JP5838700B2 - Semiconductor module arrangement structure - Google Patents

Description

The present invention relates to a mounting structure of a semiconductor module configured pull out the plurality of main electrode terminals from the semiconductor body portion.

A semiconductor module is used as a power conversion device such as an inverter mounted on an electric vehicle, a hybrid vehicle, etc., and a semiconductor element such as a transistor is disposed in a resin and molded, and a terminal for conduction is externally provided from the semiconductor element. It is formed by pulling out.
For example, in the terminal connection structure of patent document 1, the structure which connects the main electrode terminal in an electronic component and the external connection member connected to an electric circuit is disclosed. In this terminal connection structure, a through-hole through which a fastener can be inserted is formed in the main electrode terminal and the external connection member. And while a main electrode terminal and an external connection member are fastened with a fastener, these are welded.

JP-A-2005-45185

  However, as shown in the terminal connection structure of Patent Document 1, when a plurality of electronic components (semiconductor modules) are arranged in a cooler or the like, the plate surfaces (cooling surfaces) of the plurality of electronic components face each other. Arranged in the direction. At this time, the positions of the main electrode terminals that are fastened to the external connection member (bus bar) by the fasteners overlap each other, and it is difficult to insert the fasteners into the through holes formed in the main electrode terminals and the external connection members. become.

The present invention has been made in view of such background, it is obtained in an attempt to provide a mounting structure of a semiconductor module capable of improving the ease of connection between the bus bar and the main electrode terminal.

The reference aspect of the present invention has a flat plate shape, and a semiconductor main body functioning as a cooling surface in which the plate surfaces on both sides are cooled by a cooler,
A plurality of main electrode terminals connected to a bus bar drawn out from one side surface of the semiconductor body and connected to a power source;
The plurality of main electrode terminals are arranged side by side in the long side direction of the one side surface, and a connection surface facing the bus bar is formed perpendicular to the plate surface of the semiconductor body portion. The semiconductor module is characterized by the above .

One aspect of the present invention is a semiconductor body portion having a flat plate shape and functioning as a cooling surface whose both plate surfaces are cooled by a cooler, and a bus bar drawn from one side surface of the semiconductor body portion and electrically connected to a power source A semiconductor module comprising a plurality of main electrode terminals connected to each other in a direction sandwiched by the cooler in the direction of the plate surface,
The plurality of main electrode terminals are arranged side by side in the long side direction of the one side surface, and are composed of an upright portion rising from the one side surface, and a terminal tip portion bent with respect to the upright portion,
The terminal tip is formed with a connection surface that is formed perpendicular to the plate surface of the semiconductor body and faces the bus bar, and a connection hole for connecting the bus bar,
The plurality of semiconductor modules have a horizontal direction in which the left and right side surfaces orthogonal to the one side face each other, with the main electrode terminals drawn out in the same direction with the plate surface in the semiconductor body portion directed in the same direction, and the plate surface It is arranged side by side in the vertical direction where they face each other,
The plurality of semiconductor modules arranged in the vertical direction and the cooler are alternately stacked in a plurality of stages,
The entire connection surface of the main electrode terminals in the plurality of semiconductor modules is directed in the same direction,
All of the terminal tip portions in the plurality of semiconductor modules are bent in the same direction with respect to the standing portion,
Whole of the connecting surface of the main electrode terminals of the plurality pieces of semiconductor modules are arranged in a zigzag pattern,
A terminal block extending in the lateral direction, in which screw holes are formed, is arranged on the surface of the semiconductor body portion side of the terminal tip in the plurality of semiconductor modules arranged in the lateral direction,
The terminal tip portion and the bus bar are formed by screwing screws inserted into the connection holes formed in the terminal tip portion and the connection holes formed in the bus bar into the screw holes in the terminal block. The semiconductor module is arranged on the terminal block . (Structure 1)

In the semiconductor module, the connection surface of the main electrode terminal drawn from the semiconductor body is formed perpendicular to the plate surface of the semiconductor body.
Thereby, in the cooler, when the plurality of semiconductor modules are arranged and used so that the plate surfaces face each other, it is possible to prevent the connection surfaces of the plurality of main electrode terminals from facing each other. it can. Thereby, when connecting the connection surfaces of the plurality of main electrode terminals to the bus bar, a working space can be easily secured at a position facing the connection surfaces.
Therefore, according to the semiconductor module, the ease of connection between the bus bar and the main electrode terminal can be improved.

Moreover, in the arrangement structure of the semiconductor module, when arranging a plurality of semiconductor modules side by side in the horizontal and vertical directions in the cooler, it is easy to be placed at a position facing the connection surface of the main electrode terminal of each semiconductor module. It is possible to secure a working space.
Thereby, the arrangement | positioning structure of the semiconductor module excellent in the connection workability | operativity of a bus bar can be formed.

The perspective view which shows the semiconductor module concerning an Example. The top view which shows the power converter device formed by arrange | positioning the semiconductor module concerning an Example to a cooler. The perspective view which shows the other semiconductor module concerning an Example. The perspective view which shows the other semiconductor module concerning an Example. The top view which shows the power converter device formed by arrange | positioning the other semiconductor module concerning a Example to a cooler. The perspective view which shows the other semiconductor module concerning an Example. The perspective view which shows the other semiconductor module concerning an Example. Explanatory drawing which shows the state which connects the two semiconductor modules concerning an Example by a terminal block. The top view which shows the state which connects the two semiconductor modules concerning an Example by the terminal block which integrated the bus-bar part.

A preferred embodiment of the semiconductor module described above will be described.
In the above semiconductor module, the plurality of main electrode terminal includes a standing portion rising from the one side face, folded against the standing upright portion, that consisted terminal tip the connection surface is formed.
Thereby , the connection surface perpendicular | vertical with respect to the board surface in a semiconductor main-body part can be formed with the main electrode terminal of a simple shape.
Further, the standing portion can be vertically raised from one side surface, and the terminal tip portion can be formed by being bent at a right angle with respect to the standing portion.

In addition, a connection hole for connecting the bus bar is formed at the terminal tip .
Thereby , the terminal tip part of the main electrode terminal can be stably connected to the bus bar by the connection hole.

Further, the connection hole in the terminal tip portion may be a through hole or a notch through which a screw is inserted (Claim 2).
In this case, the terminal tip of the main electrode terminal can be stably connected to the bus bar by the screw inserted into the through hole or notch.

In addition, the semiconductor module includes a plurality of control terminals that are pulled out from the one side surface or the other side surface that is located on the opposite side of the one side surface and that are conducted to a control circuit, and the plurality of control terminals are connected to the one side surface. You may arrange | position along with the long side direction of a side surface or the said other side surface (Claim 3 ).
In this case, the semiconductor module can be used with the plurality of main electrode terminals connected to the power source and the plurality of control terminals connected to the control circuit.

In mounting structure of the semiconductor module, the whole of the connecting surface of the main electrode terminals of the plurality of semiconductor modules, that are arranged in a staggered manner.
Thereby , the arrangement | positioning space | interval of the connection surfaces in the main electrode terminal of each semiconductor module can be ensured appropriately, and the workability | operativity of the bus bar to a connection surface can further be improved.

Hereinafter, embodiments of a semiconductor module and an arrangement structure thereof will be described with reference to the drawings.
(Example 1)
FIG. 1 shows a semiconductor module 1 of this example. As shown in the figure, the semiconductor module 1 of the present example has a flat plate shape, a semiconductor body portion 2 that functions as a cooling surface in which the plate surfaces 21 on both sides are cooled by the cooler 5, and one side surface of the semiconductor body portion 2. And a plurality of main electrode terminals 3 to which bus bars (a plate-like conductor using a copper material or the like) 4 drawn from 22A and conducted to a power source are connected.
The plurality of main electrode terminals 3 are arranged side by side in the long side direction of the one side surface 22 </ b> A, and the connection surface 321 facing the bus bar 4 is formed perpendicular to the plate surface 21 in the semiconductor body 2. ing.

Hereinafter, the semiconductor module 1 and the arrangement structure thereof will be described in detail with reference to FIGS.
FIG. 2 shows a power converter 10 formed by disposing the semiconductor module 1 of this example in the cooler 5. As shown in the figure, the semiconductor module 1 of this example is sandwiched by the cooler 5 in the direction of the plate surface 21 to constitute a power conversion device 10 as an arrangement structure of the semiconductor module 1. The semiconductor module 1 is formed by covering a power element (semiconductor element) such as an IGBT (insulated gate bipolar transistor) with an insulating resin.
As shown in FIG. 1, the semiconductor body 2 of the semiconductor module 1 has a flat plate shape and a substantially rectangular parallelepiped shape. The long side direction of the one side surface 22A and the other side surface 22B refers to a side located around the substantially square plate surface 21 having the largest area.
The main electrode terminal 3 is drawn out from the power element and drawn out of the insulating resin. In addition, on the other side surface 22B opposite to the one side surface 22A of the semiconductor module 1, a plurality of control terminals 35 are arranged at positions aligned in the long side direction of the other side surface 22B. Each control terminal 35 is directly connected to a control circuit (control board).

As shown in FIG. 1, in the semiconductor module 1, the plurality of main electrode terminals 3 have a band plate shape, and a standing part 31 that stands vertically from one side surface 22 </ b> A, and a right angle with respect to the standing part 31. It is comprised from the terminal front-end | tip part 32 by which the connection surface 321 was formed by bending. The connection surface 321 in this example is the outer surface of the terminal tip 32 (the surface on the side away from the semiconductor body 2). The connection surface 321 can also be the inner surface of the terminal tip portion 32.
Two main electrode terminals 3 are drawn out from the semiconductor body 2, and the terminal end portions 32 of the main electrode terminals 3 are bent in the same direction. The main electrode terminal 3 is drawn out from the part corresponding to the collector part and the emitter part (in the case of FET, the drain part and the source part) of the power element.

A connection hole 322 for connecting the bus bar 4 is formed in the terminal tip portion 32. The connection hole 322 can be formed as a through hole 322 through which a screw (screw) 42 is inserted. A screw 42 is inserted into a connection hole 322 formed in the terminal tip portion 32 and a connection hole 41 formed in the bus bar 4, and the screw 42 is tightened using a nut 43, whereby the terminal tip of the main electrode terminal 3 is tightened. The portion 32 can be stably connected to the bus bar 4.
The nut 43 can be disposed on the lower surface of the terminal tip portion 32 (surface opposite to the connection surface 321) using a jig or the like. Further, the nut 43 can be welded to the lower surface of the terminal tip portion 32.
Further, the connection hole 322 in the terminal tip portion 32 is not a through-hole, but is directed toward one direction of the terminal tip portion 32 (in this example, the bent tip side of the terminal tip portion 32) as shown in FIG. A notch 322A in which a part of the terminal tip portion 32 is notched can also be used.

  The main electrode terminal 3 can also be formed in a block shape as shown in FIG. In this case, the front end surface of the block-shaped main electrode terminal 3 is used as a connection surface 321, and a screw hole 322 </ b> B into which a screw 42 used to fasten the bus bar 4 (see FIG. 1) is screwed to the connection surface 321. Can be formed. Then, the bus bar 4 and the connection surface 321 of the main electrode terminal 3 face each other, the screw 42 is inserted into the connection hole 41 formed in the bus bar 4, and the screw 42 can be screwed into the screw hole 322B (see FIG. 1).

As shown in FIG. 2, the cooler 5 includes a plurality of sandwiching plate portions 51 that sandwich the semiconductor module 1, and pipes that guide cooling water W to the sandwiching plate portions 51, located at both ends of each sandwiching plate portion 51. Part 52. Each clamping plate portion 51 is formed by forming a cooling passage 511 through which the cooling water W passes.
The plurality of semiconductor modules 1 constituting the power conversion device 10 have the left and right side surfaces 23 orthogonal to the one side surface 22A by directing the plate surface 21 of the semiconductor body 2 in the same direction and pulling out the main electrode terminal 3 in the same direction. It arrange | positions along with the horizontal direction B which faces each other, and the vertical direction H where the plate surfaces 21 face each other.
The plurality of semiconductor modules 1 are sandwiched between the sandwiching plate portions 51 of the cooler 5 in a state where two semiconductor modules 1 are arranged in the lateral direction B. The power conversion device 10 is formed by stacking the sandwiching plate portion 51 and the two semiconductor modules 1 in a plurality of stages.

  In the power conversion device 10, the entire connection surfaces 321 of the main electrode terminals 3 in the plurality of semiconductor modules 1 are directed in the depth direction which is a direction orthogonal to the vertical direction H and the horizontal direction B of the arrangement of the semiconductor modules 1. Yes. Then, the bus bar 4 can be opposed to each connection surface 321 from the outside in the depth direction. From the outside in the depth direction, the connection holes 41 and 322 formed in the bus bar 4 and the terminal tip portion 32 can be connected. The screw 42 can be inserted and the screw 42 can be fastened to the nut 43.

  As shown in FIG. 2, in the power conversion device 10, the plurality of semiconductor modules 1 arranged in the vertical direction H include the position in the horizontal direction B of the main electrode terminal 3 in one semiconductor module 1A and the main module in the other semiconductor module 1B. The positions of the electrode terminals 3 in the lateral direction B are shifted from each other. In the plurality of semiconductor modules 1 arranged in the vertical direction H, the positions in the horizontal direction B of one semiconductor module 1A and the other semiconductor module 1B are shifted from each other. In the power conversion device 10, the connection surfaces 321 of the terminal tip portions 32 of the main electrode terminals 3 of each semiconductor module 1 are arranged in a staggered manner in the whole of the plurality of semiconductor modules 1 arranged in the vertical direction H. .

In this example, as shown in the figure, there is only one type of semiconductor module 1 having a configuration in which the main electrode terminal 3 is drawn from the semiconductor body 2. Then, with respect to the two semiconductor modules 1 arranged in the horizontal direction B in the first layer X1, the positions of the two semiconductor modules 1 arranged in the horizontal direction B in the second layer X2 are a predetermined distance in the horizontal direction B. It's off. In the third layer X3, the two semiconductor modules 1 arranged in the lateral direction B are in the same position in the lateral direction B as the positions in the lateral direction B of the two semiconductor modules 1 arranged in the lateral direction B in the first layer X1. is there. In the fourth layer X4, the two semiconductor modules 1 arranged in the horizontal direction B are arranged in the same horizontal direction B as the positions of the two semiconductor modules 1 arranged in the horizontal direction B in the second layer X2. In position.
Thereafter, the positions in the horizontal direction B of the connection surfaces 321 of the main electrode terminals 3 in the two semiconductor modules 1 arranged in the horizontal direction B are alternately displaced for each layer to be stacked, so that the plurality of semiconductor modules 1 are cooled. 5 is sandwiched.

As shown in FIG. 5, the plurality of semiconductor modules 1 includes a first semiconductor module 1 </ b> C in which a plurality of main electrode terminals 3 are shifted to one side in the horizontal direction B, and a plurality of main electrode terminals 3 in the other side in the horizontal direction B. Two types of the second semiconductor module 1D that are shifted to each other can be prepared. In this case, the first semiconductor module 1C is used for the semiconductor modules 1 arranged in the lateral direction B in the first layer X1, and the two semiconductor modules 1 arranged in the lateral direction B in the second layer X2. For this, the second semiconductor module 1D is used. Thereby, the position of the semiconductor module 1 in each layer in the horizontal direction B remains the same, and the position of the first layer X1 in the horizontal direction B where the connection surface 321 of each main electrode terminal 3 is disposed, In the second layer X2, the position in the lateral direction B where the connection surface 321 of each main electrode terminal 3 is arranged can be shifted from each other.
Then, according to the number of layers to be stacked, the first semiconductor module 1C and the second semiconductor module 1D can be alternately arranged in each layer.

In the semiconductor module 1 of this example, the connection surface 321 in the main electrode terminal 3 drawn out from the semiconductor body 2 is formed perpendicular to the plate surface 21 in the semiconductor body 2. The whole connection surface 321 of the main electrode terminal 3 in the plurality of semiconductor modules 1 is directed in the depth direction of the semiconductor module 1.
Thereby, in the cooler 5, when the plurality of semiconductor modules 1 are arranged and used so that the plate surfaces 21 face each other, the connection surfaces 321 of the plurality of main electrode terminals 3 face each other. Can be prevented. Therefore, when connecting the connection surfaces 321 of the plurality of main electrode terminals 3 and the bus bar 4, a working space can be easily secured above the entire connection surface 321 (outward in the depth direction). .
Therefore, according to the semiconductor module 1 and the arrangement structure thereof in this example, the ease of connection between the bus bar 4 and the main electrode terminal 3 can be improved.

As shown in FIG. 6, in the semiconductor module 1, the control terminal 35 can be arranged side by side in the lateral direction B of the main electrode terminal 3 on one side surface 22 </ b> A from which the main electrode terminal 3 is drawn.
As shown in FIG. 7, the semiconductor module 1 can also be formed by integrating two power elements. In this case, the main electrode terminal 3 is drawn out from the collector part of one power element and the emitter part of one power element and the collector part of the other power element are integrated inside. And those extracted from the emitter of the other power element are arranged side by side in the lateral direction B.

(Example 2)
This example is an example showing a case where the method of connecting the main electrode terminal 3 of the semiconductor module 1 and the bus bar 4 is different from the first embodiment.
As shown in FIG. 8, when connecting the terminal tip portion 32 of each main electrode terminal 3 and the bus bar 4, the terminal block 45 in which the screw hole 451 is formed is connected to the lower surface of the terminal tip portion 32 (on the semiconductor body portion 2. Side). Then, the terminal tip portion 32 and the bus bar 4 are arranged so as to overlap the terminal block 45, and a screw 42 is inserted into the connection hole 41 formed in the terminal tip portion 32 and the bus bar 4, and this screw 42 is inserted into the terminal block 45. It can be screwed into the 45 screw holes 451. An insert nut in which a screw hole 451 is formed can be embedded in the terminal block 45.
In this case, by using the terminal block 45 instead of the nut 43, the terminal tip 32 of each main electrode terminal 3 and the bus bar 4 can be easily connected.

  As shown in FIG. 9, instead of using the terminal block 45, a terminal block 46 in which the bus bar portion 462 is integrated can be used. In this case, a conductive bus bar portion 462 made of a copper material or the like can be formed on the insulating terminal block main body portion 461 according to the necessity of conduction. Further, in the terminal block main body 461, a screw hole 463 for screwing the screw 42 (see FIG. 8 and the like) can be formed in accordance with the position where the terminal tip 32 of the main electrode terminal 3 is attached. Then, the terminal block 46 is disposed on the lower surface of the terminal tip portion 32 (side closer to the semiconductor body 2), and the screw 42 inserted through the connection hole 322 of the terminal tip portion 32 is screwed into the screw hole 463 of the terminal block 46. Can be combined.

  In this case, by the bus bar portion 462 of the terminal block 46, the terminal tip portion 32 of the main electrode terminal 3 of one semiconductor module 1E in the adjacent semiconductor modules 1E and 1F and the main electrode terminal 3 of the other semiconductor module 1F are connected. The terminal tip portion 32 can be conducted. Also in this example, other configurations are the same as those of the first embodiment, and the same effects as those of the first embodiment can be obtained.

DESCRIPTION OF SYMBOLS 1 Semiconductor module 10 Power converter 2 Semiconductor main-body part 21 Plate surface 22A One side surface 22B Other side surface 3 Main electrode terminal 31 Standing part 32 Terminal front-end | tip part 321 Connection surface 322 Connection hole 4 Bus bar 42 Screw 5 Cooler

Claims (3)

A semiconductor main body having a flat plate shape and functioning as a cooling surface whose both plate surfaces are cooled by a cooler, and a plurality of main bodies connected to a bus bar drawn from one side surface of the semiconductor main body and conducted to a power source A semiconductor module provided with an electrode terminal is sandwiched in the direction of the plate surface by the cooler,
The plurality of main electrode terminals are arranged side by side in the long side direction of the one side surface, and are composed of an upright portion rising from the one side surface, and a terminal tip portion bent with respect to the upright portion,
The terminal tip is formed with a connection surface that is formed perpendicular to the plate surface of the semiconductor body and faces the bus bar, and a connection hole for connecting the bus bar,
The plurality of semiconductor modules have a horizontal direction in which the left and right side surfaces orthogonal to the one side face each other, with the main electrode terminals drawn out in the same direction with the plate surface in the semiconductor body portion directed in the same direction, and the plate surface It is arranged side by side in the vertical direction where they face each other,
The plurality of semiconductor modules arranged in the vertical direction and the cooler are alternately stacked in a plurality of stages,
The entire connection surface of the main electrode terminals in the plurality of semiconductor modules is directed in the same direction,
All of the terminal tip portions in the plurality of semiconductor modules are bent in the same direction with respect to the standing portion,
Whole of the connecting surface of the main electrode terminals of the plurality pieces of semiconductor modules are arranged in a zigzag pattern,
A terminal block extending in the lateral direction, in which screw holes are formed, is arranged on the surface of the semiconductor body portion side of the terminal tip in the plurality of semiconductor modules arranged in the lateral direction,
The terminal tip portion and the bus bar are formed by screwing screws inserted into the connection holes formed in the terminal tip portion and the connection holes formed in the bus bar into the screw holes in the terminal block. The semiconductor module arrangement structure is fixed to the terminal block . 2. The semiconductor module arrangement structure according to claim 1, wherein the connection hole in the terminal tip is a through hole or a notch through which a screw is inserted. The arrangement structure of the semiconductor module according to claim 1 or 2, comprising a plurality of control terminals drawn out from the one side surface or the other side surface located on the opposite side of the one side surface and conducted to a control circuit,
The semiconductor module arrangement structure, wherein the plurality of control terminals are arranged side by side in the long side direction of the one side surface or the other side surface.

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