JP5817176B2 - Wiring board, liquid jet head, and method of manufacturing liquid jet head - Google Patents

Description

The present invention relates to a wiring board, a liquid jet head, and a method for manufacturing the liquid jet head .

  For example, a liquid ejecting head may be used as the wiring board having the wiring portion patterned on the substrate. In the following Patent Document 1, as a liquid ejecting head, a flow path forming substrate in which a pressure generation chamber communicating with a nozzle is formed, a piezoelectric element formed on one surface side of the flow path forming substrate, and a flow path forming A substrate having a protective substrate (wiring substrate) which is bonded to the piezoelectric element side of the substrate and on which a driving IC or the like is mounted via a wiring portion patterned on the substrate is disclosed.

The wiring portion is patterned by sputtering, by sequentially forming an adhesion layer and a metal layer on the entire surface of the substrate, and then forming a resist on the metal layer and performing wet etching using the resist as a mask. . The adhesion layer is for ensuring adhesion between a substrate made of silicon dioxide (SiO ₂ ) and a metal layer made of gold (Au). For example, nickel chrome (NiCr) which is a base metal is used as a material, and 50 to It is formed with a thickness of about 100 nanometers (nm). The metal layer is formed with a thickness of about 1000 nm on this adhesion layer.

JP 2007-251063 A

By the way, since the sputtering method is performed in a high temperature atmosphere of several hundred degrees Celsius, the substrate is likely to warp due to the film stress due to the thermal contraction of the metal layer having the above thickness after returning to room temperature after film formation. In addition, since the metal layer functions as a connection wiring with a driving IC or the like, it is desirable that the specific resistance is small.
Therefore, the inventor of the present application has considered adopting a plating method that can be performed in a low-temperature atmosphere of several tens of degrees Celsius and can have a specific resistance smaller than that of the sputtered layer.

  However, the plated layer formed by the plating method has a rougher surface than the sputtered layer formed by the sputtering method, and the capillary force tends to work. For this reason, when the plating layer is formed so as to protrude from the width (outer edge portion) of the adhesion layer, for example, an adhesive that adheres the predetermined member to the substrate flows out along a minute gap between the substrate and the plating layer, From this gap, it is possible to cause a situation where the surface of the plating layer is climbed by the capillary force, resulting in poor electrical connection with the driving IC or the like. Further, in such a case, the metal layer is likely to be peeled off starting from the protruding portion floating from the adhesion layer.

The present invention has been made in view of the above-described problems, and provides a wiring board, a liquid ejecting head, and a method for manufacturing the liquid ejecting head that can suppress poor electrical connection and peeling of the wiring portion that may occur when the plating method is employed. The purpose is to do.

In order to solve the above-described problems, the present invention provides a wiring board in which a wiring portion is patterned on a substrate, wherein the wiring portion is formed in contact with the adhesion layer formed on the substrate and the adhesion layer. And a plating layer formed in contact with the metal layer, and in the cross section of the wiring portion including the outer edge portion of the adhesion layer, the outer edge portion of the adhesion layer is The metal layer is formed larger than the outer edge of the plating layer, and the plating layer is provided so as to extend from the adhesion layer .
Further, in the present invention, a flow path forming substrate provided with a pressure generating chamber communicating with a nozzle for ejecting liquid, and provided on the flow path forming substrate facing the pressure generating chamber, A pressure generating means for causing a pressure change in the liquid; a protective substrate having a holding portion for accommodating the pressure generating means; and being bonded to a surface of the flow path forming substrate on which the pressure generating means is provided; A wiring portion provided on a surface opposite to the surface to be bonded to the flow path substrate of the protective substrate, and the wiring portion is formed on the adhesion layer formed on the protection substrate and the adhesion layer A liquid jet, wherein the metal layer and at least a plating layer formed on the metal layer are formed, and the adhesion layer is formed larger than an outer edge portion of the metal layer and the plating layer. Adopt a head.
By adopting such a configuration, in the present invention, since the two-layer structure of the metal layer and the plating layer is stored in the outer edge portion of the adhesion layer, the capillary force is formed by the sputtering method even if the adhesive flows out. Since it is dammed by the adhesion layer which is hard to work, it is possible to prevent the plating layer from contacting and climbing on the surface, and since the protruding portion from the adhesion layer is not formed, the plating layer is hardly peeled off.

In the present invention, the liquid ejecting head described above is configured such that the plating layer is provided to extend to the adhesion layer.
By adopting such a configuration, in the present invention, even if the plating layer protrudes from the metal layer, it does not float from the adhesion layer, so that peeling does not easily occur.

In the present invention, the above-described liquid ejecting head employs a configuration in which the metal layer and the plating layer are made of gold.
By adopting such a configuration, in the present invention, since the wiring portion includes a metal layer and a plating layer formed of gold (Au), the warp to the substrate is made rather than forming only by the sputtering method. The specific resistance can be reduced.

In the present invention, the flow path forming substrate provided with the pressure generating chamber communicating with the nozzle for ejecting the liquid, and the liquid in the pressure generating chamber provided on the flow path forming substrate facing the pressure generating chamber. A pressure generating means that causes a pressure change in the liquid crystal, a holding portion that accommodates the pressure generating means, a protective substrate that is bonded to a surface of the flow path forming substrate on which the pressure generating means is provided, and the protection And a wiring portion provided on a surface opposite to the surface to be bonded to the flow path substrate of the substrate, and a manufacturing method of a liquid ejecting head, wherein an adhesion layer is formed on the protective substrate by a sputtering method. A metal layer is sequentially formed, and a patterning process is performed by etching the adhesion layer and the metal layer, and the metal layer etched by the first patterning process is connected to an outer edge of the adhesion layer. A second patterning step of further etching so as to be smaller than a plating layer, and a plating layer forming step of forming a plating layer on at least the metal layer etched by the second patterning step by a plating method. The manufacturing method of the liquid jet head is adopted.
By adopting such a technique, in the present invention, after the wiring portion is patterned by etching, the metal layer and the plating layer are further formed by performing second patterning that makes the metal layer smaller than the outer edge portion of the adhesion layer. Since the two-layer structure is housed in the outer edge portion of the adhesion layer, it is dammed by the adhesion layer that is formed by the sputtering method even if the adhesive flows out, and the capillary force is difficult to work. The rise can be prevented, and the protruding portion from the adhesion layer is not formed, so that the plating layer hardly peels off.

In the present invention, the method for manufacturing the liquid jet head described above, wherein the plating layer forming step employs a technique in which the plating layer is formed to extend to the adhesion layer.
By adopting such a method, in the present invention, even if the plating layer protrudes from the metal layer, it does not float from the adhesion layer, and therefore, peeling does not easily occur.

It is a disassembled perspective view which shows the structure of the inkjet recording head which comprises the protective substrate manufactured by the manufacturing method in embodiment of this invention. 2A and 2B are a plan view and a cross-sectional view illustrating a configuration of an ink jet recording head according to an embodiment of the invention. It is sectional drawing which shows the wiring structure on the protective substrate in embodiment of this invention. It is a figure for demonstrating the 1st patterning process among the manufacturing methods of the inkjet recording head in embodiment of this invention. It is a figure for demonstrating the 2nd patterning process and plating layer formation process of the manufacturing methods of the inkjet recording head in embodiment of this invention. It is a reference figure showing the wiring part formed in the size of the adhesion layer smaller than the outer edge part of the plating layer.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an ink jet recording head will be described as an example.

FIG. 1 is an exploded perspective view showing a configuration of an ink jet recording head including a protective substrate (wiring substrate) manufactured by a manufacturing method according to an embodiment of the present invention. FIG. 2 is a plan view and a cross-sectional view showing the configuration of the ink jet recording head in the embodiment of the present invention. FIG. 3 is a cross-sectional view showing a wiring structure on the protective substrate in the embodiment of the present invention.
As shown in the figure, the flow path forming substrate 10 is composed of a silicon single crystal substrate having a plane orientation (110) in this embodiment, and an elastic film 50 made of silicon dioxide previously formed by thermal oxidation is formed on both surfaces thereof. Yes.

  A plurality of pressure generating chambers 12 partitioned by a plurality of partition walls are arranged in parallel in the width direction on the flow path forming substrate 10 by anisotropic etching from the other side. A communication portion 13 constituting a reservoir 100 serving as a common ink chamber for each pressure generation chamber 12 is formed outside each pressure generation chamber 12, and one end in the longitudinal direction of each pressure generation chamber 12 and each ink supply path 14. It is communicated through.

  Further, a nozzle plate 20 having a nozzle 21 communicating with the side opposite to the ink supply path 14 of each pressure generating chamber 12 is formed on one opening surface side of the flow path forming substrate 10 with an adhesive or a heat-welded film. And so on. The nozzle plate 20 is made of, for example, glass ceramics, a silicon single crystal substrate, or stainless steel (SUS).

  As described above, the elastic film 50 made of silicon dioxide is formed on the opposite side of the flow path forming substrate 10 from the opening surface. On the elastic film 50, for example, an insulating film made of zirconium oxide (ZrO2) or the like is formed. A body film 55 is laminated. On the insulator film 55, a piezoelectric element 300 composed of a lower electrode film 60, a piezoelectric layer 70, and an upper electrode film 80 is formed as pressure generating means. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80.

  In general, one electrode of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. For example, in this embodiment, the lower electrode film 60 is used as a common electrode for the piezoelectric element 300 and the upper electrode film 80 is used as an individual electrode for the piezoelectric element 300. Absent. A lead electrode 90 made of, for example, gold (Au) or the like is connected to the vicinity of the end of each upper electrode film 80 that is an individual electrode of the piezoelectric element 300, and this lead electrode 90 is used to drive the piezoelectric element 300. The driving IC (driving unit) 220 is connected to the driving wiring 200.

  On the flow path forming substrate 10 on which such a piezoelectric element 300 is formed, a wiring substrate having a wiring portion 210 on its surface, in this embodiment, a protective substrate 30 is bonded via an adhesive layer 35. . The protective substrate 30 has a holding portion 31 that is a space for protecting the piezoelectric element 300 in a region facing the piezoelectric element 300, and the piezoelectric element 300 is disposed in the piezoelectric element 300. Note that the holding unit 31 may be sealed or not sealed.

  Further, the protective substrate 30 is provided with a reservoir portion 32 that is a penetrating portion that penetrates the protective substrate 30 in the thickness direction in a region facing the communication portion 13. As described above, the reservoir section 32 communicates with the communication section 13 of the flow path forming substrate 10 and constitutes a reservoir 100 that serves as a common ink chamber for the pressure generation chambers 12. The protective substrate 30 is preferably formed of a material substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10. For example, in this embodiment, a silicon single crystal substrate of the same material as the flow path forming substrate 10 is used. It is formed using.

  On the protection substrate 30, a region facing the reservoir portion 32 is configured with, for example, a sealing film 41 made of a flexible material such as a PPS film and a fixing plate 42 made of a hard material such as a metal material. The compliance substrate 40 to be used is bonded. Since the region of the fixing plate 42 that faces the reservoir 32 is an opening 43 that is completely removed in the thickness direction, one surface of the reservoir 32 is sealed only with a flexible sealing film 41. It has been stopped.

  On the protective substrate 30, a driving IC 220 for selectively driving each piezoelectric element 300 is mounted. A wiring part 210 patterned in a predetermined shape is provided on the protective substrate 30, and the driving IC 220 is mounted on the wiring part 210. For example, an external wiring (not shown) such as an FPC is electrically connected to the wiring unit 210, and a driving signal and a driving voltage from the external wiring are supplied to each driving IC 220 via the wiring unit 210. It has become.

  As shown in FIG. 3, the wiring part 210 is configured by providing a metal layer 213 and a plating layer 214 on a protective substrate 30 via an adhesion layer 211 provided by a sputtering method. The surface of the plating layer 214 is rougher than the surfaces of the adhesion layer 211 and the metal layer 213, and is provided so as to extend on the adhesion layer 211 in this embodiment. The sizes of the metal layer 213 and the plating layer 214 are smaller than the outer edge portion of the adhesion layer 211. In other words, in the cross-sectional view shown in FIG. 3, the width of the adhesion layer 211 is greater than the width of the metal layer 213 and the plating layer 214.

  The material of the metal layer 213 and the plating layer 214 is not particularly limited as long as it is a material having relatively high conductivity. For example, gold (Au), aluminum (Al), copper (Cu), platinum (Pt), iridium ( Ir) or the like can be used. In the present embodiment, in order to ensure predetermined electrical characteristics of the wiring part 210, gold (Au) having a small specific resistance is used, the metal layer 213 is formed with a thickness of about 200 nm, and the plating layer 214 is formed with a thickness of about 1200 nm. Formed.

The adhesion layer 211 plays a role for ensuring adhesion between the metal layer 213 and the protective substrate 30 (SiO ₂ ), and the material may be appropriately determined according to the material of the metal layer 213. For example, tungsten (W), nickel (Ni), chromium (Cr), or a compound thereof is preferably used. In this embodiment, since the metal layer 213 is made of gold (Au), nickel chrome (NiCr) is used as the material of the adhesion layer 211. In the present embodiment, the adhesion layer 211 is formed with a thickness of about 100 nm.

  In the ink jet recording head having the above-described configuration, ink is taken in from an external ink supply unit (not shown), filled with ink from the reservoir 100 to the nozzle 21, and then from the drive IC 220 electrically connected to the wiring unit 210. In accordance with the drive signal, a drive voltage is applied between each of the lower electrode film 60 and the upper electrode film 80 corresponding to the pressure generation chamber 12 to bend and deform the elastic film 50, the lower electrode film 60, and the piezoelectric layer 70. Thus, the pressure in each pressure generating chamber 12 can be increased and ink droplets can be ejected from the nozzles 21.

Hereinafter, a method of manufacturing the ink jet recording head having the above-described configuration, particularly a process of forming the wiring portion 210 on the protective substrate 30 will be described.
Note that the holding portion 31 and the reservoir portion 32 are formed in advance on the protective substrate 30 before the wiring portion 210 is formed, and for example, a silicon dioxide film formed on the surface of the silicon substrate to be the protective substrate 30 is used. It is formed by wet etching as a mask.

  FIG. 4 is a diagram for explaining a first patterning step in the method of manufacturing an ink jet recording head in the embodiment of the present invention. FIG. 5 is a diagram for explaining a second patterning step and a plating layer forming step in the method of manufacturing an ink jet recording head in the embodiment of the present invention.

First, as shown in FIG. 4A, an adhesion layer 211 and a metal layer 213 are sequentially formed over the entire surface by sputtering on a silicon substrate whose surface to be a protective substrate 30 is covered with a silicon dioxide film. Film. The adhesion layer 211 is formed with a thickness of about 100 nm, and the metal layer 213 is formed with a thickness of about 200 nm.
Next, a resist pattern 160 is formed by applying a resist or the like on the metal layer 213. Specifically, for example, a negative resist is applied onto the metal layer 213 by a spin coat method or the like, and then a resist having a predetermined pattern is formed by performing exposure / development using a mask having a predetermined shape. Of course, a positive resist may be used instead of the negative resist.

Next, as shown in FIG. 4B, the metal layer 213 is wet-etched and patterned into a predetermined shape using the resist pattern 160 as a mask. That is, the metal layer 213 is wet etched until the adhesion layer 211 is exposed.
Next, as shown in FIG. 4C, the adhesion layer 211 is wet-etched using the resist pattern 160 as a mask and patterned into a predetermined shape. That is, the adhesion layer 211 is wet etched until the surface of the protective substrate 30 is exposed. At this time, the adhesion layer 211 is etched in the depth direction and also in the in-plane direction (side etching), and even a part of the lower side of the metal layer 213 is removed. One possible reason for this is an electrolytic corrosion reaction that occurs between the metal layer 213 and the adhesion layer 211.

  Next, as shown in FIG. 5A, the metal layer 213 is further etched (side-etched) without removing the resist pattern 160, so that the size of the metal layer 213 is changed to the outer edge portion of the adhesion layer 211. Smaller than. In other words, the width of the metal layer 213 is made smaller than the width of the adhesion layer 211. In this second patterning step, the etching amount of the metal layer 213 is adjusted by managing the etching time, for example, according to the thickness of the plating layer 214 formed in the subsequent step. As in this embodiment, when the thickness of the plating layer 214 is set to about 1200 nm as described above, for example, in order to ensure the predetermined electrical characteristics of the wiring part 210, the width of the metal layer 213 in the width direction is set. The etching amount (indicated by symbol “a” in FIG. 3) is adjusted to be equal to or greater than the thickness of the plating layer 214.

Next, as shown in FIG. 5B, the resist pattern 160 is removed.
Then, as a plating layer forming step, as shown in FIG. 5C, the plating layer 214 is formed on at least the metal layer 213 by plating, and the width of the plating layer 214 is equal to or less than the width of the adhesion layer 211. Adjust to. As this plating method, for example, an electroless plating method can be used. The protective substrate 30 is immersed in a plating solution at about 50 ° C., and gold (Au) in the plating solution is chemically treated using the metal layer 213 as an autocatalyst. By depositing, a plating layer 214 having a predetermined thickness is formed.

  In the plating method, since the plating layer 214 is formed in the width direction as much as the thickness direction, the metal layer 213 is etched in the width direction according to the thickness of the plating layer 214 in the previous second patterning step. By adjusting the amount, it is possible to prevent the plating layer 214 from protruding from the adhesion layer 211 while maintaining a thickness that can ensure predetermined electrical characteristics of the wiring portion 210. As described above, the wiring portion 210 in which the size of the adhesion layer 211 is larger than the outer edge portions of the metal layer 213 and the plating layer 214 as shown in FIG. 3 can be provided on the protective substrate 30.

  The protective substrate 30 thus formed is bonded to the flow path forming substrate 10 on which the piezoelectric element 300 is formed, and the flow path forming substrate 10 on the opposite side to the bonded side is polished and etched with hydrofluoric acid. Then, a mask made of silicon nitride is formed, and anisotropic etching is performed through this mask to form the pressure generating chamber 12, the communication portion 13, and the like. Furthermore, the communication portion 13 and the reservoir portion 32 are formed. And the reservoir 100 is formed. Thereafter, the driving IC 220 is mounted on the wiring part 210, and the driving IC 220 and the lead electrode 90 are connected via the driving wiring 200. Furthermore, by joining the nozzle plate 20 to the flow path forming substrate 10 and joining the compliance substrate 40 to the protective substrate 30, the ink jet recording head having the structure shown in FIGS. 1 and 2 is manufactured.

Subsequently, the operation and effect of the wiring part 210 formed as described above will be described in comparison with the wiring part 310 shown in FIG.
FIG. 6 is a reference diagram showing the wiring part 310 in which the size of the adhesion layer 311 is smaller than the outer edge part of the plating layer 314.

  As shown in FIGS. 3 and 6, the plating layers 214 and 314 formed by the plating method have a rougher surface than the metal layers 213 and 313 formed by the sputtering method, and the capillary force is likely to work. One reason for this is considered to be a difference in the film formation method between the effect due to the adhesion of sputtering and the effect due to the deposition effect of plating. As shown in FIG. 6, when the size of the adhesion layer 311 is smaller than the outer edge portion of the plating layer 314, and the plating layer 314 protrudes from the adhesion layer 311, it is between the protective substrate 30 and the plating layer 314. A minute gap (specifically, a gap of about 100 nm or less which is the thickness of the adhesion layer 311) is formed.

  When such a gap is formed, the adhesive used when adhering a predetermined member (for example, the compliance substrate 40) to the protective substrate 30 easily flows out along the gap. Further, the adhesive flowing out along the gap climbs onto the surface of the plating layer 314 by the capillary force on the surface of the plating layer 314, forms an insulating film, and is electrically connected to the driving IC 220 mounted thereon. Connection may be bad. In such a case, the metal layer 313 and the plating layer 314 are likely to be peeled off starting from the protruding portion floating from the adhesion layer 311 of the plating layer 314.

  On the other hand, according to the wiring part 210 of this embodiment, the above-mentioned electrical connection failure and peeling can be suppressed. That is, according to the wiring part 210 of the present embodiment, as shown in FIG. 3, the size of the adhesion layer 211 is larger than the outer edge parts of the metal layer 213 and the plating layer 214. A minute gap as shown is not formed, and it is difficult for the adhesive to flow out along the wiring portion 210. Further, even if the adhesive flows out in a minute amount along the adhesion layer 211, the adhesion layer 211 has a surface that is formed by a sputtering method and is difficult to work with the capillary force. As a result, it is possible to prevent the adhesive from contacting and climbing on the surface of the plating layer 214.

  Further, since the metal layer 213 and the plating layer 214 are formed to be smaller than the outer edge portion of the adhesion layer 211, the protruding portion from the adhesion layer 211 of the plating layer 214 is not formed, and the metal layer starting from the protruding portion is formed. Peeling of 213 and the plating layer 214 hardly occurs. In addition, the plating layer 214 of this embodiment is provided so as to extend from the metal layer 213 to the adhesion layer 211. For this reason, even if the plating layer 214 protrudes from the metal layer 213, the plating layer 214 does not float from the adhesion layer 211, and peeling is less likely to occur.

Further, the metal layer 213 and the plating layer 214 are made of gold (Au), and the plating layer 214 can be formed in a low temperature atmosphere of about several tens of degrees Celsius, so that the film stress due to thermal shrinkage is small and the specific resistance is low. Since the layer is a small plating layer, it is possible to reduce warpage with respect to the protective substrate 30 and to reduce the specific resistance as compared with the case of the metal layer 213 alone.
Table 1 below shows a conventional example in which the wiring portion 210 is formed by the adhesion layer 211 and the metal layer 213, and an embodiment in which the wiring layer 210 is formed by the adhesion layer 211, the metal layer 213, and the plating layer 214 as shown in FIG. A comparison of specific resistance and warpage is shown.

  As described above, according to the above-described embodiment, the wiring portion 210 is formed on the adhesion layer 211 formed on the protective substrate 30, the metal layer 213 formed on the adhesion layer 211, and at least the metal layer 213. By adopting a configuration in which the adhesion layer 211 is formed to be larger than the outer edge portions of the metal layer 213 and the plating layer 214, the wiring layer 210 may be formed when the plating method is employed. The electrical connection failure and peeling can be suppressed, and the warpage of the protective substrate 30 can be reduced with low resistance.

  As mentioned above, although preferred embodiment of this invention was described referring drawings, this invention is not limited to the said embodiment. Various shapes, combinations, and the like of the constituent members shown in the above-described embodiments are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, the protective substrate 30 is exemplified as the wiring substrate. However, the present invention may be applied to a substrate on which a wiring pattern is similarly formed, for example, the flow path forming substrate 10.

  Furthermore, in the above-described embodiment, the ink jet recording head has been described as an example of the liquid ejecting head. However, the present invention is widely intended for all liquid ejecting heads and ejects liquids other than ink. Of course, the present invention can also be applied to a method of manufacturing a liquid jet head. Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in manufacturing color filters such as liquid crystal displays, organic EL displays, and FEDs (surface emitting displays). Examples thereof include an electrode material ejection head used for electrode formation, a bioorganic matter ejection head used for biochip production, and the like.

  Needless to say, the present invention is applicable not only to such a liquid jet head but also to any wiring substrate having a wiring pattern on the substrate and the manufacture thereof.

  DESCRIPTION OF SYMBOLS 10 ... Flow path formation board | substrate (1st board | substrate), 12 ... Pressure generating chamber, 21 ... Nozzle, 30 ... Protection board (wiring board, 2nd board | substrate), 160 ... Resist pattern, 210 ... Wiring part, 211 ... Adhesion 213 ... Metal layer, 214 ... Plating layer, 220 ... Drive IC (drive unit), 300 ... Piezoelectric element

Claims (5)

A wiring board having a wiring portion patterned on the substrate,
The wiring part is
An adhesion layer formed on the substrate;
A metal layer formed in contact with the adhesion layer;
A plated layer formed in contact with the metal layer,
In the cross section of the wiring portion including the outer edge portion of the adhesion layer, the outer edge portion of the adhesion layer is formed larger than the outer edge portions of the metal layer and the plating layer,
The wiring board , wherein the plating layer is provided to extend to the adhesion layer . The wiring board according to claim 1,
The wiring board, wherein the metal layer and the plating layer are made of gold. A liquid ejecting head having the wiring board according to claim 1 or 2,
A flow path forming substrate provided with a pressure generating chamber communicating with a nozzle for ejecting liquid;
Pressure generating means provided on the flow path forming substrate facing the pressure generating chamber and causing a pressure change in the liquid in the pressure generating chamber;
A holding portion for accommodating the pressure generating means, and a protective substrate bonded to a surface of the flow path forming substrate on which the pressure generating means is provided ,
The liquid ejecting head, wherein the wiring portion is provided on a surface of the protective substrate opposite to a surface to be bonded to the flow path substrate. A flow path forming substrate provided with a pressure generating chamber communicating with a nozzle for ejecting liquid, and a pressure provided on the flow path forming substrate facing the pressure generating chamber to cause a pressure change in the liquid in the pressure generating chamber A protective substrate that has a generating unit, a holding unit that accommodates the pressure generating unit, and is bonded to a surface of the flow path forming substrate on which the pressure generating unit is provided; and the flow channel substrate of the protective substrate; A wiring portion provided on a surface opposite to the surface to be joined, and a method of manufacturing a liquid jet head comprising:
A first patterning step of sequentially forming an adhesion layer and a metal layer on the protective substrate by sputtering, and patterning by etching the adhesion layer and the metal layer;
A second patterning step of further etching the metal layer etched by the first patterning step so as to be smaller than an outer edge portion of the adhesion layer;
A plating layer forming step of forming a plating layer on at least the metal layer etched by the second patterning step by plating;
A method for manufacturing a liquid jet head, comprising: The method of manufacturing a liquid jet head according to claim 4,
The method of manufacturing a liquid jet head, wherein the plating layer forming step includes forming the plating layer so as to extend also to the adhesion layer.

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