JP5957824B2 - Processing system - Google Patents

Description

The present invention relates to a processing system that performs drilling on processed paper.

2. Description of the Related Art Conventionally, there has been a processing apparatus that uses a sewing machine blade to punch a processed paper (for example, Patent Document 1).
However, the conventional processing apparatus has the following problems.
・ Surfaces on the opposite side of the processed surface would bulge, so when stored in roll form, the bulges overlapped and wrinkles occurred on the processed paper. It also looked bad.
-Since the height of the sewing machine blade must be finely adjusted, for example, it was difficult to set the same conditions as the previous time, and workability was poor.
-As the machining progressed, the sewing machine blades would be worn out, so it was necessary to replace them.

JP 2000-61888 A

An object of the present invention is to provide a laser processing apparatus, a laser processing method, a processing sheet , and a processing system that prevent swelling of the surface opposite to the processing surface and that have good workability.

  The present invention solves the problems by the following means. In addition, in order to make an understanding easy, although the code | symbol corresponding to embodiment of this invention is attached | subjected and demonstrated, it is not limited to this. In addition, the configuration described with reference numerals may be improved as appropriate, or at least a part thereof may be replaced with another configuration.

-1st invention is a laser irradiation part (31) which irradiates a laser beam, and a laser irradiation position moving part (10, 20) which moves the laser irradiation position (P) of the said laser beam with respect to a processing paper (W, 300W) , 32), and a control unit (53, 53a, 53b) for controlling a laser irradiation unit and a laser irradiation position moving unit, the control unit changing the output of the laser beam, and a laser for the processing paper By performing at least one of changing the irradiation time, hole processing of at least two holes (61, 62, 361, 362) having different depths on the movement locus of the laser irradiation position of the processed paper is performed. The hole processing is repeated, and at least two holes having different depths are connected to each other, and continuous hole processing is performed to form a continuous uneven shape by continuous processing. When a laser machining apparatus according to claim.
-2nd invention is with respect to the processed paper (200W, 400W) formed by at least two layers of an upper layer and a lower layer (200W-2,400W-2) rather than the said upper layer (200W-1,400W-1). A laser irradiation unit (31) for irradiating a laser beam, a laser irradiation position moving unit (10, 20, 32) for moving a laser irradiation position of the laser beam on the processing paper, a laser irradiation unit, and a laser irradiation position movement A control section (53, 53a, 53b) for controlling the section, wherein the control section performs laser processing on the processed paper and performs half-cut processing (261, 460) or perforation processing on the upper layer. This is a featured laser processing apparatus.
-3rd invention is the laser processing apparatus of 2nd invention, The said control part (53, 53a, 53b) changes the output of the said laser beam, and changes the laser irradiation time with respect to the said processing paper, By performing at least one of the above, at least two holes (261, 262) having different depths are processed on the movement locus of the laser irradiation position of the processed paper (200W), and the at least two A shallow one (261) of the holes is formed in the upper layer (200W-1), and a deep one (262) of the at least two holes is formed in the lower layer (200W-2). This is a laser processing apparatus.
-4th invention is the laser processing apparatus of 3rd invention, The said control part (53, 53a, 53b) performs a half cut process (261) to the said upper layer (200W-1), and the said lower layer (200W) -2) is a laser processing apparatus characterized by performing perforation processing (262).
-The fifth invention is the laser processing apparatus according to any one of the first to fourth inventions, wherein the control section (53, 53a, 53b) sets the depth of the hole at the end of the processed paper, It is a laser processing apparatus characterized by making it deeper than the depth of the hole inside the said edge part.

-6th invention changes the laser irradiation process which irradiates a laser beam, the laser irradiation position movement process which moves the laser irradiation position of the said laser beam with respect to a processing paper (W, 300W), and the output of the said laser beam And at least one of changing the laser irradiation time with respect to the processing paper, at least two holes (61, 61) having different depths on the movement locus of the laser irradiation position (P) of the processing paper. 62, 361, 362) and the hole processing step are repeated, and at least two hole portions having different depths are connected to form a continuous uneven shape by continuous processing. And a continuous hole portion machining step.
-7th invention is with respect to the processed paper (200W, 400W) formed by at least 2 layers of an upper layer (200W-1,400W-1) and a lower layer (200W-2,400W-2) rather than the said upper layer. , A laser irradiation step of irradiating a laser beam, a laser irradiation position moving step of moving the laser irradiation position (P) of the laser beam with respect to the processed paper, and a laser processing of the processed paper to half-cut only the upper layer A laser processing method including processing (261, 460) or laser processing for perforation.

-8th invention performs at least 1 of changing the output of a laser beam, and changing laser irradiation time, and at least 2 hole part from which the depth differs on the movement locus | trajectory of a laser irradiation position Are processed papers (W, 300 W) that are connected to each other and have a continuous uneven shape.
The ninth invention is a processed paper formed of at least an upper layer and two layers lower than the upper layer, wherein only the upper layer is half-cut or perforated by laser processing. Processing paper (200 W, 400 W).

According to the present invention, the following effects can be obtained.
In the first, sixth, and eighth inventions, the adjustment work is easy because the output of the laser beam and the irradiation time may be changed. Moreover, processing accuracy can be improved. Moreover, since the continuous uneven | corrugated shape is formed by continuously processing the at least 2 hole part from which depth differs, the perforation process by a half cut can be performed. Furthermore, since the surface opposite to the processing side does not bulge, it is not bulky during storage, and the generation of wrinkles can be suppressed.

  In the second, seventh, and ninth inventions, the upper layer of the two or more layers is subjected to half-cut processing or perforation processing by changing the laser beam output and irradiation time. Like the eighth invention, the adjustment work is easy, the processing accuracy can be improved, and the generation of wrinkles can be suppressed.

In the third invention, since the shallow one of the at least two holes is formed in the upper layer and the deep one is formed in the lower layer, different processing can be performed on the upper layer and the lower layer.
In the fourth invention, the upper layer is half cut and the lower layer is perforated. For example, by adhering with an adhesive that can be peeled between layers, a part of the upper layer can be easily peeled off from the lower layer, Moreover, it can suppress that a lower layer will isolate | separate at this time.

  According to the fifth aspect of the invention, since the depth of the end portion of the processed paper is processed to be shallow, the strength of the processed portion at the end portion of the processed paper becomes stronger than the inner side, so that the processed paper is cut carelessly. It can be suppressed and handling becomes easy.

It is a figure explaining the composition of in-line processing system 1 of a 1st embodiment. 6 is a top view illustrating a state in which the laser irradiation position P according to the first embodiment moves on the processing paper W. FIG. FIG. 3 is a cross-sectional view of a processed paper W for explaining a process of perforation processing of the first embodiment, and a top view for explaining a method of using the processed paper W. It is a flowchart of the setting process of the laser output of 1st Embodiment. It is sectional drawing of the processing paper 200W explaining the process of the laser processing of 2nd Embodiment, and a top view explaining the usage method of the processing paper 200W. FIG. 10 is a cross-sectional view and a top view of a processing sheet 300W for explaining a laser processing step of a third embodiment, and a perspective view for explaining a method for using the processing sheet 300W. It is sectional drawing of the processing paper 400W explaining the process of the laser processing of 4th Embodiment, and a top view explaining the usage method of the processing paper 400W.

(First embodiment)
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram illustrating a configuration of an inline processing system 1 according to the first embodiment.
In the embodiment, the direction in which the processed paper W flows is the feed direction X, the direction perpendicular to the feed direction X among the surface directions of the processed paper W is the depth direction Y, and the normal direction of the surface of the processed paper W is the vertical direction Z. And
The inline processing system 1 is a processing system capable of producing a continuous form or the like by performing laser processing and printing on the processing paper W in a series of steps by connecting the laser processing unit 30 and the printer 40 in-line.
The inline processing system 1 includes a feed roller 2, a take-up roller 3, a front roller 10, a rear roller 20, a laser processing unit 30, a printer 40, and a management device 50.

The feed roller 2 is a roller around which a processed paper W (work) before being processed is wound, and is provided on the upstream side X1 in the feed direction X.
The take-up roller 3 is a roller that takes up the processed paper W after processing, and is provided on the downstream side X2 in the feed direction X.

The front roller 10 and the rear roller 20 are rollers for feeding the processed paper W to the downstream side X2. The front roller 10 and the rear roller 20 are arranged so as to sandwich the laser processing unit 30 in the feed direction X.
The front roller 10 and the rear roller 20 are mechanically connected to a servo motor (not shown) and are driven by the servo motor.

The laser processing unit 30 is a device that performs laser processing on the processed paper W. The laser processing unit 30 can perform, for example, drilling processing, perforation processing, marking processing, half-cut processing, marginal processing, and the like. The laser processing unit 30 is a so-called XY scanner that scans the processing paper W with the laser light L in the feeding direction X and the depth direction Y.
The laser processing unit 30 includes a laser irradiation unit 31 and an irradiation position changing unit 32.

The laser irradiation unit 31 is a light source that irradiates the laser light L, and is a laser oscillation element or the like.
The irradiation position changing unit 32 is a device that changes the irradiation direction of the laser light L from the laser irradiation unit 31. The irradiation position changing unit 32 includes a mirror 32a and pulse motors 32X and 32Y.
The mirror 32 a is a member that reflects the laser light L from the laser irradiation unit 31. The mirror 32a is a so-called galvanometer mirror, and is supported so as to be rotatable around the axis in the feed direction X and around the axis in the depth direction Y. The mirror 32a is rotationally driven to move the laser irradiation position P on the processed paper W of the laser irradiation unit 31 in the feeding direction X and the depth direction Y.

The pulse motor 32X is a motor that rotationally drives the mirror 32a about the axis in the feed direction X. The pulse motor 32Y is a motor that rotationally drives the mirror 32a about the axis in the depth direction Y.
The delivery roller 2, the take-up roller 3, and the irradiation position changing unit 32 described above constitute a laser irradiation position moving unit that moves the laser irradiation position P on the processing paper W.

The printer 40 is a general-purpose inkjet printer that prints on the processed paper W. The printer 40 is disposed on the downstream side X <b> 2 of the laser processing unit 30.
The printer 40 includes a printer roller 41, a head 42, a printer storage unit 43, and a printer control unit 44.

The printer roller 41 is a device that feeds the processed paper W to the downstream side X2 inside the printer 40. The printer rollers 41 are disposed on the upstream side X1 and the downstream side X2 in the printer 40, respectively.
The head 42 is a device that actually injects and prints ink on the processed paper W.
The printer storage unit 43 is a storage device such as a hard disk or a semiconductor memory element for storing programs, information, and the like necessary for the operation of the printer 40. The printer storage unit 43 includes a print information storage unit 43a that stores print information.

  The printer control unit 44 is a control unit that comprehensively controls the printer 40. The printer control unit 44 is composed of, for example, a CPU (Central Processing Unit). The printer control unit 44 controls the printer roller 41 and the head 42 based on the printing information in the printer storage unit 43 to print on the processed paper W.

The management device 50 is a computer that comprehensively controls hardware such as the rollers 10 and 20 and the laser processing unit 30 before and after the inline processing system 1.
The management device 50 includes an operation unit 51, a management storage unit 52, and a management control unit 53.
The operation unit 51 is an input device such as a keyboard for operating the management device 50.
The management storage unit 52 is a storage device such as a hard disk or a semiconductor memory element for storing programs, information, and the like necessary for the operation of the management device 50. The management storage unit 52 includes a processing information storage unit 52a.
The machining information storage unit 52 a is a storage area that stores a machining shape in the laser machining unit 30.

The management control unit 53 is a control unit that comprehensively controls the management device 50. The management control unit 53 is composed of, for example, a CPU. The management control unit 53 reads and executes various programs stored in the management storage unit 52 as appropriate, thereby realizing various functions according to the present invention in cooperation with the hardware described above. The management control unit 53 includes a paper feed control unit 53a and a laser control unit 53b.
The paper feed control unit 53a is a control unit that performs feed control of the processed paper W by controlling the rotation of the front and rear rollers 10 and 20, the take-up roller 3, and the like.
The laser control unit 53b is a control unit that performs laser processing based on the processing information in the processing information storage unit 52a.
The processing of each control unit will be described later.

The perforation process of the inline processing system 1 will be described.
FIG. 2 is a top view for explaining a state where the laser irradiation position P of the first embodiment moves on the processing paper W. FIG.
FIG. 2A shows a state immediately after the start of perforation machining.
FIG. 2B shows a state in which the perforation is advanced as compared with FIG.
FIG. 3 is a cross-sectional view of the processed paper W for explaining the process of perforation processing according to the first embodiment, and a top view for explaining a method of using the processed paper W.
3A to 3D are cross-sectional views viewed from the downstream side X2, and FIG. 3E is a top view. FIG.3 (d) is dd section arrow sectional drawing of FIG.3 (e).

(Laser processing process)
As shown in FIG. 2A, the laser control unit 53b starts laser irradiation from the back end of the upper surface (processed surface) of the processed paper W sent from the feed roller 2 (laser irradiation process).
Since the front roller 10 and the rear roller 20 move the processed paper W to the downstream side X2 at the moving speed Vw by the control of the paper feed control unit 53a, even when the perforation is processed in parallel to the depth direction Y (see FIG. 2B). The laser control unit 53b controls the irradiation position changing unit 32 so that the laser irradiation position P moves to both the downstream side X2 and the near side Y1 (see arrow A).

  Note that the in-line processing system 1 may stop the processed paper W in the laser processing region by providing a buffer mechanism including a dancer roller or the like. In this case, the laser control unit 53b may control the irradiation position changing unit 32 so that the laser irradiation position P moves only to the near side Y1.

As shown in FIGS. 3A and 3B, the inline processing system 1 forms the bottomed shallow hole 61 and the deep hole 62 having different depths into a half-cut shape by laser processing. (Hole processing step). Which of the shallow hole 61 and the deep hole 62 is processed may be changed by changing at least one of the laser output of the laser irradiation unit 31 and the laser irradiation time. In the embodiment, an example in which the laser output of the laser irradiation unit 31 is changed will be described. The laser control unit 53b controls the laser output of the laser irradiation unit 31. The laser control unit 53b moves the laser irradiation position P on the processing paper W while changing the laser output of the laser irradiation unit 31 in two stages.
As shown in FIGS. 3C and 3D, the paper feed control unit 53 a controls the front and rear rollers 10 and 20, and the laser control unit 53 b controls the laser processing unit 30. The deep holes 62 are continuously processed so as to be adjacent (continuous hole processing step).
As shown in FIG. 3 (e), the shallow hole 61 and the deep hole 62 having different depths are continuously processed on the movement locus of the laser irradiation position P of the processing paper W, so that the uneven perforations 60 are formed. (In the embodiment, even a bottomed hole having no through hole is referred to as a perforation).

As shown in FIG. 3D, the user can easily separate the processed paper W on which the perforation 60 is formed from the perforation 60.
As shown in FIGS. 3C and 3D, the laser controller 53b forms shallow holes 61 at both ends of the processed paper W, and forms deep holes 62 inside the ends. doing. For this reason, since the strength of the end portion of the processed paper W is stronger than the inside thereof, it is possible to prevent the processed paper W from being cut carelessly and to be easily handled.

  Thus, since the in-line processing system 1 performs perforation on the processing paper W by laser processing, the bottom surface does not bulge like the perforation by the perforation blade, and the bottom surface is smooth. Further, in the perforation processing by the perforation blade, if the thickness or hardness of the processing paper varies, the degree of the perforation blade entering the processing paper may not be stable. On the other hand, since the perforation processing by laser processing can be removed from the surface of the processing paper W by a certain depth, the processing accuracy can be improved as compared with the perforation processing by the perforation blade.

(Printing process)
The processed paper W for which laser processing has been completed is conveyed to the printer 40 and printed.
The perforation processing of the embodiment does not form a through hole in the processed paper W. For this reason, even if the ink ejected from the head 42 of the printer 40 splashes, it does not adhere to the lower surface of the processed paper W, so that the processed paper W is not stained with ink.
That is, unlike the embodiment, in the case of a perforation having a through hole, the splashed ink reaches the lower surface side of the processed paper W through the through hole. In this case, there is a problem that ink adheres to the lower surface of the processed paper W and becomes dirty, and when the processed paper W is taken up, the ink also adheres to the upper surface of the processed paper W and becomes dirty. . In the embodiment, such a problem does not occur.

(Winding process)
The processed paper W for which printing has been completed is conveyed to the take-up roller 3 and taken up in a roll shape. Since the lower surface of the processed paper W is smooth, the processed paper W is not bulky during storage and can suppress wrinkling. In other words, unlike the embodiment, in the case of perforation processing with a perforation blade, a bulge is formed on the lower surface, and therefore, when wound in a roll shape, the bulge is superimposed and bulky and wrinkles are generated. There is. In the embodiment, such a problem does not occur.
Further, as described above, the processed paper W according to the embodiment does not become dirty with ink during winding.

Next, a description will be given of a laser output setting process performed before starting the above-described processing.
FIG. 4 is a flowchart of a laser output setting process according to the first embodiment.
First, in step S (hereinafter referred to as “S”) 1, the operator operates the operation unit 51 of the management device to set a laser output value for each deep hole 62 and shallow hole 61 and perform processing. For example, the operator can set the laser output value with reference to the laser output value obtained when the machining has been performed previously.

  In S10, the operator determines whether or not the depth of the shallow hole 61 of the processed paper W after processing is appropriate. As a method for determining the depth, for example, a method of confirming with the naked eye, a method of confirming with a magnifier or the like, a method of actually cutting the processed paper W from the perforations, and the like can be used. When the operator determines that the depth of the shallow hole 61 is appropriate (S10: YES), the process proceeds to S20. On the other hand, when the operator determines that the depth of the shallow hole 61 is not appropriate (S10: NO), the process proceeds to S11.

In S11, the operator determines whether or not the depth of the shallow hole 61 is deep. When it is determined that the shallow hole 61 is deep (S11: YES), the operator proceeds to S12. On the other hand, when it is determined that the shallow hole 61 is shallow (S11: NO), the operator proceeds to S13. ,
In S12, the operator operates the operation unit 51 to set to lower the laser output, and repeats the processes from S1.
In S13, the operator operates the operation unit 51 to make a setting for increasing the laser output, and repeats the processes from S1.

In S20 to S23, the operator performs the same process as the shallow hole 61 for the deep hole 62, and sets the laser output of the deep hole 62.
When the operator determines that the depth of the deep hole 62 is appropriate (S20: YES), the series of setting processes is ended (S30). Thereafter, the operator operates the inline processing system 1 to start actual processing.

In this way, the operator may confirm the state of the processed paper W and operate the operation unit 51 in order to adjust the depth of the shallow hole 61 and the deep hole 62. For this reason, setting work is easy.
Unlike the embodiment, when performing perforation with a sewing machine blade, to adjust the height of the sewing machine blade, etc. If this is the case, there is a problem in that a sewing machine blade must be newly produced. In the embodiment, such a problem does not occur.

  When the shallow hole 61 and the deep hole 62 are processed by changing the laser irradiation time, the irradiation position changing unit 32 of the laser processing unit 30 is set so that the laser scanning speed is set in two stages. That's fine. That is, the inline processing system 1 can form the shallow hole 61 if the scanning speed is high, and can form the deep hole 62 if the scanning speed is low. Even in this case, since the operator can set the irradiation position changing unit 32 using the operation unit 51, the setting operation is easy.

As described above, the inline processing system 1 of the present embodiment can perform perforation processing without generating a bulge on the lower surface.
Further, since the in-line processing system 1 performs laser processing, there is no problem of wear like a sewing machine blade, and there is no problem that the sewing machine blade is displaced. For this reason, the in-line processing system 1 has good workability and is easy to maintain.

(Second Embodiment)
Next, a second embodiment of the present invention will be described.
Note that, in the following description and drawings, the same reference numerals or the same reference numerals are given to the portions that perform the same functions as those in the first embodiment described above, and overlapping descriptions will be omitted as appropriate. Further, since the configuration of the inline processing system is almost the same as the configuration of FIG. 1 of the first embodiment, the same names and symbols as those of the first embodiment are used as appropriate.
FIG. 5 is a cross-sectional view of the processing paper 200W for explaining the laser processing steps of the second embodiment and a top view for explaining a method for using the processing paper 200W.
5 (a) and 5 (b) are cross-sectional views, and FIGS. 5 (c) and 5 (d) are top views. FIG.5 (b) is bb part arrow sectional drawing of FIG.5 (c).

As shown in FIG. 5A, the processed paper 200W is a tack paper composed of an upper layer 200W-1, a lower layer 200W-2, and a release paper 200W-3.
A peelable adhesive is applied to each of the layers 200Wa and 200Wb, and the upper layer 200W-1 and the lower layer 200W-2 are bonded in a peelable manner, and the lower layer 200W-2 and the release paper 200W-3 are bonded in a peelable manner. Is done.

As shown in FIG. 5B, the laser processing unit 30 of this embodiment performs laser processing so that the bottom of the shallow hole 261 matches the interlayer 200Wa and the bottom of the deep hole 262 matches the interlayer 200Wb. Laser processing can be performed by changing the output of the laser beam L and the laser irradiation time in two stages, as in the first embodiment (see FIGS. 2 and 3). Thereby, the laser processing part 30 of this embodiment can perform different processes on the upper layer 200W-1 and the lower layer 200W-2.
The depths of the shallow hole 261 and the deep hole 262 can be set in the same manner as the laser output setting process of the first embodiment (see FIG. 4).

  When the processed paper 200W is laser-processed in this way, as shown in FIGS. 5B and 5C, half-cut processing is performed, and the portion of the upper layer 200W-1 on the processing line 260 is laser-processed. Burned away by irradiation and removed. Further, deep holes 262 are formed in the lower layer 200W-2 at a predetermined interval and are perforated.

The method of using the processed paper 200W is as follows.
(1) As shown in FIG.5 (c), upper layer 200W-1 is peeled from lower layer 200W-2. The upper layer 200W-1 is in a state of being divided by a half cut. For this reason, upper layer 200W-1 can be easily peeled from lower layer 200W-2. Moreover, since the lower layer 200W-2 is not completely separated, it is possible to prevent the lower layer 200W-2 from being peeled off from the release paper 200W-3 when the upper layer 200W-1 is peeled off.
(2) As shown in FIG. 5D, the lower layer 200W-2 is peeled from the release paper 200W-3. In this case, for example, if the user presses one side (the upper side shown in FIG. 5D) of the lower layer 200W-2 with a finger and peels the other side (the lower side shown in FIG. 5D), the processing line 260 With this as the boundary, one side and the other side can be divided, and the other side can be easily peeled off.

  As described above, the inline processing system of the present embodiment can perform different processing on the upper layer 200W-1 and the lower layer 200W-2 of the processing paper 200W. Further, it is possible to manufacture a form or the like that can be easily separated by dividing the upper layer 200W-1 and can be easily separated by dividing the lower layer 200W-2.

(Third embodiment)
Next, a third embodiment of the present invention will be described.
FIG. 6 is a cross-sectional view and a top view of the processing paper 300W for explaining the laser processing steps of the third embodiment, and a perspective view for explaining a method for using the processing paper 300W.
6A is a cross-sectional view, FIG. 6B is a top view, and FIG. 6C is a perspective view. FIG. 6A is a cross-sectional view taken along the line aa in FIG.

  As shown in FIGS. 6A and 6B, the laser control unit 53b (see FIG. 1) performs half-cutting on both ends of the processing paper 300W on the processing line 360, as in the first embodiment. Thus, the shallow hole 361 is formed. Further, the laser control unit 53b forms one elongated deep hole 362 by half-cutting between the shallow holes 361 at both ends on the processing line 360. For this reason, the processed paper 300 </ b> W has an end portion that is stronger than the inside, as in the first embodiment, so that it can be prevented from being cut carelessly and can be handled easily.

  As shown in FIG. 6C, the user can fold the processed paper 300W in two by folding the processing line 360. In this case, since most of the processing line 360 is formed by the deep holes 362, the processing line 360 is easily bent. For this reason, the user can bend the processed paper 300W easily. Also in this case, since the strength of the end of the processing line 360 is strong, the processed paper 300W can be prevented from being cut from the end of the fold.

  As described above, the inline processing system according to the present embodiment can easily process the processed paper 300W and process the end portion with difficulty.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described.
FIG. 7 is a cross-sectional view of a processing sheet 400W for explaining a laser processing step of the fourth embodiment, and a top view for explaining a method for using the processing sheet 400W.
FIG. 7A is a cross-sectional view, and FIG. 7B is a top view. FIG. 7B is a cross-sectional view taken along the line aa in FIG.

As shown in FIG. 7A, the processed paper 400W is a tack paper composed of an upper layer 400W-1 and a lower layer 400W-2.
A peelable adhesive is applied to the interlayer 400Wa so that the upper layer 400W-1 and the lower layer 400W-2 are peelably bonded.

The laser processing unit 30 of this embodiment performs laser processing so that the bottom of the hole 461 coincides with the interlayer 400Wa.
The depth of the hole 461 can be set in the same manner as the laser output setting process of the first embodiment (see FIG. 4).
When the processed paper 400W is laser-processed in this way, it is half-cut and the portion of the upper layer 400W-1 on the processing line 460 is removed by laser irradiation.

The method of using the processed paper 400W is as follows.
As shown in FIG. 7B, the upper layer 400W-1 is peeled from the lower layer 400W-2. The upper layer 400W-1 is in a state of being divided by half cut. For this reason, the upper layer 400W-1 can be easily peeled from the lower layer 400W-2.

As described above, the inline processing system of the present embodiment can perform half-cut processing only on the upper layer 400W-1 of the processing paper 400W. Even in this case, similarly to the first embodiment, the processing can be performed without generating the swelling of the lower surface, the processing accuracy can be improved, and the setting work before the processing is easy.
The laser processing may be perforation processing only on the upper layer 400W-1 instead of half-cut processing.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications and changes can be made as in the modifications described later, and these are also included in the present invention. Within the technical scope. In addition, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments. It should be noted that the above-described embodiment and modifications described later can be used in appropriate combination, but detailed description thereof is omitted.

(Deformation)
(1) In the embodiment, the laser processing apparatus has shown an example in which a bottomed hole is formed, but the present invention is not limited to this. For example, the laser processing apparatus may form a through hole.

(2) In the embodiment, the example in which the laser processing unit is controlled by the laser control unit of the management control unit has been described, but the embodiment is not limited thereto. For example, the laser processing unit itself may be provided with a paper feed control unit, a laser control unit, and the like for laser processing.

DESCRIPTION OF SYMBOLS 1 Inline processing system 10 Front roller 20 Rear roller 30 Laser processing part 31 Laser irradiation part 32 Irradiation position change part 40 Printer 50 Management apparatus 51 Operation part 52 Management storage part 53 Management control part 53a Paper feed control part 53b Laser control part 61,261 , 361 Shallow hole 62,262,362 Deep hole 60 Perforation 200W-1,400W-1 Upper layer 200W-2,400W-2 Lower layer 200W-3 Release paper 260,360,460 Processing line W, 200W, 300W, 400W Paper

Claims (4)

A processing system including a laser processing device,
The laser processing apparatus is
A laser irradiation unit for irradiating a laser beam;
A laser irradiation position moving unit that moves a laser irradiation position of the laser beam on the processing paper;
A laser irradiation unit, a control unit for controlling the laser irradiation position moving unit,
The controller is
More and this changing the output of the laser beam, on the movement locus of the laser irradiation position of the working paper performs hole machining depth be bottomed at least two different holes,
The repeated a hole machining, provided the depth by concatenating at least two different holes, have rows continuous hole processing for forming a continuous irregular shape by continuous processing,
A roller for feeding the processed paper in a feeding direction;
An inkjet printer that is provided downstream of the laser processing apparatus in the feed direction and that prints by ejecting ink onto the laser processed paper;
The two bottomed hole portions prevent the ink ejected and splashed by the ink jet printer from adhering to the lower surface of the processed paper;
Machining system characterized by The processing system according to claim 1,
The processed paper is formed of at least two layers, an upper layer and a lower layer than the upper layer,
The control unit forms a shallow one of the at least two holes in the upper layer, and forms a deep one of the at least two holes in the lower layer,
Machining system characterized by The processing system according to claim 2,
The control unit performs half-cut processing on the upper layer and performs perforation processing on the lower layer,
Machining system characterized by In the processing system according to any one of claims 1 to 3,
The controller is configured to make the depth of the hole at the end of the processed paper shallower than the depth of the hole inside the end,
Machining system characterized by

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