JP6025481B2 - Ceramic material processing apparatus and ceramic material processing method - Google Patents

Description

  The present invention relates to a processing technique for a ceramic material, and more particularly to a processing technique for creating a division groove for dividing a ceramic substrate by laser processing the surface of the ceramic substrate.

  As one method of manufacturing electronic components such as resistors, capacitors, inductors, fuses, etc., one component (1.0 mm × 0.5 mm per chip) is preliminarily placed on a large ceramic substrate (eg, 60 mm × 50 mm). In order to make the size, the dividing groove created in the manufacturing process of the electronic parts on the ceramic substrate is performed by forming the dividing grooves in the vertical and horizontal directions before firing using a mold etc. In general, it is divided into chips by using a single component.

Further, as shown in FIGS. 7 and 8, a method of forming split grooves in the vertical and horizontal directions on the fired ceramic substrate using a laser beam is also common. In the case of a white ceramic substrate, reflection of laser light becomes a problem. Since the ceramic substrate is white, when it is irradiated with a laser, it is reflected and a dividing groove may not be formed. In particular, as shown in FIG. 7, when the dividing groove starts to be formed, the dividing groove becomes a trigger and the dividing groove is formed, but the starting point for irradiating the laser is the trigger for starting the processing. Since it has no white surface, it is difficult to form a dividing groove. As shown from the start point P ₁ ′ to P ₅ ′, there is a problem that the start point is shifted. For example, in patent document 1, the absorption rate of a laser beam is increased by giving the coloring for suppressing the reflection of a laser beam.

JP-A-1-241389

In the example shown in FIG. 8, the dividing grooves V are formed in the vertical direction and the horizontal direction on the ceramic substrate S by laser light. By the way, as described above, in Patent Document 1, the ceramic substrate S is colored to suppress reflection of laser light. However, in these methods, pretreatment (printing and baking) is required, and production efficiency is increased. There was a problem that was very bad.
An object of the present invention is to reliably form a dividing groove by a laser from a start point without requiring a pretreatment such as coloring.

According to one aspect of the present invention, a ceramic material processing apparatus, a laser device for irradiating a laser beam for processing a ceramic material, a drive device for moving a relative position between the ceramic material and the laser beam, A laser processing light detection unit that detects processing light by the laser light of the ceramic material, and starts moving in the processing direction in the drive device at or after the timing at which the processing light is detected by the laser processing light detection unit. have a, a drive control instruction unit for instructing to, the laser processing light detecting section refers to the processing light memory for storing characteristics of the processing light, a ceramic material, characterized in that to detect the processing light A processing apparatus is provided.

Stored in pressurized Engineering optical memory, the wavelength and intensity of a laser processing beam, by referring to the laser processing beam characteristics such as the presence or absence of the detection can be performed accurately detecting process of the laser processing beam.

  Furthermore, it has a laser irradiation detection part which detects the irradiation start timing of the said laser beam, The said process light detection part is operated after the detection timing of a laser beam, It is characterized by the above-mentioned. By operating the laser processing light detection unit after the detection timing of the laser light, the processing load of the processing light detection unit can be reduced.

Also, the present invention is a machining control device of the ceramic material, and the processing light detector for detecting the processing light according Les Za light of the ceramic material, the processing light in the processing light detecting portion is detected timing or thereafter, have a, a drive control instruction unit for instructing to start the movement in the working direction of the relative positions of the laser beam for processing the ceramic material and the ceramic material, the laser processing light detecting unit, A processing control device for a ceramic material , wherein processing light is detected with reference to a processing light memory for storing characteristics of the processing light .

According to another aspect of the present invention, there is provided a machining control method of a ceramic material, and laser processing light detecting step of detecting a processing light according Les Za light of the ceramic material, processing light in the laser processing light detection step the detected timing or later, have a, a drive control step unit for starting the movement in the working direction of the relative positions of the laser beam for processing the ceramic material and the ceramic material, the laser processing light detecting step Provides a machining control method for a ceramic material , wherein machining light is detected with reference to a machining light memory for storing the characteristics of the machining light .

  The present invention may be a program for causing a computer to execute the processing control method described above, or a computer-readable recording medium for recording the program.

  According to the present invention, laser processing can be reliably performed from the start point without requiring pretreatment.

It is a figure which shows the example of 1 structure of the laser processing apparatus by this Embodiment. It is a functional block diagram which shows one structural example of the control apparatus which controls the laser processing apparatus by this Embodiment. It is a flowchart figure which shows the flow of the process in a control apparatus. It is a figure which shows a mode that a process progresses. It is a figure which shows the example of the relationship between the intensity | strength of a laser beam, a process distance (movement distance), and time. It is a figure which shows the mode of a process of a ceramic substrate, and is a figure which shows a process start point. It is a figure of the prior art which shows the mode of a process of a ceramic substrate, and is a figure which shows a process start point. It is a figure which shows the mode of a process of a ceramic substrate.

  A ceramic material processing technique according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating a configuration example of a laser processing apparatus for a ceramic material according to the present embodiment. FIG. 2 is a functional block diagram showing a configuration example of a control device that controls the laser processing apparatus according to the present embodiment. FIG. 3 is a flowchart showing the flow of processing in the control device.

  As shown in FIG. 1, the laser processing apparatus according to the present embodiment can process the surface of a stage 1 on which a ceramic substrate (ceramic material) S is placed and the white ceramic substrate S such as alumina ceramics, zirconia, mullite, spinel, etc. A laser device 3 capable of irradiating the laser beam L1 at a position, a CCD camera 5 provided at a position where the laser processing light L2 based on the laser light L1 from the surface of the ceramic substrate S can be observed, and a control device for controlling the whole (PC etc.) 7. The processing light L2 based on the laser light L1 from the surface of the ceramic substrate S is light detected when the ceramic substrate S is processed.

  The stage 1 has a drive unit (not shown) and a drive control unit 1b, and the drive of the stage 1 is controlled by the control unit 1a. The laser device 3 can use, for example, an Nd: YAG lot (center wavelength: 1064 nm) as a base material. The control unit 3a of the laser device can control the emission timing and intensity of the laser light L1. The CCD camera 5 is a camera provided with a general CCD sensor.

  The control device 7 is configured to exchange detection signals from the control signals with the stage control unit 1a, the laser control unit 3a, the control unit of the CCD camera 5, and the like. As will be described later, the control device 7 is provided with an irradiation light detector 7a for detecting laser irradiation light.

  As shown in FIG. 2, the control device 7 according to the present embodiment includes a laser irradiation detector 7-1 that detects the presence or absence of laser irradiation, and laser processing light from the CCD camera 5 that detects laser processing light L2. A laser processing light detection unit 7-2 that detects the laser processing light by receiving the detection signal, a drive control instruction unit 7-3 that instructs the drive control unit 1b to drive and control the stage, and laser processing And a laser processing light memory 7-4 for recording characteristics of the laser light such as the wavelength and intensity of the light L2 and the presence / absence of detection.

  FIG. 4 is a diagram showing how the processing proceeds. FIG. 5 is a diagram illustrating an example of the relationship between the intensity of laser light, the processing distance (movement distance), and time. The broken line is the conventional characteristic, and the solid line is the characteristic of the present embodiment.

As shown in FIGS. 3 and 4, first, the process was started (step S1), the at step S2, the irradiation from the laser device 3 with a laser beam to the point P ₁ on the ceramic substrate. At this point _{t 1,} the irradiation of the laser light is detected by the laser irradiation detection unit 7-1 (Figure 4 (a)).

Next, in step S3, the process waits until the laser processing light detector 7-2 detects the laser processing light. As shown in FIG. 4B, the laser processing light detector 7-2 detects the laser processing light based on the wavelength or intensity of the laser processing light L2 stored in the laser processing light memory 7-4, for example. Then (t ₂ : Yes), in step S4, as shown in FIG. 4C, the drive control instruction unit 7-3 moves the stage in a predetermined direction to the drive control unit 1b for driving and controlling the stage. By giving the instruction, the dividing groove V is formed in the moving direction. In step S5, the driving is continued until an instruction to stop driving is received. When an instruction to stop driving is received (Yes), the process ends in step S6. Next, the process proceeds to a process for forming the next divided groove V.

  Since the wavelength and intensity of the laser processing light, the presence / absence of detection, etc. are stored in the laser processing light memory 7-4, the characteristics of the laser light can be easily specified, and the laser light can be detected with high accuracy.

Here, as shown in FIG. 5, the movement of the laser beam (the movement of the stage, the laser beam and the CCD camera 5 is not performed at the timing t ₂ of the laser processing light detection timing or after, but the laser beam irradiation timing t ₁ . Since the processing of the split groove is started when processing is possible, the problem of the split groove being difficult to be formed because the surface is white that does not trigger the processing. can do. By measuring the detection timing of the laser beam and detecting the processing light after the detection timing of the laser beam, the processing burden can be reduced.

  Therefore, as shown in FIG. 6, the timing at which the processing by the laser beam becomes possible can be matched with the driving start timing in the direction in which the grooves for forming the divided grooves extend, and the processing is started. Even in the case of a white ceramic substrate having a white surface that is less likely to cause a trigger, as shown in FIG.

  As described above, according to the present invention, there is an advantage that it is possible to reliably form the division grooves by the laser from the start point without requiring pretreatment.

  In the above-described embodiment, the configuration and the like illustrated in the accompanying drawings are not limited to these, and can be changed as appropriate within the scope of the effects of the present invention. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  The present invention is a processing control device for a ceramic material as shown in FIG. 2, and includes a processing light detection unit that detects processing light by laser light of the ceramic material, and a timing at which processing light is detected by the processing light detection unit or Thereafter, there is provided a drive control unit for starting movement in a processing direction for moving a relative position between the ceramic material and a laser beam for processing the ceramic material. May be.

  Each component of the present invention can be arbitrarily selected, and an invention having a selected configuration is also included in the present invention.

  In addition, a program for realizing the functions described in the present embodiment is recorded on a computer-readable recording medium, and the program recorded on the recording medium is read into a computer system and executed to execute processing of each unit. May be performed. The “computer system” here includes an OS and hardware such as peripheral devices.

  The present invention can be used in a ceramic substrate processing apparatus.

DESCRIPTION OF SYMBOLS 1 ... Stage, 1a ... Control part, 1b ... Drive control part, 3 ... Laser apparatus, 3a ... Control part, 5 ... CCD camera, 7 ... Control apparatus, 7-1 ... Laser irradiation detection part, 7-2 ... Laser processing Light detection unit, 7-3... Drive control instruction unit, 7-4.

Claims (5)

A ceramic material processing apparatus,
A laser device for irradiating a laser beam for processing a ceramic material;
A driving device for moving a relative position between the ceramic material and the laser beam;
A laser processing light detector for detecting laser processing light by the laser light of the ceramic material;
The timing or after laser machining beam is detected in the laser processing light detecting unit, have a drive control instruction unit for instructing to start moving in the working direction of the driving device,
The laser processing light detection unit,
A processing apparatus for a ceramic material , wherein processing light is detected with reference to a processing light memory for storing characteristics of the processing light . Furthermore, it has a laser irradiation detection unit for detecting the irradiation start timing of the laser light,
2. The ceramic material processing apparatus according to claim 1 , wherein the laser processing light detection unit is operated after a detection timing of the laser light. A ceramic material processing control device comprising:
And laser processing light detecting unit that detects the processing light according Les Za light of the ceramic material,
A drive control unit for starting movement of a relative position between the ceramic material and the laser beam for processing the ceramic material in the processing direction at a timing when the laser processing light is detected by the laser processing light detection unit or after that; Yes, and
The laser processing light detection unit,
A processing control device for a ceramic material , wherein processing light is detected with reference to a processing light memory for storing characteristics of the processing light . A method for controlling the processing of a ceramic material,
And laser processing light detecting step of detecting a processing light according Les Za light of the ceramic material,
Drive control for giving an instruction to start moving the relative position of the ceramic material and the laser beam for processing the ceramic material in the processing direction at the timing when the laser processing light is detected in the laser processing light detection step or after that. possess and instructions steps the <br/>,
The laser processing light detection step includes
A processing control method for a ceramic material , wherein processing light is detected with reference to a processing light memory for storing characteristics of the processing light . A program for causing a computer to execute the machining control method according to claim 4 .

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