JP6119785B2 - Foreign matter inspection device, foreign matter inspection method - Google Patents

Description

  The present invention relates to a foreign matter inspection apparatus and a foreign matter inspection method for detecting foreign matter attached on an object having a pattern formed on a substrate.

  A substrate such as a photomask used for manufacturing a semiconductor integrated circuit, a color filter, or the like may be attached with various foreign substances in the manufacturing process. Such foreign matters cause deterioration in quality during the manufacture of semiconductor integrated circuits, color filters, etc., and therefore it is necessary to inspect whether foreign matters are attached or not.

  In the inspection method of Patent Document 1, light is irradiated onto a substrate, and light scattered and reflected from the substrate surface is detected by two photodetectors. One detector is provided with a polarizing filter, and foreign matter on the substrate is detected based on a difference between detection signals detected by the two detectors.

JP 2006-3245 A

  In recent years, with higher definition of semiconductor integrated circuits and color filters, photomask patterns have become finer. When the pattern is fine in this way, the foreign matter is relatively larger than the pattern.

  In the method of Patent Document 1, in order to detect a foreign object smaller than a pattern, a detection signal based on the pattern is separated using a low-pass filter. Therefore, the detection accuracy depends on the relative size of the foreign object and the pattern, and when the foreign object is relatively larger than the pattern as described above, the detection accuracy may be lowered. Also, depending on the shape of the pattern, the detection signal at the edge portion tends to be large, which may affect the detection accuracy.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a foreign substance inspection apparatus and the like that can detect foreign substances with high accuracy.

1st invention for solving the subject mentioned above is a foreign material inspection apparatus which inspects the foreign material on the target object which formed the pattern in the base material, Comprising: The ring-shaped light source part which irradiates inspection light to the target object And a light receiving unit that receives the inspection light reflected in the normal direction of the object, the direction of the inspection light emitted from the light source unit is close to the plane direction of the object, The light source unit emits inspection light from the periphery of the inspection region of the object to the inspection region, and the direction of the inspection light irradiated from the light source unit is 80 ° or more 90 ° with respect to the normal direction of the object. The object is a photomask, the pattern includes at least a pattern having a width of about 0.5 μm, and the foreign matter includes at least a pattern having a width of about 1.0 μm. It is a foreign matter inspection device.

In the present invention, the direction of the inspection light emitted from the light source unit is brought close to the plane direction of the object, and the inspection light reflected in the normal direction of the object is received by the light receiving unit. If it carries out like this, regarding the inspection light irradiated to a target object from a light source part, most things which scattered and reflected on the pattern including an edge part will remove | deviate from the direction of a light receiving part. On the other hand, when the foreign matter on the object is scattered and reflected, a part of the inspection light is directed to the light receiving unit and received by the light receiving unit. Therefore, a foreign object can be detected by setting an appropriate signal intensity threshold.
In the present invention, since signal processing using a low-pass filter or the like is not particularly necessary, the detection accuracy is not affected by the relative size of the foreign matter and the pattern. In addition, by suppressing the amount of the inspection light reflected from the pattern at the light receiving unit as described above, the pattern of the inspection object is not limited, and various settings at the time of inspection are simple. .

The light source unit of the previous SL is irradiated with inspection light to the inspection area from the surrounding test area of the object, the direction of the inspection light emitted from the light source unit, 80 ° with respect to the normal direction of the object it can be carried out more in an angle of less than 90 °, the detection of the foreign matter as described above more appropriately.

Moreover, it is desirable that the light receiving unit receives the inspection light via a polarizing filter.
When the inspection light is reflected on the pattern, the component in the predetermined polarization direction may become strong due to the pattern shape or the like. However, by providing the polarizing filter as described above, it is possible to cut the component and further reduce the amount of light received by the light receiving unit for the inspection light reflected from the pattern.

2nd invention is a foreign material inspection method which inspects the foreign material on the target object which formed the pattern in the base material, Comprising: A test light is irradiated to the target object from a ring-shaped light source part, and the method of the target object The inspection light reflected in the line direction is received by a light receiving unit, the direction of the inspection light emitted from the light source unit is close to the plane direction of the object, and the light source unit is an inspection region of the object. The inspection light is irradiated from the surroundings to the inspection region, and the direction of the inspection light irradiated from the light source unit forms an angle of 80 ° or more and less than 90 ° with respect to the normal direction of the object, It is a photomask, wherein the pattern includes at least a pattern having a width of about 0.5 μm, and the foreign substance includes at least a pattern having a width of about 1.0 μm.
Moreover, it is desirable that the light receiving unit receives the inspection light via a polarizing filter.

  ADVANTAGE OF THE INVENTION According to this invention, the foreign material inspection apparatus etc. which can detect a foreign material accurately can be provided.

The figure shown about the foreign material inspection apparatus 1 The figure shown about the test object 20 Diagram explaining foreign substance inspection method Diagram showing comparison of detection results

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

(1. Configuration of the foreign matter inspection apparatus 1)
First, the foreign substance inspection apparatus 1 of the present embodiment will be described with reference to FIG. FIG. 1A is a diagram illustrating a schematic configuration of the foreign matter inspection apparatus 1, and FIG. 1B is a perspective view illustrating the light source unit 11, the light receiving unit 12, and the like.

  A foreign matter inspection apparatus 1 shown in the figure inspects whether foreign matter is attached to an object 20 such as a photomask, and includes a light source unit 11, a light receiving unit 12, a polarization filter 14, a detection processing unit 15, and the like. .

  The light source unit 11 irradiates the inspection light 20 onto the inspection region 20 a on the object 20. For example, a metal halide lamp or an LED lamp can be used as the light source, but the light source is not limited thereto.

  The light source unit 11 is configured in a ring shape having a hollow portion on a plane, and irradiates the inspection light 40 from the periphery of the inspection region 20a to the inspection region 20a. The light source unit 11 is arranged so that the direction of the inspection light 40 is close to the plane direction of the object 20 which is a direction orthogonal to the normal direction of the object 20. The vertical direction in FIG. 1A corresponds to the normal direction of the object 20, and the horizontal direction in FIG. 1A corresponds to the plane direction of the object 20.

  As will be described later, in the present embodiment, it is particularly desirable that the irradiation direction of the inspection light 40 forms an angle θ of 80 ° or more and less than 90 ° with respect to the normal direction of the object 20.

  The light receiving unit 12 receives a part of the inspection light 40 scattered and reflected by the inspection region 20 a of the object 20 in the normal direction of the object 20 via the polarizing filter 14. In FIG. 1, for the sake of explanation, only the inspection light 40 that is scattered and reflected is displayed in the normal direction of the object 20.

  The light receiving unit 12 includes an objective lens 121, a relay lens 122, an area camera 123, and the like. In the light receiving unit 12, the inspection light 40 incident on the objective lens 121 is guided to the area camera 123 by the relay lens 122. The area camera 123 includes an electronic imaging unit such as a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). The area camera 123 can be replaced with a line camera including an electronic imaging unit such as TDI (Time Delay Integration). Thereby, the subject image based on the received inspection light 40 is converted into a two-dimensional image signal, for example, a gray scale image in which the signal intensity is expressed in gray scale. However, the light receiving unit 12 only needs to receive the inspection light 40 and convert it into a signal, and the configuration is not limited to the above.

  The detection processing unit 15 acquires the image signal from the light receiving unit 12 and determines the presence or absence of a foreign substance based on the signal intensity. The detection processing unit 15 can be realized by a general-purpose computer including a control unit, a storage unit, a communication unit, and the like, and stores a program for performing the above-described determination processing in the storage unit.

(2. Object 20)
FIG. 2A is a diagram showing the object 20 to be inspected. The object 20 is obtained by forming a pattern 22 on a transparent substrate 21. As shown in the drawing, the cross section of the pattern 22 has a rectangular shape having a substantially horizontal upper surface, and the width and interval of the pattern 22 are about 0.5 μm. In addition, the target object 20 is a photomask, for example, and forms the pattern 22 by a metal type thin film on the base material 21 which is a glass substrate. However, the type of the object 20 or the material of the base material 21 or the pattern 22 is not limited to these. For example, the object 20 may be a semiconductor integrated circuit or a color filter.

  FIG. 2B is a diagram illustrating a state in which the foreign object 30 is attached on the object 20. The width of the foreign material 30 is about 1.0 μm, which is about twice as large as the width and interval of the pattern 22.

(3. Foreign object inspection method by foreign object inspection apparatus 1)
Next, a foreign matter inspection method by the foreign matter inspection apparatus 1 shown in FIG. 1 will be described. It should be noted that the object 20 is set and aligned, the inspection area 20a is set, the optical system is calibrated, etc., before the foreign substance inspection.

  At the time of foreign matter inspection by the foreign matter inspection device 1, as shown in FIG. The inspection light 40 enters the inspection region 20 a on the object 20 at an angle θ with respect to the normal direction of the object 20.

  As shown in FIG. 3, the inspection light 40 is scattered and reflected (indicated by a dotted line in the drawing) on the pattern 22 or the foreign material 30 in the inspection region 20a.

  Of the inspection light 40, the light reflected on the foreign material 30 is scattered in various directions depending on the shape of the foreign material 30, and a part thereof is directed in the normal direction of the object 20 and received by the light receiving unit 12. Become.

  Note that the inspection light 40 irradiated from the light source unit 11 and reflected from the foreign material 30 is in a randomly polarized state including components of various polarization directions. Among these components, the polarization direction component of the polarizing filter 14 passes through the polarizing filter 14 shown in FIG.

  On the other hand, the inspection light 40 is scattered and reflected on the pattern 22 including the edge portion, but the component in the direction in which the inspection light 40 is regularly reflected is large, and most of the inspection light 40 deviates from the direction of the light receiving unit 12.

  When the inspection light 40 is reflected on the pattern 22, a component in a predetermined polarization direction may become strong due to the shape of the pattern 22 or the like. The polarizing filter 14 is provided to cut this component and further suppress the amount of light received by the light receiving unit 12 of the inspection light 40 reflected from the pattern 22. At the time of foreign matter inspection, the arrangement of the polarization filter 14 is adjusted by adjusting the polarization direction of the polarization filter 14 in a direction orthogonal to the predetermined polarization direction so as to obtain the maximum effect.

  As described above, the light receiving unit 12 can receive only the inspection light 40 reflected on the foreign material 30. In addition, since the inspection light 40 reflected on the foreign matter 30 interferes with each other, the detection signal of the inspection light 40 is enhanced in a slightly wider range than the foreign matter 30.

  FIG. 4 is a graph showing the signal intensity at which the inspection light 40 is received by the light receiving unit 12 in various cases while changing the angle θ at which the inspection light 40 is irradiated. 4A shows the case of θ = 30 °, FIG. 4B shows the case of θ = 70 °, and FIG. 4C shows the case of θ = 80 °. In each graph, the horizontal axis indicates the distance (pixel) from a predetermined position on the object 20, and the vertical axis indicates the signal intensity (grayscale gradation value).

  As shown in the figure, in the present embodiment, for the reason described above, the signal intensity at the foreign material portion tends to become superior as the angle θ increases. Particularly in the case of θ = 80 ° shown in FIG. 4C, the signal intensity of the foreign substance portion is very high as compared with the pattern portion including the edge portion, and detection is easy. Therefore, it can be seen that the angle θ of the inspection light 40 is preferably 80 ° or more and less than 90 ° when detecting foreign matter. The detection processing unit 15 compares the signal intensity with a predetermined threshold value 50, and determines that the foreign object 30 has been detected if there is a portion with the threshold value 50 or more.

  On the other hand, in the case of θ = 30 ° shown in FIG. 4A, the signal intensity at the pattern portion such as the edge portion is also high, and it is difficult to detect the foreign matter 30 by the threshold value. In addition, in the case of θ = 70 ° shown in FIG. 4B, the signal intensity of the foreign matter portion is higher than that of the edge portion of the pattern and the foreign matter can be detected. Cost.

  As described above, in the present embodiment, the direction of the inspection light 40 emitted from the light source unit 11 is brought close to the plane direction of the object 20, and the inspection light 40 reflected in the normal direction of the object 20 is received by the light receiving unit. 12 receives light. In this way, most of the inspection light 40 irradiated from the light source unit 11 to the object 20 that is scattered and reflected on the pattern 22 including the edge portion deviates from the direction of the light receiving unit 12. On the other hand, when the foreign matter 30 is scattered and reflected, the inspection light 40 is scattered in various directions, and a part of the inspection light 40 is directed to the light receiving unit 12 and received by the light receiving unit 12. Therefore, the foreign object 30 can be suitably detected by setting an appropriate signal intensity threshold value 50. In particular, in the present embodiment, the direction of the inspection light 40 irradiated from the light source unit 11 makes an angle θ of 80 ° or more and less than 90 ° with respect to the normal direction of the object 20, thereby detecting the foreign matter 30. Can be performed more suitably.

  Thus, in the present invention, since signal processing using a low-pass filter or the like is not particularly necessary, the detection accuracy is not affected by the relative sizes of the foreign material 30 and the pattern 22. In addition, by suppressing the amount of the inspection light 40 reflected from the pattern 22 by the light receiving unit 12 as described above, the pattern 22 of the object 20 is not limited, and various settings at the time of inspection can be performed. It is simple. In addition, since signal processing or the like by filtering is not performed, the resolution and the like of the light receiving unit 12 do not need to be taken into consideration, and a lens or the like can be configured at low cost. In addition, there is an advantage that precise alignment of the inspection region 20a is not required, and that the inspection region 20a is not easily affected by vibrations of the apparatus, a focus shift, and the like.

  In addition, the light receiving unit 12 receives the inspection light 40 through the polarizing filter 14. By adjusting the polarization direction of the polarizing filter 14, the amount of light received by the light receiving unit 12 can be further suppressed for the inspection light 40 reflected from the pattern 22 as described above.

  However, the present invention is not limited to this. For example, the light source unit 11 does not have to be ring-shaped and may irradiate the inspection light 40 from a part of the plane. Further, if necessary, it is also possible to perform a filtering process such as a band-pass filter on the signal that has received the inspection light 40 by the light receiving unit 12.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these naturally belong to the technical scope of the present invention. Understood.

1: Foreign object inspection apparatus 11: Light source unit 12: Light receiving unit 14: Polarizing filter 15: Detection processing unit 20: Object 21: Base material 22: Pattern 30: Foreign object 40: Inspection light

Claims (4)

A foreign matter inspection apparatus for inspecting foreign matter on an object having a pattern formed on a substrate,
A ring-shaped light source for irradiating the object with inspection light;
A light receiving unit for receiving the inspection light reflected in the normal direction of the object;
Have
The direction of the inspection light emitted from the light source unit is close to the plane direction of the object,
The light source unit irradiates inspection light from the periphery of the inspection area of the object to the inspection area,
The direction of the inspection light emitted from the light source unit forms an angle of 80 ° or more and less than 90 ° with respect to the normal direction of the object,
The object is a photomask;
The pattern includes at least a pattern having a width of about 0.5 μm,
The foreign matter inspection device includes at least a foreign matter having a width of about 1.0 μm. The foreign object inspection apparatus according to claim 1, wherein the light receiving unit receives the inspection light via a polarizing filter. A foreign matter inspection method for inspecting foreign matter on an object having a pattern formed on a substrate,
Irradiating inspection light to the object from a ring-shaped light source part, and receiving the inspection light reflected in the normal direction of the object by a light receiving part,
The direction of the inspection light emitted from the light source unit is close to the plane direction of the object,
The light source unit irradiates inspection light from the periphery of the inspection area of the object to the inspection area,
The direction of the inspection light emitted from the light source unit forms an angle of 80 ° or more and less than 90 ° with respect to the normal direction of the object,
The object is a photomask;
The pattern includes at least a pattern having a width of about 0.5 μm,
The foreign matter inspection method includes at least a foreign matter having a width of about 1.0 μm.   The foreign matter inspection method according to claim 3, wherein the light receiving unit receives the inspection light through a polarizing filter.

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