, 1-tetracocene, 1-hexacocene, 1-octacocene, 1-triacontene, 1-dotriacontene, 1-tetratoacontene, 1-hexatriacontene, 1-octatriacontene, 1-tetraconten And alkenes such as polybutene-1, polypentene-1, poly-4-methylpentene-1, and the like. In particular, it is not limited to these. These may use only 1 type or may use multiple types together.

For example, di (meth) acrylic acid ethylene oxide, di (meth) acrylic acid triethylene oxide, di (meth) acrylic acid tetraethylene oxide, di (meth) acrylic acid polyethylene oxide, di (meth) acrylic acid propylene oxide, di (Meth) acrylic acid dipropylene oxide, di (meth) acrylic acid tripropylene oxide, di (meth) acrylic acid polypropylene oxide, di (meth) acrylic acid butene oxide, di (meth) acrylic acid pentane oxide, di (meth) 2,2-dimethylpropyl acrylate, hydroxypivalylhydroxypivalate di (meth) acrylate, hydroxypivalylhydroxypivalate hydroxypivalate dicaprolactonate, 1,6-hexane di (meth) acrylate Gio Di (meth) acrylic acid 1,2-hexanediol, di (meth) acrylic acid 1,5-hexanediol di, di (meth) acrylic acid 2,5-hexanediol, di (meth) acrylic acid 1,7 -Heptanediol, di (meth) acrylic acid 1,8-octanediol, di (meth) acrylic acid 1,2-octanediol, di (meth) acrylic acid 1,9-nonanediol di, di (meth) acrylic acid 1,2-decanediol, di (meth) acrylic acid 1,10-decanediol, di (meth) acrylic acid 1,2-decanediol, di (meth) acrylic acid 1,12-dodecanediol, di (meth) 1,2-dodecanediol acrylate, 1,14-tetradecanediol di (meth) acrylate, 1,2-tetradecanediol di (meth) acrylate, di (meth) acrylate 1,16-hexadecanediol acrylate, 1,2-hexadecanediol di (meth) acrylate, 2-methyl-2,4-pentanediol di (meth) acrylate, 3-methyl-1 di (meth) acrylate , 5-pentanediol, 2-methyl-2-propyl-1,3-propanediol di (meth) acrylate, 2,4-dimethyl-2,4-pentanediol di (meth) acrylate, di (meth) 2,2-diethyl-1,3-propanediol acrylate, 2,2,4-trimethyl-1,3-pentanediol di (meth) acrylate, dimethyloloctane di (meth) acrylate, di (meth) 2-ethyl-1,3-hexanediol acrylate, 2,5-dimethyl-2,5-hexanediol di (meth) acrylate, 2-methyl di (meth) acrylate -1,8-octanediol, 2-butyl-2-ethyl-1,3-propanediol di (meth) acrylate, 2,4-diethyl-1,5-pentanediol di (meth) acrylate, di ( (Meth) acrylic acid 1,2-hexanediol, di (meth) acrylic acid 1,5-hexanediol, di (meth) acrylic acid 2,5-hexanediol, di (meth) acrylic acid 1,7-heptanediol, Di (meth) acrylic acid 1,8-octanediol, di (meth) acrylic acid 1,2-octanediol, di (meth) acrylic acid 1,9-nonanediol, di (meth) acrylic acid 1,2-decane Diol, di (meth) acrylic acid 1,10-decanediol, di (meth) acrylic acid 1,2-decanediol, di (meth) acrylic acid 1,12-dodecanediol, di (Meth) acrylic acid 1,2-dodecanediol, di (meth) acrylic acid 1,14-tetradecanediol, di (meth) acrylic acid 1,2-tetradecanediol, di (meth) acrylic acid 1,16-hexadecanediol, 1,2-hexadecanediol di (meth) acrylate, 2-methyl-2,4-pentane di (meth) acrylate, 3-methyl-1,5-pentanediol di (meth) acrylate, di (meth) 2-methyl-2-propyl-1,3-propanediol acrylate, 2,4-dimethyl-2,4-pentanediol di (meth) acrylate, 2,2-diethyl-1, di (meth) acrylate 3-propanediol, 2,2,4-trimethyl-1,3-pentanediol di (meth) acrylate, dimethyloloctane di (meth) acrylate, (Meth) acrylic acid 2-ethyl-1,3-hexanediol, di (meth) acrylic acid 2,5-dimethyl-2,5-hexanediol, di (meth) acrylic acid 2-butyl-2-ethyl-1 , 3-propanediol, di (meth) acrylic acid 2,4-diethyl-1,5-pentanediol, di (meth) acrylic acid 1,1,1-trishydroxymethylethane, etc. bifunctional (meth) acrylic acid Esters;

For example, 1,2,3-propanetriol tri (meth) acrylate, 2-methylpentane-2,4-diol tri (meth) acrylate, 2-methylpentane-2,4-diol tri (meth) acrylate Tricaprolactonate, 2,2-dimethylpropane-1,3-diol tri (meth) acrylate, trimethylolhexane tri (meth) acrylate, trimethyloloctane tri (meth) acrylate, tri (meth) acrylic acid 2,2-bis (hydroxymethyl) 1,3-propanediol, 1,1,1-trishydroxymethylethane tri (meth) acrylate, 1,1,1-trishydroxymethylpropane tri (meth) acrylate, Trifunctional (meth) acrylic esters such as pentaerythritol tri (meth) acrylate;

For example, tetra (meth) acrylic acid pentaerythritol, tetra (meth) acrylic acid ethoxylated pentaerythritol, tetra (meth) acrylic acid ditrimethylolpropane, hexa (meth) acrylic acid dipentaerythritol, tetra (meth) acrylic acid 2, 2-bis (hydroxymethyl) 1,3-propanediol, tetra (meth) acrylic acid 2,2-bis (hydroxymethyl) 1,3-propanediol tetracaprolactonate, tetra (meth) acrylic acid di1, 2,3-propanetriol, tetra (meth) acrylate di-2-methylpentane-2,4-diol, tetra (meth) acrylate di-2-methylpentane-2,4-diol tetracaprolactonate, tetra ( (Meth) acrylic acid di-2,2-dimethylpropane-1,3- All, tetra (meth) acrylate ditrimethylolbutane, tetra (meth) acrylate ditrimethylolhexane, tetra (meth) acrylate ditrimethyloloctane, tetra (meth) acrylate di-2,2-bis (hydroxymethyl) 1, 3-propanediol, hexa (meth) acrylate di-2,2-bis (hydroxymethyl) 1,3-propanediol, hexa (meth) acrylate tri-2,2-bis (hydroxymethyl) 1,3-propanediol , Hepta (meth) acrylic acid tri-2,2-bis (hydroxymethyl) 1,3-propanediol, octa (meth) acrylic acid tri-2,2-bis (hydroxymethyl) 1,3-propanediol, hepta (meta ) Di2,2-bis (hydroxymethyl) 1,3-propanediol acrylate Such as polyfunctional (meth) acrylic acid esters such as real sharp emission oxide. In particular, it is not limited to these. These may use only 1 type or may use multiple types together.

  In the resin composition for optical three-dimensional modeling, as described above, when irradiated with photoactive energy rays such as ultraviolet rays, having a ring structure improves the Tg of the cured resin and increases the cohesive force. Hardness is improved. Moreover, when it has a hydroxyl group, the shrinkage | contraction rate in polymerization hardening can be reduced, and also it becomes possible to reduce the brittleness of a resin cured material. Moreover, since having a carboxyl group interacts with the hydroxyl group and / or alkoxy group of the compound (B), the compound (B) and a carboxyl group-containing α, β-unsaturated double bond group-containing compound (d2) Are mixed and function as a compound having a plurality of α, β-unsaturated double bond groups, so that the polymerization curing density is improved, and therefore, the hardness of the resin cured product is greatly improved.

Next, the active energy ray polymerization initiator (E) will be described.
The active energy ray polymerization initiator (E) used in the present invention can be arbitrarily selected from known ones, and specific examples thereof include, for example, 2,2-dimethoxy-2-phenylacetophenone, acetophenone, Benzophenone, xanthofluorenone, benzaldehyde, anthraquinone, 3-methylacetophenone, 4-chlorobenzophenone, 4,4'-diaminobenzophenone, benzoinpropyl ether, benzoin ethyl ether, benzyldimethyl ketal, 1- (4-isopropylphenyl) -2 -Hydroxy-2-methylpropan-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 4-oxanthone, camphorquinone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane - one, and the like. Examples of commercially available products include Irgacure 184,907,651,1700,1800,819,369,261, DAROCUR-TPO (2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, manufactured by BASF), Darocur- 1173 (manufactured by Merck), Ezacure KIP150, TZT (manufactured by Nippon Shibel Hegner), Kayacure BMS, Kayacure DMBI (manufactured by Nippon Kayaku), and the like.
Moreover, the photoinitiator which has at least 1 (meth) acryloyl group in a molecule | numerator can also be used. These active energy ray polymerization initiators (E) can be used alone or as a mixture of two or more.

The blending ratio of the active energy ray polymerization initiator (E) is 0.01% of the active energy ray polymerization initiator (E) with respect to 100 parts by weight of the resin composition for optical three-dimensional modeling in terms of reactivity. It is preferable to contain -30 weight part.

The resin composition of the present invention does not substantially contain an organic solvent. Although it is preferable not to contain any organic solvent, the active energy ray polymerization initiator (E) is often poorly soluble in the polymerizable component. Therefore, a small amount of an organic solvent may be included to dissolve the active energy ray polymerization initiator (E). The content of the organic solvent in the composition is within 5% by weight.

  Furthermore, in order to improve the performance of the active energy ray polymerization initiator (E), an active energy ray sensitizer may be used in combination. Examples of active energy ray sensitizers include amines, ureas, sulfur-containing compounds, phosphorus-containing compounds, chlorine-containing compounds, nitriles, and other nitrogen-containing compounds. Anthracene, benzophenone, thioxanthone, perylene, phenothiazine, rose bengal and the like are preferably used.

Next, the silane compound (F) will be described.
The resin composition of the present invention preferably contains a silane compound (F). As a silane compound (F), a well-known silane compound can be used and it will not specifically limit if adhesiveness with the below-mentioned base material (G) improves. For example, alkyl alkoxysilane, aryl alkoxysilane, vinyl alkoxysilane, amino alkoxysilane, epoxy alkoxysilane, halogen alkoxysilane, (meth) acryloyl alkoxysilane, mercapto alkoxysilane, cationic alkoxysilane, Examples thereof include alkoxysilanes having an alkoxyl group such as isocyanate-based alkoxysilanes, and / or organic silanes having reactivity by directly bonding a hydrogen atom to a silicon atom. More specifically, for example, tetramethoxysilane, tetraethoxysilane, tetraisopropoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, methyltriacetoxysilane, methyltris (methoxyethoxy) silane, methyltris ( Methoxypropoxy) silane, ethyltrimethoxysilane, ethyltriethoxysilane, ethyltriisopropoxysilane, propyltrimethoxysilane, propyltriethoxysilane, propyltriisopropoxysilane, butyltrimethoxysilane, butyltriethoxysilane, hexyltrimethoxy Silane, hexyltriethoxysilane, octyltrimethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, decyltrie Xysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldiisopropoxysilane, dimethyldiacetoxysilane, dimethylbis (methoxyethoxy) silane, dimethylbis (methoxypropoxy) silane, diethyldimethoxy Silane, diethyldiethoxysilane, diethyldiisopropoxysilane, diethyldiacetoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methylethyldiisopropoxysilane, methylethyldiacetoxysilane, methylpropyldimethoxysilane, methylpropyldi Alkyl series such as ethoxysilane, methylpropyldiisopropoxysilane, methylpropyldiacetoxysilane, etc. Alkoxysilane compounds;

  For example, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltriisopropoxysilane, phenyltriacetoxysilane, tolyltrimethoxysilane, tolyltriethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, diphenyldiisopropoxysilane, diphenyldi Aryl alkoxysilanes such as acetoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, methylphenyldiisopropoxysilane, methylphenyldiacetoxysilane;

For example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriisopropoxysilane, vinyltriacetoxysilane, vinyltris (methoxyethoxy) silane, vinyltris (methoxypropoxy) silane, allyltrimethoxysilane, allyltriethoxysilane, divinyldimethoxysilane , Divinyldiethoxysilane, divinyldiisopropoxysilane, divinyldiacetoxysilane, methylvinyldimethoxysilane, methylvinyldiethoxysilane, methylvinyldiisopropoxysilane, methylvinyldiacetoxysilane, diallyldimethoxysilane, diallyldiethoxysilane, Diallyldiisopropoxysilane, methylallyldimethoxysilane, methylallyldiethoxysilane, methylallyldiisopropoxy Vinyl alkoxysilanes such as silane and methylallyldiacetoxysilane;

For example, N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, N- (2-aminomethyl) 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane Amino acids such as N- (2-aminoethyl) 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N- [2- (vinylbenzylamino) ethyl] -3-aminopropyltrimethoxysilane hydrochloride Alkoxysilanes;

For example, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltriethoxysilane, 2- ( Epoxy-based alkoxysilanes such as 3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethylmethyldiethoxysilane;

For example, chloromethyltrimethoxysilane, chloromethyltriethoxysilane, γ-chloropropyltrimethoxysilane, γ-chloropropyltriethoxysilane, 3-chloropropylmethyldiethoxysilane, 3,3,3-trifluoropropyltrimethoxy Halogen-based alkoxysilanes such as silane, 3,3,3-trifluoropropyltriethoxysilane, γ-chloropropylmethyldimethoxysilane, γ-chloropropylmethyldiethoxysilane, 3,3,3-trifluoropropylmethyldimethoxysilane Kind;

For example, 3-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, 3-acryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ- (Meth) acryloyl alkoxysilanes such as acryloxypropylmethyldimethoxysilane;

For example, mercaptoalkoxysilanes such as 3-mercaptopropyltrimethoxylane, 3-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldiethoxysilane;

For example, alkoxysilanes represented by isocyanate-based alkoxysilanes such as γ-isocyanatopropyltriethoxysilane are exemplified.

For example, methylsilane, ethylsilane, dimethylsilane, diethylsilane, diethylmethylsilane, butyldimethylsilane, di-t-butylmethylsilane, triethylsilane, trihexylsilane, butyldimethylsilane, cyclohexyldimethylsilane, n-hexylsilane, n- Octylsilane, tri-n-octylsilane, tripropylsilane, triisopropylsilane, triisobutylsilane, trihexylsilane, n-octadecylsilane, phenylsilane, methylphenylsilane, dimethylphenylsilane, methylphenylvinylsilane, dimethylbenzylsilane, Diphenylsilane, triphenylsilane, (phenylethynyl) dimethylsilane, methyldichlorosilane, ethyldichlorosilane, dimethylchlorosilane, bis ( -Chloroethoxy) methylsilane, tris (2-chloroethoxy) silane, n-hexyldichlorosilane, diisopropylchlorosilane, dichlorosilane, di-t-butylchlorosilane, trichlorosilane, chloromethylsilane, methylphenylchlorosilane, phenyldichlorosilane, diphenyl Chlorosilane, chloroisopropylsilane, dichloromethylsilane, dichloroethylsilane, methyldimethoxysilane, dimethoxymethylsilane, methyldiethoxysilane, dimethylethoxysilane, diethoxysilane, trimethoxysilane, triethoxysilane, tripentyloxysilane, tris ( Trimethylsiloxy) silane, methylphenylethenylsilane, allyldimethylsilane, 1,1,2-trimethyldisilane, 1,1,2, -Tetraphenyldisilane, 1,1,3,3-tetramethyldisilazane, 1,4-bis (dimethylsilyl) benzene, methyltris (dimethylsiloxy) silane, tris (trimethylsiloxy) silane, phenyltris (dimethylsiloxy) silane , Tetrakis (dimethylsiloxy) silane, tetramethyldisilazane, dimethylsilyldimethylamine, bis (dimethylamino) methylsilane, tris (dimethylamino) silane, tris (dimethylsilyl) amine, N, N-dimethylaminomethylethoxysilane, di Acetoxymethylsilane, N, O-bis (dimethylsilyl) acetamide, 2- (dimethylsilyl) pyridine, tetrakis (dimethylsilyl) silane, allyldimethylsilane, mercaptodimethylsilane, cyclopropanesilane , Tris (trimethylsilyl) silane, 1,1,4,4-tetramethyldisilylethene, cyclohexanesilane, pentamethyldisiloxane, tetramethylcyclotetrasiloxane, 1,3-diphenyl-1,3-dimethyldisiloxane, penta Methyldisiloxane, 1,1,3,3-tetramethyldisiloxane, 1,1,3,3-tetraisopropyldisiloxane, 1,1,3,3-tetrakis (trimethylsiloxy) disiloxane, 1,1,3 3,3, -tetramethyldisilazane, 1,2-bis (dimethylsilyl) benzene, 1,1,3,3,5,5-hexamethyltrisiloxane, 1,1,3,3,5,5 7,7-octamethyltetrasiloxane, 1,1,1,3,5,5,5-heptamethyltrisiloxane, 1,1,3,3,5,5 Heptamethyltrisiloxane, 1,1,1,3,5,7,7,7-octamethyltetrasiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7,9- Pentamethylcyclopentasiloxane, 1,2,3,4,5,6-hexamethylcyclotrisilazane, α, ω-bis (hydrodiene) polydimethylsiloxane and long-chain dimethylsiloxane oligomer with oily state Or waxy organic silanes etc. are mentioned.

In addition, as the silane compound (F), a commercially available product can be used, and it is also possible to use an oligomeric silane obtained by oligomerizing a mixture of two or more silanes by hydrolysis and condensation. )include. The silane compound (F) can be used alone or as a mixture of two or more.

It is preferable to contain 0.01-10 weight part of silane compounds (F) in 100 weight part of resin compositions of this invention, and it is more preferable to contain 0.1-5 weight part. If the amount is less than 0.01 parts by weight, the effect of improving heat resistance and moist heat resistance cannot be expected. On the other hand, when the amount exceeds 10 parts by weight, the cohesive force is insufficient, and a polymer coating film is likely to be foamed in durability tests such as heat resistance and moist heat resistance. When it is polymerized and cured, it is not preferable because the hardness of the cured resin is lowered.

Next, the antioxidant (G) will be described.
The resin composition for optical three-dimensional modeling in the present invention may further contain an antioxidant. By containing the antioxidant (G), coloring of the cured resin after active energy ray polymerization with time can be suppressed.
Examples of the antioxidant include phenolic antioxidants such as ADK STAB AO-50 and ADK STAB AO-80 (manufactured by Adeka), and sulfur antioxidants such as IRGANOX-PS-800FD (manufactured by BASF). , Commercially available products such as hindered amine light stabilizers such as TINUBIN 622LD, TINUBIN 144, and TINUBIN 765 (all three are manufactured by BASF), but are not limited thereto.
The mixture ratio of antioxidant (G) is 0.01-20 weight part with respect to 100 weight part of resin compositions for optical three-dimensional modeling, and it is preferable that it is 0.01-10 weight part. If it is less than 0.01 parts by weight, it will be consumed early by the active energy rays, so the polymerization rate will decrease. Conversely, if it exceeds 20 parts by weight, the polymerization rate will increase, but the molecular weight of the cured resin will decrease, In order to reduce the cohesive force of the resin composition for optical three-dimensional modeling as a cured resin, the durability is reduced.

As long as the resin composition of the present invention is within a range that does not impair the effects of the present invention, additives can be appropriately blended in addition to the above-described components. For example, blending organic or inorganic fillers from the viewpoints of polymerization cure shrinkage reduction, thermal expansion coefficient reduction, dimensional stability improvement, elastic modulus improvement, viscosity adjustment, thermal conductivity improvement, strength improvement, toughness improvement, coloring improvement, etc. it can. As such a filler, polymers, ceramics, metals, metal oxides, metal salts, dyes and pigments, and the like can be used, and the shape is not particularly limited, such as particles and fibers. In addition, when blending the above polymers, flexibility imparting agents, plasticizers, flame retardants, storage stabilizers, antioxidants, ultraviolet absorbers, thixotropy imparting agents, dispersion stabilizers, fluidity imparting agents, dissipators. It is also possible to dissolve, semi-dissolve, or micro-disperse in the resin composition for optical three-dimensional modeling as a polymer blend or a polymer alloy, not as a filler, such as a foaming agent.

Next, properties of the resin composition for optical three-dimensional modeling will be described.
The resin composition for optical three-dimensional model | molding of this invention uses the said oligomer (A) and a compound (B) as an essential component, Furthermore, a compound (C), a compound (D), and a photoinitiator as needed. (E), a silane compound (F), an antioxidant (G), and other various additives can be mixed and then mixed uniformly.
When stirring and mixing, it may be prepared by stirring and mixing using a general-purpose device such as a uniaxial or multiaxial extruder, a kneader, or a dissolver equipped with a decompression device. Usually, the temperature at the time of stirring and mixing is preferably set to 10 to 60 ° C. If the set temperature at the time of preparation is less than 10 ° C, the viscosity may be too high to make uniform stirring / mixing work difficult. Conversely, if the temperature at the time of preparation exceeds 60 ° C, a curing reaction due to heat occurs. In some cases, a normal resin composition for optical three-dimensional modeling may not be obtained.

The resin composition for optical three-dimensional modeling of the present invention can be used in any form of liquid, paste, and film.
In addition, although it is preferable that the resin composition for optical three-dimensional model | molding in this invention does not contain an organic solvent substantially, it is also possible to contain a machine solvent. For example, by further adding an organic solvent such as methanol, ethanol, isopropyl alcohol, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl acetate, ethyl acetate, butyl acetate, cyclohexane, toluene, xylene and other hydrocarbon solvents, water, The viscosity of the resin composition for optical three-dimensional modeling can be adjusted, or the viscosity can be lowered by heating the resin composition for optical three-dimensional modeling.

It is important that the resin composition for optical three-dimensional modeling in the present invention has a viscosity at 25 ° C. of 1 to 2000 mPa · s, preferably 10 to 1500 mPa · s, and 20 to 1000 mPa · s. More preferred. When the viscosity is higher than 2000 mPa · s, when the resin cured product is used, the molding process cannot be performed and the hardness deteriorates. On the other hand, if the viscosity is lower than 1 mPa · s, it becomes difficult to control the dimensional stability of the cured resin resin.
Since the viscosity of the resin composition for optical three-dimensional modeling is almost determined by the viscosity of the oligomer (A), by controlling the viscosity of the oligomer (A) in the range of 1 to 100,000 mPa · s, the optical three-dimensional modeling is performed. The viscosity of the resin composition for modeling can also be managed.

Next, the molding process (optical three-dimensional modeling method) of the resin cured product and the resin composition for optical three-dimensional modeling will be described.
The resin composition for optical three-dimensional model | molding of this invention is used suitably as a photocurable liquid resin substance in an optical three-dimensional model | molding method (henceforth optical modeling method). That is, the desired three-dimensional modeling is performed by the stereolithography method that selectively irradiates the photocurable resin composition for optical three-dimensional modeling of the present invention with active energy rays such as ultraviolet rays and supplies the energy necessary for polymerization curing. A resin cured product having a shape can be produced.

The resin composition for optical three-dimensional modeling of the present invention is suitably used as a curable liquid substance in the optical three-dimensional modeling method. That is, by selectively irradiating a specific portion of the resin composition with light such as visible light, ultraviolet light, infrared light, etc., and supplying active energy necessary for polymerization and curing, a three-dimensional shaped object with a desired shape is obtained. Can be obtained.
The active energy ray irradiation light source mainly consists of light in the wavelength range of 150 to 550 nm. Low pressure mercury lamp, medium pressure mercury lamp, high pressure mercury lamp, ultra high pressure mercury lamp, chemical lamp, black light lamp, microwave excitation mercury lamp, LED In addition to lamps, xenon lamps, metal halide lamps and the like, semiconductor laser beams, electron beams, and the like can also be used as active energy rays for exposure. In view of cost, directivity, and convergence, an ultraviolet laser beam is preferable.
The irradiation intensity of the active energy ray is preferably 10 to 500 mW / cm ² . When the light irradiation intensity is less than 10 mW / cm ² , it takes a long time for curing. When the light irradiation intensity exceeds 500 mW / cm ² , it deteriorates to an uncured resin composition for optical three-dimensional modeling by heat radiated from the lamp May occur, which is not preferable. The integrated dose expressed as the product of irradiation intensity and irradiation time is preferably 50 to 5,000 mJ / cm ² . When the integrated irradiation amount is less than 50 mJ / cm ² , it takes a long time for polymerization and curing, and when it is larger than 5,000 mJ / cm ² , the irradiation time becomes very long and the productivity is inferior.

A method for selectively irradiating light, which is an active energy ray for polymerization and curing, to a specific portion of the resin composition is not particularly limited, and can be performed by various methods. For example, a method of irradiating focused light or the like obtained by using a laser beam, a lens, a mirror, or the like to a specific portion, a method of irradiating non-focused light through a fixed pattern mask, or the like can be employed. However, when fine processing or processing accuracy is required, it is desirable to minimize the size of the focused light. In such a case, it is preferable to use laser light. Furthermore, the specific part of the resin composition that is irradiated with light may be the liquid surface of the resin composition placed in the container, the surface of the resin composition in contact with the side wall or the bottom wall of the container, or the liquid. In order to irradiate the liquid surface of the resin composition or the contact surface with the container wall, the light may be irradiated directly from the outside or through a transparent vessel wall. Irradiation may be performed using a light guide such as the above.

Further, in the above-described optical three-dimensional modeling method, usually, after the specific portion of the resin composition for optical three-dimensional modeling is polymerized and cured, the irradiated position is continuously or stepped from the already cured portion to the uncured portion. The cured portion can be grown into a desired three-dimensional shape by moving the target. This irradiation position can be moved by various methods, for example, moving at least one of a light source, a container containing the resin composition, or a cured portion of the resin composition, or uncured in the container. The resin composition (liquid curable material) can be added.

Next, a three-dimensional molded item will be described.
As a typical method for obtaining a three-dimensional model using the resin composition for optical three-dimensional modeling of the present invention, a cured layer having a desired pattern is formed on the resin composition for optical three-dimensional modeling of the present invention which is liquid. In order to obtain a cured layer by selectively irradiating light, and subsequently irradiating light to the uncured composition layer adjacent to the cured layer in a similar manner to the previously formed cured layer By forming a new hardened layer to be repeated and repeating this lamination operation, a method for finally obtaining a three-dimensional shaped object can be exemplified. As a more specific embodiment of this method, the following method can be exemplified.

The formed three-dimensional model is taken out from the container used for the reaction, and after removing unreacted compounds remaining on the surface of the model, it is washed as necessary. Examples of the cleaning agent include organic solvents represented by alcohols such as isopropyl alcohol and ethyl alcohol, organic solvents represented by acetone, ethyl acetate, methyl ethyl ketone, and the like, aliphatic compounds represented by terpenes and glycol ether esters. A low-viscosity liquid resin having an organic solvent, thermosetting property or photo-curing property (meaning polymerization curing property by light which is an active energy ray) can be used. When it is desired to impart transparency to the three-dimensional structure, it is desirable to use the thermosetting or photocurable liquid resin as a cleaning agent. In this case, depending on the type of resin used for cleaning, it is necessary to dry (also referred to as post-cure) with heat or light after cleaning. Note that post-curing has the effect of curing not only the resin on the surface but also the unreacted resin composition that may remain inside the three-dimensional structure, so it is washed with an organic solvent. It is preferable to carry out also in this case.

The resin cured product of the resin composition for optical three-dimensional modeling of the present invention is a variety of resin molded products for electronic products that require complex and fine processing; for new product design studies, presentations, advertisements and exhibitions It can be preferably used as a three-dimensional modeled object such as a model for development; a prototype for development such as performance testing and production aptitude confirmation; and a medical model for simulation of surgery.

  Specific examples of the present invention will be described below together with comparative examples, but the present invention is not limited to the following examples. In the following examples and comparative examples, “parts” and “%” represent “parts by weight” and “% by weight”, respectively.

[Composition Examples 1-42]
Into a light-shielded 300 ml mayonnaise bottle substituted with an oxygen concentration of 10% or less, an oligomer (A), an α, β-unsaturated double bond group-containing compound (B), an α, β-unsaturated double bond group -Containing compound (B ′), α, β-unsaturated double bond group-containing compound (C) and α, β-unsaturated double bond group-containing compound (D) (α, β-unsaturated double bond group-containing Compound (B ′)), active energy ray polymerization initiator (E), silane compound (F), and additives are charged in the ratios shown in Table 1, and sufficiently stirred to sufficiently degas. After that, the resin composition shown in the formulation example was obtained.

About the resin composition of the compounding example shown in Table 1, it calculated | required according to the following method and the result was shown in Table 2.

"appearance"
The liquid appearance of the resin composition obtained in each formulation example was visually evaluated.

"viscosity"
About 1.2 ml of the resin composition obtained in each blending example was measured with an E-type viscometer (TV-22 manufactured by Toki Sangyo Co., Ltd.) under an atmosphere of 23 ° C., and a rotation speed of 0.5 to The solution viscosity (mPa · s) was measured at 100 rpm for 1 minute.

《Molecular weight》
The number average molecular weight (Mn) and the weight average molecular weight (Mw) were measured using Showa Denko GPC (gel permeation chromatography) “Shodex GPC System-21”. GPC is liquid chromatography that separates and quantifies substances dissolved in a solvent based on the difference in molecular size. Tetrohydrofuran is used as a solvent, and weight average molecular weight (Mn) is determined in terms of polystyrene.

<< Hydroxyl value (OHV) >>
About 1 g of a sample is accurately weighed in a stoppered Erlenmeyer flask and dissolved by adding 100 ml of a toluene / ethanol (volume ratio: toluene / ethanol = 2/1) mixed solution. Further, exactly 5 ml of an acetylating agent (a solution in which 25 g of acetic anhydride was dissolved in pyridine to make a volume of 100 ml) was added and stirred for about 1 hour. To this, phenolphthalein reagent is added as an indicator and lasts for 30 seconds. Thereafter, the solution is titrated with a 0.1N alcoholic potassium hydroxide solution until the solution becomes light red.
The hydroxyl value was determined by the following formula. The hydroxyl value was a numerical value in the dry state of the resin (unit: mgKOH / g).
Hydroxyl value (mgKOH / g) = [{(ba) × F × 28.25} / S] / (Non-volatile content concentration / 100) + D
Where S: Amount of sample collected (g)
a: Consumption of 0.1N alcoholic potassium hydroxide solution (ml)
b: Consumption of 0.1N alcoholic potassium hydroxide solution in the empty experiment (ml)
F: Potency of 0.1N alcoholic potassium hydroxide solution
D: Acid value (mgKOH / g)

《Acid value (AV)》
About 1 g of sample compound (B) was accurately weighed in a stoppered Erlenmeyer flask, and dissolved by adding 100 ml of a toluene / ethanol (volume ratio: toluene / ethanol = 2/1) mixed solution. To this was added a phenolphthalein test solution as an indicator, which was held for 30 seconds, and then titrated with a 0.1N alcoholic potassium hydroxide solution until the solution turned light red.
The acid value (mgKOH / g) was determined by the following equation as the value of the resin in the dry state.
Acid value (mgKOH / g) = {(5.611 × a × F) / S} / (Nonvolatile content concentration / 100)
Where S: Amount of sample collected (g)
a: Consumption of 0.1N alcoholic potassium hydroxide solution (ml)
F: Potency of 0.1N alcoholic potassium hydroxide solution

<< Glass transition temperature (Tg) >>
An “SSC5200 disk station” (manufactured by Seiko Instruments Inc.) was connected to a robot DSC (differential scanning calorimeter, “RDC220” manufactured by Seiko Instruments Inc.) and used for measurement.
About 10 mg of the resin composition shown in Table 1 is applied to a release-treated polyester film, irradiated with active energy rays, polymerized and cured, and placed in an aluminum pan as a sample, weighed and a differential scanning calorimeter. The sample was heated for 5 minutes at a temperature of 100 ° C. using an aluminum pan of the same type without a sample as a reference, and then rapidly cooled to −120 ° C. using liquid nitrogen. Thereafter, the temperature was raised at 10 ° C./min, and the glass transition temperature (Tg, unit: ° C.) was determined from the DSC chart obtained during the temperature elevation.

Illustrative compounds are specifically shown in Table 1 below, but are not limited thereto. In addition, as a notation of an exemplary compound, Ebecryl 811: Daicel Cytec Co., Ltd. polyester oligomer (polyester acrylate),
Violet UV3000B: Polyurethane oligomer (urethane acrylate) manufactured by Nippon Synthetic Chemical Industry, Ebecryl 600: Polyepoxy oligomer (epoxy acrylate) manufactured by Daicel Cytec, HMAA: N-hydroxymethylacrylamide, HEAA: N-hydroxyethylacrylamide, HPAA: N- (2-hydroxyphenyl) acrylamide, NMMA: N-methoxymethylacrylamide, NBMA: N-methoxybutylacrylamide, DEAA: diethylacrylamide, ACMO: acryloylmorpholine, CHOHA: 1,4-cyclohexanedimethanol acrylic acid, HPDMA: 2-hydroxy-3-phenoxymethyl acrylate, IBXA: isobornyl acrylate, DCPA: disuccinate Lopentanyl, IMA: imide acrylate, 4HBA: 4-hydroxybutyl acrylate, HEA: 2-hydroxyethyl acrylate, AA: acrylic acid, BA: butyl acrylate, TPO: 2,4,6-trimethylbenzoyl-diphenyl-phos Finoxide (BASF, DAROCUR TPO), KBM-5103: Shin-Etsu Chemical's silane coupling agent, A-174: Tanac's silane coupling agent, DEX-S: Nippon Kayaku's thioxanthone sensitizer , AO-50: An antioxidant manufactured by Adeka Company.

[Examples 1 to 38] [Comparative Examples 1 to 4]
About the resin composition for optical three-dimensional model | molding shown to Table 1 and 2, the mechanical characteristic was measured with the following method and the molding test was done. The results are shown in Table 3. Of the examples, those other than Examples 32 and 33 are reference examples.

"Young's modulus"
The applicator was used to apply a resin composition to a thickness of 250 μm on a glass plate, and irradiated with ultraviolet rays of 0.5 J / cm ² (wavelength: 350 nm) to obtain a cured film. Next, the cured film was peeled off from the glass plate and conditioned for 24 hours at 23 ° C. and 50% relative humidity to obtain a test piece.
Measurement The Young's modulus of the test piece was measured in a constant temperature and humidity chamber at 23 ° C. and 50% relative humidity under the conditions of a tensile speed of 1 mm / min and a gap between marked lines of 25 mm. Further, the breaking elongation and breaking strength of the test piece at 23 ° C. were measured under the conditions of a tensile speed of 50 mm / min and a gap between marked lines of 25 mm.
This Young's modulus was evaluated in four stages.
A: 120 (kg / mm ² ) or more. No problem at all.
○: 100 (kg / mm ² ) or more and less than 120 (kg / mm ² ). Slightly weak, but no problem.
Δ: 80 (kg / mm ² ) or more and less than 100 (kg / mm ² ). Can be used practically.
X: Less than 80 (kg / mm ² ). There is a problem in practical use.

<Measurement of swelling degree>
Using a stereolithography apparatus (solid creator JSC-2000: manufactured by Sony Corporation) using an Ar ion laser (wavelength 351, 385 nm) as a light source, molding was performed at a laser power of 40 mW on the liquid surface and a scanning speed of 100 cm / min. A test piece [(width 50 × length 50 × height 1 mm): laminated thickness of 1 time: 0.2 mm × 5 times of lamination].
After the attached resin solution was carefully wiped off, the weight W ₁ of the plate was measured. Next, the test piece was immersed in a resin solution at 25 ° C. for 24 hours, and the adhered resin solution was wiped off, and then the weight W ₂ was measured.
The degree of swelling was calculated according to the following formula and evaluated in three stages. .
Swelling degree (%) = [(W ₂ −W ₁ ) / W ₁ ] × 100
○: Less than 2 (%). No problem at all.
Δ: 2 (%) or more and less than 5 (%). Can be used practically.
X: 5 (%) or more. There is a problem in practical use.

<Measurement of warpage>
Using the above-described stereolithography apparatus, a test piece [(width 50 × length 50 × height 40 mm): one layer thickness 0.2 mm is molded at a laser power of 40 mW on the liquid surface and a scanning speed of 100 cm / min. × 100 times lamination].
It shape | molded using the optical modeling apparatus mentioned above (one lamination thickness 0.2mm x 100 times lamination). After the adhered resin solution was wiped off, post-curing was performed using a UV lamp (irradiation dose 5 J / cm ² ).
Next, one of the test pieces was fixed to a horizontal base, and the warpage was evaluated by the lift amount Δh (mm) at the other end.
This warpage was evaluated in four stages.
A: Less than 0.2 (mm). No problem at all.
○: 0.2 (mm) or more and less than 0.5 (mm). There are some, but no problem.
Δ: 0.5 (mm) or more and less than 1.0 (mm). Can be used practically.
X: 1.0 (mm) or more. There is a problem in practical use.

When the resin composition for optical three-dimensional modeling of the present invention is polymerized and cured with active energy rays, there is no particular problem in Examples 4 to 38 as shown in Table 3. In Examples 1 to 3, although Young's modulus, degree of swelling, and warpage are slightly inferior, they can be used. On the other hand, in Comparative Examples 1-4, it turns out that there are difficulty in any of a Young's modulus, swelling degree, and curvature, and it is difficult to use it.

Claims (9)

An oligomer (A) having at least one α, β-unsaturated double bond group in the molecule and an α, β-unsaturated double bond group-containing compound (B) (however, correspond to the oligomer (A)) A resin composition for optical three-dimensional modeling comprising the following (1) and (2) :
Furthermore, an α, β-unsaturated double bond group-containing compound (C) having no amide group and a ring structure (however, oligomer (A) and α, β-unsaturated double bond group-containing compound (B ), An α, β-unsaturated double bond group-containing compound (C) having a ring structure that does not contain a heteroatom, and an α, β-unsaturated double bond group-containing compound (C1)
The α, β-unsaturated double bond group-containing compound (c1) having a ring structure not containing a hetero atom is an α, β-unsaturated double bond group-containing compound (c1-1) having a hydroxyl group,
Furthermore, the resin composition for optical three-dimensional modeling characterized by containing a silane compound (F) .
(1) The α, β-unsaturated double bond group-containing compound (B) has one or more amide groups.
(2) The α, β-unsaturated double bond group-containing compound (B) further has a hydroxyl group and / or an alkoxy group. The resin composition for optical three-dimensional modeling according to claim 1, comprising 1 to 500 parts by weight of the α, β-unsaturated double bond group-containing compound (B) with respect to 100 parts by weight of the oligomer (A).   The oligomer (A) was selected from the group consisting of a polyester oligomer (a-1), a polyurethane oligomer (a-2), a polyepoxy oligomer (a-3) and a polyacrylic oligomer (a-4). The resin composition for optical three-dimensional modeling according to claim 1 or 2, wherein the resin composition is at least one kind of oligomer. The resin composition for optical three-dimensional modeling according to any one of claims 1 to 3, wherein the oligomer (A) has a weight average molecular weight of 300 to 30,000. The α, β-unsaturated double bond group-containing compound (B) is an aliphatic α, β-unsaturated double bond group-containing compound having no ring structure. The resin composition for optical three-dimensional modeling in any one. Further, other α, β-unsaturated double bond group-containing compound (D) (however, oligomer (A), α, β-unsaturated double bond group-containing compound (B), and α, β-unsaturated divalent compound) The resin composition for optical three-dimensional modeling according to any one of claims 1 to 5 , wherein the resin composition contains a heavy bond group-containing compound (C). Furthermore, with respect to 100 parts by weight of the resin composition, the active energy ray polymerization comprising initiator (E) contains from 0.01 to 30 parts by claim 1 for stereolithography resin composition according to 6 or object. The stereolithography resin composition according to any one of claims 1 to 7, the resin cured product obtained by polymerizing and curing the active energy ray. A three-dimensional structure made of the cured resin according to claim 8 .