JP6145468B2 - Manufacturing method for flooring - Google Patents

Description

  The present invention relates to a method for manufacturing a flooring material in which the boundary between the flooring materials is not noticeable and can be easily replaced.

  In recent years, renovation has been actively performed in the construction industry. In the flooring, the flooring of the entire floor surface is replaced and the flooring of the dirty part is replaced. For this reason, there is a demand for a flooring material that can be easily replaced and is so-called excellent in peel-up property.

  Conventionally, decorative materials such as floor materials that can be constructed without conspicuous steps between the floor materials have been proposed (see, for example, Patent Documents 1 and 2).

  The flooring described in Patent Document 1 is provided with a waterproof layer made of a thermoplastic resin decorative sheet or the like on the upper surface of a wooden substrate.

  The floor material is chamfered at the ridge between the upper surface and the side surface of the outer periphery of the floor material in order to make the step between the floor material in the joint of the floor material inconspicuous and to improve the design of the floor surface. Is given.

  However, since the floor material uses a wood base material, it has a high degree of rigidity, and it is difficult to remove the floor material during re-stretching.

  Further, the flooring is mainly applied to the lower ground such as mortar and concrete. Even though these subsurfaces appear flat, there are uneven surfaces (unevenness) on the surface. As a condition of the ground at the construction site, the Japan Architectural Finishing Material Manufacturers Association, when measuring unevenness of any 1m length on the ground surface, the unevenness of the unevenness is within 2mm, and local That there is no typical unevenness. In an actual construction site, after the contractor repairs the ground surface, the flooring is constructed on the ground surface, but the above regulations are rarely observed. In general, there is unevenness of about 0.5 mm. A flooring will be constructed on such a base surface.

  Since the floor material has high rigidity, it cannot absorb unevenness (unevenness) on the ground surface. For this reason, even if the flooring is constructed after the height difference of the unevenness has been repaired to about 0.5 mm, if unevenness exists, the level difference between the flooring becomes large and the side surface of the flooring is exposed. To do. At this time, the floor material is not sufficiently thick in the thermoplastic resin decorative sheet covering the surface, and the level difference between the floor materials is large, so that the wooden base material is visually recognized on the exposed side surface of the floor material. . Since the color of the wood base material is different from the color of the decorative sheet made of thermoplastic resin that forms the design of the floor material surface, there is a problem that the boundary between the floor materials is conspicuous.

  In addition, the floor decorative material described in Patent Document 2 has a decorative sheet laminated on a wooden board via an adhesive layer, and has a chamfered portion on the decorative sheet side, and the chamfered portion is painted with a colored paint. The adhesive layer contains a colorant.

  The floor material has a chamfered portion painted with a colored paint, and the lower adhesive layer contains a colorant. This conceals the ground color of the wooden board, which is the base, and makes the step between the floors inconspicuous.

However, since the above-mentioned flooring material also uses a wooden board, it cannot be rolled up and the flooring material is difficult to peel off. In addition, when constructed on uneven floors, there is a problem that the level difference between the flooring materials becomes large, and the lower wooden boards are exposed more than the chamfered portion, and the boundary between the flooring materials is noticeable. It was.
Further, the floor material has to be chamfered with a colored paint, which complicates the manufacturing process.

JP 2003-200405 A JP 2009-228335 A

  This invention is made | formed in view of said situation, and makes it a subject to provide the manufacturing method of the flooring which the boundary between floorings is not conspicuous even if it lays, and can be replaced easily.

In the present invention, a back surface layer formed of a thermoplastic resin, a design layer including a pattern film, a transparent layer, and a surface protective layer are laminated in this order, and the thickness of the design layer is 0.5 to 1.5 mm. chamfered portion is formed on the surface angle of the timber, stiffness at 20 ° C. which is measured according to JIS K7106 is a method for producing a flooring material which is ^{500kgf / cm 2 ~1400kgf / cm 2} , the back surface Step (1) of obtaining a laminate for forming a flooring material by laminating a resin composition for forming a design layer, a pattern film, and a resin composition for forming a transparent layer in this order on the layer forming thermoplastic resin paste layer. And after heating and curing the laminate for forming a flooring material, applying a UV curable resin only to the surface of the cured laminate for flooring material, and irradiating with ultraviolet rays, a surface protective layer is formed. Forming (2) and The step (3) of performing chamfering simultaneously with the punching by pressing a pressing blade having a cutting blade and a tapered surface on the surface corner of the laminate for forming a flooring material on which the surface protective layer is formed, Have

According to this manufacturing method, the back layer formed of the thermoplastic resin, the design layer including the pattern film, and the transparent layer are laminated in this order, and the thickness of the design layer is 0.5 to 1.5 mm, chamfered portion is formed on the surface angle of the rigidity of at 20 ° C. which is measured according to JIS K7106 is a flooring is ^{500kgf / cm 2 ~1400kgf / cm 2} , to and easily manufactured at low cost be able to.
Since such flooring has chamfered portions at the corners of the surface, the construction worker can detach the flooring by hooking a fingertip, a cutter, a perforation or the like between the flooring materials during the re-covering operation. Can be repositioned easily.
In addition, the floor material has a transparent layer, a design layer including a pattern film, and a back layer formed of a thermoplastic resin, and the rigidity at 20 ° C. measured according to JIS K7106 is 500 kgf / cm ^{2 to} 1400 kgf. Since it is / cm ² , it can be peeled up and peeled off, and the flooring can be easily replaced. Furthermore, since it is excellent in unevenness followability, the level difference between floor materials can be made as small as possible in the construction state, and the back surface layer can be suppressed from being visually recognized at the level difference portion between floor materials. The boundary of becomes inconspicuous.
Furthermore, since the floor material has a design layer thickness of 0.5 to 1.5 mm, the back surface layer is not visually recognized in the stepped portion between the floor materials even if the design layer is constructed on a ground surface having unevenness. The boundary between the materials becomes inconspicuous.

  Moreover, the preferable manufacturing method of this invention forms the chamfering shape part coat | covered with the pattern film in the surface corner | angular part of a flooring by the said process (3).

  According to the manufacturing method of the present invention, a floor material that can be easily replaced can be easily manufactured without observing the boundary between the floor materials even when laid.

It is a longitudinal cross-sectional view of the flooring which concerns on this invention. It is an expansion schematic diagram at the time of laying the flooring which concerns on this invention. It is an expansion schematic diagram which shows the comparative example of this invention. It is a longitudinal cross-sectional view which shows the other example of the flooring which concerns on this invention. It is a longitudinal cross-sectional view which shows the other example of the flooring which concerns on this invention. It is a longitudinal cross-sectional view which shows the other example of the flooring which concerns on this invention. It is a longitudinal cross-sectional view which shows the other example of the flooring which concerns on this invention. It is a longitudinal cross-sectional view which shows the other example of the flooring which concerns on this invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In each figure, it should be noted that the length, thickness, and size of each member or each part are different from actual ones.

  As shown in FIG. 1, in this embodiment, the flooring 1 of the present invention has a layer structure in which a back layer 5, a design layer 4, a transparent layer 3, and a surface protective layer 2 are laminated in order from the bottom.

The flooring 1 of the present invention has chamfered portions 6 at the corners of the surface portion 1a.
By providing the chamfered shape portion 6 at the corner portion of the surface portion 1a, when the operator peels off the flooring 1, the chamfered shape portion 6 and the side surface 1b of the flooring 1 are hooked with a fingertip, a cutter, a perforation, or the like. It becomes easy to hook the jig, and the peel-up property can be improved.
Moreover, the flooring 1 of this invention has the chamfered shape part 6 formed in the corner | angular part of the surface part 1a. For this reason, a right-angle corner | angular part does not exist in the boundary between floor materials, and the boundary between floor materials can be made not conspicuous. By this, the level | step difference between flooring materials can be concealed.
That is, since the joint formed between the flooring materials is widely formed in the upper part by the formation of the chamfered shape portion 6, even when a step is generated between the flooring materials, the step is not conspicuous.
Furthermore, when there is a step between the flooring materials, if the corners of the surface portion 1a are at right angles, the toes such as bare feet and shoes are caught on the stepping portion during walking, and the feeling of walking may be impaired. Although the surface layer 4 may be damaged, the formation of the chamfered shape portion 6 can suppress catching of toes such as bare feet and shoes during walking.
The chamfered shape portion 6 of the present embodiment is a flat surface and is shown in a straight line in FIG.
The chamfered shape portion 6 is provided so that the depth is T. Here, as shown in FIG. 1, the depth T is a distance between an extension line 6c of the line indicating the floor material surface and a straight uppermost part 6e indicating the side surface of the floor material in the longitudinal sectional view of the floor material 1. is there.

  The depth T is determined by cutting the flooring 1 in the longitudinal direction to form a longitudinal section, placing a linear ruler on the surface of the flooring 1, and placing the ruler on the top of the line representing the side of the flooring. Can be obtained by measuring the distance to the other ruler.

It is preferable that the depth T of the chamfered shape portion is 0.1 to 0.6 mm. Moreover, it is more preferable that it is 0.2-0.4 mm.
If the depth T is too shallow, it may be difficult for the installer to hook a finger jig, a cutter, a perforation or other hooking jig, and the peel-up improvement effect may be impaired. May be damaged.
On the other hand, if the depth T is too deep, it becomes difficult to clean the joints and the dust may not easily accumulate, and the shape stabilizing layer 51 and the back surface layer forming thermoplastic resin layer 52 laminated on the lower layer are exposed. When the flooring is laid, the boundary of the flooring is conspicuous, which may impair the beauty.

Further, the depth T of the chamfered portion is preferably shallower than the total thickness of the transparent layer and the design layer.
If the thickness is deeper than the total thickness, the shape stabilizing layer 51 and the back surface layer-forming thermoplastic resin layer 52 laminated on the lower layer are exposed, and there is a possibility that the boundary portion of the floor material is noticeable when the floor material is laid.

  As shown in FIG. 1, the chamfered shape portion 6 forms a predetermined angle α in a longitudinal sectional view of the flooring 1 with a side 6 c extending the side representing the flooring surface and a side 6 d representing the surface of the chamfered shape portion. It is formed as follows.

  The angle α is obtained by cutting the flooring 1 in the longitudinal direction to form a longitudinal section, placing a linear ruler on the surface of the flooring 1, and determining the angle formed by the ruler and the chamfered portion surface. It can be measured by measuring with a protractor.

  The angle α of the chamfered portion is preferably 30 to 60 degrees. Moreover, it is more preferable that it is 40-50 degree | times.

If the angle α is too small, when the flooring 1 is laid, the joint formed by the chamfered shape portion 6 becomes too wide, and the floor surface may be uneven, which may impair the feeling of walking. In addition, the toes may be caught during walking and the surface layer of the flooring may be damaged.
On the other hand, if the angle α is too small, the joint becomes shallow and it becomes difficult for the installer to hook a hooking jig such as a fingertip, a cutter or a perforation, which may impair the peel-up improvement effect.

On the other hand, if the angle α is too large, the width of the joint becomes narrow, so that the cleaning property is impaired, and it becomes difficult for the builder to hook a hooking jig such as a fingertip, a cutter, or a perforation, and the peel-up property may be impaired.
If the angle α is too large, the joint becomes deep, the shape stabilizing layer 51 and the back surface layer forming thermoplastic resin layer 52 laminated on the lower layer are exposed, and when the flooring is laid, the boundary of the flooring The part is conspicuous and there is a risk of losing aesthetics.

  The thickness of the flooring 1 is preferably 1.60 to 2.50 mm. Moreover, it is more preferable that it is 1.80-2.20 mm, and it is further more preferable that it is 1.85-2.15 mm.

  If the flooring 1 is too thick, it is difficult for the installer to warp the flooring 1 upward, and thus it is difficult to peel off the flooring 1 laid on the ground surface. Moreover, since the flooring 1 becomes heavy, it becomes difficult to carry when carrying a plurality of pieces packed and carried. Furthermore, as the thickness of the resin layer increases, dimensional changes are likely to occur over time.

  On the other hand, if the floor material 1 is too thin, sufficient strength as a floor material cannot be obtained, and if the ground surface has irregularities or joints, the shape of the ground surface appears on the surface of the floor material 1 and is beautiful. May be damaged.

  In addition, in this specification, the thickness of the flooring 1 and each layer can be measured with the microscope measuring machine by Keyence Corporation.

Flooring 1 of the present invention, stiffness at 20 ° C. which is measured according to JIS K7106 ^is at ^{500kgf / cm 2 ~1400kgf / cm 2} . Is preferably ^{620kgf / cm 2 ~1380kgf / cm 2} , and more preferably ^{640kgf / cm 2 ~1360kgf / cm 2} . The rigidity is the rigidity in at least one of the vertical direction (longitudinal direction) and the horizontal direction (short direction) of the flooring.
If the degree of rigidity is too high, it becomes difficult to bend upward and peel off, and it takes time to replace the flooring and lowers the workability.
In addition, when the flooring 1 is laid on a flexible floor such as a soft resin flooring, a rubber flooring, or a cushion floor, if the rigidity is too high, the ground surface caused by walking, caster movement, etc. The flooring 1 cannot follow the deformation, and there is a risk of causing cracks or peeling of the adhesive surface.
On the other hand, if the rigidity is too low, when the flooring 1 is laid on a relatively hard ground surface having uneven surfaces such as joints, embossed patterns, cracks, etc., such as flooring, ceramic tiles, and resin tiles, There is a risk that the appearance of uneven surfaces such as joints will appear on the surface of the flooring 1 and impair the beauty.

The flooring 1 of the present invention preferably has a rigidity at 5 ° C. of 1200 kgf / cm ^{2 to} 2800 kgf / cm ² . More preferably ^{1220kgf / cm 2 ~2780kgf / cm 2} , more preferably from ^{1240kgf / cm 2 ~2760kgf / cm 2} . The rigidity at 5 ° C. is the rigidity in at least one of the longitudinal direction (longitudinal direction) and the lateral direction (short direction) of the flooring measured at 5 ° C. in accordance with JIS K7106. The flooring 1 having a rigidity of 5 ° C. can be peeled upward even when re-stretching under low-temperature conditions (for example, in a cold region or in winter), and can be easily re-stretched under low-temperature conditions. Become.
In the present specification, the rigidity is a value measured in the longitudinal direction (longitudinal direction) and the lateral direction (short direction) of the flooring according to JIS K7106. Specifically, the measurement was performed by the following measurement method.
(Rigidity at 20 ° C)
Under conditions of 20 ± 2 ° C. and humidity 65 ± 10%, an Olsen-type stiffness tester (hereinafter referred to as a tester), a 150 mm straight ruler (JIS C type 1 grade, hereinafter referred to as a straighter), a micrometer The test pieces cut into a size of 25 mm × 100 mm were cured for 24 hours.
Next, the tester was adjusted for horizontal, fulcrum distance, and zero point, and the thickness of the test piece was measured to 1/100 mm with a micrometer. Further, the test piece was set in a testing machine, and the load scale when the deviation angle pointer reached a predetermined deviation angle was read.
The stiffness E (kgf / cm ² ) was determined by the following equation.
E = (4 × S × M × (reading value) × C) / (b × h ³ × 100 × φ)
S: Distance between supporting points (cm) = 4 cm
b: Sample width (cm) = 2.5 cm
h: sample thickness (cm) = measured value M: load (lb) = 2 lbs
φ: Load scale reading angle (rad) = 0.1047 rad
C: Constant = 2.304
The constant C is a numerical value for converting the unit to correct the moment value.
The measurement was performed at n = 5, and E was calculated by rounding the average value of five samples according to JIS Z 8401 one digit below the measured value.
(Rigidity at 5 ° C)
Except for curing for 24 hours under conditions of 5 ± 2 ° C. and humidity 50 ± 10%, the rigidity is the same as the 20 ° C. above.

[Transparent layer]
The transparent layer 3 is a layer that is laminated on the surface side of the flooring 1 and protects the surface while making the design expressed by the design layer 4 visible.
By providing the transparent layer 3, the flooring 1 can be provided with durability including scratch resistance and abrasion resistance that can sufficiently withstand use in a house or office without impairing the beauty.

The transparent layer 3 is formed of a thermoplastic resin.
Examples of the thermoplastic resin include vinyl chloride resins, olefin resins, ethylene-vinyl acetate copolymers, acrylic resins such as ethylene-methacrylate resins, amide resins, ester resins, vinyl acetate, olefin elastomers, and styrene resins. Various elastomers such as an elastomer, rubber and the like can be mentioned.
Of these, vinyl chloride resin is preferable. Since vinyl chloride resin exhibits excellent flexibility and flexibility, it has a good feeling of walking and also has low rigidity, so it has high peel-up properties and can be easily peeled off from the base surface. it can. In addition, when a vinyl chloride resin is used, the material cost is relatively low and the manufacturing is easy, so that it can be manufactured at a low cost.

  The thickness of the transparent layer 3 is preferably 0.05 to 0.30 mm, and more preferably 0.10 to 0.20 mm.

If the transparent layer 3 is too thin, the surface of the flooring 1 may not be sufficiently protected.
On the other hand, if the transparent layer 3 is too thick, the rigidity of the flooring 1 is increased, and there is a possibility that the flooring 1 cannot be easily peeled off from the ground surface when the flooring 1 is replaced.
Moreover, when the said transparent layer 3 is too thick, there exists a possibility that a design layer may become difficult to visually recognize.

[Design layer]
The design layer 4 is a layer that expresses a desired design and imparts design properties to the surface of the flooring 1.
By providing the design layer 4, desired design properties can be easily and inexpensively imparted to the flooring 1.

The design layer 4 is formed of a thermoplastic resin. Examples of the thermoplastic resin include vinyl chloride resins, olefin resins, ethylene-vinyl acetate copolymers, acrylic resins such as ethylene-methacrylate resins, amide resins, ester resins, vinyl acetate, olefin elastomers, and styrene resins. Various elastomers such as an elastomer, rubber and the like can be mentioned.
Especially, it is preferable to form with a vinyl chloride resin. In order to show excellent flexibility, even when the flooring 1 is applied to a relatively uneven surface, it is possible to keep the design following the unevenness, and even if the flooring 1 is warped during construction, the design layer Will not be destroyed. In addition, since various designs can be easily formed by mixing colorants and printing, the design layer 4 can be formed inexpensively and easily.

In addition to the thermoplastic resin, various additives are usually blended in the design layer forming resin composition for forming the design layer 4.
As the additive, conventionally known additives can be used, and examples thereof include a filler, a plasticizer, a flame retardant, a stabilizer, an antioxidant, a lubricant, a colorant, and a foaming agent.

The design layer 4 may be formed by printing a pattern directly on the upper surface of the design layer forming thermoplastic resin layer 42, or a patterned film printed on the upper surface of the design layer forming thermoplastic resin layer 42. 41 may be formed by sticking.
Moreover, you may form with the resin composition for design layer formation containing a colorant, and by adding the resin chip of another color to the resin composition for design layer formation containing a colorant, and kneading. It may be formed.
In FIG. 1, the form which affixed the printed pattern film 41 to the upper surface of the design layer formation thermoplastic resin layer 42 was shown.

The design layer 4 is preferably one in which a printed pattern film 41 is pasted on the upper surface of the design layer forming thermoplastic resin layer 42.
By setting it as the said structure, a chamfering shape part is coat | covered with a pattern film, the design of a floor surface and the design of a chamfering shape part become the same, and a chamfering shape part can be made not conspicuous.
Moreover, a complicated design such as wood grain can be easily and inexpensively applied to the floor material surface.
Furthermore, by replacing the pattern film 41, it is possible to easily vary the pattern on the surface of the flooring 1 and appearance elements such as brightness, saturation, and hue with the same production facility. By irregularly laying the flooring material 1 with the elements of the above-mentioned appearance, the unique craftsman can be expressed as a whole on the entire floor surface.

As an example of expressing a unique craftsmanship integrally with the flooring material 1 with the above-mentioned appearance elements varying, for example, a floor using various woods by changing the brightness, saturation, and hue of the wood grain pattern. A case where a texture that forms a surface is expressed as a whole on the entire floor surface.
The floor may need to be partially replaced due to food or food adhering or breaking. The flooring 1 that has been laid for a long period of time has changed in brightness and the like due to sunburn and the like, and it is difficult for the flooring 1 to be the same as the newly refurbished flooring 1.
When the flooring material 1 having a uniform appearance such as lightness is laid on the floor surface, if the flooring material 1 is partially replaced, the lightness etc. of the replaced part is not consistent with other parts, An uncomfortable feeling may occur.
However, if the flooring material 1 with the appearance elements varying from the original is irregularly laid, even if the flooring material 1 is partially replaced, there is no sense of design discomfort and the flooring is made using various kinds of wood. A texture as if the surfaces were formed integrally can be expressed integrally on the entire floor surface.

  The thickness of the design layer 4 is 0.50 to 1.50 mm. It is preferable that it is 0.60-1.00 mm, and it is more preferable that it is 0.65-0.80 mm.

  Since the said design layer 4 is the structure mentioned above, a flooring shows moderate rigidity and the boundary between floorings is not conspicuous.

That is, the flooring 1 is often laid in an apartment house such as a rental house. Underground floors of these houses are repaired before construction of the flooring, but there is generally unevenness A (unevenness) with a height difference of about 0.5 mm. When the flooring 1 of the present invention is laid on the ground surface having the non-land A, the degree of rigidity is in the above-described range. Therefore, as shown in FIG. On the other hand, the shape of the unevenness A does not appear on the surface layer too much following the unevenness A, and the level difference between the flooring materials can be reduced.
Still, when a step L is generated at the boundary portion between floor materials, a part of the side surface of the floor material may be exposed at the step L.
Even in such a case, in the flooring 1 of the present invention, since the thickness of the design layer 4 is 0.50 to 1.50 mm, the level difference L caused by the unevenness A having a height difference of about 0.5 mm or less. In FIG. 2, the back surface layer 5 is not exposed, and only the design layer 4 constituted by the pattern film 41 and the design layer forming thermoplastic resin layer 42 is exposed as shown in FIG. Since the color of the exposed design layer 4 shows substantially the same color as the floor material surface, the boundary portion between the floor materials does not stand out.

  On the other hand, as shown in the comparative example of FIG. 3, when the rigidity of the flooring material is high and the thickness of the design layer 4 is too thin, the side surface of the back layer under the design layer is exposed at the level difference L, and the shape stabilization layer 51 is exposed. And the back surface layer forming thermoplastic resin layer 52 are visually recognized. In particular, the color of the back surface layer forming thermoplastic resin layer 52 is white, gray, or the like, which is different from the color of the floor material surface, so that the boundary portion between the floor materials becomes very conspicuous.

  Moreover, since the thickness of the design layer is in the above-described range, the flooring 1 of the present invention exhibits an appropriate rigidity, so that it can be peeled upwardly during re-stretching, and the re-floor is easily re-stretched. be able to.

When the design layer 4 is obtained by pasting a printed pattern film 41 on the upper surface of the design layer forming thermoplastic resin layer 42, the thickness of the pattern film 41 is 0.07 to 0.20 mm. It is preferable that it is 0.10 to 0.16 mm.
If the thickness of the pattern film 41 is too thin, the surface of the design layer forming thermoplastic resin layer 42 that is transmitted through light and laminated on the lower surface is seen through, and the design property of the pattern film 41 may not be sufficiently expressed. is there.
Moreover, when the thickness of the said pattern film 41 is too thin, when laying the flooring 1, there exists a possibility that the boundary part of the flooring 1 may be conspicuous.
When the thickness of the pattern film 41 is too thick, the rigidity of the flooring 1 is increased, and there is a possibility that the flooring 1 cannot be easily peeled off from the base surface when the flooring 1 is replaced.

(Surface protective layer)
The surface protective layer 2 is a layer that is located on the uppermost surface of the flooring 1 and further improves the durability of the upper surface of the flooring.

The surface protective layer 2 is not particularly limited as long as it can stably adhere to other layers. Polyvinyl chloride resin, low density polyethylene resin, high density polyethylene resin, polyester resin, ethylene vinyl acetate copolymer Various thermoplastic resins such as can be used. In addition, for example, unsaturated polyesters such as a condensation product of unsaturated dicarboxylic acid and polyhydric alcohol, polyester methacrylates, polyether methacrylates, polyol methacrylates, methacrylates such as melamine methacrylates, polyester acrylates, epoxy acrylates, urethane acrylates, polyethers You may use ultraviolet curable resin, such as acrylates, such as an acrylate, a polyol acrylate, and a melamine acrylate.
Especially, it is preferable to use an ultraviolet curable resin at the point which can adhere | attach with another layer more stably and can form a strong film.

  The thickness of the surface protective layer 2 is preferably 0.005 to 0.040 mm. Moreover, it is more preferable that it is 0.010-0.030 mm, and it is further more preferable that it is 0.015-0.025 mm.

If the surface protective layer 2 is too thin, the surface of the flooring 1 may not be sufficiently protected.
On the other hand, if it is too thick, the rigidity of the flooring 1 becomes high, and the flooring 1 may not be easily peeled off from the ground surface.
Moreover, when too thick, there exists a possibility that the design property which the design layer 4 expresses may be reduced.

[Back layer]
The back surface layer 5 is a layer formed on the lower surface side of the flooring 1 and is a layer in contact with the base surface.
In the present embodiment, the back surface layer 5 includes a shape stabilizing layer 51, a back surface layer forming thermoplastic resin layer 52, and a base material layer 53.

The back surface layer forming thermoplastic resin layer 52 is formed of a back surface layer forming thermoplastic resin composition (hereinafter also referred to as a back surface layer forming thermoplastic resin paste) containing a thermoplastic resin.
Examples of the thermoplastic resin include vinyl chloride resins, olefin resins, ethylene-vinyl acetate copolymers, acrylic resins such as ethylene-methacrylate resins, amide resins, ester resins, vinyl acetate, olefin elastomers, and styrene resins. Various elastomers such as an elastomer, rubber and the like can be mentioned.
Of these, vinyl chloride resin is preferable. The flooring 1 having a back layer mainly composed of a vinyl chloride resin has excellent flexibility because of its excellent flexibility, and it can be easily peeled off from the ground surface because of its low rigidity. Moreover, if a vinyl chloride resin is used, the flooring 1 can be manufactured cheaply and easily.

  The back surface layer forming thermoplastic resin layer 52 may be non-foamed or foamed. The back layer is preferably formed of a foamed resin from the viewpoint that a good cushioning property can be imparted to the flooring 1.

In addition to the thermoplastic resin, various additives are usually blended in the thermoplastic resin composition for forming the back layer.
A conventionally well-known thing can be used as said additive, For example, a filler, a plasticizer, a flame retardant, a stabilizer, antioxidant, a lubricant, a coloring agent, a foaming agent etc. are mentioned.

  Although content of the said filler is not specifically limited, It is preferable that it is 30-250 mass parts with respect to 100 mass parts of thermoplastic resin compositions for back surface layer formation. The amount is more preferably 50 to 200 parts by mass, and further preferably 75 to 150 parts by mass.

When there is too much content of the said filler, there exists a possibility that the weight of the flooring 1 may become heavy and a conveyance operation | work may become difficult.
Moreover, since the back surface layer forming thermoplastic resin layer 52 becomes hard and the flooring 1 becomes difficult to warp to the upper surface side, there is a possibility that the operation of peeling the flooring 1 becomes difficult.

  If the content is too small, the amount of thermoplastic resin and other additives is relatively increased, which may be disadvantageous in cost.

  The thickness of the back surface layer forming thermoplastic resin layer 52 is preferably 0.35 to 0.75 mm. Moreover, it is more preferable that it is 0.45-0.65 mm, and it is further more preferable that it is 0.50-0.60 mm.

If the back surface layer forming thermoplastic resin layer 52 is too thin, the thickness may be thinner than the base material layer 53, and the base material layer 53 is not sufficiently impregnated in the back surface layer forming thermoplastic resin layer 52, and the floor material When peeling 1, the surface of the base material layer 53 may be damaged.
Moreover, when the said back surface layer formation thermoplastic resin layer 52 is too thick, the rigidity of the flooring 1 will become high, and it will become difficult to warp and peel off the flooring 1 at the time of a reworking work, and time for a reworking work will be long. Workability may be reduced.

(Shape stabilization layer)
The shape stabilizing layer 51 is a layer for suppressing a dimensional change of the flooring 1 due to shrinkage or expansion over time.
The flooring 1 of the present invention preferably includes a shape stabilizing layer 51 on the upper surface of the back surface layer forming thermoplastic resin layer 52.
When the shape stabilizing layer 51 is provided, the dimensional stability of the flooring 1 can be increased and the warpage of the end portion can be suppressed.

As the shape stabilizing layer 51, a polyester nonwoven fabric, a polyester woven fabric, a glass nonwoven fabric, a glass woven fabric, a PET nonwoven fabric, a PET woven fabric, or the like is used.
Among these, a glass fiber nonwoven fabric is preferable. If a glass fiber nonwoven fabric is used, the dimensional change of the flooring 1 and the curvature of the end of the flooring can be more effectively suppressed.

  The thickness of the shape stabilizing layer 51 is preferably 0.10 to 0.50 mm. Moreover, it is more preferable that it is 0.20-0.40 mm, and it is further more preferable that it is 0.25-0.35 mm.

If the shape stabilizing layer 51 is too thin, the dimensional change of the flooring 1 and the warping of the end of the flooring may not be effectively suppressed.
On the other hand, if the shape stabilizing layer 51 is too thick, the interlayer adhesion strength with other layers laminated on the top and bottom of the shape stabilizing layer 51 is weakened, and there is a risk of delamination.

(Base material layer)
The base material layer 53 is a layer located at the bottom of the flooring 1. The flooring 1 of the present invention is preferably provided with a base material layer in terms of suppressing warpage of the flooring and improving the strength.
As the base material layer 53, a polyester nonwoven fabric, a polyester woven fabric, a glass nonwoven fabric, a glass woven fabric, a polyethylene terephthalate (hereinafter referred to as PET) nonwoven fabric, or a PET woven fabric is used.
Especially, the base material layer 53 polyester nonwoven fabric can be used conveniently. The polyester nonwoven fabric contributes to improving the strength of the entire flooring material, and warps the end of the flooring material 1 to the lower surface side by shrinkage, thereby forming the back surface layer-forming thermoplastic resin layer 52, the design layer 4, and the upper layer. And the curvature to the upper surface side of the flooring 1 by shrinkage | contraction of the transparent layer 3 can be suppressed.

The base material layer 53 is desirably provided in a state in which the lower surface side of the back surface layer forming thermoplastic resin layer 52 is impregnated and the lower surface side of the back surface layer forming thermoplastic resin layer 52 is exposed.
By comprising in this way, the base material layer 53 suppresses the transition of the plasticizer contained in the back surface layer forming thermoplastic resin layer 52 to the adhesive layer.
That is, since it suppresses that a plasticizer transfers to an adhesive bond layer and inhibits hardening of an adhesive agent, an adhesive agent can exhibit original adhesive strength.

Moreover, since the base material layer 53 is impregnated on the lower surface side of the back surface layer forming thermoplastic resin layer 52 and integrated, the base material layer 53 is firmly held by the back surface layer forming thermoplastic resin layer 52. For this reason, even if the flooring 1 is peeled off from the base surface, the base material layer 53 is not destroyed and is peeled off integrally with the back surface layer forming thermoplastic resin layer 52. It is easy to separate from the ground, and a part of the base material layer 53 does not remain on the base surface.
For this reason, when the flooring 1 is replaced, it is not necessary to remove the base material layer 53 remaining on the base surface, and the flooring 1 can be easily replaced in a short time.

Further, in the above configuration, it is desirable that a part of the fibers of the base material layer 53 is exposed on the lower surface side of the back surface layer forming thermoplastic resin layer 52.
By comprising in this way, the bottom face of the flooring 1 becomes uneven | corrugated shape, and the contact area of the bottom face of the flooring 1 and a base surface reduces. For this reason, the adhesive strength at the time of laying on a base surface can be adjusted to an appropriate range, and the flooring 1 can be easily peeled off from the base surface.

  Further, since the bottom surface is uneven, a high frictional force is exhibited between the flooring 1 and the base surface. For this reason, it can suppress that the flooring 1 slip | deviates by walking before an adhesive solidifies.

  The thickness of the base material layer 53 is preferably 0.10 to 0.70 mm. Moreover, it is more preferable that it is 0.20-0.60 mm, and it is further more preferable that it is 0.25-0.45 mm.

If the base material layer 53 is too thin, the plasticizer contained in the back surface layer forming thermoplastic resin layer 52 permeates the base material layer 53 and inhibits the curing of the adhesive on the base surface. There is a possibility that all the fibers are buried in the back surface layer forming thermoplastic resin layer 52 and the adhesive strength with the base surface becomes too high.
Furthermore, when the base material layer 53 is too thin, the strength of the base material layer 53 is weakened, and the base material layer 53 is peeled off when the flooring 1 is peeled even though the back surface layer forming thermoplastic resin layer 52 is impregnated. There is a risk that 53 may be damaged or a frictional force may not be exerted between the base material and the flooring 1 may be displaced.

  On the other hand, if the base material layer 53 is too thick, the thickness of the back surface layer forming thermoplastic resin layer 52 may be exceeded, and the back surface layer forming thermoplastic resin layer 52 is not sufficiently impregnated, and the flooring 1 is applied to the base surface. When it is peeled off, the surface of the base material layer 53 may be damaged and a part of the base material layer 53 may remain on the base surface.

  Hereinafter, the manufacturing method of the flooring 1 is demonstrated. Floor material 1 is a process of obtaining a laminate for forming a floor material by laminating a resin composition for forming a design layer and a resin composition for forming a transparent layer in this order on a thermoplastic resin paste layer for forming a back surface layer. (1), a process (2) for heating and curing the flooring-forming laminate, and a manufacturing method (3) for chamfering the cured flooring-forming laminate. be able to.

[Step (1)]
The step (1) is a step of obtaining a laminate for forming a flooring material by laminating a resin composition for forming a design layer and a resin composition for forming a transparent layer on a thermoplastic resin paste layer for forming a back surface layer. It is.

  The thermoplastic resin paste layer for forming the back layer can be formed by applying the thermoplastic resin paste for forming the back layer on the shape stabilizing layer 51.

Moreover, when the flooring 1 is provided with the base material layer 53, the back surface layer forming thermoplastic resin paste layer is formed, and the back surface layer forming thermoplastic resin paste is placed on the base material layer 53 for a certain period of time by its own weight. By impregnating the surface of the layer, a thermoplastic resin paste layer for forming the back surface layer provided with the base material layer 53 can be obtained.
The viscosity of the back surface layer forming thermoplastic resin paste on which the base material layer 53 is laminated is preferably 8 to 10 Pa · s. Such a thermoplastic resin paste for forming the back layer is easily impregnated between the fibers of the base material layer 53.
In addition, the said viscosity is the value measured on 20 degreeC conditions using the viscometer by Rion Co., Ltd. (brand name "Bisco tester").

If the impregnation is not sufficient by the weight of the base material layer 53 due to the weight of the base material layer 53 and the viscosity of the thermoplastic resin paste for forming the back surface layer, the non-mounting surface (back surface) of the base material layer 53 The load is applied from the surface opposite to the surface placed on the layer-forming thermoplastic resin paste layer.
For example, by pressing with a roll from the non-mounting surface of the base material layer 53, a load may be applied so that the thermoplastic resin paste for forming the back surface layer oozes out on the non-mounting surface of the base material layer 53. it can.

  The step (1) preferably includes a step of pregelling the thermoplastic resin paste layer for forming the backside layer by heating to obtain a pregelled backside layer.

  Although the method of the said heating is not specifically limited, For example, the heating with an electric heater is mentioned.

The heating temperature is appropriately set according to the resin forming the back layer 52. In the case of a vinyl chloride resin, the heating temperature is preferably 110 to 170 ° C, and more preferably 120 to 160 ° C.
If the heating temperature is too low, pregelation is not sufficiently performed, and the pregelled back surface layer may be damaged.
If the heating temperature is too high, the surface of the thermoplastic resin paste layer for forming the back surface layer may be completely cured, and the design layer may not be integrally laminated and bonded.

The heating time is appropriately set according to the resin forming the back layer 52. In the case of a vinyl chloride resin, it is preferably 40 to 90 seconds, and more preferably 50 to 70 seconds.
If the heating time is too short, pregelation is not sufficiently performed, and the back layer after pregelation may be damaged.
If the heating time is too long, the surface of the thermoplastic resin paste layer for forming the back surface layer may be completely cured, and the design layer may not be integrally laminated.

  The laminate for forming a flooring material is obtained by sequentially applying a resin composition for forming a design layer, a resin composition for forming a transparent layer, and a resin composition for forming a surface protective layer on the thermoplastic resin paste for forming the back surface layer. It can be obtained by laminating.

In the step (1), when a pregelled back layer is formed by applying a thermoplastic resin paste for forming a back layer on the shape stabilizing layer 51 and pregelling, It is preferable to have the process of reversing front and back.
By having the above steps, the resin composition for forming a design layer, the resin composition for forming a transparent layer, and the resin composition for forming a surface protective layer can be sequentially applied and laminated on the inverted pregelled back layer, A laminate for forming a flooring can be easily produced.

[Step (2)]
The said process (2) is a process of obtaining the laminated body for chamfering by heating and hardening the said laminated body for flooring formation.

  The heating method is not particularly limited, and examples thereof include a gas heater.

Although heating temperature is suitably set according to resin which forms each layer of the laminated body for flooring formation, when it is a vinyl chloride resin, it is preferable that it is 180-250 degreeC, and it is 190-220 degreeC. More preferred.
If the heating temperature is too low, the resin will not be sufficiently cured, and the interlayer adhesion of each layer will be weakened, which may cause delamination.
If the heating temperature is too high, the resin is excessively cured, and the rigidity of the flooring 1 may be increased. Further, the heating time is appropriately set according to the resin forming each layer of the laminate for forming a flooring material, but in the case of vinyl chloride resin, it is preferably 1 minute 30 seconds to 4 minutes 30 seconds. More preferably, it is from 4 minutes to 4 minutes.
If the heating time is too short, the resin will not be sufficiently cured, and the interlayer adhesion of each layer will be weakened, which may cause delamination.
On the other hand, if the heating time is too long, the resin is hardened too much and the rigidity of the flooring 1 becomes too high, which may impair the ease of changing the flooring 1.

  When the surface protective layer 2 is formed of an ultraviolet curable resin, it may further include a step of irradiating ultraviolet rays.

  Moreover, when the said surface protective layer 2 is formed with an ultraviolet curable resin, after forming layers other than a surface protective layer by the said process (1) and a process (2), the resin composition for surface protective layer formation is formed on the surface. You may have the process of apply | coating and irradiating an ultraviolet-ray.

[Step (3)]
The said process (3) is a process of obtaining the flooring 1 of this invention by giving a chamfering process to the said laminated body for a chamfering process.

Although the method of the said chamfering process is not specifically limited, For example, the method of pressing a rotary blade to the surface corner | angular part of the laminated body for chamfering process is mentioned.
Moreover, the method of performing a punching process and a chamfering simultaneously using the cutting device which integrally has a cutting blade and a press blade which has a taper surface may be sufficient.

The chamfering method is preferably a method in which a punching process and a chamfering process are simultaneously performed using a cutting apparatus that integrally includes a cutting blade and a pressing blade having a tapered surface.
By using the method described above, the flooring 1 can be obtained more easily by reducing the number of steps.

  The flooring 1 of the present invention can be produced by the above steps (1), (2) and (3).

  In addition, this invention is not restricted to said embodiment, A various change and deformation | transformation are possible.

  For example, in the above-described embodiment, the configuration in which the surface protective layer 2 is laminated on the transparent layer 3 is illustrated. However, the configuration is not limited thereto, and for example, the configuration without the surface protective layer 2 as illustrated in FIG. Also good.

  In the above embodiment, the base layer 53, the back surface layer forming thermoplastic resin layer 52, and the shape stabilizing layer 51 are stacked in this order as the back surface layer 5. However, the present invention is not limited to this. As shown in FIG. 5, the shape stabilizing layer 51 may not be provided.

When the shape stabilizing layer 51 is not provided, the back surface layer forming thermoplastic resin paste layer can be formed by applying the back surface layer forming thermoplastic resin paste onto the back surface layer forming film.
In this case, after the thermoplastic resin paste layer for forming the back surface layer is heated in a subsequent step to pregelate the base material layer-impregnated resin paste layer, the film for forming the back surface layer is peeled and removed.

  In the above embodiment, the base layer 53, the back surface layer forming thermoplastic resin layer 52, and the shape stabilizing layer 51 are stacked in this order as the back surface layer 5. However, the present invention is not limited to this. As shown in FIG. 6, it is good also as a structure which does not have the base material layer 53. FIG.

  In the above embodiment, the base layer 53, the back surface layer forming thermoplastic resin layer 52, and the shape stabilizing layer 51 are stacked in this order as the back surface layer 5. However, the present invention is not limited to this. 7, the shape stabilizing layer 51 and the base material layer 53 may not be provided.

  Furthermore, in the above-described embodiment, the configuration in which the chamfered portion is linear is shown, but the present invention is not limited to this, and the chamfered shape may be an R chamfered shape as shown in FIG.

  With the above-described configuration, when the flooring 1 is laid and the floor surface is formed, the joint portion formed between the flooring 1 and the other flooring 1 laid side by side is configured by a curved surface. The Thereby, when walking on the floor, a smooth walking feeling can be realized.

  Examples of the present invention and comparative examples are shown below. However, the present invention is not limited to the following examples.

[Materials Used in Examples and Comparative Examples]
(Resin paste for backside layer formation)
100 parts by mass of vinyl chloride resin paste (vinyl chloride paste having an average degree of polymerization of 2000: vinyl chloride paste having an average degree of polymerization of 950 = 2: 1 (weight ratio)), 100 parts by mass of filler (calcium carbonate), and 60 parts by mass A plasticizer (DOP), 2 parts by mass of a Ba—Zn stabilizer, and 1 part by mass of a pigment were used.
The viscosity of the resin paste for forming the back surface layer at 20 ° C. was 8 Pa · s.
This viscosity was measured using a viscometer manufactured by Rion Co., Ltd. (trade name “Bisco Tester”).

(Design layer forming resin composition)
100 parts by mass of vinyl chloride resin paste (vinyl chloride paste with an average degree of polymerization of 2000: vinyl chloride paste with an average degree of polymerization of 950 = 2: 1 (weight ratio)), 200 parts by mass of filler (calcium carbonate), and 85 parts by mass And a plasticizer (DOP) and 8 parts by mass of toner were kneaded.

(Print film)
A vinyl chloride film having a thickness of about 0.13 mm printed with a wood grain pattern was used.

(Transparent layer forming resin composition)
100 parts by mass of vinyl chloride resin paste (vinyl chloride paste having an average degree of polymerization of 2000: vinyl chloride paste having an average degree of polymerization of 950 = 4: 3 (weight ratio)), 50 parts by mass of plasticizer (DOP), 3 parts by mass of What knead | mixed the Ba-Zn type stabilizer was used.

(Resin composition for forming a surface protective layer)
A urethane resin UV curable resin was used.

(Base material layer)
A polyester-based non-woven fabric (spunbond non-woven fabric, basis weight 40 g / m ^2, thickness about 0.3 mm) was used.

(Shape stabilization layer)
A glass fiber nonwoven fabric (weight per unit area: 50 g / m ^2, thickness: about 0.3 mm) was used.

[Example 1]
A film of the back surface layer forming resin paste was formed by applying the back surface layer forming resin paste on the base material layer. A shape stabilizing layer was placed on this film. The substrate layer was pressed with a stainless steel roller (load: about 4 kg / m ² ). When it was confirmed that the resin paste had slightly exuded from the non-mounting surface of the base material layer, the pressing was stopped.
Next, the resin paste was pregelled by heating the laminate with a ceramic heater at 160 ° C. for 1 minute.

A resin composition for forming a design layer was applied on the shape stabilizing layer. Further, a printing film was placed on the film.
On this printed film, the resin composition for forming a transparent layer was applied.
Next, this laminate was heated at 200 ° C. for 3 minutes using a gas heater, thereby curing the back surface layer forming resin paste, the design layer forming resin composition, and the transparent layer forming resin composition.
Thus, in order from the bottom, the base layer, the back layer having a thickness of about 0.55 mm, the design layer (including the printed film) having a thickness of about 0.68 mm, and the transparent layer having a thickness of about 0.15 ± 0.05 mm are obtained. A laminated body was obtained.

Next, a resin composition for forming a surface protective layer was applied on the transparent layer. A surface protective layer (thickness: about 0.02 ± 0.01 mm) is formed on the transparent layer by irradiating ultraviolet rays using three 80 W ultraviolet lamps and curing the resin composition for forming the surface protective layer. And the laminated body for flooring formation was obtained.
The flooring was produced by performing chamfering simultaneously with the punching using the cutting device that integrally includes the cutting blade and the pressing blade having a tapered surface with the obtained laminate for forming the flooring. .
The obtained flooring material of Example 1 was 900 mm long, 150 mm wide, and 2.00 mm thick, and the thickness of the design layer (including the printed film) was 0.68 mm.
Each thickness was measured using a microscope measuring instrument manufactured by Keyence Corporation.

Moreover, the depth T of the chamfered shape portion of the floor material of Example 1 obtained was 0.30 mm. Further, the angle α of the chamfered portion was 45 degrees.
The depth T is determined by cutting the floor material in the longitudinal direction to form a longitudinal section, placing a linear ruler on the surface of the floor material, and the uppermost part of the straight line formed by the floor and the floor material side surface in the section. It is a value obtained by measuring the distance to the other ruler.
In addition, the angle α is formed by cutting the flooring in the longitudinal direction to form a longitudinal section, placing a linear ruler on the surface of the flooring, and the straight line formed by the surface of the chamfered portion in the section. It is a value obtained by measuring the angle to be measured with a protractor.

The rigidity of the floor material of Example 1 in the longitudinal direction (longitudinal direction) at 20 ° C. was 1056 kgf / cm ² , and the rigidity in the lateral direction (short direction) was 704 kgf / cm ² .
Moreover, the rigidity in the vertical direction at 5 ° C. of the flooring of Example 1 was 2113 kgf / cm ² , and the rigidity in the horizontal direction was 1409 kgf / cm ² .

Each said rigidity was measured about the vertical direction (longitudinal direction) and the horizontal direction (short direction) of a flooring based on JIS K7106. Specifically, the measurement was performed by the following measurement method.
(Rigidity at 20 ° C)
Under conditions of 20 ± 2 ° C. and humidity 65 ± 10%, an Olsen-type stiffness tester (hereinafter referred to as a tester), a 150 mm straight ruler (JIS C type 1 grade, hereinafter referred to as a straighter), a micrometer The test pieces cut into a size of 25 mm × 100 mm were cured for 24 hours.
Next, the tester was adjusted for horizontal, fulcrum distance, and zero point, and the thickness of the test piece was measured to 1/100 mm with a micrometer. Further, the test piece was set in a testing machine, and the load scale when the deviation angle pointer reached a predetermined deviation angle was read.
The stiffness E (kgf / cm ² ) was determined by the following equation.
E = (4 × S × M × (reading value) × C) / (b × h ³ × 100 × φ)
S: Distance between supporting points (cm) = 4 cm
b: Sample width (cm) = 2.5 cm
h: sample thickness (cm) = measured value M: load (lb) = 2 lbs
φ: Load scale reading angle (rad) = 0.1047 rad
C: Constant = 2.304
The constant C is a numerical value for converting the unit to correct the moment value.
The measurement was performed at n = 5, and E was calculated by rounding the average value of five samples according to JIS Z 8401 one digit below the measured value.
(Rigidity at 5 ° C)
Except for curing for 24 hours under conditions of 5 ± 2 ° C. and humidity 50 ± 10%, the rigidity is the same as the 20 ° C. above.

[Example 2]
A flooring was produced in the same manner as in Example 1 except that the thickness of the design layer (including the printed film) was 0.55 mm. The thickness of the flooring material obtained in Example 2 was 1.87 mm.

The floor material of Example 2 had a longitudinal rigidity of 1292 kgf / cm ² at 20 ° C. and a lateral rigidity of 862 kgf / cm ² .
The longitudinal rigidity of the flooring material of Example 2 at 5 ° C. was 2585 kgf / cm ² , and the lateral rigidity was 1724 kgf / cm ² .

[Example 3]
A flooring was produced in the same manner as in Example 1 except that the surface protective layer was not formed (except that the surface protective layer-forming resin composition was not applied). The thickness of the flooring material obtained in Example 2 was 1.98 mm, and the thickness of the design layer (including the printed film) was 0.68 mm.

The floor material of Example 3 had a longitudinal stiffness at 20 ° C. of 1089 kgf / cm ² and a lateral stiffness of 726 kgf / cm ² .
Moreover, the rigidity in the vertical direction at 5 ° C. of the flooring of Example 3 was 2177 kgf / cm ² , and the rigidity in the horizontal direction was 1452 kgf / cm ² .

[Comparative Example 1]
A flooring 1 was produced in the same manner as in Example 1 except that chamfering was not performed. The thickness of the floor material of Comparative Example 1 obtained was 2.00 mm, and the thickness of the design layer (including the printed film) was 0.68 mm.

The longitudinal stiffness of the flooring of Comparative Example 1 at 20 ° C. was 1056 kgf / cm ² , and the lateral stiffness was 704 kgf / cm ² .
Moreover, the rigidity of the vertical direction in 5 degreeC of the flooring of the comparative example 1 was 2113 kgf / cm < ² >, and the rigidity of the horizontal direction was 1408 kgf / cm < ² >.

[Comparative Example 2]
A flooring 1 was produced in the same manner as in Example 1 except that the thickness of the design layer (including the printed film) was 0.2 mm. The floor material 1 of Comparative Example 4 obtained had a thickness of 1.52 mm.

The floor material of Comparative Example 2 had a longitudinal rigidity at 20 ° C. of 134 kgf / cm ² and a lateral rigidity of 118 kgf / cm ² .
Moreover, the rigidity of the vertical direction in 5 degreeC of the flooring of the comparative example 2 was 460 kgf / cm < ² >, and the rigidity of the horizontal direction was 442 kgf / cm < ² >.

[Comparative Example 3]
A flooring 1 was produced in the same manner as in Example 1 except that the thickness of the design layer (including the printed film) was 1.80 mm. The floor material 1 obtained in Comparative Example 3 had a thickness of 3.12 mm.

The floor material of Comparative Example 3 had a longitudinal rigidity of 1631 kgf / cm ² at 20 ° C. and a lateral rigidity of 1605 kgf / cm ² .
The floor material of Comparative Example 3 had a longitudinal rigidity at 4 ° C. of 4160 kgf / cm ² and a lateral rigidity of 4292 kgf / cm ² .

[Comparative Example 4]
A flooring was produced in the same manner as in Example 1 except that the chamfering process was not performed, the thickness of the design layer (including the printed film) was 0.05 mm, and the thickness of the back layer was 1.07 mm. The floor material of Comparative Example 4 obtained had a thickness of 2.44 mm.

The floor material of Comparative Example 4 had a longitudinal rigidity at 20 ° C. of 134 kgf / cm ² and a lateral rigidity of 118 kgf / cm ² .
Moreover, the rigidity of the vertical direction in 5 degreeC of the flooring of the comparative example 4 was 460 kgf / cm < ² >, and the rigidity of the horizontal direction was 442 kgf / cm < ² >.

[Comparative Example 5]
A flooring was produced in the same manner as in Example 1 except that the chamfering process was not performed and the thickness of the design layer (including the printed film) was 1.80 mm. The floor material of Comparative Example 5 obtained had a thickness of 3.12 mm.

The floor material of Comparative Example 5 had a longitudinal rigidity at 20 ° C. of 1631 kgf / cm ² and a lateral rigidity of 1605 kgf / cm ² .
Moreover, the rigidity of the vertical direction in 5 degreeC of the flooring of the comparative example 5 was 4160 kgf / cm < ² >, and the rigidity of the horizontal direction was 4292 kgf / cm < ² >.

From here, the following evaluation was performed about the flooring 1 of said Examples 1-3 and Comparative Examples 1-5.

[Peel-up evaluation test]
Nine sheets of each of the flooring materials of Examples 1 to 3 and Comparative Examples 1 to 5 were prepared. An acrylic resin emulsion adhesive (trade name “Eco GA Cement” manufactured by Toli Co., Ltd.) is applied at an application amount of 110 g / m ² so that the nine flooring materials are vertical × horizontal = 3 × 3. Each was laid on the applied water-absorbing substrate surface. The water absorption base surface was polished with a sand blast polishing machine, so that the difference in level of unevenness was set to 0.5 mm or less. The unevenness of the unevenness was measured with a surface roughness meter. The side edge of the flooring laid at the center was picked and peeled off by hand, and whether or not it could be easily peeled was determined according to the following criteria. The results are shown in Table 1.
○: Easy peeling by hand.
(Triangle | delta): Although it can peel by hand, it is difficult.
X: It could not be peeled by hand.

[Boundary evaluation test]
Two each of the flooring materials of Examples 1 to 3 and Comparative Examples 1 to 5 were prepared. These two flooring materials are arranged in close contact with each other, and an acrylic resin emulsion adhesive (trade name “Eco GA Cement” manufactured by Toli Co., Ltd.) is applied at a coating amount of 110 g / m ^2. Each was laid on the ground. The water absorption base surface was polished with a sand blast polishing machine, so that the difference in level of unevenness was set to 0.5 mm or less. The unevenness of the unevenness was measured with a surface roughness meter. Whether or not the boundary between the two flooring materials is conspicuous was determined by visual observation according to the following criteria. The results are shown in Table 1.
○: No white line was visually recognized at the boundary.
Δ: A slight white line was confirmed at the boundary.
X: A white line was clearly confirmed at the boundary.

  From Table 1, since the flooring materials of Examples 1 to 3 have chamfered shape portions, joints are formed at the boundary portions between the flooring and other flooring materials provided side by side. Since the end of the flooring can be lifted by hooking, the work of peeling the flooring laid is easy.

  Moreover, since the flooring materials of Examples 1 to 3 show an appropriate degree of rigidity and are excellent in uneven followability, the level difference between the flooring materials is small and the thickness of the design layer is within an appropriate range. Therefore, even if the side surface of the floor material after laying is exposed due to unevenness of the ground surface, the side surface is a design layer, and the boundary between the floor materials is not visually conspicuous.

  Furthermore, since the flooring materials of Examples 1 to 3 showed an appropriate degree of rigidity and can be rolled upward, the flooring laid on the base surface could be easily peeled off.

  On the other hand, since the floor material of Comparative Examples 1 and 5 is not formed with a chamfered shape portion, the edge of the floor material is lifted by hooking a fingertip or the like on the boundary portion between the floor material and another floor material provided side by side. It was impossible to remove the floor material that had been laid.

  In particular, since the floor material of Comparative Example 5 had high rigidity, it was difficult to roll upward and difficult to peel off from the ground surface.

  Moreover, the floor material of the comparative example 3 has a chamfered shape part, and a fingertip or the like can be hooked on a boundary part between the floor material and another floor material provided side by side. However, since the rigidity of the flooring material is high, it is difficult to curl upward and difficult to peel off from the base surface.

  Moreover, since the floor material of the comparative example 4 has low rigidity, it is easy to roll up. However, since the chamfered shape portion is not provided, it is impossible to lift the end portion of the floor material by hooking a fingertip or the like on the boundary portion between the floor material and another floor material provided side by side. Therefore, although the flooring of Comparative Example 4 can be peeled by hand, the operation is difficult.

  Furthermore, the floor materials of Comparative Examples 2 and 4 have a thin design layer, so that when the side surface of the floor material after laying is exposed, a back surface layer is included on the side surface, and the boundary with other floor materials is visually Remarkable.

  The flooring of the present invention is used by being laid on a floor surface in a room such as a general house, a condominium, or an office building.

  DESCRIPTION OF SYMBOLS 1 ... Floor material, 1a ... Floor material surface part, 1b ... Floor material side part, 2 ... Surface protective layer, 3 ... Transparent layer, 4 ... Design layer, 41 ... Pattern film, 42 ... Design layer formation thermoplastic resin layer, DESCRIPTION OF SYMBOLS 5 ... Back surface layer, 51 ... Shape stabilization layer, 52 ... Back surface layer formation thermoplastic resin layer, 53 ... Base material layer, 6 ... Chamfering shape part, T ... Depth of chamfering shape part, alpha ... Angle of chamfering shape part 6c, a line obtained by extending a line representing the surface of the flooring, 6d, a side representing the surface of the chamfered shape part, 6e, an uppermost part of the straight line representing the side surface of the flooring 1, A ... non-landing of the ground surface, L ... flooring Steps between

Claims (2)

A back surface layer formed of a thermoplastic resin, a design layer including a pattern film, a transparent layer, and a surface protective layer are laminated in this order, the thickness of the design layer is 0.5 to 1.5 mm, and the surface angle of the flooring part chamfered portion is formed on, stiffness at 20 ° C. which is measured according to JIS K7106 is a method for producing a flooring material which is ^{500kgf / cm 2 ~1400kgf / cm 2} ,
Step of obtaining a laminate for forming a flooring material by laminating a resin composition for forming a design layer, a pattern film, and a resin composition for forming a transparent layer in this order on the thermoplastic resin paste layer for forming the back surface layer (1 )When,
After the laminate for forming a flooring material is heated and cured, a surface protective layer is formed by applying an ultraviolet curable resin only to the surface of the cured laminate for forming a flooring material and irradiating with ultraviolet rays. Step (2);
A step (3) of performing chamfering simultaneously with punching by pressing a pressing blade having a cutting blade and a tapered surface on a surface corner of the laminate for forming a flooring material on which the surface protective layer is formed;
A method for producing a flooring material, comprising:   The method for producing a flooring material according to claim 1, wherein a chamfered shape part covered with a pattern film is formed at a surface corner part of the flooring material by the step (3).

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