JP5988971B2 - Polycarbonate resin composition and molded body using the same - Google Patents
Polycarbonate resin composition and molded body using the same Download PDFInfo
- Publication number
- JP5988971B2 JP5988971B2 JP2013520555A JP2013520555A JP5988971B2 JP 5988971 B2 JP5988971 B2 JP 5988971B2 JP 2013520555 A JP2013520555 A JP 2013520555A JP 2013520555 A JP2013520555 A JP 2013520555A JP 5988971 B2 JP5988971 B2 JP 5988971B2
- Authority
- JP
- Japan
- Prior art keywords
- polycarbonate resin
- resin composition
- mass
- carbon atoms
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920005668 polycarbonate resin Polymers 0.000 title claims description 56
- 239000004431 polycarbonate resin Substances 0.000 title claims description 56
- 239000000203 mixture Substances 0.000 title claims description 53
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 58
- -1 polytetrafluoroethylene Polymers 0.000 claims description 49
- 229910021389 graphene Inorganic materials 0.000 claims description 40
- 125000004432 carbon atom Chemical group C* 0.000 claims description 29
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 27
- 239000004417 polycarbonate Substances 0.000 claims description 25
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 24
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 24
- 125000003118 aryl group Chemical group 0.000 claims description 19
- 229920000515 polycarbonate Polymers 0.000 claims description 19
- RRAFCDWBNXTKKO-UHFFFAOYSA-N eugenol Chemical compound COC1=CC(CC=C)=CC=C1O RRAFCDWBNXTKKO-UHFFFAOYSA-N 0.000 claims description 15
- 229920001577 copolymer Polymers 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 claims description 9
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- NPBVQXIMTZKSBA-UHFFFAOYSA-N Chavibetol Natural products COC1=CC=C(CC=C)C=C1O NPBVQXIMTZKSBA-UHFFFAOYSA-N 0.000 claims description 7
- 239000005770 Eugenol Substances 0.000 claims description 7
- UVMRYBDEERADNV-UHFFFAOYSA-N Pseudoeugenol Natural products COC1=CC(C(C)=C)=CC=C1O UVMRYBDEERADNV-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 229960002217 eugenol Drugs 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 125000001118 alkylidene group Chemical group 0.000 claims description 3
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 24
- 239000004205 dimethyl polysiloxane Substances 0.000 description 23
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 23
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 21
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- 238000000034 method Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 239000002245 particle Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- 150000003839 salts Chemical class 0.000 description 9
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- 239000003513 alkali Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 7
- 239000003963 antioxidant agent Substances 0.000 description 7
- 239000011812 mixed powder Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229910019142 PO4 Inorganic materials 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- 229910052783 alkali metal Inorganic materials 0.000 description 6
- 230000003078 antioxidant effect Effects 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- 238000004898 kneading Methods 0.000 description 6
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 5
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000002041 carbon nanotube Substances 0.000 description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 description 5
- 239000011231 conductive filler Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 235000021317 phosphate Nutrition 0.000 description 5
- 229910052700 potassium Inorganic materials 0.000 description 5
- 239000011591 potassium Substances 0.000 description 5
- 229910052708 sodium Inorganic materials 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 4
- 229920006361 Polyflon Polymers 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000005027 hydroxyaryl group Chemical group 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000002064 nanoplatelet Substances 0.000 description 4
- 229920000620 organic polymer Polymers 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 4
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 4
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 125000001273 sulfonato group Chemical class [O-]S(*)(=O)=O 0.000 description 4
- 150000003462 sulfoxides Chemical class 0.000 description 4
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910052788 barium Inorganic materials 0.000 description 3
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 3
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 3
- 239000006085 branching agent Substances 0.000 description 3
- 229910052792 caesium Inorganic materials 0.000 description 3
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 3
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 3
- 230000003405 preventing effect Effects 0.000 description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910052712 strontium Inorganic materials 0.000 description 3
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 2
- ZDSPTFQHKJLGFQ-UHFFFAOYSA-N 10,10-bis(4-hydroxyphenyl)anthracen-9-one Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)C2=CC=CC=C21 ZDSPTFQHKJLGFQ-UHFFFAOYSA-N 0.000 description 2
- ICKWICRCANNIBI-UHFFFAOYSA-N 2,4-di-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C(C(C)(C)C)=C1 ICKWICRCANNIBI-UHFFFAOYSA-N 0.000 description 2
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 2
- CKNCVRMXCLUOJI-UHFFFAOYSA-N 3,3'-dibromobisphenol A Chemical compound C=1C=C(O)C(Br)=CC=1C(C)(C)C1=CC=C(O)C(Br)=C1 CKNCVRMXCLUOJI-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 2
- BATCUENAARTUKW-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-diphenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BATCUENAARTUKW-UHFFFAOYSA-N 0.000 description 2
- QHSCVNPSSKNMQL-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-naphthalen-1-ylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(O)C=C1 QHSCVNPSSKNMQL-UHFFFAOYSA-N 0.000 description 2
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 2
- OVVCSFQRAXVPGT-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclopentyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCC1 OVVCSFQRAXVPGT-UHFFFAOYSA-N 0.000 description 2
- WEFHJJXWZHDCCM-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)-2-adamantyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C(C2)CC3CC2CC1C3 WEFHJJXWZHDCCM-UHFFFAOYSA-N 0.000 description 2
- QHJPJZROUNGTRJ-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)octan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCCCC)C1=CC=C(O)C=C1 QHJPJZROUNGTRJ-UHFFFAOYSA-N 0.000 description 2
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 2
- DNLWYVQYADCTEU-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-1-adamantyl]phenol Chemical compound C1=CC(O)=CC=C1C1(CC(C2)(C3)C=4C=CC(O)=CC=4)CC3CC2C1 DNLWYVQYADCTEU-UHFFFAOYSA-N 0.000 description 2
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 2
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 2
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 229910003481 amorphous carbon Inorganic materials 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 150000001924 cycloalkanes Chemical class 0.000 description 2
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical class OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 2
- JJRDHFIVAPVZJN-UHFFFAOYSA-N cyclotrisiloxane Chemical compound O1[SiH2]O[SiH2]O[SiH2]1 JJRDHFIVAPVZJN-UHFFFAOYSA-N 0.000 description 2
- 125000005028 dihydroxyaryl group Chemical group 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- CGEXUOTXYSGBLV-UHFFFAOYSA-N phenyl benzenesulfonate Chemical compound C=1C=CC=CC=1S(=O)(=O)OC1=CC=CC=C1 CGEXUOTXYSGBLV-UHFFFAOYSA-N 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 150000003460 sulfonic acids Chemical class 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- NZADFKWJIQWGNZ-UHFFFAOYSA-N (2-ethylphenyl) diphenyl phosphate Chemical compound CCC1=CC=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 NZADFKWJIQWGNZ-UHFFFAOYSA-N 0.000 description 1
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- JDWGPDRDUUNFIB-UHFFFAOYSA-N 1,1,1,2,3,3,4,4,5,5,5-undecafluoropentane-2-sulfonic acid Chemical compound OS(=O)(=O)C(F)(C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)F JDWGPDRDUUNFIB-UHFFFAOYSA-N 0.000 description 1
- GKNWQHIXXANPTN-UHFFFAOYSA-N 1,1,2,2,2-pentafluoroethanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)F GKNWQHIXXANPTN-UHFFFAOYSA-N 0.000 description 1
- XBWQFDNGNOOMDZ-UHFFFAOYSA-N 1,1,2,2,3,3,3-heptafluoropropane-1-sulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)F XBWQFDNGNOOMDZ-UHFFFAOYSA-N 0.000 description 1
- OYGQVDSRYXATEL-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,7-pentadecafluoroheptane-1-sulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F OYGQVDSRYXATEL-UHFFFAOYSA-N 0.000 description 1
- KEKQWCLOVHSOCU-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-pentacosafluorododecyl 4-hydroxybenzoate Chemical compound OC1=CC=C(C(=O)OC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C=C1 KEKQWCLOVHSOCU-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- KDYHQAWOWCCBAJ-UHFFFAOYSA-N 1h-indole-2,3-dione;2-methylphenol Chemical compound CC1=CC=CC=C1O.CC1=CC=CC=C1O.C1=CC=C2C(=O)C(=O)NC2=C1 KDYHQAWOWCCBAJ-UHFFFAOYSA-N 0.000 description 1
- RARQGXBOCXOJPM-UHFFFAOYSA-N 2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-hexadecafluorononanoic acid Chemical compound OC(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)F RARQGXBOCXOJPM-UHFFFAOYSA-N 0.000 description 1
- GAAIDMALZSHOQX-UHFFFAOYSA-N 2,3,4,5-tetrafluoro-6-(4-hydroxyphenyl)phenol Chemical compound FC=1C(=C(C(=C(C1F)F)F)C1=CC=C(C=C1)O)O GAAIDMALZSHOQX-UHFFFAOYSA-N 0.000 description 1
- LEDKKDPOPIKMSZ-UHFFFAOYSA-N 2,4,5-trichlorobenzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC(Cl)=C(Cl)C=C1Cl LEDKKDPOPIKMSZ-UHFFFAOYSA-N 0.000 description 1
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 1
- KDPQUXLWQYXMCE-UHFFFAOYSA-N 2,5-bis(2-phenylpropan-2-yl)phenol Chemical compound C=1C=C(C(C)(C)C=2C=CC=CC=2)C(O)=CC=1C(C)(C)C1=CC=CC=C1 KDPQUXLWQYXMCE-UHFFFAOYSA-N 0.000 description 1
- KDBZVULQVCUNNA-UHFFFAOYSA-N 2,5-di-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(C(C)(C)C)C(O)=C1 KDBZVULQVCUNNA-UHFFFAOYSA-N 0.000 description 1
- LFXZSGVZSSMCMB-UHFFFAOYSA-N 2,5-dichlorobenzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC(Cl)=CC=C1Cl LFXZSGVZSSMCMB-UHFFFAOYSA-N 0.000 description 1
- NFIDBGJMFKNGGQ-UHFFFAOYSA-N 2-(2-methylpropyl)phenol Chemical compound CC(C)CC1=CC=CC=C1O NFIDBGJMFKNGGQ-UHFFFAOYSA-N 0.000 description 1
- CJWNFAKWHDOUKL-UHFFFAOYSA-N 2-(2-phenylpropan-2-yl)phenol Chemical compound C=1C=CC=C(O)C=1C(C)(C)C1=CC=CC=C1 CJWNFAKWHDOUKL-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- XBQRPFBBTWXIFI-UHFFFAOYSA-N 2-chloro-4-[2-(3-chloro-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(Cl)=CC=1C(C)(C)C1=CC=C(O)C(Cl)=C1 XBQRPFBBTWXIFI-UHFFFAOYSA-N 0.000 description 1
- MVRPPTGLVPEMPI-UHFFFAOYSA-N 2-cyclohexylphenol Chemical compound OC1=CC=CC=C1C1CCCCC1 MVRPPTGLVPEMPI-UHFFFAOYSA-N 0.000 description 1
- NTRXCTZXSALJEY-UHFFFAOYSA-N 2-naphthalen-1-ylphenol Chemical compound OC1=CC=CC=C1C1=CC=CC2=CC=CC=C12 NTRXCTZXSALJEY-UHFFFAOYSA-N 0.000 description 1
- WUQYBSRMWWRFQH-UHFFFAOYSA-N 2-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=CC=C1O WUQYBSRMWWRFQH-UHFFFAOYSA-N 0.000 description 1
- KTMNDTPAJZKQPF-UHFFFAOYSA-N 2-tert-butyl-4-[1-(3-tert-butyl-4-hydroxyphenyl)propyl]phenol Chemical compound C=1C=C(O)C(C(C)(C)C)=CC=1C(CC)C1=CC=C(O)C(C(C)(C)C)=C1 KTMNDTPAJZKQPF-UHFFFAOYSA-N 0.000 description 1
- SQQOWYUPNYZZPI-UHFFFAOYSA-N 3,5-bis(2-phenylpropan-2-yl)phenol Chemical compound C=1C(O)=CC(C(C)(C)C=2C=CC=CC=2)=CC=1C(C)(C)C1=CC=CC=C1 SQQOWYUPNYZZPI-UHFFFAOYSA-N 0.000 description 1
- ZDWSNKPLZUXBPE-UHFFFAOYSA-N 3,5-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(O)=CC(C(C)(C)C)=C1 ZDWSNKPLZUXBPE-UHFFFAOYSA-N 0.000 description 1
- ZKSISJGIJFEBMS-UHFFFAOYSA-N 3-(2-methylpropyl)phenol Chemical compound CC(C)CC1=CC=CC(O)=C1 ZKSISJGIJFEBMS-UHFFFAOYSA-N 0.000 description 1
- PARGHORKDQHVPM-UHFFFAOYSA-N 3-(2-phenylpropan-2-yl)phenol Chemical compound C=1C=CC(O)=CC=1C(C)(C)C1=CC=CC=C1 PARGHORKDQHVPM-UHFFFAOYSA-N 0.000 description 1
- WFKNYMUYMWAGCV-UHFFFAOYSA-N 3-cyclohexylphenol Chemical compound OC1=CC=CC(C2CCCCC2)=C1 WFKNYMUYMWAGCV-UHFFFAOYSA-N 0.000 description 1
- MFZDWVIWDAFDRL-UHFFFAOYSA-N 3-naphthalen-1-ylphenol Chemical compound OC1=CC=CC(C=2C3=CC=CC=C3C=CC=2)=C1 MFZDWVIWDAFDRL-UHFFFAOYSA-N 0.000 description 1
- QWGLNWHWBCINBS-UHFFFAOYSA-N 3-nonylphenol Chemical compound CCCCCCCCCC1=CC=CC(O)=C1 QWGLNWHWBCINBS-UHFFFAOYSA-N 0.000 description 1
- YNNMNWHCQGBNFH-UHFFFAOYSA-N 3-tert-butyl-4-[1-(2-tert-butyl-4-hydroxyphenyl)propyl]phenol Chemical compound C=1C=C(O)C=C(C(C)(C)C)C=1C(CC)C1=CC=C(O)C=C1C(C)(C)C YNNMNWHCQGBNFH-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- KZMYFIUFUAOZHP-UHFFFAOYSA-N 4-(1-adamantyl)phenol Chemical compound C1=CC(O)=CC=C1C1(C2)CC(C3)CC2CC3C1 KZMYFIUFUAOZHP-UHFFFAOYSA-N 0.000 description 1
- GDEHXPCZWFXRKC-UHFFFAOYSA-N 4-(2-methylpropyl)phenol Chemical compound CC(C)CC1=CC=C(O)C=C1 GDEHXPCZWFXRKC-UHFFFAOYSA-N 0.000 description 1
- TZUAMPRYDFQGGR-UHFFFAOYSA-N 4-(4-bicyclo[2.2.1]heptanyl)phenol Chemical compound C1=CC(O)=CC=C1C1(C2)CCC2CC1 TZUAMPRYDFQGGR-UHFFFAOYSA-N 0.000 description 1
- JXXKAMNOSKLPFR-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-diphenylmethyl]phenol;4-[(4-hydroxyphenyl)-phenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=CC=C1.C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 JXXKAMNOSKLPFR-UHFFFAOYSA-N 0.000 description 1
- RSSGMIIGVQRGDS-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-phenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=CC=C1 RSSGMIIGVQRGDS-UHFFFAOYSA-N 0.000 description 1
- BRPSWMCDEYMRPE-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=C(O)C=C1 BRPSWMCDEYMRPE-UHFFFAOYSA-N 0.000 description 1
- BHWMWBACMSEDTE-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclododecyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCCCCCCCC1 BHWMWBACMSEDTE-UHFFFAOYSA-N 0.000 description 1
- TVLIVAKHIGPKLY-UHFFFAOYSA-N 4-[2,3,4,5-tetrafluoro-6-(1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,9-nonadecafluorononyl)phenyl]phenol Chemical compound C1=CC(O)=CC=C1C1=C(F)C(F)=C(F)C(F)=C1C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F TVLIVAKHIGPKLY-UHFFFAOYSA-N 0.000 description 1
- KJMVGAOYRRKQPY-UHFFFAOYSA-N 4-[2,4,6-tri(propan-2-yl)phenyl]phenol Chemical compound CC(C)C1=CC(C(C)C)=CC(C(C)C)=C1C1=CC=C(O)C=C1 KJMVGAOYRRKQPY-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- XIULDYAZWUUWQF-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)sulfanylethenylperoxymethylsulfanyl]phenol Chemical compound C1=CC(O)=CC=C1SCOOC=CSC1=CC=C(O)C=C1 XIULDYAZWUUWQF-UHFFFAOYSA-N 0.000 description 1
- RBWZNZOIVJUVRB-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-3-bicyclo[2.2.1]heptanyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C(C2)CCC2C1 RBWZNZOIVJUVRB-UHFFFAOYSA-N 0.000 description 1
- ZJNKCNFBTBFNMO-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-5,7-dimethyl-1-adamantyl]phenol Chemical compound C1C(C)(C2)CC(C3)(C)CC1(C=1C=CC(O)=CC=1)CC23C1=CC=C(O)C=C1 ZJNKCNFBTBFNMO-UHFFFAOYSA-N 0.000 description 1
- NUDSREQIJYWLRA-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=CC=2)=C1 NUDSREQIJYWLRA-UHFFFAOYSA-N 0.000 description 1
- FTMFBPJUFQDPJR-UHFFFAOYSA-N 4-[9-(4-methoxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(C)C(OC)=CC=C1C1(C=2C=C(C)C(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 FTMFBPJUFQDPJR-UHFFFAOYSA-N 0.000 description 1
- OAHMVZYHIJQTQC-UHFFFAOYSA-N 4-cyclohexylphenol Chemical compound C1=CC(O)=CC=C1C1CCCCC1 OAHMVZYHIJQTQC-UHFFFAOYSA-N 0.000 description 1
- 125000003143 4-hydroxybenzyl group Chemical group [H]C([*])([H])C1=C([H])C([H])=C(O[H])C([H])=C1[H] 0.000 description 1
- 125000004172 4-methoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C([H])C([H])=C1* 0.000 description 1
- UEULEVKFYSYUCZ-UHFFFAOYSA-N 4-naphthalen-1-ylphenol Chemical compound C1=CC(O)=CC=C1C1=CC=CC2=CC=CC=C12 UEULEVKFYSYUCZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- CIQWOQNDSHNWTB-UHFFFAOYSA-N C12CC3CC(CC(C1)C3)C2.OC2=CC=C(C=C2)C23CC1(CC(CC(C2)(C1)C)(C3)C)C3=CC=C(C=C3)O Chemical class C12CC3CC(CC(C1)C3)C2.OC2=CC=C(C=C2)C23CC1(CC(CC(C2)(C1)C)(C3)C)C3=CC=C(C=C3)O CIQWOQNDSHNWTB-UHFFFAOYSA-N 0.000 description 1
- 0 CC(*)(*)[N+]([O-])Oc1ccc(*c(cc2)ccc2O*(*)*)cc1 Chemical compound CC(*)(*)[N+]([O-])Oc1ccc(*c(cc2)ccc2O*(*)*)cc1 0.000 description 1
- UBDRBIAIXGJJJS-UHFFFAOYSA-N CC(C)(C)[NH+](C)[O-] Chemical compound CC(C)(C)[NH+](C)[O-] UBDRBIAIXGJJJS-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- CVBURIHGVPWMOA-UHFFFAOYSA-N O1SSO1.N Chemical compound O1SSO1.N CVBURIHGVPWMOA-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- UBXYXCRCOKCZIT-UHFFFAOYSA-N biphenyl-3-ol Chemical compound OC1=CC=CC(C=2C=CC=CC=2)=C1 UBXYXCRCOKCZIT-UHFFFAOYSA-N 0.000 description 1
- NWRJMFCZZOMPSU-UHFFFAOYSA-N bis(1,1,2,2,3,3,4,4,5,5,6,6,6-tridecafluorohexyl) 5-hydroxybenzene-1,3-dicarboxylate Chemical compound OC1=CC(C(=O)OC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)=CC(C(=O)OC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)=C1 NWRJMFCZZOMPSU-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 159000000006 cesium salts Chemical class 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- AOGYCOYQMAVAFD-UHFFFAOYSA-N chlorocarbonic acid Chemical group OC(Cl)=O AOGYCOYQMAVAFD-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- DDTBPAQBQHZRDW-UHFFFAOYSA-N cyclododecane Chemical compound C1CCCCCCCCCCC1 DDTBPAQBQHZRDW-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 1
- 239000001177 diphosphate Substances 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- FYAQQULBLMNGAH-UHFFFAOYSA-N hexane-1-sulfonic acid Chemical compound CCCCCCS(O)(=O)=O FYAQQULBLMNGAH-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- GPUMPJNVOBTUFM-UHFFFAOYSA-N naphthalene-1,2,3-trisulfonic acid Chemical compound C1=CC=C2C(S(O)(=O)=O)=C(S(O)(=O)=O)C(S(=O)(=O)O)=CC2=C1 GPUMPJNVOBTUFM-UHFFFAOYSA-N 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 235000010292 orthophenyl phenol Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 description 1
- BPHQIXJDBIHMLT-UHFFFAOYSA-N perfluorodecane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F BPHQIXJDBIHMLT-UHFFFAOYSA-N 0.000 description 1
- YFSUTJLHUFNCNZ-UHFFFAOYSA-N perfluorooctane-1-sulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F YFSUTJLHUFNCNZ-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- XTTGYFREQJCEML-UHFFFAOYSA-N tributyl phosphite Chemical compound CCCCOP(OCCCC)OCCCC XTTGYFREQJCEML-UHFFFAOYSA-N 0.000 description 1
- FICPQAZLPKLOLH-UHFFFAOYSA-N tricyclohexyl phosphite Chemical compound C1CCCCC1OP(OC1CCCCC1)OC1CCCCC1 FICPQAZLPKLOLH-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- GAJQCIFYLSXSEZ-UHFFFAOYSA-L tridecyl phosphate Chemical compound CCCCCCCCCCCCCOP([O-])([O-])=O GAJQCIFYLSXSEZ-UHFFFAOYSA-L 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical compound CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- CYTQBVOFDCPGCX-UHFFFAOYSA-N trimethyl phosphite Chemical compound COP(OC)OC CYTQBVOFDCPGCX-UHFFFAOYSA-N 0.000 description 1
- QUTZUATVZPXUJR-UHFFFAOYSA-N trinonyl phosphite Chemical compound CCCCCCCCCOP(OCCCCCCCCC)OCCCCCCCCC QUTZUATVZPXUJR-UHFFFAOYSA-N 0.000 description 1
- FDGZUBKNYGBWHI-UHFFFAOYSA-N trioctadecyl phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC FDGZUBKNYGBWHI-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- QOQNJVLFFRMJTQ-UHFFFAOYSA-N trioctyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OCCCCCCCC QOQNJVLFFRMJTQ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- JZZBTMVTLBHJHL-UHFFFAOYSA-N tris(2,3-dichloropropyl) phosphate Chemical compound ClCC(Cl)COP(=O)(OCC(Cl)CCl)OCC(Cl)CCl JZZBTMVTLBHJHL-UHFFFAOYSA-N 0.000 description 1
- FCFIEBVTVHJMQR-UHFFFAOYSA-N tris(2,3-dichloropropyl) phosphite Chemical compound ClCC(Cl)COP(OCC(Cl)CCl)OCC(Cl)CCl FCFIEBVTVHJMQR-UHFFFAOYSA-N 0.000 description 1
- NZRUVESPDLPFNE-UHFFFAOYSA-N tris(2-butylphenyl) phosphite Chemical compound CCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCC)OC1=CC=CC=C1CCCC NZRUVESPDLPFNE-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- LUVCTYHBTXSAMX-UHFFFAOYSA-N tris(2-chloroethyl) phosphite Chemical compound ClCCOP(OCCCl)OCCCl LUVCTYHBTXSAMX-UHFFFAOYSA-N 0.000 description 1
- BRAZJWSWBBLGAH-UHFFFAOYSA-N tris(2-ethylphenyl) phosphite Chemical compound CCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CC)OC1=CC=CC=C1CC BRAZJWSWBBLGAH-UHFFFAOYSA-N 0.000 description 1
- XKEHGKBYZJWLQC-UHFFFAOYSA-N tris(2-hydroxyphenyl) phosphite Chemical compound OC1=CC=CC=C1OP(OC=1C(=CC=CC=1)O)OC1=CC=CC=C1O XKEHGKBYZJWLQC-UHFFFAOYSA-N 0.000 description 1
- OOZBTDPWFHJVEK-UHFFFAOYSA-N tris(2-nonylphenyl) phosphate Chemical compound CCCCCCCCCC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC OOZBTDPWFHJVEK-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/10—Block- or graft-copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2427/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2427/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2427/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2427/18—Homopolymers or copolymers of tetrafluoroethylene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、ポリカーボネート樹脂組成物、及びそれを用いた成形体に関する。さらに詳しくは、難燃性、剛性、耐衝撃性、導電性及び成形外観、さらには熱伝導性などに優れた成形体を与えるポリカーボネート樹脂組成物、及び該樹脂組成物を成形してなる、上記性状を有する成形体に関するものである。 The present invention relates to a polycarbonate resin composition and a molded body using the same. More specifically, a polycarbonate resin composition that gives a molded article excellent in flame retardancy, rigidity, impact resistance, electrical conductivity and molded appearance, and further heat conductivity, and the resin composition, The present invention relates to a molded article having properties.
近年、エレクトロニクス技術の発展により、情報処理装置及び電子事務機器が急速に普及しつつある。そして電子機器の普及に伴い、電子部品から発生するノイズが周辺機器に影響を与える電磁波障害、静電気による誤作動等のトラブルが増加し、大きな問題となりつつある。これらの問題の解決のため、導電性や制電性に優れた材料が要求されており、さらに製品の薄肉化に伴い、更なる高剛性化と難燃性が要求されるようになってきた。 In recent years, information processing apparatuses and electronic office equipment are rapidly spreading due to the development of electronics technology. With the widespread use of electronic devices, troubles such as electromagnetic interference, malfunctions due to static electricity, etc., in which noise generated from electronic components affects peripheral devices are increasing, becoming a major problem. In order to solve these problems, materials with excellent electrical conductivity and antistatic properties are required, and as products become thinner, higher rigidity and flame retardance have been required. .
従来より、導電性の低い高分子材料に導電性フィラー等を配合した導電性高分子材料が広く利用されている。導電性フィラーとしては、金属繊維、金属粉末、カーボンブラック及び炭素繊維等が一般に用いられているが、金属繊維及び金属粉末を導電性フィラーとして用いると、優れた導電性付与効果はあるが、耐蝕性に劣り、機械的強度が得難い欠点がある。カーボンブラックを導電性フィラーとして用いる場合、少量の添加で高い導電性が得られるケッチェンブラック、バルカンXC72及びアセチレンブラック等の導電性カーボンブラックが用いられているが、これらは、樹脂への分散性が不良である。カーボンブラックの分散性が樹脂組成物の導電性に影響するため、安定した導電性を得るには独特の配合並びに混合技術が必要とされる。
また、炭素繊維を導電性フィラーして使用する場合、一般の補強用炭素繊維により、所望の強度、弾性率を得ることができるが、導電性を付与するには高充填を必要とし、樹脂本来の物性が低下する。Conventionally, a conductive polymer material in which a conductive filler or the like is blended with a low-conductivity polymer material has been widely used. As the conductive filler, metal fiber, metal powder, carbon black, carbon fiber and the like are generally used. However, when the metal fiber and metal powder are used as the conductive filler, there is an excellent conductivity imparting effect, but the corrosion resistance. There is a disadvantage that the mechanical strength is difficult to obtain. When carbon black is used as a conductive filler, conductive carbon black such as ketjen black, Vulcan XC72, and acetylene black, which can obtain high conductivity with a small amount of addition, is used. Is bad. Since the dispersibility of carbon black affects the conductivity of the resin composition, a unique blending and mixing technique is required to obtain stable conductivity.
In addition, when carbon fibers are used as conductive fillers, desired strength and elastic modulus can be obtained with ordinary reinforcing carbon fibers, but high filling is required to impart conductivity, and the resin itself The physical properties of the are reduced.
特許文献1には、ポリカーボネート−ポリオルガノシロキサン共重合体(PC−PDMSと略記することがある。)にカーボンナノチューブを配合し、導電性と難燃性を向上させる技術、特許文献2には、ポリカーボネートに黒鉛を配合し、熱伝導性を付与する技術、特許文献3には、官能性グラフェンを樹脂に配合する技術が開示されている。 Patent Document 1 discloses a technique for adding carbon nanotubes to a polycarbonate-polyorganosiloxane copolymer (sometimes abbreviated as PC-PDMS) to improve conductivity and flame retardancy, and Patent Document 2 includes A technique for blending graphite with polycarbonate to impart thermal conductivity, and Patent Document 3 disclose a technique for blending functional graphene with a resin.
しかしながら、特許文献1に記載の技術においては、要求される剛性を充分に付与することができない上、さらなる薄肉難燃要求にも対応することができず、必ずしも充分に満足し得るものではなかった。
また、特許文献2は、ポリカーボネートに黒鉛を配合し、熱伝導性を付与する技術であるが、難燃剤の併用でなければ、難燃性は発現せず、また、導電性や剛性についての記載はない。特許文献2には、ナノオーダーの厚さであるグラフェンについての記載はなく、ナノオーダーの厚さであるグラフェンの分散は、通常の押出機を使った製造では困難であり、グラフェンの持つ優れた性能を十分に発現するには到っていない。さらに、特許文献3は、官能性グラフェンを配合する技術であるが、ポリカーボネート材料において、難燃性や導電性に最適なグラフェンについての記載はない。
本発明は、このような状況下になされたものであり、難燃性、剛性、耐衝撃性、導電性及び成形外観、さらには熱伝導性などに優れた成形体を与えるポリカーボネート樹脂組成物及び該樹脂組成物を成形してなる上記性状を有する成形体を提供することを目的とするものである。However, in the technique described in Patent Document 1, the required rigidity cannot be sufficiently provided, and further, it cannot respond to the demand for further thin-walled flame retardant, and is not always satisfactory. .
Patent Document 2 is a technique of blending graphite with polycarbonate to impart thermal conductivity. However, unless it is used in combination with a flame retardant, flame retardancy is not manifested, and description of conductivity and rigidity is provided. There is no. In Patent Document 2, there is no description of graphene having a nano-order thickness, and dispersion of graphene having a nano-order thickness is difficult to produce using an ordinary extruder. The performance has not been fully developed. Furthermore, although patent document 3 is a technique which mix | blends functional graphene, in the polycarbonate material, there is no description about the graphene optimal for a flame retardance and electroconductivity.
The present invention has been made under such circumstances, and a polycarbonate resin composition that gives a molded article excellent in flame retardancy, rigidity, impact resistance, conductivity and molded appearance, and further in thermal conductivity and the like, and It is an object of the present invention to provide a molded article having the above-mentioned properties formed by molding the resin composition.
本発明者は、前記目的を達成すべく鋭意研究を重ねた結果、特定の構造単位からなるポリオルガノシロキサンブロックを所定の割合で含むポリカーボネートオルガノシロキサン共重合体と、それ以外の芳香族ポリカーボネートとを特定の割合で含むポリカーボネート系樹脂に対し、グラフェンシートを所定量含有する樹脂組成物がその目的に適合し得ることを見出した。本発明は、かかる知見に基づいて完成したものである。 As a result of intensive studies to achieve the above object, the present inventor has obtained a polycarbonate organosiloxane copolymer containing a polyorganosiloxane block composed of a specific structural unit at a predetermined ratio, and other aromatic polycarbonates. It has been found that a resin composition containing a predetermined amount of a graphene sheet can be adapted to the purpose with respect to a polycarbonate-based resin contained at a specific ratio. The present invention has been completed based on such findings.
すなわち、本発明は、下記(1)〜(8)を提供する。
(1)ポリカーボネート−ポリオルガノシロキサン共重合体(A−1)と、(A−1)以外の芳香族ポリカーボネート(A−2)との質量比が5:95〜100:0からなるポリカーボネート系樹脂(A)70〜99.5質量%、及びグラフェンシート(B)30〜0.5質量%を含むことを特徴とするポリカーボネート樹脂組成物。
(2)グラフェンシート(B)の厚さが5〜10nmであり、かつ大きさが3μm以上である上記(1)に記載のポリカーボネート樹脂組成物。
(3)ポリカーボネート−ポリオルガノシロキサン共重合体(A−1)は、主鎖が一般式(I)で表される構造単位及び一般式(II)で表される構造単位を含み、かつ該一般式(II)で表される構造単位からなるポリオルガノシロキサンブロックを2〜40質量%含むものである上記(1)又は(2)に記載のポリカーボネート樹脂組成物。That is, the present invention provides the following (1) to (8).
(1) A polycarbonate resin in which the mass ratio of the polycarbonate-polyorganosiloxane copolymer (A-1) to the aromatic polycarbonate (A-2) other than (A-1) is 5:95 to 100: 0. A polycarbonate resin composition comprising (A) 70 to 99.5 mass% and a graphene sheet (B) 30 to 0.5 mass%.
(2) The polycarbonate resin composition according to (1), wherein the graphene sheet (B) has a thickness of 5 to 10 nm and a size of 3 μm or more.
(3) The polycarbonate-polyorganosiloxane copolymer (A-1) includes a structural unit having a main chain represented by the general formula (I) and a structural unit represented by the general formula (II). The polycarbonate resin composition according to the above (1) or (2), comprising 2 to 40% by mass of a polyorganosiloxane block comprising a structural unit represented by the formula (II).
[式中、R1及びR2は、それぞれ独立に炭素数1〜6のアルキル基又はアルコキシ基、Xは単結合、炭素数1〜8のアルキレン基、炭素数2〜8のアルキリデン基、炭素数5〜15のシクロアルキレン基、炭素数5〜15のシクロアルキリデン基、−S−、−SO−、−SO2−、−O−又は−CO−、R3〜R6は、それぞれ独立に、水素原子、ハロゲン原子又は炭素数1〜6のアルキル基、炭素数1〜6のアルコキシ基もしくは炭素数6〜12のアリール基を示し、Yは脂肪族または芳香族を含む有機残基を示し、nは平均繰り返し数であって、1〜600の整数を示し、a及びbは0〜4の整数を示す。]
(4)Yがアリルフェノールまたはオイゲノールからの有機残基である上記(3)に記載のポリカーボネート樹脂組成物。
(5)一般式(I)で表される構造単位が、ビスフェノールAから誘導された構造単位である上記(3)又は(4)に記載のポリカーボネート樹脂組成物。
(6)一般式(II)で表される構造単位中のR3及びR4が共にメチル基である上記(3)〜(5)のいずれかに記載のポリカーボネート樹脂組成物。
(7)更に、ポリテトラフルオロエチレン(C)を(A)成分と(B)成分との合計量100質量部に対して0.01〜1質量部を含有してなる上記(1)〜(6)のいずれかに記載のポリカーボネート樹脂組成物。
(8)上記(1)〜(7)のいずれかに記載のポリカーボネート樹脂組成物を成形してなる成形体。[Wherein, R 1 and R 2 are each independently an alkyl group or alkoxy group having 1 to 6 carbon atoms, X is a single bond, an alkylene group having 1 to 8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, carbon A cycloalkylene group having 5 to 15 carbon atoms, a cycloalkylidene group having 5 to 15 carbon atoms, —S—, —SO—, —SO 2 —, —O— or —CO—, and R 3 to R 6 are each independently , A hydrogen atom, a halogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, and Y represents an organic residue containing aliphatic or aromatic , N is an average number of repetitions and represents an integer of 1 to 600, and a and b represent integers of 0 to 4. ]
(4) The polycarbonate resin composition according to the above (3), wherein Y is an organic residue from allylphenol or eugenol.
(5) The polycarbonate resin composition according to the above (3) or (4), wherein the structural unit represented by the general formula (I) is a structural unit derived from bisphenol A.
(6) The polycarbonate resin composition according to any one of the above (3) to (5), wherein R 3 and R 4 in the structural unit represented by the general formula (II) are both methyl groups.
(7) Further, the polytetrafluoroethylene (C) containing 0.01 to 1 part by mass with respect to 100 parts by mass of the total amount of the component (A) and the component (B) (1) to (1) The polycarbonate resin composition according to any one of 6).
(8) A molded article formed by molding the polycarbonate resin composition according to any one of (1) to (7).
本発明によれば、難燃性、剛性、耐衝撃性、導電性及び成形外観、さらには熱伝導性などに優れた成形体を与えるポリカーボネート樹脂組成物及び該樹脂組成物を成形してなる上記性状を有する成形体を提供することができる。
また、本発明の成形体は、上記の性状を有すると共に、カーボンの脱落による半導体等の汚染を起こすことがないことから、OA機器、情報機器、家庭電化機器等の電気・電子機器のハウジング、部品、フィルム、さらには自動車部品等その応用分野の拡大が期待される。According to the present invention, a polycarbonate resin composition that gives a molded article excellent in flame retardancy, rigidity, impact resistance, electrical conductivity and molded appearance, as well as thermal conductivity, and the above-mentioned molded resin composition. A molded body having properties can be provided.
In addition, the molded body of the present invention has the above-mentioned properties and does not cause contamination of semiconductors and the like due to the dropping of carbon. Therefore, the housing of electrical / electronic equipment such as OA equipment, information equipment, home appliances, The application fields such as parts, films, and automobile parts are expected to expand.
まず、本発明のポリカーボネート樹脂組成物について説明する。
[ポリカーボネート樹脂組成物]
本発明のポリカーボネート樹脂組成物は、ポリカーボネート−ポリオルガノシロキサン共重合体(A−1)と、(A−1)以外の芳香族ポリカーボネート(A−2)との質量比が5:95〜100:0からなるポリカーボネート系樹脂(A)70〜99.5質量%及びグラフェンシート(B)30〜0.5質量%を含むことを特徴とする。
以下、本発明のポリカーボネート樹脂組成物中の各成分について説明する。First, the polycarbonate resin composition of the present invention will be described.
[Polycarbonate resin composition]
In the polycarbonate resin composition of the present invention, the mass ratio of the polycarbonate-polyorganosiloxane copolymer (A-1) to the aromatic polycarbonate (A-2) other than (A-1) is 5:95 to 100: It comprises 70 to 99.5% by mass of a polycarbonate-based resin (A) consisting of 0 and 30 to 0.5% by mass of a graphene sheet (B).
Hereinafter, each component in the polycarbonate resin composition of the present invention will be described.
〔ポリカーボネート−ポリオルガノシロキサン共重合体(A−1)〕
本発明で用いるポリカーボネート−ポリオルガノシロキサン共重合体(A−1)は、主鎖が下記一般式(I)で表される構造単位及び下記一般式(II)で表される構造単位を含み、かつ該一般式(II)で表される構造単位からなるポリオルガノシロキサンブロックを2〜40質量%含むものが好ましい。なお、本明細書において、ポリカーボネート−ポリオルガノシロキサン共重合体を「PC−PDMS共重合体」ということがある。[Polycarbonate-polyorganosiloxane copolymer (A-1)]
The polycarbonate-polyorganosiloxane copolymer (A-1) used in the present invention includes a structural unit whose main chain is represented by the following general formula (I) and a structural unit represented by the following general formula (II), And what contains 2-40 mass% of polyorganosiloxane blocks which consist of a structural unit represented by this general formula (II) is preferable. In the present specification, the polycarbonate-polyorganosiloxane copolymer may be referred to as “PC-PDMS copolymer”.
ここで、R1及びR2は、それぞれ独立に炭素数1〜6のアルキル基又はアルコキシ基、Xは単結合、炭素数1〜8のアルキレン基、炭素数2〜8のアルキリデン基、炭素数5〜15のシクロアルキレン基、炭素数5〜15のシクロアルキリデン基、−S−、−SO−、−SO2−、−O−又は−CO−、R3〜R6は、それぞれ独立に、水素原子、ハロゲン原子又は炭素数1〜6のアルキル基、炭素数1〜6のアルコキシ基もしくは炭素数6〜12のアリール基を示し、Yは脂肪族または芳香族を含む有機残基を示し、nは平均繰り返し数であって、1〜600の整数を示し、a及びbは0〜4の整数を示す。前記Yとしては、アリルフェノール又はオイゲノールからの有機残基であることが好ましい。また、前記nとしては、得られるポリカーボネート樹脂組成物の性能の観点から、1〜500の整数であることが好ましく、5〜200であることがさらに好ましい。Here, R 1 and R 2 are each independently an alkyl group or alkoxy group having 1 to 6 carbon atoms, X is a single bond, an alkylene group having 1 to 8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, or a carbon number. A cycloalkylene group having 5 to 15 carbon atoms, a cycloalkylidene group having 5 to 15 carbon atoms, —S—, —SO—, —SO 2 —, —O— or —CO—, and R 3 to R 6 are each independently A hydrogen atom, a halogen atom or an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms or an aryl group having 6 to 12 carbon atoms, Y represents an organic residue containing aliphatic or aromatic, n is an average number of repetitions and represents an integer of 1 to 600, and a and b represent integers of 0 to 4. Y is preferably an organic residue from allylphenol or eugenol. Moreover, as said n, from a viewpoint of the performance of the polycarbonate resin composition obtained, it is preferable that it is an integer of 1-500, and it is more preferable that it is 5-200.
当該PC−PDMS共重合体(A−1)においては、前記ポリオルガノシロキサンブロックの含有量は、難燃性及び耐衝撃性などの観点から、2〜40質量%であることが好ましく、3〜25質量%であることがより好ましい。
また、得られるポリカーボネート樹脂組成物の性能の観点から、前記一般式(I)で表される構造単位が、ビスフェノールAから誘導される構造単位であるものが好ましく、前記一般式(II)で表される構造単位中のR3及びR4が共にメチル基であるものが好ましい。In the PC-PDMS copolymer (A-1), the content of the polyorganosiloxane block is preferably 2 to 40% by mass from the viewpoint of flame retardancy and impact resistance. More preferably, it is 25 mass%.
Further, from the viewpoint of the performance of the obtained polycarbonate resin composition, the structural unit represented by the general formula (I) is preferably a structural unit derived from bisphenol A, and represented by the general formula (II). In the structural unit, R 3 and R 4 are preferably both methyl groups.
また一般に、耐衝撃性を発現させるためには、PC−PDMS共重合体(A−1)の粘度平均分子量は大きい方が有効であるが、粘度平均分子量が大きくなると薄肉部材の成形が困難になる。
成形温度を上げることにより、樹脂組成物の粘度を下げることも可能であるが、その場合、成形サイクルが長くなり経済性に劣るほか、温度を上げすぎると樹脂組成物の熱劣化により生産安定性が低下する。
したがって、PC−PDMS共重合体(A−1)の粘度平均分子量は、好ましくは15000〜24000、より好ましくは16000〜22500、更に好ましくは17000〜21000である。
粘度平均分子量が15000以上であると成形品の強度が十分であり、24000以下であると共重合体の粘度が小さくなるため製造時の生産性が良好であるほか、薄肉の成形も良好となる。In general, in order to develop impact resistance, it is effective that the viscosity average molecular weight of the PC-PDMS copolymer (A-1) is large. However, when the viscosity average molecular weight is large, it is difficult to form a thin member. Become.
It is possible to lower the viscosity of the resin composition by raising the molding temperature, but in that case, the molding cycle becomes longer and inferior in economic efficiency. Decreases.
Therefore, the viscosity average molecular weight of the PC-PDMS copolymer (A-1) is preferably 15000 to 24000, more preferably 16000 to 22500, and further preferably 17000 to 21000.
When the viscosity average molecular weight is 15000 or more, the strength of the molded product is sufficient. When the viscosity average molecular weight is 24000 or less, the viscosity of the copolymer becomes small, so that the productivity during production is good and the thin-wall molding is also good. .
PC−PDMS共重合体(A−1)は、下記一般式(1)で表される二価フェノールと、下記一般式(2)で表されるポリオルガノシロキサンと、ホスゲン、炭酸エステル、又はクロロホーメート及び必要に応じて使用される分子量調節剤を用いて得られるものである。 The PC-PDMS copolymer (A-1) is composed of a dihydric phenol represented by the following general formula (1), a polyorganosiloxane represented by the following general formula (2), phosgene, carbonate, or chloro It is obtained by using a formate and a molecular weight regulator used as necessary.
ここで、一般式(1)中、R1及びR2、X、a及びbは、上記一般式(I)と同じであり、一般式(2)中、R3〜R6、Y、nは、上記一般式(II)と同じであり、mは0又は1を示し、Zはハロゲン、−R7OH、−R7COOH、−R7NH2、−COOH又は−SHを示し、R7は直鎖、分岐鎖もしくは環状アルキレン基、アリール置換アルキレン基、環上にアルコキシ基を有してもよいアリール置換アルキレン基、アリーレン基を示す。Here, in the general formula (1), R 1 and R 2, X, a and b are the same as the above general formula (I), the general formula (2), R 3 ~R 6 , Y, n Is the same as in the general formula (II), m represents 0 or 1, Z represents halogen, —R 7 OH, —R 7 COOH, —R 7 NH 2 , —COOH or —SH; 7 represents a linear, branched or cyclic alkylene group, an aryl-substituted alkylene group, an aryl-substituted alkylene group which may have an alkoxy group on the ring, or an arylene group.
本発明のポリカーボネート樹脂組成物において、PC−PDMS共重合体(A−1)の原料に用いる、一般式(1)で表される二価フェノールとしては、特に限定されないが、2,2−ビス(4−ヒドロキシフェニル)プロパン〔通称:ビスフェノールA〕が好適である。二価フェノールとしてビスフェノールAを用いた場合、一般式(I)において、Xがイソプロピリデン基であり、且つa=b=0のPC−PDMS共重合体となる。
ビスフェノールA以外の二価フェノールとしては、例えば、ビス(4−ヒドロキシフェニル)メタン、1,1−ビス(4−ヒドロキシフェニル)エタン、2,2−ビス(4−ヒドロキシフェニル)ブタン、2,2−ビス(4−ヒドロキシフェニル)オクタン、ビス(4−ヒドロキシフェニル)フェニルメタン、ビス(4−ヒドロキシフェニル)ジフェニルメタン、2,2−ビス(4−ヒドロキシ−3−メチルフェニル)プロパン、ビス(4−ヒドロキシフェニル)ナフチルメタン、1,1−ビス(4−ヒドロキシ−t−ブチルフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−ブロモフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−テトラメチルフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−クロロフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジクロロフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジブロモフェニル)プロパン等のビス(ヒドロキシアリール)アルカン類、1,1−ビス(4−ヒドロキシフェニル)シクロペンタン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン、1,1−ビス(4−ヒドロキシフェニル)−3,5,5−トリメチルシクロヘキサン、2,2−ビス(4−ヒドロキシフェニル)ノルボルナン、1,1−ビス(4−ヒドロキシフェニル)シクロドデカン等のビス(ヒドロキシアリール)シクロアルカン類、4,4’−ジヒドロキシフェニルエーテル、4,4’−ジヒドロキシ−3,3’−ジメチルフェニルエーテル等のジヒドロキシアリールエーテル類、4,4’−ジヒドロキシジフェニルスルフィド、4,4’−ジヒドロキシ−3,3’−ジメチルジフェニルスルフィド等のジヒドロキシジアリールスルフィド類、4,4’−ジヒドロキシジフェニルスルホキシド、4,4’−ジヒドロキシ−3,3’−ジメチルジフェニルスルホキシド等のジヒドロキシジアリールスルホキシド類、4,4’−ジヒドロキシジフェニルスルホン、4,4’−ジヒドロキシ−3,3’−ジメチルジフェニルスルホン等のジヒドロキシジアリールスルホン類、4,4’−ジヒドロキシジフェニル等のジヒドロキシジフェニル類、9,9−ビス(4−ヒドロキシフェニル)フルオレン、9,9−ビス(4−ヒドロキシ−3−メチルフェニル)フルオレン等のジヒドロキシジアリールフルオレン類、ビス(4−ヒドロキシフェニル)ジフェニルメタン、1,3−ビス(4−ヒドロキシフェニル)アダマンタン、2,2−ビス(4−ヒドロキシフェニル)アダマンタン、1,3−ビス(4−ヒドロキシフェニル)−5,7−ジメチルアダマンタン等のジヒドロキシジアリールアダマンタン類、4,4’−[1,3−フェニレンビス(1−メチルエチリデン)]ビスフェノール、10,10−ビス(4−ヒドロキシフェニル)−9−アントロン、1,5−ビス(4−ヒドロキシフェニルチオ)−2,3−ジオキサペンタエン等が挙げられる。
これらの二価フェノールは、単独で又は二種以上を混合して用いてもよい。In the polycarbonate resin composition of the present invention, the dihydric phenol represented by the general formula (1) used as a raw material for the PC-PDMS copolymer (A-1) is not particularly limited, but 2,2-bis (4-Hydroxyphenyl) propane (common name: bisphenol A) is preferred. When bisphenol A is used as the dihydric phenol, a PC-PDMS copolymer in which X is an isopropylidene group and a = b = 0 in the general formula (I) is obtained.
Examples of dihydric phenols other than bisphenol A include bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) butane, 2,2 -Bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenyl) phenylmethane, bis (4-hydroxyphenyl) diphenylmethane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, bis (4- Hydroxyphenyl) naphthylmethane, 1,1-bis (4-hydroxy-t-butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) propane, 2,2-bis (4-hydroxy-) 3,5-tetramethylphenyl) propane, 2,2-bis (4-hydroxy-3-chlorophene) Bis (hydroxyaryl) alkanes such as propane, 2,2-bis (4-hydroxy-3,5-dichlorophenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 1,1-bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) -3,5,5-trimethylcyclohexane, 2, Bis (hydroxyaryl) cycloalkanes such as 2-bis (4-hydroxyphenyl) norbornane and 1,1-bis (4-hydroxyphenyl) cyclododecane, 4,4′-dihydroxyphenyl ether, 4,4′-dihydroxy Dihydroxy aryl ethers such as 3,3′-dimethylphenyl ether, 4,4′-di Droxydiphenyl sulfide, dihydroxydiaryl sulfides such as 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfide, 4,4′-dihydroxydiphenyl sulfoxide, 4,4′-dihydroxy-3,3′-dimethyldiphenyl Dihydroxydiaryl sulfoxides such as sulfoxide, 4,4'-dihydroxydiphenylsulfone, dihydroxydiarylsulfones such as 4,4'-dihydroxy-3,3'-dimethyldiphenylsulfone, dihydroxydiphenyl such as 4,4'-dihydroxydiphenyl Dihydroxydiarylfluorenes such as 9,9-bis (4-hydroxyphenyl) fluorene, 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, bis (4-hydroxyphenyl) diphenyl Dihydroxydiaryl such as tan, 1,3-bis (4-hydroxyphenyl) adamantane, 2,2-bis (4-hydroxyphenyl) adamantane, 1,3-bis (4-hydroxyphenyl) -5,7-dimethyladamantane Adamantanes, 4,4 ′-[1,3-phenylenebis (1-methylethylidene)] bisphenol, 10,10-bis (4-hydroxyphenyl) -9-anthrone, 1,5-bis (4-hydroxyphenyl) Thio) -2,3-dioxapentaene and the like.
These dihydric phenols may be used alone or in admixture of two or more.
一般式(2)で表されるポリオルガノシロキサンは、オレフィン性の不飽和炭素−炭素結合を有するフェノール類、好適にはビニルフェノール、アリルフェノール、オイゲノール、イソプロペニルフェノール等を所定の重合度nを有するポリオルガノシロキサン鎖の末端に、ハイドロシラネーション反応させることにより容易に製造することができる。上記フェノール類は、アリルフェノール又はオイゲノールであることがより好ましい。この場合、(A−1)成分の一般式(II)におけるYがアリルフェノール又はオイゲノール由来の有機残基となる。 The polyorganosiloxane represented by the general formula (2) is a phenol having an olefinically unsaturated carbon-carbon bond, preferably vinylphenol, allylphenol, eugenol, isopropenylphenol or the like having a predetermined polymerization degree n. It can be easily produced by hydrosilation reaction at the end of the polyorganosiloxane chain. The phenols are more preferably allylphenol or eugenol. In this case, Y in the general formula (II) of the component (A-1) is an organic residue derived from allylphenol or eugenol.
一般式(2)で表されるポリオルガノシロキサンとしては、R3及びR4が共にメチル基であるものが好ましく、例えば、以下の一般式(3)〜(11)の化合物が挙げられる。As the polyorganosiloxane represented by the general formula (2), those in which R 3 and R 4 are both methyl groups are preferable, and examples thereof include compounds of the following general formulas (3) to (11).
上記一般式(3)〜(11)中、R3〜R6は一般式(II)と同様に、それぞれ独立に、水素原子、ハロゲン原子又は炭素数1〜6のアルキル基、炭素数1〜6のアルコキシ基もしくは炭素数6〜12のアリール基を示し、nはオルガノシロキサン構成単位の平均繰り返し数であって1〜600の数を示す。また、R8はアルキル、アルケニル、アリール又はアラルキル基を示し、cは正の整数を示し、通常1〜6の整数である。
これらの中でも、重合の容易さの観点においては、一般式(3)に示すフェノール変性ポリオルガノシロキサンが好ましい。また、入手の容易さの観点においては、一般式(4)に示す化合物中の一種であるα,ω−ビス[3−(o−ヒドロキシフェニル)プロピル]ポリジメチルシロキサン、一般式(5)に示す化合物中の一種であるα,ω−ビス[3−(4−ヒドロキシ−2−メトキシフェニル)プロピル]ポリジメチルシロキサンが好ましい。In the general formulas (3) to (11), R 3 to R 6 are each independently a hydrogen atom, a halogen atom or an alkyl group having 1 to 6 carbon atoms, 6 represents an alkoxy group having 6 carbon atoms or an aryl group having 6 to 12 carbon atoms, and n represents an average number of repeating units of the organosiloxane constitutional unit and represents 1 to 600. R 8 represents an alkyl, alkenyl, aryl or aralkyl group, c represents a positive integer, and is generally an integer of 1 to 6.
Among these, from the viewpoint of ease of polymerization, a phenol-modified polyorganosiloxane represented by the general formula (3) is preferable. In terms of availability, α, ω-bis [3- (o-hydroxyphenyl) propyl] polydimethylsiloxane, which is a kind of the compound represented by the general formula (4), is represented by the general formula (5). Α, ω-bis [3- (4-hydroxy-2-methoxyphenyl) propyl] polydimethylsiloxane, which is one of the compounds shown, is preferred.
上記フェノール変性ポリオルガノシロキサンは、公知の方法により製造することができる。製造法としては、例えば、以下に示す方法が挙げられる。
まず、シクロトリシロキサンとジシロキサンとを酸性触媒存在下で反応させ、α,ω−ジハイドロジェンオルガノポリシロキサンを合成する。このとき、シクロトリシロキサンとジシロキサンとの仕込み比を変えることで所望の平均繰り返し単位を持つα,ω−ジハイドロジェンオルガノポリシロキサンを合成することができる。次いで、ヒドロシリル化反応用触媒の存在下に、このα,ω−ジハイドロジェンオルガノポリシロキサンにアリルフェノールやオイゲノール等の不飽和脂肪族炭化水素基を有するフェノール化合物を付加反応させることで、所望の平均繰り返し単位を有するフェノール変性ポリオルガノシロキサンを製造することができる。
また、この段階では、低分子量の環状ポリオルガノシロキサンや過剰量の上記フェノール化合物が不純物として残存するために、減圧下で加熱し、これらの低分子化合物を留去することが好ましい。The phenol-modified polyorganosiloxane can be produced by a known method. As a manufacturing method, the method shown below is mentioned, for example.
First, cyclotrisiloxane and disiloxane are reacted in the presence of an acidic catalyst to synthesize α, ω-dihydrogenorganopolysiloxane. At this time, α, ω-dihydrogenorganopolysiloxane having a desired average repeating unit can be synthesized by changing the charging ratio of cyclotrisiloxane and disiloxane. Next, in the presence of a hydrosilylation reaction catalyst, the α, ω-dihydrogenorganopolysiloxane is subjected to an addition reaction with a phenol compound having an unsaturated aliphatic hydrocarbon group such as allylphenol or eugenol. A phenol-modified polyorganosiloxane having an average repeating unit can be produced.
Further, at this stage, since low molecular weight cyclic polyorganosiloxane and an excessive amount of the phenol compound remain as impurities, it is preferable to distill off these low molecular compounds by heating under reduced pressure.
〔(A−1)以外の芳香族ポリカーボネート(A−2)〕
本発明のポリカーボネート樹脂組成物において、前記(A−1)以外の芳香族ポリカーボネートである(A−2)成分は、反応に不活性な有機溶媒、アルカリ水溶液の存在下、二価フェノール系化合物及びホスゲンと反応させた後、第三級アミンもしくは第四級アンモニウム塩等の重合触媒を添加して重合させる界面重合法や、二価フェノール系化合物をピリジン又はピリジンと不活性溶媒の混合溶液に溶解し、ホスゲンを導入し直接製造するピリジン法等従来の芳香族ポリカーボネートの製造法により得られるものが使用できる。[Aromatic polycarbonate other than (A-1) (A-2)]
In the polycarbonate resin composition of the present invention, the component (A-2) which is an aromatic polycarbonate other than the above (A-1) is a dihydric phenol compound and an organic solvent inert to the reaction, in the presence of an alkaline aqueous solution. After reacting with phosgene, interfacial polymerization method in which polymerization catalyst such as tertiary amine or quaternary ammonium salt is added to polymerize, or dihydric phenol compound is dissolved in pyridine or mixed solution of pyridine and inert solvent In addition, those obtained by a conventional method for producing an aromatic polycarbonate such as a pyridine method in which phosgene is directly introduced can be used.
(A−2)成分の芳香族ポリカーボネートの製造に使用される二価フェノール系化合物としては、2,2−ビス(4−ヒドロキシフェニル)プロパン〔通称:ビスフェノールA〕、ビス(4−ヒドロキシフェニル)メタン、1,1−ビス(4−ヒドロキシフェニル)エタン、2,2−ビス(4−ヒドロキシフェニル)ブタン、2,2−ビス(4−ヒドロキシフェニル)オクタン、ビス(4−ヒドロキシフェニル)フェニルメタン、ビス(4−ヒドロキシフェニル)ジフェニルメタン、2,2−ビス(4−ヒドロキシ−3−メチルフェニル)プロパン、ビス(4−ヒドロキシフェニル)ナフチルメタン、1,1−ビス(4−ヒドロキシ−3−t−ブチルフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−ブロモフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジメチルフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−クロロフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジクロロフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジブロモフェニル)プロパン等のビス(ヒドロキシアリール)アルカン類、1,1−ビス(4−ヒドロキシフェニル)シクロペンタン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン、1,1−ビス(4−ヒドロキシフェニル)−3,5,5−トリメチルシクロヘキサン、2,2−ビス(4−ヒドロキシフェニル)ノルボルナン、1,1−ビス(4−ヒドロキシフェニル)シクロドデカン等のビス(ヒドロキシアリール)シクロアルカン類、4,4’−ジヒドロキシフェニルエーテル、4,4’−ジヒドロキシ−3,3’−ジメチルフェニルエーテル等のジヒドロキシアリールエーテル類、4,4’−ジヒドロキシジフェニルスルフィド、4,4’−ジヒドロキシ−3,3’−ジメチルジフェニルスルフィド等のジヒドロキシジアリールスルフィド類、4,4’−ジヒドロキシジフェニルスルホキシド、4,4’−ジヒドロキシ−3,3’−ジメチルジフェニルスルホキシド等のジヒドロキシジアリールスルホキシド類、4,4’−ジヒドロキシジフェニルスルホン、4,4’−ジヒドロキシ−3,3’−ジメチルジフェニルスルホン等のジヒドロキシジアリールスルホン類、4,4’−ジヒロキシジフェニル等のジヒドロキシジフェニル類、9,9−ビス(4−ヒドロキシフェニル)フルオレン、9,9−ビス(4−ヒドロキシ−3−メチルフェニル)フルオレン等のジヒドロキシジアリールフルオレン類、ビス(4−ヒドロキシフェニル)ジフェニルメタン、1,3−ビス(4−ヒドロキシフェニル)アダマンタン、2,2−ビス(4−ヒドロキシフェニル)アダマンタン、1,3−ビス(4−ヒドロキシフェニル)−5,7−ジメチルアダマンタン等のジヒドロキシジアリールアダマンタン類、4,4’−[1,3−フェニレンビス(1−メチルエチリデン)]ビスフェノール、10,10−ビス(4−ヒドロキシフェニル)−9−アントロン、1,5−ビス(4−ヒドロキシフェニルチオ)−2,3−ジオキサペンタエン等が挙げられる。これらの二価フェノールは、単独で又は二種以上を混合して用いてもよい。 As the dihydric phenol compound used in the production of the component (A-2) aromatic polycarbonate, 2,2-bis (4-hydroxyphenyl) propane [common name: bisphenol A], bis (4-hydroxyphenyl) Methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenyl) phenylmethane Bis (4-hydroxyphenyl) diphenylmethane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, bis (4-hydroxyphenyl) naphthylmethane, 1,1-bis (4-hydroxy-3-t -Butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) propane, 2, 2-bis (4-hydroxy-3,5-dimethylphenyl) propane, 2,2-bis (4-hydroxy-3-chlorophenyl) propane, 2,2-bis (4-hydroxy-3,5-dichlorophenyl) propane Bis (hydroxyaryl) alkanes such as 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 1,1-bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4 -Hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) -3,5,5-trimethylcyclohexane, 2,2-bis (4-hydroxyphenyl) norbornane, 1,1-bis (4-hydroxyphenyl) ) Bis (hydroxyaryl) cycloalkanes such as cyclododecane, 4,4′-dihydroxyphenylamine Dihydroxy aryl ethers such as 4,4′-dihydroxy-3,3′-dimethylphenyl ether, 4,4′-dihydroxydiphenyl sulfide, 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfide, etc. Dihydroxydiaryl sulfoxides, 4,4′-dihydroxydiphenyl sulfoxide, dihydroxydiaryl sulfoxides such as 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfoxide, 4,4′-dihydroxydiphenyl sulfone, 4,4′- Dihydroxy diaryl sulfones such as dihydroxy-3,3′-dimethyldiphenyl sulfone, dihydroxy diphenyls such as 4,4′-dihydroxydiphenyl, 9,9-bis (4-hydroxyphenyl) fluorene, 9,9-bis ( 4- Dihydroxydiarylfluorenes such as droxy-3-methylphenyl) fluorene, bis (4-hydroxyphenyl) diphenylmethane, 1,3-bis (4-hydroxyphenyl) adamantane, 2,2-bis (4-hydroxyphenyl) adamantane, Dihydroxydiaryladamantanes such as 1,3-bis (4-hydroxyphenyl) -5,7-dimethyladamantane, 4,4 ′-[1,3-phenylenebis (1-methylethylidene)] bisphenol, 10,10- Bis (4-hydroxyphenyl) -9-anthrone, 1,5-bis (4-hydroxyphenylthio) -2,3-dioxapentaene and the like can be mentioned. These dihydric phenols may be used alone or in admixture of two or more.
(A−2)成分の芳香族ポリカーボネートの製造にあたっては、必要に応じて、分子量調節剤、末端停止剤等を用いてもよい。これらは、通常、ポリカーボネート樹脂の重合に用いられるものであれば、各種のものを用いることができる。
具体的な分子量調節剤としては、一価フェノールとして、例えば、フェノール、o−n−ブチルフェノール、m−n−ブチルフェノール、p−n−ブチルフェノール、o−イソブチルフェノール、m−イソブチルフェノール、p−イソブチルフェノール、o−t−ブチルフェノール、m−t−ブチルフェノール、p−t−ブチルフェノール、o−n−ペンチルフェノール、m−n−ペンチルフェノール、p−n−ペンチルフェノール、o−n−ヘキシルフェノール、m−n−ヘキシルフェノール、p−n−ヘキシルフェノール、p−t−オクチルフェノール、o−シクロヘキシルフェノール、m−シクロヘキシルフェノール、p−シクロヘキシルフェノール、o−フェニルフェノール、m−フェニルフェノール、p−フェニルフェノール、o−n−ノニルフェノール、m−ノニルフェノール、p−n−ノニルフェノール、o−クミルフェノール、m−クミルフェノール、p−クミルフェノール、o−ナフチルフェノール、m−ナフチルフェノール、p−ナフチルフェノール、2,5−ジ−t−ブチルフェノール、2,4−ジ−t−ブチルフェノール、3,5−ジ−t−ブチルフェノール、2,5−ジクミルフェノール、3,5−ジクミルフェノール、p−クレゾール、ブロモフェノール、トリブロモフェノール、平均炭素数12〜35の直鎖状又は分岐状のアルキル基をオルト位、メタ位又はパラ位に有するモノアルキルフェノール、9−(4−ヒドロキシフェニル)−9−(4−メトキシフェニル)フルオレン、9−(4−ヒドロキシ−3−メチルフェニル)−9−(4−メトキシ−3−メチルフェニル)フルオレン、4−(1−アダマンチル)フェノール等が挙げられる。
これらの一価フェノールの中では、p−t−ブチルフェノール、p−クミルフェノール、p−フェニルフェノール等が好ましい。また、これらの化合物は、単独で又は二種以上の化合物を併用して用いることができる。In producing the aromatic polycarbonate as the component (A-2), a molecular weight regulator, a terminal terminator, and the like may be used as necessary. Any of these can be used as long as they are usually used for polymerization of polycarbonate resin.
Specific molecular weight regulators include, for example, monohydric phenols such as phenol, on-butylphenol, mn-butylphenol, pn-butylphenol, o-isobutylphenol, m-isobutylphenol, and p-isobutylphenol. , Ot-butylphenol, mt-butylphenol, pt-butylphenol, on-pentylphenol, mn-pentylphenol, pn-pentylphenol, on-hexylphenol, mn -Hexylphenol, pn-hexylphenol, pt-octylphenol, o-cyclohexylphenol, m-cyclohexylphenol, p-cyclohexylphenol, o-phenylphenol, m-phenylphenol, p-phenylphenol, o n-nonylphenol, m-nonylphenol, pn-nonylphenol, o-cumylphenol, m-cumylphenol, p-cumylphenol, o-naphthylphenol, m-naphthylphenol, p-naphthylphenol, 2,5 -Di-t-butylphenol, 2,4-di-t-butylphenol, 3,5-di-t-butylphenol, 2,5-dicumylphenol, 3,5-dicumylphenol, p-cresol, bromophenol, Tribromophenol, monoalkylphenol having a linear or branched alkyl group having an average carbon number of 12 to 35 in the ortho, meta or para position, 9- (4-hydroxyphenyl) -9- (4-methoxyphenyl) ) Fluorene, 9- (4-hydroxy-3-methylphenyl) -9- (4-methoxy 3-methylphenyl) fluorene, 4- (1-adamantyl) phenol, and the like.
Among these monohydric phenols, pt-butylphenol, p-cumylphenol, p-phenylphenol and the like are preferable. Moreover, these compounds can be used individually or in combination of 2 or more types.
末端停止剤としては、一価のカルボン酸とその誘導体や、一価のフェノールを用いることができる。例えば、p−t−ブチル−フェノール、p−フェニルフェノール、p−クミルフェノール、p−パーフルオロノニルフェノール、p−(パーフルオロノニルフェニル)フェノール、p−(パーフルオロキシルフェニル)フェノール、p−t−パーフルオロブチルフェノール、1−(p−ヒドロキシベンジル)パーフルオロデカン、p−〔2−(1H,1H−パーフルオロトリドデシルオキシ)−1,1,1,3,3,3−ヘキサフルオロプロピル〕フェノール、3,5−ビス(パーフルオロヘキシルオキシカルボニル)フェノール、p−ヒドロキシ安息香酸パーフルオロドデシル、p−(1H,1H−パーフルオロオクチルオキシ)フェノール、2H,2H,9H−パーフルオロノナン酸、1,1,1,3,3,3−テトラフロロ−2−プロパノール等が挙げられる。 As the terminal terminator, monovalent carboxylic acid and derivatives thereof, or monovalent phenol can be used. For example, pt-butyl-phenol, p-phenylphenol, p-cumylphenol, p-perfluorononylphenol, p- (perfluorononylphenyl) phenol, p- (perfluoroxylphenyl) phenol, pt -Perfluorobutylphenol, 1- (p-hydroxybenzyl) perfluorodecane, p- [2- (1H, 1H-perfluorotridodecyloxy) -1,1,1,3,3,3-hexafluoropropyl] Phenol, 3,5-bis (perfluorohexyloxycarbonyl) phenol, perfluorododecyl p-hydroxybenzoate, p- (1H, 1H-perfluorooctyloxy) phenol, 2H, 2H, 9H-perfluorononanoic acid, 1,1,1,3,3,3-tetrafluoro-2-pro Nord, and the like.
更に、上記の二価フェノール系化合物に対して、分岐化剤を用いて、分岐化ポリカーボネートとすることもできる。この分岐化剤の添加量は、上記の二価フェノール系化合物に対して、好ましくは0.01〜3モル%、より好ましくは0.1〜1.0モル%である。
分岐化剤としては、例えば、1,1,1−トリス(4−ヒドロキシフェニル)エタン、4,4’−[1−[4−[1−(4−ヒドロキシフェニル)−1−メチルエチル]フェニル]エチリデン]ビスフェノール、α,α’,α”−トリス(4−ヒドロキシフェニル)−1,3,5−トリイソプロピルベンゼン、1−[α−メチル−α−(4’−ヒドロキシフェニル)エチル]−4−[α’,α’−ビス(4”−ヒドロキシフェニル)エチル]ベンゼン、フロログリシン、トリメリト酸、イサチンビス(o−クレゾール)等の官能基を3つ以上有する化合物が挙げられる。Furthermore, a branched polycarbonate can be obtained by using a branching agent for the above dihydric phenol compound. The addition amount of the branching agent is preferably 0.01 to 3 mol%, more preferably 0.1 to 1.0 mol%, based on the dihydric phenol compound.
Examples of the branching agent include 1,1,1-tris (4-hydroxyphenyl) ethane and 4,4 ′-[1- [4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl. ] Ethylidene] bisphenol, α, α ′, α ″ -tris (4-hydroxyphenyl) -1,3,5-triisopropylbenzene, 1- [α-methyl-α- (4′-hydroxyphenyl) ethyl]- Examples include compounds having three or more functional groups such as 4- [α ′, α′-bis (4 ″ -hydroxyphenyl) ethyl] benzene, phloroglysin, trimellitic acid, and isatin bis (o-cresol).
(A−1)成分及び(A−2)成分からなるポリカーボネート系樹脂(A)において、(A−1)の含有量は、5〜100質量%であり、好ましくは70〜100質量%、より好ましくは50〜100質量%であり、(A−2)の含有量は、95〜0質量%、好ましくは30〜0質量%、より好ましくは50〜0質量%である。
(A−1)の含有量が5質量%以上、もしくは(A−2)の含有量が95質量%以下である場合、ポリカーボネート系樹脂(A)中のポリオルガノシロキサンブロック部分の含有量を多くし、低温衝撃強度を向上させるために、(A−1)成分の製造時に、一般式(II)で表される構造単位を含むポリオルガノシロキサンブロック部分の含有量を多くする必要がなく、したがって、(A−1)成分の製造時において、重合工程で反応の均一性が低下することがなく、また重合物の洗浄工程で重合物と洗浄水との分離性が悪化することがないため、(A−1)成分の生産性が良好となる。
一般式(II)の構造単位を有するポリオルガノシロキサンブロック部分の含有量は、(A−1)成分及び(A−2)成分からなるポリカーボネート系樹脂(A)中、好ましくは0.1〜40質量%、より好ましくは0.5〜25質量%、更に好ましくは0.5〜15質量%、より更に好ましくは0.5〜10質量%である。0.1質量%以上であれば耐衝撃強さ向上の効果が十分であり、一方、40質量%以下であれば十分な難燃性、耐熱性を有する。In the polycarbonate resin (A) comprising the component (A-1) and the component (A-2), the content of (A-1) is 5 to 100% by mass, preferably 70 to 100% by mass. Preferably it is 50-100 mass%, and content of (A-2) is 95-0 mass%, Preferably it is 30-0 mass%, More preferably, it is 50-0 mass%.
When the content of (A-1) is 5% by mass or more, or the content of (A-2) is 95% by mass or less, the content of the polyorganosiloxane block part in the polycarbonate resin (A) is increased. In order to improve the low temperature impact strength, it is not necessary to increase the content of the polyorganosiloxane block part containing the structural unit represented by the general formula (II) during the production of the component (A-1), and therefore In the production of the component (A-1), the uniformity of the reaction is not lowered in the polymerization step, and the separation property between the polymer and the washing water is not deteriorated in the washing step of the polymer, (A-1) Productivity of a component becomes favorable.
The content of the polyorganosiloxane block portion having the structural unit of the general formula (II) is preferably 0.1 to 40 in the polycarbonate resin (A) composed of the component (A-1) and the component (A-2). It is 0.5 mass%, More preferably, it is 0.5-25 mass%, More preferably, it is 0.5-15 mass%, More preferably, it is 0.5-10 mass%. If it is 0.1 mass% or more, the effect of improving impact strength is sufficient, while if it is 40 mass% or less, it has sufficient flame retardancy and heat resistance.
〔グラフェンシート(B)〕
本発明のポリカーボネート樹脂組成物においては、成形体に難燃性、導電性、剛性、成形外観、及び熱伝導性などの性状を付与するために、(B)成分としてグラフェンシートを含有することを要する。
グラフェンシートとは、1つまたは複数層のグラフェン面を有するグラフェン板のことであり、通常、超音波エネルギーを用いて薄片状にされ、薄片化のレベルは音波発生(sonification)時間を調整することによって制御することができる。
本発明に用いるグラフェンシートは、厚さが5〜10nmであることが好ましく、大きさが3μm以上であることが好ましい。本発明に用いるグラフェンシートの厚さが5〜10nm及び大きさが3μm以上であれば、グラフェンシートの分散性が向上し、樹脂と複合化しやすく、難燃性、導電性、剛性、成形外観、さらには熱伝導性に優れる成形体が得られる。上記の観点から、グラフェンシートの厚さは、6〜8nmが好ましく、グラフェンシートの大きさは、3〜30μmが好ましく、5〜25μmがより好ましく、5〜20μmが更に好ましい。上記で述べた性状の中で、より高い導電性を付与させる観点からは、グラフェンシートの大きさが5〜30μmであることが好ましく、5〜20μmであることがより好ましい。
本発明において、グラフェンシートは板状の形状をしており、その厚さとは、グラフェンシートが重なってできる厚み方向の大きさであり、大きさとは、グラフェン構造そのものの大きさであり、実施例に記載の方法により測定することができる。
製品としては、XG Sciences社製造の「xGnP」(グラフェン・ナノプレートレット)などがある。カーボンナノチューブと対照的にオープンでフラットな形状の為、周囲のエッジ部に官能基を導入したり、表面に界面処理剤を施すことも可能である。[Graphene sheet (B)]
In the polycarbonate resin composition of the present invention, in order to impart properties such as flame retardancy, conductivity, rigidity, molded appearance, and thermal conductivity to the molded body, it is necessary to contain a graphene sheet as the component (B). Cost.
A graphene sheet is a graphene plate having one or more layers of graphene surfaces, and is usually sliced using ultrasonic energy, and the level of flaking is to adjust the sound generation time (sonification) time Can be controlled by.
The graphene sheet used in the present invention preferably has a thickness of 5 to 10 nm and a size of 3 μm or more. If the graphene sheet used in the present invention has a thickness of 5 to 10 nm and a size of 3 μm or more, the dispersibility of the graphene sheet is improved, it is easy to be combined with a resin, flame retardancy, conductivity, rigidity, molded appearance, Furthermore, a molded body having excellent thermal conductivity can be obtained. From the above viewpoint, the thickness of the graphene sheet is preferably 6 to 8 nm, and the size of the graphene sheet is preferably 3 to 30 μm, more preferably 5 to 25 μm, and still more preferably 5 to 20 μm. From the viewpoint of imparting higher conductivity among the properties described above, the size of the graphene sheet is preferably 5 to 30 μm, and more preferably 5 to 20 μm.
In the present invention, the graphene sheet has a plate-like shape, and its thickness is the size in the thickness direction formed by overlapping the graphene sheets. The size is the size of the graphene structure itself. It can be measured by the method described in 1.
Products include “xGnP” (graphene nanoplatelet) manufactured by XG Sciences. In contrast to carbon nanotubes, it has an open and flat shape, so it is possible to introduce functional groups at the peripheral edges and to apply an interfacial treatment to the surface.
本発明のポリカーボネート樹脂組成物においては、導電性、剛性、難燃性、熱伝導性などの性状を付与するために、前述したポリカーボネート系樹脂(A)を70〜99.5質量%及び当該グラフェンシート(B)を30〜0.5質量%の割合で含有することを要する。グラフェンシート(B)の含有量が0.5質量%未満では、前記性状の付与効果が発揮されにくく、一方、30質量%を超えると、衝撃強度が著しく低下すると共に、成形外観も低下する。以上の観点から、当該グラフェンシート(B)の好ましい含有量は、ポリカーボネート系樹脂(A)との合計量に対して、1〜30質量%であり、より好ましくは1〜20質量%である。 In the polycarbonate resin composition of the present invention, the above-mentioned polycarbonate resin (A) is added in an amount of 70 to 99.5% by mass and the graphene in order to impart properties such as conductivity, rigidity, flame retardancy, and thermal conductivity. It is necessary to contain the sheet (B) at a ratio of 30 to 0.5% by mass. When the content of the graphene sheet (B) is less than 0.5% by mass, the effect of imparting the properties is difficult to be exhibited. On the other hand, when the content exceeds 30% by mass, the impact strength is remarkably lowered and the molded appearance is also lowered. From the above viewpoint, the preferable content of the graphene sheet (B) is 1 to 30% by mass, and more preferably 1 to 20% by mass with respect to the total amount with the polycarbonate resin (A).
〔ポリテトラフルオロエチレン(C)〕
本発明のポリカーボネート樹脂組成物においては、溶融滴下防止効果を有し、高い難燃性を付与するために、(C)成分としてポリテトラフルオロエチレンを含有することが好ましい。
当該ポリテトラフルオロエチレン(C)は、フィブリル形成能を有する平均分子量500,000以上のポリテトラフルオロエチレン(以下、PTFEと略称する。)であり、溶融滴下防止効果を有し、高い難燃性を付与することができる。その平均分子量は500,000以上であることが必要であり、好ましくは500,000〜10,000,000、さらに好ましくは1,000,000〜10,000,000である。
フィブリル形成能を有するPTFEとしては、特に制限はないが、具体的には、“テフロン(登録商標)”6−J(三井・デュポンフロロケミカル社製)、ポリフロンD−1、ポリフロンF−103、ポリフロンF201、ポリフロンMPA FA−100(ダイキン工業社製)、CD076(旭硝子フロロポリマーズ社製)及びアルゴフロンF5(モンテフルオス社製)等を挙げることができる。[Polytetrafluoroethylene (C)]
In the polycarbonate resin composition of the present invention, it is preferable to contain polytetrafluoroethylene as the component (C) in order to have a melt dripping preventing effect and to impart high flame retardancy.
The polytetrafluoroethylene (C) is polytetrafluoroethylene (hereinafter abbreviated as PTFE) having a fibril forming ability and an average molecular weight of 500,000 or more, and has an effect of preventing melt dripping and has high flame retardancy. Can be granted. The average molecular weight needs to be 500,000 or more, preferably 500,000 to 10,000,000, more preferably 1,000,000 to 10,000,000.
The PTFE having fibril forming ability is not particularly limited, and specifically, “Teflon (registered trademark)” 6-J (Mitsui / DuPont Fluorochemical Co., Ltd.), Polyflon D-1, Polyflon F-103, Polyflon F201, Polyflon MPA FA-100 (manufactured by Daikin Industries), CD076 (manufactured by Asahi Glass Fluoropolymers) and Argoflon F5 (manufactured by Montefluos) can be exemplified.
上記のようなフィブリル形成能を有するPTFEは、例えば、テトラフルオロエチレンを水性溶媒中で、ナトリウム、カリウムあるいはアンモニウムパーオキシジスルフィドの存在下で、7〜700kPaの圧力下、温度0〜200℃、好ましくは20〜100℃で重合させることによって得ることができる。
当該PTFEの含有量は、前述したポリカーボネート系樹脂(A)と、グラフェンシート(B)との合計量100質量部に対して、通常0.01〜1質量部であり、好ましくは0.05〜0.9質量部、より好ましくは0.1〜0.8質量部である。当該PTFEの含有量が上記範囲にあれば、目的とする難燃性における溶融滴下防止性が十分となる。PTFE having the fibril-forming ability as described above is, for example, tetrafluoroethylene in an aqueous solvent in the presence of sodium, potassium or ammonium peroxydisulfide, at a pressure of 7 to 700 kPa, at a temperature of 0 to 200 ° C., preferably Can be obtained by polymerization at 20 to 100 ° C.
The content of the PTFE is usually 0.01 to 1 part by mass, preferably 0.05 to 1 part by mass with respect to 100 parts by mass as a total of the polycarbonate resin (A) and the graphene sheet (B). 0.9 mass part, More preferably, it is 0.1-0.8 mass part. When the content of the PTFE is within the above range, the melt dripping prevention property in the intended flame retardancy is sufficient.
本発明のポリカーボネート樹脂組成物においては、前記PTFEの代わりに、ポリテトラフルオロエチレン粒子及び有機系重合体粒子からなる混合粉体を含有することができる。
当該混合粉体におけるポリテトラフルオロエチレン粒子は、粒子径が、通常10μm以下であり、好ましくは0.05〜1.0μmである。
ポリテトラフルオロエチレン粒子は、例えば乳化剤等を含んだ水に分散した、水性分散液として調製される。このポリテトラフルオロエチレン粒子の水性分散液は、含フッ素界面活性剤を用い、テトラフルオロエチレンモノマーを乳化重合することにより得られる。In the polycarbonate resin composition of the present invention, a mixed powder composed of polytetrafluoroethylene particles and organic polymer particles can be contained instead of the PTFE.
The particle diameter of the polytetrafluoroethylene particles in the mixed powder is usually 10 μm or less, preferably 0.05 to 1.0 μm.
The polytetrafluoroethylene particles are prepared, for example, as an aqueous dispersion dispersed in water containing an emulsifier and the like. This aqueous dispersion of polytetrafluoroethylene particles is obtained by emulsion polymerization of a tetrafluoroethylene monomer using a fluorine-containing surfactant.
ポリテトラフルオロエチレン粒子の乳化重合の際、ポリテトラフルオロエチレンの特性を損なわない範囲で、共重合成分としてヘキサフルオロプロピレン、クロロトリフルオロエチレン、フルオロアルキルエチレン及びパーフルオロアルキルビニルエーテル等の含フッ素オレフィン、パーフルオロアルキル(メタ)アクリレート等の含フッ素アルキル(メタ)アクリレートを用いることができる。
共重合成分の含有量は、好ましくは、ポリテトラフルオロエチレン粒子中のテトラフルオロエチレンに対して10質量%以下である。
当該混合粉体における有機系重合体粒子としては、特に制限されるものではないが、ポリカーボネート系樹脂(A)に配合する際のポリテトラフルオロエチレン粒子の分散性の観点から、ポリカーボネート樹脂に親和性を有するものであることが好ましい。
ポリテトラフルオロエチレン粒子及び有機系重合体粒子からなる混合粉体の含有量は、ポリカーボネート系樹脂(A)とグラフェンシート(B)との合計量100質量部に対して、通常0.1〜1質量部であり、好ましくは0.1〜0.9質量部、より好ましくは0.2〜0.8質量部である。
上記混合粉体の含有量が0.1質量部以上ではドリップ性能が良好であり、難燃性が達成できる。一方、1質量部以下であれば、組成物中の有機系重合体の割合が増加しすぎることがなく、難燃性が達成できる。Fluorine-containing olefins such as hexafluoropropylene, chlorotrifluoroethylene, fluoroalkylethylene and perfluoroalkyl vinyl ether as copolymerization components, as long as the properties of polytetrafluoroethylene are not impaired during the emulsion polymerization of polytetrafluoroethylene particles, Fluorine-containing alkyl (meth) acrylates such as perfluoroalkyl (meth) acrylate can be used.
The content of the copolymer component is preferably 10% by mass or less with respect to tetrafluoroethylene in the polytetrafluoroethylene particles.
The organic polymer particles in the mixed powder are not particularly limited, but are compatible with the polycarbonate resin from the viewpoint of dispersibility of the polytetrafluoroethylene particles when blended with the polycarbonate resin (A). It is preferable that it has.
The content of the mixed powder composed of polytetrafluoroethylene particles and organic polymer particles is usually 0.1 to 1 with respect to 100 parts by mass of the total amount of the polycarbonate resin (A) and the graphene sheet (B). It is a mass part, Preferably it is 0.1-0.9 mass part, More preferably, it is 0.2-0.8 mass part.
When the content of the mixed powder is 0.1 parts by mass or more, drip performance is good and flame retardancy can be achieved. On the other hand, if it is 1 mass part or less, the ratio of the organic polymer in a composition does not increase too much, and a flame retardance can be achieved.
〔任意添加成分〕
本発明のポリカーボネート樹脂組成物においては、前述した(A)成分、(B)成分、及び(C)成分又は混合粉体以外に、本発明の効果が損なわれない範囲で、必要に応じて、従来ポリカーボネート樹脂組成物に添加される公知の各種添加成分を含有することができる。このような添加成分としては、例えばリン系酸化防止剤、難燃向上剤としての有機スルホン酸のアルカリ(土類)金属塩、補強材、充填剤、ヒンダードアミン系光安定剤、リン系以外の酸化防止剤、紫外線吸収剤、帯電防止剤、滑剤、離型剤、染料、顔料、耐衝撃性改良用のエラストマー等が挙げられる。[Optional ingredients]
In the polycarbonate resin composition of the present invention, in addition to the above-mentioned (A) component, (B) component, and (C) component or mixed powder, as long as the effect of the present invention is not impaired, as necessary, Various known additive components conventionally added to polycarbonate resin compositions can be contained. Examples of such additives include phosphorus antioxidants, alkali (earth) metal salts of organic sulfonic acids as flame retardants, reinforcing materials, fillers, hindered amine light stabilizers, and oxidations other than phosphorus. Inhibitors, ultraviolet absorbers, antistatic agents, lubricants, mold release agents, dyes, pigments, elastomers for improving impact resistance, and the like.
(リン系酸化防止剤)
本発明で用いるリン系酸化防止剤としては、特に制限はない。代表的な例としては、トリス(ノニルフェニル)ホスファイト、2−エチルヘキシジフェニルホスファイトの他、トリメチルホスファイト、トリエチルホスファイト、トリブチルホスファイト、トリオクチルホスファイト、トリノニルホスファイト、トリデシルホスファイト、トリオクタデシルホスファイト、ジステアリルペンタエリスチルジホスファイト、トリス(2−クロロエチル)ホスファイト、トリス(2,3−ジクロロプロピル)ホスファイト等のトリアルキルホスファイト、トリシクロヘキシルホスファイト等のトリシクロアルキルホスファイト、トリフェニルホスファイト、トリクレジルホスファイト、トリス(エチルフェニル)ホスファイト、トリス(ブチルフェニル)ホスファイト、トリス(ヒドロキシフェニル)ホスファイト、トリス(2,4−ジ−tert−ブチルフェニル)ホスファイト等のトリアリールホスファイト、トリメチルホスフェイト、トリエチルホスフェイト、トリブチルホスフェイト、トリオクチルホスフェイト、トリデシルホスフェイト、トリオクタデシルホスフェイト、ジステアリルペンタエリスリチルジホスフェイト、トリス(2−クロロエチル)ホスフェイト、トリス(2,3−ジクロロプロピル)ホフェイト等のトリアルキルホスフェイト、トリシクロヘキシ−1−ホスフェイト等のトリシクロアルキルホスフェイト、トリフェニルホスフェイト、トリクレジルホスフェイト、トリス(ノニルフェニル)ホスフェイト、2−エチルフェニルジフェニルホスフェイト等のトリアリールホスフェイトなどが挙げられる。この中では、トリアリールホスファイト及びトリアリールホスフェイトが好適に用いられる。(Phosphorus antioxidant)
There is no restriction | limiting in particular as phosphorus antioxidant used by this invention. Typical examples include tris (nonylphenyl) phosphite, 2-ethylhexidiphenyl phosphite, trimethyl phosphite, triethyl phosphite, tributyl phosphite, trioctyl phosphite, trinonyl phosphite, tridecyl Trialkyl phosphites such as phosphite, trioctadecyl phosphite, distearyl pentaerythryl diphosphite, tris (2-chloroethyl) phosphite, tris (2,3-dichloropropyl) phosphite, and tricyclohexyl phosphite Tricycloalkyl phosphite, triphenyl phosphite, tricresyl phosphite, tris (ethylphenyl) phosphite, tris (butylphenyl) phosphite, tris (hydroxyphenyl) phosphite And triaryl phosphites such as tris (2,4-di-tert-butylphenyl) phosphite, trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, tridecyl phosphate, trioctadecyl phosphate , Trialkyl phosphates such as distearyl pentaerythrityl diphosphate, tris (2-chloroethyl) phosphate, tris (2,3-dichloropropyl) phosphate, tricycloalkyl phosphates such as tricyclohexyl-1-phosphate, And triaryl phosphates such as triphenyl phosphate, tricresyl phosphate, tris (nonylphenyl) phosphate, 2-ethylphenyldiphenyl phosphate, and the like. Of these, triaryl phosphites and triaryl phosphates are preferably used.
本発明においては、これらのリン系酸化防止剤は一種を単独で用いてもよく、二種以上組み合わせて用いてもよい。また、ポリカーボネート樹脂組成物中の当該リン系酸化防止剤の含有量は、ポリカーボネート系樹脂(A)100質量部に対して、0.1〜1質量部であることが好ましい。当該リン系酸化防止剤を上記範囲で含有することにより、充分な酸化防止効果が得られる。 In the present invention, these phosphorus antioxidants may be used alone or in combination of two or more. Moreover, it is preferable that content of the said phosphorus antioxidant in a polycarbonate resin composition is 0.1-1 mass part with respect to 100 mass parts of polycarbonate-type resin (A). By containing the phosphorus antioxidant in the above range, a sufficient antioxidant effect can be obtained.
(有機スルホン酸のアルカリ(土類)金属塩)
本発明のポリカーボネート樹脂組成物においては、難燃性を向上させるために、有機スルホン酸のアルカリ金属塩及び/又はアルカリ土類金属塩(以下、有機スルホン酸アルカリ(土類)金属塩、ともいう)を含有することができる。
有機スルホン酸としては、パーフルオロアルカンスルホン酸やポリスチレンスルホン酸等が挙げられる。
有機スルホン酸アルカリ(土類)金属塩としては、種々のものが挙げられるが、少なくとも一つの炭素原子を有する有機スルホン酸アルカリ金属塩やアルカリ土類金属塩である。
アルカリ金属としては、ナトリウム、カリウム、リチウム及びセシウム等が挙げられ、アルカリ土類金属としては、マグネシウム、カルシウム、ストロンチウム及びバリウム等が挙げられる。これら中でも、ナトリウム、カリウム及びセシウムの塩が好ましい。
(C)成分としては、パーフルオロアルカンスルホン酸又はポリスチレンスルホン酸のアルカリ金属塩及び/又はアルカリ土類金属塩が好ましい。(Alkali (earth) metal salt of organic sulfonic acid)
In the polycarbonate resin composition of the present invention, in order to improve flame retardancy, an alkali metal salt and / or alkaline earth metal salt of organic sulfonic acid (hereinafter also referred to as alkali (earth) metal salt of organic sulfonate). ) Can be contained.
Examples of the organic sulfonic acid include perfluoroalkane sulfonic acid and polystyrene sulfonic acid.
Various organic sulfonic acid alkali (earth) metal salts include organic sulfonic acid alkali metal salts and alkaline earth metal salts having at least one carbon atom.
Examples of the alkali metal include sodium, potassium, lithium and cesium, and examples of the alkaline earth metal include magnesium, calcium, strontium and barium. Of these, sodium, potassium and cesium salts are preferred.
As the component (C), an alkali metal salt and / or an alkaline earth metal salt of perfluoroalkanesulfonic acid or polystyrenesulfonic acid is preferable.
パーフルオロアルカンスルホン酸のアルカリ(土類)金属塩として、下記一般式(12)で表されるものが挙げられる。
(CdF2d+1SO3)eM ・・・(12)
式(12)中、dは1〜10の整数を示し、Mはリチウム、ナトリウム、カリウム及びセシウム等のアリカリ金属、又はマグネシウム、カルシウム、ストロンチウム及びバリウム等のアルカリ土類金属を示し、eはMの原子価を示す。
これらの金属塩としては、例えば、特公昭47−40445号公報に記載されているものが該当する。Examples of the alkali (earth) metal salt of perfluoroalkanesulfonic acid include those represented by the following general formula (12).
(C d F 2d + 1 SO 3 ) e M (12)
In formula (12), d represents an integer of 1 to 10, M represents an alkaline metal such as lithium, sodium, potassium and cesium, or an alkaline earth metal such as magnesium, calcium, strontium and barium, and e represents M The valence of is shown.
As these metal salts, for example, those described in Japanese Patent Publication No. 47-40445 are applicable.
一般式(12)において、パーフルオロアルカンスルホン酸としては、例えば、パーフルオロメタンスルホン酸、パーフルオロエタンスルホン酸、パーフルオロプロパンスルホン酸、パーフルオロブタンスルホン酸、パーフルオロメチルブタンスルホン酸、パーフルオロヘキサンスルホン酸、パーフルオロヘプタンスルホン酸及びパーフルオロオクタンスルホン酸等を挙げることができる。特に、これらのカリウム塩が好ましく用いられる。
その他、アルキルスルホン酸、ベンゼンスルホン酸、アルキルベンゼンスルホン酸、ジフェニルスルホン酸、ナフタレンスルホン酸、2,5−ジクロロベンゼンスルホン酸、2,4,5−トリクロロベンゼンスルホン酸、ジフェニルスルホン−3−スルホン酸、ジフェニルスルホン−3,3’−ジスルホン酸、ナフタレントリスルホン酸及びこれらのフッ素置換体並びにポリスチレンスルホン酸等の有機スルホン酸のアルカリ金属塩やアルカリ土類金属塩等を挙げられる。これらの中でも、特に、有機スルホン酸として、パーフルオロアルカンスルホン酸及びジフェニルスルホン酸が好ましい。In the general formula (12), examples of perfluoroalkanesulfonic acid include perfluoromethanesulfonic acid, perfluoroethanesulfonic acid, perfluoropropanesulfonic acid, perfluorobutanesulfonic acid, perfluoromethylbutanesulfonic acid, perfluoro Examples include hexanesulfonic acid, perfluoroheptanesulfonic acid, and perfluorooctanesulfonic acid. In particular, these potassium salts are preferably used.
In addition, alkylsulfonic acid, benzenesulfonic acid, alkylbenzenesulfonic acid, diphenylsulfonic acid, naphthalenesulfonic acid, 2,5-dichlorobenzenesulfonic acid, 2,4,5-trichlorobenzenesulfonic acid, diphenylsulfone-3-sulfonic acid, Examples include diphenylsulfone-3,3′-disulfonic acid, naphthalene trisulfonic acid, fluorine-substituted products thereof, and alkali metal salts and alkaline earth metal salts of organic sulfonic acids such as polystyrene sulfonic acid. Among these, perfluoroalkanesulfonic acid and diphenylsulfonic acid are particularly preferable as the organic sulfonic acid.
ポリスチレンスルホン酸のアルカリ(土類)金属塩しては、下記一般式(13)で表されるスルホン酸塩基含有芳香族ビニル系樹脂のアルカリ(土類)金属塩が挙げられる。 Examples of the alkali (earth) metal salt of polystyrene sulfonic acid include alkali (earth) metal salts of sulfonate group-containing aromatic vinyl resins represented by the following general formula (13).
式(13)中、Qはスルホン酸塩基を示し、R9は水素原子又は炭素数1〜10の炭化水素基を示す。sは1〜5の整数を示し、tはモル分率を示し、0<t≦1である。
ここで、Qのスルホン酸塩基は、スルホン酸のアルカリ金属塩及び/又はアルカリ土類金属塩であり、金属としては、ナトリウム、カリウム、リチウム、ルビジウム、セシウム、ベリリウム、マグネシウム、カルシウム、ストロンチウム及びバリウム等が挙げられる。
また、R9は、水素原子又は炭素数1〜10の炭化水素基であるが、好ましくは水素原子又はメチル基である。
sは1〜5の整数であり、tは、0<t≦1の関係である。そのため、スルホン酸塩基(Q)は、芳香環に対して、全置換したもの、部分置換したものを含んでもよい。In formula (13), Q represents a sulfonate group, and R 9 represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms. s represents an integer of 1 to 5, t represents a mole fraction, and 0 <t ≦ 1.
Here, the sulfonate group of Q is an alkali metal salt and / or alkaline earth metal salt of sulfonic acid, and the metals include sodium, potassium, lithium, rubidium, cesium, beryllium, magnesium, calcium, strontium and barium. Etc.
R 9 is a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, preferably a hydrogen atom or a methyl group.
s is an integer of 1 to 5, and t has a relationship of 0 <t ≦ 1. Therefore, the sulfonate group (Q) may include a fully substituted or partially substituted aromatic ring.
(C)有機スルホン酸のアルカリ(土類)金属塩の含有量は、ポリカーボネート系樹脂(A)100質量部に対して、0.01〜0.15質量部であることが好ましく、より好ましくは0.02〜0.13質量部、さらに好ましくは0.03〜0.12質量部である。0.01質量部以上であって、0.15質量部以下である場合、難燃性を十分に向上させることができる。 (C) The content of the alkali (earth) metal salt of the organic sulfonic acid is preferably 0.01 to 0.15 parts by mass, more preferably 100 parts by mass of the polycarbonate resin (A). It is 0.02-0.13 mass part, More preferably, it is 0.03-0.12 mass part. When the content is 0.01 parts by mass or more and 0.15 parts by mass or less, the flame retardancy can be sufficiently improved.
本発明のポリカーボネート系樹脂組成物は、有機ハロゲン系難燃剤及び有機リン酸エステル系難燃剤のいずれをも実質的に含まない。このため、有害ガスの発生、成形機の汚染、樹脂の焼け、耐熱性の低下のおそれがない。 The polycarbonate resin composition of the present invention does not substantially contain any of an organic halogen flame retardant and an organic phosphate ester flame retardant. For this reason, there is no fear of generation of harmful gas, contamination of the molding machine, burning of the resin, and deterioration of heat resistance.
〔ポリカーボネート樹脂組成物の調製方法〕
本発明のポリカーボネート樹脂組成物は、前述した(A)成分[(A−1)及び(A−2)]、(B)成分及び必要に応じて用いられる(C)成分又は混合粉体、さらには各種任意成分を所定の割合で配合し、混練することにより、調製することができる。
この際の配合及び混練は、通常用いられている機器、例えば、リボンブレンダー、ドラムタンブラー等で予備混合して、ヘンシェルミキサー、バンバリーミキサー、単軸スクリュー押出機、二軸スクリュー押出機、多軸スクリュー押出機、コニーダ等を用いる方法で行うことができる。
混練の際の加熱温度は、通常240〜300℃の範囲で適宜選択される。
尚、ポリカーボネート系樹脂以外の含有成分は、予め、ポリカーボネート系樹脂と溶融混練、即ち、マスターバッチとして添加することもできる。[Preparation method of polycarbonate resin composition]
The polycarbonate resin composition of the present invention comprises the components (A) [(A-1) and (A-2)], the component (B) and the component (C) or mixed powder used as necessary, Can be prepared by blending various components at a predetermined ratio and kneading.
In this case, blending and kneading are premixed with commonly used equipment such as a ribbon blender, a drum tumbler, etc., and then a Henschel mixer, a Banbury mixer, a single screw extruder, a twin screw extruder, a multi screw screw. It can be carried out by a method using an extruder, a kneader or the like.
The heating temperature at the time of kneading is usually appropriately selected within the range of 240 to 300 ° C.
In addition, the components other than the polycarbonate-based resin can be added in advance as a master batch with melt-kneading with the polycarbonate-based resin.
本発明のポリカーボネート樹脂組成物は、上記の溶融混練成形機を用いるか、あるいは得られたペレットを原料として、射出成形法、射出圧縮成形法、押出成形法、ブロー成形法、プレス成形法、真空成形法及び発泡成形法等により各種成形体を製造することができる。
特に、上記溶融混練方法により、ペレット状の成形原料を製造し、次いで、このペレットを用いて、射出成形、射出圧縮成形による射出成形品の製造に好適に用いることができる。
尚、射出成形方法としては、外観のヒケ防止のため、又は、軽量化のためのガス注入成形方法を採用することもできる。The polycarbonate resin composition of the present invention uses the above-mentioned melt-kneading molding machine, or using the obtained pellets as a raw material, an injection molding method, an injection compression molding method, an extrusion molding method, a blow molding method, a press molding method, a vacuum Various molded articles can be produced by a molding method, a foam molding method, or the like.
In particular, a pellet-shaped molding raw material can be produced by the melt kneading method, and then the pellet can be used suitably for production of an injection molded product by injection molding or injection compression molding.
In addition, as an injection molding method, a gas injection molding method for preventing the appearance of sink marks or for reducing the weight can be adopted.
このようにして作製された本発明の成形体は、難燃性、剛性、耐衝撃性、導電性、成形外観、熱伝導性などに優れると共に、カーボンの脱落による半導体などの汚染を起こすことがないことから、OA機器、情報機器、家庭電化機器等の電気・電子機器のハウジング、部品、フィルム、さらには自動車部品等に好適に用いられる。 The molded article of the present invention produced in this way is excellent in flame retardancy, rigidity, impact resistance, conductivity, molded appearance, thermal conductivity, and the like, and may cause contamination of semiconductors and the like due to carbon falling off. Therefore, it is suitably used for housings, parts, films, and automobile parts of electrical / electronic equipment such as OA equipment, information equipment, and home appliances.
次に、本発明を実施例及び比較例により、さらに詳細に説明するが、本発明は、これらの例によってなんら限定されるものではない。
なお、各例における特性値は、以下に示す要領に従って求めた。EXAMPLES Next, although an Example and a comparative example demonstrate this invention further in detail, this invention is not limited at all by these examples.
In addition, the characteristic value in each example was calculated | required according to the point shown below.
<PC−PDMS共重合体(A−1)及び芳香族ポリカーボネート(A−2)の粘度平均分子量>
これらの粘度平均分子量(Mv)は、ウベローデ型粘度計を用いて、20℃における塩化メチレン溶液の粘度を測定し、これより極限粘度[η]を求め、次式にて算出するものである。
[η]=1.23×10-5Mv0.83 <Viscosity average molecular weight of PC-PDMS copolymer (A-1) and aromatic polycarbonate (A-2)>
These viscosity average molecular weights (Mv) are obtained by measuring the viscosity of a methylene chloride solution at 20 ° C. using an Ubbelohde viscometer, obtaining the intrinsic viscosity [η] from this, and calculating by the following formula.
[Η] = 1.23 × 10 −5 Mv 0.83
<ポリカーボネート樹脂組成物(以下、PC組成物と略記することがある。)の性能評価>
(試験片の作製方法)
第1表〜第3表に示す割合で各成分を配合し、押出機(機種名:VS40、田辺プラスチック機械(株)製)に供給し、240℃で溶融混練し、ペレット化した。なお、すべての実施例及び比較例において、酸化防止剤としてイルガノックス1076(BASFジャパン(株)製)0.2質量部を配合した。得られたペレットを、120℃で12時間乾燥させ後、射出成形機(東芝機械(株)製、型式:IS100N)シリンダー温度260℃、金型温度80℃の条件で射出成形して試験片を得た。得られた試験片を用いて、以下の測定を行い、性能を評価した。<Performance evaluation of polycarbonate resin composition (hereinafter sometimes abbreviated as PC composition)>
(Test piece preparation method)
Each component was mix | blended in the ratio shown to Table 1-Table 3, and it supplied to the extruder (model name: VS40, Tanabe Plastic Machine Co., Ltd. product), and melt-kneaded at 240 degreeC and pelletized. In all Examples and Comparative Examples, 0.2 part by mass of Irganox 1076 (manufactured by BASF Japan Ltd.) was blended as an antioxidant. The obtained pellets were dried at 120 ° C. for 12 hours, and then injection molded under the conditions of an injection molding machine (manufactured by Toshiba Machine Co., Ltd., model: IS100N) cylinder temperature 260 ° C. and mold temperature 80 ° C. Obtained. Using the obtained test piece, the following measurements were performed to evaluate the performance.
(1)IZOD(アイゾット衝撃強度):ASTM D256に準拠、23℃(肉厚1/8インチ)、単位:kJ/m2
(2)曲げ弾性率:ASTM D−790に準拠(試験条件等:23℃、4mm)、単位:MPa
(3)体積固有抵抗値:JIS K6911に準拠(試験平板:80×80×3mm)、単位:Ω・cm
(4)難燃性UL94燃焼試験に準拠(試験片厚み:1.5mm、1.0mm、又は3.0mm)
(5)成形外観;以下の基準にて評価した。
○:良好、×:表面にブツ等不良外観有り(1) IZOD (Izod impact strength): conforming to ASTM D256, 23 ° C. (wall thickness 1/8 inch), unit: kJ / m 2
(2) Flexural modulus: compliant with ASTM D-790 (test conditions, etc .: 23 ° C., 4 mm), unit: MPa
(3) Volume resistivity value: Conforms to JIS K6911 (test plate: 80 × 80 × 3 mm), unit: Ω · cm
(4) Compliant with flame retardant UL94 combustion test (test specimen thickness: 1.5 mm, 1.0 mm, or 3.0 mm)
(5) Molding appearance: Evaluated according to the following criteria.
○: Good, ×: Defect appearance such as bumps on the surface
<グラフェンシートの厚さ及び大きさ>
グラフェンシートの厚さ及び大きさは、電子顕微鏡の観察により測定した。<Thickness and size of graphene sheet>
The thickness and size of the graphene sheet were measured by observation with an electron microscope.
製造例1[PCオリゴマーの製造]
400リットルの5質量%水酸化ナトリウム水溶液に、60kgのビスフェノールAを溶解させ、ビスフェノールAの水酸化ナトリウム水溶液を調製した。
次いで、室温に保持したこのビスフェノールAの水酸化ナトリウム水溶液を138リットル/時間の流量で、また、塩化メチレンを69リットル/時間の流量で、内径10mm、管長10mの管型反応器にオリフィス板を通して導入し、これにホスゲンを並流して10.7kg/時間の流量で吹き込み、3時間連続的に反応させた。ここで用いた管型反応器は二重管となっており、ジャケット部分には冷却水を通して反応液の排出温度を25℃に保った。また、排出液のpHは10〜11となるように調整した。
このようにして得られた反応液を静置することにより、水相を分離、除去し、塩化メチレン相(220リットル)を採取して、PCオリゴマー(濃度317g/リットル)を得た。ここで得られたPCオリゴマーの重合度は2〜4であり、クロロホーメイト基の濃度は0.7モル/Lであった。Production Example 1 [Production of PC oligomer]
60 kg of bisphenol A was dissolved in 400 liters of 5 mass% sodium hydroxide aqueous solution to prepare a sodium hydroxide aqueous solution of bisphenol A.
Next, this aqueous solution of bisphenol A in sodium hydroxide maintained at room temperature at a flow rate of 138 liter / hour and methylene chloride at a flow rate of 69 liter / hour was passed through an orifice plate through a tubular reactor having an inner diameter of 10 mm and a tube length of 10 m. It was introduced, and phosgene was co-flowed into it and blown in at a flow rate of 10.7 kg / hour, and reacted continuously for 3 hours. The tubular reactor used here was a double tube, and the discharge temperature of the reaction solution was maintained at 25 ° C. through the jacket portion through cooling water. The pH of the effluent was adjusted to 10-11.
The reaction solution thus obtained was allowed to stand to separate and remove the aqueous phase, and the methylene chloride phase (220 liters) was collected to obtain a PC oligomer (concentration 317 g / liter). The degree of polymerization of the PC oligomer obtained here was 2 to 4, and the concentration of the chloroformate group was 0.7 mol / L.
製造例2[反応性PDMSの製造]
1,483gのオクタメチルシクロテトラシロキサン、96gの1,1,3,3−テトラメチルジシロキサン及び35gの86質量%硫酸を混合し、室温で17時間攪拌した。その後、オイル相を分離し、25gの炭酸水素ナトリウムを加え1時間攪拌した。濾過した後、150℃、3torr(4×102Pa)で真空蒸留し、低沸点物を除きオイルを得た。
60gの2−アリルフェノールと0.0014gの塩化白金−アルコラート錯体としてのプラチナとの混合物に、上記で得られたオイル294gを90℃の温度で添加した。この混合物を90〜115℃の温度に保ちながら3時間攪拌した。生成物を塩化メチレンで抽出し、80質量%の水性メタノールで3回洗浄し、過剰の2−アリルフェノールを除いた。その生成物を無水硫酸ナトリウムで乾燥し、真空中で115℃に加熱して溶剤を留去した。得られた末端フェノールPDMSは、NMRの測定により、ジメチルシラノオキシ単位の繰り返し数は30であった。Production Example 2 [Production of Reactive PDMS]
1,483 g of octamethylcyclotetrasiloxane, 96 g of 1,1,3,3-tetramethyldisiloxane and 35 g of 86% by mass sulfuric acid were mixed and stirred at room temperature for 17 hours. Thereafter, the oil phase was separated, 25 g of sodium bicarbonate was added, and the mixture was stirred for 1 hour. After filtration, vacuum distillation was performed at 150 ° C. and 3 torr (4 × 10 2 Pa) to remove low-boiling substances to obtain oil.
To a mixture of 60 g 2-allylphenol and 0.0014 g platinum as platinum chloride-alcolate complex, 294 g of the oil obtained above was added at a temperature of 90 ° C. The mixture was stirred for 3 hours while maintaining the temperature at 90 to 115 ° C. The product was extracted with methylene chloride and washed 3 times with 80 wt% aqueous methanol to remove excess 2-allylphenol. The product was dried over anhydrous sodium sulfate and heated to 115 ° C. in vacuo to remove the solvent. The terminal phenol PDMS obtained had 30 repeats of dimethylsilanooxy units as measured by NMR.
製造例3[PC−PDMS共重合体の製造]
製造例2で得られた反応性PDMS182gを塩化メチレン2リットルに溶解させ、製造例1で得られたPCオリゴマー10リットルを混合した。そこへ、水酸化ナトリウム26gを水1リットルに溶解させたものと、トリエチルアミン5.7cm3を加え、500rpmで室温にて1時間攪拌、反応させた。
反応終了後、上記反応系に、5.2質量%の水酸化ナトリウム水溶液5リットルにビスフェノールA600gを溶解させたもの、塩化メチレン8リットル及びp−t−ブチルフェノ−ル96gを加え、500rpmで室温にて2時間攪拌、反応させた。
反応後、塩化メチレン5リットルを加え、さらに、水5リットルで水洗、0.03モル/L水酸化ナトリウム水溶液5リットルでアルカリ洗浄、0.2モル/L塩酸5リットルで酸洗浄、及び水5リットルで水洗2回を順次行い、最後に塩化メチレンを除去し、フレーク状のPC−PDMS共重合体を得た。得られたPC−PDMS共重合体を120℃で24時間真空乾燥した。粘度平均分子量は17,000であり、PDMS含有率は4.0質量%であった。
なお、PDMS含有率は、1H−NMRで1.7ppmに見られるビスフェノールAのイソプロピルのメチル基のピークと、0.2ppmに見られるジメチルシロキサンのメチル基のピークとの強度比を基に求めた。Production Example 3 [Production of PC-PDMS copolymer]
182 g of reactive PDMS obtained in Production Example 2 was dissolved in 2 liters of methylene chloride, and 10 liters of PC oligomer obtained in Production Example 1 were mixed. Thereto, 26 g of sodium hydroxide dissolved in 1 liter of water and 5.7 cm 3 of triethylamine were added, and the mixture was stirred and reacted at room temperature at 500 rpm for 1 hour.
After completion of the reaction, to the above reaction system was added 600 g of bisphenol A dissolved in 5 liters of a 5.2% by weight aqueous sodium hydroxide solution, 8 liters of methylene chloride and 96 g of pt-butylphenol, and the mixture was brought to room temperature at 500 rpm. And stirred for 2 hours.
After the reaction, 5 liters of methylene chloride is added, and further washed with 5 liters of water, washed with 5 liters of 0.03 mol / L sodium hydroxide aqueous solution, washed with acid with 5 liters of 0.2 mol / L hydrochloric acid, and water 5 Two liters of water washing were sequentially performed, and finally methylene chloride was removed to obtain a flaky PC-PDMS copolymer. The obtained PC-PDMS copolymer was vacuum-dried at 120 ° C. for 24 hours. The viscosity average molecular weight was 17,000, and the PDMS content was 4.0% by mass.
The PDMS content is determined based on the intensity ratio between the isopropyl methyl group peak of bisphenol A found at 1.7 ppm by 1 H-NMR and the methyl group peak of dimethylsiloxane found at 0.2 ppm. It was.
実施例1〜10及び比較例1〜13
前述した「試験片の作製方法」に従って、各例における試験片をそれぞれ作製し、この試験片を用いて性能を各種試験によって評価した。その結果を第1表〜第3表に示す。Examples 1-10 and Comparative Examples 1-13
In accordance with the above-described “Method for Producing Test Pieces”, the test pieces in each example were produced, and the performance was evaluated by various tests using the test pieces. The results are shown in Tables 1 to 3.
[注]
(A)成分:
(A−1)PC−PDMS:製造例3で得られた、粘度平均分子量が17,000、PDMS含有率が4.0質量%のPC−PDMS共重合体
(A−2)PC:「FN1900A」(出光興産(株)製)、粘度平均分子量19,500
(B)成分:
グラフェンシート1:「グラフェン・ナノプレートレットxGnP」(XG Sciences社製)、厚さ6〜8nm、大きさ(シートサイズ)5μm
グラフェンシート2:「グラフェン・ナノプレートレットxGnP」(XG Sciences社製)、厚さ6〜8nm、大きさ(シートサイズ)15μm
グラフェンシート3:「グラフェン・ナノプレートレットxGnP」(XG Sciences社製)、厚さ2〜4nm、大きさ(シートサイズ)2μm
(C)成分:
PTFE:PTFE「CD076」(旭硝子フロロポリマーズ(株)製)
その他の成分:
カーボンナノチューブ1:マルチウォール直径50〜100nm、長さ1〜10μm、両端開口、アモルファスカーボン量15質量%(サンナノテック社製)
カーボンナノチューブ2:マルチウォール直径10〜30nm、長さ1〜10μm、両端開口、アモルファスカーボン量15質量%(サンナノテック社製)
黒鉛:「PC99−300M」(伊東黒鉛工業(株)製)、平均粒径56μm、厚さ1.7μm[note]
(A) component:
(A-1) PC-PDMS: PC-PDMS copolymer obtained in Production Example 3 having a viscosity average molecular weight of 17,000 and a PDMS content of 4.0% by mass (A-2) PC: “FN1900A (Idemitsu Kosan Co., Ltd.), viscosity average molecular weight 19,500
(B) component:
Graphene sheet 1: “graphene nanoplatelet xGnP” (manufactured by XG Sciences), thickness 6-8 nm, size (sheet size) 5 μm
Graphene sheet 2: “Graphene nanoplatelet xGnP” (manufactured by XG Sciences), thickness 6-8 nm, size (sheet size) 15 μm
Graphene sheet 3: “graphene nanoplatelet xGnP” (manufactured by XG Sciences), thickness 2 to 4 nm, size (sheet size) 2 μm
(C) component:
PTFE: PTFE “CD076” (Asahi Glass Fluoropolymers Co., Ltd.)
Other ingredients:
Carbon nanotube 1: multi-wall diameter 50-100 nm, length 1-10 μm, opening at both ends, amorphous carbon content 15% by mass (manufactured by Sun Nanotech)
Carbon nanotube 2: multi-wall diameter 10-30 nm, length 1-10 μm, opening at both ends, amorphous carbon amount 15 mass% (manufactured by Sun Nanotech)
Graphite: “PC99-300M” (manufactured by Ito Graphite Industries Co., Ltd.), average particle size 56 μm, thickness 1.7 μm
第1表〜第3表から分かるように、本発明に属するポリカーボネート樹脂組成物は、グラフェンシートを特定の割合で含有することにより、高い難燃性が得られると共に、衝撃強度の低下を少なくすることができ、剛性、導電性及び成形外観にも優れる。特にPC−PDMS共重合体を特定の割合で含むことにより、衝撃強度及び難燃性が優れたものになる。さらにPTFEを含むことによって、さらに薄肉の難燃性が可能となる。また、厚さが5〜10nm及び大きさが3μm以上のグラフェンシートを用いることにより、より高い難燃性、剛性、導電性が得られる。
一方、比較例で用いたカーボンナノチューブでは、グラフェンシートと比較し、剛性と難燃性に劣り、また、マイクロオーダーの黒鉛では、衝撃強度が著しく低下するだけではなく、難燃性が低下してしまう。As can be seen from Tables 1 to 3, the polycarbonate resin composition belonging to the present invention contains a graphene sheet at a specific ratio, so that high flame retardancy is obtained and reduction in impact strength is reduced. It is also excellent in rigidity, conductivity and molded appearance. In particular, by including a PC-PDMS copolymer at a specific ratio, the impact strength and flame retardancy are excellent. Furthermore, by including PTFE, the flame retardance of a thin wall is attained. Further, by using a graphene sheet having a thickness of 5 to 10 nm and a size of 3 μm or more, higher flame retardancy, rigidity, and conductivity can be obtained.
On the other hand, the carbon nanotubes used in the comparative examples are inferior in rigidity and flame retardancy compared with the graphene sheet, and the micro-order graphite not only significantly reduces the impact strength but also reduces the flame retardancy. End up.
本発明のポリカーボネート樹脂組成物は、難燃性、剛性、耐衝撃性、導電性及び成形外観、さらには熱伝導性などに優れた成形体を与えることができる。この成形体は、OA機器、情報機器、家庭電化機器等の電気・電子機器のハウジング、部品、フィルム、さらには自動車部品等その応用分野の拡大が期待される。 The polycarbonate resin composition of the present invention can give a molded article excellent in flame retardancy, rigidity, impact resistance, conductivity, molded appearance, and thermal conductivity. This molded body is expected to expand its application fields such as housings, parts, films, and automobile parts of electrical / electronic equipment such as OA equipment, information equipment, and home appliances.
Claims (7)
[式中、R1及びR2は、それぞれ独立に炭素数1〜6のアルキル基又はアルコキシ基、Xは単結合、炭素数1〜8のアルキレン基、炭素数2〜8のアルキリデン基、炭素数5〜15のシクロアルキレン基、炭素数5〜15のシクロアルキリデン基、−S−、−SO−、−SO2−、−O−又は−CO−、R3〜R6は、それぞれ独立に、水素原子、ハロゲン原子又は炭素数1〜6のアルキル基、炭素数1〜6のアルコキシ基もしくは炭素数6〜12のアリール基を示し、Yは脂肪族または芳香族を含む有機残基を示し、nは平均繰り返し数であって、1〜600の整数を示し、a及びbは0〜4の整数を示す。] The polycarbonate-polyorganosiloxane copolymer (A-1) includes a structural unit having a main chain represented by the general formula (I) and a structural unit represented by the general formula (II), and the general formula (II) The polycarbonate resin composition according to claim 1 , comprising 2 to 40% by mass of a polyorganosiloxane block comprising a structural unit represented by:
[Wherein, R 1 and R 2 are each independently an alkyl group or alkoxy group having 1 to 6 carbon atoms, X is a single bond, an alkylene group having 1 to 8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, carbon A cycloalkylene group having 5 to 15 carbon atoms, a cycloalkylidene group having 5 to 15 carbon atoms, —S—, —SO—, —SO 2 —, —O— or —CO—, and R 3 to R 6 are each independently , A hydrogen atom, a halogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or an aryl group having 6 to 12 carbon atoms, and Y represents an organic residue containing aliphatic or aromatic , N is an average number of repetitions and represents an integer of 1 to 600, and a and b represent integers of 0 to 4. ]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013520555A JP5988971B2 (en) | 2011-06-17 | 2012-06-12 | Polycarbonate resin composition and molded body using the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011135663 | 2011-06-17 | ||
JP2011135663 | 2011-06-17 | ||
PCT/JP2012/065005 WO2012173111A1 (en) | 2011-06-17 | 2012-06-12 | Polycarbonate resin composition and molding produced using same |
JP2013520555A JP5988971B2 (en) | 2011-06-17 | 2012-06-12 | Polycarbonate resin composition and molded body using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012173111A1 JPWO2012173111A1 (en) | 2015-02-23 |
JP5988971B2 true JP5988971B2 (en) | 2016-09-07 |
Family
ID=47357098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013520555A Active JP5988971B2 (en) | 2011-06-17 | 2012-06-12 | Polycarbonate resin composition and molded body using the same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5988971B2 (en) |
KR (1) | KR101903214B1 (en) |
CN (1) | CN103608404B (en) |
WO (1) | WO2012173111A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5877098B2 (en) * | 2012-03-22 | 2016-03-02 | 出光興産株式会社 | Polycarbonate resin composition and molded body using the same |
JP6313971B2 (en) * | 2013-12-26 | 2018-04-18 | 出光興産株式会社 | Molded body for outdoor installation |
KR101714739B1 (en) * | 2014-04-16 | 2017-03-09 | 주식회사 엘지화학 | Novel polyorganosiloxane, copolycarbonate composition containing the same and molded articles thereof |
CN105038285A (en) * | 2014-04-18 | 2015-11-11 | 台湾奈米碳管股份有限公司 | Method for producing carbon-containing polymer composite particles |
CN104693772A (en) * | 2015-03-04 | 2015-06-10 | 安徽科聚新材料有限公司 | Glass fiber-mica mixed enhanced polycarbonate material and preparation method thereof |
CN104990022B (en) * | 2015-05-27 | 2017-08-08 | 明光泰源安防科技有限公司 | Absorption type is met an urgent need indicator lamp |
CN106800765B (en) * | 2017-01-21 | 2018-06-08 | 郑州人造金刚石及制品工程技术研究中心有限公司 | It is a kind of for makrolon material of smart mobile phone shell and its preparation method and application |
CN111621133B (en) * | 2020-06-30 | 2022-11-08 | 万华化学集团股份有限公司 | High-dielectric low-loss polycarbonate composition and preparation method and application thereof |
US20240341357A1 (en) * | 2021-08-13 | 2024-10-17 | Jt International Sa | Electronic Smoking Device with a Battery Housing |
CN115286915A (en) * | 2022-08-31 | 2022-11-04 | 河南德利新能源材料有限公司 | Preparation method of polycarbonate composition |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4122160B2 (en) * | 2002-01-30 | 2008-07-23 | 出光興産株式会社 | Polycarbonate resin composition and molded body |
EP1801164B1 (en) * | 2002-01-30 | 2009-04-22 | Idemitsu Kosan Co., Ltd. | Thermoplastic resin composition, polycarbonate resin composition, and molded article thereof |
US8110026B2 (en) * | 2006-10-06 | 2012-02-07 | The Trustees Of Princeton University | Functional graphene-polymer nanocomposites for gas barrier applications |
JP2009191392A (en) * | 2008-02-13 | 2009-08-27 | Teijin Ltd | Pitch-based carbon fiber filer and molded article using the same |
JP2009197056A (en) * | 2008-02-19 | 2009-09-03 | Teijin Chem Ltd | Conductive resin molding material |
KR101600108B1 (en) * | 2008-02-28 | 2016-03-04 | 바스프 에스이 | Graphite nanoplatelets and compositions |
CN102227782B (en) * | 2008-09-30 | 2014-03-12 | 保土谷化学工业株式会社 | Composite material containing carbon fiber |
JP4936405B2 (en) * | 2009-03-30 | 2012-05-23 | 独立行政法人国立高等専門学校機構 | Polyurethane elastomer actuator |
JP2011032156A (en) * | 2009-07-06 | 2011-02-17 | Kaneka Corp | Method for manufacturing graphene or thin film graphite |
JP5296622B2 (en) * | 2009-07-08 | 2013-09-25 | 帝人株式会社 | Molded product comprising conductive resin composition |
JP2011016937A (en) * | 2009-07-09 | 2011-01-27 | Mitsubishi Engineering Plastics Corp | High thermal conductivity thermoplastic resin composition and molding |
CN103080235B (en) * | 2010-09-03 | 2015-03-25 | 积水化学工业株式会社 | Resin composite material and method for producing resin composite material |
CN102040761A (en) * | 2011-01-14 | 2011-05-04 | 华南理工大学 | High-heat-conductivity composite material and preparation method thereof |
-
2012
- 2012-06-12 WO PCT/JP2012/065005 patent/WO2012173111A1/en active Application Filing
- 2012-06-12 CN CN201280029564.7A patent/CN103608404B/en active Active
- 2012-06-12 KR KR1020137033336A patent/KR101903214B1/en active IP Right Grant
- 2012-06-12 JP JP2013520555A patent/JP5988971B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101903214B1 (en) | 2018-10-01 |
KR20140041554A (en) | 2014-04-04 |
WO2012173111A1 (en) | 2012-12-20 |
CN103608404B (en) | 2016-03-09 |
JPWO2012173111A1 (en) | 2015-02-23 |
CN103608404A (en) | 2014-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5988971B2 (en) | Polycarbonate resin composition and molded body using the same | |
JP5877098B2 (en) | Polycarbonate resin composition and molded body using the same | |
JP5706667B2 (en) | Polycarbonate resin composition, molded product, and structural member for photovoltaic power generation | |
US8044127B2 (en) | Thermoplastic resin composition, polycarbonate resin composition, and molded article thereof | |
JP5755226B2 (en) | Polycarbonate resin composition and molded product thereof | |
JP4700770B2 (en) | Polycarbonate resin composition and molded body | |
JP6106593B2 (en) | Polycarbonate resin composition | |
JP5919454B2 (en) | Polycarbonate resin composition and molded product thereof | |
JP4746891B2 (en) | Flame retardant resin composition and molded body thereof | |
JP5264586B2 (en) | Polycarbonate resin composition | |
JP6173906B2 (en) | Thermally conductive polycarbonate resin composition and molded product | |
JP4275278B2 (en) | Polycarbonate resin composition | |
JP4275279B2 (en) | Polycarbonate resin composition | |
WO2015122492A1 (en) | Polycarbonate resin composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150114 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160315 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160426 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160726 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160809 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5988971 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |