JP5896236B2 - Board member - Google Patents

Description

  The present invention relates to a board member.

  Conventionally, as a board member composed of a plurality of layers, for example, one described in Patent Document 1 below is known. Patent Document 1 describes a structure in which a wooden board (board base material), a resin layer, and paper are laminated in this order.

Japanese Patent Laid-Open No. 11-227112

  By the way, as a board | substrate base material used for a board member, what contained vegetable fiber, such as kenaf, is known, for example. When using such vegetable fiber, for example, it is necessary to go through a process of extracting the fiber from the plant, a process of decomposing the fiber with microorganisms, etc., and a volatile organic compound (VOC) is generated in such a process. There is a case. Such VOC may remain in the board substrate.

  Thereby, for example, depending on the environment (for example, high temperature environment) in which the board base material is installed, it is considered that VOC is discharged from the board base material to the outside. In order to improve the quality of the board member, it is required to suppress the release of VOC to the outside.

  The present invention has been completed based on the above circumstances, and even if a volatile organic compound (VOC) is generated from the board base material, the volatile organic compound is present on the skin material side. It aims at providing the board member which can suppress the situation where it discharge | releases and can maintain quality.

  In order to solve the above-mentioned problems, the present invention is interposed between a board base material containing vegetable fibers, a skin material covering one surface of the board base material, and the board base material and the skin material. A functional layer, a board base-side adhesive layer that is interposed between the functional layer and the board base, and bonds the functional layer and the board base, and between the functional layer and the skin material A skin material side adhesive layer that adheres the functional layer and the skin material, and the melting point of the board base material side adhesive layer is set lower than the melting point of the functional layer, The material side adhesive layer is characterized by containing an adsorbent capable of adsorbing volatile organic compounds.

  In the present invention, the board base-side adhesive layer contains an adsorbent. Thereby, the volatile organic compound which can be generated from the vegetable fiber contained in the board base material can be adsorbed by the adsorbent, and the situation of being released to the skin material side can be suppressed.

  In addition, since the adsorbent is included in the board base-side adhesive layer (the layer for adhering the functional layer), for example, it is not necessary to provide a dedicated layer only for adsorption, and the configuration is simple. be able to.

  And, it is possible to more reliably adsorb volatile organic compounds that can be generated from the board substrate by including an adsorbent in the board substrate side adhesive layer, which is a layer closer to the board substrate. it can.

  Moreover, the melting point of the board base-side adhesive layer is lower than the melting point of the functional layer. When an adsorbent is included in a member, the member is generally heated and melted and mixed with the adsorbent. Such adsorbents are generally sensitive to high temperatures. From this, by including an adsorbent in the board base layer side adhesive layer having a lower melting point, for example, compared to the configuration included in the functional layer, it is possible to suppress the situation where the adsorbent becomes high temperature, the performance of the adsorbent Can be suppressed.

  The said structure WHEREIN: The said adsorbent shall be contained in the ratio of 1-10 mass parts with respect to 100 mass parts of said board | substrate base material side adhesive layers.

  By including the adsorbent in the above ratio, VOC that can be generated from the board substrate can be reliably adsorbed. Also, if the board base-side adhesive layer contains too much adsorbent, the adhesive strength of the board base-side adhesive layer may decrease, but if within the above range, the adhesive strength is ensured. be able to.

  The functional layer is a waterproof layer made of a waterproof resin film.

  With such a configuration, for example, when water is applied to the board member from the skin material side, the water is blocked by the waterproof layer, so that the situation where water enters the board substrate is suppressed. Can do. Thereby, the situation where a board base material corrodes when water penetrate | invades into a board base material, and the situation where odor generate | occur | produces from a board base material can be suppressed more reliably.

  According to the present invention, even if a volatile organic compound (VOC) is generated from the board base material, the situation where the volatile organic compound is released to the skin material side is suppressed, and the quality is maintained. Can do.

The perspective view which looked at the vehicle provided with the deck board of this embodiment from back. Sectional drawing which shows the formation process which shape | molds the deck board of this embodiment. Sectional drawing which shows the state which the molding process of this embodiment completed. Sectional drawing which expands and shows the deck board vicinity in FIG. The graph which shows the result of having measured the generation amount of VOC in this embodiment and a comparative example.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a perspective view of the vehicle as viewed from the rear. As shown in FIG. 1, a trunk 11 is provided behind the vehicle 10.

  A deck board 20 (board molded product) of the present embodiment is placed in the trunk 11. The deck board 20 plays a role as a flooring material when placing a luggage or the like on the deck board 20 and also plays a role in adjusting the beauty of the trunk 11.

  As shown in FIG. 3, the deck board 20 is configured by laminating a plurality of layered members. Specifically, the deck board 20 includes a board base material 21, a skin material 23 that covers one surface 21 </ b> A of the board base material 21, and an intermediate layer 30 that is interposed between the board base material 21 and the skin material 23. And.

  The board base material 21 is configured by, for example, molding a mixture of polypropylene fibers and kenaf which is vegetable fiber into a board shape. In addition, although the mixing ratio of the polypropylene and kenaf in the board | substrate base material 21 shall be 50:50 (weight ratio), for example, it is not limited to this mixing ratio, It can change suitably.

  As shown in FIG. 4, the intermediate layer 30 includes a waterproof layer 32 (functional layer) having a waterproof property, a board substrate-side adhesive layer 43 interposed between the waterproof layer 32 and the board substrate 21, and a waterproof layer. And a skin material-side adhesive layer 45 interposed between the layer 32 and the skin material 23.

  The waterproof layer 32 is, for example, a polyamide resin film (thermoplastic resin film). The board substrate-side adhesive layer 43 is a layer for bonding the waterproof layer 32 and the board substrate 21, and is a thermoplastic resin film having a melting point lower than that of the waterproof layer 32. For example, when polyamide is used as the waterproof layer 32, the board base-side adhesive layer 43 may be, for example, a polypropylene or polyethylene resin film having a melting point lower than that of polyamide.

  The skin material side adhesive layer 45 is a layer for adhering the waterproof layer 32 and the skin material 23, and is composed of a thermoplastic resin film having a melting point lower than that of the waterproof layer 32. When polyamide is used as the waterproof layer 32, the skin material side adhesive layer 45 may be a polypropylene or polyethylene resin film having a melting point lower than that of polyamide, for example.

  The skin material 23 constitutes the design surface 23 </ b> A of the deck board 20. The skin material 23 is made of, for example, a thermoplastic resin such as polyethylene terephthalate.

  And the board | substrate base material side adhesion layer 43 of this embodiment contains the adsorption agent. As such an adsorbent, what can adsorb | suck the volatile organic compound (VOC) which can be generated from the board | substrate base material 21, for example can be used.

  The board base material 21 of this embodiment contains vegetable fibers such as kenaf. For this reason, in the manufacturing process of the board base material 21, it is considered that acid-based and aldehyde-based VOCs are generated and the generated VOCs are included in the board base material 21.

  For this reason, the board base-side adhesive layer 43 includes two types of adsorbents (adsorbents capable of chemically adsorbing acid-based and aldehyde-based VOCs). As an inorganic type adsorbent (deodorant) capable of adsorbing acid-based VOC, for example, trade name “Kesmon (registered trademark) NS-80-E” manufactured by Toa Gosei Co., Ltd. can be exemplified. . Moreover, as an inorganic type adsorbent which can adsorb | suck aldehyde type | system | group VOC, the product name "Kesmon (registered trademark) NS-241" by Toa Gosei Co., Ltd. etc. can be illustrated, for example.

  Moreover, in order to shape | mold the board | substrate base material side adhesion layer 43 containing the adsorption agent, it carries out as follows, for example. First, as an adsorbent, for example, a powdery one is used, and this adsorbent is kneaded into a material resin constituting the board base-side adhesive layer 43 to form a pellet. The board base-side adhesive layer 43 can be formed from the pellet containing the adsorbent.

  The acid-based adsorbent (adsorbent capable of adsorbing acid-based VOC) contained in the board base-side adhesive layer 43 is, for example, 100 parts by mass (more specifically, the board base-side adhesive layer 43). It is preferable that it is contained at a ratio of 1 to 10 parts by mass with respect to 100 parts by mass of the thermoplastic resin film constituting the material side adhesive layer 43. The aldehyde-based adsorbent (adsorbent capable of adsorbing aldehyde-based VOC) contained in the board base-side adhesive layer 43 is, for example, 100 parts by mass of the board base-side adhesive layer 43 (more specifically, the board base It is preferable that it is contained at a ratio of 1 to 10 parts by mass with respect to 100 parts by mass of the thermoplastic resin film constituting the material side adhesive layer 43. That is, when several types of adsorbents are included as described above, each type of adsorbent is included at a ratio of 1 to 10 parts by mass with respect to 100 parts by mass of the board base-side adhesive layer 43. It is preferable. In addition, the adsorbent contained in the board base-side adhesive layer 43 is not limited to the above-described two types (acid-based and aldehyde-based adsorbent), and can be changed as appropriate. Further, the amount of the adsorbent contained in the board base-side adhesive layer 43 is not limited to the range of 1 to 10 parts by mass and can be changed as appropriate.

  Next, a method for manufacturing the deck board 20 will be described. The deck board 20 is manufactured by integrally molding a laminate in which an intermediate layer 30 is laminated on a board base material 21 and a skin material 23.

  In order to manufacture the board substrate 21, first, a material obtained by mixing polypropylene fibers and kenaf, which is a vegetable fiber, is mixed into a mat body. Next, the obtained mat body is formed into a plate shape by a heating press. Thereby, the preboard 22 (board base material 21 before being formed into the shape of the deck board 20) having a predetermined thickness can be manufactured.

  Next, the board base-side adhesive layer 43 in the intermediate layer 30 is affixed to the preboard 22 by heat pressing (laminating). The heating temperature at this time is lower than the melting point of the waterproof layer 32 and higher than the melting point of the board base-side adhesive layer 43. Thereby, the preboard 22 and the intermediate | middle layer 30 are adhere | attached because the board | substrate base material side contact bonding layer 43 fuse | melts. In addition, by making the heating temperature at this time lower than the melting point of the waterproof layer 32, the waterproof layer 32 is not melted and the waterproof performance of the waterproof layer 32 can be maintained.

  Next, a composite board in which the pre-board 22 and the intermediate layer 30 are integrated (indicated by reference numeral 26 in the following description) and the skin material 23 are integrally formed using a molding die 80 shown in FIG. Molding (molding process).

  First, as shown in FIG. 2, the skin material 23 is held on the upper mold 81 of the mold 80 by, for example, vacuuming. Further, the composite board 26 preheated by a heater (not shown) or the like is disposed between the upper mold 81 and the lower mold 82. At this time, it arrange | positions so that the skin material side adhesion layer 45 of the composite board 26 may oppose the skin material 23. FIG.

  The heating temperature of the composite board 26 is set to a temperature at which the skin material side adhesive layer 45 is melted. For example, when the skin material side adhesive layer 45 is polypropylene, since the melting point of polypropylene is 160 ° C. to 170 ° C., the skin material side adhesive layer 45 is heated to a temperature higher than this (for example, 220 ° C.).

  Next, as shown in FIG. 3, the upper mold 81 and the lower mold 82 are closed. As a result, the preboard 22 is pressed by the upper mold 81 and the lower mold 82 and formed into the shape of the cavity C <b> 1 formed between the upper mold 81 and the lower mold 82. As a result, the pre-board 22 is formed as the board base material 21.

  In the process of forming the board base material 21, the preheated skin material side adhesive layer 45 is in a molten state. Thereby, after the skin material side adhesive layer 45 and the skin material 23 come into contact with each other, the melted skin material side adhesive layer 4 is cooled and solidified, whereby the skin material 23 and the composite board 26 are bonded. Thereby, the skin material 23 and the composite board 26 are integrally molded, and the manufacture of the deck board 20 is completed.

  In addition, the manufacturing method of the deck board 20 is not limited to what was mentioned above, It can change suitably. For example, the skin material 23 and the intermediate layer 30 may be formed integrally and may be attached to the board base 21.

  Next, the effect of this embodiment will be described. In the present embodiment, the board base-side adhesive layer 43 contains an adsorbent. Thereby, VOC which can be generated from the vegetable fiber contained in the board base material 21 can be adsorbed by the adsorbent.

  This effect will be described in detail with reference to FIG. FIG. 5 is a graph showing the results of measuring the amount of acetaldehyde (an example of VOC) generated in this embodiment and a comparative example.

  The deck board of the comparative example includes only the board base material 21 and the skin material 23 in the deck board 20 of the present embodiment, and does not include the intermediate layer 30 (and hence the adsorbent). Further, in the deck board 20 of the present embodiment, with respect to 100 parts by mass of the board base-side adhesive layer 43, Kesmon (registered trademark) NS-80-E and Kesmon (registered trademark) NS manufactured by Toa Gosei Co., Ltd. -241 each containing 4 parts by mass is used.

  Next, a method for measuring the amount of acetaldehyde will be described. For example, a part of the deck board of this embodiment and the comparative example is cut out in a rectangular shape having a size of 5 cm on one side and 10 cm on the other side, and these are used as test samples. Each of these test samples was placed in each sample bag (Omi Odo Air Service, product name: Flex Sampler (registered trademark)), and the amount of acetaldehyde was measured.

  First, 1 L of nitrogen gas is filled in the sample bag containing the test sample. Then, after heating a sample bag at 100 degreeC for 1 hour, it returns to normal temperature.

  Then, a gas detector tube for acetaldehyde (product name: No. 92L) is set in a gas sampling device (product name: GV-100S), and the above sample bag is set in the gas detector tube. To do. And 100 ml of gas in a sample bag is extract | collected with a gas sampling instrument, and the quantity of acetaldehyde is measured by reading the scale of the reaction part of a detection tube.

  FIG. 5 shows an average value when the above measurement is performed twice for each test sample, and the vertical axis of FIG. 5 is the amount of acetaldehyde measured (unit: ppm). According to FIG. 5, in the comparative example, an average of 0.75 ppm of acetaldehyde was detected. On the other hand, acetaldehyde was not detected in this embodiment. Thereby, it was confirmed that acetaldehyde generated from the board substrate 21 can be adsorbed by the adsorbent contained in the board substrate-side adhesive layer 43.

  In the present embodiment, since the adsorbent is included in the board base-side adhesive layer 43 (layer for adhering the waterproof layer 32), for example, it is necessary to provide a dedicated layer only for adsorbing. And a simple configuration can be obtained.

  Then, by including an adsorbent in the board base-side adhesive layer 43, which is a layer closer to the board base 21, the VOC that can be generated from the board base 21 can be more reliably adsorbed. it can.

  Further, the melting point of the board base-side adhesive layer 43 is lower than the melting point of the waterproof layer 32. When an adsorbent is included in a member, the member is generally heated and melted and mixed with the adsorbent. Such adsorbents are generally sensitive to high temperatures. From this, by including an adsorbent in the board base-side adhesive layer 43 having a lower melting point, for example, the adsorbent becomes a higher temperature than in a configuration in which the adsorbent is included in the waterproof layer 32 having a higher melting point. The situation can be suppressed, and the situation where the performance of the adsorbent is reduced can be suppressed.

  Further, the adsorbent may be included in a ratio of 1 to 10 parts by mass with respect to 100 parts by mass of the board base-side adhesive layer 43.

  By including the adsorbent in the above ratio, VOC that can be generated from the board base material 21 can be reliably adsorbed. In addition, if there is too much adsorbent contained in the board base-side adhesive layer 43, the adhesive strength of the board base-side adhesive layer 43 may be reduced. Can be secured.

  Moreover, the waterproof layer comprised from the resin film which has waterproofness is provided. With such a configuration, for example, when water is applied from the skin material 23 side to the deck board 20, the water is blocked by the waterproof layer 32, so that water enters the board substrate 21. Can be suppressed.

  Accordingly, it is possible to more reliably suppress the corrosion of the board base material 21 and the occurrence of odor from the board base material 21. In addition, there is a concern that the rigidity of the board base material 21 may be reduced when water soaks into the board base material 21, but in the present embodiment, such a situation can be suppressed.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

  (1) In the above embodiment, the vehicle deck board is exemplified as the board member, but the board member is not limited thereto. As a board member, a package tray etc. other than a deck board can be illustrated, for example.

  (2) The material of each layer constituting the deck board is not limited to those exemplified in the above embodiment, and can be appropriately changed. For example, in the above embodiment, the waterproof layer 32 is made of polyamide, but the present invention is not limited to this. For example, polypropylene may be used for the waterproof layer 32. In this case, the board base material side adhesive layer 43 and the skin material side adhesive layer 45 may be made of a material having a melting point lower than that of polypropylene (for example, polyethylene).

  (3) The vegetable fiber contained in the board base material 21 is not limited to kenaf. Also, the type of adsorbent contained in the board base-side adhesive layer 43 is not limited to that exemplified in the above embodiment. Depending on the type of VOC that can be generated from the board substrate 21, the type of adsorbent can be changed as appropriate. Further, only one type of adsorbent may be included in the base-side adhesive layer 43, or several types of adsorbents may be included. The adsorbent mentioned here includes those that perform adsorption by physical adsorption in addition to those that perform adsorption by chemical adsorption (by changing the VOC itself by a chemical reaction). Moreover, you may use the adsorption agent which performs adsorption | suction combining physical adsorption and chemical adsorption together.

  (4) In addition to the adsorbent that adsorbs VOC, the base material side adhesive layer 43 may include an adsorbent capable of adsorbing odor components that can be generated from the board base material 21.

  (5) In the said embodiment, although the waterproof layer 32 was illustrated as a functional layer, it is not limited to this. The functional layer may be a layer that is interposed between the board base material 21 and the skin material 23 and has some function. For example, the functional layer can be exemplified by a sound insulating layer for suppressing external noise from being transmitted to the cabin. Further, the functional layer is not limited to a single layer and may be composed of a plurality of layers. For example, when the materials of the waterproof layer and the sound insulation layer are different from each other, the waterproof layer and the sound insulation layer may be layered to form a functional layer.

DESCRIPTION OF SYMBOLS 20 ... Deck board (board member), 21 ... Board base material, 21A ... One side in board base material, 23 ... Skin material, 32 ... Waterproof layer (functional layer), 43 ... Board base material side adhesive layer, 45 ... Skin material side adhesive layer

Claims (2)

A board substrate containing vegetable fibers;
A skin material covering one surface of the board substrate;
A functional layer interposed between the board base material and the skin material;
A board substrate-side adhesive layer interposed between the functional layer and the board substrate, and bonding the functional layer and the board substrate;
A skin material side adhesive layer that is interposed between the functional layer and the skin material and adheres the functional layer and the skin material;
The melting point of the board substrate side adhesive layer is set lower than the melting point of the functional layer,
The board substrate side adhesive layer contains an adsorbent capable of adsorbing volatile organic compounds ,
The functional layer is a board member that is a waterproof layer made of a waterproof resin film .   The said adsorbent is a board member of Claim 1 contained in the ratio of 1-10 mass parts with respect to 100 mass parts of said board | substrate base material side adhesion layers.

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