JP6054030B2 - 金属錯体量子結晶の作成方法 - Google Patents
金属錯体量子結晶の作成方法 Download PDFInfo
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- JP6054030B2 JP6054030B2 JP2011282474A JP2011282474A JP6054030B2 JP 6054030 B2 JP6054030 B2 JP 6054030B2 JP 2011282474 A JP2011282474 A JP 2011282474A JP 2011282474 A JP2011282474 A JP 2011282474A JP 6054030 B2 JP6054030 B2 JP 6054030B2
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- metal
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- silver
- metal complex
- aqueous solution
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- 239000013078 crystal Substances 0.000 title claims description 29
- 150000004696 coordination complex Chemical class 0.000 title claims description 24
- 238000000034 method Methods 0.000 title claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 38
- 239000004332 silver Substances 0.000 claims description 38
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 239000007864 aqueous solution Substances 0.000 claims description 20
- 239000008139 complexing agent Substances 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 12
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000001556 precipitation Methods 0.000 claims description 5
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 claims description 5
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 claims description 4
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- -1 silver halide Chemical class 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 229940068492 thiosalicylate Drugs 0.000 claims description 3
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000010953 base metal Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 20
- 238000002198 surface plasmon resonance spectroscopy Methods 0.000 description 14
- 238000003411 electrode reaction Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- 239000002096 quantum dot Substances 0.000 description 6
- 229910000906 Bronze Inorganic materials 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 238000001069 Raman spectroscopy Methods 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 229910021607 Silver chloride Inorganic materials 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000003446 ligand Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 3
- 238000004416 surface enhanced Raman spectroscopy Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZSILVJLXKHGNPL-UHFFFAOYSA-L S(=S)(=O)([O-])[O-].[Ag+2] Chemical compound S(=S)(=O)([O-])[O-].[Ag+2] ZSILVJLXKHGNPL-UHFFFAOYSA-L 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000002082 metal nanoparticle Substances 0.000 description 2
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- MWVTWFVJZLCBMC-UHFFFAOYSA-N 4,4'-bipyridine Chemical compound C1=NC=CC(C=2C=CN=CC=2)=C1 MWVTWFVJZLCBMC-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 238000001237 Raman spectrum Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- PLKATZNSTYDYJW-UHFFFAOYSA-N azane silver Chemical compound N.[Ag] PLKATZNSTYDYJW-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- ADZWSOLPGZMUMY-UHFFFAOYSA-M silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Description
(log βi)が8以下の場合、15以上の場合は電極反応速度が早すぎたり、遅すぎたりするので、基板側の電極電位等の調整により電極反応速度を制御するのがよい。
定度定数から電極反応の標準電極電位が得られる。
(ここで E゜は標準電極電位、Rは気体定数、Tは絶対温度、Zはイオン価、Fはファラデー定数を表す。)
従って、電極電位を考慮して担体金属を選択し、両者の電極電位が調和するように制御することにより、金属錯体水溶液中での電極反応を制御してナノ金属クラスタと金属錯体の量子結晶を担体金属上に析出させることができる。
図中、o-TSA、EAは其々オルトチオサルチル酸、エタノールアミンを示す。
Claims (6)
- 金、銀、銅又は白金から選ばれる金属錯塩として安定度定数(logβi)が8以上の錯塩を選択し、金属錯体濃度500〜2000ppmの希薄金属錯体水溶液を調製する一方、担体金属の電極電位を金属錯体より卑なる電位となし、希薄金属錯体水溶液に担体金属を接触させ、両者の電極電位差により、該希薄金属錯体水溶液より少なくとも金属錯体を担体金属上に量子結晶として析出させ、その後前記水溶液と担体金属との接触を解いて金属錯体の量子結晶の析出を停止させることを特徴とする表面プラズモン増強効果を有する金属錯体量子結晶の作成方法。
- 銀錯体量子結晶を作成する方法であって、500〜2000ppmの希薄銀錯体水溶液を用いる請求項1記載の方法。
- 銀錯塩として安定度定数(logβi)が8以上を選択し、希薄水溶液を調製する請求項2記載の方法。
- 銀錯体水溶液がハロゲン化銀と銀錯化剤との反応により形成される請求項2記載の方法。
- 銀錯化剤が、チオ硫酸塩、チオシアン酸塩、亜硫酸塩、チオ尿素、ヨウ化カリ、チオサリチル酸塩、チオシアヌル酸塩からなる群から選ばれる請求項4記載の方法。
- 担体金属が銅合金である請求項2記載の方法。
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JP2011282474A JP6054030B2 (ja) | 2011-12-23 | 2011-12-23 | 金属錯体量子結晶の作成方法 |
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JP2011282474A JP6054030B2 (ja) | 2011-12-23 | 2011-12-23 | 金属錯体量子結晶の作成方法 |
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JP2013133475A JP2013133475A (ja) | 2013-07-08 |
JP6054030B2 true JP6054030B2 (ja) | 2016-12-27 |
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JP6294614B2 (ja) * | 2013-05-08 | 2018-03-14 | 有限会社マイテック | 癌関連物質の定量方法 |
MY193573A (en) | 2014-05-08 | 2022-10-19 | Mytech Co Ltd | Plasmonic chip for observing cancer related substances by localized surface plasmon resonance |
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JPS5415431A (en) * | 1977-07-06 | 1979-02-05 | Hitachi Ltd | Method of forming highly adehsive thin silver film |
JPH06240463A (ja) * | 1993-02-22 | 1994-08-30 | Mitsubishi Paper Mills Ltd | 金属微粉末の無電解銀鍍金方法 |
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