JP6160182B2 - Manufacturing method of display element - Google Patents

Description

  The present invention relates to a method for manufacturing a display element having a display layer on a substrate.

  In recent years, electrophoretic display elements (for example, a display method using an e-ink sheet manufactured by E-INK) have become widespread. This display element has excellent visibility, is thin and light, and has low power consumption. For this reason, for example, electrophoretic display elements have been used in various electronic display devices such as mobile phone sub-displays, IC cards, and electronic books.

However, since the conventional display element is simply coated on the front and back surfaces with a moisture-proof resin film, when it is exposed to high temperature or high humidity, moisture enters and deteriorates. There is a problem that the display quality is significantly degraded. For this reason, various technological developments have been made in the past to improve moisture resistance. (For example, see Patent Document 1 below)
9 and 10 show a manufacturing method for improving the moisture resistance of the electrophoretic display element disclosed in Patent Document 1. FIG. FIG. 9 shows a process chart in the manufacturing method, and FIG. 10 shows an EE cross-sectional view in FIG. In the figure, the reference numerals are corrected without departing from the spirit of the invention.

First, FIG. 9A shows an FPC (Flexible) in which wiring electrodes and the like are formed on a base film.
An e-ink sheet 80 manufactured by E-INK is provided on a (Printed Circuit) 70. The FPC 70 has a projecting portion 71 having a narrow width, and has positioning holes 72, 73, and 74 that are round holes at three positions including the projecting portion 71.

  Next, FIG. 9B shows an FPC 70 and an e-ink sheet 80 formed on the FPC 70, a front barrier sheet 90 which is a resin film which is transparent from the front surface side and subjected to moisture-proof treatment, and a rear surface side from the rear side. A structure in which the e-ink sheet 80 is sealed is sandwiched between the barrier sheet 91 and the barrier sheet 91 (see FIG. 10).

  Next, FIG. 9 (c) shows the positioning pins 102 of the fixing device in the three positioning holes 72, 73, 74 after the upper moisture-proof sheet 90 and the lower moisture-proof sheet 91 are bonded together as shown in FIG. , 103, 104 to fix the FPC 70 to the fixing device, and cut the portion of the cutting line 90a indicated by the one-dot chain line.

  Next, FIG. 9D shows the shape of an electrophoretic display element in a completed state after cutting. A hatched portion outside the outer shape of the FPC 70 (portion indicated by a chain line) indicates a portion where the upper moisture-proof sheet 90 and the lower moisture-proof sheet 91 are overlapped and joined. An IC 115 for driving the e-ink sheet 80 is attached between the positioning holes 73 and 74.

  According to Patent Document 1, the e-ink sheet 80 mounted on the upper moisture-proof sheet 90 is enclosed between the upper moisture-proof sheet 90 and the FPC 70, and is further joined at the outer peripheral region of the FPC 70. 90 and the lower moisture-proof sheet 91 are covered and protected, so that intrusion of moisture into the e-ink sheet 80 is prevented.

Further, the cut surface of the protruding portion 71 of the FPC 70 is sandwiched between the upper moisture-proof sheet 90 and the lower moisture-proof sheet 91 and exposed to the outside, but the width of the protruding portion 71 is kept to a minimum. Intrusion of moisture from the exposed cut surface can be minimized. A display element having excellent moisture resistance is obtained.

JP 2009-230129 A (FIGS. 1 and 2)

  As described above, the display element described in Patent Document 1 is extremely excellent in terms of moisture resistance, but how to efficiently manufacture a plurality of such display elements is one of the problems. It was.

  Then, this invention aims at providing the manufacturing method of the display element which can obtain the several display element excellent in moisture resistance efficiently.

  As means for solving the above problems, the present invention provides a display in which a large-sized substrate on which a plurality of display layers are mounted is cut for each display layer, and a plurality of display elements each having a substrate in the display layer are obtained. A device manufacturing method, in which a part of a periphery of a region where a display layer of a large substrate is mounted is cut out to form a cut region, and a moisture-proof sheet is provided on each of the front and back surfaces of the large substrate on which the display layer is mounted And a moisture-proof sheet adhering step for adhering the moisture-proof sheets to each other in the cutout region.

  According to the display element manufacturing method of the present invention, it is possible to efficiently manufacture a plurality of display elements that are sealed in the moisture-proof sheets on the front and back sides and have excellent moisture resistance. In addition, since each process can be completed by a single work process, the cost advantage is increased and a cost reduction effect can be obtained.

In the method for manufacturing a display element of the present invention, it is preferable that the cutting process is performed by leaving a part of the large substrate between the cut regions so that a plurality of cut regions are formed.
In the method for manufacturing a display element of the present invention, it is preferable that the cutting process cuts out a region surrounding the display layer except a region where a wiring electrode pattern connected to the display layer is formed.
The manufacturing method of the display panel of this invention may have the process of forming a display layer in a large sized board | substrate before a cutting-out process.
The manufacturing method of the display panel of this invention may have the process of forming a display layer in a large sized board | substrate between a cutting-out process and a moisture-proof sheet sticking process.
In the method for manufacturing a display panel of the present invention, the display layer may be an electrophoretic display layer.
In the display panel manufacturing method of the present invention, the display layer may be an electroluminescence type display layer.

  According to the present invention, a plurality of display elements having excellent moisture resistance can be obtained efficiently.

It is explanatory drawing explaining the planar layout of a large sized board | substrate concerning 1st Embodiment of this invention. FIG. 2A is a process diagram for explaining a method for manufacturing a display element according to the first embodiment of the present invention, and FIG. 2A is a process diagram for forming a plurality of display layers at predetermined positions on a large substrate, and FIG. ) Is a process diagram for forming a cutout region on a large substrate around the display layer, and FIG. 2C is a diagram showing two moistureproof sheets disposed on the entire surface covering the top and bottom of the display layer, and passing through the cutout region. FIG. 2D shows a process chart in which a single display element is formed by cutting the bonded two moisture-proof sheet portions and the large-sized substrate portion. . It is AA sectional drawing in Fig.2 (a). It is BB sectional drawing in FIG.2 (c). FIG. 5A is a plan view, FIG. 5B is a cross-sectional view taken along the line CC in FIG. 5A, and FIG. ) Is a sectional view taken along the line DD of FIG. FIG. 6A is a process diagram for explaining a method for manufacturing a display element according to a second embodiment of the present invention, and FIG. 6A is a process diagram for forming a cutout region on a large substrate around a predetermined position where a display layer is to be formed. 6 (b) is a process diagram for forming a plurality of display layers at predetermined positions on a large substrate, and FIG. 6 (c) is a cut-out region in which two moisture-proof sheets are arranged on the entire surface covering the top and bottom of the display layer. 6D is a process diagram in which two moisture-proof sheets are bonded and joined together, and FIG. 6D is a diagram showing a single display panel formed by cutting the two moisture-proof sheets and the large-sized substrate. A process diagram is shown. It is a top view explaining the other shape of a cut-out area | region with the manufacturing method of the display element which concerns on 3rd Embodiment of this invention. In the method for manufacturing a display element according to the fourth embodiment of the present invention, the display layer is a cross-sectional view of an essential part showing the configuration of an electroluminescence type display layer. FIG. 9A is a process diagram showing a manufacturing method for improving the moisture resistance of the electrophoretic display device disclosed in the cited document 1 as a conventional technique, and FIG. 9A is a process diagram in which an e-ink sheet is formed on an FPC; FIG. 9B is a process diagram in which the upper moisture-proof sheet and the lower moisture-proof sheet are bonded together, FIG. 9C is a process diagram showing a cutting state based on the positioning holes, and FIG. 9D is a display after cutting. It is a top view of a panel. It is EE sectional drawing in FIG.9 (c).

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[Description of First Embodiment]
Initially, the manufacturing method of the display element which concerns on 1st Embodiment of this invention is demonstrated using FIGS. FIG. 1 relates to the first embodiment of the present invention, and is an explanatory diagram for explaining a planar layout of a large substrate. FIG. 2 is a process diagram for explaining a method of manufacturing a display element according to the first embodiment of the present invention. FIG. 2 (a) is a process diagram for forming a plurality of display layers at predetermined positions on a large substrate. FIG. 2B is a process diagram for forming a cutout region on a large substrate around the display layer, and FIG. 2C shows two moisture-proof sheets disposed on the entire surface covering the top and bottom of the display layer. Process diagram in which moisture-proof sheets are bonded and joined together, FIG. 2 (d) shows a process diagram in which a single display element is formed by cutting a portion of two joined moisture-proof sheets and a portion of a large substrate. ing. 3 is a cross-sectional view taken along line AA in FIG. 2A, and FIG. 4 is a cross-sectional view taken along line BB in FIG. 5 is a plan view and a sectional view of the display element formed by the process diagram of FIG. 2, FIG. 5 (a) is a plan view, and FIG. 5 (b) is a sectional view taken along the line CC in FIG. 5 (a). FIG.5 (c) has shown DD sectional drawing of Fig.5 (a).

First, the planar shape of a large substrate used in the method for manufacturing a display element according to the first embodiment of the present invention will be described with reference to FIG. A large substrate 10 shown in FIG. 1 shows a substrate on which four display layers can be formed. A region surrounded by L1 to L4 indicated by a two-dot chain line is a display layer forming region portion 10a that forms a display layer. Represents.

  The large substrate 10 is made of an FPC substrate. On the surface of the base film 11 made of polyimide resin or the like, a pixel electrode pattern 16 formed by a gold-plated copper pattern or the like and a conductive connection with the outside at the tip portion. The pixel electrode 16 and the electrode terminal 14 are connected to the back surface of the base film 11 with a wiring electrode pattern 13 formed of a copper pattern or the like through a through hole. Similarly, on the surface of the base film 11, in order to connect to the common electrode (22 in FIG. 3) of the display layer, the COM electrode 18 formed of a gold-plated copper pattern or the like is electrically connected to the outside. For this purpose, a COM terminal 17 is provided and is connected to the wiring electrode pattern 13 on the back surface by a through hole. On the back surface of the base film 11, a bottom moisture-proof sheet for protecting the wiring electrode pattern 13 and moisture prevention, and a resist are applied. In order to simplify the drawing, the pixel electrode 16 and the COM electrode 18 are combined to form the display layer forming region portion 10a.

  The large substrate 10 is provided with a cutout region forming portion 10b surrounded by a two-dot chain line. As will be described later, the cutout region forming portion 10b is provided around the other three sides except one side where the wiring electrode pattern 13 is provided so as to surround the display layer forming region portion 10a. .

  The large-sized substrate 10 has a plurality of positioning holes 15 (indicated by round holes in the drawing) in the outer peripheral area, and the display layer forming region portion 10a is located on the basis of the positioning holes 15. A display layer is formed so that a cutout region or the like can be formed at the cutout region forming portion 10b.

  In the first embodiment, the large substrate 10 is provided with four display layer forming region portions 10a. However, the number of display layer forming region portions 10a is not limited to four, and the number is appropriately set. Preferably it is done.

Next, the manufacturing method of the display element according to the first embodiment will be described with reference to FIG. First, FIG. 2A shows a process of forming a plurality of display layers at predetermined positions on a large substrate. In FIG. 2A, a display layer 20 made of an e-ink sheet is attached in accordance with the position of the display layer forming region 10a of the large substrate 10.
As shown in FIG. 3, the display layer 20 has microcapsules 23 uniformly dispersed in a transparent sheet 21 made of a PET (polyethylene terephthalate) film provided with a common electrode 22 made of an ITO film, and further has conductivity. The adhesive layer 24 is coated. The common electrode 22 is connected to the COM electrode 18 provided on the large substrate 10 using conductive rubber or conductive paste (not shown).

  The electrophoretic display layer of the microcapsule 23 includes, for example, white particles made of titanium oxide and black particles made of carbon black dispersed in a highly viscous dispersion medium such as silicon oil and enclosed in a capsule shell. It is made up of. The electrophoretic display layer 20 as the microcapsule 23 corresponds to the e-ink sheet described in the prior art.

In the microcapsule 23, when a voltage is applied to the pixel electrode pattern 16 and the common electrode 22, and the common electrode 22 is a negative electrode and the pixel electrode pattern 16 is a positive electrode, positively charged white particles are on the common electrode 22 side. The black particles that are attracted and negatively charged are attracted to the pixel electrode pattern 16 side. And when it sees from the surface side (transparent sheet 21 side), the white of white particle | grains is observed.

  On the other hand, when the common electrode 22 is the positive electrode and the pixel electrode pattern 16 is the negative electrode, the positively charged white particles are attracted to the pixel electrode pattern 16 side, and the negatively charged black particles are the common electrode 22. Drawn to the side. Then, black color of black particles is observed. In the present embodiment, as described above, the display layer 20 is an electrophoretic display layer.

  In the first embodiment, the display layer 20 is bonded using a film bonding machine on the basis of the outer shape of the large substrate 10 and the positioning pin holes 15.

  Next, FIG. 2B shows a process of forming a cutout region in a large substrate around the display layer. In FIG. 2B, the hatched part represents the cutout region 30. This cutout region 30 is formed in the cutout region forming portion 10b of the large substrate 10 shown in FIG. That is, in the first embodiment, the cutout region 30 is provided on the other three sides except the side where the wiring electrode pattern 13 is provided around the display layer 20 on which the cutout region 30 is mounted.

  The cutout region 30 is formed by cutting out with a cutting die or laser with reference to the positioning pin hole 15 of the large substrate 10.

  Next, FIG. 2C shows a sticking process in which two moisture-proof sheets are provided on the entire surface covering the upper and lower sides of the display layer, and the two moisture-proof sheets are bonded to each other through the cutout region. 2C, on the front and back surfaces of the large substrate 10 on which the display layer 20 is mounted and the cutout region 30 is provided, that is, on the upper and lower surfaces (hereinafter, the front and back surfaces will be referred to as upper and lower surfaces). A moisture-proof sheet comprising a top moisture-proof sheet 35 and a bottom moisture-proof sheet 36 is covered and bonded to the bottom surface. A thermoplastic adhesive is applied to the inside of each moisture-proof sheet, and is sealed by thermocompression bonding with a roll laminator or the like. In the figure, the chain line represents the outer shape of the cutout region 30, but the upper moistureproof sheet 35 and the lower moistureproof sheet 36 are large enough to completely cover the display layer 20 and the cutout region 30 as shown. In addition, it is preferable to use a size that covers a considerable portion of the wiring electrode pattern 13. In the cutout region 30, the upper moisture-proof sheet 35 and the lower moisture-proof sheet 36 are joined.

  FIG. 4 shows a structure in which the upper and lower moisture-proof sheets 35 and 36 are bonded together. As shown in FIG. 4, the upper and lower moisture-proof sheets 35 are formed in the cut region 30 where the large substrate 10 is cut. 36 are adhered and bonded together.

  The upper moisture-proof sheet 35 uses a moisture-proof moisture film having a very low moisture permeability formed by using aluminum oxide or silicon oxide on a transparent PET film by vapor deposition or sputtering, and the lower moisture-proof sheet 36 is an upper moisture-proof sheet. Although the same material as 35 may be used, it is not necessary to be transparent, and a PET film on which an aluminum foil is attached or a PET film in which aluminum is formed by a vapor deposition method or a sputtering method can also be used.

  Next, FIG. 2D illustrates a situation where the large substrate 10 and the upper and lower moisture-proof sheets 35 and 36 are cut in order to obtain a single display element 45. Reference numeral 40 indicated by a one-dot chain line is It represents a cutting line. The cutting line 40 includes a portion where the upper and lower moisture-proof sheets 35 and 36 in the cutout region 30 are adhesively bonded, and an outer portion where the wiring electrode pattern 13, the electrode terminal 14, and the COM terminal 17 of the large substrate 10 are cut lines. It is a part cut | disconnected by 40. This cutting is performed by cutting a portion of the cutting line 40 at a time using a cutting die having four cutting blades and cutting the portion of the cutting line 40 at a time with a plurality of single display elements 45. To form.

  FIG. 5 shows the shape and structure of a single display element 45. As shown in FIG. 5A, the display element 45 includes a display layer 20 mounted on the substrate 10, a base film 11 of the substrate 10, and a plurality of wiring electrode patterns 13 formed on the back surface of the base film 11. And electrode terminals 14 and COM terminals 17 formed on the surface of the base film 11, and moisture-proof sheets 35 and 36 covered on the upper and lower surfaces.

As shown in FIG. 5 (b), the display layer 20 of the display element 45 is in a state of being completely enclosed inside the moisture-proof sheets 35 and 36 on the upper and lower surfaces, so that moisture penetration is suppressed. The moisture resistance of the display layer 20 is improved.
Further, as shown in FIG. 5C, the display layer 20 is in a state where the right portion in the drawing is enclosed in the upper and lower moisture-proof sheets 35 and 36 that are joined together. , 36 is prevented from penetrating moisture from the joint surface. On the other hand, in the left part of the figure, the display layer 20 is sealed in a position that is recessed from the joint portion between the coated upper surface moisture-proof sheet 35 and the large substrate 10 provided with the wiring electrode pattern 13 and the like. . For this reason, moisture may permeate from the surface where the upper moisture-proof sheet 35 and the large substrate 10 are joined, but it takes time to reach the display layer 20 because the display layer 20 is located away from the joining end face. Take it. Therefore, the penetration of moisture into the display layer 20 is suppressed, and the moisture resistance of the display layer 20 is improved. Therefore, by making the configuration of the display element 45 as described above, an excellent moisture-proof effect can be obtained.
In the method of manufacturing the display element 45 having the above-described configuration, the plurality of display layers 20 are formed on the large substrate 10, the cutout region 30 is formed around the display layer 20, and the moisture-proof sheets 35 and 36 are formed on the upper and lower surfaces. The moisture-proof sheets 35 and 36 on the upper and lower surfaces are bonded to each other at the cutout region 30 by bonding. A plurality of single display elements are manufactured by cutting the adhesively bonded portions of the moisture-proof sheets 35 and 36 on the upper and lower surfaces at a time. Since the manufacturing method is simple and a plurality of display elements can be manufactured at a time with a short number of steps, the manufacturing cost is very low.
[Description of Second Embodiment]
Next, a method for manufacturing a display element according to the second embodiment will be described with reference to FIGS. FIG. 6 is a process diagram for explaining a method for manufacturing a display element according to the second embodiment of the present invention. FIG. 6A is a process diagram for forming a cutout region on a large substrate around the display layer formation region. 6 (b) is a process diagram for forming a plurality of display layers at predetermined positions on a large substrate, and FIG. 6 (c) is a diagram showing two moisture-proof sheets disposed on the entire surface covering the upper and lower sides of the display layer. FIG. 6D is a process of bonding two moisture-proof sheets to each other and joining them, and FIG. 6D is a process of cutting a part of the two moisture-proof sheets and a large substrate to form a single display element. The figure is shown.

  The manufacturing method of the second embodiment is different from the manufacturing method of the first embodiment in that the step of forming the display layer on the large substrate is performed after the step of forming the cutout region on the large substrate. In other words, the method includes a step of forming the display layer after providing the cutout region on the large substrate.

  Specifically, in FIG. 6A, the cutout region 30 is formed at the cutout region forming portion 10b of the large substrate 10 shown in FIG. This cutout region 30 is cut out leaving a part of the periphery of the display layer forming region portion 10 (a), and has the same shape as the cutout region 30 shown in FIG. 2 (b). Note that the method for forming the cutout region 30 is the same as the method in the first embodiment described above, and a description thereof will be omitted here.

  Next, in FIG. 6B, the display layer 20 is formed at the display layer forming region 10a. The method for forming the display layer 20 is the same as the method in the first embodiment described above, and a description thereof is omitted here.

Note that the two moisture-proof sheets shown in FIG. 6 (c) are disposed, the two moisture-proof sheets are bonded to each other through the cutout region, and the joining shown in FIG. 6 (d). The process of cutting the two moisture-proof sheet portions and the large substrate portion to form a single display element is shown in FIGS. 2C and 2D in the first embodiment. Since it is the same as the performed process, its description is omitted.

As described above, even if the manufacturing method of the second embodiment is taken, the same effect as the manufacturing method of the first embodiment can be obtained.
[Description of Third Embodiment]
Next, a method for manufacturing a display element according to the third embodiment will be described with reference to FIGS. FIG. 7 shows a plan view in which the shape of the cutout region is another shape in the method for manufacturing a display element according to the third embodiment of the present invention.

  As shown in FIG. 7, four display layers 20 are provided on the large substrate 10. Further, although the cutout region 30 is provided around the display layer 20, in the third embodiment, the cutout region 30 is provided in a state where the display layer 20 is divided into a right side and a left side in the drawing. That is, the connection part 31 without the cutout region 30 is provided in a part of the side on the side opposite to the side on which the wiring electrode pattern 13 is provided, and the cutout region is left and right across the connection part 31. 30 is provided.

  When the cutout region 30 is divided into two in this way, and the portion where the display layer forming region portion 10a and the large-sized substrate 10 are connected is provided on the opposite sides in this way, compared to the case of the first embodiment. Thus, the movement of the display layer forming region 10a is stabilized.

  As described above, by dividing the cutout region 30 into two parts and holding the display layer forming region portion 10a at two places on the large substrate 10, the movement of the display layer forming region portion 10a is restricted. In the step of attaching the display layer 20 made of an e-ink sheet and the step of attaching the upper and lower moisture-proof sheets 35 and 36, it is possible to prevent bending and bending, and workability and yield are improved.

  In addition, it is preferable to make the width | variety of the connection part 31 provided so small that it is not cut | disconnected easily. This is because, when the width of the connecting portion 31 is increased, when the moisture-proof sheets 35 and 36 on the upper and lower surfaces are attached and cut into a single piece, the width of the adhesive bonding portion between the upper moisture-proof sheet 35 and the large substrate 10 is increased. It is. This is because if the width of the adhesive bonding portion is increased, there is a possibility that moisture from the adhesive will permeate, which causes a deterioration in moisture resistance.

  FIG. 7 is a plan view in which the display layer 20 and the cutout region 30 are provided on the large-sized substrate 10. The process of attaching the moistureproof sheets 35 and 36 on the upper and lower surfaces and the process of cutting them into a single piece are described above. Since the process is the same as that in FIG.

In the third embodiment, the connection part 31 is provided only at one place on a part of the side opposite to the side on which the wiring electrode pattern 13 is provided. There is no limitation, and a plurality of them may be provided.
[Explanation of Fourth Embodiment]
Next, a method for manufacturing a display element according to the fourth embodiment will be described with reference to FIGS. FIG. 8 is a cross-sectional view of a principal part showing a configuration of an electroluminescence type display layer as a display layer in the method for manufacturing a display element according to the fourth embodiment of the present invention.

In the method for manufacturing a display element according to the fourth embodiment, the display layer is composed of an electroluminescence type display layer (hereinafter referred to as an electroluminescence type display layer). In the first to third embodiments described so far, the display layer 20 is configured by an electrophoretic display layer using microcapsules. Therefore, only the configuration of the display layer is different in the fourth embodiment. Is. Hereinafter, the configuration of the display layer will be described with reference to FIG. 8, and the manufacturing method is the same as the manufacturing method of the first to third embodiments, and thus the description related to the manufacturing method is omitted.
In FIG. 8, the display layer 50 includes a dielectric layer 54 provided on the pixel electrode 12 on the base film 11 of the large substrate 10, a light emitter layer 53 provided on the dielectric layer 54, and the light emitter layer. A transparent sheet 51 made of PET (polyethylene terephthalate) film, etc., provided with a common electrode 52 made of an ITO film on 53 is formed. The common electrode 52 is connected to the wiring electrode pattern 13 provided on the large substrate 10.

  Here, the dielectric layer 54 is made of a barium titanate dispersed in a high dielectric resin binder such as a cyanoresin compound, and is formed by a printing method such as a screen printing method. The phosphor layer 53 is obtained by dispersing phosphor powder obtained by doping zinc sulfide as a phosphor matrix with a small amount of activator (metal or halogen element) in a high dielectric resin binder such as a cyanoresin compound. And is formed by a printing method such as a screen printing method.

  The electroluminescent display layer 50 having the above-described configuration is configured such that when a voltage is applied to the predetermined pixel electrode 12 and the common electrode 52, a light emitting layer at a portion sandwiched between the applied pixel electrode 12 and the common electrode 52. 53 emits light, and the display is made with the light emission color. That is, the display layer 50 is configured with the light emitting display of the light emitting layer 53.

  Zinc sulfide constituting the luminescent layer 53 is very weak against moisture, and has a property that when the zinc sulfide is attacked by moisture, it deteriorates and becomes black and does not emit light. Therefore, a structure that suppresses the penetration of moisture is required.

  In the electroluminescence type display layer 50 formed on the large-sized substrate 10, the cutout region 30 is formed in a part of the periphery of the display layer 50, as in the first to third embodiments, and The moisture-proof sheets 35 and 36 are bonded to the upper and lower surfaces of the large-sized substrate 10 on which the display layer 50 is formed, and the moisture-proof sheets 35 and 36 on the upper and lower surfaces are adhesively bonded to each other at the cutout region 30. The moisture-proof sheets 35 and 36 are completely enclosed. By adopting such a structure, the electroluminescence type display layer 50 can have excellent moisture resistance and can be manufactured at a low cost.

DESCRIPTION OF SYMBOLS 10 Large substrate 10a Display layer formation area part 10b Cutout area formation part 11 Base film 12 Pixel electrode 13 Wiring electrode pattern 14 Electrode terminal 15 Positioning pin hole 16 Pixel electrode pattern 17 COM terminal 18 COM electrode 20, 50 Display layers 21, 51 Transparent Sheets 22 and 52 Common electrode 23 Microcapsule 24 Adhesive layer 30 Cutout region 31 Connection part 35 Upper surface moisture-proof sheet 36 Lower surface moisture-proof sheet 40 Cutting line 45 Display element 53 Light emitter layer 54 Dielectric layer

Claims (6)

A method for producing a display element, wherein a large-sized substrate on which a plurality of display layers are mounted is cut for each display layer, and a plurality of display elements configured to include a substrate in the display layer are obtained,
A cutting step of cutting a periphery of the other three sides except one side where a wiring electrode pattern connected to the display layer of the large substrate is formed to form a cut region;
Covering the front and back surfaces of the large substrate on which the display layer is mounted with a moisture-proof sheet, and a moisture-proof sheet attaching step for bonding the moisture-proof sheets on the upper and lower surfaces in the cutout region;
A method for manufacturing a display element, comprising: In the moisture-proof sheet attaching step, the moisture-proof sheets on the upper and lower surfaces are pasted together to completely enclose the display layer inside the other three sides except the one side on which the wiring electrode pattern is formed. The manufacturing method of the display element of Claim 1 . Wherein prior to the cut-out process, a method of manufacturing a display device according to claim 1 or 2 characterized by having a step of mounting the display layer on the large substrate. Wherein between the cutout step and the moisture-proof sheet attaching step, a method of manufacturing a display device according to claim 1 or 2 characterized by having a step of mounting the display layer on the large substrate. The display layer, method of manufacturing a display device according to any one of claims 1 to 4, characterized in that an electrophoretic display layer. The said display layer is an electroluminescence type display layer, The manufacturing method of the display element as described in any one of Claims 1-4 characterized by the above-mentioned.

Images