JP5982180B2 - Cleaning device and cleaning method - Google Patents

Description

  The present invention relates to a cleaning apparatus and a cleaning method for cleaning a substrate on which an adhesive tape having a frame portion attached to the outer periphery is attached.

  As mobile phones, digital AV devices, IC cards, etc. have become more sophisticated, the demand for higher integration of chips in packages has increased by reducing the size and thickness of semiconductor silicon chips (hereinafter referred to as chips). ing. In order to achieve high integration of the chips in the package, it is necessary to reduce the thickness of the chips to 150 μm or less.

  However, since a semiconductor wafer (hereinafter referred to as a wafer) serving as a base of a chip is thinned by grinding, its strength is weakened, and the wafer is likely to be cracked or warped. Further, since it is difficult to automatically transport a wafer whose strength has been weakened by thinning, it must be transported manually, and the handling is complicated.

  Therefore, a wafer support system that maintains the strength of the wafer by bonding a plate made of glass, hard plastic, or the like, called a support plate (hereinafter referred to as a support plate) to the wafer to be ground, and prevents the occurrence of cracks and warpage of the wafer. Has been developed. Since the wafer strength can be maintained by this wafer support system, conveyance of the thinned wafer can be automated.

  The wafer and the support plate are bonded together using an adhesive tape, a thermoplastic resin, an adhesive, or the like, and the support plate is peeled from the wafer before dicing the wafer. At this time, for example, when an adhesive tape is used for bonding the wafer and the support plate, the wafer is peeled off by peeling it from the support plate. When a thermoplastic resin is used, the wafer is peeled off by heating and dissolving. And when using an adhesive agent, it peels by making it melt | dissolve using a solution.

  Further, when the support plate is peeled from the wafer, the surface of the wafer opposite to the surface to which the support plate is bonded may be bonded to an adhesive tape such as a dicing tape depending on the film thickness of the wafer. Since the wafer is supported by the dicing tape, the occurrence of cracks and the like can be suppressed even when the film thickness is thin and the strength is low. A frame portion called a dicing frame is attached to the outer periphery of the dicing tape.

  As another example of a technique for processing a wafer, Patent Documents 1 and 2 describe laser processing for irradiating a laser beam on the wafer and cutting the wafer into chips in order to form chips from the wafer. In this laser processing, in order to prevent the influence of debris generated when the wafer is cut by the laser, a protective film is formed on the surface of the wafer during the cutting.

JP 2004-188475 A (released July 8, 2004) JP 2004-322168 A (published November 18, 2004)

  By the way, since dirt may adhere to the surface of the wafer during the manufacturing process, the adhering matter must be removed to clean the surface of the wafer. In particular, when a support plate bonded to a wafer via an adhesive is peeled off, the adhesive or the like remains on the surface of the wafer. Further, when the adhesive is dissolved, a dissolved residue derived from a filler or the like in the adhesive may remain on the surface of the wafer. For this reason, it is necessary to clean the surface of the wafer in a state of being bonded to a dicing tape before the wafer is divided into chips by dicing.

  As a wafer cleaning method, for example, as shown in FIG. FIG. 3 is a diagram illustrating an example of a conventional cleaning method for cleaning a wafer surface attached to a dicing tape having a dicing frame attached to the outer periphery.

  In the method shown in FIG. 3A, the cleaning liquid 106 is ejected vigorously from the nozzle 108 to the wafer 100, so that the deposits such as the remaining adhesive 103 and the dissolved residue 104 are flowed together to form the wafer 100 on the wafer 100. Remove from. However, in this method, the deposit flows on the exposed surface of the dicing tape 101 that protrudes outside the outer edge portion of the wafer 100, and the dissolved residue 104 adheres and is contaminated. In this case, in the subsequent dicing process, the adhering matter adhering to the dicing tape 101 may be caught in the dicing blade and contaminate the wafer 100 again.

  In the method shown in FIG. 3B, the cleaning liquid is discharged while water is applied onto the dicing tape 101 in order to prevent this contamination, but a large amount of the remaining adhesive 103 remains on the surface of the wafer 100. When water is discharged in the state, the water and the residual adhesive 103 may react to precipitate the dissolved residue 104.

  Patent Documents 1 and 2 do not describe any contamination of the dicing tape and the dicing frame when cleaning the wafer.

  Further, in the method shown in FIG. 3A, the washed-out deposits adhere to the dicing frame 102 that protrudes further outward than the exposed surface of the dicing tape 101, and therefore the dicing frame 102 is used by the robot arm in the subsequent process. When the robot is gripped, the robot arm is contaminated by the deposits.

  In recent years, a flat and rigid resin dicing frame has been developed. A resin-made dicing frame is useful because it is lighter than a stainless steel (SUS) dicing frame that has been widely used heretofore. However, in the conventional metal or alloy dicing frame, it was not necessary to consider the resistance to the cleaning liquid. However, when using a resin dicing frame, there is a possibility that the cleaning liquid may be dissolved. There is a possibility that the dicing frame deteriorates due to adhesion.

  Therefore, the development of a technology capable of efficiently cleaning a wafer with a dicing tape attached with a dicing frame attached thereto while preventing contamination of the dicing tape and the dicing frame and preventing deterioration of the dicing tape and the dicing frame. There is a strong demand.

  The present invention has been made in order to solve the above-described problems, and the purpose thereof is a cleaning apparatus capable of efficiently cleaning a substrate on which an adhesive tape having a frame portion attached to the outer periphery is attached. And providing a cleaning method.

  The cleaning apparatus according to the present invention is a cleaning apparatus including cleaning means for cleaning, with a cleaning liquid, a substrate having an adhesive tape attached to one surface thereof and a frame portion attached to the outer periphery of the adhesive tape. Further, a protective film forming means for forming a protective film for protecting these from the cleaning liquid is further provided on the exposed surface of the pressure-sensitive adhesive tape that protrudes outward from the outer edge portion and the frame portion.

  The cleaning method according to the present invention is a cleaning method for cleaning a substrate in which an adhesive tape is attached to one side and a frame portion is attached to the outer periphery of the adhesive tape, and the outer side of the outer edge portion of the substrate is outside. A protective film forming step of forming a protective film for protecting the exposed adhesive tape and the frame portion from the cleaning liquid, and a cleaning step of cleaning the substrate with the cleaning liquid after forming the protective film; It is characterized by including.

  According to the present invention, for example, it is possible to efficiently clean a substrate on which an adhesive tape having a frame portion attached to the outer periphery is attached.

It is a top view which shows the structure of the washing | cleaning apparatus which concerns on one Embodiment of this invention. It is a figure which shows the flow of a process of the washing | cleaning method which concerns on one Embodiment of this invention. It is a figure which shows an example of the conventional cleaning method which wash | cleans the wafer surface stuck on the dicing tape with which the dicing frame is attached to the outer periphery.

[Cleaning equipment]
The cleaning apparatus according to the present invention is a cleaning apparatus including cleaning means for cleaning, with a cleaning liquid, a substrate having an adhesive tape attached to one surface thereof and a frame portion attached to the outer periphery of the adhesive tape. Further, a protective film forming means for forming a protective film for protecting these from the cleaning liquid is further provided on the exposed surface of the pressure-sensitive adhesive tape that protrudes outward from the outer edge portion and the frame portion. A cleaning apparatus according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a top view showing a configuration of a cleaning apparatus 80 according to an embodiment of the present invention.

  As shown in FIG. 1, the cleaning device 80 includes a coating (protective film) unit 50 and a removal unit 60, the coating unit 50 includes a protective film forming unit 4, and the removal unit 60 includes the first cleaning unit 5. (Cleaning means). The removal unit 60 may further include second cleaning means 6 (removal means). Further, the cleaning device 80 may include the object storage unit 8, the transport unit 40, and the peeling unit 54 (peeling unit). Note that the cleaning device of the present invention is not limited to the configuration of the illustrated cleaning device 80.

  The cleaning apparatus 80 is configured to perform a cleaning process using the wafer (substrate) from which the support plate (support plate) has been peeled off as the object 9 to be processed.

(Processed object)
In this embodiment, the target object to be cleaned is a wafer (substrate) attached to a dicing tape (adhesive tape) having a dicing frame (frame portion) attached to the outer periphery thereof. The wafer is a substrate on which a circuit (element) is formed, and a conventionally known substrate such as a semiconductor can be used.

  The dicing tape is bonded to one side of the wafer in order to reinforce the strength of the wafer. As the dicing tape, for example, a dicing tape having a configuration in which an adhesive layer is formed on a base film can be used. As the base film, for example, a resin film such as PVC (polyvinyl chloride), polyolefin, or polypropylene can be used. The outer diameter of the dicing tape is larger than the outer diameter of the wafer, and when these are bonded, a part of the dicing tape is exposed at the outer edge portion of the wafer.

  A dicing frame for preventing bending of the dicing tape is attached to the outer periphery of the exposed surface of the dicing tape. That is, the dicing frame is exposed at the outer edge portion of the dicing tape. Examples of the dicing frame include a dicing frame made of metal such as aluminum, a dicing frame made of alloy such as stainless steel (SUS), and a dicing frame made of resin. Examples of the resin dicing frame include resin dicing frames manufactured by Shin-Etsu Polymer and Disco.

  If a dicing frame made of metal or alloy is used as the dicing frame, it is rigid, less distorted, and less expensive, but it is heavier than a resin dicing frame. It takes. In recent years, a flat and rigid resin-made dicing frame has been developed, which has an advantage of being lighter than a metal or alloy dicing frame that has been widely used conventionally. The resin-made dicing frame is light in weight so that it can be easily transported, and further has an advantage that dust generation due to friction is small when it is taken in and out of a metal frame cassette.

  The cleaning apparatus 80 can be suitably used for cleaning a wafer after the support plate temporarily held in the wafer manufacturing process is peeled off.

  In other words, dirt may adhere to the surface of the wafer during the manufacturing process. Therefore, the adhering matter must be removed to clean the surface of the wafer. In particular, when the support plate bonded through the adhesive is peeled off, the adhesive or the like remains on the surface of the wafer. Further, when the adhesive is dissolved, a dissolved residue derived from a filler or the like in the adhesive may remain on the surface of the wafer. Therefore, before the wafer is diced and divided into chips, it is necessary to clean the surface of the wafer while being bonded to the dicing tape.

  However, in the conventional method of removing deposits such as residual adhesive and dissolved residue together by discharging cleaning liquid onto the wafer and removing it from the wafer, dicing that protrudes outside the outer edge portion of the wafer. Deposits adhere to the exposed surface of the tape and contaminate the dicing tape. In addition, when the cleaning liquid is in direct contact with the dicing tape, the dicing tape is deteriorated depending on the type of the cleaning liquid. Furthermore, the adhering matter adhering to the dicing tape is caught in the dicing blade, and the wafer is contaminated again.

  In addition, since the adherent washed away to the dicing frame that protrudes further outward than the exposed surface of the dicing tape adheres, the robot arm is contaminated by the adherent when the dicing frame is gripped by the robot arm in the subsequent process. End up.

  In addition, in the conventional metal or alloy dicing frame, it was not necessary to consider the resistance to the cleaning liquid, but when using a resin dicing frame, depending on the type of the cleaning liquid, there is no solvent resistance and the cleaning liquid On the other hand, there is a possibility that the dicing frame may be dissolved, and there is a possibility that the dicing frame deteriorates due to the attachment of the cleaning liquid.

  According to the cleaning apparatus 80, such a problem can be prevented and the object to be processed can be appropriately cleaned.

(Conveying means)
The conveying means 40 is configured to take out the object 9 from the object storage unit 8 in which the object 9 is accommodated and convey it to the coating unit 50. Further, the transport means 40 transports the workpiece 9 from the coating unit 50 to the peeling unit 54 or the removal unit 60.

  The transport means 40 includes a transport robot 42 and a travel path 46 for realizing linear travel. The transfer robot 42 is rotatable about an axis and has two connecting arms 44a and a hand 44b.

  The connecting arm 44a performs an expansion / contraction operation by a rotation operation at the joint. The hand 44b is provided at the tip of the connecting arm 44a, and holds the object 9 or the wafer. The transfer robot 42 can move the workpiece 9 or the wafer in the horizontal plane by the expansion / contraction operation of the connecting arm 44a and the rotation operation about the axis.

(Coating unit)
The coating unit 50 is configured to form a protective film on the object 9 to be processed. Specifically, the protective film forming means 4 forms a protective film for protecting these from the cleaning liquid on the exposed surface of the dicing tape and the dicing frame that protrudes outside the outer edge portion of the wafer. The protective film forming means 4 forms a protective film by applying a protective film material insoluble in the cleaning liquid to the exposed surface of the dicing tape and the dicing frame. Thereby, a protective film can be formed easily and reliably.

  The protective film forming unit 4 may be configured to discharge a liquid protective film material from a discharge unit such as a nozzle. However, the configuration of the protective film forming means 4 is not limited to the configuration in which the liquid protective film material is discharged as described above. For example, after forming a protective layer including any of the protective film materials described above on a film such as a flexible film in advance, the protective layer is dried, and this film is attached to the exposed surface of the dicing tape and the dicing frame. It may be a configuration.

  The protective film forming means 4 may be configured to apply a protective film material to the exposed surface of the dicing tape, the dicing frame, and the outer periphery of the dicing frame. As a result, the protective film is formed up to the outer peripheral portion of the dicing frame, so that even if the cleaning liquid reaches the outer peripheral portion of the dicing frame, the dicing frame can be reliably protected from the cleaning liquid.

  Moreover, the application unit 50 may irradiate the exposed surface of the dicing tape with ultraviolet rays, for example, before applying the protective film material. Thereby, the wettability of a dicing tape can be improved.

  The application unit 50 may be configured to rotate the object 9 when the protective film forming unit 4 applies the protective film material, for example.

(Protective film material)
The protective film material applied by the protective film forming means 4 is not particularly limited as long as it is made of a material that is insoluble in the cleaning liquid, but is more preferably made of a water-soluble material. As such a protective film material, for example, at least one water-soluble resin selected from acrylic resins, vinyl resins, cellulose resins, and amide resins can be used.

  Examples of the acrylic resin include acrylic acid, methyl acrylate, methacrylic acid, methyl methacrylate, N, N-dimethylacrylamide, N, N-dimethylaminopropyl methacrylamide, N, N-dimethylaminopropylacrylamide, N- Examples thereof include polymers or copolymers containing monomers such as methyl acrylamide, diacetone acrylamide, N, N-dimethylaminoethyl methacrylate, N, N-diethylaminoethyl methacrylate, N, N-dimethylaminoethyl acrylate, and acryloylmorpholine.

  Examples of the vinyl-based resin include polymers or copolymers having monomers such as N-vinyl pyrrolidone, vinyl imidazolidinone, and vinyl acetate as constituent components.

  Examples of the cellulose resin include hydroxypropylmethylcellulose phthalate, hydroxypropylmethylcellulose acetate phthalate, hydroxypropylmethylcellulose hexahydrophthalate, hydroxypropylmethylcellulose acetate succinate, hydroxypropylmethylcellulose, hydroxypropylcellulose, hydroxyethylcellulose, cellulose acetate hexa Hydrophthalate, carboxymethylcellulose, ethylcellulose, methylcellulose and the like can be mentioned.

  Further, water-soluble amide resins can be used. Among them, vinyl resins are preferable, and polyvinyl pyrrolidone or polyvinyl alcohol is particularly preferable.

  These water-soluble resins may be used alone or in combination of two or more. Among the above resins, a resin in which the adhesive strength of the exposed surface of the dicing tape on which the protective film is formed is 50% or less compared to the value of the adhesive strength before the protective film is formed, and the resin is 30% or less. It is more preferable to use Thereby, it can prevent suitably that a residual adhesive, a melt | dissolution residue, etc. adhere to an adhesive dicing tape.

(Peeling unit)
The peeling unit 54 peels the support plate, which is attached to the surface of the wafer facing away from the surface on which the dicing tape is attached, with an adhesive. The configuration of the peeling unit 54 may be changed as appropriate according to the configuration of the adhesive layer interposed between the wafer and the support plate. For example, the configuration may be a configuration capable of supplying a solvent for dissolving the adhesive. In addition, a structure capable of irradiating light to decompose the reaction layer may be used. When a perforated support plate is used as the support plate, the peeling unit 54 supplies the solvent to the adhesive layer through the support plate through hole to dissolve the adhesive, and peels off the wafer and the support plate. Also good.

  The peeling process by the peeling unit 54 may be before or after the protective film is formed by the coating unit 50.

(Removal unit)
The removal unit 60 cleans the deposits adhering to the wafer surface by the first cleaning means 5 and removes the exposed surface of the dicing tape and the protective film formed on the dicing frame by the second cleaning means 6. It is like that.

  The configuration of the first cleaning means 5 is not particularly limited as long as the wafer is cleaned using the cleaning liquid. For example, the cleaning liquid is discharged by discharge means such as a nozzle. May be. The first cleaning means 5 may discharge the cleaning liquid onto the wafer from which the support plate has been peeled off, and clean and remove the deposits remaining on the wafer.

  The structure of the 2nd washing | cleaning means 6 is not specifically limited as long as a protective film can be removed, It can change suitably according to the material or form of a protective film. For example, the cleaning liquid may be discharged onto the protective film using a discharge unit such as a nozzle, or the protective film may be peeled off.

  In the case where the protective film is insoluble in the cleaning liquid and formed of a water-soluble protective film material, it is preferable that the second cleaning means 6 supplies water to the protective film and removes the protective film. . Thereby, a protective film can be removed easily and reliably.

  In addition, after the cleaning (protection film removal) process by the second cleaning unit 6, the removal unit 60 may further perform, for example, a dry process on the surface of the wafer. As a result, even if there are deposits such as an adhesive that could not be completely removed by the cleaning by the first cleaning means 5, the surface of the wafer can be further cleaned by further removal processing. Examples of such treatment include plasma treatment in which oxygen plasma is generated to remove the adhesive remaining on the wafer surface.

  The removal unit 60 may be configured to rotate the object 9 when the processing by the first cleaning unit 5 and the second cleaning unit 6 is performed.

(Cleaning solution)
The cleaning liquid used for cleaning the wafer by the first cleaning means 5 is appropriately selected according to the type of adhesive for bonding the wafer and the support plate, and is particularly limited as long as it contains a non-aqueous solvent. For example, a known cleaning solution using a terpene solvent such as p-menthane described later can be used.

  Specific examples of the cleaning liquid include hexane, heptane, octane, nonane, methyloctane, decane, undecane, dodecane, tridecane, and other linear hydrocarbons, branched hydrocarbons having 3 to 15 carbon atoms; geraniol , Nerol, linalool, citral, citronellol, p-menthane, o-menthane, m-menthane, diphenylmenthane, menthol, isomenthol, neomenthol, limonene, α-terpinene, β-terpinene, γ-terpinene, α-terpineol, β-terpineol, γ-terpineol, terpinen-1-ol, terpinen-4-ol, 1,4-terpine, 1,8-terpine, carvone, yonon, tuyon, camphor, bornane, borneol, norbornane, pinane, α- Pinene, β-pinene, tsujang, Cyclic hydrocarbons (terpenes) such as monoterpenes such as α-tujon, β-tujon, caran, camphor, longifolene, 1,4-cineole, 1,8-cineole, and diterpenes such as abiethane and abietic acid Is mentioned.

(adhesive)
The cleaning device 80 is an adhesive used to bond the wafer and the support plate, and cleans the adhesive residue and dissolved residue adhering to the wafer after peeling the support plate from the wafer. As described above, the adhesive to be subjected to the cleaning process of the cleaning device 80 is not particularly limited as long as it includes a resin having adhesiveness, but may further include a filler.

  The adhesive to be cleaned is, for example, gelatin, cellulose, cellulose ester (for example, cellulose acetate, nitrocellulose), polyphenol, polyvinyl butyral, polyvinyl acetal, polycarbonate, polyurethane, polyester, polyorthoester, polyacetal. , Polyvinyl alcohol, polyvinylpyrrolidone, a copolymer of vinylidene chloride and acrylonitrile, poly (meth) acrylate, polyvinyl chloride, silicone resin or block copolymer containing a polyurethane unit, or a mixture of two or more thereof. May be.

  The adhesive is used as a filler, for example, silica, alumina, zinc oxide, titanium oxide, calcium oxide, magnesium oxide, iron oxide, tin oxide, antimony oxide, ferrites, calcium hydroxide, magnesium hydroxide, aluminum hydroxide. , Basic magnesium carbonate, calcium carbonate, zinc carbonate, barium carbonate, dosonite, hydrotalcite, calcium sulfate, barium sulfate, calcium silicate, talc, clay, mica, montmorillonite, bentonite, sepiolite, imogolite, cerissato, glass fiber, Glass beads, silica-based balun, aluminum nitride, boron nitride, silicon nitride, carbon black, graphite, carbon fiber, carbon balun, zinc borate, various magnetic powders, and the like may be included.

  The adhesive may be prepared by mixing a resin and a filler using a known method. At this time, a solution diluted with an organic solvent may be used as necessary.

  Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone, cyclohexanone, methyl isoamyl ketone, and 2-heptanone; ethylene glycol, ethylene glycol monoacetate, diethylene glycol, diethylene glycol monoacetate, propylene glycol, propylene glycol monoacetate, dipropylene glycol Or polyhydric alcohols such as monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether or monophenyl ether of dipropylene glycol monoacetate and derivatives thereof; cyclic ethers such as dioxane; methyl lactate, ethyl lactate, methyl acetate , Ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, Esters such as ethyl propionate; and terpene solvent, and the like. These may be used alone or in combination of two or more.

  Examples of the terpene solvent include α-pinene, camphene, pinane, myrcene, dihydromyrcene, p-menthane, 3-carene, p-menthadiene, α-terpinene, β-terpinene, α-ferrandrene, osymene, limonene. , P-cymene, γ-terpinene, terpinolene, 1,4-cineole, 1,8-cineole, rose oxide, linalool oxide, Fencon, α-cyclocitral, osmenol, tetrahydrolinalol, linalool, tetrahydromegol, isopulegol, dihydro Linalool, isodihydrolabandulol, β-cyclocitral, citronellal, L-mentholone, linalyl formate, dihydroterpineol, β-terpineol, menthol, myrsenol, L-menthol, pinocarbeo , Α-terpineol, γ-terpineol, nopol, myrtenol, dihydrocarbeveol, citronellol, mirutenal, dihydrocarvone, d-pulegone, geranyl ethyl ether, geranyl formate, neryl formate, terpinyl formate, isodihydrolavanduril acetate, Terpinyl acetate, linalyl acetate, myrcenyl acetate, bornyl acetate, menthyl propionate, linalyl propionate, nerol, carveol, perilla alcohol, geraniol, safranal, citral, perilaaldehyde, citronellyloxyacetaldehyde, hydroxycitronellal, berbenone, d- Carvone, L-carvone, piperitone, piperitenone, citronellyl formate, isobornyl acetate, menthyl acetate, citronellyl acetate, carbyl acetate, acetic acid Dimethyloctanyl, neryl acetate, isopulegol acetate, dihydrocarbyl acetate, nopyr acetate, geranyl acetate, bornyl propionate, neryl propionate, carbyl propionate, terpinyl propionate, citronellyl propionate, isobornyl propionate, linalyl isobutyrate, isobutyric acid Examples include neryl, linalyl butyrate, neryl butyrate, terpinyl isobutyrate, terpinyl butyrate, geranyl isobutyrate, citronellyl butyrate, citronellyl hexanoate, menthyl isovalerate, β-caryophyllene, cedrene, bisabolen, hydroxycitronellol, farnesol, and rhinosyl isobutyrate. It is done. Among these, from the viewpoint of solubility, it is more preferable to use limonene and p-menthane, and it is particularly preferable to use p-menthane.

  Note that the configuration of the adhesive layer interposed between the wafer and the support plate is not limited to that composed only of the adhesive, and, for example, a reaction layer may be provided on the adhesive. The reaction layer may contain a light absorber that is decomposed by, for example, laser light. In this case, the cleaning device 80 is configured to irradiate the reaction layer with light and decompose it to clean the wafer after peeling the wafer and the support plate to remove deposits such as an adhesive. Just do it.

  Examples of the light absorber included in the reaction layer include graphite powder, iron, aluminum, copper, nickel, cobalt, manganese, chromium, zinc, tellurium and other fine metal powders, black titanium oxide and other metal oxide powders, carbon Black or aromatic diamino metal complex, aliphatic diamine metal complex, aromatic dithiol metal complex, mercaptophenol metal complex, squarylium compound, cyanine dye, methine dye, naphthoquinone dye, anthraquinone dye, etc. Dyes or pigments. The light absorber may be in the form of a film including a metal vapor deposition film.

  According to the cleaning device 80, the protective film that protects the exposed surface of the dicing tape and the dicing frame that protrudes outside the outer edge portion of the wafer from the cleaning liquid that the first cleaning means 5 uses to clean the wafer. Since the protective film forming means 4 is provided, it is possible to prevent the adhering matter from adhering to the dicing tape and the dicing frame. In addition, according to the cleaning device 80, it is possible to prevent deposits from adhering to the dicing tape and the dicing frame, so that contamination of the dicing blade and the robot arm that come into contact with them can be prevented, and the wafer can be removed again. It can also prevent contamination.

  Furthermore, according to the cleaning device 80, since the dicing tape and the dicing frame are protected by the protective film, they can be prevented from being deteriorated by the cleaning liquid. As a result, even a dicing tape and a dicing frame that are not resistant to the cleaning liquid can be suitably used.

[Cleaning method]
The cleaning method according to the present invention is a cleaning method for cleaning a substrate in which an adhesive tape is attached to one side and a frame portion is attached to the outer periphery of the adhesive tape, and the outer side of the outer edge portion of the substrate is outside. A protective film forming step of forming a protective film for protecting the exposed adhesive tape and the frame portion from the cleaning liquid, and a cleaning step of cleaning the substrate with the cleaning liquid after forming the protective film; It is characterized by including. A cleaning method according to an embodiment of the present invention will be described with reference to FIG. FIG. 2 is a diagram illustrating a processing flow of the cleaning method according to the embodiment of the present invention.

  In this embodiment, the cleaning method uses the wafer 1 after the support plate is peeled off as the object to be processed, and a dicing tape 2 having a dicing frame 3 attached to the outer periphery thereof is attached to the wafer 1. Yes. In the cleaning method, the support plate is attached to the surface of the wafer facing away from the surface on which the dicing tape is attached via an adhesive, and the support plate is removed from the wafer before the cleaning step described later. A peeling step for peeling the film may be further provided. That is, in this embodiment, the support plate is peeled off before the protective film forming step, but the support plate may be peeled off after the protective film forming step.

  As shown in FIG. 2A, deposits such as a residual adhesive 10 and a dissolved residue 11 that adhere to the wafer 1 and the support plate are attached to the surface of the wafer 1. . In the following processing, the case where the above-described cleaning device 80 is used will be described.

  As shown in FIG. 2B, first, the protective film material 12 is supplied to the exposed surface of the dicing tape 2 and the dicing frame 3. The method for supplying the protective film material 12 is not particularly limited. For example, the protective film material 12 may be discharged from the nozzle-shaped protective film forming means 4 as shown in FIG.

  The protective film material 12 may be supplied so as to cover at least the exposed surface of the dicing tape 2 and the dicing frame, and is preferably supplied until the outer peripheral portion of the dicing frame 3 is reached. Further, before supplying the protective film material 12, for example, the surface of the wafer 1 may be masked in advance. As a result, it is possible to prevent a protective film from being formed on the surface of the wafer 1 to be cleaned and failing to perform sufficient cleaning.

  Further, when the protective film material 12 is supplied, the object to be processed such as the wafer 1 may be rotated. Thereby, the discharged protective film material 12 can be efficiently spread on the dicing tape 2 and the dicing frame 3. Further, before the material 12 is supplied to the dicing tape 2 and the dicing frame 3, the dicing tape 2 and the dicing frame 3 may be irradiated with ultraviolet rays. Thereby, the wettability of the protective film material 12 to the dicing tape 2 and the dicing frame 3 can be improved.

  Thereafter, as shown in FIG. 2C, the discharged protective film material 12 is dried to form a protective film 13 (protective film forming step). The drying may be natural drying, but may be performed while rotating the object to be processed, for example, as indicated by an arrow in FIG. In addition, the drying method is not limited to this, For example, you may dry using oven, a hotplate, etc., and you may apply hot air and dry.

  Next, the wafer 1 is cleaned using a cleaning liquid (cleaning step). In the cleaning process, the deposits remaining on the wafer 1 from which the support plate has been peeled are cleaned and removed. The cleaning method of the wafer 1 is not particularly limited, but the cleaning liquid 14 may be discharged onto the wafer 1 from the nozzle-shaped first cleaning means 5 as shown in FIG. In this way, by discharging the cleaning liquid 14 onto the wafer 1, the dissolved residue 11 together with the remaining adhesive 10 can be washed away and removed from the wafer 1 ((e) of FIG. 2).

  Further, when the cleaning liquid 14 is discharged, the target object such as the wafer 1 may be rotated. Thereby, the cleaning liquid 14 can be spread over a wide range by centrifugal force and can be cleaned more efficiently. At this time, the cleaning liquid may be discharged while the nozzle is swung.

  In the cleaning method according to the present embodiment, after the protective film for protecting the dicing tape 2 and the dicing frame 3 is formed in the protective film forming process, the wafer 1 is cleaned in the cleaning process. It may be formed of a soluble resin.

  After cleaning the wafer 1, the protective film 13 formed on the dicing tape 2 and the dicing frame 3 is removed ((f) in FIG. 2). Although it does not specifically limit as a removal method of a protective film, For example, when the protective film 13 consists of a water-soluble material, the water 15 is discharged with respect to the protective film 13 from the nozzle-shaped 2nd washing | cleaning means 6, The protective film 13 may be dissolved and removed. Thereafter, the object to be processed is dried ((g) in FIG. 2). At this time, the object to be processed may be further rotated.

  As described above, according to the cleaning method of the present embodiment, the exposed surface of the dicing tape and the dicing frame are protected at the time of cleaning the wafer, and thus adhesion of dissolved residues and the like can be prevented. Therefore, in the subsequent dicing process, transfer process, etc., the dicing blade and the robot arm are not contaminated by the deposit, and the contamination of the wafer by the deposit can be prevented due to the contamination. Further, since the cleaning liquid does not directly contact the dicing tape, the dicing tape is prevented from being deteriorated, and for example, the problem that the dicing tape swells hardly occurs. Further, since the cleaning liquid does not directly contact the dicing frame, it is possible to use a dicing frame that is not resistant to the cleaning liquid. For example, a resin dicing frame that is soluble in the cleaning liquid is used for weight reduction. It can also be used.

  Note that an adhesive or the like may remain on the edge portion of the wafer 1 after being cleaned by the above-described method, but this is an amount that does not hinder the subsequent process. However, if necessary, a step of cleaning the residual adhesive that may remain on the edge portion of the wafer 1 may be provided. Specifically, for example, before drying the object to be processed, the edge portion of the wafer 1 may be washed with water on the exposed surface of the dicing tape 2 and washed with a blade or brush. May be removed.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  The present invention can be suitably used, for example, in a semiconductor wafer manufacturing process.

DESCRIPTION OF SYMBOLS 1 Wafer 2 Dicing tape 3 Dicing frame 4 Protective film formation means 5 1st washing means (cleaning means)
6 Second cleaning means (removal means)
8 To-be-processed object accommodating part 40 Conveyance means 50 Application | coating unit 54 Peeling unit (peeling means)
60 Removal unit 80 Cleaning device

Claims (8)

A cleaning device comprising a cleaning means for cleaning a substrate having a pressure-sensitive adhesive tape attached to one side and a frame portion attached to the outer periphery of the adhesive tape with a cleaning liquid,
Protective film forming means for forming a protective film on the exposed surface of the adhesive tape that protrudes outward from the outer edge portion of the substrate and the frame portion, and protecting the same from a cleaning liquid, and not forming a protective film on the substrate further comprising a,
The protective film forming means forms a protective film by applying a protective film material insoluble in the cleaning liquid to the exposed surface of the adhesive tape and the frame and drying it. Characteristic cleaning device.   2. The cleaning apparatus according to claim 1, wherein the protective film forming means further applies the protective film material to an outer peripheral portion of the frame portion. As for the said board | substrate, the support plate is affixed through the adhesive agent on the surface which turns to the surface where the said adhesive tape is affixed,
It further comprises a peeling means for peeling the support plate from the substrate,
The cleaning apparatus according to claim 1, wherein the cleaning unit is configured to clean and remove deposits remaining on the substrate from which the support plate has been peeled off.   The cleaning apparatus according to claim 1, further comprising a removing unit that removes the protective film. The protective film is formed of a water-soluble protective film material that is insoluble in the cleaning liquid,
The cleaning apparatus according to claim 4, wherein the removing unit supplies water to the protective film to remove the protective film. A cleaning method for cleaning a substrate having an adhesive tape attached to one side and a frame portion attached to the outer periphery of the adhesive tape,
A protective film forming step of forming a protective film for protecting these from the cleaning liquid on the exposed surface of the adhesive tape that protrudes outside the outer edge portion of the substrate and the frame portion, and not forming a protective film on the substrate When,
A cleaning step of cleaning the substrate with a cleaning liquid after forming the protective film;
It encompasses,
In the protective film forming step, a protective film material insoluble in the cleaning liquid is applied to the exposed surface of the adhesive tape and the frame portion and dried to form a protective film. .   The cleaning method according to claim 6, wherein a substrate to which a frame portion formed of a resin soluble in the cleaning liquid is attached is cleaned. As for the said board | substrate, the support plate is affixed through the adhesive agent on the surface which turns to the surface where the said adhesive tape is affixed,
Before the cleaning step, further comprising a peeling step of peeling the support plate from the substrate,
The cleaning method according to claim 6 or 7, wherein, in the cleaning step, deposits remaining on the substrate from which the support plate has been peeled are cleaned and removed.

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