JP5887700B2 - High frequency transformer - Google Patents
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Description
本発明は、電力変換回路に用いる高周波トランスの巻線と端子引き出し構造に関する。 The present invention relates to a winding and a terminal lead structure of a high-frequency transformer used in a power conversion circuit.
図４に一般的な高周波トランスの概観図を示す。コア1に巻線部５が巻回され、高周波トランスが構成される。1次巻線２−１、２−２のそれぞれの端子Ｐ１とＰ２、さらに２次巻線３の端子Ｓ１〜Ｓ６はそれぞれプリント基板６に接続される。尚、ここでは巻線を直接プリント基板６に接続した例を示しているが、ボビンを介して接続しても構わない。トランス内部の巻線構成は図５に示すように1次巻線が２−１と２−２に分割され、コア１の中脚を中心に巻回される。２次巻線３を1次巻線２−１と２−２の間に構成するサンドイッチ巻きとすることで、1次巻線と２次巻線の物理的距離が短くなり、1次巻線と２次巻線の漏れ磁束が低減される。 FIG. 4 shows an overview of a general high-frequency transformer. A winding part 5 is wound around the core 1 to constitute a high-frequency transformer. The terminals P1 and P2 of the primary windings 2-1 and 2-2 and the terminals S1 to S6 of the secondary winding 3 are connected to the printed circuit board 6, respectively. Although an example in which the winding is directly connected to the printed circuit board 6 is shown here, it may be connected via a bobbin. As shown in FIG. 5, the primary winding is divided into 2-1 and 2-2 and is wound around the center leg of the core 1. By making the secondary winding 3 a sandwich winding formed between the primary windings 2-1 and 2-2, the physical distance between the primary winding and the secondary winding is shortened, and the primary winding And the leakage flux of the secondary winding is reduced.
情報通信用のスイッチング電源などでは、ＣＰＵやメモリの電源電圧が低下していることもあり、低い出力電圧に変換することを求められている。よって、２次巻線３のターン数は通常1となる。また、ＣＰＵやメモリの消費電力も増加しているので、大電流を出力する必要があり、２次巻線の断面積も増加させなければならない。一方で、損失を低減させるためには高周波領域における抵抗値を下げる必要があり、巻線の表面積を大きくして表皮効果を低減する構成にしなければならない。図５では２次巻線３を３本の線で構成し、並列接続させることで、単線で構成するよりも表面積を増加させた例を示している。 In a switching power supply for information communication or the like, the power supply voltage of a CPU or memory is sometimes lowered, and it is required to convert it to a low output voltage. Therefore, the number of turns of the secondary winding 3 is normally 1. Further, since the power consumption of the CPU and memory is also increasing, it is necessary to output a large current, and the cross-sectional area of the secondary winding must be increased. On the other hand, in order to reduce the loss, it is necessary to lower the resistance value in the high frequency region, and it is necessary to increase the surface area of the winding to reduce the skin effect. FIG. 5 shows an example in which the secondary winding 3 is composed of three wires and connected in parallel, thereby increasing the surface area compared to a single wire.
このように構成された高周波トランスの等価回路は図６のようになり、1次巻線（２−１と２−２）が２次巻線（３ａ、３ｂ及び３ｃ）と磁気結合する。２２〜２５はそれぞれの漏れインダクタンスであり、結合係数が高いほど小さくなる。２１は1次側引き出し線の配線インダクタンス、２６〜２８はそれぞれ２次側引き出し線の配線インダクタンスである。なお、ここでは抵抗成分は図示していない。 An equivalent circuit of the high-frequency transformer configured as described above is as shown in FIG. 6, and the primary windings (2-1 and 2-2) are magnetically coupled to the secondary windings (3a, 3b, and 3c). Reference numerals 22 to 25 denote leakage inductances, which become smaller as the coupling coefficient is higher. Reference numeral 21 denotes a wiring inductance of the primary lead-out line, and 26 to 28 denote wiring inductances of the secondary lead-out line, respectively. The resistance component is not shown here.
上述の高周波トランスを電力変換回路に適用した例を図７に示す。ここでは、特許文献１に示された、高周波トランス４の1次側にスイッチ素子１１〜１４で構成されたフルブリッジのスイッチ回路を、２次側にリアクトル２９、３０と整流用スイッチ素子１５、１６で構成された倍電流整流回路を適用したＤＣ−ＤＣコンバータを例に挙げて説明する。ＤＣ−ＤＣコンバータの入力電圧はコンデンサ３１が並列接続された直流電圧である。この直流電圧はＡＣ１００ＶやＡＣ２００Ｖ系の系統電圧を整流して得られるため、最大電圧は４００Ｖ程度の高電圧となる。一方、情報通信用のスイッチング電源におけるＤＣ−ＤＣコンバータの出力電圧は通常１２Ｖ程度である。ここで、スイッチ素子１１と１４がオンすると高周波トランス４の入力端子Ｐ１とＰ２間に直流入力電圧が印加され、スイッチ素子１２と１３がオンするとＰ１とＰ２間に直流入力電圧が逆極性で印加される。従って、スイッチ素子１１〜１４を順次駆動することでＰ１とＰ２間に高周波の交流電圧を発生させ、配線インダクタンス２１を介して高周波トランス４に電力を供給することができる。高周波トランス４の２次側では、整流用スイッチ素子１５、１６とリアクトル２９、３０、平滑コンデンサ３４で整流平滑され、直流電圧が負荷３５に供給される。ここで、整流用スイッチ素子１５と１６にはＭＯＳＦＥＴが使用され、スイッチ素子１５と１６のボディダイオードが導通する期間にゲート信号を与えることで、スイッチ素子１５と１６のボディダイオードではなくＭＯＳＦＥＴ側に支配的に電流が流れ、導通損失が低減される。 An example in which the above-described high-frequency transformer is applied to a power conversion circuit is shown in FIG. Here, a full-bridge switch circuit composed of switch elements 11 to 14 on the primary side of the high-frequency transformer 4 shown in Patent Document 1, and reactors 29 and 30 and a rectifying switch element 15 on the secondary side, A DC-DC converter to which the double current rectifier circuit constituted by 16 is applied will be described as an example. The input voltage of the DC-DC converter is a DC voltage in which a capacitor 31 is connected in parallel. Since this DC voltage is obtained by rectifying the AC 100V or AC 200V system voltage, the maximum voltage is a high voltage of about 400V. On the other hand, the output voltage of the DC-DC converter in the switching power supply for information communication is usually about 12V. Here, when the switch elements 11 and 14 are turned on, a DC input voltage is applied between the input terminals P1 and P2 of the high-frequency transformer 4, and when the switch elements 12 and 13 are turned on, a DC input voltage is applied between P1 and P2 with a reverse polarity. Is done. Accordingly, by sequentially driving the switch elements 11 to 14, a high-frequency AC voltage can be generated between P 1 and P 2, and power can be supplied to the high-frequency transformer 4 via the wiring inductance 21. On the secondary side of the high-frequency transformer 4, the rectifying switch elements 15 and 16, the reactors 29 and 30, and the smoothing capacitor 34 are rectified and smoothed, and a DC voltage is supplied to the load 35. Here, MOSFETs are used for the rectifying switch elements 15 and 16, and a gate signal is applied to the MOSFET side instead of the body diodes of the switch elements 15 and 16 by applying a gate signal while the body diodes of the switch elements 15 and 16 are conductive. A current flows dominantly and conduction loss is reduced.
高周波トランス４の２次巻線３ａ、３ｂ及び３ｃのそれぞれに流れる電流値が異なると、各巻線に生じる銅損もアンバランスとなる。ここで、各巻線に流れる電流値は各巻線の抵抗値によって決定される。例えば、巻線３ａと３ｂの抵抗値に対して巻線３ｃの抵抗値が１／２の場合、巻線３ｃに流れる電流は他の巻線の２倍になる。巻線３ａと３ｂのそれぞれの抵抗をR、流れる電流実行値をIとすると、巻線３ａと３ｂに生じる銅損P3a、P3bは以下となる。
P3a＝P3b=RI2 ・・・・・式（１）
それに対して、巻線３ｃに生じる銅損P3cは下式となり、巻線３ａと３ｂに生じる銅損の２倍となる。
P3c=R/2×(2I)2=2RI2 ・・・・・式（２）
従って、各巻線の抵抗値がアンバランスすると、銅損もアンバランスし、特定の巻線で温度が上昇してしまう。従って、特許文献２に示されるように、巻線の抵抗値をそろえるため、巻線の長さも同等にすることが望ましい。
If the current values flowing in the secondary windings 3a, 3b and 3c of the high-frequency transformer 4 are different, the copper loss generated in each winding is also unbalanced. Here, the current value flowing through each winding is determined by the resistance value of each winding. For example, when the resistance value of the winding 3c is 1/2 with respect to the resistance values of the windings 3a and 3b, the current flowing through the winding 3c is twice that of the other windings. Assuming that the resistances of the windings 3a and 3b are R and the current execution value is I, the copper losses P 3a and P 3b generated in the windings 3a and 3b are as follows.
P 3a = P 3b = RI 2 Equation (1)
On the other hand, the copper loss P 3c generated in the winding 3c is represented by the following formula, which is twice the copper loss generated in the windings 3a and 3b.
P 3c = R / 2 × (2I) 2 = 2RI 2 Equation (2)
Therefore, when the resistance value of each winding is unbalanced, the copper loss is also unbalanced and the temperature rises in a specific winding. Therefore, as shown in Patent Document 2, it is desirable to make the lengths of the windings equal to equalize the resistance values of the windings.
図８に、２次巻線３ａ、３ｂ及び３ｃの巻線長を同等にするための引き出し方法を、図９にその概観図を、各々示す。各巻線（３ａ、３ｂ、３ｃ）の一端Ｓ１、Ｓ２及びＳ３を高周波トランスの上（プリント板に接続する側を下と定義）から、他端Ｓ４、Ｓ５及びＳ６を下から引き出す。ここで、例えばＳ１、Ｓ２及びＳ３もＳ４〜Ｓ６と同様に下から引き出すと、高周波トランス上部で巻回す巻線３ａが長くなり、下部を巻回す巻線３ｃが短くなってしまう。逆にＳ４、Ｓ５及びＳ６もＳ１〜Ｓ３と同様に上から引き出す場合には、高周波トランス上部で巻回す巻線３ａが短く、下部で巻回す巻線３ｃが長くなってしまう。従って、巻線のどちらか一端を上から、他端を下から引き出すことで長さを揃えている。
しかし、一端を上から他端を下から引き出すことで、２次巻線の一端から他端までの一巡ループ面積が大きくなり、2次側の配線インダクタンスが増加してしまう。
FIG. 8 shows a drawing method for equalizing the winding lengths of the secondary windings 3a, 3b and 3c, and FIG. 9 shows an overview diagram thereof. One end S1, S2, and S3 of each winding (3a, 3b, 3c) is pulled out from above the high-frequency transformer (the side connected to the printed board is defined as bottom), and the other end S4, S5, and S6 is pulled out from below. Here, for example, if S1, S2, and S3 are also drawn from the bottom in the same manner as S4 to S6, the winding 3a wound around the upper portion of the high-frequency transformer becomes longer and the winding 3c wound around the lower portion becomes shorter. On the other hand, when S4, S5, and S6 are pulled out from the top like S1 to S3, the winding 3a wound at the upper part of the high-frequency transformer is short and the winding 3c wound at the lower part becomes long. Accordingly, the lengths are aligned by pulling out one end of the winding from the top and the other end from the bottom.
However, pulling out one end from the top and the other end from the bottom increases the loop area from one end to the other end of the secondary winding and increases the wiring inductance on the secondary side.
この配線インダクタンスは図６や図７における配線インダクタンス２６〜２８に相当し、回路動作に大きく影響を与える。ここで、1次側巻線の巻線端子Ｐ１とＰ２から２次側巻線の巻線端子Ｓ１〜Ｓ６までの等価回路を図１０に示す。等価回路では、1次側配線インダクタンス２１と1次側漏れインダクタンス２２及び２次側寄生インダクタスの1次側換算分４１が直列接続された形になる。２次側漏れインダクタンス（２３〜２５）をLs2、2次側配線インダクタンス（２６〜２８）をLw2とすると、２次側寄生インダクタンス成分の1次側換算値Lsは以下となる。
Ls＝（Ls2＋Lw2）×(N1／N2)2 ・・・・・ 式（３）
ただし、N1は1次側のターン数、N2は２次側のターン数である。低圧出力のスイッチング電源における1次巻線のターン数は通常２０〜３０程度、２次巻線のターン数は通常１であるため、Lsは（Ls2＋Lw2）の４００〜９００倍と大きな値になり、回路内のインダクタンス成分は２次側寄生インダクタンス成分によって生じる２次側寄生インダクタンス成分の1次側換算値Lsが支配的になる。
This wiring inductance corresponds to the wiring inductances 26 to 28 in FIGS. 6 and 7 and greatly affects the circuit operation. Here, an equivalent circuit from the winding terminals P1 and P2 of the primary winding to the winding terminals S1 to S6 of the secondary winding is shown in FIG. In the equivalent circuit, the primary side wiring inductance 21, the primary side leakage inductance 22, and the primary side equivalent 41 of the secondary side parasitic inductance are connected in series. When the secondary side leakage inductance (23 to 25) is Ls2 and the secondary side wiring inductance (26 to 28) is Lw2, the primary side converted value Ls of the secondary side parasitic inductance component is as follows.
Ls = (Ls2 + Lw2) × (N 1 / N 2) 2 ····· formula (3)
N 1 is the number of turns on the primary side, and N 2 is the number of turns on the secondary side. In a low-voltage output switching power supply, the number of turns of the primary winding is usually about 20 to 30, and the number of turns of the secondary winding is usually 1. Therefore, Ls is a large value of 400 to 900 times (Ls2 + Lw2). The inductance component in the circuit is dominated by the primary side converted value Ls of the secondary side parasitic inductance component generated by the secondary side parasitic inductance component.
高周波トランスに流れる電流と２次側電圧を図１１に示す。端子Ｐ１とＰ２間に正の電圧が印加されると、まず寄生インダクタンス成分（２１、２２及び４１の直列回路）に電圧が印加され高周波トランスの電流が上昇する。この電流が２次側のリアクトル２９又は３０に流れている電流値まで達すると、電圧が寄生インダクタンス側でなくトランスの巻線（N1やN2）に印加され、トランスの２次側に電圧が発生する。端子Ｐ１とＰ２間に電圧が印加されてから２次側の電圧が立ち上がるまでの遅延時間tdは以下の式で表される。
td=L×Δi／Vin ・・・・・（４）
ここで、Lは寄生インダクタンス成分であり、２１と２２のインダクタンス値およびLs４１の和である。この式から、遅延時間tdは寄生インダクタンス成分Lに依存して増加する。ただし、Δiは電流変化分、VinはDC−DCコンバータの入力電圧である。
FIG. 11 shows the current flowing through the high-frequency transformer and the secondary side voltage. When a positive voltage is applied between the terminals P1 and P2, a voltage is first applied to the parasitic inductance component (series circuit of 21, 22, and 41), and the current of the high-frequency transformer rises. When this current reaches the current value flowing through the reactor 29 or 30 on the secondary side, the voltage is applied not to the parasitic inductance side but to the transformer winding (N 1 or N 2 ), and the voltage is applied to the secondary side of the transformer. Will occur. The delay time td from when a voltage is applied between the terminals P1 and P2 to when the secondary voltage rises is expressed by the following equation.
td = L × Δi / Vin (4)
Here, L is a parasitic inductance component, which is the sum of inductance values 21 and 22 and Ls41. From this equation, the delay time td increases depending on the parasitic inductance component L. However, Δi is a current change amount and Vin is an input voltage of the DC-DC converter.
寄生インダクタス成分が大きい場合、図１２に示すように遅延時間tdが増加し、２次側電圧が発生する時間tが短くなる。従って、周期Tに対する2次側電圧が発生する時間tの比率が小さくなるので、所望の出力電圧を得られなくなってしまう。寄生インダクタンス成分が大きい状態で所望の出力電圧を得るためには、1次側巻線のターン数を低減させ、変圧比を増加させる必要がある。しかし、2次側に発生する電圧V2は下式となり、1次側ターン数N1の減少とともに増加する。
V2=Vin×N2／N1 ・・・・・式（５）
従って、2次側に適用するスイッチ素子１５と１６に高い耐圧の素子を使用しなければならなく、導通損失とコストが増加してしまう。
さらに、1次側に流れる電流I1は下式となり、1次側ターン数の減少にともない、増加する。
I1=Io×N2／N1 ・・・・・式（６）
ここで示したIoは負荷電流である。従って、１次側回路での導通損失や1次巻線での銅損が増加してしまう。
When the parasitic inductance component is large, the delay time td is increased as shown in FIG. 12, and the time t during which the secondary side voltage is generated is shortened. Accordingly, since the ratio of the time t at which the secondary side voltage is generated with respect to the period T becomes small, a desired output voltage cannot be obtained. In order to obtain a desired output voltage with a large parasitic inductance component, it is necessary to reduce the number of turns of the primary winding and increase the transformation ratio. However, the voltage V 2 generated on the secondary side is expressed by the following equation, and increases as the number of primary side turns N 1 decreases.
V 2 = Vin × N 2 / N 1 Equation (5)
Therefore, high breakdown voltage elements must be used for the switch elements 15 and 16 applied to the secondary side, which increases conduction loss and cost.
Furthermore, the current I 1 flowing through the primary side is expressed by the following formula, and increases as the number of primary side turns decreases.
I 1 = Io × N 2 / N 1 Equation (6)
Io shown here is a load current. Therefore, conduction loss in the primary circuit and copper loss in the primary winding increase.
上述のように、２次側の寄生インダクタンスが増加すると、２次側での電圧の低下に伴い１次巻数に対する２次巻数比を高くする必要が生じる。その結果、１次スイッチ回路での導通損失と１次巻線の銅損が増え、さらに２次回路スイッチ素子の高耐圧化に伴い、導通損失が増加する。従って、本願の課題は、２次側の配線インダクタンスを低減させた高周波トランスを提供し、装置の効率向上と低コスト化を実現することである。 As described above, when the parasitic inductance on the secondary side increases, it is necessary to increase the secondary turns ratio with respect to the primary turns as the voltage on the secondary side decreases. As a result, the conduction loss in the primary switch circuit and the copper loss of the primary winding increase, and the conduction loss increases as the secondary circuit switch element has a higher breakdown voltage. Therefore, an object of the present application is to provide a high-frequency transformer in which the wiring inductance on the secondary side is reduced, and to improve the efficiency and cost of the device.
上述の課題を解決するために、第１の発明においては、プリント基板に取付けて使用する高周波トランスであって、並列接続する複数の２次巻線を前記高周波トランスの３脚コアの中脚の下部（プリント基板取付側）から上部に各々の２次巻線を分割して各々１ターンずつ巻回して構成し、前記プリント基板の導体で並列接続する高周波トランスにおいて、前記複数の２次巻線の中の少なくとも１個の巻線の一端から他端までの配線インダクタンスが他の２次巻線の配線インダクタンスに比べて小さくなるように前記高周波トランスから引き出す。 In order to solve the above-described problem, in the first invention, a high-frequency transformer used by being attached to a printed circuit board, wherein a plurality of secondary windings connected in parallel are connected to the middle leg of the three-leg core of the high-frequency transformer . from the lower (printed circuit board mounting side) by dividing each of the secondary winding to the upper constitutes turn by each one turn, the high frequency transformer connected in parallel with the conductor of the printed circuit board, the plurality of secondary windings wiring inductance from one end of at least one winding to the other end in the draws from the high-frequency transformer to be smaller than the wiring inductance of the other secondary windings.
第２の発明においては、プリント基板に取付けて使用する高周波トランスであって、並列接続する複数の２次巻線を３脚コアの中脚の下部（プリント基板取付側）から上部に各々の２次巻線を分割して各々１ターンずつ巻回し、前記３脚コアの３脚が前記プリント基板の導体面と直交する方向に配置する前記プリント基板の並列接続導体に、前記複数の２次巻線のそれぞれの端を直接又は他の導体を介して接続する高周波トランスにおいて、前記複数の２次巻線のうち、前記３脚コアの中脚のプリント基板側で巻回す２次巻線の両端を、前記プリント基板の並列接続導体からの配線インダクタンスが他の２次巻線の配線インダクタンスに比べて小さくなるように引き出す。 In the second invention, the high-frequency transformer is used by being attached to a printed circuit board, and a plurality of secondary windings connected in parallel are arranged from the lower part (printed circuit board attachment side) to the upper part of the middle leg of the three-leg core. each 1 turn turns by winding by dividing the following winding, a parallel connection conductors of the printed circuit board 3 leg of the tripod core is disposed in a direction perpendicular to the conductive surface of the printed circuit board, the plurality of secondary winding in the high frequency transformer for connecting the respective ends of the line directly or via another conductor, both ends of the plurality of secondary windings, the winding turn secondary winding in the printed circuit board side of the middle leg of the three legs core a wiring inductance from the parallel connection conductors of the printed circuit board is pulled out to be smaller than the wiring inductance of the other secondary windings.
第３の発明においては、プリント基板に取付けて使用する高周波トランスであって、並列接続する複数の２次巻線を３脚コアの中脚の下部（プリント基板取付側）から上部に各々の２次巻線を分割して各々１ターンずつ巻回し、前記３脚コアの３脚が前記プリント基板の導体面と直交する方向に配置する前記プリント基板の並列接続導体に、前記複数の２次巻線のそれぞれの端を直接又は他の導体を介して接続する高周波トランスにおいて、前記複数の２次巻線のうち、前記３脚コアの中脚の中央部で巻回す２次巻線の両端を、プリント基板の並列接続導体からの配線インダクタンスが他の２次巻線の配線インダクタンスに比べて小さくなるように引き出す。 According to a third aspect of the present invention, there is provided a high-frequency transformer used by being attached to a printed circuit board, wherein a plurality of secondary windings connected in parallel are arranged from the lower part (printed circuit board attachment side) to the upper part of the middle leg of the three-leg core. each 1 turn turns by winding by dividing the following winding, a parallel connection conductors of the printed circuit board 3 leg of the tripod core is disposed in a direction perpendicular to the conductive surface of the printed circuit board, the plurality of secondary windings in the high frequency transformer for connecting the respective ends of the line directly or via another conductor, both ends of the plurality of secondary windings, wound around at central portion in the middle leg of the three legs core secondary winding a wiring inductance from the parallel connection conductors of the printed circuit board is pulled out to be smaller than the wiring inductance of the other secondary windings.
第４の発明においては、第１〜第３のいずれかの発明における前記配線インダクタンスが他の２次巻線の配線インダクタンスに比べて小さい２次巻線の断面積を他の２次巻線の断面積よりも小さく設定する。 In the fourth invention, the first to third one of the wiring inductance other secondary winding of the cross-sectional area of the other secondary winding of the small secondary windings as compared to the wiring inductance of the invention Set smaller than the cross-sectional area.
本発明では、複数の巻線が並列接続された２次巻線のうち少なくとも１個の巻線をループ面積が他に比べて小さくなるように引き出しているので、高周波トランスにおける2次側の配線インダクタンスを低減させることができ、1次側電圧と2次側電圧の遅延時間を短くすることができる。その結果、高周波トランスの変圧比を低減させることができ、装置の高効率化と低コスト化が可能になる。 In the present invention, at least one of the secondary windings in which a plurality of windings are connected in parallel is drawn out so that the loop area is smaller than the other windings. Inductance can be reduced, and the delay time between the primary side voltage and the secondary side voltage can be shortened. As a result, the transformation ratio of the high-frequency transformer can be reduced, and the efficiency and cost of the device can be reduced.
本発明の要点は、複数の巻線が並列接続された２次巻線のうち少なくとも１個の巻線をループ面積が他に比べて小さくなるように引き出している点である。 The main point of the present invention is that at least one of the secondary windings in which a plurality of windings are connected in parallel is drawn out so that the loop area is smaller than the others.
図１に、本発明の第１の実施例を示す巻線構造図を、図２にそれを適用した高周波トランスの概観図を示す。図２（ａ）が正面図、図２（ｂ）が図１（ａ）の左側面図である。
図１は並列接続された２次巻線３におけるそれぞれの巻線３ａ、３ｂ及び３ｃの巻線形状を示している。２次側の寄生インダクタンス（漏れインダクタンス23〜25と配線インダクタンス26〜28との和）において、配線インダクタンスが支配的である場合の実施例である。磁性体コア１は３脚で構成され、中脚に並列接続される３個の巻線３ａ、３ｂ及び３ｃを各々１ターン巻回した構成である。３個の巻線はプリント基板６上で並列接続される。即ち一方の端子Ｓ１、Ｓ２及びＳ３同士、及び他方の端子Ｓ４、Ｓ５及びＳ６同士が、各々プリント基板上で接続される。図１（ａ）は巻線３ａの巻線構造を示す。巻線３ａはコア１の中脚の上部（プリント基板側を下部と定義）に１ターン巻き回され、各端子Ｓ１、Ｓ４は高周波トランスの上部（プリント基板側を下部と定義）から引き出され、プリント基板６の並列接続用導体に接続される。図１（ｂ）は巻線３ｂの巻線構造を示す。巻線３ｂはコア１の中脚の中央部に１ターン巻回され、各端子Ｓ２、Ｓ５は高周波トランスの上部から引き出され、プリント基板６の並列接続用導体に接続される。図１（ｃ）は巻線３ｃの巻線構造を示す。巻線３ｃはコア１の中脚の下部に１ターン巻回され、各端子Ｓ３、Ｓ６は高周波トランスの下部から引き出され、プリント基板６の並列接続用導体に接続される。図２（ａ）、図２（ｂ）からわかるように、巻線３ａと３ｂは上部から、巻線３ｃは下部から、各々引き出され、各々プリント基板６の並列接続用導体に接続される。
FIG. 1 shows a winding structure diagram showing a first embodiment of the present invention, and FIG. 2 shows an overview of a high frequency transformer to which the winding structure is applied. 2A is a front view, and FIG. 2B is a left side view of FIG.
FIG. 1 shows the winding shapes of the respective windings 3a, 3b and 3c in the secondary winding 3 connected in parallel. In the secondary side parasitic inductance (the sum of the leakage inductances 23 to 25 and the wiring inductances 26 to 28), the wiring inductance is dominant. The magnetic core 1 is composed of three legs, and each of the three windings 3a, 3b and 3c connected in parallel to the middle leg is wound by one turn. Three windings are connected in parallel on the printed circuit board 6. That is, one terminal S1, S2 and S3 and the other terminal S4, S5 and S6 are connected on the printed circuit board. FIG. 1A shows the winding structure of the winding 3a. Winding 3a is wound one turn in the upper part of the middle leg of the core 1 (which defines the printed circuit board side and bottom), the terminals S1, S4 is withdrawn from the high-frequency transformer of the upper (define printed circuit board side and bottom) which are connected in parallel connection conductor of the printed circuit board 6. FIG. 1B shows a winding structure of the winding 3b. Winding 3b is wound one turn around the central portion of the center leg of the core 1, the terminals S2, S5 is withdrawn from the top of the high-frequency transformer, is connected in parallel connection conductor of the printed circuit board 6. FIG. 1C shows the winding structure of the winding 3c. Winding 3c is wound one turn around the bottom of the middle leg of the core 1, the terminals S3, S6 is withdrawn from the bottom of the high-frequency transformer, is connected in parallel connection conductor of the printed circuit board 6. FIG. 2 (a), the as can be seen from FIG. 2 (b), the windings 3a and 3b are top, the winding 3c from the lower, drawn respectively, are each connected to a parallel connection conductor of the printed circuit board 6 .
以上のような構成にすると、巻線３ａと３ｂの引き出し線の一巡ループ面積に比べて、巻線３ｃの引き出し線の一巡ループ面積は小さくなる。この結果、巻線３ａと３ｂの配線インダクタンスは大きく、巻線３ｃの配線インダクタンスは小さくなる。ここで、巻線３ａ、３ｂ及び３ｃは全て並列接続されているため、巻線３ｃの配線インダクタンスのみが小さくなれば、２次側巻線全体の配線インダクタンスを低減させることができる。従って、図１１と図１２に示す遅延時間tdを短縮することができ、電力変換回路の高効率化、低コスト化が図れる。 With the above configuration, the loop area of the lead line of the winding 3c is smaller than the loop area of the lead line of the windings 3a and 3b. As a result, the wiring inductances of the windings 3a and 3b are large, and the wiring inductance of the winding 3c is small. Here, since the windings 3a, 3b and 3c are all connected in parallel, if only the wiring inductance of the winding 3c is reduced, the wiring inductance of the entire secondary winding can be reduced. Therefore, the delay time td shown in FIGS. 11 and 12 can be shortened, and the efficiency and cost of the power conversion circuit can be reduced.
尚、ここでは引き出し線をプリント基板に直接接続する例を示しているが、ボビンの接続ピンを介してプリント基板に接続しても、他の導体を介して接続しても良い。
ここで、各巻線の断面積を同じにした場合、一巡ループ面積を小さくした配線インダクタンスの小さい巻線は、抵抗値が小さくなり、高周波トランス４の２次巻線３ａ、３ｂ及び３ｃのそれぞれに流れる電流値が異なることになり、各巻線に生じる銅損もアンバランスとなる。これを解決するために、一巡ループ面積を小さくした巻線は断面積を小さくして、抵抗値を大きくすることにより、電流をバランスさせることができる。
Note that, here, an example in which the lead wire is directly connected to the printed board is shown, but it may be connected to the printed board via a connection pin of the bobbin or may be connected via another conductor.
Here, when the cross-sectional areas of the respective windings are the same, a winding having a small wiring inductance with a small loop area is reduced in resistance value, and the secondary windings 3a, 3b, and 3c of the high-frequency transformer 4 are reduced. The flowing current value is different, and the copper loss generated in each winding is also unbalanced. In order to solve this, a winding having a small loop area can be balanced in current by reducing the cross-sectional area and increasing the resistance value.
図３に、本発明の第２の実施例を示す。第1の実施例との違いは、並列接続された3個の巻線の内、中脚の上部に巻回された巻線３ａと中脚の下部に巻回された巻線３ｃは高周波トランスの上部から、中脚の中央部に巻回された巻線３ｂは下部から、各々引き出されている点である。２次側の寄生インダクタンス（漏れインダクタンスと配線インダクタンスとの和）において、漏れインダクタンスが支配的である場合の実施例である。 FIG. 3 shows a second embodiment of the present invention. The difference from the first embodiment is that among the three windings connected in parallel, the winding 3a wound around the upper part of the middle leg and the winding 3c wound around the lower part of the middle leg are composed of a high-frequency transformer. The windings 3b wound around the middle part of the middle leg are drawn from the lower part. This is an embodiment in which the leakage inductance is dominant in the secondary side parasitic inductance (the sum of the leakage inductance and the wiring inductance).
以上のような構成にすると、巻線３ａと３ｃの引き出し線の一巡ループ面積に比べて、巻線３ｂの引き出し線の一巡ループ面積は小さくなる。この結果、巻線３ａと３ｃの配線インダクタンスは大きく、巻線３ｂの配線インダクタンスは小さくなる。ここで、巻線３ａ、３ｂ及び３ｃは全て並列接続されているため、巻線３ｂの配線インダクタンスのみが小さくなれば、２次側巻線全体の配線インダクタンスを低減させることができる。従って、図１１と図１２に示す遅延時間tdを短縮することができ、電力変換回路の高効率化、低コスト化が図れる。 With the above configuration, the loop area of the lead wire of the winding 3b is smaller than the loop area of the lead wire of the windings 3a and 3c. As a result, the wiring inductances of the windings 3a and 3c are large, and the wiring inductance of the winding 3b is small. Here, since the windings 3a, 3b and 3c are all connected in parallel, if only the wiring inductance of the winding 3b is reduced, the wiring inductance of the entire secondary winding can be reduced. Therefore, the delay time td shown in FIGS. 11 and 12 can be shortened, and the efficiency and cost of the power conversion circuit can be reduced.
このように、２次側の漏れインダクタンスが支配的である場合、寄生インダクタンス（漏れインダクタンス23〜25と配線インダクタンス26〜28との和）を低減させるには、図３に示すようにコア1の中心部の巻線３ｂについて、配線インダクタンスを低減させることが効果的である。図５からも明らかなように、コア中心部に位置する巻線３ｂが1次側のどの巻線からも物理的距離が短くなり、結合係数が高くなるので漏れインダクタスが小さい。従って、漏れインダクタンスの小さい巻線３ｂについて配線インダクタスを低減させることが、トータルの寄生インダクタンスを低減させることにつながる。そこで、２次側の配線インダクタンスが支配的である場合には、巻線３ｂの両端をプリント基板側から引き出し、一巡ループ面積を小さくすることで、寄生インダクタンスの低減が可能となる。 As described above, when the leakage inductance on the secondary side is dominant, the parasitic inductance (the sum of the leakage inductances 23 to 25 and the wiring inductances 26 to 28) can be reduced as shown in FIG. It is effective to reduce the wiring inductance of the central winding 3b. As is clear from FIG. 5, the winding 3b located in the core central portion has a shorter physical distance from any of the primary windings and a higher coupling coefficient, so that the leakage inductance is small. Therefore, reducing the wiring inductance of the winding 3b having a small leakage inductance leads to a reduction in total parasitic inductance. Therefore, when the wiring inductance on the secondary side is dominant, the parasitic inductance can be reduced by pulling out both ends of the winding 3b from the printed board side and reducing the loop area.
尚、ここでは引き出し線をプリント基板に直接接続する例を示しているが、ボビンの接続ピンを介してプリント基板に接続しても、他の導体を介して接続しても構わない。
ここで、各巻線の断面積を同じにした場合、一巡ループ面積を小さくした配線インダクタンスの小さい巻線は、抵抗値が小さくなり、高周波トランス４の２次巻線３ａ、３ｂ及び３ｃのそれぞれに流れる電流値が異なることになり、各巻線に生じる銅損もアンバランスとなる。これを解決するために、一巡ループ面積を小さくした巻線は断面積を小さくして、抵抗値を大きくすることにより、電流をバランスさせる。
また、上記実施例には3個の巻線を用いた例を示したが、巻線数は複数であれば良く、特に限定されない。
Here, an example in which the lead wire is directly connected to the printed circuit board is shown, but it may be connected to the printed circuit board through a connection pin of the bobbin or may be connected through another conductor.
Here, when the cross-sectional areas of the respective windings are the same, a winding having a small wiring inductance with a small loop area is reduced in resistance value, and the secondary windings 3a, 3b, and 3c of the high-frequency transformer 4 are reduced. The flowing current value is different, and the copper loss generated in each winding is also unbalanced. In order to solve this problem, the winding having a small loop area reduces the cross-sectional area and increases the resistance value, thereby balancing the current.
Moreover, although the example which used three windings was shown in the said Example, the number of windings should just be plural, and it does not specifically limit.
本発明は、入出力間の絶縁が必要な、スイッチング電源、自動車用充電器（電気自動車、プラグインハイブリッド車など）、太陽電池や燃料電池のパワーコンディショナーなどの電力変換装置への適用が可能である。 INDUSTRIAL APPLICABILITY The present invention can be applied to power conversion devices such as switching power supplies, vehicle chargers (electric vehicles, plug-in hybrid vehicles, etc.), solar cells and fuel cell power conditioners that require insulation between input and output. is there.
１・・・コア ２−１、２−２・・・一次巻線
３ａ、３ｂ、３ｃ・・・二次巻線 ４・・・高周波トランス
５・・・巻線 ６・・・プリント基板
２２〜２５・・・漏れインダクタンス ２９、３０・・・リアクトル
２１、２６〜２８・・・配線インダクタンス ３５・・・負荷
３１、３４・・・コンデンサ １１〜１４・・・スイッチ素子
１４、１６・・・整流用スイッチ素子 ３２、３３・・・コンデンサ
DESCRIPTION OF SYMBOLS 1 ... Core 2-1, 2-2 ... Primary winding 3a, 3b, 3c ... Secondary winding 4 ... High frequency transformer 5 ... Winding 6 ... Printed circuit board
22-25 ... Leakage inductance 29, 30 ... Reactor 21, 26-28 ... Wiring inductance 35 ... Load 31, 34 ... Capacitor 11-14 ... Switch element 14, 16 ...・ Rectifier switch elements 32, 33 ... Capacitors
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