JP6173512B1 - Electronics - Google Patents

Abstract

An electronic device capable of efficiently cooling an antenna module is provided. An electronic device includes a device casing that houses a heating element therein, and heat generated in the heating element is formed on a side wall of the device casing. And a blower fan 32 that discharges outside the device housing 14 through the exhaust port 40. And by arranging the antenna module 26 for wireless communication between the blower fan 32 and the exhaust port 40, the antenna module 26 can be efficiently cooled. [Selection] Figure 2

Description

  The present invention relates to an electronic device equipped with an antenna module for wireless communication.

  In recent years, electronic devices such as notebook personal computers (notebook PCs) are often equipped with wireless communication antennas that comply with wireless LAN and mobile communication system standards. For example, Patent Literature 1 discloses a notebook PC in which an antenna for wireless communication is mounted on a display housing.

JP 2012-19497 A

  In the mobile communication system as described above, the frequency band is gradually becoming higher in order to further improve the communication speed. Therefore, for example, an antenna for wireless communication using a high frequency of 20 GHz band or more includes an antenna that converts radio waves and electric signals, and an RF (Radio Frequency) unit that amplifies electric signals transmitted to and received from the antenna to high frequencies. Configuration as an antenna module is performed. That is, the higher the frequency band for wireless communication, the greater the propagation loss and the higher the straightness of radio waves. Therefore, the propagation loss can be reduced by modularizing the antenna and the RF unit, and the straightness of the radio wave can be handled by configuring the antenna module with an active array antenna.

  However, since such an antenna module has a large amount of processing in the RF section and a large amount of heat generation, it is necessary to take measures against heat. On the other hand, there is a great demand for miniaturization of electronic devices such as those described above, and it is difficult to provide a dedicated cooling device in the housing for measures against heat of the antenna module.

  The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to provide an electronic apparatus that can efficiently cool an antenna module.

  An electronic device according to the present invention includes a device housing containing a heating element therein, and heat generated in the device housing through an exhaust port formed on an outer wall surface of the device housing. An electronic device having a blower fan that discharges to the outside of the device housing, wherein an antenna module for wireless communication is disposed between the blower fan and the exhaust port.

  According to such a configuration, since the antenna module can be blown by the blower fan, the antenna module can be efficiently cooled, and high communication quality and communication accuracy can be ensured. In addition, the blower fan that cools the antenna module is an existing component that is installed to discharge the heat generated by the heating element to the outside of the device housing through the exhaust port of the device housing. For this reason, it is not necessary to install a new blower fan for cooling the antenna module, and the electronic device can be reduced in size and cost.

  One end portion is provided with a heat pipe arranged in contact with the heating element, and the other end portion of the heat pipe is arranged between the blower fan and the exhaust port. The structure fixed to the edge part may be sufficient. If it does so, an antenna module can be cooled more efficiently because it is attached to the edge part used as the low-temperature part in a heat pipe.

  The blower fan, the heat pipe, and the antenna module may be configured as an assembly part integrally assembled. If it does so, the efficiency of the attachment operation | work to the apparatus housing | casing of an antenna module will improve.

  The antenna module may be fixed to the blower fan. Also in this case, the efficiency of attaching the antenna module to the device casing is improved.

  In addition, an electronic device according to the present invention includes a device casing that houses a heating element therein, and a heat pipe that is provided in the device casing and that has one end in contact with the heating element. The other end of the electronic device is disposed close to an exhaust port formed on the outer wall surface of the device casing, and an antenna for wireless communication is disposed in contact with the other end of the heat pipe. .

  According to such a configuration, since the antenna module is attached to the end that is a low temperature portion in the heat pipe, the antenna module can be efficiently cooled, and high communication quality and communication accuracy can be ensured. Moreover, the heat pipe that cools the antenna module is an existing component that is installed to discharge the heat generated by the heating element to the outside of the device housing through the exhaust port of the device housing. For this reason, it is not necessary to install a new heat pipe for cooling the antenna module, and the electronic device can be reduced in size and cost.

  The configuration may be such that the wiring from the antenna module is connected to the substrate in the device casing with the outer surface of the heat pipe facing. If it does so, the wiring from an antenna module can also be handled as an assembly part integral with a ventilation fan and a heat pipe, and wiring work becomes unnecessary. In addition, in communication in a high frequency band of 20 GHz band or higher, the wiring from the antenna module to the board is particularly concerned about the influence of noise, but it is expensive by arranging the wiring over the outer surface of the grounded heat pipe. Noise reduction effect can be obtained.

  The antenna module may be an active array antenna.

  The array antenna may be configured to face the outside of the device housing from the opening of the exhaust port. As a result, for example, even when the device casing is formed of a conductor such as metal, the communication quality of the array antenna can be sufficiently ensured.

  According to the present invention, the antenna module can be efficiently cooled, and high communication quality and communication accuracy can be ensured. Moreover, since the antenna module can be cooled using the existing cooling means, it is not necessary to install a new cooling means for cooling the antenna module, and the electronic device can be reduced in size and cost. .

FIG. 1 is a partially exploded perspective view of an electronic apparatus according to an embodiment of the present invention. FIG. 2 is a plan view schematically showing the internal structure of the device housing. FIG. 3 is a perspective view schematically showing an enlarged peripheral portion of the cooling unit and the antenna module. FIG. 4 is a block diagram schematically illustrating a configuration example of the communication system of the electronic device. FIG. 5 is a plan view showing another arrangement example of the antenna modules. FIG. 6 is a front view showing the positional relationship between the antenna and the exhaust port. FIG. 7 is a perspective view showing still another arrangement example of the antenna module.

  Hereinafter, preferred embodiments of an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a partially exploded perspective view of an electronic device 10 according to an embodiment of the present invention, and shows an internal structure of a device housing 14 with the keyboard device 12 removed.

  First, the overall configuration of the electronic device 10 will be described.

  As shown in FIG. 1, the electronic device 10 includes a device housing 14 having a keyboard device 12 as an input device mounted on the upper surface side, and a display housing 16 connected to the device housing 14 so as to be opened and closed. It is a notebook PC. The present invention is applicable to various electronic devices such as electronic devices other than notebook PCs, such as tablet PCs, desktop PCs, smartphones, game devices, and home appliances.

  The device housing 14 is a flat box made of, for example, resin. Inside the device housing 14, a substrate 22, which is a motherboard to which the heating element 18 and the communication chip 20 are connected, a cooling unit 24 for cooling the heating element 18, and an antenna module 26 for wireless communication are arranged. Has been.

  The heating element 18 is an electronic component such as a CPU or GPU mounted on the substrate 22 and is a CPU in this embodiment. The heating element 18 is a component that generates a large amount of heat among the electronic components mounted on the electronic device 10. The communication chip 20 is connected to the substrate 22 and is connected to the antenna module 26 via the wiring 28. The cooling unit 24 is a unit that absorbs and transports the heat of the heating element 18 by the heat pipe 30 and radiates the heat to the outside by the blower fan 32. The antenna module 26 has a structure compliant with a predetermined mobile communication system standard, and corresponds to a communication standard in a high frequency band of, for example, 20 GHz band or higher. A specific internal structure of the device housing 14 will be described later.

  The keyboard device 12 has a key top group in which a plurality of keys are arranged in a predetermined pattern on the upper surface thereof. The keyboard device 12 is connected to the substrate 22 by a cable (not shown) drawn from one side surface.

  The display housing 16 is a flat box made of resin. The display housing 16 has a display 16a on one surface thereof, and is connected to the device housing 14 by a pair of left and right hinges 34 and 34 so as to be rotatable. The display housing 16 is electrically connected to the substrate 22 by a wiring (not shown) that has passed through the hinge 34.

  Next, a specific configuration example of the internal structure of the device housing 14 will be described.

  FIG. 2 is a plan view schematically showing the internal structure of the device casing 14, and FIG. 3 is a perspective view schematically showing an enlarged peripheral portion of the cooling unit 24 and the antenna module 26.

  As shown in FIGS. 1 and 2, the side wall 14a of the device housing 14 is provided with an exhaust port 40 in which a plurality of slits 40a penetrating the side wall 14a in the thickness direction are arranged. The exhaust port 40 is an opening for radiating the heat inside the device housing 14 to the outside of the device housing 14. The exhaust port 40 may be formed of a plurality of holes, meshes, or the like instead of the slit 40a.

  As shown in FIGS. 2 and 3, the cooling unit 24 includes a heat pipe 30 having one end (one end) 30 a in contact with the heating element 18, and the other end (other end) of the heat pipe 30. And a blower fan 32 for blowing air to 30b. The heat pipe 30 and the blower fan 32 are attached in the apparatus housing 14 as an assembly part assembled in advance.

  The heat pipe 30 is disposed close to the inner surface side of the exhaust port 40 whose end 30b is formed in the side wall 14a. As a result, the heat pipe 30 can dissipate the heat absorbed from the heating element 18 at the end 30a to the outside of the device housing 14 through the exhaust port 40 from the end 30b. In the present embodiment, the heat sink 42 is fixed to the end 30 b of the heat pipe 30. The end 30b (heat sink 42) of the heat pipe 30 is disposed so that one side (left side in FIG. 2) faces the exhaust port 40 of the side wall 14a and the other side (right side in FIG. 2) of the blower fan 32. It is arranged to face the air blowing port 32a opened on one side. The heat sink 42 has a configuration in which, for example, a plurality of cooling fins 42 a along a direction parallel to the blowing direction of the blower fan 32 are arranged in a direction orthogonal to the blower direction, and can be efficiently cooled by blowing from the blower fan 32. is there.

  Thereby, the air that has been blown from the blower port 32a of the blower fan 32 and passed through the heat sink 42 is exhausted from the exhaust port 40 to the outside. As a result, the heat generated in the heating element 18 is efficiently discharged from the heat pipe 30 to the outside of the device housing 14 via the heat sink 42.

  FIG. 4 is a block diagram schematically illustrating a configuration example of the communication system of the electronic device 10.

  In the present embodiment, the antenna module 26 includes an antenna 26a that is a plurality of array antennas, and an RF (Radio Frequency) unit 26b that is integrated with the antenna 26a (see FIGS. 2 and 4). ). The antenna 26a converts radio waves (electromagnetic waves) and electrical signals. The RF unit 26b is a semiconductor component that is electrically connected to the antenna 26a and performs processing such as amplifying an electric signal transmitted to and received from the antenna 26a to a high frequency. The antenna module 26 is configured as an active array antenna (active phase array antenna) that performs beam forming, and is compatible with radio communication in a high frequency band of 20 GHz or higher.

  The antenna module 26 is disposed between the blower port 32a of the blower fan 32 and the exhaust port 40 of the side wall 14a, more specifically, between the end 30b (heat sink 42) of the heat pipe 30 and the exhaust port 40. (See FIGS. 2 and 3). In the present embodiment, the antenna module 26 is attached to the end 30b of the heat pipe 30 or the heat sink 42 using an adhesive, an adhesive tape, a fastener such as a screw, or the like. That is, the antenna module 26 is configured as an assembly part that is integrally assembled together with the cooling unit 24 in advance. The antenna module 26 may be attached to the inner surface of the side wall 14a, the bottom surface of the device housing 14, or the like. The wiring 28 from the antenna module 26 is routed over the outer surface of the heat pipe 30 and is fixed to the outer surface of the heat pipe 30 by, for example, an adhesive or an adhesive tape (not shown).

  As shown in FIG. 2, each antenna 26a, which is an array antenna, is disposed at a position corresponding to the slit 40a on the side wall 14a. That is, each antenna 26a faces the outside of the device housing 14 from the slit 40a that is the opening of the exhaust port 40 (see also FIG. 6). In other words, each antenna 26 a is disposed at least inside the slit 40 a in front view of the exhaust port 40. Thereby, for example, even when the side wall 14a is formed of a conductor such as metal, the communication quality of the antenna 26a can be sufficiently ensured. When the side wall 14a is formed of a conductor, the size of the opening of the slit 40a is sufficiently larger than the antenna 26a as shown in FIG. 6, and each antenna 26a is securely connected to the outside via the slit 40a. It may be configured to transmit and receive radio waves.

  As shown in FIGS. 2 and 4, the antenna module 26 is electrically connected to the communication chip 20 via the wiring 28. The communication chip 20 is a processing unit that drives and controls the antenna module 26, and is connected to the heating element 18 that is, for example, a CPU via a substrate 22. The communication chip 20 is an electronic component having, for example, an IF (Intermediate Frequency) unit 20a, a BB (Baseband) unit 20b, and a system IF (Interface) 20c. The IF unit 20a is a semiconductor component that performs processing such as converting an electric signal into an intermediate frequency between an electric signal (RF signal) in the RF unit and an electric signal (BB signal) in the BB unit 20b. The BB unit 20b is a semiconductor component that performs processing such as modulation and demodulation of a digital signal. The system IF is, for example, a connector terminal such as a USB standard and is connected to a connector terminal (not shown) on the substrate 22. The communication chip 20 may be mounted on the board 22 on-board.

  By the way, the antenna module 26 is an active array antenna that supports radio communication in a high frequency band of 20 GHz or higher as described above, and therefore generates considerable heat during driving.

  Therefore, in the electronic device 10 according to the present embodiment, the antenna module 26 is disposed between the blower port 32a of the blower fan 32 and the exhaust port 40 of the side wall 14a. Therefore, the antenna module 26 can be blown by the blower fan 32. For this reason, the antenna module 26 can be efficiently cooled, and high communication quality and communication accuracy can be ensured. In addition, the blower fan 32 that cools the antenna module 26 is installed in order to discharge the heat generated by the heating element 18 to the outside of the device housing 14 through the exhaust port 40 formed in the side wall 14a of the device housing 14. It is a part. Therefore, it is not necessary to install a new blower fan for cooling the antenna module 26, and the electronic device 10 can be reduced in size and cost.

  In the electronic device 10, the antenna module 26 is fixed to the end 30 b (or the heat sink 42) of the heat pipe 30 disposed between the blower fan 32 and the exhaust port 40. For this reason, the antenna module 26 can be more efficiently cooled by attaching the antenna module 26 to the end portion 30 b that is a low temperature portion in the heat pipe 30. Moreover, the antenna module 26 is configured as an assembly part that is assembled together in advance with the heat pipe 30 and the blower fan 32 that constitute the cooling unit 24. For this reason, since the mounting operation of the antenna module 26 is completed simply by connecting the wiring 28 to the communication chip 20 on the substrate 22 after the mounting operation of the cooling unit 24, the manufacturing efficiency is improved.

  Note that, depending on the specifications of the electronic device 10, there is a configuration in which the heat pipe 30 is not provided and, for example, heat from the heating element 18 radiated into the device housing 14 by the blower fan 32 is discharged from the exhaust port 40 to the outside. Therefore, in the case of such a configuration, the antenna module 26 may be configured as an assembly part attached in the vicinity of the blower port 32a of the blower fan 32.

  For example, some notebook PC models, tablet PCs, and the like have a configuration in which the blower fan 32 is not incorporated. In this case as well, there are many configurations including a heat pipe 30 for cooling the heating element 18. Therefore, even in such a configuration, for example, by attaching the antenna module 26 to the end portion 30b of the heat pipe 30 that is disposed close to the exhaust port 40 so that heat can be radiated through the exhaust port 40, the efficiency can be improved. Cooling becomes possible.

  In the electronic device 10, the wiring 28 from the antenna module 26 is connected to the communication chip 20 on the substrate 22 side with the outer surface of the heat pipe 30 facing up. For this reason, the wiring 28 can also be handled as an assembly part integrated with the cooling unit 24, and wiring work becomes almost unnecessary. In the high frequency band communication as described above, the wiring 28 from the antenna module 26 to the communication chip 20 is particularly worried about the influence of noise. In this respect, since the wiring 28 is arranged around the outer surface of the grounded heat pipe 30, a high noise reduction effect can be obtained.

  FIG. 5 is a plan view showing another arrangement example of the antenna module 26.

  In the configuration example shown in FIG. 2, the antenna module 26 is disposed between the end 30 b of the heat pipe 30 and the exhaust port 40. For this reason, depending on the specifications such as the amount of heat generated by the heating element 18 and the amount of air blown by the blower fan 32, the antenna module 26 may not be sufficiently cooled. Therefore, as in the configuration example illustrated in FIG. 5, for example, the antenna module 26 may be disposed on the end face side of the end portion 30 b (heat sink 42) of the heat pipe 30. That is, you may arrange | position the antenna module 26 facing the ventilation opening 32a of the ventilation fan 32 in parallel with the edge part 30b of the heat pipe 30. FIG. If it does so, the fresh air from the ventilation fan 32 which is not after passing through the heat sink 42 can be directly applied to the antenna module 26, and the cooling efficiency of the antenna module 26 improves. In the case of the configuration example shown in FIG. 5, the antenna module 26 may be fixed to, for example, the end surface of the end 30 b of the heat pipe 30 or the blower port 32 a of the blower fan 32.

  FIG. 7 is a perspective view showing still another arrangement example of the antenna module 26.

  As in the configuration example shown in FIG. 7, the end 30 b of the heat pipe 30 may be extended farther than the heat sink 42, and the antenna module 26 may be disposed on the lower surface of the extended portion of the end 30 b. As a result, the antenna module 26 is disposed at a position close to the end 30b, which is a low-temperature portion cooled on the heat sink 42 of the heat pipe 30, so that the antenna module 26 can be efficiently cooled. At this time, the heat generated in the antenna module 26 is transmitted to the heat sink 42 through the heat pipe 30 and cooled there.

  In addition, the depth dimension of the heat sink 42 is reduced, and an installation space for the antenna module 26 is secured at a position that is in front of the blower port 32a of the blower fan 32 and the lower surface of the end portion 30b of the heat pipe 30, and the antenna module 26 is placed here. You may arrange. That is, for example, in the configuration example shown in FIG. 5, the end 30 b of the heat pipe 30 may be extended to the upper part of the antenna module 26. Thereby, the antenna module 26 can be more efficiently cooled by the air blown from the blower fan 32 and the heat absorption by the heat pipe 30.

DESCRIPTION OF SYMBOLS 10 Electronic device 12 Keyboard apparatus 14 Equipment housing 14a Side wall 16 Display housing 18 Heating element 20 Communication chip 20a IF part 20b BB part 20c System IF
DESCRIPTION OF SYMBOLS 22 Board | substrate 24 Cooling unit 26 Antenna module 26a Antenna 26b RF part 28 Wiring 30 Heat pipe 30a, 30b End part 32 Blower fan 32a Blower outlet 40 Exhaust outlet 40a Slit 42 Heat sink

Claims (6)

A device housing that contains a heating element therein, and the heat generated in the device housing is exhausted to the outside of the device housing through an exhaust port formed in the outer wall surface of the device housing. An electronic device having a blower fan,
An antenna module for wireless communication is disposed between the blower fan and the exhaust port ,
Furthermore, one end portion includes a heat pipe disposed in contact with the heating element, and the other end portion of the heat pipe is disposed between the blower fan and the exhaust port,
The antenna module is fixed to the other end of the heat pipe . The electronic device according to claim 1 ,
The electronic device, wherein the blower fan, the heat pipe, and the antenna module are configured as an assembly part assembled integrally. The electronic device according to claim 1 or 2 ,
An electronic device, wherein wiring from the antenna module is connected to a substrate in the device casing with the outer surface of the heat pipe facing. A device housing that contains a heating element therein, and the heat generated in the device housing is exhausted to the outside of the device housing through an exhaust port formed in the outer wall surface of the device housing. An electronic device having a blower fan,
An antenna module for wireless communication is disposed between the blower fan and the exhaust port,
The electronic device is characterized in that the antenna module is fixed to the blower fan. In the electronic device of any one of Claims 1-4 ,
The electronic device is characterized in that the antenna module is an active array antenna. The electronic device according to claim 5 , wherein
The electronic device according to claim 1, wherein the array antenna faces the outside of the device housing from the opening of the exhaust port.

Images