JP5941944B2 - Method for manufacturing power conversion device - Google Patents

Description

  The present invention relates to a power module that mutually converts direct current power and alternating current, a power conversion device that includes the power module, and an electric vehicle that includes the power conversion device.

  A conventional power converter has a power module including a power semiconductor, and converts DC power and AC current to each other by a switching operation of the power semiconductor. The power module further includes a base plate for heat dissipation, and the power semiconductor is disposed on the base plate. The generated heat of the power semiconductor is radiated to the aforementioned base plate through one main surface of the power semiconductor. Further, fins are formed on the surface of the base plate opposite to the power semiconductor arrangement surface, and the cooling medium is in direct contact with the fins.

  Such a power converter is disclosed in Patent Document 1, for example.

  However, to further improve the cooling performance, it is required to expand the heat radiation area of the power semiconductor. The expansion of the heat dissipation area of the power semiconductor causes a complicated structure of the power module, causes a decrease in productivity of the power module, and causes a cost increase of the power converter.

JP 2008-29117 A

The problem to be solved by the present invention is to improve the heat dissipation of the power converter.

In order to solve the above problems, a power conversion device according to the present invention includes a double-sided electrode module that converts direct-current power into alternating-current power, and a heat-dissipating base that sandwiches the heat-radiating surfaces of the double-sided electrode module that face each other with an insulating layer interposed therebetween. A cooling jacket for fixing the heat dissipation base, a capacitor module constituting a smoothing circuit for suppressing fluctuations in DC voltage, a positive-side conductor plate for transmitting power between the capacitor module and the double-sided electrode module, and A double-sided electrode module comprising: a first power semiconductor element constituting an upper arm circuit of an inverter circuit; and a DC positive electrode wiring connected to the first power semiconductor element via a metal bonding material. A plate, a second power semiconductor element constituting a lower arm circuit of the inverter circuit, and a metal junction with the second power semiconductor element A negative flow positive wiring board are connected via, have, and the negative electrode side conductor plate is the positive electrode side conductor plate is al, the positive side conductor plate and said the negative electrode side conductor plate through the resin A power wiring unit integrated in a stacked state is configured . The manufacturing method of the power converter of the present invention is connected, a first step of contacting the power wiring unit to the cooling jacket, the positive electrode side conductor plate by welding and the DC positive wiring board of the double-sided electrode module And a second step of connecting the negative electrode side conductor plate to the DC negative electrode wiring board of the double-sided electrode module by welding.

By this invention, the heat dissipation of a power converter device can be improved.

It is a figure which shows the control block of a hybrid vehicle. It is a figure explaining the circuit structure of the power converter device. It is an appearance perspective view of a power converter concerning an embodiment of the present invention. It is sectional drawing of the power converter device which concerns on embodiment of this invention. It is a perspective view of the 1st power module concerning the embodiment of the present invention. (A) is sectional drawing of the resin mold type double-sided electrode module which is a component of the power module regarding this embodiment, (b) is a perspective view of the resin mold type double-sided electrode module. It is a figure which shows the internal circuit structure of a power module. (A) is sectional drawing of a power module, (b) is a side view of a power module. It is an assembly flow figure of a CAN-like heat dissipation base and a resin mold type double-sided electrode module. It is an assembly flow figure of a CAN-like heat dissipation base and a resin mold type double-sided electrode module. It is an assembly flow figure of a CAN-like heat dissipation base and a resin mold type double-sided electrode module. It is a perspective view of the housing | casing which attached the cooling water inlet piping and the outlet piping to the aluminum casting of the housing | casing which has a cooling water flow path. It is a top view of the housing | casing which attached the cooling water inlet piping and the outlet piping to the aluminum casting of the housing | casing which has a cooling water flow path. It is sectional drawing of the housing | casing which attached the cooling water inlet piping and the outlet piping to the aluminum casting of the housing | casing which has a cooling water flow path. It is a sealing structure figure of the cooling jacket and power module of the power converter concerning the embodiment of the present invention. (A) is sectional drawing of the 2nd power module which concerns on embodiment of this invention, (b) is a side view of a 2nd power module. (A) is sectional drawing of the 3rd power module which concerns on embodiment of this invention, (b) is a side view of a 3rd power module. (A) is sectional drawing of the 4th power module which concerns on embodiment of this invention, (b) is a side view of a 4th power module. (A) is sectional drawing of the 5th power module which concerns on embodiment of this invention, (b) is a side view of a 5th power module. (A) is sectional drawing of the 6th power module which concerns on embodiment of this invention, (b) is a side view of a 6th power module. It is a sealing structure figure of the cooling jacket and power module of the power converter concerning the embodiment of the present invention. It is sectional drawing which showed the connection structure of the input / output terminal of the power module of the power converter device which concerns on embodiment of this invention. It is sectional drawing which showed the connection structure of the input / output terminal of the power module of the power converter device which concerns on embodiment of this invention. It is sectional drawing which showed the connection structure of the input / output terminal of the power module of the power converter device which concerns on embodiment of this invention. It is sectional drawing which showed the structure of the power module and capacitor | condenser of the power converter device which concerns on embodiment of this invention. It is sectional drawing which showed the structure of the power module and capacitor | condenser of the power converter device which concerns on embodiment of this invention. It is the flowchart which showed the manufacturing process of the CAN-shaped thermal radiation base of the power module of the power converter device which concerns on embodiment of this invention. It is the process flow figure showing the manufacturing method of CAN-like heat dissipation base 304 of power module 300 concerning this embodiment.

  Embodiments of the present invention to be described later have been studied so as to be applicable to many needs required for commercialization. The contents described in the above-mentioned column “Problems to be solved by the invention” correspond to one of the needs, and improvements related to other needs will be described below.

  One need of the power module and the power converter according to the present invention is to improve productivity while improving the cooling performance of the power module and the power converter.

  Therefore, a power module and a power conversion device using the power module according to the present invention include two base plates that face each other, a semiconductor circuit unit disposed between the two base plates, and the two sheets. A connecting member that is connected to the base plate and forms a storage area for storing the semiconductor circuit portion, and is interposed between the base plate and the semiconductor circuit portion, and the base plate and the semiconductor circuit portion And an insulating member for securing electrical insulation with the base plate, wherein the rigidity of the connecting member is smaller than the rigidity of the base plate.

  Thereby, both surfaces of a semiconductor circuit part can be cooled via each of two base plates, and a heat dissipation area can be increased. Furthermore, since the rigidity of the connecting member is set smaller than the rigidity of the base plate, the case of the power module can be easily formed by pressing the two base plates so as to sandwich the semiconductor circuit portion. The semiconductor circuit portion, the insulating member, and the base plate are connected, and a heat transfer path capable of mutually exchanging heat can be easily formed.

  Another need of the power module and the power conversion device according to the present invention is to improve the cooling performance while ensuring insulation of the power module and the power conversion device.

  Therefore, a power module and a power conversion device using the power module according to the present invention include a cylindrical case, a semiconductor circuit unit housed in a housing region formed in the case, an inner wall of the case, and the semiconductor circuit unit. An insulating member for ensuring electrical insulation between the semiconductor circuit portion and the inner wall of the case, and the insulating member is supported between the inner wall of the case and the semiconductor circuit portion. The insulating member is a material that improves the adhesive force between the semiconductor circuit portion and the case inner wall by heat treatment.

  Thereby, the insulation of a semiconductor circuit part and a case inner wall is securable. Furthermore, the adhesive force between the semiconductor circuit part and the case inner wall is improved, and the occurrence of delamination between the semiconductor circuit part and the case inner wall is suppressed, and the thermal conductivity of the heat transfer path from the semiconductor circuit part to the case Is not reduced.

  Moreover, the outline of the power module and power converter device which concern on this embodiment is demonstrated before the specific description of the power converter device which concerns on embodiment of this invention.

  In the power module according to the present embodiment, the plate-shaped electric wiring board is fixed to both electrodes provided on both side surfaces of the plate-shaped power semiconductor, and the power flow and heat energy can be dissipated from both sides of the power semiconductor, In addition, a part of the electrical wiring board and the power semiconductor are packed with resin, and both heat radiation surfaces of both electrical wiring boards in the vicinity of the power semiconductor are exposed from a part of the resin, forming a flat surface between the heat radiation surface and the resin surface. Then, an insulating layer having adhesiveness is formed on both formed planes. Furthermore, the power semiconductor, the electric wiring board, part of the resin, and both adhesive insulating layers are built in the “CAN” -shaped heat dissipation base having two flat surfaces to be bonded to the formed adhesive insulating layer. A heat-dissipating fin portion is formed outside the heat radiation base so that heat can be radiated from both sides of the power semiconductor through the fin portion.

  The power conversion device according to the present embodiment has a cooling water channel that can store the fin portion in the case of the power conversion device, and the side surface of the cooling water channel is provided with an insertion port into which the power module can be inserted. A cooling medium sealing structure is formed around the mouth by fitting with a flange provided in the power module.

  In addition, the power conversion device according to the present embodiment is provided with a water channel lid that seals the entire water channel at the opening of the cooling water channel opposite to the insertion port, and a cooling jacket through which a cooling medium flows by the power module and the water channel cover. Configure and cool the power module by immersing it in the cooling channel. A circuit for controlling the power semiconductor and controlling the power supply to the load is housed in the region where the electric wiring board of the power module protrudes, and a power smoothing capacitor and a circuit for boosting the input voltage are provided in the region below the water cooling jacket. It was.

  A power converter according to an embodiment of the present invention will be described below in detail with reference to the drawings. The power conversion device according to the embodiment of the present invention can be applied to a hybrid vehicle or a pure electric vehicle. Here, as a representative example, a control configuration and a circuit configuration of the power conversion device when the power conversion device according to the embodiment of the present invention is applied to a hybrid vehicle will be described with reference to FIGS. 1 and 2.

  The power conversion device according to the embodiment of the present invention is used in a vehicle-mounted power conversion device for a vehicle-mounted electrical system mounted on an automobile, in particular, a vehicle drive electrical system, and has a very severe mounting environment and operational environment. The inverter device will be described as an example. A vehicle drive inverter device is provided in a vehicle drive electrical system as a control device for controlling the drive of a vehicle drive motor, and a DC power supplied from an onboard battery or an onboard power generator constituting an onboard power source is a predetermined AC power. Then, the AC power obtained is supplied to the vehicle drive motor to control the drive of the vehicle drive motor. Further, since the vehicle drive motor also has a function as a generator, the vehicle drive inverter device also has a function of converting AC power generated by the vehicle drive motor into DC power according to the operation mode. ing. The converted DC power is supplied to the on-vehicle battery.

  Note that the configuration of the present embodiment is optimal as a power converter for driving a vehicle such as an automobile or a truck, but can be applied to other power converters. For example, power converters for trains, ships, airplanes, etc., industrial power converters used as control devices for motors that drive factory equipment, or motors that drive household solar power generation systems and household appliances The present invention can also be applied to a household power conversion device that is used in other control devices.

  FIG. 1 is a diagram showing a control block of a hybrid vehicle. In FIG. 1, a hybrid electric vehicle (hereinafter referred to as “HEV”) 110 is one electric vehicle and includes two vehicle drive systems. One of them is an engine system that uses an engine 120 that is an internal combustion engine as a power source. The engine system is mainly used as a drive source for HEV 110. The other is an in-vehicle electric system using motor generators MG1 192 and MG2 194 as a power source. The in-vehicle electric system is mainly used as a drive source for HEV 110 and a power generation source for HEV 110. The motor generators MG1 192 and MG2 194 are, for example, synchronous machines or induction machines, and operate as a motor or a generator depending on the operation method.

  A front wheel axle 114 is rotatably supported at the front portion of the vehicle body. A pair of front wheels 112 are provided at both ends of the front wheel axle 114. A rear wheel axle (not shown) is rotatably supported on the rear portion of the vehicle body. A pair of rear wheels are provided at both ends of the rear wheel axle. The HEV of this embodiment employs a so-called front wheel drive system in which the main wheel driven by power is the front wheel 112 and the driven wheel to be driven is the rear wheel. You may adopt.

  A front wheel side differential gear (hereinafter referred to as “front wheel side DEF”) 116 is provided at the center of the front wheel axle 114. The front wheel axle 114 is mechanically connected to the output side of the front wheel side DEF 116. The output shaft of the transmission 118 is mechanically connected to the input side of the front wheel side DEF 116. The front wheel side DEF 116 is a differential power distribution mechanism that distributes the rotational driving force that is shifted and transmitted by the transmission 118 to the left and right front wheel axles 114. The output side of the motor generator 192 is mechanically connected to the input side of the transmission 118. The output side of the engine 120 and the output side of the motor generator 194 are mechanically connected to the input side of the motor generator 192 via the power distribution mechanism 122. Motor generators 192 and 194 and power distribution mechanism 122 are housed inside the casing of transmission 118.

  The motor generators 192 and 194 are synchronous machines having permanent magnets on the rotor, and the AC power supplied to the armature windings of the stator is controlled by the inverter devices 140 and 142, whereby the motor generators 192 and 194 are used. Is controlled. A battery 136 is connected to the inverter devices 140 and 142, and power can be exchanged between the battery 136 and the inverter devices 140 and 142.

  In the present embodiment, the HEV 110 includes two parts, a first motor generator unit composed of a motor generator 192 and an inverter device 140, and a second motor generator unit composed of a motor generator 194 and an inverter device 142, depending on the operating state. I use them properly. That is, in the situation where the vehicle is driven by the power from the engine 120, when assisting the driving torque of the vehicle, the second motor generator unit is operated by the power of the engine 120 as a power generation unit to generate power, and the power generation The first motor generator unit is operated as an electric unit by the electric power obtained by the above. Further, when assisting the vehicle speed in the same situation, the first motor generator unit is operated by the power of the engine 120 as a power generation unit to generate power, and the second motor generator unit is generated by the electric power obtained by the power generation. Operate as an electric unit.

  In the present embodiment, the vehicle can be driven only by the power of the motor generator 192 by operating the first motor generator unit as an electric unit by the electric power of the battery 136. Furthermore, in this embodiment, the battery 136 can be charged by operating the first motor generator unit or the second motor generator unit as a power generation unit by the power of the engine 120 or the power from the wheels to generate power.

  The battery 136 is also used as a power source for driving an auxiliary motor 195. As the auxiliary machine, for example, there is a motor that drives a compressor of an air conditioner or a motor that drives a hydraulic pump for control. The DC power supplied from the battery 136 to the inverter device 43 is exchanged by the converter 43 for the auxiliary machine. And is supplied to the motor 195. The auxiliary converter 43 has the same function as the inverter devices 140 and 142, and controls the phase, frequency, and power of the alternating current supplied to the motor 195. For example, the motor 195 generates torque by supplying AC power having a leading phase with respect to the rotation of the rotor of the motor 195. On the other hand, by generating the delayed phase AC power, the motor 195 acts as a generator, and the motor 195 is operated in a regenerative braking state. The control function of the auxiliary converter 43 is the same as the control function of the inverter devices 140 and 142. Since the capacity of the motor 195 is smaller than the capacity of the motor generators 192 and 194, the maximum conversion power of the auxiliary converter 43 is smaller than the inverter devices 140 and 142, but the circuit configuration of the auxiliary converter 43 is fundamental. Further, the circuit configuration of the inverter devices 140 and 142 is the same.

  Inverter devices 140, 142, and 43 and capacitor module 500 are in an electrical close relationship. Furthermore, there is a common point that measures against heat generation are necessary. It is also desired to make the volume of the device as small as possible. From these points, the power conversion device 200 described in detail below includes the inverter devices 140, 142, and 43 and the capacitor module 500 in the casing of the power conversion device 200. With this configuration, it is possible to realize a small and highly reliable power conversion device while reducing the number of harnesses and reducing radiation noise.

  Further, by incorporating the inverter devices 140, 142 and 43 and the capacitor module 500 in one housing, it is effective in simplifying wiring and taking measures against noise. In addition, the inductance of the connection circuit between the capacitor module 500 and the inverter devices 140, 142, and 43 can be reduced, the spike voltage can be reduced, and heat generation can be reduced and heat dissipation efficiency can be improved.

  Next, the circuit configuration of the power conversion device 200 will be described with reference to FIG. As shown in FIG. 1, the power conversion device 200 includes inverter devices 140 and 142, an auxiliary conversion device 43, and a capacitor module 500.

The inverter devices 140 and 142 are configured by connecting a plurality of double-sided cooling type power modules 300 to form a three-phase bridge circuit. As will be described later, each power module has a power semiconductor element and its connection wiring and an opening as shown in FIG. 6, and a can-shaped heat radiation base 304 (hereinafter referred to as “CAN”) surrounded by the opening surface. It has a Jo heat dissipation base "that), and the like. This CAN-shaped heat radiation base 304 has an outer wall made of the same material that is continuously connected to both heat radiation bases so as to cover the periphery of the opposed heat radiation base, and an opening is prepared in a part of the outer wall. It is a cooler which stores a power semiconductor in an opening. The auxiliary converter 43 constitutes an inverter device and a step-up / step-down circuit.

  The inverter devices 140 and 142 are driven and controlled by two driver circuits provided in the control unit. In FIG. 2, the two driver circuits are collectively indicated as a driver circuit 174. Each driver circuit is controlled by a control circuit 172. The control circuit 172 generates a switching signal for controlling the switching timing of the switching power semiconductor element.

  The inverter device 140 is configured by a three-phase bridge circuit, and is connected to the positive side for each of the U phase (indicated by the symbol U1), the V phase (indicated by the symbol V1), and the W phase (indicated by the symbol W1). And a negative electrode side semiconductor switch unit connected to the negative electrode side. The positive-side semiconductor switch unit and the negative-side semiconductor switch unit constitute an upper and lower arm series circuit. The positive-side semiconductor switch unit includes an upper-arm IGBT 328 (insulated gate bipolar transistor) that is a switching power semiconductor element and a diode 156. The negative electrode side semiconductor switch section includes a lower arm IGBT 330 and a diode 166. Each upper and lower arm series circuit is electrically connected in parallel between the DC positive electrode wiring board 314 and the DC negative electrode wiring board 316.

  The upper arm IGBT 328 and the lower arm IGBT 330 are hereinafter referred to as IGBTs 328 and 330, respectively.

  The IGBTs 328 and 330 operate in response to a drive signal output from one driver circuit 174A of the driver circuit 174, and convert DC power supplied from the battery 136 into three-phase AC power. The converted electric power is supplied to the armature winding of the motor generator 192. In addition, about the V phase and the W phase, the display of the code | symbol 328,330,156,166 was abbreviate | omitted. The power module 300 of the inverter device 142 has the same configuration as that of the inverter device 140, and the auxiliary converter 43 has the same configuration as the inverter device 142, and the description thereof is omitted here. .

  In the present embodiment, IGBTs 328 and 330 are used as power semiconductor elements for switching. The IGBTs 328 and 330 include a collector electrode, an emitter electrode (signal emitter electrode terminal), and a gate electrode (gate electrode terminal). Diodes 156 and 166 are electrically connected between the collector electrodes and emitter electrodes of the IGBTs 328 and 330 as shown in the figure. The diodes 156 and 166 have two electrodes, a cathode electrode and an anode electrode. The cathode electrode serves as the collector electrode of the IGBTs 328 and 330 so that the direction from the emitter electrode to the collector electrode of the IGBTs 328 and 330 is the forward direction. The anode electrodes are electrically connected to the emitter electrodes of the IGBTs 328 and 330, respectively. A MOSFET (metal oxide semiconductor field effect transistor) may be used as the switching power semiconductor element. In this case, the diode 156 and the diode 166 are not necessary.

  The control circuit 172 generates a timing signal for controlling the switching timing of the IGBTs 328 and 330 based on input information from a control device or a sensor (for example, a current sensor 180) on the vehicle side. The driver circuit 174 generates a drive signal for switching the IGBTs 328 and 330 based on the timing signal output from the control circuit 172.

  The control circuit 172 includes a microcomputer (hereinafter referred to as “microcomputer”) for calculating the switching timing of the IGBTs 328 and 330. The microcomputer inputs the target torque value required for the motor generator 192, the current value supplied from the upper and lower arm series circuit to the armature winding of the motor generator 192, and the magnetic pole position of the rotor of the motor generator 192. Input as information. The target torque value is based on a command signal output from a host control device (not shown). The current value is detected based on the detection signal output from the current sensor 180. The magnetic pole position is detected based on a detection signal output from a rotating magnetic pole sensor (not shown) provided in the motor generator 192. In the present embodiment, the case where the current values of three phases are detected will be described as an example, but the current values for two phases may be detected.

  The microcomputer in the control circuit 172 calculates the d and q axis current command values of the motor generator 192 based on the target torque value, and the calculated d and q axis current command values and the detected d and q Based on the difference from the current value of the axis, the voltage command values for the d and q axes are calculated. Further, the microcomputer converts the calculated d and q-axis voltage command values into U-phase, V-phase, and W-phase voltage command values based on the detected magnetic pole positions. Then, the microcomputer generates a pulse-like modulated wave based on the comparison between the fundamental wave (sine wave) and the carrier wave (triangular wave) based on the voltage command values of the U-phase, V-phase, and W-phase, and the generated modulation The wave is output to the driver circuit 174 as a PWM (pulse width modulation) signal.

  When driving the lower arm, the driver circuit 174 amplifies the PWM signal and outputs the amplified PWM signal as a drive signal to the gate electrode of the corresponding IGBT 330 of the lower arm. On the other hand, when driving the upper arm, the driver circuit 174 amplifies the PWM signal after shifting the level of the reference potential of the PWM signal to the level of the reference potential of the upper arm, and uses this as a drive signal. Output to the gate electrode of the IGBT 328 of the upper arm. As a result, each IGBT 328, 330 performs a switching operation based on the input drive signal.

  In addition, the control unit performs abnormality detection (overcurrent, overvoltage, overtemperature, etc.) to protect the upper and lower arm series circuits. For this reason, sensing information is input to the control unit. For example, information on the current flowing through the emitter electrodes of the IGBTs 328 and 330 is input to the corresponding driver circuit 174 from the signal emitter electrode terminal of each arm. As a result, the driver circuit 174 detects an overcurrent, and when an overcurrent is detected, stops the switching operation of the corresponding IGBT 328, 330 and protects the corresponding IGBT 328, 330 from the overcurrent. Information on the temperature of the upper and lower arm series circuit is input to the microcomputer from a temperature sensor (not shown) provided in the upper and lower arm series circuit. In addition, voltage information on the DC positive side of the upper and lower arm series circuit is input to the microcomputer. The microcomputer performs over-temperature detection and over-voltage detection based on such information, and when over-temperature or over-voltage is detected, the switching operation of all IGBTs 328 and 330 is stopped, and the upper and lower arm series circuits are over-temperature or over-voltage. Protect from.

  The conduction and cut-off operations of the IGBTs 328 and 330 of the upper and lower arms of the inverter device 140 are switched in a certain order, and the current generated in the stator winding of the motor generator 192 at this switching flows through a circuit including the diodes 156 and 166. In the power conversion device 200 of the present embodiment, one upper and lower arm series circuit is provided for each phase of the inverter device 140. However, as a circuit that generates an output of each phase of the three-phase AC output to the motor generator, A power conversion device having a circuit configuration in which two upper and lower arm series circuits are connected in parallel to each other may be used.

  DC terminals 313 provided in the inverter devices 140 and 142 are connected to a common laminated conductor plate 700. The laminated conductor board 700 is a laminated wiring board having a three-layer structure in which an insulating sheet 706 (not shown) is sandwiched between a positive-side conductor board 702 and a negative-side conductor board 704 made of a conductive board material wide in the power module arrangement direction. It is composed. The positive electrode side conductor plate 702 and the negative electrode side conductor plate 704 of the multilayer conductor plate 700 are respectively connected to the positive electrode conductor plate 507 and the negative electrode conductor plate 505 of the multilayer wiring board 501 provided in the capacitor module 500. The positive electrode conductor plate 507 and the negative electrode conductor plate 505 are also made of a conductive plate material that is wide in the power module arrangement direction, and constitute a laminated wiring board having a three-layer structure sandwiching an insulating sheet 517 (not shown).

  A plurality of capacitor cells 514 are connected in parallel to the capacitor module 500, the positive electrode side of the capacitor cell 514 is connected to the positive electrode conductor plate 507, and the negative electrode side is connected to the negative electrode conductor plate 505. Capacitor module 500 constitutes a smoothing circuit for suppressing fluctuations in DC voltage caused by the switching operation of IGBTs 328 and 330.

  The multilayer wiring board 501 of the capacitor module 500 is connected to the input multilayer wiring board 230 connected to the DC connector of the power converter 200. The input laminated wiring board 230 is also connected to an inverter device in the auxiliary converter 43. A noise filter is provided between the input multilayer wiring board 230 and the multilayer wiring board 501. The noise filter includes two capacitors that connect the ground terminal of the housing 12 and each DC power line, and constitutes a Y capacitor for common mode noise countermeasures.

  As shown in FIG. 4, 19A is a cooling jacket in which a cooling water flow path is formed, and the cooling water flowing in from the cooling water inlet pipe 13 flows back and forth in a U-shape as indicated by an arrow, and the cooling water outlet It flows out from the pipe 14. The inverter circuits 140 and 142 are arranged on the reciprocating path of the cooling water. In any inverter circuit, the IGBT and the diode on the upper arm side are arranged on the forward path side of the cooling water path, and the IGBT and the diode on the lower arm side. Is arranged on the return side of the cooling water channel.

3 to 6, 200 is a power converter, 10 is an upper case, 11 is a metal base plate, 12 is a housing, 13 is a cooling water inlet pipe, 14 is a cooling water outlet pipe , 16 is a lower case, 17 Is an AC terminal case, 18 is an AC output wiring, 19 is a cooling water flow path, and 20 is a control circuit board that holds the control circuit 172. Reference numeral 21 denotes a connector for connection to the outside, and reference numeral 22 denotes a drive circuit board that holds a driver circuit 174. In this way, the control unit is configured by the control circuit board 20, the control circuit 172, the drive circuit board 22, and the driver circuit 174. Three power modules (double-sided electrode modules) 300 are provided in each inverter. One power module 300 includes an inverter device 142, and the other power module 300 includes an inverter device 140. 700 laminated conductor plate, 800 is a liquid seal, 304 CAN heat-dissipating base, 314 denotes a DC positive electrode wiring board 316 is DC negative wiring board, 500 denotes a capacitor module, 50 5 negative side conductor plate, 50 7 positive The pole-side conductor plate 514 represents a capacitor cell.

  In FIG. 3, the external appearance perspective view of the power converter device 200 which concerns on embodiment of this invention is shown. The external components of the power conversion device 200 according to the present embodiment include a casing 12 having a substantially rectangular top or bottom surface and a cooling water inlet pipe 13 (not yet provided) on one of the outer circumferences on the short side of the casing 12. And a cooling water outlet pipe 14, an upper case 10 for closing the upper opening of the housing 12, and a lower case 16 for closing the lower opening of the housing 12. By making the shape of the bottom surface side or the top surface side of the housing 12 substantially rectangular, it is easy to attach to the vehicle, and it is easy to manufacture and particularly to mass-produce.

  An AC terminal case 17 used for connection to the motor generators 192 and 194 is provided on the outer periphery on the long side of the power conversion device 200. AC output wiring 18 is used to electrically connect power module 300 and motor generators 192 and 194. The alternating current output from the power module 300 is transmitted to the motor generators 192 and 194 via the alternating current output wiring 18.

  The connector 21 is connected to a control circuit board 20 built in the housing 12. Various signals from the outside are transmitted to the control circuit board 20 via the connector 21. The direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512 electrically connect the battery 136 and the capacitor module 500. Here, in the present embodiment, the connector 21 is provided on one side of the outer peripheral surface on the short side of the housing 12. On the other hand, the direct current (battery) negative electrode side connection terminal portion 510 and the direct current (battery) positive electrode side connection terminal portion 512 are provided on the outer peripheral surface on the short side opposite to the surface on which the connector 21 is provided. That is, the connector 21 and the direct current (battery) negative electrode side connection terminal portion 510 are arranged apart from each other. As a result, noise that enters the housing 12 from the direct current (battery) negative electrode side connection terminal portion 510 and propagates to the connector 21 can be reduced, and the controllability of the motor by the control circuit board 20 can be improved. The DC connector 138 in FIG. 2 has these terminal portions 510 and 512.

  FIG. 4 is a cross-sectional view of the power converter according to the embodiment of the present invention.

  As shown in FIG. 4, a cooling jacket 19 </ b> A in which a cooling water flow path 19 is formed is provided in the middle of the housing 12, and two sets of openings are arranged above the cooling jacket 19 </ b> A in the flow direction. 400 and 402 are formed in three rows to form six openings (see FIG. 10B). Each power module 300 is fixed to the upper surface of the cooling jacket 19A via a liquid seal 800. Fins 305 for heat dissipation are provided on the CAN-shaped heat dissipation base 304 of each power module 300 so as to face each other. It protrudes inside. The protruding CAN-shaped heat radiation base 304 and a columnar part of the cooling jacket 19A separate the cooling water channel 19 to the left and right, and flow separately from the fins 305 that divide the cooling medium and oppose each other. Further, the cooling water channel 19 is provided in the cooling jacket 19A meandering in an S-shape so that six power modules can be cooled in series.

  An opening 404 is formed along the cooling water channel 19 on the lower surface of the cooling jacket 19 </ b> A, and the opening 404 is closed by a sewer channel back cover 420. A converter 43 for auxiliary equipment is attached to the lower surface of the cooling jacket 19A for cooling. Auxiliary converter 43 is fixed to the lower surface of sewer back cover 420 such that the heat dissipating metal surface of the built-in power module or the like (not shown) faces the lower surface of cooling jacket 19A. A liquid seal 800 is provided between the sewer back cover 420 and the housing 12. In the present embodiment, the sealing material is a liquid seal, but a resin material, a rubber O-ring, a packing, or the like may be substituted for the liquid seal. In particular, when the liquid seal is used, the power converter 200 is assembled. Can be improved.

  Further, a lower case 16 is provided below the cooling jacket 19A, and a capacitor module 500 is provided in the lower case 16. Capacitor module 500 is fixed to the inner surface of the bottom plate of lower case 16 such that the heat dissipation surface of the metal case is in contact with the inner surface of the bottom plate of lower case 16. With this structure, the power module 300 and the auxiliary converter 43 can be efficiently cooled using the upper and lower surfaces of the cooling jacket 19A, leading to the miniaturization of the entire power converter.

  Further, the casing 12 provided with the cooling jacket 19A is cooled, whereby the lower case 16 provided at the lower portion of the casing 12 is cooled. As a result, the heat of the capacitor module 500 is thermally conducted to the cooling water through the lower case 16 and the housing 12, and the capacitor module 500 is cooled.

  A laminated conductor plate 700 for electrically connecting the power module 300 and the capacitor module 500 is disposed above the power module 300. The laminated conductor plate 700 connects the power modules 300 in parallel across the input terminals 313 of the power modules 300. Furthermore, the laminated conductor plate 700 includes a positive-side conductor plate 702 (see FIG. 20) connected to the positive-electrode conductor plate 507 of the capacitor module 500 and a negative-side conductor plate 704 (see FIG. 20) connected to the negative-electrode conductor plate 505 of the capacitor module 500. 20) and an insulating sheet 7000 disposed between the conductor plates 702 and 704. The conductor plates 505 and 507 are arranged so that the cooling water channel 19 of the cooling jacket 19A penetrates the water channel partition wall, and the wiring length can be shortened. The parasitic inductance up to the module 500 can be reduced.

  A control circuit board 20 and a drive circuit board 22 are disposed above the laminated conductor plate 700. A driver circuit 174 shown in FIG. 2 is mounted on the drive circuit board 22, and a control circuit 172 having a CPU shown in FIG. 2 is mounted on the control circuit board 20. A metal base plate 11 is disposed between the drive circuit board 22 and the control circuit board 20. The metal base plate 11 functions as an electromagnetic shield for a circuit group mounted on both the boards 22 and 20 and also has an action of releasing and cooling the heat generated in the drive circuit board 22 and the control circuit board 20. Yes. As described above, the cooling jacket 19A is provided in the central portion of the housing 12, the power module 300 for driving the motor generators 192 and 194 is disposed on one side thereof, and the inverter device (power module for auxiliary equipment) is disposed on the other side. ) 43 can be efficiently cooled in a small space, and the entire power conversion device can be downsized. By making the cooling jacket 19A integrally with the housing 12 by aluminum casting, the cooling jacket 19A has an effect of increasing the mechanical strength in addition to the cooling effect. Further, since the casing 12 and the cooling jacket 19A are integrally formed by casting aluminum, the heat conduction is improved, and the cooling efficiency for the drive circuit board 22, the control circuit board 20 and the capacitor module 500 located far from the cooling jacket 19A is improved. improves.

  The drive circuit board 22 and the control circuit board 20 are provided with flexible wirings 23 that pass through the metal base plate 11 and connect the circuit groups of the circuit boards 20 and 22. The flexible wiring 23 includes a structure laminated in advance in a wiring board, a structure fixed to a wiring pattern on the wiring board with a bonding material such as solder, and a flexible wiring 23 in a through hole provided in advance in the wiring board. The switching timing signal of the inverter circuit is transmitted from the control circuit board 20 to the drive circuit board 22 through the flexible wiring 23, and the drive circuit board 22 is driven by the gate. A signal is generated and applied to each gate electrode of the power module. As described above, by using the flexible wiring 23, the conventionally used connector head becomes unnecessary, the mounting efficiency of the wiring board can be improved, the number of parts can be reduced, and the inverter can be downsized. Further, the control circuit board 20 is connected to a connector 21 for electrical connection with the outside. The connector 21 is used to transmit a signal to and from the in-vehicle battery 136 provided outside the power converter, that is, a lithium battery module. A signal representing the state of the battery and a signal such as the state of charge of the lithium battery are sent from the lithium battery module to the control circuit board 20.

  Openings are formed in the upper end and lower end of the housing 12. These openings are closed by fixing the upper case 10 and the lower case 16 to the housing 12 with fastening parts such as screws and bolts, for example. A cooling jacket 19 </ b> A in which a cooling water flow path 19 is provided is formed substantially at the center in the height direction of the housing 12. The upper surface opening of the cooling jacket 19A is covered with each power module 300, and the lower surface opening is covered with the sewer back cover 420, whereby the cooling water channel 19 is formed inside the cooling jacket 19A. A water leakage test of the cooling water passage 19 is performed during the assembly. And after passing a water leak test, the operation | work which attaches a board | substrate and the capacitor | condenser module 500 from the upper and lower opening of the housing | casing 12 will be performed. In this way, the cooling jacket 19A is arranged in the center of the housing 12, and then a structure that allows the necessary parts to be fixed from the openings at the upper and lower ends of the housing 12 is adopted, thereby improving productivity. To do. Moreover, it becomes possible to complete the cooling water flow path 19 first and to attach other parts after the water leak test, which improves both productivity and reliability.

  In FIG. 5, reference numeral 304 denotes a seamless CAN-shaped heat dissipation base having an outer wall made of the same material that is continuously connected to both heat dissipation bases so as to cover the periphery of the opposing heat dissipation base. An opening is prepared in a part of the housing, and the power semiconductor is accommodated in the opening. 314 is a DC positive wiring board connection part, 316 is a DC negative wiring board connection part, and 320U / 320L is a control terminal of the power module.

  The power module 300 according to the present embodiment includes a CAN-like heat radiation base 304 made of a metal material such as Cu, Al, AlSiC, Cu-C, and Al-C, and external connection terminals 314, 316, 320U, and 320L. And a double-sided electrode module 300A in which a power semiconductor is molded with a resin material 302 (see FIG. 6A), and a U-, V-, or W-phase AC terminal for connection to a load motor. 705.

  A feature of the power module 300 of this embodiment is that a double-sided electrode module 300A, which is an electrical component having poor water resistance performance, is built in a seamless heat dissipation base 304 that is in direct contact with the cooling medium, thereby providing a cooling medium such as water or oil. Does not directly touch the double-sided electrode module 300A, and the heat-dissipating base side can be penetrated from the heat-dissipating base side by using a seamless heat-dissipating base 304 that does not use an adhesive such as a metal joint or resin in the heat-dissipating base structure. Therefore, the cooling medium flowing in can be eliminated, and the reliability of the power semiconductor can be increased. Furthermore, when the power semiconductor is destroyed, it is possible to provide a highly reliable power conversion device by eliminating the reliability reduction of the power conversion device caused by water leakage due to secondary destruction of the heat dissipation base.

  6A is a cross-sectional view of a resin-molded double-sided electrode module 300A that is a component of the power module 300, and FIG. 6B is a perspective view of the resin-molded double-sided electrode module 300A. 6A, in the double-sided electrode module 300A, the upper and lower arms IGBTs 328 and 330, the diodes 156/166 and the like are connected to a pair of electric wiring boards 334 via a metal bonding material 337 such as a solder material or a silver sheet. The collector side of the IGBTs 328 and 330 is fixed to the positive electrode wiring board 314, the heat diffusion plate 338 is fixed to the emitter side of the IGBTs 328 and 330 with a metal bonding material 337, and the heat diffusion plate 338 is connected to the DC negative electrode wiring board 316 and the metal bonding material 337. It is fixed with. FIG. 7 shows a circuit configuration of one phase of the inverter circuit built in the power module 300. A wiring layout of the electric wiring board 334 is prepared so that it can be configured by IGBTs 328 and 330 and diodes 156/166, and DC The upper and lower arms are connected by an upper and lower arm wiring board 370 that connects the positive electrode wiring board 314 and the DC negative electrode wiring board 316. In addition, as a circuit built in the power module 300, the three-phase part which comprises an inverter circuit may be mounted, and only a 1-phase upper arm may be sufficient. As shown in FIG. 6A, the IGBTs 328 and 330 and the diodes 156/166 of the upper and lower arms are sandwiched between the electric wiring boards 334 and integrated with the resin material 302. A heat radiation surface 334B of both electric wiring boards 334 in the vicinity of the power semiconductor is exposed from a part of the resin material 302, and a flat surface 334C is formed by the heat radiation surface 334B and the resin material 302, and is adhered to both the formed flat surfaces 334C. By forming the insulating layer 334 </ b> A having a good property, it is possible to improve insulation and improve thermal conductivity. The electrical wiring board 334 may be Cu or Al. The adhesive insulating layer 334A may be a thin insulating sheet obtained by mixing a thermally conductive filler with an epoxy resin. By making it into a sheet shape, the thickness can be accurately determined as compared with grease or adhesive. In addition, generation of voids can be reduced, and variations in thermal resistance and insulation performance can be greatly reduced. The insulating layer may be a ceramic plate or an adhesive substrate in which an adhesive is applied to both sides of the ceramic plate. By adhering the insulating layer 334A having adhesion and the CAN-shaped heat dissipation base 304, it is possible to configure a heat dissipation route with excellent heat dissipation from both sides of the power semiconductor.

  The resin-molded double-sided electrode module 300A incorporated in the power module 300 of this embodiment is characterized in that the heat radiation surface 334B of both electric wiring boards 334 is attached to the inner side wall of the seamless CAN-shaped heat radiation base 304 with an adhesive layer. Since it has a connection structure that is fixed via 334A, the resin-molded double-sided electrode module 300A that is a peripheral portion of the power semiconductor is individually formed to verify the operation of the power semiconductor and between the power semiconductor and the electric wiring board 334. Since the inspection of the joint can be performed without using the heat dissipation base, the reliability of the power semiconductor can be increased, and the reliability of the power conversion device can be increased.

  In other words, the CAN-shaped heat radiation base 304 of the present embodiment is a bottomed cylindrical case having an opening on one surface. Then, the double-sided electrode module 300 </ b> A constituting the semiconductor circuit unit is stored in a storage region formed in the CAN-shaped heat dissipation base 304. In order to ensure electrical insulation between the inner wall of the CAN-shaped heat dissipation base 304 and the double-sided electrode module 300A, an insulating layer 334A that is an insulating member is provided. The double-sided electrode module 300A is sandwiched and supported by the inner wall of the CAN-shaped heat dissipation base 304. Further, an insulating layer 334A is interposed between the inner wall of the CAN-shaped heat radiation base 304 and the double-sided electrode module 300A, and the adhesive force between the double-sided electrode module 300A and the CAN-shaped heat radiation base 304 is set by heat treatment as will be described later. Consists of materials that improve

  Thereby, the insulation between the double-sided electrode module 300A and the inner wall of the CAN-shaped heat dissipation base can be ensured. Further, the adhesive force between the double-sided electrode module 300A and the inner wall of the CAN-shaped heat dissipation base is improved, and the occurrence of separation between the double-sided electrode module 300A and the inner wall of the CAN-shaped heat dissipation base is suppressed. The thermal conductivity of the heat transfer path to the heat radiation base is not lowered.

  In other words, the CAN-shaped heat dissipation base 304 of the present embodiment has two base plates that form a heat dissipation surface arranged to face each other, and they are connected by an outer peripheral curved portion 304A. That is, the outer peripheral curved portion 304A functions as a connecting member for the two base plates. Further, an insulating layer 334A is interposed between the inner wall of the storage area formed by the two base plates and the outer peripheral curved portion 304A and the double-sided electrode module 300A. Here, the rigidity of the outer peripheral curved portion 304A is set to be smaller than the rigidity of the two base plates. Alternatively, the thickness of the outer peripheral curved portion 304A is set to be smaller than the thickness of the two base plates.

  Thereby, both surfaces of a semiconductor circuit part can be cooled via each of two base plates, and a heat dissipation area can be increased. Furthermore, since the rigidity of the connecting member is set smaller than the rigidity of the base plate, the case of the power module can be easily formed by pressing the two base plates so as to sandwich the semiconductor circuit portion. The semiconductor circuit portion, the insulating member, and the base plate are connected, and a heat transfer path capable of mutually exchanging heat can be easily formed.

  In this embodiment, the outer peripheral curved portion 304A that functions as a connecting member for the two base plates is formed integrally with the base plate. However, the outer peripheral curved portion 304A is joined to the two base plates as separate members by welding or the like. It may be. Also in this case, the rigidity or thickness of the outer curved portion 304A is set smaller than the rigidity or thickness of the two base plates.

  FIG. 8A shows a cross-sectional view of the power module 300, and FIG. 8B shows a side view of the power module 300. In FIG. 8A, a double-sided electrode module 300A is built in a seamless CAN-shaped heat dissipation base 304, and is fixed to the CAN-shaped heat dissipation base 304 with an adhesive insulating layer 334A to form an integral structure. As shown in FIG. 8B, pin-like fins 305 are formed on the outer side surface of the CAN-shaped heat radiation base 304 to oppose the heat radiation surfaces 334B of both electric wiring boards 334 of the double-sided electrode module 300A. The pin-shaped fins 305 are disposed so as to cover the outer periphery of the base 304, and the CAN-shaped heat radiation base 304 and the pin-shaped fins 305 are integrally formed of the same material, so that the CAN-shaped heat radiation base 304 has corrosion resistance and resin adhesion performance. In order to improve, the entire surface is anodized, and each fin 305 is in contact with the cooling medium flowing in the cooling water channel so that both sides of the power semiconductor Allow heat radiation from the then, the thermal resistance can be significantly reduced by parallelizing the heat transfer route from the power semiconductor to the cooling medium, miniaturization of the power semiconductor and miniaturization of the power converter can be realized.

  FIG. 9A shows an assembly flow for integrating the CAN-shaped heat radiation base 304 and the resin-molded double-sided electrode module 300A and a cross-sectional view. In FIG. 9A, the CAN-shaped heat dissipation base 304 has a structure in which the thickness of the bonding portion of the CAN-shaped heat dissipation base 304 bonded to the heat dissipation surface 334B is larger than that of the outer peripheral curved portion 304A. The double-sided electrode module 300A is disposed inside the opening 304, and (2) an adhesive insulating layer 334A that covers the heat-radiating surface 334B of the double-sided electrode module 300A is then fixed to the inner side wall of the CAN-like heat-radiating base 304. In this way, pressure is applied from the outside of the CAN-shaped heat radiation base 304 to deform the outer curved portion 304A of the CAN-shaped heat radiation base 304, and the gap between the adhesive insulating layer 334A and the CAN-shaped heat radiation base 304 is eliminated and connected to the heat radiation surface 334B. It is possible to adhere and fix the CAN-shaped heat radiation base 304 to be bonded, and to generate heat generated from the power semiconductor on both sides. By transferring heat to the CAN-like heat dissipation base 304 via the adhesive insulating layers 334A provided on both sides of the polar module 300A, heat can be dissipated from both sides of the power semiconductor, and the heat transfer route from the power semiconductor to the cooling medium Is divided into two parallel routes, the thermal resistance can be greatly reduced, and the power semiconductor and the power converter can be downsized.

  FIG. 9B shows an assembly flow and a cross-sectional view for integrally connecting the double-sided electrode module 300A and the seamless CAN-shaped heat radiation base 304 to each other. In FIG. 9B, the CAN-shaped heat radiation base 304 has a structure in which the thickness of the bonding portion of the CAN-shaped heat radiation base 304 that adheres to the heat radiation surface 334B is larger than that of the outer curved portion 304A. The inner side of 304 is deformed so as to move in parallel with the surface connected to the heat radiation surface 334B of the double-sided electrode module 300A to enlarge the internal space, thereby deforming the outer peripheral curved portion 304A of the CAN-shaped heat radiation base 304 and the CAN-shaped heat radiation base. (2) Next, the double-sided electrode module 300A is disposed inside the opening of the CAN-shaped heat dissipation base 304, and then the insulating layer 334A having adhesiveness that covers the heat-dissipation surface 334B of the double-sided electrode module 300A. Is pressed from the outside of the CAN-shaped heat radiation base 304 so as to be fixed to the inner side wall of the CAN-shaped heat radiation base 304, The outer peripheral curved portion 304A of the AN-shaped heat radiating base 304 is deformed to eliminate the gap between the adhesive insulating layer 334A and the CAN-shaped heat radiating base 304 and to deform the heat radiating fin portion of the CAN-shaped heat radiating base 304 connected to the heat radiating surface 334B. Can be bonded and fixed sufficiently small, and heat generated from the power semiconductor can be transferred to the CAN-like heat radiation base 304 via the adhesive insulating layers 334A provided on both side surfaces of the double-sided electrode module 300A. Therefore, it is possible to dissipate heat from both sides of the power semiconductor, and the heat transfer route from the power semiconductor to the cooling medium is divided into two parallel routes, so that the thermal resistance can be greatly reduced, miniaturization of the power semiconductor and the power conversion device Can be made smaller.

  FIG. 9C is an assembly flow for integrally connecting the double-sided electrode module 300A and the seamless CAN-shaped heat radiation base 304, and a cross-sectional view with respect to FIG. 9B. FIG. 9C shows an assembling process for adhering the adhesive insulating layer 334 </ b> A and the inner side wall of the CAN-shaped heat dissipation base 304. The fins 305 of the CAN-shaped heat radiation base 304 are pressed and bonded by a press machine 307 incorporating a superheater 306 or the like. At that time, by creating a vacuum around the double-sided electrode module 300A, air pockets such as voids generated at the interface of the adhesive insulating layer 334A can be discharged. Furthermore, curing of the adhesive can be promoted by baking at a high temperature for several hours. As a result, the reliability such as the insulation life of the insulating layer 334A can be improved, so that a small and highly reliable power conversion device can be provided.

  In addition, when the inner side wall of the CAN-shaped heat dissipation base 304 and the double-sided electrode module 300A are joined by pressing from both side walls of the power module 300 as in the power module 300 according to the present embodiment, the insulating layer 334A is What has adhesiveness is desirable. Alternatively, the insulating layer 334 </ b> A is desirably formed using a material that can be thermally cured using a temperature change caused by the above-described overheater 306. Thereby, the formation process by the press machine 307 and the adhesion process by the insulating layer 334A can be performed simultaneously or promptly for the CAN-shaped heat radiation base 304.

  Here, an insulating layer 334A suitable for the power module 300 according to the present embodiment will be described. The insulating layer 334A according to the present embodiment is required to ensure electrical insulation between the inner side wall of the CAN-shaped heat dissipation base 304 and the double-sided electrode module 300A, and to secure these adhesive properties. However, the heat radiating surface 334B of the double-sided electrode module 300A is formed of electrical wiring, a resin material 302, or the like, as shown in FIG. 6B. Therefore, unevenness is formed at the boundary between the electrical wiring and the resin material 302, and the adhesiveness to the insulating layer 334A may be reduced. As a result, air or the like may enter between the insulating layer 334A and the double-sided electrode module 300A, and the heat transfer coefficient of the power module 300 may be greatly reduced.

  Therefore, it is desirable that the insulating layer 334A be made of a soft insulating material having a low Young's modulus that can fill the unevenness at the boundary between the electric wiring and the resin material 302.

  On the other hand, an insulating material having a low Young's modulus contains a large amount of impurities different from a material for ensuring electrical insulation, and thus electrical insulation may not be sufficiently ensured. Therefore, the insulating layer 334A according to the present embodiment further includes an insulating material with less impurities, that is, a high Young's modulus, between the insulating material with a low Young's modulus and the inner side wall of the CAN-shaped heat dissipation base 304. . That is, the insulating layer 334A has a multilayer shape made of insulating materials having different Young's moduli. Thereby, while suppressing the fall of a heat transfer rate, electrical insulation can also be ensured.

  Furthermore, the inner side wall of the CAN-shaped heat radiation base 304 is required to have an uneven shape for the reason described later in FIG. In this case, in order to suppress a decrease in the heat transfer coefficient between the inner side wall of the CAN-shaped heat radiation base 304 and the insulating layer 334A, the above-described insulating material having a low Young's modulus is provided on the inner side wall side of the CAN-shaped heat radiation base 304. That is, for the insulating layer 334A, an insulating material having a low Young's modulus is used for the upper layer and the lower layer, and an insulating material having a high Young's modulus is used for the intermediate layer. Thereby, even in the embodiment as shown in FIG. 12, it is possible to suppress a decrease in heat transfer coefficient and to ensure electrical insulation.

  FIG. 10 is a view in which a cooling water inlet pipe and an outlet pipe are attached to the aluminum casting of the housing 12 having the cooling jacket 19A. FIG. 10 (a) is a perspective view of the cooling jacket 19A, and FIG. FIG. 10C is a cross-sectional view of the housing 12. As shown in FIG. 10, the casing 12 is integrally cast with a cooling jacket 19 </ b> A in which a cooling water passage 19 is formed. A cooling water inlet pipe 13 and a cooling water inlet pipe 14 for taking in cooling water are provided on one side surface of the short side of the housing 12 having a substantially rectangular shape in plan view.

  In FIG. 10A, the cooling water flowing into the cooling water flow path 19 from the cooling water inlet pipe 13 flows in two along the long side of the rectangle which is the direction of the arrow 418, and the other of the short sides of the rectangle. At the corner 19C near the front side of the side, it is folded back as indicated by an arrow 421a and flows again in two directions in the direction of the arrow 422 along the long side of the rectangle, and further flows along the long side of the rectangle. Then, it flows back into the outlet pipe provided in the lower cooling water channel lid 420, turns back, and flows out from the outlet hole to the cooling water inlet pipe 14 (see FIG. 10B). Six openings 400 are opened on the upper surface of the cooling jacket 19A. The CAN-shaped heat radiation base 304 of each power module 300 protrudes into the flow of cooling water from the respective openings, and the cooling water is divided into two at the columnar boundary 19B of the CAN-shaped heat radiation base 304 and the cooling jacket 19A to reduce pressure loss. It is also possible to reduce the pressure loss by dividing the cooling water into two parts by making the curved surface 304A of the outer periphery of the CAN-shaped heat radiation base 304, and meander the flow path in an S-shape so that six power modules are arranged in series and cooled. Even if it makes it, the rise in pressure loss can be reduced and cooling efficiency can be improved. Each power module 300 is fixed so as to close the opening of the cooling jacket 19 </ b> A in a watertight manner through a sealing material such as a liquid seal 800.

  In FIG. 10B, the cooling jacket 19A is integrally formed with the casing 12 across the middle stage of the casing peripheral wall 12W. Six openings 400 are provided on the upper surface of the cooling jacket 19A, and one opening 404 is provided on the lower surface. Around each of the openings 400 and 402, a power module mounting surface 410S is provided. The screw hole 412 is a screw hole for fixing the module fixing jig 304C for pressing the power module to the mounting surface 410S to the cooling jacket 19A (see FIG. 11). The module fixing jig 304C can pressurize the plurality of power modules 300 to the cooling jacket 19A, reduce the number of screws for pressing and fixing the power module 300 to the cooling jacket, improve assemblability, and reduce the size of the cooling jacket 19A. Since the size of the flange of the CAN-shaped heat radiation base 304 of the power module can be reduced, the cooling jacket 19A, the casing 12, and the power module 300 can be downsized, which greatly contributes to downsizing of the power converter 200. The power semiconductor built in the power module 300 can be cooled from both sides by the diverted cooling water, and has an advantage that the thermal resistance can be reduced. The module fixing jig 304C is provided with a base 304D for fixing the control circuits 20 and 21 and the heat dissipation base 11.

  In FIG. 10C, a through hole 406 is formed in the partition wall of the reciprocating cooling water channel 19 in parallel with each power module 300 (see FIG. 10A). Electrical components (power module 300 and capacitor module 500) that are alternately sandwiched and arranged in cooling jacket 19 </ b> A and installed on both sides of cooling water flow path 19 are electrically connected through this through hole 406. The positive conductor plate 702 (see FIG. 18) connected to the positive conductor plate 507 of the capacitor module 500 and the negative conductor plate 704 (see FIG. 18) connected to the negative conductor plate 505 of the capacitor module 500 can be shortened. Wiring inductance can be reduced because of this capability, contributing to power semiconductor loss and surge voltage reduction. Reduction of-type or noise is possible.

  FIG. 11 is a cross-sectional view showing a seal portion between the power module 300 and the cooling jacket 19A according to the present embodiment.

  In FIG. 11, the cooling jacket 19A is integrally formed with the casing 12 across the middle stage of the casing peripheral wall 12W, and an opening 400 is provided on the upper surface of the cooling jacket 19A, and an opening 404 of the cooling water channel is provided on the lower surface. Yes. Around the opening 400, a power module mounting surface 410S is provided. A fitting portion 420A with the lower cooling water channel lid 420 is provided around the opening 404 and sealed with the liquid sealant 800, and the screw hole 412 pressurizes the flange 300B of the power module 300 to the mounting surface 410S. This is a screw hole for fixing the module fixing jig 304C to the cooling jacket 19A, and the module fixing jig 304C can press the plurality of power modules 300 to the cooling jacket 19A. The liquid sealant previously applied between the flanges 300B is crushed and pressurized to stop the cooling medium from leaking through the attachment surface 410S and the power module 300, and the power module 300 is pressure-fixed to the cooling jacket 19A. Screw book Since the cooling jacket 19A and the size of the flange 300B of the CAN-shaped heat radiation base 304 of the power module 300 can be reduced, the cooling jacket 19A, the casing 12, and the power module 300 can be downsized. Therefore, the power conversion device 200 can be greatly reduced in size. The power semiconductor built in the power module 300 can be cooled from both sides by the diverted cooling water, and has an advantage that the thermal resistance can be reduced. Note that the same effect can be obtained by using a liquid sealing material such as a rubber O-ring.

  FIG. 12A is a cross-sectional view of the second power module 300 according to this embodiment, and FIG. 12B is a side view of the second power module 300.

  The difference from the above embodiment is that the fins 305 provided on the cooling surface outside the CAN-shaped heat radiation base 304 are not made of the same material at the same time when the CAN-shaped heat radiation base 304 is formed. An uneven surface 305B is provided on the surface of the CAN-shaped heat radiation base 304 so that the resin fin 305A having excellent thermal conductivity is bonded to the outside and the fin is formed and the resin fin 305A is not dropped. The fin 305A is mechanically fitted.

  According to the present invention, since the fins 305 can be formed separately, the CAN-shaped heat radiation base 304 can be formed like a juice can, and productivity can be improved. Further, the provision of the projections and depressions 305B improves the bonding performance between the resinous fin 305A and the CAN-shaped heat radiation base 304, and prevents a drop in reliability such as dropout. The area related to heat transfer 304 can be increased, and the thermal resistance of the power module 300 can be reduced, so that the power module can be downsized and the power converter can be downsized.

  FIG. 13A is a cross-sectional view of the third power module 300 according to this embodiment, and FIG. 13B is a side view of the third power module 300.

  The difference from the above embodiment is that the fins 305 provided on the cooling surface outside the CAN-shaped heat radiation base 304 are not made of the same material at the same time when the CAN-shaped heat radiation base 304 is formed. A plate-like fin base 305C in which a plurality of fins 305 are formed on the outside is fixed with a metal connecting material such as a brazing material or a resin adhesive, and fins are provided on the CAN-like heat radiation base 304.

  According to the present invention, since the fins 305 can be formed separately, the CAN-shaped heat radiation base 304 can be formed like a juice can, and productivity can be improved. Further, the fin base 305B may be made of a metal such as Cu, Al, AlSiC, Cu—C, or Al—C manufactured by a method such as forging, or may be formed of an organic material such as a high thermal conductive resin. The shape of the part can be changed from a concentric pin shape to an ellipse shape, and since the surface area of the fin 305 can be increased, the area related to heat transfer can be increased and the thermal resistance of the power module 300 can be reduced. It is possible to reduce the size of the power module and the power converter.

  FIG. 14A is a cross-sectional view of the fourth power module 300 according to this embodiment, and FIG. 14B is a side view of the fourth power module 300.

  The difference from the above embodiment is that the fins 305 provided on the cooling surface outside the CAN-shaped heat radiation base 304 are straight fins 305D, which are integrally formed with the same material as the CAN-shaped heat radiation base 304.

  According to the present invention, since the fins 305 have a straight shape, manufacturing can be facilitated and pressure loss generated in the cooling flow path can be reduced. Therefore, the thermal resistance of the power module 300 can be reduced, and the power module can be reduced in size. In addition, the power converter can be downsized.

  FIG. 15A is a cross-sectional view of the fifth power module 300 according to this embodiment, and FIG. 15B is a side view of the fifth power module 300.

  The difference from the above embodiment is that the layout of the pin-shaped fins 305 provided on the cooling surface outside the CAN-shaped heat radiation base 304 is provided with a coarse and dense layout, and the flow velocity of the cooling medium flowing through the fins 305 located near the power semiconductor is increased. As described above, the distance between the fins 305 far from the power semiconductor is reduced, and the distance between the fins 305 near the power semiconductor is increased.

  According to the present invention, since the flow velocity of the cooling medium flowing through the fins 305 near the power semiconductor can be increased, the heat transfer coefficient near the power semiconductor can be increased, and the thermal resistance of the cooling medium and the power semiconductor can be reduced. Realization makes it possible to reduce the size of the power module and the power converter.

  FIG. 16A is a cross-sectional view of the sixth power module 300 according to this embodiment, and FIG. 16B is a side view of the sixth power module 300.

  The difference from the above embodiment is that the layout of the pin-shaped fins 305 provided on the cooling surface outside the CAN-shaped heat radiation base 304 is provided with a coarse and dense layout, and the flow velocity of the cooling medium flowing through the fins 305 located near the power semiconductor is increased. As described above, the distance between the fins 305 far from the power semiconductor is reduced, the distance between the fins 305 in the vicinity of the power semiconductor is increased, and the shape of the fin 305 in the vicinity of the power semiconductor is further changed to an elliptical fin 305E.

  According to the present invention, since the flow velocity of the cooling medium flowing through the fins 305 near the power semiconductor can be increased, the heat transfer coefficient near the power semiconductor can be increased, and the fins 305 near the power semiconductor can be made elliptical. As a result, the surface area of the fin 305 can be increased and the heat transfer rate can be increased, and the thermal resistance of the cooling medium and the power semiconductor can be reduced, so that the power module can be downsized and the power converter can be downsized.

  FIG. 17 is a cross-sectional view showing a seal portion between the power module 300 and the cooling jacket 19A according to the present embodiment.

  In FIG. 17, the cooling jacket 19A is integrally formed with the casing 12 across the middle stage of the casing peripheral wall 12W, and an opening 400 is provided on the upper surface of the cooling jacket 19A, and an opening 404 of the cooling water channel is provided on the lower surface. Yes. Around the opening 400, a power module mounting surface 410S is provided. A fitting portion 420A with the lower cooling water channel lid 420 is provided around the opening 404 and sealed with the liquid sealant 800, and the screw hole 412 pressurizes the flange 300B of the power module 300 to the mounting surface 410S. This is a screw hole for fixing the module fixing jig 304C to the cooling jacket 19A, and the module fixing jig 304C can press the plurality of power modules 300 to the cooling jacket 19A. The liquid sealing material previously applied between the flanges 300B is crushed and pressurized, so that the cooling medium can be prevented from leaking through the mounting surface 410S and the power module 300, and the power module 300 can be pressure-fixed to the cooling jacket. Low number of screws As a result, the flange 300B of the power module 300 can be tapered so that the width of the flange 300B can be reduced while maintaining the shield area. The size of the flange 300B of the CAN-shaped heat radiation base 304 can be reduced, and the cooling jacket 19A, the casing 12, and the power module 300 can be downsized, which greatly contributes to downsizing of the power converter 200. The power semiconductor built in the power module 300 can be cooled from both sides by the diverted cooling water, and has an advantage that the thermal resistance can be reduced. The liquid sealing material 800 can obtain the same effect even if it is a rubber O-ring.

  FIG. 18 is a cross-sectional view showing a connection structure of input / output terminals of the power module 300 according to the present embodiment.

  In FIG. 18, a through hole 406 is formed in the partition wall portion of the cooling water channel 19 reciprocating in an S shape in parallel with each power module 300, and the capacitor module 500 installed across the cooling water channel 19 and the through hole The positive electrode conductor plate 507 of the capacitor module 500 and the negative electrode conductor plate 505 of the capacitor module 500 are arranged through the through hole 406 in the vicinity of the power module 300 and can be connected to each other through the power module 300. An electrical wiring board 334 is disposed in close proximity to the positive electrode side conductor plate 507, the negative electrode side conductor plate 505, and the output wiring 705, and is disposed on each of the electric wiring boards 334 or the positive electrode side conductor plate 507, the negative electrode side conductor plate 505, and a part of the output wiring 705. A brazing material 706 is arranged in advance, and each electric wiring board 334 and the positive electrode side conductor plate 5 are arranged via the arranged brazing material 706. 7 and the negative electrode side conductor plate 505 and the output wiring 705 are arranged to oppose each other, and current flows between each electric wiring board 334, the positive electrode side conductor plate 507, the negative electrode side conductor plate 505, and the output wiring 705 sandwiching the brazing material. The brazing material 706 and each electric wiring board 334, the positive electrode side conductor plate 507, the negative electrode side conductor plate 505, and the output wiring 705 are heated, and the brazing material 706 is melted to form each electric wiring board 334, the positive electrode side conductor plate 507, and the negative electrode. The side conductor plate 505 and the output wiring 705 are connected.

  According to the present invention, it is possible to electrically connect the power wiring without using a tightening area such as a bolt, so the power wiring area can be reduced, the power converter can be reduced in size, and the bolt is not used. Therefore, the assembly time can be shortened and the assemblability can be improved, thereby contributing to cost reduction.

  FIG. 19 is a cross-sectional view showing the connection structure of the input / output terminals of the power module 300 according to this embodiment.

  In FIG. 19, a through hole 406 is formed in the partition wall portion of the cooling water passage 19 reciprocating in an S shape in parallel with each power module 300, and the capacitor module 500 installed across the cooling water passage 19 and the through hole The positive electrode conductor plate 507 of the capacitor module 500 and the negative electrode conductor plate 505 of the capacitor module 500 are arranged in the vicinity of the power module 300 via the through hole 406 and extend from the power module 300. Each electric wiring board 334 is disposed close to the positive electrode side conductor plate 507, the negative electrode side conductor plate 505, and the output wiring 705, and each electric wiring board 334 or the positive electrode side conductor plate 507, the negative electrode side conductor plate 505, and a part of the output wiring 705. , And each conductor plate is arc welded 707 or microtig welding and laser at a predetermined connection point. Welding by fixing or the like, and constitutes an electrical connection point.

  According to the present invention, it is possible to electrically connect the power wiring without using a tightening area such as a bolt, so the power wiring area can be reduced, the power converter can be reduced in size, and the bolt is not used. Therefore, the assembly time can be shortened and the assemblability can be improved, thereby contributing to cost reduction.

  FIG. 20 is a cross-sectional view showing a power wiring structure connected to the input / output terminals of the power module 300 according to the present embodiment.

In FIG. 20, a through hole 406 is formed in the partition wall portion of the cooling water passage 19 reciprocating in an S shape in parallel with each power module 300, and the capacitor module 500 installed across the cooling water passage 19 and the through hole. The positive electrode side conductor plate 702 connected to the positive electrode conductor plate 507 of the capacitor module 500 through the through hole 406 prepared in the vicinity of the power module 300 and the negative electrode conductor plate of the capacitor module 500. 505 is connected to each of the electric wiring boards 334, the positive electric conductor board 702, and the negative electric conductor board 704 of the power module 300. The electric wiring board 334 of the power module 300 is arranged with the power wiring unit 701 laminated through the It has been placed on top, thereby fixing the respective conductor plates in an arc welding 70 7 or micro-TIG welding and laser welding in a predetermined connection point, constitutes an electrical connection point. Further, the power wiring unit 701 is integrated with a pressure jig 700A for fixing the power module 300 to the cooling jacket 19A, and the power module 300 can be pressure-fixed to the cooling water channel 19. In addition, since dust is generated in arc welding or the like, the inverter device 200 may be configured by inserting the power module 300 into the power wiring unit 701 and finishing it in a form in which the power module 300 is attached and wiring in advance, and then inserting it into the housing 12.

  According to the present invention, the power capacity in the vicinity of the welded portion is increased by laminating and integrating each power wiring with resin, and the temperature rise of the power module 300 due to the temperature rise during welding can be reduced as much as possible. The temperature of the power module 300 does not increase even when the distance of the power module 300 is reduced, and the position of the power wiring unit and the power module 300 can be fixed by using the reference point 12A prepared for the welding point alignment in the housing 12. Therefore, it is possible to reduce misalignment during welding and to form a highly reliable electrical connection point.

  Here, the insulating sheet 7000 may be sandwiched between the positive electrode conductor plate 702 and the negative electrode conductor plate 704. As a result, the distance between the conductor plates is shortened, and the conductor parts can be downsized.

  FIG. 21 is a cross-sectional view showing the input / output terminals and the capacitor structure of the power module 300 according to this embodiment.

In FIG. 21, each power module 300 is arranged at a predetermined position in the cooling water flow path 19 reciprocating in an S shape, and the power wiring unit connected to the electric wiring board 334 of the power module 300 is arranged at the upper part of the power module 300. is, the capacitor 514 is disposed between the power wiring unit 70 1 and the cooling water flow path 19 is provided with connecting portions of the capacitor 514 and the electric wiring board 334 between the power wiring unit 70 1 and the cooling water flow path 19, an electric wiring board 334 to the lead portion 314B for mating with the electrical connection terminal of the capacitor 514, constitutes a 316B, arc welding 70 7 or micro-TIG welding and laser respective electric wiring board 334 of the lead portion 314B and the power module 300 at a predetermined connection point It is fixed by welding or the like to form an electrical connection point. Further, the power wiring unit 701 is integrated with a pressure jig 700A for fixing the power module 300 to the cooling jacket 19A, and the power module 300 can be pressure-fixed to the cooling water channel 19. Further, since dust is generated in arc welding or the like, the power wiring unit 701 is preliminarily finished with the power module 300 and the capacitors 514 and 500 attached and wired, and then inserted into the housing 12 to constitute the inverter device 200. May be.

  According to the present invention, since the capacitor 514 is disposed between the power wiring unit and the cooling water channel 19, the wiring distance between the power module 300 and the capacitor 514 can be greatly reduced, so that the wiring inductance can be reduced and the power semiconductor can be reduced. Since it is possible to reduce the surge voltage generated during switching, and further reduce the switching loss and noise of the power semiconductor, the power module can be miniaturized, and the power converter can be miniaturized and highly reliable.

  FIG. 22 is a cross-sectional view showing the input / output terminals and the capacitor structure of the power module 300 according to the present embodiment.

In FIG. 22, each power module 300 is disposed at a predetermined position in the cooling water flow path 19 reciprocating in an S shape, and a power wiring unit connected to the electrical wiring board 334 of the power module 300 is disposed above the power module 300. The capacitor 514 is disposed between the power wiring unit and the cooling water passage 19, and the power wiring connected to the negative electrode and the positive electrode of the power module 300 built in the power wiring unit and the electrical connection terminal of the capacitor 514 are connected. connect a structure formed by integrating a capacitor 514 and a power wiring unit, is fixed in an arc welding 70 7 or micro-TIG welding and laser welding in a predetermined connection points of the power wiring to constitute an electrical connection point . Further, the power wiring unit 701 is integrated with a pressure jig 700A for fixing the power module 300 to the cooling jacket 19A, and the power module 300 can be pressure-fixed to the cooling water channel 19. Further, since dust is generated in arc welding or the like, the power wiring unit 701 is preliminarily finished with the power module 300 and the capacitors 514 and 500 attached and wired, and then inserted into the housing 12 to constitute the inverter device 200. May be. Further, the power wiring unit 701 is integrated with a pressure jig 700A for fixing the power module 300 to the cooling jacket 19A, and the power module 300 can be pressure-fixed to the cooling water channel 19. Further, since dust is generated in arc welding or the like, the power wiring unit 701 is preliminarily finished with the power module 300 and the capacitors 514 and 500 attached and wired, and then inserted into the housing 12 to constitute the inverter device 200. May be.

  According to the present invention, since the wiring distance between the power module 300 and the capacitor 514 can be greatly reduced by integrating the capacitor 514 with the power wiring unit, the wiring inductance can be reduced, and the surge voltage generated when the power semiconductor is switched. Furthermore, since the switching loss and noise generation of the power semiconductor can be reduced, the power module can be downsized, and the power converter can be downsized and highly reliable.

  FIG. 23 is a cross-sectional view showing a fixing method of the power module 300 and a capacitor structure according to this embodiment.

  In FIG. 23, each power module 300 is disposed at a predetermined position in the cooling water passage 19 reciprocating in an S shape, and a module fixing jig 304C that pressurizes and fixes the power module 300 to the cooling water passage 19 is a flange 300B of the power module 300. Arranged at the top. The module fixing jig 304C is provided with a protrusion 304B so as to contact the flange 300B of the power module 300 at a point, and the protrusion 304B pressurizes the upper surface of the flange 300B. Therefore, the pressurized pressure is uniformly dispersed in the cooling jacket 19A of the flange 300B, the liquid seal is uniformly crushed, and the unevenness of the applied pressure due to the deformation of the module fixing jig 304C can be reduced.

  A power wiring unit 701 connected to the electrical wiring board 334 of the power module 300 is disposed on the power module 300. The cooling jacket 19A is provided with an opening that can accommodate the capacitor 514 accommodated in a part of the power wiring unit 701 in parallel with the cooling water channel 19, and the capacitor 514 is directly or by cooling water through the inner wall of the cooling jacket 19A. Cool down. In addition, the power wiring connected to the negative electrode and the positive electrode of the power module 300 and the electrical connection terminal of the capacitor 514 are connected, and the capacitor 514 and the power wiring unit 701 are integrated. Then, the electric connection point 707 is configured by being fixed by arc welding, microtig welding, laser welding, or the like at a predetermined connection point of each power wiring. Further, since dust is generated in arc welding or the like, the power module 300 and the capacitors 514 and 500 are attached to the power wiring unit 701 in advance and finished in a form in which the wiring is completed, and then inserted into the housing 12 and then the inverter device 200. May be configured.

  According to the present invention, the power module 300 and the capacitor 514 can be efficiently cooled by integrating the capacitor 514 with the power wiring unit 701. Furthermore, since the wiring distance connecting each of them can be reduced, the wiring inductance can be reduced, the allowable value of the ripple current of the capacitor 514 can be improved, the surge voltage generated when the power semiconductor is switched, and further the power semiconductor Switching loss and noise generation can be reduced. As a result, the power module and the capacitor can be downsized, and the power converter can be downsized and highly reliable.

  FIG. 24 is a process flow diagram illustrating a method for manufacturing the CAN-shaped heat dissipation base 304 of the power module 300 according to the present embodiment.

  In FIG. 24, the first step (1) is a step for transforming the raw material of the CAN-shaped heat dissipation base 304 into a heat dissipation base shape. The raw material is put into a CAN-shaped hole prepared in the mold 901, The metal mold 900 is easily deformable or powdery metal such as aluminum or copper, and the mold 900 has a recess 900A for forming a flange to be fitted with the cooling jacket 19A and an opening 900B for accommodating a power semiconductor housing. If formed and pressed so that the metal mold 900 and the metal mold 901 fit together, a primary molded CAN-like coolant 903 is formed. Next, in the second process (2), the primary molding created in the first process. This is a step of forming fins in the CAN-like coolant 903, and the fin forming dies 902A and 902B are provided with a plurality of holes 904 for forming pin-like fins, and the primary molding CA When a cylindrical coolant 903 is inserted into a mold having the same shape as the mold 901 and the fin forming dies 902A and 902B are arranged and pressed on both sides, the fin 305 portion of the CAN-shaped heat radiation base 304 and a thin curved shape are formed. A portion 304A is formed, and the remaining material protrudes from between the fin forming dies 902A and 902B. Finally, the height of the formed fin 305 part and the protruding remaining material are deleted to complete.

  After completion, the surface of the CAN-like heat dissipation base 304 may be cleaned or processed to reduce the surface roughness by chemical polishing or the like.

  According to the present invention, the outer wall composed of the same material that is continuously connected to both the heat radiation bases is provided so as to cover the periphery of the opposed heat radiation bases, and an opening is prepared in a part of the outer wall. It is a technique that can easily manufacture the CAN-shaped heat dissipation base 304 that houses the power semiconductor in two press processes, and when deformed due to metal corrosion or cooling water pressure compared to the CAN-shaped heat dissipation base with joints such as welding. The reliability and strength of the insulating sheet 334A can be maintained for many years, and there is no generation of thermal stress during welding or deformation due to the residual stress. Uniformity and tearing can be eliminated, fins are not enlarged due to welding flanges, etc., and a highly reliable and compact double-sided cooling power module 300 can be constructed. It can be realized Yoriyukika.

156, 166 Diode 300A Double-sided electrode module 302 Resin material 304 CAN-like heat dissipation base 304A Outer curved portion 305 Fin 314 DC positive wiring board 316 DC negative wiring board 320L, 320U Power module control terminal 328 Upper arm IGBT
330 IGBT for lower arm
334 Electric wiring board 334A Insulating layer (insulating sheet)
334B Heat dissipation surface 334C Plane 337 Metal bonding material 338 Thermal diffusion plate

Claims (6)

A double-sided electrode module that converts DC power to AC power;
A heat dissipating base sandwiching the heat dissipating surfaces facing each other of the double-sided electrode module through an insulating layer;
A cooling jacket for fixing the heat dissipation base;
A capacitor module constituting a smoothing circuit for suppressing fluctuations in DC voltage;
A positive-side conductor plate and a negative-side conductor plate that transmit electric power between the capacitor module and the double-sided electrode module,
The double-sided electrode module includes a first power semiconductor element that constitutes an upper arm circuit of an inverter circuit, a DC positive electrode wiring board connected to the first power semiconductor element via a metal bonding material, and a lower arm of the inverter circuit A second power semiconductor element constituting a circuit, and a DC negative electrode wiring board connected to the second power semiconductor element via a metal bonding material ,
Wherein the of al the positive electrode side conductor plate negative electrode side conductor plate, power conversion devices constituting the power wiring unit which is integrated in a state in which through the resin by laminating the positive electrode side conductor plate and said negative side conductor plate A manufacturing method of
A first step of bringing the power wiring unit into contact with the cooling jacket ;
A second step of connecting the positive electrode side conductor plate to the DC positive electrode wiring board of the double-sided electrode module by welding and connecting the negative electrode side conductor plate to the DC negative electrode wiring board of the double-sided electrode module; A method for manufacturing a power conversion device . It is a manufacturing method of the power converter device according to claim 1,
The cooling jacket is formed with a space for storing the capacitor module,
In the first step, the capacitor module is a method of manufacturing a power conversion device in which the capacitor module is disposed to face the double-sided electrode module with the heat dissipation base interposed therebetween. A method for manufacturing the power conversion device according to claim 1, wherein:
The double-sided electrode module has an AC wiring board that outputs the AC power;
The power conversion device includes an output wiring that transmits the alternating current from the double-sided electrode module,
The power wiring unit is formed by integrating the positive side conductor plate, the negative side conductor plate, and the output wiring through a resin ,
The second step is a method of manufacturing a power conversion device including a step of connecting the output wiring to the AC wiring board of the double-sided electrode module by welding . It is a manufacturing method of the power converter device according to claim 3,
The power wiring unit is formed by laminating at least a first region where the output wiring is disposed, the positive conductor plate and the negative conductor plate, and not including the output wiring. Two regions,
The second region is disposed on the opposite side of the first region across the DC positive wiring board and the DC negative wiring board ,
The manufacturing method of the power converter device which connects the said output wiring of the said 1st area | region in the said 2nd process with the said alternating current wiring board of the said double-sided electrode module by welding . A method for manufacturing a power conversion device according to any one of claims 1 to 4,
A capacitor-side positive-side conductor plate and a capacitor-side negative-side conductor plate protruding from the capacitor module;
The integrated positive electrode side conductive plate and the negative electrode side conductive plate are arranged on the opposite side of the capacitor module across the heat dissipation base,
In the second step, the capacitor-side positive-side conductor plate and the capacitor-side negative-side conductor plate are respectively connected to the positive-side conductor plate and the negative-side conductor plate through a side portion of the heat dissipation base. Device manufacturing method . A method for manufacturing the power conversion device according to claim 5,
In the second step, the capacitor-side positive electrode side conductor plate and the capacitor-side negative side conductor plate, the manufacturing method of the power converter to be connected by welding respectively the in the positive electrode side conductor plate and the negative electrode side conductor plate.