JP6125958B2 - Conductor deposition film for film capacitors - Google Patents

Description

  The present invention relates to a conductor vapor-deposited film for a film capacitor.

  Conventionally, a film capacitor has been used for a filter element of an in-vehicle audio. The film capacitor is, for example, used by laminating two layers of a conductor vapor-deposited film in which a conductor is vapor-deposited on one side of a dielectric film. One of the positive and negative poles is connected to one vapor-deposited surface, and the other is vapor-deposited. Connect the remaining poles to the surface.

  It is known that a conductor vapor-deposited film can provide a self-security function by dividing a conductor region into a plurality of segments and connecting adjacent segments with conductor fuses. When the dielectric film includes a defective portion (such as a defective portion or a thin portion), dielectric breakdown occurs in the segment including the defective portion (defect segment), and current is concentrated. At this time, the current flowing through the defective segment flows into the adjacent segment through the fuse. When a large current flows into the fuse, the fuse is melted and scattered by Joule heat. As a result, the defective segment is separated from the adjacent segment, and the dielectric breakdown can be stopped.

  A segment is divided | segmented by the non-deposition slit which is a non-deposition area | region. For example, in Patent Document 1, as shown in FIG. 4, the non-evaporation slit 100 is constituted by a first corrugated curve pattern 100A and a second corrugated curve pattern 100B obtained by inverting the first corrugated curve pattern 100A. In addition, a conductor is deposited on a part of the corrugated curve patterns 100 </ b> A and 100 </ b> B to form the fuse portion 102. Further, the narrow portion 104 is provided with a fuse function by making the separation distance d of the narrow portion 104 approaching the corrugated curve patterns 100A and 100B equal to the separation distance d of the fuse portion.

JP 2012-99747 A

  By the way, as shown in FIG. 4, the width W where the separation distance of the fuse portion 102 provided in the corrugated curve pattern 100 is d may be different from the length L where the separation distance of the narrow portion 104 is d. is there. That is, in consideration of the fact that the corrugated curve patterns 100A and 100B are both curved, the separation distance of the narrow portion 104 is d only in principle, and the separation distance is kept at d by a predetermined length. It becomes difficult. In other words, the length L at which the distance between the narrow portions is d is shorter than the width W of the fuse portion 102. Even if a very short section of the narrow portion 104 is heated by Joule heat, heat escapes to the periphery, so that the conductor is less likely to melt and scatter in the narrow portion 104 than in the fuse portion 102. As a result, defect segment separation may not be delayed or performed, making it difficult to stop dielectric breakdown.

  The present invention relates to a conductor vapor-deposited film for a film capacitor in which a plurality of conductor vapor-deposited segments defined by non-vapor-deposited slits are formed on a dielectric film. The non-evaporation slit includes a first corrugated curve pattern extending in the width direction of the dielectric film, and a second corrugated slit in which the first corrugated curve pattern is inverted in the longitudinal direction of the dielectric film. A corrugated curve pattern is formed by being alternately provided in the longitudinal direction of the dielectric film, and the first and second corrugated curve patterns are interrupted by a plurality of fuse portions on which a conductor is deposited, respectively. The plurality of fuse portions are formed such that the widthwise lengths of the corrugated curve patterns in the region where the separation distance that interrupts the first and second corrugated curve patterns is the same, respectively. The first and second corrugated curve patterns are formed such that a peak portion of one pattern and a valley portion of the other pattern overlap.

  In the above invention, each of the plurality of fuse portions is formed such that a separation distance for interrupting the first and second corrugated curve patterns is the same across the width direction of the corrugated curve pattern. It is suitable.

  In the above invention, the first and second corrugated curve patterns are divided into an upward convex arc and a downward convex arc with the fuse portion as a boundary. The radius of curvature of the convex arc on the downward convex arc and the second corrugated curve pattern is below the convex arc on the first corrugated curve pattern and the second corrugated curve pattern. It is preferable that it is 85% or more and 115% or less of the radius of curvature of the convex arc.

  According to the present invention, defect segments can be more reliably separated than in the past.

It is a figure which illustrates the conductor vapor deposition film which concerns on this embodiment. It is a perspective view which illustrates the film capacitor using the conductor vapor deposition film concerning this embodiment. It is a figure explaining the pattern shape of the conductor vapor deposition film which concerns on this embodiment. It is a figure explaining the conductor vapor deposition film which concerns on a prior art.

  In FIG. 1, the conductor vapor deposition film 10 which concerns on this embodiment is illustrated. In this figure, a plan view is shown in the upper stage, and a side view is shown in the lower stage. The conductor vapor-deposited film 10 includes a dielectric film 12, on which a conductor vapor-deposited segment 14, a non-deposition slit 16, a metallicon connection portion 18, and a non-deposition margin 20 are formed.

  The dielectric film 12 is a sheet-like member formed from a dielectric material. Further, as will be described later, the dielectric film 12 is preferably made of a material having flexibility since the conductor vapor-deposited film 10 is wound up during the production of the film capacitor. For example, the dielectric film 12 is formed from a resin material such as polypropylene.

  The metallicon connection portion 18 is a conductor vapor deposition region provided at one end in the width direction of the dielectric film 12. Metallicon connection 18 is provided across the longitudinal direction of dielectric film 12. As shown in the lower part of FIG. 1, the metallicon connection portion 18 may be formed to have a thickness greater than that of the conductor vapor deposition segment 14. The conductor constituting the metallicon connection portion 18 may be a metal material such as aluminum.

  The non-deposition margin 20 is a non-deposition region provided at the other end in the width direction of the dielectric film 12. The non-deposition margin 20 is provided over the longitudinal direction of the dielectric film 12 as in the metallicon connection portion 18.

  As shown in FIG. 2, the film capacitor 22 is formed by laminating the conductor vapor-deposited film 10. At this time, it is preferable that the arrangement of the metallicon connection portion 18 and the non-deposition margin 20 is switched between the conductive vapor deposition film 10A of one layer and the conductive vapor deposition film 10B of the other layer. The laminated conductor vapor-deposited films 10A and 10B are wound into a cylindrical shape, and metallicon (metal spray) is applied to both side surfaces thereof. As a result, the metallicon metal film on one side is electrically connected to the metallicon connection part 18 on one layer, and the metallicon metal film on the other side is electrically connected to the metallicon connection part 18 on the other layer. Furthermore, one of the positive and negative electrodes is connected to one metallicon metal film, and the remaining pole is connected to the other.

  Returning to FIG. 1, the conductor vapor-deposited segment 14 is a conductor vapor-deposited region formed between the metallicon connection 18 and the non-deposition margin 20. The conductor is continuously deposited on the metallicon connection 18 so that the conductor vapor deposition segment 14 is electrically connected to the metallicon connection 18. The conductor constituting the conductor vapor deposition segment 14 may be the same material as the metallicon connection 18 or may be a metal material such as aluminum.

  The non-evaporation slit 16 defines each conductor vapor deposition segment 14. The non-evaporation slit 16 is a non-evaporation part formed on the dielectric film 12. The non-evaporation slit 16 is formed such that the first wavy curve pattern 24 </ b> A and the second wavy curve pattern 24 </ b> B are alternately provided along the longitudinal direction of the dielectric film 12.

  The first corrugated curve pattern 24 </ b> A extends in the width direction of the dielectric film 12. The first corrugated curve pattern 24 </ b> A may have a shape in which arcs are alternately arranged in the width direction of the dielectric film 12 or may be a sine wave shape. The first corrugated curve pattern 24 </ b> A may extend from the metallicon connection 18 to the non-deposition margin 20. The second corrugated curve pattern 24 </ b> B has a shape obtained by inverting the first corrugated curve pattern 24 </ b> A in the longitudinal direction of the dielectric film 12.

  By forming the non-evaporation slit 16 in a curved shape, the contour of the conductor deposition segment 14 becomes a curved shape. When the conductor vapor-deposited segment 14 is formed in a rectangular shape, the current flowing through the corners is less than that in the central portion, resulting in uneven current distribution, but by forming the conductor vapor-deposited segment 14 in a curved shape, Such bias in current distribution can be improved.

  Further, as shown in FIG. 3, the shapes of the first and second corrugated curve patterns 24A and 24B may be finely adjusted. Taking the first corrugated curve pattern 24A as an example, a curvature radius R1 of an upwardly convex arc and a curvature radius R2 of an upwardly convex arc as viewed from the paper surface with the fuse portion 26 as a boundary. The radius may be changed. For example, the curvature radius R2 of the downward convex arc may be 85% or more and 115% or less of the curvature radius R1 of the upward convex arc. On the contrary, the curvature radius R1 of the upward convex arc may be 85% or more and 115% or less of the curvature radius R2 of the downward convex arc. At this time, the first waveform curve pattern 24A in which the radius of curvature is changed may be inverted to form the second waveform curve pattern 24B.

  As a result of experiments by the inventors, it has been found that even if the radius of curvature of the arc is changed within the above range, the self-security function of the film capacitor 22 is equivalent to the case where the radius of curvature is not changed. Thus, by finely adjusting the curvature radius, when the width dimension of the dielectric film 12 is changed, it is possible to finely adjust the corrugated curve pattern according to the change, and the degree of freedom in design is improved.

  The first and second corrugated curve patterns 24A and 24B are interrupted by a plurality of fuse portions 26 each having a conductor deposited thereon. The fuse portion 26 may be provided at an intermediate position between the crest and trough portions of the corrugated curve patterns 24A and 24B. 1-3, two fuse parts 26A and 26B are provided in the first corrugated curve pattern 24A, and two fuse parts 26C and 26D are provided in the second corrugated curve pattern 24B.

  In the fuse portions 26A to 26D, the length of the corrugated curve pattern in the width direction W of the region having the minimum separation distance d among the separation distances that interrupt the first and second corrugated curve patterns 24A and 24B is respectively It is formed to be equal. For example, each of the fuse portions 26A to 26D is preferably formed so that the separation distance d is the same over the width direction W of the corrugated curve pattern.

  By doing so, the width set as the minimum separation distance is equal in any fuse part 26A to 26D, the current flow is difficult, in other words, the heating tendency of the fuse part is uniform in any fuse part 26A to 26D. . By doing in this way, it becomes possible to keep the fusing function (self-protection function of the film capacitor 22) of each fuse part uniform.

  In addition, from the viewpoint of keeping the fusing function of each fuse portion uniform, in the present embodiment, the narrow portion where the first and second corrugated curve patterns 24A and 24B face each other is not provided. That is, the first and second corrugated curve patterns 24A and 24B are formed such that the peak portion (maximum point) of one pattern and the valley portion (minimum point) of the other pattern overlap. As described above, since the corrugated curve patterns 24A and 24B have a curved shape, it is difficult to provide the separation distance with a constant width. Therefore, in the present embodiment, the fuse portion is configured only by the vapor deposition pattern that interrupts a part of the corrugated curve pattern without providing the fuse portion using the interval between the corrugated curve patterns. By doing in this way, the function of a fuse part can be equalize | homogenized and stabilized, and it becomes possible to isolate | separate a defect segment more reliably than before.

  DESCRIPTION OF SYMBOLS 10 Conductor vapor deposition film, 12 Dielectric film, 14 Conductor vapor deposition segment, 16 Non vapor deposition slit, 18 Metallicon connection part, 20 Non vapor deposition margin, 22 Film capacitor, 24A 1st wave type curve pattern, 24B 2nd wave Mold curve pattern, 26A-26D fuse part.

Claims (3)

A conductor deposited film for a film capacitor in which a plurality of conductor deposited segments defined by non-evaporated slits are formed on a dielectric film,
The non-evaporation slit includes a first corrugated curve pattern extending in the width direction of the dielectric film, and a second corrugated slit in which the first corrugated curve pattern is inverted in the longitudinal direction of the dielectric film. A wavy curve pattern is formed by being alternately provided in the longitudinal direction of the dielectric film,
Each of the first and second corrugated curve patterns is interrupted by a plurality of fuse portions on which a conductor is deposited,
The plurality of fuse portions are formed such that the widthwise lengths of the corrugated curve patterns in the regions where the separation distance that interrupts the first and second corrugated curve patterns is the same, respectively.
The conductor-deposited film for a film capacitor, wherein the first and second corrugated curve patterns are formed such that a peak portion of one pattern and a valley portion of the other pattern overlap each other. .   The conductor vapor deposition film for a film capacitor according to claim 1, wherein each of the plurality of fuse portions has a separation distance that interrupts the first and second corrugated curve patterns. A conductor-deposited film for a film capacitor, characterized in that the conductor-deposited film is formed to be the same in the width direction of the film capacitor. It is the conductor vapor deposition film for film capacitors of Claim 1 or 2, Comprising:
The first and second corrugated curve patterns are divided into an upward convex arc and a downward convex arc with the fuse portion as a boundary,
A radius of curvature of a convex arc below the first corrugated curve pattern and a radius of curvature of the convex arc above the second corrugated curve pattern, and a convex arc above the first corrugated curve pattern and the A conductor-deposited film for a film capacitor, characterized in that the curvature radius is 85% or more and 115% or less of a curvature arc of a convex arc under the second corrugated curve pattern.

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