JP5870759B2 - Electronic equipment - Google Patents

Description

  The present invention relates to an electronic device.

  Conventionally, various electronic devices including operation keys operated by a user have been proposed (see, for example, Patent Document 1).

JP 2006-202751 A

  As an electronic device provided with such operation keys, for example, there is a DSRC on-vehicle device. In such a DSRC on-vehicle device, a substrate is arranged so as to be orthogonal to the design surface (operation surface), and on this substrate, a switch that is turned on and off by an operation key arranged on the design surface is pressed. On the other hand, the type in which the movable part moves in the vertical direction is mounted.

  In addition, in the configuration using the type of switch in which the movable part moves in the horizontal direction with respect to the substrate surface, a defect due to solder peeling of the switch occurs and the reliability is lowered. On the other hand, a switch of a type in which the movable part moves in the vertical direction is used.

  FIG. 6 shows the hinge structure of the operation key of the DSRC on-vehicle device as described above. As shown in this figure, a resin rod-shaped shaft 30c is provided on the lower side of the key operation unit 30, and when the key operation unit 30 is pushed horizontally with the component mounting surface of the substrate 40, the resin The rod-shaped shaft 30c is twisted so that the pressing member 30a moves in a direction perpendicular to the component mounting surface of the substrate 40, and a movable part of a switch (not shown) arranged immediately below the pressing member 30a is pushed down. .

  However, in such a configuration in which the direction of the force is converted using the twist of the rod-shaped shaft 30c, a member 30d for supporting the rod-shaped shaft 30c from both the left and right sides is required. Therefore, there is a problem that the component mountable region on the board 40 is narrowed by the member 30d for supporting the rod-shaped shaft 30c from the left and right sides.

  The present invention has been made in view of the above problems, and an object of the present invention is to widen a component mountable area on a board.

  To achieve the above object, the invention described in claim 1 includes a case (2) having a design surface (2a) and a substrate (2) accommodated in the case (2) so as to be orthogonal to the design surface (2a). 40), a switch (50) mounted on the component mounting surface of the substrate (40) and moving the movable portion (50a) in a direction orthogonal to the component mounting surface, and the movable portion (50a) of the switch (50). The key operation unit (30) connected to the pressing member (30a) moved in the direction orthogonal to the component mounting surface, one end connected to the key operation unit (30), and the other end contacted the side surface of the board (40). When the key operating part (30) receives a pressing force in a direction perpendicular to the design surface (2a), the key operating part (30) is elastically deformed, and the pressing member (30a) is moved from the side surface of the substrate (40) to the base ( 40) a spring member that is displaced in a direction perpendicular to the component mounting surface ( And 0b), it is characterized by comprising a.

  According to such a configuration, the spring member (30b) is arranged such that one end is connected to the key operation unit (30) and the other end is in contact with the side surface of the substrate (40), and the key operation unit (30). Receives elastic pressure in a direction perpendicular to the design surface (2a) and elastically deforms, and the pressing member (30a) is displaced in a direction perpendicular to the component mounting surface of the substrate (40) with the side surface of the substrate (40) as a base point. Since it does not cover the component mounting surface of the substrate (40), the component mountable region on the substrate can be widened.

In the invention according to claim 1 , the shape of the spring member (30b) viewed from the side surface of the case (2) orthogonal to the design surface (2a) and the component mounting surface of the substrate (40) is an inverted V-shape. It is characterized by becoming.

  According to such a configuration, the shape of the spring member (30b) viewed from the side surface of the case (2) orthogonal to the design surface (2a) and the component mounting surface of the substrate (40) is an inverted V-shape. Therefore, when the key operating portion (30) receives the pressing force F in the direction orthogonal to the design surface (2a) and the top of the spring member (30b) is compressed and elastically deformed, the key on the spring member (30b) A spring reaction force in the direction opposite to the pressing force received by the key operation unit (30) is generated at the connection portion with the operation unit (30), and the stress is relieved by this spring reaction force, improving the durability of the spring member (30b). Can be made.

Further, as in the invention described in claim 2 , by configuring the one end of the spring member (30b) to be connected to the key operation portion (30) at one central position inside the case (2), The structure of the spring member (30b) can be simplified.

Further, as in the invention described in claim 3 , by configuring the one end of the spring member (30b) to be connected to the lower end inside the case (2) of the key operation portion (30), It is possible to generate a large moment in 30a) in the direction perpendicular to the component mounting surface of the substrate (40).

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

1 is an external view of an electronic device according to an embodiment of the present invention. It is an external view of the hinge structure of the electronic device which concerns on one Embodiment of this invention. It is the figure seen from the arrow A direction in FIG. It is the figure seen from the arrow B direction in FIG. It is the figure which showed the relationship between the pressing force F with respect to a key operation part, and the spring reaction force F 'of a spring member. It is a figure showing the hinge structure of the structure which supports resin-made rod-shaped shafts from right and left both sides.

  FIG. 1 is an external view of an electronic device according to an embodiment of the present invention. The electronic device according to the present embodiment is configured as a DSRC vehicle-mounted device 1. The DSRC on-vehicle device 1 communicates with a roadside machine based on information stored in a card for fee payment inserted from the card insertion slot, thereby paying a toll road toll or a parking lot usage fee, etc. Is to do. The DSRC on-vehicle device 1 is attached to an accessory case provided on an instrument panel of a vehicle, for example.

  The DSRC vehicle-mounted device 1 includes a case 2 having a design surface (operation surface) 2a. On the design surface 2 a, two key operation units 30, a card connector 31 for storing a fee payment card, an eject switch 32 for taking out a fee payment card stored in the card connector 31, and the like are arranged. . Note that one side of the key operation unit 30 is for adjusting the volume, and the other side of the key operation unit 30 is for instructing voice guidance of the usage history.

  In FIG. 2, the hinge structure part including the key operation part 30 at the time of permeate | transmitting the case 2 of the DSRC onboard equipment 1 is shown. FIG. 3 shows a view of one hinge structure portion from the direction of arrow A in FIG. FIG. 4 shows a view of one hinge structure portion from the direction of arrow B in FIG. Note that the card connector shown in FIG. 3 is omitted in FIGS.

  The hinge structure part is composed of a key operation part 30, a pressing member 30a, and a spring member 30b. A push member 30a and a spring member 30b are connected to the key operation unit 30, respectively. The key operation unit 30, the pressing member 30a, and the spring member 30b are formed by integrally molding ABS resin.

  The substrate 40 is housed in the case 2 so that the component mounting surface is parallel to the bottom surface of the case 2. That is, the substrate 40 is housed in the case 2 so as to be orthogonal to the design surface 2 a of the case 2.

  Various electronic components are mounted on the component mounting surface of the substrate 40. In FIG. 2, only the switch 50 is shown, and other electronic components are omitted. The switches 50 are respectively arranged at positions corresponding to the two hinge structures. Each switch 50 is a tact switch in which a movable portion 50a moves in a direction orthogonal to the component mounting surface of the substrate 40, and a contact (not shown) opens and closes according to the state of the movable portion 50a.

  As shown in FIG. 3, a pressing member 30 a that moves the movable portion 50 a of the switch 50 in a direction orthogonal to the component mounting surface of the substrate 40 is disposed on the top of the switch 50.

  The spring member 30b is arranged so that one end is connected to the lower end of the key operation unit 30 and the other end is in contact with the side surface of the substrate 40, and the key operation unit 30 is pressed in a direction perpendicular to the design surface 2a. When received, it is elastically deformed and the pressing member 30a is displaced in a direction orthogonal to the component mounting surface of the substrate 40 with the side surface of the substrate 40 as a base point.

  Further, as shown in FIG. 3, the spring member 30b is located between the side surface of the substrate 40 and the inside of the design surface a of the case 2 and does not cover the component mounting surface of the substrate 40. There is no restriction on the component mountable area.

  Moreover, in this embodiment, as shown in FIG. 3, the shape of the spring member 30b seen from the direction of arrow A in FIG. 2, that is, the side surface of the case 2 orthogonal to the design surface 2a and the component mounting surface of the substrate 40 The shape of the spring member 30b viewed from the side is an inverted V-shape.

  In addition, in order to reduce the height of the case 2 to reduce the thickness of the case 2, one end of the spring member 30 b is connected to the lower end of the key operation unit 30 and the other end contacts the side surface of the substrate 40. Are arranged as follows.

  As shown in FIG. 4, the spring member 30 b is provided on the back side at the center of the left and right of the key operation unit 30 when viewed from the design surface side. In addition, the dimension (width) of the key operation part 30 seen from the design surface side is 10 millimeters (mm), and the dimension (width) T of the spring member 30b is about 5 millimeters (m).

  In the above configuration, normally, the pressing member 30a is arranged on the top of the switch 50, and the contact of the switch 50 is in an open state.

  When the key operation unit 30 receives a pressing force in a direction orthogonal to the design surface 2a according to a user operation, the spring member 30b is elastically deformed, and the pressing member 30a is used as a component mounting surface of the substrate 40 with the side surface of the substrate 40 as a base point. Displace in the orthogonal direction. As described above, when the pressing member 30a is displaced in the direction orthogonal to the component mounting surface of the substrate 40 and the movable part of the switch 50 is pressed, the contact of the switch 50 is closed.

  Further, when the key operation unit 30 is not subjected to the pressing force in the direction orthogonal to the design surface 2a, the spring member 30b acts to return to the original state, so that the key operation unit 30 returns to the original position, and the switch 50 contacts are open.

  In the present embodiment, as shown in FIG. 3, the shape of the spring member 30 b viewed from the direction of arrow A in FIG. 2, that is, from the side surface side of the case 2 orthogonal to the design surface 2 a and the component mounting surface of the substrate 40. Since the shape of the spring member 30b as viewed is an inverted V-shape, as shown in FIG. 5, the key operating portion 30 receives a pressing force F in a direction perpendicular to the design surface 2a, and the top portion C of the spring member 30b. Is compressed and elastically deformed, a spring reaction force F ′ in the direction opposite to the pressing force F received by the key operation unit 30 is generated at the connection portion D of the spring member 30b with the lower end of the key operation unit 30.

  That is, the top portion C of the spring member 30b is compressed by the pressing force F received by the key operation portion 30, whereas the connection portion D of the spring member 30b with the lower end of the key operation portion 30 is caused by the spring reaction force F ′. Acts to stretch. Due to such a spring reaction force F ', the stress is relieved, so that the durability of the spring member 30b can be improved.

  Further, since one end of the spring member 30b is connected to the lower end inside the case 2 of the key operation unit 30, a large moment (rotation) in the direction perpendicular to the component mounting surface of the board 40 as shown in FIG. Force) can be generated.

  It should be noted that in order to obtain the user operating force required to turn on the switch = 3.8 Newton (N), the maximum stress applied to the resin rod-shaped shaft 30c as shown in FIG. When the maximum stress applied to the spring member 30b shown in FIG. 4 was analyzed, the maximum stress applied to the resin rod-shaped shaft 30c was 34.3 megapascals (MPa), and the maximum stress applied to the spring member 30b was 19.834. .3 megapascal (MPa). This is the result of analysis assuming that the hinge structure is composed of ABS resin with Young's modulus = 1930 megapascals (MPa).

  As described above, the maximum stress applied to the spring member 30b is about 58% of the maximum stress applied to the resin rod-shaped shaft 30c as shown in FIG. 6, and this is advantageous in terms of durability. It could be confirmed.

  According to the configuration described above, the spring member 30b is arranged so that one end is connected to the key operation unit 30 and the other end is in contact with the side surface of the substrate 40, and the key operation unit 30 is in a direction orthogonal to the design surface 2a. The pressing member 30a is configured to be displaced in a direction orthogonal to the component mounting surface of the substrate 40 with the side surface of the substrate 40 as a base point, and does not affect the component mounting surface of the substrate 40. It is possible to widen the component mountable area on the board.

  Further, since the shape of the spring member 30b viewed from the side surface side of the case 2 orthogonal to the design surface 2a and the component mounting surface of the substrate 40 is an inverted V shape, the key operation unit 30 is orthogonal to the design surface 2a. When the top portion of the spring member 30b is compressed and elastically deformed by receiving the pressing force F in the direction, the spring reaction in the opposite direction to the pressing force received by the key operation unit 30 at the connection portion with the key operation unit 30 in the spring member 30b. A force is generated, the stress is relieved by the spring reaction force, and the durability of the spring member 30b can be improved.

  Moreover, the structure of the spring member 30b can be simplified by configuring the one end of the spring member 30b to be connected to the key operation unit 30 at one central position inside the case 2.

  Further, by configuring one end of the spring member 30b to be connected to the lower end inside the case 2 of the key operation unit 30, a large moment in the direction perpendicular to the component mounting surface of the substrate 40 is generated in the pressing member 30a. Is possible.

  In addition, this invention is not limited to the said embodiment, Based on the meaning of this invention, it can implement with a various form.

  For example, in the above-described embodiment, an electronic device configured as an ETC on-vehicle device has been described.

  Moreover, in the said embodiment, although the key operation part 30, the pressing member 30a, and the spring member 30b showed the example comprised by integrally molding ABS resin, it is not limited to ABS resin, Moreover, integral molding is carried out. It is not limited to what was done.

  Moreover, in the said embodiment, although the end of the spring member 30b showed the structure connected with the lower end inside case 2 of the key operation part 30, it was not necessarily connected with the lower end inside case 2 of the key operation part 30. For example, the spring member 30b may be configured such that one end of the spring member 30b is connected to a slightly upper part of the lower end inside the case 2 of the key operation unit 30.

  Moreover, in the said embodiment, although the example which made the shape of the spring member 30b seen from the side surface side of the case 2 orthogonal to the design surface 2a and the component mounting surface of the board | substrate 40 made reverse V shape was shown, It can also be a shape.

DESCRIPTION OF SYMBOLS 1 DSRC onboard equipment 2 Case 30 Key operation part 30a Push member 30b Spring member 40 Board | substrate 50 Switch

Claims (3)

A case (2) having a design surface (2a);
A substrate (40) housed in the case (2) so as to be orthogonal to the design surface (2a);
A switch (50) mounted on a component mounting surface of the substrate (40) and having a movable part (50a) moving in a direction perpendicular to the component mounting surface;
A key operation unit (30) connected to a pressing member (30a) for moving the movable part (50a) of the switch (50) in a direction perpendicular to the component mounting surface;
One end is connected to the key operation unit (30), the other end is disposed so as to contact the side surface of the substrate (40), and the key operation unit (30) is perpendicular to the design surface (2a). A spring member (30b) that is elastically deformed when subjected to a pressing force of (2) and displaces the pressing member (30a) in a direction perpendicular to the component mounting surface of the substrate (40) with the side surface of the substrate (40) as a base point; equipped with a,
The shape of the spring member (30b) viewed from the side surface of the case (2) orthogonal to the design surface (2a) and the component mounting surface of the substrate (40) is an inverted V-shape. apparatus. One end of the spring member (30b), the electronic device according to claim 1, characterized in that connected the key operation unit (30) in said case (2) one point of the inner central. The electronic device according to claim 1 or 2 , wherein one end of the spring member (30b) is connected to a lower end inside the case (2) of the key operation unit (30).

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