JP6129605B2 - Power converter manufacturing method and jig used therefor - Google Patents

Power converter manufacturing method and jig used therefor Download PDF

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JP6129605B2
JP6129605B2 JP2013061252A JP2013061252A JP6129605B2 JP 6129605 B2 JP6129605 B2 JP 6129605B2 JP 2013061252 A JP2013061252 A JP 2013061252A JP 2013061252 A JP2013061252 A JP 2013061252A JP 6129605 B2 JP6129605 B2 JP 6129605B2
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bus bar
lead
solder
casing
semiconductor element
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良宣 須原
良宣 須原
小澤　哲也
哲也 小澤
聡則 井浦
聡則 井浦
史彦 嶋津
史彦 嶋津
良 今川
良 今川
麻子 米口
麻子 米口
利武 大西
利武 大西
前田　康宏
康宏 前田
仁志 西尾
仁志 西尾
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Honda Motor Co Ltd
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Description

本発明は、駆動用モータを駆動する駆動回路に用いられ、バスバーから半導体素子へと電力を供給して電力変換を行って出力する電力変換装置の製造方法及びそれに用いられる治具に関する。   The present invention relates to a method for manufacturing a power conversion device that is used in a drive circuit that drives a drive motor, supplies power from a bus bar to a semiconductor element, performs power conversion, and outputs the power conversion device, and a jig used therefor.

本出願人は、特許文献１に開示されるように、高圧バスバー及び低圧バスバーがトランジスタ素子、ダイオード素子に対して半田等で電気的に接続され、該高圧バスバー及び低圧バスバーに接続された金属配線板を介して出力バスバーと接続され、前記高圧バスバー及び低圧バスバーに供給された電力を変換して前記出力バスバーから電気自動車やハイブリッド自動車等に用いられる駆動用モータへと供給する電力変換装置が知られている。   As disclosed in Patent Document 1, the applicant of the present application electrically connects a high-voltage bus bar and a low-voltage bus bar to a transistor element and a diode element with solder or the like, and a metal wiring connected to the high-voltage bus bar and the low-voltage bus bar. There is known a power conversion device connected to an output bus bar via a plate, converting power supplied to the high-voltage bus bar and the low-voltage bus bar and supplying the power from the output bus bar to a drive motor used in an electric vehicle, a hybrid vehicle, or the like. It has been.

特許第４９７７４０７号公報Japanese Patent No. 4977407

本発明は、前記の提案に関連してなされたものであり、バスバーとリードとを接続する際の鉛直方向及び水平方向のばらつきを吸収して確実に接続すると共に、その接合部に設けられた半田を効率的に加熱して接合することが可能な電力変換装置の製造方法及びそれに用いられる治具を提供することを目的とする。   The present invention has been made in connection with the above-mentioned proposal, and absorbs the variation in the vertical direction and the horizontal direction when connecting the bus bar and the lead and securely connects them, and is provided at the joint portion. An object of the present invention is to provide a method of manufacturing a power conversion device capable of efficiently heating and joining solder and a jig used therefor.

前記の目的を達成するために、本発明は、ケーシングにモールドされたバスバーに一端部が接続され、他端部が半導体素子に接続されるリードを有し、該リードを通じて前記バスバーから前記半導体素子の電極へと電力供給を行う電力変換装置の製造方法であって、
前記電力変換装置は、前記リードの一端部に、前記バスバーに対して当接又は所定間隔離間し、鉛直下方向に所定角度傾斜した屈曲部を有し、
前記屈曲部に臨んで鉛直方向に延在する前記バスバーの鉛直壁と該屈曲部との間に載置された半田を加熱し、前記鉛直壁と前記屈曲部とを互いに前記半田によって接合する接合工程を有し、前記接合工程において、前記バスバーに加熱手段を当接させ加熱した状態で前記ケーシングを保持する治具が用いられ、
前記治具は、前記半導体素子に当接する前記リードのチップ接続部を押圧し、該リードを位置決めして固定する押圧体を有し、
前記接合工程を行う前に、前記電力変換装置を構成するヒートシンクに対して前記ケーシングを載置すると共に前記半田を介して載置する工程と、
基板に対して前記半田を介して複数の半導体素子を配置する工程と、
前記複数の半導体素子を前記リードによって互いに接続する工程と、
前記押圧体によって前記チップ接続部を押圧する工程と、
を有することを特徴とする。
In order to achieve the above object, the present invention has a lead having one end connected to a bus bar molded in a casing and the other end connected to a semiconductor element, and the semiconductor element is connected to the semiconductor element through the lead. A method of manufacturing a power converter for supplying power to the electrodes of
The power conversion device has a bent portion that is in contact with or spaced apart from the bus bar at one end of the lead and is inclined at a predetermined angle in the vertical downward direction.
A joint that heats the solder placed between the bent wall and the vertical wall of the bus bar that extends in the vertical direction facing the bent portion, and joins the vertical wall and the bent portion to each other by the solder. have a step in the joining step, a jig for holding the casing in a state of being heated by contact with the heating means to said bus bar is used,
The jig includes a pressing body that presses the chip connecting portion of the lead that contacts the semiconductor element, and positions and fixes the lead.
Before performing the joining step, placing the casing on the heat sink constituting the power conversion device and placing the casing via the solder;
Placing a plurality of semiconductor elements on the substrate via the solder;
Connecting the plurality of semiconductor elements to each other by the leads;
Pressing the chip connecting portion with the pressing body; and
And wherein the Rukoto to have a.

本発明によれば、ケーシングにモールドされたバスバーと半導体素子とを接続するリードを有した電力変換装置において、前記リードの一端部に形成され前記バスバーに対して当接又は所定間隔離間して鉛直下方向に所定角度傾斜した屈曲部と前記バスバーの鉛直壁とを接合工程で半田を加熱することによって接合している。   According to the present invention, in a power converter having a lead connecting a bus bar molded in a casing and a semiconductor element, the lead is formed at one end of the lead and abuts or is spaced apart from the bus bar by a vertical distance. The bent part inclined downward by a predetermined angle and the vertical wall of the bus bar are joined by heating the solder in the joining process.

従って、バスバーやリードに寸法ばらつきが生じ、互いの相対的な位置関係が鉛直方向にずれた場合に、前記バスバーの鉛直壁と前記リードとの離間距離が変化することがなく接合工程において半田を加熱することで確実に接合できると共に、水平方向にずれた場合でも、鉛直壁と屈曲部とを接合する半田でばらつきを吸収することができる。その結果、バスバー及びリードが寸法ばらつきに起因して位置ずれした場合でも、鉛直方向及び水平方向の寸法ばらつきを好適に吸収して確実に前記バスバーと前記リードとを接合することができる。   Therefore, when dimensional variations occur in the bus bars and leads, and the relative positional relationship between them deviates in the vertical direction, the distance between the vertical wall of the bus bar and the lead does not change, and solder is used in the joining process. By heating, it is possible to surely join, and even when it is displaced in the horizontal direction, the variation can be absorbed by the solder joining the vertical wall and the bent portion. As a result, even when the bus bar and the lead are misaligned due to the dimensional variation, the bus bar and the lead can be reliably joined by suitably absorbing the dimensional variation in the vertical direction and the horizontal direction.

また、接合工程において、バスバーに加熱手段を当接させ加熱した状態でケーシングを保持する治具を用いるとよい。これにより、ケーシングにモールドされ温度上昇しにくいバスバーを加熱手段によって直接加熱することができ、接合されるリードとの温度差を抑制し、前記バスバーと前記リードの屈曲部との間に載置された半田を均等に溶融させて接合することが可能となる。その結果、バスバーとリードとをより一層確実に接合できると共に、その接合部にそれぞれフィレットを形成できるため、該フィレットによって前記接合部の接合状態を目視で容易且つ確実に確認することができる。   In the joining step, it is preferable to use a jig that holds the casing in a heated state with the heating means abutting the bus bar. As a result, the bus bar that is molded in the casing and hardly rises in temperature can be directly heated by the heating means, and the temperature difference with the lead to be joined is suppressed, and the bus bar is placed between the bus bar and the bent portion of the lead. It is possible to melt the solder evenly and join them. As a result, the bus bar and the lead can be more reliably joined together, and a fillet can be formed at each joined portion. Therefore, the joined state of the joined portion can be easily and reliably confirmed visually by the fillet.

さらに、治具は、半導体素子に当接するリードのチップ接続部を押圧し、該リードを位置決めして固定する押圧体を有し、接合工程を行う前に、電力変換装置を構成するヒートシンクに対してケーシングを載置すると共に前記半田を介して載置する工程と、基板に対して前記半田を介して複数の半導体素子を配置する工程と、複数の半導体素子を前記リードによって互いに接続する工程と、前記押圧体によって前記チップ接続部を押圧する工程とを有するとよい。これにより、複数の半導体素子をリードで互いに接続する電力変換装置において、治具の押圧体でチップ接続部を半導体素子へと押圧し、且つ、位置決めすることで前記チップ接続部を前記半導体素子に密着された状態で所定の位置に確実に接続することができる。
Furthermore, the jig has a pressing body that presses the chip connecting portion of the lead that contacts the semiconductor element, and positions and fixes the lead, and before performing the joining process, the jig is attached to the heat sink that constitutes the power conversion device. Placing the casing and placing the casing via the solder, placing a plurality of semiconductor elements on the substrate via the solder, and connecting the plurality of semiconductor elements to each other by the leads; And a step of pressing the chip connecting portion with the pressing body. Thereby, in the power conversion device for connecting a plurality of semiconductor elements to each other with leads, the chip connection part is pressed against the semiconductor element by the pressing body of the jig and positioned, thereby positioning the chip connection part on the semiconductor element. It is possible to reliably connect to a predetermined position in a close contact state.

さらにまた、ケーシングにモールドされたバスバーに一端部が接続され、他端部が半導体素子に接続されるリードを有し、該リードを通じて前記バスバーから前記半導体素子の電極へと電力供給を行う電力変換装置の製造に用いられる治具であって、
前記バスバーは鉛直方向に延在する鉛直壁を有し、前記リードの一端部には前記鉛直壁に対して所定間隔離間し、鉛直下方向に所定角度傾斜した屈曲部を有し、前記鉛直壁と前記屈曲部とが半田によって互いに接合された接合部が形成され、
前記治具は、前記ケーシングの載置されるベース体と、
前記ベース体に対して離間し、前記電力変換装置の上方を覆う遮蔽部材と、
前記バスバーに当接し加熱する加熱手段と、
を備え、
前記遮蔽部材には、少なくとも前記接合部に臨む位置に開口部が形成され、該開口部を通じて前記接合部近傍が加熱され、前記半導体素子に当接する前記リードのチップ接続部を該半導体素子側に向かって押圧する押圧体を備えることを特徴とする。
Furthermore, a power conversion unit having one end connected to the bus bar molded in the casing and the other end connected to the semiconductor element, and supplying power from the bus bar to the electrode of the semiconductor element through the lead. A jig used in the manufacture of a device,
The bus bar has a vertical wall extending in a vertical direction, and one end of the lead has a bent portion that is spaced apart from the vertical wall by a predetermined distance and is inclined at a predetermined angle in the vertical downward direction. And a bent portion is formed by joining the bent portion with solder,
The jig includes a base body on which the casing is placed;
A shielding member that is spaced apart from the base body and covers the power converter;
Heating means for contacting and heating the bus bar;
With
The shielding member is formed with an opening at a position facing at least the bonding portion, and the vicinity of the bonding portion is heated through the opening so that the chip connecting portion of the lead that contacts the semiconductor element faces the semiconductor element side. toward characterized Rukoto a pressing member that presses.

本発明によれば、リードの一端部をケーシングにモールドされたバスバーに接続し、他端部を半導体素子に接続する電力変換装置の製造に用いられる治具において、前記ケーシングが載置されるベース体と、前記ベース体に対して離間して前記電力変換装置の上方を覆う遮蔽部材と、前記バスバーに当接して加熱する加熱手段とを備えている。そして、治具に装着された電力変換装置を加熱することでリードをバスバー及び半導体素子に接続する際、遮蔽部材の開口部を通じて接合部近傍に熱を付与させることで、ケーシングにモールドされ温度上昇しにくいバスバー近傍を効果的に加熱させることができると共に、さらに加熱手段によって前記バスバーを直接加熱することができる。   According to the present invention, in a jig used for manufacturing a power conversion device in which one end of a lead is connected to a bus bar molded in a casing and the other end is connected to a semiconductor element, the base on which the casing is placed A body, a shielding member that covers the upper portion of the power converter while being spaced apart from the base body, and a heating unit that abuts and heats the bus bar. Then, when connecting the lead to the bus bar and the semiconductor element by heating the power conversion device mounted on the jig, heat is applied to the vicinity of the joint through the opening of the shielding member, so that the temperature is increased by being molded into the casing. The vicinity of the bus bar which is difficult to be heated can be effectively heated, and the bus bar can be directly heated by the heating means.

従って、バスバーを積極的に加熱することでリードとの間の温度差が抑制され、略同一の温度に加熱されたバスバー及びリードによって半田を均等に溶融させ確実に接合することができると共に、前記バスバー及びリードに対してフィレットを形成することができる。その結果、バスバーとリードとを確実に接合して電気的に接続しつつ、その接合状態を作業者が目視によって容易且つ確実に確認することが可能となる。   Therefore, by positively heating the bus bar, the temperature difference between the lead and the lead is suppressed, and the solder can be evenly melted and reliably joined by the bus bar and the lead heated to substantially the same temperature. Fillets can be formed for bus bars and leads. As a result, it is possible for the operator to easily and surely confirm the joining state by visual observation while reliably joining and electrically connecting the bus bar and the lead.

また、バスバーやリードに寸法ばらつきが生じ、互いの相対的な位置関係が鉛直方向にずれた場合に、前記バスバーの鉛直壁と前記リードとの離間距離が変化することがなく半田によって確実に接合できると共に、水平方向にずれた場合でも、鉛直壁と屈曲部とを接合する半田でばらつきを吸収することができる。その結果、バスバー及びリードが寸法ばらつきに起因して位置ずれした場合でも、鉛直方向及び水平方向の寸法ばらつきを好適に吸収して確実に接合することが可能となる。   In addition, when the bus bars and leads have dimensional variations and the relative positional relationship between them deviates in the vertical direction, the distance between the vertical wall of the bus bar and the lead does not change, and soldering is ensured. In addition, even when it is displaced in the horizontal direction, the variation can be absorbed by the solder that joins the vertical wall and the bent portion. As a result, even when the bus bar and the lead are displaced due to dimensional variations, the vertical and horizontal dimensional variations can be favorably absorbed and reliably bonded.

さらに、半導体素子に当接するリードのチップ接続部を該半導体素子側に向かって押圧する押圧体を備えることにより、前記チップ接続部を前記半導体素子側へと押圧して密着させることが可能となるため、前記チップ接続部と前記半導体素子とを確実に接続することが可能となる。
Further, by providing a pressing body that presses the chip connecting portion of the lead that contacts the semiconductor element toward the semiconductor element side, the chip connecting portion can be pressed and brought into close contact with the semiconductor element side. Therefore, the chip connection part and the semiconductor element can be reliably connected.

本発明によれば、以下の効果が得られる。   According to the present invention, the following effects can be obtained.

すなわち、ケーシングにモールドされたバスバーと半導体素子とを接続するリードを有した電力変換装置において、前記リードの一端部に形成され前記バスバーに対して所定間隔離間して鉛直下方向に所定角度傾斜した屈曲部と前記バスバーの鉛直壁とを接合工程において半田を加熱して互いに接合できると共に、前記バスバーや前記リードに寸法ばらつきが生じ、互いの相対的な位置関係がずれた場合でも、半田によって鉛直方向及び水平方向のばらつきを吸収して確実に接合することが可能となる。   That is, in a power conversion device having a lead connecting a bus bar molded in a casing and a semiconductor element, the lead is formed at one end of the lead and is inclined at a predetermined angle vertically downward from the bus bar at a predetermined interval. The bent portion and the vertical wall of the bus bar can be joined to each other by heating the solder in the joining process, and even when the bus bar and the lead have dimensional variations and their relative positional relationship is deviated, the solder vertically It becomes possible to reliably join by absorbing variations in the direction and the horizontal direction.

本発明の実施の形態に係る電力変換装置の製造に用いられる治具を示す外観斜視図である。It is an external appearance perspective view which shows the jig | tool used for manufacture of the power converter device which concerns on embodiment of this invention. 図１に示される電力変換装置の一部平面図である。It is a partial top view of the power converter device shown by FIG. 図２のＩＩＩ−ＩＩＩ線に沿った断面図である。It is sectional drawing along the III-III line of FIG. 図４Ａは、図２の電力変換装置における第１バスバーと接続リードとの接合部位近傍を示す拡大断面図であり、図４Ｂは、図４Ａにおける第１バスバーと接続リードとが接合される前の状態を示す拡大断面図である。4A is an enlarged cross-sectional view showing the vicinity of a joint portion between the first bus bar and the connection lead in the power conversion device of FIG. 2, and FIG. 4B is a diagram before the first bus bar and the connection lead in FIG. 4A are joined. It is an expanded sectional view showing a state.

本発明に係る電力変換装置の製造方法について、それを実施する治具との関連で好適な実施の形態を挙げ、添付の図面を参照しながら以下詳細に説明する。図１において、参照符号１０は、本発明の実施の形態に係る治具を用いて製造される電力変換装置を示す。   A method for manufacturing a power conversion device according to the present invention will be described in detail below with reference to the accompanying drawings by giving preferred embodiments in relation to a jig for carrying out the method. In FIG. 1, reference numeral 10 indicates a power converter manufactured using the jig according to the embodiment of the present invention.

先ず、この治具を用いて製造される電力変換装置１０について図１〜図３を参照しながら説明する。この電力変換装置１０は、例えば、電気自動車やハイブリッド自動車等に用いられる駆動用モータを駆動するためのインバータ装置であり、図２及び図３に示されるように、樹脂製材料からなるケーシング１２と、前記ケーシング１２の下部に設けられるヒートシンク１４と、前記ケーシング１２の内部に収納される回路基板１６と、該回路基板１６の上面に実装される複数の半導体チップ（半導体素子）１８ａ、１８ｂと、前記ケーシング１２にモールドされる第１及び第２バスバー２０、２２と、前記半導体チップ１８ａ、１８ｂを前記第１バスバー（バスバー）２０に対して接合する接続リード（リード）２４とを含む。   First, the power converter 10 manufactured using this jig will be described with reference to FIGS. This power conversion device 10 is an inverter device for driving a drive motor used in, for example, an electric vehicle, a hybrid vehicle, and the like. As shown in FIGS. 2 and 3, a casing 12 made of a resin material and A heat sink 14 provided in the lower part of the casing 12, a circuit board 16 accommodated in the casing 12, and a plurality of semiconductor chips (semiconductor elements) 18a and 18b mounted on the upper surface of the circuit board 16, First and second bus bars 20, 22 molded in the casing 12, and connection leads (leads) 24 for joining the semiconductor chips 18 a, 18 b to the first bus bars (bus bars) 20 are included.

ケーシング１２は、その中央部に幅方向に沿って延在して断面矩形状に形成された絶縁部２６と、該絶縁部２６に対して所定間隔離間して略平行に設けられるサイド部２８とからなり、前記絶縁部２６には第１バスバー２０が一体的にモールドされ、サイド部２８にはそれぞれ第２バスバー２２が一体的にモールドされる。   The casing 12 has an insulating portion 26 extending in the width direction at the center thereof and formed in a rectangular cross section, and a side portion 28 provided substantially parallel to the insulating portion 26 at a predetermined interval. The first bus bar 20 is integrally molded on the insulating portion 26, and the second bus bar 22 is integrally molded on the side portion 28, respectively.

そして、ケーシング１２の下面には、例えば、アルミニウムや銅等の金属製材料からプレート状に形成されたヒートシンク１４が設けられ、該ヒートシンク１４によって前記下面が覆われる。このヒートシンク１４は、その上面に設けられる半導体チップ１８ａ、１８ｂで生じた熱を外部へと放熱する目的で設けられる。   And the heat sink 14 formed in plate shape from metal materials, such as aluminum and copper, for example is provided in the lower surface of the casing 12, and the said heat sink 14 covers the said lower surface. The heat sink 14 is provided for the purpose of radiating heat generated in the semiconductor chips 18a and 18b provided on the upper surface to the outside.

第１バスバー２０は、図３に示されるように、例えば、金属製材料から上方（矢印Ａ１方向）に向かって開口した断面Ｕ字状に形成され、ケーシング１２の絶縁部２６に沿って一直線状に形成されると共に、前記絶縁部２６の側壁には一方の鉛直壁３０ａが外側に露呈している。   As shown in FIG. 3, the first bus bar 20 is formed, for example, in a U-shaped cross section that opens upward (in the direction of arrow A <b> 1) from a metal material, and is straight along the insulating portion 26 of the casing 12. In addition, one vertical wall 30a is exposed to the outside on the side wall of the insulating portion 26.

第２バスバー２２は、金属製材料から断面Ｌ字状に形成され、ケーシング１２のサイド部２８に沿って一直線状に形成されると共に、第１バスバー２０側（矢印Ｂ１方向）に向かって水平方向に延在する端部がボンディングワイヤ３２によって半導体チップ１８ｂと電気的に接続される。このサイド部２８には、外側に臨む側面に第１バスバー２０における他方の鉛直壁３０ｂが露呈するように設けられる。   The second bus bar 22 is formed from a metal material to have an L-shaped cross section, is formed in a straight line along the side portion 28 of the casing 12, and is horizontally oriented toward the first bus bar 20 side (arrow B1 direction). The end portion extending to is electrically connected to the semiconductor chip 18b by the bonding wire 32. The side portion 28 is provided so that the other vertical wall 30b of the first bus bar 20 is exposed on the side surface facing the outside.

そして、この第１及び第２バスバー２０、２２は、例えば、バッテリー等の直流電源に対してケーブル（図示せず）を介してそれぞれ電気的に直接接続される。   The first and second bus bars 20 and 22 are electrically connected directly to a DC power source such as a battery via a cable (not shown), for example.

回路基板１６は、ケーシング１２において絶縁部２６とサイド部２８との間に設けられ、ヒートシンク１４の上面に板状半田３４を介して設置される。そして、回路基板１６の上面には、例えば、図示しないトランジスタ電極やダイオード電極の形成された複数の半導体チップ１８ａ、１８ｂが配置され、その下面の板状半田３６を介して前記回路基板１６と前記半導体チップ１８ａ、１８ｂとが電気的に接続される。なお、複数の半導体チップ１８ａ、１８ｂは回路基板１６上において互いに所定間隔離間するように配置される。   The circuit board 16 is provided between the insulating part 26 and the side part 28 in the casing 12, and is installed on the upper surface of the heat sink 14 via the plate-like solder 34. For example, a plurality of semiconductor chips 18a and 18b on which transistor electrodes and diode electrodes (not shown) are formed are arranged on the upper surface of the circuit board 16, and the circuit board 16 and the above-described semiconductor chip are connected to each other via the plate-like solder 36 on the lower surface. The semiconductor chips 18a and 18b are electrically connected. The plurality of semiconductor chips 18a and 18b are arranged on the circuit board 16 so as to be spaced apart from each other by a predetermined distance.

接続リード２４は、例えば、一定厚さの金属製の板材をプレス加工することによって形成され、水平方向（矢印Ｂ方向）に延在する一組の水平部３８ａ、３８ｂと、該水平部３８ａ、３８ｂに対して鉛直下方向（矢印Ａ２方向）にオフセットするように突出した一組のチップ接続部４０ａ、４０ｂと、該接続リード２４の一端部側（矢印Ｂ１方向）に形成され、一方の水平部３８ａに対して所定角度で折曲された屈曲部４２とからなる。   The connection lead 24 is formed by, for example, pressing a metal plate having a certain thickness, and extends in the horizontal direction (arrow B direction), and a set of horizontal portions 38a, 38b, and the horizontal portions 38a, A pair of chip connection portions 40a and 40b projecting so as to be offset vertically downward (arrow A2 direction) with respect to 38b and one end side (arrow B1 direction) of the connection lead 24, and one horizontal The bent portion 42 is bent at a predetermined angle with respect to the portion 38a.

水平部３８ａ、３８ｂは、接続リード２４の長手方向（矢印Ｂ方向）に沿ってそれぞれ所定長さ、且つ、互いに所定間隔離間して形成され、回路基板１６及び半導体チップ１８ａ、１８ｂと略平行に設けられる。   The horizontal portions 38a and 38b are formed with a predetermined length along the longitudinal direction (arrow B direction) of the connection lead 24 and spaced apart from each other by a predetermined distance, and are substantially parallel to the circuit board 16 and the semiconductor chips 18a and 18b. Provided.

チップ接続部４０ａ、４０ｂは、水平部３８ａ、３８ｂと略平行な平面状に形成され、一方のチップ接続部４０ａは、断面略Ｕ字状に形成され水平部３８ａと水平部３８ｂとの間に設けられる。また、他方のチップ接続部４０ｂは、断面略Ｌ字状に形成され水平部３８ｂの他端部側（矢印Ｂ２方向）に設けられる。そして、チップ接続部４０ａ、４０ｂは、各半導体チップ１８ａ、１８ｂの上面に当接した状態で板状半田３６を介して接続される。これにより、接続リード２４のチップ接続部４０ａ、４０ｂと各半導体チップ１８ａ、１８ｂとが電気的に接続された状態となる。   The chip connection portions 40a and 40b are formed in a planar shape substantially parallel to the horizontal portions 38a and 38b, and one chip connection portion 40a is formed in a substantially U-shaped cross section between the horizontal portions 38a and 38b. Provided. The other chip connection portion 40b is formed in a substantially L-shaped cross section and is provided on the other end side (arrow B2 direction) of the horizontal portion 38b. The chip connecting portions 40a and 40b are connected via the plate-like solder 36 in contact with the upper surfaces of the semiconductor chips 18a and 18b. As a result, the chip connecting portions 40a and 40b of the connection lead 24 and the semiconductor chips 18a and 18b are electrically connected.

屈曲部４２は、図３〜図４Ｂに示されるように、例えば、一方の水平部３８ａの端部に対してチップ接続部４０ａ、４０ｂの突出方向（矢印Ａ２方向）に向かって所定角度で折曲して形成され、絶縁部２６側（矢印Ｂ１方向）となるように配置される。そして、接続リード２４は、一組のチップ接続部４０ａ、４０ｂが半導体チップ１８ａ、１８ｂにそれぞれ接続された状態で、屈曲部４２が第１バスバー２０の鉛直壁３０ａに当接する。   As shown in FIGS. 3 to 4B, for example, the bent portion 42 is folded at a predetermined angle toward the protruding direction (arrow A2 direction) of the chip connecting portions 40a and 40b with respect to the end portion of one horizontal portion 38a. It is formed to be bent and arranged to be on the insulating portion 26 side (arrow B1 direction). In the connection lead 24, the bent portion 42 contacts the vertical wall 30 a of the first bus bar 20 in a state where the pair of chip connection portions 40 a and 40 b are connected to the semiconductor chips 18 a and 18 b, respectively.

また、図４Ａ及び図４Ｂに示される第１バスバー２０の鉛直壁３０ａと屈曲部４２とがなす接合角度Ｃは、例えば、３５°〜６０°の範囲内（３５°≦Ｃ≦６０°）となる鋭角に設定される。   Moreover, the joint angle C formed by the vertical wall 30a of the first bus bar 20 and the bent portion 42 shown in FIGS. 4A and 4B is, for example, within a range of 35 ° to 60 ° (35 ° ≦ C ≦ 60 °). Is set to an acute angle.

そして、屈曲部４２と第１バスバー２０の鉛直壁３０ａとの間の空間４４は、下方（矢印Ａ２方向）に向かって徐々に先細となる断面略三角形状に形成され、その内部には溶融した半田Ｈからなる接合部４６が形成される。   A space 44 between the bent portion 42 and the vertical wall 30a of the first bus bar 20 is formed in a substantially triangular shape with a tapered shape that gradually tapers downward (in the direction of arrow A2), and melted therein. A joint 46 made of solder H is formed.

この接合部４６は、空間４４内において第１バスバー２０及び接続リード２４の屈曲部４２に対して接触する断面略三角形状に形成され、半田Ｈを加熱することで溶融させた後に固化させることで前記屈曲部４２と第１バスバー２０とを電気的に接続している。   The joint portion 46 is formed in a substantially triangular shape in cross section in contact with the bent portion 42 of the first bus bar 20 and the connection lead 24 in the space 44, and is solidified after being melted by heating the solder H. The bent portion 42 and the first bus bar 20 are electrically connected.

また、接合部４６には、第１バスバー２０及び接続リード２４に対する接触端部に、該第１バスバー２０及び接続リード２４側に向かってそれぞれ断面円弧状に窪んだフィレット４８ａ、４８ｂが形成される（図４Ａ参照）。   In addition, fillets 48 a and 48 b that are recessed in a circular arc shape toward the first bus bar 20 and the connection lead 24 are formed in the joint 46 at the contact end portions with respect to the first bus bar 20 and the connection lead 24. (See FIG. 4A).

さらに、接合部４６は、図４Ａに示されるように、接触端部の表面に引いた接線と第１バスバー２０及び接続リード２４の表面とのなす角度である濡れ角Ｄ（接触角）が９０°未満、すなわち、鋭角となるように形成される（Ｄ＜９０°）。   Further, as shown in FIG. 4A, the joint 46 has a wetting angle D (contact angle) of 90, which is an angle formed between the tangent line drawn on the surface of the contact end and the surfaces of the first bus bar 20 and the connection lead 24. It is formed to be less than 0 °, that is, an acute angle (D <90 °).

次に、上述した電力変換装置１０における接続リード２４、半導体チップ１８ａ、１８ｂ及び第１バスバー２０等を、半田Ｈ及び板状半田３６を溶融させることで電気的に接続するリフロー工程を行う際に用いられる治具１００について説明する。   Next, when performing the reflow process of electrically connecting the connection leads 24, the semiconductor chips 18a and 18b, the first bus bar 20, and the like in the power conversion apparatus 10 described above by melting the solder H and the plate-like solder 36. The jig 100 used will be described.

この治具１００は、図１及び図３に示されるように、板状のベースプレート（ベース体）１０２と、該ベースプレート１０２の上面に立設した複数の支柱１０４で支持される遮蔽プレート（遮蔽部材）１０６と、前記ベースプレート１０２と前記遮蔽プレート１０６との間に設けられる複数の押圧体１０８と、前記遮蔽プレート１０６の外縁部に設けられた一組の加熱ブロック（加熱手段）１１０とを含む。   As shown in FIGS. 1 and 3, the jig 100 includes a plate-like base plate (base body) 102 and a shielding plate (shielding member) supported by a plurality of support columns 104 erected on the upper surface of the base plate 102. ) 106, a plurality of pressing bodies 108 provided between the base plate 102 and the shielding plate 106, and a set of heating blocks (heating means) 110 provided on the outer edge of the shielding plate 106.

ベースプレート１０２は、例えば、アルミニウム等の金属製材料から板状に形成され、図示しない位置決めピンによって治具１００に対する位置ずれが防止される。   The base plate 102 is formed in a plate shape from, for example, a metal material such as aluminum, and positional displacement with respect to the jig 100 is prevented by a positioning pin (not shown).

また、ベースプレート１０２の上面には、外縁部に複数（例えば、６本）の支柱１０４が互いに等間隔離間し、且つ、該上面に対して直立するように設けられる。なお、この支柱１０４も金属製材料から形成される。   In addition, a plurality of (for example, six) columns 104 are provided on the outer edge of the upper surface of the base plate 102 so as to be spaced apart from each other at an equal interval and upright with respect to the upper surface. In addition, this support | pillar 104 is also formed from a metal material.

遮蔽プレート１０６は、例えば、アルミニウム等の金属製材料から略一定厚さで形成され、その外縁部近傍が支柱１０４によってそれぞれ支持される。これにより、遮蔽プレート１０６は、ベースプレート１０２の上方（矢印Ａ１方向）に所定間隔離間した状態で平行に保持される。なお、このベースプレート１０２と遮蔽プレート１０６との鉛直方向（矢印Ａ方向）に沿った離間距離は、その間に収納される電力変換装置１０の高さ寸法と略同等、若しくは、より大きく設定される。   The shielding plate 106 is formed with a substantially constant thickness from a metal material such as aluminum, for example, and the vicinity of the outer edge thereof is supported by the column 104. As a result, the shielding plate 106 is held in parallel above the base plate 102 (in the direction of arrow A1) while being spaced apart by a predetermined distance. In addition, the separation distance along the vertical direction (arrow A direction) between the base plate 102 and the shielding plate 106 is set to be substantially equal to or larger than the height dimension of the power conversion device 10 accommodated therebetween.

また、遮蔽プレート１０６には、その略中央部に長方形状に開口した開口部１１４が形成され、該開口部１１４は遮蔽プレート１０６の上面と下面とを貫通するように形成されると共に、幅方向に沿って所定長さで形成される。そして、電力変換装置１０が治具１００の内部に載置された際、図３に示されるように、開口部１１４は第１バスバー２０近傍の上方（矢印Ａ１方向）となる位置に形成されている。   Further, the shielding plate 106 is formed with an opening 114 having a rectangular shape at a substantially central portion thereof. The opening 114 is formed so as to penetrate the upper surface and the lower surface of the shielding plate 106, and in the width direction. Are formed with a predetermined length. And when the power converter device 10 is mounted in the jig | tool 100, as FIG. 3 shows, the opening part 114 is formed in the position which becomes the upper direction (arrow A1 direction) of the 1st bus-bar 20 vicinity. Yes.

この遮蔽プレート１０６は、例えば、支柱１０４の上端部に形成されたピン部１１６が挿通可能なピン孔１１８を複数有し、前記ピン孔１１８にピン部１１６を挿入することで支柱１０４によって支持され、反対に、前記支柱１０４から離間させる方向（上方）に持ち上げることで容易に取り外すことができる。そして、ピン孔１１８にピン部１１６が挿入された状態で、該ピン部１１６にナット１１９を螺合させることで遮蔽プレート１０６が支柱１０４に対して固定される。   The shielding plate 106 has, for example, a plurality of pin holes 118 through which the pin portions 116 formed at the upper end portions of the support posts 104 can be inserted, and is supported by the support posts 104 by inserting the pin portions 116 into the pin holes 118. On the contrary, it can be easily removed by lifting it up (in the upward direction) away from the column 104. In a state where the pin portion 116 is inserted into the pin hole 118, the shielding plate 106 is fixed to the support column 104 by screwing the nut 119 into the pin portion 116.

そして、治具１００では、遮蔽プレート１０６の取り外された状態で、ベースプレート１０２の位置決めピン（図示せず）に電力変換装置１０を設置した後、前記遮蔽プレート１０６を再び支柱１０４に対して装着することで、前記治具１００に対して前記電力変換装置１０が装着された状態となる。   In the jig 100, the power conversion device 10 is installed on a positioning pin (not shown) of the base plate 102 with the shielding plate 106 removed, and then the shielding plate 106 is attached to the support 104 again. Thus, the power conversion device 10 is attached to the jig 100.

押圧体１０８は、例えば、ステンレス鋼等の金属製材料から断面長方形状のブロック状に形成され、ベースプレート１０２及び遮蔽プレート１０６とは別体で設けられる。この押圧体１０８は、所定重さを有した錘として用いられ、治具１００の内部に電力変換装置１０が設置された状態で、遮蔽プレート１０６の設置前に接続リード２４における一組のチップ接続部４０ａ、４０ｂの内部に上方から設置することにより、前記チップ接続部４０ａ、４０ｂがそれぞれ下方に設けられた半導体チップ１８ａ、１８ｂ側（矢印Ａ２方向）へと押圧され密着する。この押圧体１０８は、電力変換装置１０におけるチップ接続部４０ａ、４０ｂの形状、数量に応じてそれぞれ複数設けられる。   The pressing body 108 is formed in a block shape having a rectangular cross section from a metal material such as stainless steel, and is provided separately from the base plate 102 and the shielding plate 106. This pressing body 108 is used as a weight having a predetermined weight, and in a state where the power conversion device 10 is installed inside the jig 100, a set of chip connections in the connection lead 24 before the shielding plate 106 is installed. By installing inside the parts 40a and 40b from above, the chip connecting parts 40a and 40b are pressed and adhered to the semiconductor chips 18a and 18b (in the direction of arrow A2) provided below. A plurality of the pressing bodies 108 are provided according to the shape and quantity of the chip connecting portions 40a and 40b in the power conversion device 10, respectively.

なお、この押圧体１０８は、上述したようにベースプレート１０２及び遮蔽プレート１０６と別体で構成される場合に限定されるものではなく、例えば、遮蔽プレート１０６において接続リード２４のチップ接続部４０ａ、４０ｂに臨む位置に一体的に接続して設けるようにしてもよい。この場合には、遮蔽プレート１０６を支柱１０４に対して組み付けるのと同時に、押圧体１０８をチップ接続部４０ａ、４０ｂへとそれぞれ挿入できるため組付工数の削減が可能となる。   The pressing body 108 is not limited to the case where it is configured separately from the base plate 102 and the shielding plate 106 as described above. For example, in the shielding plate 106, the chip connecting portions 40a and 40b of the connection lead 24 are provided. Alternatively, it may be integrally connected to the position facing the surface. In this case, since the pressing body 108 can be inserted into the chip connecting portions 40a and 40b at the same time that the shielding plate 106 is assembled to the support column 104, the number of assembling steps can be reduced.

加熱ブロック１１０は、例えば、熱伝導率の高い金属製材料、又は、カーボンからアーム状に形成され、ケーシング１２の外縁部に設けられ、ベースプレート１０２側に向かって鉛直下方向（矢印Ａ２方向）に延在し、その先端部には該鉛直方向と直交する水平方向（矢印Ｂ１、Ｂ２方向）に折曲した加熱部１２０を有する。この加熱部１２０は、平面状に形成され鉛直面である接触面１２２を有し、電力変換装置１０における第１バスバー２０の鉛直壁３０ａ、３０ｂに当接可能に設けられる。また、加熱ブロック１１０は、図示しない熱源から照射される赤外線によって所定温度に加熱され、接触面１２２で接触している第１バスバー２０を加熱する。   The heating block 110 is formed in an arm shape from, for example, a metal material having high thermal conductivity or carbon, and is provided on the outer edge portion of the casing 12, and vertically downward (arrow A2 direction) toward the base plate 102 side. It has a heating part 120 that extends and is bent in the horizontal direction (arrow B1, B2 direction) perpendicular to the vertical direction. This heating unit 120 has a contact surface 122 that is a flat surface and is a vertical surface, and is provided so as to be able to contact the vertical walls 30 a and 30 b of the first bus bar 20 in the power conversion device 10. The heating block 110 is heated to a predetermined temperature by infrared rays irradiated from a heat source (not shown), and heats the first bus bar 20 that is in contact with the contact surface 122.

本発明の実施の形態に係る治具１００及び該治具１００を用いて製造される電力変換装置１０は、基本的には以上のように構成されるものであり、前記治具１００を用いて電力変換装置１０のリフロー工程を行う場合について説明する。   The jig 100 according to the embodiment of the present invention and the power conversion device 10 manufactured using the jig 100 are basically configured as described above. The case where the reflow process of the power converter device 10 is performed is demonstrated.

先ず、電力変換装置１０のリフロー工程を行う連続炉１５０について簡単に説明する。この連続炉１５０は、図３に示されるように、ワークとなる電力変換装置１０及び治具１００を水平方向に搬送可能な搬送路１５２と、該搬送路１５２に沿って互いに所定間隔離間するように上方及び下方に設けられた一組の第１及び第２ヒータ１５４、１５６とを備える。   First, the continuous furnace 150 which performs the reflow process of the power converter device 10 is demonstrated easily. As shown in FIG. 3, the continuous furnace 150 is configured so that the power conversion device 10 and the jig 100 that are workpieces can be transported in the horizontal direction, and are spaced apart from each other by a predetermined distance along the transport path 152. And a pair of first and second heaters 154 and 156 provided above and below.

次に、この連続炉１５０でリフロー工程を行うために、電力変換装置１０を治具１００に装着する場合について説明する。なお、この電力変換装置１０では、予め接続リード２４が所定位置に配置され、その屈曲部４２と第１バスバー２０との間に円柱状の半田Ｈが載置され（図４Ｂ参照）、一方、半導体チップ１８ａ、１８ｂが板状半田３６を介して回路基板１６上に配置され、該半導体チップ１８ａ、１８ｂの上方に板状半田３６を介して前記接続リード２４のチップ接続部４０ａ、４０ｂが当接した状態にある。   Next, the case where the power converter 10 is mounted on the jig 100 in order to perform the reflow process in the continuous furnace 150 will be described. In the power conversion device 10, the connection lead 24 is previously disposed at a predetermined position, and the columnar solder H is placed between the bent portion 42 and the first bus bar 20 (see FIG. 4B). The semiconductor chips 18a and 18b are disposed on the circuit board 16 via the plate-like solder 36, and the chip connecting portions 40a and 40b of the connection lead 24 are placed above the semiconductor chips 18a and 18b via the plate-like solder 36. In contact.

先ず、ベースプレート１０２及び支柱１０４から遮蔽プレート１０６を上方へと取り外した状態とし、ヒートシンク１４側が下方となるように電力変換装置１０を前記ベースプレート１０２の上方から接近させ、該ヒートシンク１４を該ベースプレート１０２の位置決めピンを基準に設置する。この位置決めピンに挿入されることで電力変換装置１０がベースプレート１０２に対して水平方向（矢印Ｂ方向）に移動してしまうことがなく一体的に保持される。   First, the shielding plate 106 is removed upward from the base plate 102 and the column 104, the power converter 10 is approached from above the base plate 102 so that the heat sink 14 side is downward, and the heat sink 14 is attached to the base plate 102. Install using the positioning pin as a reference. By being inserted into the positioning pin, the power conversion device 10 is integrally held without moving in the horizontal direction (arrow B direction) with respect to the base plate 102.

そして、接続リード２４のチップ接続部４０ａ、４０ｂに対してそれぞれ上方から押圧体１０８を挿入する。これにより、各押圧体１０８によってチップ接続部４０ａ、４０ｂが半導体チップ１８ａ、１８ｂ側（矢印Ａ２方向）へと押圧され、板状半田３６を介して該半導体チップ１８ａ、１８ｂにそれぞれ密着する。   Then, the pressing body 108 is inserted into the chip connection portions 40a and 40b of the connection lead 24 from above. As a result, the chip connecting portions 40a and 40b are pressed toward the semiconductor chips 18a and 18b (in the direction of the arrow A2) by the pressing bodies 108, and are in close contact with the semiconductor chips 18a and 18b via the plate-like solder 36, respectively.

次に、ベースプレート１０２に設置された電力変換装置１０の上方を覆うように遮蔽プレート１０６を配置し、そのピン孔１１８に支柱１０４のピン部１１６をそれぞれ挿通させた後、ナット１１９を螺合させ固定する。これにより、遮蔽プレート１０６が、ベースプレート１０２と略平行に電力変換装置１０の上方（矢印Ａ１方向）に配置され、その開口部１１４が第１バスバー２０及びケーシング１２の絶縁部２６に臨む位置に固定される（図３参照）。また、加熱ブロック１１０の加熱部１２０を、第１バスバー２０における鉛直壁３０ａ、３０ｂに当接させる。詳細には、加熱部１２０の接触面１２２が、第１バスバー２０の鉛直壁３０ａ、３０ｂに対してそれぞれ面接触している。   Next, the shielding plate 106 is disposed so as to cover the power converter 10 installed on the base plate 102, and the pin portion 116 of the column 104 is inserted into the pin hole 118, and then the nut 119 is screwed. Fix it. Thereby, the shielding plate 106 is disposed above the power converter 10 (in the direction of arrow A1) substantially parallel to the base plate 102, and the opening 114 is fixed at a position facing the first bus bar 20 and the insulating portion 26 of the casing 12. (See FIG. 3). Further, the heating unit 120 of the heating block 110 is brought into contact with the vertical walls 30 a and 30 b in the first bus bar 20. Specifically, the contact surface 122 of the heating unit 120 is in surface contact with the vertical walls 30 a and 30 b of the first bus bar 20.

このように治具１００の内部に電力変換装置１０が収納され保持された状態で、前記治具１００を連続炉１５０の搬送路１５２に沿って搬送することで、前記治具１００及び電力変換装置１０が搬送路１５２に沿って水平移動し、その上方及び下方に設置された第１及び第２ヒータ１５４、１５６によって加熱されると共に、遮蔽プレート１０６の開口部１１４を通じて前記第１ヒータ１５４からの熱が第１バスバー２０近傍に直接付与されることで加熱される。   Thus, the jig 100 and the power conversion device are conveyed by conveying the jig 100 along the conveyance path 152 of the continuous furnace 150 in a state where the power conversion device 10 is accommodated and held in the jig 100. 10 moves horizontally along the conveyance path 152 and is heated by the first and second heaters 154 and 156 installed above and below the conveyance path 152, and from the first heater 154 through the opening 114 of the shielding plate 106. Heat is applied by applying heat directly to the vicinity of the first bus bar 20.

一方、電力変換装置１０における第１バスバー２０近傍以外の部位は、遮蔽プレート１０６によって覆われているため、第１ヒータ１５４からの熱が遮蔽され樹脂製材料からなるケーシング１２が加熱されてしまうことが防止され、該ケーシング１２の温度上昇が抑制される。   On the other hand, since portions other than the vicinity of the first bus bar 20 in the power conversion device 10 are covered with the shielding plate 106, the heat from the first heater 154 is shielded and the casing 12 made of a resin material is heated. Is prevented, and the temperature rise of the casing 12 is suppressed.

また、第１バスバー２０は、第１ヒータ１５４からの熱に加え、図示しない熱源からの熱によって昇温している加熱ブロック１１０の接触作用下に加熱されてさらに昇温する。この第１バスバー２０は、接合される接続リード２４と比較して樹脂製材料にモールドされているため温度が上昇しにくく、第１及び第２ヒータ１５４、１５６によって前記接続リード２４と均等に加熱した場合、前記第１バスバー２０と接続リード２４との加熱状況が異なり、温度差が生じることとなる。   In addition to the heat from the first heater 154, the first bus bar 20 is heated under the contact action of the heating block 110 that has been heated by heat from a heat source (not shown), and the temperature is further increased. Since the first bus bar 20 is molded in a resin material as compared with the connection lead 24 to be joined, the temperature does not easily rise, and the first bus bar 20 is heated evenly with the connection lead 24 by the first and second heaters 154 and 156. In this case, the heating conditions of the first bus bar 20 and the connection lead 24 are different, resulting in a temperature difference.

その結果、両者の温度が異なることで空間４４内に載置された半田Ｈの溶融状態が均等とならず、温度の高い接続リード２４側が溶けやすいため流動した半田Ｈの多くが前記接続リード２４側へ移動してしまい、両者を均等に接合することができない。   As a result, since the temperatures of the two are different, the molten state of the solder H placed in the space 44 is not uniform, and the high-temperature connection lead 24 side is easily melted, so that most of the solder H that has flowed flows. It moves to the side and cannot join both equally.

詳細には、この半田Ｈが固化した接合部４６では、第１バスバー２０側の濡れ角Ｄが鈍角となってしまい、しかも、フィレット４８ａ、４８ｂが形成されないこととなり、その接合状態を目視で確認することが困難となる。   Specifically, in the joint portion 46 where the solder H is solidified, the wetting angle D on the first bus bar 20 side becomes an obtuse angle, and the fillets 48a and 48b are not formed, and the joining state is visually confirmed. Difficult to do.

そのため、接続リード２４と比較して温度上昇のしにくい第１バスバー２０を加熱ブロック１１０による熱を加えて積極的に加熱することで、前記接続リード２４との間の温度差を抑制して空間４４内における半田Ｈを前記第１バスバー２０側、接続リード２４側で均等に溶融させることが可能となるため、それぞれフィレット４８ａ、４８ｂの形成された接合部４６を形成できると共に、第１バスバー２０側の濡れ角Ｄ、接続リード２４側の濡れ角Ｄをそれぞれ鋭角とすることができる。   Therefore, the first bus bar 20, which is less likely to rise in temperature than the connection lead 24, is positively heated by applying heat from the heating block 110, thereby suppressing the temperature difference between the connection lead 24 and the space. Since the solder H in 44 can be uniformly melted on the first bus bar 20 side and the connection lead 24 side, the joint portions 46 formed with the fillets 48a and 48b can be formed, respectively, and the first bus bar 20 can be formed. The wetting angle D on the side and the wetting angle D on the connection lead 24 side can each be an acute angle.

すなわち、第１バスバー２０と接続リード２４とが略同一の温度となるように加熱させることで、第１バスバー２０と接続リード２４との接合を確実に行うことが可能となり、しかも、両方にそれぞれフィレット４８ａ、４８ｂを形成し、接合状態を目視で確認することができる。   That is, the first bus bar 20 and the connection lead 24 are heated so as to have substantially the same temperature, so that the first bus bar 20 and the connection lead 24 can be reliably bonded to each other. Fillets 48a and 48b can be formed, and the joining state can be visually confirmed.

最後に、ワークとなる治具１００及び電力変換装置１０が搬送路１５２に沿って連続炉１５０の外部へと搬送されることで、徐々に冷却されていき、溶融していた半田Ｈ及び板状半田３６が徐々に固化し始め、前記半田Ｈが固化して形成された接合部４６によって第１バスバー２０と接続リード２４の屈曲部４２とが接合され電気的に接続された状態になると共に、板状半田３６の固化によって半導体チップ１８ａ、１８ｂが回路基板１６及び接続リード２４のチップ接続部４０ａ、４０ｂに対してそれぞれ電気的に接続される。   Finally, the jig 100 and the power conversion device 10 that are workpieces are conveyed along the conveyance path 152 to the outside of the continuous furnace 150, so that they are gradually cooled and melted in the solder H and the plate shape. The solder 36 begins to solidify gradually, and the first bus bar 20 and the bent portion 42 of the connection lead 24 are joined and electrically connected by the joint 46 formed by solidifying the solder H, and By solidifying the plate-like solder 36, the semiconductor chips 18a and 18b are electrically connected to the circuit board 16 and the chip connection portions 40a and 40b of the connection leads 24, respectively.

そして、上述したように連続炉１５０から搬出され各部位が電気的に接続された後に、遮蔽プレート１０６を再び上方へと取り外し、電力変換装置１０をベースプレート１０２から取り出すことでリフロー工程が終了する。   And as above-mentioned, after carrying out from the continuous furnace 150 and each site | part being electrically connected, the shielding plate 106 is removed upwards again, and the reflow process is complete | finished by taking out the power converter device 10 from the baseplate 102. FIG.

以上のように、本実施の形態では、電力変換装置１０を構成する第１バスバー２０、接続リード２４及び半導体チップ１８ａ、１８ｂ等を半田Ｈ、板状半田３６によって接続するリフロー工程において、前記第１バスバー２０の鉛直壁３０ａと接続リード２４の屈曲部４２との間に半田Ｈを載置した状態で治具１００に装着し、連続炉１５０の搬送路１５２に沿って搬送することで、上方の第１ヒータ１５４からの熱が遮蔽プレート１０６の開口部１１４を通じて前記第１バスバー２０近傍に付与されるため、樹脂製材料からなるケーシング１２にモールドされた該第１バスバー２０を積極的に昇温させることが可能となり、それに伴って、接続リード２４との間の温度差を抑制して均等とすることができる。   As described above, in the present embodiment, in the reflow process in which the first bus bar 20, the connection lead 24, the semiconductor chips 18 a and 18 b and the like constituting the power conversion device 10 are connected by the solder H and the plate-like solder 36, 1 is mounted on the jig 100 in a state where the solder H is placed between the vertical wall 30a of the bus bar 20 and the bent portion 42 of the connection lead 24, and is transported along the transport path 152 of the continuous furnace 150. Since the heat from the first heater 154 is applied to the vicinity of the first bus bar 20 through the opening 114 of the shielding plate 106, the first bus bar 20 molded in the casing 12 made of a resin material is actively raised. Accordingly, the temperature difference between the connecting lead 24 and the connecting lead 24 can be suppressed and uniform.

そのため、略同一の温度に加熱された第１バスバー２０及び接続リード２４によって半田Ｈを均等に溶融させて接合できると共に、該半田Ｈによって形成された接合部４６における第１バスバー２０側及び接続リード２４側の濡れ角Ｄをそれぞれ鋭角とすることが可能となり、しかも、第１バスバー２０及び接続リード２４に対してフィレット４８ａ、４８ｂを形成することができる。その結果、第１バスバー２０と接続リード２４とを確実に接合して電気的に接続しつつ、その接合状態を作業者が目視によって容易且つ確実に確認することが可能となる。   Therefore, the solder H can be evenly melted and joined by the first bus bar 20 and the connection lead 24 heated to substantially the same temperature, and the first bus bar 20 side and the connection lead in the joint 46 formed by the solder H can be joined. The wetting angle D on the 24 side can be made acute, and the fillets 48 a and 48 b can be formed on the first bus bar 20 and the connection lead 24. As a result, the first bus bar 20 and the connection lead 24 can be reliably joined and electrically connected, and the joined state can be easily and reliably confirmed by an operator visually.

また、電力変換装置１０を構成する接続リード２４に屈曲部４２を設け、該屈曲部４２を、鉛直方向（矢印Ａ方向）に延在する前記第１バスバー２０の鉛直壁３０ａに臨むように配置し、前記屈曲部４２と前記鉛直壁３０ａとがなす断面略三角形状の空間４４に配置された半田Ｈを溶融させることで第１バスバー２０と接続リード２４とを接合して電気的に接続している。   Further, a bent portion 42 is provided in the connection lead 24 constituting the power conversion device 10, and the bent portion 42 is disposed so as to face the vertical wall 30a of the first bus bar 20 extending in the vertical direction (arrow A direction). Then, the first bus bar 20 and the connection lead 24 are joined and electrically connected by melting the solder H disposed in the space 44 having a substantially triangular cross section formed by the bent portion 42 and the vertical wall 30a. ing.

そのため、例えば、第１バスバー２０や接続リード２４に寸法ばらつきが生じ、屈曲部４２が水平方向（矢印Ｂ方向）に位置ずれし、前記第１バスバー２０と前記接続リード２４との間の間隙が変化した場合でも、空間４４内で溶融される半田Ｈによって寸法ばらつきを好適に吸収して前記第１バスバー２０と接続リード２４とを確実に接合することができ、一方、前記寸法ばらつきによって第１バスバー２０と接続リード２４とが鉛直方向（矢印Ａ方向）に位置ずれした場合には、鉛直壁３０ａが鉛直方向に延在しているため、前記第１バスバー２０と前記接続リード２４との離間距離が変化することがなく、半田Ｈによって該第１バスバー２０と接続リード２４とを確実に接合することができる。すなわち、第１バスバー２０及び接続リード２４が寸法ばらつきに起因して位置ずれした場合でも、水平方向（矢印Ｂ方向）及び鉛直方向（矢印Ａ方向）のいずれの寸法ばらつきにも容易に対応して確実に接合することが可能となる。   Therefore, for example, dimensional variations occur in the first bus bar 20 and the connection lead 24, the bent portion 42 is displaced in the horizontal direction (arrow B direction), and the gap between the first bus bar 20 and the connection lead 24 is increased. Even if it changes, the first bus bar 20 and the connection lead 24 can be reliably joined by suitably absorbing the dimensional variation by the solder H melted in the space 44, while the first variation due to the dimensional variation. When the bus bar 20 and the connection lead 24 are displaced in the vertical direction (arrow A direction), the vertical wall 30a extends in the vertical direction, so that the first bus bar 20 and the connection lead 24 are separated from each other. The distance does not change, and the first bus bar 20 and the connection lead 24 can be reliably joined by the solder H. In other words, even when the first bus bar 20 and the connecting lead 24 are displaced due to the dimensional variation, it can easily cope with any dimensional variation in the horizontal direction (arrow B direction) and the vertical direction (arrow A direction). It becomes possible to join reliably.

さらに、第１及び第２ヒータ１５４、１５６によって電力変換装置１０を加熱するのと同時に、加熱ブロック１１０によって第１バスバー２０をさらに加熱できるため、樹脂製材料からなるケーシング１２にモールドされ温まりにくく、しかも、前記第１ヒータ１５４と直交するように鉛直方向（矢印Ａ方向）に配置された第１バスバー２０の鉛直壁３０ｂを好適に加熱することが可能となる。その結果、互いに接合される第１バスバー２０及び接続リード２４を均等に加熱して、半田Ｈを溶融させることができるため、均等に濡れ広がった半田Ｈによって両者を均等に接合することができ、その濡れ角Ｄを鋭角にできると共に、両者に対するフィレット４８ａ、４８ｂを形成することが可能となる。   Furthermore, since the first bus bar 20 can be further heated by the heating block 110 at the same time as the power converter 10 is heated by the first and second heaters 154 and 156, it is hard to be molded and molded in the casing 12 made of a resin material, In addition, the vertical wall 30b of the first bus bar 20 arranged in the vertical direction (arrow A direction) so as to be orthogonal to the first heater 154 can be suitably heated. As a result, the first bus bar 20 and the connection lead 24 that are joined to each other can be evenly heated to melt the solder H, so that both can be evenly joined by the solder H that has spread evenly, The wetting angle D can be made an acute angle, and the fillets 48a and 48b for both can be formed.

その結果、フィレット４８ａ、４８ｂを有した接合部４６によって第１バスバー２０と接続リード２４との接合状態を、作業者が目視によって容易且つ確実に確認することができる。   As a result, the operator can easily and reliably confirm the joining state of the first bus bar 20 and the connection lead 24 by the joining portion 46 having the fillets 48a and 48b.

さらにまた、電力変換装置１０を構成する接続リード２４のチップ接続部４０ａ、４０ｂには、その上方から内部に押圧体１０８が挿入され、この錘として機能する押圧体１０８によって前記チップ接続部４０ａ、４０ｂが半導体チップ１８ａ、１８ｂ側へと好適に押圧される。その結果、リフロー工程において、押圧体１０８を各チップ接続部４０ａ、４０ｂに挿入するという簡単な作業で、前記チップ接続部４０ａ、４０ｂを半導体チップ１８ａ、１８ｂの上面に密着させ、その間に塗布された板状半田３６が溶融することで前記チップ接続部４０ａ、４０ｂと半導体チップ１８ａ、１８ｂとを確実に接合して電気的に接続することが可能となる。   Furthermore, a pressing body 108 is inserted into the chip connection portions 40a, 40b of the connection lead 24 constituting the power conversion device 10 from above, and the chip connection portions 40a, 40b, 40b is suitably pressed toward the semiconductor chips 18a and 18b. As a result, in the reflow process, the chip connecting portions 40a and 40b are brought into close contact with the upper surfaces of the semiconductor chips 18a and 18b by a simple operation of inserting the pressing body 108 into the chip connecting portions 40a and 40b, and applied between them. When the plate-like solder 36 is melted, the chip connecting portions 40a and 40b and the semiconductor chips 18a and 18b can be reliably joined and electrically connected.

なお、本発明に係る電力変換装置１０の製造方法及びそれに用いられる治具は、上述の実施の形態に限らず、本発明の要旨を逸脱することなく、種々の構成を採り得ることはもちろんである。   In addition, the manufacturing method of the power converter device 10 concerning this invention and the jig | tool used for it are not restricted to the above-mentioned embodiment, Of course, it can take various structures, without deviating from the summary of this invention. is there.

１０…電力変換装置 １２…ケーシング
１４…ヒートシンク １８ａ、１８ｂ…半導体チップ
２０…第１バスバー ２２…第２バスバー
２４…接続リード ３０ａ、３０ｂ…鉛直壁
３８ａ、３８ｂ…水平部 ４０ａ、４０ｂ…チップ接続部
４２…屈曲部 ４６…接合部
１００…治具 １０２…ベースプレート
１０６…遮蔽プレート １０８…押圧体
１１０…加熱ブロック １１４…開口部
１２０…加熱部 １５０…連続炉
１５４…第１ヒータ １５６…第２ヒータ DESCRIPTION OF SYMBOLS 10 ... Power converter 12 ... Casing 14 ... Heat sink 18a, 18b ... Semiconductor chip 20 ... 1st bus bar 22 ... 2nd bus bar 24 ... Connection lead 30a, 30b ... Vertical wall 38a, 38b ... Horizontal part 40a, 40b ... Chip connection part 42 ... Bending part 46 ... Joining part 100 ... Jig 102 ... Base plate 106 ... Shielding plate 108 ... Pressing body 110 ... Heating block 114 ... Opening part 120 ... Heating part 150 ... Continuous furnace 154 ... First heater 156 ... Second heater

Claims (2)

ケーシングにモールドされたバスバーに一端部が接続され、他端部が半導体素子に接続されるリードを有し、該リードを通じて前記バスバーから前記半導体素子の電極へと電力供給を行う電力変換装置の製造方法であって、
前記電力変換装置は、前記リードの一端部に、前記バスバーに対して当接又は所定間隔離間し、鉛直下方向に所定角度傾斜した屈曲部を有し、
前記屈曲部に臨んで鉛直方向に延在する前記バスバーの鉛直壁と該屈曲部との間に載置された半田を加熱し、前記鉛直壁と前記屈曲部とを互いに前記半田によって接合する接合工程を有し、前記接合工程において、前記バスバーに加熱手段を当接させ加熱した状態で前記ケーシングを保持する治具が用いられ、
前記治具は、前記半導体素子に当接する前記リードのチップ接続部を押圧し、該リードを位置決めして固定する押圧体を有し、
前記接合工程を行う前に、前記電力変換装置を構成するヒートシンクに対して前記ケーシングを載置すると共に前記半田を介して載置する工程と、
基板に対して前記半田を介して複数の半導体素子を配置する工程と、
前記複数の半導体素子を前記リードによって互いに接続する工程と、
前記押圧体によって前記チップ接続部を押圧する工程と、
を有することを特徴とする電力変換装置の製造方法。 Manufacturing of a power conversion device having one end connected to a bus bar molded in a casing and the other end connected to a semiconductor element, and supplying power from the bus bar to the electrode of the semiconductor element through the lead A method,
The power conversion device has a bent portion that is in contact with or spaced apart from the bus bar at one end of the lead and is inclined at a predetermined angle in the vertical downward direction.
A joint that heats the solder placed between the bent wall and the vertical wall of the bus bar that extends in the vertical direction facing the bent portion, and joins the vertical wall and the bent portion to each other by the solder. have a step in the joining step, a jig for holding the casing in a state of being heated by contact with the heating means to said bus bar is used,
The jig includes a pressing body that presses the chip connecting portion of the lead that contacts the semiconductor element, and positions and fixes the lead.
Before performing the joining step, placing the casing on the heat sink constituting the power conversion device and placing the casing via the solder;
Placing a plurality of semiconductor elements on the substrate via the solder;
Connecting the plurality of semiconductor elements to each other by the leads;
Pressing the chip connecting portion with the pressing body; and
Method of manufacturing a power converter according to claim Rukoto to have a. ケーシングにモールドされたバスバーに一端部が接続され、他端部が半導体素子に接続されるリードを有し、該リードを通じて前記バスバーから前記半導体素子の電極へと電力供給を行う電力変換装置の製造に用いられる治具であって、
前記バスバーは鉛直方向に延在する鉛直壁を有し、前記リードの一端部には前記鉛直壁に対して所定間隔離間し、鉛直下方向に所定角度傾斜した屈曲部を有し、前記鉛直壁と前記屈曲部とが半田によって互いに接合された接合部が形成され、
前記治具は、前記ケーシングの載置されるベース体と、
前記ベース体に対して離間し、前記電力変換装置の上方を覆う遮蔽部材と、
前記バスバーに当接し加熱する加熱手段と、
を備え、
前記遮蔽部材には、少なくとも前記接合部に臨む位置に開口部が形成され、該開口部を通じて前記接合部近傍が加熱され、前記半導体素子に当接する前記リードのチップ接続部を該半導体素子側に向かって押圧する押圧体を備えることを特徴とする電力変換装置の製造に用いられる治具。 Manufacturing of a power conversion device having one end connected to a bus bar molded in a casing and the other end connected to a semiconductor element, and supplying power from the bus bar to the electrode of the semiconductor element through the lead A jig used for
The bus bar has a vertical wall extending in a vertical direction, and one end of the lead has a bent portion that is spaced apart from the vertical wall by a predetermined distance and is inclined at a predetermined angle in the vertical downward direction. And a bent portion is formed by joining the bent portion with solder,
The jig includes a base body on which the casing is placed;
A shielding member that is spaced apart from the base body and covers the power converter;
Heating means for contacting and heating the bus bar;
With
The shielding member is formed with an opening at a position facing at least the bonding portion, and the vicinity of the bonding portion is heated through the opening so that the chip connecting portion of the lead that contacts the semiconductor element faces the semiconductor element side. jig used for manufacturing a power converter according to claim Rukoto a pressing member that presses against.
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