JP5892971B2 - Method for manufacturing nitride semiconductor layer - Google Patents

Description

  Embodiments described herein relate generally to a method for manufacturing a nitride semiconductor layer.

  A light emitting diode (LED), which is a semiconductor light emitting element using a nitride semiconductor, is used in, for example, a display device or illumination. Electronic devices using nitride semiconductors are used for high-speed electronic devices and power devices.

  When such a nitride semiconductor device is formed on a silicon (Si) substrate excellent in mass productivity, cracks due to differences in lattice constant and thermal expansion coefficient are likely to occur. A technique for producing a high-quality crystal on a silicon substrate is desired.

JP 2006-128626 A

  Embodiments of the present invention provide a method for manufacturing a nitride semiconductor layer in which the occurrence of cracks is suppressed.

According to an embodiment of the present invention, a first lower layer of a nitride semiconductor having a first lattice spacing of a first axis parallel to the main surface is formed on the main surface of the silicon substrate, and the first on the first lower, having a second lattice spacing have a pressure Chijimiyugami larger the first axis than the first lattice spacing, to form a first layer of nitride semiconductor, wherein the first lower layer There is provided a method for manufacturing a nitride semiconductor layer including a step of forming a first stacked body including a first upper layer. The absolute value of the ratio of the difference between the second lattice spacing and the first lattice spacing to the first lattice spacing is 0.005 or more and 0.019 or less. The formation of the first upper layer is such that the growth rate of the first upper layer in a direction parallel to the main surface is larger than the growth rate of the first upper layer in a direction perpendicular to the main surface, Forming the first upper layer while applying a compressive stress based on the difference between the second lattice spacing and the first lattice spacing to the first upper layer. The step of forming the first stacked body has a lattice spacing of the first axis smaller than the first lattice spacing on the main surface before forming the first lower layer, and a nitride semiconductor Forming a first base layer, wherein the first base layer is AlN. The first lattice spacing of the first axis of the first lower layer is smaller than the unstrained first axis lattice spacing of the first lower layer.

FIG. 1A to FIG. 1C are schematic views showing a nitride semiconductor layer according to the first embodiment. It is a flowchart figure which shows the manufacturing method of the nitride semiconductor layer which concerns on 1st Embodiment. It is a graph which shows the characteristic of a nitride semiconductor layer. It is a graph which shows the characteristic of a nitride semiconductor layer. It is a graph which shows the characteristic of a nitride semiconductor layer. FIG. 6A to FIG. 6D are graphs showing characteristics of the nitride semiconductor layer. It is a graph which shows the characteristic of a nitride semiconductor layer. FIG. 8A to FIG. 8D are schematic cross-sectional views showing characteristics of the nitride semiconductor layer. FIG. 9A to FIG. 9D are schematic views showing nitride semiconductor layers. FIG. 10A to FIG. 10C are schematic views showing the nitride semiconductor layer according to the first embodiment. It is a flowchart figure which shows the manufacturing method of another nitride semiconductor layer which concerns on 1st Embodiment. FIG. 12A to FIG. 12D are schematic views showing nitride semiconductor layers according to the second embodiment. FIG. 13A to FIG. 13D are schematic views showing another nitride semiconductor layer according to the second embodiment. It is a graph which shows the characteristic of the nitride semiconductor layer which concerns on embodiment. It is a graph which shows the characteristic of the nitride semiconductor layer which concerns on embodiment. FIG. 16A to FIG. 16C are schematic views showing the nitride semiconductor layer according to the third embodiment.

Embodiments of the present invention will be described below with reference to the drawings.
The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between the parts, and the like are not necessarily the same as actual ones. Further, even when the same part is represented, the dimensions and ratios may be represented differently depending on the drawings.
Note that, in the present specification and each drawing, the same elements as those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description thereof is omitted as appropriate.

(First embodiment)
The present embodiment relates to a method for manufacturing a nitride semiconductor layer. The nitride semiconductor layer according to the embodiment is used in semiconductor devices such as a semiconductor light emitting element, a semiconductor light receiving element, and an electronic device. The semiconductor light emitting element includes, for example, a light emitting diode (LED) and a laser diode (LD). The semiconductor light receiving element includes a photodiode (PD) and the like. The electronic device includes, for example, a high electron mobility transistor (HEMT), a heterojunction bipolar transistor (HBT), a field transistor (FET), a Schottky barrier diode (SBD), and the like.

First, an example of the configuration of the nitride semiconductor layer according to the embodiment will be described.
FIG. 1A to FIG. 1C are schematic views illustrating the nitride semiconductor layer according to the first embodiment.
FIG. 1A is a schematic cross-sectional view illustrating the configuration of a nitride semiconductor layer according to this embodiment. FIG. 1B is a graph illustrating the _Al composition ratio (C _Al ) in the nitride semiconductor layer. FIG. 1C is a graph illustrating the a-axis lattice spacing Ld in the nitride semiconductor layer.

  As illustrated in FIG. 1A, the nitride semiconductor layer 310 according to the embodiment includes a first stacked body 61 provided on the main surface 40 a of the substrate 40. The first stacked body 61 includes a first lower layer 61a provided on the main surface 40a and a first upper layer 61b provided on the first lower layer 61a. A nitride semiconductor is used as the first lower layer 61a and the first upper layer 61b.

  In this example, the buffer layer 70 is provided on the main surface of the substrate 40, and the first stacked body 61 is provided on the buffer layer 70.

  A direction perpendicular to the main surface 40a is taken as a Z-axis direction. The Z-axis direction is parallel to the direction from the first lower layer 61a toward the first upper layer 61b. One axis perpendicular to the Z axis is taken as the X axis. A direction perpendicular to the Z axis and the X axis is taken as a Y axis. The functional layer 10 is stacked with the first stacked body 61 along the Z axis.

  In this specification, the state of “provided on” includes not only the case of being provided in direct contact but also the case of being provided with another element inserted therebetween. The state of “stacked” includes not only the case of being stacked in direct contact but also the case of being stacked with another element inserted therebetween.

  For example, a silicon substrate is used as the substrate 40. The silicon substrate is, for example, a Si (111) substrate. However, in the embodiment, the plane orientation of the silicon substrate may not be the (111) plane. As the substrate 40, for example, a silicon substrate having a plane orientation represented by (11n) (n: integer) or a (100) plane can be used. The use of a (110) plane silicon substrate is preferable because lattice mismatch between the silicon substrate and the nitride semiconductor layer is reduced.

  The substrate 40 may be a substrate including an oxide layer. For example, a silicon on insulator (SOI) substrate or the like can be used as the substrate 40. As the substrate 40, a substrate having a material whose lattice constant is different from that of the functional layer 10 can be used. As the substrate 40, a substrate containing a material having a thermal expansion coefficient different from that of the functional layer 10 can be used. For example, the substrate 40 may be a sapphire, spinel, GaAs, InP, ZnO, Ge, SiGe, or SiC substrate.

  In the nitride semiconductor device using the nitride semiconductor layer according to the embodiment, the substrate 40, the buffer layer 70, the first stacked body 61, and a part of the functional layer 10 are used. There is a case.

As the buffer layer 70, for example, an AlN layer 71 is used. The thickness of the AlN layer 71 is preferably 20 nanometers (nm) or more and 400 nm or less, for example, about 100 nm. By using AlN, which hardly causes chemical reaction with silicon of the substrate 40, in a portion of the buffer layer 70 that is in contact with the substrate 40, problems such as meltback etching caused by the reaction between silicon and gallium can be easily solved.
For example, when the AlN layer 71 is used, the growth temperature of the buffer layer 70 is preferably 500 ° C. or higher and 1300 ° C. or lower. More preferably, it is 600 degreeC or more and 1200 degrees C or less.

As illustrated in FIG. 1B, for example, Al _x1 Ga _1-x1 N (0 <x1 <1) is used for the first lower layer 61 a of the first stacked body 61. Hereinafter, in order to simplify the description, the notation “AlGaN” may be used as appropriate for Al _x1 Ga _1-x1 N (0 <x1 <1).

  For the first upper layer 61b of the first stacked body 61, for example, GaN is used. The Al composition ratio in the first upper layer 61b is lower than the Al composition ratio in the first lower layer 61a. For example, the first upper layer 61b substantially does not contain Al.

  The thickness of the first lower layer 61a is preferably 100 nm or more and 500 nm or less, for example, about 250 nm. The Al composition ratio (x1) in the first lower layer 61a is preferably, for example, 0.1 or more and 0.9 or less. More preferably, it is 0.2 or more and 0.6 or less, for example, 0.25. The Al composition ratio is the ratio of the number of Al element atoms to the number of Group III element atoms. The first lower layer 61a can increase the effect of suppressing meltback etching.

  The lattice spacing of the first axis (for example, the a axis) in the XY plane of the first lower layer 61a (AlGaN layer) is the same as the lattice spacing of the first axis of the AlN layer 71 or the first axis of the AlN layer 71. Greater than lattice spacing. The lattice spacing of the first axis (for example, a axis) of the first lower layer 61a (AlGaN layer) is smaller than the unstrained lattice spacing (lattice constant) of the first lower layer 61a (AlGaN layer). Thereby, compressive strain (stress) is formed in the first lower layer 61a (AlGaN layer). This reduces the tensile stress caused by the difference in thermal expansion coefficient between the nitride semiconductor layer and the substrate 40 (silicon substrate) in the temperature lowering process after crystal growth of the nitride semiconductor layer, and suppresses the generation of cracks. it can.

  When a plurality of nitride semiconductor layers having different compositions from each other are stacked, the nitride semiconductor layer (for example, the first upper layer 61b) to be stacked is the nitride semiconductor layer (for example, the first lower layer 61a) formed below. ) To match the grid length. For this reason, the actual lattice length of the nitride semiconductor layer is different from the unstrained lattice length (lattice constant).

  In the present specification, the length of an unstrained lattice of a nitride semiconductor is defined as “lattice constant”. The actual lattice length of the formed nitride semiconductor layer is defined as “lattice spacing”. The lattice constant is, for example, a physical property constant. The lattice spacing is, for example, an actual lattice length in the nitride semiconductor layer included in the formed nitride semiconductor element. The lattice spacing is obtained from, for example, X-ray diffraction measurement.

  As shown in FIG. 1C, the lattice spacing Ld (first lattice spacing) in the first lower layer 61a (AlGaN layer) is, for example, the length (lattice constant) dg of unstrained GaN lattice. It has a value between the lattice length (lattice constant) da of strained AlN.

  The thickness of the first upper layer 61b is preferably 200 nm or more and 2000 nm or less, for example, 1000 nm. The lattice spacing Ld (second lattice spacing) of the first upper layer 61b is the same as or larger than the first lattice spacing.

  At least a part of the first upper layer 61b has a compressive strain. For example, at least the lower part of the first upper layer 61b (the part on the first lower layer 61a side) has compressive strain. As will be described later, when the thickness of the first upper layer 61b is thick, the upper portion of the first upper layer 61b may not have compressive strain.

  A first upper layer 61b having a lattice constant (second lattice constant) larger than the first lattice spacing of the first lower layer 61a is formed on the first lower layer 61a so as to match the lattice spacing of the first lower layer 61a as much as possible. Thus, compressive strain (stress) is likely to occur during crystal growth of the first stacked body 61. Thereby, generation | occurrence | production of a crack can be suppressed.

  However, during crystal growth of the first upper layer 61b, lattice relaxation occurs as the thickness of the first upper layer 61b increases, and the lattice spacing of the first upper layer 61b approaches the lattice constant of the unstrained first upper layer 61b. That is, the lattice spacing (second lattice spacing) of the first upper layer 61b is larger than the lattice spacing of the first lower layer 61a. When the lattice spacing (second lattice spacing) of the first upper layer 61b is substantially equal to the lattice constant of the first upper layer 61b, compressive stress applied to the first upper layer 61b is generated even if the thickness is further increased. Therefore, it is easily affected by tensile strain (stress) received from the substrate 40 (silicon substrate). Therefore, the thickness of the first upper layer 61b is such that the lattice spacing (second lattice spacing) of the first upper layer 61b on the first axis (for example, the a axis) in the XY plane is larger than the lattice constant of the first upper layer 61b. It is preferable that the thickness be equal to or less than a thickness that can maintain a small state.

As shown in FIG. 1A, when the nitride semiconductor layer 310 is a light emitting element, the functional layer 10 includes, for example, a first semiconductor layer 11 of a first conductivity type (for example, n-type), A second semiconductor layer 12 of two conductivity types (for example, p-type), and a light emitting layer 13 provided between the first semiconductor layer 11 and the second semiconductor layer 12. The light emitting layer 13 includes a plurality of GaN barrier layers and an InGaN (for example, In _0.15 Ga _0.85 N) layer provided between the barrier layers. The light emitting layer 13 has an MQW (Multi-Quantum Well) structure or an SQW (Single-Quantum Well) structure. The thickness of the functional layer 10 is preferably 1 micrometer (μm) or more and 5 μm or less, for example, about 3.5 μm.

The nitride semiconductor layer 310 can be used, for example, in a gallium nitride (GaN) -based HEMT (High Electron Mobility Transistor) nitride semiconductor element. At this time, the functional layer 10 includes, for example, an undoped Al _z1 Ga _{1 -z1} N (0 ≦ z1 ≦ 1) layer that does not contain impurities and an undoped or n-type Al _z2 Ga _{1 -z2} N (0 ≦ z2). ≦ 1, z1 <z2) layers. In this case, the thickness of the functional layer 10 is preferably about 10 nm or more and 1000 nm or less, for example, 50 nm, for example.

  Further, a GaN layer 11i (for example, an undoped GaN layer) may be further provided on the first stacked body 61 (for example, between the first stacked body 61 and the functional layer 10). By providing the GaN layer 11i (undoped GaN layer), compressive strain (stress) is formed in the GaN layer 11i, and cracks are further suppressed.

FIG. 2 is a flowchart illustrating the method for manufacturing the nitride semiconductor layer according to the first embodiment.
The method for manufacturing a nitride semiconductor layer according to this embodiment includes a step of forming the first stacked body 61.
As shown in FIG. 2, the step of forming the first stacked body 61 includes a nitride having a first axis first lattice interval parallel to the main surface 40 a on the main surface 40 a of the substrate 40. A process of forming the first lower layer 61a of the semiconductor (step S110), and the second lattice spacing of the first axis larger than the first lattice spacing is provided on the first lower layer 61a, and at least a part thereof has compressive strain. And a process of forming the first upper layer 61b of nitride semiconductor (step S120). Thereby, the 1st laminated body 61 containing the 1st lower layer 61a and the 1st upper layer 61b is formed.

  At this time, the ratio of the difference between the second lattice spacing and the first lattice spacing to the first lattice spacing is defined as a lattice mismatch ratio LM (first lattice mismatch ratio LM1) in the first stacked body 61. In the embodiment, the absolute value of the lattice mismatch rate LM is 0.005 or more and 0.019 or less.

  The formation of the first upper layer 61b (step S120) is performed by setting the growth rate (lateral growth rate) of the first upper layer 61b in the direction parallel to the main surface 40a to the first in the direction perpendicular to the main surface 40a. The growth rate (vertical growth rate) of the upper layer 61b is set larger. In the formation of the first upper layer 61b (step S120), the first upper layer 61b is formed while applying a compressive stress based on the difference between the second lattice spacing and the first lattice spacing to the first upper layer 61b.

  Thereby, the high quality nitride semiconductor layer which suppressed generation | occurrence | production of a crack can be manufactured. This configuration is based on a phenomenon found by an original experiment conducted by the present inventor. Hereinafter, this experiment will be described.

  In this experiment, a nitride semiconductor layer is used for the nitride semiconductor element 110. The nitride semiconductor device 110 has the configuration described with reference to FIGS. Hereinafter, a method for manufacturing a nitride semiconductor layer used for the nitride semiconductor element 110 will be specifically described.

The silicon substrate 40 is processed by organic cleaning and acid cleaning, and the substrate 40 is introduced into the reaction chamber of the MOCVD apparatus. After heating the temperature of the substrate 40 to 1080 ° C., an AlN layer 71 is formed using trimethylaluminum (TMAl) and ammonia (NH ₃ ) in an atmosphere containing nitrogen and hydrogen at a growth pressure of 400 hPa. The supply amount of NH ₃ is 1 L / min, and the supply amount of TMAl is 25 cc / min. The thickness of the AlN layer 71 is about 100 nm.

The temperature of the substrate 40 is set to 1050 ° C., and an AlGaN layer serving as the first lower layer 61a is formed using trimethylaluminum (TMGa), TMAl, and ammonia in an atmosphere containing nitrogen and hydrogen at a growth pressure of 400 hPa. In this experiment, the Al composition ratio in the AlGaN layer was changed. For example, when the Al composition ratio is 0.25, the supply amount of TMAl is 25 cc / min, and the supply amount of TMGa is 18 cc / min. The total supply amount of TMAl and TMGa was kept constant, and the ratio of TMAl and TMGa was changed to change the Al composition ratio. The supply amount of NH ₃ is 2.5 L / min. The thickness of the AlGaN layer is about 250 nm.

A GaN layer to be the first upper layer 61b is formed using TMGa and ammonia at a growth pressure of 1013 hPa in an atmosphere containing nitrogen and hydrogen at a temperature of the substrate 40 of 1090 ° C. The supply amount of NH ₃ is 20 L / min, and the supply amount of TMGa is 47 cc / min. The ratio of ammonia as the group V source gas to TMGa as the group III source gas, that is, the V / III ratio is 3900. The V / III ratio is a ratio of the number of group V element atoms supplied per unit time to the number of group III element atoms supplied per unit time. The thickness of this GaN layer is about 550 nm.

  In this experiment, the lattice mismatch ratio LM between the first lower layer 61a and the first upper layer 61b was changed by changing the Al composition ratio in the AlGaN layer serving as the first lower layer 61a. Furthermore, a sample was produced in which the V / III ratio during the formation of the GaN layer to be the first upper layer 61b was changed. That is, in the growth of the GaN layer to be the first upper layer 61b, the flow rate of TMGa, which is a group III source gas, is constant at 18 cc / min, and the flow rate of ammonia is set to 5, 10, 20, 40 L / min. A GaN layer was formed. At this time, the ratio of ammonia to TMGa, that is, the V / III ratio is 980, 1950, 3900, and 7800, respectively.

  Then, the lattice mismatch ratio LM of these samples and the curvature (warpage) of the substrate (sample) were evaluated. The lattice mismatch ratio LM in the AlGaN layer and the GaN layer was calculated from reciprocal lattice mapping measurement by X-ray diffraction. The warpage of the substrate (sample) was measured during film formation by an optical monitor.

FIG. 3 is a graph illustrating characteristics of the nitride semiconductor layer.
FIG. 3 shows an example of experimental results. FIG. 3 shows an example of a change in the curvature (warpage) of the substrate when the first upper layer 61b (GaN layer) is formed on the first lower layer 61a (AlGaN layer). In this example, the results of three samples (first sample SP01 to third sample SP03) in which the V / III ratio is constant at 3900 and the Al composition ratio in the first lower layer 61a (AlGaN layer) is changed are shown. ing.

  In the first sample SP01, the lattice mismatch factor LM is 0.024. In the second sample SP02, the lattice mismatch factor LM is 0.019. In the third sample SP03, the lattice mismatch factor LM is 0.009.

The horizontal axis in FIG. 3 is the thickness t _GaN (nm) of the first upper layer 61b (GaN layer). The thickness t _GaN (nm) corresponds to the passage of time for crystal growth of the first upper layer 61b (GaN layer). The vertical axis represents the curvature Cv (km ⁻¹ ) of the substrate, which substantially corresponds to the warp of the substrate. The curvature Cv is a value measured by an optical monitor during crystal growth of the first upper layer 61b (GaN layer). The curvature Cv is normalized by setting the curvature (warpage) of the substrate 40 at the start of crystal growth of the GaN layer to zero. When the curvature Cv is positive, the substrate 40 is convex downward (concave warp). When negative, the substrate 40 is convex upward (convex warpage). The state where the curvature Cv is positive corresponds to the warp of the substrate 40 due to the tensile stress applied to the nitride semiconductor layer. The state in which the curvature Cv is negative corresponds to the warp of the substrate 40 due to the compressive stress applied to the nitride semiconductor layer.

As shown in FIG. 3, in the first sample SP01 (lattice mismatch ratio LM is 0.024), when the thickness t _GaN is increased from 0 nm to 50 nm (point P1), the curvature Cv is negative and its absolute value. Becomes larger. When the thickness t _GaN is 50 nm to 150 nm, the rate of change of the curvature Cv becomes small, and the curve of the curvature Cv becomes almost horizontal. When the thickness t _GaN exceeds 150 nm, the curvature Cv increases in absolute value in the positive direction, and changes to a convex warp downward. That is, tensile stress is formed in the GaN layer as it grows.

In the second sample SP02 (lattice mismatch ratio LM is 0.019), in the region of the thickness _{t GaN} is 0Nm～100nm (point P2), when the thickness _{t GaN} increases, the curvature Cv is the absolute value is negative Becomes larger. When the thickness t _GaN is 100 nm to 400 nm, the change rate of the curvature Cv is small, and the curve of the curvature Cv is almost horizontal. When the thickness t _GaN exceeds 400 nm, the curvature Cv increases in the positive direction.

In the third sample SP03 (lattice mismatch ratio LM 0.009), in the region of the thickness _{t GaN} is 0Nm～500nm (point P3), when the thickness _{t GaN} increases, the curvature Cv is the absolute value is negative Becomes larger. The change rate (decrease rate) of the curvature Cv is larger than that of the second sample SP02. When the thickness t _GaN exceeds 500 nm, the change rate of the curvature Cv is small, and the curve of the curvature Cv becomes almost horizontal.

Thus, the characteristic of the change in curvature Cv differs depending on the sample. The thickness t _GaN (point P1, point P2, and point P3) at which the curve of the curvature Cv becomes horizontal is the thickness at which no compressive stress is applied to the GaN layer in the sample. In this way, the thickness when compressive stress is no longer applied to the GaN layer is defined as “maximum thickness of compressive stress applied” tc (nm). The compression stress applied maximum thickness tc in each of the first sample SP01, the second sample SP02, and the third sample SP03 is 50 nm, 100 nm, and 500 nm, respectively.
In this way, the maximum compressive stress applied thickness tc is obtained for each sample.

FIG. 4 is a graph illustrating characteristics of the nitride semiconductor layer.
FIG. 4 illustrates the relationship between the compression stress applied maximum thickness tc of the fabricated sample and the lattice mismatch ratio LM between the AlGaN layer and the GaN layer.
The horizontal axis in FIG. 4 is the lattice mismatch ratio LM, and the vertical axis is the compressive stress application maximum thickness tc. FIG. 4 shows the case where the Al composition ratio in the AlGaN layer serving as the first lower layer 61a is changed and the V / III ratio during the formation of the GaN layer serving as the first upper layer 61b is changed to 980, 1950, 3900, and 7800. The results are shown. By changing the Al composition ratio in the AlGaN layer, the lattice mismatch ratio LM has different values. However, the lattice mismatch factor LM is a value related to the lattice spacing in the actually formed layer. That is, when the Al composition ratio is 0.25, the lattice mismatch factor LM when the AlGaN layer and the GaN layer have an unstrained lattice spacing (lattice constant) is about 0.006. The lattice mismatch factor LM of the sample is about 0.009. As described above, when a plurality of nitride semiconductor layers having different compositions are stacked, the nitride semiconductor layer stacked on top matches the lattice length of the nitride semiconductor layer formed below. It is because it forms so that. The lattice mismatch factor LM depends on the film forming conditions in addition to the Al composition ratio in the AlGaN layer. The condition that the lattice mismatch factor LM is 0.024 corresponds to the case where an AlN layer is used as the first lower layer 61a (that is, the Al composition ratio of the first lower layer 61a is 1).

As can be seen from FIG. 4, when the lattice mismatch ratio LM is large, the maximum compressive stress applied thickness tc is small. This is considered to be because the lattice relaxation of the GaN layer easily occurs when the lattice mismatch factor LM increases, and the lattice relaxation easily occurs even when the GaN layer is thin. On the other hand, when the lattice mismatch ratio LM is small, the maximum compressive stress applied thickness tc is large. Since the lattice mismatch ratio LM hardly occurs lattice relaxation small the Most GaN layer, it is considered to be thick GaN layer is because the lattice relaxation does not occur.

  Thus, it is natural that the maximum compressive stress applied thickness tc tends to be inversely proportional to the lattice mismatch ratio LM. That is, it is natural that the product of the compressive stress application maximum thickness tc and the lattice mismatch ratio LM is substantially constant.

  At this time, it can be seen from FIG. 4 that the relationship between the compressive stress application maximum thickness tc and the lattice mismatch ratio LM changes depending on the crystal growth conditions of the GaN layer (in this example, the V / III ratio). It was.

  For example, when the Al composition ratio in the first lower layer 61a (AlGaN layer) is 0.25, the lattice mismatch factor LM corresponds to 0.009. The maximum compressive stress applied thickness tc when the lattice mismatch factor LM is about 0.009 is about 200 nm when the V / III ratio is 980, and is about 250 nm when the V / III ratio is 1950. When the / III ratio is 3900, it is about 350 nm to about 500 nm, and when the V / III ratio is 7800, it is about 600 nm.

  As described above, the relationship between the maximum compressive stress applied thickness tc and the lattice mismatch ratio LM changes depending on the crystal growth conditions of the GaN layer, which is a characteristic found for the first time in this experiment. By appropriately controlling the crystal growth conditions of the GaN layer, the maximum compressive stress applied thickness tc can be increased even if the lattice mismatch ratio LM is constant. Then, by increasing the compressive stress application maximum thickness tc, it is possible to form a GaN layer having a necessary thickness in a state where compressive stress is applied. The occurrence of cracks is suppressed by weakening the tensile stress generated by the difference in thermal expansion coefficient between the silicon substrate and the GaN layer by the compressive stress applied to the GaN layer. For example, cracks can be effectively suppressed by making the compressive stress of the GaN layer larger than the tensile stress generated by the difference in thermal expansion coefficient between the silicon substrate and the GaN layer.

  For example, when the composition ratio of Al in the first lower layer 61a (AlGaN layer) is 0.25 (lattice mismatch factor LM is 0.009), in the samples with a V / III ratio of 980 and 1950, these Cracks occurred on the surface of the sample. In this sample, the thickness of the first upper layer 61b (GaN layer) (about 550 nm is significantly greater than the compressive stress applied maximum thickness tc (about 200 nm, about 250 nm) in the samples having a V / III ratio of 980 and 1950. For this reason, it is considered that sufficient compressive stress cannot be formed in the GaN layer, and tensile stress is applied to the GaN layer due to the difference in thermal expansion coefficient between the silicon substrate and the GaN layer, and cracks are generated.

  On the other hand, when the Al composition ratio in the first lower layer 61a (AlGaN layer) is 0.25 (lattice mismatch factor LM is 0.009), the samples with V / III ratio of 3900 and 7800 have cracks. Did not occur. In these samples, the thickness (about 550 nm) of the first upper layer 61b (GaN layer) does not greatly exceed the maximum compressive stress applied thickness tc (about 350 nm to about 500 nm, about 600 nm) of these samples. For this reason, the tensile stress is not substantially applied to the GaN layer, and it is considered that no crack was generated.

  For example, when the Al composition ratio in the first lower layer 61a (AlGaN layer) is 0.5, the lattice mismatch factor LM corresponds to about 0.011. The maximum compressive stress applied thickness tc at this time is about 200 nm when the V / III ratio is 980, about 280 nm when the V / III ratio is 1950, and about 300 nm when the V / III ratio is 3900. When the V / III ratio is 7800, it is about 500 nm. When cracks of these samples were evaluated, cracks occurred in the samples having a V / III ratio of 980, and no cracks occurred in the other samples. On the other hand, it was found that when the V / III ratio is as large as 9700, cracks do not occur, but defects are formed in the silicon substrate and the crystal quality of the GaN layer may be degraded. This is probably because the silicon substrate was damaged because the compressive stress formed in the GaN layer was too large.

  That is, if the compressive stress of the GaN layer is too small, a tensile stress is applied to the GaN layer after crystal growth and a crack is generated. If the compressive stress of the GaN layer is too large, tensile stress is applied to the silicon substrate after crystal growth, causing damage to the silicon substrate.

  As described above, regarding the conditions for crystal growth of the GaN layer, it was found that the thickness of the GaN layer capable of forming compressive stress increases as the ammonia flow rate increases, that is, the V / III ratio increases. Increasing the V / III ratio increases the effect of suppressing cracks.

  As shown in FIG. 4, the degree of change in the relationship between the compressive stress applied maximum thickness tc and the lattice mismatch factor LM depending on the crystal growth conditions of the GaN layer is as follows. Get smaller. For example, the difference in the compressive stress application maximum thickness tc due to the difference in V / III ratio is remarkable in the region R02 in which the lattice mismatch ratio LM is 0.005 or more and 0.02 or less. Even in the region R02, when the lattice mismatch ratio LM increases, the difference in the compressive stress applied maximum thickness tc due to the difference in the V / III ratio decreases. The curve of the relationship between the compressive stress applied maximum thickness tc and the lattice mismatch factor LM tends to converge to a point where the lattice mismatch factor LM is 0.024 (when the first lower layer 61a is an AlN layer). . For example, in the region R03 where the lattice mismatch factor LM exceeds 0.02, the relationship between the compressive stress applied maximum thickness tc and the lattice mismatch factor LM does not substantially change depending on the crystal growth conditions of the GaN layer. Conceivable.

  In the embodiment, in order to form a necessary compressive stress, an AlGaN layer having a necessary Al composition ratio (an AlGaN layer for forming a necessary lattice mismatch factor LM) is formed and then formed thereon. By performing crystal growth of the GaN layer under appropriate conditions, the maximum thickness tc of compressive stress application is increased, and the generation of cracks is suppressed. Therefore, the lattice mismatch ratio LM of the region R02 in which the relationship between the maximum compressive stress applied thickness tc and the lattice mismatch ratio LM changes depending on the crystal growth conditions of the GaN layer is adopted. If the lattice mismatch ratio LM of the region R03 is adopted, the relationship between the maximum thickness tc of compressive stress applied and the lattice mismatch ratio LM does not substantially change depending on the crystal growth conditions of the GaN layer. Even if the conditions are appropriate, the effect of increasing the maximum compressive stress application thickness tc cannot be obtained, and therefore cracks cannot be sufficiently suppressed.

FIG. 5 is a graph illustrating characteristics of the nitride semiconductor layer.
FIG. 5 shows substrates in samples having a lattice mismatch ratio LM of 0.009 (Al composition ratio of the AlGaN layer is 0.25) and V / III ratios during crystal growth of the GaN layer of 980, 1950, 3900, and 7800. A curvature Cv (warp) of 40 is shown. The horizontal axis in FIG. 5 represents the thickness t _GaN of the first upper layer 61b (GaN layer). The vertical axis represents the curvature Cv of the substrate. FIG. 5 shows the transition of the warp of the substrate 40 during the crystal growth of the first upper layer 61b (GaN layer). The curvature Cv is normalized with the curvature (warpage) of the substrate 40 at the start of crystal growth of the GaN layer being zero.

As shown in FIG. 5, when the V / III ratio increases, the curvature Cv (warpage) of the substrate 40 during the formation of the GaN layer increases. In this case, the thickness _{t GaN} is about 40nm below the region R11, the thickness _{t GaN} is more than about 40nm region R12, in a different behavior can be seen. For example, when the V / III ratio is 7800, the slope of the curvature Cv in the region R11 where the thickness t _GaN is less than about 40 nm is steep. The slope of the curvature Cv in the region R12 where the thickness t _GaN is about 40 nm or more is gentle. Other V / III ratios show the same tendency.

  That is, when the thickness of the GaN layer is thin at the initial stage of growth of the GaN layer (for example, less than about 40 nm), the absolute value of the curvature Cv increases rapidly as the thickness increases. Thereafter, when the thickness exceeds a certain thickness (for example, 40 nm or more), the change in the curvature Cv becomes gentle.

  For example, at the initial stage of growth of the GaN layer, some influence of the underlying AlGaN layer is large, and when the thickness exceeds a certain level, the influence of the AlGaN layer is considered to be small. That is, it is conceivable that a phenomenon (first phenomenon) that occurs in the early stage of growth of the GaN layer is different from a phenomenon that occurs thereafter (second phenomenon).

  In the region R03 shown in FIG. 4 (lattice mismatch ratio LM is greater than 0.02), the maximum thickness tc applied with compressive stress is small, so the first phenomenon that occurs at the early stage of growth of the GaN layer is considered to be dominant. . In the region R02 (lattice mismatch rate LM is 0.02 or less), the second phenomenon that occurs thereafter is considered to be dominant. In the embodiment, the occurrence of cracks is effectively suppressed by applying the region R02 in which the second phenomenon occurs.

  Further, in FIG. 4, when the lattice mismatch ratio LM is excessively small (for example, the region R01 less than 0.005), in order to accumulate the compressive stress necessary for suppressing cracks, the GaN layer is used. It needs to be too thick. If it is too thick, for example, the crystallinity will be adversely affected. For this reason, in the embodiment, the lattice mismatch ratio LM is set to 0.005 or more as a condition for accumulating necessary compressive stress without excessively thickening the GaN layer. That is, in the method for manufacturing a nitride semiconductor layer according to the embodiment, the lattice mismatch factor LM is employed in the range of 0.005 to 0.020. It is further preferable that the lattice mismatch ratio LM is 0.015 or less.

  Further, FIG. 5 shows the warpage of the substrate during the crystal growth (cancellation curvature Cv0) necessary for canceling the warpage of the substrate that occurs in the temperature lowering process after the crystal growth.

As shown in FIG. 5, the curvature Cv with the V / III ratio of 980 is above the dotted line of the cancel curvature Cv0. The curvature Cv having a V / III ratio of 1950 is at the same level as the dotted line of the cancel curvature Cv0. However, when the thickness t _GaN is about 250 nm or more, the curvature Cv becomes the upper side and reverses. On the other hand, the curvature Cv when the V / III ratio is 3900 or 7800 is lower than the cancel curvature Cv0.

  When the curvature Cv is below the cancel curvature Cv0, the warpage of the substrate that occurs in the temperature lowering process after crystal growth can be sufficiently canceled. On the other hand, when the curvature Cv is above the cancel curvature Cv0, the warpage of the substrate that occurs in the temperature lowering process after crystal growth cannot be canceled. For this reason, it is considered that cracks occurred in samples having V / III ratios of 980 and 1950.

  Thus, cracks can be effectively suppressed by setting the curvature Cv of the substrate 40 during crystal growth of the GaN layer to be lower than the cancel curvature Cv0.

  As a result of observing the surface of the manufactured element with a microscope, cracks can be effectively suppressed when the product of the lattice mismatch ratio LM and the maximum compressive stress applied thickness tc is 3 or more. Note that the value of this product is a scale representing the magnitude of the product of the lattice mismatch rate LM and the compressive stress.

  Further, when the maximum compressive stress applied thickness tc is 250 nm or more, when a practical GaN layer is formed, the product of the lattice mismatch rate and the maximum compressive stress applied thickness is greater than 3, and the lattice mismatch rate And the effect of suppressing cracks is great.

  A phenomenon in which the maximum thickness tc of compressive stress application during GaN layer formation is increased by increasing the V / III ratio will be described.

FIG. 6A to FIG. 6D are graphs illustrating characteristics of the nitride semiconductor layer.
These figures show reflection during growth of the AlGaN layer and the GaN layer when the GaN layer (first upper layer 61b) is formed on the AlGaN layer (first lower layer 61a) having an Al composition ratio of 0.25. An example of a spectrum is shown. FIGS. 6A, 6B, 6C, and 6D correspond to the cases where the V / III ratio in the growth of the GaN layer is 980, 1950, 3900, and 7800, respectively. . The horizontal axis in these figures is the growth time t (seconds). The vertical axis represents the reflection intensity Rf (arbitrary scale) of the GaN layer with respect to laser light having a wavelength of 405 nm.

  As can be seen from FIG. 6A, when the V / III ratio is 980, the reflection intensity Rf decreases to almost zero at the initial stage of formation of the GaN layer (first upper layer 61b), and thereafter, the reflection intensity Rf increases with growth. Has increased. The minimum value of the reflection intensity Rf at the initial stage of formation is about 0.02.

  As can be seen from FIGS. 6B to 6D, the minimum value of the reflection intensity Rf at the initial stage of the formation of the GaN layer increases as the V / III ratio increases. For example, when the V / III ratio is 1950, the minimum value of the reflection intensity Rf is about 0.02, and when the V / III ratio is 3900, the minimum value of the reflection intensity Rf is about 0.07. When the V / III ratio is 7800, the minimum value of the reflection intensity Rf is about 0.09. And after the minimum of the reflection intensity Rf at the initial stage of formation of the GaN layer, it was found that the amplitude of the reflection intensity Rf increases as the V / III ratio increases.

  The reflection intensity Rf varies depending on the flatness of the crystal surface. When the crystal surface has large irregularities, the reflection intensity Rf decreases. It is considered that the flatter the film, the larger the amplitude of the reflection intensity Rf, and the clear interference vibration depending on the growth film thickness appears.

  When the V / III ratio is as small as 1950 or less, the minimum value of the reflection intensity Rf at the initial stage of growth of the GaN layer is low, so that it is considered that the unevenness of the crystal surface is large at the initial stage of growth. Even at the stage of growth, it is considered that the surface is not so flat. When the V / III ratio is as small as 1950 or less, it is considered that the growth rate in the stacking direction is higher than the growth rate in the direction parallel to the crystal surface in the growth of the GaN layer.

  On the other hand, when the V / III ratio is as large as 3900 or more, the minimum value of the reflection intensity Rf at the initial stage of growth of the GaN layer is large, and the crystal surface is relatively flat even at the initial stage of growth. It is thought that. When the V / III ratio is as large as 3900 or more, it is considered that in the growth of the GaN layer, the growth rate in the direction parallel to the crystal surface is higher than the growth rate in the stacking direction.

  Regardless of the V / III ratio, the center value of the amplitude of the reflection spectrum when the GaN layer is formed increases as the growth time t increases. The case where the center value of the amplitude of the reflection intensity Rf is about 0.2 corresponds to the case where the surface of the crystal becomes substantially flat.

FIG. 7 is a graph illustrating characteristics of the nitride semiconductor layer.
FIG. 7 shows a reflection spectrum extracted when the GaN layer (first upper layer 61b) is formed from the reflection spectra shown in FIGS. 6A to 6D, and the horizontal axis indicates the thickness of the GaN layer. It is the figure made into _tGaN (nm). The vertical axis represents the reflection intensity Rf.

As shown in FIG. 7, when the V / III ratio is 980, the central value of the amplitude of the reflection intensity Rf becomes 0.2 when the GaN layer thickness t _GaN is about 300 nm. That is, when the GaN layer is formed to 300 nm, a flat crystal surface is formed.
When the V / III ratio is 1950, the central value of the amplitude of the reflection intensity Rf is 0.2 when the thickness t _GaN is about 280 nm. At this thickness, the flat crystal surface is It is formed.
When the V / III ratio is 3900, the central value of the amplitude of the reflection intensity Rf is 0.2 when the thickness t _GaN is about 250 nm. At this thickness, the flat crystal surface is It is formed.
When the V / III ratio is 7800, the central value of the amplitude of the reflection intensity Rf is 0.2 when the thickness t _GaN is about 100 nm. At this thickness, the flat crystal surface is It is formed.

  As already explained, when the ratio of Al composition is 0.25, when the V / III ratio is 3900 or more, a nitride semiconductor layer without cracks was obtained. From this result, it is considered that the thickness until flattening greatly affects the formation of cracks in GaN layer formation. By forming a flat surface with a film thickness of 250 nm or less, the formation of cracks can be suppressed.

  FIG. 8A to FIG. 8D are schematic cross-sectional views illustrating characteristics of the nitride semiconductor layer. These drawings are schematic diagrams illustrating an example of a growth process when a GaN layer (first upper layer 61b) is grown on an AlGaN layer (first lower layer 61a). FIG. 8A shows an initial growth state when the V / III ratio is small (for example, the V / III ratio is 980). FIG. 8B shows a state where the growth has progressed when the V / III ratio is small. FIG. 8C shows an initial growth state when the V / III ratio is large (for example, the V / III ratio is 3900). FIG. 8D shows a state in which the growth has progressed when the V / III ratio is large.

  As shown in FIG. 8A, when the V / III ratio is small, as described above, the growth rate in the stacking direction is higher than the growth rate in the direction parallel to the crystal surface. Concavities and convexities made of a plurality of microcrystals 66 having a small diameter are formed.

  As shown in FIG. 8B, with the growth, the formed crystals are united, and the planarization proceeds. Thereby, the reflection intensity Rf increases.

  On the other hand, as shown in FIG. 8C, when the V / III ratio is large, the growth rate in the direction parallel to the crystal surface is larger than the growth rate in the stacking direction. Large crystals 67 are formed. As a result, the unevenness becomes smaller than when the V / III ratio is small. For this reason, the decrease in the reflection intensity Rf at the initial stage of growth is small.

  Then, as shown in FIG. 8D, the flattening of the crystal surface proceeds rapidly, and a flat surface is easily obtained in the thin GaN layer. For this reason, the amplitude of the interference vibration of the reflection intensity Rf increases.

  When the microcrystals 66 are combined, the crystals attract each other, so that a tensile stress 68 is generated. The substrate in forming the nitride semiconductor layer by the sum of the tensile stress 68 and the compressive stress generated by the difference in lattice spacing between the AlGaN layer and the GaN layer (that is, the product of the lattice mismatch rate and the film thickness) The curvature (amount of warping) is determined.

  When the V / III ratio is small (for example, 980), the density of the microcrystals 66 is high and the height of the microcrystals 66 is high. For this reason, a large tensile stress 68 is formed at the boundary between the microcrystals 66. The compressive stress generated by the difference in lattice spacing between the AlGaN layer and the GaN layer is reduced by the tensile stress generated by the combination of crystals. For this reason, the tensile stress (strain) generated in the temperature lowering process after the end of crystal growth becomes larger, and cracks are likely to occur.

  On the other hand, when the V / III ratio is large (for example, 3900), the density of the crystal 67 becomes low and the height of the crystal 67 is low. For this reason, the area of the crystal interface is reduced, and the tensile stress 68 generated when the GaN layer is formed is reduced. As a result, the compressive stress caused by the difference in lattice spacing between the AlGaN layer and the GaN layer (lattice mismatch rate LM) becomes relatively large. For this reason, a compressive stress sufficiently larger than the tensile stress generated in the temperature lowering process after the end of crystal growth can be accumulated. In this case, the convex warpage can be increased in a high temperature state after completion of the growth. And even if tensile stress (strain) acts in the temperature lowering process after the end of crystal growth, cracks hardly occur.

  In the embodiment, the growth rate in the direction parallel to the crystal surface of the GaN layer is made larger than the growth rate in the stacking direction using a condition where the V / III ratio is 2000 or more. Thereby, the tensile strain (stress) formed at the time of GaN layer formation can be suppressed. As a result, cracks can be suppressed.

  And V / III ratio shall be 8000 or less. As will be described later, when the V / III ratio exceeds 8000, excessive compressive stress is accumulated, and defects may occur in the silicon substrate 40 during crystal growth. Moreover, excessive stress accumulation leads to a decrease in yield in the element process. By setting the V / III ratio to 8000 or less, defect formation of the substrate 40 can be suppressed.

  Thus, in the embodiment, the absolute value of the ratio of the difference between the second lattice spacing of the first upper layer 61b and the first lattice spacing of the first lower layer 61a to the first lattice spacing is 0.005 or more and 0.00. Further, in the formation of the first upper layer 61b, the growth rate (lateral growth rate) of the first upper layer 61b in the direction parallel to the main surface 40a is the direction perpendicular to the main surface 40a. The growth rate of the first upper layer 61b (longitudinal growth rate) is made larger. Thus, the first upper layer 61b is formed while applying a compressive stress based on the difference between the second lattice spacing and the first lattice spacing to the first upper layer 61b. Thereby, the high quality nitride semiconductor layer which suppressed generation | occurrence | production of a crack can be manufactured.

In the present embodiment, the lattice spacing of the nitride compound semiconductor layer is a lattice spacing of the first axis parallel to the major surface 40a of the substrate 40. When the c-axis of the nitride semiconductor layer is perpendicular to the main surface 40a, for example, the a-axis can be adopted as the first axis. However, the embodiment is not limited thereto, and an axis in an arbitrary direction parallel to the main surface 40a of the substrate 40 can be adopted as the first axis.

FIG. 9A to FIG. 9D are schematic views illustrating the configuration of the nitride semiconductor layer.
As shown in FIG. 9A and FIG. 9B, the c-axis of the nitride semiconductor layer may be perpendicular to the Z-axis direction (the direction perpendicular to the main surface 40a of the substrate 40). At this time, the first axis related to the lattice spacing can be, for example, an axis parallel to the (1-100) plane. Further, the first axis can be an axis parallel to the (11-20) plane, for example.

As shown in FIGS. 9C and 9D, the c-axis of the nitride semiconductor layer may be inclined with respect to the Z-axis direction. At this time, the 1st axis | shaft regarding a lattice space | interval can be made into an axis | shaft parallel to a (1-101) plane, for example. Further, the first axis can be, for example, an axis parallel to the (11-22) plane.
These are examples, and in the embodiment, an arbitrary axis parallel to the major surface 40a of the substrate 40 can be applied as the first axis.

FIG. 10A to FIG. 10C are schematic views illustrating another nitride semiconductor layer according to the first embodiment.
FIG. 10A is a schematic cross-sectional view illustrating the configuration of the nitride semiconductor layer 320 according to this embodiment. FIG. 10B illustrates the Al composition ratio (C _Al ), and FIG. 10C is a graph illustrating the a-axis lattice spacing Ld.

  As shown in FIG. 10A, in the nitride semiconductor layer 320 (nitride semiconductor element 120) according to the embodiment, the substrate 40, the buffer layer 70 (for example, the AlN layer 71), the first stacked body 61, and the function In addition to the layer 10, a second stacked body 62 is further provided. The first stacked body 61 includes a first lower layer 61a and a first upper layer 61b. A GaN layer 11 i (for example, an undoped GaN layer) may be further provided between the second stacked body 62 and the functional layer 10. Since the substrate 40, the buffer layer 70, the first stacked body 61, and the functional layer 10 have been described with respect to the nitride semiconductor layer 310 (nitride semiconductor element 120), description thereof will be omitted. Below, the 2nd laminated body 62 is demonstrated.

The second stacked body 62 is provided between the first stacked body 61 and the functional layer 10. Second stack 6 2 includes a second lower 62a provided on the first laminate 61, a second upper layer 62b provided on the second lower 62a, the. A nitride semiconductor is used for the second lower layer 62a and the second upper layer 62b.

  As shown in FIG. 10C, the second lower layer 62 a has a third lattice spacing of a first axis (for example, a axis) parallel to the major surface 40 a of the substrate 40. The second upper layer 62b has a first lattice fourth lattice spacing. The fourth lattice spacing is the same as or larger than the third lattice spacing.

  At least a part of the second upper layer 62b has a compressive strain. For example, at least the lower part of the first upper layer 62b (the part on the second lower layer 62a side) has compressive strain. For example, when the thickness of the second upper layer 62b is thick, the upper portion of the second upper layer 62b may not have compressive strain.

As shown in FIG. 10B, for example, Al _x2 Ga _1-x2 N (0 <x2 <1) is used for the second lower layer 62a. The second upper layer 6 2b, for example, GaN is used.

  The absolute value of the ratio of the difference between the fourth lattice spacing and the third lattice spacing to the third lattice spacing is 0.005 or more and 0.019 or less. That is, the absolute value of the lattice mismatch factor LM (second lattice mismatch factor LM2) in the second stacked body 62 is 0.005 or more and 0.019 or less.

FIG. 11 is a flowchart illustrating another method for manufacturing a nitride semiconductor layer according to the first embodiment.
FIG. 11 illustrates an example of a method for manufacturing the nitride semiconductor layer 320 illustrated in FIG.
As shown in FIG. 11, the nitride semiconductor layer manufacturing method of this example is the same as the manufacturing method described with reference to FIG. 2, in which the second lower layer 62 a is formed on the first stacked body 61 (step S <b> 130). The method further includes the step of forming the second upper layer 62b on the second lower layer 62a to form the second stacked body (step S140).

  In the formation of the second upper layer 62b, the growth rate of the second upper layer 62b in the direction parallel to the main surface 40a of the substrate 40 is larger than the growth rate of the second upper layer 62b in the direction perpendicular to the main surface 40a. To do. The second upper layer 62b is formed while applying a compressive stress based on the difference between the fourth lattice spacing and the third lattice spacing to the second upper layer 62b.

  That is, in this example, a plurality of laminated bodies are laminated. Thereby, generation | occurrence | production of a crack can be suppressed more.

  Also in this case, in the formation of the second upper layer 62b, the V / III ratio (ratio of the number of group V element atoms supplied per unit time to the number of group III element atoms supplied per unit time) is 2000 or more and 8000 or less.

  In addition, in the formation of the second upper layer 62b, the ratio of the flow rate of the ammonia gas to the total flow rate of the supply gas is preferably 0.2 or more and 0.5 or less. The thickness of the second upper layer 62b is preferably 250 nm or more.

  In this example, the number of cycles of the stacked body is 2 when a stacked body including one AlGaN layer and one GaN underlayer formed on the AlGaN layer is defined as one cycle. However, the embodiment is not limited to this, and the number of periods of the stacked body may be three or more. In the nitride semiconductor device according to the embodiment, any number of stacked bodies can be provided.

  As described with reference to FIG. 3, an increase in the thickness of the GaN layer causes lattice relaxation in the GaN layer, and compression stress formation cannot be maintained. A GaN layer thinner than a thickness at which compressive stress cannot be formed is formed, and an AlGaN layer is formed again thereon. Thereby, the lattice spacing approaches the lattice spacing of the AlGaN layer. That is, the lattice spacing can be returned to a state without lattice relaxation. By forming the GaN layer on the AlGaN layer, the film thickness of the GaN layer can be increased while maintaining the compressive stress. That is, the effect of suppressing cracks can be greatly improved by periodically laminating a plurality of times.

  In the embodiment, the configuration of the second stacked body 62 may be different from the configuration of the first stacked body 61. For example, the thickness of the second upper layer 62b may be thicker than the thickness of the first upper layer 61b. For example, the thickness of the second lower layer 62a may be thicker than the thickness of the first lower layer 61a. For example, the Al composition ratio in the second lower layer 62a may be higher than the Al composition ratio in the first lower layer 61a. For example, the amount of strain stored in the laminate varies depending on the number of laminates. By changing the structure in response to the change in the amount of strain, the effect of further reducing cracks and dislocations can be obtained.

(Second Embodiment)
FIG. 12A to FIG. 12D are schematic views illustrating the nitride semiconductor layer according to the second embodiment.
FIG. 12A is a schematic cross-sectional view illustrating the configuration of the nitride semiconductor layer 330 (nitride semiconductor element 130) according to this embodiment. 12B illustrates the Al composition ratio (C _Al ), FIG. 12C is a graph illustrating the a-axis lattice spacing Ld, and FIG. 12D illustrates a nitride semiconductor. It represents the growth temperature GT of the layer.

  As shown in FIG. 12A, in the nitride semiconductor layer 330 (nitride semiconductor element 130), the second stacked body 62 further includes a second base layer 62c of nitride semiconductor. The second base layer 62 c is provided between the second lower layer 62 a and the first stacked body 61. The second base layer 62c has a first-axis lattice spacing that is less than or equal to the third lattice spacing of the second lower layer 62a. A GaN layer 11i (for example, an undoped GaN layer) may be further provided on the second stacked body 62 (for example, between the second stacked body 62 and the functional layer 10). Except for this, it is the same as the nitride semiconductor layer 320 (nitride semiconductor element 120), and the description thereof is omitted.

  That is, in the method for manufacturing a nitride semiconductor layer according to the present embodiment, the step of forming the second stacked body 62 includes the step of forming a third lattice on the first stacked body 61 before forming the second lower layer 62a. Forming a second base layer 62c of a nitride semiconductor having a lattice spacing of a first axis equal to or smaller than the spacing.

As shown in FIG. 12B, the second base layer 62c is, for example, AlN. The second lower layer 62a is, for example, Al _x2 Ga _1-x2 N (0 <x2 <1). The second upper layer 62b is, for example, GaN.

  As shown in FIG. 12C, the lattice spacing Ld in the second stacked body 62 is small in the second base layer 61c and large in the second upper layer 62b. The lattice spacing in the direction perpendicular to the stacking direction (Z-axis direction) (for example, the lattice spacing of the a-axis) is the largest in the second upper layer 62b and abruptly decreases in the second base layer 62c. The lattice spacing of the second lower layer 62a is greater than or the same as that of the second base layer 62c (AlN layer). The lattice spacing of the second upper layer 62b is greater than or the same as that of the second base layer 62c.

  Thus, by providing the second base layer 62c (AlN layer), the lattice spacing approaches the lattice spacing (lattice constant) of the unstrained AlN layer. That is, the lattice spacing can be returned to a state without lattice relaxation. By forming an AlGaN layer to be the second lower layer 62a on the second base layer 62c (AlN layer), a larger compressive stress can be formed in the second upper layer 62b (GaN layer). Further, dislocations are bent by the stress generated by the difference in lattice spacing, and dislocations reaching the semiconductor layer (for example, the functional layer 10) formed on the second stacked body 62 can be reduced.

As shown in FIG. 12D, for example, the growth temperature GT of the second base layer 62c is lower than the growth temperature GT of the second lower layer 62a and the growth temperature GT of the second upper layer 62b.
The growth temperature GT of the AlN layer to be the second base layer 62c is preferably 500 ° C. or higher and 1050 ° C. or lower, for example. More preferably, it is 600 degreeC or more and 850 degrees C or less. When the growth temperature GT of the AlN layer is lower than 500 ° C., impurities are easily taken in. Further, cubic AlN or the like is grown, and crystal dislocations are excessively generated. And the crystal quality of an AlN layer will deteriorate excessively. On the other hand, when the growth temperature GT of the AlN layer is higher than 1050 ° C., lattice relaxation hardly occurs. Therefore, the strain is not relaxed, and tensile strain is easily introduced into the AlN layer. Furthermore, when forming the AlGaN layer (and the functional layer 10 and the like) to be the second lower layer 62a on the AlN layer, the compressive stress cannot be applied properly, and cracks are likely to occur in the temperature lowering process after crystal growth. .

  As shown in FIG. 12C, when the growth temperature GT of the AlN layer is, for example, 800 ° C., lattice relaxation becomes easy in the AlN layer. As a result, the AlN layer can be formed so as not to be affected by the strain from the GaN layer of the first upper layer 61b. That is, it becomes difficult to receive tensile strain from the GaN layer of the first upper layer 61b from the beginning of the formation of the AlN layer. In this manner, the lattice-relaxed AlN layer (second base layer 61c) is formed on the GaN layer (first upper layer 61b).

  The thickness of the second base layer 62c (AlN layer) is preferably 5 nm or more and 100 nm or less, for example. If the thickness of the AlN layer is less than 5 nm, the AlN layer is not easily relaxed. If the thickness of the AlN layer is thicker than 100 nm, the crystal quality of the AlN layer tends to deteriorate. For example, the surface flatness is deteriorated and pits are easily generated. The thickness of the AlN layer is more preferably 50 nm or less. When the thickness of the AlN layer is 50 nm or less, the deterioration of the crystal quality is further suppressed. The thickness of the AlN layer is about 12 nm, for example.

The second base layer 62c is not limited to AlN, and may be an Al _y2 Ga _1-y2N layer (0 <y2 ≦ 1) having a first-axis lattice spacing equal to or smaller than the third lattice spacing of the second lower layer 62a. . The Al composition ratio in Al _y2 Ga _1-y2 N is preferably 0.5 or more and 1.0 or less, for example, about 1.0. If the Al composition ratio in the second base layer 62c is smaller than 0.5, the second base layer 62c is difficult to relax sufficiently.

  Here, the relaxation rate α is introduced as a parameter indicating the degree of strain relaxation (lattice relaxation) of the second base layer 62c (AlN layer). The relaxation rate α of the second base layer 62c (AlN layer) is the lattice spacing dg of the axis equivalent to the first axis of unstrained GaN (axis parallel to the main surface 40a) and that of unstrained AlN. With respect to the absolute value of the difference between the lattice spacing da of the axis equivalent to the first axis, the lattice spacing dg of the axis equivalent to the first axis of unstrained GaN and the first axis of the second base layer 62c The ratio of the absolute value of the difference between the actual lattice interval Da and the difference. That is, the relaxation rate α = | dg−Da | / | dg−da |.

When the second base layer 62c is an Al _y2 Ga _1-y2 N layer (0 <y2 ≦ 1), the relaxation rate α is the unstrained GaN first axis (axis parallel to the main surface 40a). For the absolute value of the difference between the lattice spacing dg of the axis equivalent to λ and the lattice spacing da of the axis equivalent to the first axis of unstrained Al _y2 Ga _1-y2 N (0 <y2 ≦ 1). The absolute value of the difference between the lattice spacing dg of the axis equivalent to the first axis of strained GaN and the actual lattice spacing Da of the first axis in the second base layer 62c is taken as the ratio.

Note that the lattice spacing (lattice constant) of the first axis of unstrained Al _y2 Ga _1-y 2N (0 <y2 ≦ 1) is, for example, the lattice spacing (lattice constant) of the first axis of unstrained AlN. It is a value calculated using the Vegard law from the lattice spacing (lattice constant) of the first axis of unstrained GaN.

  As described above, the relaxation rate α of the second base layer 62c (AlN layer) varies depending on the growth temperature GT. For example, when the growth temperature GT during the growth of AlN as the second base layer 62c is 1130 ° C., the AlN relaxation rate α is 0.43, and when it is 650 ° C., it is 0.71. Thus, when the growth temperature is low, the relaxation rate α increases. In order to increase the relaxation rate α, the relaxation rate α is preferably formed at a growth temperature lower than the growth temperature GT of the first upper layer 61b (GaN layer).

  In addition, the relaxation rate α varies depending on the growth rate. For example, when the growth rate of AlN as the second base layer 62c is 8.82 nm / min, it is 0.35, and when it is 3.92 nm / min, it is 0.57. Thus, when the growth rate is slow, the relaxation rate α increases. In order to increase the relaxation rate α, the growth rate is preferably smaller than the growth rate of the first upper layer 61b (GaN layer). For example, 2 nm / min or more and 10 nm / min are preferable. More preferably, it is 3 nm / min or more and 8 nm / min or less.

The relaxation rate α also changes depending on the ammonia partial pressure. For example, when the ammonia partial pressure of AlN as the second base layer 62c is 0.009, it is 0.43, and when it is 0.111, it is 0.72. Thus, when the ammonia partial pressure is large, the relaxation rate α increases. In order to increase the relaxation rate α, it is preferable that the ammonia partial pressure is, for example, 0.01 or more and 0.5 or less. When ammonia partial pressure is less than 0.01, hardly relaxed enough. If the ammonia partial pressure is greater than 0.5, the gas phase reaction between ammonia, which is a group V atom source gas, and aluminum, which is a group III atom source gas, becomes excessive, and the second base layer 62c (AlN layer) Crystal quality decreases.

Furthermore, the relaxation rate α also varies depending on the ratio (V / III ratio) of the group V atom source gas to the group III atom source gas. The V / III ratio is a ratio of the number of group V element atoms supplied per unit time to the number of group III element atoms supplied per unit time. For example, when the V / III ratio of AlN as the second base layer 62c is 1800, it is 0.44, and when it is 22600, it is 0.72. Thus, when the V / III ratio is large, the relaxation rate α increases. In order to increase the relaxation rate α, the V / III ratio is preferably set to 1500 or more and 100000 or less, for example. When the V / III ratio is less than 1500, hardly relaxed enough. When the V / III ratio is greater than 100,000, the gas phase reaction between ammonia, which is a group V atom source gas, and aluminum, which is a group III atom source gas, becomes excessive, and crystals of the second base layer 62c (AlN layer) Quality deteriorates.
A large relaxation rate α corresponds to a small actual lattice spacing Da of the AlN layer.

  However, the second base layer 62c (AlN layer) is completely lattice-relaxed, and the actual lattice spacing Da of the second base layer 62c (AlN layer) is the unstrained AlN lattice spacing da (for example, a-axis lattice constant). The crystal information of the first upper layer 61b (GaN layer) cannot be taken over, the crystal axis fluctuates, and the crystal quality is greatly degraded. In addition, misfit dislocations accompanying lattice relaxation increase and crystal quality deteriorates. Therefore, it is preferable that the lattice spacing Da (for example, the a-axis lattice spacing) of the second base layer 62c (AlN layer) is larger than the unstrained AlN lattice spacing da (for example, the a-axis lattice constant).

  A second lower layer 62a (AlGaN layer) is formed on the second base layer 62c. The Al composition ratio in the second lower layer 62a (AlGaN layer) is preferably less than or equal to the relaxation rate α of the second base layer 62c (AlN layer).

  At this time, the lattice constant in the direction perpendicular to the stacking direction (Z-axis direction) of the AlGaN layer is larger than the actual lattice spacing of the AlN layer. The AlGaN layer is formed so as to lattice match with the lattice of the AlN layer and grows while receiving compressive strain. Therefore, the actual lattice spacing (third lattice spacing Dag) in the direction perpendicular to the stacking direction (Z-axis direction) of the AlGaN layer is greater than or equal to the actual lattice spacing Da of the AlN layer.

On the other hand, when the Al composition ratio in the AlGaN layer is larger than the relaxation rate α of the AlN layer, the lattice constant in the direction perpendicular to the stacking direction (Z-axis direction) of the AlGaN layer is the actual AlN layer. Smaller than the lattice spacing. Therefore, to grow while receiving the tension strain Tsu argument, the third lattice spacing Dag the AlGaN layer is smaller than the actual lattice spacing Da of a-axis of AlN layer, tensile strain occurs, cracking it is likely to occur.

  That is, simply forming the second lower layer 62a (AlGaN layer) having an Al composition ratio smaller than that of the second base layer 62c (AlN layer) on the second base layer 62c (AlN layer) forms compressive strain. It is difficult to suppress cracks. By forming an AlGaN layer having a lattice constant larger than the actual lattice spacing of the AlN layer on the second base layer 62c (AlN layer) with a lattice spacing smaller than the lattice constant, the AlGaN layer is subjected to compressive strain. The compressive strain is stored on the surface of the substrate 40. It is preferable to form an AlGaN layer having an Al composition ratio reflecting the relaxation rate α of the AlN layer, that is, to form an AlGaN layer having an Al composition ratio equal to or less than the relaxation rate α of the AlN layer.

  The thickness of the second lower layer 62a (AlGaN layer) is preferably 5 nm or more and 100 nm or less, for example. If the thickness of the AlGaN layer is less than 5 nm, it is difficult to obtain the effect of suppressing the generation of cracks and the effect of reducing dislocations. When the thickness of the AlGaN layer is larger than 100 nm, not only the effect of reducing dislocation is saturated, but also cracks are likely to occur. The thickness of the AlGaN layer is more preferably less than 50 nm. By making the thickness of the AlGaN layer less than 50 nm, the dislocation density can be effectively reduced. The thickness of the AlGaN layer is, for example, about 25 nm.

In a thin state (initial stage of growth), Al _X Ga _1-X N is formed so as to lattice match with the lattice constant of AlN and grows while receiving compressive strain. Then, the lattice gradually relaxes as the growth of Al _X Ga _1-X N progresses, and the lattice spacing of Al _X Ga _1-X N becomes the lattice spacing of Al _X Ga _1-X N in a state not subjected to distortion. Get closer. When Al _X Ga _1-X N grows under compressive strain, the compressive strain is stored on the substrate surface, so that a convex warpage occurs on the substrate. By storing the compressive strain in advance during crystal growth, it is possible to suppress the occurrence of cracks caused by the difference in thermal expansion coefficient when the temperature is lowered after the growth is completed. By controlling the Al composition ratio reflecting the relaxation rate α of the AlN layer and the film thickness, the Al composition ratio can reduce cracks and dislocations.

  The second lower layer 62a (AlGaN layer) may include a plurality of layers stacked on each other. For example, the Al composition ratio of the AlGaN layer may decrease stepwise or gradually along the direction from the first stacked body 61 toward the second stacked body 62. Thereby, the lattice relaxation of the AlGaN layer can be suppressed, and the compressive stress formed in the AlGaN layer can be increased. Further, at the interface of the AlGaN layer (the interface between the AlN layer and the AlGaN layer and the interface between the AlGaN layer and the GaN layer), the dislocations generated at the substrate interface are bent, and the dislocation reaching the functional layer 10 can be reduced. .

  As shown in FIG. 12C, the growth temperature GT of the second lower layer 62a (AlGaN layer) is about 1130 ° C., for example. When the growth temperature of the AlGaN layer is higher by 80 ° C. or more than the growth temperature of the AlN layer, the effect of growing so as to lattice match with the lattice spacing of AlN is obtained. For example, when the growth temperature of the AlGaN layer is 1050 ° C. or higher, the growth thickness increases so as to match the lattice. As a result, compression strain is easily applied, and cracks are easily suppressed. In addition, the effect of reducing dislocations can be obtained more greatly.

  The total of the thickness of the second base layer 62c (AlN layer), the thickness of the second lower layer 62a (AlGaN layer), and the thickness of the second upper layer (GaN layer) is, for example, 50 nm or more and 2000 nm or less. preferable. When the total thickness is less than 50 nm, the temperature increase process and the temperature decrease process of the growth temperature for obtaining a desired thickness of the stacked body are excessively increased. Therefore, productivity deteriorates. On the other hand, if the total thickness is larger than 2000 nm, accumulation of compressive strain becomes insufficient and cracks are likely to occur. The total thickness is more preferably 300 nm or more and less than 1000 nm. By setting the total thickness to 300 nm or more and less than 1000 nm, a flat surface can be easily obtained, and the effect of reducing cracks and dislocations can be easily exhibited.

A Si δ-doped layer (not shown) may be provided on at least a part of at least one of the first upper layer 61b (GaN layer) and the second upper layer 62b (GaN layer). For example, a δ-doped layer may be provided inside the first upper layer 61b (GaN layer). For example, a δ-doped layer may be provided on the surface of the first upper layer 61b (GaN layer) on the first lower layer 61a (AlGaN layer) side. For example, it may be δ-doped layer is provided on the surface side of the function layer 10. Further, a Si δ-doped layer (not shown) may be provided on at least part of the first lower layer 61a (AlGaN layer) and the second lower layer 62a (AlGaN layer). By providing these δ-doped layers, dislocations are shielded or dislocations bent in the δ-doped layers, and dislocations reaching the semiconductor layer (for example, the functional layer 10) formed on the δ-doped layer are prevented. It can reduce more effectively.

When the AlN layer 71 is used as the buffer layer 70 illustrated in FIG. 12A, it can be considered that the first stacked body 61 includes the AlN layer 71 provided under the first lower layer 61a. In this case, the step of forming the first stacked body 61 has a lattice spacing of a first axis smaller than the first lattice spacing on the main surface 40a before the formation of the first lower layer 61a. Forming the first base layer (for example, the AlN layer 71). The first base layer is Al _y1 Ga _1-y1 N (0 <y1 ≦ 1). The first lower layer 61a is Al _x1 Ga _1-x1 N (0 <x1 <1, x1 <y1). The first upper layer 61b is GaN.

  In the embodiment shown in FIG. 12A, the second base layer 62c, the second lower layer 61a, and the second upper layer 62b may be regarded as the first base layer, the first lower layer, and the first upper layer, respectively. .

FIG. 13A to FIG. 13D are schematic views illustrating another nitride semiconductor layer according to the second embodiment.
FIG. 13A is a schematic cross-sectional view illustrating the configuration of the nitride semiconductor layer 340 (nitride semiconductor element 140) according to this embodiment. FIG. 13B illustrates the Al composition ratio (C _Al ), FIG. 13C is a graph illustrating the a-axis lattice spacing Ld, and FIG. 13D illustrates the nitride semiconductor. It represents the growth temperature GT of the layer.

  As shown in FIG. 13A, in the nitride semiconductor layer 340 (nitride semiconductor element 140), the first stacked body 61 further includes a first base layer 61c of a nitride semiconductor. The first base layer 61c is provided between the substrate 40 and the first lower layer 61a. The first base layer 61c has a first axis lattice spacing that is smaller than the first lattice spacing of the first lower layer 61a. Further, the second stacked body 62 further includes a second base layer 62c of a nitride semiconductor. The second base layer 62 c is provided between the second lower layer 62 a and the first stacked body 61. The second base layer 62c has a first-axis lattice spacing that is smaller than the third lattice spacing of the second lower layer 62a. Another laminated body 63 is provided between the first laminated body 61 and the substrate 40 (specifically, between the first laminated body 61 and the buffer layer 70). The stacked body 63 includes a lower layer 63a provided on the buffer layer 70 and an upper layer 63b provided on the lower layer 63a. A GaN layer 11 i (for example, an undoped GaN layer) may be further provided between the second stacked body 62 and the functional layer 10. Except for this, it is the same as the nitride semiconductor layer 330 (nitride semiconductor element 130), and the description thereof is omitted.

The first base layer 61c is Al _y1 Ga _1-y1 N (0 <y1 ≦ 1), and the first lower layer 61a is Al _x1 Ga _1-x1 N (0 <x1 <1, x1 <y1). The first upper layer 61b is GaN. The second base layer 62c is Al _{y2Ga1 -y2N} (0 <y2 ≦ 1), and the second lower layer 62a is _{Alx2Ga1 -x2N} (0 <x2 <1, x2 <y2). The second upper layer 62b is GaN. The lower layer 63a is Al _x3 Ga _1-x3 N (0 <x3 <1), and the upper layer 63b is GaN.

  Also in manufacturing the nitride semiconductor layer having such a configuration, the manufacturing method described with reference to FIG. 11 is applied. Thereby, the manufacturing method of the high quality nitride semiconductor layer which suppressed generation | occurrence | production of a crack can be provided.

Hereinafter, the results of experiments conducted by the inventors will be further described.
In the experiment, a nitride semiconductor layer (nitride semiconductor element) having the configuration described with reference to FIGS. 12A to 12D was manufactured. However, in this experiment, four layers are stacked. The experimental sample was prepared as follows.

The silicon substrate 40 is processed in the same manner as described above, the substrate 40 is introduced into the reaction chamber of the MOCVD apparatus, the temperature of the substrate 40 is heated to 1080 ° C., and then in an atmosphere containing nitrogen and hydrogen at a growth pressure of 400 hPa. An AlN layer to be the buffer layer 70 is formed using TMAl and NH ₃ . The supply amount of NH ₃ is 1 L / min, and the supply amount of TMAl is 25 cc / min. The thickness of this AlN layer is about 100 nm.

An AlGaN layer (first lower layer 61a) with an Al composition ratio of 0.25 is formed using TMGa, TMAl, and ammonia in an atmosphere containing nitrogen and hydrogen at a growth pressure of 400 hPa in an atmosphere containing nitrogen and hydrogen. To do. The supply amount of NH ₃ is 2.5 L / min, the supply amount of TMAl is 25 cc / min, and the supply amount of TMGa is 18 cc / min. The thickness of this AlGaN layer is about 250 nm.

A GaN layer (first upper layer 61b) is formed using TMGa and ammonia in an atmosphere containing nitrogen and hydrogen at a growth pressure of 1013 hPa in a temperature of the substrate 40 of 1090 ° C. The supply amount of NH ₃ is 20 L / min, and the supply amount of TMGa is 47 cc / min. The ratio of ammonia, which is a group V source gas, to TMGa, which is a group III source gas, that is, the V / III ratio is 3900. The thickness of this GaN layer is about 300 nm.

An AlN layer (second base layer 62c) is formed using TMAl and ammonia in an atmosphere containing nitrogen and hydrogen at a growth pressure of 400 hPa in a temperature of the substrate 40 of 800 ° C. The thickness of this AlN layer is about 12 nm. The supply amount of NH ₃ is 1 L / min, and the supply amount of TMAl is 17 cc / min. The relaxation rate α of this AlN layer is about 0.57.

An AlGaN layer (second lower layer 62a) having an Al composition ratio of 0.25 is formed at a growth pressure of 400 hPa using a temperature of the substrate 40 of 1130 ° C. and TMGa, TMAl, and ammonia. The thickness of this AlGaN layer is about 25 nm. The supply amount of NH ₃ is 2.5 L / min, the supply amount of TMAl is 18 cc / min, and the supply amount of TMGa is 6 cc / min.

  A GaN layer (second upper layer 62b) is formed using TMGa and ammonia at a growth pressure of 1013 hPa in an atmosphere containing nitrogen and hydrogen at a substrate temperature of 1090 ° C. The thickness of this GaN layer is about 300 nm. The growth conditions for this GaN layer are the same as those for the first upper layer 61b.

  A stacked body of the combination of the AlN layer (second base layer 62c), the AlGaN layer (second lower layer 62a), and the GaN layer (second upper layer 62b) is further repeatedly formed three times.

The temperature of the substrate 40 is set to 1090 ° C., and TMGa, ammonia, and silane (SiH 4) that is an impurity source gas are used on the stacked body in an atmosphere containing nitrogen and hydrogen at a growth pressure of 1013 hPa. An n-type GaN layer (thickness about 1 μm) is formed. The n-type GaN layer becomes the functional layer 10. The supply amount of NH ₃ is 20 L / min, and the supply amount of TMGa is 47 cc / min. The V / III ratio is 3900. The Si concentration in the n-type GaN layer is 5.0 × 10 ¹⁸ cm ⁻³ . In this experiment, the lattice mismatch ratio LM of each laminate was 0.009.

  In the experiment, the nitride semiconductor layer (nitride semiconductor element) was formed as follows by changing the growth conditions of the GaN layers other than the n-type GaN layer (the first upper layer 61b, the second upper layer 62b, etc.).

  In the growth of the GaN layer, the flow rate of ammonia was changed to 5, 10, 20, 40, and 50 L / min. At this time, the ratio of ammonia, which is a group V source gas, to TMGa, which is a group III source gas, that is, the V / III ratio is 980, 1950, 3900, 7800, and 9700, respectively.

  As described above, five samples having different ammonia flow rates at the time of forming the GaN layer were prepared, and the substrate warpage, cracks, substrate defects, and the like were evaluated.

FIG. 14 is a graph illustrating characteristics of the nitride semiconductor layer according to the embodiment.
FIG. 14 is a graph showing an example of the relationship between the amount of ammonia supplied during the formation of the GaN layer and the amount of warpage of the substrate. The warpage amount of the substrate is a value of warpage at a position of 50 mm from the center of the substrate 40. The horizontal axis represents the V / III ratio when forming the GaN layer. The vertical axis represents the amount of warpage Wr (μm) at room temperature of the substrate 40 on which the nitride semiconductor layer (nitride semiconductor element structure) is formed.

  When the warp amount Wr is positive, the warp is convex downward (concave warp), which corresponds to a state in which a tensile stress SS is applied to the nitride semiconductor layer (and the functional layer 10). When the warp amount Wr is negative, the warp amount is convex upward (convex warp), which corresponds to a state in which the compressive stress CS is applied to the nitride semiconductor layer (and the functional layer 10).

  As shown in FIG. 14, when the V / III ratio is 980 and 1950, a concave warp occurs, and the warp amount Wr is about 220 μm. At this time, cracks occurred on the surface of the nitride semiconductor element. This is because, as described with reference to FIG. 3, the thickness of the GaN layer that can maintain the formation of compressive strain (stress) is small. Under this condition, the total of the compressive strain (stress) formed in the GaN layer when forming the GaN layer is small, and the tensile strain (stress) generated by the difference in thermal expansion coefficient between the silicon substrate 40 and the nitride semiconductor layer is small. Is bigger. For this reason, a concave warp occurs and a crack occurs.

  As shown in FIG. 14, the concave warpage amount Wr decreased as the ammonia supply amount increased, that is, the V / III ratio increased, and changed to a convex warpage. This is presumably because the accumulation of compressive strain (stress) in the GaN layer increases with an increase in the V / III ratio. When the V / III ratio was 3900 or higher, a nitride semiconductor element free from cracks was obtained.

  On the other hand, although not shown, when the V / III ratio was increased to 9800, excessive compressive stress was accumulated, so that defects occurred in the silicon substrate 40 during crystal growth.

  In the embodiment, for example, the V / III ratio is set to 2000 or more and 8000 or less. Thereby, a nitride semiconductor layer (nitride semiconductor element) in which generation of cracks is suppressed is obtained.

  Thus, it has been found that there is a close relationship between the amount of ammonia supplied during the formation of the GaN layer and the warpage of the nitride semiconductor element.

  Furthermore, an experiment was performed in which a similar nitride semiconductor device was formed as follows by changing the ammonia partial pressure when forming a GaN layer (the first upper layer 61b, the second upper layer 62b, etc.) other than the n-type GaN layer. .

  The GaN layer was formed using TMGa and ammonia in an atmosphere containing nitrogen and hydrogen at a growth pressure of 1013 hPa. The total amount of supply gas into the reaction chamber was 90 L / min, the amount of ammonia supply was changed, and the ratio of ammonia gas to the total supply gas (ammonia partial pressure) was 0.11, 0.22, 0.4, It was changed to 0.53.

Four samples with different ammonia partial pressures Pp (NH ₃ ) at the time of forming the GaN layer were prepared, and substrate warpage, cracks, substrate defects, and the like were evaluated.

FIG. 15 is a graph illustrating characteristics of the nitride semiconductor layer according to the embodiment.
FIG. 15 is a graph showing an example of the relationship between the ammonia partial pressure Pp (NH ₃ ) at the time of forming the GaN layer and the warpage amount Wr (warpage amount at room temperature) of the nitride semiconductor element.
As shown in FIG. 15, when the ammonia partial pressure Pp (NH ₃ ) was 0.11, a concave warp of about 200 μm was generated, and a crack was generated on the surface of the nitride semiconductor element.

As the ammonia partial pressure Pp (NH ₃ ) increased, the concave warp decreased and changed to a convex warp. When the ammonia partial pressure Pp (NH ₃ ) was 0.22 or more, a nitride semiconductor device without cracks was obtained. When the ammonia partial pressure Pp (NH ₃ ) is 0.53, a convex warp of about 280 μm results, and when the ammonia partial pressure Pp (NH ₃ ) is further increased, excessive compressive strain (stress) occurs. Accumulated warpage increased due to accumulation, and defects occurred in the silicon substrate during crystal growth. Excessive stress accumulation leads to a decrease in yield in the device process. By setting the ammonia partial pressure Pp (NH ₃ ) to 0.5 or less, defect formation of the substrate 40 can be suppressed.

In the embodiment, the ammonia partial pressure Pp (NH ₃ ) is set to 0.2 or more and 0.5 or less. Thereby, a nitride semiconductor layer (nitride semiconductor element) in which generation of cracks is suppressed is obtained.

Thus, the growth mode of the GaN layer can be controlled by controlling the ammonia partial pressure Pp (NH ₃ ). By setting the ratio of ammonia gas to the total supply gas (ammonia partial pressure) to be 0.2 or more and 0.5 or less, the growth rate in the direction parallel to the crystal surface of the GaN layer becomes the growth rate in the stacking direction. You can make it bigger. Thereby, the tensile strain (stress) formed at the time of GaN layer formation can be suppressed, and a crack can be suppressed.

  Thus, a crack can be suppressed by applying said conditions as V / III ratio or ammonia partial pressure. This is because the growth rate in the direction parallel to the crystal surface of the GaN layer can be larger than the growth rate in the stacking direction, and tensile strain formed during the formation of the GaN layer can be suppressed.

(Third embodiment)
FIG. 16A to FIG. 16C are schematic views illustrating the nitride semiconductor layer according to the third embodiment.
FIG. 16A is a schematic cross-sectional view illustrating the configuration of the nitride semiconductor layer 350 (nitride semiconductor element 150) according to this embodiment. FIG. 16 (b), illustrate the composition ratio of Al of _{(C Al),} FIG. 16 (c) is a graph illustrating the lattice spacing Ld of a shaft.

  As illustrated in FIG. 16A, the nitride semiconductor layer 350 (nitride semiconductor element 150) is provided on the intermediate layer 65 provided on the main surface 40 a of the substrate 40 and the intermediate layer 65. First laminated body 61. The nitride semiconductor layer 350 (nitride semiconductor element 150) may further include the functional layer 10 provided on the first stacked body 61. Further, a GaN layer 11i (for example, an undoped GaN layer 11i) may be further provided on the first stacked body 61 (for example, between the first stacked body 61 and the functional layer 10).

The first stacked body 61 includes the first lower layer 61a and the first upper layer 61b.
The intermediate layer 65 has a first axis lattice spacing larger than the first lattice spacing. A nitride semiconductor is used for the intermediate layer 65. For the intermediate layer 65, for example, GaN is used. The lattice spacing of the intermediate layer 65 may be the same as the second lattice spacing of the first upper layer 61b.

The first stacked body 61 further includes a first base layer 61c. The first base layer 61c is provided between the intermediate layer 65 and the first lower layer 61a. Al _y1 Ga _1-y1 N (0 <y1 ≦ 1) is used for the first base layer 61c.

The first lower layer 61a is Al _x1 Ga _1-x1 N (0 <x1 <1, x1 <y1). The first upper layer 61b is, for example, a GaN layer.

The Al composition ratio x1 in the first lower layer 61a is the lattice spacing of the axis equivalent to the first axis of unstrained GaN and the first strain of unstrained Al _y1 Ga _1-y1 N (0 <y1 ≦ 1). With respect to the absolute value of the difference between the lattice spacing of the axis equivalent to one axis, the lattice spacing of the shaft equivalent to the first axis of unstrained GaN and the actual first axis in the first base layer 61c. It is below the ratio of the absolute value of the difference from the lattice spacing.
Thereby, the tensile strain formed at the time of GaN layer formation can be suppressed, and a crack can be suppressed.

That is, the manufacturing method according to the present embodiment further includes a step of forming the GaN intermediate layer 65 between the main surface 40a and the first stacked body 61a in addition to Step S110 and Step S120 illustrated in FIG. Can do. The manufacturing method may further include a step of forming a first base layer 61c of Al _y1 Ga _1-y1 N (0 <y1 ≦ 1) between the intermediate layer 65 and the first lower layer 61a. At this time, by setting the Al composition ratio x1 in the first lower layer 61a to the above-described conditions, the tensile strain formed when the GaN layer is formed can be suppressed, and cracks can be suppressed.

In the case where a plurality of stacked bodies are provided on the substrate 40, at least one of the plurality of stacked bodies has the configuration of the first lower layer 61a and the first upper layer 6 1 b. Just do it. Further, as described above, it is only necessary to have the configuration of the intermediate layer 65 and the first base layer 61c.

  In the embodiment, the semiconductor layer is grown by, for example, a metal-organic chemical vapor deposition (MOCVD) method, a metal-organic vapor phase epitaxy (MOVPE) method, or molecular beam epitaxy. (Molecular Beam Epitaxy: MBE) method, halide vapor phase epitaxy method (HVPE) method and the like can be used.

For example, when the MOCVD method or the MOVPE method is used, the following can be used as raw materials for forming each semiconductor layer. For example, TMGa (trimethyl gallium) and TEGa (triethyl gallium) can be used as the Ga raw material. As a source of In, for example, TMIn (trimethylindium), TEIn (triethylindium), or the like can be used. As a raw material for Al, for example, TMAl (trimethylaluminum) can be used. As a raw material of N, for example, NH ₃ (ammonia), MMHy (monomethylhydrazine), DMHy (dimethylhydrazine) and the like can be used. As a Si raw material, SiH ₄ (monosilane), Si ₂ H ₆ (disilane), or the like can be used.

  According to the embodiment, it is possible to provide a method for manufacturing a nitride semiconductor layer in which generation of cracks is suppressed.

In this specification, “nitride semiconductor” means B _x In _y Al _z Ga _1-xyz N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ z ≦ 1, x + y + z ≦ 1) Semiconductors having all compositions in which the composition ratios x, y, and z are changed within the respective ranges are included. Furthermore, in the above chemical formula, those further containing a group V element other than N (nitrogen), those further containing various elements added for controlling various physical properties such as conductivity type, and unintentionally Those further including various elements included are also included in the “nitride semiconductor”.

  In the present specification, “vertical” and “parallel” include not only strictly vertical and strictly parallel, but also include, for example, variations in the manufacturing process, and may be substantially vertical and substantially parallel. is good.

  The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, a specific configuration of each element such as a substrate, a buffer layer, a stacked body, an upper layer, a lower layer, a base layer, and a functional layer included in the nitride semiconductor layer and the nitride semiconductor element is within a publicly known range. As long as the present invention can be implemented in the same manner by selecting as appropriate and the same effect can be obtained, it is included in the scope of the present invention.

  Moreover, what combined any two or more elements of each specific example in the technically possible range is also included in the scope of the present invention as long as the gist of the present invention is included.

  In addition, based on the method for manufacturing a nitride semiconductor layer described above as an embodiment of the present invention, all methods for manufacturing a nitride semiconductor layer that can be implemented by a person skilled in the art appropriately modify the gist of the present invention. As long as it is included, it belongs to the scope of the present invention.

  In addition, in the category of the idea of the present invention, those skilled in the art can conceive of various changes and modifications, and it is understood that these changes and modifications also belong to the scope of the present invention. .

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 10 ... Functional layer, 11 ... 1st semiconductor layer, 11i ... GaN layer, 12 ... 2nd semiconductor layer, 13 ... Light emitting layer, 40 ... Substrate, 40a ... Main surface, 61 ... 1st laminated body, 61a ... 1st lower layer 61b ... first upper layer, 61c ... first base layer, 62 ... second laminated body, 62a ... second lower layer, 62b ... second upper layer, 62c ... second base layer, 63 ... laminated body, 63a ... lower layer, 63b ... upper layer, 65 ... intermediate layer, 66 ... microcrystal, 67 ... crystal, 68 ... stress, 70 ... buffer layer, 71 ... AlN layer, 110, 120, 130, 140, 150 ... nitride semiconductor element, 310, 320, 330, 340, 350 ... nitride semiconductor layer, CS ... compressive stress, Cv ... curvature, Cv0 ... cancel curvature, GT ... growth temperature, LM ... lattice mismatch, Ld ... lattice spacing, P1-P3 ... point, Pp ( V / III) ... A Pneumoniae partial pressure, R01, R02, R03, R11 , R12 ... area, Rf ... reflection intensity, SS ... tensile stress, Wr ... warpage, t ... growth time, _{t GaN ...} thickness, tc ... compressive stress applied maximum thickness

Claims (8)

A first lower layer of a nitride semiconductor having a first lattice spacing of a first axis parallel to the main surface is formed on the main surface of the silicon substrate, and the first lower layer is formed on the first lower layer. having have a second lattice spacing larger the first axis than the lattice spacing pressure Chijimiyugami, to form a first layer of nitride semiconductor, a first laminate including a first layer and the first lower layer Comprising the step of forming a body,
The absolute value of the ratio of the difference between the second lattice spacing and the first lattice spacing to the first lattice spacing is 0.005 or more and 0.019 or less,
The formation of the first upper layer is such that the growth rate of the first upper layer in a direction parallel to the main surface is larger than the growth rate of the first upper layer in a direction perpendicular to the main surface, Forming the first upper layer while applying compressive stress to the first upper layer based on the difference between the second lattice spacing and the first lattice spacing;
The step of forming the first stacked body has a lattice spacing of the first axis smaller than the first lattice spacing on the main surface before forming the first lower layer, and a nitride semiconductor Forming a first base layer of
Said first base layer, Ri AlN der,
The method of manufacturing a nitride semiconductor layer, wherein the first lattice spacing of the first axis of the first lower layer is smaller than the unstrained lattice spacing of the first axis of the first lower layer.   In the formation of the first upper layer, the ratio of the number of group V element atoms supplied per unit time to the number of group III element atoms supplied per unit time is 2000 or more and 8000 or less. Item 2. A method for producing a nitride semiconductor layer according to Item 1.   The ratio of the flow rate of ammonia gas containing nitrogen as a group V element to the flow rate of the total supply gas in the formation of the first upper layer is 0.2 or more and 0.5 or less. The method for producing a nitride semiconductor layer according to 1 or 2.   The method for manufacturing a nitride semiconductor layer according to claim 1, wherein the first upper layer has a thickness of 250 nanometers or more. A second lower layer of a nitride semiconductor having a third lattice spacing of the first axis is formed on the first stacked body, and the second lower layer is larger than the third lattice spacing on the second lower layer. a fourth have a lattice spacing pressure Chijimiyugami monoaxial, further comprising a step of forming a second laminate by forming a second layer of nitride semiconductor includes a second lower layer and the second layer,
The absolute value of the ratio of the difference between the fourth lattice spacing and the third lattice spacing to the third lattice spacing is 0.005 or more and 0.019 or less,
In the formation of the second upper layer, the growth rate of the second upper layer in a direction parallel to the main surface is made larger than the growth rate of the second upper layer in a direction perpendicular to the main surface, 5. The method according to claim 1, further comprising forming the second upper layer while applying a compressive stress based on the difference between the fourth lattice spacing and the third lattice spacing to the second upper layer. A method for manufacturing a nitride semiconductor layer.   The step of forming the second stacked body has a lattice spacing of the first axis smaller than the third lattice spacing on the first stacked body before the formation of the second lower layer; The method for manufacturing a nitride semiconductor layer according to claim 5, comprising forming a second base layer of the nitride semiconductor. The second base layer is AlN;
The second lower layer is Al _x2 Ga _1-x2 N (0 <x2 <1),
The method for manufacturing a nitride semiconductor layer according to claim 6, wherein the second upper layer is GaN. A second base layer of AlN is formed on the first stacked body, and a third axis of the first axis larger than the lattice spacing of the first axis of the second base layer is formed on the second base layer. Forming a second lower layer of Al _x2 Ga _1-x2 N (0 <x2 < 1) having a lattice spacing;
On the second layer, the third have a fourth lattice spacing larger the first axis than the lattice spacing having a pressure Chijimiyugami, wherein the forming a second layer of GaN said second base layer A step of forming a second laminate including a second lower layer and the second upper layer;
The absolute value of the ratio of the difference between the fourth lattice spacing and the third lattice spacing to the third lattice spacing is 0.005 or more and 0.019 or less,
In the formation of the second upper layer, the growth rate of the second upper layer in a direction parallel to the main surface is made larger than the growth rate of the second upper layer in a direction perpendicular to the main surface, Forming the second upper layer while applying a compressive stress based on the difference between the fourth lattice spacing and the third lattice spacing to the second upper layer;
The first lower layer is Al _x1 Ga _1-x1 N (0 <x1 <1),
The first upper layer is GaN;
The Al composition ratio x2 in the second lower layer is the absolute difference between the lattice spacing of the axis equivalent to the first axis of unstrained GaN and the lattice spacing of the axis equivalent to the first axis of unstrained AlN. The ratio of the absolute value of the difference between the lattice spacing of the axis equivalent to the first axis of the unstrained GaN and the lattice spacing of the axis equivalent to the first axis in the second base layer to the value, The manufacturing method of the nitride semiconductor layer as described in any one of Claims 1-4.

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