JP5914971B2 - Patterned film transport method - Google Patents

Description

  The present invention relates to a method for conveying a patterned film in which a predetermined pattern is formed on a resin film, which is used for various applications such as a color filter and a wiring pattern.

  In recent years, liquid crystal display elements have been aimed at reducing the thickness and weight and improving impact resistance, and as a base material constituting a color filter, a TFT array, etc., a base material having a certain thickness that has been conventionally used, for example, Attempts have been made to use thin flexible substrates, such as resin films, instead of glass substrates. And these base materials are generally conveyed in the state packed with packing materials, such as cardboard.

  Various proposals have been made for transporting such a film substrate. For example, Patent Document 1 discloses a roll film in which an adhesive layer and a protective film are laminated to prevent scratches and wrinkles of the film being transported. Is disclosed. Patent Document 2 proposes a transport method in which a cushion sheet is inserted between stacked substrates in order to prevent the color filter from being damaged during transport.

Japanese Patent Laid-Open No. 11-157592 Japanese Patent No. 4494056

  However, even when transporting or the like is performed by the method proposed in Patent Document 1 or Patent Document 2, if a thin resin film is used as the base material, Is exposed to an extremely dry state or an extremely wet state, resulting in a large change in the moisture content of the film, resulting in a dimensional change in the film. Then, the pattern formed on the film is similarly displaced in size, and there may be a problem that high-definition patterning and high-precision bonding cannot be performed at the delivery destination after being transported to the delivery destination.

  Currently, transport methods that take into account various problems that may occur in subsequent processes due to dimensional changes that occur during transport have been studied, but these problems remain unresolved.

  This invention is made in view of such a situation, and provides the conveyance method of the film with a pattern in which a high-definition patterning process and a highly accurate bonding can be performed in a delivery destination after conveyance to a delivery destination etc. Is the main issue.

The present invention for solving the aforementioned problems is a method of transporting patterned film obtained by forming a pattern on a resin film, the water content of the resin film during pattern formation when the reference water content, the resin When the moisture content at the time of purchase of the film is lower than the reference moisture content, the moisture content of the patterned film after pattern formation is always kept lower than the reference moisture content and conveyed, while the resin film When the moisture content at the time of purchase is higher than the reference moisture content, the moisture content of the patterned film after pattern formation is always kept higher than the reference moisture content and conveyed.

  The method of the present invention can provide a method for transporting a film with a pattern that can be subjected to high-definition patterning and high-precision bonding at the delivery destination after being transported to the delivery destination or the like.

It is the graph which showed the relationship between the moisture content of a film, and time at the time of performing the 1st conveying method of this invention. It is the graph which showed the relationship between the moisture content of a film, and time at the time of performing the 2nd conveying method of this invention.

  Hereinafter, the conveyance method of the film with a pattern of this invention is demonstrated in detail using drawing.

(First transport method)
FIG. 1 is a graph showing the relationship between the moisture content of a film and time when the first conveying method of the present invention is performed.

  As shown in FIG. 1, in the first conveying method of the present invention, when the moisture content of the resin film at the time of pattern formation is set to the reference moisture content X, the moisture content of the resin film in the process a that reaches the pattern formation time. When the rate is lower than the reference moisture content X, the pattern is formed, that is, the moisture content of the patterned film in the conveyance b is always kept lower than the reference moisture content X and conveyed. Yes.

  The inventor of the present application has earnestly studied the relationship between the moisture content of the film and the environment in which the film is placed. For example, the moisture content of the film that is the raw material is very low, and the film is the raw material. When the pattern is formed in a state where the moisture content of the film is increased to some extent, as shown by the dotted line y in FIG. 1, the film is transported in a state where the moisture content is higher than the moisture content X of the film at the time of pattern formation. Therefore, even if it is attempted to lower the moisture content by drying the film with the pattern in the post process at the destination, as shown by the symbol h in the figure, the moisture content X is no longer lowered to the pattern forming time. The inventors have found that a phenomenon, that is, hysteresis occurs, and have completed the present invention. Here, the said water content X is made into the reference | standard water content in this invention.

  As explained above, most of the resin film that is the raw material of the patterned film is in a state where it is dried in comparison with the moisture content in the normal temperature and humidity atmosphere at the stage of manufacture, while the environment in which the pattern is formed is Often a room temperature and humidity environment. In such a situation, in the normal case, the resin film gradually absorbs moisture from the dry state and often has a steady moisture content in a normal temperature and humidity atmosphere. Therefore, in such a case, The moisture content X of the film at the time of pattern formation is set as the reference moisture content, and the moisture content of the film is always smaller than the reference moisture content X during conveyance, that is, the above-mentioned hysteresis is caused by conveying in a slightly dry state. Can be prevented. And in the 1st conveying method of this invention, since the film with a pattern in conveyance becomes a little dry state compared with the time of pattern formation as above-mentioned, the whole film shrinks by the change of a moisture content, and this. The dimensions of the pattern itself will also change due to this, but the moisture content at the time of pattern formation, that is, the reference moisture content will be restored by exposing it to the same environment at the time of pattern formation at the delivery destination. Therefore, the dimensions of the film and pattern are also restored. Therefore, in the said delivery destination, it becomes possible to perform high-definition patterning process and highly accurate bonding using the said film with a pattern.

(Second transport method)
FIG. 2 is a graph showing the relationship between the moisture content of the film and time when the second conveying method of the present invention is performed.

  As shown in FIG. 2, in the second transport method of the present invention, when the moisture content of the resin film at the time of pattern formation is set to the reference moisture content X, the moisture content of the resin film in the process “a” at the time of pattern formation. When the rate is higher than the reference moisture content X, it is characterized in that after the pattern formation, that is, the moisture content of the patterned film in the conveyance b is always kept higher than the reference moisture content X and conveyed. Yes.

  In the first transport method of the present invention described with reference to FIG. 1, the moisture content of the resin at the time of pattern formation, that is, the moisture content of the resin film in the process a leading to the pattern formation is lower than the reference moisture content X. In the opposite case, that is, when the moisture content of the resin film in the process a leading to the pattern formation is higher than the reference moisture content X, so-called hysteresis occurs if the conveyance method is wrong. However, as shown in FIG. 2, when the moisture content of the resin film in the process a leading to pattern formation is high, the resin film is conveyed in a slightly wet state than the reference moisture content X during conveyance after pattern formation. By doing so, it is possible to prevent the so-called hysteresis from occurring. Similar to the first transport method of the present invention, even in the second transport method, the patterned film during transport becomes slightly wet compared to the pattern formation, so that the entire film is caused by a change in moisture content. Although the pattern size itself changes due to the elongation, the moisture content at the time of pattern formation, that is, the reference moisture content at the delivery destination by exposing it to the same environment as that at the time of pattern formation for a predetermined time. Therefore, the dimensions of the film and the pattern are also restored. Therefore, in the said delivery destination, it becomes possible to perform high-definition patterning process and highly accurate bonding using the said film with a pattern.

  As a film with a pattern used as the object of the conveyance method of this invention, what is necessary is just a pattern formed on the resin film, and there is no limitation about a film with a pattern. Examples of the resin film include polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonate (PC), polyimide (PI), polyetheretherketone (PEEK), polyethylene (PE), polypropylene (PP), and polyphenylene sulfide (PPS). ), Polyetherimide (PEI), cellulose triacetate (CTA), cyclic polyolefin (COP), polymethyl methacrylate (PMMA), polysulfone (PSF), polyamideimide (PAI), norbornene resin, allyl ester resin, etc. The film etc. which consist of can be mentioned.

  The resin film may have a single layer configuration, or may have a configuration in which a plurality of layers are laminated.

The humidity expansion coefficient of the resin film is preferably 2 × 10 ⁻⁵ /% RH or less, more preferably 1 × 10 ⁻⁵ /% RH or less, and more preferably 5 × 10 ⁻⁶ /% RH. More preferably, it is as follows. This is because the dimensional change amount due to the humidity change of the base material itself is small and the handling becomes easy.

The linear expansion coefficient of the resin film is preferably 2 × 10 ⁻⁵ / ° C. or less, more preferably 1 × 10 ⁻⁵ / ° C. or less, and 5 × 10 ⁻⁶ / ° C. or less. More preferably. This is because, like the humidity expansion coefficient, the amount of dimensional change due to temperature change is small, and handling is easy.

  The pattern formed on the resin film is an arbitrary pattern, for example, an optical functional layer used for an image display element for a liquid crystal display device or the entire image display element, more specifically, a color filter or various wiring patterns, Further examples include a hard coat layer, an antiglare layer, an antireflection layer, and a polarizing layer.

  Further, the shape of the film with a pattern is not particularly limited, and may be a single wafer having a predetermined dimension or a roll.

  In any of the first transport method and the second transport method, it is necessary to manage the moisture content of the patterned film being transported, but the management manages only either the upper limit or the lower limit of the moisture content. In other words, in the case of the first transport method, it is sufficient to manage the upper limit value so that the moisture content does not exceed the reference moisture content X. On the other hand, in the case of the second transport method, the moisture content Since it is only necessary to manage the lower limit value so that the rate does not become lower than the reference moisture content X, the management means does not have to be strict, and any means capable of such management can be used. Even if it is, it can be adopted.

Specifically, using a packaging material having a certain degree of moisture-proof performance, for example, having a moisture-proof performance with a water vapor permeability of 1.0 g / m ² · 24 hr · MPa or less at a temperature of 40 ° C. and a relative humidity of 90%, By sealing the film with a pattern, it is possible to prevent the water content of the film with a pattern from fluctuating greatly due to the influence of moisture in the external environment during conveyance.

  As such a packing material, a gas barrier film having a water vapor permeability within the above range can be used. Examples of the gas barrier film include those obtained by laminating a base film and an inorganic oxide layer.

  Base film includes poly (meth) acrylate, poly (meth) arylate (PAR), polyimide (PI), polyamideimide (PAI), polyethersulfone (PES), polycarbonate (PC), cyclic polyolefin copolymer Polynorbornene, cyclic polyolefin resin, polycyclohexene, polyetherketone (PEK), polyetheretherketone (PEEK), polyetherimide (PEI), polysiloxane, ethylene-tetrafluoroethylene copolymer (ETFE) Fluorine-based resins such as ethylene trifluoride chloride (PFA), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (FEP), vinylidene fluoride (PVDF), and vinyl fluoride (PVF). .

  Examples of the inorganic oxide layer include oxides such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, zirconium oxide, titanium oxide, boron oxide, hafnium oxide, and barium oxide. In consideration of productivity that can be within the above range, aluminum oxide, silicon oxide, silicon oxynitride, silicon oxycarbide, or silicon dioxide is preferable. As a method for forming the inorganic oxide layer, a vacuum deposition method, a sputtering method, an ion plating method, a PVD method, a plasma assisted CVD method, an ion beam assisted CVD method, or the like can be applied. Preferably, the PVD method is used from the viewpoint of productivity. Or ion plating. These methods may be selected in consideration of the type of base film or inorganic oxide film forming material, easiness of film forming, process efficiency, and the like.

  There is no limitation in particular about the method of packing a film with a pattern with a packing material, for example, using a bag-shaped packing material, inserting a film with a pattern into a bag, and closing an opening part by a packing material with a packing material Can be packed.

  Moreover, in the case of sealing the patterned film with a packing material, when the first transport method is carried out, the drying condition is maintained by packing a desiccant such as silica gel together with the patterned film. You may prevent exceeding the moisture content X.

  On the other hand, in the case where the patterned film is sealed with a packing material, when the second transport method is carried out, the wet state is maintained by packing absorbent cotton containing water together with the patterned film. , It may be prevented from falling below the reference moisture content X.

  The present invention will be further described below using examples.

Example 1
As a base film, a PET film (manufactured by Toyobo Co., Ltd., product name: A4100, film thickness: 125 μm) was purchased, and the water content of the base film was measured, and it was 0.10 ± 0.01 wt%. A moisture meter (manufactured by Kurabo Industries, product name: RX-100) was used for the measurement of the moisture content. Moreover, when the relationship between the moisture content and the dimension of the substrate film was examined, it was found that the dimension varied by 1.8 μm per 100 mm when the moisture content varied by 0.01 wt%.

  Here, as a result of curing the base film in a normal temperature and normal humidity equilibrium state (23 ± 2 ° C., 45 ± 5% RH), the water content became 0.33 wt%. A predetermined pattern was formed on the surface. That is, the base moisture content of the base film is 0.33 wt%, and the base film has a lower moisture content in the process up to the reference moisture content than the reference moisture content.

  After transporting the moisture content of the base film after pattern formation for 24 hours in a state always lower than the reference moisture content, it was cured again at normal temperature and normal humidity, and the moisture content measured thereafter was 0.33 wt%. became. Therefore, the dimensional change with the predetermined pattern was 0 ± 1.8 μm / 100 mm. Note that “± 1.8 μm” in the dimensional change amount is caused by “± 0.01 wt%”, which is a measurement error that may occur when measuring the moisture content of the base film. It can be said that the substantial dimensional change in Example 1 is “0 μm”.

(Example 2)
As a base film, a PET film (manufactured by Toyobo Co., Ltd., product name: A4100, film thickness: 125 μm) was purchased, and the water content of the base film was measured. As a result, it was 0.60 ± 0.01 wt%. A moisture meter (manufactured by Kurabo Industries, product name: RX-100) was used for the measurement of the moisture content. Moreover, when the relationship between the moisture content and the dimension of the substrate film was examined, it was found that the dimension varied by 1.8 μm per 100 mm when the moisture content varied by 0.01 wt%.

  Here, as a result of curing the base film in a normal temperature and normal humidity equilibrium state (23 ± 2 ° C., 45 ± 5% RH), the water content became 0.36 wt%. A predetermined pattern was formed on the surface. That is, the reference moisture content of the base film is 0.36 wt%, and the base film has a higher moisture content in the process up to the reference moisture content than the reference moisture content.

  After transporting the moisture content of the base film after pattern formation for 24 hours in a state always higher than the reference moisture content, it was cured again in a normal temperature and normal humidity equilibrium state, and the subsequent moisture content was measured to be 0.36 wt%. became. Therefore, the dimensional change with the predetermined pattern was 0 ± 1.8 μm / 100 mm. As in Example 1 above, “± 1.8 μm” in the dimensional change amount is caused by “± 0.01 wt%”, which is a measurement error that may occur when measuring the moisture content of the base film. Therefore, it can be said that the substantial amount of dimensional change in Example 2 is “0 μm”.

(Comparative Example 1)
A base film similar to that in Example 1 was prepared, and a predetermined pattern was formed on the base film under the same conditions as in Example 1.

  That is, the base moisture content of the base film is 0.33 wt%, and the base film has a lower moisture content in the process up to the reference moisture content than the reference moisture content.

  Unlike Example 1, the moisture content of the base film after pattern formation was always transported for 24 hours in a state higher than the reference moisture content, and then again at normal temperature and normal humidity (23 ± 2 ° C., 45 ± 5% RH). ) And the subsequent moisture content was measured and found to be 0.36 wt%. Therefore, the dimensional change with the predetermined pattern was 5.4 ± 1.8 μm / 100 mm. As in Example 1 above, “± 1.8 μm” in the dimensional change amount is caused by “± 0.01 wt%”, which is a measurement error that may occur when measuring the moisture content of the base film. Therefore, it can be said that the substantial dimensional change in Comparative Example 1 is “5.4 μm”.

(Comparative Example 2)
A base film similar to that in Example 2 was prepared, and a predetermined pattern was formed on the base film under the same conditions as in Example 2.

  That is, the reference moisture content of the base film is 0.36 wt%, and the base film has a higher moisture content in the process up to the reference moisture content than the reference moisture content.

  Unlike Example 2, the moisture content of the substrate film after pattern formation was always transported for 24 hours in a state lower than the reference moisture content, and then again at room temperature and humidity equilibrium state (23 ± 2 ° C., 45 ± 5% RH). ) And then measured the water content, it was 0.33 wt%. Therefore, the dimensional change with the predetermined pattern was 5.4 ± 1.8 μm / 100 mm. As in Example 1 above, “± 1.8 μm” in the dimensional change amount is caused by “± 0.01 wt%”, which is a measurement error that may occur when measuring the moisture content of the base film. Therefore, it can be said that the substantial amount of dimensional change in Comparative Example 2 is “5.4 μm”.

(result)
As is clear from Examples 1 and 2, according to the transport method of the present invention, the moisture content of the film returns to the moisture content at the time of pattern formation by returning to the environment at the time of pattern formation. The elongation of the film can be suppressed within an allowable range. On the other hand, when the moisture content in the process leading to the pattern formation is low as in Comparative Examples 1 and 2, the moisture content in the process leading to the pattern formation is transported in a state exceeding the moisture content during the pattern formation. If the moisture content is higher than the moisture content at the time of pattern formation, so-called hysteresis occurs, and the moisture content at the time of pattern formation cannot be restored, and the film stretches due to a change in the moisture content. End up.

Claims (1)

A method of transporting a patterned film formed by forming a pattern on a resin film,
When the moisture content of the resin film at the time of pattern formation is the reference moisture content,
When the moisture content at the time of purchase of the resin film is lower than the reference moisture content, the moisture content of the patterned film after pattern formation is always kept lower than the reference moisture content and conveyed,
When the moisture content at the time of purchase of the resin film is higher than the reference moisture content, the moisture content of the patterned film after pattern formation is always kept higher than the reference moisture content and conveyed.
A method for conveying a patterned film, comprising:

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