JP5892056B2 - Long resin film cooling apparatus and cooling method, and long resin film surface treatment apparatus - Google Patents

Description

  The present invention is a surface treatment of a long resin film that performs a surface treatment that requires a thermal load such as ion beam treatment or sputtering film formation while conveying the long resin film by a roll-to-roll method in a vacuum chamber. The present invention relates to an apparatus, and in particular, relates to an improvement in a cooling apparatus and a cooling method for cooling a long resin film incorporated in the surface treatment apparatus.

  Flexible wiring boards are used in liquid crystal panels, notebook computers, digital cameras, mobile phones, and the like. The flexible wiring board is manufactured from a heat-resistant resin film with a metal film in which a metal film is formed on one side or both sides of a heat-resistant resin film. In recent years, wiring patterns formed on flexible wiring boards have become increasingly finer and denser, and it has become even more important that the heat-resistant resin film with metal film itself is smooth and free of defects. Yes.

  As a manufacturing method of this kind of heat-resistant resin film with a metal film, a method of manufacturing by attaching a metal foil to a heat-resistant resin film with an adhesive (referred to as a manufacturing method of a three-layer substrate), heat-resistant to the metal foil By coating with a conductive resin solution and drying to manufacture (called casting method), dry plating method (vacuum film forming method) or a combination of dry plating method (vacuum film forming method) and wet plating method A method for producing a metal film on a heat-resistant resin film (referred to as a metallizing method) has been conventionally known. Further, the dry plating method (vacuum film forming method) in the metalizing method includes a vacuum deposition method, a sputtering method, an ion plating method, an ion beam sputtering method and the like.

  Regarding the metallizing method, Patent Document 1 discloses a method in which chromium is sputtered on a polyimide insulating layer and then copper is sputtered to form a conductor layer on the polyimide insulating layer. In Patent Document 2, a first metal thin film formed by sputtering using a copper nickel alloy as a target and a second metal thin film formed by sputtering using copper as a target are laminated on a polyimide film in this order. A flexible circuit board material (that is, a copper-clad laminated resin film substrate) is disclosed. In addition, when manufacturing a heat resistant resin film with a metal film by vacuum film-forming to a heat resistant resin film like a polyimide film, it is common to use the sputtering web coater described below.

  And although the sputtering method mentioned above has the advantage which is excellent in the adhesive force of the metal thin film etc. which were formed into a film, it is said that the heat load given to a heat resistant resin film is large compared with the vacuum evaporation method. It is also known that when a large heat load is applied to the heat resistant resin film during film formation, wrinkles are likely to occur in the film.

  In order to prevent the occurrence of this wrinkle, in the sputtering web coater, the heat-resistant long resin film conveyed by a roll-to-roll or the like is brought into close contact with a cooling can roll having a cooling function composed of a rotating roll and a cooling means. A method of cooling the heat-resistant resin film being formed from the back side by winding is employed.

  Further, as a cooling method other than the cooling can roll method, in Patent Document 3, a cooling body that has a cooling surface close to the back surface of the heat-resistant resin film to be formed and that is cooled with a coolant such as water, A method of introducing a cooling gas between the cooling surface and the heat resistant resin film has been proposed.

  FIG. 1 shows an example of a vacuum film forming apparatus (sputtering web coater) in which a cooling can roll, a cooling roll and the like constituted by the rotating roll and the cooling means are incorporated in a vacuum chamber.

  This vacuum film formation apparatus (sputtering web coater: surface treatment apparatus) includes an unwind chamber 110 having an unwind roll 114 for unwinding the heat-resistant long resin film 113 before film formation, an ion beam irradiation apparatus 138, It has a cooling roll 136 that is cooled by a coolant (cooling means) such as cooling water, and a metal film that is formed by irradiating the surface of the heat-resistant long resin film 113 carried from the unwind chamber 110 with an ion beam. An ion beam chamber 134 that improves adhesion, a magnetron sputtering cathode 130, 131, 132, 133 and a cooling can roll 123 that is cooled by a coolant (cooling means) such as cooling water, are carried from the ion beam chamber 134. A film forming chamber 111 for forming a metal film or the like on the heat resistant long resin film 113 and a film forming chamber 111 are carried in. And a take-up chamber 112 having a winding roll 129 for winding the heat-resistant elongated resin film 113 after the film formation.

  In the unwinding chamber 110, the heat-resistant long resin film 113 before film formation is unwound from the unwinding roll 114, passes through the tension sensor roll 115, and dries the heat-resistant long resin film 113. After passing through the heater box 116 containing the heaters 117 and 118, it passes through the free roll 119 and is carried out to the ion beam chamber 134.

  In the ion beam chamber 134, the heat-resistant long resin film 113 carried in from the unwinding chamber 110 is wound around a winding region on the outer peripheral surface of the cooling roll 136 via a carry-in guide roll (free roll) 135, and ions After the ion beam is irradiated from the beam irradiation device 138 to the surface of the heat-resistant long resin film 113, the winding region on the outer peripheral surface of the cooling roll 136 is passed from the winding surface of the cooling roll 136 to the film forming chamber 111 through the carry-out guide roll (free roll) 137. It is carried out. Note that a coolant (cooling means) such as cooling water supplied through the inside of the rotating shaft of the roll circulates inside the cooling roll 136 constituted by the rotating roll. The rotating shaft of the cooling roll 136 is a rotating shaft driven by a motor having a sealing rotary joint that prevents leakage of the refrigerant (cooling means). In addition, since the rotation shaft driven by the motor is rotated by the motor drive installed outside the ion beam chamber 134 via, for example, a magnetically sealed shaft, a hole for penetrating the magnetically sealed shaft is used. Must be opened in the ion beam chamber 134. For this reason, it is extremely difficult to retrofit the cooling roll 136 later to an existing vacuum film forming apparatus (sputtering web coater) that does not include the cooling roll 136.

  Next, in the film forming chamber 111, the heat-resistant long resin film 113 carried from the ion beam chamber 134 passes through the free roll 120 and the tension sensor roll 121, and passes through the carry-in side guide roll (pre-feed roll) 122. The sputtering cathode 130 is wound on the surface of the heat resistant long resin film 113 while being wound around the winding area of the outer peripheral surface of the cooling can roll 123 and the back surface side of the heat resistant long resin film 113 is cooled by the cooling can roll 123. After the thin film is formed by 131, 132, and 133, the take-up chamber passes from the winding area on the outer peripheral surface of the cooling can roll 123 through the carry-out side guide roll (rear feed roll) 124 through the tension sensor roll 125 and the free roll 126. It is carried out to 112.

  The rotation axis of the cooling can roll 123 is also a rotation axis driven by a motor provided with a sealing rotary joint, like the cooling roll 136 of the ion beam chamber 134.

  Further, in the winding chamber 112, the heat-resistant long resin film 113 carried from the film forming chamber 111 is wound around the winding roll 129 via the free roll 127 and the tension sensor roll 128.

  In this vacuum film forming apparatus (sputtering web coater: surface treatment apparatus), the unwinding roll 114, the cooling roll 136, and the carry-in side guide roll (pre-feed roll) according to the tension value of each tension sensor roll 115, 121, 125, 128. ) 122, the cooling can roll 123, the carry-out side guide roll (rear feed roll) 124, the number of rotations of the motor, the motor torque, and the like are controlled to maintain a predetermined tension range for the heat-resistant long resin film 113. It is designed to be transported.

  In FIG. 1, a part of a free roll for changing the transport direction of the heat-resistant long resin film 113 and the vacuum exhaust equipment are omitted.

  By the way, the cooling roll 136 and the cooling can roll 123 composed of the rotating roll and the cooling means (refrigerant) need to circulate a refrigerant (cooling means) such as cooling water inside, so that the rotating shaft as described above. The interior of the cylinder has a complicated shaft structure including a refrigerant piping and a sealing rotary joint that prevents leakage of the refrigerant and a magnetic seal joint that maintains a reduced pressure atmosphere of the rotary shaft and the vacuum chamber.

  FIG. 2 is a configuration explanatory view showing a schematic configuration of the rotating shaft structure of the rotating roll 10 such as the cooling roll and the cooling can roll and the cooling means.

  The rotary shaft 11 of the rotary roll (cooling roll 136 or cooling can roll 123) 10 has therein a refrigerant introduction double pipe 12 that constitutes a refrigerant pipe. The refrigerant introduction double pipe 12 rotates together with the rotating shaft 11 and the rotating roll (cooling roll 136 and cooling can roll 123) 10. The rotary joint 13 is connected to a rotating refrigerant introduction double pipe 12, a fixed water supply hose 14 and a drain hose 15. In particular, the rotary shaft 11 provided with a joint for refrigerant pipe sealing has a magnetic seal at the sealing portion. The rotating shaft 16 is not only high in rotation resistance but also complicated in the structure of the sealing portion. The rotating roll cannot be rotated only by the frictional force of the long resin film in contact with the rotating roll (cooling roll 136 or cooling can roll 123) 10.

  Therefore, in order to rotationally drive the rotating roll (cooling roll 136 or cooling can roll 123) 10, the rotating shaft 11 is a driving roll having a driving force such as the motor 21 protruding outside the vacuum chamber wall 20. The shaft structure (the refrigerant pipe and the refrigerant seal mechanism are provided in the rotating shaft) may be complicated, and cannot be realized without consideration from the design stage of the sputtering web coater.

  For this reason, for example, it is extremely difficult to retrofit the cooling roll 136 to an existing sputtering web coater that does not include the ion beam chamber 134 for the reason that the ion beam chamber 134 is installed later. Further, providing the piping for the refrigerant and the sealing mechanism around the sputtering web coater having no spatial space raises a concern that the structure of the sputtering web coater is further complicated.

  In FIG. 2, reference numeral 17 denotes a bearing, reference numeral 18 denotes a bearing, reference numeral 22 denotes a pulley, and reference numeral 23 denotes a belt.

Japanese Patent Laid-Open No. 2-98994 Japanese Patent No. 3447070 JP 2010-255045 A

50th Annual Technical Conference Proceedings (2007) ISSN 0737-5921, page 752 “DISCUSSION“

  The present invention has been made paying attention to such problems, and the problem is, for example, to an existing sputtering web coater (vacuum film forming apparatus: surface treatment apparatus) that does not have an ion beam chamber. However, a long resin film surface treatment device that can be equipped with a cooling roll consisting of a rotating roll and cooling means without any large-scale remodeling or modification is provided and combined with the surface treatment device. An object of the present invention is to provide a cooling device and a cooling method for a long resin film.

  Therefore, as a result of intensive research conducted by the inventor to solve the above-described problems, the present inventors have cooled to 130K or lower instead of the conventional cooling method of cooling a rotating roll such as a cooling roll or a cooling can roll with a coolant such as cooling water. By adopting a method of cooling a rotating roll such as a cooling roll or a cooling can roll by a cooling means comprising a cooling panel having a possible refrigerator and a cooling gas introduction means, for example, an existing one without an ion beam chamber The present inventors have found that the ion beam chamber can be easily attached to a sputtering web coater (vacuum film forming apparatus: surface treatment apparatus) of the above without adding or remodeling. The present invention has been completed by such technical discovery.

That is, the invention according to claim 1
A long resin film conveyed from the upstream side by the roll-to-roll method is wound around the winding area of the outer peripheral surface via the carry-in side guide roll and downstream from the winding area of the outer peripheral surface via the carry-out side guide roll A long roll resin film provided in a vacuum chamber with a rotary roll carried out to the cooling roll and cooling means for cooling the rotary roll and cooling the long resin film on the rotary roll wound around the winding area of the outer circumferential surface of the rotary roll In the cooling device of
The cooling means is provided in a space region defined by the outer peripheral surface of the rotating roll and the outer peripheral surfaces of the carry-in side guide roll and the carry-out side guide roll, and is located on the opposite side to the winding region of the long resin film. Cooling panel that is disposed in the vicinity of the non-winding area of the outer peripheral surface of the rotating roll and has a refrigerator that can be cooled to 130K or less, and cooling that introduces a cooling gas between the non-winding area of the outer peripheral surface of the rotating roll and the cooling panel. And a gas introduction unit, and has no cooling unit for circulating the refrigerant inside the rotary roll to cool the rotary roll .

The invention according to claim 2
In the cooling device of the long resin film according to claim 1,
The cooling panel and the cooling roll are provided with a cooling box surrounding the non-wrapping area of the outer peripheral surface of the rotating roll,
The invention according to claim 3
In the cooling device of the long resin film according to claim 1 or 2,
The interval between the cooling panel and the non-wrapping area of the outer peripheral surface of the rotating roll is set to 20 to 200 μm,
The invention according to claim 4
In the cooling device of the long resin film in any one of Claims 1-3,
The cooling gas introduction means is constituted by a gas nozzle in which a nozzle tip is disposed between the non-wrapping region of the outer peripheral surface of the rotating roll and the cooling panel, and discharges the cooling gas from the nozzle tip.
The invention according to claim 5
In the cooling device of the long resin film in any one of Claims 1-3,
The cooling gas introducing means is a hollow structure in which cooling gas is introduced from a gas introduction pipe attached and connected to a side of the cooling panel facing the non-winding region of the outer peripheral surface of the rotary roll, and the hollow structure It is composed of a plurality of cooling gas discharge holes established on the side facing the non-winding region of the outer peripheral surface of the rotating roll,
The invention according to claim 6
In the cooling device of the long resin film in any one of Claims 1-3,
The cooling gas introduction means is composed of a porous structure in which cooling gas is introduced from a gas introduction pipe attached and connected to a side of the cooling panel facing the non-wrapping region of the outer peripheral surface of the rotating roll. It is characterized by.

Next, the invention according to claim 7 provides:
A long resin film conveyed by the roll-to-roll method from the upstream side is wound around the winding area of the outer peripheral surface of the rotating roll via the carry-in guide roll and is wound around the outer peripheral surface of the rotating roll via the unloading-side guide roll A long resin that is transported from the downstream to the downstream side and cooled by the cooling means provided in the vacuum chamber to cool the long resin film on the rotary roll wound around the winding area of the outer peripheral surface of the rotary roll In the film cooling method,
The cooling means is provided in a space region defined by the outer peripheral surface of the rotating roll and the outer peripheral surfaces of the carry-in side guide roll and the carry-out side guide roll, and is located on the opposite side to the winding region of the long resin film. Cooling panel that is disposed in the vicinity of the non-winding area of the outer peripheral surface of the rotating roll and has a refrigerator that can be cooled to 130K or less, and cooling that introduces a cooling gas between the non-winding area of the outer peripheral surface of the rotating roll and the cooling panel. It is composed of gas introducing means, characterized in that no cooling means is provided for cooling the rotary roll by circulating a refrigerant inside the rotary roll ,
The invention according to claim 8 provides:
In the cooling method of the long resin film according to claim 7,
The panel temperature of the cooling panel is set higher than the temperature at which the cooling gas aggregates according to the equilibrium vapor pressure curve of the cooling gas under the pressure condition of the cooling gas introduced by the cooling gas introduction means,
The invention according to claim 9 is:
In the cooling method of the long resin film of Claim 7 or 8,
The cooling gas introduction means is constituted by a gas nozzle in which a nozzle tip is disposed between the non-wrapping region of the outer peripheral surface of the rotating roll and the cooling panel, and discharges the cooling gas from the nozzle tip.
The invention according to claim 10 is:
In the cooling method of the long resin film of Claim 7 or 8,
The cooling gas introducing means is a hollow structure in which cooling gas is introduced from a gas introduction pipe attached and connected to a side of the cooling panel facing the non-winding region of the outer peripheral surface of the rotary roll, and the hollow structure It is composed of a plurality of cooling gas discharge holes established on the side facing the non-winding region of the outer peripheral surface of the rotating roll,
The invention according to claim 11 is:
In the cooling method of the long resin film of Claim 7 or 8,
The cooling gas introduction means is composed of a porous structure in which cooling gas is introduced from a gas introduction pipe attached and connected to a side of the cooling panel facing the non-wrapping region of the outer peripheral surface of the rotating roll. It is characterized by.

Furthermore, the invention according to claim 12 is
A long resin comprising a surface treatment means for treating the surface side of a long resin film conveyed by a roll-to-roll method and a cooling device for cooling the long resin film heated by the surface treatment in a vacuum chamber. In film surface treatment equipment,
The said cooling device is comprised by the cooling device in any one of Claims 1-6, and the said surface treatment means is arrange | positioned at the winding area | region side of the rotary roll outer peripheral surface around which a long resin film is wound. As a feature,
The invention according to claim 13 is:
In the surface treatment apparatus of the long resin film according to claim 12,
The surface treatment is an ion beam treatment or a plasma treatment,
The invention according to claim 14 is:
In the surface treatment apparatus of the long resin film according to claim 12,
The surface treatment is a film formation process by a vacuum film formation method,
The invention according to claim 15 is
In the surface treatment apparatus of the long resin film according to claim 14,
The vacuum film forming method is magnetron sputtering.

  According to the apparatus for cooling a long resin film according to the present invention, a refrigerator capable of cooling to 130K or lower instead of the conventional cooling means for cooling a rotating roll such as a cooling roll or a cooling can roll with a coolant such as cooling water. The structure of the rotating shaft of the cooling roll, the cooling can roll, etc. is adopted because the cooling means comprising the cooling panel having the cooling mechanism and the cooling gas introducing means adopts a method of cooling the rotating roll such as the cooling roll and the cooling can roll. Can be simplified.

  For this reason, for example, it is possible to easily attach an ion beam chamber to an existing sputtering web coater (vacuum film forming apparatus: surface treatment apparatus) that does not have an ion beam chamber without making a large scale modification or alteration. Have

  In addition, the cooling device for a long resin film according to the present invention does not require a refrigerant pipe or the like to be provided inside the rotary shaft of a rotary roll such as a cooling roll or a cooling can roll, and the rotary roll can be provided without a driving force. Can be rotated. For this reason, since it is not necessary to complicate the conveyance path and conveyance control of a long resin film, it has the effect that the manufacturing cost of the surface treatment apparatus incorporating the cooling device of the present invention can be reduced.

  Furthermore, according to the surface treatment apparatus in which the cooling device of the present invention is incorporated, since the long resin film heated by the surface treatment is cooled by the cooling device, wrinkles hardly occur in the long resin film, It also has the effect of improving product quality and yield.

Structure explanatory drawing which shows schematic structure of the conventional surface treatment apparatus provided with the unwinding chamber, the ion beam chamber, the film-forming chamber, and the winding chamber. Structure explanatory drawing which shows schematic structure of the rotating shaft structure and cooling means of the rotating roll in the conventional surface treatment apparatus. Structure explanatory drawing which shows schematic structure of the surface treatment apparatus concerning this invention provided with the unwinding chamber, the ion beam chamber, the film-forming chamber, and the winding chamber. Structure explanatory drawing which shows schematic structure of the rotating shaft structure of the rotating roll in the surface treatment apparatus of this invention. BRIEF DESCRIPTION OF THE DRAWINGS Configuration explanatory drawing which shows the structure where the cooling gas introduction means of the cooling device provided in the ion beam chamber of the surface treatment apparatus which concerns on this invention was comprised with the gas nozzle. The cooling gas introducing means of the cooling device provided in the ion beam chamber of the surface treatment apparatus according to the present invention comprises a hollow structure into which cooling gas is introduced and a cooling gas discharge hole opened in the hollow structure. FIG. The structure explanatory drawing which shows the structure where the cooling gas introduction means of the cooling device provided in the ion beam chamber of the surface treatment apparatus according to the present invention is composed of a porous structure into which the cooling gas is introduced. The graph of an equilibrium vapor pressure curve.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 3 shows a schematic configuration of a surface treatment apparatus (vacuum film forming apparatus: sputtering web coater) according to the present invention including an unwinding chamber 410, an ion beam chamber 434, a film forming chamber 411, and a winding chamber 412. . In FIG. 3, each of the unwinding chamber 410, the ion beam chamber 434, the film forming chamber 411, and the winding chamber 412 has a structure partitioned by a partition (wall) for convenience of explanation. You may employ | adopt the structure which does not provide a partition (wall).

  The cooling means of the cooling device according to the present invention is employed in a cooling roll (rotating roll) 436 provided in an ion beam chamber 434 of a surface treatment apparatus (vacuum film forming apparatus: sputtering web coater). The cooling can roll (rotary roll) 423 in the film chamber 411 employs conventional cooling means for cooling with cooling water. Further, the surface treatment in the film forming chamber 411 will be described by taking as an example a film forming process using magnetron sputtering cathodes 430, 431, 432, and 433, which can be expected to have an effect of ion beam processing. In addition, the said sputtering web coater is an apparatus used suitably when performing the film-forming process continuously and efficiently on the heat resistant long resin film surface conveyed by a roll-to-roll system.

(1) Vacuum film forming equipment (sputtering web coater)
As in the apparatus shown in FIG. 1, this sputtering web coater has an unwinding chamber 410 having an unwinding roll 414 for unwinding the heat-resistant long resin film 413 before film formation as shown in FIG. Instead of a roll (rotary roll) 436 and a conventional cooling means (cooling means using a refrigerant), a cooling panel 439 having a cryocooler 440 that can cool the rotary roll to 130K or less, and introducing a cooling gas (not shown) An ion beam irradiation device 437 that irradiates an ion beam toward the surface of the heat-resistant long resin film 413 carried from the unwind chamber 410. Beam chamber 434, magnetron sputtering cathodes 430, 431, 432, 433 and refrigerant (cooling) A film forming chamber 411 for forming a film on the heat-resistant long resin film 413 carried from the ion beam chamber 434, and a film carrying chamber 411 The main part is composed of a winding chamber 412 having a winding roll 429 for winding the heat-resistant long resin film 413 after film formation.

  In the unwinding chamber 410, the heat-resistant long resin film 413 before film formation is unwound from the unwinding roll 414, passes through the tension sensor roll 415, and dries the heat-resistant long resin film 413. After passing through the heater box 416 containing the heaters 417 and 418, it passes through the free roll 419 and is carried out to the ion beam chamber 434.

  In the ion beam chamber 434, the heat-resistant long resin film 413 carried from the unwind chamber 410 is cooled by a cooling panel 439 via a carry-in guide roll (free roll) 435, and a cooling roll (rotating roll) 436. After the ion beam is irradiated from the ion beam irradiation device 437 toward the surface of the heat-resistant long resin film 413 while being wound around the winding region of the outer peripheral surface and in close contact with the cooling roll (rotary roll) 436, the delivery side The cooling roll (rotary roll) 436 is unloaded from the winding area of the outer peripheral surface of the cooling roll (rotary roll) 438 to the film forming chamber 411 via a guide roll (free roll) 438. The cooling panel 439 is provided in a space area defined by the outer peripheral surface of the cooling roll (rotating roll) 436 and the outer peripheral surfaces of the carry-in side guide roll (free roll) 435 and the carry-out side guide roll (free roll) 438. The cooling panel 439 is processed into a curved shape along the outer peripheral surface of the cooling roll 436 so that the cooling roll (rotating roll) 436 can be efficiently cooled. The cooling roll (rotating roll) 436 is cooled by a cooling means comprising a cooling panel 439 and a cooling gas introduction means (not shown), so that refrigerant as a conventional cooling means is contained inside the cooling roll (rotating roll) 436. Not circulating. Therefore, as shown in FIG. 4, there is no refrigerant pipe or refrigerant seal mechanism inside the rotation shaft 11 of the cooling roll (rotation roll) 436, and the rotation resistance is lowered because it is composed only of the rotation shaft 11. Therefore, there is no need to drive a motor that rotates the cooling roll (rotating roll) 436. However, a configuration in which the cooling roll (rotating roll) 436 is rotated by a motor drive may be adopted, but since there is no refrigerant pipe or the like in the rotating shaft, a simple structure using the rotating shaft as a magnetic seal joint is adopted. Can do. In FIG. 4, reference numeral 17 denotes a bearing, reference numeral 18 denotes a bearing, and reference numeral 20 denotes a vacuum chamber wall.

  Next, in the film formation chamber 411, the heat-resistant long resin film 413 carried from the ion beam chamber 434 passes through the free roll 420 and the tension sensor roll 421, and passes through the carry-in side guide roll (front feed roll) 422. The heat-resistant long resin film is wound around the outer peripheral surface of the conventional cooling can roll 423 that is cooled with cooling water, and the back side of the heat-resistant long resin film 413 is cooled by the cooling can roll 423. After a thin film is formed on the surface of 413 by sputtering cathodes 430, 431, 432, 433, tension sensor roll 425, free roll from the winding region on the outer peripheral surface of cooling can roll 423 via carry-out side guide roll (rear feed roll) 424 It is carried out to the winding chamber 412 via 426.

  Further, in the winding chamber 412, the heat-resistant long resin film 413 carried from the film forming chamber 411 is wound around the winding roll 429 via the free roll 427 and the tension sensor roll 428.

  Also in this vacuum film forming apparatus (sputtering web coater: surface treatment apparatus), depending on the tension value of each tension sensor roll 415, 421, 425, 428, unwinding roll 414, carry-in side guide roll (pre-feed roll) 422, cooling The cooling can roll 423 cooled by water, the carry-out side guide roll (rear feed roll) 424, the rotational speed of the motor that rotates the take-up roll 429, the motor torque, etc. are controlled, and the heat resistant long resin film 413 is controlled. The sheet is conveyed while maintaining a predetermined tension range.

  In FIG. 3, a part of a free roll for changing the transport direction of the heat-resistant long resin film 413 and the vacuum exhaust equipment are omitted.

By the way, in the film formation chamber 411 provided with the magnetron sputtering cathodes 430, 431, 432, and 433, in order to perform the sputtering film formation, the pressure is reduced to an ultimate pressure of about 10 ⁻⁴ Pa, and then the sputtering gas is introduced to 0.1. Pressure adjustment of about 10 Pa is performed. A known gas such as argon is used as the sputtering gas, and a gas such as oxygen is further added depending on the purpose. The shape and material of the vacuum chamber constituting the film formation chamber 411 are not particularly limited as long as they can withstand such a reduced pressure state, and various types can be used. Various devices such as a dry pump, a turbo molecular pump, and a cryocoil (not shown) are provided to reduce the pressure inside the vacuum chamber and maintain the state.

  In the case of sputtering a metal film, a plate-like target (not shown) can be used. However, when a plate-like target is used, nodules (foreign material growth) are generated on the target. Sometimes. When this becomes a problem, it is preferable to use a cylindrical rotary target that generates no nodules and has high target use efficiency. Further, since the vacuum film forming apparatus (sputtering web coater: surface treatment apparatus) shown in FIG. 3 assumes sputtering as a film forming means with a thermal load, magnetron sputtering cathodes 430, 431, 432, and 433 are shown. However, in the case where the film forming means accompanied by the heat load is other such as vapor deposition, other film forming means is provided in place of the plate target. Other film forming means with thermal load include CVD (chemical vapor deposition) and vacuum deposition.

(2) Film temperature of heat-resistant long resin film after ion beam irradiation treatment To improve the adhesion of the metal film, the ion beam irradiation treatment is performed on the surface of the heat-resistant long resin film 413 in the ion beam chamber 434. Is effective. However, when the heat resistant long resin film 413 is irradiated with an ion beam, it causes wrinkles due to heat load. For this reason, ion beam irradiation treatment with strong energy that can be expected to have adhesive force unless the heat-resistant long resin film is cooled by a cooling roll having a complicated structure in which a coolant such as cooling water is circulated. Could not do.

  However, by adopting the cooling device of the present invention composed of a cooling panel or the like, it is possible to perform ion beam irradiation with strong energy that can be expected to have an adhesive force without using the above-described cooling roll having a complicated structure. It becomes.

  Incidentally, when the heat-resistant long resin film was irradiated with an ion beam, the film temperature of the heat-resistant long resin film was observed. First, a thermocouple is attached to a long resin film, and a sputtering web coater, which is a film forming apparatus for the long resin film shown in FIG. 3, is used to set the film temperature during ion beam irradiation without operating the cooling panel 439. It was measured. A polyimide film with a thickness of 25 μm is used for the heat-resistant long resin film, and when the ion beam power is 2 kW (ion beam voltage 2500 V, oxygen flow rate 100 sccm), the film temperature is 57 ° C. before irradiation with the ion beam to a maximum of 100 ° C. It was confirmed that wrinkles occurred. As the gas introduced into the ion beam, a gas suitable for the kind of heat-resistant long resin film and the metal film is appropriately selected.

(3) Cooling means according to the present invention comprising a cooling panel and cooling gas introduction means Next, a “cooling panel” and a “cooling gas introduction” for cooling a cooling roll (rotary roll) 436 provided in the ion beam chamber 434 The cooling means constituted by “means” will be described.

  This cooling means has a cryocooler 440 that can be cooled to 130K or less as shown in FIG. 3 instead of the conventional cooling means that cools the cooling roll (rotating roll) using a refrigerant, and includes a cooling roll (rotating roll). The cooling gas is introduced between the “cooling panel 439” disposed in the vicinity of the non-winding area of FIG. 5 and the non-winding area of the cooling roll (rotating roll) and the cooling panel 439. Introducing means ”.

  Details of the “cooling gas introduction means” will be described below. Since the heat conduction is low in the vacuum (decompression) space, a cooling gas is introduced to enhance the heat conduction. As a method for introducing the cooling gas between the non-wrapping region of the outer peripheral surface of the cooling roll (rotating roll) and the cooling panel, for example, the method shown in FIG. There are a method shown in FIG. 6 for introducing the cooling gas from the cooling gas discharge hole of the hollow structure and a method shown in FIG. 7 for introducing the cooling gas from the porous structure attached to the cooling panel.

  In FIG. 5, gas nozzles 213 and 214 are provided between a cooling panel 211 cooled by a cryocooler (not shown) and disposed in the cooling box 212 and a non-wrapping region on the outer peripheral surface of the cooling roll (rotating roll) 210. Cooling gas is introduced from the nozzle tip.

  In FIG. 6, the cooling panel 231 is cooled by a cryo refrigerator (not shown) and disposed on the side facing the outer peripheral surface of the cooling roll (rotating roll) 230 of the cooling panel 231. A hollow structure (gas introduction plate) 235 in which a cooling gas is introduced from gas introduction pipes 233 and 234 connected to the gas introduction passage 236, and a hollow structure (gas introduction plate) 235 are provided. A plurality of cooling gas discharge holes 237 respectively opened on the side of the gas introduction path 236 facing the outer peripheral surface of the cooling roll (rotating roll) 230 constitute a cooling gas introduction means. Cooling gas is introduced from the cooling gas discharge hole 237 between the non-wrapping region and the cooling panel 231. Since the cooling gas discharge hole 237 has a uniform gas partial pressure between the non-wrapping region of the outer peripheral surface of the cooling roll (rotating roll) 230 and the cooling panel 231, it is preferable that a large number of fine holes are opened and the diameter is 100. It is desirable that ~ 500 μm holes are opened at intervals of several mm. A hollow structure (gas introduction plate) 235 having a structure in which the gas introduction path 236 is not incorporated may be used.

  In FIG. 7, the cooling panel 251 is cooled by a cryo refrigerator (not shown) and disposed in the cooling box 252, and is attached to the side facing the outer peripheral surface of the cooling roll (rotating roll) 250. The introduction path 256 is provided, and the cooling gas introduction means is constituted by the porous structure (gas introduction porous plate) 255 into which the cooling gas is introduced from the gas introduction pipes 253 and 254 connected to the gas introduction path 256, Cooling gas is introduced from the porous structure (gas-introducing porous plate) 255 between the cooling roll (rotating roll) 250 outer circumferential surface of the outer peripheral surface and the cooling panel 251. The porous structure (gas-introducing porous plate) 255 has many fine holes in order to obtain a uniform gas partial pressure between the non-wrapping region of the outer peripheral surface of the cooling roll (rotating roll) 250 and the cooling panel 251. It is better to use a porous plate having pores of several to several tens of μm. In addition, it is good also as the porous structure (gas introduction porous board) 255 of the structure where the incorporation of the gas introduction path 256 was abbreviate | omitted.

  The cooling panels 211, 231 and 251 described above are arranged along the outer peripheral surface of the cooling rolls (rotating rolls) 210, 230 and 250 so that the cooling rolls (rotating rolls) 210, 230 and 250 can be efficiently cooled. It is desirable to be processed into a curved shape.

  In addition, the cooling gas to be introduced includes hydrogen, helium, argon, oxygen, etc. having good thermal conductivity. Desirably, when the cooling gas leaks from the cooling box, the ion beam treatment is applied to the heat-resistant long resin film. A gas that does not affect is good, and helium and argon are preferable. However, the ion beam is relatively less susceptible to the influence of the surrounding gas atmosphere because a gas is introduced therein to generate plasma inside.

And the said cooling panel cools a long resin film indirectly by the following three effects.
(3-1) Radiation cooling due to temperature difference between cooling panel and cooling roll (3-2) Gas cooling by spraying cooling gas cooled by cooling panel onto cooling roll (3-3) between cooling panel and cooling roll Cooling by molecular flow in a narrow region

  In order to perform the radiation cooling, the higher the temperature difference between the cooling panel and the cooling roll, the higher the efficiency. When the long resin film is carried into the ion beam chamber after drying the heater in the unwinding chamber described above, the film temperature of the long resin film is about 330 K (57 ° C.), so it is cooled by the cooling panel and the cooling roll. In order to obtain a temperature difference of at least 200K of the long resin film, the cooling panel needs to be 130K or less.

  In order to effectively use the space in the vacuum film forming apparatus (sputtering web coater: surface treatment apparatus), the length dimension of the cooling panel in the conveying direction of the long resin film (vertical direction of the cooling panel) is 10 cm. ~ 50 cm. And in order to cool the long resin film heated by cooling a cooling roll with the cooling panel of length 10cm-50cm to room temperature, it is necessary to equip the cooling panel with the refrigerator which can be cooled to 130K or less. . In addition, the width dimension (width direction of a long resin film) of a cooling panel can be suitably selected on the condition that it is wider than the width of a long resin film.

  In order to cool the cooling panel to 130K or lower, it is necessary to provide the cooling panel with a refrigerator in which a refrigerant that can be cooled to 130K or lower circulates. In vacuum deposition equipment (sputtering web coater: surface treatment equipment), the vacuum deposition equipment is opened to the atmosphere to remove the heat-resistant resin film. Heats above dew point. The refrigerant of the refrigerator also serves as a heating medium during the heating and needs to withstand the heat cycle of cooling and heating. Examples of the refrigerant that can withstand such a heat cycle include He and Freon. Moreover, the cryo refrigerator mentioned above can be used for a refrigerator.

  However, if the cooling panel is extremely cooled, the cooling gas introduced between the cooling panel and the cooling roll may condense on the cooling panel. The pressure of the cooling gas introduced between the cooling panel and the cooling roll must be lower than the equilibrium vapor pressure at the panel temperature of the cooling panel according to the equilibrium vapor pressure curve. In other words, the panel temperature of the cooling panel must be higher than the temperature at which the cooling gas condenses according to the equilibrium vapor pressure curve of the cooling gas under the pressure conditions of the introduced cooling gas.

That is, the panel temperature of the cooling panel is determined by the pressure of the cooling gas introduced between the cooling panel and the cooling roll. For example, the panel temperature of the cooling panel is 55 K or more if the Ar gas pressure is 100 Pa, and 85 K or more if the Ar gas pressure is 100 kPa. Similarly, the panel temperature of the cooling panel is 55 K or more for an O ₂ gas pressure of 100 Pa, and 90 K or more for an O ₂ gas pressure of 100 kPa. Further, the panel temperature of the cooling panel is 15 K or more when the He gas pressure is 100 Pa, and 25 K or more when the He gas pressure is 100 kPa.

  The temperature of the introduced cooling gas only needs to be lower than room temperature, and the cooling panel immediately cools to a temperature near the panel temperature. The pressure of the cooling gas is preferably 100 Pa to 1000 Pa in the vicinity of the cooling panel and the cooling roll in order to efficiently conduct the heat conduction between the cooling panel and the cooling roll. If the pressure of the cooling gas exceeds 1000 Pa, it is not suitable for use in a vacuum chamber. In particular, when the pressure of the cooling gas exceeds 100 kPa, the pressure of the introduced gas is near atmospheric pressure or above atmospheric pressure, the exhaust capacity of the vacuum device does not follow, and the pressure other than the pressure near the cooling panel and the cooling roll increases. In addition, since it adversely affects the film forming process and the like, it is inappropriate as the gas pressure introduced into the vacuum film forming apparatus.

Further, according to Non-Patent Document 1, when the cooling gas is argon gas and the pressure of the cooling gas is 500 Pa, the thermal conductance of the gap portion is as follows when the gap between the cooling panel and the cooling roll is a molecular flow region of about 40 μm or less. 250 (W / m ² · K). The molecular flow region is about 3 times the mean free path of molecules at the time of cooling gas pressure, and must be at most 200 μm or less. In order to obtain a molecular flow region with good heat exchange efficiency, the interval needs to be narrowed. However, in the case of the surface treatment apparatus (vacuum film forming apparatus: sputtering web coater) according to the present invention shown in FIG. 3, it is very important to keep the distance between the cooling panel 439 and the cooling roll (rotating roll) 436 outer peripheral surface at 20 μm. It is difficult, and the outer peripheral surface of the cooling roll (rotating roll) 436 may rub against the cooling panel and cause a scratch.

(4) Long resin film and copper-clad laminated resin film substrate (4-1) Long resin film The long resin film of the present invention includes a long resin film such as a polyethylene terephthalate (PET) film, and a polyimide film. Such a heat resistant long resin film is exemplified.

(4-2) Copper-clad laminated resin film (heat-resistant resin film with metal film) substrate Using the vacuum film-forming apparatus (sputtering web coater: surface treatment apparatus) of the present invention shown in FIG. A copper-clad laminated resin film (heat-resistant resin film with a metal film) substrate can be produced.

  The copper-clad laminated resin film (heat-resistant resin film with metal film) substrate includes a base metal layer made of Ni, Ni-based alloy, Cr, etc. on the surface of the heat-resistant resin film, and copper laminated on the surface of the base metal layer. A structure composed of a thin film layer is exemplified. The copper clad laminated resin film substrate having such a structure is processed into a flexible wiring substrate by a subtractive method. Here, the subtractive method is a method of manufacturing a flexible wiring board by removing a metal film (for example, the copper thin film layer) not covered with a resist by etching.

  The layer made of Ni alloy or the like is called a seed layer (underlying metal layer), and its composition is selected depending on desired characteristics such as electrical insulation and migration resistance of the copper-clad laminated resin film substrate. The seed layer can be made of various known alloys such as Ni—Cr alloy or Inconel, Condanthan, Monel and the like. Moreover, when it is desired to further increase the thickness of the metal film (copper thin film layer) of the copper-clad laminated resin film (heat-resistant resin film with metal film) substrate, the metal film may be formed using a wet plating method. There are cases where a metal film is formed only by electroplating (ie, electroplating), and electroless plating is performed as primary plating and wet plating such as electrolytic plating is combined as secondary plating. is there. The wet plating process may employ various conditions of a conventional wet plating method.

  Examples of the heat-resistant long resin film used for the copper-clad laminated resin film (heat-resistant resin film with metal film) include, for example, a polyimide film, a polyamide film, a polyester film, a polytetrafluoroethylene film, and a polyphenylene. Examples include resin films selected from sulfide-based films, polyethylene naphthalate-based films, and liquid crystal polymer-based films, and have flexibility as a copper-clad laminated resin film, practically necessary strength, and electrical insulation suitable as a wiring material. To preferred.

  In addition, as the copper-clad laminated resin film (heat-resistant resin film with a metal film), a structure in which a metal film such as a Ni—Cr alloy or Cu is laminated on a heat-resistant long resin film is exemplified. In addition, an oxide film, a nitride film, a carbide film, or the like can be used depending on the purpose.

  Hereinafter, reference examples and examples will be specifically described.

[Reference example]
A conventional vacuum film forming apparatus (sputtering web coater: surface treatment apparatus) provided with the unwinding chamber 110, the ion beam chamber 134, the film forming chamber 111, and the winding chamber 112 shown in FIG. The heat-resistant polyimide film “Kapton (registered trademark)” manufactured by Toray DuPont Co., Ltd. having a width of 500 mm, a length of 1000 m, and a thickness of 25 μm was used.

  The cooling can roll 123 has a diameter of 800 mm and a width of 800 mm, the surface of the can roll main body is subjected to hard chrome plating, and conventional cooling means for cooling the cooling can roll (rotating roll) 123 with cooling water is adopted. ing.

  The carry-in side guide roll (front feed roll) 122 is configured by an IH (induction heating) type heating roll, and has a diameter of 150 mm and an effective width of 500 mm. The peripheral speed of the carry-in side guide roll (pre-feed roll) 122 is the peripheral speed of the cooling can roll (rotating roll) 123 that serves as a reference speed for strongly attaching the heat-resistant long resin film 113 to the outer peripheral surface of the cooling can roll 123. It is rotated at a speed 0.1% slower than that. The roll temperature of the cooling can roll 123 is set to 60 ° C., and the temperatures of the heaters 117 and 118 disposed in the heater box 116 of the unwinding chamber 110 are set to 100 ° C.

  The metal film formed on the heat-resistant polyimide film (heat-resistant long resin film) 113 is a Cu film formed on a Ni—Cr film as a seed layer, and a magnetron sputtering cathode ( Ni-Cr target is used for (target) 130, Cu target is used for magnetron sputtering cathodes (targets) 131, 132 and 133, and 300 sccm of argon gas is introduced. The power applied to each cathode is controlled by power control. Membrane was performed.

  Next, in the ion beam chamber 134, the ion beam irradiation apparatus 138 for improving the adhesion between the heat-resistant polyimide film (heat-resistant long resin film) 113 and the Ni—Cr film as the seed layer includes a line type DC ion. A beam irradiation device was used. The cooling roll 136 has a diameter of 300 mm and a width of 800 mm, and a hard chrome plating is applied to the surface of the roll body. Like the cooling can roll 123, cooling water circulates in the inside thereof and has a driving force. Roll. The temperature of the cooling roll 136 is controlled by the temperature of the cooling water, and the structure of the rotating shaft of the cooling roll 136 is the same as that of the cooling can roll 123.

  The tension of the unwinding roll 114 and the winding roll 129 was 100N. A heat-resistant polyimide film (heat-resistant long resin film) 113 is set on the unwinding roll 114, and the leading end portion of the heat-resistant polyimide film 113 is wound on the winding roll 129 via the cooling roll 136 and the cooling can roll 123. Attached.

Further, after the unwinding chamber 110, the ion beam chamber 134, the film forming chamber 111, and the winding chamber 112 are evacuated to 5 Pa by a plurality of dry pumps, 3 × using a plurality of turbo molecular pumps and a cryocoil. The gas was exhausted to 10 ⁻³ Pa.

Further, Ar (argon) gas was introduced into the line type DC ion beam irradiation apparatus 138 in the ion beam chamber 134 under the condition of 50 sccm, but O ₂ , N ₂ gas, or the like can also be used. Further, a DC power source (not shown) is connected to the line type DC ion beam irradiation device 138, and the intensity of the ion beam can be adjusted in the range of the ion beam voltage 500 to 3000V by voltage control. In the reference example, the ion beam voltage was set to 1000V.

  Then, after setting the conveyance speed of the heat-resistant polyimide film (heat-resistant long resin film) 113, argon gas is introduced into each of the magnetron sputter cathodes 130, 131, 132, and 133, and electric power is applied to form a seed layer. The Ni-Cr film to be formed and the Cu film to be formed on the Ni-Cr film were started.

  Then, after completing the film formation of the heat-resistant polyimide film (heat-resistant long resin film) 113 having a length of 1000 m, the voltage application to the line-type DC ion beam irradiation device 138 is stopped and Ar gas is introduced. Stopped. Subsequently, the power applied to each magnetron sputter cathode 130, 131, 132, 133 was stopped, the introduction of Ar gas was stopped, and the conveyance of the heat resistant polyimide film (heat resistant long resin film) 113 was stopped. . Thereafter, a plurality of dry pumps, a plurality of turbo molecular pumps and a cryocoil are stopped for the unwinding chamber 110, the ion beam chamber 134, the film forming chamber 111, and the winding chamber 112, and the unwinding chamber 110 is stopped. Then, air was introduced into the ion beam chamber 134, the film forming chamber 111, and the winding chamber 112, and the heat-resistant polyimide film 113 after film formation was taken out.

  In the examples described below, the Ni—Cr film serving as the seed layer has a thickness of 10 nm, and a single Ni—Cr target is used for the magnetron sputtering cathode (target) 430 in FIG. When the film thickness is 100 nm, three Cu targets are used for the magnetron sputtering cathodes (targets) 431, 432, and 433, and the deposition rate is 8 m / min, the total power applied to the sputtering cathode is 70 kW. It was.

  And immediately after the heat resistant polyimide film 113 comes out of the cooling roll 136 temperature-controlled at 10 degreeC-70 degreeC with the thermocouple affixed on the heat resistant polyimide film (heat resistant long resin film) 113 of a reference example. The film temperature was measured. In addition, the presence or absence of wrinkles when the heat-resistant polyimide film 113 exited the ion beam chamber 134 was also observed.

  The results are shown in Table 1.

[Example 1]
In the first embodiment, as a method for introducing the cooling gas between the cooling panel 439 and the outer peripheral surface of the cooling roll 436 shown in FIG. 3, the method shown in FIG. 5 using a gas nozzle is adopted. In addition, the implementation procedures, such as an ion beam process and a film-forming process, on the heat resistant polyimide film 413 are the same as those in the reference example.

That is, in Example 1, as shown in FIG. 5, the gas nozzle 213, between the cooling panel 211 cooled by a cryo refrigerator (not shown) and disposed in the cooling box 212 and the outer peripheral surface of the cooling roll 210, Ar, O ₂ , and He gases are introduced as cooling gases from the nozzle tip of 214.

  The cooling roll 210 has a diameter of 300 mm and a width of 800 mm, and the surface of the roll body is hard chrome plated. Further, refrigerant such as cooling water does not circulate inside the cooling roll 210, and therefore, the refrigerant is not supplied from the outside of the vacuum chamber wall and is constituted by a free roll not driven by a motor.

Then, “RS80T” manufactured by ULVAC Cryo Co., Ltd. is used for a cryocooler (not shown), and a copper panel (width 600 mm × length 200 mm × thickness) processed into a curved shape along the outer peripheral surface of the cooling roll 210 is used for the cooling panel 211. 1 mm) was adopted. The introduction amount of the cooling gas is controlled by a pressure gauge (not shown) attached to the cooling box 212, and the control temperature of the cooling panel 211 is controlled by each cooling gas (Ar, O ₂ , He gas). From the equilibrium vapor pressure curve (refer to the graph of FIG. 8), it is selected so as to be equal to or higher than the condensing temperature of the cooling gas under the pressure condition.

In addition, the distance between the cooling panel 211 and the outer peripheral surface of the cooling roll 210 (50 μm, 500 μm), the type of cooling gas (Ar, O ₂ , He gas), the pressure in the cooling box 212 (50, 500, 5000 Pa), the cooling panel 211 For each temperature (90, 130, 300 K) conditions, the film temperature immediately after the heat-resistant polyimide film 413 comes out of the temperature-controlled cooling roll 436 is measured, and the heat-resistant polyimide film 413 is in the ion beam chamber 434. The presence or absence of wrinkles when exiting was also observed.

These results are shown in Table 2 (Ar), Table 3 (O ₂ ), and Table 4 (He), respectively.

From the data groups shown in Tables 2 to 4, in the case of the type of cooling gas (Ar, O ₂ , He), the temperature of the cooling panel 211 is 130 K or less, and the gas pressure in the cooling box 212 ( 50Pa, 500Pa), the cooling panel 211, and the cooling roll 210 outer peripheral surface (50 μm) is in the molecular flow region, it is confirmed that the heat-resistant polyimide film 413 is efficiently cooled, and ion beam irradiation It was also confirmed that no wrinkles were generated when the film temperature of the heat-resistant polyimide film 413 was less than 30 ° C.

[Example 2]
In the second embodiment, as a method for introducing the cooling gas between the cooling panel 439 and the outer peripheral surface of the cooling roll 436 shown in FIG. 3, the hollow structure (gas introduction plate) 235 attached to the cooling panel 231 and the cooling gas are used. The method shown in FIG. 6 using the discharge hole 237 is adopted. In addition, the implementation procedures, such as an ion beam process and a film-forming process, on the heat resistant polyimide film 413 are the same as those in the reference example.

That is, the method shown in FIG. 6 is attached to the cooling panel 231 that is cooled by a cryocooler (not shown) and disposed in the cooling box 232 on the side facing the outer peripheral surface of the cooling roll 230, and inside the cooling panel 231. A hollow structure (gas introduction plate) in which a gas introduction path 236 is provided and three types of cooling gases (Ar, O ₂ , He gas) are introduced from gas introduction pipes 233 and 234 connected to the gas introduction path 236 235, a hollow structure body (gas introduction plate) 235, and a plurality of cooling gas discharge holes 237 respectively provided on the side of the gas introduction path 236 facing the outer peripheral surface of the cooling roll 230 constitute a cooling gas introduction means. Ar, O ₂ , and He gas are introduced as cooling gases from the cooling gas discharge hole 237 between the panel 231 and the outer peripheral surface of the cooling roll 230. The diameter of the gas introduction path 236 is 3 mm, the diameter of the hole in the cooling gas discharge hole 237 is 200 μm, and the interval between the holes is 10 mm.

  The cooling roll 230 has a diameter of 300 mm and a width of 800 mm, and the surface of the roll body is hard chrome plated. Further, refrigerant such as cooling water does not circulate inside the cooling roll 230, and therefore, the refrigerant is not supplied from the outside of the vacuum chamber wall and is constituted by a free roll that is not driven by a motor.

Then, “RS80T” manufactured by ULVAC Cryo Co., Ltd. is used for a cryocooler not shown, and a copper panel (width 600 mm × length 200 mm × thickness) processed into a curved shape along the outer peripheral surface of the cooling roll 230 is used for the cooling panel 231. 1 mm) was adopted. The introduction amount of the cooling gas is controlled by a pressure gauge (not shown) attached to the cooling box 232, and the control temperature of the cooling panel 231 is set for each cooling gas (Ar, O ₂ , He gas). From the equilibrium vapor pressure curve (refer to the graph of FIG. 8), it is selected so as to be equal to or higher than the condensing temperature of the cooling gas under the pressure condition.

Further, the distance between the cooling panel 231 and the outer peripheral surface of the cooling roll 230 (50 μm, 500 μm), the type of cooling gas (Ar, O ₂ , He gas), the pressure in the cooling box 232 (50, 500, 5000 Pa), the cooling panel 231 For each temperature (90, 130, 300 K) conditions, the film temperature immediately after the heat-resistant polyimide film 413 comes out of the temperature-controlled cooling roll 436 is measured, and the heat-resistant polyimide film 413 is in the ion beam chamber 434. The presence or absence of wrinkles when exiting was also observed.

These results are shown in Table 5 (Ar), Table 6 (O ₂ ), and Table 7 (He), respectively.

From the data groups shown in Tables 5 to 7, in the case of the kind of the cooling gas (Ar, O ₂ , He), the temperature of the cooling panel 231 is 130 K or less and the gas pressure in the cooling box 232 ( 50 Pa, 500 Pa), and the cooling panel 231 and the cooling roll 230 outer peripheral surface (50 μm) are in the molecular flow region, it is confirmed that the heat-resistant polyimide film 413 is efficiently cooled, and ion beam irradiation It was also confirmed that no wrinkles were generated when the film temperature of the heat-resistant polyimide film 413 was less than 30 ° C.

  Next, with respect to the interval between the cooling panel 231 and the outer peripheral surface of the cooling roll 230, instead of the above-described two types of intervals (50 μm, 500 μm), more divided intervals (20 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm) And fixing the kind of cooling gas (Ar gas), the pressure in the cooling box 232 (500 Pa), and the temperature (130 K) of the cooling panel 231, the heat-resistant polyimide film 413 is attached to the cooling roll 436. The film temperature immediately after exiting was measured, and the presence or absence of wrinkles when the heat-resistant polyimide film 413 exited the ion beam chamber 434 was also observed.

  The results are shown in Table 8.

  From the data shown in Table 8, it is confirmed that the heat-resistant polyimide film 413 is efficiently cooled when the distance between the outer peripheral surface of the cooling panel 231 and the cooling roll 230 is 20 μm to 200 μm in the molecular flow region. In addition, setting the interval between the cooling panel 231 and the outer peripheral surface of the cooling roll 230 to be less than 20 μm means that the outer periphery of the cooling panel 231 and the cooling roll 230 is caused by the play of the bearing 18 shown in FIG. It was also confirmed that it was not realistic because the surfaces might come into contact.

[Example 3]
In Example 3, a porous structure (gas-introducing porous plate) attached to the cooling panel is used as a method for introducing the cooling gas between the cooling panel 439 and the outer peripheral surface of the cooling roll 436 shown in FIG. The method shown in FIG. In addition, the implementation procedures, such as an ion beam process and a film-forming process, on the heat resistant polyimide film 413 are the same as those in the reference example.

That is, the method shown in FIG. 7 is attached to the side of the cooling panel 251 that is cooled by a cryocooler (not shown) and faces the outer peripheral surface of the cooling roll 250 disposed in the cooling box 252, A porous structure (gas introduction porous) in which a gas introduction path 256 is provided and three types of cooling gas (Ar, O ₂ , He gas) are introduced from gas introduction pipes 253 and 254 connected to the gas introduction path 256. The cooling gas introducing means is constituted by the material plate) 255, and Ar, O ₂ , He gas as the cooling gas from the porous structure (gas introducing porous plate) 255 between the cooling panel 251 and the outer peripheral surface of the cooling roll 250. Are introduced respectively. The porous structure (gas-introducing porous plate) 255 should have a large number of fine holes in order to obtain a uniform gas partial pressure between the cooling panel 251 and the outer peripheral surface of the cooling roll 250. Alumina particles having a diameter of 10 μm A porous plate made of the sintered body was used.

  The cooling roll 250 has a diameter of 300 mm and a width of 800 mm, and the surface of the roll body is hard chrome plated. Further, refrigerant such as cooling water does not circulate inside the cooling roll 250, and therefore, the refrigerant is not supplied from the outside of the vacuum chamber wall, and is constituted by a free roll not driven by a motor.

Then, “RS80T” manufactured by ULVAC Cryo Co., Ltd. is used as a cryocooler (not shown), and a copper panel (width 600 mm × length 200 mm × thickness) processed into a curved shape along the outer peripheral surface of the cooling roll 230 is used for the cooling panel 251. 1 mm) was adopted. The introduction amount of the cooling gas is controlled by a pressure gauge (not shown) attached to the cooling box 252, and the control temperature of the cooling panel 251 is set for each cooling gas (Ar, O ₂ , He gas). From the equilibrium vapor pressure curve (refer to the graph of FIG. 8), it is selected so as to be equal to or higher than the condensing temperature of the cooling gas under the pressure condition.

Further, the distance between the cooling panel 251 and the outer peripheral surface of the cooling roll 250 (50 μm, 500 μm), the type of cooling gas (Ar, O ₂ , He gas), the pressure in the cooling box 252 (50, 500, 5000 Pa), the cooling panel 251 For each temperature (90, 130, 300 K) conditions, the film temperature immediately after the heat-resistant polyimide film 413 comes out of the temperature-controlled cooling roll 436 is measured, and the heat-resistant polyimide film 413 is in the ion beam chamber 434. The presence or absence of wrinkles when exiting was also observed.

These results are shown in Table 9 (Ar), Table 10 (O ₂ ), and Table 11 (He), respectively.

From the data groups shown in Tables 9 to 11, in the case of the type of cooling gas (Ar, O ₂ , He), the temperature of the cooling panel 251 is 130 K or less, and the gas pressure in the cooling box 252 ( 50 Pa, 500 Pa), the cooling panel 251 and the cooling roll 250 outer peripheral surface (50 μm) is in the molecular flow region, it is confirmed that the heat-resistant polyimide film 413 is efficiently cooled, and ion beam irradiation It was also confirmed that no wrinkles were generated when the film temperature of the heat-resistant polyimide film 413 was less than 30 ° C.

  According to the apparatus for cooling a long resin film according to the present invention, the structure of a rotating shaft in a cooling roll, a cooling can roll or the like can be simplified. For example, for an existing sputtering web coater that does not include an ion beam chamber. However, it is possible to easily install an ion beam chamber without any large-scale remodeling or modification. Therefore, a copper-clad laminated resin film (with a metal film) used for flexible wiring boards such as liquid crystal televisions and mobile phones. It has industrial applicability applied as a manufacturing apparatus and manufacturing method of a heat resistant resin film).

10 Rotating roll (cooling roll, cooling can roll)
DESCRIPTION OF SYMBOLS 11 Rotating shaft 12 Refrigerant introduction double piping 13 Rotary joint 14 Water supply hose 15 Drainage hose 16 Magnetic seal 17 Bearing 18 Bearing 20 Vacuum chamber wall 21 Motor 22 Pulley 23 Belt 110 Unwinding chamber 111 Deposition chamber 112 Winding chamber 113 Heat resistance Long resin film 114 Unwinding roll 115, 121, 125, 128 Tension sensor roll 116 Heater box 117, 118 Heater 119, 120, 126, 127 Free roll 122 Carrying side guide roll (front feed roll)
123 Cooling can roll (rotating roll)
124 Unloading side guide roll (rear feed roll)
129 Winding rolls 130, 131, 132, 133 Magnetron sputtering cathode (target)
134 Ion beam chamber 135 Carry-in side guide roll (free roll)
136 Cooling roll 137 Unloading side guide roll (free roll)
138 Ion beam irradiation device 210 Cooling roll (rotating roll)
211 Cooling panel 212 Cooling box 213, 214 Gas nozzle 230 Cooling roll (rotating roll)
231 Cooling panel 232 Cooling box 233, 234 Gas introduction pipe 235 Hollow structure (gas introduction plate)
236 Gas introduction path 237 Cooling gas discharge hole 250 Cooling roll (rotating roll)
251 Cooling panel 252 Cooling box 253, 254 Gas introduction pipe 255 Porous structure (gas introduction porous plate)
256 Gas introduction path 410 Unwinding chamber 411 Film forming chamber 412 Winding chamber 413 Heat-resistant long resin film 414 Unwinding roll 415, 421, 425, 428 Tension sensor roll 416 Heater box 417, 418 Heater 419, 420, 426, 427 Free roll 422 Carry-in side guide roll (front feed roll)
423 Cooling Can Roll (Rotating Roll)
424 Unloading side guide roll (rear feed roll)
429 Winding rolls 430, 431, 432, 433 Magnetron sputtering cathode (target)
434 Ion beam chamber 435 Loading side guide roll (free roll)
436 Cooling roll (rotating roll)
437 Ion beam irradiation device 438 Unloading side guide roll (free roll)
439 Cooling panel 440 Cryo refrigerator 441 Cooling box

Claims (15)

A long resin film conveyed from the upstream side by the roll-to-roll method is wound around the winding area of the outer peripheral surface via the carry-in side guide roll and downstream from the winding area of the outer peripheral surface via the carry-out side guide roll A long roll resin film provided in a vacuum chamber with a rotary roll carried out to the cooling roll and cooling means for cooling the rotary roll and cooling the long resin film on the rotary roll wound around the winding area of the outer circumferential surface of the rotary roll In the cooling device of
The cooling means is provided in a space region defined by the outer peripheral surface of the rotating roll and the outer peripheral surfaces of the carry-in side guide roll and the carry-out side guide roll, and is located on the opposite side to the winding region of the long resin film. Cooling panel that is disposed in the vicinity of the non-winding area of the outer peripheral surface of the rotating roll and has a refrigerator that can be cooled to 130K or less, and cooling that introduces a cooling gas between the non-winding area of the outer peripheral surface of the rotating roll and the cooling panel. An apparatus for cooling a long resin film, comprising: a gas introduction means, and no cooling means for cooling the rotary roll by circulating a refrigerant inside the rotary roll .   The cooling device for a long resin film according to claim 1, further comprising a cooling box surrounding the non-wrapping region of the cooling panel and the outer peripheral surface of the rotating roll.   The long resin film cooling device according to claim 1 or 2, wherein a distance between the cooling panel and the non-winding region of the outer peripheral surface of the rotating roll is set to 20 to 200 µm.   The cooling gas introducing means is constituted by a gas nozzle that has a nozzle tip disposed between a non-wrapping region on the outer peripheral surface of the rotating roll and a cooling panel and discharges the cooling gas from the nozzle tip. The cooling device of the long resin film in any one of Claims 1-3.   The cooling gas introducing means is a hollow structure in which cooling gas is introduced from a gas introduction pipe attached and connected to a side of the cooling panel facing the non-winding region of the outer peripheral surface of the rotary roll, and the hollow structure The cooling of the long resin film according to any one of claims 1 to 3, comprising a plurality of cooling gas discharge holes established on a side of the outer peripheral surface of the rotating roll facing the non-winding region. apparatus.   The cooling gas introduction means is composed of a porous structure in which cooling gas is introduced from a gas introduction pipe attached and connected to a side of the cooling panel facing the non-wrapping region of the outer peripheral surface of the rotating roll. The apparatus for cooling a long resin film according to any one of claims 1 to 3. A long resin film conveyed by the roll-to-roll method from the upstream side is wound around the winding area of the outer peripheral surface of the rotating roll via the carry-in guide roll and is wound around the outer peripheral surface of the rotating roll via the unloading-side guide roll A long resin that is transported from the downstream to the downstream side and cooled by the cooling means provided in the vacuum chamber to cool the long resin film on the rotary roll wound around the winding area of the outer peripheral surface of the rotary roll In the film cooling method,
The cooling means is provided in a space region defined by the outer peripheral surface of the rotating roll and the outer peripheral surfaces of the carry-in side guide roll and the carry-out side guide roll, and is located on the opposite side to the winding region of the long resin film. Cooling panel that is disposed in the vicinity of the non-winding area of the outer peripheral surface of the rotating roll and has a refrigerator that can be cooled to 130K or less, and cooling that introduces a cooling gas between the non-winding area of the outer peripheral surface of the rotating roll and the cooling panel. A cooling method for a long resin film, comprising: a gas introduction unit; and no cooling unit for circulating the refrigerant inside the rotary roll to cool the rotary roll .   The panel temperature of the cooling panel is set higher than a temperature at which the cooling gas aggregates according to an equilibrium vapor pressure curve of the cooling gas under a pressure condition of the cooling gas introduced by the cooling gas introduction means. The cooling method of the long resin film of 7.   The cooling gas introducing means is constituted by a gas nozzle that has a nozzle tip disposed between a non-wrapping region on the outer peripheral surface of the rotating roll and a cooling panel and discharges the cooling gas from the nozzle tip. The cooling method of the long resin film of Claim 7 or 8.   The cooling gas introducing means is a hollow structure in which cooling gas is introduced from a gas introduction pipe attached and connected to a side of the cooling panel facing the non-winding region of the outer peripheral surface of the rotary roll, and the hollow structure The cooling method for a long resin film according to claim 7 or 8, comprising a plurality of cooling gas discharge holes provided on a side of the outer peripheral surface of the rotating roll facing the non-winding region.   The cooling gas introduction means is composed of a porous structure in which cooling gas is introduced from a gas introduction pipe attached and connected to a side of the cooling panel facing the non-wrapping region of the outer peripheral surface of the rotating roll. The method for cooling a long resin film according to claim 7 or 8. A long resin comprising a surface treatment means for treating the surface side of a long resin film conveyed by a roll-to-roll method and a cooling device for cooling the long resin film heated by the surface treatment in a vacuum chamber. In film surface treatment equipment,
The said cooling device is comprised by the cooling device in any one of Claims 1-6, and the said surface treatment means is arrange | positioned at the winding area | region side of the rotary roll outer peripheral surface around which a long resin film is wound. A surface treatment apparatus for a long resin film.   The surface treatment apparatus for a long resin film according to claim 12, wherein the surface treatment is ion beam treatment or plasma treatment.   The surface treatment apparatus for a long resin film according to claim 12, wherein the surface treatment is a film formation treatment by a vacuum film formation method.   15. The surface treatment apparatus for a long resin film according to claim 14, wherein the vacuum film forming method is magnetron sputtering.

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