JP6068318B2 - Electronic device and method for manufacturing electronic device - Google Patents

Description

  The present invention relates to an electronic device that transmits a sound to a user by vibrating a panel by applying a predetermined electrical signal to a piezoelectric element and transmitting the vibration of the panel to a human body.

  In Patent Document 1, in an electronic device such as a mobile phone terminal, a piezoelectric element is attached to a panel in the electronic device, and the panel is vibrated due to deformation of the piezoelectric element, so that a human body is attached to an object in contact with the panel. What transmits vibration sound is described. Patent Document 1 describes that human body vibration sound is sound transmitted to the user's auditory nerve through a part of the user's body (for example, the cartilage of the outer ear) that contacts the vibrating object. ing.

Japanese Patent No. 5270783

  In patent document 1, examination of electronic device design is not made.

  An object of the present invention is to provide an electronic device having excellent design in an electronic device in which a piezoelectric element is attached to a panel.

  An electronic apparatus according to the present invention includes a panel, a casing to which the panel is attached, a joining member for attaching the panel to the casing, and a piezoelectric element attached to the panel. Due to the deformation of the element, the panel vibrates and transmits a human body vibration sound to an object in contact with the panel, and a space is formed by the panel, the housing, and the joining member, At least two holes communicating from the space to the outside of the space are formed in the space, and the opening surfaces of the two holes are not parallel to each other.

  The space may be filled with an adhesive, and the adhesive may be filled in a part or all of at least one of the two holes.

  The adhesive may be disposed in the vicinity of the piezoelectric element in the longitudinal direction of the piezoelectric element, and may have higher adhesive strength than the bonding member when solidified.

  An electronic device manufacturing method according to the present invention includes a panel, a housing to which the panel is attached, a joining member for attaching the panel to the housing, and a piezoelectric element attached to the panel. A method of manufacturing an electronic device that transmits a human body vibration sound to an object that contacts the panel due to vibration of the panel due to deformation of the piezoelectric element, the panel, the casing, and the joining member, A space is formed, and at least two holes communicating from the space to the outside of the space are formed in the space, and the space is filled with an adhesive via the first hole of the at least two holes. In addition, the gas existing in the space is exhausted out of the space through a second hole different from the first hole.

  The opening surfaces of the two holes may not be parallel to each other.

  The adhesive may be filled in a part or all of at least one of the two holes.

  The joining member may be a double-sided tape, and the second hole may be formed by providing a slit in the double-sided tape.

  The electronic device according to the present invention can provide an electronic device with excellent design in an electronic device in which a piezoelectric element is attached to a panel.

It is a figure which shows the functional block of the electronic device which concerns on one Embodiment of this invention. It is a figure which shows the suitable shape of a panel. It is a figure which shows the mounting structure of the electronic device 1 which concerns on embodiment of this invention. It is a figure which shows an example of the vibration of the panel of the electronic device 1 which concerns on embodiment of this invention. It is a figure which shows the schematic aspect of adhesion | attachment of a panel and a housing | casing. It is a figure for demonstrating the 1st filling method of the adhesive agent in this embodiment. It is a figure for demonstrating the 2nd filling method of the adhesive agent in this embodiment. It is a figure for demonstrating the 3rd filling method of the adhesive agent in this embodiment. It is a figure which shows the comparative example of the aspect of adhesion | attachment of a panel and a housing | casing. It is a figure which shows the example of the vibration of a panel for every case where the adhesion | attachment methods differ. It is a figure which shows the frequency characteristic of the panel in embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing functional blocks of an electronic device 1 according to an embodiment of the present invention. The electronic device 1 is, for example, a mobile phone (smart phone), and includes a panel 10, a display unit 20, a piezoelectric element 30, an input unit 40, and a control unit 50.

  The panel 10 is a touch panel that detects contact or a cover panel that protects the display unit 20. For example, it is formed of a synthetic resin such as glass or acrylic, sapphire crystal, or the like. Here, the sapphire crystal is made of aluminum oxide (AlO 3) crystal and manufactured industrially. The shape of the panel 10 may be a plate shape. The panel 10 may be a flat plate or a curved panel having a curved surface in part. When the panel 10 is a touch panel, the touch of a user's finger, pen, stylus pen, or the like is detected. As a detection method of the touch panel, an arbitrary method such as a capacitance method, a resistance film method, a surface acoustic wave method (or an ultrasonic method), an infrared method, an electromagnetic induction method, a load detection method, or the like can be used.

  The display unit 20 is a display device such as a liquid crystal display, an organic EL display, or an inorganic EL display. The display unit 20 is provided on the back surface of the panel 10. The display unit 20 is disposed on the back surface of the panel 10 by a bonding member (for example, an adhesive). The display unit 20 may be disposed apart from the panel 10 and supported by the housing of the electronic device 1. Or in a suitable mode, display part 20 may be joined to the back of panel 10 with a joining member (for example, adhesives). The joining member is, for example, an elastic resin such as an optical elastic resin in which the refractive index of light to be transmitted is controlled. The display unit 20 displays various information through the bonding member and the panel 10. By bonding the display unit 20 to the back surface of the panel 10, the attenuation of vibration of the panel 10 can be adjusted as will be described later.

  The piezoelectric element 30 is an element that expands or contracts or bends according to an electromechanical coupling coefficient of a constituent material by applying an electric signal (voltage). For these elements, for example, those made of ceramic or quartz are used. The piezoelectric element 30 may be a unimorph, bimorph, or multilayer piezoelectric element. The stacked piezoelectric element includes a stacked bimorph element in which bimorphs are stacked (for example, 16 layers or 24 layers are stacked). The laminated piezoelectric element is composed of a laminated structure of a plurality of dielectric layers made of, for example, PZT (lead zirconate titanate) and electrode layers disposed between the plurality of dielectric layers. When an electric signal (voltage) is applied to the laminated piezoelectric element, the displacement of the bending occurs in the lamination direction of each layer, that is, the thickness direction.

  The input unit 40 receives an operation input from a user, and includes, for example, an operation button (operation key). In addition, when the panel 10 is a touch panel, the panel 10 can also accept the operation input from a user by detecting the contact from a user.

  The control unit 50 is a processor that controls the electronic device 1. The controller 50 applies a predetermined electrical signal (voltage corresponding to the audio signal) to the piezoelectric element 30. The voltage applied to the piezoelectric element 30 by the control unit 50 is, for example, ± 15 V, which is higher than ± 5 V, which is an applied voltage of a so-called panel speaker for the purpose of conducting sound by air conduction sound instead of human body vibration sound. It may be. As a result, even when the user presses the panel 10 against his / her body with a force of 3N or more (5N to 10N), for example, the panel 10 is sufficiently vibrated, It is possible to generate a human body vibration sound through the section. Note that how much applied voltage is used can be appropriately adjusted according to the fixing strength of the panel 10 to the casing or the support member or the performance of the piezoelectric element 30. When the control unit 50 applies an electrical signal to the piezoelectric element 30, the piezoelectric element 30 causes a deflection displacement in the thickness direction. At this time, the panel 10 to which the piezoelectric element 30 is attached is deformed in accordance with the displacement of the piezoelectric element 30, and the panel 10 vibrates. For this reason, the panel 10 generates air conduction sound. In addition, the panel 10 transmits a human body vibration sound to an object in contact with the panel 10. Examples of the object include a part of the user's body (such as cartilage in the outer ear). For example, the control unit 50 can apply an electric signal corresponding to a voice signal related to the voice of the other party to the piezoelectric element 30 and generate air conduction sound and human body vibration sound corresponding to the voice signal. The audio signal may relate to a ringing melody or a music piece including music. Note that the audio signal applied to the electrical signal may be based on music data stored in the internal memory of the electronic device 1, or music data stored in an external server or the like is reproduced via a network. May be.

  The panel 10 vibrates not only in the attachment region to which the piezoelectric element 30 is attached, but also in a region away from the attachment region. The panel 10 has a plurality of locations that vibrate in a direction intersecting the main surface of the panel 10 in the vibrating region, and the amplitude value of the vibration is increased from positive to negative with time in each of the plurality of locations. Or vice versa. At a certain moment, the panel 10 vibrates in such a manner that a portion having a relatively large vibration amplitude and a portion having a relatively small vibration amplitude are distributed randomly or periodically throughout the panel 10 at first glance. That is, vibrations of a plurality of waves are detected over the entire panel 10. Even when the user presses the panel 10 against his / her body with a force of 5N to 10N, for example, the control unit 50 does not attenuate the piezoelectric element 30 in order to prevent the above-described vibration of the panel 10 from being attenuated. The applied voltage may be ± 15V. Therefore, the user can hear the sound by bringing his / her ear into contact with a region away from the above-described region where the panel 10 is attached.

  Here, the panel 10 may be approximately the same size as the user's ear. The panel 10 may be larger than the user's ear, as shown in FIG. In this case, when the user listens to the sound, the entire ear is easily covered with the panel 10 of the electronic device 1, so that it is difficult for ambient sounds (noise) to enter the ear canal. Panel 10 is an area wider than an area having a length corresponding to the distance from the lower leg of the anti-annulus (lower anti-limb) to the anti-tragus and a width corresponding to the distance from the tragus to the anti-annulus. Should just vibrate. The panel 10 preferably has a length corresponding to the distance between a portion near the upper leg of the ankle ring (upper pair leg) in the ear ring and the earlobe, and a distance between the tragus and a portion near the ear ring in the ear ring. It suffices that a region having a width corresponding to is vibrated. In this example, the length direction is the longitudinal direction 2a in which the panel 10 extends, and the piezoelectric element 30 is disposed closer to one end from the center. The width direction is a direction 2b orthogonal to the longitudinal direction. The region having such a length and width may be a rectangular region, or may be an elliptical shape having the above length as the major axis and the width as the minor axis. The average size of Japanese ears can be found by referring to the Japanese human body size database (1992-1994) created by the Human Life Engineering Research Center (HQL). If the panel 10 is larger than the average size of Japanese ears, the panel 10 is considered to be large enough to cover the entire foreign ear.

  By having the dimensions and shapes as described above, the panel 10 can cover the user's ears and is tolerant of misalignment when applied to the ears.

  The electronic device 1 can transmit air conduction sound and vibration sound via a part of the user's body (for example, cartilage of the outer ear) to the user by the vibration of the panel 10. Therefore, when outputting a sound having a volume equivalent to that of a conventional dynamic receiver, the sound transmitted to the periphery of the electronic device 1 due to the vibration of the air due to the vibration of the panel 10 is less than that of the dynamic receiver. Therefore, it is suitable, for example, when listening to a recorded message on a train or the like.

  In addition, since the electronic device 1 transmits vibration sound due to the vibration of the panel 10, even if the user wears an earphone or a headphone, for example, the user can touch the electronic device 1 to contact the earphone or the headphone. Sounds can be heard through headphones and body parts.

  The electronic device 1 transmits sound to the user by the vibration of the panel 10. Therefore, when the electronic device 1 does not include a separate dynamic receiver, it is not necessary to form an opening (sound outlet) for sound transmission in the housing, and the waterproof structure of the electronic device 1 can be simplified. In addition, when the electronic device 1 is provided with a dynamic receiver, the sound emission port is preferably closed by a member that allows gas to pass but not liquid. An example of the member that allows gas to pass but not liquid is Gore-Tex (registered trademark).

  FIG. 3 is a diagram showing a mounting structure of the electronic device 1 according to the embodiment of the present invention. 3A is a front view, and FIG. 3B is a cross-sectional view taken along the line bb in FIG. 3A. The electronic device 1 shown in FIG. 3 is a smartphone in which a touch panel, which is a glass plate, is arranged as a panel 10 on the front surface of a housing 60 (for example, a metal or resin case). As will be described later, the panel 10 is bonded to the housing 60 by a bonding member and supported by the housing 60. The joining member is, for example, an adhesive or a double-sided tape. The input unit 40 is also supported by the housing 60. The display unit 20 and the piezoelectric element 30 are each bonded to the panel 10 with a bonding member (not shown). The joining member is an adhesive having a thermosetting property or an ultraviolet curable property, a double-sided tape, or the like, and may be, for example, an optical elastic resin which is a colorless and transparent acrylic ultraviolet curable adhesive. The panel 10, the display part 20, and the piezoelectric element 30 are each substantially rectangular.

  The display unit 20 is disposed approximately at the center in the short direction of the panel 10. The piezoelectric element 30 is disposed at a predetermined distance from an end portion in the longitudinal direction of the panel 10 and is disposed in the vicinity of the end portion so that the longitudinal direction of the piezoelectric element 30 is along the short side of the panel 10. The display unit 20 and the piezoelectric element 30 are arranged side by side in a direction parallel to the inner surface of the panel 10.

  FIG. 4 is a diagram illustrating an example of vibration of the panel 10 of the electronic device 1 according to the embodiment of the present invention. In the electronic device 1 according to the first embodiment, the display unit 20 is attached to the panel 10. For this reason, the lower part of the panel 10 is less likely to vibrate than the upper part of the panel 10 to which the piezoelectric element 30 is attached. That is, the vibration generated by the piezoelectric element 30 in the longitudinal direction 2a of the panel 10 can be attenuated. Therefore, sound leakage due to vibration of the lower portion of the panel 10 at the lower portion of the panel 10 can be reduced.

  As described above, according to the electronic apparatus 1 according to the present embodiment, the panel 10 is deformed due to the deformation of the piezoelectric element 30 attached to the back surface of the panel 10, and the object that contacts the deformed panel 10 is detected. It conveys air conduction sound and vibration sound to it. Further, when the case 60 is deformed instead of the panel 10, the user tends to drop the terminal when generating vibration, whereas when the panel 10 is vibrated, Things are hard to happen.

  The piezoelectric element 30 is joined to the panel 10 by a joining member. Thereby, the piezoelectric element 30 can be attached to the panel 10 in a state in which the degree of freedom of deformation of the piezoelectric element 30 is hardly hindered. The joining member can be a non-heating type curable adhesive. Thereby, there is an advantage that thermal stress shrinkage hardly occurs between the piezoelectric element 30 and the panel 10 at the time of curing. The joining member can be a double-sided tape. Thereby, there is an advantage that contraction stress is hardly applied between the piezoelectric element 30 and the panel 10 as in the case of using an adhesive.

  Here, the bonding structure between the panel 10 and the housing 60 will be described with reference to FIG. FIG. 5 is a diagram showing a schematic mode of adhesion between the panel 10 and the housing 60. FIG. 5 shows a state where the panel 10 is separated from the housing 60. On the housing 60 side of FIG. 5, a position 31 where the piezoelectric element 30 is disposed in a state where the housing 60 and the panel 10 are attached is also shown. As shown on the housing 60 side, the panel 10 and the housing 60 are bonded by the adhesive 11 and the bonding member 12. The adhesive 11 is temporarily non-heating type curable adhesive having fluidity, for example, and is disposed by being filled in the gap between the panel 10 and the housing 60. The adhesive 11 may be, for example, a moisture curable elastic adhesive that cures by reacting with moisture (humidity) in the air. Such a moisture curable elastic adhesive is mainly composed of, for example, a special polymer containing a silyl group. The joining member 12 is, for example, a double-sided tape containing a foam material. The double-sided tape with a foam material is, for example, a double-sided tape in which an acrylic pressure-sensitive adhesive is laminated on both sides of a polyethylene base material having a micro closed cell structure.

  The adhesive 11 and the joining member 12 are not limited to those mentioned above. It is preferable that the adhesive 11 is more difficult to deform than the joining member 12 when solidified. The ease of deformation is measured by, for example, a spring type hardness tester or a penetration meter compliant with JIS standards. It is preferable that the adhesive 11 has a higher adhesive strength than the joining member 12 when solidified. The adhesive force here is measured by a method defined in JISZ0237 (including both new and old), for example. It is preferable that the adhesive 11 has a stronger adhesive strength than the joining member 12 when solidified. The adhesive strength here is, for example, a tensile adhesive strength measured by a method defined in JISK6849.

  The adhesive 11 is disposed in the vicinity of the piezoelectric element 30. Specifically, on the left and right sides of the piezoelectric element 30, that is, in the vicinity of the end portion on the side of the direction 2b (this is the short direction of the panel 10) which is the longitudinal direction of the piezoelectric element 30 and the expansion / contraction direction. Arranged. However, the case where the piezoelectric element 30 is disposed on either the left or right side is also included in the present embodiment. On the other hand, the joining member 12 is disposed along the outer periphery of the panel 10. Moreover, the joining member 12 is arrange | positioned so that the adhesive agent 11 may be enclosed. The panel 10 is attached to the housing 60 by the adhesive 11 and the joining member 12 arranged as described above. Here, the adhesive 11 and the joining member 12 may have a part overlapping each other. In this case, the adhesive 11 and the bonding member 12 can be firmly bonded to each other, so that the panel 10 and the housing 60 can be firmly bonded. In addition, the adhesive 11 and the joining member 12 are waterproof, and reduce water intrusion from the gap between the panel 10 and the housing 60.

  FIG. 6 is a diagram for explaining a first filling method of the adhesive 11 in the present embodiment when the adhesive 11 is the moisture-curing elastic adhesive described above.

  FIG. 6A shows an enlarged view of the upper front portion of the housing 60 before the panel 10 is bonded. FIG. 6B shows an XX cross-sectional view of the housing 60. FIG. 6C shows an XX cross-sectional view of the housing 60 after the adhesive 11 is filled. 6B and 6C show a state where the panel 10 is arranged.

  As shown in FIG. 6A, the housing 60 is provided with a recess 100 for filling the adhesive 11. The bottom of the recess 100 is made of the housing 60, and the side surface of the recess 100 is made of the joining member 12. When bonding the panel 10, the panel 10 is first attached to the housing 60 via the bonding member 12. At this time, as shown in FIG. 6B, a space 110 is formed by the recess 100 (that is, the joining member 12 and / or the housing 60) and the panel 10. A first hole 101 that communicates from the space 110 to the outside of the space is formed in the space 110. Specifically, a first hole 101 communicating with the back side is formed at the bottom of the recess 100 forming the space 110. Next, the adhesive agent 11 is filled into the space 110 through the hole 101 from the back side of the housing 60 (arrow 103). At this time, for example, a tapered nozzle is used as the nozzle for discharging the adhesive 11 so that the outer wall of the nozzle and the outer periphery of the opening of the hole 101 come into contact with each other without generating a gap between the hole 101 and the nozzle. The space 110 can be filled with the adhesive 11. In this way, the panel 10 can be bonded to the housing 60 by the adhesive 11.

  The adhesive 11 is discharged into at least a part of the hole 101 communicating with the space 110 after being filled into the space 110 from the nozzle. That is, as shown in FIG. 6C, the adhesive 11 is filled in the space 110 and is also filled in part or all of the hole 101 (the portion of the adhesive 11 is indicated by a small dot pattern). ing). By adopting such an adhesive structure, the adhesive 11 filled in the space 110 integrally enters the hole 101, so that the bottom of the recess 100 is compared with the case where the hole 101 is not filled with the adhesive. And the so-called anchor effect that improves the adhesive strength between the solidified adhesive 11. Further, since the hole 101 is formed in a direction communicating with the back side of the housing 60, resistance to tension, impact, and the like in a direction perpendicular to the direction is further improved.

  In the first filling method, the hole 101 is formed in a direction communicating with the back side of the housing 60, but is not limited thereto. For example, the hole 101 may be formed in the panel 10 or the joining member 12.

  FIG. 7 is a diagram for explaining a second filling method of the adhesive 11 in the present embodiment. FIG. 7A shows an enlarged view of the upper front portion of the housing 60 before the panel 10 is bonded. FIG. 7B shows an XX cross-sectional view of the housing 60. FIG. 7C shows an XX cross-sectional view of the housing 60 after the adhesive 11 is filled. 7B and 7C show a state in which the panel 10 is arranged.

  As shown in FIG. 7A, the housing 60 is provided with a recess 100 for filling the adhesive 11. The bottom of the recess 100 is made of the housing 60, and the side surface of the recess 100 is made of the joining member 12. When bonding the panel 10, the panel 10 is first attached to the housing 60 via the bonding member 12. At this time, as shown in FIG. 7B, a space 110 is formed by the recess 100 and the panel 10. The space 110 is formed with a first hole 101 and a second hole 102 that communicate from the space 110 to the outside of the space. Specifically, a first hole 101 and a second hole 102 communicating with the back side are formed at the bottom of the recess 100 forming the space 110. Next, the adhesive agent 11 is filled into the space 110 through the hole 101 from the back side of the housing 60, and the panel 10 is attached to the housing 60 through the adhesive agent 11. At this time, the adhesive 11 is discharged from the nozzle into the first hole 101, the adhesive 110 is filled in the space 110 communicating with the first hole, and the gas present in the space 110 is in the second hole 102. Exhausted from. By adopting such a filling method, even when the nozzle is brought into contact with the hole 101 and the adhesive 11 is filled into the space 110 without generating a gap, the gas in the space 110 can be exhausted.

  After the adhesive 11 is filled into the space 110 from the nozzle, it is also discharged into at least a part of the hole 101 or the hole 102 communicating with the space 110. That is, as shown in FIG. 7C, the adhesive 11 fills the space 110 and also fills at least part or all of the hole 101 or the hole 102. By adopting such an adhesive structure, the adhesive 11 filled in the space 110 integrally enters the hole 101 or the hole 102 as well, so that the adhesive is not filled in the hole 101 and the hole 102 as compared with the case where the adhesive is not filled. Thus, the adhesive strength between the bottom of the recess 100 and the solidified adhesive 11 is improved. As a result, the adhesive strength between the panel 10 and the bottom of the recess 100 (housing 60) is improved. Further, since the hole 101 is formed in a direction communicating with the back side of the housing 60, resistance to tension, impact, and the like in a direction perpendicular to the direction is further improved.

  In the second filling method, the hole 101 is formed in a direction communicating with the back side of the housing 60, but the present invention is not limited to this.

  FIG. 8 is a view for explaining a third filling method of the adhesive 11 in the present embodiment. FIG. 8A shows an enlarged view of the upper front portion of the housing 60 before the panel 10 is bonded. FIG. 8B shows an XX cross-sectional view of the housing 60. FIG. 8C shows an XX cross-sectional view of the housing 60 after the adhesive 11 is filled. 8B and 8C show a state in which the panel 10 is arranged.

  As shown in FIG. 8A, the housing 60 is provided with a recess 100 for filling the adhesive 11. The bottom of the recess 100 is made of the housing 60, and the side surface of the recess 100 is made of the joining member 12. When bonding the panel 10, the panel 10 is first attached to the housing 60 via the bonding member 12. At this time, as shown in FIG. 8B, a space 110 is formed by the recess 100 and the panel 10. The space 110 is formed with a first hole 101 and a second hole 102 that communicate from the space 110 to the outside of the space. The opening surface of the first hole 101 and the opening surface of the second hole 102 are not parallel to each other. That is, as will be described later, it is only necessary that the second hole 102 is formed so that the joining member 12 for the second hole 102 is not disposed at the edge of the electronic device 1. Specifically, the first hole 101 is formed at the bottom of the recess 100 forming the space 110 in a direction communicating with the back side, whereas the second hole 102 is formed on the side surface of the space 110. That is, it is formed on the side surface of the recess 100 in a direction communicating with an adjacent space (a surrounding space where the piezoelectric element 30 is located). Further, for example, a double-sided tape is disposed on the side surface of the recess 100 as the bonding member 12, and the second hole 102 is formed by providing a slit in the double-sided tape. Next, the adhesive agent 11 is filled into the space 110 through the hole 101 from the back side of the housing 60, and the panel 10 is attached to the housing 60 through the adhesive agent 11. At this time, the adhesive 11 is discharged from the nozzle into the first hole 101, the adhesive 110 is filled in the space 110 communicating with the first hole, and the gas present in the space 110 is in the second hole 102. Exhausted from.

  After the adhesive 11 is filled into the space 110 from the nozzle, it is also discharged into at least a part of the hole 101 or the hole 102 communicating with the space 110.

  That is, as shown in FIG. 8C, the adhesive 11 fills the space 110 and fills at least a part or all of the hole 101 or the hole 102. By adopting such an adhesive structure, the adhesive 11 filled in the space 110 integrally enters the hole 101 or the hole 102 as well, so that the adhesive is not filled in the hole 101 and the hole 102 as compared with the case where the adhesive is not filled. Thus, the adhesive strength between the concave portion 100 and the solidified adhesive 11 is improved. As a result, the adhesive strength between the panel 10 and the recess 100 is improved. In addition, the opening surfaces of the hole 101 and the hole 102 are not parallel to each other, that is, the direction in which the hole 101 and the hole 102 communicate with each other is not parallel to each other. , Further improve.

  When the hole 101 or the hole 102 is formed in the bottom of the recess 100 of the housing 60 as in the embodiment of the present invention, it is necessary to provide another case member on the back side of the recess 100 to provide a waterproof structure. There is. That is, the housing 60 of the electronic device 1 needs to be configured from at least two case members. Here, the housing 60 is again defined as being configured by combining a case member 60a in which the holes 101 and 102 are formed and a case member 60b provided on the back side of the case member 60a. The case member 60 a and the case member 60 b are attached via a joint member 12 such as a double-sided tape having waterproofness, and the joint member 12 has a role of preventing water from entering the hole 101 or the hole 102. .

  In the second filling method, as shown in FIG. 7C, two holes 101 and 102 that are separated by a predetermined distance are formed at the bottom of the case member 60a. And the waterproof structure of the case member 60a is provided by providing the joining members 12 at positions close to the edge of the electronic device 1 (the left side for the hole 101 and the right side for the hole 102), respectively. Is possible. On the other hand, in the third filling method, as shown in FIG. 8 (c), since one hole 101 is formed in the bottom of the case member 60a, the bonding member 12 is provided on the left and right sides of the hole 101 so that the case The waterproof structure of the member 60a can be given. In the third filling method, even if the joining member 12 is provided in the vicinity of the hole 101, a waterproof structure can be provided.

  Therefore, the third filling method can take a layout in which one joining member 12 is not disposed near the edge of the electronic device 1 as compared with the second filling method.

  By the way, when providing a double-sided tape as the joining member 12 in the electronic device 1, the thickness of the electronic device 1 increases by the thickness of the double-sided tape (for example, about 0.4 mm). Therefore, when the double-sided tape is located at the edge of the electronic apparatus 1, the case member 60b must be curved (curved with a larger curvature) or bent at the position to form the bottom and sides. .

  However, in the third filling method, a layout in which the joining member 12 is not disposed near the edge of the electronic device 1 can be taken. Therefore, compared with the second filling method, the thickness of the edge of the electronic device 1 is increased. Can be thinned. That is, the thickness width d ′ of the upper part of the electronic device 1 in the third filling method (FIG. 8C) is greater than the thickness width d of the upper part of the electronic device 1 in the second filling method (FIG. 7C). Can also be reduced.

  Thus, by reducing the thickness of the edge of the electronic device 1, the case member 60b does not need to be greatly curved, and can be formed in a gentle round shape. The shape of the case member (that is, the shape of the housing) is, for example, a shape that can be easily taken by the user. Therefore, according to the 3rd filling method, the electronic device excellent in the design property can be manufactured.

  In the embodiment of the present invention, as described above, the panel 10 is bonded to the housing 60 by the adhesive 11 and the bonding member 12, for example, the panel 10 is bonded only to the bonding member 12, that is, both surfaces as shown in FIG. 9. The frequency characteristics of the panel 10 can be improved as compared with the case where bonding is performed using only the tape.

  FIG. 10 is a diagram illustrating an example of vibration of the panel 10 for each case where the bonding method is different. FIGS. 10A and 10B show the vibration of the panel 10 when a driving signal having a certain frequency is applied to the piezoelectric element 30 when the panel 10 is bonded only by the joining member 12, that is, the double-sided tape. On the other hand, FIGS. 10C and 10D show the adhesive 11 and the joining member 12, that is, when the panel 10 is bonded with the adhesive and the double-sided tape, and the drive signal having the same frequency is applied to the piezoelectric element 30. The vibration of the panel 10 is shown. 10 (a) and 10 (c), and FIG. 10 (b) and FIG. 10 (d) show antiphase vibrations in each case.

  As shown in the drawing, vibration with a larger amplitude is obtained when the panel 10 is bonded with the adhesive and the double-sided tape than when the panel 10 is bonded only with the double-sided tape. Here, the direction of the amplitude of the panel 10 will be seen with reference to the plane (main surface) of the panel 10 when it is not vibrating. The direction of the amplitude is positive on the upper surface and negative on the lower surface. Then, for example, in the short direction 2b of the panel 10, when attention is paid to the center and the left and right ends of the region where the piezoelectric element 30 is mounted, when the panel 10 is bonded only with the double-sided tape, FIG. ), (B), the center portion of the region where the piezoelectric element 30 is mounted on the panel 10 and the left and right end portions of the region where the piezoelectric element 30 is mounted have opposite amplitudes. That is, when the center portion vibrates in the positive direction, the left and right end portions vibrate in the negative direction. When the center part vibrates in the negative direction, the left and right end parts vibrate in the positive direction. On the other hand, when the panel 10 is bonded with an adhesive and a double-sided tape, as shown in FIGS. 10C and 10D, the central portion of the area where the piezoelectric element 30 is mounted on the panel 10 and the piezoelectric The amplitude direction coincides with the left and right ends of the region where the element 30 is mounted.

  This is because the joining member 12 (double-sided tape with foam material) is more easily deformed than the adhesive 11 and has a weak adhesive force. Therefore, when the panel 10 is adhered only by the joining member 12, depending on the frequency of the drive signal. This is because the left and right end portions of the panel 10 vibrate greatly, and as a result, the vibration of the central portion is suppressed. On the other hand, by arranging the adhesive 11 in the longitudinal direction of the piezoelectric element 30, that is, in the expansion / contraction direction 2 b side, the right and left end portions of the panel 10 can be firmly fixed. As a result, the vicinity of the piezoelectric element 30 is obtained. It is possible to avoid suppressing the vibration. By doing so, good sound pressure can be secured.

  FIG. 11 is a diagram illustrating frequency characteristics of the panel 10 according to the embodiment of the present invention. In FIG. 11, the frequency characteristics 91 when the panel 10 is bonded only by the bonding member 12 (when the adhesive 11 is not disposed in the vicinity of both ends in the longitudinal direction of the piezoelectric element 30), and the adhesive 11 and the bonding member 12 are bonded. In this case, frequency characteristics 92 in the case (when the adhesive 11 is disposed in the vicinity of both ends in the longitudinal direction of the piezoelectric element 30) are shown. The horizontal axis represents the frequency of the output sound, and the vertical axis represents the sound pressure.

  As shown by the frequency characteristic 91, when the panel 10 is bonded only by the joining member 12, a “dip” in which the sound pressure drops near 4 kHz occurs. On the other hand, as shown by the frequency characteristic 92, when the panel 10 is bonded with the adhesive 11 and the bonding member 12, the generation of dip can be moved to a band of 6 kHz or more. In other words, it is possible to more reliably avoid the occurrence of the frequency band in which the dip is used in the voice call of the mobile phone at 400 Hz to 3.4 kHz. At the same time, the sound pressure at 3 kHz or higher can be increased. Thus, the frequency characteristics of the panel 10 can be improved by bonding the longitudinal direction of the piezoelectric element 30, that is, the expansion / contraction direction 2 b side with the adhesive 11 and bonding the outer periphery of the panel 10 with the bonding member 12.

  In the bonding mode shown in FIG. 9, a part of the bonding member 12 extends from the outer peripheral portion of the panel 10 to the vicinity of both ends in the longitudinal direction of the piezoelectric element 30. Therefore, compared with the aspect in which the joining member 12 is disposed only on the outer peripheral portion of the panel 10, the acoustic characteristics of the panel 10 are improved. In the bonding mode shown in FIG. 9, the joining member 12 disposed on the outer peripheral portion of the panel 10 and the joining member 12 disposed near both ends in the longitudinal direction of the piezoelectric element 30 are continuous (connected). I can say.

  Although the present invention has been described based on the drawings and embodiments, it should be noted that those skilled in the art can easily make various changes and modifications based on the present disclosure. Therefore, it should be noted that these variations and modifications are included in the scope of the present invention. For example, in the third filling method of the adhesive, the configuration in which the second hole 102 communicating with the space around the piezoelectric element 30 is formed is shown, but the present invention is not limited to this, and the periphery of the display unit 20 or the like. The second hole 102 may be formed so as to communicate with the space. In addition, for example, in the third filling method of the adhesive, the configuration in which the second hole 102 is formed by providing a slit in the double-sided tape that is the bonding member 12 that configures the side surface of the recess 100 is shown. The second hole 102 may be formed by forming at least a part of the side surface of the recess 100 from the housing 60 and forming a groove in the housing 60. Moreover, although the embodiment of the present invention has been described by taking a smartphone as an example, the present invention can be realized even with a foldable mobile phone.

DESCRIPTION OF SYMBOLS 1 Electronic device 10 Panel 11 Adhesive 12 Bonding member 20 Display part 30 Piezoelectric element 40 Input part 50 Control part 60 Case 60a, 60b Case member 100 Concave part 101 1st hole 102 2nd hole 110 Space

Claims (7)

A panel,
A housing to which the panel is attached;
A joining member for attaching the panel to the housing;
A piezoelectric element attached to the panel;
Due to the deformation of the piezoelectric element, the panel vibrates, and is an electronic device that transmits a human body vibration sound to an object in contact with the panel,
A space is formed by the panel, the housing, and the joining member,
In the space, at least two holes communicating from the space to the outside of the space are formed,
The opening surface of the two holes is not parallel to each other. The space is filled with an adhesive,
The electronic device according to claim 1, wherein the adhesive is also filled in part or all of at least one of the two holes. 3. The electronic apparatus according to claim 1, wherein the adhesive is disposed in the vicinity of the piezoelectric element in the longitudinal direction of the piezoelectric element, and has an adhesive strength higher than that of the bonding member when solidified. 4. . A panel,
A housing to which the panel is attached;
A joining member for attaching the panel to the housing;
A piezoelectric element attached to the panel;
Due to the deformation of the piezoelectric element, the panel vibrates, and is a method of manufacturing an electronic device that transmits a human body vibration sound to an object that contacts the panel,
A space is formed by the panel, the housing, and the joining member,
In the space, at least two holes communicating from the space to the outside of the space are formed,
The space is filled with an adhesive through the first of the at least two holes, and the gas existing in the space is exhausted out of the space from a second hole different from the first hole. A method for manufacturing an electronic device. The method of manufacturing an electronic device according to claim 4, wherein the opening surfaces of the two holes are not parallel to each other. The method for manufacturing an electronic device according to claim 4, wherein the adhesive is filled in part or all of at least one of the two holes. The joining member is a double-sided tape,
The method for manufacturing an electronic device according to claim 4, wherein the second hole is formed by providing a slit in the double-sided tape.