JP5925869B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus for processing a substrate.

  In order to perform various processes on various substrates such as a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate, Used.

  For example, the substrate processing apparatus described in Patent Document 1 includes an indexer block, a processing block, and an interface block. A substrate is carried into the indexer block, and a film forming process is performed on the substrate in the processing block. The substrate after the film formation process is transferred to the exposure apparatus via the interface block, and the exposure process is performed on the substrate in the exposure apparatus. The substrate after the exposure processing is returned to the processing block via the interface block, and development processing is performed on the substrate in the processing block. The substrate after the development processing is carried out from the indexer block.

JP 2007-189138 A

  A plurality of transport mechanisms for transporting the substrate are provided in the substrate processing apparatus. In order to improve the throughput of the substrate processing apparatus, it is required to increase the substrate transfer efficiency by a plurality of transfer mechanisms.

  An object of the present invention is to provide a substrate processing apparatus capable of improving throughput.

[A] Present Invention (1) A substrate processing apparatus according to the present invention is a substrate processing apparatus that is disposed adjacent to an exposure apparatus and configured to perform processes before and after the exposure process by the exposure apparatus. , An indexer block into which a container capable of accommodating a plurality of substrates is carried in and out, a processing block for performing a predetermined process on the substrate, and a delivery for delivering the substrate between the exposure apparatus and the processing block And the indexer block is configured to convey the substrate in parallel between the container placement unit on which the container is placed and the storage container placed on the container placement unit and the processing block. And the second transport mechanism, the processing block includes a third transport mechanism for transporting the substrate, and a plurality of substrates are temporarily placed between the first transport mechanism and the third transport mechanism. Possible first substrate platform A second substrate placement unit that is provided and capable of temporarily placing a plurality of substrates between the second transport mechanism and the third transport mechanism; The third transport mechanism includes a processing section and a lower processing section, and the third transport mechanism includes an upper transport mechanism provided in the upper processing section and a lower transport mechanism provided in the lower processing section, and the transfer section transports the substrate. The order of the substrates transported from the indexer block to the processing block is the same as the order of the substrates transported from the processing block to the transfer unit, and the order of the substrates transferred from the transfer unit to the processing block is The first, second, third and fourth transport mechanisms transport the substrates so that the order of the substrates transported from the processing block to the indexer block matches.

  (2) The container placement unit includes a first placement unit and a second placement unit, and the accommodation container in which the substrate before processing is accommodated is placed on the first placement unit to accommodate the processed substrate. And the first transport mechanism is configured to transport the substrate from the storage container placed on the first placement part to the processing block. The second transport mechanism may be configured to transport the substrate from the processing block to the storage container placed on the second placement unit.

(3) The first substrate placing unit is provided between the first upper placing unit provided between the first carrying mechanism and the upper carrying mechanism, and between the first carrying mechanism and the lower carrying mechanism. A second lower stage placing section provided between the second transport mechanism and the upper stage transport mechanism, and a second lower stage placing section. A second lower stage mounting portion provided between the upper transport mechanism and the lower transport mechanism, and a third upper stage mounting portion is provided between the upper transport mechanism and the fourth transport mechanism. A third lower stage placement unit is provided between the transport mechanism and the fourth transport mechanism, and one or both of the first and second transport mechanisms can transfer the substrate before processing to the first upper stage placement unit and The fourth transport mechanism is configured to alternately transport the substrate to the first lower stage placement unit, and the fourth transport mechanism alternately receives the substrate from the third upper stage placement unit and the third lower stage placement unit. It is configured to transfer a substrate alternately in the lower section of the stepped section and the third, the other or both of the first and second transport mechanism, the processed substrate mounting the second upper portion and a You may comprise so that it may receive alternately from two lower stage mounting parts.
(4) The first transport mechanism is configured to alternately transport the substrate before processing to the first upper stage mounting unit and the first lower stage mounting unit, and the second transport mechanism You may be comprised so that a board | substrate may be alternately received from a 2nd upper stage mounting part and a 2nd lower stage mounting part.

( 5 ) The first and second substrate platforms are provided so as to overlap each other, and the first transport mechanism transports the substrate to the first substrate platform at the first position. The second transport mechanism may be configured to receive the substrate from the second substrate platform at a second position different from the first position.

( 6 ) The indexer block includes first and second transfer chambers arranged one above the other, the first transfer mechanism is provided in the first transfer chamber, and the second transfer mechanism is the second transfer chamber. It may be provided in the chamber.

[B] Reference Form (1) A substrate processing apparatus according to a reference form includes an indexer block into which a storage container capable of storing a plurality of substrates is loaded and unloaded, and a processing block that performs a predetermined process on the substrate. The indexer block includes first and second transporting substrates in parallel with each other between a container mounting unit on which the storage container is mounted, and the storage container mounted on the container mounting unit and the processing block. And a transport mechanism.

  In the substrate processing apparatus, a storage container storing a plurality of substrates is carried into the indexer block. The substrate taken out from the storage container is transferred to the processing block, and a predetermined process is performed in the processing block. The processed substrate is accommodated in the accommodating container and carried out of the indexer block.

  In the indexer block, the storage container is placed on the container mounting portion, the substrate before processing is transported from the storage container to the processing block by the first and second transport mechanisms, and the processed substrate is transferred from the processing block to the storage container. Is transported. In this case, the substrate can be efficiently transported between the storage container and the processing block by transporting the substrate in parallel by the first and second transport mechanisms. As a result, the throughput of the substrate processing apparatus can be improved.

  Here, “the substrate is transported in parallel” is not limited to the case where the first and second transport mechanisms transport the substrate at the same time, and the transport period of the substrate by the first transport mechanism and the second transport mechanism. This includes the case where the substrate transport period by the transport mechanism partially overlaps.

  (2) The first transport mechanism includes first and second holding portions configured to be able to hold a substrate, and the second transport mechanism is configured to be configured to hold the substrate. You may have a holding part.

  In this case, each of the first and second transport mechanisms can simultaneously hold and transport two substrates. Thereby, the board | substrate conveyance efficiency by the 1st and 2nd conveyance mechanism is further raised.

  (3) The first transport mechanism is configured to transport the substrate before processing from the storage container placed on the container placement unit to the processing block, and the second transport mechanism processes the substrate after processing. You may be comprised so that it may convey to the storage container mounted in the container mounting part from the block.

  In this case, compared with the case where each of the first and second transport mechanisms both transports the substrate from the storage container to the processing block and transports the substrate from the processing block to the storage container, the first and second transport mechanisms. The operation of the transport mechanism is simplified. Thereby, the board | substrate conveyance efficiency by the 1st and 2nd conveyance mechanism is further raised.

  (4) The container placement unit includes first and second placement units, and the accommodation container in which the substrate before processing is accommodated is placed on the first placement unit and accommodates the substrate after processing. And the first transport mechanism is configured to transport the substrate from the storage container placed on the first placement part to the processing block. The second transport mechanism may be configured to transport the substrate from the processing block to the storage container placed on the second placement unit.

  In this case, since the storage container in which the substrate before processing is stored and the storage container for storing the processed substrate are placed on different container mounting portions, the first transport mechanism is the substrate before processing. Can be transported more smoothly, and the second transport mechanism can transport the processed substrate more smoothly. Thereby, the board | substrate conveyance efficiency by the 1st and 2nd conveyance mechanism is further raised.

  (5) The processing block includes a third transport mechanism for transporting the substrate, and the substrate processing apparatus is provided between the first transport mechanism and the third transport mechanism, and temporarily mounts a plurality of substrates. A first substrate placement unit that can be placed; and a second substrate placement unit that is provided between the first transport mechanism and the third transport mechanism and that can temporarily place a plurality of substrates. Further, it may be provided.

  In this case, the substrate is transferred between the first and third transport mechanisms via the first substrate platform, and the substrate is transferred between the second and third transport mechanisms via the second substrate platform. Is passed. Since a plurality of substrates can be placed on the first and second substrate platforms, even if the previously transported substrates are placed on the first and second substrate platforms, A new substrate can be mounted on the first and second substrate platforms. Therefore, the substrate can be continuously transferred by the first to third transfer mechanisms. As a result, the substrate transfer efficiency is further enhanced.

  (6) The indexer block includes first and second transfer chambers arranged one above the other, the first transfer mechanism is provided in the first transfer chamber, and the second transfer mechanism is the second transfer chamber. It may be provided in the chamber.

  In this case, the installation area of the first and second transport mechanisms can be reduced by arranging the first and second transport mechanisms vertically. Thereby, the substrate processing apparatus can be downsized.

  According to the present invention, the throughput of the substrate processing apparatus can be improved.

1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic side view of a coating processing unit, a coating development processing unit, and a cleaning / drying processing unit of FIG. 1. It is a schematic side view of the heat processing part and washing | cleaning drying process part of FIG. It is a typical side view of the 1st processing block. It is a typical side view of a conveyance part. It is a typical side view which shows the structure of a conveyance mechanism. It is a typical side view which shows the structure of a conveyance mechanism. It is the perspective view and front view of a carrier. It is an external appearance perspective view which shows the structure of a sending buffer part and a return buffer part. It is a side view which shows the structure of a sending buffer part and a return buffer part. It is a top view for demonstrating mounting and reception of the board | substrate with respect to a sending buffer part and a return buffer part. It is a top view for demonstrating mounting and reception of the board | substrate with respect to a sending buffer part and a return buffer part. It is a typical side view for demonstrating conveyance of the board | substrate from the carrier to a sending buffer part by a conveyance mechanism. It is a typical side view for demonstrating conveyance of the board | substrate from the carrier to a sending buffer part by a conveyance mechanism. It is a typical side view for demonstrating conveyance of the board | substrate from the return buffer part by a conveyance mechanism to a carrier. It is a typical side view for demonstrating conveyance of the board | substrate from the return buffer part by a conveyance mechanism to a carrier. It is a typical side view which shows the structure of the substrate processing apparatus which concerns on the 2nd Embodiment of this invention. It is a typical side view which shows the structure of the substrate processing apparatus which concerns on the 2nd Embodiment of this invention. It is a typical top view which shows the structure of the substrate processing apparatus which concerns on the 3rd Embodiment of this invention. It is a typical top view which shows the structure of the substrate processing apparatus which concerns on the 4th Embodiment of this invention. It is a typical side view which shows the structure of the substrate processing apparatus which concerns on the 4th Embodiment of this invention. It is the side view and top view which show the other example of a hand.

  Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, a photomask glass substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate. Etc.

(1) First Embodiment (1-1) Configuration of Substrate Processing Apparatus FIG. 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention. 1 and 2 and subsequent drawings are provided with arrows indicating X, Y, and Z directions orthogonal to each other in order to clarify the positional relationship. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction. In each direction, the direction in which the arrow points is the + direction, and the opposite direction is the-direction.

  The substrate processing apparatus 100 includes an indexer block 11, a first processing block 12, a second processing block 13, and an interface block 14. The interface block 14 includes a cleaning / drying processing block 14A and a loading / unloading block 14B. The exposure device 15 is disposed adjacent to the carry-in / carry-out block 14B. In the exposure device 15, the substrate W is subjected to exposure processing by a liquid immersion method.

  As shown in FIG. 1, the indexer block 11 includes a pair of carrier placement units 111 a and 111 b and a transport unit 112. Carriers 113 for accommodating a plurality of substrates W in multiple stages are respectively placed on the carrier placement portions 111a and 111b. In the present embodiment, FOUP (front opening unified pod) is used as the carrier 113.

  The transport unit 112 is provided with a control unit 114 and transport mechanisms IR1 and IR2. The control unit 114 controls various components of the substrate processing apparatus 100. The transport mechanisms IR1 and IR2 each hold and transport the substrate W. As shown in FIG. 5 to be described later, the transport unit 112 is formed with an opening 117 for delivering the substrate W between the carrier 113 and the transport mechanisms IR1 and IR2.

  A main panel PN is provided on the side surface of the transport unit 112. The user can check the processing status of the substrate W in the substrate processing apparatus 100 on the main panel PN. In addition, an operation unit (not shown) including a keyboard is provided near the main panel PN. The user can perform operation setting of the substrate processing apparatus 100 by operating the operation unit.

  The first processing block 12 includes a coating processing unit 121, a transport unit 122, and a heat treatment unit 123. The coating processing unit 121 and the heat treatment unit 123 are provided so as to face each other with the conveyance unit 122 interposed therebetween. A sending buffer unit SBF1 is provided between the transport unit 122 and the indexer block 11. As shown in FIG. 5 to be described later, below the sending buffer unit SBF1, a sending buffer unit SBF2 and return buffer units RBF1 and RBF2 are provided. The sending buffer units SBF1 and SBF2 and the return buffer units RBF1 and RBF2 are configured so that a plurality of substrates W can be placed thereon. The transport unit 122 is provided with a transport mechanism 127 for transporting the substrate W and a transport mechanism 128 (see FIG. 5) described later.

  The second processing block 13 includes a coating and developing processing unit 131, a conveying unit 132, and a heat treatment unit 133. The coating / development processing unit 131 and the heat treatment unit 133 are provided so as to face each other with the conveyance unit 132 interposed therebetween. Between the transport unit 132 and the transport unit 122, a substrate platform PASS1 on which the substrate W is placed and substrate platforms PASS2 to PASS4 (see FIG. 5) described later are provided. The transport unit 132 is provided with a transport mechanism 137 for transporting the substrate W and a transport mechanism 138 (see FIG. 5) described later. In the second processing block 13, a packing 145 is provided between the heat treatment unit 133 and the interface block 14.

  The cleaning / drying processing block 14 </ b> A includes cleaning / drying processing units 161, 162 and a transport unit 163. The cleaning / drying processing units 161 and 162 are provided to face each other with the conveyance unit 163 interposed therebetween. The transport unit 163 is provided with transport mechanisms 141 and 142.

  Between the transport unit 163 and the transport unit 132, a placement / buffer unit P-BF1 and a later-described placement / buffer unit P-BF2 (see FIG. 5) are provided. The placement / buffer units P-BF1 and P-BF2 are configured to be capable of placing a plurality of substrates W.

  Between the transport mechanisms 141 and 142, a substrate platform PASS5 and a later-described platform / cooler P-CP (see FIG. 5) are provided so as to be adjacent to the carry-in / carry-out block 14B. The placement / cooling unit P-CP has a function of cooling the substrate W (for example, a cooling plate). In the placement / cooling section P-CP, the substrate W is cooled to a temperature suitable for the exposure process.

  A transport mechanism 146 is provided in the carry-in / carry-out block 14B. The transport mechanism 146 carries the substrate W into and out of the exposure apparatus 15. The exposure apparatus 15 is provided with a substrate carry-in portion 15a for carrying in the substrate W and a substrate carry-out portion 15b for carrying out the substrate W. Note that the substrate carry-in portion 15a and the substrate carry-out portion 15b of the exposure apparatus 15 may be arranged so as to be adjacent in the horizontal direction, or may be arranged vertically.

  The carry-in / carry-out block 14B is provided to be movable in the + Y direction and the −Y direction with respect to the cleaning / drying processing block 14A. During maintenance of the cleaning / drying processing block 14A, the carry-in / carry-out block 14B, and the exposure apparatus 15, the work space can be secured by moving the carry-in / carry-out block 14B in the + Y direction or the −Y direction. The carry-in / carry-out block 14B is lighter than other blocks and can be easily moved.

(1-2) Configuration of Application Processing Unit and Development Processing Unit FIG. 2 is a schematic side view of the application processing unit 121, the application development processing unit 131, and the cleaning / drying processing unit 161 in FIG. In FIG. 2, components provided in a region (hereinafter referred to as + Y side) along one side surface of the substrate processing apparatus 100 are mainly shown.

  As shown in FIG. 2, the coating processing section 121 is provided with coating processing chambers 21, 22, 23, and 24 in a hierarchical manner. In each of the coating processing chambers 21 to 24, a coating processing unit 129 is provided. The coating development processing unit 131 is provided with development processing chambers 31 and 33 and coating processing chambers 32 and 34 in a hierarchical manner. Each development processing chamber 31, 33 is provided with a development processing unit 139, and each coating processing chamber 32, 34 is provided with a coating processing unit 129.

  Each coating processing unit 129 includes a spin chuck 25 that holds the substrate W and a cup 27 that is provided so as to cover the periphery of the spin chuck 25. In the present embodiment, two spin chucks 25 and two cups 27 are provided in each coating processing unit 129. The spin chuck 25 is rotationally driven by a driving device (not shown) (for example, an electric motor).

  As shown in FIG. 1, each coating processing unit 129 includes a plurality of nozzles 28 that discharge a processing liquid and a nozzle transport mechanism 29 that transports the nozzles 28.

  In the coating processing unit 129, any one of the plurality of nozzles 28 is moved above the substrate W by the nozzle transport mechanism 29. Then, the processing liquid is applied onto the substrate W by discharging the processing liquid from the nozzle 28. When the processing liquid is supplied from the nozzle 28 to the substrate W, the spin chuck 25 is rotated by a driving device (not shown). Thereby, the substrate W is rotated.

  In the present embodiment, the treatment liquid for the antireflection film is supplied from the nozzle 28 to the substrate W in the coating processing unit 129 of the coating processing chambers 22 and 24. In the coating processing units 129 of the coating processing chambers 21 and 23, a resist film processing solution is supplied to the substrate W from the nozzle 28. In the coating processing unit 129 of the coating processing chambers 32 and 34, a processing liquid for resist cover film is supplied from the nozzle 28 to the substrate W.

  As shown in FIG. 2, the development processing unit 139 includes a spin chuck 35 and a cup 37, similar to the coating processing unit 129. In the present embodiment, three spin chucks 35 and three cups 37 are provided in the development processing unit 139. Further, as shown in FIG. 1, the development processing unit 139 includes two slit nozzles 38 that discharge the developer and a moving mechanism 39 that moves the slit nozzles 38 in the X direction.

  In the development processing unit 139, first, the developer is supplied to each substrate W while one slit nozzle 38 moves in the X direction. Thereafter, the developer is supplied to each substrate W while the other slit nozzle 38 moves. Note that when the developer is supplied from the slit nozzle 38 to the substrate W, the spin chuck 35 is rotated by a driving device (not shown). Thereby, the substrate W is rotated.

  In the present embodiment, the developing solution is supplied to the substrate W in the development processing unit 139, whereby the resist cover film on the substrate W is removed and the development processing of the substrate W is performed. In the present embodiment, different developer solutions are discharged from the two slit nozzles 38. Thereby, two types of developers can be supplied to each substrate W.

  In the example of FIG. 2, the coating processing unit 129 has two spin chucks 25 and two cups 27, and the development processing unit 139 has three spin chucks 35 and three cups 37, but the spin chucks 25, 35 and The number of cups 27 and 37 is not limited to this, and may be arbitrarily changed.

  The cleaning / drying processing unit 161 includes a plurality (four in this example) of cleaning / drying processing units SD1. In the cleaning / drying processing unit SD1, the substrate W before the exposure processing is cleaned and dried.

  In the cleaning / drying processing unit SD1, the back surface of the substrate W and the end portion (bevel portion) of the substrate W may be polished using a brush or the like. Here, the back surface of the substrate W refers to a surface opposite to the surface of the substrate W on which various patterns such as circuit patterns are formed.

  As shown in FIG. 2, clean air whose temperature and humidity are adjusted is supplied into the coating processing chambers 21 to 24, 32 and 34 above the coating processing unit 129 in the coating processing chambers 21 to 24, 32 and 34. An air supply unit 41 is provided. In the development processing chambers 31 and 33, an air supply unit 47 for supplying clean air adjusted in temperature and humidity is provided in the development processing chambers 31 and 33 above the development processing unit 139.

  In the coating processing chambers 21 to 24, 32, and 34, an exhaust unit 42 for exhausting the atmosphere in the cup 27 is provided below the coating processing unit 129. In the development processing chambers 31 and 33, an exhaust unit 48 for exhausting the atmosphere in the cup 37 is provided below the development processing unit 139.

  As shown in FIGS. 1 and 2, a fluid box unit 50 is provided in the coating processing unit 121 so as to be adjacent to the coating and developing processing unit 131. Similarly, a fluid box unit 60 is provided in the coating and developing processing unit 131 so as to be adjacent to the cleaning / drying processing block 14A. In the fluid box unit 50 and the fluid box unit 60, conduits, joints, valves for supplying chemicals to the coating processing unit 129 and the development processing unit 139 and draining and exhausting the coating processing unit 129 and the development processing unit 139, etc. Houses fluid-related equipment such as flowmeters, regulators, pumps, and temperature controllers.

(1-3) Configuration of Heat Treatment Unit FIG. 3 is a schematic side view of the heat treatment units 123 and 133 and the cleaning / drying processing unit 162 of FIG. In FIG. 3, components provided in a region along the other side surface of the substrate processing apparatus 100 (hereinafter referred to as “−Y side”) are mainly shown.

  As shown in FIG. 3, the heat treatment part 123 has an upper heat treatment part 301 provided above and a lower heat treatment part 302 provided below. The upper heat treatment section 301 and the lower heat treatment section 302 are provided with a plurality of heat treatment units PHP, a plurality of adhesion reinforcement processing units PAHP, and a plurality of cooling units CP.

  In the heat treatment unit PHP, the substrate W is heated and cooled. In the adhesion reinforcement processing unit PAHP, adhesion reinforcement processing for improving the adhesion between the substrate W and the antireflection film is performed. Specifically, in the adhesion reinforcement processing unit PAHP, an adhesion enhancing agent such as HMDS (hexamethyldisilazane) is applied to the substrate W, and the substrate W is subjected to heat treatment. In the cooling unit CP, the substrate W is cooled.

  The heat treatment part 133 includes an upper heat treatment part 303 provided above and a lower heat treatment part 304 provided below. The upper heat treatment unit 303 and the lower heat treatment unit 304 are provided with a cooling unit CP, a plurality of heat treatment units PHP, and an edge exposure unit EEW. In the edge exposure unit EEW, exposure processing (edge exposure processing) of the peripheral edge of the substrate W is performed.

  The cleaning / drying processing section 162 is provided with a plurality (five in this example) of cleaning / drying processing units SD2. In the cleaning / drying processing unit SD2, the substrate W after the exposure processing is cleaned and dried.

(1-4) Configuration of Conveying Unit (1-4-1) Schematic Configuration FIG. 4 is a schematic side view of the first processing block 12, and FIG. 5 illustrates the conveying units 112, 122, 132, and 163. It is a typical side view. FIG. 4 shows the configuration of the first processing block 12 viewed from the indexer block 11, and FIG. 5 shows the configuration of the transport units 112, 122, 132, and 163 viewed from the + Y side.

  As shown in FIGS. 4 and 5, the transfer unit 122 includes an upper transfer chamber 125 and a lower transfer chamber 126. The transfer unit 132 includes an upper transfer chamber 135 and a lower transfer chamber 136.

  The upper transfer chamber 125 is provided with a transfer mechanism 127, and the lower transfer chamber 126 is provided with a transfer mechanism 128. The upper transfer chamber 135 is provided with a transfer mechanism 137, and the lower transfer chamber 136 is provided with a transfer mechanism 138.

  As shown in FIG. 4, the coating processing chambers 21 and 22 and the upper thermal processing section 301 are provided so as to face each other with the upper transport chamber 125 interposed therebetween, and the coating processing chambers 23 and 24 and the lower thermal processing section 302 are disposed in the lower transport chamber. 126 so as to face each other with 126 therebetween. Similarly, the development processing chamber 31 and the coating processing chamber 32 (FIG. 2) and the upper heat treatment section 303 (FIG. 3) are provided to face each other with the upper transfer chamber 135 (FIG. 5) interposed therebetween. The coating treatment chamber 34 (FIG. 2) and the lower heat treatment section 304 (FIG. 3) are provided to face each other with the lower transfer chamber 136 (FIG. 5) interposed therebetween.

As shown in FIG. 5, there is a feed buffer unit SB between the transport unit 112 and the upper transport chamber 125.
F1 and a return buffer unit RBF1 are provided, and a feed buffer unit SBF2 and a return buffer unit RBF2 are provided between the transfer unit 112 and the lower transfer chamber 126. Details of the sending buffer units SBF1, SBF2 and the return buffer units RBF1, RBF2 will be described later. Substrate platforms PASS1 and PASS2 are provided between the upper transport chamber 125 and the upper transport chamber 135, and substrate platforms PASS3 and PASS4 are provided between the lower transport chamber 126 and the lower transport chamber 136. It is done. A placement / buffer unit P-BF1 is provided between the upper transfer chamber 135 and the transfer unit 163, and a placement / buffer unit P-BF2 is provided between the lower transfer chamber 136 and the transfer unit 163. . A substrate platform PASS5 and a plurality of placement / cooling units P-CP are provided in the transport unit 163 so as to be adjacent to the carry-in / carry-out block 14B.

  The sending buffer unit SBF1 and the return buffer unit RBF1 are configured to be able to carry in and out the substrate W by the transport mechanisms IR1 and IR2 and the transport mechanism 127. The sending buffer unit SBF2 and the return buffer unit RBF2 are configured to be able to carry in and out the substrate W by the transport mechanisms IR1 and IR2 and the transport mechanism 128. The substrate platforms PASS1, PASS2 are configured such that the substrate W can be carried in and out by the transport mechanisms 127, 137. The substrate platforms PASS3 and PASS4 are configured so that the transport mechanisms 128 and 138 can carry in and out the substrate W.

  The placement / buffer unit P-BF1 is configured so that the substrate W can be carried in and out by the transport mechanism 137 and the transport mechanisms 141 and 142 (FIG. 1). The placement / buffer unit P-BF2 is configured such that the substrate W can be carried in and out by the transport mechanism 138 and the transport mechanisms 141 and 142 (FIG. 1). The configuration of the placement / buffer units P-BF1 and P-BF2 may be the same as the configuration of the sending buffer units SBF1 and SBF2 and the return buffer units RBF1 and RBF2 (see FIGS. 9 and 10 described later). The substrate platform PASS5 and the placement / cooling unit P-CP are configured such that the substrate W can be carried in and out by the transport mechanisms 141 and 142 (FIG. 1) and the transport mechanism 146.

  In the example of FIG. 5, only one substrate platform PASS5 is provided, but a plurality of substrate platforms PASS5 may be provided vertically. In this case, a plurality of substrate platforms PASS5 may be used as a buffer unit for temporarily placing the substrate W thereon.

  A substrate W to be transported from the indexer block 11 to the first processing block 12 is placed on the sending buffer units SBF1 and SBF2, and from the first processing block 12 to the indexer block 11 on the return buffer units RBF1 and RBF2. A substrate W to be transported is placed.

  The substrate W to be transferred from the first processing block 12 to the second processing block 13 is placed on the substrate platform PASS1 and the substrate platform PASS3, and is placed on the substrate platform PASS2 and the substrate platform PASS4. The substrate W transported from the second processing block 13 to the first processing block 12 is placed.

  A substrate W to be transported from the second processing block 13 to the cleaning / drying processing block 14A is placed on the placement / buffer units P-BF1 and P-BF2. The substrate W to be transported from the cleaning / drying processing block 14A to the carry-in / carry-out block 14B is placed on the placement / cooling unit P-CP. The substrate W to be transported from the carry-in / carry-out block 14B to the cleaning / drying processing block 14A is placed on the substrate platform PASS5.

  An air supply unit 43 is provided above the transfer mechanism 127 in the upper transfer chamber 125, and an air supply unit 43 is provided above the transfer mechanism 128 in the lower transfer chamber 126. An air supply unit 43 is provided above the transfer mechanism 137 in the upper transfer chamber 135, and an air supply unit 43 is provided above the transfer mechanism 138 in the lower transfer chamber 136. The air supply unit 43 is supplied with air whose temperature and humidity are adjusted from a temperature control device (not shown).

  An exhaust unit 44 for exhausting the upper transport chamber 125 is provided below the transport mechanism 127 in the upper transport chamber 125, and the exhaust of the lower transport chamber 126 is exhausted below the transport mechanism 128 in the lower transport chamber 126. An exhaust unit 44 for performing is provided.

  Similarly, an exhaust unit 44 for exhausting the upper transport chamber 135 is provided below the transport mechanism 137 in the upper transport chamber 135, and the exhaust of the lower transport chamber 136 is disposed below the transport mechanism 138 in the lower transport chamber 136. An exhaust unit 44 for performing the above is provided.

  As a result, the atmosphere in the upper transfer chambers 125 and 135 and the lower transfer chambers 126 and 136 is maintained in an appropriate temperature and humidity and a clean state.

  An air supply unit 45 is provided in the upper part of the transport unit 163 of the cleaning / drying processing block 14A. An air supply unit 46 is provided in the upper part of the carry-in / carry-out block 14B. The air supply units 45 and 46 are supplied with air whose temperature and humidity are adjusted from a temperature control device (not shown). Thereby, the atmosphere in the cleaning / drying processing block 14A and the carry-in / carry-out block 14B is maintained at an appropriate temperature and humidity and in a clean state.

(1-4-2) Configuration of Transport Mechanism The configuration of the transport mechanisms 127, 128, 137, and 138 will be described with reference to FIG. As shown in FIG. 5, each of the transport mechanisms 127, 128, 137, and 138 includes guide rails 311, 312, and 313, a moving member 314, a rotating member 315, and hands H1 and H2.

  The guide rails 311 and 312 are provided so as to extend in the vertical direction. The guide rail 313 is provided so as to extend in the X direction between the guide rail 311 and the guide rail 312 and is attached to the guide rails 311 and 312 so as to be movable up and down. The moving member 314 is attached to the guide rail 313 so as to be movable in the X direction.

  A rotating member 315 is rotatably provided on the upper surface of the moving member 314. A hand H1 and a hand H2 for holding the substrate W are attached to the rotating member 315. The hands H1 and H2 are configured to be able to advance and retract based on the rotating member 315.

  With the configuration described above, each of the transport mechanisms 127, 128, 137, and 138 holds the substrate W using the hands H1 and H2, and transports the substrate W by freely moving in the X direction and the Z direction. Can do.

  FIG. 6 is a schematic side view showing the configuration of the transport mechanisms IR1 and IR2, and FIG. 7 is a schematic side view showing the configuration of the transport mechanisms 141 and 142. FIG. 6 shows the configuration of the transport mechanisms IR1 and IR2 from the side opposite to the first processing block 12. FIG. 7 shows the configuration of the transport mechanisms 141 and 142 viewed from the carry-in / carry-out block 14B.

  As shown in FIG. 6, each of the transport mechanisms IR1 and IR2 has hands IH1 and IH2 for holding the substrate W. Each of the transport mechanisms IR1 and IR2 can advance and retract the hands IH1 and IH2 independently of each other. In addition, each of the transport mechanisms IR1 and IR2 is configured to be extendable in the vertical direction and rotatable about an axis in the vertical direction. The interval C1 in the vertical direction of the hands IH1 and IH2 is kept constant.

  As shown in FIG. 7, each of the transport mechanisms 141 and 142 has hands H3 and H4 that can hold the substrate W. Each of the transport mechanisms 141 and 142 can advance and retract the hands H3 and H4 independently of each other. Further, each of the transport mechanisms 141 and 142 is configured to be extendable in the vertical direction and to be rotatable around an axis in the vertical direction.

(1-5) Operation of Each Component of Substrate Processing Apparatus Hereinafter, an operation of each component of the substrate processing apparatus 100 according to the present embodiment will be described.

(1-5-1) Operation of the Indexer Block 11 Hereinafter, the operation of the indexer block 11 will be described with reference mainly to FIG. 1 and FIG. A carrier 113 containing an unprocessed substrate W is placed on the carrier placement portion 111a of the indexer block 11, and an empty carrier 113 containing no substrate W is placed on the carrier placement portion 111b. Is done. The transport mechanism IR1 alternately transports the unprocessed substrate W from the carrier 113 placed on the carrier placement unit 111a to the sending buffer units SBF1 and SBF2. The transport mechanism IR2 alternately transports the processed substrate W from the return buffer units RBF1 and RBF2 to the carrier 113 placed on the carrier platform 111b. In this case, the substrate W is transported in parallel by the transport mechanisms IR1 and IR2. Here, “the substrate W is transported in parallel” is not limited to the case where the transport mechanisms IR1 and IR2 transport the substrate W at the same time, but the transport period of the substrate W by the transport mechanism IR1 and the substrate by the transport mechanism IR2. This includes the case where the W conveyance period partially overlaps. Details of the operations of the transport mechanisms IR1 and IR2 will be described later.

(1-5-2) Operation of First Processing Block 12 Hereinafter, the operation of the first processing block 12 will be described with reference mainly to FIGS. 1 to 3 and FIG. In the following, for the sake of simplicity, description of movement of the transport mechanisms 127 and 128 in the X direction and Z direction will be omitted.

  The substrate W placed on the sending buffer unit SBF1 (FIG. 5) by the transport mechanism IR1 (FIG. 1) is taken out by the hand H1 of the transport mechanism 127 (FIG. 5). Further, the transport mechanism 127 places the substrate W held by the hand H2 on the return buffer unit RBF1. The substrate W placed on the return buffer unit RBF1 from the hand H2 is the substrate W after development processing.

  Next, the transport mechanism 127 takes out the substrate W after the adhesion reinforcement processing from the predetermined adhesion reinforcement processing unit PAHP (FIG. 3) of the upper thermal processing section 301 (FIG. 3) with the hand H2. Further, the transport mechanism 127 carries the unprocessed substrate W held by the hand H1 into the adhesion strengthening processing unit PAHP.

  Next, the transport mechanism 127 takes out the substrate W after the cooling processing from the predetermined cooling unit CP of the upper thermal processing section 301 (FIG. 3) with the hand H1. Further, the transport mechanism 127 carries the substrate W after the adhesion strengthening process held by the hand H2 into the cooling unit CP. In the cooling unit CP, the substrate W is cooled to a temperature suitable for forming the antireflection film.

  Next, the transport mechanism 127 takes out the substrate W after the formation of the antireflection film from the spin chuck 25 (FIG. 2) in the coating processing chamber 22 (FIG. 2) with the hand H <b> 2. Further, the transport mechanism 127 places the substrate W after the cooling process held by the hand H <b> 1 on the spin chuck 25. In the coating processing chamber 22, an antireflection film is formed on the substrate W by the coating processing unit 129 (FIG. 2).

  Next, the transport mechanism 127 takes out the substrate W after the heat treatment from the predetermined heat treatment unit PHP of the upper heat treatment portion 301 (FIG. 3) with the hand H1. Further, the transport mechanism 127 carries the substrate W after the formation of the antireflection film held by the hand H2 into the heat treatment unit PHP. In the heat treatment unit PHP, the heating process and the cooling process of the substrate W are continuously performed.

  Next, the transport mechanism 127 takes out the substrate W after the cooling processing from the predetermined cooling unit CP (FIG. 3) of the upper thermal processing section 301 (FIG. 4) with the hand H2. Further, the transport mechanism 127 carries the substrate W after the heat treatment held by the hand H1 into the cooling unit CP. In the cooling unit CP, the substrate W is cooled to a temperature suitable for the resist film forming process.

  Next, the transport mechanism 127 takes out the substrate W after the formation of the resist film from the spin chuck 25 (FIG. 2) in the coating processing chamber 21 (FIG. 2) with the hand H1. Further, the transport mechanism 127 places the substrate W after the cooling process held by the hand H <b> 2 on the spin chuck 25. In the coating processing chamber 22, a resist film is formed on the substrate W by the coating processing unit 129 (FIG. 2).

  Next, the transport mechanism 127 takes out the substrate W after the heat treatment from the predetermined heat treatment unit PHP of the upper heat treatment portion 301 (FIG. 3) with the hand H2. Further, the transport mechanism 127 carries the substrate W after the resist film formation held by the hand H1 into the heat treatment unit PHP.

  Next, the transport mechanism 127 places the heat-treated substrate W held by the hand H2 on the substrate platform PASS1 (FIG. 5). Further, the transport mechanism 127 takes out the substrate W after the development processing from the substrate platform PASS2 (FIG. 5) with the hand H2. Thereafter, the transport mechanism 127 transports the substrate W after the development processing taken out from the substrate platform PASS2 to the return buffer unit RBF1 (FIG. 5).

  The transport mechanism 127 repeats the above processing, whereby predetermined processing is continuously performed on the plurality of substrates W in the first processing block 12.

  The transport mechanism 128 is operated in the same manner as the transport mechanism 127, so that the feed buffer unit SBF 2, the return buffer unit RBF 2, the substrate platforms PASS 3 and PASS 4 (FIG. 5), the coating processing chambers 23 and 24 (FIG. 2), and the lower heat treatment unit. The substrate W is carried into and out of 302 (FIG. 4).

As described above, in the present embodiment, the substrate W transported by the transport mechanism 127 is processed in the coating processing chambers 21 and 22 and the upper thermal processing section 301, and the substrate W transported by the transport mechanism 128 is processed by the coating process. Processing is performed in the chambers 23 and 24 and the lower heat treatment section 302. In this case, the processing of the plurality of substrates W is simultaneously performed in the upper processing units (coating processing chambers 21 and 22 and the upper thermal processing unit 301) and the lower processing units (coating processing chambers 23 and 24 and the lower thermal processing unit 302). Can do. Thereby, the throughput of the first processing block 12 can be improved without increasing the transport speed of the substrate W by the transport mechanisms 127 and 128. In addition, since the transport mechanisms 127 and 128 are provided above and below, an increase in the footprint of the substrate processing apparatus 100 can be prevented.

(1-5-3) Operation of Second Processing Block 13 The operation of the second processing block 13 will be described below mainly using FIGS. 1 to 3 and FIG. In the following, for the sake of simplicity, description of movement of the transport mechanisms 137 and 138 in the X direction and the Z direction is omitted.

  The substrate W placed on the substrate platform PASS1 (FIG. 5) by the transport mechanism 127 is taken out by the hand H1 of the transport mechanism 137 (FIG. 5). The transport mechanism 137 places the substrate W held by the hand H2 on the substrate platform PASS2. The substrate W placed on the substrate platform PASS2 from the hand H2 is the substrate W after development processing.

  Next, the transport mechanism 137 takes out the substrate W after the formation of the resist cover film from the spin chuck 25 (FIG. 2) in the coating processing chamber 32 (FIG. 2) with the hand H2. Further, the transport mechanism 137 places the substrate W after the resist film formation held by the hand H <b> 1 on the spin chuck 25. In the coating processing chamber 32, a resist cover film is formed on the substrate W by the coating processing unit 129 (FIG. 2).

  Next, the transport mechanism 137 takes out the substrate W after the heat treatment from the predetermined heat treatment unit PHP of the upper heat treatment section 303 (FIG. 3) with the hand H1. Further, the transport mechanism 137 carries the substrate W after the resist cover film formation held by the hand H2 into the heat treatment unit PHP.

  Next, the transport mechanism 137 takes out the substrate W after the edge exposure processing from the edge exposure unit EEW (FIG. 3) with the hand H2. Further, the transport mechanism 137 carries the substrate W after the heat treatment held by the hand H1 into the edge exposure unit EEW.

  The transport mechanism 137 places the substrate W after edge exposure processing held by the hand H2 on the placement / buffer unit P-BF1 (FIG. 5), and adjoins the carry-in / out block 14A by the hand H2. The substrate W after the heat treatment is taken out from the heat treatment unit PHP of the heat treatment portion 301 (FIG. 4). The substrate W taken out from the heat treatment unit PHP adjacent to the carry-in / carry-out block 14A is the substrate W for which the exposure processing in the exposure apparatus 15 has been completed.

  Next, the transport mechanism 137 takes out the substrate W after the cooling process from the predetermined cooling unit CP (FIG. 3) of the upper thermal processing section 303 (FIG. 3) with the hand H <b> 1. Further, the transport mechanism 137 carries the substrate W after the exposure processing held by the hand H2 into the cooling unit CP. In the cooling unit CP, the substrate W is cooled to a temperature suitable for development processing.

  Next, the transport mechanism 137 takes out the substrate W after the development processing from the spin chuck 35 (FIG. 2) of the development processing chamber 31 (FIG. 2) with the hand H2. Further, the transport mechanism 137 places the cooled substrate W held by the hand H <b> 1 on the spin chuck 35. In the development processing chamber 31, a resist cover film removal process and a development process are performed by the development processing unit 139.

  Next, the transport mechanism 137 takes out the substrate W after the heat treatment from the predetermined heat treatment unit PHP of the upper heat treatment section 303 (FIG. 3) with the hand H1. Further, the transport mechanism 137 carries the substrate W after the development processing held by the hand H2 into the thermal processing unit PHP. Thereafter, the transport mechanism 137 places the substrate W taken out from the heat treatment unit PHP on the substrate platform PASS2 (FIG. 5).

  As the transport mechanism 137 repeats the above processing, predetermined processing is continuously performed on the plurality of substrates W in the second processing block 13.

  The transport mechanism 138 is operated in the same manner as the transport mechanism 137, so that the substrate platforms PASS3, PASS4, P-BF2 (FIG. 5), the development processing chamber 33 (FIG. 2), the coating processing chamber 34 (FIG. 2), and the lower heat treatment. The substrate W is carried into and out of the unit 304 (FIG. 3).

  As described above, in this embodiment, the substrate W transported by the transport mechanism 137 is processed in the development processing chamber 31, the coating processing chamber 32, and the upper thermal processing section 303, and the substrate W transported by the transport mechanism 138 is Processing is performed in the development processing chamber 33, the coating processing chamber 34, and the lower heat treatment section 304. In this case, the processing of the plurality of substrates W is performed by an upper processing unit (development processing chamber 31, coating processing chamber 32, and upper thermal processing unit 303) and a lower processing unit (developing processing chamber 33, coating processing chamber 34, and lower thermal processing unit 304). ) At the same time. Thereby, the throughput of the second processing block 13 can be improved without increasing the transport speed of the substrate W by the transport mechanisms 137 and 138. In addition, since the transport mechanisms 137 and 138 are provided above and below, an increase in the footprint of the substrate processing apparatus 100 can be prevented.

(1-5-4) Operations of the Cleaning / Drying Processing Block 14A and the Loading / Unloading Block 14B Hereinafter, the operations of the cleaning / drying processing block 14A and the loading / unloading block 14B will be described mainly with reference to FIGS.

  In the cleaning / drying processing block 14A, the transport mechanism 141 (FIG. 7) takes out the substrate W after edge exposure placed on the placement / buffer unit P-BF1 by the transport mechanism 137 (FIG. 5) with the hand H3.

  Next, the transport mechanism 141 takes out the substrate W after the cleaning and drying processing from the predetermined cleaning / drying processing unit SD1 of the cleaning / drying processing section 161 (FIG. 7) with the hand H4. Further, the transport mechanism 141 carries the edge-exposed substrate W held by the hand H3 into the cleaning / drying processing unit SD1.

  Next, the transport mechanism 141 places the substrate W after the cleaning and drying process held by the hand H4 on the placement / cooling unit P-CP (FIG. 5). In the placement / cooling section P-CP, the substrate W is cooled to a temperature suitable for the exposure processing in the exposure apparatus 15 (FIG. 1).

  Next, the transport mechanism 141 takes out the edge-exposed substrate W placed on the placement / buffer unit P-BF2 by the transport mechanism 138 (FIG. 5) using the hand H3. Next, the transport mechanism 141 takes out the substrate W after the cleaning and drying processing from the predetermined cleaning / drying processing unit SD1 of the cleaning / drying processing section 161 (FIG. 7) with the hand H4. Further, the transport mechanism 141 carries the edge-exposed substrate W held by the hand H3 into the cleaning / drying processing unit SD1. Next, the transport mechanism 141 places the substrate W after the cleaning and drying process held by the hand H4 on the placement / cooling unit P-CP (FIG. 5).

  As described above, the transport mechanism 141 alternately takes out the substrate W after the edge exposure from the placement / buffer units P-BF1 and P-BF2, and places the substrate W through the cleaning / drying processing unit 161. Transport to part P-CP.

  The transport mechanism 142 (FIG. 7) takes out the substrate W after the exposure processing placed on the substrate platform PASS5 (FIG. 5) with the hand H3. Next, the transport mechanism 142 takes out the substrate W after the cleaning and drying processing from the predetermined cleaning / drying processing unit SD2 of the cleaning / drying processing section 162 (FIG. 7) with the hand H4. Further, the transport mechanism 142 carries the substrate W after the exposure processing held in the hand H3 into the cleaning / drying processing unit SD2.

  Next, the transport mechanism 142 transports the cleaned and dried substrate W held in the hand H4 to the heat treatment unit PHP (FIG. 7) of the upper heat treatment unit 303. In this heat treatment unit PHP, a post-exposure bake (PEB) process is performed.

  Next, the transport mechanism 142 (FIG. 7) takes out the substrate W after the exposure processing placed on the substrate platform PASS5 (FIG. 5) with the hand H3. Next, the transport mechanism 142 takes out the substrate W after the cleaning and drying processing from the predetermined cleaning / drying processing unit SD2 of the cleaning / drying processing section 162 (FIG. 7) with the hand H4. Further, the transport mechanism 142 carries the substrate W after the exposure processing held in the hand H3 into the cleaning / drying processing unit SD2.

  Next, the transport mechanism 142 transports the substrate W after the cleaning and drying process held by the hand H4 to the heat treatment unit PHP (FIG. 7) of the lower heat treatment unit 304. In this heat treatment unit PHP, PEB treatment is performed.

  As described above, the transport mechanism 142 alternately transports the substrate W after the exposure processing placed on the substrate platform PASS5 to the upper thermal processing unit 303 and the lower thermal processing unit 304 via the cleaning / drying processing unit 162.

  In the carry-in / carry-out block 14B, the transport mechanism 146 (FIG. 5) takes out the substrate W placed on the placement / cooling unit P-CP with the hand H7 and transports it to the substrate carry-in unit 15a of the exposure apparatus 15. Further, the transport mechanism 146 takes out the substrate W after the exposure processing from the substrate carry-out portion 15b of the exposure apparatus 15 by the hand H8, and transports it to the substrate platform PASS5.

  If the exposure apparatus 15 cannot accept the substrate W, the substrate W after the cleaning and drying process is temporarily stored in the placement / buffer units P-BF1, P-BF2 by the transport mechanism 141 (FIG. 7). The

  Further, when the development processing unit 139 (FIG. 2) of the second processing block 13 cannot accept the substrate W after the exposure processing, the substrate W after the PEB processing is placed by the transport mechanisms 137 and 138 (FIG. 5). The buffer units P-BF1 and P-BF2 are temporarily accommodated.

  Further, when the substrate W is not normally transferred to the placement / buffer units P-BF1 and P-BF2 due to problems of the first and second processing blocks 12 and 13, the transfer mechanism until the transfer of the substrate W becomes normal. The conveyance of the substrate W from the placement / buffer units P-BF1 and P-BF2 by 141 may be temporarily stopped.

  In the present embodiment, the substrate W is alternately transferred to the sending buffer units SBF1 and SBF2 by the transfer mechanism IR1, and the substrate W is alternately taken out from the placement / buffer units P-BF1 and P-BF2 by the transfer mechanism 141. Thereby, the order of the substrates W transferred from the indexer block 11 to the first processing block 12 and the order of the substrates W transferred from the second processing block 13 to the interface block 14 can be matched. Therefore, the order of the substrates W taken out from the carrier 113 and the order of the substrates W carried into the exposure apparatus 15 can be matched.

  Further, the substrate W after the exposure processing is alternately transported to the upper thermal processing section 303 and the lower thermal processing section 304 by the transport mechanism 142, and the substrates W are alternately taken out from the return buffer sections RBF1 and RBF2 by the transport mechanism IR2. Thereby, the order of the substrates W transferred from the interface block 14 to the second processing block 13 and the order of the substrates W transferred from the first processing block 12 to the indexer block 11 can be matched. Therefore, the order of the substrates W carried out from the exposure apparatus 15 and the order of the substrates W accommodated in the carrier 113 can be matched.

  This facilitates management of the processing history of each substrate W in the substrate processing apparatus 100. In addition, it is possible to prevent variations in processing accuracy between the plurality of substrates W.

(1-6) Transport of Substrate in Indexer Block (1-6-1) Configuration of Carrier FIG. 8A is a perspective view of the carrier 113, and FIG. 8B is a front view of the carrier 113. As shown in FIGS. 8A and 8B, the carrier 113 has a box shape with an open front surface. A plurality of shelves 113a are provided inside the carrier 113 so as to protrude inward from both side surfaces. A substrate W is placed on each shelf 113a. In this example, the carrier 113 has 25 shelves 113a. An interval C2 between the vertically adjacent shelves 113a is set to a half of an interval C1 between the hands IH1 and IH2 of the transport mechanisms IR1 and IR2.

  In the following description, the lowermost shelf 113a to the uppermost shelf 113a of the carrier 113 are sequentially referred to as a first shelf 113a, a second shelf 113a,..., And a 25th shelf 113a.

(1-6-2) Configuration of Feed Buffer Unit and Return Buffer Unit FIGS. 9 and 10 are an external perspective view and a side view showing configurations of the feed buffer unit SBF1 and the return buffer unit RBF1, respectively. The sending buffer unit SBF2 and the return buffer unit RBF2 have the same configuration as the sending buffer unit SBF1 and the return buffer unit RBF1 of FIGS.

  As shown in FIGS. 8 and 9, there is a vertical direction (Z direction) between the transport section 112 (FIG. 5) of the indexer block 11 and the upper transport chamber 125 (FIG. 5) of the first processing block 12. A pair of extending frames 911, 912 are provided. A pair of fixing members 91 are attached to the pair of frames 911 and 912, respectively.

  Each fixing member 91 is provided with a plurality of convex portions 921 protruding in the horizontal direction (X direction) at regular intervals in the vertical direction. One end portions of the plurality of support plates 92 are respectively fixed to the upper and lower surfaces of the convex portion 921 of one fixing member 91, and the other end portions of the plurality of support plates 92 are fixed to the upper and lower surfaces of the convex portion 921 of the other fixing member 91 Are fixed respectively. Thereby, the plurality of support plates 92 are arranged at equal intervals in the vertical direction in a horizontal posture. An interval C3 (FIG. 10) between the support plates 92 adjacent in the vertical direction is set equal to an interval C1 (FIG. 6) between the hands IH1 and IH2 of the transport mechanisms IR1 and IR2. A plurality (three in this example) of support pins 93 are provided on the upper surface of each support plate 92. On each support plate 92, the substrate W is supported by a plurality of support pins 93.

  In the present embodiment, 26 support plates 92 are fixed to the fixing member 91. Out of the 26 support plates 92, the upper half 13 support plates 92 and the plurality of support pins 93 provided on the 13 support plates 92 constitute the feed buffer unit SBF1. Of the 26 support plates 92, the lower half 13 support plates 92 and the plurality of support pins 93 provided on the 13 support plates 92 constitute the return buffer portion RBF1.

  In the following description, in each of the sending buffer units SBF1 and SBF2 and the return buffer units RBF1 and RBF2, the first support plate 92, the second support plate 92, and the second support plate 92 are sequentially arranged from the lowermost support plate 92 to the uppermost support plate 92. Are called the support plate 92 of the 13th stage.

  11 and 12 are plan views for explaining placement and reception of the substrate W on the sending buffer unit SBF1 and the return buffer unit RBF1. The placement and reception of the substrate W on the sending buffer unit SBF2 and the return buffer unit RBF2 are performed in the same manner as the placement and reception of the substrate W on the sending buffer unit SBF1 and the return buffer unit RBF1.

  FIG. 11A shows the positions of the hands IH1 and IH2 of the transport mechanism IR1 when the substrate W is placed on the sending buffer unit SBF1. FIG. 11B shows the positions of the hands IH1 and IH2 of the transport mechanism IR2 when the substrate W is received from the return buffer unit RBF1. FIG. 12 shows the positions of the hands H1 and H2 of the transport mechanism 127 when the substrate W is received from the sending buffer unit SBF1 and when the substrate W is placed on the return buffer unit RBF1.

  As shown in FIGS. 11A and 11B, the hands IH1 and IH2 of the transport mechanisms IR1 and IR2 have a substantially U shape and are arranged so as to overlap the lower surface of the substrate W. Hold the outer periphery. As shown in FIG. 11 (a), the hands IH1 and IH2 of the transport mechanism IR1 enter the feed buffer unit SBF1 so as to be inclined with respect to the X direction without contacting the support pins 93 and the frames 911 and 912. Then, the substrate W can be placed on the support pins 93. Similarly, as shown in FIG. 11B, the return buffer unit is configured so that the hands IH1 and IH2 of the transport mechanism IR2 are inclined with respect to the X direction without contacting the support pins 93 and the frames 911 and 912. The substrate W can be received from the support pins 93 by entering the RBF 1.

  As shown in FIG. 12, the hands H <b> 1 and H <b> 2 of the transport mechanism 127 have a substantially U shape, are arranged so as to surround the outer periphery of the substrate W, and hold the outer periphery of the substrate W. The hands H1 and H2 of the transport mechanism 127 can enter the sending buffer unit SBF1 along the X direction without contacting the support pins 93 and the frames 911 and 912, and can receive the substrate W from the support pins 93. . Further, the hands H1 and H2 of the transport mechanism 127 enter the return buffer portion RBF1 along the X direction without contacting the support pins 93 and the frames 911 and 912, and place the substrate W on the support pins 93. can do.

(1-6-3) Transport of Substrate Transport of the substrate W by the transport mechanisms IR1 and IR2 will be described. As described above, the transport mechanism IR1 transports the substrate W alternately from the carrier 113 to the sending buffer units SBF1 and SBF2, and the transport mechanism IR2 transports the substrate W alternately from the return buffer units RBF1 and RBF2 to the carrier 113. .

  13 and 14 are schematic side views for explaining the transport of the substrate W from the carrier 113 to the sending buffer unit SBF1 by the transport mechanism IR1. In the example of FIGS. 13 and 14, as an initial state, the substrate W is accommodated in all the shelves 113a of the carrier 113, and the substrate W is not placed in the sending buffer unit SBF1.

  First, as shown in FIG. 13A, the hands IH1 and IH2 of the transport mechanism IR1 move to a position in front of the carrier 113. As described above, the interval C2 between the shelves 113a of the carrier 113 is a half of the interval C1 between the hands IH1 and IH2 of the transport mechanism IR1.

  As shown in FIG. 13B, the hands IH1 and IH2 of the transport mechanism IR1 enter the carrier 113 at the same time. In this case, the hand IH1 enters just below the substrate W placed on the third shelf 113a, and the hand IH2 enters just below the substrate W placed on the first shelf 113a.

  Subsequently, as shown in FIG. 13C, the hands IH1 and IH2 of the transport mechanism IR1 are integrally raised to receive the substrate W from the first shelf 113a and the third shelf 113a, and from the carrier 113. Exit.

  Next, as shown in FIG. 14A, the hands IH1 and IH2 of the transport mechanism IR1 move to a position obliquely forward of the feed buffer unit SBF1. As described above, the interval C3 between the plurality of support plates 92 is equal to the interval C1 between the hands IH1 and IH2.

  As shown in FIG. 14B, the hands IH1 and IH2 of the transport mechanism IR1 enter the sending buffer unit SBF1 at the same time. In this case, the hand IH1 enters just above the second stage support plate 92, and the hand IH2 enters just above the first stage support plate 92.

  Subsequently, as shown in FIG. 14 (c), the hands IH1 and IH2 of the transport mechanism IR1 are integrally lowered so that the support pins 93 on the first stage support plate 92 and the second stage support plate 92 are moved. The substrate W is placed on the support pins 93 and then withdraws from the sending buffer unit SBF1.

  Next, the hands IH1 and IH2 of the transport mechanism IR1 move to a position in front of the carrier 113, and from the second shelf 113a and the fourth shelf 113a of the carrier 113, as in the example of FIG. Two substrates W are received simultaneously. Subsequently, the hands IH1 and IH2 of the transport mechanism IR1 move to a position obliquely forward of the feed buffer unit SBF2, and support pins 93 on the first stage support plate 92 and the second stage support plate of the feed buffer unit SBF2. Similarly to the example of FIG. 14, two substrates W are simultaneously placed on the support pins 93 on 92. Thereafter, similarly, the transport mechanism IR1 transports two substrates W alternately from the carrier 113 to the sending buffer units SBF1 and SBF2. The substrates W transferred to the sending buffer unit SBF1 are sequentially received by the transfer mechanism 127, and the substrates W transferred to the sending buffer unit SBF2 are sequentially received by the transfer mechanism 128.

  In this example, after the substrate W is taken out from the first to 24th shelves 113a of the carrier 113, the substrate W remains only on the 25th shelf 113a. In this case, the transport mechanism IR1 takes out the substrate W from the 25th shelf 113a of the carrier 113 using only one of the hands IH1 and IH2, and transports the substrate W to the feed buffer unit SBF1 or the feed buffer unit SBF2.

  FIGS. 15 and 16 are schematic side views for explaining transport of the substrate W from the return buffer unit RBF1 to the carrier 113 by the transport mechanism IR2. In the example of FIGS. 15 and 16, as an initial state, the substrate W is placed on the first and second stage support plates 92 of the return buffer units RBF1 and RBF2, and the substrate W is placed on the carrier 113. Not.

  First, as shown in FIG. 15A, the hands IH1 and IH2 of the transport mechanism IR2 move to a position obliquely forward of the return buffer unit RBF1. As described above, the interval C2 between the shelves 113a of the return buffer unit RBF1 is equal to the interval C1 between the hands IH1 and IH2 of the transport mechanism IR2.

  As shown in FIG. 15B, the hands IH1 and IH2 of the transport mechanism IR2 enter the return buffer unit RBF1 at the same time. In this case, the hand IH1 enters between the second-stage support plate 92 and the substrate W supported by the support pins 93 on the support plate 92, and the hand IH2 enters the first-stage support plate 92 and its support plate. It enters between the substrate W supported by the support pins 93 on 92.

  Subsequently, as shown in FIG. 15 (c), the hands IH1 and IH2 of the transport mechanism IR2 are integrally raised so that the support pins 93 on the first stage support plate 92 and the second stage support plate 92 are moved. The substrate W is received from the support pins 93 and exits from the return buffer unit RBF1.

  Next, as shown in FIG. 16A, the hands IH1 and IH2 of the transport mechanism IR2 move to positions ahead of the carrier 113, and as shown in FIG. 16B, the hands IH1 and IH2 of the transport mechanism IR2 Enters the carrier 113 simultaneously. In this case, the hand IH1 enters the position at the height of the third shelf 113a, and the hand IH2 enters the position at the height of the first shelf 113a.

  Subsequently, as shown in FIG. 16C, the hands IH1 and IH2 of the transport mechanism IR2 are integrally lowered to place the substrate W on the first shelf 113a and the third shelf 113a, and the carrier Exit from 113.

  Next, the hands IH1 and IH2 of the transport mechanism IR2 move to a position obliquely forward of the return buffer unit RBF2, and from the first stage support plate 92 and the second stage support plate 92 of the return buffer unit RBF2, Similarly to the example of FIG. 15, two substrates W are received simultaneously. Subsequently, the hands IH1 and IH2 of the transport mechanism IR2 move to a position in front of the carrier 113, and, on the second shelf 113a and the fourth shelf 113a of the carrier 113, as in the example of FIG. Two substrates W are placed simultaneously. Thereafter, similarly, the transport mechanism IR2 transports the substrates W alternately by two from the return buffer units RBF1 and RBF2 to the carrier 113. Substrate W after development processing is sequentially placed on return buffer portion RBF1 by transport mechanism 127, and substrate W after development processing is sequentially placed on return buffer portion RBF2 by transport mechanism 128.

  In this example, after the substrate W is placed on the first to 24th shelves 113a of the carrier 113, the substrate W is not placed only on the 25th shelf 113a. In this case, the transport mechanism IR1 takes out one substrate W from the sending buffer unit SBF1 or the sending buffer unit SBF2 using only one of the hands IH1 and IH2, and puts the substrate W on the 25th shelf 113a of the carrier 113. Place.

  As described above, in the present embodiment, the substrate W is transported from the carrier 113 to the sending buffer units SBF1 and SBF2 by the transport mechanism IR1, and the substrate W is transported from the return buffer units RBF1 and RBF2 to the carrier 113 by the transport mechanism IR2. Two sheets are conveyed. In this case, the transport mechanism IR1 can transport two substrates W from the carrier 113 to the feed buffer unit SBF1 or the feed buffer unit SBF2, for example, every 6 seconds. Further, the transport mechanism IR2 can transport the two substrates W from the return buffer unit RBF1 or the return buffer unit RBF2 to the carrier 113, for example, every 6 seconds.

(1-7) Effect In this embodiment, the substrate W is transported in parallel by the two transport mechanisms IR1 and IR2 in the indexer block 11. Thereby, the transport efficiency of the substrate W in the indexer block 11 is increased. As a result, the throughput of the substrate processing apparatus 100 is improved.

  Further, the transport mechanisms IR1 and IR2 transport two substrates W simultaneously by the hands IH1 and IH2, respectively. Thereby, the transport mechanisms IR1 and IR2 can transport the substrate W more efficiently.

  Further, the transport mechanism IR1 transports the unprocessed substrate W from the carrier 113 to the sending buffer units SBF1 and SBF2, and the transport mechanism IR2 transports the processed substrate W from the return buffer units RBF1 and RBF2 to the carrier 113. Thereby, the operations of the transport mechanisms IR1 and IR2 are simplified. Therefore, the transport mechanisms IR1 and IR2 can transport the substrate W more efficiently.

  Further, the carrier 113 in which the unprocessed substrate W is accommodated is placed on the carrier placement unit 111a, and the carrier 113 in which the processed substrate W is accommodated is placed on the carrier placement unit 111b. Accordingly, the transport mechanisms IR1 and IR2 can transport the substrate W smoothly.

  Further, each of the sending buffer units SBF1 and SBF2 and the return buffer units RBF1 and RBF2 is configured to be capable of mounting a plurality of substrates W. Thus, the transport mechanism IR1 can continue to transport new substrates W to the feed buffer units SBF1 and SBF2 even if the previously transported substrate W is placed on the feed buffer units SBF1 and SBF2. Further, the transport mechanism IR2 can simultaneously take out two substrates W from the return buffer units RBF1, RBF2. Further, the transport mechanisms 127 and 128 can continue to transport new substrates W to the return buffer units RBF1 and RBF2 even if the previously transported substrate W is placed on the return buffer units RBF1 and RBF2. . Accordingly, the transport mechanisms IR1, IR2, 127, and 128 can transport the substrate W more efficiently.

(1-8) Other Operation Examples In the above embodiment, the transport mechanism IR1 transports the substrate W from the carrier 113 to the sending buffer units SBF1 and SBF2, and the transport mechanism IR2 transports the substrate from the return buffer units RBF1 and RBF2 to the carrier 113. Although W is transported, the operations of the transport devices IR1 and IR2 are not limited thereto. Each of the transfer devices IR1 and IR2 may perform the transfer of the substrate W from the carrier 113 to the sending buffer units SBF1 and SBF2 and the transfer of the substrate W from the return buffer units RBF1 and RBF2 to the carrier 113 in parallel.

  For example, the transport mechanism IR1 takes out the unprocessed substrate W from the carrier 113 by the hand IH1, and transports the substrate W to the sending buffer unit SBF1. Subsequently, the transport mechanism IR1 takes out the processed substrate W from the return buffer unit RBF1 by the hand IH2, and transports the substrate W to the carrier 113. Next, the transport mechanism IR1 takes out the unprocessed substrate W from the carrier 113 by the hand IH1, and transports the substrate W to the sending buffer unit SBF2. Subsequently, the transport mechanism IR1 takes out the processed substrate W from the return buffer unit RBF2 by the hand IH2, and transports the substrate W to the carrier 113. The transport mechanism IR1 repeats the above operation. The transport mechanism IR2 repeats the same operation.

  Also in this case, since the substrate W is transported in parallel by the two transport mechanisms IR1 and IR2, the transport efficiency of the substrate W in the indexer block 11 is increased. As a result, the throughput of the substrate processing apparatus 100 is improved.

(2) Second Embodiment FIGS. 17 and 18 are schematic side views showing a configuration of a substrate processing apparatus 100 according to a second embodiment of the present invention. FIG. 17 shows a partial configuration of the substrate processing apparatus 100 as viewed from the −Y side, and FIG. 18 shows the carrier mounting portions 111a and 111b and their peripheral portions. 17 and 18 will be described with respect to differences from the substrate processing apparatus 100 according to the first embodiment.

  In the substrate processing apparatus 100 of FIGS. 17 and 18, a stocker apparatus 400 is provided adjacent to the indexer block 11. The stocker device 400 includes a receiving shelf 401 (FIG. 18), a delivery shelf 402, a plurality (four in this example) of storage shelves 403, and a transport device 410 (FIG. 17). As shown in FIG. 18, a plurality of storage shelves 403 are arranged along the Y direction above the carrier placement portions 111a and 111b. A receiving shelf 401 is arranged above the storage shelf 403 located at one end, and a delivery shelf 402 is arranged above the storage shelf 403 located at the other end.

  As illustrated in FIG. 17, the transport device 410 includes a gripping unit 411, an arm mechanism 412, and a moving mechanism 413. The gripping portion 411 and the arm mechanism 412 are integrally moved in the Z direction and the Y direction by the moving mechanism 413. The transport device 410 grips the carrier 113 with the gripping portion 411 and transports the carrier 113 between the receiving shelf 401, the delivery shelf 402, the plurality of storage shelves 403, and the carrier mounting portions 111a and 111b. In this example, a gripped portion 113 b that can be gripped by the grip portion 411 is provided on the top of the carrier 113.

  The conveyance of the carrier 113 by the conveyance device 410 will be described. First, the carrier 113 containing the unprocessed substrate W is transported to the receiving shelf 401 by an external transport device (not shown). The carrier 113 is conveyed from the receiving shelf 401 to the carrier placement unit 111a. When the other carrier 113 transported first is placed on the carrier placement unit 111a, the carrier 113 is temporarily placed on any storage shelf 403. Unprocessed substrates W are sequentially taken out from the carrier 113 placed on the carrier placement unit 111a by the transport mechanism IR1.

  When the carrier 113 placed on the carrier placement unit 111a becomes empty, the carrier 113 is transported to the carrier placement unit 111b. When the other carrier 113 transported first is placed on the carrier placement unit 111b, the empty carrier 113 is temporarily placed on any storage shelf 403. In the carrier 113 placed on the carrier placing portion 111b, the substrates W after processing are sequentially accommodated by the transport mechanism IR2.

  When a predetermined number of substrates W are accommodated in the carrier 113 on the carrier platform 111b, the carrier 113 is transferred to the delivery shelf 402. When the other carrier 113 transported first is placed on the delivery shelf 402, the carrier 113 is temporarily placed on any storage shelf 403. The carrier 113 placed on the delivery shelf 402 is transported to the outside by an external transport device.

  As described above, in the stocker device 400, the plurality of carriers 113 are sequentially conveyed between the receiving shelf 401, the carrier mounting portions 111a and 111b, and the delivery shelf 402. Further, when another carrier 113 is placed at a place to be transported next, the carrier 113 is temporarily placed on the storage shelf 403. Thereby, the carrier 113 in which the unprocessed substrate W is accommodated can be transported to the carrier placement unit 111a without any delay, and the carrier 113 in which the processed substrate W is accommodated from the carrier placement unit 111b without any delay. Can be transported. Therefore, the transport mechanisms IR1 and IR2 can transport the substrate W more smoothly between the carrier 113 and the first processing block 12. As a result, the throughput of the substrate processing apparatus 100 is improved.

(3) Third Embodiment FIG. 19 is a schematic plan view showing the configuration of a substrate processing apparatus 100 according to a third embodiment of the present invention. A difference between the substrate processing apparatus 100 of FIG. 19 and the substrate processing apparatus 100 according to the above embodiment will be described.

  In the substrate processing apparatus 100 of FIG. 19, the indexer block 11 is provided with two carrier mounting portions 111 a and two carrier mounting portions 111 b. Guide shafts GS1 and GS2 are provided in the transport section 112 of the indexer block 11 so as to extend in the X direction. The transport mechanism IR1 is attached to the guide shaft GS1, and the transport mechanism IR2 is attached to the guide shaft GS2. The transport mechanism IR1 is configured to be movable in the X direction along the guide shaft GS1, and the transport mechanism IR2 is configured to be movable in the X direction along the guide shaft GS2.

  In this example, the transport mechanism IR1 moves in the X direction and sequentially transports the unprocessed substrates W from the two carriers 113 placed on the two carrier platforms 111a to the sending buffer units SBF1 and SBF2. Further, the processed substrate W is sequentially transferred from the return buffer units RBF1 and RBF2 to the two carriers 113 placed on the two carrier platforms 111b while the transport mechanism IR2 moves in the X direction. Thereby, the conveyance efficiency of the substrate W in the indexer block 11 is further enhanced.

  In this example, the transport mechanisms IR1 and IR2 themselves move in the X direction to take out the substrate W from the two carriers 113 and store the substrate W in the two carriers 113. However, the present invention is not limited to this, and the transport mechanism IR1. , IR2 itself does not move, and the transport mechanism IR1 can be used so that the substrates W can be taken out from and stored in the two carriers 113 by moving the hands IH1, IH2. , IR2 may be configured.

(4) Fourth Embodiment FIGS. 20 and 21 are a schematic plan view and a schematic side view showing a configuration of a substrate processing apparatus 100 according to a fourth embodiment of the present invention. FIG. 21 shows a partial configuration of the substrate processing apparatus 100 as viewed from the −Y side.

  In the substrate processing apparatus 100 of FIG. 20 and FIG. 21, the transfer unit 112 of the indexer block 11 has an upper transfer chamber 112a and a lower transfer chamber 112b. A transport mechanism IR1 is provided in the upper transport chamber 112a, and a transport mechanism IR2 is provided in the lower transport chamber 112b (FIG. 21). The transport mechanisms IR1 and IR2 are configured to be movable in the X direction along the guide shafts GS1 and GS2, respectively. Further, carrier mounting tables 111a and 111b are provided on one side surface of the upper transfer chamber 112a, and carrier mounting tables 111a and 111b are provided on one side surface of the lower transfer chamber 112b.

  In this example, while the transport mechanism IR1 moves in the X direction in the upper transport chamber 112a, the unprocessed substrate W is sequentially transported from the carrier 113 on the carrier platform 111a to the sending buffer unit SBF1, and the return buffer unit RBF1. The processed substrate W is sequentially transferred to the carrier 113 on the carrier mounting portion 111b. Further, in the lower transfer chamber 112b, the transfer mechanism IR2 moves in the X direction while the unprocessed substrate W is sequentially transferred from the carrier 113 on the carrier platform 111a to the send buffer unit SBF2, and processed from the return buffer unit RBF2. Subsequent substrates W are sequentially transported to the carrier 113 on the carrier platform 111b.

  Also in this case, since the substrate W is transported in parallel by the two transport mechanisms IR1 and IR2, the transport efficiency of the substrate W in the indexer block 11 is increased. As a result, the throughput of the substrate processing apparatus 100 is improved. Further, since the transport mechanisms IR1 and IR2 are arranged above and below, the installation area of the transport mechanisms IR1 and IR2 can be reduced. Thereby, it is possible to prevent the footprint of the substrate processing apparatus 100 from increasing.

(5) Other embodiments (5-1)
In the above embodiment, the transport mechanisms IR1 and IR2 have two hands IH1 and IH2, respectively. However, the present invention is not limited to this, and each of the transport mechanisms IR1 and IR2 may have only one hand, or the transport mechanism IR1. , IR2 may each have more than two hands.

(5-2)
In the above embodiment, the hands IH1 and IH2 of the transport mechanisms IR1 and IR2 are each configured to be able to hold one substrate W, but the hands IH1 and IH2 are each configured to be capable of holding a plurality of substrates W. Also good.

  FIG. 22 is a side view and a plan view showing another example of the hands IH1 and IH2. Hands IH 1 and IH 2 in FIG. 22 include a plurality of hand elements 260 and a hand support 270. The plurality of hand elements 260 are fixed to the hand support portion 270 so as to be arranged at equal intervals in the vertical direction. The interval between the hand elements 260 adjacent in the vertical direction is set to be equal to the interval C1 in the vertical direction of the hands IH1 and IH2 shown in FIG. 6, for example. Each hand element 260 has two claw portions 261 extending substantially in parallel (FIG. 22B). The outer peripheral portion of the substrate W is held by the two claw portions 261.

  By using the hands IH1 and IH2 of FIG. 22, the transport mechanisms IR1 and IR2 can transport more substrates W at the same time. Thereby, the transport efficiency of the substrate W in the indexer block 11 is further increased, and the throughput of the substrate processing apparatus 100 is further improved.

(5-3)
In the above embodiment, the indexer block 11 is provided with the two transport mechanisms IR1 and IR2. However, the indexer block 11 may be provided with three or more transport mechanisms.

(5-4)
In the above embodiment, the exposure apparatus 15 that performs the exposure process of the substrate W by the immersion method is provided as an external apparatus of the substrate processing apparatus 100. However, the present invention is not limited to this, and the exposure process of the substrate W is performed without using a liquid. An exposure apparatus to be performed may be provided as an external apparatus of the substrate processing apparatus 100. In that case, the same effect as the above embodiment can be obtained.

  In this case, the cleaning / drying processing units SD1 and SD2 may not be provided. Further, the resist cover film may not be formed on the substrate W in the coating processing unit 129 of the coating processing chambers 32 and 34.

(5-5)
The above embodiment is an example in which the present invention is applied to a substrate processing apparatus (so-called coater / developer) that performs a resist film coating formation process and a development process on the substrate W. Not limited to this. For example, the present invention may be applied to a substrate processing apparatus that performs a single process such as a cleaning process on the substrate W. In that case, the same effect as the above embodiment can be obtained.

(6) Correspondence between each constituent element of claim and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the carrier 113 is an example of a storage container, the indexer block 11 is an example of an indexer block, the first and second processing blocks 12 and 13 are examples of processing blocks, and the carrier mounting The parts 111a and 111b are examples of the container placement unit, the transport mechanism IR1 is an example of the first transport mechanism, the transport mechanism IR2 is an example of the second transport mechanism, and the hand IH1 is the first and third. The hand IH2 is an example of the second and fourth holding units.

  Further, the carrier placement unit 111a is an example of the first placement unit, the carrier placement unit 111b is an example of the second placement unit, and the transport mechanisms 127 and 128 are examples of the third transport mechanism. Yes, the send buffer units SBF1 and SBF2 are examples of the first substrate mounting unit, the return buffer units RBF1 and RBF2 are examples of the second substrate mounting unit, and the upper transfer chamber 112a is the first transfer chamber. The lower transfer chamber 112b is an example of the second transfer chamber.

  As each constituent element in the claims, various other elements having configurations or functions described in the claims can be used.

  The present invention can be used for processing various substrates.

11 Indexer block 12 First processing block
13 Second processing block 14 Interface block 14A Cleaning / drying processing block 14B Loading / unloading block 15 Exposure apparatus 100 Substrate processing apparatus 111a, 111b Carrier placement section 113 Carrier 114 Control section 129 Coating processing unit 139 Development processing units IH1, IH2, H1 , H2, H3, H4 Hands IR1, IR2, 127, 128, 137, 138, 141, 142, 146 Transport mechanism P-BF1, P-BF2 Placement and buffer unit RBF1, RBF2 Return buffer unit SD1, SD2 Cleaning and drying process Unit SBF1, SBF2 Feed buffer W substrate

Claims (6)

A substrate processing apparatus that is arranged adjacent to an exposure apparatus and configured to perform processing before and after the exposure process by the exposure apparatus,
An indexer block into which a storage container capable of storing a plurality of substrates is carried in and out;
A processing block for performing predetermined processing on the substrate;
A delivery unit for delivering a substrate between the exposure apparatus and the processing block;
The indexer block is
A container placement section on which the container is placed;
Including first and second transport mechanisms for transporting a substrate in parallel with each other between the storage container placed on the container placement unit and the processing block;
The processing block includes a third transport mechanism for transporting the substrate,
A first substrate mounting portion capable of temporarily mounting a plurality of substrates between the first transport mechanism and the third transport mechanism;
A second substrate placement unit capable of temporarily placing a plurality of substrates between the second transport mechanism and the third transport mechanism;
The processing block includes an upper processing unit and a lower processing unit provided above and below,
The third transport mechanism includes an upper transport mechanism provided in the upper processing section and a lower transport mechanism provided in the lower processing section,
The delivery unit includes a fourth transport mechanism for transporting the substrate,
The order of the substrates transferred from the indexer block to the processing block matches the order of the substrates transferred from the processing block to the transfer unit, and the order of the substrates transferred from the transfer unit to the processing block; A substrate processing apparatus, wherein the first, second, third and fourth transport mechanisms transport substrates so that the order of the substrates transported from the processing block to the indexer block matches. The container placement unit includes first and second placement units,
A storage container storing the unprocessed substrate is placed on the first placement unit,
A storage container for storing the processed substrate is placed on the second placement portion,
The first transport mechanism is configured to transport a substrate from the storage container placed on the first placement unit to the processing block,
The substrate processing apparatus according to claim 1, wherein the second transport mechanism is configured to transport a substrate from the processing block to the storage container placed on the second placement unit. The first substrate platform is
A first upper stage mounting portion provided between the first transport mechanism and the upper transport mechanism;
Including a first lower stage mounting portion provided between the first transport mechanism and the lower transport mechanism,
The second substrate platform is
A second upper stage mounting portion provided between the second transport mechanism and the upper transport mechanism;
Including a second lower stage mounting portion provided between the second transport mechanism and the lower transport mechanism,
A third upper stage mounting portion is provided between the upper transport mechanism and the fourth transport mechanism;
A third lower stage mounting portion is provided between the lower transport mechanism and the fourth transport mechanism;
One or both of the first and second transport mechanisms are configured to alternately transport the unprocessed substrate to the first upper stage placement unit and the first lower stage placement unit,
The fourth transport mechanism alternately receives substrates from the third upper stage placement unit and the third lower stage placement unit, and places the substrates on the third upper stage processing unit and the third lower stage processing unit. Configured to carry alternately,
The other or both of the first and second transport mechanisms are configured to alternately receive the processed substrate from the second upper stage placement unit and the second lower stage placement unit. 3. The substrate processing apparatus according to 1 or 2.   The first transport mechanism is configured to alternately transport the unprocessed substrate to the first upper stage placement unit and the first lower stage placement unit,
  The substrate processing apparatus according to claim 3, wherein the second transport mechanism is configured to alternately receive the processed substrate from the second upper stage placement unit and the second lower stage placement unit. The first and second substrate platforms are provided so as to overlap each other,
The first transport mechanism is configured to transport a substrate to the first substrate platform at a first position,
The second transport mechanism, according to claim 1-4, characterized in that in a second position different from the first position is configured to perform receiving a substrate from said second substrate platform The substrate processing apparatus as described in any one of these. The indexer block includes first and second transfer chambers arranged above and below,
The first transfer mechanism is provided in the first transfer chamber,
The substrate processing apparatus according to claim 1, wherein the second transfer mechanism is provided in the second transfer chamber.

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