JP5969496B2 - クリスクロス書き込み戦略 - Google Patents
クリスクロス書き込み戦略 Download PDFInfo
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- 230000007246 mechanism Effects 0.000 claims description 36
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- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70583—Speckle reduction, e.g. coherence control or amplitude/wavefront splitting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Ink Jet (AREA)
Description
本出願は、2010年12月7日に出願された「Criss−cross writing strategy」と題する米国特許仮出願第61/420,416号の利益を主張するものである。これはまた、2010年12月15日に出願された「Direct writing of panels」と題する米国特許仮出願第61/423,503号の利益を主張するものである。これはさらに、2011年1月18日に出願された「Alternative Direct Panel Writing Systems and Method」と題する米国特許仮出願第61/433,925号の利益を主張するものである。
説明される技術は、スイープ方向及びクロススイープ方向の異なる度合いのコヒーレンスから結果として生じる非等方的特性を有する書き込み機構を適用する動作と、第1の書き込みと第2の書き込みとの間で加工片上に書き込まれるイメージパターンに対して回転される書き込み機構を用いてイメージパターンを加工片上に2回書き込む動作とを含み、回転された書き込み機構での書き込みが非等方的特性を平均する方法において具体化することができる。
Claims (13)
- 加工片上にマイクロリソグラフィパターンを書き込む方法であって、前記方法は、
スイープ方向及びクロススイープ方向における異なる度合いのコヒーレンス相互作用から生じる非等方的書き込み特性を有する書き込み機構を適用することと、
第1の書き込みと第2の書き込みとの間で加工片上に書き込まれるイメージパターンに対して回転される前記書き込み機構でイメージパターンを加工片上に2回書き込むことと、を含み、
前記回転された書き込み機構での書き込みが非等方的特性を平均する、方法。 - 前記第1の書き込みと前記第2の書き込みとの間のイメージパターンに対する前記書き込み機構の回転が40〜120度の範囲内にある、請求項1に記載の方法。
- 前記第1の書き込みと前記第2の書き込みとの間の前記書き込み機構の移動方向に対する前記書き込み機構の回転が40〜120度の範囲内にある、請求項1に記載の方法。
- 前記第1の書き込みが第1の方向に進み、前記第2の書き込みが第2の方向に進み、前記第1の方向又は前記第2の方向のいずれも、前記第1の書き込み及び前記第2の書き込みの最中に形成されるマイクロリソグラフィパターンにおける第1の優勢な方向に平行でもなく直交もしていない、請求項1に記載の方法。
- 前記第1の書き込みが第1の方向に進み、前記第2の書き込みが第2の方向に進み、前記第1の方向及び前記第2の方向が互いに直交している、請求項1〜4のいずれかに記載の方法。
- 前記書き込み機構においてSLMを用いることをさらに含む、請求項1〜5のいずれかに記載の方法。
- 前記書き込みプロジェクタと前記加工片との間の相対的な動きの第1の方向に直交する方向において、前記第1の書き込みの最中に書き込みプロジェクタがエネルギービームを走査する、請求項1〜6のいずれかに記載の方法。
- 前記書き込み機構においてレーザビームスキャナを用いることをさらに含む、請求項7に記載の方法。
- 前記書き込み機構において複数のレーザビームを用いることをさらに含む、請求項1〜8のいずれかに記載の方法。
- 前記第1の書き込みが第1の方向に進み、前記第2の書き込みが第2の方向に進み、前記第1の方向が、前記第1の書き込み及び前記第2の書き込みの最中に形成されるマイクロリソグラフィパターンにおける第1の優勢な方向に対して45度+/−2度の範囲内にあり、前記第2の方向が、前記第1の方向に対して90度+/−4度の範囲内にある、請求項1〜9のいずれかに記載の方法。
- 前記第1の書き込みが第1の方向に進み、前記第2の書き込みが第2の方向に進み、前記第1の方向が、前記第1の書き込み及び前記第2の書き込みの最中に形成されるマイクロリソグラフィパターンにおける第1の優勢な方向に25度及び65度の間にあり、前記第2の方向が、一次線配向に平行であるか又は直交している、請求項1〜10のいずれかに記載の方法。
- 複数の放射エネルギービームで各書き込み経路を書き込むことと、
送達される最大放射エネルギーが前記加工片にわたって変化し、且つ前記ストリップの中央よりも前記ストリップのエッジにおいてより少ないように、前記複数の放射エネルギービームのうちの幾つかの開始点及び終了点を前記加工片に対して互い違いにすることと、
隣接する書き込みスイープの重なり合うストリップを書き込み、隣接するストリップの重なり領域において複数の放射エネルギービームを変調するときに複数の放射エネルギービームを互い違いにすることを考慮に入れることと、
をさらに含む、請求項1〜11のいずれかに記載の方法。 - 請求項1〜11のいずれかに記載の方法を用いて加工片上に書き込む走査制御ハードウェア及びソフトウェアを含むマイクロリソグラフィ書き込みシステム。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42041610P | 2010-12-07 | 2010-12-07 | |
US61/420,416 | 2010-12-07 | ||
US42350310P | 2010-12-15 | 2010-12-15 | |
US61/423,503 | 2010-12-15 | ||
US201161433925P | 2011-01-18 | 2011-01-18 | |
US61/433,925 | 2011-01-18 | ||
PCT/EP2011/072140 WO2012076629A2 (en) | 2010-12-07 | 2011-12-07 | Criss-cross writing strategy |
Publications (2)
Publication Number | Publication Date |
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JP2014504006A JP2014504006A (ja) | 2014-02-13 |
JP5969496B2 true JP5969496B2 (ja) | 2016-08-17 |
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Application Number | Title | Priority Date | Filing Date |
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JP2013542535A Active JP5969496B2 (ja) | 2010-12-07 | 2011-12-07 | クリスクロス書き込み戦略 |
Country Status (6)
Country | Link |
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US (1) | US8767185B2 (ja) |
EP (1) | EP2649494B1 (ja) |
JP (1) | JP5969496B2 (ja) |
KR (1) | KR101906538B1 (ja) |
CN (1) | CN103270453B (ja) |
WO (1) | WO2012076629A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7403265B2 (en) | 2005-03-30 | 2008-07-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method utilizing data filtering |
WO2014140047A2 (en) * | 2013-03-12 | 2014-09-18 | Micronic Mydata AB | Method and device for writing photomasks with reduced mura errors |
KR102253995B1 (ko) * | 2013-03-12 | 2021-05-18 | 마이크로닉 아베 | 기계적으로 생성된 정렬 표식 방법 및 정렬 시스템 |
WO2018075100A1 (en) * | 2016-06-21 | 2018-04-26 | The Regents Of The University Of California | Mems-based spatial light modulator and method of forming |
US10714427B2 (en) | 2016-09-08 | 2020-07-14 | Asml Netherlands B.V. | Secure chips with serial numbers |
US10418324B2 (en) * | 2016-10-27 | 2019-09-17 | Asml Netherlands B.V. | Fabricating unique chips using a charged particle multi-beamlet lithography system |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69226511T2 (de) * | 1992-03-05 | 1999-01-28 | Micronic Laser Systems Ab, Taeby | Verfahren und Vorrichtung zur Belichtung von Substraten |
SE9800665D0 (sv) * | 1998-03-02 | 1998-03-02 | Micronic Laser Systems Ab | Improved method for projection printing using a micromirror SLM |
US6489984B1 (en) * | 1998-12-29 | 2002-12-03 | Kenneth C. Johnson | Pixel cross talk suppression in digital microprinters |
JP3731566B2 (ja) | 2002-06-28 | 2006-01-05 | ソニー株式会社 | 露光方法、マスク製造方法および半導体装置の製造方法 |
EP2151717A1 (en) * | 2008-08-05 | 2010-02-10 | ASML Holding N.V. | Full wafer width scanning using step and scan system |
US8442302B2 (en) | 2008-12-05 | 2013-05-14 | Micronic Laser Systems | Method and device using rotating printing arm to project or view image across a workpiece |
US8531755B2 (en) | 2009-02-16 | 2013-09-10 | Micronic Laser Systems Ab | SLM device and method combining multiple mirrors for high-power delivery |
IL198719A0 (en) * | 2009-05-12 | 2010-02-17 | Orbotech Ltd | Optical imaging system |
US8767175B2 (en) | 2010-03-05 | 2014-07-01 | Micronic Laser Systems Ab | 1.5D SLM for lithography |
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2011
- 2011-12-07 WO PCT/EP2011/072140 patent/WO2012076629A2/en active Application Filing
- 2011-12-07 JP JP2013542535A patent/JP5969496B2/ja active Active
- 2011-12-07 US US13/314,063 patent/US8767185B2/en active Active
- 2011-12-07 EP EP11796662.2A patent/EP2649494B1/en active Active
- 2011-12-07 CN CN201180061905.4A patent/CN103270453B/zh active Active
- 2011-12-07 KR KR1020137017764A patent/KR101906538B1/ko active IP Right Grant
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Publication number | Publication date |
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CN103270453B (zh) | 2016-04-13 |
CN103270453A (zh) | 2013-08-28 |
KR101906538B1 (ko) | 2018-10-10 |
US20120307219A1 (en) | 2012-12-06 |
KR20140027088A (ko) | 2014-03-06 |
US8767185B2 (en) | 2014-07-01 |
EP2649494A2 (en) | 2013-10-16 |
WO2012076629A2 (en) | 2012-06-14 |
EP2649494B1 (en) | 2014-08-20 |
JP2014504006A (ja) | 2014-02-13 |
WO2012076629A3 (en) | 2012-09-27 |
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