JP5969326B2 - Heat insulation mold - Google Patents

Description

  The present invention relates to a heat insulating mold used for injection molding.

  The injection molding method is a method in which molten resin is injected into a mold cavity at a high pressure and molded. When a heat insulating mold is applied to this mold, rapid temperature drop on the surface of the heat insulating mold during molding is prevented, transferability of the surface of the heat insulating mold is improved, and a molded product can be manufactured almost as designed. It has been known.

  As such a heat insulating mold, there has been proposed one in which a resin layer is mounted as a heat insulating resin layer on a metal substrate, and a metal layer is mounted as a surface layer on the resin layer.

JP 2008-212472 A

  By the way, when the metal layer in the said patent document 1 is formed thinly by plating etc., the intensity | strength of the metal layer itself becomes small, and there exists a tendency for durability of a heat insulation metal mold to become inadequate.

  On the other hand, when the metal layer is formed thick, the strength of the metal layer can be increased, but the heat insulating effect of the heat insulating resin layer is reduced and the transferability of the surface of the heat insulating mold tends to be poor.

  The present invention has been made in view of the above points, and an object of the present invention is to propose a heat insulating mold that can improve durability while maintaining a good transferability of the surface of the heat insulating mold.

  In order to solve such a problem, the present invention provides a heat insulating mold in which a surface protective layer, a reinforcing layer, a heat insulating resin layer, and a mold base are laminated in this order from the front side, and the reinforcing layer is a longitudinal layer of the heat insulating resin layer. It has a longitudinal elastic modulus larger than an elastic modulus, and has a thermal permeability smaller than that of the surface protective layer.

In such a heat insulating mold, since a reinforcing layer having a longitudinal elastic modulus larger than the longitudinal elastic modulus of the heat insulating resin layer is provided between the surface protective layer and the heat insulating resin layer, there is no such reinforcing layer. In comparison with this, even if the surface protective layer is thin, the durability of the heat insulating mold can be improved.
In addition, since this reinforcing layer has a thermal permeability smaller than that of the surface protective layer, it can effectively suppress a rapid temperature drop on the surface of the heat insulating mold during molding. The transferability of the heat insulating mold surface can be made good.
In this way, a heat insulating mold that can improve the durability while providing a good transfer property on the surface of the heat insulating mold is provided.

  The reinforcing layer is preferably an inorganic member, and more preferably ceramic.

  When such a member is applied, a material having a longitudinal elastic modulus larger than that of the heat-insulating resin layer and having a heat permeability smaller than that of the surface protective layer can be selected as a reinforcing layer. A wider range of choices. Therefore, it is possible to obtain a reinforcing layer capable of improving the durability while making the transferability of the surface of the heat insulating mold favorable for various types of molding resins.

  When the reinforcing layer is an inorganic member (ceramics), the reinforcing layer and the surface protective layer are bonded by an inorganic binder contained in the reinforcing layer, or the reinforcing layer and the surface protective layer Is preferably bonded with an inorganic adhesive.

  In such a case, compared to the case where the reinforcing layer and the surface protective layer are bonded with an organic adhesive, the adhesive itself caused by the pressure applied by mold clamping or filling of the molten resin into the cavity is reduced. Compression deformation can be suppressed. Therefore, it can be prevented in advance that the heat insulating mold surface itself has an uneven shape due to the compression deformation of the adhesive and a molded product having a large difference from the design value is manufactured.

  It is preferable that the heat insulating resin layer also serves as an adhesive for the reinforcing layer and the mold base.

  In this case, since the adhesive member for bonding the heat insulating resin layer and the reinforcing layer or the mold base can be omitted, the heat insulating mold can be made thinner accordingly. In addition, since the heat insulation effect of the heat insulation resin layer can be prevented from changing due to the adhesive member that adheres the heat insulation resin layer and the reinforcing layer or the mold base, the heat insulation effect in the heat insulation mold can be accurately measured. Can get well.

  Moreover, it is preferable that the said reinforcement layer has a longitudinal elastic modulus larger than the longitudinal elastic modulus of the said surface protective layer.

  In such a case, the strength of the reinforcing layer itself can be increased, and as a result, the durability of the heat insulating mold can be further improved. Further, the surface protective layer can be made thinner, and the heat insulating effect in the heat insulating resin layer can be further improved.

  Moreover, it is preferable that the said reinforcement layer has a heat capacity smaller than the heat capacity of the said surface protective layer.

  In such a case, a rapid temperature drop on the surface of the heat insulating mold during molding can be significantly suppressed, and as a result, the transferability of the surface of the heat insulating mold can be further improved.

  As described above, according to the present invention, there is provided a heat insulating mold that can improve the durability while keeping the transferability of the surface of the heat insulating mold in a good state.

It is sectional drawing which shows the heat insulation metal mold | die in this embodiment. It is a flowchart which shows the manufacturing method of the heat insulation metal mold | die in this embodiment. It is sectional drawing which shows the mode of a 1st mounting process. It is sectional drawing which shows the mode of the 1st step in a 2nd mounting process. It is sectional drawing which shows the mode of the 2nd step in a 2nd mounting process. It is sectional drawing which shows the mode of the 3rd step and the 4th step in a 2nd mounting process. It is sectional drawing which shows the mode of a shaving process. It is sectional drawing which shows the mode of the other adhesion | attachment in a surface protective layer and a reinforcement layer from the same viewpoint as FIG. 6 (B). It is sectional drawing which illustrates the heat insulation metal mold | die from which a cavity area | region becomes concave shape. It is sectional drawing which illustrates the heat insulation metal mold | die from which a cavity area | region becomes convex shape. It is sectional drawing which illustrates the other heat insulation metal mold | die in which a cavity area | region becomes flat shape.

  Hereinafter, preferred embodiments of a heat insulating mold according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a view showing a cross section of a heat insulating mold in the present embodiment. As shown in FIG. 1, the heat insulating mold 1 in the present embodiment includes a mold base 10, a heat insulating resin layer 20, a surface protective layer 30, and a reinforcing layer 40 as main components.

<About mold base>
The mold base 10 is obtained by subjecting a steel material to processing such as quenching. The thickness of the mold base 10 is not particularly limited, but is larger than at least the heat insulating resin layer 20, the surface protective layer 30, and the reinforcing layer 40.

  Examples of the material of the mold base 10 include metals, alloys, and the like. Specifically, for example, tool steel such as alloy tool steel, die steel or high-speed tool steel, martensitic stainless steel, etc. It is said.

  In the case of this embodiment, a plurality of screw holes 11 penetrating in the vertical direction of the surface of the peripheral portion are formed in the peripheral portion of the one surface S1 of the mold base 10. A spacer 12 that defines the thickness T of the heat insulating resin layer 20 is formed at the opening edge on the one surface S1 side of these screw holes 11.

<Insulation resin layer>
The heat insulating resin layer 20 is a resin layer that suppresses a rapid temperature drop on the surface of the heat insulating mold during molding, and also serves as an adhesive for the mold base 10 and the reinforcing layer 40. This adhesive force is 0.1 [MPa] or more.

Moreover, the thickness T of the heat insulating resin layer 20 is in the range of 0.2 [mm] to 1.5 [mm], and the thermal permeability is in the range of 500 to 1500 [J / (s ^0.5 m ² K)]. The thermal conductivity is in the range of 0.3 to 3 [W / (mK)], and the longitudinal elastic modulus is in the range of 4 to 50 [GPa].

  The material of the heat insulating resin layer 20 is a thermosetting resin. Specific examples of the thermosetting resin include epoxy acrylate resin, phenol resin, epoxy resin, melamine resin, urea resin, unsaturated polyester resin, alkyd resin, polyurethane, and thermosetting polyimide.

  The thermosetting resin may contain inorganic particles called fillers as a reinforcing agent. The shape of the inorganic particles is preferably spherical, and the average particle size is preferably in the range of 1 to 100 [μm]. Moreover, the content rate of an inorganic particle is good in the range of 60 to 90 weight%. Specific examples of such inorganic particles include glass beads.

Further, the relationship between the thermal conductivity of the heat insulating resin layer 20 (thermosetting resin in a cured state) and the thickness T of the heat insulating resin layer 20 is such that the thermal conductivity is λ [W / (mK)] When the thickness T is t [mm], there is a relationship of λ / t = 1000 [W / (m ² K)]. The thickness T of the heat insulating resin layer 20 corresponds to the height of the spacer 12.

<About surface protective layer>
The surface protective layer 30 is a surface layer of the heat insulating mold 1 that protects the heat insulating resin layer 20, and is a steel material that has been subjected to processing such as quenching. The thickness of the surface protective layer 30 is in the range of 0.2 [mm] to 1.5 [mm].

  Examples of the material of the surface protective layer 30 include metals, alloys, and the like. Specifically, for example, alloy tool steel, die steel, tool steel, martensitic stainless steel and other steel materials, or chromium, There are thin films such as zinc, nickel and diamond.

  In the present embodiment, the central region of the surface protective layer 30 is a flat cavity region CAR. Note that the cavity region CAR is a surface region in contact with the space to be molded. In the region NAR other than the cavity region CAR, a plurality of screw holes 31 extending in the vertical direction from the one surface S2 of the surface protective layer 30 are formed. The drilling positions of these screw holes 31 are relatively the same as the drilling positions of the screw holes 11 of the mold base 10.

  One surface S2 of the surface protective layer 30 is the back surface opposite to the surface in contact with the space to be molded, and faces the one surface S1 of the mold base 10 with the heat insulating resin layer 20 and the reinforcing layer 40 therebetween. The one surface S2 of the surface protective layer 30 and the one surface S1 of the mold base 10 are substantially parallel to each other, and the distance between the one surface S1 and the one surface S2 has the same relationship at any position in the surface. is there.

<Reinforcing layer>
The reinforcing layer 40 is a layer that reinforces the surface protective layer 30, has a longitudinal elastic modulus larger than that of the heat insulating resin layer 20, and has a thermal permeability smaller than that of the surface protective layer 30. An inorganic member is bonded to the surface protective layer 30 with an inorganic binder contained in the inorganic member. This adhesive force is 0.1 [MPa] or more. Moreover, the thickness of the reinforcement layer 40 shall be in the range of 0.1 [mm]-1.5 [mm]. The longitudinal elastic modulus is also called a longitudinal elastic modulus or Young's modulus.

  Such a reinforcing layer 40 is not particularly limited as long as it is an inorganic member having a longitudinal elastic modulus larger than that of the heat insulating resin layer 20 and having a thermal permeability smaller than that of the surface protective layer 30. Specifically, for example, there are ceramics such as zirconia and aluminum oxide, and minerals such as silica and talc. Examples of inorganic binders include hydraulic materials such as cement and hydraulic alumina, latent hydraulic materials such as blast furnace granulated slag and amorphous silica, and sodium silicate.

  In the case of this embodiment, a plurality of screw holes 41 penetrating in the vertical direction of the surface of the peripheral portion are formed in the peripheral portion of the reinforcing layer 40, and the drilling positions of these screw holes 41 are located on the mold base 10. The screw holes 11 and the surface protective layer 30 are located at the same positions as the positions where the screw holes 31 are formed.

<Effects>
As described above, as shown in FIG. 1, the heat insulating mold 1 of the present embodiment is laminated in the order of the surface protective layer 30, the reinforcing layer 40, the heat insulating resin layer 20, and the mold base 10 from the front side. The reinforcing layer 40 has a longitudinal elastic modulus larger than that of the heat insulating resin layer 20 and has a thermal permeability smaller than that of the surface protective layer 30.

  In such a heat insulating mold 1, the reinforcing layer 40 having a longitudinal elastic modulus larger than the longitudinal elastic modulus of the heat insulating resin layer 20 is provided between the surface protective layer 30 and the heat insulating resin layer 20. Compared to the case where the reinforcing layer 40 is not provided, the durability of the heat insulating mold 1 can be improved even if the surface protective layer 30 is thin.

  In addition, since the reinforcing layer 40 has a heat permeability smaller than that of the surface protective layer 30, it is possible to effectively suppress a rapid temperature drop on the heat insulating mold surface during molding. The transfer property of the surface of the heat insulating mold can be made good.

  Thus, the heat insulation mold 1 of the present embodiment can improve the durability while keeping the transferability of the surface of the heat insulation mold in a good state.

  By the way, when the reinforcement layer 40 which has a longitudinal elastic modulus larger than the longitudinal elastic modulus of the heat insulation resin layer 20 is made larger than the longitudinal elastic modulus of the surface protective layer 30, it can raise the intensity | strength of the reinforcement layer 40 itself. As a result, the durability of the heat insulating mold 1 can be further improved.

  In addition, when performing machining such as embossing and patterning, the surface of the heat insulating mold 1 needs to have a hardness that enables the machining. Therefore, it is preferable to apply the reinforcing layer 40 having a longitudinal elastic modulus larger than the longitudinal elastic modulus of the surface protective layer 30 from the viewpoint of obtaining a hardness that allows machining.

  Further, when the reinforcing layer 40 having a heat permeability smaller than that of the surface protective layer 30 has a heat capacity smaller than that of the surface protective layer 30, the surface of the heat insulating mold at the time of molding is used. As a result, the transferability of the surface of the heat insulating mold can be further improved.

  In the present embodiment, the reinforcing layer 40 is an inorganic member, and the reinforcing layer 40 is bonded to the surface protective layer 30 with an inorganic binder contained in the inorganic member. For this reason, compared with the case where the reinforcing layer 40 and the surface protective layer 30 are bonded with an organic adhesive, compression of the adhesive itself due to pressure applied by mold clamping or filling of the molten resin into the cavity during molding is performed. Deformation can be suppressed. Therefore, it can be prevented in advance that the heat insulating mold surface itself has an uneven shape due to the compression deformation of the adhesive and a molded product having a large difference from the design value is manufactured.

  Furthermore, in the case of this embodiment, the heat insulating resin layer 20 also serves as an adhesive for the reinforcing layer 40 and the mold base 10. For this reason, the adhesive member which adhere | attaches the heat insulation resin layer 20, the reinforcement layer 40, or the metal mold | die base | substrate 10 can be abbreviate | omitted, and the heat insulation metal mold | die 1 can be reduced in thickness by that much. Moreover, since it can prevent beforehand that the heat insulation effect of the heat insulation resin layer 20 changes according to the adhesive member which adhere | attaches the heat insulation resin layer 20, the reinforcement layer 40, or the metal mold | die base | substrate 10, the heat insulation metal mold | die 1 The heat insulation effect in can be obtained with high accuracy.

  Further, in the case of the present embodiment, as shown in FIG. 1, the region NAR other than the cavity region of the surface protective layer 30 that is the surface layer of the heat insulating mold 1, the reinforcing layer 40, and the mold base 10 are formed by bolts BT. It is fixed.

  For this reason, the surface protective layer 30 is peeled off from the reinforcing layer 40 by the force that acts when the mold is clamped, when the molten resin is filled, or when the molded product is released without affecting the cavity region CAR due to the bolt BT. Further, the reinforcing layer 40 can be prevented from peeling off from the heat insulating resin layer 20. As a result, the durability of the heat insulating mold 1 can be further improved.

Further, in the case of the present embodiment, when the thermal conductivity of the heat insulating resin layer 20 is λ [W / (mK)] and the thickness T of the heat insulating resin layer 20 is t [mm], λ / t = 1000 [W / (M ² K)].

Here, the physical properties of the heat insulating resin layer were determined using an analytical model in which a molding resin layer having a thickness of 2 mm was injected into the cavity of the heat insulating mold in which the surface of the mold layer having a thickness of 100 mm was coated with the heat insulating resin layer. The results of analyzing the influence of the thickness are shown in the following table.

  Each temperature shown in the table is a temperature (hereinafter referred to as a boundary temperature) at a thickness of 1 mm from the center of the molding resin layer to the heat insulating resin layer. In this analysis model, the molding resin is polycarbonate, the initial temperature of the molding resin layer is 300 ° C., the initial temperature of the heat insulating resin layer and the mold layer is 100 ° C., and the end portion of the mold layer (the heat insulating resin). The temperature on the side opposite to the side facing the layer was constant at 100 ° C.

  As shown in “1” to “6” in the above table, when the thermal conductivity λ and the thickness T in the heat insulating resin layer have a relationship of λ / t = 1000, the material of the heat insulating resin layer and the heat penetration It was found that even if the rates were different, the transition of the boundary temperature converged almost uniformly.

  On the other hand, as shown in “7” of the above table, it was found that when the value of λ / t is much smaller than 1000, the temperature lowering time of the boundary temperature is extremely slow. In addition, although not shown in the said table | surface, it turns out that the fall width per unit time becomes small, so that the value of (lambda) / t becomes smaller than 1000.

  Further, as indicated by “8” in the above table, it was found that when the value of λ / t is significantly larger than 1000, the temperature drop time of the boundary temperature is extremely fast. In addition, although not shown in the said table | surface, it turns out that the fall width per unit time of boundary temperature becomes large, so that the value of (lambda) / t becomes larger than 1000.

  That is, as long as the relationship of λ / t = 1000 is satisfied, the heat insulating resin layer has a heat insulating effect that the boundary temperature becomes equal to or higher than the glass transition temperature during the injection period of the molding resin and immediately falls below the glass transition temperature after the injection. It can be obtained with a thickness of 20. For this reason, it is possible to strictly control the heat insulation effect that becomes higher than the glass transition temperature of the molding resin during the injection period of the molding resin and immediately falls below the glass transition temperature after injection. Therefore, while improving the durability, it is possible to realize good transferability during the injection period of the molding resin and to shorten the cooling time after the injection period.

  By the way, when the heat insulation resin layer 20 in this embodiment is made to contain an inorganic filler, the strength of the heat insulation resin layer 20 itself can be increased by the inorganic filler, and as a result, the durability of the heat insulation mold is further improved. be able to. In addition, it is effective that the inorganic filler is spherical, the average particle size of the inorganic filler is in the range of 1 to 100 μm, and the content of the inorganic filler is in the range of 60 to 90% by weight. It is a condition.

  Next, an example of the manufacturing method in the heat insulation metal mold | die 1 mentioned above is demonstrated.

  FIG. 2 is a flowchart showing a method for manufacturing the heat insulating mold 1 in the present embodiment. As shown in FIG. 2, the manufacturing method of the heat insulation metal mold | die 1 in this embodiment is equipped with the preparation process P1, the 1st mounting process P2, the 2nd mounting process P3, and the shaving process P4 as a main process.

<Preparation process P1>
This preparation process P1 prepares the mold base 10, an uncured thermosetting resin that is a precursor of the heat insulating resin layer 20, a steel material to be the surface protective layer 30, and a precursor of the reinforcing layer 40. It is a process to do.

  Specifically, as the mold base 10, for example, a product obtained by subjecting a rectangular parallelepiped steel material to processing such as quenching is prepared. A screw hole 11 is formed at a predetermined portion on the periphery of the mold base 10.

  As the uncured thermosetting resin, for example, a material in which a base material and a curing agent are mixed to adjust the fluidity is prepared. If necessary, a reinforcing agent such as an inorganic filler and other additives are mixed together with the base material and the curing agent.

  As the steel material to be used as the surface protective layer 30, a material obtained by subjecting a plate material having a substantially rectangular shape having the same area as the horizontal surface of the mold base 10 to a quenching process or the like is prepared. The thickness of the steel material 50 is greater than the thickness of the surface protective layer 30.

  As a precursor for the reinforcing layer 40, for example, a material in which ceramic particles, an inorganic binder, and a dispersant are mixed to adjust the fluidity is prepared. In addition, a filler and another additive are mixed with a ceramic particle, an inorganic binder, and a dispersing agent as needed.

<First mounting process P2>
The first mounting step P2 is a step of forming the reinforcing layer 40 using the precursor of the reinforcing layer 40 and mounting the reinforcing layer 40 and the steel material 50.

  Specifically, first, as shown in FIG. 3A, the precursor of the reinforcing layer 40 is sprayed or painted on one surface of the steel material 50 to form a precursor layer 60 having a predetermined thickness. .

  Next, the precursor layer 60 is heated in a heating furnace, for example. As a result, the curing of the precursor layer 60 proceeds, and as shown in FIG. 3B, the reinforcing layer 40 of the inorganic member is formed in a state where it is adhered to the steel material 50 by the inorganic binder contained in the reinforcing layer 40. Is done.

  Next, as shown in FIG. 3C, the screw holes 31 and 41 are provided at portions relatively the same as the screw holes 11 of the mold base 10 with respect to the reinforcing layer 40 and the steel material 50, respectively. Drilled.

<Second mounting process P3>
This 2nd mounting process P3 is a process of mounting the reinforcement layer 40 with which the steel material 50 was mounted | worn, and the metal base | substrate 10 with the heat insulation resin layer 20. FIG.

  Specifically, as a first step, as shown in FIG. 4, the uncured thermosetting resin 70 is made of gold so as to be equal to or higher than the height of the spacer 12 formed on the one surface S1 side of the mold base 10. It is applied on one surface S1 of the mold base 10.

  As a second stage, as shown in FIG. 5, the reinforcing layer 40 is placed on the mold base 10 with the one surface S1 of the mold base 10 and the one surface of the reinforcing layer 40 to which the steel material 50 is attached facing each other. Placed. Thereby, one surface S1 of the mold base 10 and one surface of the reinforcing layer 40 are equidistant at any position within the surface via the spacer 12.

  As a third stage, as shown in FIG. 6A, a bolt BT is passed through the screw hole 11 of the mold base 10, the screw hole 41 of the reinforcing layer 40, and the screw hole 31 of the steel material 50. The mold base 10, the reinforcing layer 40, and the steel material 50 are fixed. As a result, the uncured thermosetting resin 70 is pressed.

  As a fourth stage, the uncured thermosetting resin 70 is heated in, for example, a heating furnace in a state where the uncured thermosetting resin 70 is pressed. As a result, curing of the uncured thermosetting resin 70 proceeds, and as shown in FIG. 6B, the heat insulating resin layer 20 bonds the reinforcing layer 40 and the metal substrate 10 sandwiching the heat insulating resin layer 20 to each other. It is formed in the state.

  As described above, in the second mounting step P3, the spacer 12 is disposed between the one surface S1 of the mold base 10 and the one surface of the reinforcing layer 40 to which the steel material 50 is mounted so as to avoid the vertical direction of the cavity region. The uncured thermosetting resin 70 is heated while the mold base 10 is pressed.

  For this reason, even if the uncured thermosetting resin 70 has a certain thickness or more by the spacer 12 disposed between the mold base 10 and the reinforcing layer 40, the thickness unevenness of the mold base 10 is reduced. It can be greatly suppressed by pressing. As a result, the heat insulating resin layer 20 can be accurately formed with the height of the spacer 12 as the thickness of the heat insulating resin layer 20.

  In the case of the present embodiment, the spacer 12 is formed integrally with the mold base 10. Therefore, as long as the reinforcing layer 40 to which the steel material 50 is mounted is disposed on the mold base 10, the mold base 10. The spacer 12 is disposed between the reinforcing layer 40 and the reinforcing layer 40. Therefore, the arrangement process of the spacer 12 can be simplified while maintaining the accuracy of the arrangement position of the spacer 12.

<Machining process P4>
This cutting process P4 is a process of cutting the opposite side of the steel material 50 from the side on which the reinforcing layer 40 is mounted to create the surface of the heat insulating mold 1.

  Specifically, as shown in FIG. 7, for example, the entire surface opposite to the one surface of the steel material 50 to which the reinforcing layer 40 is attached is cut flat to make the flat cavity region CAR of the heat insulating mold 1. A surface protective layer 30 having a surface is formed.

  Thus, the heat insulation metal mold | die 1 as shown in FIG. 1 is manufactured by passing through the above-mentioned preparation process P1, the 1st mounting process P2, the 2nd mounting process P3, and the scraping process P4 in order.

  The above-described embodiment is merely an example, and the present invention is not limited to the above-described embodiment.

  For example, in the above embodiment, the reinforcing layer 40 is an inorganic member having a longitudinal elastic modulus larger than the longitudinal elastic modulus of the heat insulating resin layer 20 and having a thermal permeability smaller than that of the surface protective layer 30. It was. However, an organic member having a longitudinal elastic modulus larger than that of the heat insulating resin layer 20 and smaller than that of the surface protective layer 30 may be applied as the reinforcing layer 40. As such an organic member, for example, there is a member filled with a filler at a higher density than the heat insulating resin layer 20.

  In addition, when an inorganic member is applied as the reinforcing layer 40 as in the above embodiment, the heat having a longitudinal elastic modulus larger than the longitudinal elastic modulus of the heat insulating resin layer 20 and smaller than the thermal permeability of the surface protective layer 30 is used. The range of materials that can be selected as the reinforcing layer 40 having the penetration rate is widened. For this reason, it is preferable that an inorganic member is applied as the reinforcing layer 40 from the viewpoint of improving durability while maintaining good transferability on the surface of the heat insulating mold for various types of molding resins. Moreover, it is especially preferable that ceramic is applied among inorganic members.

Moreover, in the said embodiment, the reinforcement layer 40 was adhere | attached with the steel material 50 (surface protection layer before cutting out) with the inorganic binder contained in the reinforcement layer 40. FIG. However, the reinforcing layer 40 and the steel material 50 (surface protective layer before shaving) may be bonded with an inorganic adhesive. The inorganic adhesive can be generated by, for example, a base material, a curing agent, and a filler. Examples of the substrate include alkali metal silicate, phosphate, and silica sol.
Examples of the curing agent when the base material is an alkali metal silicate type include, for example, oxides or hydroxides such as Zn, Mg and Ca, silicides or silicofluorides such as Na, K and Ca, Al and Zn. And phosphates such as Ca, Ba, and Mg. Examples of the curing agent when the base material is phosphate-based include oxides or hydroxides such as Mg, Ca, Zn, and Al, Mg and Ca silicates, and group 2 borates. When the substrate is made of silica sol, a curing agent is often not used. Further, as the filler, for example, there is a refractory powder having a low reactivity with the binder.
In addition, when bonding the reinforcement layer 40 and the steel material 50 with an inorganic adhesive agent, a part of manufacturing method of the heat insulation metal mold | die 1 mentioned above is changed.
That is, in the preparation step P1 in the above embodiment, the precursor of the reinforcing layer 40 was prepared. On the other hand, in the preparation step P1 in the case where the reinforcing layer 40 and the steel material 50 are bonded with an inorganic adhesive, for example, the reinforcing layer 40 obtained by firing a plate-like ceramic green sheet and the inorganic adhesive are prepared. The
In the first mounting step P <b> 2 in the embodiment, the precursor layer 60 formed on one surface of the steel material 50 is heated and the reinforcing layer 40 is bonded to the steel material 50 with an inorganic binder contained in the reinforcing layer 40. On the other hand, in the first mounting step P2 in the case where the reinforcing layer 40 and the steel material 50 are bonded with an inorganic adhesive, the inorganic adhesive is applied to one surface of the reinforcing layer 40 or the steel material 50, for example, as shown in FIG. The reinforcing layer 40 and the steel material 50 are bonded through the inorganic adhesive 80.

  In the above embodiment, the flat cavity region CAR is cut out. However, the concave cavity region CAR may be cut out as shown in FIG. 8, for example, as shown in FIG. The cavity region CAR may be cut out.

The heat insulating mold shown in FIG. 9 is different from the heat insulating mold 1 of the above embodiment in that it has a surface protective layer 30 (steel material 50) and a mold base 10 having a shape different from that of the above embodiment.
Specifically, with respect to one surface S1 of the mold base 10 shown in FIG. 9, the mold base 10 of the above-described embodiment in which the one surface S1 is flat in that a concave portion having a substantially central region is formed. Is different.
Further, the surface protection of the above-described embodiment in which the one surface S2 is flat in that a convex portion with a substantially central region is formed on one surface S2 of the surface protection layer 30 (steel material 50) shown in FIG. It is different from the layer 30 (steel material 50).
Such a heat-insulating mold is subjected to the above-mentioned preparation process P1, first mounting process P2, and second mounting process P3 in this order, and then in the shaving process P4, from the surface opposite to the one surface of the steel material 50, It can manufacture by cutting out the concave surface along the convex part.

The heat insulating mold shown in FIG. 10 is different from the heat insulating mold 1 of the above embodiment in that it has a surface protective layer 30 (steel material 50) and a mold base 10 having a shape different from that of the above embodiment.
Specifically, with respect to one surface S1 of the mold base 10 shown in FIG. 10, the mold base 10 of the above-described embodiment in which the one surface S1 is flat in that a convex portion whose substantially central region is raised is formed. Is different.
Further, the surface protective layer of the above embodiment in which the one surface S2 is flat in that a concave portion having a substantially central region is formed on one surface S2 of the surface protective layer 30 (steel material 50) shown in FIG. 30 (steel material 50).
Such a heat-insulating mold is subjected to the above-mentioned preparation process P1, first mounting process P2, and second mounting process P3 in this order, and then in the shaving process P4, from the surface opposite to the one surface of the steel material 50, It can manufacture by cutting out the convex surface along the recessed part.

As shown in FIG. 11, the cavity region CAR has a flat shape, but a convex portion is formed in which the substantially central region of the one surface S <b> 1 of the mold base 10 is raised, and the surface protective layer 30 (steel material 50). A concave portion in which a substantially central region of one surface S2 is recessed may be formed.
In short, the shape of the cavity region CAR, the shape S1 of the mold base 10, and the shape S2 of the surface protection layer 30 (steel material 50) are not limited to the shapes shown in the above embodiment and FIGS. The shape of can be widely applied. The same applies to the shape of the reinforcing layer 40.

  Moreover, in the said embodiment, although the cavity area | region CAR formed in the steel material 50 (surface protective layer 30) was made into one, you may be made into two or more. When the cavity area CAR is two or more, each cavity area may be in an independent state, each cavity area may be in a connected state, or connected to an independent cavity area. A cavity region in a state may be mixed.

In the above-described embodiment, the uncured thermosetting resin 70 is applied to the one surface S <b> 1 of the mold base 10, and the steel material 50 is placed on the mold base 10. However, an uncured thermosetting resin 70 may be applied to one surface of the reinforcing layer 40 attached to the steel material 50, and the mold base 10 may be placed on the steel material 50.
Further, after the steel material 50 is placed on the one surface S <b> 1 of the mold base 10, the uncured thermosetting resin 70 is filled between the mold base 10 and the reinforcing layer 40 attached to the steel material 50. May be. Furthermore, after the steel material 50 is placed on one surface S1 of the mold base 10 in the container in which the uncured thermosetting resin 70 is placed, the mold base 10 and the steel material 50 are placed in the placement state. You may make it take out from a container.
In short, in the second mounting step P3, the steel material 50 and the mold base 10 are arranged with a gap of a predetermined distance between one surface of the reinforcing layer 40 mounted on the steel material 50 and one surface S1 of the mold base 10. An uncured thermosetting resin may be disposed in the gap.

  In the above embodiment, the mold base 10 is pressed against the steel material 50 by terminating the peripheral portions of the mold base 10 and the steel material 50 with the bolts BT. However, the steel material 50 may be pressed against the mold base 10, or one of the mold base 10 and the steel material 50 may be pressed against the other by a method other than termination.

Moreover, in the said embodiment, although the spacer 12 was formed integrally with one surface S1 of the metal mold | die base | substrate 10, you may form integrally with one surface of the steel material 50. FIG. Further, although the spacer 12 is formed at the opening edge of the screw hole 21 in the mold base 10, it may be formed at the opening edge of the screw hole 11 of the steel material 50, and between the steel material 50 and the mold base 10. If so, it may be other than the opening edge.
In short, the spacer 12 may be disposed at any position between the one surface of the steel material 50 and the one surface S1 of the mold base 10 as long as the position avoids the vertical direction of the cavity region CAR. Alternatively, it may be integral with the mold base 10 or separate.

  In the above embodiment, no processing is performed on the surface of the cavity region CAR. However, surface processing such as embossing may be performed.

  The present invention can be used in the field of handling injection molded articles.

DESCRIPTION OF SYMBOLS 1 ... Thermal insulation mold 10 ... Mold base 20 ... Thermal insulation resin layer 30 ... Surface protection layer 40 ... Reinforcement layer 50 ... Steel material 60 ... Inorganic solvent layer 70 ... Uncured thermosetting resin 80 ... Inorganic adhesive CAR ... Cavity region P1 ... Preparation process P2 ... First mounting process P3 ... Second mounting process P4 ... Machining process

Claims (8)

It is a heat insulating mold laminated in the order of a surface protective layer, a reinforcing layer, a heat insulating resin layer, a mold base from the front side,
The reinforcing layer, the has a larger longitudinal elastic modulus than the longitudinal elastic modulus of the heat insulating resin layer, it has a low thermal effusivity than the thermal effusivity of the surface protective layer,
The heat insulating mold, wherein the reinforcing layer has a thickness equal to or less than a thickness of the heat insulating resin layer . The heat insulation mold according to claim 1, wherein the reinforcing layer is an inorganic member. The heat insulation mold according to claim 2, wherein the reinforcing layer is ceramic. The heat insulating mold according to claim 2 or 3, wherein the reinforcing layer and the surface protective layer are bonded by an inorganic binder contained in the reinforcing layer. The heat insulation mold according to claim 2 or 3, wherein the reinforcing layer and the surface protective layer are bonded with an inorganic adhesive. The said heat insulation resin layer serves as the adhesive agent with respect to the said reinforcement layer and the said mold base | substrate, The heat insulation metal mold | die of any one of Claims 1-5 characterized by the above-mentioned. The heat insulation mold according to any one of claims 1 to 6, wherein the reinforcing layer has a longitudinal elastic modulus larger than that of the surface protective layer. The heat insulation mold according to any one of claims 1 to 7, wherein the reinforcing layer has a heat capacity smaller than a heat capacity of the surface protective layer.

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