JP6122323B2 - Sample holder - Google Patents

Description

  The present invention relates to a sample holder used when holding each sample such as a semiconductor wafer, which is used in a manufacturing process of a semiconductor integrated circuit or a manufacturing process of a liquid crystal display device.

  Semiconductor wafers such as silicon wafers used in the manufacture of semiconductor integrated circuits and plate-like samples such as glass substrates used in the manufacture of liquid crystal display devices are placed on the support bases of the manufacturing equipment or inspection equipment in those manufacturing processes. Is held, and processing or inspection is performed. In a manufacturing process, it is common to use a plurality of manufacturing apparatuses and inspection apparatuses, and means for holding a sample such as a silicon wafer on a support base are the types of manufacturing apparatuses and inspection apparatuses in the manufacturing process and the following: Various types of devices have been proposed according to the type of the conveying device for conveying to the first device.

  Taking a semiconductor integrated circuit as an example, demands for miniaturization and higher density of the semiconductor integrated circuit have been further increased in recent years. Along with this, the sample holder is further required to have thermal uniformity on the surface holding the sample.

  Patent Document 1 discloses an electrostatic chuck composed of a plurality of ceramic layers, and a flow path for allowing a coolant to flow through an intermediate ceramic layer is formed in the electrostatic chuck. Thus, by adjusting the balance between heating and cooling in each part, it is possible to improve the thermal uniformity on the surface of the electrostatic chuck.

Japanese Patent Laid-Open No. 3-108737

  However, as in the electrostatic chuck described in Patent Document 1, when the substrate is composed of a laminate of ceramic layers, contact with the heat medium when a heat medium such as a refrigerant flows through the flow path. As a result, the ceramic layer may deteriorate, and the inner surface of the flow path may be worn by the heat medium. In some cases, the heat generated between the heat medium and the substrate is partially reduced by the powder generated by the wear being deposited inside the flow path. As a result, the thermal uniformity may decrease on the surface of the electrostatic chuck.

  Therefore, a method of reducing the wear on the inner surface of the flow path by providing a coating film on the inner surface of the flow path can be considered. However, even when a coating film is provided on the inner surface of the flow path, cracks may occur in the base body due to vibration generated on the flow path surface due to fluid pulsation or the like. As a result, it has been difficult to improve the long-term reliability of the electrostatic chuck.

  The present invention has been made in view of such circumstances, and an object thereof is to improve the long-term reliability of the electrostatic chuck.

A sample holder according to one aspect of the present invention includes a base body made of ceramics, having a sample holding surface on the outer surface and having a channel inside, and a coating film covering the inner surface of the channel. The coating film has an extension part that extends from the inner surface to the base and faces the extension part of the surface of the coating film that faces the flow path. It has the overhang | projection part in the area | region to perform.

  According to the sample holder of one aspect of the present invention, the area of the interface between the substrate and the coating film is widened because the coating film has the extended portion that extends from the inner surface to the substrate. . As a result, even if vibration is generated on the surface of the flow path due to fluid pulsation or the like, this vibration can be well dispersed in the substrate and the flow path. Thereby, it can suppress that a crack generate | occur | produces in a base | substrate. As a result, the long-term reliability of the sample holder can be improved.

It is a figure which shows the external appearance of the sample holder which is an example of embodiment of this invention. It is a schematic diagram which shows arrangement | positioning of the flow path inside a sample holder planarly. It is sectional drawing of the A-A 'cross section of the sample holder shown in FIG. FIG. 4 is a partially enlarged cross-sectional view in which one channel cross section in the cross-sectional view shown in FIG. 3 is enlarged. It is a partial expanded sectional view of the B-B 'cross section of the sample holder shown in FIG. It is a partial expanded sectional view which shows the modification 1 of the sample holder of this invention. It is a partial expanded sectional view which shows the modification 2 of the sample holder of this invention. It is a partial expanded sectional view which shows the modification 3 of the sample holder of this invention. It is a partial expanded sectional view which shows the extension part vicinity in the modification 4 of the sample holder of this invention. It is a partial expanded sectional view which shows the extension part vicinity among the modifications 5 of the sample holder of this invention.

  FIG. 1 is a view showing an appearance of a sample holder 1 which is an example of an embodiment of the present invention. FIG. 1A is a perspective view of the sample holder 1, and FIG. 1B is a plan view of the sample holder 1.

  The sample holder 1 includes a base body 10 having a sample holding surface 10a on the outer surface (here, upper surface) and having a flow path 11 therein, and an electrode layer 20 provided inside the base body 10. The sample holder 1 is used so as to hold a sample such as a silicon wafer on the sample holding surface 10a of the substrate 10 by electrostatic force by applying a voltage to the electrode layer 20 provided on the substrate 10.

  In the present embodiment, the base body 10 is composed of a laminated body in which a plurality of ceramic layers are laminated. A flow path 11 for flowing a heat medium is provided inside the base body 10. The sample holder 1 can heat, cool, or keep the sample held on the sample holding surface 10 a by flowing a heat medium through the flow path 11. The heat medium flowing in the flow path 11 may be a substance that can exchange heat with the held sample through the ceramic layer and the electrode layer 20 from the flow path 11 of the substrate 10 to the one main surface serving as the sample holding surface 10a. Any heat medium may be used. As such a heat medium, various fluids, for example, an aqueous medium such as hot water, cold water or steam, an organic medium such as ethylene glycol, a gas containing air, or the like can be used.

As shown in FIG. 1A, the flow path 11 has an opening 11 a that opens to the external space on the end surface of the base 10. Although not shown in FIG. 1A, the end face on the opposite side of the opening 11a also has an opening leading to the external space. The heat medium flowing in the flow path 11 flows into the flow path 11 from, for example, the opening 11a serving as a supply port, and is discharged from the opening on the opposite side of the opening 11a. When the sample holder 1 is used in a semiconductor manufacturing apparatus or inspection apparatus, a supply pipe extending from a supply apparatus for supplying a heat medium is connected to the opening 11a, and a flow path is supplied from the supply apparatus at a predetermined flow rate and flow rate. 11 is supplied with a heat medium. A discharge pipe is connected to the discharge port on the side opposite to the opening 11 a, and the heat medium that flows through the flow channel 11 and exchanges heat with the sample is discharged from the flow channel 11. Alternatively, a return pipe may be connected to the discharge port, and the heat medium that has flowed through the flow path 11 and exchanged heat with the sample may be discharged from the flow path 11 and returned to the supply device to circulate the heat medium. .

  FIG. 2 is a schematic diagram illustrating the arrangement of the flow path 11 inside the substrate 10 in a plan view. In order for the heat medium flowing through the flow channel 11 to efficiently exchange heat with the sample held on the sample holding surface 10a, the flow channel 11 is preferably formed in a wide range corresponding to the sample holding surface 10a. In addition, it is important that the flow path 11 is formed in a wide range from the viewpoint of heat uniformity over the entire sample holding surface 10a. Therefore, in the sample holder 1 of the present embodiment, as shown in FIG. 2, the flow path 11 from the opening 11a to the opening 11b located on the opposite side of the opening 11a extends over the entire sample holding surface 10a. It has a meandering shape. By arranging the flow path 11 in this way, the width of the flow path 11 is increased, or the radius of curvature of the curved portion when the flow path 11 is meandered is reduced, so that Heat exchange can be performed more efficiently. In addition, if the distance of the folded portion between the straight portions when meandering is made too short, the portion that becomes the side wall of the flow path 11 becomes thin and the mechanical strength is lowered. However, it is preferable to form the flow path 11.

  In the example shown in FIG. 2, the flow path 11 has a meandering shape, but the arrangement shape of the flow path 11 is not limited to this. For example, the flow path 11 may have a spiral shape, or may have a shape in which a plurality of concentric circles and a straight line extending in the radial direction connecting the circles are combined.

  The shape of the channel 11 when viewed in a cross section perpendicular to the main surface of the substrate 10 can be a square shape or a circular shape. In particular, a rectangular shape is preferable from the viewpoint of ease of production.

  The base 10 is made of, for example, ceramic (ceramic sintered body) whose main component is silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, or the like. Among these, an aluminum nitride sintered body is particularly preferable.

  The aluminum nitride sintered body can have a thermal conductivity at room temperature of 150 W / (m · K) or higher, and has a higher thermal conductivity than other ceramic materials. For this reason, even when heat is locally applied to the held sample, the heat of the sample can be conducted by the base 10 and can be dissipated, so that the sample is hardly distorted due to thermal expansion. This can reduce deterioration of exposure accuracy due to distortion of the sample due to heat generation, for example, in the exposure process in the semiconductor manufacturing process.

  The thermal conductivity at room temperature is a value of thermal conductivity measured at a measurement atmosphere temperature within a room temperature range of 22 ° C. to 24 ° C., and heat measured at any set temperature within this temperature range. The conductivity is 150 W / (m · K) or more. Furthermore, the aluminum nitride sintered body can maintain a high thermal conductivity even in an environment exceeding room temperature. Specifically, for example, the thermal conductivity at an ambient temperature of 600 ° C. or higher can be 60 W / (m · K) or higher.

  The aluminum nitride sintered body preferably has an average crystal grain size in the range of 3 to 10 μm. When the average crystal grain size is 3 μm or more, the crystal grains in the aluminum nitride sintered body are relatively sufficiently filled, and the mechanical properties of the sintered body are made relatively good. In addition, by making crystals having an average crystal grain size of 10 μm or less, it is possible to reduce the residual voids (voids) existing between the crystals. Therefore, the average crystal grain size is preferably in the range of 3 to 10 μm. A more preferable range of the average crystal grain size is 3 to 7 μm.

  Returning to FIG. 1, the electrode layer 20 is provided inside the substrate 10 and is composed of one or two separated electrodes 21 and 22. The electrode layer 20 is provided for electrostatic adsorption. One of the electrodes 21 and 22 is connected to the positive electrode of the power supply, and the other is connected to the negative electrode. As an example, the electrode connected to the positive electrode is referred to as electrode 21 (hereinafter referred to as “positive electrode 21”), and the electrode connected to the negative electrode is referred to as electrode 22 (hereinafter referred to as “negative electrode 22”). The electrode layer 20 may have the electrode 21 connected to the negative electrode and the electrode 22 connected to the positive electrode.

  The positive electrode 21 and the negative electrode 22 are each formed in a substantially semicircular shape, and are disposed inside the base body 10 so that the semicircular chords face each other. The two electrodes of the positive electrode 21 and the negative electrode 22 are combined, and the outer shape of the entire electrode layer 20 is substantially circular. The substantially circular center that is the outer shape of the entire electrode layer 20 is set to be the same as the circular center that is the outer shape of the substrate 10.

  The positive electrode 21 and the negative electrode 22 are respectively provided with a connection terminal 21a and a connection terminal 22a for electrical connection with an external power source. In the present embodiment, each of the positive electrode 21 and the negative electrode 22 is provided with the connection terminal 21a and the connection terminal 22a so as to extend along the string at a portion where the arc and the string intersect. The connection terminal 21 a provided on the positive electrode 21 and the connection terminal 22 a provided on the negative electrode 22 are spaced from each other by the same distance between the semicircle strings of the positive electrode 21 and the semicircle strings of the negative electrode 22. And extend to the outer peripheral surface of the base body 10 along the extension lines of these semicircular strings. Further, the connection terminal 21 a and the connection terminal 22 a are provided so that a part thereof is exposed on the end surface of the base 10. The positive electrode 21 and the negative electrode 22 are connected to an external power source through a portion where the connection terminal 21a and the connection terminal 22a are exposed.

  The electrode layer 20 is made of, for example, a conductive material such as tungsten or molybdenum, and is formed so as to be positioned between the ceramic layers of the substrate 10 by screen printing of a paste containing the conductive material. The thickness of the electrode layer 20 of this embodiment is about 1-100 micrometers, for example.

  FIG. 3 is a cross-sectional view of the sample holder 1 taken along a cutting plane line A-A ′ shown in FIG. 2. FIG. 4 is a partially enlarged cross-sectional view in which the cross section of one channel 11 in the cross-sectional view shown in FIG. 3 is enlarged. The base 10 is formed of a laminate in which four ceramic layers 12, 13, 14, and 15 are laminated, and an electrode layer 20 is provided therein. The ceramic layers 12, 13, 14, and 15 here do not necessarily need to be made of one green sheet. Specifically, the ceramic layers 12, 13, 14, and 15 may each be a laminate of a plurality of green sheets. In the present embodiment, the electrode layer 20 is provided on the one main surface (sample holding surface 10 a) side that holds the sample with respect to the flow path 11.

  In the following, the outermost ceramic layer 15 is the outermost layer 15, the ceramic layer 12 is provided with the electrode layer 20 between the outermost layer 15, and the upper layer 12 is the ceramic provided on the opposite side of the ceramic layer 13. The ceramic layer 13 sandwiched between the lower layer 14 and the upper layer 12 and the lower layer 14 is referred to as an intermediate layer 13. The names of these layers are given for the sake of convenience of explanation, and the upper layer 12 is not necessarily positioned on the upper side in the vertical direction, and the lower layer 14 is not positioned on the lower side in the vertical direction. Further, as shown in FIG. 2, the heat medium flows from the opening 11a serving as the supply port to the opening 11b serving as the discharge port. Therefore, in FIGS. 3 and 4, the flow direction of the heat medium is perpendicular to the paper surface. .

Here, as shown in FIG. 4, a coating film 30 is provided on the inner surface of the flow path 11. The coating film 30 is provided to prevent the inner surface of the flow path 11 from being worn by the heat medium. The coating film 30 is not particularly limited as long as a sufficient bonding force with the substrate 1 can be obtained. As the coating film 30, for example, a ceramic material or a metal material can be used. In particular, a metal material is preferable from the viewpoint of strength. In the case of a metal material, it may be a refractory metal having a melting point higher than the sintering temperature of the ceramic material, such as tungsten or molybdenum, so that it can be fired simultaneously with the substrate 10 for convenience of manufacture. preferable. The coating film 30 has an extending portion 31 that enters the base body 10 from the inner surface. In the present embodiment, as shown in FIGS. 4 and 5, the extending portion 31 is provided in a layered manner along the traveling direction of the heat medium in the flow path 11. In addition, as shown in FIG. 6, while the extension part 31 is provided in protrusion shape, the structure provided with two or more may be sufficient. The sample holder 1 of the present embodiment has an extended portion 31 in which the coating film 30 extends from the inner surface to the base body 10 so that the area of the interface between the base body 10 and the coating film 30 is increased. Become wider. As a result, even if vibration is generated on the surface of the flow path 11 due to fluid pulsation or the like, this vibration can be well dispersed in the substrate 10. Thereby, it can suppress that a crack generate | occur | produces in the base | substrate 10. FIG. As a result, the long-term reliability of the sample holder 1 can be improved.

  The coating film 30 can be formed to a thickness of about 10 to 100 μm, for example. Further, for example, the extension portion 31 has a thickness in the vicinity of the inner surface of the flow path 11 of 5 to 50 μm and a length entering the base 10 of 0.1 to 0 when viewed in the cross section shown in FIG. It can be set to about 5 mm.

  Further, since the interface between the extension portion 31 and the base body 10 extends in a direction different from the inner surface of the flow path 11, vibration is generated in a direction parallel to the direction perpendicular to the surface of the flow path 11. Can be dispersed in both. As a result, it is possible to further reduce the possibility that the base 10 will crack.

  Moreover, it is preferable that the extension part 31 is extended in the direction parallel to the sample holding surface 10a. Thereby, the thermal uniformity in the direction parallel to the sample holding surface 10a inside the substrate 10 can be improved. As a result, the thermal uniformity of the sample holding surface 10a can be improved.

  In addition, as shown in FIG. 7, the extension portion 31 is preferably located in the vicinity of the corner portion of the flow path 11. Accordingly, the stress can be concentrated on the extension portion 31 by positioning the extension portion 31 in the vicinity of the corner portion where the stress is easily concentrated when vibration is generated on the surface of the flow path 11. Here, the extending portion 31 extends to the inside of the base body 10. Therefore, the extension part 31 can absorb stress over a wide range. As a result, it is possible to further reduce the possibility that the base 10 will crack.

  Furthermore, as shown in FIG. 8, the sample holder 1 preferably has a plurality of extending portions 31 in the thickness direction of the base 10. As a result, the area of the interface between the substrate 10 and the coating film 30 is further increased, and the area of the interface extending in a direction different from the inner surface of the flow path 11 is also increased, so that vibration can be further dispersed. . As a result, it is possible to further reduce the possibility that the base 10 will crack.

  Furthermore, as shown in FIG. 9, it is preferable to have an overhang portion 32 in a region facing the extension portion 31 in the surface facing the flow path 11 of the coating film 30. As a result, the vibration generated at the base of the extended portion 31 toward the inside of the base body 10 in the coating film 30 is satisfactorily reached by the overhang portion 32 before reaching the root of the extended portion 31. Can be dispersed in other directions.

Further, as shown in FIG. 10, it is preferable to have a groove 33 in a region facing the extension portion 31 in the surface facing the flow path 11 of the coating film 30. As a result, what is likely to generate high stress due to vibration at the base of the extension portion 31 (upper and lower two locations) is also dispersed in the groove portion 33. Thereby, the generated stress is reduced, and the damage from the base of the extended portion 31 of the coating film 30 is less likely to occur. As a result, the effect of vibration dispersion in the coating film 30 can be maintained over a long period of time.

  The ceramic constituting the substrate 10 is preferably a ceramic that is stable against the heat medium flowing in the flow path 11. Thereby, the corrosion by the chemical reaction with a heat medium can be suppressed. As a result, it is possible to reduce deterioration of the thermal uniformity of the sample holding surface 10a due to the accumulation of corrosive powder.

  Next, a method for forming the extending portion 31 in the sample holder 1 will be briefly described.

  The base 10 of the sample holder 1 of the present embodiment is a laminated body in which a plurality of ceramic layers are laminated as described above, and is obtained by laminating and firing a plurality of green sheets that are pre-formed into a predetermined shape. It is what The green sheet serving as the intermediate layer 13 is formed in a shape corresponding to the flow path 11. Specifically, a through hole penetrating in the vertical direction is provided. Of the surface of the green sheet serving as the upper layer 12 on the side in contact with the intermediate layer 13, the surface 121 facing the through hole provided in the green sheet serving as the intermediate layer 13, and the side contacting the intermediate layer 13 in the green sheet serving as the lower layer 14 The surface 141 facing the through hole provided in the green sheet to be the intermediate layer 13 and the inner surface 131 of the through hole in the green sheet to be the intermediate layer 13 are the inner surface of the flow path 11 after firing. Become. Here, the size and shape of the inner surface are not particularly limited, and are determined by the amount of the heat medium flowing through the flow path 11 or the required cooling rate. Here, the green sheet serving as the intermediate layer 13 is notched along the shape of the flow path 11.

  When a ceramic material is used as the coating film 30, a slurry is prepared by mixing an organic binder, ceramic particles, an additive, and the like, as in the case of producing a green sheet, and this slurry is laminated with the green sheet. During the process prior to the process or the process of laminating, the coating film 30 is partially applied by printing or the like to the place where the coating film 30 is to be provided, and is baked together with the green sheet. It can be formed on the surface. At this time, the extension part 31 can be formed after firing by allowing the slurry to permeate into the notch provided in the green sheet serving as the intermediate layer 13 when applying the slurry.

  In the case where a metal material is used as the coating film 30, a metal paste in which an organic binder and metal powder are mixed is prepared in advance, and this metal paste is a step prior to the step of laminating the green sheets or during the step of laminating. In addition, the coating film 30 can be formed on the inner surface of the flow path 11 by partially coating the portion where the coating film 30 is to be provided by printing or the like and firing the green sheet together. At this time, the extended portion 31 can be formed after firing by allowing the metal paste to penetrate into the notch provided in the green sheet to be the intermediate layer 13 when the metal paste is applied.

  Further, as another example of using a metal material as the coating film 30, the coating film 30 may be formed by plating, for example. Specifically, a metal thin film may be formed by electroless plating with respect to the flow path 11 of the substrate 10 after firing and the above-described notch, and further, an electric current may be passed through the metal thin film to perform electroplating. Thereby, the coating film 30 which has the extension part 31 can be formed.

  The sample holder 1 of the example of the present invention was produced as follows.

As a starting material, an aluminum nitride powder having an average particle size of 1.5 μm, an oxygen content of 0.8%, and a carbon content of 300 ppm produced by an alumina reduction nitriding method was prepared. And after mixing an organic binder and a solvent with respect to this aluminum nitride powder, it dried at 60 degreeC and manufactured granulated powder.

  Next, this granulated powder was filled in a mold, and eight disk-shaped molded bodies having a radius of 50 mm and a thickness of 1 mm were produced at a molding pressure of 100 MPa.

  Thereafter, chamfering is performed on the corners of the two molded bodies having a thickness of 1 mm, which will be the intermediate layer 12, and the chamfered portion 31 is chamfered at the portion where the extended portion 31 is to be formed later. Formed. These two chamfered compacts were laminated so that their C-faces face each other and adhered with a molding pressure of 80 MPa to obtain a compact with a thickness of 2 mm. In this way, an intermediate layer 12 in which a notch was formed by two opposing C surfaces was obtained.

  Six green compacts that are not machined are laminated three by three and are brought into close contact with each other at a molding pressure of 80 MPa to form a layer corresponding to the upper layer 11 and the outermost layer 15 or a lower layer 13 having a thickness of 2 mm. A molded body was obtained.

  Further, these three molded bodies were laminated in the order of the layer corresponding to the upper layer 11 and the outermost layer 15, the intermediate layer 12 and the lower layer 13, and were brought into close contact with each other at a molding pressure of 80 MPa to obtain a molded body having a thickness of 8 mm.

  A metal slurry in which an organic binder and tungsten powder were mixed was poured into the inner surface of the flow path 11 formed by the intermediate layer 12, the upper layer 11, and the lower layer 13, and after leaving for about 20 seconds, these were discharged. Thereby, the coating film 30 having a thickness of about 30 μm was formed on the inner surface of the flow path 11. Further, an extension 31 that enters the base body 10 at a depth of 0.1 to 0.4 mm was formed in the notch. Next, degreasing was performed in a nitrogen atmosphere, followed by firing at 1900 ° C. for 2 hours.

  Finally, the upper surface of the outermost layer 15 was polished to form a sample holding surface 10a having a flatness of 20 μm and an arithmetic average roughness Ra of 0.1 μm. In the present embodiment, the sample holder 1 does not include the electrode layer 20.

  For comparison, a sample holder for a comparative example in which a coating film was formed without providing a notch in the manufacturing method of the substrate 10 was prepared. That is, the sample holder of the comparative example does not have an extension portion.

  A pipe connected to a temperature controller was connected to the flow path of each of these substrates to circulate water whose water temperature was adjusted to 70 ° C., and the thermal uniformity of the sample holding surface was evaluated. The difference between the lowest temperature and the highest temperature on the sample holding surface was 0.12 ° C. for the sample holder 1 of the example and 0.13 ° C. for the sample holder of the comparative example. Furthermore, these sample holders were placed on a shaker, and 200-hour continuous vibration tests were performed. After the test, when the temperature uniformity of the sample holding surface of each sample holder was evaluated, the difference between the minimum temperature and the maximum temperature on the sample holding surface 10a of the sample holder 1 of the example was 0.122 ° C., before the test. While the change from about 2% was about 2%, the difference between the lowest temperature and the highest temperature on the sample holding surface of the sample holder of the comparative example was 0.245 ° C., which was doubled or more.

  Then, when the cut surface of the base | substrate of each sample holder was observed, the crack of length 1mm at the maximum was recognized in a part of corner | angular part of the flow path of the sample holder of a comparative example. On the other hand, generation of cracks could not be confirmed in the sample holder 1 of the example.

From the above results, it was confirmed that the base film 10 can be prevented from being cracked by the coating film 30 formed on the inner surface of the flow path 11 and the extended portion 31 thereof. As a result, the long-term reliability of the sample holder 1 could be improved.

DESCRIPTION OF SYMBOLS 1 Sample holder 10 Base | substrate 10a Sample holding surface 11 Flow path 11a, 11b Opening part 12 Upper layer 13 Intermediate layer 14 Lower layer 15 Outermost layer 20 Electrode layer 21 Positive electrode 22 Negative electrode 30 Coating film 31 Extension part 32 Overhang part 33 Groove

Claims (5)

And a substrate having a sample holding surface on the outer surface and having a channel inside, and a coating film covering the inner surface of the channel, the coating film comprising: It has an extended part that extends from the surface into the base body ,
Of the surface of the coating film facing the flow path, the sample holder has a projecting portion in a region facing the extension portion . And a substrate having a sample holding surface on the outer surface and having a channel inside, and a coating film covering the inner surface of the channel, the coating film comprising: It has an extended part that extends from the surface into the base body,
  A sample holder having a groove portion in a region facing the extension portion in a surface of the coating film facing the flow path. When the flow path is viewed in a cross section perpendicular to the length direction, the inner surface of the flow path has a corner portion, and the extension portion is located in the vicinity of the corner portion. The sample holder according to claim 1 or 2 . Sample holder according to any one of claims 1 to 3, characterized in that it comprises a plurality of said Shin join the club. The sample holder according to any one of claims 1 to 4 , wherein the extending portion extends in a direction parallel to the sample holding surface of the base.

Images