JP5870834B2 - Method for producing gas barrier film - Google Patents

Description

  The present invention relates to a method for producing a gas barrier film exhibiting good gas barrier properties and durability, and a method for producing an apparatus including a gas barrier film produced by the production method.

  The gas barrier film is permeable to chemical components such as oxygen or water vapor that degrade the performance of organic electroluminescence elements (organic EL elements), liquid crystal display elements, thin film transistors, solar cells, touch panels, electronic paper, and other devices. It is preferably applied to prevent. In particular, with the recent enhancement of performance and quality of electronic devices, gas barrier films are required to have high gas barrier properties.

  Some gas barrier films in recent years are composed of a plastic film substrate, an organic layer provided on the plastic substrate, and an inorganic layer provided on the organic layer. The organic layer is provided as a planarizing layer under the gas barrier inorganic layer, and plays a role of enhancing the gas barrier property by preventing defects from occurring in the inorganic layer. Moreover, as a plastic film used as a base material, a polyester film which is excellent in mechanical strength and chemical stability, and is light and inexpensive is widely used.

  The polyester film has the property that the surface irregularities are small and the density is high. Moreover, there are few functional groups which have polarity, such as a carboxyl group (COOH group) and a hydroxyl group (OH group), on the polyester film surface. Therefore, the gas barrier film using a polyester film as a base material has a problem that the adhesion between the polyester film and the organic layer provided on the polyester film is low.

  Various gas barrier films having such a structure have been conventionally proposed. Patent Document 1 discloses a compound (A) having two or more ethylenically unsaturated double bonds on one or both sides of a plastic film, and an acrylic resin (B) having a glass transition temperature of 60 ° C. or higher and 200 ° C. or lower. A technique relating to a base material for a gas barrier laminate having a resin layer made of a cured product of a resin composition is proposed. In the same document, the acrylic resin (B) includes a radically polymerizable monomer (b1) having a glass transition temperature of homopolymer of −100 ° C. or higher and lower than 60 ° C. and a glass transition temperature of homopolymer of 60 ° C. or higher and 200 ° C. A copolymer with a radically polymerizable monomer (b2) at a temperature of 0 ° C. or lower is preferred. Furthermore, it is said in the same document that the radical polymerizable monomer (b1) or (b2) preferably has one or both of a hydroxyl group and a carboxyl group.

  Patent Document 2 discloses a hard coat film in which a hard coat layer is provided on at least one surface of a transparent film substrate, and the material for forming the hard coat layer is urethane acrylate, polyol (meth) acrylate, and A technique relating to a hard coat film containing a (meth) acrylic polymer having an alkyl group containing two or more hydroxyl groups has been proposed. In the present specification, “(meth) acrylate” means acrylate or methacrylate, and “(meth) acrylic polymer” means acrylic polymer or methacrylic polymer.

  In Patent Document 3, an ultraviolet curable resin layer and a gas barrier inorganic compound layer are formed on at least one surface of a plastic film one by one in this order, and the ultraviolet curable resin layer is composed of pentaerythritol (meth) acrylate and isocyanuric acid. A technique relating to a gas barrier substrate for a display element made of a resin mainly composed of (meth) acrylate has been proposed.

JP 2003-118046 A JP 2007-46031 A JP 2010-94863 A

  The recent demand for higher performance is the same for gas barrier films, and it is desired to increase the durability against heat and humidity (moisture heat resistance) after ensuring the necessary and sufficient gas barrier properties. Specifically, according to the study of the present inventors, each of the substrate for gas barrier laminate, the hard coat film, and the gas barrier substrate for display element proposed in Patent Documents 1 to 3 is a high temperature and humid environment. By holding it underneath, a new problem has been found that the adhesion between the organic layer and the plastic film substrate is lowered, and their durability is lowered.

  This invention solves the said subject, The objective is to provide the manufacturing method of the gas-barrier film which shows favorable gas-barrier property and durability. Another object of the present invention is to provide a method for manufacturing a device exhibiting good durability.

  As a result of intensive studies on the above problems by the present inventors, this gas barrier property is obtained by devising the composition of the organic layer provided on the polyester substrate using a polyester substrate as the plastic film substrate of the gas barrier film. The inventors have found that high adhesion between the organic layer and the polyester base material can be maintained even after the film is held in a high temperature and humidity environment, and the present invention has been completed.

  The method for producing a gas barrier film according to the present invention for solving the above problems includes a step of preparing a polyester base material, a monomer raw material containing a monomer having three or more acryloyl groups on the polyester base material, and acrylonitrile. A step of applying a resin composition containing a polymer raw material containing a copolymer having a monomer component as a monomer component, a step of curing the resin composition to form an organic layer, and forming an inorganic layer on the organic layer And a step of performing.

  According to this invention, since it has the process of apply | coating the resin composition containing the monomer raw material containing the monomer which has a 3 or more acryloyl group on a polyester base material, it is thought that the crosslinking density of the organic layer formed becomes high. It is done. Therefore, since this organic layer is estimated to be dense with high hardness, it is considered that the inorganic layer formed on the organic layer becomes dense. Therefore, a gas barrier film showing good gas barrier properties can be produced. Moreover, since it has the process of apply | coating the resin composition containing the polymer raw material containing the copolymer which uses acrylonitrile as a monomer component on a polyester base material, a nitrile group (CN group) can be introduce | transduced into an organic layer. . Since the nitrile group introduced into the organic layer and the ester bond in the polyester base material are considered to exhibit high affinity due to the polar interaction, the adhesion between the organic layer and the polyester base material becomes high. Therefore, a gas barrier film showing good durability can be produced. As a result, the method for producing a gas barrier film of the present invention can produce a gas barrier film exhibiting good gas barrier properties and durability.

  In the method for producing a gas barrier film according to the present invention, it is preferable that a polymerization ratio of acrylonitrile of the copolymer is 0.1 mol% or more and 10 mol% or less.

  According to this invention, since the polymerization ratio of acrylonitrile in the above-mentioned copolymer is 0.1 mol% or more and 10 mol% or less, a nitrile group can be introduced into the organic layer. Since the nitrile group introduced into the organic layer and the ester bond in the polyester base material are considered to exhibit high affinity due to the polar interaction, the adhesion between the organic layer and the polyester base material becomes high. As a result, a gas barrier film exhibiting good durability can be produced.

  In the method for producing a gas barrier film according to the present invention, the blending amount of the monomer having three or more acryloyl groups is 40% by mass or more and 70% by mass or less with respect to the total amount of the monomer raw material and the polymer raw material. It is preferable.

  According to this invention, the blending amount of the monomer having three or more acryloyl groups is 40% by mass or more and 70% by mass or less with respect to the total amount of the monomer raw material and the polymer raw material. The density is thought to increase. Therefore, since this organic layer is estimated to be dense with high hardness, it is considered that the inorganic layer formed on the organic layer becomes dense. As a result, a gas barrier film showing good gas barrier properties can be produced.

  In the method for producing a gas barrier film according to the present invention, the polyester base material is preferably a polyethylene terephthalate film or a polyethylene naphthalate film.

  In the method for producing a gas barrier film according to the present invention, the step of forming an inorganic layer on the organic layer is preferably performed by an ion plating method.

  According to this invention, since the step of forming the inorganic layer on the organic layer is performed by an ion plating method, it is considered that a dense inorganic layer can be formed on the organic layer. As a result, a gas barrier film showing good gas barrier properties can be produced.

  The method for producing an apparatus according to the present invention for solving the above-mentioned problems is a method for producing an apparatus comprising a gas barrier film produced by the method for producing a gas barrier film according to the present invention.

  According to the present invention, since the gas barrier film having good gas barrier properties and durability is provided, an apparatus having good durability can be manufactured.

  According to the method for producing a gas barrier film according to the present invention, a gas barrier film exhibiting good gas barrier properties and durability can be produced. Moreover, according to the manufacturing method of the apparatus which concerns on this invention, the apparatus which shows favorable durability can be manufactured.

It is a typical sectional view showing an example of a gas barrier film concerning the present invention. It is typical sectional drawing which shows another example of the gas barrier film which concerns on this invention. It is typical sectional drawing which shows another example of the gas barrier film which concerns on this invention.

  Hereinafter, embodiments of the present invention will be described in detail. The present invention is not limited to the following embodiments, and various modifications can be made within the scope of the gist thereof.

[Method for producing gas barrier film]
The method for producing the gas barrier film 10 according to the present invention is a method for producing the gas barrier film 10 shown in FIGS. 1 to 3, and a step of preparing the polyester substrate 1 (preparation step), and on the polyester substrate 1 A step of applying a resin composition containing a monomer raw material containing a monomer having three or more acryloyl groups and a polymer raw material containing a copolymer containing acrylonitrile (ACN) as a monomer component (application step); It is characterized by having a step of curing the resin composition to form the organic layer 2 (organic layer forming step) and a step of forming the inorganic layer 3 on the organic layer 2 (inorganic layer forming step).

  According to such a method for producing the gas barrier film 10, it is considered that the organic layer 2 to be formed has a high crosslink density, and thus the organic layer 2 is presumed to be dense with high hardness. Therefore, since the inorganic layer 3 formed on the organic layer 2 is considered to be dense, a gas barrier film 10 exhibiting good gas barrier properties can be produced. Moreover, a nitrile group (CN group) can be introduced into the organic layer 2, and the nitrile group introduced into the organic layer 2 and the ester bond in the polyester base material 1 exhibit high affinity due to polar interaction. As a result, the adhesion between the organic layer 2 and the polyester substrate 1 is increased. Therefore, the gas barrier film 10 which shows favorable durability can be manufactured. As a result, the gas barrier film 10 showing good gas barrier properties and durability can be produced.

  The gas barrier film 10 includes a polyester substrate 1, an organic layer 2 provided on the polyester substrate 1, and an inorganic layer 3 provided on the organic layer 2. The organic layer 2 and the inorganic layer 3 are at least provided in this order on one surface S1 of the polyester base 1 as shown in FIG. 1, but the organic layer 2 ′ and the other surface S2 as shown in FIG. The inorganic layer 3 ′ may be provided in that order. From the viewpoint of improving gas barrier properties, as shown in FIG. 2, a gas barrier film 10B in which organic layers 2, 2 ′ and inorganic layers 3, 3 ′ are respectively provided on both sides of the polyester substrate 1 in this order is preferable. . Further, as shown in FIG. 3, the gas barrier film 10 may be formed of two layers of the first organic layer 4 and the second organic layer 5 as shown in FIG. The inorganic layer 3 may be formed of two layers.

  Hereinafter, each step will be described in detail.

(Preparation process)
The preparation step is a step of preparing the polyester base material 1. The polyester substrate 1 is formed of a polyester resin. Examples of the polyester resin include those selected from polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), copolymers thereof, and polycyclohexanedimethylene terephthalate (PCT). be able to. Among the polyester resins, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and copolymers thereof are preferable. Particularly preferably, the polyester substrate 1 is a polyethylene terephthalate film or a polyethylene naphthalate film.

  Although the thickness of the polyester base material 1 is not specifically limited, It is preferable that they are 10 micrometers or more and about 500 micrometers or less.

  The surface of the polyester substrate 1 is subjected to corona treatment, flame treatment, plasma treatment, glow discharge treatment, roughening treatment, chemical treatment, and easy adhesion as necessary to improve the adhesion with the organic layer 2. Surface treatment such as treatment may or may not be performed. As a specific method of such surface treatment, a conventionally known method can be appropriately used. From the viewpoint of simplification of the manufacturing process and cost reduction, it is preferable not to perform such surface treatment. The gas barrier film 10 can maintain high adhesion between the organic layer 2 and the polyester base material 1 without performing such surface treatment, and in particular, the gas barrier film 10 is maintained in a high temperature and humidity environment. Even later, the high adhesion between the two can be maintained.

(Coating process)
In the coating step, a resin composition containing a monomer raw material containing a monomer having three or more acryloyl groups and a polymer raw material containing a copolymer containing acrylonitrile (ACN) as a monomer component is applied onto the polyester base 1. It is a process to do.

  The resin composition is a mixture of a monomer raw material and a polymer raw material. The monomer raw material mainly includes a monomer having three or more acryloyl groups, and the polymer raw material mainly includes a copolymer having acrylonitrile as a monomer component.

  The monomer having three or more acryloyl groups is not particularly limited. For example, pentaerythritol triacrylate, glycerol acrylate, trimethylolpropane triacrylate, ditrimethylolpropane tetraacrylate, ethoxylated isocyanuric acid triacrylate, pentaerythritol tetraacrylate, Examples of dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, etc., and one or more monomers selected from these ethylene oxide modified products, propylene oxide modified products, caprolactan modified products, etc. be able to. In this specification, “acryloyl group” includes a methacryloyl group, “acrylate” includes methacrylate, “acrylic acid” includes methacrylic acid, and “acrylic ester” such as methyl acrylate and ethyl acrylate is Methacrylic acid esters such as methyl methacrylate and ethyl methacrylate.

  The monomer having three or more acryloyl groups may include an oligomer having three or more acryloyl groups. Examples of the oligomer having 3 or more acryloyl groups include one or more oligomers selected from polyester acrylate, epoxy acrylate, urethane acrylate, silicone acrylate, and the like. Such an oligomer may be produced by bonding monomers having 3 or more acryloyl groups, or may be produced by bonding monomers having less than 3 acryloyl groups.

  Although it does not specifically limit as a monomer which has an acryloyl group less than 3, For example, a monofunctional acrylate ester monomer and a bifunctional acrylate ester monomer can be mentioned. Monofunctional acrylic acid ester monomers include, for example, phenoxyethyl acrylate, lauryl acrylate, stearyl acrylate, butoxyethyl acrylate, ethoxydiethylene glycol acrylate, methoxytriethylene glycol acrylate, methoxypolyethylene glycol acrylate, methoxydipropylene glycol acrylate, nonylphenoxypolyethylene Examples thereof include one or more monomers selected from glycol acrylate, tetrahydrofurfuryl acrylate, isobornyl acrylate, isooctyl acrylate, cyclohexyl acrylate, benzyl acrylate, N, N-dimethylaminopropyl acrylate, acryloylmorpholine, and the like. Examples of the bifunctional acrylic acid ester monomer include diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, tripropylene glycol diacrylate, polypropylene glycol diacrylate, polytetramethylene glycol diacrylate, and butanediol diacrylate. Acrylate, hexanediol diacrylate, nonanediol diacrylate, pentanediol diacrylate, neopentyl glycol diacrylate, dimethylol-tricyclodecane diacrylate, hydroxypivalate neopentyl glycol diacrylate, bisphenol A polyethoxydiol diacrylate, bisphenol A Polypropoxydiol diacrylate, etc. It can be exemplified et 1 or 2 or more monomers selected.

  It is considered that the crosslink density of the organic layer 2 to be formed becomes high by containing a monomer having three or more acryloyl groups in the resin composition. Therefore, since the organic layer 2 is considered to be dense with high hardness, the inorganic layer 3 formed on the organic layer 2 is considered to be dense. As a result, the gas barrier film 10 showing good gas barrier properties can be produced.

  The monomer having 3 or more acryloyl groups preferably has 1 or more hydroxyl groups (OH groups). Examples of such monomers include pentaerythritol triacrylate, dipentaerythritol triacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, tripentaerythritol tetraacrylate, tripentaerythritol pentaacrylate, and ditrimethylolpropane triacrylate. One or two or more monomers selected from

  Among the monomers having three or more acryloyl groups, a monomer having one or more hydroxyl groups (OH groups) is contained in the resin composition, and the organic layer 2 is formed with this resin composition, whereby the hydroxyl groups are added to the organic layer 2. Can be introduced. Since it is thought that this hydroxyl group and the ester bond in the polyester base material 1 express high affinity by the interaction based on a hydrogen bond, the adhesiveness of the organic layer 2 and the polyester base material 1 can be improved.

  It is preferable that the compounding quantity of the monomer which has 3 or more acryloyl groups is 40 to 70 mass% with respect to the total amount of a monomer raw material and a polymer raw material. By setting the blending amount of the monomer having three or more acryloyl groups within this range, it is considered that the cross-linking density of the organic layer 2 to be formed becomes higher, so that the organic layer 2 has a higher hardness and a higher density. It is estimated that

  Although the blending amount of the monomer having 3 or more acryloyl groups is effective outside the above range, for example, the blending amount of the monomer having 3 or more acryloyl groups is the total amount of the monomer raw material and the polymer raw material. On the other hand, if it is less than 40% by mass, it is considered that the crosslinking density of the organic layer 2 formed with this resin composition is lowered, so that the heat resistance may be lowered or the hardness may be lowered. When the heat resistance of the organic layer 2 is lowered, a low-molecular component volatile matter may be generated from the organic layer 2 when the organic layer 2 is heated. There is a possibility that it cannot be formed. Moreover, when the hardness of the organic layer 2 falls, the inorganic layer 3 may not be formed on the organic layer 2. When the blending amount of the monomer having three or more acryloyl groups exceeds 70% by mass with respect to the total amount of the monomer raw material and the polymer raw material, the resin composition is cured, the inorganic layer is formed, or Since it is considered that the curing shrinkage of the organic layer 2 that occurs when it is held in a humid heat environment or the like, the adhesion between the organic layer 2 and the polyester substrate 1 is reduced, or the organic layer 2 and the inorganic layer 3 have defects. May occur. Therefore, there is a possibility that peeling occurs between the organic layer 2 and the polyester substrate 1 and the durability of the gas barrier film 10 is lowered, or the gas barrier property of the gas barrier film 10 is lowered.

  The copolymer having acrylonitrile as a monomer component is a copolymer of an acrylonitrile monomer and another monomer. Although it will not specifically limit as another monomer if it is a monomer copolymerizable with acrylonitrile, For example, the vinyl-type monomer which has a 1 or 2 or more ethylenically unsaturated double bond in a molecule | numerator can be mentioned. Such a vinyl monomer is not particularly limited, and examples thereof include methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, hexyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, dodecyl acrylate, phenyl acrylate, and benzyl acrylate. Acrylic acid esters; vinyl halides such as vinyl chloride, vinyl bromide, vinylidene chloride; one or more monomers selected from acrylic acid, acrylamide, styrene, α-methylstyrene, vinyl acetate, etc. be able to.

  Furthermore, examples of the copolymer containing acrylonitrile as a monomer component include a copolymer having a structure represented by the following chemical formula (1).

In the chemical formula (1) and R ₁ , R ₁ is a hydrogen atom or a methyl group, and R ₂ is not particularly limited. For example, a hydrogen atom, a linear or branched alkyl group having 18 or less carbon atoms, a cycloalkyl group, Aryl group, hydroxy group, alkoxy group, hydroxyalkyl group, mercapto group, alkylthio group, alkylcarbonyl group, arylcarbonyl group, carboxyl group, alkoxycarbonyl group, carboxylalkyl group, sulfonic acid group, alkyl ether group, allyl ether group, A nitro group, an amino group, an alkylamino group, an alkylamide group, and a halogen atom such as a fluorine atom, a chlorine atom, or a bromine atom, and m and n represent a molar ratio of monomer components constituting the copolymer. M + n = 100 and n = 0.1-10.

  Specific examples of the copolymer having acrylonitrile as a monomer component include acrylic acid-acrylonitrile copolymer, methyl acrylate-acrylonitrile copolymer, ethyl acrylate-acrylonitrile copolymer, butyl acrylate-acrylonitrile copolymer. One type or two or more types of copolymers selected from a polymer, a styrene-acrylonitrile copolymer, and the like can be given.

  By containing a copolymer having acrylonitrile as a monomer component in the resin composition, a nitrile group derived from a side chain of the copolymer having acrylonitrile as a monomer component is added to the organic layer 2 formed from the resin composition ( CN group) can be introduced. Since it is thought that the nitrile group of the organic layer 2 and the ester bond in the polyester base material 1 express high affinity by polar interaction, the adhesiveness of the organic layer 2 and the polyester base material 1 can be improved. .

  Further, by containing a polymer in the resin composition, it is possible to alleviate curing shrinkage of the organic layer 2 that occurs when the resin composition is cured, when an inorganic layer is formed, or when it is held in a moist heat environment. it is conceivable that. Therefore, since it is thought that the adhesiveness of the organic layer 2 and the polyester base material 1 falls, or it can prevent that a defect arises in the organic layer 2 and the inorganic layer 3, the gas barrier property which shows favorable gas-barrier property and durability The film 10 can be manufactured.

  The polymerization ratio of acrylonitrile in the copolymer containing acrylonitrile as a monomer component is preferably 0.1 mol% or more and 10 mol% or less, and more preferably 0.5 mol% or more and 5 mol% or less. By setting the polymerization ratio of acrylonitrile of the copolymer containing acrylonitrile as a monomer component to 0.1 mol% or more and 10 mol% or less, a nitrile group is introduced into the organic layer 2, and the organic layer 2, the polyester substrate 1, The adhesion can be further improved.

  Although the polymerization ratio of acrylonitrile is effective outside the above range, for example, when the polymerization ratio of acrylonitrile exceeds 10 mol%, the molecular weight of the copolymer containing acrylonitrile as a monomer component becomes small. It is considered that the curing shrinkage of the organic layer 2 that occurs when the product is cured is increased. Therefore, there is a possibility that the adhesion between the organic layer 2 and the polyester base material 1 may be reduced, or that the organic layer 2 and the inorganic layer 3 may be defective.

  The number average molecular weight of the copolymer containing acrylonitrile as a monomer component is preferably 15000 or more and 25000 or less. By setting the number average molecular weight of the copolymer containing acrylonitrile as a monomer component within this range, the shrinkage of the organic layer 2 that occurs when the resin composition is cured is reduced, and the dense organic layer 2 is formed. It can be formed. Therefore, the gas barrier film 10 which shows favorable gas barrier property and durability can be manufactured. In addition, the value of polystyrene conversion by gel permeation chromatography (GPC) can be used for the number average molecular weight.

  The number average molecular weight of the copolymer containing acrylonitrile as the monomer component is effective even if it is outside the above range. For example, if the number average molecular weight of the copolymer containing acrylonitrile as the monomer component is less than 15,000, this copolymer Since the molecular weight of the coalescence is small, it is considered that the curing shrinkage of the organic layer 2 that occurs when the resin composition is cured is increased. Therefore, there is a possibility that the adhesion between the organic layer 2 and the polyester base material 1 may be reduced, or that the organic layer 2 and the inorganic layer 3 may be defective. Further, when the number average molecular weight of the copolymer containing acrylonitrile as a monomer component exceeds 25,000, it is considered that the crosslink density of the organic layer 2 is lowered, so that there is a possibility that the dense organic layer 2 with high hardness cannot be formed.

  The blending amount of the copolymer containing acrylonitrile as a monomer component is preferably 30% by mass or more and 60% by mass or less with respect to the total amount of the monomer raw material and the polymer raw material. By setting the blending amount of the copolymer containing acrylonitrile as a monomer component within this range, a nitrile group is introduced into the organic layer 2 to further improve the adhesion between the organic layer 2 and the polyester substrate 1, It is considered that the dense organic layer 2 can be formed. Therefore, the gas barrier film 10 which shows favorable gas barrier property and durability can be manufactured.

  Even if the amount of the copolymer containing acrylonitrile as the monomer component is outside the above range, the effects of the present invention can be obtained. For example, the amount of the copolymer containing acrylonitrile as the monomer component is different from the monomer raw material and the polymer raw material. If the total amount is less than 30% by mass, the amount of nitrile groups introduced into the organic layer 2 is small, so that the adhesion between the organic layer 2 and the polyester substrate 1 may not be sufficiently improved. Moreover, since it is thought that the crosslinking density of the organic layer 2 falls when the compounding quantity of the copolymer which uses acrylonitrile as a monomer component exceeds 60 mass% with respect to the total amount of a monomer raw material and a polymer raw material, the organic layer 2 There is a possibility that the heat resistance of the resin may be reduced, or the dense and dense organic layer 2 may not be formed.

  The resin composition may contain a polymerizable compound such as a conventionally known monomer, oligomer or polymer other than those described above. Such a polymerizable compound is preferably a radical polymerizable compound. Although it does not specifically limit as a radically polymerizable compound, For example, what has a 1 or 2 or more ethylenically unsaturated double bond in a molecule | numerator is preferable. Although it does not specifically limit as a monomer containing 1 or 2 or more ethylenically unsaturated bond in a molecule | numerator, Vinyl monomers, such as N-vinyl pyrrolidone, N-vinyl caprolactone, vinyl imidazole, vinyl pyridine, styrene; Examples thereof include one or more monomers selected from derivatives, monofunctional acrylate monomers, bifunctional acrylate monomers, and the like. The oligomer containing one or more ethylenically unsaturated bonds in the molecule is not particularly limited. For example, oligomers formed by bonding the above monomers, polyfunctional acrylates, urethane acrylates, polyester acrylates, epoxies One or two or more oligomers selected from acrylate and the like can be mentioned. Although it does not specifically limit as a polymer which contains a 1 or 2 or more ethylenically unsaturated bond in a molecule | numerator, For example, the polymer of an above-described monomer or oligomer can be mentioned.

  The resin composition may contain a solvent from the viewpoint of adjusting the viscosity of the composition. Solvents include alcohols such as isopropyl alcohol, methanol and ethanol; ketones such as methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone; esters such as ethyl acetate and butyl acetate; halogenated hydrocarbons; aromatic carbonization such as toluene and xylene Mention may be made of hydrogen; or mixtures thereof. These solvents may be mixed and used at an arbitrary ratio within the scope of the gist of the present invention.

  If necessary, an additive may be added to the resin composition as long as the effects of the present invention are not impaired. Examples of the additive include a heat stabilizer, a plasticizer, a surfactant, an antistatic agent, an antioxidant, an infrared absorber, a dye (colored dye, colored pigment), an extender pigment, and a light diffusing agent. .

  The resin composition preferably contains a polymerization initiator as an additive. The polymerization initiator is not particularly limited, and examples thereof include acetophenones, benzophenones, Michler benzoyl benzoate, α-amyloxime ester, tetramethylthiuram monosulfide, and thioxanthones. More specifically, 1-hydroxycyclohexyl phenyl ketone can be preferably exemplified as the photopolymerization initiator.

  As a method of applying the resin composition, a conventionally known application method can be applied. Examples of such coating methods include roll coating, gravure roll coating, kiss roll coating, reverse roll coating, Miya bar coating, gravure coating, spin coating, dip coating, spray coating, and curtain coating. Method, flow coating method, die coating method and the like.

  After applying the resin composition, drying is performed as necessary. The drying temperature may be room temperature, but when the resin composition contains a solvent, drying for removing the solvent is preferably performed at a temperature equal to or higher than the boiling point of the solvent.

  The number of times that the resin composition is applied to the polyester substrate 1 may be one time or two or more times. By applying the resin composition twice or more, the gas barrier film 10C shown in FIG. 3 can be manufactured. When the application of the resin composition is performed twice or more, a resin composition having the same composition may be used or a resin composition having a different composition may be used as long as the constituent elements of the present invention are satisfied. From the viewpoint of improving gas barrier properties and durability of the gas barrier film 10, the composition of the resin composition applied for the first time is that the adhesion between the organic layer 2 formed of this resin composition and the polyester film substrate 1 is determined. In order to improve, it is preferable to increase the polymer. In addition, the composition of the resin composition to be applied after the second time is preferable to increase the monomer in order to improve the denseness of the inorganic layer 3 formed on the organic layer 2 formed of this resin composition. . In the case where the number of times of application of the resin composition is two times or more and a resin composition having a different composition is used, in order to prevent the resin compositions applied to the polyester substrate 1 from being mixed with each other, It is preferable to dry the resin composition applied in between or to provide an organic layer forming step described later between the application steps.

(Organic layer formation process)
The organic layer forming step is a step of forming the organic layer 2 by curing the resin composition. The organic layer 2 is provided in contact with the polyester substrate 1 by such a method of forming the organic layer 2.

  The method for curing the resin composition is not particularly limited, and examples thereof include a method for curing by irradiating with ionizing radiation to cause crosslinking polymerization. The ionizing radiation is an electron beam and an ultraviolet ray, an electromagnetic wave such as a visible ray, an X-ray and a γ ray, and a charged particle beam such as an α ray.

  When ultraviolet rays are applied as the ionizing radiation, for example, a light source such as an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc lamp, a black light fluorescent lamp, or a metal halide lamp is used. When applying an electron beam as ionizing radiation, for example, various electron beam accelerators such as Cockcroft-Walton type, Bandegraft type, resonant transformer type, insulated core transformer type, linear type, dynamitron type, high frequency type, etc. Can be used as an electron beam source.

  The thickness of the organic layer 2 to be formed is preferably 0.1 μm or more and 20 μm or less from the viewpoint of the deflection of the substrate regardless of whether it is a single layer or two or more layers. More preferably, it is 0.5 μm or more and 10 μm or less.

(Inorganic layer forming process)
The inorganic layer forming step is a step of forming the inorganic layer 3 on the organic layer 2.

  The inorganic layer 3 is formed on the organic layer 2 as a functional layer that blocks gas such as water vapor. Examples of the material for forming the inorganic layer 3 include one or more inorganic compounds selected from inorganic oxides, inorganic oxynitrides, inorganic nitrides, inorganic oxide carbides, inorganic oxycarbonitrides, silicon zinc oxides, and the like. Can be mentioned. Specific examples include inorganic compounds containing one or more elements selected from silicon, aluminum, magnesium, titanium, tin, indium, cerium, and zinc, and more specifically, silicon. Inorganic oxides such as oxides, aluminum oxides, magnesium oxides, titanium oxides, tin oxides, silicon zinc alloy oxides and indium alloy oxides, inorganics such as silicon nitrides, aluminum nitrides and titanium nitrides Inorganic silicon oxynitride such as nitride and silicon oxynitride can be given. Particularly preferably, the inorganic layer 3 is a layer made of one or more selected from silicon oxide, silicon nitride, silicon oxynitride, and silicon zinc oxide. The inorganic layer 3 may use the said material independently, and may mix and use the said material in arbitrary ratios within the range of the summary of this invention.

  The thickness of the inorganic layer 3 varies depending on the inorganic compound used, but is usually 5 nm or more, preferably 10 nm or more from the viewpoint of securing gas barrier properties, and usually 5000 nm or less from the viewpoint of suppressing the occurrence of cracks and the like. , Preferably 500 nm or less, more preferably 300 nm or less. The inorganic layer 3 may be a single layer or two or more inorganic layers 3 having a total thickness within the above range. In the case of two or more inorganic layers 3, the same materials may be combined or different materials may be combined.

  As a method for forming the inorganic layer 3, for example, a physical vapor deposition method such as a vacuum deposition method, a sputtering method, an ion plating method, or a plasma chemical vapor deposition method can be preferably exemplified. The film forming conditions in these various forming methods may be adjusted by appropriately adjusting conventionally known film forming conditions in consideration of the physical properties and thickness of the inorganic layer to be obtained.

  More specifically, (1) a vacuum vapor deposition method in which a raw material such as an inorganic oxide, inorganic nitride, inorganic oxynitride, or metal is heated and deposited on a substrate, and (2) oxygen gas is introduced into the raw material. Oxidation reaction vapor deposition method to oxidize and deposit on the substrate, (3) Sputtering method to deposit on the substrate by introducing argon gas and oxygen gas into the target material and sputtering, (4) Generate the material with plasma gun Using an ion plating method in which the plasma beam is heated and deposited on the substrate, and (5) a plasma chemical vapor deposition method in which an organic silicon compound or the like is used as a raw material and a silicon oxide film is deposited on the substrate. Can do.

  Among the methods for forming the inorganic layer 3 described above, an ion plating method is preferable. Since the dense inorganic layer 3 can be formed on the organic layer 2 by forming the inorganic layer 3 by the ion plating method, the gas barrier film 10 exhibiting a good gas barrier property can be manufactured.

(Other processes)
The method for producing the gas barrier film 10 may include, for example, a step of forming an arbitrary functional layer on the inorganic layer 3 or the surface S2 on the side where the organic layer 2 is not provided. As an optional functional layer, a conventionally known matting agent layer, protective layer, antistatic layer, smoothing layer, adhesion improving layer, light shielding layer, antireflection layer, hard coat layer, stress relaxation layer, antifogging layer, antifouling layer Layer, printing layer, and the like. A conventionally well-known formation method can be applied to the formation process of such a functional layer.

[Device Manufacturing Method]
The device manufacturing method according to the present invention is characterized in that it is a device including the gas barrier film 10 manufactured by the gas barrier film manufacturing method of the present invention. Thereby, since the gas barrier property film 10 which shows a favorable gas barrier property and a weather resistance is provided, the apparatus which shows a favorable weather resistance can be provided. More specifically, it is possible to reduce the influence of high temperature and high humidity that degrade the quality characteristics of the apparatus. Examples of such a device include a display device and a power generation device.

  Examples of the display device include an organic EL element, a liquid crystal display element, a touch panel, and electronic paper. Moreover, as a power generator, a solar cell element (solar cell module) can be mentioned, for example. Since these devices have the property that the organic EL element, the liquid crystal display element, the solar cell element, and the like, which are to be sealed, easily deteriorate due to moisture absorption, it is highly significant that the gas barrier film 10 of the present invention is provided.

  The configuration of the apparatus is not particularly limited, and a conventionally known configuration can be adopted as appropriate. Moreover, the manufacturing method of such an apparatus is not specifically limited, If a gas barrier film 10 is provided as a sealing body, a conventionally known manufacturing method can be applied.

  Specifically, for example, as an organic EL element, a cathode and an anode are provided on the gas barrier film 10 according to the present invention, and an organic light emitting layer (also simply referred to as “light emitting layer”) is provided between both electrodes. The thing which has an organic layer to include can be mentioned. Such an organic EL element can be manufactured by forming electrodes on the gas barrier film 10 by a conventionally known method such as sputtering. As a lamination | stacking aspect of the organic layer containing a light emitting layer, the aspect laminated | stacked in order of the positive hole transport layer, the light emitting layer, and the electron carrying layer from the anode side is preferable. Furthermore, a charge blocking layer or the like may be provided between the hole transport layer and the light-emitting layer, or between the light-emitting layer and the electron transport layer. Further, a hole injection layer may be provided between the anode and the hole transport layer, and an electron injection layer may be provided between the cathode and the electron transport layer. Further, the light emitting layer may be only one layer, or the light emitting layer may be divided like a first light emitting layer, a second light emitting layer, a third light emitting layer, and the like. Furthermore, each layer may be divided into a plurality of secondary layers. Since the organic EL element is a light emitting element, at least one of the anode and the cathode is preferably transparent.

  As a solar cell module, the example which uses the gas barrier film 10 which concerns on this invention as a solar cell backsheet can be given. Such solar cell modules are, in order from the sunlight side in the thickness direction, a front substrate (having high light transmittance such as glass or film), filler, solar cell element, lead wire, terminal, terminal box, solar In the configuration of the battery back sheet, they are fixed to exterior materials (aluminum frames or the like) at both ends via a sealing material. Examples of the solar cell backsheet include an example in which the gas barrier film 10 according to the present invention is disposed between the back surface sealing film and the film disposed on the outer layer side. As the back surface sealing film, for example, a white polyester film having a high reflectivity is used so as to reflect sunlight on the solar cell module side and increase the conversion efficiency. Moreover, as a film arrange | positioned at the outer layer side, a weather resistance, a hydrolysis resistance film, etc. are used.

  EXAMPLES The present invention will be described more specifically with reference to examples. However, the present invention is not limited to the description of the following examples unless it exceeds the gist.

[Example 1]
As a polyester base material, a resin composition A prepared in the following composition was applied to one side of a polyethylene terephthalate film (PET, manufactured by Toray Industries, Inc., trade name: S10) having a thickness of 100 μm by die coating, and 3% at 80 ° C. After drying for a minute, an organic layer having a thickness of 2 μm was formed by irradiating with ultraviolet rays under the condition of an integrated light quantity of 400 mJ in a wavelength range of 260 nm to 400 nm. The polyethylene terephthalate film is not surface-treated or provided with an undercoat layer.

(Composition of resin composition A)
A mixture of pentaerythritol triacrylate (monomer) and methyl methacrylate-acrylonitrile copolymer (polymer) (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., trade name: UV-5501): 15.4 parts by mass Methyl ethyl ketone: 32 parts by mass Toluene: 32 parts by mass 1-hydroxycyclohexyl phenyl ketone (photopolymerization initiator, manufactured by Ciba Geigy Japan Ltd., trade name: Irgacure 184): 0.6 parts by mass The number of acryloyl groups in the above monomer is 3 The polymerization ratio of acrylonitrile (ACN) of the above-mentioned polymer is 1 mol%, and the number average molecular weight is 20000.

The inorganic layer was formed on the organic layer. Specifically, the organic layer side of the polyethylene terephthalate film on which the organic layer was formed was set in a hollow cathode type ion plating apparatus in a direction to form a film. Then, silicon oxide (manufactured by High-Purity Chemical Laboratory), which is an evaporation source material, was put into a crucible in a hollow cathode ion plating apparatus, and then evacuated. After the degree of vacuum reached 5 × 10 ⁻⁴ Pa, 15 sccm of argon gas was introduced into the plasma gun, and plasma with a current of 110 A and a voltage of 90 V was generated. Plasma was bent in a predetermined direction by maintaining the inside of the chamber at 1 × 10 ⁻¹ Pa and magnetic force, and the evaporation source material was irradiated. It was confirmed that the evaporation source material in the crucible sublimates through a molten state. Ion plating was performed for 15 seconds to deposit on the substrate, thereby forming a silicon oxide layer having a thickness of 100 nm.

  The gas barrier film of Example 1 obtained as described above is formed by laminating a polyethylene terephthalate film, an organic layer, and an inorganic layer in that order.

[Example 2]
A gas barrier film of Example 2 is produced in the same manner as in Example 1 except that a 100 μm thick polyethylene naphthalate film (PEN, manufactured by Teijin DuPont Films Ltd., trade name: Q51) is used as the polyester base material. did.

[Example 3]
A gas barrier film of Example 3 was produced in the same manner as in Example 1 except that the resin composition B prepared in the following composition was used. Resin composition B is the same as resin composition A except that the type of polymer is changed.

(Composition of resin composition B)
Pentaerythritol triacrylate (monomer, Nippon Kayaku Co., Ltd., trade name: PET-30): 7.7 parts by mass Styrene-acrylonitrile copolymer (polymer): 7.7 parts by mass Methyl ethyl ketone: 32 parts by mass Toluene: 32 parts by mass 1-hydroxycyclohexyl phenyl ketone (photopolymerization initiator, manufactured by Ciba Geigy Japan Ltd., trade name: Irgacure 184): 0.6 parts by mass The number of acryloyl groups in the above monomer is 3 The polymerization ratio of acrylonitrile (ACN) of the above-mentioned polymer is 1 mol%, and the number average molecular weight is 18000-20000.

[Example 4]
A gas barrier film of Example 4 was produced in the same manner as in Example 1 except that the resin composition C prepared in the following composition was used. Resin composition C is the same as resin composition B except that the type of monomer is changed.

(Composition of resin composition C)
-Hexafunctional urethane acrylate (monomer, Nippon Synthetic Chemical Industry Co., Ltd., trade name: UV-7600B): 7.7 parts by mass-Styrene-acrylonitrile copolymer (polymer): 7.7 parts by mass-Methyl ethyl ketone: 32 -Toluene: 32 parts by mass-1-hydroxycyclohexyl phenyl ketone (photopolymerization initiator, manufactured by Ciba Geigy Japan, trade name: Irgacure 184): 0.6 parts by mass-Number of acryloyl groups of the above-described monomers The polymerization ratio of acrylonitrile (ACN) of the above-mentioned polymer is 1 mol%, and the number average molecular weight is 18000-20000.

[Example 5]
A gas barrier film of Example 5 was produced in the same manner as in Example 1 except that the resin composition D prepared in the following composition was used. The resin composition D is the same as the resin composition B except that the amount of the monomer and the polymer is changed and the type of the polymer is changed.

(Composition of resin composition D)
Pentaerythritol triacrylate (monomer, Nippon Kayaku Co., Ltd., trade name: PET-30): 10.8 parts by mass Styrene-acrylonitrile copolymer (polymer): 4.6 parts by mass Methyl ethyl ketone: 32 parts by mass Toluene: 32 parts by mass 1-hydroxycyclohexyl phenyl ketone (photopolymerization initiator, manufactured by Ciba Geigy Japan Ltd., trade name: Irgacure 184): 0.6 parts by mass The number of acryloyl groups in the above monomer is 3 The polymerization ratio of acrylonitrile (ACN) of the above-mentioned polymer is 1 mol%, and the number average molecular weight is 18000-20000.

[Comparative Example 1]
A gas barrier film of Comparative Example 1 was produced in the same manner as in Example 1 except that the resin composition a prepared in the following composition was used. The resin composition a is the same as the resin composition A except that the type and amount of the monomer are changed and no polymer is contained.

(Composition of resin composition a)
Dipentaerythritol hexaacrylate (monomer, manufactured by Toagosei Co., Ltd., trade name: M-403): 15.4 parts by mass Methyl ethyl ketone: 32 parts by mass Toluene: 32 parts by mass 1-hydroxycyclohexyl phenyl ketone (photopolymerization) Initiator, manufactured by Nippon Ciba-Geigy Co., Ltd., trade name: Irgacure 184): 0.6 parts by mass The number of acryloyl groups in the monomer described above is 6.

[Comparative Example 2]
A gas barrier film of Comparative Example 2 was produced in the same manner as in Example 1 except that the resin composition b prepared in the following composition was used. The resin composition b is the same as the resin composition a except that the type of monomer is changed.

(Composition of resin composition b)
-Hexafunctional urethane acrylate (monomer, Nippon Synthetic Chemical Industry Co., Ltd., trade name: UV-7600B): 15.4 parts by mass-Methyl ethyl ketone: 32 parts by mass-Toluene: 32 parts by mass-1-hydroxycyclohexyl phenyl ketone ( Photopolymerization initiator, manufactured by Ciba Geigy Japan, trade name: Irgacure 184): 0.6 parts by mass The number of acryloyl groups in the above-described monomer is 6.

[Comparative Example 3]
A gas barrier film of Comparative Example 3 was produced in the same manner as in Example 1 except that the resin composition c prepared in the following composition was used. The resin composition c is the same as the resin composition a except that the type of monomer is changed.

(Composition of resin composition c)
-Bifunctional urethane acrylate (monomer, manufactured by Nippon Synthetic Chemical Industry Co., Ltd., trade name: UV-3000B): 15.4 parts by mass-Methyl ethyl ketone: 32 parts by mass-Toluene: 32 parts by mass-1-hydroxycyclohexyl phenyl ketone ( Photopolymerization initiator, manufactured by Ciba Geigy Japan Ltd., trade name: Irgacure 184): 0.6 parts by mass The number of acryloyl groups in the above-described monomer is 2.

[Comparative Example 4]
A gas barrier film of Comparative Example 4 was produced in the same manner as in Example 1 except that the resin composition d prepared in the following composition was used. The resin composition d is the same as the resin composition A except that the type and content of the polymer are changed and no monomer is contained.

(Composition of resin composition d)
-Polymethyl methacrylate (polymer, manufactured by Sigma-Aldrich Japan): 15.4 parts by mass-Methyl ethyl ketone: 32 parts by mass-Toluene: 32 parts by mass-1-hydroxycyclohexyl phenyl ketone (photopolymerization initiator, Nippon Ciba-Geigy Corporation) Manufactured, trade name: Irgacure 184): 0.6 parts by mass The polymerization ratio of acrylonitrile (ACN) of the above-mentioned polymer is 0 mol%, and the number average molecular weight is 12000 to 24000.

[Comparative Example 5]
A gas barrier film of Comparative Example 5 was produced in the same manner as in Example 1 except that the resin composition e prepared in the following composition was used. The resin composition e is the same as the resin composition C except that the type of monomer is changed.

(Composition of resin composition e)
-Bifunctional urethane acrylate (monomer, manufactured by Nippon Synthetic Chemical Industry Co., Ltd., trade name: UV-3000B: 7.7 parts by mass)-Styrene-acrylonitrile copolymer (polymer): 7.7 parts by mass-Methyl ethyl ketone: 32 parts by mass Parts Toluene: 32 parts by mass 1-hydroxycyclohexyl phenyl ketone (photopolymerization initiator, Nippon Ciba Geigy Co., Ltd., trade name: Irgacure 184): 0.6 parts by mass The number of acryloyl groups of the above-described monomers is The polymerization ratio of acrylonitrile (ACN) of the above-mentioned polymer is 1 mol%, and the number average molecular weight is 18000-20000.

[Reference Example 1]
A gas barrier film of Reference Example 1 was produced in the same manner as in Example 1 except that the resin composition f prepared in the following composition was used. The resin composition f is the same as the resin composition B except that the type of polymer is changed.

(Composition of resin composition f)
Pentaerythritol triacrylate (monomer, Nippon Kayaku Co., Ltd., trade name: PET-30): 7.7 parts by mass Styrene-acrylonitrile copolymer (polymer, manufactured by Wako Pure Chemical Industries, Ltd.): 7.7 -Methyl ethyl ketone: 32 parts by mass-Toluene: 32 parts by mass-1-Hydroxycyclohexyl phenyl ketone (photopolymerization initiator, manufactured by Nippon Ciba-Geigy Co., Ltd., trade name: Irgacure 184): 0.6 parts by mass The number of acryloyl groups of the monomer is 3, the polymerization ratio of acrylonitrile (ACN) of the above-mentioned polymer is 25 mol%, and the number average molecular weight is 18,000 to 20,000.

  Table 1 shows the compositions of the resin compositions of Examples 1 to 5, Comparative Examples 1 to 5, and Reference Example 1. In addition, each compounding quantity of a monomer raw material and a polymer raw material represents the compounding quantity with respect to the total amount of a monomer raw material and a polymer raw material.

[Evaluation and results]
For the gas barrier films of Examples 1 to 5, Comparative Examples 1 to 5 and Reference Example 1, (A) Measurement of water vapor permeability immediately after production (initial), (A) Adhesion test immediately after production (initial), ( C) Measurement of water vapor transmission rate after the moist heat resistance test and (d) an adhesion test after the moist heat resistance test.

  The measurement of water vapor transmission rate was performed using a water vapor transmission rate measurement device (manufactured by MOCON, trade name: PERMATRAN-W3 / 31) in an atmosphere of a temperature of 40 ° C. and a humidity of 100% RH.

  The moisture and heat resistance test is performed using an unsaturated pressure cooker apparatus (trade name: PC-422R7, manufactured by Hirayama Seisakusho Co., Ltd.) in an atmosphere adjusted to a temperature of 120 ° C. and a humidity of 85% RH. Performed by holding for 48 hours.

  The adhesion test was performed by a cross cut test. The cross cut test is based on the description of JIS-K5600-5-6 (1999) "Paint general test method-Part 5: Mechanical properties of coating film-Section 6: Adhesion (cross-cut method)". went. Specifically, 100 cuts are made by placing 11 cuts vertically and horizontally at intervals of 1 mm through the inorganic layer to reach the polyester base material, and cello tape (registered trademark of Nichiban Co., Ltd. After attaching the name), this was quickly pulled in the direction of 60 ° to be peeled off, and visually observed to confirm the presence or absence of peeling. As a notation method of the result, the case where there is no peeling of 100 grids is indicated as 0/100, the case where 10 pieces are peeled off is indicated as 10/100, and all 100 grids are peeled off. The case was expressed as 100/100.

  The results are shown in Table 2.

  From Table 1, the gas barrier films of Examples 1 to 5 were able to maintain a high water vapor transmission rate even after the wet heat resistance test. In addition, the gas barrier films of Examples 1 to 3 and 5 were not peeled between the organic layer and the inorganic layer by the adhesion test, and the gas barrier film of Example 4 was peeled 5 out of 100 pieces. It turned out to be no problem in practical use.

  The gas barrier film of Reference Example 1 was slightly inferior to the gas barrier films of Examples 1 to 5 in terms of water vapor transmission rate and adhesion test after the heat and humidity resistance test, but it was practically used depending on applications. It was usable without problems.

  The gas barrier films of Comparative Examples 1 and 2 had good initial water vapor transmission rate and adhesion, but both the water vapor transmission rate and adhesion deteriorated after the wet heat resistance test. The gas barrier film of Comparative Example 3 had a high initial water vapor permeability and insufficient gas barrier properties. The gas barrier films of Comparative Examples 4 and 5 had good adhesion even after the wet heat resistance test, but had a high initial water vapor permeability and insufficient gas barrier properties.

DESCRIPTION OF SYMBOLS 1 Polyester base material 2,2 'Organic layer 3,3' Inorganic layer 4 1st organic layer 5 2nd organic layer 10, 10A, 10B, 10C Gas barrier film S1 One side of polyester base material S2 Other than polyester base material Face of

Claims (6)

Preparing a polyester substrate;
Applying a resin composition containing a monomer raw material containing a monomer having three or more acryloyl groups and a polymer raw material containing a copolymer containing acrylonitrile as a monomer component on the polyester substrate;
Curing the resin composition to form an organic layer;
And a step of forming an inorganic layer on the organic layer.   The method for producing a gas barrier film according to claim 1, wherein a polymerization ratio of acrylonitrile of the copolymer is 0.1 mol% or more and 10 mol% or less.   The gas barrier film according to claim 1 or 2, wherein a blending amount of the monomer having three or more acryloyl groups is 40% by mass or more and 70% by mass or less with respect to a total amount of the monomer raw material and the polymer raw material. Manufacturing method.   The method for producing a gas barrier film according to any one of claims 1 to 3, wherein the polyester substrate is a polyethylene terephthalate film or a polyethylene naphthalate film.   The method for producing a gas barrier film according to claim 1, wherein the step of forming an inorganic layer on the organic layer is performed by an ion plating method.   The manufacturing method of an apparatus provided with the gas barrier film manufactured with the manufacturing method of the gas barrier film of any one of Claims 1-5.

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