JP5947117B2 - Fluorescent light emitting resin composition - Google Patents
Fluorescent light emitting resin composition Download PDFInfo
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- JP5947117B2 JP5947117B2 JP2012132940A JP2012132940A JP5947117B2 JP 5947117 B2 JP5947117 B2 JP 5947117B2 JP 2012132940 A JP2012132940 A JP 2012132940A JP 2012132940 A JP2012132940 A JP 2012132940A JP 5947117 B2 JP5947117 B2 JP 5947117B2
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- 239000011342 resin composition Substances 0.000 title claims description 49
- 125000004432 carbon atom Chemical group C* 0.000 claims description 83
- -1 rare earth ions Chemical class 0.000 claims description 81
- 229920005668 polycarbonate resin Polymers 0.000 claims description 37
- 239000004431 polycarbonate resin Substances 0.000 claims description 37
- 125000003118 aryl group Chemical group 0.000 claims description 30
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 125000003545 alkoxy group Chemical group 0.000 claims description 11
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 239000010419 fine particle Substances 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 8
- 125000003342 alkenyl group Chemical group 0.000 claims description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 7
- 125000003172 aldehyde group Chemical group 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 125000002102 aryl alkyloxo group Chemical group 0.000 claims description 6
- 125000004104 aryloxy group Chemical group 0.000 claims description 6
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 6
- 125000000000 cycloalkoxy group Chemical group 0.000 claims description 6
- 125000005843 halogen group Chemical group 0.000 claims description 6
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 238000006467 substitution reaction Methods 0.000 claims description 4
- 125000004429 atom Chemical group 0.000 claims description 3
- 150000001721 carbon Chemical group 0.000 claims description 3
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 63
- 150000001875 compounds Chemical class 0.000 description 39
- 238000000034 method Methods 0.000 description 36
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 30
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 30
- 239000004810 polytetrafluoroethylene Substances 0.000 description 30
- 239000003063 flame retardant Substances 0.000 description 28
- 229910052751 metal Inorganic materials 0.000 description 28
- 239000002184 metal Substances 0.000 description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 28
- 239000000178 monomer Substances 0.000 description 27
- 150000003839 salts Chemical class 0.000 description 26
- 239000000203 mixture Substances 0.000 description 25
- 238000000465 moulding Methods 0.000 description 25
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 24
- 229920001296 polysiloxane Polymers 0.000 description 24
- 239000002245 particle Substances 0.000 description 23
- 238000006243 chemical reaction Methods 0.000 description 22
- 239000003381 stabilizer Substances 0.000 description 21
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 238000003756 stirring Methods 0.000 description 19
- 239000003513 alkali Substances 0.000 description 18
- 239000000243 solution Substances 0.000 description 18
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 15
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000843 powder Substances 0.000 description 14
- 239000000047 product Substances 0.000 description 14
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 150000002989 phenols Chemical class 0.000 description 12
- 229910052783 alkali metal Inorganic materials 0.000 description 11
- 238000001746 injection moulding Methods 0.000 description 11
- 238000002156 mixing Methods 0.000 description 11
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- 229910052698 phosphorus Inorganic materials 0.000 description 10
- 239000011574 phosphorus Substances 0.000 description 10
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 9
- 229910019142 PO4 Inorganic materials 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- 150000001340 alkali metals Chemical class 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- 239000010452 phosphate Substances 0.000 description 8
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 8
- 229920000515 polycarbonate Polymers 0.000 description 8
- 239000004417 polycarbonate Substances 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 239000001294 propane Substances 0.000 description 8
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 8
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 6
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 229920000620 organic polymer Polymers 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 229910052708 sodium Inorganic materials 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000011575 calcium Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- 125000002524 organometallic group Chemical group 0.000 description 5
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 5
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 5
- 238000005809 transesterification reaction Methods 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- NUDSREQIJYWLRA-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=CC=2)=C1 NUDSREQIJYWLRA-UHFFFAOYSA-N 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 239000008346 aqueous phase Substances 0.000 description 4
- CJDPJFRMHVXWPT-UHFFFAOYSA-N barium sulfide Chemical compound [S-2].[Ba+2] CJDPJFRMHVXWPT-UHFFFAOYSA-N 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 4
- 150000004650 carbonic acid diesters Chemical class 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000012074 organic phase Substances 0.000 description 4
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910052700 potassium Inorganic materials 0.000 description 4
- 239000011591 potassium Substances 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- BRPSWMCDEYMRPE-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=C(O)C=C1 BRPSWMCDEYMRPE-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 3
- 0 CCC(*)(O[Si]1(*CC*1)C(C)O[Si](*)(*)*C)[Si](*)(*)*C Chemical compound CCC(*)(O[Si]1(*CC*1)C(C)O[Si](*)(*)*C)[Si](*)(*)*C 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 3
- 150000001342 alkaline earth metals Chemical class 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 229910052792 caesium Inorganic materials 0.000 description 3
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 3
- GRWZHXKQBITJKP-UHFFFAOYSA-L dithionite(2-) Chemical compound [O-]S(=O)S([O-])=O GRWZHXKQBITJKP-UHFFFAOYSA-L 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
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- 239000012760 heat stabilizer Substances 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- LVTHXRLARFLXNR-UHFFFAOYSA-M potassium;1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound [K+].[O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F LVTHXRLARFLXNR-UHFFFAOYSA-M 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910052701 rubidium Inorganic materials 0.000 description 3
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- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 3
- KLDXJTOLSGUMSJ-KVTDHHQDSA-N (3r,3ar,6r,6ar)-2,3,3a,5,6,6a-hexahydrofuro[3,2-b]furan-3,6-diol Chemical compound O[C@@H]1CO[C@@H]2[C@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-KVTDHHQDSA-N 0.000 description 2
- GVJHHUAWPYXKBD-UHFFFAOYSA-N (±)-α-Tocopherol Chemical compound OC1=C(C)C(C)=C2OC(CCCC(C)CCCC(C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 2
- 229940061334 2-phenylphenol Drugs 0.000 description 2
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 2
- XTEGBRKTHOUETR-UHFFFAOYSA-N 4-(4-hydroxy-3-methylphenyl)sulfonyl-2-methylphenol Chemical compound C1=C(O)C(C)=CC(S(=O)(=O)C=2C=C(C)C(O)=CC=2)=C1 XTEGBRKTHOUETR-UHFFFAOYSA-N 0.000 description 2
- CUAWUNQAIYJWQT-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxy-3,5-dimethylphenyl)ethyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C=2C=C(C)C(O)=C(C)C=2)C=2C=C(C)C(O)=C(C)C=2)=C1 CUAWUNQAIYJWQT-UHFFFAOYSA-N 0.000 description 2
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 2
- KOWHWSRFLBFYRR-UHFFFAOYSA-N 4-[1-[3-[2-(4-hydroxyphenyl)propyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)CC(C=1)=CC=CC=1CC(C)C1=CC=C(O)C=C1 KOWHWSRFLBFYRR-UHFFFAOYSA-N 0.000 description 2
- OKWDECPYZNNVPP-UHFFFAOYSA-N 4-[1-[4-[2-(4-hydroxyphenyl)propyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)CC(C=C1)=CC=C1CC(C)C1=CC=C(O)C=C1 OKWDECPYZNNVPP-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 2
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- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical compound [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 2
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- KLDXJTOLSGUMSJ-JGWLITMVSA-N Isosorbide Chemical compound O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-JGWLITMVSA-N 0.000 description 2
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- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
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- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
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- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- FUAAEMCCEGHVCH-UHFFFAOYSA-L strontium;benzenesulfonate Chemical compound [Sr+2].[O-]S(=O)(=O)C1=CC=CC=C1.[O-]S(=O)(=O)C1=CC=CC=C1 FUAAEMCCEGHVCH-UHFFFAOYSA-L 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- XLKZJJVNBQCVIX-UHFFFAOYSA-N tetradecane-1,14-diol Chemical compound OCCCCCCCCCCCCCCO XLKZJJVNBQCVIX-UHFFFAOYSA-N 0.000 description 1
- IFYFNVDTVZKNBZ-UHFFFAOYSA-N tetradecyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1O IFYFNVDTVZKNBZ-UHFFFAOYSA-N 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229960000984 tocofersolan Drugs 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000002088 tosyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C([H])([H])[H])S(*)(=O)=O 0.000 description 1
- HTCCWYQPPPBLQT-UHFFFAOYSA-N triacontyl 2-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCOC(=O)C1=CC=CC=C1O HTCCWYQPPPBLQT-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- DMEUUKUNSVFYAA-UHFFFAOYSA-N trinaphthalen-1-ylphosphane Chemical compound C1=CC=C2C(P(C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 DMEUUKUNSVFYAA-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- QOQNJVLFFRMJTQ-UHFFFAOYSA-N trioctyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OCCCCCCCC QOQNJVLFFRMJTQ-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- KCTAHLRCZMOTKM-UHFFFAOYSA-N tripropylphosphane Chemical compound CCCP(CCC)CCC KCTAHLRCZMOTKM-UHFFFAOYSA-N 0.000 description 1
- DCAFJGSRSBLEPX-UHFFFAOYSA-N tris(2,3-dibutylphenyl) phosphite Chemical compound CCCCC1=CC=CC(OP(OC=2C(=C(CCCC)C=CC=2)CCCC)OC=2C(=C(CCCC)C=CC=2)CCCC)=C1CCCC DCAFJGSRSBLEPX-UHFFFAOYSA-N 0.000 description 1
- OOZKMYBQDPXENQ-UHFFFAOYSA-N tris(2,3-diethylphenyl) phosphite Chemical compound CCC1=CC=CC(OP(OC=2C(=C(CC)C=CC=2)CC)OC=2C(=C(CC)C=CC=2)CC)=C1CC OOZKMYBQDPXENQ-UHFFFAOYSA-N 0.000 description 1
- AJHKJOCIGPIJFZ-UHFFFAOYSA-N tris(2,6-ditert-butylphenyl) phosphite Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=C1OP(OC=1C(=CC=CC=1C(C)(C)C)C(C)(C)C)OC1=C(C(C)(C)C)C=CC=C1C(C)(C)C AJHKJOCIGPIJFZ-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- QFGXDXGDZKTYFD-UHFFFAOYSA-N tris[2,3-di(propan-2-yl)phenyl] phosphite Chemical compound CC(C)C1=CC=CC(OP(OC=2C(=C(C(C)C)C=CC=2)C(C)C)OC=2C(=C(C(C)C)C=CC=2)C(C)C)=C1C(C)C QFGXDXGDZKTYFD-UHFFFAOYSA-N 0.000 description 1
- 235000019165 vitamin E Nutrition 0.000 description 1
- 229940046009 vitamin E Drugs 0.000 description 1
- 239000011709 vitamin E Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000004260 weight control Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 239000002076 α-tocopherol Substances 0.000 description 1
- 235000004835 α-tocopherol Nutrition 0.000 description 1
Landscapes
- Luminescent Compositions (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は蛍光発光性樹脂組成物に関する。さらに詳しくはLED光源の高い輝度を効率よく可視光に変換し、照明器具または表示器具に好適に用いることができる蛍光発光性樹脂組成物およびその成形体に関する。 The present invention relates to a fluorescent light-emitting resin composition. More specifically, the present invention relates to a fluorescent light-emitting resin composition that efficiently converts high luminance of an LED light source into visible light and can be suitably used for a lighting device or a display device, and a molded body thereof.
LED(発光ダイオード)とは、電流を流すと発光する半導体素子の一種であり、赤、緑、オレンジなどに加え、これまで難しいとされていた青色のLEDが実用化されたため、これらの組み合わせで白色を含む様々な色の光を作ることができるようになり、フルカラーの表示装置や照明、光ディスク装置のヘッドなどの用途における使用が拡大している。特に白色LEDは、照明器具や表示器具などへの利用が期待されるために、LEDの高効率化はこれらの用途への展開のために必要な技術とされている。 An LED (light-emitting diode) is a kind of semiconductor element that emits light when an electric current is applied. In addition to red, green, orange, etc., blue LEDs that have been considered difficult so far have been put to practical use. Light of various colors including white can be produced, and its use in applications such as full-color display devices, lighting, and heads of optical disk devices is expanding. In particular, white LEDs are expected to be used for lighting equipment, display equipment, and the like, and therefore, high efficiency of LEDs is considered a necessary technology for the development of these applications.
一般的に白色光は、可視光線の全域に渡って連続したスペクトルによって実現される光である。しかしながら、発光ダイオードはある狭い範囲の波長のみを発光するため、本来の意味での白色光は実現できない。しかし人間の眼には光の三原色の混合や補色関係にある2色の混合も白色に見えるので、これを白色光の代用とする方法がいくつか考案されている。この中で視感度の高い波長である黄色に蛍光する蛍光体と青色LEDとを組み合わせることによって、視覚上で大変に明るい白色LEDが開発されている。この中で、蛍光体とLEDとを具体的に組み合わせる方法としては、LED素子の封止樹脂中に蛍光体を分散・固定する方法が一般的であるが、この蛍光体が分散された蛍光発光性樹脂組成物には、従来エポキシ樹脂やシリコーン樹脂が用いられてきた。しかしながらエポキシ樹脂は、乾熱劣化による黄変や透明度の低さなど問題点があり、シリコーン樹脂は、ガスの透過性が高く、LED発光素子の劣化に起因する発光効率の低下という問題点がある。 In general, white light is light realized by a continuous spectrum over the entire visible light range. However, since the light emitting diode emits light only in a narrow range of wavelengths, the original white light cannot be realized. However, since the human eye sees a mixture of three primary colors of light and a mixture of two complementary colors as white, several methods have been devised to substitute this for white light. Among these, a white LED that is very bright visually has been developed by combining a blue LED and a fluorescent substance that fluoresces yellow, which has a wavelength with high visibility. Among these, as a method of specifically combining the phosphor and the LED, a method of dispersing and fixing the phosphor in the sealing resin of the LED element is generally used, but the fluorescent light emission in which the phosphor is dispersed is used. Conventionally, an epoxy resin or a silicone resin has been used for the conductive resin composition. However, the epoxy resin has problems such as yellowing due to dry heat deterioration and low transparency, and the silicone resin has a problem that the gas permeability is high and the light emission efficiency is lowered due to deterioration of the LED light emitting element. .
一方、ポリカーボネート樹脂を用いた蛍光発光性樹脂組成物は、視認性を向上させた電飾看板、照明ディスプレイ、交通標識、サインボード、スクリーンなどにおいて、好適に使用されている。特許文献1ではポリカーボネート樹脂およびアルミン酸塩を母結晶とする蛍光体粒子からなるポリカーボネート樹脂組成物が報告されている。特許文献2では、ポリカーボネート樹脂、紫外線発光顔料およびシラン化合物からなる熱可塑性樹脂組成物が報告されている。また特許文献3ではポリカーボネート樹脂、酸化イットリウム系蛍光体およびシラン化合物及び/又はシリコーン化合物からなる熱可塑性樹脂組成物が報告されている。更に特許文献4ではポリカーボネート樹脂および紫外線発光蛍光体からなる蛍光発光性透明ポリカーボネート樹脂組成物が報告されている。これらの報告はいずれも熱安定性を改良したり、特定の蛍光体を用いる事で、蛍光発光時の色相の良好な樹脂組成物を提供しているが、上記封止樹脂組成物としてみた場合、LEDの発光効率については述べられていない。発光効率を表す指標の一つとして導光性がある。一般的にポリカーボネートは透明性は良好であることが知られているが導光性については充分ではなく、従ってポリカーボネートに蛍光体を混合した従来の蛍光発光性樹脂組成物の導光性は更なる改良が求められている。 On the other hand, a fluorescent light-emitting resin composition using a polycarbonate resin is suitably used in an electric decoration signboard, an illumination display, a traffic sign, a sign board, a screen and the like with improved visibility. Patent Document 1 reports a polycarbonate resin composition comprising phosphor particles having a polycarbonate resin and aluminate as a mother crystal. Patent Document 2 reports a thermoplastic resin composition comprising a polycarbonate resin, an ultraviolet light emitting pigment, and a silane compound. Patent Document 3 reports a thermoplastic resin composition comprising a polycarbonate resin, an yttrium oxide phosphor and a silane compound and / or a silicone compound. Furthermore, Patent Document 4 reports a fluorescent light-emitting transparent polycarbonate resin composition comprising a polycarbonate resin and an ultraviolet light-emitting phosphor. All of these reports provide a resin composition with good hue at the time of fluorescence emission by improving the thermal stability or using a specific phosphor, but when seen as the sealing resin composition The luminous efficiency of the LED is not described. One of the indexes representing luminous efficiency is light guide. In general, polycarbonate is known to have good transparency, but the light guide property is not sufficient. Therefore, the light guide property of a conventional fluorescent light-emitting resin composition in which a phosphor is mixed with polycarbonate is further improved. There is a need for improvement.
本発明の目的はLED発光効率向上を目的とした光学特性の改良、具体的には導光性および色相に優れた蛍光発光性樹脂組成物およびその成形体を提供することにある。 An object of the present invention is to provide an improved optical property for the purpose of improving LED light emission efficiency, specifically, a fluorescent light-emitting resin composition excellent in light guiding properties and hue, and a molded product thereof.
本発明者らは上記目的を達成せんとして鋭意研究を重ねた結果、透明樹脂と蛍光材料からなる樹脂組成物に特定量の光拡散剤を配合することで、導光性および色相が向上するという驚くべき効果を見出し、本発明に到達した。 The inventors of the present invention have conducted intensive research to achieve the above-mentioned object, and as a result, by adding a specific amount of a light diffusing agent to a resin composition composed of a transparent resin and a fluorescent material, light guiding properties and hue are improved. The inventors have found a surprising effect and have reached the present invention.
すなわち、本発明によれば(1)(A)透明樹脂(A成分)、(B)受光することによって励起されて蛍光する蛍光材料(B成分)および(C)光拡散剤(C成分)からなる蛍光発光性樹脂組成物であって、C成分の含有量とB成分の含有量との重量比(C/B)が下記式(1)を満たすことを特徴とする蛍光発光性樹脂組成物が提供される。
0.01≦C/B<1.0 ・・・(1)
本発明のより好適な態様の一つは(2)A成分100重量部に対し、B成分1.0〜10.0重量部およびC成分0.05〜9.0重量部を含有することを特徴とする上記構成(1)に記載の蛍光発光性樹脂組成物である。
本発明のより好適な態様の一つは(3)A成分が下記一般式〔1〕で表される繰り返し単位からなるポリカーボネート樹脂であることを特徴とする上記構成(1)または(2)に記載の蛍光発光性樹脂組成物である。
本発明のより好適な態様の一つは(4)B成分が希土類イオンを含む無機蛍光材料であることを特徴とする上記構成(1)〜(3)のいずれかに記載の蛍光発光性樹脂組成物である。
本発明のより好適な態様の一つは(5)C成分が架橋構造を有する高分子微粒子からなることを特徴とする上記構成(1)〜(4)のいずれかに記載の蛍光発光性樹脂組成物である。
本発明のより好適な態様の一つは(6)上記構成(1)〜(5)のいずれかに記載の蛍光発光性樹脂組成物からなる成形体である。
本発明のより好適な態様の一つは(7)成形体がLEDを光源とする照明器具又は表示器具である上記構成(6)に記載の成形体である。
That is, according to the present invention, from (1) (A) a transparent resin (A component), (B) a fluorescent material (B component) that is excited and fluorescent by receiving light, and (C) a light diffusing agent (C component). A fluorescent light-emitting resin composition, wherein the weight ratio (C / B) of the content of the C component and the content of the B component satisfies the following formula (1): Is provided.
0.01 ≦ C / B <1.0 (1)
One of the more preferable embodiments of the present invention is (2) containing 1.0 to 10.0 parts by weight of B component and 0.05 to 9.0 parts by weight of C component with respect to 100 parts by weight of A component. The fluorescent light-emitting resin composition according to the above-described configuration (1).
One of the more preferred embodiments of the present invention is (3) the above constitution (1) or (2), wherein the component A is a polycarbonate resin comprising a repeating unit represented by the following general formula [1] The fluorescent light-emitting resin composition described.
One of the more preferable embodiments of the present invention is (4) the fluorescent light-emitting resin according to any one of the above constitutions (1) to (3), wherein the B component is an inorganic fluorescent material containing rare earth ions. It is a composition.
One of the more preferable embodiments of the present invention is (5) the fluorescent light-emitting resin according to any one of the above constitutions (1) to (4), wherein the component C comprises polymer fine particles having a crosslinked structure It is a composition.
One of the more preferable embodiments of the present invention is (6) a molded article made of the fluorescent light-emitting resin composition according to any one of the above-described configurations (1) to (5).
One of the more preferable aspects of the present invention is (7) the molded body according to the above configuration (6), wherein the molded body is a lighting apparatus or a display apparatus using an LED as a light source.
以下本発明について具体的に説明する。
(A成分:透明樹脂)
本発明のA成分として使用される透明樹脂としてはポリカーボネート樹脂、スチレン系樹脂、ポリメチルメタアクリレート樹脂、ポリエステル樹脂、エポキシ樹脂、シリコーン樹脂およびアクリルニトリル樹脂からなる群より選ばれる1種以上の熱可塑性樹脂が挙げられ、好ましくはポリカーボネート樹脂、スチレン系樹脂、ポリメチルメタアクリレート樹脂、ポリエステル樹脂、エポキシ樹脂、シリコーン樹脂であり、さらにより好ましくはポリカーボネート樹脂である。
The present invention will be specifically described below.
(A component: transparent resin)
The transparent resin used as the component A of the present invention is one or more thermoplastics selected from the group consisting of polycarbonate resins, styrene resins, polymethyl methacrylate resins, polyester resins, epoxy resins, silicone resins, and acrylonitrile resins. Examples of the resin include polycarbonate resins, styrene resins, polymethyl methacrylate resins, polyester resins, epoxy resins, and silicone resins, and even more preferable are polycarbonate resins.
本発明のA成分として使用されるポリカーボネート樹脂は、通常ジヒドロキシ化合物とカーボネート前駆体とを界面重縮合法、溶融エステル交換法で反応させて得られたものの他、カーボネートプレポリマーを固相エステル交換法により重合させたもの、または環状カーボネート化合物の開環重合法により重合させて得られるものである。ここで使用されるジヒドロキシ成分としては、通常芳香族ポリカーボネートのジヒドロキシ成分として使用されているものであればよく、ビスフェノール類でも脂肪族ジオール類でも良い。ビスフェノール類としては、例えば4,4’ −ジヒドロキシビフェニル、ビス(4−ヒドロキシフェニル)メタン、1,1−ビス(4−ヒドロキシフェニル)エタン、1,1−ビス(4−ヒドロキシフェニル)−1−フェニルエタン、2,2−ビス(4−ヒドロキシフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−メチルフェニル)プロパン、1,1−ビス(4−ヒドロキシフェニル)−3,3,5−トリメチルシクロヘキサン、2,2−ビス(4−ヒドロキシ−3,3’−ビフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−イソプロピルフェニル)プロパン、2,2−ビス(3−t−ブチル−4−ヒドロキシフェニル)プロパン、2,2−ビス(4−ヒドロキシフェニル)ブタン、2,2−ビス(4−ヒドロキシフェニル)オクタン、2,2−ビス(3−ブロモ−4−ヒドロキシフェニル)プロパン、2,2−ビス(3,5−ジメチル−4−ヒドロキシフェニル)プロパン、2,2−ビス(3−シクロヘキシル−4−ヒドロキシフェニル)プロパン、1,1−ビス(3−シクロヘキシル−4−ヒドロキシフェニル)シクロヘキサン、ビス(4−ヒドロキシフェニル)ジフェニルメタン、9,9−ビス(4−ヒドロキシフェニル)フルオレン、9,9−ビス(4−ヒドロキシ−3−メチルフェニル)フルオレン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン、1,1−ビス(4−ヒドロキシフェニル)シクロペンタン、4,4’−ジヒドロキシジフェニルエ−テル、4,4’−ジヒドロキシ−3,3’−ジメチルジフェニルエ−テル、4,4’−スルホニルジフェノール、4,4’−ジヒドロキシジフェニルスルホキシド、4,4’−ジヒドロキシジフェニルスルフィド、2,2’−ジメチル−4,4’−スルホニルジフェノール、4,4’−ジヒドロキシ−3,3’−ジメチルジフェニルスルホキシド、4,4’−ジヒドロキシ−3,3’−ジメチルジフェニルスルフィド、2,2’−ジフェニル−4,4’−スルホニルジフェノール、4,4’−ジヒドロキシ−3,3’−ジフェニルジフェニルスルホキシド、4,4’−ジヒドロキシ−3,3’−ジフェニルジフェニルスルフィド、1,3−ビス{2−(4−ヒドロキシフェニル)プロピル}ベンゼン、1,4−ビス{2−(4−ヒドロキシフェニル)プロピル}ベンゼン、1,4−ビス(4−ヒドロキシフェニル)シクロヘキサン、1,3−ビス(4−ヒドロキシフェニル)シクロヘキサン、4,8−ビス(4−ヒドロキシフェニル)トリシクロ[5.2.1.02,6]デカン、4,4’−(1,3−アダマンタンジイル)ジフェノール、1,3−ビス(4−ヒドロキシフェニル)−5,7−ジメチルアダマンタン、および下記一般式〔4〕
で表されるシロキサン構造を有するビスフェノール化合物等が挙げられる。脂肪族ジオール類としては、例えば2,2−ビス−(4−ヒドロキシシクロヘキシル)−プロパン、1,14−テトラデカンジオール、オクタエチレングリコール、1,16−ヘキサデカンジオール、4,4’−ビス(2−ヒドロキシエトキシ)ビフェニル、ビス{(2−ヒドロキシエトキシ)フェニル}メタン、1,1−ビス{(2−ヒドロキシエトキシ)フェニル}エタン、1,1−ビス{(2−ヒドロキシエトキシ)フェニル}−1−フェニルエタン、2,2−ビス{(2−ヒドロキシエトキシ)フェニル}プロパン、2,2−ビス{(2−ヒドロキシエトキシ)−3−メチルフェニル}プロパン、1,1−ビス{(2−ヒドロキシエトキシ)フェニル}−3,3,5−トリメチルシクロヘキサン、2,2−ビス{4−(2−ヒドロキシエトキシ)−3,3’−ビフェニル}プロパン、2,2−ビス{(2−ヒドロキシエトキシ)−3−イソプロピルフェニル}プロパン、2,2−ビス{3−t−ブチル−4−(2−ヒドロキシエトキシ)フェニル}プロパン、2,2−ビス{(2−ヒドロキシエトキシ)フェニル}ブタン、2,2−ビス{(2−ヒドロキシエトキシ)フェニル}−4−メチルペンタン、2,2−ビス{(2−ヒドロキシエトキシ)フェニル}オクタン、1,1−ビス{(2−ヒドロキシエトキシ)フェニル}デカン、2,2−ビス{3−ブロモ−4−(2−ヒドロキシエトキシ)フェニル}プロパン、2,2−ビス{3,5−ジメチル−4−(2−ヒドロキシエトキシ)フェニル}プロパン、2,2−ビス{3−シクロヘキシル−4−(2−ヒドロキシエトキシ)フェニル}プロパン、1,1−ビス{3−シクロヘキシル−4−(2−ヒドロキシエトキシ)フェニル}シクロヘキサン、ビス{(2−ヒドロキシエトキシ)フェニル}ジフェニルメタン、9,9−ビス{(2−ヒドロキシエトキシ)フェニル}フルオレン、9,9−ビス{4−(2−ヒドロキシエトキシ)−3−メチルフェニル}フルオレン、1,1−ビス{(2−ヒドロキシエトキシ)フェニル}シクロヘキサン、1,1−ビス{(2−ヒドロキシエトキシ)フェニル}シクロペンタン、4,4’−ビス(2−ヒドロキシエトキシ)ジフェニルエ−テル、4,4’−ビス(2−ヒドロキシエトキシ)−3,3’−ジメチルジフェニルエ−テル、1,3−ビス[2−{(2−ヒドロキシエトキシ)フェニル}プロピル]ベンゼン、1,4−ビス[2−{(2−ヒドロキシエトキシ)フェニル}プロピル]ベンゼン、1,4−ビス{(2−ヒドロキシエトキシ)フェニル}シクロヘキサン、1,3−ビス{(2−ヒドロキシエトキシ)フェニル}シクロヘキサン、4,8−ビス{(2−ヒドロキシエトキシ)フェニル}トリシクロ[5.2.1.02,6]デカン、1,3−ビス{(2−ヒドロキシエトキシ)フェニル}−5,7−ジメチルアダマンタン、3,9−ビス(2−ヒドロキシー1,1−ジメチルエチル)−2,4,8,10−テトラオキサスピロ(5,5)ウンデカン、1,4:3,6−ジアンヒドロ−D−ソルビトール(イソソルビド)、1,4:3,6−ジアンヒドロ−D−マンニトール(イソマンニド)、1,4:3,6−ジアンヒドロ−L−イジトール(イソイディッド)等が挙げられる。
The polycarbonate resin used as the component A of the present invention is usually obtained by reacting a dihydroxy compound and a carbonate precursor by an interfacial polycondensation method or a melt transesterification method, or a carbonate prepolymer by a solid phase transesterification method. Or obtained by polymerizing by a ring-opening polymerization method of a cyclic carbonate compound. The dihydroxy component used here may be any one that is usually used as a dihydroxy component of an aromatic polycarbonate, and may be a bisphenol or an aliphatic diol. Examples of bisphenols include 4,4′-dihydroxybiphenyl, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, and 1,1-bis (4-hydroxyphenyl) -1- Phenylethane, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, 1,1-bis (4-hydroxyphenyl) -3,3,5 -Trimethylcyclohexane, 2,2-bis (4-hydroxy-3,3'-biphenyl) propane, 2,2-bis (4-hydroxy-3-isopropylphenyl) propane, 2,2-bis (3-t- Butyl-4-hydroxyphenyl) propane, 2,2-bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxypheny) ) Octane, 2,2-bis (3-bromo-4-hydroxyphenyl) propane, 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane, 2,2-bis (3-cyclohexyl-4) -Hydroxyphenyl) propane, 1,1-bis (3-cyclohexyl-4-hydroxyphenyl) cyclohexane, bis (4-hydroxyphenyl) diphenylmethane, 9,9-bis (4-hydroxyphenyl) fluorene, 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, 1,1-bis (4-hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) cyclopentane, 4,4′-dihydroxydiphenyl ether, 4,4′-dihydroxy-3,3′-dimethyldiphenyl ether, 4,4′-sulfoni Diphenol, 4,4'-dihydroxydiphenyl sulfoxide, 4,4'-dihydroxydiphenyl sulfide, 2,2'-dimethyl-4,4'-sulfonyldiphenol, 4,4'-dihydroxy-3,3'-dimethyl Diphenyl sulfoxide, 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfide, 2,2′-diphenyl-4,4′-sulfonyldiphenol, 4,4′-dihydroxy-3,3′-diphenyldiphenyl sulfoxide 4,4′-dihydroxy-3,3′-diphenyldiphenyl sulfide, 1,3-bis {2- (4-hydroxyphenyl) propyl} benzene, 1,4-bis {2- (4-hydroxyphenyl) propyl } Benzene, 1,4-bis (4-hydroxyphenyl) cyclohexane, 1,3-bis (4-hydro Xylphenyl) cyclohexane, 4,8-bis (4-hydroxyphenyl) tricyclo [5.2.1.02,6] decane, 4,4 ′-(1,3-adamantanediyl) diphenol, 1,3-bis (4-Hydroxyphenyl) -5,7-dimethyladamantane and the following general formula [4]
And bisphenol compounds having a siloxane structure represented by the formula: Examples of the aliphatic diols include 2,2-bis- (4-hydroxycyclohexyl) -propane, 1,14-tetradecanediol, octaethylene glycol, 1,16-hexadecanediol, 4,4′-bis (2- Hydroxyethoxy) biphenyl, bis {(2-hydroxyethoxy) phenyl} methane, 1,1-bis {(2-hydroxyethoxy) phenyl} ethane, 1,1-bis {(2-hydroxyethoxy) phenyl} -1- Phenylethane, 2,2-bis {(2-hydroxyethoxy) phenyl} propane, 2,2-bis {(2-hydroxyethoxy) -3-methylphenyl} propane, 1,1-bis {(2-hydroxyethoxy) ) Phenyl} -3,3,5-trimethylcyclohexane, 2,2-bis {4- (2-hydroxy) Ethoxy) -3,3′-biphenyl} propane, 2,2-bis {(2-hydroxyethoxy) -3-isopropylphenyl} propane, 2,2-bis {3-tert-butyl-4- (2-hydroxy) Ethoxy) phenyl} propane, 2,2-bis {(2-hydroxyethoxy) phenyl} butane, 2,2-bis {(2-hydroxyethoxy) phenyl} -4-methylpentane, 2,2-bis {(2 -Hydroxyethoxy) phenyl} octane, 1,1-bis {(2-hydroxyethoxy) phenyl} decane, 2,2-bis {3-bromo-4- (2-hydroxyethoxy) phenyl} propane, 2,2- Bis {3,5-dimethyl-4- (2-hydroxyethoxy) phenyl} propane, 2,2-bis {3-cyclohexyl-4- (2-hydroxyethoxy) Cis) phenyl} propane, 1,1-bis {3-cyclohexyl-4- (2-hydroxyethoxy) phenyl} cyclohexane, bis {(2-hydroxyethoxy) phenyl} diphenylmethane, 9,9-bis {(2-hydroxy) Ethoxy) phenyl} fluorene, 9,9-bis {4- (2-hydroxyethoxy) -3-methylphenyl} fluorene, 1,1-bis {(2-hydroxyethoxy) phenyl} cyclohexane, 1,1-bis { (2-hydroxyethoxy) phenyl} cyclopentane, 4,4′-bis (2-hydroxyethoxy) diphenyl ether, 4,4′-bis (2-hydroxyethoxy) -3,3′-dimethyldiphenyl ether Ter, 1,3-bis [2-{(2-hydroxyethoxy) phenyl} propyl] benzene, 1,4- [2-{(2-hydroxyethoxy) phenyl} propyl] benzene, 1,4-bis {(2-hydroxyethoxy) phenyl} cyclohexane, 1,3-bis {(2-hydroxyethoxy) phenyl} cyclohexane, 4 , 8-bis {(2-hydroxyethoxy) phenyl} tricyclo [5.2.1.02,6] decane, 1,3-bis {(2-hydroxyethoxy) phenyl} -5,7-dimethyladamantane, 3 , 9-bis (2-hydroxy-1,1-dimethylethyl) -2,4,8,10-tetraoxaspiro (5,5) undecane, 1,4: 3,6-dianhydro-D-sorbitol (isosorbide) 1,4: 3,6-dianhydro-D-mannitol (isomannide), 1,4: 3,6-dianhydro-L-iditol (iso Secluded), and the like.
これらの中で芳香族ビスフェノール類が好ましく、なかでも1,1−ビス(4−ヒドロキシフェニル)−1−フェニルエタン、2,2−ビス(4−ヒドロキシフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−メチルフェニル)プロパン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン、1,1−ビス(4−ヒドロキシフェニル)−3,3,5−トリメチルシクロヘキサン、4,4’−スルホニルジフェノール、2,2’−ジメチル−4,4’−スルホニルジフェノール、9,9−ビス(4−ヒドロキシ−3−メチルフェニル)フルオレン、1,3−ビス{2−(4−ヒドロキシフェニル)プロピル}ベンゼン、および1,4−ビス{2−(4−ヒドロキシフェニル)プロピル}ベンゼン、が好ましく、殊に2,2−ビス(4−ヒドロキシフェニル)プロパン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン、4,4’−スルホニルジフェノール、および9,9−ビス(4−ヒドロキシ−3−メチルフェニル)フルオレンが好ましい。中でも強度に優れ、良好な耐久性を有する2,2−ビス(4−ヒドロキシフェニル)プロパンが最も好適である。また、これらは単独または二種以上組み合わせて用いてもよい。
本発明のA成分として使用されるポリカーボネート樹脂は、下記一般式〔1〕で表される繰り返し単位からなるポリカーボネート樹脂であることが好ましい。
Among these, aromatic bisphenols are preferable, and among them, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (4 -Hydroxy-3-methylphenyl) propane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane, 4,4'-sulfonyl Diphenol, 2,2′-dimethyl-4,4′-sulfonyldiphenol, 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, 1,3-bis {2- (4-hydroxyphenyl) Propyl} benzene and 1,4-bis {2- (4-hydroxyphenyl) propyl} benzene, particularly 2,2-bis (4 Hydroxyphenyl) propane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 4,4'-sulfonyl diphenol, and 9,9-bis (4-hydroxy-3-methylphenyl) fluorene is preferred. Among them, 2,2-bis (4-hydroxyphenyl) propane having excellent strength and good durability is most preferable. Moreover, you may use these individually or in combination of 2 or more types.
The polycarbonate resin used as the component A of the present invention is preferably a polycarbonate resin composed of a repeating unit represented by the following general formula [1].
本発明のA成分として使用されるポリカーボネート樹脂は、分岐化剤を上記のジヒドロキシ化合物と併用して分岐化ポリカーボネート樹脂としてもよい。 かかる分岐ポリカーボネート樹脂に使用される三官能以上の多官能性芳香族化合物としては、フロログルシン、フロログルシド、または4,6−ジメチル−2,4,6−トリス(4−ヒドロキジフェニル)ヘプテン−2、2,4,6−トリメチル−2,4,6−トリス(4−ヒドロキシフェニル)ヘプタン、1,3,5−トリス(4−ヒドロキシフェニル)ベンゼン、1,1,1−トリス(4−ヒドロキシフェニル)エタン、1,1,1−トリス(3,5−ジメチル−4−ヒドロキシフェニル)エタン、2,6−ビス(2−ヒドロキシ−5−メチルベンジル)−4−メチルフェノール、4−{4−[1,1−ビス(4−ヒドロキシフェニル)エチル]ベンゼン}−α,α−ジメチルベンジルフェノール等のトリスフェノール、テトラ(4−ヒドロキシフェニル)メタン、ビス(2,4−ジヒドロキシフェニル)ケトン、1,4−ビス(4,4−ジヒドロキシトリフェニルメチル)ベンゼン、またはトリメリット酸、ピロメリット酸、ベンゾフェノンテトラカルボン酸およびこれらの酸クロライド等が挙げられ、中でも1,1,1−トリス(4−ヒドロキシフェニル)エタン、1,1,1−トリス(3,5−ジメチル−4−ヒドロキシフェニル)エタンが好ましく、特に1,1,1−トリス(4−ヒドロキシフェニル)エタンが好ましい。 The polycarbonate resin used as the component A of the present invention may be a branched polycarbonate resin by using a branching agent in combination with the dihydroxy compound. Examples of the trifunctional or higher polyfunctional aromatic compound used in the branched polycarbonate resin include phloroglucin, phloroglucid, or 4,6-dimethyl-2,4,6-tris (4-hydroxydiphenyl) heptene-2, 2 , 4,6-trimethyl-2,4,6-tris (4-hydroxyphenyl) heptane, 1,3,5-tris (4-hydroxyphenyl) benzene, 1,1,1-tris (4-hydroxyphenyl) Ethane, 1,1,1-tris (3,5-dimethyl-4-hydroxyphenyl) ethane, 2,6-bis (2-hydroxy-5-methylbenzyl) -4-methylphenol, 4- {4- [ Trisphenol such as 1,1-bis (4-hydroxyphenyl) ethyl] benzene} -α, α-dimethylbenzylphenol, tetra (4-hydride) Loxyphenyl) methane, bis (2,4-dihydroxyphenyl) ketone, 1,4-bis (4,4-dihydroxytriphenylmethyl) benzene, or trimellitic acid, pyromellitic acid, benzophenonetetracarboxylic acid and their acids Among them, 1,1,1-tris (4-hydroxyphenyl) ethane and 1,1,1-tris (3,5-dimethyl-4-hydroxyphenyl) ethane are preferable. 1-Tris (4-hydroxyphenyl) ethane is preferred.
これらのポリカーボネート樹脂は、通常の芳香族ポリカーボネート樹脂を製造するそれ自体公知の反応手段、例えば芳香族ジヒドロキシ成分にホスゲンや炭酸ジエステルなどのカーボネート前駆物質を反応させる方法により製造される。その製造方法について基本的な手段を簡単に説明する。 These polycarbonate resins are produced by a reaction means known per se for producing ordinary aromatic polycarbonate resins, for example, a method of reacting an aromatic dihydroxy component with a carbonate precursor such as phosgene or carbonic acid diester. The basic means of the manufacturing method will be briefly described.
カーボネート前駆物質として、例えばホスゲンを使用する反応では、通常酸結合剤および溶媒の存在下に反応を行う。酸結合剤としては、例えば水酸化ナトリウム、水酸化カリウムなどのアルカリ金属水酸化物またはピリジンなどのアミン化合物が用いられる。溶媒としては、例えば塩化メチレン、クロロベンゼンなどのハロゲン化炭化水素が用いられる。また反応促進のために例えば第三級アミンまたは第四級アンモニウム塩などの触媒を用いることもできる。その際、反応温度は通常0〜40℃であり、反応時間は数分〜5時間である。カーボネート前駆物質として炭酸ジエステルを用いるエステル交換反応は、不活性ガス雰囲気下所定割合の芳香族ジヒドロキシ成分を炭酸ジエステルと加熱しながら撹拌して、生成するアルコールまたはフェノール類を留出させる方法により行われる。反応温度は生成するアルコールまたはフェノール類の沸点などにより異なるが、通常120〜300℃の範囲である。反応はその初期から減圧にして生成するアルコールまたはフェノール類を留出させながら反応を完結させる。また、反応を促進するために通常エステル交換反応に使用される触媒を使用することもできる。前記エステル交換反応に使用される炭酸ジエステルとしては、例えばジフェニルカーボネート、ジナフチルカーボネート、ビス(ジフェニル)カーボネート、ジメチルカーボネート、ジエチルカーボネート、ジブチルカーボネートなどが挙げられる。これらのうち特にジフェニルカーボネートが好ましい。 In a reaction using, for example, phosgene as a carbonate precursor, the reaction is usually performed in the presence of an acid binder and a solvent. As the acid binder, for example, an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide or an amine compound such as pyridine is used. As the solvent, for example, halogenated hydrocarbons such as methylene chloride and chlorobenzene are used. In order to accelerate the reaction, a catalyst such as a tertiary amine or a quaternary ammonium salt can also be used. In that case, reaction temperature is 0-40 degreeC normally, and reaction time is several minutes-5 hours. The transesterification reaction using a carbonic acid diester as a carbonate precursor is performed by a method in which an aromatic dihydroxy component in a predetermined ratio is stirred with a carbonic acid diester while heating with an inert gas atmosphere to distill the generated alcohol or phenols. . The reaction temperature varies depending on the boiling point of the alcohol or phenol produced, but is usually in the range of 120 to 300 ° C. The reaction is completed while distilling off the alcohol or phenol produced under reduced pressure from the beginning. Moreover, in order to accelerate | stimulate reaction, the catalyst normally used for transesterification can also be used. Examples of the carbonic acid diester used in the transesterification include diphenyl carbonate, dinaphthyl carbonate, bis (diphenyl) carbonate, dimethyl carbonate, diethyl carbonate, and dibutyl carbonate. Of these, diphenyl carbonate is particularly preferred.
本発明において、重合反応においては末端停止剤を使用する。末端停止剤は分子量調節のために使用され、また得られたポリカーボネート樹脂は、末端が封鎖されているので、そうでないものと比べて熱安定性に優れている。かかる末端停止剤としては、下記一般式〔5〕〜〔7〕で表される単官能フェノール類を示すことができる。 In the present invention, a terminal terminator is used in the polymerization reaction. The end terminator is used for molecular weight control, and the obtained polycarbonate resin is excellent in thermal stability as compared with the other one because the end is blocked. Examples of the terminal terminator include monofunctional phenols represented by the following general formulas [5] to [7].
上記一般式〔5〕で表される単官能フェノール類の具体例としては、例えばフェノール、イソプロピルフェノール、p−tert−ブチルフェノール、p−クレゾール、p−クミルフェノール、2−フェニルフェノール、4−フェニルフェノール、およびイソオクチルフェノールなどが挙げられる。また、上記一般式〔6〕〜〔7〕で表される単官能フェノール類は、長鎖のアルキル基あるいは脂肪族エステル基を置換基として有するフェノール類であり、これらを用いてポリカーボネート樹脂の末端を封鎖すると、これらは末端停止剤または分子量調節剤として機能するのみならず、樹脂の溶融流動性が改良され、成形加工が容易になるばかりでなく、樹脂の吸水率を低くする効果があり好ましく使用される。上記一般式〔6〕の置換フェノール類としてはnが10〜30、特に10〜26のものが好ましく、その具体例としては例えばデシルフェノール、ドデシルフェノール、テトラデシルフェノール、ヘキサデシルフェノール、オクタデシルフェノール、エイコシルフェノール、ドコシルフェノールおよびトリアコンチルフェノール等を挙げることができる。また、上記一般式〔7〕の置換フェノール類としてはXが−R−CO−O−であり、Rが単結合である化合物が適当であり、nが10〜30、特に10〜26のものが好適であって、その具体例としては例えばヒドロキシ安息香酸デシル、ヒドロキシ安息香酸ドデシル、ヒドロキシ安息香酸テトラデシル、ヒドロキシ安息香酸ヘキサデシル、ヒドロキシ安息香酸エイコシル、ヒドロキシ安息香酸ドコシルおよびヒドロキシ安息香酸トリアコンチルが挙げられる。これら単官能フェノール類の内、上記一般式〔5〕で表される単官能フェノール類が好ましく、より好ましくはアルキル置換もしくはフェニルアルキル置換のフェノール類であり、特に好ましくはp−tert−ブチルフェノール、p−クミルフェノールまたは2−フェニルフェノールである。これらの単官能フェノール類の末端停止剤は、得られたポリカーボネート樹脂の全末端に対して少なくとも5モル%、好ましくは少なくとも10モル% 末端に導入されることが望ましく、また、末端停止剤は単独でまたは2種以上混合して使用してもよい。 Specific examples of the monofunctional phenols represented by the general formula [5] include, for example, phenol, isopropylphenol, p-tert-butylphenol, p-cresol, p-cumylphenol, 2-phenylphenol, 4-phenyl. Phenol, isooctylphenol, etc. are mentioned. The monofunctional phenols represented by the general formulas [6] to [7] are phenols having a long-chain alkyl group or an aliphatic ester group as a substituent, and using these, the terminal of the polycarbonate resin is used. These not only function as a terminal terminator or molecular weight regulator, but also improve the melt fluidity of the resin and facilitate molding, as well as reducing the water absorption rate of the resin. used. The substituted phenols represented by the general formula [6] preferably have n of 10 to 30, particularly 10 to 26. Specific examples thereof include decylphenol, dodecylphenol, tetradecylphenol, hexadecylphenol, octadecylphenol, Examples include eicosylphenol, docosylphenol, and triacontylphenol. Further, as the substituted phenols represented by the general formula [7], compounds in which X is —R—CO—O— and R is a single bond are suitable, and n is 10 to 30, particularly 10 to 26. Specific examples thereof include decyl hydroxybenzoate, dodecyl hydroxybenzoate, tetradecyl hydroxybenzoate, hexadecyl hydroxybenzoate, eicosyl hydroxybenzoate, docosyl hydroxybenzoate and triacontyl hydroxybenzoate. Among these monofunctional phenols, monofunctional phenols represented by the above general formula [5] are preferable, more preferably alkyl-substituted or phenylalkyl-substituted phenols, and particularly preferably p-tert-butylphenol, p -Cumylphenol or 2-phenylphenol. These monofunctional phenolic terminal terminators are desirably introduced at the terminal at least 5 mol%, preferably at least 10 mol%, based on all the terminals of the obtained polycarbonate resin. Or a mixture of two or more thereof.
本発明のA成分として用いられるポリカーボネート樹脂は、本発明の趣旨を損なわない範囲で、芳香族ジカルボン酸、例えばテレフタル酸、イソフタル酸、ナフタレンジカルボン酸あるいはその誘導体を共重合したポリエステルカーボネートであってもよい。 The polycarbonate resin used as the component A of the present invention may be a polyester carbonate copolymerized with an aromatic dicarboxylic acid, for example, terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid or a derivative thereof, as long as the gist of the present invention is not impaired. Good.
本発明のA成分として使用されるポリカーボネート樹脂の粘度平均分子量は、13,000〜50,000の範囲が好ましく、16,000〜30,000がより好ましく、18,000〜28,000の範囲がさらにより好ましく、19,000〜26,000の範囲が最も好ましい。分子量が50,000を越えると溶融粘度が高くなりすぎて成形性に劣る場合があり、分子量が13,000未満であると機械的強度に問題が生じる場合がある。なお、本発明でいう粘度平均分子量は、まず次式にて算出される比粘度を塩化メチレン100mlにポリカーボネート樹脂0.7gを20℃で溶解した溶液からオストワルド粘度計を用いて求め、求められた比粘度を次式にて挿入して粘度平均分子量Mを求める。
比粘度(ηSP)=(t−t0)/t0
[t0は塩化メチレンの落下秒数、tは試料溶液の落下秒数]
ηSP/c=[η]+0.45×[η]2c(但し[η]は極限粘度)
[η]=1.23×10−4M0.83
c=0.7
The viscosity average molecular weight of the polycarbonate resin used as the component A of the present invention is preferably in the range of 13,000 to 50,000, more preferably 16,000 to 30,000, and in the range of 18,000 to 28,000. Even more preferred is the range of 19,000 to 26,000. If the molecular weight exceeds 50,000, the melt viscosity may become too high and the moldability may be poor, and if the molecular weight is less than 13,000, a problem may occur in mechanical strength. In addition, the viscosity average molecular weight as used in the field of this invention was calculated | required and calculated | required first using the Ostwald viscometer from the solution which melt | dissolved the polycarbonate resin 0.7g in 20 ml of methylene chloride in the specific viscosity computed by following Formula. The viscosity average molecular weight M is determined by inserting the specific viscosity by the following formula.
Specific viscosity (η SP ) = (t−t 0 ) / t 0
[T 0 is methylene chloride falling seconds, t is sample solution falling seconds]
η SP /c=[η]+0.45×[η] 2 c (where [η] is the intrinsic viscosity)
[Η] = 1.23 × 10 −4 M 0.83
c = 0.7
本発明のA成分として使用されるポリカーボネート樹脂は、樹脂中の全Cl(塩素)量が好ましくは0〜200ppm、より好ましくは0〜150ppmである。ポリカーボネート樹脂中の全Cl量が200ppmを越えると、色相および熱安定性が悪くなるので好ましくない。 The polycarbonate resin used as the component A of the present invention has a total Cl (chlorine) amount in the resin of preferably 0 to 200 ppm, more preferably 0 to 150 ppm. If the total Cl content in the polycarbonate resin exceeds 200 ppm, the hue and thermal stability deteriorate, which is not preferable.
<B成分:蛍光材料>
本発明のB成分として使用される蛍光材料は、有機蛍光体、無機蛍光体のいずれでも良いが、熱安定性の観点から無機蛍光体が好ましい。また、本発明のB成分として使用される蛍光材料は、受光することによって励起されて蛍光する蛍光材料であり、可視光発光蛍光体を用いることが重要である。可視光発光蛍光体は、黄色蛍光体、緑色蛍光体、青色蛍光体、および赤色蛍光体からなる群より選ばれる1種以上の蛍光体であることが好ましい。
<B component: fluorescent material>
The fluorescent material used as the component B of the present invention may be either an organic phosphor or an inorganic phosphor, but an inorganic phosphor is preferred from the viewpoint of thermal stability. In addition, the fluorescent material used as the component B of the present invention is a fluorescent material that is excited by receiving light to fluoresce, and it is important to use a visible light emitting phosphor. The visible light emitting phosphor is preferably one or more phosphors selected from the group consisting of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor.
蛍光体の構造式については、特に限定されるものではないが、代表的な蛍光体として、以下に挙げられるような希土類イオン賦活蛍光体が挙げられる。
Y3Al5O12:Ce3+,Ba2SiO4:Eu2+,Sr2SiO4:Eu2+,Ca2SiO4:Eu2+,Ca0.67Si10Al2O0.7N15.3:Eu2+,Ba3SiO5:Eu2+,Sr3SiO5:Eu2+,Ba2Si5N8:Eu2+,Sr2Si5N8:Eu2+,Ca2Si5N8:Eu2+,CaAlSiN3:Eu2+,SrAlSiN3:Eu2+,BaSi2O2N2:Eu2+,SrSi2O2N2:Eu2+,CaSi2O2N2:Eu2+,Si2Al4O4N4:Eu2+,Sr3Si13Al3O2N21:Eu2+,Sr2Si7Al3ON13:Eu2+,Ca3Sc2Si3O12:Ce3+,CaSc2O4:Ce3+,Li2SrSiO4:Eu2+,Ba3Si6O12N2:Eu2+,La3Si6N11:Ce3+,CaSiN2:Eu2+,SrSiN2:Eu2+,BaSiN2:Eu2+
The structural formula of the phosphor is not particularly limited, but typical phosphors include rare earth ion activated phosphors as listed below.
Y 3 Al 5 O 12 : Ce 3+ , Ba 2 SiO 4 : Eu 2+ , Sr 2 SiO 4 : Eu 2+ , Ca 2 SiO 4 : Eu 2+ , Ca 0.67 Si 10 Al 2 O 0.7 N 15.3 : Eu 2+ , Ba 3 SiO 5 : Eu 2+ , Sr 3 SiO 5 : Eu 2+ , Ba 2 Si 5 N 8 : Eu 2+ , Sr 2 Si 5 N 8 : Eu 2+ , Ca 2 Si 5 N 8 : Eu 2+ , CaAlSiN 3 : Eu 2+ , SrAlSiN 3 : Eu 2+ , BaSi 2 O 2 N 2 : Eu 2+ , SrSi 2 O 2 N 2 : Eu 2+ , CaSi 2 O 2 N 2 : Eu 2+ , Si 2 Al 4 O 4 N 4 : Eu 2+ , Sr 3 Si 13 Al 3 O 2 N 21 : Eu 2+ , Sr 2 Si 7 Al 3 ON 13 : Eu 2+ , Ca 3 Sc 2 Si 3 O 12: Ce 3+, CaSc 2 O 4: Ce 3+, Li 2 SrSiO 4: Eu 2+, Ba 3 Si 6 O 12 N 2: Eu 2+, La 3 Si 6 N 11: Ce 3+, CaSiN 2: Eu 2+ , SrSiN 2 : Eu 2+ , BaSiN 2 : Eu 2+
B成分の含有量は、A成分100重量部に対して、1.0〜10.0重量部であることが好ましく、より好ましくは3.0〜10.0重量部、さらに好ましくは3.0〜8.0重量部、特に好ましくは4.0〜8.0重量部、最も好ましくは4.0〜6.0重量部である。B成分が1.0重量部より少ないと、蛍光発光性が低下し、10.0重量部より多いと可視光の吸収が増えてしまい、逆に色相や導光性が低下する場合があるので好ましくない。 The content of the B component is preferably 1.0 to 10.0 parts by weight, more preferably 3.0 to 10.0 parts by weight, and still more preferably 3.0 to 100 parts by weight of the A component. It is ˜8.0 parts by weight, particularly preferably 4.0 to 8.0 parts by weight, and most preferably 4.0 to 6.0 parts by weight. If the B component is less than 1.0 part by weight, the fluorescence emission is reduced, and if it is more than 10.0 part by weight, the absorption of visible light increases, and conversely the hue and light guiding properties may be reduced. It is not preferable.
(C成分:光拡散剤)
本発明のC成分として使用される光拡散剤は、高分子微粒子に代表される有機系微粒子、並びに無機系微粒子の何れであってもよい。高分子微粒子としては、非架橋性モノマーと架橋性モノマーとを重合して得られる架橋粒子が代表的に例示される。さらにかかるモノマー以外の他の共重合可能なモノマーを使用することもできる。
(C component: light diffusing agent)
The light diffusing agent used as the component C of the present invention may be any of organic fine particles typified by polymer fine particles and inorganic fine particles. Typical examples of the polymer fine particles include crosslinked particles obtained by polymerizing a non-crosslinkable monomer and a crosslinkable monomer. Furthermore, other copolymerizable monomers other than such monomers can also be used.
前記C成分のなかでも、高分子微粒子が好ましく、特に架橋粒子が好適に使用できる。かかる架橋粒子において、非架橋性モノマーとして使用されるモノマーとして、アクリル系モノマー、スチレン系モノマー、アクリロニトリル系モノマー等の非架橋性ビニル系モノマー及びオレフィン系モノマー等を挙げることができる。アクリル系モノマーとしては、メチルアクリレート、エチルアクリレート、プロピルアクリレート、ブチルアクリレート、2−エチルヘキシルアクリレート、メチルメタクリート、エチルメタクリレート、プロピルメタクリレート、ブチルメタクリレート、2− エチルヘキシルメタクリレート、およびフェニルメタクリレート等を単独でまたは混合して使用することが可能である。このなかでも特にメチルメタクリレートが好ましい。また、スチレン系モノマーとしては、スチレン、α−メチルスチレン、メチルスチレン(ビニルトルエン)、およびエチルスチレン等のアルキルスチレン、並びにブロモ化スチレンの如きハロゲン化スチレンを使用することができ、特にスチレンが好ましい。アクリロニトリル系モノマーとしては、アクリロニトリル、およびメタクリロニトリルを使用することができる。また、オレフィン系モノマーとしては、エチレンおよび各種ノルボルネン型化合物等を使用することができる。さらに、他の共重合可能な他のモノマーとして、グリシジルメタクリレート、N−メチルマレイミド、および無水マレイン酸等を例示することができる。本発明の有機架橋粒子は結果としてN−メチルグルタルイミドの如き単位を有することもできる。一方、かかる非架橋性ビニル系モノマーに対する架橋性モノマーとしては、例えば、ジビニルベンゼン、アリルメタクリレート、トリアリルシアヌレート、トリアリルイソシアネート、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、プロピレングリコール(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、トリメチロールプロパン(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ビスフェノールAジ(メタ)アクリレート、ジシクロペンタニルジ(メタ)アクリレート、ジシクロペンテニルジ(メタ)アクリレート、およびN−メチロール(メタ)アクリルアミド等が挙げられる。また、他の架橋粒子としては、ポリオルガノシルセスキオキサンに代表されるシリコーン架橋粒子を挙げることができる。 Among the components C, polymer fine particles are preferable, and crosslinked particles can be particularly preferably used. In such crosslinked particles, examples of the monomer used as the non-crosslinkable monomer include non-crosslinkable vinyl monomers such as acrylic monomers, styrene monomers, and acrylonitrile monomers, and olefin monomers. Acrylic monomers include methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate, and phenyl methacrylate alone or in combination. Can be used. Of these, methyl methacrylate is particularly preferable. As the styrenic monomer, styrene, α-methyl styrene, methyl styrene (vinyl toluene), alkyl styrene such as ethyl styrene, and halogenated styrene such as brominated styrene can be used, and styrene is particularly preferable. . As the acrylonitrile monomer, acrylonitrile and methacrylonitrile can be used. As the olefin monomer, ethylene, various norbornene-type compounds, and the like can be used. Furthermore, glycidyl methacrylate, N-methylmaleimide, maleic anhydride, etc. can be illustrated as another copolymerizable monomer. As a result, the organic crosslinked particles of the present invention may have units such as N-methylglutarimide. On the other hand, examples of the crosslinkable monomer for the non-crosslinkable vinyl monomer include divinylbenzene, allyl methacrylate, triallyl cyanurate, triallyl isocyanate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, and propylene glycol. (Meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylolpropane (meth) acrylate, pentaerythritol tetra (meth) acrylate, bisphenol A di (meth) acrylate, dicyclopentanyl di (meth) acrylate , Dicyclopentenyl di (meth) acrylate, N-methylol (meth) acrylamide, and the like. Examples of the other crosslinked particles include silicone crosslinked particles represented by polyorganosilsesquioxane.
本発明のC成分として使用される光拡散剤の平均粒径は0.01〜50μmであることが好ましく、より好ましくは1〜30μm 、さらに好ましく2〜30μmである。平均粒径が0.01μm未満あるいは50μmを超えると光拡散性が不足する場合がある。かかる平均粒径は、レーザー回折・散乱法で求められる粒度の積算分布の50%値(D50)で表されるものである。粒子径の分布は単一であっても複数であってもよい。即ち平均粒径の異なる2種以上の光拡散剤を組み合わせることが可能である。しかしながらより好ましい光拡散剤は、その粒径分布の狭いものである。平均粒径の前後2μmの範囲に、粒子の70重量%以上が含有される分布を有するものがより好ましい。光拡散剤の形状は、光拡散性の観点から球状に近いものが好ましく、真球状に近い形態であるほどより好ましい。かかる球状には楕円球を含む。 The average particle diameter of the light diffusing agent used as the component C of the present invention is preferably 0.01 to 50 μm, more preferably 1 to 30 μm, and further preferably 2 to 30 μm. If the average particle size is less than 0.01 μm or exceeds 50 μm, the light diffusibility may be insufficient. The average particle size is represented by a 50% value (D50) of the cumulative distribution of particle sizes obtained by the laser diffraction / scattering method. The particle size distribution may be single or plural. That is, it is possible to combine two or more light diffusing agents having different average particle diameters. However, a more preferred light diffusing agent has a narrow particle size distribution. It is more preferable to have a distribution containing 70% by weight or more of the particles in the range of 2 μm before and after the average particle diameter. The shape of the light diffusing agent is preferably close to a sphere from the viewpoint of light diffusibility, and more preferably a shape close to a true sphere. Such a sphere includes an elliptical sphere.
本発明のC成分として使用される光拡散剤の屈折率は、通常1.30〜1.80の範囲が好ましく、より好ましくは1.33〜1.70、さらに好ましくは1.35〜1.65の範囲である。これらはB成分と共に樹脂組成物に配合した状態において十分な導光性を発揮する。
C成分の含有量は、A成分100重量部に対して、0.05〜9.0重量部が好ましく、0.1〜4.0重量部がより好ましく、0.1〜2.0重量部がさらに好ましく、0.1〜1.0重量部が特に好ましく、0.3〜1.0重量部が最も好ましい。C成分の含有量が0.05重量部未満である場合、充分な導光性が得られず、9.0重量部より多くなると、光拡散性が強くなりすぎて、導光性が低下する場合があるので好ましくない。
The refractive index of the light diffusing agent used as the component C of the present invention is usually preferably in the range of 1.30 to 1.80, more preferably 1.33 to 1.70, still more preferably 1.35 to 1.80. A range of 65. These exhibit sufficient light guiding properties in a state where they are blended with the B component in the resin composition.
The content of component C is preferably 0.05 to 9.0 parts by weight, more preferably 0.1 to 4.0 parts by weight, and 0.1 to 2.0 parts by weight with respect to 100 parts by weight of component A. Is more preferable, 0.1 to 1.0 part by weight is particularly preferable, and 0.3 to 1.0 part by weight is most preferable. When the content of component C is less than 0.05 parts by weight, sufficient light guide properties cannot be obtained, and when it exceeds 9.0 parts by weight, the light diffusibility becomes too strong and the light guide properties are reduced. Since it may be, it is not preferable.
C成分の含有量とB成分の含有量との重量比(C/B)は、下記式(1)を満たす。
0.01≦C/B<1.0 ・・・(1)
上記式においてC/Bの値は0.02〜0.5が好ましく、0.06〜0.4がより好ましく、0.06〜0.2がさらに好ましい。C/Bの値が0.01未満、あるいは1.0以上の場合、色相および導光性が低下する。
The weight ratio (C / B) between the content of the C component and the content of the B component satisfies the following formula (1).
0.01 ≦ C / B <1.0 (1)
In the above formula, the value of C / B is preferably 0.02 to 0.5, more preferably 0.06 to 0.4, and still more preferably 0.06 to 0.2. When the value of C / B is less than 0.01 or 1.0 or more, the hue and light guide properties are lowered.
(その他の添加剤)
本発明の樹脂組成物の難燃性、酸化防止性、光安定性(紫外線安定性)、離型性および金型腐食の改良のために、これらの改良に使用されている添加剤が有利に使用される。以下これら添加剤について具体的に説明する。
(Other additives)
In order to improve the flame retardancy, antioxidant properties, light stability (ultraviolet light stability), mold releasability and mold corrosion of the resin composition of the present invention, the additives used in these improvements are advantageous. used. Hereinafter, these additives will be specifically described.
(I)難燃剤
本発明の樹脂組成物には、難燃性ポリカーボネート樹脂の難燃剤として知られる各種の化合物が配合されてよい。かかる化合物の配合は難燃性の向上をもたらすが、それ以外にも各化合物の性質に基づき、例えば帯電防止性、流動性、剛性、および熱安定性の向上などがもたらされる。かかる難燃剤としては、(i)有機金属塩系難燃剤(例えば有機スルホン酸アルカリ(土類)金属塩、有機ホウ酸金属塩系難燃剤、および有機錫酸金属塩系難燃剤など)、(ii)有機リン系難燃剤(例えば、有機基含有のモノホスフェート化合物、ホスフェートオリゴマー化合物、ホスホネートオリゴマー化合物、ホスホニトリルオリゴマー化合物、およびホスホン酸アミド化合物など)、(iii)シリコーン化合物からなるシリコーン系難燃剤、(iv)フィブリル化PTFEが挙げられ、その中でも有機金属塩系難燃剤、有機リン系難燃剤が好ましい。
(I) Flame Retardant The resin composition of the present invention may contain various compounds known as flame retardants for flame retardant polycarbonate resins. The compounding of such a compound brings about an improvement in flame retardancy, but besides that, based on the properties of each compound, for example, an improvement in antistatic property, fluidity, rigidity and thermal stability is brought about. Examples of such flame retardants include (i) organic metal salt flame retardants (for example, organic sulfonate alkali (earth) metal salts, organic borate metal salt flame retardants, organic stannate metal salt flame retardants, etc.), ii) organophosphorous flame retardants (for example, organic group-containing monophosphate compounds, phosphate oligomer compounds, phosphonate oligomer compounds, phosphonitrile oligomer compounds, phosphonic acid amide compounds, etc.), (iii) silicone flame retardants comprising silicone compounds (Iv) fibrillated PTFE, among which organometallic salt flame retardants and organic phosphorus flame retardants are preferred.
(i)有機金属塩系難燃剤
有機金属塩化合物は炭素原子数1〜50、好ましくは1〜40の有機酸のアルカリ(土類)金属塩、好ましくは有機スルホン酸アルカリ(土類)金属塩であることが好ましい。この有機スルホン酸アルカリ(土類)金属塩には、炭素原子数1〜10、好ましくは2〜8のパーフルオロアルキルスルホン酸とアルカリ金属またはアルカリ土類金属との金属塩の如きフッ素置換アルキルスルホン酸の金属塩、並びに炭素原子数7〜50、好ましくは7〜40の芳香族スルホン酸とアルカリ金属またはアルカリ土類金属との金属塩が含まれる。金属塩を構成するアルカリ金属としてはリチウム、ナトリウム、カリウム、ルビジウムおよびセシウムが挙げられ、アルカリ土類金属としては、ベリリウム、マグネシウム、カルシウム、ストロンチウムおよびバリウムが挙げられる。より好適にはアルカリ金属である。かかるアルカリ金属の中でも、透明性の要求がより高い場合にはイオン半径のより大きいルビジウムおよびセシウムが好適である一方、これらは汎用的でなくまた精製もし難いことから、結果的にコストの点で不利となる場合がある。一方、リチウムおよびナトリウムなどのより小さいイオン半径の金属は逆に難燃性の点で不利な場合がある。これらを勘案してスルホン酸アルカリ金属塩中のアルカリ金属を使い分けることができるが、いずれの点においても特性のバランスに優れたスルホン酸カリウム塩が最も好適である。かかるカリウム塩と他のアルカリ金属からなるスルホン酸アルカリ金属塩とを併用することもできる。
(I) Organometallic salt flame retardant The organometallic salt compound is an alkali (earth) metal salt of an organic acid having 1 to 50 carbon atoms, preferably 1 to 40, preferably an alkali (earth) metal salt of an organic sulfonate. It is preferable that The alkali (earth) metal salt of the organic sulfonate includes a fluorine-substituted alkyl sulfone such as a metal salt of a perfluoroalkyl sulfonic acid having 1 to 10, preferably 2 to 8 carbon atoms and an alkali metal or an alkaline earth metal. Metal salts of acids and metal salts of aromatic sulfonic acids having 7 to 50 carbon atoms, preferably 7 to 40 carbon atoms, and alkali metals or alkaline earth metals are included. Examples of the alkali metal constituting the metal salt include lithium, sodium, potassium, rubidium and cesium, and examples of the alkaline earth metal include beryllium, magnesium, calcium, strontium and barium. More preferred is an alkali metal. Among such alkali metals, rubidium and cesium having larger ionic radii are suitable when the requirement for transparency is higher, but these are not general-purpose and difficult to purify, resulting in cost. It may be disadvantageous. On the other hand, metals with smaller ionic radii such as lithium and sodium may be disadvantageous in terms of flame retardancy. Considering these, the alkali metal in the sulfonic acid alkali metal salt can be properly used. In any respect, the sulfonic acid potassium salt having an excellent balance of properties is most preferable. Such potassium salts and sulfonic acid alkali metal salts comprising other alkali metals can be used in combination.
パーフルオロアルキルスルホン酸アルカリ金属塩の具体例としては、トリフルオロメタンスルホン酸カリウム、パーフルオロブタンスルホン酸カリウム、パーフルオロヘキサンスルホン酸カリウム、パーフルオロオクタンスルホン酸カリウム、ペンタフルオロエタンスルホン酸ナトリウム、パーフルオロブタンスルホン酸ナトリウム、パーフルオロオクタンスルホン酸ナトリウム、トリフルオロメタンスルホン酸リチウム、パーフルオロブタンスルホン酸リチウム、パーフルオロヘプタンスルホン酸リチウム、トリフルオロメタンスルホン酸セシウム、パーフルオロブタンスルホン酸セシウム、パーフルオロオクタンスルホン酸セシウム、パーフルオロヘキサンスルホン酸セシウム、パーフルオロブタンスルホン酸ルビジウム、およびパーフルオロヘキサンスルホン酸ルビジウム等が挙げられ、これらは1種もしくは2種以上を併用して使用することができる。ここでパーフルオロアルキル基の炭素数は、1〜18の範囲が好ましく、1〜10の範囲がより好ましく、更に好ましくは1〜8の範囲である。これらの中で特にパーフルオロブタンスルホン酸カリウムが好ましい。アルカリ金属からなるパーフルオロアルキルスルホン酸アルカリ(土類)金属塩中には、通常少なからず弗化物イオン(F−)が混入する。かかる弗化物イオンの存在は難燃性を低下させる要因となり得るので、できる限り低減されることが好ましい。かかる弗化物イオンの割合はイオンクロマトグラフィー法により測定できる。弗化物イオンの含有量は、100ppm以下が好ましく、40ppm以下が更に好ましく、10ppm以下が特に好ましい。また製造効率的に0.2ppm以上であることが好適である。かかる弗化物イオン量の低減されたパーフルオロアルキルスルホン酸アルカリ(土類)金属塩は、製造方法は公知の製造方法を用い、かつ含フッ素有機金属塩を製造する際の原料中に含有される弗化物イオンの量を低減する方法、反応により得られた弗化水素などを反応時に発生するガスや加熱によって除去する方法、並びに含フッ素有機金属塩を製造に再結晶および再沈殿等の精製方法を用いて弗化物イオンの量を低減する方法などによって製造することができる。特に有機金属塩系難燃剤は比較的水に溶けやすいこことから、イオン交換水、特に電気抵抗値が18MΩ・cm以上、すなわち電気伝導度が約0.55μS/cm以下を満足する水を用い、かつ常温よりも高い温度で溶解させて洗浄を行い、その後冷却させて再結晶化させる工程により製造することが好ましい。芳香族スルホン酸アルカリ(土類)金属塩の具体例としては、例えばジフェニルサルファイド−4,4’−ジスルホン酸ジナトリウム、ジフェニルサルファイド−4,4’−ジスルホン酸ジカリウム、5−スルホイソフタル酸カリウム、5−スルホイソフタル酸ナトリウム、ポリエチレンテレフタル酸ポリスルホン酸ポリナトリウム、1−メトキシナフタレン−4−スルホン酸カルシウム、4−ドデシルフェニルエーテルジスルホン酸ジナトリウム、ポリ(2,6−ジメチルフェニレンオキシド)ポリスルホン酸ポリナトリウム、ポリ(1,3−フェニレンオキシド)ポリスルホン酸ポリナトリウム、ポリ(1,4−フェニレンオキシド)ポリスルホン酸ポリナトリウム、ポリ(2,6−ジフェニルフェニレンオキシド)ポリスルホン酸ポリカリウム、ポリ(2−フルオロ−6−ブチルフェニレンオキシド)ポリスルホン酸リチウム、ベンゼンスルホネートのスルホン酸カリウム、ベンゼンスルホン酸ナトリウム、ベンゼンスルホン酸ストロンチウム、ベンゼンスルホン酸マグネシウム、p−ベンゼンジスルホン酸ジカリウム、ナフタレン−2,6−ジスルホン酸ジカリウム、ビフェニル−3,3’−ジスルホン酸カルシウム、ジフェニルスルホン−3−スルホン酸ナトリウム、ジフェニルスルホン−3−スルホン酸カリウム、ジフェニルスルホン−3,3’−ジスルホン酸ジカリウム、ジフェニルスルホン−3,4’−ジスルホン酸ジカリウム、α,α,α−トリフルオロアセトフェノン−4−スルホン酸ナトリウム、ベンゾフェノン−3,3’−ジスルホン酸ジカリウム、チオフェン−2,5−ジスルホン酸ジナトリウム、チオフェン−2,5−ジスルホン酸ジカリウム、チオフェン−2,5−ジスルホン酸カルシウム、ベンゾチオフェンスルホン酸ナトリウム、ジフェニルスルホキサイド−4−スルホン酸カリウム、ナフタレンスルホン酸ナトリウムのホルマリン縮合物、およびアントラセンスルホン酸ナトリウムのホルマリン縮合物などを挙げることができる。これら芳香族スルホン酸アルカリ(土類)金属塩では、特にカリウム塩が好適である。これらの芳香族スルホン酸アルカリ(土類)金属塩の中でも、ジフェニルスルホン−3−スルホン酸カリウム、およびジフェニルスルホン−3,3’−ジスルホン酸ジカリウムが好適であり、特にこれらの混合物(前者と後者の重量比が15/85〜30/70)が好適である。 Specific examples of alkali metal perfluoroalkyl sulfonates include potassium trifluoromethane sulfonate, potassium perfluorobutane sulfonate, potassium perfluorohexane sulfonate, potassium perfluorooctane sulfonate, sodium pentafluoroethane sulfonate, perfluoro Sodium butanesulfonate, sodium perfluorooctanesulfonate, lithium trifluoromethanesulfonate, lithium perfluorobutanesulfonate, lithium perfluoroheptanesulfonate, cesium trifluoromethanesulfonate, cesium perfluorobutanesulfonate, perfluorooctanesulfonate Cesium, cesium perfluorohexane sulfonate, rubidium perfluorobutane sulfonate, and perf Oro hexane sulfonate rubidium, and these may be used in combination of at least one or two. Here, the carbon number of the perfluoroalkyl group is preferably in the range of 1-18, more preferably in the range of 1-10, and still more preferably in the range of 1-8. Of these, potassium perfluorobutanesulfonate is particularly preferred. The alkali (earth) metal salt of perfluoroalkylsulfonic acid composed of an alkali metal is usually mixed with not less than fluoride ions (F − ). The presence of such fluoride ions can be a factor that lowers the flame retardancy, so it is preferably reduced as much as possible. The ratio of such fluoride ions can be measured by ion chromatography. The content of fluoride ions is preferably 100 ppm or less, more preferably 40 ppm or less, and particularly preferably 10 ppm or less. Moreover, it is suitable that it is 0.2 ppm or more in terms of production efficiency. Such alkali (earth) metal salt of perfluoroalkylsulfonic acid having a reduced amount of fluoride ion is contained in a raw material when producing a fluorine-containing organometallic salt using a known production method. A method for reducing the amount of fluoride ions, a method for removing hydrogen fluoride and the like obtained by the reaction by a gas generated during the reaction or heating, and a purification method such as recrystallization and reprecipitation for producing a fluorine-containing organometallic salt Can be produced by a method of reducing the amount of fluoride ions using, for example. In particular, organic metal salt flame retardants are relatively soluble in water, and therefore ion-exchanged water, especially water that has an electric resistance of 18 MΩ · cm or more, that is, an electric conductivity of about 0.55 μS / cm or less is used. In addition, it is preferable to produce by a process of dissolving at a temperature higher than room temperature and washing, then cooling and recrystallization. Specific examples of the aromatic (earth) metal salt of an aromatic sulfonate include, for example, disodium diphenyl sulfide-4,4′-disulfonate, dipotassium diphenyl sulfide-4,4′-disulfonate, potassium 5-sulfoisophthalate, Sodium 5-sulfoisophthalate, polysodium polyethylene terephthalate polysulfonate, calcium 1-methoxynaphthalene-4-sulfonate, disodium 4-dodecylphenyl ether disulfonate, polysodium poly (2,6-dimethylphenylene oxide) polysulfonate Poly (1,3-phenylene oxide) polysulfonic acid polysodium, poly (1,4-phenylene oxide) polysulfonic acid polysodium, poly (2,6-diphenylphenylene oxide) polysulfonic acid polycarbonate , Lithium poly (2-fluoro-6-butylphenylene oxide) polysulfonate, potassium sulfonate benzenesulfonate, sodium benzenesulfonate, strontium benzenesulfonate, magnesium benzenesulfonate, dipotassium p-benzenedisulfonate, naphthalene-2 , 6-disulfonic acid dipotassium, biphenyl-3,3'-disulfonic acid calcium, diphenylsulfone-3-sulfonic acid sodium, diphenylsulfone-3-sulfonic acid potassium, diphenylsulfone-3,3'-disulfonic acid dipotassium, diphenylsulfone -Potassium 3,4'-disulfonate, sodium α, α, α-trifluoroacetophenone-4-sulfonate, dipotassium benzophenone-3,3'-disulfonate, thiophene-2 Formalin of disodium 5-disulfonate, dipotassium thiophene-2,5-disulfonate, calcium thiophene-2,5-disulfonate, sodium benzothiophenesulfonate, potassium diphenylsulfoxide-4-sulfonate, sodium naphthalenesulfonate Examples thereof include condensates and formalin condensates of sodium anthracene sulfonate. Among these aromatic sulfonate alkali (earth) metal salts, potassium salts are particularly preferable. Among these aromatic sulfonate alkali (earth) metal salts, potassium diphenylsulfone-3-sulfonate and dipotassium diphenylsulfone-3,3′-disulfonate are preferable, and particularly a mixture thereof (the former and the latter). Is preferably 15/85 to 30/70).
スルホン酸アルカリ(土類)金属塩以外の有機金属塩としては、硫酸エステルのアルカリ(土類)金属塩および芳香族スルホンアミドのアルカリ(土類)金属塩などが好適に例示される。硫酸エステルのアルカリ(土類)金属塩としては、特に一価および/または多価アルコール類の硫酸エステルのアルカリ(土類)金属塩を挙げることができ、かかる一価および/または多価アルコール類の硫酸エステルとしては、メチル硫酸エステル、エチル硫酸エステル、ラウリル硫酸エステル、ヘキサデシル硫酸エステル、ポリオキシエチレンアルキルフェニルエーテルの硫酸エステル、ペンタエリスリトールのモノ、ジ、トリ、テトラ硫酸エステル、ラウリン酸モノグリセライドの硫酸エステル、パルミチン酸モノグリセライドの硫酸エステル、およびステアリン酸モノグリセライドの硫酸エステルなどを挙げることができる。これらの硫酸エステルのアルカリ(土類)金属塩として好ましくはラウリル硫酸エステルのアルカリ(土類)金属塩が挙げられる。芳香族スルホンアミドのアルカリ(土類)金属塩としては、例えばサッカリン、N−(p−トリルスルホニル)−p−トルエンスルホイミド、N−(N’−ベンジルアミノカルボニル)スルファニルイミド、およびN−(フェニルカルボキシル)スルファニルイミドのアルカリ(土類)金属塩などが挙げられる。有機金属塩系難燃剤の含有量は、樹脂組成物100重量部に対し、好ましくは0.001〜1重量部、より好ましくは0.005〜0.5重量部、さらに好ましくは0.01〜0.3重量部、特に好ましくは0.03〜0.15重量部である。 Preferable examples of the organic metal salt other than the alkali (earth) metal sulfonate include an alkali (earth) metal salt of a sulfate ester and an alkali (earth) metal salt of an aromatic sulfonamide. Examples of alkali (earth) metal salts of sulfates include alkali (earth) metal salts of sulfates of monovalent and / or polyhydric alcohols, and such monovalent and / or polyhydric alcohols. Examples of sulfuric acid esters include methyl sulfate, ethyl sulfate, lauryl sulfate, hexadecyl sulfate, polyoxyethylene alkylphenyl ether sulfate, pentaerythritol mono-, di-, tri-, tetra-sulfate, and lauric acid monoglyceride sulfate. Examples include esters, sulfates of palmitic acid monoglyceride, and sulfates of stearic acid monoglyceride. The alkali (earth) metal salts of these sulfates are preferably alkali (earth) metal salts of lauryl sulfate. Alkali (earth) metal salts of aromatic sulfonamides include, for example, saccharin, N- (p-tolylsulfonyl) -p-toluenesulfonimide, N- (N′-benzylaminocarbonyl) sulfanilimide, and N- ( And an alkali (earth) metal salt of phenylcarboxyl) sulfanilimide. The content of the organometallic salt flame retardant is preferably 0.001 to 1 part by weight, more preferably 0.005 to 0.5 part by weight, and still more preferably 0.01 to 100 parts by weight with respect to 100 parts by weight of the resin composition. 0.3 part by weight, particularly preferably 0.03 to 0.15 part by weight.
(ii)有機リン系難燃剤
有機リン系難燃剤としては、アリールホスフェート化合物が好適である。かかるホスフェート化合物は概して色相に優れるためである。またホスフェート化合物は可塑化効果があるため、成形加工性を高められる点で有利である。かかるホスフェート化合物は、従来難燃剤として公知の各種ホスフェート化合物が使用できる。有機リン系難燃剤の配合量は、樹脂組成物100重量部に対し、好ましくは0.01〜20重量部、より好ましくは2〜10重量部、さらに好ましくは2〜7重量部である。
(Ii) Organophosphorus Flame Retardant As the organophosphorus flame retardant, an aryl phosphate compound is suitable. This is because such phosphate compounds are generally excellent in hue. Moreover, since the phosphate compound has a plasticizing effect, it is advantageous in that the molding processability can be improved. As the phosphate compound, various phosphate compounds known as conventional flame retardants can be used. The compounding amount of the organic phosphorus flame retardant is preferably 0.01 to 20 parts by weight, more preferably 2 to 10 parts by weight, and further preferably 2 to 7 parts by weight with respect to 100 parts by weight of the resin composition.
(iii)シリコーン系難燃剤
シリコーン系難燃剤として使用されるシリコーン化合物は、燃焼時の化学反応によって難燃性を向上させるものである。該化合物としては従来芳香族ポリカーボート樹脂の難燃剤として提案された各種の化合物を使用することができる。シリコーン化合物はその燃焼時にそれ自体が結合してまたは樹脂に由来する成分と結合してストラクチャーを形成することにより、または該ストラクチャー形成時の還元反応により、ポリカーボネート樹脂に難燃効果を付与するものと考えられている。したがってかかる反応における活性の高い基を含んでいることが好ましく、より具体的にはアルコキシ基およびハイドロジェン(即ちSi−H基)から選択された少なくとも1種の基を所定量含んでいることが好ましい。かかる基(アルコキシ基、Si−H基)の含有割合としては、0.1〜1.2mol/100gの範囲が好ましく、0.12〜1mol/100gの範囲がより好ましく、0.15〜0.6mol/100gの範囲が更に好ましい。かかる割合はアルカリ分解法より、シリコーン化合物の単位重量当たりに発生した水素またはアルコールの量を測定することにより求められる。尚、アルコキシ基は炭素数1〜4のアルコキシ基が好ましく、特にメトキシ基が好適である。一般的にシリコーン化合物の構造は、以下に示す4種類のシロキサン単位を任意に組み合わせることによって構成される。すなわち、M単位:(CH3)3SiO1/2、H(CH3)2SiO1/2、H2(CH3)SiO1/2、(CH3)2(CH2=CH)SiO1/2、(CH3)2(C6H5)SiO1/2、(CH3)(C6H5)(CH2=CH)SiO1/2等の1官能性シロキサン単位、D単位:(CH3)2SiO、H(CH3)SiO、H2SiO、H(C6H5)SiO、(CH3)(CH2=CH)SiO、(C6H5)2SiO等の2官能性シロキサン単位、T単位:(CH3)SiO3/2、(C3H7)SiO3/2、HSiO3/2、(CH2=CH)SiO3/2、(C6H5)SiO3/2等の3官能性シロキサン単位、Q単位:SiO2で示される4官能性シロキサン単位である。シリコーン系難燃剤に使用されるシリコーン化合物の構造は、具体的には、示性式としてDn、Tp、MmDn、MmTp、MmQq、MmDnTp、MmDnQq、MmTpQq、MmDnTpQq、DnTp、DnQq、DnTpQqが挙げられる。この中で好ましいシリコーン化合物の構造は、MmDn、MmTp、MmDnTp、MmDnQqであり、さらに好ましい構造は、MmDnまたはMmDnTpである。
(Iii) Silicone Flame Retardant A silicone compound used as a silicone flame retardant improves flame retardancy by a chemical reaction during combustion. As the compound, various compounds conventionally proposed as a flame retardant for aromatic polycarbonate resin can be used. The silicone compound binds itself during combustion or binds to a component derived from the resin to form a structure, or gives a flame retardant effect to the polycarbonate resin by a reduction reaction during the structure formation. It is considered. Therefore, it is preferable that a group having high activity in such a reaction is contained, and more specifically, a predetermined amount of at least one group selected from an alkoxy group and a hydrogen (ie, Si—H group) is contained. preferable. As a content rate of this group (alkoxy group, Si-H group), the range of 0.1-1.2 mol / 100g is preferable, the range of 0.12-1 mol / 100g is more preferable, 0.15-0. The range of 6 mol / 100 g is more preferable. Such a ratio can be determined by measuring the amount of hydrogen or alcohol generated per unit weight of the silicone compound by the alkali decomposition method. The alkoxy group is preferably an alkoxy group having 1 to 4 carbon atoms, and particularly preferably a methoxy group. Generally, the structure of a silicone compound is constituted by arbitrarily combining the following four types of siloxane units. That is, M units: (CH 3 ) 3 SiO 1/2 , H (CH 3 ) 2 SiO 1/2 , H 2 (CH 3 ) SiO 1/2 , (CH 3 ) 2 (CH 2 = CH) SiO 1 / 2 , monofunctional siloxane units such as (CH 3 ) 2 (C 6 H 5 ) SiO 1/2 , (CH 3 ) (C 6 H 5 ) (CH 2 ═CH) SiO 1/2 , D unit: 2 such as (CH 3 ) 2 SiO, H (CH 3 ) SiO, H 2 SiO, H (C 6 H 5 ) SiO, (CH 3 ) (CH 2 ═CH) SiO, (C 6 H 5 ) 2 SiO Functional siloxane unit, T unit: (CH 3 ) SiO 3/2 , (C 3 H 7 ) SiO 3/2 , HSiO 3/2 , (CH 2 ═CH) SiO 3/2 , (C 6 H 5 ) trifunctional siloxane units SiO 3/2, etc., Q unit: 4 represented by SiO 2 It is a functional siloxane units. Specific examples of the structure of the silicone compound used in the silicone-based flame retardant include Dn, Tp, MmDn, MmTp, MmQq, MmDnTp, MmDnQq, MmTpQq, MmDnTpQq, DnTp, DnQq, and DnTpQq. Among these, preferred structures of the silicone compound are MmDn, MmTp, MmDnTp, and MmDnQq, and a more preferred structure is MmDn or MmDnTp.
ここで、前記示性式中の係数m、n、p、qは各シロキサン単位の重合度を表す1以上の整数であり、各示性式における係数の合計がシリコーン化合物の平均重合度となる。この平均重合度は好ましくは3〜150の範囲、より好ましくは3〜80の範囲、更に好ましくは3〜60の範囲、特に好ましくは4〜40の範囲である。かかる好適な範囲であるほど難燃性において優れるようになる。更に後述するように芳香族基を所定量含むシリコーン化合物においては透明性や色相にも優れる。その結果良好な反射光が得られる。またm、n、p、qのいずれかが2以上の数値である場合、その係数の付いたシロキサン単位は、結合する水素原子や有機残基が異なる2種以上のシロキサン単位とすることができる。 Here, the coefficients m, n, p, and q in the above formula are integers of 1 or more that indicate the degree of polymerization of each siloxane unit, and the sum of the coefficients in each formula is the average degree of polymerization of the silicone compound. . This average degree of polymerization is preferably in the range of 3 to 150, more preferably in the range of 3 to 80, still more preferably in the range of 3 to 60, and particularly preferably in the range of 4 to 40. The better the range, the better the flame retardancy. Further, as described later, a silicone compound containing a predetermined amount of an aromatic group is excellent in transparency and hue. As a result, good reflected light can be obtained. When any of m, n, p, and q is a numerical value of 2 or more, the siloxane unit with the coefficient can be two or more types of siloxane units having different hydrogen atoms or organic residues to be bonded. .
シリコーン化合物は、直鎖状であっても分岐構造を持つものであってもよい。またシリコン原子に結合する有機残基は炭素数1〜30、より好ましくは1〜20の有機残基であることが好ましい。かかる有機残基としては、具体的には、メチル基、エチル基、プロピル基、ブチル基、ヘキシル基、およびデシル基などのアルキル基、シクロヘキシル基の如きシクロアルキル基、フェニル基の如きアリール基、並びにトリル基の如きアラルキル基を挙げることがでる。さらに好ましくは炭素数1〜8のアルキル基、アルケニル基またはアリール基である。アルキル基としては、特にはメチル基、エチル基、およびプロピル基等の炭素数1〜4のアルキル基が好ましい。さらにシリコーン系難燃剤として使用されるシリコーン化合物はアリール基を含有することが好ましい。一方、二酸化チタン顔料の有機表面処理剤としてのシラン化合物およびシロキサン化合物は、アリール基を含有しない方が好ましい効果が得られる点で、シリコーン系難燃剤とはその好適な態様において明確に区別される。シリコーン系難燃剤として使用されるシリコーン化合物は、前記Si−H基およびアルコキシ基以外にも反応基を含有していてもよく、かかる反応基としては例えば、アミノ基、カルボキシル基、エポキシ基、ビニル基、メルカプト基、およびメタクリロキシ基などが例示される。
シリコーン系難燃剤の配合量は、樹脂組成物100重量部に対し、好ましくは0.01〜20重量部、より好ましくは0.5〜10重量部、さらに好ましくは1〜5重量部である。
The silicone compound may be linear or have a branched structure. The organic residue bonded to the silicon atom is preferably an organic residue having 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms. Specific examples of such an organic residue include alkyl groups such as a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, and a decyl group, a cycloalkyl group such as a cyclohexyl group, an aryl group such as a phenyl group, And aralkyl groups such as tolyl groups. More preferably, they are a C1-C8 alkyl group, an alkenyl group, or an aryl group. As the alkyl group, an alkyl group having 1 to 4 carbon atoms such as a methyl group, an ethyl group, and a propyl group is particularly preferable. Further, the silicone compound used as the silicone flame retardant preferably contains an aryl group. On the other hand, silane compounds and siloxane compounds as organic surface treatment agents for titanium dioxide pigments are clearly distinguished from silicone-based flame retardants in their preferred embodiments in that it is preferable to contain no aryl group. . The silicone compound used as the silicone-based flame retardant may contain a reactive group in addition to the Si-H group and the alkoxy group. Examples of the reactive group include an amino group, a carboxyl group, an epoxy group, and a vinyl group. Examples thereof include a group, a mercapto group, and a methacryloxy group.
The compounding amount of the silicone flame retardant is preferably 0.01 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, and further preferably 1 to 5 parts by weight with respect to 100 parts by weight of the resin composition.
(iv)フィブリル形成能を有するポリテトラフルオロエチレン(フィブリル化PTFE)
フィブリル化PTFEは、フィブリル化PTFE単独であっても、混合形態のフィブリル化PTFEすなわちフィブリル化PTFE粒子と有機系重合体からなるポリテトラフルオロエチレン系混合体であってもよい。フィブリル化PTFEは極めて高い分子量を有し、せん断力などの外的作用によりPTFE同士を結合して繊維状になる傾向を示すものである。その数平均分子量は、150万〜数千万の範囲である。かかる下限はより好ましくは300万である。かかる数平均分子量は、特開平6−145520号公報に開示されているとおり、380℃でのポリテトラフルオロエチレンの溶融粘度に基づき算出される。即ち、B成分のフィブリル化PTFEは、かかる公報に記載された方法で測定される380℃における溶融粘度が107〜1013poiseの範囲であり、好ましくは108〜1012poiseの範囲である。かかるPTFEは、固体形状の他、水性分散液形態のものも使用可能である。またかかるフィブリル化PTFEは樹脂中での分散性を向上させ、更に良好な難燃性および機械的特性を得るために他の樹脂との混合形態のPTFE混合物を使用することも可能である。また、特開平6−145520号公報に開示されているとおり、かかるフィブリル化PTFEを芯とし、低分子量のポリテトラフルオロエチレンを殻とした構造を有するものも好ましく利用される。かかるフィブリル化PTFEの市販品としては例えば三井・デュポンフロロケミカル(株)のテフロン(登録商標)6J、ダイキン化学工業(株)のポリフロンMPA FA500、F−201Lなどを挙げることができる。混合形態のフィブリル化PTFEとしては、(1)フィブリル化PTFEの水性分散液と有機重合体の水性分散液または溶液とを混合し共沈殿を行い共凝集混合物を得る方法(特開昭60−258263号公報、特開昭63−154744号公報などに記載された方法)、(2)フィブリル化PTFEの水性分散液と乾燥した有機重合体粒子とを混合する方法(特開平4−272957号公報に記載された方法)、(3)フィブリル化PTFEの水性分散液と有機重合体粒子溶液を均一に混合し、かかる混合物からそれぞれの媒体を同時に除去する方法(特開平06−220210号公報、特開平08−188653号公報などに記載された方法)、(4)フィブリル化PTFEの水性分散液中で有機重合体を形成する単量体を重合する方法(特開平9−95583号公報に記載された方法)、および(5)PTFEの水性分散液と有機重合体分散液を均一に混合後、更に該混合分散液中でビニル系単量体を重合し、その後混合物を得る方法(特開平11−29679号公報などに記載された方法)により得られたものが使用できる。これらの混合形態のフィブリル化PTFEの市販品としては、三菱レイヨン(株)の「メタブレン A3000」(商品名)「メタブレン A3700」(商品名)、「メタブレン A3800」(商品名)で代表されるメタブレンAシリーズ、Shine polymer社のSN3300B7(商品名)、およびGEスペシャリティーケミカルズ社製 「BLENDEX B449」(商品名)などが例示される。
(Iv) Polytetrafluoroethylene (fibrillated PTFE) having fibril-forming ability
The fibrillated PTFE may be fibrillated PTFE alone or a mixed form of fibrillated PTFE, that is, a polytetrafluoroethylene-based mixture composed of fibrillated PTFE particles and an organic polymer. Fibrilized PTFE has an extremely high molecular weight and tends to be bonded to each other by an external action such as shearing force to form a fiber. Its number average molecular weight ranges from 1.5 million to tens of millions. The lower limit is more preferably 3 million. The number average molecular weight is calculated based on the melt viscosity of polytetrafluoroethylene at 380 ° C. as disclosed in JP-A-6-145520. That is, the fibrillated PTFE of the B component has a melt viscosity at 380 ° C. measured by the method described in this publication in the range of 107 to 1013 poise, preferably in the range of 108 to 1012 poise. Such PTFE can be used in solid form or in the form of an aqueous dispersion. Such fibrillated PTFE can also be used in the form of a PTFE mixture with other resins in order to improve dispersibility in the resin and to obtain better flame retardancy and mechanical properties. Further, as disclosed in JP-A-6-145520, those having a structure having such a fibrillated PTFE as a core and a low molecular weight polytetrafluoroethylene as a shell are also preferably used. Examples of such commercially available fibrillated PTFE include Teflon (registered trademark) 6J from Mitsui DuPont Fluorochemical Co., Ltd., Polyflon MPA FA500, F-201L from Daikin Chemical Industries, Ltd., and the like. As a mixed form of fibrillated PTFE, (1) a method in which an aqueous dispersion of fibrillated PTFE and an aqueous dispersion or solution of an organic polymer are mixed and co-precipitated to obtain a co-agglomerated mixture (JP-A-60-258263). (2) A method of mixing an aqueous dispersion of fibrillated PTFE and dried organic polymer particles (Japanese Patent Laid-Open No. 4-272957). Described method), (3) A method in which an aqueous dispersion of fibrillated PTFE and an organic polymer particle solution are uniformly mixed, and the respective media are simultaneously removed from the mixture (Japanese Patent Laid-Open Nos. 06-220210, (Method described in Japanese Patent Application Laid-Open No. 08-188653), (4) A method of polymerizing monomers forming an organic polymer in an aqueous dispersion of fibrillated PTFE (Method described in JP-A-9-95583), and (5) an aqueous dispersion of PTFE and an organic polymer dispersion are uniformly mixed, and then a vinyl monomer is further polymerized in the mixed dispersion. Thereafter, those obtained by a method for obtaining a mixture (a method described in JP-A-11-29679, etc.) can be used. Commercial products of these mixed forms of fibrillated PTFE include methabrene represented by Mitsubishi Rayon Co., Ltd.'s "methabrene A3000" (trade name), "methabrene A3700" (trade name), and "methabrene A3800" (trade name). Examples include A series, SN3300B7 (trade name) manufactured by Shine Polymer, and “BLENDEX B449” (trade name) manufactured by GE Specialty Chemicals.
混合形態におけるフィブリル化PTFEの割合としては、かかる混合物100重量%中、フィブリル化PTFEが1重量%〜95重量%であることが好ましく、10重量%〜90重量%であるのがより好ましく、20重量%〜80重量%が最も好ましい。
混合形態におけるフィブリル化PTFEの割合がかかる範囲にある場合は、フィブリル化PTFEの良好な分散性を達成することができる。フィブリル化PTFEの配合量は、樹脂組成物100重量部に対して、好ましくは0.001〜0.2重量部であり、0.01〜0.2重量部がより好ましく、0.01〜0.18重量部がさらに好ましい。なお、ここで示す重量部はポリテトラフルオロエチレンが混合形態(混合体)の場合は、混合体全体の重量を示す。
The proportion of fibrillated PTFE in the mixed form is preferably 1% by weight to 95% by weight, more preferably 10% by weight to 90% by weight, and more preferably 20% by weight in 100% by weight of the mixture. Most preferred is from 80% to 80% by weight.
When the ratio of fibrillated PTFE in the mixed form is within such a range, good dispersibility of the fibrillated PTFE can be achieved. The amount of fibrillated PTFE is preferably 0.001 to 0.2 parts by weight, more preferably 0.01 to 0.2 parts by weight, and more preferably 0.01 to 0 parts by weight with respect to 100 parts by weight of the resin composition. More preferred is 18 parts by weight. In addition, the weight part shown here shows the weight of the whole mixture, when polytetrafluoroethylene is a mixed form (mixture).
(II)リン系安定剤
本発明の樹脂組成物は、加水分解性を促進させない程度において、リン系安定剤が配合されることが好ましい。かかるリン系安定剤は製造時または成形加工時の熱安定性を向上させ、機械的特性、色相、および成形安定性を向上させる。リン系安定剤としては、亜リン酸、リン酸、亜ホスホン酸、ホスホン酸およびこれらのエステル、並びに第3級ホスフィンなどが例示される。具体的にはホスファイト化合物としては、例えば、トリフェニルホスファイト、トリス(ノニルフェニル)ホスファイト、トリデシルホスファイト、トリオクチルホスファイト、トリオクタデシルホスファイト、ジデシルモノフェニルホスファイト、ジオクチルモノフェニルホスファイト、ジイソプロピルモノフェニルホスファイト、モノブチルジフェニルホスファイト、モノデシルジフェニルホスファイト、モノオクチルジフェニルホスファイト、2,2−メチレンビス(4,6−ジ−tert−ブチルフェニル)オクチルホスファイト、トリス(ジエチルフェニル)ホスファイト、トリス(ジ−iso−プロピルフェニル)ホスファイト、トリス(ジ−n−ブチルフェニル)ホスファイト、トリス(2,4−ジ−tert−ブチルフェニル)ホスファイト、トリス(2,6−ジ−tert−ブチルフェニル)ホスファイト、ジステアリルペンタエリスリトールジホスファイト、ビス(2,4−ジ−tert−ブチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,6−ジ−tert−ブチル−4−メチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,6−ジ−tert−ブチル−4−エチルフェニル)ペンタエリスリトールジホスファイト、フェニルビスフェノールAペンタエリスリトールジホスファイト、ビス(ノニルフェニル)ペンタエリスリトールジホスファイト、ジシクロヘキシルペンタエリスリトールジホスファイトなどが挙げられる。更に他のホスファイト化合物としては二価フェノール類と反応し環状構造を有するものも使用できる。例えば、2,2’−メチレンビス(4,6−ジ−tert−ブチルフェニル)(2,4−ジ−tert−ブチルフェニル)ホスファイト、2,2’−メチレンビス(4,6−ジ−tert−ブチルフェニル)(2−tert−ブチル−4−メチルフェニル)ホスファイト、2,2’−メチレンビス(4−メチル−6−tert−ブチルフェニル)(2−tert−ブチル−4−メチルフェニル)ホスファイト、2,2’−エチリデンビス(4−メチル−6−tert−ブチルフェニル)(2−tert−ブチル−4−メチルフェニル)ホスファイトなどを挙げることができる。ホスフェート化合物としては、トリブチルホスフェート、トリメチルホスフェート、トリクレジルホスフェート、トリフェニルホスフェート、トリクロルフェニルホスフェート、トリエチルホスフェート、ジフェニルクレジルホスフェート、ジフェニルモノオルソキセニルホスフェート、トリブトキシエチルホスフェート、ジブチルホスフェート、ジオクチルホスフェート、ジイソプロピルホスフェートなどを挙げることができ、好ましくはトリフェニルホスフェート、トリメチルホスフェートである。
(II) Phosphorus stabilizer It is preferable that the resin composition of the present invention contains a phosphorus stabilizer to the extent that it does not promote hydrolyzability. Such phosphorus stabilizers improve thermal stability during production or molding, and improve mechanical properties, hue, and molding stability. Examples of phosphorus stabilizers include phosphorous acid, phosphoric acid, phosphonous acid, phosphonic acid and esters thereof, and tertiary phosphine. Specifically, as the phosphite compound, for example, triphenyl phosphite, tris (nonylphenyl) phosphite, tridecyl phosphite, trioctyl phosphite, trioctadecyl phosphite, didecyl monophenyl phosphite, dioctyl monophenyl Phosphite, diisopropyl monophenyl phosphite, monobutyl diphenyl phosphite, monodecyl diphenyl phosphite, monooctyl diphenyl phosphite, 2,2-methylenebis (4,6-di-tert-butylphenyl) octyl phosphite, tris ( Diethylphenyl) phosphite, tris (di-iso-propylphenyl) phosphite, tris (di-n-butylphenyl) phosphite, tris (2,4-di-tert-butylpheny) ) Phosphite, tris (2,6-di-tert-butylphenyl) phosphite, distearyl pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis (2 , 6-Di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4-ethylphenyl) pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite Phyto, bis (nonylphenyl) pentaerythritol diphosphite, dicyclohexyl pentaerythritol diphosphite, and the like. Further, as other phosphite compounds, those which react with dihydric phenols and have a cyclic structure can be used. For example, 2,2′-methylenebis (4,6-di-tert-butylphenyl) (2,4-di-tert-butylphenyl) phosphite, 2,2′-methylenebis (4,6-di-tert- Butylphenyl) (2-tert-butyl-4-methylphenyl) phosphite, 2,2′-methylenebis (4-methyl-6-tert-butylphenyl) (2-tert-butyl-4-methylphenyl) phosphite 2,2′-ethylidenebis (4-methyl-6-tert-butylphenyl) (2-tert-butyl-4-methylphenyl) phosphite. Examples of the phosphate compound include tributyl phosphate, trimethyl phosphate, tricresyl phosphate, triphenyl phosphate, trichlorophenyl phosphate, triethyl phosphate, diphenyl cresyl phosphate, diphenyl monoorthoxenyl phosphate, tributoxyethyl phosphate, dibutyl phosphate, dioctyl phosphate, Examples thereof include diisopropyl phosphate, and triphenyl phosphate and trimethyl phosphate are preferable.
ホスホナイト化合物としては、テトラキス(2,4−ジ−tert−ブチルフェニル)−4,4’−ビフェニレンジホスホナイト、テトラキス(2,4−ジ−tert−ブチルフェニル)−4,3’−ビフェニレンジホスホナイト、テトラキス(2,4−ジ−tert−ブチルフェニル)−3,3’−ビフェニレンジホスホナイト、テトラキス(2,6−ジ−tert−ブチルフェニル)−4,4’−ビフェニレンジホスホナイト、テトラキス(2,6−ジ−tert−ブチルフェニル)−4,3’−ビフェニレンジホスホナイト、テトラキス(2,6−ジ−tert−ブチルフェニル)−3,3’−ビフェニレンジホスホナイト、ビス(2,4−ジ−tert−ブチルフェニル)−4−フェニル−フェニルホスホナイト、ビス(2,4−ジ−tert−ブチルフェニル)−3−フェニル−フェニルホスホナイト、ビス(2,6−ジ−n−ブチルフェニル)−3−フェニル−フェニルホスホナイト、ビス(2,6−ジ−tert−ブチルフェニル)−4−フェニル−フェニルホスホナイト、ビス(2,6−ジ−tert−ブチルフェニル)−3−フェニル−フェニルホスホナイト等が挙げられ、テトラキス(ジ−tert−ブチルフェニル)−ビフェニレンジホスホナイト、ビス(ジ−tert−ブチルフェニル)−フェニル−フェニルホスホナイトが好ましく、テトラキス(2,4−ジ−tert−ブチルフェニル)−ビフェニレンジホスホナイト、ビス(2,4−ジ−tert−ブチルフェニル)−フェニル−フェニルホスホナイトがより好ましい。かかるホスホナイト化合物は上記アルキル基が2以上置換したアリール基を有するホスファイト化合物との併用可能であり好ましい。ホスホネイト化合物としては、ベンゼンホスホン酸ジメチル、ベンゼンホスホン酸ジエチル、およびベンゼンホスホン酸ジプロピル等が挙げられる。第3級ホスフィンとしては、トリエチルホスフィン、トリプロピルホスフィン、トリブチルホスフィン、トリオクチルホスフィン、トリアミルホスフィン、ジメチルフェニルホスフィン、ジブチルフェニルホスフィン、ジフェニルメチルホスフィン、ジフェニルオクチルホスフィン、トリフェニルホスフィン、トリ−p−トリルホスフィン、トリナフチルホスフィン、およびジフェニルベンジルホスフィンなどが例示される。特に好ましい第3級ホスフィンは、トリフェニルホスフィンである。上記リン系安定剤は、1種のみならず2種以上を混合して用いることができる。上記リン系安定剤の中でもトリメチルホスフェートに代表されるアルキルホスフェート化合物が配合されることが好ましい。またかかるアルキルホスフェート化合物と、ホスファイト化合物および/またはホスホナイト化合物との併用も好ましい態様である。 Examples of the phosphonite compound include tetrakis (2,4-di-tert-butylphenyl) -4,4′-biphenylenediphosphonite, tetrakis (2,4-di-tert-butylphenyl) -4,3′-biphenylenedi. Phosphonite, tetrakis (2,4-di-tert-butylphenyl) -3,3′-biphenylenediphosphonite, tetrakis (2,6-di-tert-butylphenyl) -4,4′-biphenylenediphosphonite Tetrakis (2,6-di-tert-butylphenyl) -4,3′-biphenylene diphosphonite, tetrakis (2,6-di-tert-butylphenyl) -3,3′-biphenylene diphosphonite, bis (2,4-di-tert-butylphenyl) -4-phenyl-phenylphosphonite, bis (2,4-di tert-butylphenyl) -3-phenyl-phenylphosphonite, bis (2,6-di-n-butylphenyl) -3-phenyl-phenylphosphonite, bis (2,6-di-tert-butylphenyl)- Examples include 4-phenyl-phenylphosphonite, bis (2,6-di-tert-butylphenyl) -3-phenyl-phenylphosphonite, and tetrakis (di-tert-butylphenyl) -biphenylenediphosphonite, bis. (Di-tert-butylphenyl) -phenyl-phenylphosphonite is preferred, tetrakis (2,4-di-tert-butylphenyl) -biphenylenediphosphonite, bis (2,4-di-tert-butylphenyl)- More preferred is phenyl-phenylphosphonite. Such a phosphonite compound is preferable because it can be used in combination with a phosphite compound having an aryl group in which two or more alkyl groups are substituted. Examples of the phosphonate compound include dimethyl benzenephosphonate, diethyl benzenephosphonate, and dipropyl benzenephosphonate. Tertiary phosphine includes triethylphosphine, tripropylphosphine, tributylphosphine, trioctylphosphine, triamylphosphine, dimethylphenylphosphine, dibutylphenylphosphine, diphenylmethylphosphine, diphenyloctylphosphine, triphenylphosphine, tri-p-tolyl. Examples include phosphine, trinaphthylphosphine, and diphenylbenzylphosphine. A particularly preferred tertiary phosphine is triphenylphosphine. The phosphorus stabilizers can be used alone or in combination of two or more. Among the phosphorus stabilizers, an alkyl phosphate compound typified by trimethyl phosphate is preferably blended. A combination of such an alkyl phosphate compound and a phosphite compound and / or phosphonite compound is also a preferred embodiment.
(III)ヒンダードフェノール系安定剤
本発明の樹脂組成物には、更にヒンダードフェノール系安定剤を配合することができる。かかる配合は例えば成形加工時の色相悪化や長期間の使用における色相の悪化などを抑制する効果が発揮される。ヒンダードフェノール系安定剤としては、例えば、α−トコフェロール、ブチルヒドロキシトルエン、シナピルアルコール、ビタミンE、n−オクタデシル−β−(4’−ヒドロキシ−3’,5’−ジ−tert−ブチルフェル)プロピオネート、2−tert−ブチル−6−(3’−tert−ブチル−5’−メチル−2’−ヒドロキシベンジル)−4−メチルフェニルアクリレート、2,6−ジ−tert−ブチル−4−(N,N−ジメチルアミノメチル)フェノール、3,5−ジ−tert−ブチル−4−ヒドロキシベンジルホスホネートジエチルエステル、2,2’−メチレンビス(4−メチル−6−tert−ブチルフェノール)、2,2’−メチレンビス(4−エチル−6−tert−ブチルフェノール)、4,4’−メチレンビス(2,6−ジ−tert−ブチルフェノール)、2,2’−メチレンビス(4−メチル−6−シクロヘキシルフェノール)、2,2’−ジメチレン−ビス(6−α−メチル−ベンジル−p−クレゾール)2,2’−エチリデン−ビス(4,6−ジ−tert−ブチルフェノール)、2,2’−ブチリデン−ビス(4−メチル−6−tert−ブチルフェノール)、4,4’−ブチリデンビス(3−メチル−6−tert−ブチルフェノール)、トリエチレングリコール−N−ビス−3−(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオネート、1,6−へキサンジオールビス[3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート]、ビス[2−tert−ブチル−4−メチル6−(3−tert−ブチル−5−メチル−2−ヒドロキシベンジル)フェニル]テレフタレート、3,9−ビス{2−[3−(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ]−1,1,−ジメチルエチル}−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、4,4’−チオビス(6−tert−ブチル−m−クレゾール)、4,4’−チオビス(3−メチル−6−tert−ブチルフェノール)、2,2’−チオビス(4−メチル−6−tert−ブチルフェノール)、ビス(3,5−ジ−tert−ブチル−4−ヒドロキシベンジル)スルフィド、4,4’−ジ−チオビス(2,6−ジ−tert−ブチルフェノール)、4,4’−トリ−チオビス(2,6−ジ−tert−ブチルフェノール)、2,2−チオジエチレンビス−[3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート]、2,4−ビス(n−オクチルチオ)−6−(4−ヒドロキシ−3’,5’−ジ−tert−ブチルアニリノ)−1,3,5−トリアジン、N,N’−ヘキサメチレンビス−(3,5−ジ−tert−ブチル−4−ヒドロキシヒドロシンナミド)、N,N’−ビス[3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオニル]ヒドラジン、1,1,3−トリス(2−メチル−4−ヒドロキシ−5−tert−ブチルフェニル)ブタン、1,3,5−トリメチル−2,4,6−トリス(3,5−ジ−tert−ブチル−4−ヒドロキシベンジル)ベンゼン、トリス(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)イソシアヌレート、トリス(3,5−ジ−tert−ブチル−4−ヒドロキシベンジル)イソシアヌレート、1,3,5−トリス(4−tert−ブチル−3−ヒドロキシ−2,6−ジメチルベンジル)イソシアヌレート、1,3,5−トリス2[3(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオニルオキシ]エチルイソシアヌレート、およびテトラキス[メチレン−3−(3’,5’−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート]メタンなどが例示される。これらはいずれも入手容易である。上記ヒンダードフェノール系安定剤は、単独でまたは2種以上を組合せて使用することができる。リン系安定剤およびヒンダードフェノール系安定剤の配合量は、樹脂組成物100重量部に対し、好ましくは0.0001〜1重量部、より好ましくは0.001〜0.5重量部、さらに好ましくは0.005〜0.3重量部である。
(III) Hindered phenol stabilizer A hindered phenol stabilizer can be further blended in the resin composition of the present invention. Such blending exhibits an effect of suppressing, for example, hue deterioration during molding and hue deterioration during long-term use. Examples of the hindered phenol-based stabilizer include α-tocopherol, butylhydroxytoluene, sinapir alcohol, vitamin E, n-octadecyl-β- (4′-hydroxy-3 ′, 5′-di-tert-butylfel). Propionate, 2-tert-butyl-6- (3′-tert-butyl-5′-methyl-2′-hydroxybenzyl) -4-methylphenyl acrylate, 2,6-di-tert-butyl-4- (N , N-dimethylaminomethyl) phenol, 3,5-di-tert-butyl-4-hydroxybenzylphosphonate diethyl ester, 2,2′-methylenebis (4-methyl-6-tert-butylphenol), 2,2′- Methylene bis (4-ethyl-6-tert-butylphenol), 4,4′-methylene bis (2,6- Di-tert-butylphenol), 2,2′-methylenebis (4-methyl-6-cyclohexylphenol), 2,2′-dimethylene-bis (6-α-methyl-benzyl-p-cresol) 2,2′- Ethylidene-bis (4,6-di-tert-butylphenol), 2,2'-butylidene-bis (4-methyl-6-tert-butylphenol), 4,4'-butylidenebis (3-methyl-6-tert- Butylphenol), triethylene glycol-N-bis-3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate, 1,6-hexanediol bis [3- (3,5-di-tert -Butyl-4-hydroxyphenyl) propionate], bis [2-tert-butyl-4-methyl 6- (3-tert-butyl) -5-methyl-2-hydroxybenzyl) phenyl] terephthalate, 3,9-bis {2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1,1,- Dimethylethyl} -2,4,8,10-tetraoxaspiro [5,5] undecane, 4,4′-thiobis (6-tert-butyl-m-cresol), 4,4′-thiobis (3-methyl) -6-tert-butylphenol), 2,2'-thiobis (4-methyl-6-tert-butylphenol), bis (3,5-di-tert-butyl-4-hydroxybenzyl) sulfide, 4,4'- Di-thiobis (2,6-di-tert-butylphenol), 4,4′-tri-thiobis (2,6-di-tert-butylphenol), 2,2-thiodiethyl Nbis- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 2,4-bis (n-octylthio) -6- (4-hydroxy-3 ′, 5′-di- tert-butylanilino) -1,3,5-triazine, N, N′-hexamethylenebis- (3,5-di-tert-butyl-4-hydroxyhydrocinnamide), N, N′-bis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyl] hydrazine, 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5 -Trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, tris (3,5-di-tert-butyl-4-hydroxyphenyl) iso Anurate, tris (3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate, 1,3,5-tris (4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl) isocyanurate, 1,3,5-tris 2 [3 (3,5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] ethyl isocyanurate and tetrakis [methylene-3- (3 ′, 5′-di-tert -Butyl-4-hydroxyphenyl) propionate] methane and the like. All of these are readily available. The said hindered phenol type stabilizer can be used individually or in combination of 2 or more types. The blending amount of the phosphorus stabilizer and the hindered phenol stabilizer is preferably 0.0001 to 1 part by weight, more preferably 0.001 to 0.5 part by weight, and further preferably 100 parts by weight of the resin composition. Is 0.005 to 0.3 parts by weight.
(IV)前記以外の熱安定剤
本発明の樹脂組成物には、前記リン系安定剤およびヒンダードフェノール系安定剤以外の他の熱安定剤を配合することもできる。かかる他の熱安定剤としては、例えば3−ヒドロキシ−5,7−ジ−tert−ブチル−フラン−2−オンとo−キシレンとの反応生成物に代表されるラクトン系安定剤が好適に例示される。かかる安定剤の詳細は特開平7−233160号公報に記載されている。かかる化合物はIrganox HP−136(商標、CIBA SPECIALTY CHEMICALS社製)として市販され、該化合物を利用できる。更に該化合物と各種のホスファイト化合物およびヒンダードフェノール化合物を混合した安定剤が市販されている。例えば前記社製のIrganoxHP−2921が好適に例示される。ラクトン系安定剤の配合量は、樹脂組成物100重量部に対して好ましくは0.0005〜0.05重量部、より好ましくは0.001〜0.03重量部である。またその他の安定剤としては、ペンタエリスリトールテトラキス(3−メルカプトプロピオネート)、ペンタエリスリトールテトラキス(3−ラウリルチオプロピオネート)、およびグリセロール−3−ステアリルチオプロピオネートなどのイオウ含有安定剤が例示される。かかるイオウ含有安定剤の配合量は、樹脂組成物100重量部に対して好ましくは0.001〜0.1重量部、より好ましくは0.01〜0.08重量部である。本発明の樹脂組成物には、必要に応じてエポキシ化合物を配合することができる。かかるエポキシ化合物は、金型腐食を抑制するという目的で配合されるものであり、基本的にエポキシ官能基を有するもの全てが適用できる。好ましいエポキシ化合物の具体例としては、3,4ーエポキシシクロヘキシルメチルー3’,4’ーエポキシシクロヘキシルカルボキシレート、2,2−ビス(ヒドロキシメチル)−1−ブタノールの1,2−エポキシ−4−(2−オキシラニル)シクロセキサン付加物、メチルメタクリレートとグリシジルメタクリレートの共重合体、スチレンとグリシジルメタクリレートの共重合体等が挙げられる。かかるエポキシ化合物の添加量としては、樹脂組成物100重量部に対して0.003〜0.2重量部が好ましく、より好ましくは0.004〜0.15重量部であり、さらに好ましくは0.005〜0.1重量部である。
(IV) Heat stabilizer other than the above The resin composition of the present invention may contain a heat stabilizer other than the phosphorus stabilizer and the hindered phenol stabilizer. Preferable examples of such other heat stabilizers include lactone stabilizers represented by a reaction product of 3-hydroxy-5,7-di-tert-butyl-furan-2-one and o-xylene. Is done. Details of such a stabilizer are described in JP-A-7-233160. Such a compound is commercially available as Irganox HP-136 (trademark, manufactured by CIBA SPECIALTY CHEMICALS) and can be used. Furthermore, a stabilizer obtained by mixing the compound with various phosphite compounds and hindered phenol compounds is commercially available. For example, Irganox HP-2921 manufactured by the above company is preferably exemplified. The blending amount of the lactone stabilizer is preferably 0.0005 to 0.05 parts by weight, more preferably 0.001 to 0.03 parts by weight with respect to 100 parts by weight of the resin composition. Other stabilizers include sulfur-containing stabilizers such as pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tetrakis (3-laurylthiopropionate), and glycerol-3-stearylthiopropionate. Illustrated. The amount of the sulfur-containing stabilizer is preferably 0.001 to 0.1 parts by weight, more preferably 0.01 to 0.08 parts by weight, based on 100 parts by weight of the resin composition. An epoxy compound can be mix | blended with the resin composition of this invention as needed. Such an epoxy compound is blended for the purpose of suppressing mold corrosion, and basically any compound having an epoxy functional group can be applied. Specific examples of preferable epoxy compounds include 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexylcarboxylate, 1,2-epoxy-4-butane of 2,2-bis (hydroxymethyl) -1-butanol. Examples include (2-oxiranyl) cyclosexane adduct, a copolymer of methyl methacrylate and glycidyl methacrylate, and a copolymer of styrene and glycidyl methacrylate. The addition amount of the epoxy compound is preferably 0.003 to 0.2 parts by weight, more preferably 0.004 to 0.15 parts by weight, and still more preferably 0.000 to 0.15 parts by weight with respect to 100 parts by weight of the resin composition. 005 to 0.1 parts by weight.
(V)紫外線吸収剤
本発明の樹脂組成物においては、耐光性を付与することを目的として紫外線吸収剤の配合も可能である。紫外線吸収剤としては、具体的にはベンゾフェノン系では、例えば、2,4−ジヒドロキシベンゾフェノン、2−ヒドロキシ−4−メトキシベンゾフェノン、2−ヒドロキシ−4−オクトキシベンゾフェノン、2−ヒドロキシ−4−ベンジロキシベンゾフェノン、2−ヒドロキシ−4−メトキシ−5−スルホキシベンゾフェノン、2,2’−ジヒドロキシ−4−メトキシベンゾフェノン、2,2’,4,4’−テトラヒドロキシベンゾフェノン、2,2’−ジヒドロキシ−4,4’−ジメトキシベンゾフェノン、2,2’−ジヒドロキシ−4,4’−ジメトキシ−5−ソジウムスルホキシベンゾフェノン、ビス(5−ベンゾイル−4−ヒドロキシ−2−メトキシフェニル)メタン、2−ヒドロキシ−4−n−ドデシルオキシベンソフェノン、および2−ヒドロキシ−4−メトキシ−2’−カルボキシベンゾフェノンなどが例示される。紫外線吸収剤としては、具体的に、ベンゾトリアゾール系では、例えば、2−(2−ヒドロキシ−5−メチルフェニル)ベンゾトリアゾ−ル、2−(2−ヒドロキシ−5−tert−オクチルフェニル)ベンゾトリアゾ−ル、2−(2−ヒドロキシ−3,5−ジクミルフェニル)フェニルベンゾトリアゾール、2−(2−ヒドロキシ−3−tert−ブチル−5−メチルフェニル)−5−クロロベンゾトリアゾール、2,2’−メチレンビス[4−(1,1,3,3−テトラメチルブチル)−6−(2H−ベンゾトリアゾール−2−イル)フェノール]、2−(2−ヒドロキシ−3,5−ジ−tert−ブチルフェニル)ベンゾトリアゾ−ル、2−(2−ヒドロキシ−3,5−ジ−tert−ブチルフェニル)−5−クロロベンゾトリアゾール、2−(2−ヒドロキシ−3,5−ジ−tert−アミルフェニル)ベンゾトリアゾ−ル、2−(2−ヒドロキシ−5−tert−オクチルフェニル)ベンゾトリアゾ−ル、2−(2−ヒドロキシ−5−tert−ブチルフェニル)ベンゾトリアゾ−ル、2−(2−ヒドロキシ−4−オクトキシフェニル)ベンゾトリアゾ−ル、2,2’−メチレンビス(4−クミル−6−ベンゾトリアゾールフェニル)、2,2’−p−フェニレンビス(1,3−ベンゾオキサジン−4−オン)、および2−[2−ヒドロキシ−3−(3,4,5,6−テトラヒドロフタルイミドメチル)−5−メチルフェニル]ベンゾトリアゾ−ル、並びに2−(2’−ヒドロキシ−5−メタクリロキシエチルフェニル)−2H−ベンゾトリアゾールと該モノマーと共重合可能なビニル系モノマーとの共重合体や2−(2’―ヒドロキシ−5−アクリロキシエチルフェニル)―2H―ベンゾトリアゾールと該モノマーと共重合可能なビニル系モノマーとの共重合体などの2−ヒドロキシフェニル−2H−ベンゾトリアゾール骨格を有する重合体などが例示される。紫外線吸収剤は、具体的に、ヒドロキシフェニルトリアジン系では、例えば、2−(4,6−ジフェニル−1,3,5−トリアジン−2−イル)−5−ヘキシルオキシフェノール、2−(4,6−ジフェニル−1,3,5−トリアジン−2−イル)−5−メチルオキシフェノール、2−(4,6−ジフェニル−1,3,5−トリアジン−2−イル)−5−エチルオキシフェノール、2−(4,6−ジフェニル−1,3,5−トリアジン−2−イル)−5−プロピルオキシフェノール、および2−(4,6−ジフェニル−1,3,5−トリアジン−2−イル)−5−ブチルオキシフェノールなどが例示される。さらに2−(4,6−ビス(2,4−ジメチルフェニル)−1,3,5−トリアジン−2−イル)−5−ヘキシルオキシフェノールなど、上記例示化合物のフェニル基が2,4−ジメチルフェニル基となった化合物が例示される。紫外線吸収剤は、具体的に環状イミノエステル系では、例えば2,2’−p−フェニレンビス(3,1−ベンゾオキサジン−4−オン)、2,2’−m−フェニレンビス(3,1−ベンゾオキサジン−4−オン)、および2,2’−p,p’−ジフェニレンビス(3,1−ベンゾオキサジン−4−オン)などが例示される。また紫外線吸収剤としては、具体的にシアノアクリレート系では、例えば1,3−ビス−[(2’−シアノ−3’,3’−ジフェニルアクリロイル)オキシ]−2,2−ビス[(2−シアノ−3,3−ジフェニルアクリロイル)オキシ]メチル)プロパン、および1,3−ビス−[(2−シアノ−3,3−ジフェニルアクリロイル)オキシ]ベンゼンなどが例示される。さらに上記紫外線吸収剤は、ラジカル重合が可能な単量体化合物の構造をとることにより、かかる紫外線吸収性単量体および/または光安定性単量体と、アルキル(メタ)アクリレートなどの単量体とを共重合したポリマー型の紫外線吸収剤であってもよい。前記紫外線吸収性単量体としては、(メタ)アクリル酸エステルのエステル置換基中にベンゾトリアゾール骨格、ベンゾフェノン骨格、トリアジン骨格、環状イミノエステル骨格、およびシアノアクリレート骨格を含有する化合物が好適に例示される。前記の中でも紫外線吸収能の点においてはベンゾトリアゾール系およびヒドロキシフェニルトリアジン系が好ましく、耐熱性や色相の点では、環状イミノエステル系およびシアノアクリレート系が好ましい。具体的には例えばケミプロ化成(株)「ケミソーブ79」などが挙げられる。前記紫外線吸収剤は単独であるいは2種以上の混合物で用いてもよい。紫外線吸収剤の配合量は、樹脂組成物100重量部に対して好ましくは0.01〜2重量部、より好ましくは0.02〜2重量部、さらに好ましくは0.03〜1重量部、特に好ましくは0.05〜0.5重量部である。
(V) Ultraviolet absorber In the resin composition of this invention, the mixing | blending of an ultraviolet absorber is also possible for the purpose of providing light resistance. Specific examples of the ultraviolet absorber include benzophenone-based compounds such as 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, and 2-hydroxy-4-benzyloxy. Benzophenone, 2-hydroxy-4-methoxy-5-sulfoxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 2,2'-dihydroxy-4 , 4′-dimethoxybenzophenone, 2,2′-dihydroxy-4,4′-dimethoxy-5-sodiumsulfoxybenzophenone, bis (5-benzoyl-4-hydroxy-2-methoxyphenyl) methane, 2-hydroxy- 4-n-dodecyloxybenzophenone, and 2- Examples thereof include hydroxy-4-methoxy-2′-carboxybenzophenone. Specific examples of the ultraviolet absorber include, for example, 2- (2-hydroxy-5-methylphenyl) benzotriazole and 2- (2-hydroxy-5-tert-octylphenyl) benzotriazole in the benzotriazole series. 2- (2-hydroxy-3,5-dicumylphenyl) phenylbenzotriazole, 2- (2-hydroxy-3-tert-butyl-5-methylphenyl) -5-chlorobenzotriazole, 2,2′- Methylenebis [4- (1,1,3,3-tetramethylbutyl) -6- (2H-benzotriazol-2-yl) phenol], 2- (2-hydroxy-3,5-di-tert-butylphenyl) ) Benzotriazole, 2- (2-hydroxy-3,5-di-tert-butylphenyl) -5-chlorobenzotriazole 2- (2-hydroxy-3,5-di-tert-amylphenyl) benzotriazole, 2- (2-hydroxy-5-tert-octylphenyl) benzotriazole, 2- (2-hydroxy-5- tert-butylphenyl) benzotriazole, 2- (2-hydroxy-4-octoxyphenyl) benzotriazole, 2,2'-methylenebis (4-cumyl-6-benzotriazolephenyl), 2,2'-p -Phenylenebis (1,3-benzoxazin-4-one), and 2- [2-hydroxy-3- (3,4,5,6-tetrahydrophthalimidomethyl) -5-methylphenyl] benzotriazole, and Copolymerizable with 2- (2′-hydroxy-5-methacryloxyethylphenyl) -2H-benzotriazole and the monomer 2-hydroxy such as copolymers with vinyl monomers and copolymers of 2- (2′-hydroxy-5-acryloxyethylphenyl) -2H-benzotriazole and vinyl monomers copolymerizable with the monomers Examples thereof include a polymer having a phenyl-2H-benzotriazole skeleton. Specifically, the ultraviolet absorber is, for example, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-hexyloxyphenol, 2- (4, 4-hydroxyphenyltriazine). 6-diphenyl-1,3,5-triazin-2-yl) -5-methyloxyphenol, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-ethyloxyphenol 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-propyloxyphenol, and 2- (4,6-diphenyl-1,3,5-triazin-2-yl) ) -5-butyloxyphenol and the like. Furthermore, the phenyl group of the above exemplary compounds such as 2- (4,6-bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl) -5-hexyloxyphenol is 2,4-dimethyl. Examples of the compound are phenyl groups. Specifically, in the case of the cyclic imino ester, the ultraviolet absorber is, for example, 2,2′-p-phenylenebis (3,1-benzoxazin-4-one), 2,2′-m-phenylenebis (3,1). -Benzoxazin-4-one), 2,2'-p, p'-diphenylenebis (3,1-benzoxazin-4-one) and the like. Further, as the ultraviolet absorber, specifically, for cyanoacrylate, for example, 1,3-bis-[(2′-cyano-3 ′, 3′-diphenylacryloyl) oxy] -2,2-bis [(2- Examples include cyano-3,3-diphenylacryloyl) oxy] methyl) propane and 1,3-bis-[(2-cyano-3,3-diphenylacryloyl) oxy] benzene. Furthermore, the ultraviolet absorber has a structure of a monomer compound capable of radical polymerization, so that the ultraviolet absorbent monomer and / or the light stable monomer and a single amount of alkyl (meth) acrylate or the like can be obtained. It may be a polymer type ultraviolet absorber copolymerized with a body. Preferred examples of the ultraviolet absorbing monomer include compounds containing a benzotriazole skeleton, a benzophenone skeleton, a triazine skeleton, a cyclic imino ester skeleton, and a cyanoacrylate skeleton in the ester substituent of (meth) acrylic acid ester. The Among them, benzotriazole and hydroxyphenyltriazine are preferable in terms of ultraviolet absorption ability, and cyclic imino ester and cyanoacrylate are preferable in terms of heat resistance and hue. Specifically, Chemipro Kasei Co., Ltd. “Chemisorb 79” and the like can be mentioned. You may use the said ultraviolet absorber individually or in mixture of 2 or more types. The blending amount of the ultraviolet absorber is preferably 0.01 to 2 parts by weight, more preferably 0.02 to 2 parts by weight, still more preferably 0.03 to 1 part by weight, particularly 100 parts by weight of the resin composition. Preferably it is 0.05-0.5 weight part.
(VI)その他
上記以外にも本発明の樹脂組成物には、成形品に種々の機能の付与や特性改善のために、それ自体知られた添加物を少割合配合することができる。これら添加物は本発明の目的を損なわない限り、通常の配合量である。かかる添加剤としては、強化充填剤、摺動剤(例えばPTFE粒子)、着色剤(例えばカーボンブラック、酸化チタンなどの顔料、染料)、帯電防止剤、結晶核剤、無機および有機の抗菌剤、光触媒系防汚剤(例えば微粒子酸化チタン、微粒子酸化亜鉛)、離型剤、流動改質剤、ラジカル発生剤、赤外線吸収剤(熱線吸収剤)、並びにフォトクロミック剤などが挙げられる。
(VI) Others In addition to the above, the resin composition of the present invention may contain a small amount of additives known per se for imparting various functions to the molded product and improving the properties. These additives are used in usual amounts as long as the object of the present invention is not impaired. Examples of such additives include reinforcing fillers, sliding agents (for example, PTFE particles), colorants (for example, pigments and dyes such as carbon black and titanium oxide), antistatic agents, crystal nucleating agents, inorganic and organic antibacterial agents, Examples thereof include photocatalytic antifouling agents (for example, fine particle titanium oxide and fine particle zinc oxide), mold release agents, flow modifiers, radical generators, infrared absorbers (heat ray absorbers), and photochromic agents.
本発明の樹脂組成物は、単軸押出機、二軸押出機の如き押出機を用いて、溶融混練することによりペレット化することができる。かかるペレットを作製するにあたり、上記各種難燃剤、強化充填剤、添加剤を配合することもできる。本発明の樹脂組成物は、通常前記の如く製造されたペレットを射出成形して各種製品を製造することができる。更にペレットを経由することなく、押出機で溶融混練された樹脂を直接シート、フィルム、異型押出成形品、ダイレクトブロー成形品、および射出成形品にすることも可能である。かかる射出成形においては、通常の成形方法だけでなく、適宜目的に応じて、射出圧縮成形、射出プレス成形、ガスアシスト射出成形、発泡成形(超臨界流体の注入によるものを含む)、インサート成形、インモールドコーティング成形、断熱金型成形、急速加熱冷却金型成形、二色成形、サンドイッチ成形、および超高速射出成形などの射出成形法を用いて成形品を得ることができる。これら各種成形法の利点は既に広く知られるところである。また成形はコールドランナー方式およびホットランナー方式のいずれも選択することができる。また本発明の樹脂組成物は、押出成形により各種異形押出成形品、シート、およびフィルムなどの形で利用することもできる。またシート、フィルムの成形にはインフレーション法や、カレンダー法、キャスティング法なども使用可能である。さらに特定の延伸操作をかけることにより熱収縮チューブとして成形することも可能である。また本発明の樹脂組成物を回転成形やブロー成形などにより成形品とすることも可能である。 The resin composition of the present invention can be pelletized by melt kneading using an extruder such as a single screw extruder or a twin screw extruder. In producing such pellets, the above-mentioned various flame retardants, reinforcing fillers and additives can be blended. The resin composition of the present invention can be usually produced by injection-molding pellets produced as described above to produce various products. Furthermore, the resin melt-kneaded by an extruder can be directly made into a sheet, a film, a profile extrusion molded product, a direct blow molded product, and an injection molded product without going through pellets. In such injection molding, not only a normal molding method but also an injection compression molding, an injection press molding, a gas assist injection molding, a foam molding (including those by injection of a supercritical fluid), an insert molding, depending on the purpose as appropriate. A molded product can be obtained using an injection molding method such as in-mold coating molding, heat insulating mold molding, rapid heating / cooling mold molding, two-color molding, sandwich molding, and ultrahigh-speed injection molding. The advantages of these various molding methods are already widely known. In addition, either a cold runner method or a hot runner method can be selected for molding. Moreover, the resin composition of this invention can also be utilized in the form of various profile extrusion-molded articles, a sheet | seat, a film, etc. by extrusion molding. For forming sheets and films, an inflation method, a calendar method, a casting method, or the like can also be used. It is also possible to form a heat-shrinkable tube by applying a specific stretching operation. The resin composition of the present invention can be formed into a molded product by rotational molding, blow molding or the like.
<樹脂組成物の製造について>
本発明の樹脂組成物を製造するには、任意の方法が採用される。例えばA成分、B成分、C成分および任意に他の成分をそれぞれV型ブレンダー、ヘンシェルミキサー、メカノケミカル装置、押出混合機などの予備混合手段を用いて充分に混合した後、必要に応じて押出造粒器やブリケッティングマシーンなどにより造粒を行い、その後ベント式二軸ルーダーに代表される溶融混練機で溶融混練、およびペレタイザー等の機器によりペレット化する方法が挙げられる。
<About production of resin composition>
Arbitrary methods are employ | adopted in order to manufacture the resin composition of this invention. For example, component A, component B, component C and optionally other components are mixed thoroughly using premixing means such as a V-type blender, Henschel mixer, mechanochemical device, extrusion mixer, etc., and then extruded as necessary. Examples of the method include granulating with a granulator, a briquetting machine, and the like, and then melt-kneading with a melt-kneader represented by a vent type biaxial ruder and pelletizing with a device such as a pelletizer.
<成形品の製造>
本発明の樹脂組成物は通常かかるペレットを射出成形して成形品を得ることができる。
かかる射出成形においては、通常のコールドランナー方式の成形法だけでなく、ランナーレスを可能とするホットランナーによって製造することも可能である。また射出成形においても、通常の成形方法だけでなくガスアシスト射出成形、射出圧縮成形、超高速射出成形、射出プレス成形、二色成形、サンドイッチ成形、インモールドコーティング成形、インサート成形、発泡成形(超臨界流体を利用するものを含む)、急速加熱冷却金型成形、断熱金型成形および金型内再溶融成形、並びにこれらの組合せからなる成形法等を使用することができる。さらに樹脂組成物から形成された成形品には、各種の表面処理を行うことが可能である。表面処理としては、加飾塗装、ハードコート、撥水・撥油コート、親水コート、紫外線吸収コート、赤外線吸収コート、電磁波吸収コート、発熱コート、帯電防止コート、制電コート、導電コート、並びにメタライジング(メッキ、化学蒸着(CVD)、物理蒸着(PVD)、溶射など)などの各種の表面処理を行うことができる。殊に透明シートに透明導電層が被覆されたものは好適である。
<Manufacture of molded products>
The resin composition of the present invention can usually be obtained by injection molding such pellets.
In such injection molding, not only a normal cold runner type molding method but also a hot runner that enables runnerlessness can be used. Also in injection molding, not only ordinary molding methods, but also gas-assisted injection molding, injection compression molding, ultra-high speed injection molding, injection press molding, two-color molding, sandwich molding, in-mold coating molding, insert molding, foam molding (ultra-molding) Including those using critical fluids), rapid heating / cooling mold forming, heat insulating mold forming and in-mold remelt molding, and combinations of these, etc. can be used. Furthermore, various surface treatments can be performed on the molded product formed from the resin composition. Surface treatment includes decorative coating, hard coat, water / oil repellent coat, hydrophilic coat, UV absorbing coat, infrared absorbing coat, electromagnetic wave absorbing coat, heat generating coat, antistatic coat, antistatic coating, conductive coating, and meta coating. Various surface treatments such as rising (plating, chemical vapor deposition (CVD), physical vapor deposition (PVD), thermal spraying, etc.) can be performed. In particular, a transparent sheet coated with a transparent conductive layer is preferred.
本発明において得られる蛍光発光性樹脂組成物は、その成形体において、優れた色相、導光性および蛍光発光性を発揮するため、視認性を向上させた電飾看板、照明ディスプレイ、交通標識、サインボード、スクリーンなどの従来用途のみならず、LED照明の蛍光発光部位、導光板、面光源体など幅広く使用することができる。 In the molded product, the fluorescent light-emitting resin composition obtained in the present invention exhibits excellent hue, light guiding properties and fluorescent light-emitting properties. Therefore, an electric signboard, an illumination display, a traffic sign, Not only conventional applications such as signboards and screens, but also a wide range of uses such as fluorescent light emitting portions of LED lighting, light guide plates, and surface light source bodies.
本発明者が現在最良と考える本発明の形態は、前記の各要件の好ましい範囲を集約したものとなるが、例えば、その代表例を下記の実施例中に記載する。もちろん本発明はこれらの形態に限定されるものではない The form of the present invention considered to be the best by the present inventor is a collection of the preferable ranges of the above requirements. For example, typical examples are described in the following examples. Of course, the present invention is not limited to these forms.
以下に実施例を挙げてさらに説明するが、本発明はそれに限定されるものではない。
尚、評価としては以下の項目について実施した。
The present invention will be further described below with reference to examples, but the present invention is not limited thereto.
The following items were evaluated.
(1)平均輝度
実施例の各組成から得られたペレットを120℃で5時間、熱風循環式乾燥機にて乾燥し、射出成形機[住友重機械工業(株)SG150U・S−M IV]を用いて、成形温度280℃、金型温度80℃にて幅100mm、長さ100mm、厚みが5.0mmである平滑平面板を成形した。この平滑平面板の片面側から青色LEDを入射させ、透過光の輝度をトプコン社製BM−7を用いて測定した。平均輝度を幅3水準、長さ3水準の合計9箇所の測定値を平均して求めた。なお入射光としては、青色LEDとして市販のLT201201BLN((株)ヤザワコーポレーション製)を18ミリピッチで実装したものを光源として用いた(消費電力 約30W)。
(1) Average brightness The pellets obtained from each composition of the examples were dried at 120 ° C. for 5 hours in a hot air circulating dryer, and an injection molding machine [Sumitomo Heavy Industries, Ltd. SG150U · SM IV] Was used to mold a smooth flat plate having a width of 100 mm, a length of 100 mm, and a thickness of 5.0 mm at a molding temperature of 280 ° C. and a mold temperature of 80 ° C. A blue LED was incident from one side of the smooth flat plate, and the brightness of the transmitted light was measured using BM-7 manufactured by Topcon Corporation. The average luminance was obtained by averaging the measured values at a total of 9 locations, 3 levels wide and 3 levels long. In addition, as incident light, what mounted commercially available LT201101BLN (product made from Yazawa Corporation) as a blue LED by 18 millimeter pitch was used as a light source (power consumption about 30W).
(2)色相(白色度)
上記平滑平面板の片面側から青色LEDを入射させ、透過光の色度(x,y)をトプコン社製BM−7を用いて測定した。CIE表示系において、白色は理論上、x+y+z=1,x=y=zを満たす値であり、実施例における白色の色度を(0.33,0.33)と定義する。この時、白色度(Δ(x,y))は、以下の式(1)より算出した数値で評価を行った。なお数値は小さいほど好ましく、透過光の色相が白色に近い事を意味する。なお入射光としては、青色LEDとして市販のLT201201BLN((株)ヤザワコーポレーション製)を18ミリピッチで実装したものを光源として用いた(消費電力 約30W)。
Δ(x,y)=[(x−0.33)2+(y−0.33)2]1/2 (1)
(x,y):透過光の色度
(2) Hue (whiteness)
A blue LED was incident from one side of the smooth flat plate, and the chromaticity (x, y) of transmitted light was measured using BM-7 manufactured by Topcon Corporation. In the CIE display system, white is theoretically a value satisfying x + y + z = 1, x = y = z, and the white chromaticity in the example is defined as (0.33, 0.33). At this time, the whiteness (Δ (x, y)) was evaluated by a numerical value calculated from the following equation (1). In addition, a numerical value is so preferable that it is small, and it means that the hue of transmitted light is close to white. In addition, as incident light, what mounted commercially available LT201101BLN (product made from Yazawa Corporation) as a blue LED by 18 millimeter pitch was used as a light source (power consumption about 30W).
Δ (x, y) = [(x−0.33) 2 + (y−0.33) 2 ] 1/2 (1)
(X, y): chromaticity of transmitted light
[実施例1〜10、および比較例1〜4]
A〜C成分および各種添加剤を表1および表2記載の各配合量で、ブレンダーにて混合した後、ベント式二軸押出機を用いて溶融混練してペレットを得た。使用する各種添加剤は、それぞれ配合量の10〜100倍の濃度を目安に予めポリカーボネート樹脂との予備混合物を作成した後、ブレンダーによる全体の混合を行った。ベント式二軸押出機は(株)日本製鋼所製:TEX30α(完全かみ合い、同方向回転、2条ネジスクリュー)を使用した。押出条件は吐出量20kg/h、スクリュー回転数150rpm、ベントの真空度3kPaであり、また押出温度は第一供給口から第二供給口まで270℃、第二供給口からダイス部分まで290℃とした。評価結果を表1および表2に示す。
[Examples 1 to 10 and Comparative Examples 1 to 4]
The components A to C and various additives were mixed in the blending amounts shown in Tables 1 and 2 with a blender, and then melt-kneaded using a vent type twin screw extruder to obtain pellets. Various additives to be used were prepared in advance by premixing with a polycarbonate resin with a concentration of 10 to 100 times the blending amount as a guide, and then the whole was mixed by a blender. The vent type twin screw extruder used was TEX30α (completely meshing, rotating in the same direction, two-thread screw) manufactured by Nippon Steel Works. The extrusion conditions were a discharge rate of 20 kg / h, a screw rotation speed of 150 rpm, a vent vacuum of 3 kPa, and an extrusion temperature of 270 ° C. from the first supply port to the second supply port and 290 ° C. from the second supply port to the die part. did. The evaluation results are shown in Tables 1 and 2.
なお、使用した各成分の詳細は以下の通りである。
(A成分)
A−1:下記製法により得られた粘度平均分子量19,700のポリカーボネート樹脂パウダー
温度計、攪拌機、還流冷却器付き反応器にイオン交換水2340部、25%水酸化ナトリウム水溶液947部、ハイドロサルファイト0.7部を仕込み、攪拌下に2,2−ビス(4−ヒドロキシフェニル)プロパン(以下「ビスフェノールA」と称する事がある)710部を溶解した後、塩化メチレン2299部と48.5%水酸化ナトリウム水溶液112部を加えて、15〜25℃でホスゲン354部を約90分かけて吹き込みホスゲン化反応を行った。ホスゲン化終了後、11%濃度のp−tert−ブチルフェノールの塩化メチレン溶液148部と48.5%水酸化ナトリウム水溶液88部を加えて、攪拌を停止し、10分間静置分離後、攪拌を行い乳化させ5分後、ホモミキサー(特殊機化工業(株))で回転数1200rpm、バス回数35回で処理し高乳化ドープを得た。該高乳化ドープを重合槽(攪拌機付き)で、無攪拌条件下、温度35℃で3時間反応し重合を終了した。反応終了後、有機相を分離し、塩化メチレンで希釈して水洗した後塩酸酸性にして水洗し、水相の導電率がイオン交換水と殆ど同じになったところで温水を張ったニーダーに投入して、攪拌しながら塩化メチレンを蒸発させ、ポリカーボネートのパウダーを得た。脱水後、熱風循環式乾燥機により120℃で12時間乾燥し、ポリカーボネート樹脂パウダーを得た。
A−2:下記製法により得られた粘度平均分子量20,300の分岐構造を有するポリカーボネート樹脂パウダー
温度計、攪拌機、還流冷却器付き反応器にイオン交換水2340部、25%水酸化ナトリウム水溶液947部、ハイドロサルファイト0.7部を仕込み、攪拌下にビスフェノールA 710部を溶解した(ビスフェノールA溶液)後、塩化メチレン2299部と48.5%水酸化ナトリウム水溶液112部、14%濃度の水酸化ナトリウム水溶液に1,1,1−トリス(4−ヒドロキシフェニル)エタンを25%濃度で溶解した水溶液38.1部(1.00mol%)を加えて、15〜25℃でホスゲン354部を約90分かけて吹き込みホスゲン化反応を行った。ホスゲン化終了後、11%濃度のp−tert−ブチルフェノールの塩化メチレン溶液261部と48.5%水酸化ナトリウム水溶液88部を加えて、攪拌を停止し、10分間静置分離後、攪拌を行い乳化させ5分後、ホモミキサー(特殊機化工業(株))で回転数1200rpm、バス回数35回で処理し高乳化ドープを得た。該高乳化ドープを重合槽(攪拌機付き)で、無攪拌条件下、温度35℃で3時間反応し重合を終了した。反応終了後、有機相を分離し、塩化メチレンで希釈して水洗した後塩酸酸性にして水洗し、水相の導電率がイオン交換水と殆ど同じになったところで温水を張ったニーダーに投入して、攪拌しながら塩化メチレンを蒸発させ、ポリカーボネートのパウダーを得た。脱水後、熱風循環式乾燥機により120℃で12時間乾燥し、分岐構造を有するポリカーボネート樹脂パウダーを得た。
A−3:下記製法により得られた粘度平均分子量20,500のポリカーボネート共重合樹脂パウダー
温度計、攪拌機、還流冷却器付き反応器にイオン交換水2340部、25%水酸化ナトリウム水溶液947部、ハイドロサルファイト0.7部を仕込み、攪拌下にビスフェノールA355部および9,9−ビス(4−ヒドロキシ−3−メチルフェニル)フルオレン551部を溶解した後、塩化メチレン2299部と48.5%水酸化ナトリウム水溶液112部を加えて、15〜25℃でホスゲン354部を約90分かけて吹き込みホスゲン化反応を行った。ホスゲン化終了後、11%濃度のp−tert−ブチルフェノールの塩化メチレン溶液141部と48.5%水酸化ナトリウム水溶液88部を加えて乳化させた後、トリエチルアミン1.0部を加えて28〜33℃で1時間撹拌して反応を終了した。 反応終了後、有機相を分離し、塩化メチレンで希釈して水洗した後塩酸酸性にして水洗し、水相の導電率がイオン交換水と殆ど同じになったところで温水を張ったニーダーに投入して、攪拌しながら塩化メチレンを蒸発させ、ポリカーボネートのパウダーを得た。脱水後、熱風循環式乾燥機により120℃で12時間乾燥し、ポリカーボネート樹脂パウダーを得た。
A−4:下記製法により得られた粘度平均分子量19,100のポリカーボネートーポリジオルガノシロキサン共重合樹脂パウダー
温度計、撹拌機、還流冷却器付き反応器にイオン交換水21591部、48.5%水酸化ナトリウム水溶液3674部を入れ、ビスフェノールA3880部、およびハイドロサルファイト7.6部を溶解した後、塩化メチレン14565部を加え、撹拌下22〜30℃でホスゲン1900部を60分要して吹き込んだ。次に、48.5%水酸化ナトリウム水溶液1131部、p−tert−ブチルフェノール108部を塩化メチレン800部に溶解した溶液を加え、攪拌しながら下記式〔8〕で表されるポリジオルガノシロキサン化合物430部を塩化メチレン1600部に溶解した溶液を、ジヒドロキシアリール末端ポリジオルガノシロキサンが二価フェノール(I)の量1モルあたり0.0008モル/minとなる速度で加えて乳化状態とした後、再度激しく撹拌した。かかる攪拌下、反応液が26℃の状態でトリエチルアミン4.3部を加えて温度26〜31℃において1時間撹拌を続けて反応を終了した。反応終了後、有機相を分離し、塩化メチレンで希釈して水洗した後塩酸酸性にして水洗し、水相の導電率がイオン交換水と殆ど同じになったところで温水を張ったニーダーに投入して、攪拌しながら塩化メチレンを蒸発させ、ポリカーボネート−ポリジオルガノシロキサン共重合のパウダーを得た。脱水後、熱風循環式乾燥機により120℃で12時間乾燥し、ポリカーボネートーポリジオルガノシロキサン共重合樹脂パウダーを得た。
In addition, the detail of each used component is as follows.
(Component A)
A-1: Polycarbonate resin powder thermometer with a viscosity average molecular weight of 19,700 obtained by the following production method, a reactor equipped with a stirrer and a reflux condenser, 2340 parts of ion-exchanged water, 947 parts of 25% aqueous sodium hydroxide solution, hydrosulfite 0.7 part was charged and 710 parts of 2,2-bis (4-hydroxyphenyl) propane (hereinafter sometimes referred to as “bisphenol A”) was dissolved with stirring, and then 2299 parts of methylene chloride and 48.5%. 112 parts of aqueous sodium hydroxide was added, and 354 parts of phosgene was blown in at about 15 to 25 ° C. over about 90 minutes to carry out a phosgenation reaction. After the completion of phosgenation, 148 parts of 11% strength p-tert-butylphenol in methylene chloride and 88 parts of 48.5% aqueous sodium hydroxide solution were added, stirring was stopped, and the mixture was allowed to stand for 10 minutes, followed by stirring. After 5 minutes of emulsification, the mixture was processed with a homomixer (Special Machine Industries Co., Ltd.) at a rotation speed of 1200 rpm and a bath frequency of 35 times to obtain a highly emulsified dope. The highly emulsified dope was reacted in a polymerization tank (with a stirrer) at a temperature of 35 ° C. for 3 hours under non-stirring conditions to complete the polymerization. After completion of the reaction, the organic phase is separated, diluted with methylene chloride, washed with water, acidified with hydrochloric acid, washed with water, and poured into a kneader filled with warm water when the conductivity of the aqueous phase is almost the same as that of ion-exchanged water. Then, methylene chloride was evaporated with stirring to obtain polycarbonate powder. After dehydration, it was dried at 120 ° C. for 12 hours with a hot air circulation dryer to obtain a polycarbonate resin powder.
A-2: Polycarbonate resin powder thermometer having a branched structure with a viscosity average molecular weight of 20,300 obtained by the following production method, a reactor equipped with a stirrer and a reflux condenser, 2340 parts of ion-exchanged water, 947 parts of 25% aqueous sodium hydroxide solution After adding 0.7 part of hydrosulfite and dissolving 710 parts of bisphenol A under stirring (bisphenol A solution), 2299 parts of methylene chloride, 112 parts of 48.5% sodium hydroxide aqueous solution, 14% concentration of hydroxide 38.1 parts (1.00 mol%) of an aqueous solution in which 1,1,1-tris (4-hydroxyphenyl) ethane was dissolved at a concentration of 25% was added to an aqueous sodium solution, and 354 parts of phosgene was added at about 90 ° C at 15 to 25 ° C. The phosgenation reaction was carried out over a period of minutes. After completion of phosgenation, 261 parts of 11% strength p-tert-butylphenol in methylene chloride and 88 parts of 48.5% aqueous sodium hydroxide solution were added, stirring was stopped, and the mixture was allowed to stand for 10 minutes and then stirred. After 5 minutes of emulsification, the mixture was processed with a homomixer (Special Machine Industries Co., Ltd.) at a rotation speed of 1200 rpm and a bath frequency of 35 times to obtain a highly emulsified dope. The highly emulsified dope was reacted in a polymerization tank (with a stirrer) at a temperature of 35 ° C. for 3 hours under non-stirring conditions to complete the polymerization. After completion of the reaction, the organic phase is separated, diluted with methylene chloride, washed with water, acidified with hydrochloric acid, washed with water, and poured into a kneader filled with warm water when the conductivity of the aqueous phase is almost the same as that of ion-exchanged water. Then, methylene chloride was evaporated with stirring to obtain polycarbonate powder. After dehydration, it was dried at 120 ° C. for 12 hours with a hot air circulation dryer to obtain a polycarbonate resin powder having a branched structure.
A-3: Polycarbonate copolymer resin powder thermometer having a viscosity average molecular weight of 20,500 obtained by the following production method, a reactor equipped with a stirrer and a reflux condenser, 2340 parts of ion-exchanged water, 947 parts of 25% aqueous sodium hydroxide solution, hydro 0.7 part of sulfite was charged, 355 parts of bisphenol A and 551 parts of 9,9-bis (4-hydroxy-3-methylphenyl) fluorene were dissolved with stirring, and then 2299 parts of methylene chloride and 48.5% hydroxylation were added. A phosgenation reaction was performed by adding 112 parts of an aqueous sodium solution and blowing 354 parts of phosgene over 15 minutes at 15 to 25 ° C. After the completion of phosgenation, 141 parts of 11% strength p-tert-butylphenol in methylene chloride and 88 parts of 48.5% aqueous sodium hydroxide were added to emulsify, and then 1.0 part of triethylamine was added to add 28 to 33. The reaction was terminated by stirring for 1 hour at ° C. After completion of the reaction, the organic phase is separated, diluted with methylene chloride, washed with water, acidified with hydrochloric acid, washed with water, and poured into a kneader filled with warm water when the conductivity of the aqueous phase is almost the same as that of ion-exchanged water. Then, methylene chloride was evaporated with stirring to obtain polycarbonate powder. After dehydration, it was dried at 120 ° C. for 12 hours with a hot air circulation dryer to obtain a polycarbonate resin powder.
A-4: Polycarbonate-polydiorganosiloxane copolymer resin powder thermometer having a viscosity average molecular weight of 19,100 obtained by the following production method, a reactor equipped with a stirrer and a reflux condenser, 21591 parts of ion-exchanged water, 48.5% water After adding 3675 parts of aqueous sodium oxide solution and dissolving 3880 parts of bisphenol A and 7.6 parts of hydrosulfite, 14565 parts of methylene chloride was added, and 1900 parts of phosgene was blown in at 22-30 ° C. for 60 minutes with stirring. . Next, a solution obtained by dissolving 1131 parts of a 48.5% aqueous sodium hydroxide solution and 108 parts of p-tert-butylphenol in 800 parts of methylene chloride is added, and the polydiorganosiloxane compound 430 represented by the following formula [8] is stirred. A solution prepared by dissolving 1 part of methylene chloride in 1600 parts of methylene chloride was emulsified by adding dihydroxyaryl-terminated polydiorganosiloxane at a rate of 0.0008 mol / min per 1 mol of dihydric phenol (I), and then vigorously again. Stir. Under such stirring, 4.3 parts of triethylamine was added while the reaction solution was at 26 ° C., and stirring was continued for 1 hour at a temperature of 26 to 31 ° C. to complete the reaction. After completion of the reaction, the organic phase is separated, diluted with methylene chloride, washed with water, acidified with hydrochloric acid, washed with water, and poured into a kneader filled with warm water when the conductivity of the aqueous phase is almost the same as that of ion-exchanged water. Then, methylene chloride was evaporated while stirring to obtain a polycarbonate-polydiorganosiloxane copolymer powder. After dehydration, it was dried at 120 ° C. for 12 hours with a hot air circulation dryer to obtain a polycarbonate-polydiorganosiloxane copolymer resin powder.
(B成分)
B−1:下記製法により得られた黄色蛍光体粉末
硫化バリウム(BaS)及び硫酸銅(CuSO4)を原料とし、BaSを100モル%としたときに、CuSO4が0.1モル%となるように秤量し、乳鉢にてエタノール中で30分間混合した。次に、1050℃、1時間、1%−水素ガスの混合窒素ガス中で焼成し、BaS:Cuで示される黄色蛍光体を得た。
B−2:下記製法により得られた黄色蛍光体粉末
窒化珪素(Si3N4)、単体珪素(Si)、アルミナ(Al2O3)を原料とし、賦活剤としては酸化ユーロピウム(Eu2O3)を使用した。Si3N4/Si/Al2O3/=1/1.4/0.15となるように秤量し、この合計を100%とした時にEu2O3が1.4%となるように秤量し、混合機と篩を使用して混合した後、1950℃、5時間、1%−水素ガスの混合窒素ガス中で焼成し、Si(6−x)AlxOyN(6−y):Lnz で示される黄色蛍光体を得た。
[上記式中x、y、zは 0<x≦4.2、0<y≦4.2、0<z≦1.0を満たす。]
(B component)
B-1: When yellow phosphor powder barium sulfide (BaS) and copper sulfate (CuSO 4 ) obtained by the following manufacturing method are used as raw materials and BaS is 100 mol%, CuSO 4 is 0.1 mol%. And weighed in ethanol in a mortar for 30 minutes. Next, it was baked in a mixed nitrogen gas of 1% -hydrogen gas at 1050 ° C. for 1 hour to obtain a yellow phosphor represented by BaS: Cu.
B-2: Yellow phosphor powder silicon nitride (Si 3 N 4 ), simple silicon (Si), alumina (Al 2 O 3 ) obtained by the following production method are used as raw materials, and europium oxide (Eu 2 O) is used as an activator. 3 ) was used. Weigh so that Si 3 N 4 / Si / Al 2 O 3 /=1/1.4/0.15. When this sum is taken as 100%, Eu 2 O 3 becomes 1.4%. After weighing and mixing using a mixer and a sieve, firing at 1950 ° C. for 5 hours in a mixed nitrogen gas of 1% -hydrogen gas, Si (6-x) Al x O y N (6-y ): to give a yellow fluorescent material represented by Ln z.
[In the above formula, x, y, and z satisfy 0 <x ≦ 4.2, 0 <y ≦ 4.2, and 0 <z ≦ 1.0. ]
(C成分)
C−1:ビーズ状架橋アクリル粒子(積水化成品工業(株)製:MBX−5(商品名)、平均粒子径5μm)
C−2:ビーズ状架橋シリコーン(モメンティブパフォーマンスマテリアルズジャパン合同会社株)製:TSR9002(商品名)、平均粒子径2μm)
(その他の成分)
D−1:パーフルオロブタンスルホン酸カリウム塩(大日本インキ化学(株)製:メガファックF−114P(商品名))
D−2:下記製法により得られたSi−H基および芳香族基を含むシリコーン化合物
攪拌機、冷却装置、温度計を取り付けた1Lフラスコに水301.9gとトルエン150gを仕込み、内温5℃まで冷却した。滴下ロートにトリメチルクロロシラン21.7g、メチルジクロロシラン23.0g、ジメチルジクロロシラン12.9gおよびジフェニルジクロロシラン76.0gの混合物を仕込み、フラスコ内へ攪拌しながら2時間かけて滴下した。この間、内温を20℃以下に維持するよう、冷却を続けた。滴下終了後、さらに内温20℃で攪拌を4時間続けて熟成した後、静置して分離した塩酸水層を除去し、10%炭酸ナトリウム水溶液を添加して5分間攪拌後、静置して分離した水層を除去した。その後、さらにイオン交換水で3回洗浄し、トルエン層が中性になったことを確認した。このトルエン溶液を減圧下内温120℃まで加熱してトルエンと低沸点物を除去した後、濾過により不溶物を取り除いてシリコーン化合物を得た。
E−1:ヒンダードフェノール系酸化防止剤(チバ・スペシャルティ・ケミカルズ社製:Irganox1076(商品名))
F−1:UV吸収剤(ケミプロ化成(株)製:ケミソーブ79(商品名))
(C component)
C-1: Bead-like crosslinked acrylic particles (manufactured by Sekisui Plastics Co., Ltd .: MBX-5 (trade name), average particle diameter 5 μm)
C-2: Beaded cross-linked silicone (Momentive Performance Materials Japan GK): TSR9002 (trade name), average particle size 2 μm)
(Other ingredients)
D-1: Potassium perfluorobutane sulfonate (Dainippon Ink Chemical Co., Ltd .: Megafac F-114P (trade name))
D-2: Silicon compound containing Si—H group and aromatic group obtained by the following production method 301.9 g of water and 150 g of toluene were charged in a 1 L flask equipped with a stirrer, a cooling device, and a thermometer, and the internal temperature reached 5 ° C. Cooled down. A mixture of 21.7 g of trimethylchlorosilane, 23.0 g of methyldichlorosilane, 12.9 g of dimethyldichlorosilane, and 76.0 g of diphenyldichlorosilane was charged into the dropping funnel and dropped into the flask over 2 hours while stirring. During this time, cooling was continued to maintain the internal temperature at 20 ° C. or lower. After completion of the dropwise addition, the mixture was further aged for 4 hours with stirring at an internal temperature of 20 ° C., then left to stand to remove the separated hydrochloric acid aqueous layer, added with 10% aqueous sodium carbonate solution, stirred for 5 minutes and then left to stand. The separated aqueous layer was removed. Then, it wash | cleaned 3 times with ion-exchange water, and it confirmed that the toluene layer became neutral. The toluene solution was heated to an internal temperature of 120 ° C. under reduced pressure to remove toluene and low-boiling substances, and then insoluble materials were removed by filtration to obtain a silicone compound.
E-1: Hindered phenol antioxidant (Ciba Specialty Chemicals: Irganox 1076 (trade name))
F-1: UV absorber (Kemipro Kasei Co., Ltd .: Chemisorb 79 (trade name))
Claims (6)
0.01≦C/B<1.0 ・・・(1)
0.01 ≦ C / B <1.0 (1)
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