JP5889640B2 - Resin game board, mold and method for manufacturing resin game board - Google Patents

Description

  The present invention relates to a resin game board for a game machine using a game ball such as a pachinko game machine, an arrange ball game machine, and a sparrow ball game machine as a game medium, a mold for manufacturing the resin game board, and a manufacturing method.

  In recent years, from the viewpoints of recyclability, economy, environment, design, etc., resin game boards are being adopted instead of game machines made of wooden plywood (for example, veneer).

  A game board made by injection molding as a resin game board, in which the central part of the game board as a game area is a circular thick part that can hold the obstacle nail and the other part is a thin part. A board has been proposed (Patent Document 1). By setting it as such a game board, weight reduction can be achieved compared with the case where a game board is formed in a uniform thick part.

  However, in general, the cooling time required for producing a resin game board having a thickness of 5.0 mm or less is almost 1 minute or less, but becomes progressively longer when the thickness is 5.0 mm or more. . The cooling time required for producing a resin game board having a thickness of about 10.0 mm, which is a thickness capable of implanting a obstacle nail or the like, is approximately 3 minutes or more. In this way, in order to mold a resin game board having a thickness that can be used to plant obstacle nails, the cooling time gradually increases according to the thickness, so that the molding cycle can be shortened. It was a big obstacle.

  Also, in conventional resin game boards, the thick part and the thin part have significantly different thicknesses, so the time required for cooling the thick part and the thin part during injection molding, respectively. Therefore, there is a problem that the contraction timing is different and warpage or dents are likely to occur.

  Furthermore, the above-mentioned resin game board is premised on producing a plurality of molds according to the type of gaming machine when molding by injection molding, and there are many game boards with a small number of shipments or a large number of shipments. Since any type of game board has the same cost for producing a mold, there is a problem that the merit of cost reduction by mass production is not utilized.

JP-A-10-113428

  Therefore, the present invention has been made in view of the above problems, and even a resin game board having a thick portion of approximately 5.0 mm or more can shorten the molding cycle as compared with the conventional one. The main purpose is to provide a game board, and even a resin game board with different thicknesses for thick and thin parts may cause warpage and unevenness due to differences in cooling time. Another object of the present invention is to provide a resin game board capable of reducing the performance. It is another object of the present invention to provide a resin game board that can utilize the merit of cost reduction by injection molding even if it is a different type of game board.

  The present invention adopts the following means in order to achieve the main object described above.

The resin game board of the present invention is a resin game board formed by injection molding used in a ball game machine.
The resin game board has a thick part of 5.0 mm or more in which a nail can be implanted,
The thick portion is formed by at least two steps of a primary molding step of molding the first resin layer by injection molding and a secondary molding step of molding the second resin layer,
At least one part of the first resin layer and the second resin layer is integrally laminated in a mold during secondary molding.

  According to the present invention, in a resin game board molded by injection molding, a thick part having a thickness of 5.0 mm or more capable of implanting a nail is separated into two layers of a first resin layer and a second resin layer. And forming the first resin layer and the second resin layer by laminating the first resin layer and the second resin layer so that the thickness of the first resin layer and the second resin layer in the thick portion is the thickness of the entire thick portion, respectively. It can be made thinner. Therefore, the cooling time of the primary molding process for forming the first resin layer and the secondary molding process for forming the second resin layer can be shortened. By adopting such a configuration, even when the total molding time of the molding time of the primary molding process and the molding time of the secondary molding process is compared with the case where the entire resin game board is molded by a single injection molding. And can be shortened. Therefore, it is possible to shorten the molding cycle time of the resin game board. In addition, by making the thick part into two layers, even if there is a thin part in the resin game board, the difference in thickness between the thin part and the first resin layer or between the thin part and the second resin layer Since the difference between the thick part and the thin part can be reduced, the difference in the rate of shrinkage and the length of the cooling time can be reduced. The degree can be reduced.

  In the resin game board of the present invention, the resin game board includes a plurality of assembly openings for assembling game parts, and the first resin layer has at least the assembly openings in the game area. It may include all the areas. If the first resin layer includes all the areas of the assembly opening in the game area that changes depending on the model, the mold for molding the first resin layer can be variously different if the portion having the assembly opening is nested. It becomes possible to produce the 1st resin layer which has an assembly opening of a different shape for a model with the same metallic mold. Therefore, since the mold for primary molding itself can be a mold having versatility for various models, the mold for primary molding can be compared with the case of producing molds for each model. The manufacturing cost can be reduced.

  On the other hand, by nesting the part to which the first resin layer of the secondary molding die is attached, the nesting can be changed according to the first resin layer having different assembly openings corresponding to different models. The mold for secondary molding can also be a versatile mold. Therefore, also in the secondary molding, the manufacturing cost of the mold can be reduced as compared with the case where the mold is manufactured for each model. Note that it is not always necessary to form both the primary molding die and the secondary molding die in a nested manner, and only one of the molds may be formed in a nested manner.

  Furthermore, in the resin game board according to the present invention, the first resin layer is erected on the periphery of the assembly opening exposed on the surface when the first resin layer is integrally laminated by secondary molding. An opening rib is provided. By adopting such a configuration, it is possible to prevent the resin flowing in the mold from flowing into the assembly opening by the assembly opening rib formed in the first resin layer during the secondary molding. Therefore, even when the shape, size, and number of assembly openings are changed as appropriate, the mold for secondary molding should be prepared in a nest that can fix the first resin layer. Regardless of the shape of the assembly opening, the portion outside the assembly opening can be molded without the resin flowing into the assembly opening. Therefore, the types of nesting of the mold for secondary molding can be reduced. Furthermore, if the attachment portion of the first resin layer of the secondary molding die is formed in a recess similar to the outer peripheral edge of the first resin layer, the first resin layer can be formed in the secondary molding die without any gap. Since it can be attached, it is possible to omit the nesting of the mold for secondary molding, and by using the mold for secondary molding as it is, it is possible to further reduce the production cost of the mold. .

  Furthermore, in the resin game board of the present invention, the thick portion has a thin portion around the thick portion, and the outer peripheral end portion of the thin portion has an outer peripheral rib erected from the outer peripheral end portion to the back side. The thin portion and the outer peripheral rib may be made of the second resin layer. In the present invention, since the thick portion is separated into two layers and molded, the second resin layer has a thick portion of 1 even if it has a relatively thin thin portion and an outer peripheral rib. Since it is thinner than the case where it is molded in a single time, it can be brought close to the shrinkage rate and cooling time of the thin wall portion and the outer peripheral rib. Therefore, even if it is a case where it molds simultaneously with the thick part of the 2nd resin layer, possibility that a warp and an unevenness will occur can be reduced.

  Furthermore, in the resin game board according to the present invention, the resin game board may have a two-layer region in which the first resin layer is formed in two layers so as to sandwich the second resin layer therebetween. Good. By adopting such a configuration, the possibility that the first resin layer and the second resin layer are separated can be reduced.

  Furthermore, in the resin game board according to the present invention, the resin game board may have a two-layer region in which the second resin layer is formed in two layers so as to sandwich the first resin layer. Good. By adopting such a configuration, it is possible to reduce the possibility that the first resin layer and the second resin layer are separated for the same reason as in the case where the first resin layer sandwiches the second resin layer.

  Furthermore, in the resin game board of the present invention, the resin game board has an uneven surface such as a relief or a relief on at least a part of a boundary surface of the first resin layer that forms a boundary with the second resin layer. It may be a thing. By adopting such a configuration, it is possible to form a design surface including an uneven surface such as a relief or a relief on the surface of the first resin layer at the boundary between the first resin layer and the second resin layer. Therefore, it is possible to obtain a resin game board in which the design surface is gorgeously expressed by utilizing refraction of light transmitted through the resin game board.

  Furthermore, in the resin game board of the present invention, the two steps may be formed by insert molding or two-color molding. By adopting such a configuration, a resin game board having the first resin layer and the second resin layer can be produced in two steps separated in time, or produced in two steps continuous in time. can do. Regardless of insert molding or two-color molding, the first resin layer can be laminated and integrated with the second resin layer without using an adhesive.

  In the mold for producing the resin game board according to the present invention, the mold for forming the molding surface of the first resin layer by the primary molding is formed by nesting including a convex part for forming the assembly opening. It is characterized by that. By adopting such a configuration, it is possible to obtain a highly versatile mold in which the first resin layer having different assembly openings of different models can be molded by exchanging the insert. By using such a mold, the number of first resin layers shot with one mold can be increased, so that the mold cost per one first resin layer can be kept low. The mold cost per resin game board can be kept low.

  Further, in the mold for producing the resin game board of the present invention, the mold used for the secondary molding is formed by nesting having a convex portion adapted to the assembly opening formed in the first resin layer. It may be what has been done. By adopting such a configuration, even if the first resin layer has different assembly openings, a plurality of types of first resin can be used in the same mold by exchanging the nesting of the mold used for the secondary molding. The resin layer can be fixed, and molding that is integrated with the second resin layer can be performed. Therefore, a resin game board having various assembly openings can be produced, and the mold cost per one resin game board can be kept low.

  Further, in the mold for producing the resin game board according to the present invention, the mold used for the secondary molding is formed with a recess that can be fixed by fitting the outer periphery of the first resin layer molded by the primary molding. It may be what has been done. By adopting such a configuration, the first resin layer can be fixed by fitting the first resin layer into the recess of the secondary molding die, and molding that is integrated with the second resin layer can be performed. it can. This makes it possible to mold the first resin layer having various assembly openings without producing a mold nesting used for secondary molding, thus reducing the mold cost per resin game board. It can be kept low. As an example of the concave portion into which the outer periphery of the first resin layer can be fitted, the concave portion formed so as to fit snugly as the concave portion having the same size as the outer periphery of the first resin layer, or the outer periphery of the first resin layer A concavity formed so that the first resin layer formed and fitted so as to be in contact with at least three of them does not move can be considered.

The production method for producing the resin game board of the present invention is as follows:
(1) A primary molding step of molding the first resin layer that is disposed on the back side of the thick part and has a thickness smaller than the thickness of the thick part,
(2) A secondary molding step of molding the second resin layer for molding a part of the surface side of the thick part.
It is characterized by including.
By adopting such a configuration, it is possible to produce a resin game board in which the thick part is laminated in two layers, and it is possible to provide a resin game board having the above-described effects.

  According to the resin game board of the gaming machine according to the present invention, it is possible to provide a resin game board that can shorten the molding cycle as compared with the prior art.

FIG. 1 is a perspective view showing an outline of the configuration of the pachinko gaming machine 120 according to the first embodiment. FIG. 2 is a front view of the pachinko gaming machine 120 according to the first embodiment. FIG. 3 is a rear view of the pachinko gaming machine 120 according to the first embodiment. FIG. 4 is a front view of the resin game board 10 according to the first embodiment and an AA cross-sectional view of the front view. FIG. 5 is an exploded perspective view in which the first resin layer 20 and the second resin layer 30 of the resin game board 10 of the first embodiment are disassembled. FIG. 6 is a perspective view showing the primary molding die 50 and the first resin layer 20 according to the first embodiment. FIG. 7 is a cross-sectional view showing the secondary molding die 60 and the second resin layer 30 according to the first embodiment. FIG. 8 is a process diagram showing a part of the process of the method for manufacturing the resin game board 10 according to the first embodiment. FIG. 9 is a cross-sectional view of a portion corresponding to A-AA in FIG. 1 showing a modification of the resin game board 10 according to the first embodiment. FIG. 9A is a cross-sectional view of the resin game board 10 according to the second embodiment, FIG. 9B is a cross-sectional view showing a further modification of the resin game board 10 according to the second embodiment, and FIG. FIG. 5 is a cross-sectional view of a resin game board 10 according to a third embodiment. FIG. 10 is a perspective view and a cross-sectional view of a resin game board 10 according to the fourth embodiment. FIG. 11 is a cross-sectional view of the insert 61 of the secondary molding die 60 according to the fifth embodiment. FIG. 12 is a cross-sectional view of a secondary molding die 60 according to the sixth embodiment. FIG. 13 is a process diagram of a method of manufacturing the resin game board 10 according to the seventh embodiment. FIG. 14A shows a cross-sectional view at the time of molding the first resin layer 22 in the primary molding in the manufacturing method according to the seventh embodiment, and FIG. 14B shows a cross-sectional view at the time of molding the second resin layer 32 in the secondary molding. Show

  Now, a mode for carrying out the present invention will be described in detail based on the above-described drawings. In this embodiment, a pachinko gaming machine 120 will be described as an example of a ball game machine.

(First embodiment)
Hereinafter, the manufacturing method of the resin gaming board 10, the primary molding die 50, the secondary molding die 60, and the resin gaming board 10 according to the first embodiment will be described in detail with reference to the drawings.

  First, the configuration of a pachinko gaming machine 120 to which the resin gaming board 10 of the present invention is attached will be briefly described with reference to FIGS. Here, FIG. 1 is a perspective view showing an outline of the configuration of the pachinko gaming machine 120, FIG. 2 is a front view of the pachinko gaming machine 120, and FIG. 3 is a rear view of the pachinko gaming machine 120. As shown in FIG. 1, the pachinko gaming machine 120 includes an outer frame 122 that is supported by being sandwiched between an upper plate and a lower plate on an island such as a pachinko hall, and a main body frame 130 that is pivotally supported by the outer frame 122. And a transparent plate holding frame 171 that is provided on one side of the main body frame 130 and is pivotally mounted by a hinge (not shown) so as to be opened and closed.

  As shown in FIG. 2, the main body frame 130 includes a resin game board 10 including a game area α, a launch handle 132 that is rotatably provided at one side position of the lower front portion, and a lower front portion that is not shown. A ball tray 134 that stores game balls, and a speaker 136 that is provided at both sides of the main body frame 130 below the ball tray 134 and emits a production sound or the like. Further, on the back side of the main body frame 130, as shown in FIG. 3, a ball payout device 140 for supplying a prize ball or a rental ball from a ball tank 138 provided in the upper portion, and a ball payout control enclosed in an enclosing case A main board including the board 148 and the main control board 170 and a peripheral board including the lamp control board 149 are provided.

  As shown in FIG. 2, the resin game board 10 is positioned below the symbol variation display device 152 or the symbol variation display device 152 having a large liquid crystal panel that is positioned substantially in the center and displays various effects such as winnings. It has a game area α in which a large winning opening 156a and a plurality of winning holes 156 located on both sides of the large winning opening 156a are arranged, and a group of obstacle nails composed of a windmill and a number of obstacle nails is appropriately arranged on the surface. . A game ball (not shown) in the ball tray 134 is guided to a hit ball launching device (not shown) via a hitting ball supply device (not shown), and is launched into the game area α with a strength corresponding to the rotation degree of the launch handle 132. When a game ball injected into the game area α having the obstacle nail group 159, the winning hole 156, etc. by the launching device (not shown) passes through the windmill or the obstacle nail group 159 and reaches the winning hole 156 or the big prize opening 156a, It is detected by a winning ball switch provided in the winning opening 156 or the large winning opening 156a, and is treated as a winning when the main control board 170 receives a winning signal. In this case, a ball payout signal is transmitted from the main control board 170 to the ball payout control board 148, and a prize ball is supplied from the ball tank 138 through the ball payout device 140 to the ball receiving tray 134. You can get a prize ball.

  A resin game board 10 according to the first embodiment is shown in FIGS. FIG. 4 is a front view of the resin game board 10 according to the first embodiment and an AA sectional view of the front view, and FIG. 5 is a first resin layer 20 of the resin game board 10 of the first embodiment. 2 is an exploded perspective view of the second resin layer 30 viewed from two directions. In FIG. 5, the first resin layer 20 and the second resin layer 30 are decomposed, but in actuality, they are not decomposed. In all the following embodiments, a resin layer molded by primary molding is referred to as a first resin layer, and a resin layer molded by secondary molding is referred to as a second resin layer.

  The resin game board 10 of the first embodiment is made of polycarbonate, and as shown in the AA cross-sectional view of FIG. 4, the thick part 11 and the thin part formed around the thick part 11. 12 and an outer peripheral rib 13 which is an outer periphery of the thin portion 12 and is erected along the outer periphery of the resin game board 10. Furthermore, various sizes for attaching a decorative body (for example, 156a in FIG. 2) such as a symbol change device, a big prize opening, an electronic display, or an electrical decoration device to the thick portion 11 of the resin game board 10. Alternatively, a plurality of assembly openings 14 having a shape are formed.

  As shown in the AA cross-sectional view of FIG. 4 and FIG. 5, the thick portion 11 includes an assembly opening rib 20 a of the first resin layer 20, and a laminated region β of the first resin layer 20 and the second resin layer 30. And it is formed with the side surface outer periphery rib 30a which covers the side surface outer periphery of the 1st resin layer 20 among the 2nd resin layers 30. The thick portion 11 is formed in a region substantially the same as the game region α and has a thickness of about 10.0 mm. Here, the game area α is an area where a winning device or the like is provided and a game ball can freely move, and indicates a hatched portion shown in FIG.

  As shown in FIG. 5, the first resin layer 20 is formed to have substantially the same size as the game area α, and is about the back surface side 11 a of the second resin layer 30 of the thick portion 11 (see FIG. 4). It is formed with a thickness of 5.0 mm. The first resin layer 20 is provided with an assembly opening rib 20a having a thickness of about 1.0 mm that is erected so as to be exposed to the surface of the resin game board 10 so as to form an inner peripheral wall at the periphery of the assembly opening 14. It has.

  The second resin layer 30 is disposed in almost the entire region of the resin game board 10 except for the region of the assembly opening 14 and the assembly opening rib 20a of the first resin layer 20, and the thick portion 11 (see FIG. 4). ), The thin wall portion 12 and the outer peripheral rib 13 are formed. In the region of the thick portion 11 in the second resin layer 30, the second resin layer 30 is formed to have a thickness of about 5.0 mm and is disposed so as to be laminated on the surface of the first resin layer 20. The thin portion is formed with a thickness of about 5.0 mm, and the outer peripheral rib 13 is formed with a thickness of about 2.0 mm.

  Next, the metal mold | die for shape | molding the resin game board 10 mentioned above is demonstrated. As shown in FIG. 6, the mold used in the first embodiment molds a primary molding mold 50 for molding the first resin layer 20 and the second resin layer 30 as shown in FIG. A secondary molding die 60 is provided. 6 is a perspective view showing the primary molding die 50 and the first resin layer 20, and FIG. 7A is a cross-sectional view showing the secondary molding die 60 and the first resin layer 20. 7B is a cross-sectional view showing a state in which the secondary resin layer 30 is injected.

  As shown in FIG. 6, the primary molding die 50 includes a fixed die 50a, a movable die 50b, and a nest 51 attached to the movable die. Note that other components necessary for injection molding such as a gate and an extrusion pin are omitted. The nesting 51 is formed so as to include all the regions for forming the assembly openings 14 so that the assembly openings 14 of the resin game board 10 can all be formed. Thereby, by exchanging the insert 51, the first resin layers 20 having different assembly openings 14 can be molded using the same primary molding die 50.

  As shown in FIG. 7, the secondary molding die 60 includes a fixed die 60a, a movable die 60b, and a nest 61 attached to the movable die 60b. The nest 61 is formed with a convex portion 61a so as to fit the assembly opening 14 of the first resin layer 20 so that the first resin layer 20 molded by the primary molding can be fixed. Further, side outer peripheral rib forming grooves 62 for forming the side outer peripheral rib 30 a are formed on the outer periphery of the first resin layer 20. A resin for secondary molding is injected between the fixed mold 60 a and the first resin layer 20, and is integrated with the first resin layer 20 to produce the resin game board 10.

  Next, a method for producing the resin game board 10 of the first embodiment will be described with reference to the drawings.

(Insert molding)
FIG. 8 shows a schematic diagram of a part of the secondary molding step of the method for manufacturing the resin game board 10 according to the first embodiment. In addition, the metal mold | die of FIG. 8 is simplified and illustrated. The manufacturing method of the resin game board 10 according to the first embodiment is roughly divided into a primary molding process of the first resin layer 20 and a secondary molding in which the first resin layer is inserted and integrated with the second resin layer 30. It is insert molding which consists of a process.

  The primary molding step is a step of molding the first resin layer 20 and is molded by injection molding using a primary molding die 50 to which a nest 51 having a desired assembly opening 14 is attached. The molding method of the first resin layer 20 is not particularly limited, and a conventional injection molding method can be employed. As for the cooling time of the first resin layer 20 in the primary molding step, when polycarbonate is used for the first resin layer 20, the thickness is 5.0 mm, and therefore a cooling time of approximately 1 minute or less is sufficient.

  The secondary molding step is manufactured by injection molding using a secondary molding die 60 to which a nest 61 capable of fixing the first resin layer 20 molded by primary molding is attached. First, the 1st resin layer 20 shape | molded by primary shaping | molding is attached to the guide member 71 for arrange | positioning in the metal mold | die 60 for secondary shaping | molding (FIG. 8A). From this state, the guide member 71 moves into the secondary molding die 60 in the mold open state (FIG. 8B), and the first resin layer 20 is attached to the insert 61 (FIG. 8C). Then, the guide member 71 is moved out of the mold, the secondary molding die 60 is closed, and a resin for secondary molding is injected (FIG. 8D). Thereby, the 1st resin layer 20 and the 2nd resin layer 30 are integrated. Then, after the cooling time has elapsed, the secondary molding die 60 is opened (FIG. 8E), and the integrated resin game board 10 is taken out from the secondary molding die 60 to be completed (FIG. 8). 8F). The cooling time by this secondary molding is approximately 1 minute or less because the second resin layer 30 becomes a polycarbonate having a thickness of 5.0 mm when a polycarbonate having a thickness of 5.0 mm is used for the first resin layer 20. The cooling time is sufficient.

  According to the resin game board 10 according to the first embodiment, in the manufacturing by the conventional injection molding method, the cooling time is progressively increased according to the thickness, and the thick portion is primary molded. And secondary molding are laminated in two steps, and compared with the case where a resin game board having the same outer shape is molded by one injection molding, primary molding and secondary molding are performed in the molding process. The problem can be solved by greatly reducing the total time required for cooling the molding, and the molding cycle can be shortened.

  Further, at the time of molding, primary molding and secondary molding are avoided by avoiding a large non-uniformity in the thickness of the molded part due to the thick part 11 and the thin part 12 that occurs when molding is performed by one injection molding. In any case, by suppressing the difference in thickness between the thick part and the thin part to the minimum, the possibility of occurrence of warpage or unevenness can be reduced.

  Furthermore, by making the first resin layer 20 having assembly openings of various shapes in advance and stocking by making it possible to mold in two steps of primary molding and secondary molding, secondary molding can be performed. Since the resin game board 10 can be produced only in the process time, it is possible to easily cope with a case where a sudden increase in production is required.

  Further, by replacing the insert 51 of the primary molding die 50, the first resin layer 20 having the assembly openings 14 of various shapes of different models can be produced. The primary molding die 50 is common. Thus, the cost burden of the primary molding die 50 per product can be reduced. Further, the primary molding die 50 is a die that molds the first resin layer 20 that is smaller than the overall size of the resin game board 10 disposed on the back side of the thick portion 11. Compared with a mold for molding the panel 10 at a time, a small mold is sufficient, and it is possible to reduce a long time and a great cost for manufacturing the mold.

  Furthermore, by replacing the insert 61 of the secondary molding die 60, the first resin layer 20 having the assembly openings 14 of various shapes of different models can be attached and integrated with the second resin layer 30. Therefore, like the primary molding die 50, the secondary molding die 60 can be used repeatedly in common. Therefore, the cost burden of the secondary molding die 60 per product can be reduced.

  In the manufacturing method for manufacturing the resin game board 10 described above, the primary molding step and the secondary molding step are (1) disposed on the back side of the thick portion and having a thickness smaller than the thickness of the thick portion. A primary molding step of molding the first resin layer having a plurality of the assembly openings, and (2) a secondary molding of the second resin layer for molding a part of the surface side of the thick portion. What is necessary is just to include a shaping | molding process.

  Furthermore, in the manufacturing method for manufacturing the resin game board 10 described above, the primary molding step and the secondary molding step are (1) arranged on the back side of the thick portion and thinner than the thickness of the thick portion. A primary molding step of molding the first resin layer having a plurality of the assembly openings and the assembly opening ribs; and (2) forming the part on the surface side of the thick portion. A secondary molding step of molding the two resin layers may be included.

  Further, in the manufacturing method for manufacturing the resin gaming board 10 described above, (1) the plurality of sets are arranged on the back surface side of the thick part and have a thickness smaller than the thickness of the thick part. A primary molding step of molding the first resin layer having the attached opening and the assembled opening rib; (2) the second resin for molding a part of the surface side of the thick portion, the thin portion, and the outer peripheral rib. A secondary forming step of forming the layer.

  Hereinafter, modifications of the resin game board 10 according to the first embodiment will be described.

(Second Embodiment)
FIG. 9A shows a resin game board 10 according to the second embodiment. FIG. 9A shows a cross-sectional view of the resin game board 10 according to the second embodiment, which is the same as the AA part of FIG. The resin game board 10 according to the second embodiment is formed so that the second resin layer 30 sandwiches the first resin layer 20 in the vicinity of the side surface outer peripheral rib 30a of the first resin layer 20. That is, the second resin layer 30 is disposed on both the lower surface and the upper surface of the first resin layer 30. Other configurations are the same as those of the resin game board 10 of the first embodiment. In order to produce such a resin game board 10, a step or slope may be formed on the outer periphery of the side surface of the first resin layer 20 from the back surface side to the front surface side during the primary molding. By performing secondary molding using the first resin layer 20, the molten resin for secondary molding flows into the stepped portion so that the second resin layer 30 is formed into the first resin layer. The resin game board 10 formed so as to sandwich 20 can be produced.

  According to the resin game board 10 according to the second embodiment, even if the interfacial adhesion between the first resin layer 20 and the second resin layer 30 is low, the first resin layer 20 and the second resin layer The possibility of separation from 30 can be reduced.

  In the second embodiment described above, as shown in FIG. 9B, the first resin layer 20 is formed so as to sandwich a part of the second resin layer 30 in the vicinity of the side surface outer peripheral rib 30a of the first resin layer 20. May be. Similarly, even when such a configuration is adopted, the possibility that the first resin layer 20 and the second resin layer 30 are separated can be reduced.

(Third embodiment)
FIG. 9C shows a resin game board 10 according to the third embodiment. FIG. 9C is a cross-sectional view of the resin game board 10 according to the second embodiment, which is the same as the AA part in FIG. 4. The resin game board 10 according to the third embodiment is different from the resin game board 10 according to the first embodiment in that it does not have the assembly opening rib 20a. Other points are the same as the resin game board of the first embodiment. Even when such a configuration is adopted, the resin game board 10 having the same function as that of the first embodiment can be obtained.

(Fourth embodiment)
A resin game board 10 according to the fourth embodiment is shown in FIG. The resin game board 10 according to the third embodiment has a design surface having reliefs and other irregularities, such as relief, on a part of the surface of the first resin layer 20 at the boundary between the first resin layer 20 and the second resin layer 30. Is formed. The resin used for the second resin layer 30 is a colorless transparent, colored transparent or highly transparent resin, and the design surface of the first resin layer 20 can be visually recognized from the surface. Other configurations are the same as those of the resin game board 10 of the first embodiment. In order to form irregularities such as reliefs, a design surface having irregularities may be formed on the surface of the primary molding die 50 and may be reversed when the first resin layer 20 is molded, or the first resin layer Concavities and convexities may be formed after molding 20. The design surface may be colored in addition to the unevenness.

  By adopting such a configuration, the design surface can be expressed gorgeously by refraction of light transmitted through the resin game board 10.

  Next, a modified example of the insert 61 of the secondary molding die 60 of the first embodiment will be described.

(Fifth embodiment)
A nesting 61 of the secondary molding die 60 according to the fifth embodiment is shown in FIG. FIG. 11 is a cross-sectional view of the insert 61 of the secondary molding die 60 according to the fifth embodiment. The nest 61 according to the fifth embodiment is different from the nest 61 of the first embodiment in that a part of the convex portion 61a corresponding to the assembly opening 14 is not present. Other configurations are the same as the nesting 61 of the first embodiment.

  The insert 61 of the secondary molding die 60 according to the fifth embodiment can be applied to the first resin layer 20 according to the first embodiment, the second embodiment, and the fourth embodiment. That is, the second resin layer 30 can be molded when the first resin layer 20 having the assembly opening rib 20a is used. When the first resin layer 20 having the assembly opening rib 20a is installed in the secondary molding die 60, the assembly opening rib 20a comes into contact with the fixed mold when the mold is closed. 20a regulates the fluidity of the molten resin during the secondary molding and prevents the resin from flowing into the assembly opening 20a. Therefore, even if the convex part 61a does not exist, the resin game board in which the assembly opening 14 is formed can be formed. Therefore, even if the shape, size, number, and the like of the assembly opening 14 are changed, if the first resin layer 20 can be fixed to the movable mold, secondary molding can be performed. . Thereby, the kind of the nest | insert 61 of the metal mold | die 60 for secondary shaping | molding can be reduced, and the expense burden of the nest | insert per product can be reduced.

  Next, a modification of the secondary molding die of the first embodiment will be described.

(Sixth embodiment)
The secondary molding die 60 according to the sixth embodiment is different from the first embodiment in that no nest exists. The movable mold 60b of the secondary molding die 60 of the sixth embodiment has a concave portion 61b of a size that allows the outer periphery of the primary resin layer 20 to fit snugly in advance, and the primary resin layer 20 Can be fixed to the movable mold 60b by fitting in the recess 61b. For this reason, in the primary molding, the outer periphery of the primary resin layer 20 formed with the same assembly opening rib 20a as in the fifth embodiment is produced with the same size, so that various combinations can be made without corresponding by nesting. A resin game board having the attached opening 14 can be formed. According to the sixth embodiment, the manufacturing cost of the nesting can be further reduced.

  In the sixth embodiment, the recess 61b is sized so that the outer periphery of the primary resin layer 20 fits snugly. However, the present invention is not limited to this, and at least of the outer periphery of the first resin layer. The concave part etc. which were formed so that the 1st resin layer formed and fitted so that it might contact 3 or more points might not move may be sufficient.

    Next, the modification of the manufacturing method of the resin game board 10 of 1st Embodiment is demonstrated.

(Seventh embodiment)
(Two-color molding)
A method for manufacturing the resin game board 10 according to the seventh embodiment is shown in FIG. FIG. 13 is a process diagram of a method of manufacturing the resin game board 10 according to the seventh embodiment. This is a manufacturing method for two-color molding of the resin game board 10 of the seventh embodiment, which is molded by two molds for primary molding and secondary molding, respectively.

  First, the metal mold | die concerning this embodiment consists of two metal mold | dies, and each becomes a movable mold | type and a fixed mold | type. The two first movable molds 55b and the second movable mold 65b are provided so as to be rotatable around both molds, and are shared molds for the primary molding and the secondary molding. In the fixed mold, one fixed mold is a primary molding fixed mold 55a dedicated to primary molding, and the other fixed mold is a secondary molding fixed mold 65a dedicated to secondary molding. In the mold thus configured, all molds are closed from the state where all molds are opened (FIG. 13A). In this state, a primary molding resin is injected into the primary molding fixed mold 55a and the first movable mold 55b to mold the first resin layer 20 (FIG. 13B). After sufficient cooling, all molds are opened (FIG. 13C). At this time, the first resin layer 20 is attached to the first movable mold 55b. Without removing the first resin layer 20 from the first movable mold 55b in this state, the first movable mold 55b corresponds to the secondary molding fixed mold 65a, and the second movable mold 65b is the primary molding fixed mold. The first movable mold 55b and the second movable mold 65b are rotated so as to correspond to 55a (FIG. 13D). After all the molds are closed again, the second movable mold 65b injects the primary molding resin into the primary molding fixed mold 55a, molds the first resin layer 21, and the first movable mold 55b A secondary molding resin is injected into the secondary molding die 65a, and the second resin layer 30 is molded and integrated with the first resin layer 20 molded earlier (FIG. 13E). After cooling, all the molds are opened to form the first resin layer 21 on the second movable mold 65b, and the first resin layer 20 and the second resin layer 30 are formed on the first movable mold 55b. And a resin game board 10 in which are integrated with each other (FIG. 13F).

  According to the method for manufacturing the resin game board 10 of the seventh embodiment, the thicknesses of the first resin layer 20 and the second resin layer 30 are thicker than when the resin game board is molded at a time. Since the meat part is formed thin, the cooling time can be shortened, so that the production efficiency can be improved. Moreover, since the molding of the first resin layer 20 and the molding of the second resin layer 30 are performed simultaneously, the molding time can be halved.

(Eighth embodiment)
FIG. 14A shows a method for manufacturing the resin game board 10 according to the eighth embodiment. FIG. 14A shows a cross-sectional view during molding of the first resin layer 22 in primary molding in the manufacturing method according to the eighth embodiment, and FIG. 14B shows a cross-sectional view during molding of the second resin layer 32 in secondary molding. Show.

  In the eighth embodiment, the surface side of the resinous gaming board 10 is molded with the first resin layer 22 in the primary molding, and then the second resin layer 32 is injected on the back surface side in the second molding. The point which integrates 32 with the 1st resin layer 22 is different from embodiment mentioned above. That is, first, the first resin layer 22 is molded by the primary molding die 50 that is formed so that the first resin layer 22 can be formed by the fixed mold 50a and the movable mold 50b. At this time, the assembly opening rib 20a is provided in the first resin layer 22 on the surface side. Thereby, the flow of the resin for forming the second resin layer 32 at the time of secondary molding can be regulated. As shown in FIG. 14B, the second resin layer 32 is integrated with the first resin layer 22 using a secondary molding die 60 having a nesting 61 capable of fixing the first resin layer 22, and a resin game. A board 10 is produced.

  When the front side 11b of the thick part, the thin part 12 and the outer peripheral rib 13 are first molded by primary molding, and the rear side part (second resin layer) 32 of the thick part is molded by secondary molding. The main components of the game board, which has a large overall area, uses a large amount of resin, and requires a relatively long cooling time, can be molded and stocked first. Therefore, even when a sudden increase in production is required, it is only necessary to mold the second resin layer 32 having a short cooling period by secondary molding, so that it is possible to respond quickly.

  In addition, this invention is not limited to each embodiment mentioned above, and it cannot be overemphasized that it can implement with a various aspect, as long as it belongs to the technical scope of this invention. In addition, the second to fourth embodiments, which are modifications of the resin game board 10 according to the first embodiment, the fifth embodiment, which is a modification of the mold nesting according to the first embodiment, and the first embodiment. The sixth embodiment, which is a modified example of the mold according to the embodiment, and the seventh embodiment and the eighth embodiment, which are modified examples of the manufacturing method according to the first embodiment, are combined and implemented as long as they are applicable. can do.

  In the above-described embodiment, the polycarbonate resin is used as the material of the resin game board 10, but the present invention is not limited to this, and an acrylic resin such as polymethyl methacrylate resin, an ABS resin, or a resin such as polystyrene is used. Can be adopted. Further, in the above-described embodiment, the colorless and transparent acrylic resin is adopted. However, it is not necessarily transparent as long as it can be used, and may be colored and transparent or colored and opaque. In particular, if a colored resin is used on the back side and a transparent resin is used on the front side, it is possible to provide a resin game board having a high design by taking advantage of the two-layer structure. Moreover, the resin of the 1st resin layer 20 and the 2nd resin layer 30 does not necessarily need to be the same resin. In consideration of the adhesiveness between the first resin layer 20 and the second resin layer 30 and the influence of warping during and after molding, it is preferable to use resins having the same shrinkage rate.

  In the above-described embodiment, the thick portion 11 has been described as an example of a region substantially similar to the game region α. However, the present invention is not limited to this, and the thick portion 11 is larger than the game region α. The resin game board 10 may be a resin game board 10 having a thick portion 11 smaller than the game area α.

  Furthermore, in the embodiment described above, the primary molded nest 51 is formed so as to include the entire assembly opening 14, but not necessarily all the assembly openings 14. For example, when a common assembly opening 14 is present in a plurality of models, a convex portion may be formed not on the insert 51 but on the primary molding die 50 itself.

  Furthermore, in the above-described embodiment, the case where the nesting is used for both the primary molding die 50 and the secondary molding die 60 has been mainly described. Good.

  Further, in the above-described embodiment, the thickness of the first resin layer 20 that is a part of the thick part 11 formed in the primary molding and the second resin layer that is a part of the thick part 11 formed by the secondary molding. The thickness of 30 is formed to the same thickness, but is not limited to this, and may be a different thickness. For example, when the manufacturing method in which the first resin layer 20 can be stocked in advance is employed as in the first embodiment, the first resin layer 20 formed in the thick thick portion 11 that requires a long cooling time is previously formed. By forming the second resin layer 30 having the relatively thin thick portion 11 when a sudden increase in production is required, the cooling time is shortened, so that it is easy to respond quickly. Moreover, although it demonstrated using the resin game board 10 which has the thick part 11 of 10.0 mm as thickness of the thick part 11, it is not limited to this, The thick part 11 of 5.0 mm or more is used. What is necessary is just the resin game board 10 which has. If it has a thick part of 5.0 mm or more, even if it is a case where it manufactures in two processes, shortening of a molding cycle can be aimed at. The use of the resin game board 11 having a thickness of preferably 8.0 mm or more facilitates the effect of shortening the time.

  As shown in the above-described embodiment, the present invention can be used in the field of resin plate molding, in particular, in the field of game machine molding.

DESCRIPTION OF SYMBOLS 10 ... Resin game board, 11 ... Thick part, 11a ... Back side, 11b ... Front side, 12 ... Thin part, 13 ... Outer peripheral rib, 14 ... Assembly opening, 20 ... 1st resin layer, 20a ... Assembly Opening ribs,
DESCRIPTION OF SYMBOLS 21 ... 1st resin layer, 30 ... 2nd resin layer, 30a ... Side surface outer periphery rib, 50 ... Primary mold, 50a ... Fixed mold, 50b ... Movable mold, 51 ... Nest, 55a ... Fixed mold for primary molding ,
55b ... first movable mold, 60 ... secondary molding mold, 60a ... fixed mold, 60b ... movable mold,
61 ... Nest, 61a ... Convex part, 62 ... Side surface outer peripheral rib forming groove,
65a ... fixed mold for secondary molding, 65b ... second movable mold, 71 ... induction member,
DESCRIPTION OF SYMBOLS 100 ... Injection molding machine, 120 ... Pachinko machine, 122 ... Outer frame, 130 ... Main body frame,
132 ... Launch handle, 134 ... Ball tray, 136 ... Speaker, 138 ... Ball tank,
140 ... ball dispensing device, 148 ... ball dispensing control board, 149 ... lamp control board,
156... Winning prize opening, 156a .large winning prize opening, 159.
171 ... Transparent plate holding frame

Claims (6)

In a resin game board used for a ball game machine,
The resin game board has a thick part including a game area having a thickness of 5.0 mm or more in which a nail can be implanted, and a thin part thinner than the thick part,
The thick part is composed of a first resin layer and a second resin layer,
The thin portion is composed of either the first resin layer or the second resin layer,
The resin game board, wherein the first resin layer and the second resin layer are integrally laminated. The resin game board includes a plurality of assembly openings for assembling game parts,
2. The resin game board according to claim 1, wherein the first resin layer includes at least an area having the assembly opening in the game area.   3. The resin game board according to claim 2, wherein the first resin layer includes an assembly opening rib formed upright on a peripheral edge of the assembly opening exposed on the surface. The thin portion has the thin portion around the thick portion, and the outer peripheral end portion of the thin portion includes an outer peripheral rib erected on the back side from the outer peripheral end portion,
4. The resin game board according to claim 1, wherein the thin portion and the outer peripheral rib are formed in the second resin layer. 5. In the manufacturing method of the resin game board according to any one of claims 1 to 4,
(1) Said 1st which is arrange | positioned in the back surface side of the said thick part, and has thickness thinner than the thickness of the said thick part.
A primary molding step for molding the resin layer,
(2) A secondary molding step of molding the second resin layer for molding a part of the surface side of the thick part.
A manufacturing method for manufacturing a resin game board characterized by comprising:   In the manufacturing method of the resin game board according to any one of claims 1 to 4,
(1) The second part disposed on the back side of the thick part and having a thickness smaller than the thickness of the thick part.
A primary molding step for molding the resin layer,
(2) A secondary molding step of molding the first resin layer for molding a part of the surface side of the thick part.
  A manufacturing method for manufacturing a resin game board characterized by comprising:

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