JP5874004B2 - Circuit forming method, substrate holding method, and substrate holder - Google Patents

Description

  TECHNICAL FIELD The present invention relates to holding a substrate when forming a circuit on a flexible substrate and a substrate holder for holding the substrate, and in particular, a circuit forming method for holding a thin sheet-like or film-like substrate. , A substrate holding method, and a substrate holder.

  As a system for forming a circuit by mounting electronic components on a substrate, for example, a printing device that prints cream solder on the surface of the substrate, a component mounting machine that mounts electronic components on the surface of the substrate on which the solder is printed, There is a system in which reflow ovens for heating and melting solder to solder components on a substrate are arranged in-line, and the substrate is conveyed by a conveyor passing through each device.

  Since the conventional substrate is thick and has high rigidity, the conveyor directly holds the edge of the substrate to convey the substrate. However, many recent substrates are thin and flexible in order to reduce the size and weight of electronic devices, and it is almost impossible to hold and transport only this thin substrate.

  By the way, in patent document 1, the board | substrate was mounted on the holding board using the board | substrate holder with which the 2nd electrode which is a flat board provided with electroconductivity, and the holding board provided with insulation were laminated | stacked, and mounted A technique is described in which a holding plate and a substrate are dielectrically polarized by applying a voltage between a first electrode covering the formed substrate and the second electrode, and the substrate is held on the holding plate by electrostatic adsorption. This technique releases the voltage applied between the first electrode and the second electrode and maintains the holding force by the electrostatic force for a long time even after the first electrode is removed. This can be considered as one of the techniques for holding the substrate.

US7,733,624 B2

  However, in the circuit forming system for mounting the electronic component on the substrate to form a circuit, when the substrate holding method is employed, the electric charge charged on the substrate when the electronic component is mounted on the substrate is transferred to the electronic component. Discharges and damages electronic components (such as electrostatic breakdown), and the board and other devices come into contact with each other when printing solder or mounting components on the board, and the board charge is gradually lost. There is a concern that the force with which the holding plate holds the substrate decreases, and the substrate cannot be held.

  The present invention has been made in view of the above problems, and avoids the possibility of damage to electronic components due to electric discharge, and avoids a decrease in the holding force of the substrate, while holding the substrate using electrostatic adsorption force. An object is to provide a circuit forming method, a substrate holding method, and a substrate holder capable of forming a circuit by mounting electronic components on the substrate.

  In order to achieve the above object, a circuit forming method according to the present invention is a circuit forming method for forming a circuit on a flexible substrate, wherein the substrate is disposed on a holding member made of an insulating material. Arrangement step and non-arrangement region that is a region of the substrate where no circuit is formed and a non-arrangement region that is a region of the holding member where the substrate is not disposed in plan view with respect to the surface of the substrate Between the holding step and the cover step of arranging a flexible sheet-like cover member made of an insulating material in a bridging manner and at least a non-placement region of the holding member Between the electrode placement step of placing the first electrode so as to sandwich the cover member, and the second electrode placed on the opposite side of the holding member from the side on which the substrate is placed, and the first electrode Applying process to apply voltage , Characterized in that the placed the first electrode and a separation step of separating from the cover member.

  According to this, a holding force is generated between the portion of the cover member that is in contact with the non-arrangement region of the holding member and the holding member, and the cover member is not formed on the substrate by using the holding force. The region is pressed against the holding member. Therefore, since the substrate itself is not charged, cream solder is printed on the formation area where the circuit of the substrate is formed, and when a circuit for mounting the component is formed, the electronic component may be damaged by discharge. In addition, it is possible to avoid a problem that the holding force is reduced.

  Further, in the cover step, a peripheral portion that is a non-formation region of the substrate may be pressed by the cover member, and in the electrode placement step, the first electrode may be disposed so as to surround the substrate.

  According to this, the whole peripheral part of a board | substrate can be hold | maintained in the state pressed against the holding member. The substrate can be held in a stable state.

  In order to achieve the above object, a substrate holding method according to the present invention is a substrate holding method for fixing a flexible substrate, wherein the substrate is arranged on a holding member made of an insulating material. And a non-formation region that is a region of the substrate in which a circuit is not formed and a holding member in a non-arrangement region that is a region of the holding member in which the substrate is not arranged in a plan view with respect to the surface of the substrate The cover that is in contact with at least the non-arrangement region of the holding member between the holding step and the cover step in which the sheet-like cover member made of an insulating material and having flexibility is arranged in a bridge A voltage is applied between the first electrode and an electrode arranging step of arranging the first electrode so as to sandwich the member, and the second electrode arranged on the opposite side of the holding member from the side on which the substrate is arranged. Application process to be applied and arrangement Characterized in that it comprises a said first electrode and separating step of separating from the cover member.

  According to this, it is possible to generate a holding force due to electrostatic attraction between the portion of the cover member that is in contact with the non-arranged region of the holding member and the holding member, and the cover member is used as a substrate by using the holding force. The non-formed area can be pressed against the holding member to hold the substrate. Therefore, the board should be provided to the component mounting machine in a state where the electronic components mounted in the formation area where the circuit of the board is formed are damaged due to discharge or the holding power of the board is reduced. Is possible.

  In order to achieve the above object, a substrate holder according to the present invention is a substrate holder for holding a substrate to be used in a circuit forming apparatus, and is made of an insulating material and arranged in a contact state. A holding member, a second electrode made of a conductive material disposed on a side opposite to the side on which the substrate is disposed with respect to the retaining member, and a region in which a circuit of the substrate is not formed in plan view with respect to the substrate And a flexible sheet-like cover made of an insulating material arranged in a bridging manner between the non-formation region and the holding member in the non-arrangement region where the substrate is not arranged. And a member.

  According to this, it is possible to generate a holding force due to electrostatic attraction between the portion of the cover member that is in contact with the non-arranged region of the holding member and the holding member, and the cover member is used as a substrate by using the holding force. The non-formed area can be pressed against the holding member to hold the substrate. Therefore, it is possible to provide the substrate to the component mounting machine in a state in which the problem that the electronic component is damaged or the holding force is reduced due to the discharge is avoided.

  The cover member may have an annular shape corresponding to a peripheral portion that is a non-formation region of the substrate.

  According to this, the whole peripheral part of a board | substrate can be hold | maintained in the state pressed against the holding member. The substrate can be held in a stable state.

  It should be noted that executing a program for causing a computer to execute each process included in the circuit forming method also corresponds to the implementation of the present invention. Of course, implementing the recording medium in which the program is recorded also corresponds to the implementation of the present invention.

  According to the present invention, a flexible substrate is held using electrostatic adsorption while avoiding problems such as damage to the electronic component due to electric discharge when a circuit is formed by mounting the electronic component on the substrate. The member can be held.

FIG. 1 is a diagram schematically showing a circuit forming system. FIG. 2 is a perspective view showing a substrate holding device for holding the substrate on the substrate holder. FIG. 3 is a cross-sectional view showing a part of the substrate holding device. FIG. 4 is a plan view showing the substrate. FIG. 5 is a top view showing the first electrode. FIG. 6 is a top view showing the cover member. FIG. 7 is a perspective view showing a state where the substrate is placed on the holding member. FIG. 8 is a perspective view showing a state where the cover member is placed. FIG. 9 is a perspective view showing a state where the first electrode is placed. FIG. 10 is a perspective view showing a state in which a charging power source is connected. FIG. 11 is a cross-sectional view showing a part of another embodiment of the substrate holding apparatus. FIG. 12 is a cross-sectional view showing a part of a state in which the first electrode and the cover member are in close contact with each other in the substrate holding apparatus according to another aspect. FIG. 13 is a perspective view showing the substrate holding device supported by the support member.

  Next, embodiments of a circuit forming method, a substrate holding method, and a substrate holder according to the present invention will be described with reference to the drawings. The following embodiments are merely examples of a circuit forming method, a substrate holding method, and a substrate holder according to the present invention. Accordingly, the scope of the present invention is defined by the wording of the claims with reference to the following embodiments, and is not limited to the following embodiments.

  FIG. 1 is a diagram schematically showing a circuit forming system.

  A circuit forming system 300 shown in the figure is a system for forming an electronic circuit by mounting a component 201 on a substrate 200 held by a substrate holder 100. In the case of the present embodiment, the circuit forming system 300 includes a plurality of various component mounting apparatuses (302 to 304) arranged inline, and a conveyor 301 that conveys the substrate 200 together with the substrate holder 100 therebetween. ing. In addition, the circuit forming system 300 includes a printing device 302 that prints a cream solder pattern on the surface of the substrate 200, a component mounter 303 (mounter) that mounts various components 201 on the substrate 200, and a component mounting device. And a reflow furnace 304 for melting the cream solder on the substrate 200 and soldering the component 201.

  FIG. 2 is a perspective view showing a substrate holding device for holding the substrate on the substrate holder.

  FIG. 3 is a cross-sectional view showing a part of the substrate holding device.

  As shown in these drawings, the substrate holding device 110 is a device for holding the substrate 200 on the substrate holder 100 and includes a first electrode 111 and a charging power source 112.

  The first electrode 111 is a conductive member that is disposed in contact with the portion of the cover member 103 that is in contact with the non-arranged region of the holding member 101 from the side opposite to the holding member 101. In the case of the present embodiment, the first electrode 111 has a rectangular ring shape that surrounds the outside of the substrate 200.

  The first electrode 111 can adopt not only a simple ring shape that can correspond to various shapes of the substrate 200 but also any shape corresponding to the shape of the substrate 200 to be held. For example, as in the substrate 200 shown in FIGS. 2 and 4, a so-called multi-substrate in which a plurality of formation regions B, which are regions in which components 201 are mounted on one substrate 200 and a circuit is formed, are separated. In the case of such a configuration, in the present embodiment, for ease of explanation, for example, the case where there are two places is illustrated. The first electrode 111 is a rectangular shape surrounding the substrate 200 as shown in FIG. In addition to the frame portion, a portion that passes between the two formation regions B and crosses (vertically cuts) the substrate 200 may be provided integrally or separately.

  In addition, the cover member 103 may hold down the non-formation area | region of the board | substrate 200 along the break line of a multi board | substrate.

  Moreover, the 1st electrode 111 is the sheet | seat form (including mesh shape) which has the softness | flexibility and electroconductivity which cover the whole cover member 103 which hold | suppresses the board | substrate 200 arrange | positioned at the holding member 101 as shown in FIG. It may be a member. The first electrode 111 may be held by the frame body 113 without wrinkles. Then, as shown in FIG. 12, the first electrode 111 is deformed along the cover member 103 by pressing the frame body 113 against the holding member 101. Here, since the substrate 200 and the first electrode 111 are separated from each other by the thickness of the cover member 103, the substrate 200 can be prevented from being charged even when a voltage is applied to the first electrode 111.

  The charging power source 112 applies a DC voltage between the first electrode 111 and the second electrode 102 (described later) disposed so as to sandwich the cover member 103 that is in direct contact with the non-arranged region of the holding member 101. It is a power supply device that can be applied. For example, the charging power supply 112 is preferably a power supply device that can apply a voltage selected from a range of 200 v or more and 3000 v or less in a fixed or variable manner.

  The substrate holding device 110 includes a moving device that can bring the first electrode 111 close to and away from the substrate holder 100 conveyed by the conveyor 301, and automatically transfers the substrate 200 to the substrate. What hold | maintains to the holder 100 may be used.

  The substrate holder 100 is a jig for holding the substrate 200 used in the component mounting apparatuses (302 to 304), and includes a holding member 101, a second electrode 102, and a cover member 103.

  The holding member 101 is a member that can be dielectrically polarized by the substrate 200 made of an insulating material and disposed in a contact state. In the case of the present embodiment, the holding member 101 has a flat plate shape and includes the second electrode 102.

  In the present embodiment, the mounting surface on which the substrate 200 of the holding member 101 is mounted is a flat surface, but a positioning portion for determining the position of the substrate 200 on the holding member 101 may be provided. Examples of the positioning portion include a portion that is recessed in the shape of the substrate 200 with respect to the surface of the holding member 101, a protrusion (pin) that contacts a corner portion of the substrate 200, a reference mark or a line provided, and the like. it can.

  In addition, in order to improve the installation property and positioning property of the substrate 200 to the holding member 101, liquid (for example, a solvent such as water or alcohol, or other substrate 200 or the holding member 101 is damaged between the substrate 200 and the holding member 101. Liquid that is not applied) or sol or gel may be disposed.

  In addition, the material constituting the holding member 101 is not particularly limited as long as it is an insulating material capable of dielectric polarization. However, if the material needs to be heated such as passing through a reflow furnace 304, For example, a material having a heat resistance of 150 ° C. or higher is preferable. For example, the holding member 101 is preferably made of polyimide.

  The second electrode 102 is a member made of a conductive material disposed on the side of the holding member 101 opposite to the side on which the substrate 200 is disposed.

  In the case of the present embodiment, the second electrode 102 is a plate-like electrode that is disposed so as to spread over substantially the entire mounting surface of the holding member 101, and is entirely covered with the holding member 101. Note that the second electrode 102 includes a terminal portion 121 for connecting to the charging power source 112. The terminal part 121 is arranged in a state of penetrating the holding member 101.

  The cover member 103 is bridged between the holding member 101 and the non-formation region A (see FIG. 4), which is a region of the substrate 200 where the component 201 is not mounted and a circuit is not formed, in a plan view with respect to the surface of the substrate 200. It is a sheet-like member made of an insulating material and having flexibility.

  Here, the region in which no circuit is formed in plan view with respect to the surface of the substrate 200 means that no circuit is formed while the substrate holder 100 is holding the substrate 200. Therefore, even if a circuit is formed in the non-formation region A of the substrate 200 that is not held by the substrate holder 100, the region is a non-formation region A in which no circuit is formed in plan view with respect to the surface of the substrate 200. It is.

  In the case of the present embodiment, the cover member 103 adopts the holding shape of the substrate 200 corresponding to the formation region B which is a region where the circuit of the substrate 200 to be held is formed. Since the substrate 200 shown in this embodiment has two formation regions B on one substrate 200, the cover member 103 has a rectangular shape surrounding the substrate 200 as shown in FIG. In addition to the frame portion, it has a shape including a portion that passes between the two formation regions B and traverses (vertically cuts) the substrate 200. That is, the cover member 103 has a shape in which two rectangular holes are arranged side by side on a rectangular sheet.

  This shape is preferable because the cover member 103 can strongly press the substrate 200 against the holding member 101 and the force for holding the substrate 200 of the substrate holder 100 can be increased.

  The shape of the cover member 103 is not particularly limited, and may be a simple ring shape that can correspond to various shapes of the substrate 200, a belt shape, or the like. Further, the thickness of the cover member 103 may be about several μm to several tens of μm, for example.

  Next, a circuit forming method and a substrate holding method will be described with reference to the drawings.

  As shown in FIG. 7, the substrate 200 is placed on the placement surface of the holding member 101 and placed (substrate placement step). At this time, if the holding member 101 has a positioning portion, the substrate 200 is arranged in accordance with the positioning portion.

  Next, as shown in FIG. 8, the cover member 103 is disposed in a bridging manner between the non-formation region A of the substrate 200 and the holding member 101 (cover process). In the present embodiment, the periphery of the substrate 200 is pressed by the cover member 103, and the portion of the mounting surface of the holding member 101 corresponding to the outer periphery of the substrate 200 is also covered by the cover member 103. Further, the cover member 103 holds down between the two formation regions B included in the substrate 200.

  Next, as shown in FIG. 9, the first electrode 111 is arranged so as to sandwich a part of the cover member 103 with the holding member 101 (electrode arrangement step). In the present embodiment, the first electrode 111 is placed on the cover member 103, but a pressing force that presses the cover member 103 against the holding member 101 may be applied.

  Next, as shown in FIG. 10, a voltage is applied by the charging power source 112 between the second electrode 102 (not shown in FIG. 10) and the first electrode 111 (application process).

  Through the above process, the holding member 101 and the cover member 103 are dielectrically polarized, and the holding member 101 and the cover member 103 are electrostatically adsorbed. The cover member 103 presses the substrate 200 against the holding member 101 by the electrostatic attraction force, and the substrate 200 is held by the substrate holder 100.

  Next, the application of voltage by the charging power source 112 is canceled, and the first electrode 111 disposed on the cover member 103 is separated from the cover member 103 (separation process). The appearance is as shown in FIG. 8, and the substrate 200 is held by the substrate holder 100 (substrate holding method).

  Even in this state, the holding member 101 and the cover member 103 are maintained in a state of being electrostatically attracted by dielectric polarization, and the substrate 200 is maintained in the state of being held by the substrate holder 100. Therefore, the substrate 200 can be transported by the conveyor 301 together with the substrate holder 100.

  Next, a cream solder pattern is printed on the surface of the substrate 200 held by the substrate holder 100 by the printing device 302, the component 201 is mounted by the component mounter 303, and is held by the substrate holder 100 by the reflow furnace 304. The substrate 200 is heated and soldered to form a circuit (circuit forming step).

  After the circuit formation step, the substrate 200 held by the holding member 101 of the substrate holder 100 is removed by the following method (substrate removal step). Electrons that are dielectrically polarized in the cover member 103 and the holding member 101 are released or neutralized. Specific methods for releasing electrons and neutralizing polarization include a method in which the second electrode 102 is grounded to GND, a method in which a reverse voltage is applied, and a method in which ionizer irradiation is performed. Thereby, the cover member 103 can be removed from the holding member 101, and the substrate 200 can be taken out.

  As described above, since the substrate holder 100 does not charge the substrate 200 itself, the electronic component 201 can be prevented from being damaged due to static electricity when the electronic component 201 is mounted. It is possible to avoid a decrease in the holding force of the substrate 200 due to discharge caused by contact with the substrate.

  Further, the substrate holder 100 can hold the substrate 200 only by disposing the cover member 103 above the substrate 200. Therefore, compared with the case where the substrate 200 is mechanically held, it does not get in the way when printing the cream solder, and is less likely to get in the way when the component 201 is mounted on the surface of the substrate 200. Further, since the substrate 200 is not held by an adhesive or the like, there is no decrease in holding force due to deterioration of the adhesive or the like. Further, since it is not always necessary to connect to a vacuum system as in vacuum suction, the substrate 200 can be freely transported.

  In addition, this invention is not limited to the said embodiment. For example, another embodiment realized by arbitrarily combining the components described in this specification and excluding some of the components may be used as an embodiment of the present invention. In addition, the present invention includes modifications obtained by making various modifications conceivable by those skilled in the art without departing from the gist of the present invention, that is, the meaning described in the claims. It is.

  In the above embodiment, the circuit forming method and the case where the substrate holder 100 is applied to the mounting of the component 201 are exemplified, but the present invention is not limited to this. For example, formation of a conductive pattern using screen printing, formation of an insulating film, or the like is one of circuit formation, and the circuit formation method and the substrate holder 100 can be employed.

  In addition, the second electrode 102 may be configured to be disposed on the side of the holding member 101 opposite to the side on which the substrate 200 is held, and is not necessarily in an integrated state wrapped in the holding member 101. Alternatively, a configuration (separate body) separable from the holding member 101 may be used.

  Further, when the substrate holder 100 transported while holding the substrate 200 is low in rigidity and hinders transportation, a support member 119 such as a tray that further supports the holding member 101 as shown in FIG. It may be transported while being supported.

  In the separation step, the second electrode 102 may be separated from the holding member 101 in the same manner as the operation of separating the first electrode 111 from the cover member 103.

  In addition, although one substrate 200 is held by one substrate holder 100, the present invention is not limited to this, and a plurality of substrates 200 may be held by one substrate holder 100.

  The present invention can be used in circuit forming systems such as component mounting for mounting components on a substrate and formation of an insulating film.

DESCRIPTION OF SYMBOLS 100 Substrate holder 101 Holding member 102 Second electrode 103 Cover member 110 Substrate holding device 111 First electrode 112 Charging power supply 121 Terminal unit 200 Substrate 201 Component 300 Circuit forming system 301 Conveyor 302 Printing device 303 Component mounting machine 304 Reflow furnace

Claims (5)

A circuit forming method for forming a circuit on a flexible substrate,
A substrate placement step of placing a substrate on a holding member made of an insulating material;
In plan view with respect to the surface of the substrate, between the non-formation region which is a region of the substrate where no circuit is formed and the holding member in the non-arrangement region which is a region of the holding member where the substrate is not arranged A cover step of arranging a sheet-like cover member made of an insulating material and having flexibility, in a cross-linked manner;
An electrode arrangement step of arranging a first electrode so as to sandwich at least the cover member in contact with the non-arrangement region of the holding member between the holding member;
An application step of applying a voltage between the first electrode and the second electrode disposed on the side opposite to the side on which the substrate is disposed with respect to the holding member;
A circuit forming method including a separating step of pulling the arranged first electrode away from the cover member. In the cover step, a peripheral portion which is a non-formation region of the substrate is pressed by the cover member,
The circuit forming method according to claim 1, wherein in the electrode placement step, the first electrode is placed so as to surround the substrate. A substrate holding method for fixing a flexible substrate,
A substrate placement step of placing a substrate on a holding member made of an insulating material;
In plan view with respect to the surface of the substrate, between the non-formation region which is a region of the substrate where no circuit is formed and the holding member in the non-arrangement region which is a region of the holding member where the substrate is not arranged A cover step of arranging a sheet-like cover member made of an insulating material and having flexibility, in a cross-linked manner;
An electrode arrangement step of arranging a first electrode so as to sandwich at least the cover member in contact with the non-arrangement region of the holding member between the holding member;
An application step of applying a voltage between the first electrode and the second electrode disposed on the side opposite to the side on which the substrate is disposed with respect to the holding member;
A separation step of separating the first electrode arranged from the cover member. A board holder for holding a board to be used in a component mounting apparatus,
A holding member made of an insulating material and disposed in contact with the substrate;
A second electrode made of a conductive material disposed on the side opposite to the side on which the substrate is disposed with respect to the holding member;
In a plan view with respect to the substrate, the substrate is arranged in a bridging manner between a non-formation region where a circuit of the substrate is not formed and a holding member in a non-arrangement region where the substrate is not arranged. And a sheet-like cover member made of an insulating material and having flexibility. The substrate holder according to claim 4, wherein the cover member has a ring shape corresponding to a peripheral portion which is a non-formation region of the substrate.

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