JP6182708B2 - Deposition equipment - Google Patents

Description

  The present invention relates to a film forming apparatus for dissolving a fine particle film forming material and forming a film on a substrate.

  2. Description of the Related Art Conventionally, a film forming apparatus that forms a film of a film forming material on the surface of a base material is known for the purpose of rust prevention treatment or wear resistance treatment on the base material. For example, in the film forming apparatus described in Patent Document 1, a high-speed frame (flame) in which combustion gas is accelerated by an expansion nozzle is injected, and a film-forming material is introduced into the high-speed frame, and the film-forming material is applied by the high-speed frame. A film is formed by melting and hitting and adhering to the substrate surface. Further, for example, in the film forming apparatus described in Patent Document 2, a film forming material is introduced into a plasma jet and melted, and the melted film forming material is accelerated by an acceleration nozzle to collide with the surface of a base material. Is forming.

JP 2001-181817 A JP 2010-149095 A

By the way, in a film forming method (spraying) in which a film forming material is melted by a processing medium such as a flame (flame) or plasma and sprayed (sprayed) onto the substrate, the film forming material sprayed on the substrate Most of the material was discarded without being deposited on the substrate. Therefore, in the film formation by thermal spraying, there is a problem that the utilization efficiency of the film forming material is extremely poor.
Further, in the conventional film formation by thermal spraying, depending on the material of the base material, the base material is deformed or deteriorated due to thermal damage by the processing medium or collision of the molten film forming material, so that the base material on which the film can be formed is limited. It was.
An object of the present invention is to provide a film forming apparatus capable of solving the problems of the conventional techniques described above, improving the use efficiency of the film forming material, and expanding the target substrate.

In order to achieve the above object, the present invention provides a film forming apparatus that melts a particulate film forming material to form a film on a substrate, and supplies the film forming material toward the film forming position of the substrate. A mechanism, a processing medium supply mechanism for supplying a laser beam for heating and melting the film forming material toward the film forming position of the base material, and a recovery for recovering the film forming material that has passed through the film forming position of the base material And a mechanism.

In the film forming apparatus according to the present invention, the processing medium supply mechanism locally supplies the laser light to a certain range at the film forming position, and the supply mechanism is larger than the certain range. The film forming material is supplied to a range.

  According to the present invention, in the film forming apparatus, the supply mechanism and the recovery mechanism are connected by a reuse circulation mechanism, and the function of the reuse circulation mechanism allows the collected film forming material to be recovered by the supply mechanism. It is reused.

Further, the present invention is the above film forming apparatus, wherein the supply mechanism has a supply nozzle, the recovery mechanism has a recovery nozzle, the nozzles face each other, and the angle formed by the supply nozzle and the substrate is The film forming material is supplied at an angle smaller than an angle formed by the recovery nozzle and the base material .

According to the present invention, in the film forming apparatus, the processing medium supply mechanism includes a control mechanism for controlling the output of the laser beam .

  According to the present invention, a supply mechanism that supplies a film forming material toward the film forming position of the substrate, and a processing medium supply mechanism that supplies a processing medium for heating and melting the film forming material toward the film forming position of the substrate. And a recovery mechanism for recovering the film forming material that has passed through the film forming position of the base material, so that the film forming material that has passed through the base material surface is recovered by the recovery mechanism without being formed on the base material. And the utilization efficiency of the film forming material can be increased. Further, the supply of the processing medium can be independently controlled by the processing medium supply mechanism, and the target substrate can be expanded.

It is a schematic diagram which shows the structure of the film-forming apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the film-forming result in a film-forming position. It is a schematic diagram which shows the structure of the film-forming apparatus which concerns on 2nd Embodiment of this invention. It is a schematic diagram which shows the structure of the film-forming apparatus which concerns on 3rd Embodiment of this invention. It is a figure which shows the example of a change of a collection | recovery mechanism.

<First Embodiment>
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic diagram showing a configuration of a film forming apparatus 1 according to the first embodiment to which the present invention is applied. The film forming apparatus 1 is a film forming apparatus that heats and melts a fine particle material (film forming material) 3 as a fine particle film forming material and forms a film at a predetermined film forming position P on the surface of the substrate 2. . The film forming apparatus 1 is an apparatus that can be suitably used to produce, for example, a coating 4 of a particulate material 3 containing tungsten carbide having a high melting point on a base 2 made of an aluminum alloy having a low melting point. 3 can be used and the coating 4 can be made hard. As an example, the film forming apparatus 1 can be suitably used when the coating 4 is formed on the sliding portion of the flap attached to the wing of the airplane for the purpose of wear resistance treatment.

  The film forming apparatus 1 heats and melts the metal fine particle material 3 on the surface of the metal base material 2 to form a film, and the base material 2 and the fine particle material 3 made of silicone, ceramic, resin, or the like. Can be applied to. In addition to aircraft parts, the film forming apparatus 1 is provided with coatings for wear resistance, heat resistance, chemical corrosion resistance, insulation, conductivity, etc. on automobile parts (particularly engine parts), gas turbines, and semiconductor manufacturing equipment. Can be used to form.

As shown in FIG. 1, the film forming apparatus 1 includes a circulation mechanism 20 that circulates the fine particle material 3 for forming a film on the surface of the substrate 2, and a laser beam that is a processing medium for heating and melting the fine particle material 3. And a processing medium supply mechanism 10 for supplying 15. In this embodiment, the laser beam 15 that has good convergence and can concentrate high-density optical energy in a small area is used as a processing medium. A configuration using may be used.
The processing medium supply mechanism 10 includes a laser oscillator 11, an optical fiber 12, a light emission position control optical system 13, and a condenser lens 14. The laser oscillator 11 functions as a control mechanism including control means for controlling the output of the laser light 15 output from the processing medium supply mechanism 10. The processing medium supply mechanism 10 is configured to be able to control the laser wavelength, laser power, oscillation mode (continuous oscillation / pulse transmission), irradiation time, and the like by the control function of the laser oscillator 11. The film forming apparatus 1 controls the output of the laser light 15 according to film forming conditions based on the base material 2 and / or the fine particle material 3, film forming quality based on a desired film thickness and film hardness, and the like. It is configured to be able to. According to this configuration, the processing medium supply mechanism 10 can control the irradiation conditions of the laser light 15, for example, switching between continuous irradiation / pulse irradiation and focusing, independently of the supply of the particulate material 3. . Thereby, the thermal damage of the base material around a film-forming position can be suppressed, and the application range of the base material of film-forming object can be extended to resin, an organic material, etc.

The laser beam generated by the laser oscillator 11 is transmitted to the light emission position control optical system 13 by the optical fiber 12. The light emission position control optical system 13 includes, for example, a plurality of mirrors, and the irradiation point can be moved to a predetermined position by appropriately shaking these mirrors. The laser beam 15 emitted from the optical system 13 for controlling the light emission position passes through the condenser lens 14 and is condensed at a predetermined distance from the condenser lens 14. In the present embodiment, the condenser lens 14 is an objective lens. The optical fiber 12 is not an essential configuration, and may be a configuration in which laser light is incident on the light emission position control optical system 13 through a plurality of mirrors.
As described above, the laser beam 15 is a processing medium having locality, and can be locally supplied to a certain range in the film formation position P provided at an arbitrary position on the surface of the substrate 2. Thereby, the fine particle material 3 can be heated and melted only in a certain range to which the laser beam 15 is supplied, and film formation can be locally performed in a certain range at the film formation position P on the surface of the substrate 2. Therefore, when film formation is performed on the surface of the base material 2 using the film formation apparatus 1, it is not necessary to perform masking on portions other than the part where film formation is performed, and the workability of film formation can be improved. . Since the laser beam 15 can be locally supplied to the film formation position P, film formation can be performed without causing thermal damage to the base material 2 outside the portion where film formation is desired.

  Further, the processing medium supply mechanism 10 includes a processing medium feeding mechanism 16. The processing medium feeding mechanism 16 integrally adjusts the light emission position control optical system 13 and the condenser lens 14 so that the irradiation position of the laser beam 15 and the focal length can be adjusted. , And can be moved in the Z-axis direction. As shown in FIG. 1, the processing medium feeding mechanism 16 has a holding portion 17 that holds the light emission position control optical system 13 and the condenser lens 14 movably attached in the X-axis direction and the Y-axis direction. The structure which consists of the table 18 and the leg part 19 to which the said table 18 was attached so that a movement to a Z-axis direction was possible may be sufficient. Although not shown, the processing medium feeding mechanism 16 holds the light emission position control optical system 13 and the condenser lens 14 so as to be movable integrally in the X-axis direction, the Y-axis direction, and the Z-axis direction. The robot arm / robot hand may be configured. The processing medium feeding mechanism 16 is configured to be capable of teaching in advance on the base material 2 according to the shape. For example, when the surface of the base material 2 is not a flat surface, light is emitted along the shape of the base material 2. The configuration may be such that the position control optical system 13 and the condenser lens 14 can be moved as appropriate.

The circulation mechanism 20 includes a supply mechanism 21 that supplies the particulate material 3 to the surface of the substrate 2, a recovery mechanism 25 that collects the particulate material 3 that has passed through the surface of the substrate 2 without forming a film, and a particulate material 3. The recovery mechanism 25 and the circulation pipe (reuse circulation mechanism) 29 circulated between the supply mechanism 21 are configured.
The supply mechanism 21 includes a pressurizing pump 22, a supply pipe 23, and a supply nozzle 24. Although not shown, the pressurizing pump 22 includes a blower fan, for example, and forms an air flow for supplying the particulate material 3 to the surface of the substrate 2. The pressurizing pump 22 is configured to blow air so that when the fine particle material 3 hits the surface of the substrate 2, the fine particle material 3 is supplied at a pressure that does not cause damage. The supply nozzle 24 is provided so that the particulate material 3 is supplied at a small angle with respect to the surface of the substrate 2. The particulate material 3 rides on the air flow formed by the pressure pump 22, passes through the supply pipe 23, and is supplied from the supply nozzle 24 to the surface of the substrate 2.
According to these configurations, the fine particle material 3 supplied to the surface of the base material 2 by the supply mechanism 21 may come off the air flow formed by the pressurization pump 22 by splashing against the base material 2 and scatter around. The particulate material 3 can be supplied to a desired film forming range.

  The recovery mechanism 25 includes a suction pump 26, a recovery pipe 27, and a recovery nozzle 28. The suction pump 26 includes, for example, a suction fan, and forms an air flow for collecting the particulate material 3 that has passed through the film formation position on the surface of the base material 2 without being formed on the surface of the base material 2. The suction pump 26 includes a non-contact type suction mechanism in addition to the configuration including the suction fan, and the fine particle material 3 is collected by decompressing the inside of the collection mechanism 25 by the non-contact type suction mechanism. There may be.

  The collection nozzle 28 is provided so as to face the supply nozzle 24. The collection port 28A of the collection nozzle 28 is formed wider than the supply port 24A of the supply nozzle 24, and is configured to collect the particulate material 3 from a range wider than the supply range. Further, the recovery nozzle 28 may have a configuration in which the recovery port 28 </ b> A is directed to the surface of the substrate 2 at a larger angle than the supply nozzle 24. The particulate material 3 rides on the air flow formed by the suction pump 26, is collected from the collection nozzle 28, passes through the collection pipe 27, and is sent to the circulation pipe 29.

The supply mechanism 21 and the recovery mechanism 25 are connected by a circulation pipe 29, and the particulate material 3 recovered by the recovery mechanism 25 by the circulation pipe 29 is reused by the supply mechanism 21. According to this configuration, the particulate material 3 that has been supplied to the surface of the base material 2 and passed over the surface of the base material 2 without being deposited on the surface of the base material 2 is recovered by the recovery mechanism 25, and the circulation pipe 29 Thus, the supply mechanism 21 can be reused. As described above, by circulatingly supplying the particulate material 3 between the supply mechanism 21 and the recovery mechanism 25, the utilization efficiency of the particulate material 3 can be increased.
The fine particle material 3 is a material having a particle size of 100 μm or less, and preferably a material having a particle size of 50 μm or less. Thus, since the fine particle material 3 is a fine particle having a small particle diameter, by forming an air flow between the supply mechanism 21 and the recovery mechanism 25, the fine particle material 3 is placed on the air flow to form a base material. 2 can form a flow of particles through which the particulate material 3 passes.

The processing medium supply mechanism 10 causes the fine particle material 3 supplied to the surface of the substrate 2 to locally distribute the laser beam 15 between the supply mechanism 21 and the recovery mechanism 25 within a certain range at the film formation position P. To be heated and melted to form a film.
FIG. 2 is a diagram illustrating a result when film formation is performed by supplying the fine particle material 3 and the laser beam 15 to the film formation position P without pre / post irradiation. The film formation result shown in FIG. 2 is obtained by supplying a particulate material 3 containing tungsten carbide to a base material 2 made of aluminum alloy and forming a super hard film. Using the film forming apparatus 1 of the present application, the laser beam 15 continuously oscillates with a laser wavelength set to 1070 nm, a laser power set to 200 watts, and an irradiation diameter set to a diameter of 5 mm. It has been proved by experiments that a super hard film having a thickness of more than 100 μm can be formed with a laser irradiation time of less than a second.

  In the experiment shown in FIG. 2, the film formation was performed without pre / post irradiation. However, the film forming apparatus 1 performs pre / post irradiation to form a harder film. Can be set. In the initial stage of the film forming process before the supply of the fine particle material 3 is started, the film forming apparatus 1 first outputs an output of the laser beam 15 as a normal output for forming a film with the predetermined base material 2 and the predetermined fine particle material 3. Is set lower than that, and a low-power laser beam 15 is supplied to the film forming position P on the surface of the substrate 2 (pre-irradiation). Thereby, the surface of the base material 2 is heated and melted. Subsequently, circulation supply of the particulate material 3 is started, and the output of the laser beam 15 is set to a normal output. Thereby, after the fine particle material 3 is adhered to the surface of the base material 2 that has been melted by heating, the fine particle material 3 can be heated and melted to form a film on the surface of the base material 2. Thereby, the strong coupling | bonding of the base material 2 and the particulate material 3 can be enabled.

  Then, in the latter stage of the film forming process in which the fine particle material 3 is formed in a plurality of layers, the output of the laser beam 15 is set higher than the normal output, and the high output laser beam 15 is set to the film forming position P. (Post irradiation). Thereby, the laminated particulate materials 3 are heated and melted and bonded to form a film. Therefore, it is possible to form a film without micropores or microspaces between the fine particle material 3 supplied to the surface of the base material 2, form a hard film with improved hardness, and improve the wear resistance of the base material 2. Can be improved.

  As described above, according to the embodiment to which the present invention is applied, in the film forming apparatus 1 that melts the fine particle material 3 that is a fine particle film forming material and forms the film on the base material 2, the fine particle material 3 is used as the base material. 2, a supply mechanism 21 that supplies the film 2 toward the film formation position P, a processing medium supply mechanism 10 that supplies a laser beam 15 for heating and melting the film formation material toward the film formation position P of the substrate 2, and the substrate 2. And a recovery mechanism 25 that recovers the particulate material 3 that has passed through the film formation position P. According to this configuration, the supply mechanism 21 that supplies the fine particle material 3 for film formation on the surface of the base material 2 and the fine particle material 3 supplied to the film formation position P on the surface of the base material 2 are heated and melted. Since the processing medium supply mechanism 10 for supplying the laser beam 15 is separately provided, the material supply function and the material heating and melting function can be made independent, and the controllability of each function is improved. Can do. In addition, since the collection mechanism 25 that collects the particulate material 3 that has passed through the film formation position P of the substrate 2 is provided, the particulate material 3 that has passed through the surface of the substrate 2 without being deposited on the surface of the substrate 2 is collected. The collected particulate material 3 can be reused, and the utilization efficiency of the particulate material 3 can be increased. Further, the irradiation condition of the laser beam 15 can be controlled by the processing medium supply mechanism 10 independently of the supply of the fine particle material 3. Thereby, the thermal damage of the base material around a film-forming position can be suppressed, and the application range of the base material of film-forming object can be extended to resin, an organic material, etc.

  Further, according to the embodiment to which the present invention is applied, the processing medium supply mechanism 10 locally supplies the laser light 15 to a certain range at the film forming position P, and the supply mechanism 21 from the certain range. The fine particle material 3 is supplied to a larger range. According to this configuration, since the processing medium supply mechanism 10 locally supplies the laser beam 15 to a certain range at the film forming position P, the fine particle material 3 is supplied within the certain range to which the laser beam 15 is supplied. The film can be formed by locally heating and melting. Thereby, outside the certain range to which the laser beam 15 is supplied, the particulate material 3 is not thermally damaged, and the particulate material 3 can be reused to increase the utilization efficiency of the particulate material 3. Further, it is possible to perform film formation locally only at a desired position without masking the periphery of the film formation position P, and it is possible to improve the utilization efficiency of the fine particle material 3 and to perform film formation work. Can be improved.

  Further, according to the embodiment to which the present invention is applied, the supply mechanism 21 and the recovery mechanism 25 are connected by the circulation pipe 29, and the recovered particulate material is reused by the supply mechanism 21 by the function of the circulation pipe. The According to this configuration, the particulate material 3 collected by the collection mechanism 25 can be circulated to the supply mechanism 21 to be efficiently reused, and the utilization efficiency of the particulate material 3 can be improved.

  Further, according to the embodiment to which the present invention is applied, the supply mechanism 21 has the supply nozzle 24, the recovery mechanism 25 has the recovery nozzle 28, these nozzles 24, 28 face each other, and the supply nozzle 24 is formed. The particulate material 3 is supplied to the film position P at a small angle. According to this configuration, an airflow that passes through the surface of the substrate 2 and flows from the supply nozzle 24 toward the recovery nozzle 28 can be formed, and the particulate material 3 is placed on the surface of the substrate 2 in the airflow. , The particulate material 3 can be circulated between the supply mechanism 21 and the recovery mechanism 25. Further, since the supply nozzle 24 supplies the fine particle material 3 to the film forming position P at a small angle, the impact when the fine particle material 3 hits the surface of the substrate 2 is suppressed, and the fine particle material 3 is prevented from being scattered around. Can do.

  In addition, according to the embodiment to which the present invention is applied, the processing medium supply mechanism 10 includes the laser oscillator 11 as a control mechanism for controlling the output of the laser light 15, so that the film is formed by controlling the output of the laser light 15. Film quality such as conditions and film thickness and hardness of the film to be formed can be appropriately controlled, and a film having high functionality can be formed.

  Further, according to the embodiment to which the present invention is applied, the output of the laser beam 15 is controlled, and the output of the laser beam 15 is set lower than usual at the initial stage of the film forming process. According to this configuration, prior to the supply of the particulate material 3, the laser beam 15 whose output is set low is provided to the surface of the base material 2, and the surface (for example, the oxide layer) is not damaged to the base material 2. ) Is heated and melted, the fine particle material 3 is supplied to the surface of the molten base material 2, and the fine particle material 3 can be adhered to the surface of the base material 2. As a result, a film in which the base material 2 and the fine particle material 3 are integrated can be formed on the surface of the base material 2, and a film with higher adhesion can be formed on the surface of the base material 2.

Second Embodiment
In the first embodiment described above, the supply mechanism 21 and the recovery mechanism 25 are connected by the circulation pipe 29, and the particulate material 3 recovered by the recovery mechanism 25 is reused by the supply mechanism 21 by the circulation pipe 29. did. In the second embodiment, as shown in FIG. 3, a film forming apparatus 101 in which a supply mechanism 31 and a recovery mechanism 35 each include buffer tanks 32 and 36 that temporarily store the particulate material 3 will be described. Note that in the second embodiment, identical symbols are assigned to configurations identical to those in the first embodiment described above and descriptions thereof are omitted.

FIG. 3 is a schematic diagram showing a configuration of a film forming apparatus 101 according to the second embodiment to which the present invention is applied. As illustrated in FIG. 3, the film forming apparatus 101 includes a processing medium supply mechanism 10, a supply mechanism 31, and a recovery mechanism 35.
The supply mechanism 31 includes a supply buffer tank 32 that temporarily stores the particulate material 3. The supply mechanism 31 supplies the particulate material 3 stored in the supply buffer tank 32 from the supply nozzle 24 to the film forming position P on the surface of the substrate 2 through the supply pipe 23 by the pressurizing pump 22. .

The recovery mechanism 35 includes a recovery buffer tank 36 that temporarily stores the particulate material 3. The collection mechanism 35 collects the particulate material 3 that has not passed through the surface of the substrate 2 and formed a film from the collection nozzle 28 via the collection pipe 27 by the suction pump 26 and stores it in the collection buffer tank 36.
The processing medium supply mechanism 10 is configured such that the light emission position control optical system 13 and the condenser lens 14 are integrally movable in the Z-axis direction, and the focal length of the laser light 15 is adjustable. The drive table 6 on which the substrate 2 is placed is configured to be movable in the X-axis direction and the Y-axis direction so that the film-forming position P can be moved to a predetermined position.

  The film forming apparatus 101 collects the particulate material 3 supplied from the supply mechanism 31 and not formed at the film forming position P on the surface of the substrate 2 by the collecting mechanism 35 and stores it in the collecting buffer tank 36. The particulate material 3 stored in the recovery buffer tank 36 can be filled again into the supply buffer tank 32 and reused, and the utilization efficiency of the particulate material can be increased.

<Third Embodiment>
In the first embodiment and the second embodiment described above, the laser beam 15 is condensed at the film forming position P on the surface of the substrate 2, and the fine particle material 3 is heated and melted at the condensing position of the laser beam 15. Thus, the film is formed in a certain range of the film formation position P. In the third embodiment, as shown in FIG. 4, the condensing position C of the laser light 15 is set between the condensing lens 14 and the surface of the substrate 2, and the fine particle material is set at the condensing position C. 3 is a diagram showing a film forming apparatus 201 that supplies 3 to the same axis as the optical axis of a laser beam 15. Note that in the third embodiment, identical symbols are assigned to configurations identical to those in the first embodiment or second embodiment described above and descriptions thereof are omitted.

FIG. 4 is a schematic diagram showing a configuration of a film forming apparatus 201 according to the third embodiment to which the present invention is applied. As illustrated in FIG. 4, the film forming apparatus 201 includes a processing medium supply mechanism 10, a supply mechanism 41, and a recovery mechanism 35.
The supply mechanism 41 is provided with a supply tube 43 that makes the supply port 43 </ b> A of the particulate material 3 coaxial with the optical axis of the laser beam 15 at the tip of the supply nozzle 42. The supply pipe 43 is formed from a material having a melting point higher than that of the particulate material 3. The supply pipe 43 extends from the supply nozzle 42 so that the supply port 43 </ b> A is disposed between the condensing lens 14 and the condensing position C of the condensing lens 14.

  The particulate material 3 supplied from the supply mechanism 41 through the supply pipe 43 and the supply port 43A coaxially with the optical axis of the laser beam 15 is heated and melted at the condensing position C of the laser beam 15. The particulate material 3 heated and melted at the condensing position C of the laser beam 15 is dropped onto the film forming position P on the surface of the substrate 2. The surface of the substrate 2 is irradiated with laser light 15 in a ring shape. By moving the drive table 6 in the X-axis direction and the Y-axis direction, the substrate 2 is moved, and the position of the laser beam 15 irradiated on the surface of the substrate 2 is moved.

  For example, when the drive table 6 is moved in the X-axis direction, the laser beam 15 irradiated on the surface of the substrate 2 in a ring shape is irradiated to the pre-irradiation position P1, and the substrate 2 is irradiated at the pre-irradiation position P1. The surface is heated and melted. Then, the fine particle material 3 is supplied to the surface of the base material 2 heated and melted at the film forming position P. Further, at the post-irradiation position P2, the fine particle materials 3 formed on the surface of the base material 2 are heated and bonded to form a hard film.

  The particulate material 3 that has not passed through the condensing position C of the laser beam 15 and has not been melted and has not passed through the surface of the substrate 2 is recovered by the recovery mechanism 35 and stored in the recovery buffer tank 36. . The particulate material 3 stored in the recovery buffer tank 36 can be filled again into the supply buffer tank 32 and reused, and the utilization efficiency of the particulate material can be increased.

  In addition, the said embodiment is only an example of the specific aspect to which this invention is applied, this invention is not limited, It is also possible to apply this invention as an aspect different from the said embodiment. For example, the supply mechanisms 21, 31, and 41 do not necessarily include the pressurizing pump 22, and an air flow that allows the particulate material 3 to pass through the surface of the substrate 2 by sucking on the collection mechanisms 25 and 35 side. The structure to form may be sufficient.

  FIG. 5 is a diagram showing a recovery mechanism 40 which is a modification of the recovery mechanism. As shown in FIG. 5, the film forming apparatus 1 forms an airflow that flows from the top to the bottom and places it on this airflow. The fine particle material 3 may be supplied to the surface of the base material 2 disposed obliquely with respect to the airflow. A recovery mechanism 40 that recovers the particulate material 3 that has passed through the surface of the base 2 is provided at the bottom of the base 2. The airflow flowing from the top to the bottom of the base material 2 passing through the surface of the base material 2 may be formed by blowing air from a supply mechanism (not shown) provided on the top of the base material 2. Or the structure formed by making the inside of the collection | recovery mechanism 40 provided in the lower part of the base material 2 into a low pressure may be sufficient, or it is by the combination of the ventilation of a supply mechanism, and the suction | inhalation of the collection | recovery mechanism 40. The structure formed may be sufficient. In this way, the fine particle material 3 having a predetermined density and particle diameter is supplied to the surface of the base material 2 in an air flow having a predetermined flow velocity, so that the fine particle material 3 flows on the surface of the base material 2 from the top to the bottom. It can be recovered by the recovery mechanism 40 so as to slide down on the surface of the base material 2 without being separated from the air current and scattered outside the periphery.

  And the base material 2 does not necessarily need to be the structure fixed to the table etc., and the film-forming apparatus 1 is provided with a supply mechanism and a collection | recovery mechanism with the processing medium supply mechanism so that a movement along the base material 2 is possible. It may be a configuration. With this configuration, the film forming apparatus 1 can be widely used in maintenance processes such as repairs.

1, 101, 102 Film forming apparatus 2 Base material 3 Fine particle material (film forming material)
10 Processing medium supply mechanism 11 Laser oscillator (control mechanism)
15 Laser light (processing medium)
DESCRIPTION OF SYMBOLS 20 Circulation mechanism 21, 31, 41 Supply mechanism 24, 42 Supply nozzle 25, 35, 40 Recovery mechanism 28 Recovery nozzle 29 Circulation pipe (reuse circulation mechanism)
P Deposition position

Claims (5)

In a film forming apparatus that melts a particulate film forming material and forms a film on a substrate,
A supply mechanism for supplying the film forming material toward the film forming position of the substrate;
A processing medium supply mechanism for supplying a laser beam for heating and melting the film forming material toward the film forming position of the substrate;
A recovery mechanism for recovering the film forming material that has passed through the film forming position of the substrate;
A film forming apparatus comprising: The processing medium supply mechanism locally supplies the laser beam to a certain range at the film forming position, and the supply mechanism supplies the film forming material to a range larger than the certain range. The film forming apparatus according to claim 1.   The supply mechanism and the recovery mechanism are connected by a reuse circulation mechanism, and the collected film forming material is reused by the supply mechanism by the function of the reuse circulation mechanism. Item 3. The film forming apparatus according to Item 1 or 2. The supply mechanism has a supply nozzle, the recovery mechanism has a recovery nozzle, these nozzles face each other, and the angle formed by the supply nozzle and the base material is the angle formed by the recovery nozzle and the base material The film forming apparatus according to claim 1, wherein the film forming material is supplied at an angle smaller than that of the film forming material. The film forming apparatus according to claim 1, wherein the processing medium supply mechanism includes a control mechanism that controls an output of the laser light .