JP6105013B1 - Shrink film with conductive circuit and manufacturing method thereof - Google Patents

Abstract

Disclosed are a shrink film with a conductive circuit in which a conductive circuit can follow a cubic surface even when the shrink film is shrunk, and a method for manufacturing a shrink film with a conductive circuit in which the shrink film does not shrink during the manufacturing process. A method for producing a shrink film with a conductive circuit according to the present invention includes a step of forming a transfer layer including a conductive circuit layer formed using a stretchable ink on a base sheet to obtain a transfer sheet. And a step of laminating the transfer sheet and the shrink base material, applying heat and pressure to the laminate to transfer the transfer layer to the shrink base material, and removing the base sheet from the laminate. Moreover, the shrink film with an electrically conductive circuit of this invention was comprised so that the electrically conductive circuit layer formed using the ink which has a stretching base material on a shrink base material and a shrink base material may be included. [Selection] Figure 1

Description

  The present invention relates to a shrink film with a conductive circuit and a method for producing the same.

  In recent years, for the purpose of distribution and inventory management, IC tags that transmit and receive data in a non-contact manner via external readers and writers are often attached to packages such as products. Here, the IC tag includes an antenna circuit printed on a film or the like and an IC chip.

  As one embodiment, there is a label for a bottle in which an IC tag is attached to a shrink film (for example, see Patent Document 1). This label has an image label printed on one side of the shrink film, an antenna circuit made of conductive ink printed on the other side, and an IC tag attached to the antenna circuit so as to be conductive. It is. A bottle with an IC tag is obtained by attaching a cylindrical label by overlapping both ends of the IC label to the bottle, and thermally shrinking the shrink film so as to adhere to the bottle.

JP 2004-020771 A

  However, in conventional IC labels, since the conductive ink is not shrinkable, the location where the IC label is provided is limited to a flat surface or a quadric surface, and it is difficult to provide the IC label at the location of the cubic surface. There is a problem that there is.

  Further, since the shrink start temperature of the shrink film is lower than the drying temperature of the conductive ink, there is a problem that the shrink film shrinks in the process of manufacturing the IC label.

  The present invention has been made in order to solve the above-described problems, and a shrink film with a conductive circuit in which the conductive circuit can follow a cubic surface even when the shrink film is shrunk, and the shrink film shrinks in the manufacturing process. It aims at providing the manufacturing method of the shrink film with a conductive circuit which does not have.

  Hereinafter, a plurality of modes will be described as means for solving the problems. These embodiments can be arbitrarily combined as necessary.

The manufacturing method of the shrink film with a conductive circuit of the present invention,
Forming a transfer layer including a conductive circuit layer formed using a stretchable ink on a base sheet to obtain a transfer sheet;
Laminating a transfer sheet and a shrink substrate, applying heat and pressure to the laminate, transferring the transfer layer to the shrink substrate, and removing the substrate sheet from the laminate.

  In a preferred embodiment, the method further includes a step of forming a pattern layer between the base sheet and the conductive circuit layer.

  In a preferred embodiment, the method further includes a step of forming a protective layer on the pattern layer.

  In these preferred embodiments, the ink contains any one of silver, PEDOT, carbon black, and carbon nanotubes.

  In these preferable embodiments, the method further includes a step of mounting an electronic component on the shrink film with a conductive circuit so as to be electrically connected to the conductive circuit layer.

  In these preferable embodiments, the method further includes a step of mounting an electronic component on the shrink base material or the conductive circuit layer so as to be electrically connected to the conductive circuit layer.

The shrink film with conductive circuit of the present invention is
A shrink substrate;
And a conductive circuit layer formed using a stretchable ink on a shrink base material.

  In a preferred embodiment, a picture layer is formed on the conductive circuit layer.

  In a preferred embodiment, a protective layer is formed on the pattern layer.

  In these preferred embodiments, the ink contains any one of silver, PEDOT, carbon black, and carbon nanotubes.

  In these preferred embodiments, an electronic component is mounted on the conductive film-attached shrink film so as to be electrically connected to the conductive circuit layer.

  The shrink film with a conductive circuit of the present invention was configured to include a shrink base material and a conductive circuit layer formed on the shrink base material using an ink having stretchability. Therefore, the shrink film with a conductive circuit of the present invention allows the conductive circuit to follow the cubic curved surface even when the shrink film with the conductive circuit is thermally contracted and attached to a molded product having a cubic curved surface.

  The method for producing a shrink film with a conductive circuit of the present invention comprises a step of forming a transfer layer including a conductive circuit layer formed using a stretchable ink on a base sheet to obtain a transfer sheet, And a step of applying a heat and pressure to the laminate to transfer the transfer layer to the shrink substrate and removing the substrate sheet from the laminate. Therefore, according to this invention, the shrink film with a conductive circuit which a shrink film does not shrink | contract in a manufacture process can be obtained easily.

It is sectional drawing of the shrink film with an electrically conductive circuit which concerns on embodiment of this invention. It is sectional drawing which shows an example of the manufacturing method of the shrink film with a conductive circuit of this invention. It is sectional drawing which shows an example of a transfer sheet. It is a top view of the shrink film with a conductive circuit with which the electronic component was mounted | worn.

  Hereinafter, an example of embodiment is described about the shrink film with a conductive circuit, and its manufacturing method.

  The method for producing a shrink film with a conductive circuit of the present invention comprises a step of forming a transfer layer including a conductive circuit layer formed using a stretchable ink on a base sheet to obtain a transfer sheet, Laminating a shrink substrate, applying heat and pressure to the laminate, transferring the transfer layer to the shrink substrate, and removing the substrate sheet from the laminate.

  First, a transfer layer including a conductive circuit layer formed using stretchable ink is formed on a base sheet to obtain a transfer sheet.

  The material of the base sheet is not particularly limited. For example, heat such as polypropylene resin, polyethylene resin, polyamide resin, acrylic resin, olefin resin, polyester resin, vinyl chloride resin, polycarbonate resin, ABS resin, etc. A plastic resin and these laminated products can be mentioned. The thickness of the base sheet can be, for example, 15 μm to 600 μm.

  The material of the stretchable ink can include any one of silver, PEDOT (poly (3,4-ethylenedioxythiophene)), carbon black, and carbon nanotube. When PEDOT is used, it is preferable to add PSS (polystyrene sulfonic acid) because PEDOT is hardly soluble in water or a solvent. These materials are dispersed in the ink as particles. The ink preferably contains a binder resin. The particles are dispersed in the ink by the binder resin, and the particles are supported on the binder resin. Moreover, ink can adhere | attach firmly on an application surface because binder resin is contained. The ink may contain a curing agent, a solvent, and other additives.

  Examples of the binder resin include epoxy resin, polyester resin, acrylic resin, urethane resin, phenol resin, polyimide resin, and elastomer resin. These may be used alone or in combination of two or more. The weight ratio of the particles to the binder resin is preferably 20:80 to 99: 1, and more preferably 60:40 to 80:20. When the weight ratio of the particles is less than 20, problems such as a decrease in conductivity and an increase in resistance value occur in the formed conductive circuit layer. On the other hand, when the weight ratio of the binder resin is less than 1, since the particles are not uniformly dispersed, problems such as a decrease in conductivity and an increase in resistance value occur.

  As the transfer sheet 1, a sheet in which a protective layer 12, a picture layer 13, a conductive circuit layer 14, and an adhesive layer 15 are sequentially laminated on a base sheet 11 can be used (see FIG. 3). A release layer may be formed on the base sheet 11 in order to improve the release property between the base sheet and the protective layer.

  The protective layer 12 is a layer that becomes the outermost surface of the shrink film 3 with conductive circuit after the transfer layer 10 is transferred onto the shrink substrate 2 and the base sheet 11 is removed. By forming the protective layer 12, water resistance and durability can be imparted to the pattern layer 13 and the conductive circuit layer 14. Materials for the protective layer 12 include acrylic resin, polyester resin, polyvinyl chloride resin, cellulose resin, rubber resin, polyurethane resin, polyvinyl acetate resin, and vinyl chloride-vinyl acetate copolymer. Copolymers such as system resins and ethylene-vinyl acetate copolymer resins may be used. When the protective layer 12 requires hardness, a photo-curable resin such as an ultraviolet curable resin, a radiation curable resin such as an electron beam curable resin, or a thermosetting resin may be selected and used. As a method for forming the protective layer 12, a normal printing method such as a gravure printing method, a screen printing method, or an offset printing method, or a coating method such as a gravure coating method or a roll coating method may be used.

  The pattern layer 13 may be formed entirely on the protective layer 12 or may be partially formed. Examples of the material of the pattern layer 13 include resins such as polyvinyl resins, polyamide resins, polyester resins, acrylic resins, polyurethane resins, polyvinyl acetal resins, polyester urethane resins, cellulose ester resins, and alkyd resins. A colored ink containing a suitable color pigment or dye as a colorant may be used as a binder. As a method for forming the pattern layer 13, a normal printing method such as a gravure printing method, a screen printing method, or an offset printing method, or a coating method such as a gravure coating method or a roll coating method may be used.

  The conductive circuit layer 14 is formed using the ink described above. As a method for forming the conductive circuit layer 14, a normal printing method such as a gravure printing method, a screen printing method, or an offset printing method, or a coating method such as a gravure coating method or a roll coating method may be used.

  The adhesive layer 15 is formed in order to adhere the above-described layers on the shrink base material 2. As the adhesive layer 15, a heat-sensitive or pressure-sensitive resin suitable for the material of the shrink base material 2 may be appropriately selected and used. For example, acrylic resin, polystyrene resin, polyamide resin, polyester resin, chlorinated polyolefin resin, chlorinated ethylene-vinyl acetate copolymer resin, vinyl chloride-vinyl acetate copolymer resin, cyclized rubber, coumarone Examples thereof include indene resins. As a method for forming the adhesive layer 15, a normal printing method such as a gravure printing method, a screen printing method, or an offset printing method, or a coating method such as a gravure coating method or a roll coating method may be used.

  In addition, the drying temperature at the time of forming each said layer can be 50 degreeC-200 degreeC, for example.

  As described above, a transfer sheet in which a transfer layer including a conductive circuit layer formed using a stretchable ink is formed on a base sheet can be obtained.

  Next, the transfer sheet and the shrink substrate are laminated, heat and pressure are applied to the laminate, the transfer layer is transferred to the shrink substrate, and the substrate sheet is removed from the laminate.

  Specifically, as shown in FIG. 2, the transfer sheet 1 and the shrink base material 2 are laminated, and the laminate is heated and passed between rollers 4 rotating in opposite directions, and heat and pressure are applied to the laminate. Add The transfer layer is transferred to the shrink base material 2 by heat and pressure. After the transfer, the base sheet 11 is peeled from the laminate.

  The material of the shrink base material 2 is not particularly limited. For example, polyvinyl chloride, polyvinylidene chloride, polyethylene, ethylene-propylene copolymer, ionomer, polypropylene, polystyrene, polyester, fluororesin, hydrochloric acid rubber, silicone Mention may be made of resins or rubbers such as rubber, EPDM, chloroprene rubber, nitrile-butadiene rubber. A shrink base material is obtained by shape | molding these in a film form, extending | stretching to a uniaxial or biaxial direction, and heat-setting.

  The temperature at the time of transfer is 170 ° C. to 210 ° C., preferably 180 ° C. to 200 ° C. Within this range, the resin of the adhesive layer 15 is sufficiently melted, the transfer layer 10 and the shrink substrate 2 are in close contact, and the transfer layer 10 can be reliably transferred to the shrink substrate 2.

  The pressure at the time of transfer is 0.3 MPa to 1.2 MPa, preferably 0.4 MPa to 0.8 MPa. Within this range, heat conduction is good, the resin of the adhesive layer 15 is appropriately melted, the transfer layer 10 and the shrink base 2 are in close contact, and the transfer layer 10 is reliably transferred to the shrink base 2. Can do.

  The time for applying the temperature and pressure can be expressed by the relative moving speed of the laminate and the roller 4, and is preferably 0.5 m / min to 4.0 m / min. When the speed is less than 0.5 m / min, heat conduction is high and the shrink base material 2 shrinks during the manufacturing process. When the speed is higher than 4.0 m / min, heat transfer is low and the resin of the adhesive layer 15 is not sufficiently melted, so that the transfer layer 10 does not adhere to the shrink base material 2.

  By transferring each layer including the conductive circuit layer 14 to the shrink base material 2, the conductive circuit layer 14 can be easily installed on the shrink base material 2 without shrinking the shrink base material 2.

  The shrink film 3 with conductive circuit of the present invention can be heat-shrinked and attached to a molded product or the like. The mounting location may be a location where the shrinkage rate is large when the shrink film 3 with conductive circuit is thermally contracted, or may be a small location. When the molded product is, for example, a bottle, examples of the portion having a large shrinkage rate include a mouth portion, a constricted portion, and a bottom portion. . Since the conductive circuit layer 14 is formed using the ink described above, it has elasticity. Therefore, even if the shrink film 3 with a conductive circuit is thermally contracted and mounted on a molded product having a cubic curved surface, the conductive circuit can follow the cubic curved surface.

  The manufacturing method of the shrink film with a conductive circuit of this invention can further have the process of mounting | wearing an electronic component on the shrink film 3 with a conductive circuit so that it may conduct | electrically_connect with the conductive circuit layer 14. FIG. Examples of the electronic component include an IC chip. In this case, the conductive circuit layer 14 on the base sheet 11 is formed as an antenna 6 patterned in a shape that is electrically connected to the IC chip 5 (see FIG. 4). The antenna 6 is a portion through which a current generated when the magnetic flux generated from the reader / writer passes through the antenna 6 flows. This current is supplied from the antenna 6 to the IC chip 5 to activate the IC chip 5 and exchange information with the reader / writer.

  When the protective layer 12 and the pattern layer 13 are not formed on the shrink film 3 with the conductive circuit, the antenna 6 and the IC chip are mounted by mounting the IC chip 5 through a conductive adhesive applied on the antenna 6, for example. 5 can be conductively connected. When the protective layer 12 and the pattern layer 13 are formed on the shrink film 3 with a conductive circuit, for example, the antenna 6 and the IC chip 5 can be conductively connected by the following method. (1) A hole reaching the antenna 6 through the protective layer 12 and the picture layer 13 is provided, (2) the hole is filled with a conductive paste, and (3) via a conductive adhesive applied on the conductive paste. The IC chip 5 is attached.

  The electronic component can be mounted before obtaining the shrink film 3 with conductive circuit. In this case, the IC chip 5 is mounted on the transfer sheet 1 or the shrink base material 2.

  When the IC chip 5 is mounted on the transfer sheet 1, the conductive circuit layer 14 is formed as an antenna 6 that is patterned into a shape that is electrically connected to the IC chip 5. Next, the transfer sheet 1 is obtained by electrically connecting the antenna 6 and the circuit of the IC chip 5 with a conductive adhesive or the like. By transferring this transfer sheet 1 to the shrink base material 2, the shrink film 3 with a conductive circuit can be obtained.

  When the IC chip 5 is mounted on the shrink base material 2, a conductive adhesive may be applied on the adhesive layer 15 in contact with the circuit of the IC chip 5. In this way, the conductive adhesive is fused by heat and pressure during transfer, and the circuit of the IC chip 5 and the antenna 6 can be conductively connected.

  When the IC chip 5 is mounted before obtaining the shrink film 3 with the conductive circuit, by appropriately selecting the thickness and material of the base sheet 11, the transfer layer 10, and the shrink base material 2, The IC chip 5 can be protected from pressure.

  In addition to the IC chip, electronic components such as a display module, a touch panel, a solar cell, and various sensors (gas sensor, heat sensor, pressure sensor) can be used.

  The shrink film with a conductive circuit of the present invention can be obtained as described above.

1: Transfer sheet 10: Transfer layer 11: Base sheet 12: Protective layer 13: Picture layer 14: Conductive circuit layer 15: Adhesive layer 2: Shrink base material 3: Shrink film with conductive circuit 4: Roller 5: IC chip 6: antenna

Claims (6)

Forming a transfer layer including a conductive circuit layer formed using a stretchable ink on a base sheet to obtain a transfer sheet;
The transfer sheet and the shrink substrate are laminated, the laminate is passed between heated rollers rotating in opposite directions, and heat and pressure are applied to the laminate to transfer the transfer layer to the shrink substrate. And removing the base sheet from the laminate ,
The heat is 170 ° C. to 210 ° C., the pressure is 0.3 MPa to 1.2 MPa, and the application time of the heat and the pressure is expressed by a relative moving speed of the laminate and the roller, and is 0.5 m / The manufacturing method of the shrink film with a conductive circuit which is min-4.0m / min . The manufacturing method of the shrink film with a conductive circuit of Claim 1 further equipped with the process of forming a pattern layer between the said base sheet and the said conductive circuit layer. The manufacturing method of the shrink film with a conductive circuit of Claim 2 further equipped with the process of forming a protective layer on the said pattern layer. The inks are silver, PEDOT, carbon black, including any one of the carbon nanotube manufacturing method of the conductive circuit with shrink film according to any one of claims 1 to 3. After removing the base sheet from said stack, said to conduct with the conductive circuit layer, wherein further comprising the step of mounting the electronic component on a transfer layer, according to any one of claims 1 4 Manufacturing method of shrink film with conductive circuit. 2. The method of claim 1 , further comprising mounting an electronic component on the conductive circuit layer or on the shrink base material so as to be electrically connected to the conductive circuit layer before the transfer sheet and the shrink base material are laminated. method for producing a conductive circuit with the shrink film according to any one of the 4.

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