JP6133339B2 - Motor and manufacturing method thereof - Google Patents

Description

  The present invention relates to a motor and a manufacturing method thereof.

  Since an electronic device such as a hard disk drive may break down due to the entry of foreign matter, a motor used in the electronic device is required to prevent the entry of foreign matter or the like into the motor. Therefore, various techniques have been proposed for preventing foreign matter and the like from entering the motor.

  For example, Patent Document 1 discloses that an ultraviolet curable adhesive that seals a lead-out hole of a base and a through-hole of a circuit board with an ultraviolet curable adhesive and then protrudes to the upper surface side of the base is a thermosetting adhesive. A technique for increasing the sealing degree of the through hole to prevent entry of a foreign substance or the like is disclosed.

JP 2006-187145 A

  In a motor, it is necessary not only to prevent the entry of foreign matter from the outside, but also to prevent the entry of foreign matter or the like into the interior by cleaning the motor members during the manufacturing stage. However, in the technique described in Patent Document 1, after the extraction hole formed in the base is sealed with an ultraviolet curable adhesive, a thermosetting adhesive is subsequently applied and cured. If cleaning is performed after curing, there is a risk of deterioration of an adhesive (such as an ultraviolet curable adhesive or an adhesive that bonds a circuit board) or generation of cracks due to the influence of vibration caused by the cleaning. Therefore, there is a possibility that the sealing performance of the extraction hole is lowered. On the other hand, it may be possible to apply UV-curing adhesive and thermosetting adhesive after curing, etc., and then cure, but in this case, the lead wire from the coil is pulled out by vibration generated during cleaning. There is a risk of the lead wire breaking due to vibration in the hole.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a motor capable of suitably sealing a lead-out hole of a base while preventing disconnection of a lead-out wire of a coil, and a manufacturing method thereof. To do.

The motor according to the first aspect of the present invention is:
A base part;
A stator located on one side of the base portion and having a coil;
A rotor positioned on the one side of the base portion and rotating with respect to the stator;
A circuit board located on the other side of the base portion and connected to the lead wire of the coil,
The base portion is provided with a lead hole through which the lead wire of the coil passes from the one side to the other side,
A first adhesive for fixing a part of the leader line in the lead hole;
A second adhesive that seals the lead-out hole and fixes the lead-out line, different from the first adhesive.
It is characterized by that.

  The curing rate of the first adhesive may be faster than the curing rate of the second adhesive.

  The adhesive strength of the second adhesive may be higher than the adhesive strength of the first adhesive.

  The first adhesive may be an ultraviolet curable adhesive, and the second adhesive may be a thermosetting adhesive.

An insulating material is provided on the inner peripheral wall of the extraction hole,
A part of the leader line may be fixed to the insulating material by the first adhesive.

A method for manufacturing a motor according to a second aspect of the present invention is as follows.
A base part;
A stator located on one side of the base portion and having a coil;
A rotor positioned on the one side of the base portion and rotating with respect to the stator;
A circuit board located on the other side of the base part,
The base part is a method of manufacturing a motor in which a lead hole for passing a lead wire of the coil from the one side to the other side and connecting to the circuit board is provided,
A temporary fixing step of fixing a part of the lead wire connected to the circuit board with a first adhesive in a state of being separated from the inner peripheral wall of the lead hole;
A unit cleaning step for cleaning a unit including the base part, the stator and the circuit board;
A main fixing step of fixing the other part of the lead wire fixed in the temporary fixing step by sealing the extraction hole with a second adhesive,
The unit cleaning step is a step performed between the temporary fixing step and the main fixing step.
It is characterized by that.

  The first adhesive may be an ultraviolet curable adhesive, and the second adhesive may be a thermosetting adhesive.

An insulating material is provided on the inner peripheral wall of the extraction hole,
In the temporary fixing step, a part of the lead wire connected to the circuit board may be fixed to the insulating material.

  The unit cleaning step may be a step of cleaning by immersing the unit in a liquid and applying ultrasonic vibration.

  ADVANTAGE OF THE INVENTION According to this invention, the motor which can seal the drawer hole of a base suitably, and its manufacturing method can be provided, preventing disconnection of the leader line of a coil.

It is sectional drawing of the spindle motor which concerns on the 1st Embodiment of this invention. It is a top view which shows the circuit board provided in the base lower surface. It is process drawing which shows a part of manufacturing process of a spindle motor. It is process drawing which shows a part of manufacturing process of the spindle motor which concerns on the 2nd Embodiment of this invention. It is process drawing which shows a part of manufacturing process of the spindle motor which concerns on the modification of 2nd Embodiment.

  A spindle motor according to an embodiment of the present invention will be described with reference to the drawings. The spindle motor 100 is used as a drive source for a data storage device including a disk such as a magnetic disk or an optical disk used in a computer. In this embodiment, a spindle motor will be described as an example. However, the present invention is not particularly limited, and the present invention can be applied to various motors.

(First embodiment)
As shown in FIG. 1, the spindle motor 100 according to the first embodiment of the present invention is configured as an outer rotor type spindle motor. For example, the spindle motor 100 rotates a magnetic disk of a hard disk drive (HDD) (not shown).

As shown in FIG. 1, the spindle motor 100 includes a rotor 10, a stator 20, a sleeve 30, a magnetic attraction plate 40, a base unit 50, and a circuit board 60.
FIG. 1 is a sectional view of the spindle motor 100. In the following, in order to facilitate understanding of the configuration of the spindle motor 100, the terms “upper” and “lower” will be described in correspondence with the vertical direction in FIG. 1 unless otherwise specified.

  The rotor 10 rotates about the axis A with respect to the stator 20 and includes a shaft 11, a rotor hub 12, and a magnet 13.

  The shaft 11 is a rotation axis of the rotor 10 and is formed in a substantially cylindrical shape along the axis A. The shaft 11 is supported by the sleeve 30 so as to be rotatable about the axis A via a bearing mechanism (not shown) using fluid dynamic pressure.

  The rotor hub 12 holds the magnet 13 and is formed in a bottomed cylindrical shape that opens downward. The rotor hub 12 is made of, for example, stainless steel. The shaft 11 is fixed to the central portion of the rotor hub 12 by a technique such as press fitting or adhesion. Thereby, the rotor hub 12 rotates together with the shaft 11. A magnet 13 is fixed to the inner peripheral surface of the rotor hub 12.

  The magnet 13 is formed in an annular shape around the axis A, and has a structure in which N and S poles are alternately magnetized along the circumferential direction.

The stator 20 includes a core 21 and a coil 22 wound around the core 21.
The core 21 is configured by laminating a plurality of plate-like magnetic materials in the vertical direction. The core 21 is formed in a substantially annular shape with the axis A as the center, and has a plurality of comb teeth arranged along the circumferential direction and protruding in the outer diameter direction. The core 21 is fixed to the base portion 50 and is disposed at a position facing the inner peripheral surface of the magnet 13 with a gap.

  A coil 22 is wound around the core 21 by a three-phase winding. The end of the coil 22 is drawn out to the lower side of the base portion 50 and constitutes a lead line L. The lead wire L is covered with an insulating film on the surface except for the tip in order to prevent a short circuit.

  The sleeve 30 is formed in a substantially cylindrical shape with the axis A as a center, and supports the shaft 11 so as to be rotatable therein.

  The magnetic attraction plate 40 is made of a magnetic material and is located below the magnet 13. The magnetic attraction plate 40 generates a magnetic attraction force that attracts the magnet 13 in order to stabilize the floating position of the rotor 10.

  The base part 50 fixes and holds the stator 20 and the magnetic suction plate 40 on the upper side. The base portion 50 is made of, for example, an aluminum alloy and is configured as a part of the housing of the hard disk drive device. The base portion 50 is formed so as to face the rotor hub 12 in the vertical direction and to expand in the radial direction with the axis A as the center.

  In the base portion 50, a sleeve attachment hole 50a to which the sleeve 30 is attached is formed. The sleeve mounting hole 50a penetrates the base portion 50 from the bottom surface 51 (lower surface) in the axis A direction. The sleeve 30 is inserted into the sleeve mounting hole 50a and fixed by means such as an adhesive. The counter plate 31 is fixed to the inner periphery of the lower end of the sleeve mounting hole 50a by a predetermined method, whereby the lower end side of the sleeve 30 is closed.

  The base portion 50 is formed with a recess 52 that is recessed upward from the bottom surface 51. The recess 52 is provided to secure a space for arranging the circuit board 60, and the circuit board 60 is fixed therein by an adhesive layer 63 (see FIG. 3).

The circuit board 60 is made of, for example, FPC (Flexible Printed Circuits) and is electrically connected to the coil 22. A drive current is supplied to the coil 22 from a drive circuit (not shown) via the circuit board 60. When a drive current is supplied to the coil 22, an interaction occurs between the magnetic poles of the stator 20 (comprised of the comb teeth of the core 21 and the coil 22) and the magnetic poles of the magnet 13, and the rotor 10 with respect to the stator 20 Rotates. In this way, the spindle motor 100 operates.
For example, in a hard disk drive, a magnetic disk is fixed to the rotor hub 12 of the spindle motor 100 by a predetermined method, and the magnetic disk is rotated by the power of the spindle motor 100.

  As shown in FIG. 2, the circuit board 60 is provided with a pad portion 61 that is connected to the drive circuit described above and supplies a drive current to the coil 22. Further, the circuit board 60 is formed with a through hole H6 for drawing out the lead line L connected to the pad portion 61 at a position away from the pad portion 61. On the other hand, as shown in FIG. 1, a lead hole H <b> 5 is formed in the base portion 50 immediately below the coil 22. The through hole H6 of the circuit board 60 is provided so as to overlap the lead hole H5 in a plan view. A lead line L extending from the coil 22 on the upper surface side of the base portion 50 is passed through the through hole H6 of the circuit board 60 and the lead hole H5 of the base portion 50. The lead wire L is four wires including a wire in which ends of the three-phase windings of the coil 22 are bundled together and three wires corresponding to the U, V, and W phases. As shown in FIG. 2, the tip of each wiring is soldered to the pad portion 61 of the circuit board 60 on the bottom surface 51 side of the base portion 50 for each wiring. In the example shown in FIG. 2, one of the lead lines L including four wirings is soldered to the corresponding pad portion 61. The pad part 61 is provided corresponding to each wiring.

  The through hole H6 of the circuit board 60 and the lead hole H5 of the base portion 50 are formed to have a diameter larger than the lead line L of the coil 22 so that the lead line L of the coil 22 can be easily inserted in the assembly stage. ing. A space is formed between the through hole H <b> 6 and the lead hole H <b> 5 between the lead line L and the lead line L. For this reason, when ultrasonic cleaning is performed after the lead wire L is soldered to the pad portion 61, the lead wire L moves inside the through hole H6 and the lead hole H5 due to vibration. As a result, the leader line L may be disconnected. Moreover, there is a possibility that the lead line L hits the edge of the lead hole H5 and the covering of the lead line L is broken and short-circuited. Therefore, in order to prevent disconnection or short circuit of the lead line L, as shown in FIG. 1, between the lead line L and the inner peripheral wall of the lead hole H5 of the base portion 50, as described later, before ultrasonic cleaning is performed. The first adhesive 70 is applied, and the lead line L and the inner peripheral wall of the lead hole H5 are bonded by the first adhesive 70. This adhesion corresponds to temporary fixing during assembly of the spindle motor 100 as will be described later.

  For the first adhesive 70, an adhesive capable of easily adhering the leader line L is used. The first adhesive 70 has a faster curing speed than the second adhesive 80 described later, and is preferably an ultraviolet curable adhesive. This is because if the first adhesive 70 is an ultraviolet curable adhesive, it can be cured in a short time by irradiation with ultraviolet rays, and the productivity of the spindle motor 100 can be increased. The first adhesive 70 of this embodiment uses an ultraviolet curable adhesive, but it is not particularly limited as long as the curing speed is high. For example, various adhesives can be used as long as the curing rate is higher than the second adhesive 80 described later, such as a photo-curing adhesive or an instantaneous adhesive. For the ultraviolet curable adhesive, for example, an insulating adhesive mainly composed of an acrylic resin is used. However, the resin is not particularly limited to an acrylic resin. For example, an epoxy resin may be used, or a polyimide resin, a polybenzoxazal resin, or the like may be used.

  The first adhesive 70 is used so as to connect between the lead wire L and the inner peripheral wall of the lead hole H5 of the base portion 50 (see FIG. 3B). In the lead hole H5, in order to prevent a short circuit, the lead line L passes through a position away from the inner peripheral wall of the lead hole H5. The first adhesive 70 is applied and cured between a part of the lead line L and a part of the inner peripheral wall of the lead hole H5. Thereby, disconnection and a short circuit of the leader line L are prevented. In addition, if the 1st adhesive agent 70 is apply | coated so that the leader line L may be fixed to a part of inner peripheral wall of the leader hole H5, the part of the leader line L to which the 1st adhesive agent 70 is applied Is not limited to the portion of the leader line L located in the leader hole H5. For example, the first adhesive 70 may be applied so as to connect a part of the lead line L outside the lead hole H5 and the inner peripheral wall of the lead hole H5. Returning to FIG. 1, the lead line L is further bonded to another part of the lead line L which is different from the part bonded with the first adhesive 70 by the second adhesive 80.

  The second adhesive 80 is applied so as to fill the inside of the through hole H6 of the circuit board 60 and the lead hole H5 of the base portion 50, and seals the through hole H6 and the lead hole H5. The second adhesive 80 is hardened inside the through-hole H6 and the lead-out hole H5, and the lead-out line L is placed in the through-hole H6 and in the lead-out hole while the lead-out line L is bonded with the first adhesive 70. It is fixed in H5. The fixing of the leader line L by the second adhesive 80 corresponds to the main fixing at the time of assembling the spindle motor 100 as will be described later.

  The second adhesive 80 is also used on the lower surface side of the base portion 50. As shown in FIG. 2, the lead line L drawn to the lower surface side of the base portion 50, the through hole H6 of the circuit board 60, The pad portion 61 and the solder 62 are covered. The second adhesive 80 protects the leader line L, the solder 62 and the like on the lower surface side of the base portion 50. As described above, the example shown in FIG. 2 shows an example in which one wiring out of the lead lines L including four wirings is soldered to the corresponding pad portion 61. Although not shown, the second adhesive 80 covers the through hole H6 of the circuit board 60 and the pad portion 61 and the solder 62 provided corresponding to each wiring. In the illustrated example, an example is shown in which one extraction hole H5 and one through hole H6 are provided, but a plurality of extraction holes H5 and through holes H6 may be provided correspondingly. In this case, the second adhesive 80 may be applied so as to seal all the drawing holes H5 and the through holes H6.

  For the second adhesive 80, an adhesive different from the first adhesive 70 capable of firmly adhering the leader line L is used. The strength of the second adhesive 80 is higher than the strength of the first adhesive 70, and its durability is also higher than the durability of the first adhesive 70. The second adhesive 80 is preferably a thermosetting adhesive. If the second adhesive 80 is a thermosetting adhesive, it can be completely cured even in places where light is difficult to enter, such as the lead-out hole H5, and high strength and durability can be achieved in fixing the lead-out line L. Because you can. It is also possible to improve the sealing performance of the extraction hole H5 and the like. For the second adhesive 80, for example, an insulating adhesive mainly composed of an epoxy resin is used, but it is not particularly limited. For example, various adhesives such as a phenol resin, a urea resin, a melamine resin, a resorcinol resin, a xylene resin, a methylol resin such as a furan resin, and a polyester resin can be used.

  Next, a method for fixing the lead wire L of the coil 22 will be described. First, the core 21 and the coil 22 are attached to the base portion 50, and the circuit board 60 is attached to the concave portion 52 on the lower surface of the base portion 50. Thereby, a unit (hereinafter simply referred to as a unit) constituted by the base portion 50, the core 21, the coil 22, and the circuit board 60 is assembled.

  Next, as shown in FIG. 3A, the leading ends of the lead lines L passed through the lead holes H5 of the base portion 50 and the through holes H6 of the circuit board 60 are soldered to the pad portions 61 of the circuit board 60.

  Next, as shown in FIG. 3B, the lead line L and the inner peripheral wall of the lead hole H <b> 5 of the base portion 50 are bonded and temporarily fixed with a first adhesive 70. Specifically, the first adhesive 70 is applied so as to connect the inner peripheral wall of the lead hole H5 and a part of the side face of the lead line L, and then the first adhesive 70 is cured to thereby draw out The line L is temporarily fixed in the extraction hole H5. When the first adhesive 70 is an ultraviolet curable adhesive, the first adhesive 70 is cured by irradiating ultraviolet rays into the extraction hole H5. In the illustrated example, the first adhesive 70 is applied so as to connect the inner peripheral wall of the lead hole H5 and a part of the side surface of the lead line L. The application of the adhesive 70 is not limited to the side surface. In addition, as described above, if the first adhesive 70 is applied so that the lead line L is fixed to a part of the inner peripheral wall of the lead hole H5, the first adhesive 70 is applied. The part of the leader line L is not limited to the part of the leader line L located in the leader hole H5.

  Next, the unit on which the leader line L is temporarily fixed is immersed in a liquid, and ultrasonic vibration is applied to clean the unit (ultrasonic cleaning). Thereby, the foreign material adhering to the unit is removed. In addition, since ultrasonic cleaning is performed after the lead line L is temporarily fixed, the lead line L is prevented from moving inside the through hole H6 and the lead hole H5 due to vibration, and disconnection or short circuit of the lead line L is prevented. Can be prevented.

  Next, as shown in FIG. 3C, the extraction hole H5 is sealed with the second adhesive 80, and the extraction line L is permanently fixed in the extraction hole H5. Specifically, the second adhesive 80 is filled so as to seal the extraction hole H5 of the base portion 50 and the through hole H6 of the circuit board 60. At this time, no space or air bubbles penetrating the inside of the extraction hole H5 are left. Further, the second adhesive 80 is applied so as to cover the leader line L drawn to the lower surface side of the base portion 50 and the pad portion 61 of the circuit board 60. Thereafter, the second adhesive 80 is cured. When the second adhesive 80 is a thermosetting adhesive, the second adhesive 80 is cured by storing the unit coated with the second adhesive 80 in a high-temperature thermostatic bath. With the above process, the fixing of the lead wire L of the coil 22 is completed. In this embodiment, other members such as the rotor 10 are assembled after the leader line L is fixed, but the leader line L may be fixed after the other members are assembled.

  As described above, in the spindle motor 100 according to the first embodiment, the lead wire L extending from the coil 22 is passed through the lead hole H5 of the base portion 50 and the through hole H6 of the circuit board 60, and the pad of the circuit board 60 is passed. The unit 61 is connected. Before the ultrasonic cleaning, a part of the lead line L and the inner peripheral wall of the lead hole H5 are bonded with the first adhesive 70, whereby the lead line L is temporarily fixed in the lead hole H5. For this reason, it can prevent that the leader line L vibrates by ultrasonic cleaning, and it is prevented that a disconnection (complete disconnection or half disconnection) or a short circuit occurs. In addition to ultrasonic cleaning, disconnection and short-circuiting of the lead wire L can be prevented even in a process after temporary fixing in which vibration or impact is applied to the spindle motor 100 being assembled (for example, a transport process).

  Further, in the spindle motor 100, after the ultrasonic cleaning, the extraction hole H5 is sealed with the second adhesive 80, and the extraction line L is permanently fixed in the extraction hole H5. For this reason, ultrasonic vibration is not given to the second adhesive 80 used in the main fixing, and no cracks or the like occur in the second adhesive 80. As described above, in the spindle motor 100 according to the first embodiment, it is possible to prevent the second adhesive 80 from being deteriorated in hermeticity and adhesiveness, and to suitably seal the extraction hole H5 of the base portion 50. .

  In the lead hole H5 of the base part 50, the lead line L is temporarily fixed by the first adhesive 70 at a position away from the inner peripheral wall of the lead hole H5. Since the 1st adhesive agent 70 has insulation, the short circuit of the leader line L can be prevented in the manufacturing process after temporarily fixing the leader line L.

  When the first adhesive 70 is an ultraviolet curable adhesive, the adhesive can be easily cured, so that the productivity of the spindle motor 100 can be increased. Further, when the second adhesive 80 is a thermosetting adhesive, the strength and durability of the adhesive can be increased, so that the quality and reliability of the spindle motor 100 can be improved.

(Second Embodiment)
In the spindle motor 100 according to the second embodiment, an insulating material 90 is provided on the inner peripheral wall of the extraction hole H5 of the base portion 50. Hereinafter, a configuration different from the first embodiment will be described.

  The insulating material 90 is formed of an insulating material such as resin. As shown in FIG. 4C, the insulating material 90 includes a cylindrical portion 91 and a flange portion 92 that projects from the upper end side of the cylindrical portion 91 in the radial direction of the cylinder. The cylindrical portion 91 of the insulating material 90 is fitted into the extraction hole H5, and the outer peripheral wall of the cylindrical portion 91 and the inner peripheral wall of the extraction hole H5 are fixed. The length of the cylindrical portion 91 is shorter than the length of the extraction hole H5, and the tip of the cylindrical portion 91 is located in the extraction hole H5. The inner circumference of the cylindrical portion 91 becomes slightly smaller as it goes downward, and the inner diameter on the lower surface side is substantially the same as the through hole H <b> 6 of the circuit board 60. The lead wire L of the coil 22 is passed through the cylindrical portion 91, and the opening of the cylindrical portion 91 functions as an outlet 93 for the lead wire L. Inside the cylindrical portion 91, the leader line L is temporarily fixed by being bonded to the inner peripheral wall by the first adhesive 70, thereby suppressing the movement of the leader line L. The first adhesive 70 prevents disconnection or short circuit of the leader line L.

  A substantially lower half of the inside of the cylindrical portion 91 is filled with the second adhesive 80. The second adhesive 80 is filled not only in the cylindrical portion 91 but also in the extraction hole H5 and the through hole H6. Similar to the first embodiment, the second adhesive 80 is provided on the lower surface side of the base portion 50. The second adhesive 80 seals the inside of the through hole H6 and the lead hole H5 and permanently fixes the lead line L.

  Next, a method for fixing the lead wire L of the coil 22 in the second embodiment will be described. First, as in the first embodiment, a unit including the base unit 50, the core 21, the coil 22, and the circuit board 60 is assembled. In the second embodiment, the cylindrical portion 91 of the insulating material 90 is inserted into the extraction hole H5 of the base portion 50 so that the flange portion 92 of the insulating material 90 contacts the upper surface of the base portion 50, and the insulating material 90 is The unit is assembled using the inserted base portion 50.

  Next, as shown in FIG. 4A, the lead wire L of the coil 22 is passed through the cylindrical portion 91 of the insulating material 90 and drawn out from the through hole H <b> 6 of the circuit board 60. The tip of the lead line L is soldered to the pad portion 61 of the circuit board 60.

  Next, as shown in FIG. 4 (B), a part of the lead line L and the inner peripheral wall of the insulating material 90 are bonded with the first adhesive 70, whereby the lead line L is temporarily placed in the lead hole H5. Fix it. Specifically, the first adhesive 70 is applied to the inner peripheral wall of the insulating material 90, and a part of the leader line L is brought into contact with the first adhesive 70. Subsequently, the first adhesive 70 is cured. Thereby, the leader line L is temporarily fixed. In the illustrated example, the leader line L is temporarily fixed at a position separated from the inner peripheral wall of the insulating material 90. However, the leader line L and the insulating material 90 are temporarily fixed in contact with each other. May be.

  Next, as in the first embodiment, the unit on which the leader line L is temporarily fixed is immersed in a liquid and cleaned by applying ultrasonic vibration (ultrasonic cleaning).

  Next, as shown in FIG. 4C, the lead line L is permanently fixed with the second adhesive 80. In the second embodiment, the second adhesive is used so that the space below the position where the lead line L of the cylindrical portion 91 of the insulating material 90 is temporarily fixed is filled with the second adhesive 80. 80 is applied. Application of the lower surface side of the base portion 50 is the same as that in the first embodiment. Subsequently, the second adhesive 80 is cured. Thereby, the lead wire L is permanently fixed in the lead hole H5. With the above process, the fixing of the lead wire L of the coil 22 is completed.

  As described above, in the spindle motor 100 according to the second embodiment, the insulating material 90 is inserted into the extraction hole H5 of the base portion 50, and the lead wire L extending from the coil 22 is passed through the outlet 93 of the insulating material 90. Yes. Before the ultrasonic cleaning, a part of the lead line L is adhered to the insulating material 90 with the first adhesive 70, thereby temporarily fixing the lead line L in the lead hole H5. As with the first embodiment, the spindle motor 100 according to the second embodiment can prevent disconnection or short circuit of the lead wire L by ultrasonic cleaning or the like after temporary fixing.

  In the second embodiment, after the ultrasonic cleaning, the cylindrical portion 91 of the insulating material 90 and the extraction hole H5 are sealed with the second adhesive 80, and the extraction line L is permanently fixed in the extraction hole H5. For this reason, the adhesiveness and adhesiveness of the 2nd adhesive agent 80 do not fall by ultrasonic vibration. Also in the second embodiment, the extraction hole H5 of the base portion 50 can be suitably sealed.

  The lead line L is fixed to the base part 50 via the insulating material 90. For this reason, the insulation of the leader line L in the leader hole H5 is improved, and the short circuit of the leader line L can be prevented suitably. Further, since the inner periphery of the cylindrical portion 91 of the insulating material 90 is slightly smaller as it goes downward, the lead line L can be easily inserted from above, and temporary fixing can be facilitated from above. By temporarily fixing the lead line L above the cylindrical portion 91 of the insulating material 90 or at the flange portion 92, it can be temporarily fixed above the base portion 50.

  As mentioned above, although embodiment of this invention was described, this invention is not limited by the said embodiment etc. For example, in the second embodiment, the example in which the insulating material 90 has a cylindrical shape having the cylindrical portion 91 has been shown. However, as long as the insulating material 90 has an outlet through which the leader line L of the coil 22 can be inserted, The shape is not asked.

For example, as shown in FIG. 5, the insulating material 90 may be a sheet-shaped insulating shim having a funnel-shaped outlet 93. In this case, the unit is assembled by attaching the insulating shim to the base part 50 so that the outlet 93 of the insulating shim overlaps the lead-out hole H5 of the base part 50. Then, the lead wire L of the coil 22 is passed through the insulation shim outlet 93, and the leading end of the lead wire L is soldered to the pad portion 61 of the circuit board 60 (see FIG. 5A). Then, the leader line L is temporarily fixed by adhering a part of the leader line L to the upper surface wall of the funnel portion of the insulating shim with the first adhesive 70 (see FIG. 5B). Thereafter, as in the above embodiment, the lead hole H5 is cleaned and sealed with the second adhesive 80, and the lead line L is permanently fixed in the lead hole H5 (see FIG. 5C). Even when the insulating shim is used in this manner, the movement of the lead line L is suppressed by temporary fixing, and disconnection or short circuit of the lead line L can be prevented.
In this case, the lead wire L may be temporarily fixed on the inner peripheral wall of the lead hole H5 in addition to the insulating material 90 (insulating shim) as in the first embodiment.

  Moreover, in the said 2nd Embodiment, as shown in FIG. 4, although the insulating material 90 showed the example which is a cylindrical shape which has the cylindrical part 91 and the flange part 92, the insulating material 90 is the extraction hole H5. The leader line L may be provided only on the side temporarily fixed with the first adhesive 70, such as only on the right side shown in FIG.

  In the first and second embodiments, the through hole H6 is formed in the circuit board 60, and the lead wire L of the coil 22 is passed through the through hole H6. However, the present invention is not limited to this. In the present invention, it is only necessary that the extraction hole H5 is formed at least in the base portion 50. For example, the through hole H6 may not be formed in the circuit board 60. In this case, the circuit board 60 may be provided at a position away from the extraction hole H5 of the base part 50 so that the circuit board 60 does not block the extraction hole H5 of the base part 50. Even in this case, the leader line L can be drawn out to the lower surface of the base portion 50.

  In the first and second embodiments, the second adhesive 80 is applied so that the second adhesive 80 fills most of the extraction hole H5. However, the present invention is not limited to this. . In the present invention, when a portion other than the portion fixed by the first adhesive 70 of the lead line L is fixed and the lead hole H5 is sealed, most of the lead hole H5 in the lead hole H5 is sealed by the second adhesive 80. Does not have to be satisfied. The second adhesive 80 may be filled in the extraction hole H5 so that a space penetrating the inside of the extraction hole H5 of the base portion 50 does not remain. In addition, the part fixed with the 2nd adhesive agent 80 may include the part of the leader line L fixed with the 1st adhesive agent 70 in temporary fixation, and does not need to include the said part. .

  In the first and second embodiments, the unit is ultrasonically cleaned, but the present invention is not limited to this. The unit cleaning in the present invention includes, for example, dip cleaning in which the unit is cleaned by immersing the unit in a cleaning solution. Even with such cleaning, for example, when the cleaning liquid is agitated, disconnection or short circuit of the lead wire L due to the vibration can be prevented. Further, if the lead line L is permanently fixed after such cleaning, the adhesion of the second adhesive 80 due to the cleaning is not deteriorated, and the lead hole H5 of the base portion 50 can be suitably sealed.

  In the first and second embodiments, the example in which the lead lines L including four wires are temporarily fixed together has been shown, but this is an example. For example, each of the four wirings may be individually bonded to the respective positions inside the extraction hole H5 with the first adhesive 70. Alternatively, two of the four wires may be combined and bonded. The combination may be arbitrary. According to this, since each wiring is respectively fixed, the intensity | strength of the leader line L whole can be improved. Moreover, since the drawer hole H5 of the base part 50 can be made small, the fall of the intensity | strength of the base part 50 can be prevented.

  In the above description, in order to facilitate understanding of the present invention, descriptions of known technical matters are omitted as appropriate.

DESCRIPTION OF SYMBOLS 100 ... Spindle motor 10 ... Rotor 11 ... Shaft 12 ... Rotor hub 13 ... Magnet 20 ... Stator 21 ... Core 22 ... Coil 30 ... Sleeve 31 ... Counter plate 50 ... Base part 51 ... Bottom 52 ... Concave H5 ... Lead-out hole 60 ... Circuit board DESCRIPTION OF SYMBOLS 61 ... Pad part 62 ... Solder 63 ... Adhesion layer H6 ... Through-hole 70 ... 1st adhesive agent 80 ... 2nd adhesive agent 90 ... Insulating material 91 ... Cylindrical part 92 ... Flange part 93 ... Outlet L ... Lead wire

Claims (9)

A base part;
A stator located on one side of the base portion and having a coil;
A rotor positioned on the one side of the base portion and rotating with respect to the stator;
A circuit board located on the other side of the base portion and connected to the lead wire of the coil,
The base portion is provided with a lead hole through which the lead wire of the coil passes from the one side to the other side,
A first adhesive for fixing a part of the leader line in the lead hole;
A second adhesive that seals the lead-out hole and fixes the lead-out line, different from the first adhesive.
A motor characterized by that.   The motor according to claim 1, wherein a curing rate of the first adhesive is faster than a curing rate of the second adhesive.   The motor according to claim 1, wherein an adhesive strength of the second adhesive is higher than an adhesive strength of the first adhesive.   4. The motor according to claim 1, wherein the first adhesive is an ultraviolet curable adhesive, and the second adhesive is a thermosetting adhesive. 5. An insulating material is provided on the inner peripheral wall of the extraction hole,
5. The motor according to claim 1, wherein a part of the lead wire is fixed to the insulating material by the first adhesive. 6. A base part;
A stator located on one side of the base portion and having a coil;
A rotor positioned on the one side of the base portion and rotating with respect to the stator;
A circuit board located on the other side of the base part,
The base part is a method of manufacturing a motor, wherein a lead hole is provided to connect the lead wire of the coil from the one side to the other side and connect to the circuit board.
A temporary fixing step of fixing a part of the lead wire connected to the circuit board with a first adhesive in a state of being separated from the inner peripheral wall of the lead hole;
A unit cleaning step for cleaning a unit including the base part, the stator and the circuit board;
A main fixing step of fixing the other part of the lead wire fixed in the temporary fixing step by sealing the extraction hole with a second adhesive,
The unit cleaning step is a step performed between the temporary fixing step and the main fixing step.
A method of manufacturing a motor characterized by the above.   The method for manufacturing a motor according to claim 6, wherein the first adhesive is an ultraviolet curable adhesive, and the second adhesive is a thermosetting adhesive. An insulating material is provided on the inner peripheral wall of the extraction hole,
8. The method of manufacturing a motor according to claim 6, wherein in the temporary fixing step, a part of the lead wire connected to the circuit board is fixed to the insulating material.   9. The method of manufacturing a motor according to claim 6, wherein the unit cleaning step is a step of cleaning the unit by immersing the unit in a liquid and applying ultrasonic vibration.