JP5921640B2 - LED light source assembly with heat sink and thermally conductive glass cover - Google Patents

LED light source assembly with heat sink and thermally conductive glass cover Download PDF

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JP5921640B2
JP5921640B2 JP2014222455A JP2014222455A JP5921640B2 JP 5921640 B2 JP5921640 B2 JP 5921640B2 JP 2014222455 A JP2014222455 A JP 2014222455A JP 2014222455 A JP2014222455 A JP 2014222455A JP 5921640 B2 JP5921640 B2 JP 5921640B2
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light source
heat sink
led light
conductive glass
thermally conductive
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JP2015062188A (en
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クラウス ボールマン
クラウス ボールマン
トム ペニック
トム ペニック
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リングデール インコーポレーテッド
リングデール インコーポレーテッド
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

本出願は、２００８年１１月１８日に出願された米国仮特許出願第６１／１１５７９０号に関するものであり、その仮特許出願の優先権日を主張する。さらに、本出願は、２００８年１２月１４日に出願された米国仮特許出願第６１／１２２３７９号に関する。   This application is related to US Provisional Patent Application No. 61/115790 filed on Nov. 18, 2008 and claims the priority date of the provisional patent application. Furthermore, this application is related to US Provisional Patent Application No. 61/122379 filed on Dec. 14, 2008.

本出願は、ＬＥＤ照明に関し、より詳細には、ＬＥＤ照明用の反射体とヒートシンクのアセンブリに関する。   The present application relates to LED lighting and, more particularly, to a reflector and heat sink assembly for LED lighting.

ＬＥＤ照明は、蛍光灯照明と同様に効率的になってきており、また、価格競争力もある。しかしながら、技術に対して固有で、変更することができないＬＥＤ装置構成については技術的課題がある。   LED lighting is becoming as efficient as fluorescent lighting and is also price competitive. However, there are technical challenges for LED device configurations that are unique to the technology and cannot be changed.

従来技術として、丸い特徴（round nature）のＬＥＤ本体に散光用レンズを組み込んだＬＥＤをあげることができる。他にも、平坦な表面を備えた細長部にＬＥＤを有するものもある。本発明は両方の技術に適用可能である。   As a prior art, there can be mentioned an LED in which a diffuser lens is incorporated in an LED body having a round nature. Others have LEDs in the elongated section with a flat surface. The present invention is applicable to both techniques.

既知のＬＥＤ装置の製造業者らは全て、持続的で効率的なＬＥＤ照明を製造する場合、何らかの形態の強力な冷却を使用する必要がある。特にこれは、赤道から±３０度前後の緯度の暑い国で使用する場合に当てはまる。   All known LED device manufacturers need to use some form of strong cooling when producing sustained and efficient LED lighting. This is especially true when used in hot countries with latitudes around ± 30 degrees from the equator.

本発明によると、熱放散を大幅に改善し、熱接合性能を向上することができる。   According to the present invention, heat dissipation can be greatly improved, and thermal bonding performance can be improved.

用語「ＬＥＤ」とは、１以上の発光ダイオードを含む光源部品、かかる光源部品を１以上含む照明モジュール、及び、かかる照明モジュールを複数含む照明システムを意味する。   The term “LED” means a light source component including one or more light emitting diodes, an illumination module including one or more such light source components, and an illumination system including a plurality of such illumination modules.

用語「ＬＥＤ光源」とは、１以上の発光ダイオード、及び、発光ダイオードと散光器の組み合わせを意味する。   The term “LED light source” means one or more light emitting diodes and a combination of light emitting diodes and diffusers.

用語「ＬＥＤアセンブリ」とは、ヒートシンクと伝導性ガラス製カバー部品と組み合わせた、１以上のＬＥＤ光源部品を意味する。   The term “LED assembly” refers to one or more LED light source components combined with a heat sink and a conductive glass cover component.

用語「頂部」と「底部」とは、ヒートシンクをＬＥＤ光源の下方とした時の上向きの方向性に対するものである。具体的には、アセンブリは、光が上方向に発せられるその上向きの方向性で使用してもよく、又は、天井照明固定具などの光が下方向に発せられる下向きの方向性で使用してもよく、又は、広告用掲示板照明などの水平を基準として角度を付けてアセンブリを設けた用途で使用してもよい。   The terms “top” and “bottom” are for upward orientation when the heat sink is below the LED light source. Specifically, the assembly may be used in its upward direction where light is emitted upwards, or used in a downward direction where light is emitted downwards, such as ceiling lighting fixtures. Alternatively, it may be used in an application in which an assembly is provided at an angle with respect to the horizontal, such as advertising billboard lighting.

本発明の一実施形態では、熱伝導性ガラスをＬＥＤのためのカバープレートとして使用し、反射体ヒートシンクに機械的に固定して、ＬＥＤ冷却性能を向上し、発光面を増加させる。増加した発光面は、グレアを低減する。一例では、スプリングワイヤの１以上の部分を反射体の孔に挿入して、ＬＥＤに対して熱伝導性ガラスを保持するための圧縮力を提供する。   In one embodiment of the present invention, thermally conductive glass is used as a cover plate for an LED and mechanically secured to a reflector heat sink to improve LED cooling performance and increase the light emitting surface. The increased light emitting surface reduces glare. In one example, one or more portions of the spring wire are inserted into the holes in the reflector to provide a compressive force to hold the thermally conductive glass against the LED.

熱伝導性のガラス部品を使用することによって、いくつかの効果を達成することができる。その一例を以下に列挙する。
ａ）ガラスによって冷却ヒートシンクに対して個別のＬＥＤ又はＬＥＤのグループを押圧することができるので、最適な接合接触が可能となる。
ｂ）耐食性材料を付加することができる。
ｃ）接合抵抗を改善する材料を添加することができる（アルミニウム化学溶接（aluminum chemical weld））。
ｄ）いくらかのヒートシンク機能がガラスによって追加される。
ｅ）同時に、用途の要件に応じて、ガラスを使用してＬＥＤが生成した光を分散することができる。 Several effects can be achieved by using thermally conductive glass parts. Some examples are listed below.
a) The individual LEDs or groups of LEDs can be pressed against the cooling heat sink by the glass, so that optimum bonding contact is possible.
b) A corrosion resistant material can be added.
c) Materials that improve the joint resistance can be added (aluminum chemical weld).
d) Some heat sink function is added by the glass.
e) At the same time, depending on the requirements of the application, the light produced by the LED can be dispersed using glass.

用途に応じて、必要とされるレンズ又は散光器の形状が異なることがある。   Depending on the application, the required lens or diffuser shape may vary.

図１Ａは、代表的な実施形態のヒートシンク反射体と、ＬＥＤ光源と、二つのステンレス製スプリングワイヤによって所定の位置に保持された熱伝導性ガラス製カバープレートの上面斜視図である。FIG. 1A is a top perspective view of a heat conductive glass cover plate held in place by a heat sink reflector, LED light source, and two stainless spring wires of a representative embodiment. 図１Ｂは、図１Ａの実施形態の側面斜視図である。FIG. 1B is a side perspective view of the embodiment of FIG. 1A. 図２Ａは、他の代表的な実施形態のヒートシンク反射体と、ＬＥＤ光源と、複数のステンレス製スプリングワイヤによって所定の位置に保持された熱伝導性ガラス製カバープレートの上面斜視図である。FIG. 2A is a top perspective view of a heat conductive glass cover plate held in place by a heat sink reflector of another representative embodiment, an LED light source, and a plurality of stainless spring wires. 図２Ｂは、図２Ａの実施形態の上面図である。FIG. 2B is a top view of the embodiment of FIG. 2A. 図３は、ダイオードと散光器を有するＬＥＤ光源と、熱伝導性ガラス製カバープレートと、散光レンズとを有する固定具の概略断面図である。本発明の代表的な実施形態を説明する図面は、以下の参照符号を含む。FIG. 3 is a schematic cross-sectional view of a fixture having an LED light source having a diode and a diffuser, a thermally conductive glass cover plate, and a diffuser lens. The drawings describing exemplary embodiments of the invention include the following reference characters.

ＬＥＤ光源を備えたヒートシンク反射体と、熱伝導性ガラス製カバープレート
図１Ａ及び図１Ｂは、代表的な実施形態のヒートシンク反射体１３０と、ＬＥＤ光源１２０と、二つステンレス製スプリングワイヤ１５２を含む押下部材１５０によって所定の位置に保持されている熱伝導性ガラス製カバープレート１４０と、の上面斜視図と側面斜視図である。この例では、反射体であるヒートシンクは、第１と第２の上向きの側部１３２、１３４を含む。スプリングワイヤ部は、反射体ヒートシンクの側部の孔１３３、１３５に挿入される。ヒートシンクは、様々な厚さのＬＥＤ光源又はカバープレートを許容できるように様々な孔を有してもよい。 Heat sink reflector with LED light source and heat conductive glass cover plate
FIGS. 1A and 1B show a heat conductive reflector 130 of a representative embodiment, an LED light source 120, and a thermally conductive glass that is held in place by a pressing member 150 including two stainless spring wires 152. It is the upper surface perspective view and side perspective view of a cover plate 140. In this example, the heat sink, which is a reflector, includes first and second upward sides 132,134. The spring wire portion is inserted into the holes 133 and 135 on the side of the reflector heat sink. The heat sink may have various holes to allow different thickness LED light sources or cover plates.

この例では、ＬＥＤ光源は、単一のフラットファイン散光レンズ１２５によって覆われる１以上のダイオードを含む。熱伝導製ガラス製カバープレート１４０は、散光レンズの表面積より２〜５倍広い表面積を有する。   In this example, the LED light source includes one or more diodes covered by a single flat fine diffuser lens 125. The thermally conductive glass cover plate 140 has a surface area that is 2-5 times wider than the surface area of the diffuser lens.

平坦な熱伝導性ガラス部材１４０は、頂部表面と底部表面を有し、略１／１６〜３／１６インチ（１．６〜４．８ｍｍ）の範囲の厚さを有するIndustrex（商標名）ガラスでもよい。熱伝導性ガラス部材の頂部表面は、ＬＥＤ光源の散光器よりも略２〜１０．５倍広い面積を有する。略１／８インチ（３．２ｍｍ）の厚さで、ＬＥＤ散光器の面積の５倍の面積を有する熱伝導性ガラス部材はよく機能した。   The flat thermally conductive glass member 140 has a top surface and a bottom surface, and has a thickness in the range of approximately 1/16 to 3/16 inch (1.6 to 4.8 mm). But you can. The top surface of the thermally conductive glass member has an area approximately 2 to 10.5 times wider than the diffuser of the LED light source. A thermally conductive glass member that was approximately 1/8 inch (3.2 mm) thick and had an area five times the area of the LED diffuser worked well.

押下部材として、径が０．０３２インチ（０．８ｍｍ）の２０ゲージ、タイプ３０２のステンレス製スプリングワイヤ材料は効果的に機能した。他の例では、スプリングなどを押下部材を用いてもよい。   As a pressing member, a 20 gauge, type 302 stainless spring wire material with a diameter of 0.032 inch (0.8 mm) worked effectively. In another example, a pressing member such as a spring may be used.

図２Ａは、他の代表的な実施形態のヒートシンク反射体１３０と、ＬＥＤ光源１２０と、複数のステンレス製スプリングワイヤによって所定の位置に保持されている熱伝導性ガラス製カバープレート１４０と、の上面斜視図である。図２Ｂは、図２Ａの実施形態の上面図である。   FIG. 2A is a top view of another exemplary embodiment heat sink reflector 130, LED light source 120, and thermally conductive glass cover plate 140 held in place by a plurality of stainless steel spring wires. It is a perspective view. FIG. 2B is a top view of the embodiment of FIG. 2A.

ＬＥＤ光源と熱伝導性ガラス製カバープレートを有するヒートシンク反射体を有するＬＥＤ照明固定具 図３は、ダイオード１２２と散光器１２４を有するＬＥＤ光源１２０と、熱伝導性ガラス製カバープレート１４０と、散光レンズ８２とを有する照明固定具８０の一部の概略断面図である。   LED lighting fixture having heat sink reflector with LED light source and thermally conductive glass cover plate FIG. 3 shows LED light source 120 with diode 122 and diffuser 124, thermally conductive glass cover plate 140, and diffuser lens. FIG.

従来のＬＥＤ光源は、通常、ダイオードと散光器を備えている。従来のＬＥＤ照明固定器具は、通常、ヒートシンク反射体に装着した複数の比較的小型のＬＥＤを備え、ＬＥＤ光源から離間した大型の散光レンズ８２を備えている。複数のＬＥＤを使用することにより、グレアの削減を助けている。   Conventional LED light sources typically include a diode and a diffuser. Conventional LED lighting fixtures typically include a plurality of relatively small LEDs mounted on a heat sink reflector and a large diffuser lens 82 spaced from the LED light source. The use of multiple LEDs helps reduce glare.

本発明の実施形態では、１以上のＬＥＤをヒートシンク反射体に装着し、大型の散光レンズ８２を設けている。ＬＥＤ散光器１２４の面積の２〜５倍の表面積を有する熱伝導性ガラス製カバープレート１４０によってさらなる光拡散を行っている。この大型カバープレートは、ＬＥＤ光源の点光源の「不快感（harshness）」を軽減し、オプションの固定具の散光レンズ８２に到達する前に光の散光を助けている。熱伝導性ガラス製カバープレート１４０の頂部表面に散光パターンを設けることによって、さらに散光を促進することができる。いくつかの例では、カバープレートは、ＬＥＤ光源の側部から発せられる望ましくない黄色光を反射又はブロックし、ＬＥＤ光源用の頂部側部側のヒートシンクともなる。ある例では、カバープレートは、上向きに細かく散光するパターンを有した１／８インチのI ndustrex（商標名）ガラスである。散光レンズ８２は、ＬＥＤ光源を向いて細かく散光するパターンを有するIndustrex（商標名）ガラスでもよい。   In the embodiment of the present invention, one or more LEDs are mounted on a heat sink reflector, and a large diffuser lens 82 is provided. Further light diffusion is performed by a thermally conductive glass cover plate 140 having a surface area 2 to 5 times the area of the LED diffuser 124. This large cover plate reduces the “harshness” of the point source of the LED light source and helps diffuse the light before reaching the light fixture 82 of the optional fixture. By providing a diffuse pattern on the top surface of the thermally conductive glass cover plate 140, the diffused light can be further promoted. In some examples, the cover plate reflects or blocks unwanted yellow light emanating from the side of the LED light source and also serves as a heat sink on the top side for the LED light source. In one example, the cover plate is 1/8 inch Industrex ™ glass with a finely diffusing pattern upward. The diffuser lens 82 may be Industrex (trade name) glass having a pattern that finely diffuses light toward the LED light source.

本発明は、上述の個別の例及び実施形態に限定されない。   The invention is not limited to the individual examples and embodiments described above.

８０ ＬＥＤ固定具
８２ 散光レンズ
１００ ＬＥＤアセンブリ
１２０ ＬＥＤ光源
１２２ 発光ダイオード
１２４ 散光器
１２５ フラットファイン散光レンズ
１２６ 「バルブ」散光器
１３０ ヒートシンク反射体
１３２、１３４ 側壁
１３３、１３５ 孔
１４０ 伝導性ガラス製カバー部品
１４２ 頂部表面
１４４ 散光パターン１４４
１４６ 底部表面
１５０ 押下部材
１５２ スプリングワイヤ 80 LED fixture 82 diffuser lens 100 LED assembly 120 LED light source 122 light emitting diode 124 diffuser 125 flat fine diffuser lens 126 “bulb” diffuser 130 heat sink reflector 132, 134 side wall 133, 135 hole 140 conductive glass cover part 142 Top surface 144 Diffuse pattern 144
146 Bottom surface 150 Depressing member 152 Spring wire

Claims (3)

ヒートシンクと、
熱伝導性ガラス部材と、
前記ヒートシンクと前記熱伝導性ガラス部材との間に位置するＬＥＤ光源と、
前記熱伝導性ガラス部材を前記ＬＥＤ光源に対して保持する圧縮力を提供し、前記ＬＥＤ光源を前記ヒートシンクに対して押圧する、少なくとも一つの、ワイヤを有する押下部材と、を備え、
前記ワイヤを有する前記押下部材は、
前記ヒートシンクに設けられた第１の孔に挿入された第１のワイヤ部と、
前記ヒートシンクに設けられた第２の孔に挿入された第２のワイヤ部と、
を有する、ＬＥＤアセンブリ。 A heat sink,
A thermally conductive glass member;
An LED light source located between the heat sink and the thermally conductive glass member;
A pressing member having a wire that provides a compressive force for holding the thermally conductive glass member against the LED light source and presses the LED light source against the heat sink;
The pressing member having the wire is
A first wire portion inserted into a first hole provided in the heat sink;
A second wire portion inserted into a second hole provided in the heat sink;
The a, LED assembly. ヒートシンクと、
熱伝導性ガラス部材と、
前記ヒートシンクと前記熱伝導性ガラス部材との間に位置するＬＥＤ光源と、
前記熱伝導性ガラス部材を前記ＬＥＤ光源に対して保持する圧縮力を提供し、前記ＬＥＤ光源を前記ヒートシンクに対して押圧する、少なくとも一つの、ワイヤを有する押下部材と、を備え、
前記ヒートシンクは、
上部表面を有する基部と、
前記基部から上方に突出した第１の側部と、
前記基部から上方に突出した第２の側部と、を有し、
前記ＬＥＤ光源は、前記基部の前記上部表面であって、前記第１の側部と前記第２の側部との間に位置し、
前記熱伝導性ガラス部材は、前記ＬＥＤ光源の上方に位置し、
前記押下部材は、
前記ヒートシンクの前記第１の側部に取り付けられた第１の端部と、
前記ヒートシンクの前記第２の側部に取り付けられた第２の端部とを、さらに含む、ＬＥＤアセンブリ。 A heat sink,
A thermally conductive glass member;
An LED light source located between the heat sink and the thermally conductive glass member;
A pressing member having a wire that provides a compressive force for holding the thermally conductive glass member against the LED light source and presses the LED light source against the heat sink;
The heat sink is
A base having a top surface;
A first side projecting upward from the base;
A second side projecting upward from the base,
The LED light source is the upper surface of the base and is located between the first side and the second side;
The thermally conductive glass member is located above the LED light source,
The pressing member is
A first end attached to the first side of the heat sink;
And a second end attached to said second side of said heat sink further comprising, LED assembly. ＬＥＤアセンブリの熱制御と拡散光特性を改善する方法であって、前記方法は、
凹形の反射性の上部表面を含むヒートシンクを提供するステップと、
発光ダイオードと散光器を含むＬＥＤ光源を前記ヒートシンクの前記上部表面に配置するステップと、
頂部表面と底部表面を有し、１／１６〜３／１６インチ（１．６〜４．８ｍｍ）の範囲の厚さを有する平坦な熱伝導性ガラス部材であって、前記熱伝導性ガラス部材の前記頂部表面は、前記ＬＥＤ光源の前記散光器より５倍の面積を有する、熱伝導性ガラス部材を提供するステップと、
前記熱伝導性ガラス部材を前記ＬＥＤ光源の上に配置して、前記ＬＥＤ光源からの光の散光を増加させるステップと、
前記ヒートシンクにワイヤを有する押下部材の第１の部分を取り付けるステップと、
前記押下部材によって、前記ＬＥＤ光源に対して前記平坦な熱伝導性ガラス部材を押圧して、前記ＬＥＤ光源を前記ヒートシンクに押しつけ、前記ＬＥＤ光源から前記ヒートシンクと前記熱伝導性ガラス部材の両方への熱伝導を改善するステップとを、含み、
前記ヒートシンクに押下部材の第１の部分を取り付けるステップと、前記押下部材によって、前記ＬＥＤ光源に対して前記平坦な熱伝導性ガラス部材を押圧するステップと、は、
前記ＬＥＤ光源の一方の側部に前記ヒートシンクの第１の孔を設けるステップと、
前記ＬＥＤ光源の第２の側部に前記ヒートシンクの第２の孔を設けるステップと、
前記第１の孔と前記第２の孔にワイヤを貫通して、前記熱伝導性ガラス部材に前記ＬＥＤ光源に対する圧縮力を与えるステップと、をさらに含む、方法。 A method for improving thermal control and diffused light properties of an LED assembly, the method comprising:
Providing a heat sink including a concave reflective upper surface;
Placing an LED light source including a light emitting diode and a diffuser on the upper surface of the heat sink;
A flat thermally conductive glass member having a top surface and a bottom surface and having a thickness in the range of 1/16 to 3/16 inch (1.6 to 4.8 mm), said thermally conductive glass member Providing a thermally conductive glass member, wherein the top surface of the LED light source has an area five times larger than the diffuser of the LED light source;
Disposing the thermally conductive glass member on the LED light source to increase light scattering from the LED light source;
Attaching a first portion of a pressing member having a wire to the heat sink;
The pressing member presses the flat heat conductive glass member against the LED light source to press the LED light source against the heat sink, and from the LED light source to both the heat sink and the heat conductive glass member. Improving heat conduction, and
Attaching the first portion of the pressing member to the heat sink, and pressing the flat thermally conductive glass member against the LED light source by the pressing member;
Providing a first hole of the heat sink on one side of the LED light source;
Providing a second hole in the heat sink on a second side of the LED light source;
Wherein the first hole and the second hole through the wire, further comprising the steps of: providing a compressive force to said LED light source to the thermally conductive glass member, the method.
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