JP5854089B2 - Housing for electrical parts - Google Patents

Description

  The present invention relates to an electrical component housing that can efficiently dissipate heat from an electrical element that generates heat when energized.

Electrical elements such as transistors, diodes, resistors, and capacitors generate heat when energized. In particular, a large current flows and the LED becomes high temperature as the brightness increases. If the LED remains at a high temperature, the life of the LED will be affected. Therefore, it is important to suppress the temperature rise by dissipating the heat from the electric element to the surrounding atmosphere or transferring the heat to other components.
For example, in Patent Document 1, an intermediate layer made of a copper foil pattern having a heat dissipation function is formed on a circuit board having a multilayer structure, and an upper surface electrode on which an LED chip is mounted and an intermediate layer are joined by a filled via, thereby producing an LED. A surface-mount type light emitting diode is disclosed in which heat generated in a chip is released to an intermediate layer.

JP 2008-288487 A

  However, the surface-mounted light-emitting diode described in Patent Document 1 has a complicated structure because the substrate needs to be multilayered because heat is transferred by an intermediate layer made of a copper foil pattern. In addition, a substrate can be used if the electrical component is a thin plate, but the technology of the substrate on which the intermediate layer is formed can be applied to the housing of the electrical component having a three-dimensional shape formed by a resin molded body. Can not.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electrical component housing that is simple in structure and can be easily formed into a desired shape while suppressing an increase in temperature from the electrical element.

The electrical component housing of the present invention is a housing in which an electric circuit portion in which a circuit pattern portion is formed on an insulating substrate and an electric element is mounted on the circuit pattern portion is mounted on the circuit mounting portion. A circuit-side terminal portion that is electrically connected to the circuit pattern portion is formed in the wiring portion embedded in the formed housing, and widened transmission that transfers heat from the electric element to the housing. A heat part is formed, and the heat transfer part is arranged in parallel with the electric circuit part mounted on the circuit mounting part .

According to the present invention, the electric circuit portion is formed with the circuit pattern portion on the insulating substrate, and the electric element is mounted on the circuit mounting portion of the housing, which is separate from the housing. However, when the circuit side terminal portion of the wiring portion comes into contact with the circuit pattern portion, heat from the electric element that generates heat due to energization is transferred to the wiring portion, but the wiring portion is embedded in the housing, Since the heat transfer section is provided, heat can be efficiently transferred from the heat transfer section to the housing even if the housing and the electric circuit section are separated. Accordingly, the heat from the heat transfer section is radiated from the housing to the surroundings, and thus the temperature rise of the electric element can be suppressed. Since the housing is formed of a resin molded body, it can be easily formed into a desired shape regardless of whether it is a flat plate shape or a three-dimensional shape. Moreover, since the wiring part is only embedded in the resin molded body, the structure is simple. Furthermore, since the heat transfer section is disposed in parallel with the electric circuit section mounted on the circuit mounting section, the heat transfer section can be disposed close to the electric circuit section, and the circuit pattern section can be interposed through the housing. The heat lost to the heat transfer section can be radiated from the housing after being transferred to the entire housing.

The circuit-side terminal portion is preferably a press-fit terminal that passes through a through-hole formed in the insulating substrate and is electrically connected to the circuit pattern portion.
Since the circuit side terminal part is a press-fit terminal, the electrical connection between the circuit side terminal part and the electric circuit part is completed simply by fitting the electric circuit part into the circuit mounting part. Easy to mount on the housing.

The circuit-side terminal portion may be a spring contact portion that contacts a side surface pattern portion that is conductively connected to the circuit pattern portion on the upper surface of the insulating substrate.
Since the circuit side terminal portion is in contact with the side surface pattern portion by the spring contact portion, the electrical connection between the circuit side terminal portion and the electric circuit portion is completed simply by fitting the electric circuit portion into the circuit mounting portion. It is easy to mount the electric circuit section on the housing.

  If the wiring portion is wired by bending one or more places, the wiring portion becomes longer than the shortest route, so that a wide heat transfer portion can be easily secured.

  When a plurality of the heat transfer portions are formed, a wider area can be ensured, so that the heat transfer effect can be further enhanced.

  If the heat transfer section is formed in the forward path section and the return path section where the wiring section is folded, the heat transfer section can be multilayered.

  If the housing is formed by insert molding in a state where the wiring portion is embedded, the wiring portion can be easily embedded at a desired position when the resin molded body is formed.

  The electric circuit portion is formed by a wiring pattern transfer method in which a metal thin film pattern conductively connected to the electric element is cut out from a metal thin film sheet and transferred to the housing to form a patterned metal thin film pattern. It is desirable to be a thing. If the wiring pattern transfer method is used, a pattern made of a metal thin film can be directly formed on a housing which is a resin molded body. Since the pattern can be used to dissipate heat to the surroundings, or heat can be transferred to the housing, the temperature rise of the electric element can be suppressed.

  In the present invention, the heat transfer part releases heat from the electric circuit part to the housing, and since the housing in which the heat transfer part is embedded is formed of a resin molded body, the temperature rise from the electric element is suppressed, The structure is simple and it can be easily formed into a desired shape.

It is a perspective view which shows the LED lamp which concerns on Embodiment 1 of this invention. It is a top view of the LED lamp shown in FIG. It is a circuit diagram of the electric circuit part of the LED lamp shown in FIG. It is the sectional view on the AA line of the LED lamp shown in FIG. It is a perspective view of the wiring part of the LED lamp shown in FIG. It is a perspective view of the LED lamp which shows the modification of the circuit side terminal part of a wiring part. It is sectional drawing of the LED lamp shown in FIG. It is sectional drawing which shows the LED lamp which concerns on Embodiment 2 of this invention. It is a perspective view of the wiring part of the LED lamp shown in FIG. It is a perspective view for demonstrating a state when embedding the wiring part shown in FIG. 8 in a housing main body by insert molding. (A) is a front view of the wiring part shown in FIG. 10, (B) is BB sectional drawing of (A). It is a perspective view which shows the housing by which insert molding was carried out. FIG. 13 is a perspective view of a state where a circuit pattern portion is formed on the housing shown in FIG. 12. It is sectional drawing which shows the LED lamp which concerns on Embodiment 3 of this invention. It is a perspective view which shows the LED lamp which concerns on Embodiment 4 of this invention. It is a perspective view of the wiring part of the LED lamp shown in FIG. It is a perspective view which shows the LED lamp which concerns on Embodiment 5 of this invention. It is a perspective view of the wiring part of the LED lamp shown in FIG.

(Embodiment 1)
The electrical component housing according to Embodiment 1 of the present invention will be described by taking an LED lamp as an example.
As shown in FIGS. 1 and 2, the LED lamp 10 can be used for a vehicle headlight, position light, turn signal, brake light, and the like. The LED lamp 10 includes an electric circuit unit 20 and a housing 30.

The electric circuit portion 20 includes a circuit pattern portion 21 formed of a metal thin film and an electric element 22 that is conductively connected to the circuit pattern portion 21.
The circuit pattern portion 21 is formed by a wiring pattern transfer method for forming a patterned metal thin film pattern by punching a metal thin film sheet and transferring it to a circuit forming surface of the housing 30 (forming surface of the electric circuit portion 20). Is formed.
In the first embodiment, the electric element 22 includes, as an example of an LED lamp, two surface-mounting LEDs 221, one chip resistor 222, and one diode 223 including a circuit pattern portion. 21.
With the circuit pattern portion 21 and the electric element 22, the electric circuit portion 20 is formed into a circuit as shown in FIG. In the circuit shown in FIG. 3, one LED 221, one chip resistor 222, and one diode 223 are connected in series.

As shown in FIG. 4, the housing 30 is formed of a resin molded body by insert molding. The housing 30 includes a housing body 31 and a wiring portion 32 that supplies power to the electric circuit portion 20. The housing main body 31 is formed by a base 311 that is fitted into a power supply unit (not shown) and a circuit mounting portion 312 that is provided at the distal end (the top of the base) of the base 311.
The base 311 is formed in a substantially rectangular tube shape. The circuit mounting portion 312 is formed in a disk shape having a larger diameter than the base portion 311.

  As shown in FIGS. 4 and 5, the wiring part 32 includes a circuit-side terminal part 321 connected to the circuit pattern part 21 of the electric circuit part 20, a heat transfer part 322 embedded in the housing body 31, and a heat transfer part. A relay part 323 that is bent from the part 322 and hangs down toward the bottom surface, and a power supply side terminal part 324 that protrudes from the circuit mounting part 312 into the hollow part of the base part 311 are provided. The wiring part 32 can be formed by pressing a metal plate.

  The circuit side terminal portion 321 is formed by bending the tip end portion of the wiring portion 32 protruding from the circuit forming surface of the circuit mounting portion 312 and bringing it into surface contact with the circuit pattern portion 21 (see FIG. 1). The circuit side terminal portion 321 is soldered to the circuit pattern portion 21. In FIG. 5, the circuit-side terminal portion 321 shows a state before bending.

The heat transfer part 322 is formed between the bending position of the circuit side terminal part 321 and the bending position of the relay part 323. The heat transfer part 322 is formed in a plate shape wider than the circuit side terminal part 321 and the relay part 323 connected to both ends. In the first embodiment, the heat transfer part 322 is formed in a substantially trapezoidal shape with the hypotenuse having an arc shape along the circumference of the circuit mounting part 312.
The power supply side terminal portion 324 is exposed from the circuit mounting portion 312, and a portion wider than the relay portion 323 is folded back and thickened to increase the strength.

The usage state of the LED lamp 10 according to Embodiment 1 of the present invention configured as described above will be described with reference to the drawings.
The LED lamp 10 is fitted into the power supply unit, and power is supplied from the power supply side terminal unit 324 of the wiring unit 32, whereby power is supplied from the circuit side terminal unit 321 of the wiring unit 32 to the electric circuit unit 20.
In the electric circuit unit 20, power is supplied to the LED 221 from the circuit pattern unit 21 connected to the circuit side terminal unit 321 through the chip resistor 222 and the diode 223, and the LED 221 emits light.

The LED 221 emits heat to generate heat, but dissipates heat from the circuit pattern portion 21 formed wide by the wiring pattern transfer method and transfers heat from the circuit pattern portion 21 to the housing 30, and from the housing 30 to the LED lamp 10. Dissipate heat. Further, the heat transferred to the circuit pattern portion 21 is transferred from the circuit side terminal portion 321 to the heat transfer portion 322.
Since the heat transfer part 322 is formed in a widened plate shape, a wide contact area with the housing body 31 can be secured. Therefore, the heat transferred to the heat transfer section 322 can be efficiently released to the housing body 31, and the heat transferred to the housing body 31 can be dissipated to the surroundings. Further, part of the heat transmitted to the heat transfer unit 322 can be released to the power supply unit through the relay unit 323 and the power supply side terminal unit 324.

  In addition, since the heat transfer section 322 is disposed in parallel with the circuit formation surface of the circuit mounting section 312, the heat released from the circuit pattern section 21 to the heat transfer section 322 via the housing body 31 is also in the housing. The heat can be radiated from the housing body 31 after the heat is transferred to the entire body 31.

  Thus, since the heat from the heat transfer part 322 is dissipated from the housing 30 to the surroundings, the temperature rise of the LED 221 that is an electric element can be suppressed. Since the housing 30 is formed of a resin molded body, the housing can be easily formed into a desired shape regardless of whether it is a flat plate shape or a three-dimensional shape. Further, since the housing 30 which is a resin molded body in which the wiring portion 32 is embedded is formed by insert molding, the structure can be simplified and the wiring portion 32 can be embedded at a desired position. .

  In the first embodiment, the wiring portion 32 is bent at a right angle between the circuit-side terminal portion 321 and the heat transfer portion 322, and the heat transfer portion 322 is arranged in parallel with the circuit formation surface of the circuit mounting portion 312. Since it is further bent between the heat transfer section 322 and the relay section 323, the wiring section 32 is routed more linearly from the bottom surface of the circuit mounting section 312 to the position where the circuit side terminal section 321 protrudes. Becomes longer. Therefore, since the heat transfer part 322 can be made large and a large area can be secured, heat can be transferred from the heat transfer part 322 to the housing body 31.

  Moreover, since the circuit pattern part 21 can be made into a wide solid pattern by forming the circuit pattern part 21 by the wiring pattern transfer method, the heat from the LED 221 can be radiated from the circuit pattern part 21.

  In the LED lamp according to the first embodiment, the circuit-side terminal portion 321 is formed by bending the tip portion of the wiring portion 32 and bringing it into surface contact with the circuit pattern portion 21, but FIG. 6 and FIG. As shown in FIG. 7, as the circuit-side terminal portion 321x, the distal end portion of the wiring portion 32 may be folded in half, and the base portion exposed from the housing body 31 may be soldered.

(Embodiment 2)
An electrical component housing according to Embodiment 2 of the present invention will be described with reference to the drawings. The LED lamp according to the second embodiment is characterized in that a plurality of heat transfer portions are provided. 8 to 13, the same components as those in FIGS. 1 to 7 are denoted by the same reference numerals, and description thereof is omitted.

  The wiring part 32a of the LED lamp 11 according to the second embodiment of the present invention shown in FIGS. 8 and 9 includes a heat transfer part 322 (first heat transfer part) between the circuit side terminal part 321 and the relay part 323. 322x to 3rd heat transfer part 322z) are formed.

  The first heat transfer unit 322x to the third heat transfer unit 322z are connected to each other by a turn-back unit 325. Specifically, the first heat transfer unit 322x is disposed from the bending position of the circuit-side terminal unit 321, the second heat transfer unit 322y is disposed by being folded back by the folding unit 325, and further the second heat transfer unit. The third heat transfer section 322z is disposed by being folded from the section 322y by the folding section 325. Accordingly, the first heat transfer section 322x serves as the forward path section of the wiring section 32a, and the second heat transfer section 322y connected to the folded section 325 serves as the return path section. Furthermore, since the third heat transfer section 322z is disposed by being folded back from the second heat transfer section 322y, the center position of the bottom surface of the circuit mounting section 312 is determined in the same manner as the LED lamp 10 according to the first embodiment. The power supply side terminal portion 324 can be protruded. The folding | returning part 325 is a connection member which connects between the heat-transfer parts 322 in three places.

A through-hole 326 through which the rod-shaped member is inserted vertically is formed in the first heat transfer section 322x to the third heat transfer section 322z that are arranged in parallel.
Here, a method of forming the housing body 31 by insert molding in a state where the wiring portion 32a is arranged will be described based on the drawings.
As shown in FIGS. 10 and 11, when insert molding is performed, the rod-like fixing members PU1 to PU6 are on one side of any one of the first heat transfer portions 322x to the third heat transfer portions 322z (in FIG. 10). The upper surface) is pressed, and the fixing members PD1 to PD6 press the other surface side (the lower surface in FIG. 10) of any of the first heat transfer part 322x to the third heat transfer part 322z and sandwich them. .

For example, the fixing member PU1 presses the first heat transfer portion 322x, and the fixing member PD1 facing the fixing member PU1 is formed between the through-hole 326 of the third heat transfer portion 322z and the second heat transfer portion 322y. The first heat transfer portion 322x is inserted between the fixing member PU1 and the fixing member PD1 by inserting the through hole 326 and pressing the position serving as the back surface of the first heat transfer portion 322x pressed by the fixing member PU1. It is sandwiched.
Further, the fixing member PU2 is inserted through the through-hole 326 of the first heat transfer section 322x, presses the second heat transfer section 322y, and the fixing member PD2 facing the fixing member PU2 is the third heat transfer section 322z. The position which becomes the back surface of the 2nd heat-transfer part 322y which penetrates the through-hole 326 and the member PU2 for fixing presses is pressed.
Similarly, each of the fixing member PU3 and the fixing member PD3, and the fixing member PU4 and the fixing member PD4 sandwich the third heat transfer portion 322z, and the fixing member PU5 and the fixing member PD5 sandwich the first heat transfer portion 322x, The fixed member PU6 and the fixed member PD6 sandwich the second heat transfer unit 322y.

  Even if the molten resin flows into the mold by sandwiching the first heat transfer part 322x to the third heat transfer part 322z by the fixing members PU1 to PU6 and the fixing members PD1 to PD6, the first heat transfer part 322x is inserted into the mold. The distance between the heat transfer portions 322x to the third heat transfer portions 322z can be maintained.

  As shown in FIG. 12, when the housing main body 31 in which the heat transfer section 322 is embedded is formed by insert molding, a blind hole 313 is formed in the housing main body 31 by the fixing members PU1 to PU6 and the fixing members PD1 to PD6. However, as shown in FIG. 13, the blind hole 313 (see FIG. 12) is blocked by forming the circuit pattern portion 21 on the circuit formation surface of the circuit mounting portion 312 of the housing body 31 by the wiring pattern transfer method. Therefore, it can be made invisible from the appearance.

  Thus, in LED lamp 11 concerning this Embodiment 2, since a still larger area can be ensured by providing multiple heat-transfer parts 322 in housing 30a, a heat-transfer effect can further be heightened. Moreover, since the 1st heat-transfer part 322x-the 3rd heat-transfer part 322z are arrange | positioned in parallel for every predetermined space | interval, since the heat-transfer part 322 can be multilayered, in the narrow housing main body 31 A large number of heat transfer sections 322 can be arranged.

  In the LED lamp according to the second embodiment, the first heat transfer portion 322x to the third heat transfer portion 322z are formed in the same contour shape, but may have different shapes according to the shape of the housing. .

(Embodiment 3)
A housing for electric parts according to Embodiment 3 of the present invention will be described with reference to the drawings. The LED lamp according to Embodiment 3 is characterized in that a part of the heat transfer section is exposed. In FIG. 14, the same components as those in FIG.
The circuit mounting part 312b of the LED lamp 12 shown in FIG. 14 is formed thinner than the circuit mounting part 312 shown in FIG. 8, so that a part of the heat transfer part 322 is a housing body 31b of the housing 30b. Is exposed from.
In the third embodiment, each half of the second heat transfer section 322y and the third heat transfer section 322z, and the folded section 325 connecting the second heat transfer section 322y and the third heat transfer section 322z are provided. , Exposed.

  As described above, since a part of the heat transfer part 322 is exposed, in addition to the heat transfer to the housing 30, a heat dissipation effect to the surroundings can be obtained, so that the temperature increase of the LED 221 can be further suppressed. .

In the third embodiment, a part of the second heat transfer unit 322y and the third heat transfer unit 322z, and a folded portion 325 that connects the second heat transfer unit 322y and the third heat transfer unit 322z. Is exposed from the housing body 31b, but exposes all of the second heat transfer section 322y and the third heat transfer section 322z, or exposes only a part or all of the third heat transfer section 322z. You may let them.
Further, in order to expose the wiring portion from the circuit mounting portion 312 shown in FIG. 8, the heat transfer portion 322 in the circuit mounting portion 312 is bent and protruded downward from the outer peripheral position of the circuit mounting portion 312. Various modifications of the part are possible. Further, a part or all of one heat transfer part 322 of the wiring part 32 according to the first embodiment may be exposed from the housing body 31.

(Embodiment 4)
A housing for electric parts according to Embodiment 4 of the present invention will be described with reference to the drawings. The LED lamp according to the fourth embodiment is characterized in that the electric circuit portion is a circuit board. 15 and FIG. 16, the same components as those in FIG. 1 and FIG.

In the housing 30c of the LED lamp 13 according to Embodiment 4 of the present invention shown in FIGS. 15 and 16, a recess for mounting the board-shaped electric circuit portion 20c is formed in the circuit mounting portion 312c of the housing body 31c. ing. A claw portion 314 for locking the electric circuit portion 20c is formed on the circuit mounting portion 312c.
In the electric circuit portion 20 c, a circuit pattern portion 21 is formed on a substantially circular insulating substrate 23, and an electric element 22 is mounted on the circuit pattern 21.
In order to conduct to the circuit pattern portion 21 of the electric circuit portion 20c, the circuit side terminal portion 321y of the wiring portion 32c is formed as a press-fit terminal, and passes through the through-hole formed in the insulating substrate 23, so that the circuit pattern The part 21 is electrically connected. A metal thin film as the electric circuit portion 20c is formed on the inner peripheral surface of the through hole formed in the insulating substrate 23.

As described above, even if the housing 30c and the electric circuit portion 20c are separated from each other, the circuit side terminal portion 321y of the wiring portion 32c is used as a press-fit terminal to contact the circuit pattern portion 21, so that the same as in the first to third embodiments. An effect can be obtained.
Moreover, since the circuit side terminal portion 321y is a press-fit terminal, the electrical connection between the circuit side terminal portion 321y and the electric circuit portion 20c is completed simply by fitting the electric circuit portion 20c into the circuit mounting portion 312c. It is easy to mount the electric circuit portion 20c as a substrate on the housing 30c.

(Embodiment 5)
A housing for electric parts according to Embodiment 5 of the present invention will be described with reference to the drawings. The LED lamp according to the fifth embodiment is characterized in that the contact between the wiring portion and the electric circuit portion as the circuit board is a leaf spring contact. In FIGS. 17 and 18, the same components as those in FIGS. 1, 5, 16, and 18 are given the same reference numerals and description thereof is omitted.

In the housing 30d of the LED lamp 14 according to Embodiment 5 of the present invention shown in FIGS. 17 and 18, a recess for mounting the board-shaped electric circuit portion 20d is formed in the circuit mounting portion 312d of the housing body 31d. ing. Further, a claw portion 314 for locking the electric circuit portion 20d to the circuit mounting portion 312d is formed.
In the electric circuit portion 20d, a side surface pattern portion 21a that is in contact with the circuit side terminal portion 321z of the wiring portion 32d is formed in the cutout portion of the insulating substrate 23. The side pattern portion 21 a is conductively connected to the circuit pattern portion 21 formed on the upper surface of the insulating substrate 23.
The circuit-side terminal portion 321z is formed of two opposing side wall portions 3211 that are erected from the heat transfer portion 322, and a spring contact portion 3212 that is bent from the tip portion.

As described above, even if the housing 30d and the electric circuit portion 20d are separated, the circuit side terminal portion 321z of the wiring portion 32d is used as a leaf spring terminal to contact the circuit pattern portion 21 via the side pattern portion 21a. The same effects as those of Embodiments 1 to 3 can be obtained.
Further, since the circuit side terminal portion 321z is brought into contact with the side surface pattern portion 21a by the spring contact portion 3212, the circuit side terminal portion 321z and the electric circuit portion 20d can be simply fitted into the circuit mounting portion 312d. Since the conduction is completed, it is easy to mount the electric circuit portion 20d as a circuit board on the housing 30d.

In the first to fifth embodiments, the LED is described as an example of the electric element. However, the electric element may be a transistor, a diode, a resistor, a capacitor, a coil, or the like that generates heat when energized.
Moreover, in this Embodiment 1-5, the heat-transfer part 322 was formed between the two bending positions. For example, in FIG. 8 and FIG. 9, the heat transfer part 322 is connected with the folded part 325 interposed. However, the heat transfer section itself may be folded back or bent so that the heat transfer section also serves as the relay section 323 (see FIG. 4) or the heat transfer section 322 for two sheets may be wide. .
In the fourth and fifth embodiments, the wiring sections 32c and 32d are one heat transfer section. However, even if the plurality of heat transfer sections are the same as the wiring sections 32a in the second and third embodiments. Good.

  The present invention can suppress an increase in the temperature of an electric element that generates heat when energized. Therefore, the present invention is suitable for a housing of an electric circuit unit on which an electric element that becomes high temperature is mounted. Ideal for housing.

10, 11, 12, 13, 14 LED lamp 20, 20c Electric circuit part 21 Circuit pattern part 21a Side surface pattern part 22 Electric element 221 LED
222 Chip resistor 223 Diode 23 Insulating substrate 30, 30a, 30b, 30c Housing 31, 31b, 31c Housing body 311 Base part 312, 312b, 312c Circuit mounting part 313 Blind hole 314 Claw part 32, 32a, 32c, 32d Wiring part 321 , 321x, 321y, 321z Circuit side terminal part 3211 Side wall part 3212 Spring contact part 322 Heat transfer part 322x First heat transfer part 322y Second heat transfer part 322z Third heat transfer part 323 Relay part 324 Power supply side terminal part 325 Folding part 326 Through hole PU1 to PU6, PD1 to PD6 Fixing member

Claims (8)

A circuit pattern portion is formed on an insulating substrate, and an electric circuit portion having an electric element mounted on the circuit pattern portion is mounted on the circuit mounting portion, and is embedded in the housing formed of a resin molded body. In the wiring portion, a circuit side terminal portion that is conductively connected to the circuit pattern portion is formed, and a widened heat transfer portion that transfers heat from the electric element to the housing is formed,
The electrical component housing, wherein the heat transfer section is disposed in parallel with the electrical circuit section mounted on the circuit mounting section.   The electrical component housing according to claim 1, wherein the circuit-side terminal portion is a press-fit terminal that passes through a through-hole formed in the insulating substrate and is electrically connected to the circuit pattern portion.   The electrical component housing according to claim 1, wherein the circuit-side terminal portion is a spring contact portion that contacts a side surface pattern portion that is conductively connected to the circuit pattern portion on the upper surface of the insulating substrate.   The electrical component housing according to claim 1, wherein the wiring portion is bent at one or more places.   The electrical component housing according to claim 1, wherein a plurality of the heat transfer portions are formed.   6. The electrical component housing according to claim 5, wherein the heat transfer section is formed in an outward path section and a return path section where the wiring section is folded. The housing for an electric part housing according to claim 1, wherein has been made form a state embedded the wiring portion. The electrical component housing according to claim 1, wherein the electrical circuit portion is formed with a metal thin film that is electrically connected to the electrical element.

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