JP6099344B2 - 配線が分離しやすいようにバックプレーンを平行移動させることを具現化する方法及びシステム - Google Patents
配線が分離しやすいようにバックプレーンを平行移動させることを具現化する方法及びシステム Download PDFInfo
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- JP6099344B2 JP6099344B2 JP2012211618A JP2012211618A JP6099344B2 JP 6099344 B2 JP6099344 B2 JP 6099344B2 JP 2012211618 A JP2012211618 A JP 2012211618A JP 2012211618 A JP2012211618 A JP 2012211618A JP 6099344 B2 JP6099344 B2 JP 6099344B2
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- backplane
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- 238000000034 method Methods 0.000 title claims description 31
- 238000000926 separation method Methods 0.000 title description 7
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- 230000003287 optical effect Effects 0.000 claims description 12
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- -1 optical waveguides Substances 0.000 claims description 3
- 230000010354 integration Effects 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000012423 maintenance Methods 0.000 description 9
- 238000009423 ventilation Methods 0.000 description 7
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- 238000010586 diagram Methods 0.000 description 5
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- 230000004048 modification Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 3
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- 230000007613 environmental effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010720 hydraulic oil Substances 0.000 description 1
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- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1434—Housings for electronics exposed to high gravitational force; Cylindrical housings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T50/00—Aeronautics or air transport
- Y02T50/40—Weight reduction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Description
(a)航空機内に多次元バックプレーンを設置し、このバックプレーンには複数のコネクタが装着され、バックプレーン内に形成された導電体によって相互接続されたコネクタには接点が付随している、(b)機体側配線をバックプレーンのコネクタの第1部分に取り付ける、(c)電子機器の電気的コネクタをバックプレーンの対応するコネクタに取り付ける
の内の少なくとも一つを含む。ある実施形態では、本明細書に記載する方法、システム、及びコンピュータが読み取り可能な媒体の技術的効果は下記:
(a)航空機内に多次元バックプレーンを設置し、このバックプレーンには複数のコネクタが装着され、バックプレーン内に形成された導電体によって相互接続されたコネクタには接点が付随している、(b)機体側配線をバックプレーンのコネクタの第1部分に取り付ける、(c)電子機器の電気的コネクタをバックプレーンの対応するコネクタに取り付ける
の内の少なくとも一つを含む。
200 航空機
300 航空機
302 航空機の外壁
304 フレーム室
306 フレーム室
308 フレーム室
310 フレーム室
320 バックプレーン
330 配線インターフェース
340 機体側配線
342 機体側配線
344 機体側配線
346 機体側配線
350 貫通フレーム
352 貫通フレーム
360 床
370 貨物室
380 コネクタ
384 光コネクタ
390 強制換気プレナム
400 バックプレーン
410 コネクタ
420 複合材料層
430 フレキシブル回路層
440 ビア
450 型
Claims (9)
- 航空機内の機器を相互接続させる方法であって、
航空機(200、300)内に、複数のコネクタ(380、410)が装着された多次元バックプレーン(320、400)を設置するステップであって、前記コネクタ(380、410)は前記多次元バックプレーン(320、400)内に形成された導電体、光導波路、空気配管、及び油圧パイプのうちの一又は複数によって相互接続され、前記多次元バックプレーン(320、400)は、航空機(200、300)に付随する複数のフレーム室(304、306、308、310)全域に設置される、ステップと、
機体側配線(340、342、344、346)を前記多次元バックプレーン(320、400)のコネクタ(380、410)の第1部分に取り付けるステップと、
前記機器のコネクタを、前記多次元バックプレーン(320、400)の対応するコネクタ(380、410)に取り付けるステップ
を含む方法。 - 航空機(200、300)内に多次元バックプレーン(320、400)を設置するステップが、複数の航空機の機器アイテムに付随する電子機器の配線インターフェース(330)を隣接するフレーム室(304、306、308、310)に平行移動させて、機体側配線(340、342、344、346)と接続させることを含む、請求項1に記載の方法。
- 航空機(200、300)内に多次元バックプレーン(320、400)を設置するステップが、航空機(200、300)の外壁(302)の輪郭をたどる多次元バックプレーン(320、400)を設置することを含む、請求項1又は2に記載の方法。
- 航空機(200、300)の外壁(302)の輪郭をたどる多次元バックプレーン(320、400)を設置するステップが、航空機(200、300)の客室の後部から床(360)を通って貨物室(370)の中まで、外壁(302)の輪郭をたどる多次元バックプレーン(320、400)を設置することを含む、請求項3に記載の方法。
- 航空機(200、300)内に多次元バックプレーン(320、400)を設置するステップが、電子機器のアイテム及び機体側配線(340、342、344、346)のうちの少なくとも1つと、複数の電子機器アイテムとを系統分離させる多次元バックプレーン(320、400)を設置することを含む、請求項1乃至4のいずれか1項に記載の方法。
- 多次元バックプレーン(320、400)であって、
複数の複合層(420)と、
導電体を備え、前記複数の複合層(420)の間に配置された複数のフレキシブル回路層(430)と、
前記多次元バックプレーン(320、400)に取り付けられ、導電体のうちの特定の一つと係合する接点を含む複数のコネクタ(380、410)であって、第1部分は機体側配線(340、342、344、346)に付随する嵌合コネクタに取り付けて使用可能であり、第2部分は船上に配備される電子機器に付随する嵌合コネクタに取り付けて使用可能である複数のコネクタ(380、410)と
を含み、
前記多次元バックプレーン(320、400)は、航空機(200、300)に付随する複数のフレーム室(304、306、308、310)全域に設置される、多次元バックプレーン(320、400)。 - 前記複数の複合層(420)と、前記複数のフレキシブル回路層(430)は三次元形状を含む、請求項6に記載の多次元バックプレーン(320、400)。
- 前記多次元バックプレーン(320、400)は、複数の航空機の機器アイテムに付随する電子機器の配線インターフェース(330)を隣接するフレーム室(304、306、308、310)の中へ平行移動させて、機体側配線(340、342、344、346)と接続させる、請求項6または7に記載の多次元バックプレーン(320、400)。
- 前記多次元バックプレーン(320、400)が、航空機(200、300)の外壁(302)の輪郭をたどる、請求項6乃至8のいずれか1項に記載の多次元バックプレーン(320、400)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/246,470 | 2011-09-27 | ||
US13/246,470 US8936217B2 (en) | 2011-09-27 | 2011-09-27 | Methods and systems for incorporating translating backplanes to facilitate wire separation |
Publications (3)
Publication Number | Publication Date |
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JP2013071731A JP2013071731A (ja) | 2013-04-22 |
JP2013071731A5 JP2013071731A5 (ja) | 2016-12-01 |
JP6099344B2 true JP6099344B2 (ja) | 2017-03-22 |
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JP2012211618A Active JP6099344B2 (ja) | 2011-09-27 | 2012-09-26 | 配線が分離しやすいようにバックプレーンを平行移動させることを具現化する方法及びシステム |
Country Status (6)
Country | Link |
---|---|
US (1) | US8936217B2 (ja) |
EP (2) | EP2574556B1 (ja) |
JP (1) | JP6099344B2 (ja) |
CN (1) | CN103072699B (ja) |
CA (1) | CA2783783C (ja) |
RU (1) | RU2625915C2 (ja) |
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2012
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- 2012-09-24 RU RU2012140710A patent/RU2625915C2/ru active
- 2012-09-24 EP EP12185713.0A patent/EP2574556B1/en active Active
- 2012-09-24 EP EP19175618.8A patent/EP3566950B1/en active Active
- 2012-09-26 JP JP2012211618A patent/JP6099344B2/ja active Active
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RU2625915C2 (ru) | 2017-07-19 |
EP2574556A3 (en) | 2017-07-19 |
CA2783783A1 (en) | 2013-03-27 |
EP3566950A1 (en) | 2019-11-13 |
EP3566950B1 (en) | 2021-04-28 |
EP2574556B1 (en) | 2019-07-31 |
US8936217B2 (en) | 2015-01-20 |
US20130075530A1 (en) | 2013-03-28 |
JP2013071731A (ja) | 2013-04-22 |
CN103072699B (zh) | 2016-06-15 |
CA2783783C (en) | 2015-06-09 |
RU2012140710A (ru) | 2014-03-27 |
EP2574556A2 (en) | 2013-04-03 |
CN103072699A (zh) | 2013-05-01 |
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