JP5994140B2 - Inductor and manufacturing method thereof - Google Patents
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Description
コイルと、コイルが内部に配置された磁性コアと、磁性コアの外面に引き出された端子と、を有するインダクタ及びその製造方法に関する。 The present invention relates to an inductor having a coil, a magnetic core in which the coil is disposed, and a terminal drawn out on the outer surface of the magnetic core, and a method for manufacturing the inductor.
下記特許文献にはインダクタの構造に関する発明が開示されている。磁性コア内にコイルが埋められており、特許文献１や特許文献２には、磁性コアの側面にコイルとは別部材として前記コイルに電気的に接続された端子が形成されている。 The following patent documents disclose inventions related to inductor structures. A coil is embedded in the magnetic core, and in Patent Document 1 and Patent Document 2, a terminal electrically connected to the coil is formed on the side surface of the magnetic core as a separate member from the coil.
特許文献３〜特許文献５では、コイルからそのまま導体を磁性コアの外側に引き出している。いずれも磁性コアの外側に引き出した端子全体の被覆部を剥がして導体を露出させている（特許文献３の［００１６］欄、特許文献４の［００１８］欄、特許文献５の［００１３］欄参照）。なお特許文献５では、磁性コアと端子の間に絶縁シートを介在させて磁気コアと端子間を電気的に絶縁している（特許文献５の［００１５］欄、［００１６］欄、図１、図２参照）。 In Patent Documents 3 to 5, the conductor is directly pulled out from the coil to the outside of the magnetic core. In either case, the conductor is exposed by peeling off the covering portion of the entire terminal drawn out of the magnetic core (column [0016] in Patent Document 3, column [0018] in Patent Document 4, column [0013] in Patent Document 5). reference). In Patent Document 5, an insulating sheet is interposed between the magnetic core and the terminal to electrically insulate between the magnetic core and the terminal (Patent Document 5, [0015] column, [0016] column, FIG. (See FIG. 2).
特許文献１〜特許文献５に開示されたインダクタを、ランドとの間ではんだ付けした際、インダクタの側面から下面にかけての端子全体にはんだ層が形成される。したがってインダクタの側面にはフィレットが形成される。 When the inductor disclosed in Patent Literature 1 to Patent Literature 5 is soldered to the land, a solder layer is formed on the entire terminal from the side surface to the lower surface of the inductor. Therefore, a fillet is formed on the side surface of the inductor.
上記したように、従来のインダクタの構成では、磁性コアの側面にフィレットが形成されるためインダクタの実装面積はフィレットの面積を足したものとなった。したがって従来の構造ではフィレット分、実装面積が広がることになるが、近年におけるインダクタを組み込む電子機器の小型化や実装基板の小型化、実装基板上での各部品の実装効率化等を促進するためには、インダクタの実装面積をより小さくできる構造が求められた。 As described above, in the conventional inductor configuration, since the fillet is formed on the side surface of the magnetic core, the mounting area of the inductor is the sum of the fillet area. Therefore, in the conventional structure, the mounting area will be expanded by the fillet, but in order to promote the downsizing of electronic devices incorporating inductors, the downsizing of the mounting board, and the mounting efficiency of each component on the mounting board in recent years. Therefore, a structure capable of reducing the mounting area of the inductor was required.
また、インダクタの小型化に伴い、特許文献５に示すようにインダクタを構成する磁性コアと端子間の電気絶縁を保つことが重要となる。ここで特許文献５では、磁性コアと端子間に別部材として絶縁シートを介在させているが、かかる構成では部品点数が増えて生産コストが上昇し、また製造工程が煩雑化するなどの問題があった。 As the inductor is downsized, it is important to maintain electrical insulation between the magnetic core and the terminals constituting the inductor as disclosed in Patent Document 5. Here, in Patent Document 5, an insulating sheet is interposed as a separate member between the magnetic core and the terminal. However, in such a configuration, there are problems such as an increase in the number of parts, an increase in production cost, and a complicated manufacturing process. there were.
そこで本発明は、上記の従来課題を解決するためのものであり、特に、ランドとの間でのはんだ接合の際、側面にフィレットが形成されるのを防止できるインダクタ及びその製造方法を提供することを目的とする。 Therefore, the present invention is to solve the above-described conventional problems, and in particular, to provide an inductor capable of preventing a fillet from being formed on a side surface during solder bonding with a land, and a method for manufacturing the same. For the purpose.
本発明におけるインダクタは、コイルと、前記コイルが内部に配置された磁性コアと、前記磁性コアの側面から前記磁性コアの下面にかけて引き出された端子と、を有し、前記端子で覆われていない前記磁性コアの表面全体が絶縁性の表皮層で覆われたインダクタであって、
導体の外周表面を電気絶縁性の被覆部で絶縁被覆した被覆導体が巻回されて前記コイルを構成しており、
前記被覆導体は前記端子として、前記コイルから前記磁性コアの側面及び前記磁性コアの下面にかけて引き出されるとともに、前記磁性コアの下面の位置では、前記磁性コアと対向する導体上面に前記被覆部を残した状態で、前記導体上面に対し逆側の導体下面の前記被覆部が剥がされて前記導体が露出した電極面が形成されていることを特徴とするものである。本発明によれば、被覆導体によりコイルを形成するとともに、コイルからそのまま被覆導体を端子として磁性コアの側面から下面にかけて引き出している。このとき、端子全体が被覆導体の状態では、ランドとはんだ接合できないので、ランドと対向する導体下面の被覆部を剥がして導体を露出させて電極面とした。一方、磁性コアの側面に位置する端子は被覆導体で構成されており、また磁性コアの下面と対向する導体上面にも被覆部を残している。したがってランドとの間ではんだ接合した際、端子の下面に設けられた前記電極面ではんだが濡れるが、磁性コアの側面に位置する端子部分までは濡れず、したがってフィレットが形成されることはない。また、端子の磁性コアとの対向面全域は被覆部で適切に覆われているから、磁性コアと端子との間の電気絶縁性を適切に保つことができる。
The inductor according to the present invention includes a coil, a magnetic core in which the coil is disposed, and a terminal drawn from a side surface of the magnetic core to a lower surface of the magnetic core, and is not covered with the terminal. An inductor in which the entire surface of the magnetic core is covered with an insulating skin layer,
A coated conductor in which the outer peripheral surface of the conductor is insulated with an electrically insulating coating is wound to form the coil.
As the coated conductor is the terminal, with drawn toward the lower surface side and the magnetic core of the magnetic core from the coil, the position of the lower surface of said magnetic core, said covering portion, leaving the conductor upper surface facing the magnetic core In this state, the covering portion on the lower surface of the conductor opposite to the upper surface of the conductor is peeled off to form an electrode surface where the conductor is exposed. According to the present invention, the coil is formed by the coated conductor, and is drawn from the coil as it is from the side surface to the lower surface of the magnetic core using the coated conductor as a terminal. At this time, when the entire terminal is in the state of the coated conductor, it cannot be soldered to the land. Therefore, the covering portion on the lower surface of the conductor facing the land is peeled to expose the conductor to form an electrode surface. On the other hand, the terminal located on the side surface of the magnetic core is made of a covered conductor, and the covered portion is also left on the upper surface of the conductor facing the lower surface of the magnetic core. Therefore, when soldering with the land, the solder is wetted by the electrode surface provided on the lower surface of the terminal, but the terminal portion located on the side surface of the magnetic core is not wetted, and therefore no fillet is formed. . In addition, since the entire area of the terminal facing the magnetic core is appropriately covered with the covering portion, the electrical insulation between the magnetic core and the terminal can be appropriately maintained.
本発明では、前記被覆部は、前記導体上面から前記導体上面と前記導体下面との間の導体側面にかけて残されていることが好ましい。これにより、より好ましく磁性コアと端子との間の電気絶縁性を確保できる。前記表皮層は、前記導体側面上の前記被覆部を覆っていることが好ましい。 In this invention, it is preferable that the said coating | coated part is left over the conductor side surface between the said conductor upper surface and the said conductor lower surface from the said conductor upper surface. Thereby, the electrical insulation between a magnetic core and a terminal can be secured more preferably. It is preferable that the skin layer covers the covering portion on the conductor side surface.
また本発明では、複数の前記端子が前記磁性コアの同じ前記側面から引き出されていることが好ましい。これによりインダクタの小型化を効果的に促進できる。 In the present invention, it is preferable that a plurality of the terminals are drawn from the same side surface of the magnetic core. This effectively promotes downsizing of the inductor.
また本発明では、前記端子は前記磁性コアの下面に樹脂により接着されていることが好ましい。これにより、端子強度を向上させることができる。 In the present invention, it is preferable that the terminal is bonded to the lower surface of the magnetic core with a resin. Thereby, terminal strength can be improved.
また本発明では、前記磁性コアの側面から前記磁性コアの下面にかけて前記端子と対向する位置に溝が設けられ、前記溝内にも前記表皮層が形成されていることが好ましい。磁性コアの下面にのみ溝を形成することもできるが、磁性コアの側面にも溝を形成し、端子全体を溝に配置する構成とすることで、インダクタの小型化をより効果的に促進できる。 Moreover, in this invention, it is preferable that a groove | channel is provided in the position facing the said terminal from the side surface of the said magnetic core to the lower surface of the said magnetic core, and the said skin layer is also formed in the said groove | channel . Although it is possible to form a groove only on the bottom surface of the magnetic core, it is possible to more effectively promote downsizing of the inductor by forming a groove on the side surface of the magnetic core and arranging the entire terminal in the groove. .
また本発明では、前記端子は前記磁性コアの側面から前記磁性コアの下面にかけて前記溝内にて樹脂により接着されていることが好ましい。これにより、より効果的に端子強度を向上させることができる。 In the present invention, it is preferable that the terminal is bonded with resin in the groove from the side surface of the magnetic core to the lower surface of the magnetic core. Thereby, terminal strength can be improved more effectively.
また本発明では、前記端子と前記磁性コア間を接着する樹脂材は、ガラス転移温度Ｔｇが１５０℃以上であることが好ましい。これにより、リフローに対する耐熱性を備えた構成にできる。 Moreover, in this invention, it is preferable that the glass transition temperature Tg of the resin material which adhere | attaches between the said terminal and the said magnetic core is 150 degreeC or more. Thereby, it can be set as the structure provided with the heat resistance with respect to reflow.
また本発明では、前記磁性コアは、Ｆｅ基非晶質合金粉末及び結着材を含む圧縮成形体であることが好ましい。かかる場合、磁性コアはフェライト等に比べて電気抵抗が高くないので、端子と磁性コア間に絶縁性の被覆部を備えることで、効果的に、磁性コアと端子との間の電気絶縁性を確保することができる。 In the present invention, the magnetic core is preferably a compression-molded body including an Fe-based amorphous alloy powder and a binder. In such a case, since the magnetic core does not have an electrical resistance higher than that of ferrite or the like, by providing an insulating covering between the terminal and the magnetic core, the electric insulation between the magnetic core and the terminal can be effectively improved. Can be secured.
また本発明は、コイルと、前記コイルが内部に配置された磁性コアと、前記磁性コアの側面から前記磁性コアの下面にかけて引き出された端子と、を有するインダクタの製造方法であって、
導体の外周表面を電気絶縁性の被覆部で絶縁被覆した被覆導体を巻回して前記コイルを形成し、
前記被覆導体を前記端子として、前記コイルから前記磁性コアの側面及び前記磁性コアの下面にかけて引き出すとともに、インダクタ表面全体を覆う絶縁性の表皮層を形成し、前記磁性コアの下面の位置では、前記磁性コアと対向する導体上面に前記被覆部を残した状態で、前記導体上面に対し逆側の導体下面の前記被覆部および前記表皮層を剥がして前記導体が露出した電極面を形成することを特徴とするものである。本発明によれば、端子を構成する被覆導体のうち、磁性コアの下面に配置される被覆導体の導体下面の被覆部を剥がすことで導体を露出させて電極面を形成している。一方、電極面の逆側の導体上面の被覆部や磁性コアの側面に位置する端子部分の被覆部はそのまま残している。これにより、ランドとの間ではんだ接合した際、インダクタの側面にフィレットが形成されるのを防止できる。また、磁性コアと端子との間の電気絶縁性を効果的に保つことができる。
The present invention is also a method for manufacturing an inductor comprising a coil, a magnetic core in which the coil is disposed, and a terminal drawn from a side surface of the magnetic core to a lower surface of the magnetic core,
The coil is formed by winding a coated conductor in which the outer peripheral surface of the conductor is insulated and coated with an electrically insulating coating .
With the coated conductor as the terminal, the coil is pulled out from the coil to the side surface of the magnetic core and the lower surface of the magnetic core, and an insulating skin layer is formed to cover the entire inductor surface , at the position of the lower surface of the magnetic core, in a state in which the magnetic core facing the conductor upper surface leaving the cover portion, to form the covering portion and the electrode surface on which the conductor is exposed by peeling the skin layer of the conductive lower surface of the opposite side with respect to the conductor upper surface It is a feature. According to the present invention, among the coated conductors constituting the terminals, the conductor is exposed by peeling off the coated portion of the conductor lower surface of the coated conductor disposed on the lower surface of the magnetic core to form the electrode surface. On the other hand, the covering portion of the conductor upper surface opposite to the electrode surface and the covering portion of the terminal portion located on the side surface of the magnetic core are left as they are. This can prevent a fillet from being formed on the side surface of the inductor when soldered to the land. Moreover, the electrical insulation between a magnetic core and a terminal can be maintained effectively.
本発明では、前記導体上面から、前記導体上面と前記導体下面間の導体側面にかけて前記被覆部を残すことが好ましい。このように、被覆部を導体上面のみならず導体側面にも残すことで、磁性コアとの間の電気絶縁性をより効果的に保つことができる。 In this invention, it is preferable to leave the said covering part from the said conductor upper surface to the conductor side surface between the said conductor upper surface and the said conductor lower surface. Thus, by leaving the covering portion not only on the conductor upper surface but also on the conductor side surface, the electrical insulation between the magnetic core can be more effectively maintained.
また本発明では、前記磁性コアの側面から前記磁性コアの下面に前記被覆導体を折り曲げたのち、前記導体下面の前記被覆部および前記表皮層を剥がして前記電極面を形成することが好ましい。これにより簡単に、導体下面の被覆部を剥がして電極面を形成できるとともに、導体上面に被覆部を残すことができる。 In the present invention, it is preferable that the electrode surface is formed by bending the covered conductor from the side surface of the magnetic core to the lower surface of the magnetic core and then peeling off the covering portion and the skin layer on the lower surface of the conductor. As a result, the covering portion on the lower surface of the conductor can be easily peeled off to form the electrode surface, and the covering portion can be left on the upper surface of the conductor.
また本発明では、前記端子を前記磁性コアの下面に接着することが好ましい。
また本発明では、前記磁性コアの側面から前記磁性コアの下面にかけて溝を形成し、前記端子を前記溝に沿って配置することが好ましい。
In the present invention, it is preferable that the terminal is bonded to the lower surface of the magnetic core.
Moreover, in this invention, it is preferable to form a groove | channel from the side surface of the said magnetic core to the lower surface of the said magnetic core, and to arrange | position the said terminal along the said groove | channel.
また本発明では、前記端子を前記磁性コアの側面から前記磁性コアの下面にかけて前記溝内にて接着することが好ましい。
上記により端子強度を向上させることができる。
In the present invention, it is preferable that the terminal is bonded in the groove from the side surface of the magnetic core to the lower surface of the magnetic core.
The terminal strength can be improved by the above.
本発明のインダクタ及びその製造方法によれば、ランドとの間ではんだ接合した際、インダクタの側面にフィレットが形成されるのを防止できる。また、磁性コアと端子との間の電気絶縁性を効果的に保つことができる。 According to the inductor and the manufacturing method thereof of the present invention, it is possible to prevent a fillet from being formed on the side surface of the inductor when soldered to the land. Moreover, the electrical insulation between a magnetic core and a terminal can be maintained effectively.
図１は、第１実施形態におけるインダクタの斜視図であり、図２は、図１に示すインダクタを基板上に実装した状態を示す縦断面図であり、図３は、本実施形態におけるインダクタの裏面図（下面図）であり、図４（ａ）は、磁性コアの側面に位置する端子の拡大断面図を示し、図４（ｂ）は、磁性コアの下面に位置する端子の拡大断面図を示し、図４（ｃ）、図４（ｄ）は、図４（ｂ）の変形例を示す。なお図２の断面図では本来、コイル１２の断面が一部、露出するが省略した。 FIG. 1 is a perspective view of the inductor in the first embodiment, FIG. 2 is a longitudinal sectional view showing a state in which the inductor shown in FIG. 1 is mounted on a substrate, and FIG. 3 is a diagram of the inductor in the present embodiment. FIG. 4A is a back view (bottom view), FIG. 4A shows an enlarged cross-sectional view of a terminal located on a side surface of the magnetic core, and FIG. 4B is an enlarged cross-sectional view of a terminal located on the lower surface of the magnetic core. 4 (c) and 4 (d) show a modification of FIG. 4 (b). In the cross-sectional view of FIG. 2, a part of the cross section of the coil 12 is originally exposed but omitted.
図１，図２，図３に示すようにインダクタ１０は、磁性コア１１と、コイル１２と、複数の端子１３，１３とを有して構成される。 As shown in FIGS. 1, 2, and 3, the inductor 10 includes a magnetic core 11, a coil 12, and a plurality of terminals 13 and 13.
磁性コア１１は、多数のＦｅ基非晶質合金（Ｆｅ基金属ガラス合金）粉末と、結着材とを圧縮成形したものである。本実施形態では、Ｆｅ基非晶質合金を例えば、アトマイズ法により粉末状に、あるいは液体急冷法により帯状（リボン状）に製造できる。 The magnetic core 11 is formed by compression molding a large number of Fe-based amorphous alloy (Fe-based metallic glass alloy) powders and a binder. In the present embodiment, the Fe-based amorphous alloy can be produced, for example, in a powder form by an atomizing method or in a strip shape (ribbon form) by a liquid quenching method.
Ｆｅ基非晶質合金粉末は、略球状あるいは楕円体状等からなる。前記Ｆｅ基非晶質合金粉末は、コア中に多数個存在し、各Ｆｅ基非晶質合金粉末間が結着材（バインダー樹脂）にて絶縁された状態となっている。なお、本実施形態においては、他の磁性合金粉末、例えばＦｅ−Ｓｉ合金粉末、Ｆｅ−Ａｌ−Ｓｉ合金粉末、Ｆｅ−Ｓｉ−Ｃｒ合金粉末等に代えても良い。 The Fe-based amorphous alloy powder has a substantially spherical shape or an ellipsoidal shape. A large number of the Fe-based amorphous alloy powders are present in the core, and the Fe-based amorphous alloy powders are insulated by a binder (binder resin). In the present embodiment, other magnetic alloy powders such as Fe-Si alloy powder, Fe-Al-Si alloy powder, Fe-Si-Cr alloy powder, etc. may be used.
結着材としては、エポキシ樹脂、シリコーン樹脂、シリコーンゴム、フェノール樹脂、尿素樹脂、メラミン樹脂、ＰＶＡ（ポリビニルアルコール）、アクリル樹脂等の液状又は粉末状の樹脂あるいはゴムや、水ガラス（Ｎａ２Ｏ−ＳｉＯ２）、酸化物ガラス粉末（Ｎａ２Ｏ−Ｂ２Ｏ３−ＳｉＯ２、ＰｂＯ−Ｂ２Ｏ３−ＳｉＯ２、ＰｂＯ−ＢａＯ−ＳｉＯ２、Ｎａ２Ｏ−Ｂ２Ｏ３−ＺｎＯ、ＣａＯ−ＢａＯ−ＳｉＯ２、Ａｌ２Ｏ３−Ｂ２Ｏ３−ＳｉＯ２、Ｂ２Ｏ３−ＳｉＯ２）、ゾルゲル法により生成するガラス状物質（ＳｉＯ２、Ａｌ２Ｏ３、ＺｒＯ２、ＴｉＯ２等を主成分とするもの）等を挙げることができる。 Examples of the binder include epoxy resins, silicone resins, silicone rubbers, phenol resins, urea resins, melamine resins, PVA (polyvinyl alcohol), acrylic resins, and other liquid or powder resins, or water glass (Na 2 O). -SiO 2), oxide glass powder (Na 2 O-B 2 O 3 -SiO 2, PbO-B 2 O 3 -SiO 2, PbO-BaO-SiO 2, Na 2 O-B 2 O 3 -ZnO, CaO—BaO—SiO 2 , Al 2 O 3 —B 2 O 3 —SiO 2 , B 2 O 3 —SiO 2 ), glassy substances (SiO 2 , Al 2 O 3 , ZrO 2 , TiO) produced by the sol-gel method 2 ) and the like.
また潤滑剤として、ステアリン酸亜鉛、ステアリン酸アルミニウム等を添加してもよい。結着材の混合比は５質量％以下、潤滑剤の添加量は０．１質量％〜１質量％程度である。 Further, zinc stearate, aluminum stearate or the like may be added as a lubricant. The mixing ratio of the binder is 5% by mass or less, and the addition amount of the lubricant is about 0.1% by mass to 1% by mass.
図３に示すようにコイル１２は、磁性コア１１内に配置されている。コイル１２を磁性コア１１内に封入した状態で前記磁性コア１１を圧縮成形したものであっても、例えば磁性コア１１をコイル１２の収納部を備える分割形状として、各磁性コアを単体にて圧縮成形し、その後、コイル１２を磁性コア内の収納部に収納する構成とすることもできる。 As shown in FIG. 3, the coil 12 is disposed in the magnetic core 11. Even if the magnetic core 11 is compression-molded with the coil 12 enclosed in the magnetic core 11, for example, the magnetic core 11 is divided into a shape having a storage portion for the coil 12, and each magnetic core is compressed alone. The coil 12 may be molded and then housed in a housing part in the magnetic core.
コイル１２は、図４（ａ）に示す導体１５の外周表面１５ｄを絶縁性の被覆部１６で覆った被覆導体１７を巻回形成したものである。図４（ａ）に示すように、被覆導体１７の断面は矩形状であり、コイル１２は、例えば、エッジワイズコイルにより形成されている。導体１５は銅線等であるが特に材質を限定するものでない。また被覆部１６は熱硬化性樹脂、熱可塑性樹脂の別を問わないが、難燃性、耐熱性に優れた材質であることが好適である。 The coil 12 is formed by winding a covered conductor 17 in which the outer peripheral surface 15d of the conductor 15 shown in FIG. As shown in FIG. 4A, the cross section of the coated conductor 17 is rectangular, and the coil 12 is formed of, for example, an edgewise coil. The conductor 15 is a copper wire or the like, but the material is not particularly limited. Moreover, although the coating | coated part 16 does not ask | require whether it is a thermosetting resin and a thermoplastic resin, it is suitable that it is a material excellent in the flame retardance and heat resistance.
図３に示すように、被覆導体１７はコイル１２の両端からそのまま磁性コア１１の側面１１ａにまで引き出されている。なお図３では、コイル１２から引き出した被覆導体（点線で示す）１７を少し、Ｘ方向にずらして図示している。すなわち後述する電極面４０と被覆導体１７とを高さ方向で一致させることができるが、図３では被覆導体１７がコイル１２から引き出されていることを明確にするために、被覆導体１７を電極面４０に対して少しずらして表示した。 As shown in FIG. 3, the covered conductor 17 is drawn from both ends of the coil 12 to the side surface 11 a of the magnetic core 11 as it is. In FIG. 3, the coated conductor (shown by a dotted line) 17 drawn from the coil 12 is slightly shifted in the X direction. That is, although the electrode surface 40 and the coated conductor 17 which will be described later can be made to coincide with each other in the height direction, in order to clarify that the coated conductor 17 is drawn from the coil 12 in FIG. Displayed with a slight shift from the surface 40.
そしてコイル１２から引き出された被覆導体１７は、図１，図２に示すように磁性コア１１の側面１１ａから下面（裏面）１１ｂに向けて折り曲げられている。なお図１では、磁性コア１１の下面（裏面）１１ｂを上方向に向けて示した。ここで磁性コア１１の下面１１ｂとは、基板２０のランド２１と接合する側の面を指す。よって下面側は設置状態により重力方向と一致することもあるが、必ずしもそうとは限らない。 The coated conductor 17 drawn out from the coil 12 is bent from the side surface 11a of the magnetic core 11 toward the lower surface (back surface) 11b as shown in FIGS. In FIG. 1, the lower surface (back surface) 11b of the magnetic core 11 is shown facing upward. Here, the lower surface 11 b of the magnetic core 11 refers to a surface of the substrate 20 on the side to be joined to the land 21. Therefore, the lower surface side may coincide with the direction of gravity depending on the installation state, but this is not always the case.
そして、磁性コア１１の側面１１ａから下面１１ｂに引き出された被覆導体１７により端子１３が構成されている。端子１３は磁性コア１１の外面に露出した部分を指す。 And the terminal 13 is comprised by the covering conductor 17 pulled out from the side surface 11a of the magnetic core 11 to the lower surface 11b. The terminal 13 refers to a portion exposed on the outer surface of the magnetic core 11.
図２に示すように、磁性コア１１の側面１１ａに位置する端子１３（以下、端子サイド部１３ａと称する場合がある）は、図４（ａ）と同様に、導体１５の外周表面１５ｄ全体が被覆部１６で覆われた状態にあり、したがって端子サイド部１３ａでは導体１５は外部に露出していない。 As shown in FIG. 2, the terminal 13 (hereinafter sometimes referred to as a terminal side portion 13a) located on the side surface 11a of the magnetic core 11 has the entire outer peripheral surface 15d of the conductor 15 as in FIG. Therefore, the conductor 15 is not exposed to the outside in the terminal side portion 13a.
一方、図２、図４（ｂ）に示すように、磁性コア１１の下面１１ｂに位置する端子１３（以下、端子下面部１３ｂと称する場合がある）では、導体下面１５ａ（磁性コア１１の下面１１ｂと対向する側である導体上面１５ｂの逆面）の被覆部１６が剥がされており、これにより導体１５が外部に露出した状態となっている。図４（ｂ）の実施形態では、導体下面１５ａの被覆部１６のみが剥がされており、導体上面１５ｂや導体側面１５ｃ（導体上面１５ｂと導体下面１５ａとの間に位置する略垂直面）には被覆部１６が残されている。 On the other hand, as shown in FIG. 2 and FIG. 4B, the terminal 13 located on the lower surface 11b of the magnetic core 11 (hereinafter sometimes referred to as the terminal lower surface portion 13b) has a conductor lower surface 15a (the lower surface of the magnetic core 11). The covering portion 16 on the opposite side of the conductor upper surface 15b on the side facing 11b is peeled off, so that the conductor 15 is exposed to the outside. In the embodiment of FIG. 4B, only the covering portion 16 of the conductor lower surface 15a is peeled off, and the conductor upper surface 15b and the conductor side surface 15c (substantially vertical surface located between the conductor upper surface 15b and the conductor lower surface 15a). The covering portion 16 is left.
図１に示すように、磁性コア１１の下面１１ｂには端子下面部１３ｂの延出方向（Ｙ方向）に沿って溝２５が形成されている。端子１３は２本あるから、溝２５も２本あり、各溝２５はＸ方向に間隔を空けた状態でＹ方向に平行に形成されている。各端子下面部１３ｂは少なくとも一部が各溝２５内に位置しており、各端子下面部１３ｂは各溝２５に沿って平行に形成されている。 As shown in FIG. 1, a groove 25 is formed in the lower surface 11b of the magnetic core 11 along the extending direction (Y direction) of the terminal lower surface portion 13b. Since there are two terminals 13, there are also two grooves 25, and each groove 25 is formed parallel to the Y direction with a gap in the X direction. At least a part of each terminal lower surface portion 13 b is located in each groove 25, and each terminal lower surface portion 13 b is formed in parallel along each groove 25.
図４（ｂ）に示すように、溝２５の幅Ｔ１は、端子下面部１３ｂの幅Ｔ２よりもやや広くなっている。 As shown in FIG. 4B, the width T1 of the groove 25 is slightly wider than the width T2 of the terminal lower surface portion 13b.
図１、図４（ｂ）に示すように、溝２５の底面２５ａ（磁性コア１１の下面１１ｂの一部に相当する）と端子下面部１３ｂとの間が樹脂層２７を介して接着固定されている。 As shown in FIGS. 1 and 4B, the bottom surface 25 a of the groove 25 (corresponding to a part of the lower surface 11 b of the magnetic core 11) and the terminal lower surface portion 13 b are bonded and fixed via a resin layer 27. ing.
図４（ｃ）に示すように樹脂層２７が端子下面部１３ｂと溝２５の底面２５ａとの間のみならず、端子下面部１３ｂと溝２５の側壁面２５ｂとの間にも介在して、端子下面部１３ｂの一部が樹脂層２７内に埋設された状態であると、より端子強度を向上させることが可能である。 As shown in FIG. 4C, the resin layer 27 is interposed not only between the terminal lower surface portion 13b and the bottom surface 25a of the groove 25 but also between the terminal lower surface portion 13b and the side wall surface 25b of the groove 25, When a part of the terminal lower surface portion 13b is embedded in the resin layer 27, the terminal strength can be further improved.
図３に示す斜線部分が、端子下面部１３ｂにおいて、被覆部１６を剥がして導体下面１５ａが露出した電極面４０を構成している。なお図３では、図１に示すはんだ層４１を省略した。 The shaded portion shown in FIG. 3 constitutes the electrode surface 40 in the terminal lower surface portion 13b where the covering portion 16 is peeled off and the conductor lower surface 15a is exposed. In FIG. 3, the solder layer 41 shown in FIG. 1 is omitted.
このため図１に示すように、電極面４０にはんだ層（はんだペースト）４１を塗布（印刷）することができる。 Therefore, a solder layer (solder paste) 41 can be applied (printed) to the electrode surface 40 as shown in FIG.
そして図２に示すように、インダクタ１０を実装基板２０のランド２１上に配置し、リフロー方式により、電極面４０とランド２１間をはんだ層４１を介して接合することができる。 As shown in FIG. 2, the inductor 10 can be disposed on the land 21 of the mounting substrate 20, and the electrode surface 40 and the land 21 can be joined via the solder layer 41 by the reflow method.
本実施形態によれば、被覆導体１７によりコイル１２を巻回形成するとともに、コイル１２からそのまま被覆導体１７を端子１３として磁性コア１１の側面１１ａから下面１１ｂにかけて引き出している。このとき、端子全体が被覆導体１７の状態では、ランド２１とはんだ接合できないので、ランド２１と対向する端子下面部１３ｂの導体下面１５ａの被覆部１６を剥がして導体１５を露出させて電極面４０とした。一方、磁性コア１１の側面１１ａに位置する端子サイド部１３ａは被覆導体１７で形成されており、また端子下面部１３ｂのうち磁性コア１１の下面１１ｂと対向する導体上面１５ｂには被覆部１６を残している。 According to the present embodiment, the coil 12 is formed by winding with the covered conductor 17, and the covered conductor 17 is directly pulled out from the coil 12 from the side surface 11 a to the lower surface 11 b of the magnetic core 11 as the terminal 13. At this time, when the entire terminal is in the state of the covered conductor 17, it cannot be soldered to the land 21. Therefore, the covering portion 16 of the conductor lower surface 15 a of the terminal lower surface portion 13 b facing the land 21 is peeled off to expose the conductor 15 and the electrode surface 40. It was. On the other hand, the terminal side portion 13a located on the side surface 11a of the magnetic core 11 is formed by the covered conductor 17, and the covering portion 16 is provided on the conductor upper surface 15b of the terminal lower surface portion 13b facing the lower surface 11b of the magnetic core 11. I'm leaving.
図９は比較例のインダクタの縦断面図を示す。図９では、磁性コア１１の側面１１ａから下面１１ｂに引き出された端子５０は、被覆導体１７の被覆部１６をすべて剥いだ状態にあり、したがって端子５０は全体が導体１５で形成されている。このため図９に示すように、ランド２１との間ではんだ接合した際、はんだが端子５０全体に濡れ、したがってフィレット５１がインダクタの側面に形成される。 FIG. 9 shows a longitudinal sectional view of a comparative inductor. In FIG. 9, the terminal 50 drawn from the side surface 11 a to the lower surface 11 b of the magnetic core 11 is in a state where all the covering portion 16 of the covering conductor 17 is peeled off, and therefore the terminal 50 is entirely formed of the conductor 15. For this reason, as shown in FIG. 9, when the solder bonding is performed with the land 21, the solder wets the entire terminal 50, so that the fillet 51 is formed on the side surface of the inductor.
これに対して本実施形態では、導体１５が露出しているのは、端子下面部１３ｂの下面の電極面４０のみであるため（ただし後述する図４（ｄ）のように導体下面１５ａとともに導体側面１５ｃが露出する形態もある）、ランド２１との間ではんだ接合した際、前記電極面４０ではんだが濡れるが、磁性コア１１の側面１１ａに位置する端子サイド部１３ａまでは濡れず、したがって図９に示す比較例と違ってフィレットがインダクタの側面に形成されることはない。 On the other hand, in the present embodiment, the conductor 15 is exposed only on the electrode surface 40 on the lower surface of the terminal lower surface portion 13b (however, as shown in FIG. In some embodiments, the side surface 15c is exposed). When soldering is performed between the land 21 and the solder, the solder gets wet on the electrode surface 40, but the terminal side portion 13a located on the side surface 11a of the magnetic core 11 does not get wet. Unlike the comparative example shown in FIG. 9, the fillet is not formed on the side surface of the inductor.
図９に示すようにフィレット５１が形成されることで、フィレット５１の領域（図９では幅Ｔ３として示した）分、インダクタの実装面積が大きくなるが、本実施形態では、前記フィレットが形成されるのを防止できるため、インダクタの実装面積を従来の構成に比べて効果的に小さくすることができる。 The formation of the fillet 51 as shown in FIG. 9 increases the mounting area of the inductor by the area of the fillet 51 (shown as the width T3 in FIG. 9). In this embodiment, the fillet is formed. Therefore, the mounting area of the inductor can be effectively reduced as compared with the conventional configuration.
この結果、本実施形態のインダクタ１０を使用することで、近年におけるインダクタ１０を組み込む電子機器の小型化や実装基板２０の小型化、実装基板２０上での各部品の実装効率化等を適切に促進することが可能となる。 As a result, by using the inductor 10 of the present embodiment, it is possible to appropriately reduce the size of electronic devices incorporating the inductor 10 in recent years, the size of the mounting board 20, the mounting efficiency of each component on the mounting board 20, and the like. It becomes possible to promote.
また図９の比較例に示すように、端子５０の表面全体が導体１５であると、磁性コア１１と端子５０との間での電気絶縁性を確保するために、例えば、特許文献５に記載されたように絶縁シートを端子５０と磁性コア１１との間に挟む必要性がある。特に磁性コア１１が磁性合金粉末と結着材で形成される場合、磁性合金粉末は結着材（バインダー樹脂）で覆われているため、ある程度電気絶縁性を有しているが、高電圧、高電流で用いられる場合に絶縁破壊が生じやすい。従って、端子５０と磁性コア１１との間の絶縁性はより高くする必要があるため、この様な絶縁対策は必須となる。 Further, as shown in the comparative example of FIG. 9, when the entire surface of the terminal 50 is the conductor 15, for example, it is described in Patent Document 5 in order to ensure electrical insulation between the magnetic core 11 and the terminal 50. As described above, it is necessary to sandwich the insulating sheet between the terminal 50 and the magnetic core 11. In particular, when the magnetic core 11 is formed of a magnetic alloy powder and a binder, the magnetic alloy powder is covered with a binder (binder resin), and thus has a certain level of electrical insulation. When used at high currents, dielectric breakdown is likely to occur. Therefore, since the insulation between the terminal 50 and the magnetic core 11 needs to be higher, such an insulation measure is essential.
これに対して本実施形態では、端子１３の磁性コア１１との対向面全域（端子サイド部１３ａにおける磁性コア１１の側面１１ａとの対向面及び端子下面部１３ｂの導体上面１５ｂ側（図２、図４（ａ）（ｂ）参照））は被覆部１６で適切に覆われているから、磁性コア１１と端子１３との間の電気絶縁性を適切に保つことができる。 On the other hand, in the present embodiment, the entire region of the terminal 13 facing the magnetic core 11 (the surface facing the side surface 11a of the magnetic core 11 in the terminal side portion 13a and the conductor upper surface 15b side of the terminal lower surface portion 13b (FIG. 2, 4 (a) and 4 (b)) are appropriately covered with the covering portion 16, the electrical insulation between the magnetic core 11 and the terminal 13 can be appropriately maintained.
特に本実施形態における磁性コア１１は、磁性合金粉末、例えばＦｅ基非晶質合金粉末及び結着材を圧縮成形したものであり、フェライトなどと比べて電気抵抗が高くない。また、本実施形態では図３に示すように、コイル１２を巻回形成して磁性コア１１の同じ側面１１ａから２本の端子１３を引き出している。このような構成によりコイル１２から無理なく端子１３を外部に引き出すことができる。例えば図８に示すようにコイル１２からの被覆導体１７を異なる方向に延出させて、２本の端子１３，１３を磁性コア１１の異なる側面１１ａ，１１ｃに引き出すことも可能であるが、かかる場合、引き出し方に工夫が必要となる。なお図８では、コイル１２から被覆導体１７を反対方向に引き出し、反対面となる側面１１ａと側面１１ｃから端子１３，１３を外部に引き出している。 In particular, the magnetic core 11 in the present embodiment is formed by compression-molding magnetic alloy powder, for example, Fe-based amorphous alloy powder and a binder, and has an electric resistance that is not higher than that of ferrite. In the present embodiment, as shown in FIG. 3, the coil 12 is wound and the two terminals 13 are drawn from the same side surface 11 a of the magnetic core 11. With such a configuration, the terminal 13 can be pulled out from the coil 12 without difficulty. For example, as shown in FIG. 8, it is possible to extend the coated conductor 17 from the coil 12 in different directions and draw out the two terminals 13 and 13 to different side surfaces 11 a and 11 c of the magnetic core 11. In this case, it is necessary to devise how to pull it out. In FIG. 8, the coated conductor 17 is drawn out from the coil 12 in the opposite direction, and the terminals 13 and 13 are drawn out from the side surface 11a and the side surface 11c which are opposite surfaces.
図８に示す端子１３の引き出し方に対して、図３に示すようにコイル１２から磁性コア１１の同じ側面１１ａに向けて端子１３を引き出す構成であると、特に引き出し方に工夫を必要とすることなく端子１３を磁性コア１１の側面１１ａに向けてストレートに簡単に引き出すことができ、図８の構成に比べてコイル１２を効果的に薄く形成でき、ひいてはインダクタの小型化（薄型化）を図ることが可能である。図１では、インダクタ１０の縦横寸法を例えば、１ｍｍ〜３ｍｍ程度、厚さ寸法を１ｍｍ程度以下にできる。 In contrast to the method of pulling out the terminal 13 shown in FIG. 8, when the terminal 13 is drawn from the coil 12 toward the same side surface 11a of the magnetic core 11 as shown in FIG. The terminal 13 can be easily pulled straight out toward the side surface 11a of the magnetic core 11, and the coil 12 can be effectively made thinner than the configuration shown in FIG. 8, thereby reducing the size (thinning) of the inductor. It is possible to plan. In FIG. 1, the vertical and horizontal dimensions of the inductor 10 can be, for example, about 1 mm to 3 mm, and the thickness dimension can be about 1 mm or less.
このように図３に示す構造によりインダクタ１０の小型化を促進できるが、小型化されたインダクタ１０では、コイル１２と磁性コア１１の表面までの距離が非常に薄くなっている。よって本実施形態に示すように、磁性コア１１の側面１１ａの位置における端子サイド部１３ａを被覆導体１７で形成し、また端子下面部１３ｂのうち磁性コア１１の下面１１ｂと対向する導体上面１５ｂに端子サイド部１３ａから連続する電気絶縁性の被覆部１６を残したことで、インダクタの小型化や磁性コア１１にＦｅ基非晶質合金を用いた構成において好ましく端子１３と磁性コア１１との間の電気絶縁性を保つことができる。 As described above, the structure shown in FIG. 3 can promote downsizing of the inductor 10. However, in the downsized inductor 10, the distance between the coil 12 and the surface of the magnetic core 11 is very thin. Therefore, as shown in the present embodiment, the terminal side portion 13a at the position of the side surface 11a of the magnetic core 11 is formed by the covered conductor 17, and the conductor upper surface 15b of the terminal lower surface portion 13b facing the lower surface 11b of the magnetic core 11 is formed. By leaving the electrically insulating covering portion 16 continuous from the terminal side portion 13a, it is preferable to reduce the size of the inductor or to use a Fe-based amorphous alloy for the magnetic core 11 between the terminal 13 and the magnetic core 11. The electrical insulation can be maintained.
図４（ｂ）（ｃ）に示すように、端子下面部１３ｂにおいて、被覆部１６は導体上面１５ｂから導体側面１５ｃにかけて残されていることが好適である。図４（ｂ）（ｃ）では、端子下面部１３ｂと溝２５の側壁面２５ｂとの間に間隔が空いているが、多少、端子下面部１３ｂがずれて配置されると、端子下面部１３ｂが溝２５の側壁面２５ｂに接触する可能性がある。かかる場合でも、被覆部１６が導体側面１５ｃまで形成されていることで、磁性コア１１と端子１３との間の電気絶縁性を良好に保つことができる。またはんだ層４１が導体下面１５ａに塗布され、導体側面１５ｃを伝って両側に広がるのを抑制できる。はんだ層４１が広がると、端子下面部１３ｂと磁性コア１１とがはんだ層４１を介して電気的につながる恐れもあるが、図４（ｂ）（ｃ）の構成では、そのような心配はない。 As shown in FIGS. 4B and 4C, in the terminal lower surface portion 13b, the covering portion 16 is preferably left from the conductor upper surface 15b to the conductor side surface 15c. 4B and 4C, there is a gap between the terminal lower surface portion 13b and the side wall surface 25b of the groove 25. However, if the terminal lower surface portion 13b is slightly displaced, the terminal lower surface portion 13b is disposed. May come into contact with the side wall surface 25 b of the groove 25. Even in such a case, the electrical insulation between the magnetic core 11 and the terminal 13 can be kept good because the covering portion 16 is formed up to the conductor side surface 15c. Moreover, it can suppress that the solder layer 41 is apply | coated to the conductor lower surface 15a, and spreads to both sides along the conductor side surface 15c. When the solder layer 41 spreads, the terminal lower surface portion 13b and the magnetic core 11 may be electrically connected via the solder layer 41, but there is no such concern in the configurations of FIGS. .
一方、図４（ｄ）では、導体側面１５ｃの被覆部１６の大部分が剥がされた状態とされている。ここで、導体側面１５ｃの半分以上の領域に、被覆部１６が残されていることが好ましいが、図４（ｄ）のように被覆部１６が導体側面１５ｃにわずかに残された状態であっても、あるいは被覆部１６が導体側面１５ｃに残っていなくても、被覆部１６は導体上面１５ｂには残された状態にあり、したがっていずれも本実施形態とされる。 On the other hand, in FIG. 4D, most of the covering portion 16 of the conductor side surface 15c is peeled off. Here, it is preferable that the covering portion 16 is left in an area of more than half of the conductor side surface 15c, but the covering portion 16 is slightly left on the conductor side surface 15c as shown in FIG. Even if the covering portion 16 does not remain on the conductor side surface 15c, the covering portion 16 remains on the conductor upper surface 15b.
なお被覆部１６はレーザ、エッチング、機械的処理等により剥がすことができるが、レーザ等で被覆部１６を剥がすと図４（ｄ）に示すように、被覆部１６は導体下面１５ａのみならず導体側面１５ｃの少なくとも一部において剥がれるものと思われる。このように図４（ｄ）では、導体側面１５ｃが露出した状態にあるが、実際には、後述の図１１（ｃ）で示すように、電気絶縁性の表皮層６０を磁性コア１１の表面全域に形成するので、端子１３と磁性コア１１間の電気絶縁性を効果的に保つことが可能になる。図４（ｄ）の構成でも、被覆部１６は導体上面１５ｂには残されているので、導体上面１５ｂと磁性コア１１の下面１１ｂ（溝２４の底面２５ａ）との間の電気絶縁性は適切に保たれた状態となっている。 The covering portion 16 can be peeled off by laser, etching, mechanical treatment, etc. However, when the covering portion 16 is peeled off by a laser or the like, the covering portion 16 is not only a conductor lower surface 15a but also a conductor as shown in FIG. It is considered that at least a part of the side surface 15c is peeled off. As shown in FIG. 4D, the conductor side surface 15c is exposed as described above. Actually, however , as shown in FIG. 11C described later, the electrically insulating skin layer 60 is formed on the surface of the magnetic core 11. because it forms the entire region, it is possible to keep the electrical insulation between the terminals 13 and the magnetic core 11 effectively. Even in the configuration of FIG. 4D, since the covering portion 16 remains on the conductor upper surface 15b, the electrical insulation between the conductor upper surface 15b and the lower surface 11b of the magnetic core 11 (the bottom surface 25a of the groove 24) is appropriate. It is in the state kept in.
図１，図２，図４（ｂ）〜図４（ｄ）に示すように、端子下面部１３ｂと磁性コア１１の下面１１ｂ（溝２４の底面２５ａ）との間が電気絶縁性の樹脂層２７により接着されている。ここで樹脂層２７は例えばエポキシ樹脂であるが材質を限定するものではない。樹脂層２７には耐熱性に優れた樹脂を用いることが好ましい。具体的には、ガラス転移温度Ｔｇが１５０℃以上の樹脂を用いることが好ましい。これにより、リフローに対する耐熱性を備えた構成にできる。 As shown in FIG. 1, FIG. 2, FIG. 4B to FIG. 4D, an electrically insulating resin layer is formed between the terminal lower surface portion 13b and the lower surface 11b of the magnetic core 11 (the bottom surface 25a of the groove 24). 27 is adhered. Here, the resin layer 27 is, for example, an epoxy resin, but the material is not limited. It is preferable to use a resin having excellent heat resistance for the resin layer 27. Specifically, it is preferable to use a resin having a glass transition temperature Tg of 150 ° C. or higher. Thereby, it can be set as the structure provided with the heat resistance with respect to reflow.
端子下面部１３ｂと磁性コア１１の下面１１ｂ間を樹脂層２７により接着したことで強度を効果的に向上させることができる。すなわち、端子１３を磁性コア１１に接着固定していない構成では、図２のようにインダクタ１０をランド２１との間ではんだ接合した状態やインダクタ１０単体の状態において、磁性コア１１や端子１３に力が加わると、端子１３の部分が折れ曲がったり損傷を受けるなどして、インダクタ１０が不良品となったり、あるいは適切にインダクタ１０をランド２１上に実装できなくなる。したがって端子下面部１３ｂと磁性コア１１の下面１１ｂ間を樹脂層２７により接着したことで端子強度ひいてはインダクタ全体の強度を効果的に向上させることができる。 By bonding the terminal lower surface portion 13b and the lower surface 11b of the magnetic core 11 with the resin layer 27, the strength can be effectively improved. That is, in the configuration in which the terminal 13 is not bonded and fixed to the magnetic core 11, in the state where the inductor 10 is soldered to the land 21 as shown in FIG. When force is applied, the terminal 13 is bent or damaged, and the inductor 10 becomes defective, or the inductor 10 cannot be properly mounted on the land 21. Therefore, by bonding the terminal lower surface portion 13b and the lower surface 11b of the magnetic core 11 with the resin layer 27, the terminal strength and thus the strength of the entire inductor can be effectively improved.
本実施形態では図１に示すように磁性コア１１の下面１１ｂに溝２５，２５を設ける構成のほか、図５に示すように、磁性コア１１の側面１１ａから下面１１ｂにかけて連続し、端子１３と対向する位置に、溝４４，４４を設けることもできる。またこの際、図５，図６（図５の縦断面図である。図２と同様にコイル断面を省略した）に示すように磁性サイド部１３ａと磁性コア１１の側面１１ａに該当する溝４４の底面４４ａとの間も、磁性下面部１３ｂと磁性コア１１の下面１１ｂ（溝４４の底面４４ａ）との間と同様に樹脂層４５により接着することが、より効果的に強度を向上させることができ好適である。 In this embodiment, in addition to the configuration in which grooves 25 and 25 are provided on the lower surface 11b of the magnetic core 11 as shown in FIG. 1, as shown in FIG. 5, it continues from the side surface 11a to the lower surface 11b of the magnetic core 11, and It is also possible to provide grooves 44, 44 at opposing positions. At this time, as shown in FIG. 5 and FIG. 6 (a longitudinal sectional view of FIG. 5, the coil cross section is omitted as in FIG. 2), the groove 44 corresponding to the magnetic side portion 13 a and the side surface 11 a of the magnetic core 11. It is possible to improve the strength more effectively by bonding with the resin layer 45 in the same manner as between the magnetic bottom surface portion 13b and the bottom surface 11b of the magnetic core 11 (bottom surface 44a of the groove 44). This is preferable.
また磁性コア１１の側面１１ａにも溝４４を設け、前記溝４４に沿って端子サイド部１３ａを配置することで、溝４４の略深さ分、端子サイド部１３ａの位置を後退させやすく、したがってインダクタ１０の小型化を促進できる。また、端子サイド部１３ａの少なくとも一部を溝４４内に入れることで、磁性コア１１の最側面（最も出っ張った位置の側面であり、図６では符号１１ａ１を付した）からの端子サイド部１３ａの突出量を小さくすることができる。 Further, by providing a groove 44 on the side surface 11a of the magnetic core 11 and arranging the terminal side portion 13a along the groove 44, the position of the terminal side portion 13a can be easily retracted by the approximate depth of the groove 44. The downsizing of the inductor 10 can be promoted. Further, by inserting at least a part of the terminal side portion 13a into the groove 44, the terminal side portion 13a from the outermost side surface (the side surface at the most protruding position, denoted by reference numeral 11a1 in FIG. 6) of the magnetic core 11. The amount of protrusion can be reduced.
図７に示す別の実施形態では、図３と同様に斜線部分が、被覆部１６を剥いだ電極面４０である。図７では、図３よりも電極面４０を端子サイド部１３ａが位置する側の磁性コア１１の側面１１ａから後退させた位置に設けている。すなわち図３では、電極面４０がちょうど端子サイド部１３ａが配置される側の磁性コア１１の側面１１ａの位置から形成されているが、図７では、電極面４０の端子サイド部１３ａ側の端部４０ａを、磁性コア１１の側面１１ａよりも少し奥まった位置（側面１１ａよりも内側）から形成した。これにより、ランド２１と接合した際に、はんだ層４１をインダクタ１０の真下部分だけに設けやすい。ただし、図７のように電極面４０を磁性コア１１の側面１１ａよりも後退させた位置から形成すると、図３に比べて電極面４０の領域が狭くなるので、電極面４０の後退位置をランド２１との間でのはんだ接合性を考慮して制御することが好適である。 In another embodiment shown in FIG. 7, the shaded portion is the electrode surface 40 from which the covering portion 16 is peeled, as in FIG. 3. In FIG. 7, the electrode surface 40 is provided at a position retracted from the side surface 11a of the magnetic core 11 on the side where the terminal side portion 13a is located as compared with FIG. That is, in FIG. 3, the electrode surface 40 is formed from the position of the side surface 11 a of the magnetic core 11 on the side where the terminal side portion 13 a is disposed, but in FIG. 7, the end of the electrode surface 40 on the terminal side portion 13 a side. The portion 40a was formed from a position slightly deeper than the side surface 11a of the magnetic core 11 (inside the side surface 11a). This makes it easy to provide the solder layer 41 only under the inductor 10 when bonded to the land 21. However, if the electrode surface 40 is formed from a position retracted from the side surface 11a of the magnetic core 11 as shown in FIG. 7, the region of the electrode surface 40 becomes narrower than that of FIG. It is preferable to control in consideration of the solderability with 21.
またこれまで図示してこなかったが、インダクタ１０全体（ただし電極面４０は除く）は、インダクタの強度を向上させるために、樹脂による表皮層にて覆われる。これにより例えば磁性コア１１を構成する磁性粉末の脱粒を防ぐことができる。 Although had not shown so far, the inductor 10 as a whole (excluding proviso electrode surface 40) is, in order to improve the strength of the inductor, dividing covered with skin layer by resin. Thereby, for example, it is possible to prevent the magnetic powder constituting the magnetic core 11 from degranulating.
本実施形態におけるインダクタ１０の製造方法では、導体１５の外周表面１５ｄを絶縁被覆した被覆導体１７を巻回してコイル１２を形成する。 In the method for manufacturing the inductor 10 in the present embodiment, the coil 12 is formed by winding the coated conductor 17 in which the outer peripheral surface 15d of the conductor 15 is insulated.
Ｆｅ基非晶質合金（Ｆｅ基金属ガラス合金）粉末及び結着材を圧縮成形した磁性コア１１を形成する。このとき磁性コア１１を分割形状などとして、まずは各磁性コアを形成し、続いて磁性コア１１内の収納部にコイル１２を収納するか、あるいはコイル１２を磁性コア１１内に封入した状態で前記磁性コア１１を圧縮成形する。このとき、図１に示す溝２５や図５に示す溝４４を磁性コア１１の外面に形成する。 The magnetic core 11 is formed by compression molding an Fe-based amorphous alloy (Fe-based metallic glass alloy) powder and a binder. At this time, the magnetic core 11 is divided into shapes, and each magnetic core is first formed, and then the coil 12 is housed in the housing portion in the magnetic core 11, or the coil 12 is enclosed in the magnetic core 11. The magnetic core 11 is compression molded. At this time, the groove 25 shown in FIG. 1 and the groove 44 shown in FIG. 5 are formed on the outer surface of the magnetic core 11.
磁性コア１１に対するアニール処理を施したのち、磁性コア１１の側面１１ａから引き出された被覆導体１７を端子１３として、磁性コア１１の側面１１ａから下面１１ｂに向けて折り曲げ、少なくとも磁性コア１１の下面１１ｂ（例えば図２に示す溝２５の底面２５ａ）と端子下面部１３ｂ間を樹脂層２７により接着固定する。樹脂層２７が熱硬化性樹脂であれば熱硬化させる。 After annealing the magnetic core 11, the coated conductor 17 drawn from the side surface 11a of the magnetic core 11 is bent as a terminal 13 from the side surface 11a to the lower surface 11b of the magnetic core 11, and at least the lower surface 11b of the magnetic core 11 (For example, the bottom surface 25a of the groove 25 shown in FIG. 2) and the terminal lower surface portion 13b are bonded and fixed by the resin layer 27. If the resin layer 27 is a thermosetting resin, it is thermoset.
続いて、インダクタ１０の表面全体に絶縁性の表皮層６０を形成する。端子下面部１３ｂ付近の状態を図１１（ａ）に示す。なお図１１（ａ）から図１１（ｂ）では、図４（ｂ）〜図４（ｄ）に対して上下を逆転させて図示した。よって図１１（ａ）から図１１（ｂ）では、導体上面１５ｂが下面側に位置し、導体下面１５ａが上面側に位置している。 Subsequently, an insulating skin layer 60 is formed on the entire surface of the inductor 10. A state in the vicinity of the terminal lower surface portion 13b is shown in FIG. 11 (a) to 11 (b) are shown upside down with respect to FIGS. 4 (b) to 4 (d). Accordingly, in FIGS. 11A to 11B, the conductor upper surface 15b is located on the lower surface side, and the conductor lower surface 15a is located on the upper surface side.
図１１（ｂ）は図１１（ａ）の次工程を示している。図１１（ｂ）では、導体下面１５ａの被覆部１６及び表皮層６０を例えば機械的処理により除去した。 FIG.11 (b) has shown the next process of Fig.11 (a). In FIG.11 (b), the coating | coated part 16 and the skin layer 60 of the conductor lower surface 15a were removed by the mechanical process, for example.
図１０に示す斜線部分が被覆部１６及び表皮層６０を除去した部分であり、これにより斜線部分に導体１５が露出した電極面４０を形成できる。 The hatched portion shown in FIG. 10 is a portion from which the covering portion 16 and the skin layer 60 have been removed, whereby the electrode surface 40 with the conductor 15 exposed at the shaded portion can be formed.
また図１１（ｃ）では、レーザ等で導体下面１５ａの被覆部１６及び表皮層６０を除去した例であり、これにより、導体下面１５ａのみならず導体側面１５ｃの被覆部１６及び表皮層６０も一部が剥がれるものと思われる。ただし図１１（ｃ）の構成においても導体上面１５ｂには被覆部１６が残されているため、溝２５の底面２５ａ（磁性コア１１の下面１１ｂ）と端子下面部１３ｂとの間の電気絶縁性を確保することができる。 FIG. 11C shows an example in which the covering portion 16 and the skin layer 60 on the conductor lower surface 15a are removed by a laser or the like, so that not only the conductor lower surface 15a but also the covering portion 16 and the skin layer 60 on the conductor side surface 15c can be obtained. It seems that a part is peeled off. However, in the configuration of FIG. 11C as well, since the covering portion 16 remains on the conductor upper surface 15b, electrical insulation between the bottom surface 25a of the groove 25 (the lower surface 11b of the magnetic core 11) and the terminal lower surface portion 13b. Can be secured.
本実施形態におけるインダクタ１０の製造方法によれば、端子１３全体をまず被覆導体１７で形成し、続いて、磁性コア１１の下面１１ｂに配置される被覆導体１７の導体下面１５ａの被覆部１６を剥がすことで導体１５を露出させて電極面４０を形成している。一方、電極面４０と対向する導体上面１５ｂの被覆部１６や磁性コア１１の側面１１ａに位置する端子サイド部１３ａの被覆部１６はそのまま残している。これにより、図２に示すようにランド２１との間ではんだ接合した際、インダクタ１０の側面にフィレットが形成されるのを防止できる。また、磁性コア１１と端子１３との間の電気絶縁性を効果的に保つことができる。 According to the method for manufacturing the inductor 10 in the present embodiment, the entire terminal 13 is first formed by the covered conductor 17, and then the covered portion 16 of the conductor lower surface 15 a of the covered conductor 17 disposed on the lower surface 11 b of the magnetic core 11 is formed. By peeling off, the conductor 15 is exposed and the electrode surface 40 is formed. On the other hand, the covering portion 16 of the conductor upper surface 15b facing the electrode surface 40 and the covering portion 16 of the terminal side portion 13a located on the side surface 11a of the magnetic core 11 are left as they are. Thereby, it is possible to prevent the fillet from being formed on the side surface of the inductor 10 when the solder bonding is performed with the land 21 as shown in FIG. Moreover, the electrical insulation between the magnetic core 11 and the terminal 13 can be effectively maintained.
本実施形態では、図１０に示すように、磁性コア１１の側面１１ａから下面１１ｂにかけて端子１３を構成する被覆導体１７を折り曲げた後、導体下面１５ａの被覆部１６を剥がして電極面４０を形成することが好ましい。例えば、端子１３を折り曲げる前の段階で被覆部１６を剥がして電極面４０を形成することもできるが、図１０に示すように端子下面部１３ｂを形成してから被覆部１６を剥がして電極面４０を形成したほうが、電極面４０を所定領域に形成しやすく、また導体上面１５ｂに被覆部１６を適切に残すことができる。 In the present embodiment, as shown in FIG. 10, after the covered conductor 17 constituting the terminal 13 is bent from the side surface 11a to the lower surface 11b of the magnetic core 11, the covered portion 16 of the conductor lower surface 15a is peeled off to form the electrode surface 40. It is preferable to do. For example, the covering portion 16 can be peeled off to form the electrode surface 40 before the terminal 13 is bent, but the covering portion 16 is peeled off after forming the terminal lower surface portion 13b as shown in FIG. The formation of the electrode 40 makes it easier to form the electrode surface 40 in a predetermined region, and the covering portion 16 can be appropriately left on the conductor upper surface 15b.
また図１１に示すように、端子下面部１３ｂと磁性コア１１の下面１１ｂとの間を樹脂層２７を介して接着固定することで、端子強度を向上させることができる。 Further, as shown in FIG. 11, the terminal strength can be improved by bonding and fixing between the terminal lower surface portion 13 b and the lower surface 11 b of the magnetic core 11 via the resin layer 27.
なお図１１に示した表皮層６０とともに被覆部１６を剥いで電極面４０を形成することで、製造工程を容易化できる。 Note By forming the electrode surface 40 by both stripped coating portion 16 and the skin layer 6 0 shown in FIG. 11, cut with ease the manufacturing process.
１０ インダクタ
１１ 磁性コア
１１ａ （磁性コアの）側面
１１ｂ （磁性コアの）下面
１２ コイル
１３ 端子
１３ａ 端子サイド部
１３ｂ 端子下面部
１５ 導体
１５ａ 導体下面
１５ｂ 導体上面
１５ｃ 導体側面
１６ 被覆部
１７ 被覆導体
２０ 実装基板
２１ ランド
２５、４４ 溝
２７ 樹脂層
４０ 電極面
４１ はんだ層
５１ フィレット
６０ 表皮層
10 Inductor 11 Magnetic core 11a (Magnetic core) side surface 11b (Magnetic core) lower surface 12 Coil 13 Terminal 13a Terminal side portion 13b Terminal lower surface portion 15 Conductor 15a Conductor lower surface 15b Conductor upper surface 15c Conductor side surface 16 Covering portion 17 Covered conductor 20 Mounting Substrate 21 Land 25, 44 Groove 27 Resin layer 40 Electrode surface 41 Solder layer 51 Fillet 60 Skin layer
Claims (15)
導体の外周表面を電気絶縁性の被覆部で絶縁被覆した被覆導体が巻回されて前記コイルを構成しており、
前記被覆導体は前記端子として、前記コイルから前記磁性コアの側面及び前記磁性コアの下面にかけて引き出されるとともに、前記磁性コアの下面の位置では、前記磁性コアと対向する導体上面に前記被覆部を残した状態で、前記導体上面に対し逆側の導体下面の前記被覆部が剥がされて前記導体が露出した電極面が形成されていることを特徴とするインダクタ。 A coil, a magnetic core in which the coil is disposed, and a terminal drawn from a side surface of the magnetic core to a lower surface of the magnetic core, and the entire surface of the magnetic core not covered with the terminal Is an inductor covered with an insulating skin layer,
A coated conductor in which the outer peripheral surface of the conductor is insulated with an electrically insulating coating is wound to form the coil.
As the coated conductor is the terminal, with drawn toward the lower surface side and the magnetic core of the magnetic core from the coil, the position of the lower surface of said magnetic core, said covering portion, leaving the conductor upper surface facing the magnetic core The inductor is characterized in that the electrode surface is formed by peeling off the covering portion on the lower surface of the conductor opposite to the upper surface of the conductor.
導体の外周表面を電気絶縁性の被覆部で絶縁被覆した被覆導体を巻回して前記コイルを形成し、
前記被覆導体を前記端子として、前記コイルから前記磁性コアの側面及び前記磁性コアの下面にかけて引き出すとともに、インダクタ表面全体を覆う絶縁性の表皮層を形成し、前記磁性コアの下面の位置では、前記磁性コアと対向する導体上面に前記被覆部を残した状態で、前記導体上面に対し逆側の導体下面の前記被覆部および前記表皮層を剥がして前記導体が露出した電極面を形成することを特徴とするインダクタの製造方法。 A method of manufacturing an inductor comprising: a coil; a magnetic core in which the coil is disposed; and a terminal drawn from a side surface of the magnetic core to a lower surface of the magnetic core,
The coil is formed by winding a coated conductor in which the outer peripheral surface of the conductor is insulated and coated with an electrically insulating coating .
With the coated conductor as the terminal, the coil is pulled out from the coil to the side surface of the magnetic core and the lower surface of the magnetic core, and an insulating skin layer is formed to cover the entire inductor surface , at the position of the lower surface of the magnetic core, in a state in which the magnetic core facing the conductor upper surface leaving the cover portion, to form the covering portion and the electrode surface on which the conductor is exposed by peeling the skin layer of the conductive lower surface of the opposite side with respect to the conductor upper surface A method for manufacturing an inductor.
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| JP2012189655A JP5994140B2 (en) | 2012-08-30 | 2012-08-30 | Inductor and manufacturing method thereof |
| TW102129177A TWI451455B (en) | 2012-08-30 | 2013-08-14 | Inductor and its manufacturing method |
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| US20160225516A1 (en) * | 2015-01-30 | 2016-08-04 | Toko, Inc. | Surface-mount inductor and a method for manufacturing the same |
| JP6529476B2 (en) * | 2016-09-30 | 2019-06-12 | 太陽誘電株式会社 | Electronic parts |
| JP7107691B2 (en) * | 2018-01-31 | 2022-07-27 | 太陽誘電株式会社 | Coil parts and electronic equipment |
| CN108389679A (en) * | 2018-03-20 | 2018-08-10 | 深圳顺络电子股份有限公司 | A kind of inductance element and manufacturing method |
| JP7193968B2 (en) * | 2018-09-28 | 2022-12-21 | 太陽誘電株式会社 | Coil parts and electronic equipment |
| JP7188258B2 (en) * | 2019-04-22 | 2022-12-13 | Tdk株式会社 | Coil component and its manufacturing method |
| JP7192815B2 (en) * | 2020-03-16 | 2022-12-20 | 株式会社村田製作所 | inductor components |
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| JP2004281777A (en) * | 2003-03-17 | 2004-10-07 | Tokyo Coil Engineering Kk | Choke coil |
| JP4203950B2 (en) * | 2003-08-07 | 2009-01-07 | Ｔｄｋ株式会社 | Common mode filter and manufacturing method thereof |
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| JP4994579B2 (en) * | 2004-04-16 | 2012-08-08 | パナソニック株式会社 | Coil parts |
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| JP2007150139A (en) * | 2005-11-30 | 2007-06-14 | Mitsumi Electric Co Ltd | Inductor |
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